TW201928041A - Butylpyrrolidone based cleaning agent for removal of contaminates from electronic and semiconductor devices - Google Patents

Abstract

A composition effective for removing contaminates from an electronic device either as a concentrated material or when diluted with water. The composition designed for effective removal of undesirable contaminates from an electronic device, including but not limited to, solder flux and polymeric residues. The composition contains butylpyrrolidone and an alkali and has a pH of greater than 7.1 and a pKa less than 12. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.

Description

Butyl pyrrolidone detergent for removing contaminants from electronic and semiconductor devices

This invention relates to a composition and method for removing contaminants, fluxes, polymers or other contaminants from electronic and semiconductor devices.

During the manufacture of electronic devices, there are fluxes, polymers, oils, greases, contaminants, and other contaminants that are deliberately added for ease of manufacture or are undesirably introduced into the component. These contaminants need to be removed before certain steps or after the product is completed. The inability to completely remove such contaminants from the product can result in a wide variety of failures, from aesthetics to catastrophic product failures that can result in loss of life.

In accordance with the present invention, a composition effective for removing flux, polymeric residues, ionic residues, and other undesirable contaminants is provided as a concentrated material or diluted with water. The composition, in combination with the rinsing and/or drying steps, effectively removes undesirable contaminants including, but not limited to, fluxes and polymers from the electronic device. The term "electronic device" includes components such as printed circuit boards, ceramic electronic devices, germanium wafers, and the like. The composition comprises butyl pyrrolidone and a base and has a pH of at least about 7.1 and a pKa of less than 12. Butyrrolidone is selected from the group consisting of butyl pyrrolidone: n-butyl pyrrolidone, second butyl pyrrolidone, 2-methyl-1-propyl pyrrolidone and third Pyrrolidone, and mixtures thereof. It should be clear that any particular butylpyrrolidone may not be completely pure and may be mixed with other pyrrolidone. These ingredients are considered to be a mixture within the scope of the patent application. The butyl pyrrolidone is present in the compositions of the present invention in an amount between about 0.1 and about 100%. The base used in the composition is in an amount sufficient to provide an amine or hydroxide having a pH between about 7.1 and about 14.

Water can be present in the composition in an amount from about 0.01 to about 99.9%.

The composition may include a second solvent, as appropriate.

The present invention also encompasses a method of removing flux and/or polymer and other undesirable contaminants by contacting a substrate containing a flux and/or polymer with a composition of the present invention. As used herein, "substrate" is defined as any component or manufacturing electronic device such as a printed circuit board, ceramic electronic component, or germanium wafer that is contaminated with flux and/or polymer or other undesirable contaminants.

Surfactants may be added to the concentrated composition to promote cleaning efficacy, as appropriate. Corrosion inhibitors, buffers, chelating agents and/or chelating agents as would be known to those skilled in the art can be added as needed. The concentrated composition can be used neat (100%) or diluted with water to produce a composition concentration as discussed above. The use of diluted or concentrated cleaners will allow for the use of cleaning agents in a variety of types of cleaning machines and cleaning processes. When diluted, the concentration of the composition is effective to dissolve or remove and clean the flux and/or polymer and other undesirable contaminants from the electronic device. It should be noted that all concentrations in the specification and claims of this application are by weight unless otherwise indicated.

According to the invention, a novel cleaning composition comprising butylpyrene is formulated The rancidinone and the pH of the concentrated cleansing composition are one or more alkaline agents having a pH greater than about 7.1 and a pKa of less than 12. Optionally, as known to those skilled in the art, the composition comprises one or more additional solvents, water, surfactants, corrosion inhibitors, clamping or sequestering agents, or pH buffering agents.

The use of diluted or concentrated cleaners will allow for the use of cleaning agents in a variety of types of cleaning machines and cleaning processes.

As discussed above, the present invention contemplates a concentrated liquid cleaning composition comprising butyl pyrrolidone and a base sufficient to produce a pH of at least about 7.1 and a pKa of less than 12. The composition can be diluted with water to a concentration of from 0.1 to 99%. In a preferred embodiment, the composition is undiluted, meaning that the cleaning agent has a concentration of 100% or is diluted with water to a concentration of 5 to 30% detergent.

In another embodiment, the composition can include at least one additional second solvent that imparts different solubility parameters for different soils, fluxes, polymers, or other contaminants. The optional second solvent can be present in an amount from about 0.1 to about 99.9%. An optional second solvent system R ₁ -O-(C _x H _2x O) _n -H glycol ether, wherein: R ₁ is an alkyl group having 1 to 8 carbon atoms, and n is between 1 An integer with 10, and x is 2 or 3.

The glycol ether is selected from one or more of the following: propylene glycol methyl ether, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol methyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol Propyl ether, dipropylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol butyl ether, tripropylene glycol butyl ether, polypropylene glycol butyl ether, propylene glycol phenyl ether, propylene glycol diacetate, polypropylene glycol butyl ether, two Ethylene glycol ethyl ether, diethylene glycol methyl ether, diethylene glycol butyl ether, diethylene glycol hexyl ether, diethylene glycol butyl ether acetate, ethylene glycol Propyl ether, ethylene glycol n-butyl ether, ethylene glycol hexyl ether, ethylene glycol n-butyl ether acetate, triethylene glycol methyl ether, triethylene glycol ethyl ether, triethylene glycol butyl ether , polyethylene glycol butyl ether, ethylene glycol phenyl ether, polyethylene glycol ethyl ether, and mixtures thereof.

Other optional second solvents are oxidizing solvents such as alcohols, polyols, and hydrazine, which impart polar solvency and also aid in acting as a coupling agent. An optional second solvent has the formula: CxHyOzSn, wherein: x is an integer between 2 and 8, y is an integer between 5 and 18, z is 1 to 5, and n is 0 or 1.

Alternative solvents of this form are ethanol, n-propanol, isopropanol, n-butanol, isobutanol, tert-butanol, n-pentanol, isoamyl alcohol, tetrahydrofuran methanol, hexanol, cyclohexanol, ethyl Hexanol, ethylene glycol, propylene glycol, glycerin, butylene glycol, butyl triol, pentanediol, pentanetriol and dimethyl hydrazine.

The base amine or hydroxide is present in an amount sufficient to bring the pH between about 7.1 and about 14. In addition, the material has a pKa of less than 12.0. Preferably, the amine is an alkanolamine present in an amount between about 0.1 and 50% and/or a hydroxide present in an amount between 0.01 and 20%. More preferably, the base reagent is present in an amount such that the pH is between about 8 and about 13.

The alkanolamine is selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, amine methylpropanol, methylethanolamine, methyldiethanolamine, dimethylethanolamine, diglycolamine, methylethanolamine, monomethylethylethanolamine. , dimethylaminopropylamine, amine propyl diethanolamine, isopropylhydroxylamine, dimethylaminomethylpropanol, amine ethyl propylene glycol, amine ethyl propylene glycol, dimethylamine methyl propanol ginseng ( Hydroxymethyl)aminomethane, aminobutanol, diglycolamine, dimethylaminopropanol, ethylaminoethanol, butylaminoethanol, dibutylaminoethanol, butyldiethanolamine, amine Methyl butanol, hydroxyethylper Ethane sulfonic acid, N- Alkyl propanesulfonic acid, bis(hydroxyethyl)amino ginseng (hydroxymethyl)methane, propanolamine, isopropanolamine, dipropanolamine, diisopropanolamine, and combinations thereof. The alkali hydroxide is selected from the group consisting of tetramethylammonium hydroxide, tetrabutylammonium hydroxide, tetrapropylammonium hydroxide, sodium hydroxide, or potassium hydroxide.

Preferably one or more surfactants are added to improve cleaning, or processing. The surfactant may be an anionic surfactant, a cationic surfactant, or a nonionic surfactant. The surfactant is preferably present in an amount from about 0.1 to about 10%.

The anionic surfactant is selected from the group consisting of sulfate surfactants, alkyl sulfate surfactants, sulfonate surfactants, phosphate surfactants, phosphonate surfactants, and carboxylate surfactants.

The cationic surfactant is selected from the group consisting of primary, secondary, tertiary, or quaternary amines and salts thereof.

The nonionic surfactant is selected from the group consisting of polyoxyethylene glycol alkyl ether, polyoxypropylene glycol alkyl ether, acetylene glycol, glucoside alkyl ether, polyoxyethylene glycol octyl phenyl ether, polyoxyethylene glycol. Alkyl phenol ether, block polymers of ethylene oxide and propylene oxide, and fluorinated surfactants.

One or more corrosion inhibitors can be added to the composition to improve compatibility with the equipment used to apply or remove the cleaning agent or with the electronic product undergoing the cleaning process. Preferred corrosion inhibitors are selected from the group consisting of phosphonates, citrates, molybdates, tungstates, carbonates, hydroxides, carboxylic acids, benzotriazoles, tolutriazoles, and mixtures thereof. The corrosion inhibitor is present in an amount from about 0.001 to about 10%.

One or more buffers may be added to provide pH control to maintain the pH between about 7.1 and about 14. Preferred buffers are selected from the group consisting of mono-, di- and tri-carboxylic acids, Amines, inorganic acids, and mixtures thereof. Preferred buffering agents are one or more of a monocarboxylic acid, a dicarboxylic acid, a phosphoric acid, a phosphonic acid, sulfuric acid, boric acid, and salts thereof.

At least one clamping or chelating agent can be added to the composition. A preferred nip or chelating agent is ethylenediaminetetraacetic acid (EDTA) or a salt thereof and ethylenediamine-N,N'-disuccinic acid or a salt thereof, a phosphonic acid or a salt thereof, and a mixture thereof.

Foaming modifiers of the type well known in the art may be included, as desired.

In another aspect of the invention, a method is provided comprising contacting a product as hereinbefore described with a composition of the invention in a manner known to those skilled in the art of cleaning, for a period of time sufficient to remove flux or other contaminants. . After washing, the rinse phase of the composition is removed from the component, followed by the drying phase. Washing and rinsing can be accomplished by spraying, spraying, agitating, sonicating, dipping, rolling, wiping or soaking.

The preferred embodiments of the present invention are described in detail in the following examples, which should not be construed as limiting the scope of the invention.

[Comparative Example 1]

A cleaning agent with 100% n-butyl pyrrolidone was formulated to test the removal of various commercial fluxes encountered in the industry. The solution was heated to 60 ° C in a beaker that was agitated at low speed with a stir bar. The test board with the flux was soaked in the solution for 5, 10 and 15 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning:

[Example 1]

A solution of 95% n-butylpyrrolidone and 5% diglycolamine (pH = 11.6, pKa = 9.45) was formulated and heated to 60 ° C in a beaker stirred at low speed with a stir bar. The test board with the flux was soaked in the solution for 5, 10 and 15 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

In all of the 21 tests under the same conditions, the alkaline material diglycolamine was added to improve the cleaning of the pure n-butylpyrrolidone.

[Embodiment 2]

A solution having 85% n-butylpyrrolidone and 5% diglycolamine (pH = 11.6, pKa = 9.45) and 10% dipropylene glycol n-butyl ether was formulated. The mixture was heated to 60 ° C in a beaker that was agitated at a low speed with a stir bar. The test board with the flux was soaked in the solution for 5, 10 and 15 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The cleaning of the pure n-butylpyrrolidone was improved by adding the basic material diglycolamine and the addition of the glycol ether dipropylene glycol n-butyl ether to 19 of the 21 tests under the same conditions.

[Comparative Example 2]

A detergent having 100% n-butylpyrrolidone in Comparative Example 1 was formulated as in Comparative Example 1. This test is to evaluate the ability to remove the same commercial flux using an aqueous process in which the concentrated solution is diluted with water and sprayed onto the part. The test solution was added to water to form a 15% solution. The 15% solution has a pH of 4.6. The 15% cleaning solution was placed in a commercial batch cleaning machine (Aqueous Technologies SMT800-LD) and cleaned by spraying air onto the plate. The cleaning solution was heated to 60 ° C in a machine storage tank and sprayed on the test panel at the same temperature. The test plate with the flux was cleaned in the machine for 15 and 30 minutes, then rinsed with deionized water for 5 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning:

[Example 3]

The cleaning agent from Example 1 having 95% n-butylpyrrolidone and 5% diglycolamine was formulated. The solution was then added to water to form a 15% solution. The 15% solution has a pH of 10.7 and a pKa of 9.45. The 15% cleaning solution was placed in a commercial batch cleaning machine (Aqueous Technologies SMT800-LD) and cleaned by spraying air onto the plate. The cleaning solution was heated to 60 ° C in a machine storage tank and sprayed on the test panel at the same temperature. The test plate with the flux was cleaned in the machine for 15 and 30 minutes, then rinsed with deionized water for 5 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The addition of the basic material diglycolamine equals or improves the cleaning of the pure n-butylpyrrolidone in 14 of the 14 tests under the same conditions.

[Example 4]

The cleaning agent from Example 2 was formulated with 85% n-butylpyrrolidone and 5% diglycolamine and 10% dipropylene glycol n-butyl ether. The solution was then added to water to form a 15% solution. The 15% solution has a pH of 10.7 and a pKa of 9.45. The 15% cleaning solution was placed in a commercial batch cleaning machine (Aqueous Technologies SMT800-LD) and cleaned by spraying air onto the plate. The cleaning solution was heated to 60 ° C in a machine storage tank and sprayed on the test panel at the same temperature. The test plate with the flux was cleaned in the machine for 15 and 30 minutes, then rinsed with deionized water for 5 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

In all of the 14 tests under the same conditions, the alkaline material diglycolamine was added and the glycol ether dipropylene glycol n-butyl ether was added to improve the cleaning of the pure n-butyl pyrrolidone.

[Comparative Example 3]

In the test for evaluating various polymerizable resist materials for self-cleaning wafers, a detergent having 100% n-butylpyrrolidone was formulated. Two commercial and one patented polymers classified as "dry film" photoresists were selected for the examples. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test wafer with the polymeric photoresist was soaked in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning:

[Example 5]

In a test for evaluating various polymerizable resist materials for self-cleaning wafers, a detergent having 75% n-butylpyrrolidone, 18.75% water, and 6.25% tetramethylammonium hydroxide was formulated. The pH of the solution was 13.1 and the pKa was 9.8. The same two commercial and one patented polymers classified as "dry film" photoresists were selected for the examples. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test wafer with the polymeric photoresist was soaked in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The addition of an alkaline material improves the cleaning of the wafer compared to a pure solvent.

[Embodiment 6]

In the test for evaluating various polymerizable resist materials for self-cleaning wafers, a detergent having 50% n-butylpyrrolidone, 37.5% water, and 12.5% tetramethylammonium hydroxide was formulated. The pH of the solution was 13.6 and the pKa was 9.8. The same two commercial and one patented polymers classified as "dry film" photoresists were selected for the examples. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test wafer with the polymeric photoresist was soaked in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The addition of increased levels of alkalinity and reduced levels of butyl pyrrolidone actually increases cleaning.

[Embodiment 7]

In the test for evaluating various polymerizable resist materials for self-cleaning wafers, a detergent having 34% n-butyl pyrrolidone, 33% dimethyl hydrazine, 24.75% water, and 8.25% tetramethylammonium hydroxide was formulated. . The pH of the solution was 13.6 and the pKa was 9.8. The same two commercial and one patented polymers classified as "dry film" photoresists were selected for the examples. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test wafer with the polymeric photoresist was soaked in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the board. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The addition of an increased level of alkalinity in combination with a polar solvent results in a complete cleaning of the wafer, demonstrating the value of the formulated product over a single solvent.

[Embodiment 8]

A cleaner having 100% n-butylpyrrolidone was formulated to evaluate the cleaning of a cured general novolak type polymeric adhesive. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test substrate with the polymeric adhesive was immersed in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the metal substrate. The results of this test are based on the percentage of cleaning:

[Embodiment 9]

A cleaning agent having 90% n-butylpyrrolidone and 10% diglycolamine (pH = 11.6, pKa = 9.45) was formulated to evaluate the cleaning of the cured general novolac type polymeric adhesive. The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test substrate with the polymeric adhesive was immersed in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the metal substrate. The results of this test are based on the percentage of cleaning:

[Embodiment 10]

A cleaning agent with 70% n-butyl pyrrolidone, 10% diglycolamine (pH=11.6, pKa=9.45), 20% propylene carbonate was formulated to evaluate the cleaning of the cured general novolac type polymeric adhesive. . The solution was heated to 75 ° C in a beaker stirred at low speed with a stir bar. The test substrate with the polymeric adhesive was immersed in the solution for 90 minutes, then rinsed with deionized water for 2 minutes and dried with hot air. Then check the metal substrate. The results of this test are based on the percentage of cleaning, which is the comparison score in parentheses:

The addition of an increased level of alkalinity to the solvent results in complete cleaning of the metal substrate, demonstrating the value of the formulated product over a single solvent.

Claims (41)

A composition effective for removing contaminants from an electronic component or assembly during manufacture, comprising at least one butyl pyrrolidone; and a base, and having a pH of at least about 7.1 and a pKa of less than 12. The composition of claim 1, which further comprises water. The composition of claim 2, wherein the water system is present in an amount of from about 0.1 to about 99.9%. The composition of claim 1, which further comprises a second solvent. The composition of claim 1, wherein the second solvent is present in an amount of from about 0.1% to about 99.9%. The composition of claim 4, wherein the second solvent is a glycol ether of the formula R ₁ -O-(C _x H _2x O) _n -H, wherein: R ₁ is an alkane having 1 to 8 carbon atoms Base, n is an integer between 1 and 10, and x is 2 or 3. The composition of claim 6, wherein the second solvent is selected from the group consisting of propylene glycol methyl ether, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol methyl ether acetate, and dipropylene glycol methyl ether acetate. , propylene glycol n-propyl ether, dipropylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol butyl ether, tripropylene glycol butyl ether, polypropylene glycol butyl ether, propylene glycol phenyl ether, propylene glycol diacetate, polypropylene glycol butyl Ether, diethylene glycol ethyl ether, diethylene glycol methyl ether, diethylene glycol butyl ether, diethylene glycol hexyl ether, diethylene glycol butyl ether acetate, ethylene glycol propyl ether , ethylene glycol n-butyl ether, ethylene glycol hexyl ether, ethylene glycol n-butyl ether acetate, triethylene glycol methyl ether, triethylene glycol ethyl ether, triethylene glycol butyl ether, polyethyl b Glycol butyl ether, ethylene glycol phenyl ether, polyethylene glycol ethyl ether, and Its mixture. The composition of claim 4, wherein the second solvent is an alcohol or a polyol of the formula C _x H _y O _z S _n , wherein: x is an integer between 2 and 8, and the y is between 5 and 18. The integer between, and z is an integer between 1 and 5, and n is 0 or 1. The composition of claim 8, wherein the second solvent is selected from the group consisting of ethanol, n-propanol, isopropanol, n-butanol, isobutanol, tert-butanol, n-pentanol, isoamyl alcohol, tetrahydrofuran methanol , hexanol, cyclohexanol, ethylhexanol, ethylene glycol, propylene glycol, glycerin, butylene glycol, butyl triol, pentanediol, pentanetriol and dimethyl hydrazine, and mixtures thereof. The composition of claim 1 wherein the base is in an amount sufficient to provide an amine or hydroxide having a pH between about 7.1 and about 14 and a pKa of less than 12. The composition of claim 10, wherein the base is present in an amount between about 0.1 and about 50%. The composition of claim 10, wherein the base is an amine present in an amount to provide a pH between about 8 and about 13. The composition of claim 10, wherein the amine is an alkanolamine. The composition of claim 13, wherein the alkanolamine is selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, amine methylpropanol, methylethanolamine, methyldiethanolamine, dimethylethanolamine, diglycolamine. , methylethanolamine, monomethylethylethanolamine, dimethylaminopropylamine, amine propyldiethanolamine, isopropylhydroxylamine, dimethylaminomethylpropanol, amine ethyl propylene glycol, amine ethyl propylene glycol , dimethylamine methyl propanol ginseng (hydroxymethyl) aminomethane, aminobutanol, diglycolamine, dimethylaminopropanol, ethylaminoethanol, butylaminoethanol, dibutyl Aminoethanol, butyl diethanolamine, amine methylbutanol, hydroxyethylper Ethane sulfonic acid, N- Alkanopropanesulfonic acid, bis(hydroxyethyl)amino ginseng (hydroxymethyl)methane, propanolamine, isopropanolamine, dipropanolamine, diisopropanolamine, and combinations thereof; the alkali hydroxide It is selected from the group consisting of tetramethylammonium hydroxide, tetrabutylammonium hydroxide, tetrapropylammonium hydroxide, sodium hydroxide, or potassium hydroxide. The composition of claim 10, wherein the base is tetrapropylammonium hydroxide or potassium hydroxide. The composition of claim 1, wherein the ester of butylpyrrolidone is present at a concentration of from about 0.1 to about 100%. The composition of claim 16, wherein the butylpyrrolidone is n-butyl pyrrolidone. The composition of claim 1, which further comprises a surfactant. The composition of claim 18, wherein the surfactant is present in an amount of from about 0.1 to about 10%. The composition of claim 19, wherein the surfactant is selected from the group consisting of anionic surfactants, cationic surfactants, nonionic surfactants, and mixtures thereof. The composition of claim 20, wherein: a. the anionic surfactant is selected from the group consisting of a sulfate surfactant, an alkyl sulfate surfactant, a sulfonate surfactant, a phosphate surfactant, and a phosphonate. a surfactant, and a carboxylate surfactant; b. the cationic surfactant is selected from the group consisting of a primary, secondary, tertiary, or quaternary amine and a salt thereof; and c. the nonionic surfactant is selected from the group consisting of Oxyethylene glycol alkyl ether, polyoxypropylene glycol alkyl ether, acetylene glycol, glucoside alkyl ether, polyoxyethylene glycol octyl phenyl ether, polyoxygen A glycol alkyl phenol ether, a block polymer of ethylene oxide and propylene oxide, and a fluorinated surfactant. The composition of claim 1, which further comprises a corrosion inhibitor. The composition of claim 22, wherein the corrosion inhibitor is selected from the group consisting of phosphonates, citrates, molybdates, tungstates, carbonates, hydroxides, carboxylic acids, azoles, and mixtures thereof. The composition of claim 23, wherein the corrosion inhibitor is selected from the group consisting of sodium citrate, sodium metasilicate, potassium citrate, tetramethylammonium citrate, benzotriazole, and tolutriazole. The composition of claim 22, wherein the corrosion inhibitor is present in an amount of from about 0.001 to about 10%. The composition of claim 1, which further comprises a buffer. The composition of claim 26, wherein the buffer is selected from the group consisting of carboxylic acids, inorganic acids, and mixtures thereof. The composition of claim 27, wherein the buffer is one of 5 to 18 carbon monocarboxylic acids, 5 to 18 carbon dicarboxylic acids, phosphoric acid, phosphonic acid, sulfuric acid, boric acid, and salts thereof More. The composition of claim 26, wherein the buffer is present in a concentration effective to maintain the pH between 7.1 and 14 and a pKa of less than 12. The composition of claim 1 further comprising at least one chelating agent. The composition of claim 30, wherein the chelating agent is selected from the group consisting of ethylenediaminetetraacetic acid or a salt thereof and ethylenediamine-N,N'-disuccinic acid or a salt thereof, phosphonic acid Or a salt thereof and a mixture thereof. The composition of claim 1, which further comprises a foaming modifier. The composition of claim 1, wherein the contaminant is a flux. The composition of claim 1, wherein the contaminant is a polymeric photoresist. The composition of claim 1, wherein the contaminant is an adhesive. The composition of claim 1 wherein the contaminant is ionic in nature and is capable of causing stray undesired currents between two points on the electronic component. A method of removing contaminants from a substrate comprising contacting the substrate with a composition of claim 1 at a temperature and contact time sufficient to remove the flux. The method of claim 37, further comprising a cleaning step, and wherein the cleaning step is at a temperature between 20 ° C and the boiling point and a time between 1 and 1000 seconds and a cleaning at -0.3 to 2 atmospheres Under pressure. The method of claim 38, wherein the cleaning step comprises a washing stage and a subsequent washing stage and drying stage. The method of claim 39, wherein the rinsing stage is performed using a rinsing fluid comprising the cleaning agent, water, deionized water, or a fluorinated solvent. A method of cleaning contaminants from an electronic component or assembly during manufacture, comprising contacting the components or assemblies with the composition of claim 2 for a time sufficient to remove the contaminants.