TW201927507A - Substrate overturning device capable of effectively carrying out overturning of a substrate in a relatively small space - Google Patents

Abstract

An object of the present invention is to provide a substrate inverting device that is effective and can invert a substrate in a small space.
The substrate inversion device 1 is characterized by including a pair of suction sections 100 that can suck a substrate, and a driving section 200 that drives a pair of suction sections 100. The driving part 200 drives a pair of suction parts 100 between a first position and a second position. The first position is a pair of suction parts 100 that can transfer the substrate F to and from the mounting surfaces 2c and 2d of the substrate F. The second position is a position facing the placement surfaces 2c and 2d, and the pair of suction portions 100 are opposite to each other so that the substrates F can be transferred in a state perpendicular to the placement surfaces 2c and 2d.

Description

Substrate turning device

The invention relates to a substrate inverting device for inverting a substrate.

Generally speaking, a mother board including a substrate of a brittle material such as a glass substrate is divided into substrates of a specific size after a scribing step and a breaking step. When used in these steps, the motherboard is properly flipped from the front to the back. For example, when two glass substrates are bonded together to form a mother board, scribe lines are formed on both sides of the mother board. In this case, after a scribe line is formed on one side, the front and back sides of the motherboard are turned over, and a scribe line is formed on the other side. In addition, there may be a case where the front and back surfaces of the mother board forming the scribe line are reversed and supplied to the breaking step.

Patent Document 1 below discloses a device for turning the front and back surfaces of a mother board when the mother board is transported between two platforms arranged in a horizontal direction. The device includes a conveying mechanism that conveys the mother board in a horizontal direction, and a rotating mechanism that reverses the mother board. Suction plates are respectively provided on the conveying mechanism and the rotating mechanism. The mother board placed on a platform is adsorbed by the adsorption plate of the rotating mechanism and reversed. The mother plate turned over from the front and the back is transferred from the adsorption plate of the rotating mechanism to the adsorption plate of the conveying mechanism. Thereafter, the mother board is transferred to another platform by a transfer mechanism, and is placed on another platform.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-080336

[Problems to be solved by the invention]

In the structure of Patent Document 1, when the mother board is turned over, the mother board is temporarily lifted from the platform and then retreated in the horizontal direction. At this position, in order to rotate the mother board 180 degrees, it must be horizontal. And vertical direction to ensure sufficient space. Moreover, when the mother board is turned over, it is difficult to say the steps of lifting the mother board from the platform, the step of retreating the mother board in the horizontal direction, and the step of rotating the mother board 180 degrees when the mother board is turned over. The flipping operation is more effective.

In view of this problem, an object of the present invention is to provide a substrate inverting device that can efficiently and effectively invert a substrate in a smaller space.
[Technical means to solve the problem]

The main aspect of the present invention relates to a substrate turning device. This aspect of the substrate inverting device includes a pair of suction sections that can suck the substrate, and a drive section that drives the pair of suction sections. The driving section is configured to drive the pair of suction sections between a first position and a second position, and the first position is a pair of the suction sections capable of transferring the substrate between the pair of suction sections and a mounting surface of the substrate. The second position is a position facing the mounting surface, and the second position is a position where the pair of suction portions can be transferred to the substrate in a state perpendicular to the mounting surface and facing each other.

According to this configuration, after one substrate is adsorbed on the substrate at the first position, the substrate can be transferred from one adsorption portion to the other adsorption portion by positioning the two adsorption portions at the second position. After that, by positioning the other suction portion at the first position, the front and back surfaces of the substrate can be inverted and placed on the mounting surface. According to the above configuration, as long as the pair of suction portions is rotated within an angular range of about 90 degrees, the front and back surfaces of the substrate can be reversed. Thereby, the substrate can be reversed efficiently and in a lower space.

In the substrate inverting device of this aspect, the driving unit may be configured to include a set of link mechanisms, and the rotary driving force may be applied to move the suction unit between the first position and the second position.

According to this configuration, by using a motor as a driving source, each adsorption section can be smoothly controlled.

In the substrate inversion device of this aspect, each of the above-mentioned link mechanisms may be provided with: a support portion that supports the suction portion in a linearly movable manner; a support shaft that rotatably supports the support portion; and a rotating member by which The rotation driving force rotates; and a connecting shaft, which is arranged in parallel to the support shaft, and connects the rotating member and the suction portion to each other in a rotatable manner.

In this case, when the connection shaft is viewed in a direction parallel to the support shaft, the connection shaft may be arranged to be inserted between the rotation shaft of the rotation member and the support shaft as the rotation member rotates.

According to this configuration, when the rotating member is rotated by the rotational driving force, the suction portion rotates while approaching or separating from the support portion, and moves between the first position and the second position. That is, the suction section is closer to the support section as it moves toward the middle of the first position and the second position, and is separated from the support section as it moves toward the first and second positions. Accordingly, at the second position, the pair of suction portions can be brought closer to the direction in which the substrates are sandwiched, and the substrate can be smoothly transferred between the pair of suction portions. Further, at the second position, each of the suction portions can be brought close to the mounting surface in a direction of holding the substrate between the suction portion and the mounting surface, and the substrate can be smoothly transferred between the suction portions and the mounting surface.

In the substrate inversion device of this aspect, each of the above-mentioned link mechanisms may be configured to give the above-mentioned rotational driving force by an individual driving motor.

According to this configuration, since the driving force can be individually provided for each link mechanism, each link mechanism can be controlled appropriately and individually. However, the drive motor does not need to be provided in each link mechanism, and the driving force of one drive motor may be distributed to each link mechanism through a transmission mechanism.
[Effect of the invention]

As described above, according to the present invention, it is possible to provide a substrate inverting device that can effectively and invert a substrate in an even smaller space.

The effect and meaning of the present invention will be made clearer by the description of the embodiment shown below. However, the embodiment shown below is only an example for implementing the present invention, and the present invention is not limited by any of those described in the following embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are indicated in each drawing. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is a vertical direction. The positive side of the Z axis is above and the negative side of the Z axis is below.

[Embodiment]
Various substrates such as glass substrates and ceramic substrates, or PET (polyethylene terephthalate resin) substrates and resin substrates such as polyimide resin (hereinafter referred to as "substrates") are subjected to various processes to become final products. Examples of such processes include a process of cutting a substrate into a specific number of divided elements, a process of removing corner materials generated when the substrate is cut, and a process of cleaning the surface of the substrate. The substrate is carried into a specific stage during each process, and after the process is completed, it is carried out to another stage for the next process.

The substrate reversing device 1 according to the embodiment is a device that cuts the mother board that has undergone the scribing step and the slicing step into division elements of a specific size, and then reverses each specific number of division elements on the front and back sides. In addition, in the present embodiment, the “specific direction” is the positive direction of the X-axis, and it coincides with the direction in which the divided elements of the substrate F are carried into the substrate inverting device 1. In addition, in the future, although there are descriptions of "adsorbing the substrate F", or "reversing the front and back of the substrate F", and "the substrate F", this means that the substrate inverting device 1 performs a specific number of front and back inversions in one operation The elements of division.

The types of substrates include, for example, polyester resins such as polyimide resin, polyimide resin, and PET; polyolefin resins such as polyethylene resin and polypropylene; polyolefin resins such as polystyrene and polypropylene; polystyrene and poly Organic substrates such as resin substrates such as vinyl chloride and other resin substrates (also including films or sheets. The same applies below); inorganic substrates such as glass substrates or ceramic substrates, and brittle material substrates, but substrates that are inverted by the substrate inversion device 1 of the embodiment F series resin substrate. The resin substrate may be laminated with different substrates, or may be a substrate laminated from the lower layer in the order of PET, polyimide resin, and PET, for example.

The substrate F carried into the substrate reversing device 1 is in a state of being divided into a plurality of division elements in a specific direction. The substrate F may be divided in a specific direction or may be vertically divided with respect to the specific direction. The division elements of the thus-divided substrate F become a checkered shape.

FIG. 1 is a perspective view showing an external configuration of a substrate inverting device 1 according to an embodiment. As shown in FIG. 1, the substrate inverting device 1 includes a substrate placing section 2, a pressure applying section 3, a suction section 100, and a driving section 200.

The substrate mounting portion 2 is a flat surface on which the substrate F is mounted, that is, a member having a mounting surface of the substrate, and includes, for example, a platform and a belt conveyor. The substrate placing section 2 is composed of a substrate placing section 2 a on which the substrate F carried into the substrate inverting device 1 is placed, and a substrate placing section 2 b on which the substrate F after the front and rear faces are inverted is placed. A plurality of fine holes are formed in the substrate placing portions 2a and 2b, and the pressure is transmitted to the substrate F through the fine holes by the pressure applying portion 3 described later.

The pressure applying section 3 includes an air pressure source, is provided on the lower surface of the substrate mounting section 2, and applies pressure to the lower surface of the substrate F. When pressure is applied to the substrate F by the pressure applying portion 3, pressure is applied to the lower surface of the substrate F through a plurality of minute holes formed in the lower surface of the substrate placing portion 2. When the pressure applying section 3 applies a negative pressure to the substrate F, the substrate F is attracted to the substrate placing section 2. Therefore, the substrate F is not easily separated from the substrate placing section 2. Thereby, the positional deviation of the division elements of the substrate F is suppressed. On the other hand, when the pressure applying section does not apply a negative pressure to the substrate F and when a positive pressure is applied, the substrate mounting section 2 will release the adsorption of the substrate F. Therefore, the substrate F can be easily separated from the substrate mounting portion 2.

Although FIG. 1 shows the substrate inverting device 1 provided with only one pressure applying section 3, the pressure applying section 3 may be provided in the substrate placing sections 2a and 2b, respectively.

As shown in FIG. 1, the adsorption section 100 includes a first adsorption section 101 that adsorbs the substrate F placed on the substrate mounting section 2 a, and a second adsorption section 102 that receives the substrate F from the first adsorption section 101. The first suction section 101 and the second suction section 102 are provided in a pair in the substrate inversion device 1. In the substrate reversing device 1 of the embodiment, the configuration of the first suction section 101 and the second suction section 102 are the same. The configuration of the first adsorption section 101 and the second adsorption section 102 may be a configuration in which the substrate F can be transferred between them, and the configurations of the two need not be the same. Further, in the substrate inversion device 1, the first suction section 101 is arranged on the mounting surface 2c of the substrate mounting surface 2a, and the second suction section 102 is arranged on the mounting surface 2d of the substrate mounting section 2b.

The adsorption unit 100, that is, the first adsorption unit 101 and the second adsorption unit 102 include an adsorption pad 110, a valve driving unit 120, a pipe 130, and a base portion 140. A plurality of suction pads 110 are provided, and the substrate F is suctioned. The valve driving unit 120 (see FIG. 5 (a)) is connected to an air pressure source (not shown), and when positive or negative pressure is applied to the adsorption pad 110 from the air pressure source, the valve is switched, and the adsorption pad 110 is switched. Give negative or positive pressure. The piping 130 is a member that connects the plurality of adsorption pads 110 to each other. The piping 130 is connected to the valve driving unit 120 via a piping (not shown). The base 140 is a base provided with an adsorption pad 110 and a piping 130, and is made of stainless steel.

In addition, although the substrate inverting device 1 provided with 10 base portions 140 is illustrated in FIG. 1, the number and size of the base portions 140 are appropriately adjusted according to the number and size of the divided elements of the substrate F. In addition, the numbers of the suction pads 110 and the piping 130 are appropriately adjusted in accordance with the number and size of the division elements of the substrate F. Furthermore, it is not necessary to provide the same number of adsorption pads 110 in each base portion 140, and the number of the adsorption pads 110 can be changed for each base portion 140.

The driving section 200 drives the first suction section 101 and the second suction section 102. As shown in FIG. 1, the driving unit 200 includes a motor 210, a link mechanism 220, and a transmission unit 230. The link mechanism 220 drives the first suction section 101 and the second suction section 102. As shown in FIG. 1, each of the first suction section 101 and the second suction section 102 has a configuration in which one link mechanism 220 is provided on each of the positive side and the negative side of the Y axis. Hereinafter, the link mechanism 220 provided in the first suction section 101 will be described, but the same applies to the case where the link mechanism 220 is provided in the second suction section 102.

FIG. 2 is an enlarged view of a part of FIG. 1, and is a diagram for explaining the link mechanism 220 of the substrate inversion device 1 of the embodiment. As shown in FIGS. 1 and 2, the link mechanism 220 includes a support portion 10, a support shaft 20, a rotation member 30, and a connection shaft 40.

The support section 10 supports the first suction section 101. The support unit 10 includes a support block 11 and two shafts 12. The support block 11 has two holes 11 a formed in the Z-axis direction, and holes 11 b formed in the Y-axis direction. Bearing portions 13 are provided on the inner periphery of each of the holes 11 a. Two shafts 12 are inserted into each bearing portion 13.

A support shaft 20 rotatably supporting the support portion 10 is inserted into the hole 11 b. In addition, when the support shaft 20 is inserted into the hole 11 b of the support block 11, a positioning ring 14 may be provided on the support block 11.

The rotating member 30 is a rectangular plate member that is rotated by a rotational driving force of the motor 210. Holes 30a and 30b are formed at both ends of the rotating member 30 in the X-axis direction. A rotation shaft 31 is provided in the hole 30a, and a connection shaft 40 is inserted in the hole 30b along the Y-axis direction. The connection shaft 40 is connected to the first suction portion 101 via a connection portion 50.

The connection portion 50 connects the support portion 10 and the connection shaft 40. In addition, the first suction part 101 is connected to the support shaft 20 and the connection shaft 40 via the connection part 50. The connecting portion 50 includes a connecting block 51, two connecting shafts 52, and a fixing portion 53.

The connecting block 51 has two holes 51a formed in the Z-axis direction. The two shafts 12 of the support portion 10 are respectively inserted into the two holes 51a. Thereby, the support part 10 and the connection part 50 are connected via the two shafts 12. Further, the connecting block 51 has three holes formed in the Y-axis direction. Two of the three holes 51b are formed below the two holes 51a. Two connecting shafts 52 are respectively inserted into the two holes 51b. Each connecting shaft 52 is fixed to the base portion 140 by a fixing portion 53.

A hole 51c formed in three holes in the Y-axis direction of the connecting block 51 is located between the two holes 5a. The hole 51c is inserted through the connection shaft 40. In this way, the support shaft 20, the connection shaft 40, and the two connection shafts 52 are arranged in parallel in the Y-axis direction.

The transmitting unit 230 transmits the driving force of the motor 210 to the link mechanism 220. As shown in FIG. 1, the transmitting unit 230 is provided in each link mechanism 220.

The transmission unit 230 includes two timing wheels 231 and a belt 232. The two timing wheels 231 are attached to the flat plate 4 and the belt 232 is suspended from the two timing wheels 231. In FIG. 1, a motor 210 and two timing wheels 231 and a belt 232 are provided through the plate 4 on the positive side of the Y axis. The positive side of the Z axis of the two timing wheels 231 is the timing wheel 231 located above, The motor 210 is connected by a shaft 233. On the other hand, a timing wheel 231 on the negative side of the Z-axis, that is, a lower side, is connected to the rotation shaft 31. In addition, in FIG. 1, the motor 210 is not provided on the negative side of the Y side of the substrate turning device 1. Therefore, the timing wheel 231 on the negative side of the Y-axis is connected to the shaft 233 only.

When the motor 210 is rotationally driven, the rotational driving force is transmitted to the timing wheel 231 located above via the shaft 233. As a result, the belt 232 operates, and the timing wheel 231 located below rotates, and a rotational driving force is applied to the rotation shaft 31.

Next, the operation of inverting the front and back surfaces of the substrate F of the substrate inverting device 1 will be described based on FIGS. 3 (a) to (d) and FIGS. 4 (a) to (c). 3 (a) to (d) and FIGS. 4 (a) to (c) are schematic diagrams for explaining the operation of the substrate inverting device 1, and are views of the substrate inverting device viewed from the positive side of the Y-axis.

The state of the substrate reversing device 1 shown in FIG. 3 (a) is the substrate F carried into the substrate reversing device 1, that is, the substrate F divided into a specific number of divided elements is placed on the mounting surface of the substrate mounting portion 2a. 2c, and the state where the first suction section 101 faces the mounting surface 2c. In this manner, the position of the first suction section 101 when the first suction section 101 faces the mounting surface 2c is referred to as "first position". On the other hand, the second suction section 102 is also in a state facing the mounting surface 2d of the substrate mounting section 2b, and the position of the second suction section 102 is the same as the first suction section 101 and is the first position. The position perpendicular to the first position is referred to as "second position".

As shown in FIG. 3 (a), the first suction section 101 suctions the surface F1 of the substrate F at the first position. At this time, the angle of the rotating member 30 with respect to the first position is approximately 0 degrees. The rotating member 30 moves to the positive side of the X-axis on the X-Z plane with the rotating shaft 31 as the center, that is, if it rotates clockwise, the connecting shaft 40 rotates clockwise in a manner close to the supporting block 11 of the supporting portion 10. At this time, since the connection shaft 40 and the first suction part 101 are connected by the connection part 50, it is considered that the original system rotates clockwise similarly to the rotation member 30.

However, as the connection shaft 40 approaches the support shaft 20, the support block 11 moves to the negative side of the X-axis on the X-Z plane opposite to the rotation direction of the rotation member 30 in a manner to avoid the rotation member 30, that is, to rotate counterclockwise. If the support block 11 rotates counterclockwise, the shaft 12 moves linearly in the positive direction of the Z axis. Since the shaft 12 is connected to the first suction portion 101 via the connection portion 50, the first suction portion 101 rotates counterclockwise as the support portion 10 rotates counterclockwise. Its state is shown in Fig. 3 (b).

As shown in FIG. 3 (b), when the angle of the rotating member 30 with respect to the first position is about 45 degrees, the connecting shaft 40 is closest to the supporting shaft 20. When the angle of the rotating member 30 with respect to the first position exceeds approximately 45 degrees, as shown in FIG. 3 (c), the connecting shaft 40 is separated from the supporting shaft 20. As shown in FIG. 3 (d), if the angle of the rotating member 30 with respect to the first position exceeds approximately 90 degrees, the connecting shaft 40 is farthest from the support shaft 20. In this way, by the cooperation mechanism 220, the rotation direction of the first suction part 101 is changed from counterclockwise to clockwise.

On the other hand, the second suction unit 102 operates symmetrically with respect to the Z-Y plane in the substrate reversing device 1 with respect to the Z-Y plane. That is, in the second suction section 102, the rotating member 30 moves to the negative side of the X-axis on the X-Z plane, that is, rotates counterclockwise. Similar to the rotation of the first suction section 101 described above, the second suction section 102 changes the rotation direction by the cooperation mechanism 220 and moves to the positive side of the X axis on the XZ plane opposite to the rotation direction of the rotation member 30, that is, clockwise Turn. As a result, as shown in FIGS. 3 (b) to 3 (d), in the second suction portion 102, the connection shaft 40 is also rotated to be close to or separated from the support shaft 20. As shown in FIG. 3 (d), in the second position, the first adsorption section 101 and the second adsorption section 102 face each other.

When the first adsorption section 101 and the second adsorption section 102 are in a state shown in FIG. 3 (d), the substrate F is transferred from the first adsorption section 101 to the second adsorption section 102. Here, as described above, the first adsorption unit 101 adsorbs the surface F1 side of the substrate F. Therefore, the second suction unit 102 suctions the surface F2 on the side opposite to the surface F2.

The second suction part 102 of the suction substrate F and the first suction part 101 of the transfer substrate F return from the second position to the first position. As shown in FIGS. 4 (a) to (c), the rotating member 30 on the side of the second suction section 102 rotates clockwise. Thereby, the 2nd adsorption | suction part 102 rotates counterclockwise to the opposite direction, and is located in the 1st position with respect to the mounting surface 2d. As shown in FIG. 4 (c), the second suction section 102 mounts the substrate F on the mounting surface 2d. At this time, the surface F1 of the substrate F is in contact with the mounting surface 2d. In this way, the substrate inversion device 1 of the embodiment can reverse the front and back surfaces of the substrate F at the timing when the substrate F is transferred from the first adsorption section 101 to the second adsorption section 102.

On the other hand, the rotating member 30 on the side of the first suction section 101 rotates counterclockwise from the second position. Therefore, the first suction portion 101 rotates clockwise and is located at the first position which is the position facing the mounting surface 2d.

FIG. 5 (a) is a block diagram showing the configuration of the substrate inversion device 1. As shown in FIG. As shown in FIG. 5 (a), the substrate reversing device 1 includes the substrate mounting section 2, the pressure applying section 3, the suction section 100, and the driving section 200 shown in FIG. And control section 80.

The input unit 60 receives the number of the substrates F which are reversed by the substrate inversion device 1. The detection section 70 detects the positions of the first adsorption section 101 and the second adsorption section 102. As described above, the first suction section 101 and the second suction section 102 hold the substrate F and face each other due to the second position, thereby inverting and transferring the substrate F. Therefore, the positions of the first suction section 101 and the second suction section 102 are detected by the detection section 70, and the timings of the two positions at the first position and the second position are controlled. The detection unit 70 may appropriately detect the positions of the first adsorption unit 101 and the second adsorption unit 102. For example, a sensor or an imaging device may be used.

The control unit 80 includes arithmetic processing circuits such as a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and memory such as a hard disk. . The control section 80 controls each section in accordance with a program stored in the memory.

FIG. 5 (b) is a flowchart showing the operation of the substrate inversion device 1 according to the embodiment. The control unit 80 shown in FIG. 5 (a) performs this control. In the flowchart of FIG. 5 (b), the state of the substrate inverting device 1 at the beginning of the operation is a state in which the substrate F is carried into the substrate inverting device 1 and placed on the substrate placing portion 2a.

In step S11, the control unit 80 releases the pressure application unit 3 from applying negative pressure or positive pressure to the substrate F. Thereby, the adsorption state between the substrate mounting portion 2a and the substrate F is released, so the substrate F is easily separated from the substrate mounting portion 2a.

In step S12, the control unit 80 switches the valve driving unit 120 because a negative pressure is applied to the first suction unit 101 by an air pressure source. Thereby, the substrate F is easily adsorbed on the first adsorption section 101. Steps S11 and S12 correspond to the state of the substrate turning device 1 shown in FIG. 3 (a).

In step S13, the control unit 80 rotationally drives the motor 210 and applies a rotational driving force to each link mechanism 220. Thereby, the 1st adsorption | suction part 101 and the 2nd adsorption | suction part 102 are rotated so that they may approach each other. Step S13 corresponds to the state of the substrate inverting device 1 shown in Figs. 3 (b) and (c).

In step S13, if the first adsorption unit 101 and the second adsorption unit 102 rotate and are located at the second position with each other, then in step S14, the control unit 80 releases the negative pressure or applies a positive pressure by the air pressure source. Therefore, the valve driving unit 120 is switched. Thereby, the adsorption state between the first adsorption section 101 and the substrate F is released, and the substrate F is easily separated from the first adsorption section 101. In addition, since the control unit 80 applies negative pressure to the second suction unit 102 by an air pressure source, the valve driving unit 120 can be switched. As a result, since the second suction unit 102 applies a negative pressure, the substrate F is suctioned by the second suction unit 102. Thereby, the substrate F is transferred from the first suction section 101 to the second suction section 102. Step S14 corresponds to the state of the substrate inverting device 1 shown in FIG. 3 (d).

After step S14, the 1st adsorption | suction part 101 and the 2nd adsorption | suction part 102 are rotated from a 2nd position to a 1st position, as shown to Fig.4 (a)-(c). In step S15, as shown in FIG. 4 (c), the second suction unit 102 is located immediately before the first position, or at the same time, the control unit 80 controls the pressure application unit 3 to apply a negative pressure to the substrate F. When a negative pressure is applied to the substrate F, the substrate F and the substrate placing portion 2b are in an adsorption state. As a result, the substrates F can be downloaded and placed on the substrate mounting portion 2b in an aligned state.

In step S16, the control unit 80 determines whether or not there is a substrate F that should be reversed on both sides. When preparing the substrate F that should be turned on the front and back, the processing in steps S11 to S15 is performed again. In step S16, when there is no substrate F that should be reversed from the front to the back, the reverse of the front and back of the substrate F of the substrate reversing device 1 is completed.

＜ Effects of Implementation Mode ＞
According to this embodiment, the following effects are exhibited.

As shown in FIGS. 1 and 2, in the substrate reversing device 1, the adsorption unit 100 pairs the first adsorption unit 101 and the second adsorption unit 102. In addition, a link mechanism 220 having the same configuration is applied to the first suction section 101 and the second suction section 102. Thereby, the board | substrate inversion apparatus 1 can be comprised easily.

As shown in FIGS. 3 (a) to (d) and FIGS. 4 (a) to (c), the front and back surface of the substrate F is turned between the first position and the second position. In the link mechanism 220, when the support part 10 is not provided, in the state of FIG. 3 (a), the clockwise rotation of the rotating member 30 causes the first suction part 101 to rotate clockwise. In this case, if the rotating member 30 is not rotated 180 degrees, the substrate F is not reversed. Therefore, the substrate turning device needs space in the horizontal direction and the vertical direction. In contrast, as shown in FIG. 1, the link mechanism 220 of the substrate reversing device 1 according to the embodiment includes a support shaft 20, a rotation shaft 31, and a connection shaft 40. The linear movement of the axis 12. Thereby, the first suction portion 101 can be rotated in a direction opposite to the rotation direction of the rotation member 30. That is, the rotation direction of the suction unit 100 is changed by the link mechanism 220. Therefore, the rotation range of the suction part 100 may be about 90 degrees, and the substrate can be turned at the second position. As a result, the substrate can be inverted in an even smaller space.

In addition, at the same time as the substrate F is transferred at the second position, the front and back surfaces of the substrate F are reversed. Thereby, the substrate F can be effectively inverted.

[Other embodiments]
In the embodiment described above, although the motor 210 is provided in each of the first suction section 101 and the second suction section 102, the number of the motors 210 may be one. In this case, for example, a configuration may be adopted in which the driving force of one motor 210 is distributed to each link mechanism 220 by a transmission mechanism such as a gear.

The embodiment of the present invention can be appropriately modified in various ways within the scope of the technical idea described in the scope of patent application.

1‧‧‧ substrate turning device

2‧‧‧ substrate mounting section

2a, 2b‧‧‧ substrate mounting section

2c, 2d‧‧‧ placement surface

3‧‧‧Pressure imparting department

4‧‧‧ positioning ring

10‧‧‧Support Department

11‧‧‧ support block

11a, 11b‧‧‧hole

12‧‧‧ axis

13‧‧‧bearing department

14‧‧‧ positioning ring

20‧‧‧ support shaft

30‧‧‧Rotating member

30a, 30b‧‧‧hole

31‧‧‧Rotating shaft

40‧‧‧ connecting shaft

50‧‧‧ connecting shaft

51‧‧‧ link block

51a, 51b, 51c‧‧‧holes

52‧‧‧Connecting shaft

53‧‧‧Fixed section

60‧‧‧Input Department

70‧‧‧Testing Department

80‧‧‧Control Department

100‧‧‧ Adsorption Department

101‧‧‧The first adsorption section

102‧‧‧Second adsorption section

110‧‧‧Adsorption pad

120‧‧‧valve drive unit

130‧‧‧Piping

140‧‧‧ base

200‧‧‧Driver

210‧‧‧ Motor

220‧‧‧ Linkage

230‧‧‧ Communication Department

231‧‧‧ timing wheel

232‧‧‧Belt

233‧‧‧axis

F‧‧‧ substrate

F1‧‧‧face

F2‧‧‧face

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

FIG. 1 is a perspective view showing an external configuration of a substrate inversion device according to an embodiment.

FIG. 2 is an enlarged view of a part of FIG. 1 and is a diagram for explaining a link mechanism of the substrate inversion device of the embodiment.

3 (a)-(d) are front views schematically showing the operation of the substrate reversing device according to the embodiment.

4 (a)-(c) are front views schematically showing the operation of the substrate reversing device according to the embodiment.

Fig. 5 (a) is a block diagram showing the structure of a substrate inverting device according to the embodiment. Fig. 5 (b) is a flowchart of the operation of the substrate inversion device of the embodiment.

Claims (5)

A substrate turning device, comprising: A pair of adsorption portions that can adsorb the substrate; and A driving section that drives the pair of adsorption sections; and The driving section drives the pair of suction sections between a first position and a second position, where the first position is opposite to the substrate between the pair of suction sections and the mounting surface of the substrate so that the substrate can be transferred. The second position is a position of the mounting surface, and the second position is a position where the pair of suction portions can be transferred to the substrate in a state of being perpendicular to the mounting surface and facing each other. The substrate reversing device as claimed in item 1, wherein The driving unit includes a set of cooperation mechanisms, and the rotary driving force is applied to move each of the adsorption units between the first position and the second position. Such as the substrate flip device of item 2, wherein The above cooperation agencies include: A support section that supports the suction section in a linearly movable manner; A support shaft that rotatably supports the above support; A rotating member which is rotated by the above-mentioned rotational driving force; and The connecting shaft is disposed parallel to the support shaft, and connects the rotating member and the suction portion to each other so as to be rotatable. The substrate turning device as claimed in item 3, wherein When viewed from a direction parallel to the support shaft, the connection shaft is disposed so as to pass between the rotation shaft of the rotation member and the support shaft as the rotation member rotates. The substrate reversing device according to any one of claims 2 to 4, wherein Each of the cooperation mechanisms is given the above-mentioned rotational driving force by an individual driving motor.