TW201927452A - Laser machining method and method for manufacturing mask assembly - Google Patents

Abstract

The present disclosure relates to a laser machining method and a method for manufacturing a mask assembly, the laser machining method including: setting a plurality of guide lines including curved lines on a plate-shaped workpiece in a first axis direction of the workpiece; setting a plurality of unit machining regions disposed on the workpiece so as to be spaced apart from each other along the plurality of guide lines; and irradiating the plurality of unit machining regions with a laser beam while moving an irradiation position of the laser beam.

Description

Laser cutting method and method for manufacturing mask assembly

The invention relates to a laser processing method and a method for manufacturing a mask assembly, and more particularly, to a laser processing method for compensating a shape change when a workpiece is stretched and a method for manufacturing a mask assembly.

When manufacturing an active matrix organic light-emitting diode (AMOLED), a vacuum deposition process is performed to deposit several layers of organic materials, and the RGB (red, green, and blue) graphics Each deposits a different organic material. Here, a fine metal mask (FMM) is used as a mask mask so that the organic material is deposited only on the desired picture elements and not on other regions.

In general, a fine metal mask assembly is manufactured such that each of a plurality of mask bars manufactured as a separate mask is stretched and fixed to a frame by welding or the like. When the mask rod is stretched to fix the mask rod to the frame, the mask rod expands in the stretching direction and contracts in a direction perpendicular to the stretching direction, thus forming a shape of a hole in the mask rod , Size, and position will change. Therefore, when the holes of the mask stick are formed, if the shapes and pitches of all the holes are made the same, the shape, size, and position of the holes will change when the mask stick is stretched, and therefore, for example, the position accuracy The standards or specifications of each hole such as, shape, size, etc. cannot be met.

Specifically, in the related art, when laser processing is performed on the hole of the mask rod, the laser beam is controlled only two-dimensionally on the x-axis and the y-axis, and only in a straight direction (or in a straight line). Top) Shape of the machined hole. Therefore, it is difficult to compensate for changes in shape, size, and position that occur when the mask rod is stretched while the holes are being processed.

Related technical documents Patent Documents: Korean Patent Publication No. 10-2015-0111349

The invention provides a laser processing method and a method for manufacturing a mask assembly. When a workpiece is stretched, the two methods can pass through a plurality of unit processing areas guided by a plurality of guide lines including a curve through a processing position. To compensate for shape changes.

According to an exemplary embodiment, a laser processing method includes: providing a plurality of guide lines on a workpiece in a first axis direction of a plate-shaped workpiece, the plurality of guide lines including a curve; and positioning the workpiece on the workpiece. A plurality of unit processing areas on the plurality of unit processing areas are arranged to be spaced apart from each other along the plurality of guide lines; and a plurality of unit processing areas are irradiated with a laser beam while moving an irradiation position of the laser beam.

Two guide lines adjacent to each other among the plurality of guide lines have different curvatures.

The curved guide line of the plurality of guide lines forms an arc toward a side far from a center line of the workpiece in the first axis direction, and the guide line is spaced from the workpiece in the first axis direction. The farther the centerline is on, the greater the curvature of the guideline may be.

During the process of irradiating the plurality of unit processing areas with a laser beam, the laser can be used while moving a laser head that emits the laser beam to each of the guide lines. A radiation beam illuminates the plurality of processed regions.

During the process of irradiating the plurality of unit processing areas with a laser beam, the laser head may be moved at a constant rate on each of the guide lines.

In the process of irradiating the plurality of unit processing areas with a laser beam, the size of the laser beam may be changed along with the size of each unit processing area in the unit processing area while changing the size of the laser beam. Each of the guide lines moves the irradiation position of the laser beam.

In the process of irradiating the plurality of unit processing regions with a laser beam, the size of the laser beam may be changed by adjusting a height of the laser head.

In the process of irradiating the plurality of unit processing regions with a laser beam, the irradiation position of the laser beam may be changed while sequentially changing the three-dimensional coordinate value of the laser head while changing the irradiation position of the laser beam. The size of the laser beam.

In the process of setting the plurality of unit processing areas, the unit processing area in the center portion in each of the guide lines may be set larger than the unit processing areas located on both end portions.

In the process of setting the plurality of unit processing areas, the farther the unit processing area is from the center line of the workpiece in the first axis direction, each of the guide lines The unit processing area in the center portion may be set larger.

In the process of setting the plurality of unit processing areas, the farther the unit processing area is from the center line of the workpiece in the first axis direction, each of the guide lines The unit processing area in the center portion may be set larger at a constant ratio, and the constant ratio may be determined according to the strain of the workpiece.

In the process of setting the plurality of unit processing regions, the unit processing regions located on both ends of the plurality of guide lines may be set to a constant size.

According to another exemplary embodiment, a method of manufacturing a mask assembly includes processing a workpiece through a laser processing method according to an exemplary embodiment, and providing a mask rod in which the plurality of A unit processing area is formed with a plurality of processing holes; and the mask rod is stretched in the first axis direction and the mask rod is fixed to a frame having an opening portion.

In the process of stretching the mask rod in the first axis direction to fix the mask rod, the guide rod may be aligned in the guide line toward both sides of the mask rod in the first axial direction. A parallel tensile force is applied to both ends of each guide wire.

In the process of stretching the mask rod in the first axis direction to fix the mask rod, the plurality of processing holes may be arranged in a two-dimensional manner in a straight line, and The size can be made uniform.

Hereinafter, exemplary embodiments will be explained in more detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the description, similar reference numbers refer to similar configurations, the drawings may be partially enlarged to clearly illustrate exemplary embodiments, and similar reference numbers refer to similar elements in the drawings.

FIG. 1 is a flowchart illustrating a laser processing method according to an exemplary embodiment, and FIG. 2 is a conceptual diagram illustrating the setting of a guide line and a unit processing area according to an exemplary embodiment.

1 and 2, a laser processing method according to an exemplary embodiment may include: providing a plurality of guide lines 11 on the workpiece 100 in a first axis direction of the plate-shaped workpiece 100, the plurality of guide lines 11 Including a curve (step S100); setting a plurality of unit processing regions 110 along the plurality of guide lines 11 on the workpiece 100, the plurality of unit processing regions 110 being disposed spaced apart from each other (step S120); using a laser beam 10 irradiate the plurality of unit processing regions 110 while moving the irradiation position of the laser beam 10.

In an exemplary embodiment, the workpiece 100 may be a mask rod of a fine metal mask (FMM) used to perform a vacuum deposition process when manufacturing an organic electroluminescence (EL) element or an organic semiconductor element, but will also It can be any object as long as the object can be processed using laser. Specifically, when packaging a semiconductor element, the laser processing method may be used in various situations, such as when a through hole is provided in a printed circuit board (PCB) or a specific area of a semiconductor substrate When processing a pattern.

First, the plurality of guide lines 11 are provided on the workpiece 100 along the first axis direction 21 of the plate-shaped workpiece 100, and the plurality of guide lines 11 includes a curve (step S100). The plurality of guide lines 11 may be provided as virtual lines on the workpiece 100, may be provided along the first axis direction 21 of the workpiece 100, and may include at least one curve. At this time, the plurality of guide lines 11 can guide the positions where a plurality of unit processing areas 110 are to be set, and the first axis direction 21 of the workpiece 100 may be the longitudinal direction (or length direction) of the workpiece 100, and when the long axis When there is no difference from the short axis, the first axis direction may be the direction in which the workpiece is stretched. Here, the meaning of the phrase “along the first axis direction of the workpiece” includes straight and curved shapes, and may include not only “stretching parallel to the first axis of the workpiece” but also “stretching not parallel to the first axis of the workpiece”. That is, each of the plurality of guide lines 11 has a component in the first axis direction 21 of the workpiece 100 and each guide line extends from one end to the other end of the workpiece 100 in the first axis direction 21, So sufficient.

Next, a plurality of unit processing areas 110 are provided, which are disposed on the workpiece 100 to be spaced apart from each other along the plurality of guide lines 11 (step S120). The plurality of unit processing areas 110 may be spaced apart from each other along each of the guide lines 11 and may be set as a virtual area on the workpiece 100. At this time, the plurality of unit processing regions 110 may be set such that the center of each unit processing region 110 is located on each guide line 11. Here, when the shape of each unit processing area 110 is a shape having a direction, the guide line 11 may guide the formation direction of the unit processing area 110.

When the workpiece 100 is stretched, the workpiece expands in the stretching direction and shrinks in a direction perpendicular to the stretching direction, so the shape and position of the processing object 110a (in the processing object 110a, the processing unit processing area 110) will be changes happened. Therefore, in the exemplary embodiment, these changes in the shape and position of the processing object 110a are compensated, the unit processing area 110 is set, and the unit processing area 110 that reflects the change in shape and position is processed, and therefore when the workpiece is stretched At 100 hours, changes in the shape and position of the processed object 110a can be compensated.

Generally, a mask assembly is manufactured so that each of a plurality of mask sticks manufactured as a separate mask is stretched and fixed to a frame by welding or the like. When the mask rod is stretched to fix the mask rod to the frame, the mask rod expands in the stretching direction and contracts in the direction perpendicular to the stretching direction, so the shape of the processing hole formed in the mask rod, Size and position will change. Therefore, when forming a processing hole in a mask rod, if the shape and pitch of all holes are made the same, the shape, size, and position of the processing hole will change when the mask rod is stretched, and therefore, for example The standards or specifications of each hole, such as position accuracy, shape, and size, cannot be met.

However, through the laser processing method of the exemplary embodiment, these changes in the shape and position of the processing object 110a (that is, changes in the shape and position of the processing hole) are compensated, and the unit processing area 110 is processed. Therefore, when a processing hole is formed in the mask rod, and when the mask rod is stretched and fixed to the frame, changes in position, size, and shape are compensated (or corrected) such that, for example, position accuracy, Standards or specifications such as size and shape can be met.

Two guide lines 11 adjacent to each other among the plurality of guide lines 11 may have different curvatures or bending directions from each other. Here, the curvature includes a sign, and a curvature having a different sign may be a different curvature. At this time, the sign of the curvature is determined according to the bending direction. The bending direction means a direction in which the curve is bent, and the upward bending direction may be a "+" direction (or a "+" sign) and the concave bending direction may be a "-" direction (or a "-" sign). In FIG. 2, with respect to a center line in the first axis direction 21 of the workpiece 100 (or a line at the center among the plurality of guide lines), the upper side may be a “+” direction, and the lower side Can be "-" direction. Here, the center line of the workpiece 100 on the first axis 21 may mean a line located at the center among lines extending parallel in the first axis direction 21, and when there is no center in the plurality of guide lines 11 When the line is centered, the center line may be a virtual line. At the same time, among the plurality of guide lines 11, the center line that coincides with the center line of the workpiece 100 in the first axis direction 21 may have a curvature "0" and is not a curve, and thus there may be no bending direction (or curvature) Sign). Here, the bending directions that exist may also be different bending directions.

According to the position of the workpiece 100, since the tensile force when the workpiece 100 is stretched (that is, the expansion force in the stretching direction and the contraction force in the direction perpendicular to the stretching direction), the pulling force applied to each position To determine the setting position of the unit processing area 110. Here, the curvatures or bending directions of the plurality of guide lines 11 may be different to guide the setting positions of the unit processing areas 110.

Since the plurality of guide lines 11 can be set to different positions from each other, the pulling force applied to each of the guide lines 11 to which the plurality of unit processing areas 110 are set can be different. Therefore, the curvature of the guide wire 11 may be determined according to the pulling force at the position of each guide wire 11, and the bending direction may be determined according to the direction of the pulling force at the position of each guide wire 11. Therefore, two guide lines 11 adjacent to each other among the plurality of guide lines 11 may have different curvatures or bending directions from each other.

For example, since the curvature of the linear guide line 11 corresponding to the center line of the workpiece 100 in the first axis direction 21 is "0", the curvature is different from the curvature of the adjacent curved guide line 11 . In addition, since the other guide wires 11 having a curvature may have different curvatures due to differences in the pulling force applied to each position, the curved guide wires 11 adjacent to each other may have different curvatures from each other.

In addition, the curved (or curved) guide line 11 among the plurality of guide lines 11 may form an arc toward a side far from the center line of the workpiece 100 in the first axis direction 21, and the curved guide line may be spaced from the workpiece. The farther the centerline of 100 in the first axis direction 21 is, the larger the curvature of the curved guide line is.

The guide line 11 bent in the plurality of guide lines 11 may form an arc with a chord parallel to a first axis of the workpiece 100 (or a center line of the workpiece in the first axis direction). At this time, the arc may be formed toward one side (or toward both sides in the second axis direction of the workpiece) away from the center line of the workpiece 100 in the first axis direction 21. Here, the second axis direction 22 of the workpiece 100 may be a short axis direction (or width direction) of the workpiece 100, and may be a direction that intersects (or is perpendicular to) the first axis direction 21 of the workpiece 100. When the workpiece 100 is stretched in the first axis direction 21, the workpiece 100 expands in the first axis direction 21 of the workpiece 100 and contracts in the second direction 22 of the workpiece 100. Therefore, it is possible to compensate for a change in the position of the processing object 110 a when the workpiece 100 is stretched in the first axis direction 21 by forming an arc facing one side away from the center line of the workpiece 100 in the first axis direction 21. In addition, the curve can be stretched into a straight line only when the same tension is applied to both ends of the curve. Therefore, an arc having a chord parallel to the axis of the workpiece 100 in the first axis direction 21 is formed, and when a plurality of processing objects 110 a arranged in a curved shape on the curved guide line 11 are aligned in the first axis direction 21 of the workpiece 100 During stretching, the processed objects 110a may be arranged in a line (or in a linear shape).

The farther the curved guide line 11 is from the center line of the workpiece 100 in the first axis direction 21, the greater the curvature of the curved guide line. At this time, the two peripheral sides of the workpiece 100 in the second axis direction 22 (which is subjected to the strongest contraction force in the second axis direction 22) may have a maximum curvature and be away from the workpiece 100 in the second axis direction 22 The closer the central portion (which is subjected to the strongest contraction force in the second axis direction 22), the smaller the curvature may be. As far as the workpiece 100 is stretched in the first axis direction 21, the contraction force of the workpiece 100 in the second axis direction 22 is from the two peripheral sides of the workpiece 100 in the second axis direction 22 toward the workpiece 100 in the second axis. Applied in the center in the direction 22. Therefore, in the second axis direction 22, the contraction force on the two peripheral sides of the workpiece 100 is the strongest, and the contraction force on the center of the workpiece 100 is the weakest. Therefore, the farther from the center line of the workpiece 100 in the first axis direction 21, the larger the curvature may be. At this time, the curvature of each guide wire 11 can be determined according to the strain of the workpiece 100 and the tensile force applied to both ends of the workpiece 100. In addition, at least one of factors such as the thickness of the workpiece 100, the material of the workpiece 100, the shape, size, and position of each unit processing area 110, and the size of a pattern formed by the plurality of unit processing areas 110 can be considered. The curvature of each guide line 11 is determined.

At the same time, the plurality of unit processing regions 110 may be disposed symmetrically with respect to a center line of the workpiece 100 in the first axis direction 21 and a center line in the second axis direction 22. For example, the unit processing area may be arranged to be linearly symmetrical with respect to the center of the plurality of guide lines 11. In this case, the pulling force that stretches the workpiece 100 in the first axis direction 21 is uniformly transmitted to the entire area of the workpiece 100 in a predetermined pattern, and each processed object of the workpiece 100 when stretched in the first axis direction 21 The position accuracy of 110 a can be improved, and an accurate two-dimensional pattern can be formed at the center portion of the workpiece 100.

Subsequently, the plurality of unit processing regions 110 are irradiated with the laser beam 10 while moving the irradiation position of the laser beam 10 (step S130). Here, the irradiation position of the laser beam 10 can be moved by moving the position of the workpiece 100 or the position of the laser head 50. At this time, the laser beam 10 can be used to irradiate the workpiece 100 only in the plurality of unit processing regions 110. That is, the laser beam 10 can be turned on only in the plurality of unit processing regions 110, and the laser beam 10 can be turned off in other regions that do not need to be processed by the laser beam 10. In addition, when the laser beam 10 is enabled (turned on), the laser beam 10 is blocked by a blocking member (not shown) or the like in a region that does not need to be processed by the laser beam 10, and only the plurality of Only the processing area 110 can be illuminated by the laser beam 10.

For example, during the process of irradiating the plurality of unit processing regions 110 with the laser beam 10, the irradiation position of the laser beam 10 can be moved while changing the coordinate value of the laser beam 10. That is, the irradiation position of the laser beam 10 is moved to the coordinates corresponding to the plurality of unit processing regions 110 by changing the coordinate values of the laser beam 10, and therefore, the plurality of unit processing regions 110 can be lasered. The light beam 10 is irradiated. In this case, the laser beam 10 may be enabled (turned on) at the coordinates corresponding to the plurality of unit processing regions 11. In addition, it is easy to use the laser beam 10 to irradiate and process only the plurality of unit processing regions 110, and it is also easy to move the irradiation position of the laser beam 10 to the plurality of unit processing regions 110.

FIG. 3 is a conceptual diagram for explaining the movement of the laser head according to an exemplary embodiment, FIG. 3 (a) is a conceptual diagram for explaining the horizontal movement of the laser head, and FIG. 3 (b) is used for A conceptual diagram for explaining the vertical movement of the laser head.

Referring to FIG. 3, in the process of irradiating the plurality of unit processing areas 110 with the laser beam 10 (step S130), the laser head 50 which emits the laser beam 10 to each guide line 11 can be used while moving, A laser beam 10 illuminates the plurality of unit processing regions 110. The laser head 50 may be continuously moved with reference to each guide line 11. For example, the laser head can be moved along each guide line 11, and when the laser beam 10 is enabled (or turned on) and moved, the plurality of processes can be processed only in the plurality of processing areas 110 District 110. Here, when the laser head is moved along the curved guide line 11, a combination of micro-linear vectors may be used to move the laser head in a similar manner to a curve, and the meaning of the word "along the guide line" may include not only the guide line 11 The same movement, and includes movement similar to the guide line 11. At this time, multiple scans (or reciprocations) may be performed along a single guide line 11. When multiple scans are performed along a single guide line 11, if each unit processing area 110 is irradiated with a laser beam 10 having a size smaller than the size of the unit processing area 110, the multiple scans may be performed along a single guide line 11 until use The laser beam 10 completely scans each unit processing area 110. At this time, while the curvature of the guide wire 11 is maintained, one end of the guide wire 11 and / or the other end is moved in the second axis direction 22 The head is a distance equal to or smaller than the width of the laser beam 10 in the second axis direction, so that the irradiation position of the laser beam 10 can be changed in each unit processing area 110. At this time, the irradiation position of the laser beam 10 may be moved in a time division manner or a space division manner. The irradiation position of the laser beam 10 can be moved with reference to each guide line 11. For example, the irradiation position of the laser beam 10 may be moved in a time division manner with reference to each guide line 11, or the irradiation position of the laser beam 10 may be moved in a space division manner with reference to a plurality of guide lines 11.

Using the laser beam 10 to illuminate a plurality of unit processing areas 110 (step S130) may include: using the laser beam 10 to sequentially illuminate the unit processing areas 110 in a first guide line 110a of the plurality of guide lines 11 (step S131) And irradiate the unit processing region 110 of the second guide line 11b adjacent to the first guide line 11a with the laser beam 10.

The processing of the unit processing regions 110 arranged in the first guide line 11a is performed (or completed) by sequentially irradiating the unit processing areas 110 in the first guide line 11a, and the processing of the unit processing areas 110 in the second guide line 11b is sequentially irradiated. The unit processing area 110 performs (or completes) the processing of the unit processing areas 110 arranged in the second guide line 11 b so that the unit processing area 110 can be processed with reference to each guide line 11. Since a pulling force is applied to both ends of each guide wire 11 according to a corresponding position, the same pulling force is applied to each guide wire 11. Therefore, when each guide line processing unit processing area 110 is not referred to under the same conditions, it is impossible to obtain a pattern with uniform quality from the plurality of unit processing areas 110 of each guide line 11.

Therefore, in order to obtain a pattern with uniform quality from the plurality of unit processing areas 110 of each guide line 11, processing should be performed on the unit processing area 110 with reference to each guide line 11 under the same conditions. Here, when processing is performed on the unit processing area 110 without referring to each guide line 11, it is difficult to form the same conditions for each guide line 11, and the conditions should be constantly changed. Therefore, the unit processing area 110 can be executed with reference to each guide line 11. Therefore, a pattern having a uniform quality can be obtained from the plurality of unit processing regions 110 of each guide line 11.

In the process of using the laser beam 10 to illuminate the plurality of processing regions 110, the laser beam can be moved along each guide line 11 while changing the size of the laser beam 10 corresponding to the size of each unit processing region 110 The irradiation position of the light beam 10. Here, the size of the laser beam 10 can also be changed to be the same as the size of each unit processing area 110 or, although smaller than the size of each unit processing area 110, it can also be changed to be the same as each unit processing area 110. The size is proportional. In addition, when the size of the laser beam 10 is smaller than the size of each unit processing area 110, multiple scans can be performed along the guide line 11 with reference to each guide line 11. In order to reduce (minimize) the moving distance of the irradiation position of the laser beam 10 and the moving rate (or moving speed) of the laser beam 10 in each unit processing area 110 is constant, the laser beam 10 may be moved along the guide line 11 Irradiation position. When the irradiation position of the laser beam 10 is along the guide line 11, the irradiation position of the laser beam 10 is linearly moved and the curvature of the moving section is uniform, and therefore it is easy to maintain the rate (or Speed) and the laser beam 10 can be easily switched on / off.

At this time, the size of the laser beam 10 can be changed according to the size of the unit processing area 110. To process each unit processing area 110 having various sizes with reference to each guide line 11, the irradiation position of the laser beam 10 can be moved and can be changed at the same time The size of the laser beam 10. That is, the size (or area) to be processed can be adjusted by changing the size of the laser beam 10, and the size of the laser beam 10 can be changed according to the size of the unit processing area 110.

For example, in the process of sequentially irradiating the unit processing area 110 of the first guide line 11a with the laser beam 10 (step S131), the first guide line 11a is moved from one end to the other end along the first guide line 11a. At the same time as the irradiation position of the laser beam 10, the unit processing region 110 of the first guide line 11 a may be irradiated with the laser beam 10. In addition, while the unit processing area 110 of the second guide line 11b is sequentially irradiated with the laser beam 10 (step S132), the laser is moved along the second guide line 11b from one end of the second guide line 11b to the other end. At the same time as the irradiation position of the light beam 10, the unit processing area 110 of the second guide line 11 b may be irradiated with the laser beam 10. In this case, when all of the plurality of unit processing areas 110 are irradiated with the laser beam 10 (or when one surface of the workpiece is completely scanned), the irradiation distance of the moving laser beam 10 can be minimized And the number of times (or the number of repetitions) of irradiating each unit processing area 110 with the laser beam 10 may be the same.

At this time, the irradiation position of the laser beam 10 can be moved from the other end of the first guide line 11 a to the second guide line by moving the laser beam 10 in the second axis direction 22 (or step direction) of the workpiece 100. The other end of 11b and the moving distance between the plurality of guide lines 11 between the guide lines 11 of the workpiece 100 in the second axis direction 22 may be constant. That is, the unit processing areas 110 located at both ends of each guide line 11 may have a constant interval between the guide lines 11, and in this case, when the workpiece 100 is stretched in the first axis direction 21, it may be obtained A pattern with a constant interval.

When the laser beam 10 is used to irradiate the plurality of unit processing regions 110 while moving the irradiation position of the laser beam 10 along each guide line 11, side effects such as thermal effects or each unit processing region 110 can be reduced. Burrs, etc.), can shorten the processing time of the plurality of unit processing areas 110, and can easily control the moving direction, moving speed, etc. of the laser head 50.

For example, when the laser beam 10 is used to irradiate each unit processing area 110 while not moving but stopping the laser beam, heat will be accumulated in each unit processing area 110 and the shape of the processing object 110a may be Deformation occurs due to the accumulated heat, and burrs may be formed around the processed object 110a. In addition, when the number of the unit processing areas 110 is large (for example, hundreds), it may take a long time to complete the processing of the hundreds of unit processing areas 110.

However, as in the exemplary embodiment, when the laser beam 10 is used to irradiate the plurality of unit processing regions 110 while moving the irradiation position of the laser beam 10 along each guide line 11, since The position at which the laser beam 10 is irradiated is continuously changed, so that heat can be prevented from being accumulated in the unit processing area 110, and thus thermal deformation or burrs can be prevented from occurring. In addition, since in each unit processing area 110, it is only necessary to adjust the number of scans (or repetitions) during the movement along each guide line 11 without waiting for processing to be completed, the processing of the plurality of unit processing areas 110 can be shortened Time, and the scanning distance for scanning the plurality of unit processing regions 110 can also be reduced.

At the same time, when the laser beam 10 is used to move the laser head 50 in an arbitrary direction while irradiating the plurality of unit processing regions 110, the moving direction of the laser head 50 may suddenly change and be in the first axis direction The rate of change between 21 and the second axis direction 21 is not constant. Therefore, since the movement of the laser head 50 suddenly changes, it is not only difficult to control the movement of the laser head 50, but a machining error of the unit processing area 110 may be generated. However, when the laser beam 10 is used to irradiate the plurality of unit processing regions 110 while moving the laser head 50 along each guide line 11, the moving direction of the laser head 50 may be smoothed in a constant pattern (or sequentially). Ground, and the rate of change in the first axis direction and the second axis direction may be constant, and thus the movement of the laser head 50 may be easily controlled.

During the process of irradiating the plurality of unit processing regions 110 with the laser beam 10 (step S130), the size of the laser beam 10 can be changed by adjusting the height of the laser head 50. The laser head 50 can emit a laser beam 10, and the size of the laser beam 10 can be changed by adjusting the height (or the position in the z-axis direction) of the laser head 50. For example, when the height of the laser head 50 is lowered (or when the laser head is close to the workpiece), the size of the laser beam 10 may be increased, and when the height of the laser head 50 is raised (or when the laser head is raised) When the head is moved away from the workpiece), the size of the laser beam 10 can be reduced.

To uniformly process the plurality of unit processing regions 110 over the entire region of the workpiece 100, each unit processing region 110 should be processed using a laser beam having the same energy. At this time, when the height of the laser head 50 is adjusted to change the size of the laser beam 10, the laser beam 10 having the same size and the same energy can be obtained. Therefore, the plurality of unit processing regions 110 may be processed using the laser beam 10 having the same energy, and the unit processing regions 110 may be processed at the same depth so that the number of times the plurality of unit processing regions 110 are scanned is the same. . Therefore, the plurality of unit processing regions 110 can be processed using the same energy and the same number of scans, so that a uniformly processed object 110a can be formed over the entire region of the workpiece.

During the process of irradiating the plurality of unit processing areas 110 with the laser beam 10 (step S130), the irradiation position of the laser beam 10 can be changed by sequentially changing the three-dimensional coordinate value of the laser head 50 while changing the irradiation position of the laser beam 10. The size of the laser beam 10. At this time, the value in the first axis direction 21 (for example, the x-axis value), the value in the second axis direction 22 (for example, the y-axis value), and the value in the height direction 23 (for example, the z-axis value) can be set to three-dimensional value.

In the related art, during laser processing, the shape is processed by linearly controlling the x-axis and y-axis (that is, two-dimensional) on a straight line, and when the workpiece 100 is stretched in the first axis direction 21, since Processing in a straight direction cannot compensate for changes in the shape and position of the processed object. That is, in the related art, standards or specifications such as position accuracy, size, and shape can be satisfied in a laser processing mask rod state, but when the mask rod is stretched in the first axis direction 21, the hole processing standard Or specifications cannot be satisfied due to expansion in the stretching direction and contraction in the direction perpendicular to the stretching direction.

However, in the exemplary embodiment, not only the three-dimensional coordinate value of the laser head 50 may be sequentially changed and processing may be performed in a curved direction along the guide line 11, but also the laser may be changed in a height direction (or a z-axis direction). The position of the head 50 is such that the size of the laser beam 10 can be changed while maintaining the constant energy of the laser beam 10. Therefore, when the workpiece 100 is stretched in the first axis direction 21 (for example, the mask rod is stretched and the mask rod is fixed to the frame), the desired shape and position accuracy of the processing object 110a can be ensured.

During the process of irradiating the plurality of unit processing regions 110 with a laser beam (step S130), the laser head 50 may be moved at a constant rate on each guide line 11. In order to obtain a pattern with uniform quality from the plurality of unit processing areas 110 of each guide line 11, processing should be performed on the unit processing area 110 at a constant rate with reference to each guide line 11. At this time, when the three-dimensional coordinate value is set, the velocity values in the first axis direction, the second axis direction, and the height direction are also set so that the laser head 50 can move at a constant rate along each guide line 11 and pass through The three-dimensional movement of the laser head 50, the size of the laser beam 10 can be adjusted while the laser head 50 moves along each guide line 11. Therefore, a pattern having a uniform quality can be obtained from the plurality of unit processing regions 110 of each guide line 11.

For example, the laser head 50 may be moved by using a numerical control (NC) method. Here, nanoscale can be applied to numerical control (NC) methods. In the numerical control method, the linear movement in each direction is performed in micro units, and thus the linear movement can be performed substantially the same as the curved movement. More specifically, the trajectories on the x-axis, y-axis, and z-axis are obtained during the curve movement, and at the same time, the three axes (or in the three-axis direction) of the laser head 50 are moved so that the laser beam can be used 10 to processing unit processing area. Since the information about the three-dimensional coordinate values can be calculated in advance through the guide line 11, when these coordinates are converted into G codes and an NC device is used, it is easier to perform accurate control to compensate for the change in the shape of the processed object 110a. Here, the G code is a programming language or standard format used in numerical control (NC), and can input the three-dimensional coordinates on the x-axis, y-axis, and z-axis and the velocity of each axis, and therefore can pass through each An axis of velocity input causes the laser head 50 to move at a constant rate on each guide line.

At the same time, the velocity in the first axis direction 21 (for example, the velocity in the x-axis direction) may be the same on all guide lines 11 and according to the curvature of each guide line 11 in the second axis direction The velocity (for example, velocity in the y-axis direction) may increase as the curvature increases. For example, the moving speed of the laser head 50 may be adjusted so that the resulting velocity vector (obtained velocity) in the x-axis direction and the y-axis direction is constant. At this time, the movement in the z-axis direction can be relatively small compared to the movement in the x-axis direction and the y-axis direction. However, since the size of the laser beam 10 should be changed to accommodate the plurality of unit processing regions 110 that increase or decrease at a constant rate according to the curvature of each guide line 11, it may be advantageous to adjust the laser head The rate of movement of 50 is such that the resulting velocity vectors in the x-axis direction, y-axis direction, and z-axis direction are constant.

In addition, the time during which the laser head 50 passes (or scans) each guide line 11 is constant, so that a pattern with uniform quality can be obtained for all of the plurality of unit processing regions 110.

In the process of setting the plurality of unit processing areas 110 (step S120), the central unit processing area 110 in each guide line 11 may be set larger than the unit processing areas 110 located on both end portions of the guide line. . Since the pulling force applied when the workpiece 100 is stretched varies according to the position of the unit processing area 110, the size of the unit processing area 110 can be determined according to the pulling force applied at each position. The expansion force in the first axis direction 21 generated by stretching the workpiece 100 in the first axis direction 21 may be applied in the first axis direction 21 from both end portions of the workpiece 100 in the first axis direction 21 To the center of the workpiece 100. Therefore, the expansion force at the two ends of the workpiece 100 in the first axis direction 21 may be the largest, and the expansion force at the center of the workpiece 100 in the first axis direction 21 may be the smallest. Therefore, the unit processing region 110 of the central portion where the guide wire 11 is expanded relatively little may be set larger than the unit processing region 110 on the two end portions which are relatively expanded on the guide wire 11. In addition, compared to the two end portions of the workpiece 100 in the first axis direction 21, the central portion of the workpiece 100 in the first axis direction 21 can receive more contraction force of the workpiece 100 in the second axis direction 22 . This may be the reason (or factor) that the central unit processing area 110 on each guide line 11 is set larger than the unit processing area 110 located on both end portions.

In the process of setting the plurality of unit processing areas 110 (step S120), the unit processing area 110 located at the center of each guide line 11 may be set to a distance from the center line of the workpiece 100 in the first axis direction 21. The farther, the unit processing area 110 is larger. The expansion force in the second axis direction 22 generated by stretching the workpiece 100 in the first axis direction 21 may be applied to the workpiece 100 in the first axis direction 21 from both sides of the workpiece 100 in the second axis direction 22. Center line. Therefore, as far as the centerline of the workpiece 100 in the first axis direction 21 is concerned, the contraction force can be strongest on both sides of the workpiece 100 in the second axis direction 22 and at the center of the workpiece 100 in the first axis direction 21 The shrinkage force at the line can be the weakest. Therefore, the unit processing areas 110 (relatively contracted) of the guide line 11 on both sides of the workpiece 100 in the second axis direction 22 may be set to be larger than the guide line 11 located in the workpiece 100 and in the first The unit processing area 110 (relatively shrunk) adjacent to the center line in the axial direction 21. In addition, compared to the centerline of the workpiece 100 in the first axis direction 21, both sides of the workpiece 100 in the second axis direction 22 can receive more expansion force in the first axis direction 21 of the workpiece 100. This may be to set the unit processing areas 110 of the guide line 11 on both sides of the workpiece 100 in the second axis direction 22 larger than the center of the guide line 11 in the workpiece 100 and in the first axis direction 21 One reason for the unit processing area 110 adjacent to the line. Therefore, the unit processing area 110 located at the center portion of each guide line 11 can also be set to be farther from the center line of the workpiece 100 in the first axis direction 21, the larger the unit processing area 110 is.

In the process of setting the plurality of unit processing areas 110 (step S120), the unit processing area 110 located at the center portion of each guide line 11 may be set to a center line in the first axis direction 21 from the workpiece 100. The further away, the unit processing area 110 increases at a constant ratio, and the constant ratio can be determined according to the strain of the workpiece 100.

Since the pulling force applied when the workpiece 100 is stretched is changed according to the position of the unit processing area 110, the size of the unit processing area 110 can be determined according to the pulling force applied at each position. At this time, the pulling force applied at each position may be proportional to the distance from the center line of the workpiece 100 in the first axis direction 21 to the position. Therefore, the unit processing area 110 located at the center portion of each guide line 11 can be set so that the farther away from the center line of the workpiece 100 in the first axis direction 21, the unit processing area 110 increases at a constant rate. Therefore, when the workpiece 100 is stretched in the first axis direction 21, the plurality of processing objects 110a may be corrected (or compensated) to a constant size.

The constant ratio may be determined according to the strain of the workpiece 100 and the pulling force applied to both ends of the workpiece 100 in the first axis direction 21. At this time, according to the strain of the workpiece 100 and the pulling force applied to both ends of the workpiece 100 in the first axis direction 21, the size of the unit processing area 110 at each position can be calculated.

Since a tensile force is applied to both ends of the workpiece 100 in the first axis direction 21, compressive stress is generated on both sides of the center portion of the workpiece 100 in the second direction 22, and therefore, the workpiece shrinks. At this time, the degree of contraction varies depending on the strength of the tensile force applied to both ends of the workpiece 100 in the first axis direction 21. When the workpiece 100 is stretched in the first axis direction 21, the actually desired shape of the pattern of the plurality of processing objects 110a is formed so that the guides at the two sides of the workpiece 100 in the second axis direction 22 are guided The line 11 and the processing objects 110a arranged along the guide line are contracted to conform to the pulling force applied to both ends of the workpiece 100 in the first axis direction 21, and the guide line 11 and the processing object 110a become level. Therefore, the workpiece 100 is calculated (or measured) on the first axis on both sides of the center portion of the workpiece 100 in the second axis direction 22 according to the strength of the pulling force applied to both ends of the workpiece 100 in the first axis direction 21. A contraction amount (or contraction force) in the direction 21, and the shape (or size) of the unit processing area 110 may be corrected (or compensated) according to the calculated amount (or size).

In this case, the guide lines 11 on both sides of the workpiece 100 in the second axis direction 22 are formed into a curved shape, and the unit processing area 110 of the central portion of each guide line 11 is larger than that on the two end portions. The further the unit processing area 110 is from the center line of the workpiece 100 in the first direction 21, the larger the unit processing area 110 at the center portion of each guide line 11 may be. At this time, the curvature (or radius of curvature) of the guide line 11 can be calculated according to the distance between the straight line (ie, the chord) connecting the two ends of the guide line and the center of the guide line 11, and can be calculated according to A stiffness is applied to each position to determine the length of a straight line connecting the two ends of the guide wire 11 and the shape (or size) of the unit processing area 110 at each position.

In addition, depending on the strain determined by the rigidity of the workpiece 100 or the like, the amount of shrinkage (or the application of a tensile force) varies at each position. Therefore, a constant ratio can be determined by considering the strain of the workpiece 100. In addition, at least one factor of the thickness of the workpiece 100, the material of the workpiece 100, the size of the pattern formed by the plurality of processing regions 110, and the size of the processing object 110a may be considered when the workpiece 100 is stretched.

In the process of setting the plurality of unit processing regions 110 (step S120), the unit processing regions 110 on both ends of the plurality of guide lines 11 may be set to a constant size. At this time, the plurality of guide lines 11 may have straight lines connecting the two ends of the guide line 11 and have the same length, and the interval between the straight lines connecting the two ends of the guide line 11 may be constant. That is, the unit processing regions 110 located on both ends of the plurality of guide lines 11 may be disposed on the same line so as to be spaced apart from each other in the second axis direction 22 of the workpiece 100.

Since parallel tensile forces are applied to both ends of the workpiece 100 in the first axis direction 21, when the workpiece 100 is stretched in the first axis direction 21, the processing objects located on both ends of the plurality of guide lines 11 110a may have the same position change. In addition, since the distance from both ends of the workpiece 100 in the first direction 21 is the same, and therefore the expansion of the workpiece in the first direction 21 can be the same, and since it is not in the center portion of the workpiece 100, the workpiece 100 There may be little contraction force on both sides in the second axis direction 22. Therefore, the unit processing regions 110 located at both ends of the plurality of guide lines 11 can be set to a constant size. Therefore, when the workpiece 100 is stretched in the first axis direction 21, the sizes of the processing objects 110a may be the same, and a pattern having a uniform size and interval may be obtained.

As such, in the exemplary embodiment, the plurality of guide lines 11 having a curvature calculated according to the strain of the workpiece 100 and the tensile force applied to the workpiece 100 may be provided on the workpiece 100 so that a plurality of units can be processed The region 110 is set to a position where a change in position due to stretching is compensated. In addition, the change of the processed shape according to the position of the unit processing area 110 is calculated through the strain of the workpiece 100 and the tensile force applied to the workpiece 100, and thus the size of each unit processing area 110 can be determined. Therefore, when the workpiece 100 is stretched, a change in position and a change in the shape of the processed object 110a can be compensated.

FIG. 4 is a view illustrating a mask assembly made through a method of manufacturing a mask assembly according to another exemplary embodiment.

Referring to FIG. 4, a method for manufacturing a mask assembly according to another exemplary embodiment will be explained in more detail, and portions related to the laser processing method according to the exemplary embodiment explained above will be omitted. Duplicate content.

A method of manufacturing a mask assembly according to another exemplary embodiment may include providing a mask bar 210 in which a workpiece is processed through a laser processing method according to an exemplary embodiment in each of the mask bars 210. 100 and a plurality of processing holes 211 are formed according to a plurality of unit processing areas 110 (step S210); and the mask rod 210 is stretched in the first axis direction 21 and the mask rod 210 is fixed to a frame having an opening (step S220) ).

First, a mask rod 210 is provided, in each of which a workpiece 100 is processed through a laser processing method according to an exemplary embodiment, and a plurality of processing holes 211 are formed according to a plurality of unit processing regions 110 ( Step S210). The mask rod 210 may be provided by processing the workpiece 100 by a laser processing method according to an exemplary embodiment. At this time, a plurality of processing holes 211 may be formed according to a plurality of unit processing regions 110, and a plurality of processing objects 110a (in the plurality of processing objects 110a, the plurality of unit processing regions 110 are processed) may be the A plurality of processed holes 211. Before the mask stick is stretched, in order to fix the mask stick to the frame 220, the plurality of processing holes 211 may be arranged to be spaced apart from each other along a plurality of guide lines 11 including a curve, and thus a pattern may be formed. In addition, according to the shape (or form) of the plurality of guide lines 11, starting from the two end portions of the pattern in the first axis direction 21, the closer to the center portion, the pattern is perpendicular to the first axis direction 21 The width in the direction (ie, the direction of the second axis) can be larger.

The mask assembly 200 may be formed by aggregating a plurality of mask rods 210, and the mask assembly 200 may be composed of at least two mask rods 210, and although four mask rods 210 are shown in FIG. Are examples, and the exemplary embodiments are not limited thereto.

In addition, each of the mask sticks 210 may have a thin rectangular plate shape, the plurality of processing holes 211 may be formed at a predetermined regular pitch in the first axis direction 21, and the blocking region may be formed at the substrate. The periphery of the pattern formed by the plurality of processing holes 211 is described. In addition, as shown in FIG. 4, the shape of the pattern formed by the plurality of processed holes 211 and the shape of the plurality of processed holes 211 are different before and after fixing the mask bar 210 to the frame 220. This will be explained in more detail below.

For example, each of the mask rods may be a magnetic thin plate, and may be composed of nickel or a nickel alloy, or may be formed by using a nickel-cobalt alloy that can be easily formed into a fine pattern and has excellent properties. Surface roughness.

Next, the mask rod 210 is stretched in the first axis direction 21 (or in a length direction extending in the first axis direction) and fixed to the frame 220 having an opening portion (step S220). The frame 220 may have an opening portion and is formed of an elastic material, but the embodiment is not limited thereto. In addition, since the mask bar 210 is supported by the frame 220 in a stretched state, the frame 220 may be sufficiently rigid to stably support the mask bar 210. In addition, a structure may be used for the frame 220 as long as the deposited object and the mask assembly 200 are in close contact in the structure, and the two do not interfere with each other.

Both ends of the mask rod 210 in the first axis direction 21 may be fixed to the frame 220 while applying a predetermined pulling force to the mask rod 210 in the first axis direction 21 (or the length direction). At this time, the plurality of processing holes 211 of the mask bar 210 are all located in the opening portion. Here, various methods (for example, laser welding or resistance heating welding) may be applied as the fixing method, but in consideration of a change in accuracy, etc., a laser welding method may be used. In addition, the mask bars 210 may be arranged and welded to form a predetermined gap between the mask bars 210.

According to an exemplary embodiment, the shape of the pattern formed by the plurality of processed holes 211 and the shape of the plurality of processed holes 211 are different before and after fixing the mask bar 210 to the frame.

5 is a conceptual diagram illustrating shape compensation of a processed hole by stretching a mask rod according to an exemplary embodiment, FIG. 5 (a) illustrates a mask rod before stretching, and FIG. 5 (b) illustrates Mask stick after stretching.

Referring to FIG. 5, in the process of stretching the mask rod 210 in the first axis direction 21 and fixing the mask rod 210 (step S220), each side of the mask rod 210 in the first axis direction 21 may face each other. Both ends of a guide wire 11 apply a parallel tensile force.

Generally, when an integrated mask is fixed to a frame, the mask is stretched in four directions and the mask is fixed to the frame. However, as in the exemplary embodiment, a mask assembly configured from a plurality of mask bars 210 may be configured by stretching each of the separate mask bars 210 only in the first axis direction 21 of the mask bars 210. 200 is fixed to the frame 220. In this case, the mask rod 210 may be in a direction perpendicular to the stretching direction (that is, the second axis direction) due to the tensile force generated in the stretching direction of the mask rod 210 (that is, the first axis direction). ) Shrink.

Here, since the curve can be stretched into a straight line only when the same stretching force is applied to both ends of each guide wire 11, the two sides of the mask rod 210 in the first axis direction 21 can face each other. The same tensile force is applied to both ends of one guide wire 11. Therefore, when the mask stick 210 is stretched in the first axis direction 21, the plurality of processing holes 211 arranged in a curved shape on the curved guide line 11 may be arranged in a line (or in a linear shape). . In addition, the mask can be stretched in the first axis direction 21 only when parallel stretching forces are applied to both ends of the plurality of guide wires 11 toward the two sides of the mask rod 210 in the first axis direction 21. In the mold bar 210, the plurality of processing holes 211 are arranged in parallel (or side by side).

At this time, the strain of the mask rod 210 in the transaxial direction (or vertical direction) on the mask rod can be determined through the thickness or material of the mask rod 210 or the shape, size, position, etc. of the plurality of processed holes 211. The ratio of 210 strain in the tensile direction (ie, Poisson ratio).

The mask bar 210 shown in (a) of FIG. 5 illustrates an example of compensation and design by considering all factors that affect the above-mentioned Poisson's ratio.

During the process of stretching the mask rod 210 in the first axis direction 21 and fixing the mask rod 210 (step S220), the plurality of processing holes 211 may be arranged in a two-dimensional manner in a straight line (or in a grid shape). ), And the sizes of the plurality of processing holes 211 may be uniform. Here, the term "uniform" may include not only the same, but also substantially the same within a predetermined tolerance. Referring to FIG. 5 (b), after stretching both ends of the mask rod in the first axis direction 21 and fixing the mask rod to the frame 220, a pattern formed by the plurality of processing holes 211 The first axis direction 21 may have the same width in a direction perpendicular to the first axis direction 21. That is, the plurality of processing holes 211 may be arranged in a two-dimensional manner in a straight line, the sizes of the plurality of processing holes 211 may be uniform, and all the intervals and arrays may be uniformly arranged. Therefore, the organic material deposited through the plurality of aligned processing holes 211 and deposited can be accurately deposited on a desired position.

As such, in the exemplary embodiment, a plurality of guide lines are provided on the workpiece in a first axis direction of the plate-shaped workpiece, the plurality of guide lines includes a curve, and a plurality of unit processing areas are processed, the plurality of units The position of the processing area is guided by the plurality of guide lines, and thus when the workpiece is stretched, changes in the shape and position of the processed part can be compensated. That is, a plurality of guide lines whose curvature is calculated according to the strain of the workpiece are provided on the workpiece, so that the unit processing area can be set at a position where the position change can be compensated. In addition, according to the position of the unit processing area, the change of the processed shape is calculated through the strain of the workpiece, and the size of each unit processing area can be determined. Therefore, when the workpiece is stretched, the change in position and the shape of the machined part can be compensated. Therefore, when forming a mask bar in which a workpiece has been processed and a processing hole has been formed, differences in the position, size, and shape of the processing hole are compensated, and standards or specifications such as position accuracy, size, and shape of each processing hole are formed. Available. In addition, a plurality of unit processing areas are processed while moving the irradiation position of the laser beam along each guide line, and therefore, a plurality of unit processing areas can be processed at a constant rate with reference to each guide line. Therefore, a machining object with uniform quality can be obtained with each unit processing area. In addition, the height of the laser head is adjusted and the size of the laser beam is adjusted according to the change in the size of the unit processing area, and therefore, a plurality of units having different sizes at each position can be irradiated with a laser beam having a uniform energy. Area. Therefore, the workpiece can be processed with a constant number of repetitions, and uniform processing can be performed over the entire area of the workpiece.

In the laser processing method according to an exemplary embodiment, a plurality of guide lines are provided on the workpiece in a first axis direction of the plate-shaped workpiece, the plurality of guide lines includes a curve, and a plurality of unit processing areas are processed, so The positions of the plurality of unit processing areas are guided by the plurality of guide lines, and thus when the workpiece is stretched, changes in the shape and position of the processed can be compensated. That is, by providing a plurality of guide lines whose curvature is calculated according to the strain of the workpiece on the workpiece, the unit processing area can be set at a position where the position change can be compensated. In addition, since the size of each unit processing area can be determined by considering the change of the processed shape calculated according to the position of the unit processing area, when the workpiece is stretched, the position change and the change of the processed shape can be compensated.

Therefore, when forming a processing hole in a mask rod through the laser processing method of the exemplary embodiment, the difference in the position, size, and shape of the processing hole is when the mask rod is stretched and the mask rod is fixed to the frame Compensated, such as the location accuracy, size, and shape of each machined hole can be met.

In addition, a plurality of unit processing areas are processed while moving the irradiation position of the laser beam along each guide line, and therefore, a plurality of unit processing areas can be processed at a constant rate with reference to each guide line. Therefore, a machining object with uniform quality can be obtained with each unit processing area.

In addition, the height of the laser head is adjusted according to the change in the size of the unit processing area, thereby adjusting the size of the laser beam, and therefore, a plurality of cells having different sizes at each position can be irradiated with a laser beam having uniform energy Processing Zone. Therefore, the workpiece can be processed with a constant number of repetitions, and uniform processing can be performed over the entire area of the workpiece.

The meaning of the term "on" used in the above description includes a case of direct contact and a case of being positioned facing the upper part or the lower part but not directly touching the part, and may include not only being positioned partially facing the entire top The case of a surface or a lower surface also includes a case that is positioned to partially face the surface, and is used as a meaning of facing the upper or lower surface in a position spaced from or in direct contact with the surface. Therefore, the term "on the workpiece" may refer to the surface (upper or lower surface) of the workpiece, and may also be the surface of a film deposited on the surface of the workpiece.

So far, preferred embodiments have been explained in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described above, and those skilled in the art to which the present invention pertains should understand that various modifications and other equivalent embodiments can be made without departing from the subject matter of the present invention. Therefore, the protection scope of the present invention should be determined by the technical scope of the appended claims.

10‧‧‧laser beam

11‧‧‧Guidelines

21‧‧‧first axis direction / first axis / first direction

22‧‧‧second axis direction / second direction

23‧‧‧ height direction

50‧‧‧laser head

100‧‧‧Workpieces / Flat Workpieces

110‧‧‧Unit processing area / processing area / central unit processing area

110a‧‧‧processed object / uniformly processed object

200‧‧‧Mask assembly

210‧‧‧Mask stick

211‧‧‧machined hole / arranged machined hole

220‧‧‧Frame

S110, S120, S130‧‧‧ steps

A-A’‧‧‧ line segment

Exemplary embodiments can be understood in more detail by reading the following description in conjunction with the accompanying drawings, in which:

FIG. 1 is a flowchart illustrating a laser processing method according to an exemplary embodiment.

FIG. 2 is a conceptual diagram for explaining the setting of a guide line and a unit processing area according to an exemplary embodiment.

FIG. 3 is a conceptual diagram for explaining movement of a laser head according to an exemplary embodiment.

FIG. 4 is a view illustrating a mask assembly manufactured by a method of manufacturing a mask assembly according to another exemplary embodiment.

FIG. 5 is a conceptual diagram illustrating shape compensation of a processed hole by stretching a mask rod according to another exemplary embodiment.

Claims (15)

A laser processing method includes: Providing a plurality of guide lines on the workpiece in a first axis direction of the plate-shaped workpiece, the plurality of guide lines including a curve; Setting a plurality of unit processing areas disposed on the workpiece so as to be spaced apart from each other along the plurality of guide lines; and A laser beam is used to irradiate the plurality of unit processing regions while moving the irradiation position of the laser beam. The laser processing method according to item 1 of the scope of patent application, wherein two guide lines adjacent to each other among the plurality of guide lines have different curvatures. The laser processing method according to item 1 of the patent application scope, wherein The curved guide line of the plurality of guide lines forms an arc toward a side far from a center line of the workpiece in the first axis direction, and The farther from the center line of the workpiece in the first axis direction, the greater the curvature of the guide line. The laser processing method according to item 1 of the scope of patent application, wherein in the process of irradiating the plurality of unit processing areas with a laser beam, each guide line of the guide lines is emitted while moving. At the same time as the laser head of the laser beam, the plurality of processed regions are irradiated with the laser beam. The laser processing method according to item 4 of the scope of patent application, wherein in the process of irradiating the plurality of unit processing areas with a laser beam, each of the guide lines is moved at a constant rate The laser head. The laser processing method according to item 1 of the scope of patent application, wherein, in the process of irradiating the plurality of unit processing regions with a laser beam, the laser processing method The size changes the size of the laser beam correspondingly while moving the irradiation position of the laser beam along each of the guide lines. The laser processing method according to item 6 of the patent application scope, wherein in the process of irradiating the plurality of unit processing regions with a laser beam, the laser is changed by adjusting a height of the laser head The size of the beam. The laser processing method according to item 7 of the scope of patent application, wherein in the process of irradiating the plurality of unit processing regions with a laser beam, the three-dimensional coordinate values of the laser head are sequentially changed by While moving the irradiation position of the laser beam, the size of the laser beam is changed. The laser processing method according to item 1 of the scope of patent application, wherein in the process of setting the plurality of unit processing areas, a unit processing area in a central portion of each of the guide lines is set It is larger than the unit processing area on the two end portions. The laser processing method according to item 1 of the patent application scope, wherein in the process of setting the plurality of unit processing regions, the unit processing regions are spaced from the workpiece in a direction of the first axis. The farther the center line is, the larger the unit processing area in the center portion in each of the guide lines is set. The laser processing method according to item 10 of the patent application scope, wherein In the process of setting the plurality of unit processing areas, the farther the unit processing area is from the center line of the workpiece in the first axis direction, each of the guide lines The unit processing area in the center portion in is set larger at a constant ratio, and The constant ratio is determined based on the strain of the workpiece. The laser processing method according to item 1 of the patent application scope, wherein during the setting of the plurality of unit processing regions, the unit processing regions located on both ends of the plurality of guide lines are set to be constant the size of. A method of manufacturing a mask assembly includes: A workpiece is processed by the laser processing method according to any one of claims 1 to 12, and a mask bar is provided, and a plurality of processes are formed according to the plurality of unit processing areas in the mask bar. Holes; and The mask rod is stretched in the first axis direction and the mask rod is fixed to a frame having an opening portion. The method for manufacturing a mask assembly according to item 13 of the scope of patent application, wherein in the process of stretching the mask rod in the first axis direction to fix the mask rod, the mask rod is directed toward the mask. Both sides of the rod in the first axial direction apply parallel tensile forces to both ends of each of the guide wires. The method for manufacturing a mask assembly according to item 13 of the scope of patent application, wherein in the process of stretching the mask rod in the first axis direction to fix the mask rod, the plurality of processing The holes are arranged in a two-dimensional manner in a straight line, and the sizes of the plurality of processed holes are made uniform.