TW201927084A - Flexible circuit board structure - Google Patents
Flexible circuit board structure Download PDFInfo
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- TW201927084A TW201927084A TW106142520A TW106142520A TW201927084A TW 201927084 A TW201927084 A TW 201927084A TW 106142520 A TW106142520 A TW 106142520A TW 106142520 A TW106142520 A TW 106142520A TW 201927084 A TW201927084 A TW 201927084A
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- metal foil
- patterned metal
- foil layer
- circuit board
- flexible circuit
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 117
- 239000002184 metal Substances 0.000 claims abstract description 117
- 239000011888 foil Substances 0.000 claims abstract description 101
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明是有關於一種線路板結構，且特別是有關於一種軟性線路板結構。The present invention relates to a circuit board structure, and more particularly to a flexible circuit board structure.
現今之資訊社會下，人類對電子產品之依賴性與日俱增。為了因應現今電子產品高速度、高效能、且輕薄短小的要求，具有撓曲特性之可撓性線路板已逐漸應用於各種電子裝置中，例如筆記型電腦(Notebook PC)、行動電話(Cell Phone)、數位相機(digital camera)、個人數位助理器(Personal Digital Assistant, PDA)、印表機(printer)與光碟機(optical disk drive)等。值得注意的是，軟性線路板不僅可作為電性連接之用，更可用於承載晶片或其他電子元件，其應用層面相當廣泛。In today's information society, human dependence on electronic products is increasing. In order to meet the requirements of high speed, high efficiency, light weight and shortness of today's electronic products, flexible circuit boards with flexural characteristics have been gradually applied to various electronic devices, such as notebook computers (Notebook PCs) and mobile phones (Cell Phone). ), digital camera, personal digital assistant (PDA), printer, and optical disk drive. It is worth noting that the flexible circuit board can be used not only for electrical connection, but also for carrying wafers or other electronic components, and its application level is quite extensive.
一般而言，晶片等電子元件通常配設於軟性電路板上，且電子元件係與軟性電路板之連接墊連接。由於電子元件運作所產生熱能，造成軟性電路板與電子元件之溫度升高，因此連接墊與電子元件之連接處容易因為高溫，而產生劣化，進而造成電子元件失效。此外，配設於此軟性電路板之其他電子元件，也會因為軟性電路板之溫度升高，而造成其他電子元件本身之效能下降。In general, electronic components such as wafers are usually disposed on a flexible circuit board, and the electronic components are connected to the connection pads of the flexible circuit board. Due to the thermal energy generated by the operation of the electronic component, the temperature of the flexible circuit board and the electronic component is increased. Therefore, the connection between the connection pad and the electronic component is liable to be deteriorated due to high temperature, thereby causing the electronic component to fail. In addition, other electronic components disposed on the flexible circuit board may also degrade the performance of other electronic components due to the temperature rise of the flexible circuit board.
本發明提供一種軟性線路板結構，其具有良好的散熱效率。The invention provides a flexible circuit board structure which has good heat dissipation efficiency.
本發明的軟性線路板結構適於承載一發熱元件並包括一軟性基板以及至少一導熱貫孔。軟性基板包括一絕緣層、一第一圖案化金屬箔層以及一第二圖案化金屬箔層，其中第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面。發熱元件適於設置於第一圖案化金屬箔層，且第二圖案化金屬箔層的一厚度大於第一圖案化金屬箔層的一厚度。導熱貫孔貫穿軟性基板，並與發熱元件熱耦接。The flexible circuit board structure of the present invention is adapted to carry a heat generating component and includes a flexible substrate and at least one thermally conductive through hole. The flexible substrate comprises an insulating layer, a first patterned metal foil layer and a second patterned metal foil layer, wherein the first patterned metal foil layer and the second patterned metal foil layer are respectively disposed on opposite surfaces of the insulating layer . The heating element is adapted to be disposed on the first patterned metal foil layer, and a thickness of the second patterned metal foil layer is greater than a thickness of the first patterned metal foil layer. The thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heat generating component.
在本發明的一實施例中，上述的軟性線路板結構更包括一圖案化金屬層，覆蓋於第一圖案化金屬箔層以及第二圖案化金屬箔層上，並至少覆蓋至少一導熱貫孔的內壁。In an embodiment of the invention, the flexible circuit board structure further includes a patterned metal layer covering the first patterned metal foil layer and the second patterned metal foil layer, and covering at least one of the heat conducting through holes The inner wall.
在本發明的一實施例中，上述的圖案化金屬層填滿至少一導熱貫孔。In an embodiment of the invention, the patterned metal layer fills at least one thermally conductive through hole.
在本發明的一實施例中，上述的至少一導熱貫孔的直徑實質上介於20微米（μm）至50微米之間。In an embodiment of the invention, the at least one thermally conductive through hole has a diameter substantially between 20 micrometers (μm) and 50 micrometers.
在本發明的一實施例中，上述的軟性線路板結構更包括一散熱片，設置於第二圖案化金屬箔層上。In an embodiment of the invention, the flexible circuit board structure further includes a heat sink disposed on the second patterned metal foil layer.
在本發明的一實施例中，上述的散熱片包括石墨片或鋁片。In an embodiment of the invention, the heat sink comprises a graphite sheet or an aluminum sheet.
在本發明的一實施例中，上述的第一圖案化金屬箔層以及第二圖案化金屬箔層的材料包括銅。In an embodiment of the invention, the material of the first patterned metal foil layer and the second patterned metal foil layer comprises copper.
在本發明的一實施例中，上述的發熱元件設置於軟性基板的一元件設置區並與第一圖案化金屬箔層熱耦接，至少一導熱貫孔設置於元件設置區的外圍。In an embodiment of the invention, the heat generating component is disposed in a component mounting region of the flexible substrate and thermally coupled to the first patterned metal foil layer, and at least one thermally conductive through hole is disposed at a periphery of the component mounting region.
在本發明的一實施例中，上述的發熱元件設置於軟性基板的一元件設置區並與第一圖案化金屬箔層熱耦接，至少一導熱貫孔設置於元件設置區內並與發熱元件連接。In an embodiment of the invention, the heat generating component is disposed in a component mounting region of the flexible substrate and is thermally coupled to the first patterned metal foil layer, and at least one thermally conductive through hole is disposed in the component mounting region and is associated with the heat generating component connection.
在本發明的一實施例中，上述的第一圖案化金屬箔層包括彼此電性絕緣的一線路部以及一散熱部，發熱元件電性連接線路部並熱耦接散熱部。In an embodiment of the invention, the first patterned metal foil layer includes a line portion electrically insulated from each other and a heat dissipating portion, and the heating element is electrically connected to the line portion and thermally coupled to the heat dissipating portion.
基於上述，本發明實施例的軟性線路板結構包括軟性基板以及導熱貫孔。軟性基板的第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面，且第二圖案化金屬箔層的厚度大於第一圖案化金屬箔層的厚度。導熱貫孔貫穿軟性基板並熱耦接設置於第一圖案化金屬箔層上的發熱元件。如此配置，發熱元件運作時所產生的熱可經由與之熱耦接的導熱貫孔而傳導至第二圖案化金屬箔層，並且，第二圖案化金屬箔層的厚度較厚，可有效增進熱傳導及散熱的效率，進而可將熱迅速地散逸至外界。因此，本發明實施例可有效提升軟性線路板結構的散熱效率。Based on the above, the flexible circuit board structure of the embodiment of the present invention includes a flexible substrate and a thermally conductive through hole. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively disposed on opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is greater than the thickness of the first patterned metal foil layer. The thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heat generating component disposed on the first patterned metal foil layer. In this way, the heat generated when the heating element operates can be conducted to the second patterned metal foil layer via the thermally conductive through hole thermally coupled thereto, and the thickness of the second patterned metal foil layer is thick, which can effectively improve The heat transfer and heat dissipation efficiency can quickly dissipate heat to the outside world. Therefore, the embodiment of the invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本發明。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.
圖1至圖4是依照本發明的一實施例的一種軟性線路板結構的製作流程剖面示意圖。在本實施例中，軟性線路板結構100適於承載一發熱元件200，並可對此發熱元件200進行散熱。本實施例的軟性線路板結構100的製作流程包括下列步驟。請先參照圖1，提供如圖1的一軟性基板110a，其包括一絕緣層112以及一第一金屬箔層113以及一第二金屬箔層115。在本實施例中，第一金屬箔層113以及第二金屬箔層115如圖1所示之分別設置於絕緣層112的相對兩表面。第二金屬箔層115的厚度D2大於第一金屬箔層113的厚度D1。在本實施例中，第一金屬箔層113以及第二金屬箔層115的材料包括銅，也就是說，第一金屬箔層113以及第二金屬箔層115可為厚度不同的兩銅箔層，其分別壓合於絕緣層112的相對兩表面。1 to FIG. 4 are schematic cross-sectional views showing a manufacturing process of a flexible circuit board structure according to an embodiment of the invention. In the present embodiment, the flexible circuit board structure 100 is adapted to carry a heat generating component 200 and to dissipate heat from the heat generating component 200. The manufacturing process of the flexible circuit board structure 100 of this embodiment includes the following steps. Referring to FIG. 1 , a flexible substrate 110 a as shown in FIG. 1 includes an insulating layer 112 and a first metal foil layer 113 and a second metal foil layer 115 . In the present embodiment, the first metal foil layer 113 and the second metal foil layer 115 are respectively disposed on opposite surfaces of the insulating layer 112 as shown in FIG. The thickness D2 of the second metal foil layer 115 is greater than the thickness D1 of the first metal foil layer 113. In this embodiment, the material of the first metal foil layer 113 and the second metal foil layer 115 includes copper, that is, the first metal foil layer 113 and the second metal foil layer 115 may be two copper foil layers having different thicknesses. They are respectively pressed against the opposite surfaces of the insulating layer 112.
請參照圖2，形成貫孔120a於軟性基板110a上，其中，貫孔120a貫穿軟性基板110a。在本實施例中，貫孔120a的形成方式可包括雷射或是機械鑽孔等。在本實施例中，貫孔120a的直徑約可介於20微米（μm）至50微米之間。當然，本實施例僅用以舉例說明，本發明並不限制形成貫孔120a的直徑及其形成方法。Referring to FIG. 2, a through hole 120a is formed on the flexible substrate 110a, wherein the through hole 120a penetrates through the flexible substrate 110a. In this embodiment, the through hole 120a may be formed in a manner of laser or mechanical drilling or the like. In this embodiment, the through hole 120a may have a diameter of between about 20 micrometers (μm) and 50 micrometers. Of course, this embodiment is for illustrative purposes only, and the present invention does not limit the diameter of the through hole 120a and the method of forming the same.
接著，請參照圖3，形成一金屬層130a，其覆蓋於第一金屬箔層113以及第二金屬箔層115上，並至少覆蓋貫孔120a的內壁，以形成導熱貫孔120。在本實施例中，導熱貫孔120的直徑約可介於20微米（μm）至50微米之間，而金屬層130a可例如透過電鍍的方式而形成，以全面性覆蓋第一金屬箔層113以及第二金屬箔層115上並可填滿貫孔120a。在其他實施例中，若貫孔120a的直徑較大（例如貫孔120a的直徑大於50微米），金屬層130a亦可僅覆蓋貫孔120a的內壁，之後再以填孔材料填滿貫孔120a。Next, referring to FIG. 3, a metal layer 130a is formed on the first metal foil layer 113 and the second metal foil layer 115, and covers at least the inner wall of the through hole 120a to form the heat conducting through hole 120. In the present embodiment, the diameter of the thermally conductive through hole 120 may be between about 20 micrometers (μm) and 50 micrometers, and the metal layer 130a may be formed, for example, by electroplating to cover the first metal foil layer 113 in a comprehensive manner. And the second metal foil layer 115 can fill the through hole 120a. In other embodiments, if the diameter of the through hole 120a is large (for example, the diameter of the through hole 120a is larger than 50 micrometers), the metal layer 130a may cover only the inner wall of the through hole 120a, and then fill the through hole with the hole filling material. 120a.
請參照圖4，接著，對第一金屬箔層113以及第二金屬箔層115以及覆蓋第一金屬箔層113以及第二金屬箔層115的金屬層130a進行一圖案化製程，以形成如圖4所示之第一圖案化金屬箔層114、第二圖案化金屬箔層116以及覆蓋第一圖案化金屬箔層114及第二圖案化金屬箔層116的圖案化金屬層130。如此，本實施例的軟性線路板結構100即可大致完成。Referring to FIG. 4, a first patterning process is performed on the first metal foil layer 113 and the second metal foil layer 115 and the metal layer 130a covering the first metal foil layer 113 and the second metal foil layer 115 to form a pattern. The first patterned metal foil layer 114, the second patterned metal foil layer 116, and the patterned metal layer 130 covering the first patterned metal foil layer 114 and the second patterned metal foil layer 116 are shown in FIG. Thus, the flexible circuit board structure 100 of the present embodiment can be substantially completed.
就結構上而言，本實施例的軟性線路板結構100包括軟性基板110以及至少一導熱貫孔120。軟性基板110包括絕緣層112、第一圖案化金屬箔層114、第二圖案化金屬箔層116以及圖案化金屬層130，其中，第一圖案化金屬箔層114以及第二圖案化金屬箔層116分別設置於絕緣層112的相對兩表面，且第二圖案化金屬箔層116的厚度D2大於第一圖案化金屬箔層114的厚度D1。圖案化金屬層130覆蓋於第一圖案化金屬箔層114以及第二圖案化金屬箔層116上，並至少覆蓋導熱貫孔120的內壁。如此，發熱元件200可如圖4所示之設置於第一圖案化金屬箔層114上，且導熱貫孔120貫穿軟性基板110，並與發熱元件200熱耦接。如此配置，發熱元件200運作時所產生的熱可經由與之熱耦接的導熱貫孔120而傳導至第二圖案化金屬箔層116，並且，第二圖案化金屬箔層116的厚度D2較厚，可有效增進熱傳導及散熱的效率。Structurally, the flexible circuit board structure 100 of the present embodiment includes a flexible substrate 110 and at least one thermally conductive through hole 120. The flexible substrate 110 includes an insulating layer 112, a first patterned metal foil layer 114, a second patterned metal foil layer 116, and a patterned metal layer 130, wherein the first patterned metal foil layer 114 and the second patterned metal foil layer 116 are respectively disposed on opposite surfaces of the insulating layer 112, and the thickness D2 of the second patterned metal foil layer 116 is greater than the thickness D1 of the first patterned metal foil layer 114. The patterned metal layer 130 covers the first patterned metal foil layer 114 and the second patterned metal foil layer 116 and covers at least the inner wall of the thermally conductive through hole 120. As such, the heat generating component 200 can be disposed on the first patterned metal foil layer 114 as shown in FIG. 4 , and the thermally conductive through hole 120 extends through the flexible substrate 110 and is thermally coupled to the heat generating component 200 . So, the heat generated when the heating element 200 operates can be conducted to the second patterned metal foil layer 116 via the thermally conductive through hole 120 thermally coupled thereto, and the thickness D2 of the second patterned metal foil layer 116 is higher. Thick, can effectively improve the efficiency of heat conduction and heat dissipation.
在本實施例中，發熱元件200可如圖4所示之設置於軟性基板100的元件設置區A1上，並與圖案化金屬層130以及第一圖案化金屬箔層114熱耦接。本實施例中，導熱貫孔120可設置於元件設置區A1以外。並且，導熱貫孔120的數量可為多個，在這樣的配置下，導熱貫孔120可環繞元件設置區A1設置，並經由第一圖案化金屬箔層114而與發熱元件200熱耦接。也就是說，導熱貫孔120的設置位置可不與元件設置區A1重疊。在本實施例中，發熱元件200可例如透過覆晶接合的方式設置於軟性線路板結構100上，並與圖案化金屬層130以及第一圖案化金屬箔層114熱耦接。當然，本發明並不以此為限，在其他實施例中，發熱元件200也可例如透過打線接合的方式設置於軟性線路板結構100上。In the present embodiment, the heat generating component 200 can be disposed on the component setting area A1 of the flexible substrate 100 as shown in FIG. 4 and thermally coupled to the patterned metal layer 130 and the first patterned metal foil layer 114. In this embodiment, the thermally conductive through hole 120 may be disposed outside the component setting area A1. Also, the number of thermally conductive through holes 120 may be plural. In such a configuration, the thermally conductive through holes 120 may be disposed around the element setting area A1 and thermally coupled to the heating element 200 via the first patterned metal foil layer 114. That is to say, the position where the heat conduction through hole 120 is disposed may not overlap with the element setting area A1. In the present embodiment, the heat generating component 200 can be disposed on the flexible wiring board structure 100 by, for example, flip chip bonding, and thermally coupled to the patterned metal layer 130 and the first patterned metal foil layer 114. Of course, the present invention is not limited thereto. In other embodiments, the heat generating component 200 can also be disposed on the flexible circuit board structure 100 by wire bonding.
在本實施例中，第一圖案化金屬箔層114可包括彼此電性絕緣的一線路部114a以及一散熱部114b，發熱元件200電性連接線路部114a並熱耦接散熱部114b，且導熱通孔120連接散熱部114b。舉例而言，發熱元件200可包括多個接墊，其分別連接至線路部114a及散熱部114b，導熱通孔120連接散熱部114b，如此配置，發熱元件200所產生的熱可經由散熱部114b以及與之連接的導熱貫孔120而傳導至第二圖案化金屬箔層116。對應地，第二圖案化金屬箔層116也可包括彼此電性絕緣的一線路部116a以及一散熱部116b，導熱貫孔120連接散熱部116b，以將熱傳導至第二圖案化金屬箔層116的散熱部116b而進行散熱。在本實施例中，軟性線路板結構100可包括多個通孔，其中，連接至散熱部114b及/或散熱部116b的通孔即為用以散熱的導熱通孔120，而連接至線路部114a及/或線路部116a的通孔則為用以電性連接的導電通孔122。In this embodiment, the first patterned metal foil layer 114 may include a line portion 114a electrically insulated from each other and a heat dissipating portion 114b. The heating element 200 is electrically connected to the line portion 114a and thermally coupled to the heat dissipating portion 114b, and is thermally conductive. The through hole 120 is connected to the heat radiating portion 114b. For example, the heating element 200 may include a plurality of pads respectively connected to the line portion 114a and the heat dissipation portion 114b. The heat conduction through hole 120 is connected to the heat dissipation portion 114b. The heat generated by the heat generating component 200 may be transmitted through the heat dissipation portion 114b. And a thermally conductive through hole 120 connected thereto is conducted to the second patterned metal foil layer 116. Correspondingly, the second patterned metal foil layer 116 may also include a line portion 116a electrically insulated from each other and a heat dissipating portion 116b. The heat conducting through hole 120 is connected to the heat dissipating portion 116b to conduct heat to the second patterned metal foil layer 116. The heat radiating portion 116b dissipates heat. In this embodiment, the flexible circuit board structure 100 may include a plurality of through holes, wherein the through holes connected to the heat dissipation portion 114b and/or the heat dissipation portion 116b are the heat conduction through holes 120 for heat dissipation, and are connected to the line portion. The through holes of the 114a and/or the line portion 116a are electrically conductive through holes 122 for electrical connection.
圖5是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。在此必須說明的是，本實施例的軟性線路板結構100與圖4的軟性線路板結構100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。請參照圖5，以下將針對本實施例的軟性線路板結構100與圖4之軟性線路板結構100的差異做說明。FIG. 5 is a cross-sectional view showing a flexible circuit board structure in accordance with an embodiment of the present invention. It should be noted that the flexible circuit board structure 100 of the present embodiment is similar to the flexible circuit board structure 100 of FIG. 4. Therefore, the present embodiment uses the component numbers and parts of the foregoing embodiments, wherein the same reference numerals are used. The same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiment, and the description is not repeated herein. Referring to FIG. 5, differences between the flexible circuit board structure 100 of the present embodiment and the flexible circuit board structure 100 of FIG. 4 will be described below.
在本實施例中，發熱元件200可設置於軟性基板110的元件設置區A1並與第一圖案化金屬箔層114熱耦接，並且，本實施例的導熱貫孔120設置於此元件設置區A1內並與發熱元件200連接。換句話說，導熱貫孔120的設置位置可與元件設置區A1重疊而使導熱貫孔120位於發熱元件200的下方。並且，在本實施例中，發熱元件200的電性接墊可直接連接導熱貫孔120，以使導熱貫孔120運作時所產生的熱能直接經由導熱貫孔120傳導至厚度較厚的第二圖案化金屬箔層116並進行散熱。In this embodiment, the heat generating component 200 can be disposed in the component setting area A1 of the flexible substrate 110 and thermally coupled to the first patterned metal foil layer 114, and the thermally conductive through hole 120 of the embodiment is disposed in the component setting area. A1 is connected to the heating element 200. In other words, the position where the heat conduction through hole 120 is disposed may overlap the element setting area A1 such that the heat conduction through hole 120 is located below the heat generating element 200. Moreover, in the embodiment, the electrical pads of the heat generating component 200 can be directly connected to the heat conducting through holes 120, so that the heat energy generated when the heat conducting through holes 120 operates is directly conducted to the second thicker thickness via the heat conducting through holes 120. The metal foil layer 116 is patterned and dissipated.
圖6是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。在此必須說明的是，本實施例的軟性線路板結構100與圖4的軟性線路板結構100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。請參照圖6，以下將針對本實施例的軟性線路板結構100與圖4之軟性線路板結構100的差異做說明。6 is a cross-sectional view showing the structure of a flexible wiring board in accordance with an embodiment of the present invention. It should be noted that the flexible circuit board structure 100 of the present embodiment is similar to the flexible circuit board structure 100 of FIG. 4. Therefore, the present embodiment uses the component numbers and parts of the foregoing embodiments, wherein the same reference numerals are used. The same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference may be made to the foregoing embodiment, and the description is not repeated herein. Referring to FIG. 6, the difference between the flexible circuit board structure 100 of the present embodiment and the flexible circuit board structure 100 of FIG. 4 will be described below.
在本實施例中，軟性線路板結構100更可包散熱片140，其設置於第二圖案化金屬箔層116上。進一步而言，散熱片140是設置於覆蓋第二圖案化金屬箔層116的圖案化金屬層130上。以增進熱傳導的效率，使傳導至第二圖案化金屬箔層116的熱能可經由散熱片140而快速散逸至外界。在本實施例中，散熱片140可包括石墨片或鋁片。並且，散熱片140可例如貼附於第二圖案化金屬箔層116的散熱部116b上。在使用石墨片作為散熱片140的實施例中，石墨片可大幅提高軟性線路板結構100在橫向（XY方向）上的熱傳導效率。在使用鋁片作為散熱片140的實施例中，鋁片可進一步增強軟性線路板結構100的剛性，以便於將軟性線路板結構100固定於其他電子元件上。In this embodiment, the flexible circuit board structure 100 further includes a heat sink 140 disposed on the second patterned metal foil layer 116. Further, the heat sink 140 is disposed on the patterned metal layer 130 covering the second patterned metal foil layer 116. In order to increase the efficiency of heat conduction, the heat energy conducted to the second patterned metal foil layer 116 can be quickly dissipated to the outside via the heat sink 140. In the present embodiment, the heat sink 140 may include a graphite sheet or an aluminum sheet. Also, the heat sink 140 may be attached to the heat dissipation portion 116b of the second patterned metal foil layer 116, for example. In the embodiment in which the graphite sheet is used as the heat sink 140, the graphite sheet can greatly improve the heat transfer efficiency of the flexible wiring board structure 100 in the lateral direction (XY direction). In embodiments where an aluminum sheet is used as the heat sink 140, the aluminum sheet can further enhance the rigidity of the flexible circuit board structure 100 to facilitate securing the flexible circuit board structure 100 to other electronic components.
綜上所述，本發明實施例的軟性線路板結構包括軟性基板以及導熱貫孔。軟性基板的第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面，且第二圖案化金屬箔層的厚度大於第一圖案化金屬箔層的厚度。導熱貫孔貫穿軟性基板並熱耦接設置於第一圖案化金屬箔層上的發熱元件。如此配置，發熱元件運作時所產生的熱可經由與之熱耦接的導熱貫孔而傳導至第二圖案化金屬箔層，並且，第二圖案化金屬箔層的厚度較厚，可有效增進熱傳導及散熱的效率，進而可將熱迅速地散逸至外界。因此，本發明實施例可有效提升軟性線路板結構的散熱效率。In summary, the flexible circuit board structure of the embodiment of the invention includes a flexible substrate and a thermally conductive through hole. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively disposed on opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is greater than the thickness of the first patterned metal foil layer. The thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heat generating component disposed on the first patterned metal foil layer. In this way, the heat generated when the heating element operates can be conducted to the second patterned metal foil layer via the thermally conductive through hole thermally coupled thereto, and the thickness of the second patterned metal foil layer is thick, which can effectively improve The heat transfer and heat dissipation efficiency can quickly dissipate heat to the outside world. Therefore, the embodiment of the invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧軟性線路板結構100‧‧‧Soft circuit board structure
110、110a‧‧‧軟性基板110, 110a‧‧‧Soft substrate
112‧‧‧絕緣層112‧‧‧Insulation
114‧‧‧第一圖案化金屬箔層114‧‧‧First patterned metal foil layer
114a‧‧‧線路部114a‧‧‧Line Department
114b‧‧‧散熱部114b‧‧‧Dissipation Department
116‧‧‧第二圖案化金屬箔層116‧‧‧Second patterned metal foil layer
116a‧‧‧線路部116a‧‧‧Line Department
116b‧‧‧散熱部116b‧‧‧Dissipation Department
113‧‧‧第一金屬箔層113‧‧‧First metal foil layer
115‧‧‧第二金屬箔層115‧‧‧Second metal foil layer
120a‧‧‧貫孔120a‧‧‧Tongkong
120‧‧‧導熱貫孔120‧‧‧Conducting through hole
122‧‧‧導電通孔122‧‧‧ conductive through holes
130‧‧‧圖案化金屬層130‧‧‧ patterned metal layer
130a‧‧‧金屬層130a‧‧‧metal layer
140‧‧‧散熱片140‧‧‧ Heat sink
200‧‧‧發熱元件200‧‧‧heating components
A1‧‧‧元件設置區A1‧‧‧Component setting area
D1、D2‧‧‧厚度D1, D2‧‧‧ thickness
圖1至圖4是依照本發明的一實施例的一種軟性線路板結構的製作流程剖面示意圖。 圖5是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。 圖6是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。1 to FIG. 4 are schematic cross-sectional views showing a manufacturing process of a flexible circuit board structure according to an embodiment of the invention. FIG. 5 is a cross-sectional view showing a flexible circuit board structure in accordance with an embodiment of the present invention. 6 is a cross-sectional view showing the structure of a flexible wiring board in accordance with an embodiment of the present invention.
Claims (10)
Priority Applications (4)
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| TW106142520A TWI702887B (en) | 2017-12-05 | 2017-12-05 | Flexible circuit board structure |
| CN201721838115.3U CN208094874U (en) | 2017-12-05 | 2017-12-26 | Flexible circuit board structure with heat conduction through hole |
| CN201711426326.0A CN109874223A (en) | 2017-12-05 | 2017-12-26 | Thermally conductive flexible circuit board structure |
| CN202310889072.5A CN116669286A (en) | 2017-12-05 | 2017-12-26 | Thermally conductive flexible circuit board structure |
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| DE102021116560A1 (en) | 2020-11-11 | 2022-05-12 | G2F Tech Co., Ltd. | CONDUCTIVE AND FLEXIBLE PLATE FOR HEAT DISSIPATION |
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| TWI890140B (en) * | 2023-09-18 | 2025-07-11 | 聚燁科技股份有限公司 | Thermally conductive board |
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| JP2501266B2 (en) * | 1991-11-15 | 1996-05-29 | 株式会社東芝 | Semiconductor module |
| US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
| JP5185683B2 (en) * | 2008-04-24 | 2013-04-17 | パナソニック株式会社 | LED module manufacturing method and lighting apparatus manufacturing method |
| JP2010021400A (en) * | 2008-07-11 | 2010-01-28 | Mitsui Mining & Smelting Co Ltd | Printed circuit board with excellent heat dissipation property |
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacturing method thereof and communication equipment |
| TWI391039B (en) * | 2010-07-30 | 2013-03-21 | Umu Technology Co Ltd | Circuit board with metal heat sink and manufacturing method thereof |
| DE102011077206B4 (en) * | 2011-06-08 | 2019-01-31 | Zf Friedrichshafen Ag | Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board |
| JP5794002B2 (en) * | 2011-07-07 | 2015-10-14 | ソニー株式会社 | Solid-state imaging device, electronic equipment |
| CN202535631U (en) * | 2011-12-28 | 2012-11-14 | 鋐鑫电光科技股份有限公司 | Alumina ceramic circuit board with metal pillars and its packaging structure |
| KR101418008B1 (en) * | 2012-07-10 | 2014-07-09 | 주식회사 케이씨씨 | Substrate for LED and LED heat-sink structure |
| JP6073637B2 (en) * | 2012-10-18 | 2017-02-01 | 株式会社小糸製作所 | Electronic unit |
| WO2014087470A1 (en) * | 2012-12-03 | 2014-06-12 | 株式会社メイコー | Circuit board and method for manufacturing circuit board |
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| US9706668B2 (en) * | 2014-10-24 | 2017-07-11 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, electronic module and method of manufacturing the same |
| KR20160108867A (en) * | 2015-03-09 | 2016-09-21 | 엘이디라이텍(주) | Flexible printed circuit board for LED lamp |
| TWI702887B (en) * | 2017-12-05 | 2020-08-21 | 同泰電子科技股份有限公司 | Flexible circuit board structure |
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| DE102021116560A1 (en) | 2020-11-11 | 2022-05-12 | G2F Tech Co., Ltd. | CONDUCTIVE AND FLEXIBLE PLATE FOR HEAT DISSIPATION |
| US11665859B2 (en) | 2020-11-11 | 2023-05-30 | G2F Tech Co., Ltd. | Heat dissipation conductive flexible board |
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| CN109874223A (en) | 2019-06-11 |
| CN116669286A (en) | 2023-08-29 |
| CN208094874U (en) | 2018-11-13 |
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