TW201913221A - Panoramic image capturing device with at least three lenses and panoramic image capturing module thereof - Google Patents
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B37/00—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe
- G03B37/04—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe with cameras or projectors providing touching or overlapping fields of view
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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Abstract
Description
本發明涉及一種全景影像擷取裝置及其全景影像擷取模組,特別是涉及一種具有至少三個鏡頭的全景影像擷取裝置及其全景影像擷取模組。 The invention relates to a panoramic image capturing device and a panoramic image capturing module thereof, and in particular to a panoramic image capturing device having at least three lenses and a panoramic image capturing module thereof.
全景影像是一種拍攝方式,其目的是為了能夠建立具有較大視野的影像。全景影像的產生方式為,將多張拍攝而得的原始影像(raw image)暫存並進行拼接之後,再通過多個影像信號處理器的後製處理,以製作成具有較大尺寸的全景影像。 Panoramic images are a way of shooting, the purpose of which is to be able to create images with a large field of view. A panoramic image is generated by temporarily storing and stitching raw images obtained by multiple shots, and then processing them by multiple image signal processors to produce a large-sized panoramic image. .
本發明所要解決的技術問題在於,針對現有技術的不足提供一種具有至少三個鏡頭的全景影像擷取裝置及其全景影像擷取模組。 The technical problem to be solved by the present invention is to provide a panoramic image capturing device with at least three lenses and a panoramic image capturing module in response to the shortcomings of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種具有至少三個鏡頭的全景影像擷取模組,其包括:一鏡頭結構、一光學結構、一單一個影像感測晶片以及一單一個影像信號處理器。所述鏡頭結構包括一用於擷取一第一預定影像光源的第一鏡頭組件、一用於擷取一第二預定影像光源的第二鏡頭組件以及一用於擷取一第三預定影像光源的第三鏡頭組件。所述光學結構設置在所述第一鏡頭組件、所述第二鏡頭組件以及所 述第三鏡頭組件三者之間。所述單一個影像感測晶片鄰近所述光學結構,其中,所述單一個影像感測晶片具有一第一影像感測區域、一第二影像感測區域以及一第三影像感測區域。所述單一個影像信號處理器電性連接於所述單一個影像感測晶片。其中,所述第一預定影像光源通過所述光學結構而投向所述第一影像感測區域,且所述第一預定影像光源通過所述第一影像感測區域的擷取而得到一第一影像信號。其中,所述第二預定影像光源通過所述光學結構而投向所述第二影像感測區域,且所述第二預定影像光源通過所述第二影像感測區域的擷取而得到一第二影像信號。其中,所述第三預定影像光源通過所述光學結構而投向所述第三影像感測區域,且所述第三預定影像光源通過所述第三影像感測區域的擷取而得到一第三影像信號。其中,所述第一影像信號、所述第二影像信號以及所述第三影像信號三者都傳送至所述單一個影像信號處理器,且所述第一影像信號、所述第二影像信號以及所述第三影像信號三者通過所述單一個影像信號處理器的處理而得到一全景影像。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a panoramic image capturing module with at least three lenses, which includes: a lens structure, an optical structure, and a single image sensor. Chip and a single image signal processor. The lens structure includes a first lens assembly for capturing a first predetermined image light source, a second lens assembly for capturing a second predetermined image light source, and a third predetermined image light source. Third lens assembly. The optical structure is disposed between the first lens assembly, the second lens assembly, and the third lens assembly. The single image sensing chip is adjacent to the optical structure, wherein the single image sensing chip has a first image sensing area, a second image sensing area, and a third image sensing area. The single image signal processor is electrically connected to the single image sensing chip. Wherein, the first predetermined image light source is projected to the first image sensing area through the optical structure, and the first predetermined image light source is obtained by acquiring the first image sensing area to obtain a first Image signal. Wherein, the second predetermined image light source is projected to the second image sensing area through the optical structure, and the second predetermined image light source obtains a second image by capturing the second image sensing area. Image signal. The third predetermined image light source is projected to the third image sensing area through the optical structure, and the third predetermined image light source is obtained by acquiring the third image sensing area to obtain a third Image signal. The first video signal, the second video signal, and the third video signal are all transmitted to the single video signal processor, and the first video signal and the second video signal are transmitted. And the three image signals are processed by the single image signal processor to obtain a panoramic image.
為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種具有至少三個鏡頭的全景影像擷取模組,其包括:一鏡頭結構、一光學結構、一單一個影像感測晶片以及一單一個影像信號處理器。所述鏡頭結構包括一用於擷取一第一預定影像光源的第一鏡頭組件、一用於擷取一第二預定影像光源的第二鏡頭組件以及一用於擷取一第三預定影像光源的第三鏡頭組件。所述光學結構設置在所述第一鏡頭組件、所述第二鏡頭組件以及所述第三鏡頭組件三者之間。所述單一個影像感測晶片鄰近所述光學結構,其中,所述單一個影像感測晶片具有通過所述光學結構以接收所述第一預定影像光源的一第一影像感測區域、通過所述光學結構以接收所述第二預定影像光源的一第二影像感測區域以及通過所述光學結構以接收所述第三預定影像光源的一第三影像 感測區域。所述單一個影像信號處理器電性連接於所述單一個影像感測晶片,其中,所述第一預定影像光源、所述第二預定影像光源以及所述第三預定影像光源三者通過所述單一個影像信號處理器的處理而得到一全景影像。 In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a panoramic image capturing module with at least three lenses, which includes: a lens structure, an optical structure, and a single image sensing Chip and a single image signal processor. The lens structure includes a first lens assembly for capturing a first predetermined image light source, a second lens assembly for capturing a second predetermined image light source, and a third predetermined image light source. Third lens assembly. The optical structure is disposed between the first lens assembly, the second lens assembly, and the third lens assembly. The single image sensing chip is adjacent to the optical structure, wherein the single image sensing chip has a first image sensing area that passes through the optical structure to receive the first predetermined image light source, passes through The optical structure receives a second image sensing area of the second predetermined image light source and a third image sensing area of the third predetermined image light source through the optical structure. The single image signal processor is electrically connected to the single image sensing chip, wherein the first predetermined image light source, the second predetermined image light source, and the third predetermined image light source pass through all three. A single image signal processor is described to obtain a panoramic image.
為了解決上述的技術問題,本發明所採用的另外再一技術方案是,提供一種具有至少三個鏡頭的全景影像擷取裝置,其包括:一外殼體以及一全景影像擷取模組。所述外殼體具有一第一透光視窗、一第二透光視窗以及一第三透光視窗。所述全景影像擷取模組設置在所述外殼體內,其中,所述全景影像擷取模組包括:一鏡頭結構、一光學結構、一單一個影像感測晶片以及一單一個影像信號處理器。所述鏡頭結構包括通過所述第一透光視窗以擷取一第一預定影像光源的一第一鏡頭組件、通過所述第二透光視窗以擷取一第二預定影像光源的一第二鏡頭組件以及通過所述第三透光視窗以擷取一第三預定影像光源的一第三鏡頭組件。所述光學結構設置在所述第一鏡頭組件、所述第二鏡頭組件以及所述第三鏡頭組件三者之間。所述單一個影像感測晶片鄰近所述光學結構,其中,所述單一個影像感測晶片具有通過所述光學結構以接收所述第一預定影像光源的一第一影像感測區域、通過所述光學結構以接收所述第二預定影像光源的一第二影像感測區域以及通過所述光學結構以接收所述第三預定影像光源的一第三影像感測區域。所述單一個影像信號處理器電性連接於所述單一個影像感測晶片,其中,所述第一預定影像光源、所述第二預定影像光源以及所述第三預定影像光源三者通過所述單一個影像信號處理器的處理而得到一全景影像。 In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a panoramic image capturing device having at least three lenses, which includes: an outer casing and a panoramic image capturing module. The outer casing has a first transparent window, a second transparent window, and a third transparent window. The panoramic image capturing module is disposed in the housing, wherein the panoramic image capturing module includes a lens structure, an optical structure, a single image sensing chip, and a single image signal processor. . The lens structure includes a first lens assembly for capturing a first predetermined image light source through the first transparent window, and a second lens assembly for capturing a second predetermined image light source through the second transparent window. A lens assembly and a third lens assembly through the third light-transmissive window to capture a third predetermined image light source. The optical structure is disposed between the first lens assembly, the second lens assembly, and the third lens assembly. The single image sensing chip is adjacent to the optical structure, wherein the single image sensing chip has a first image sensing area that passes through the optical structure to receive the first predetermined image light source, passes through The optical structure receives a second image sensing area of the second predetermined image light source and a third image sensing area of the third predetermined image light source through the optical structure. The single image signal processor is electrically connected to the single image sensing chip, wherein the first predetermined image light source, the second predetermined image light source, and the third predetermined image light source pass through all three. A single image signal processor is described to obtain a panoramic image.
本發明的其中一有益效果在於,本發明所提供的一種具有至少三個鏡頭的全景影像擷取裝置及其全景影像擷取模組,其能通過“所述單一個影像感測晶片具有通過所述光學結構以接收所述第一預定影像光源的一第一影像感測區域、通過所述光學結構以 接收所述第二預定影像光源的一第二影像感測區域以及通過所述光學結構以接收所述第三預定影像光源的一第三影像感測區域”以及“所述單一個影像信號處理器電性連接於所述單一個影像感測晶片”的技術方案,以使得所述第一預定影像光源、所述第二預定影像光源以及所述第三預定影像光源三者能通過所述單一個影像信號處理器的處理而得到一全景影像。 One of the beneficial effects of the present invention is that a panoramic image capturing device having at least three lenses and a panoramic image capturing module provided by the present invention can pass the "single image sensing chip The optical structure receives a first image sensing area of the first predetermined image light source, passes through the optical structure to receive a second image sensing area of the second predetermined image light source, and uses the optical structure to Receiving a third image sensing area of the third predetermined image light source "and a technical solution of" the single image signal processor is electrically connected to the single image sensing chip ", so that the first The three predetermined image light sources, the second predetermined image light source, and the third predetermined image light source can obtain a panoramic image through processing by the single image signal processor.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.
D‧‧‧全景影像擷取裝置 D‧‧‧Panoramic image capture device
C‧‧‧外殼體 C‧‧‧ Outer shell
W1‧‧‧第一透光視窗 W1‧‧‧The first transparent window
W2‧‧‧第二透光視窗 W2‧‧‧Second transparent window
W3‧‧‧第三透光視窗 W3‧‧‧The third transparent window
M‧‧‧全景影像擷取模組 M‧‧‧ panoramic image capture module
1‧‧‧鏡頭結構 1‧‧‧ lens structure
11‧‧‧第一鏡頭組件 11‧‧‧The first lens assembly
110‧‧‧第一鏡片 110‧‧‧first lens
12‧‧‧第二鏡頭組件 12‧‧‧Second lens assembly
120‧‧‧第二鏡片 120‧‧‧Second lens
13‧‧‧第三鏡頭組件 13‧‧‧Third lens assembly
130‧‧‧第三鏡片 130‧‧‧ Third lens
2‧‧‧光學結構 2‧‧‧ Optical Structure
20‧‧‧合光稜鏡 20‧‧‧Heguang
201‧‧‧第一反射面 201‧‧‧First reflecting surface
202‧‧‧第二反射面 202‧‧‧Second reflective surface
3‧‧‧單一個影像感測晶片 3‧‧‧Single image sensor chip
30‧‧‧單一個影像感測區域 30‧‧‧Single image sensing area
31‧‧‧第一影像感測區域 31‧‧‧First image sensing area
32‧‧‧第二影像感測區域 32‧‧‧Second image sensing area
33‧‧‧第三影像感測區域 33‧‧‧Third image sensing area
4‧‧‧單一個影像信號處理器 4‧‧‧ single image signal processor
L1‧‧‧第一預定影像光源 L1‧‧‧First scheduled image light source
L2‧‧‧第二預定影像光源 L2‧‧‧ Second scheduled image light source
L3‧‧‧第三預定影像光源 L3‧‧‧ Third scheduled image light source
S‧‧‧未經處理的影像信號 S‧‧‧Unprocessed video signal
S1‧‧‧第一影像信號 S1‧‧‧First image signal
S2‧‧‧第二影像信號 S2‧‧‧Second image signal
S3‧‧‧第三影像信號 S3‧‧‧ Third image signal
圖1為本發明第一實施例的全景影像擷取模組的側視示意圖。 FIG. 1 is a schematic side view of a panoramic image capturing module according to a first embodiment of the present invention.
圖2為本發明第一實施例的全景影像擷取模組的單一個影像感測晶片的俯視示意圖。 FIG. 2 is a schematic top view of a single image sensing chip of the panoramic image capturing module according to the first embodiment of the present invention.
圖3為本發明第二實施例的全景影像擷取模組的側視示意圖。 3 is a schematic side view of a panoramic image capturing module according to a second embodiment of the present invention.
圖4為本發明第二實施例的全景影像擷取模組的單一個影像感測晶片的俯視示意圖。 FIG. 4 is a schematic top view of a single image sensing chip of a panoramic image capturing module according to a second embodiment of the present invention.
圖5為本發明第二實施例的全景影像擷取模組的第一鏡頭組件、合光稜鏡以及第一影像感測區域相互配合的側視示意圖。 FIG. 5 is a schematic side view of a first lens assembly, a combined light source, and a first image sensing area of a panoramic image capturing module according to a second embodiment of the present invention.
圖6為本發明第二實施例的全景影像擷取模組的第二鏡頭組件、合光稜鏡以及第二影像感測區域相互配合的側視示意圖。 FIG. 6 is a schematic side view of a second lens assembly, a combined light source, and a second image sensing area of a panoramic image capturing module according to a second embodiment of the present invention.
圖7為本發明第二實施例的全景影像擷取模組的第主鏡頭組件、合光稜鏡以及第三影像感測區域相互配合的側視示意圖。 FIG. 7 is a schematic side view of a first main lens component, a combined light source, and a third image sensing area of a panoramic image capturing module according to a second embodiment of the present invention.
圖8為本發明第二實施例的全景影像擷取模組的另一種單一個影像感測晶片的俯視示意圖。 FIG. 8 is a schematic top view of another single image sensing chip of the panoramic image capturing module according to the second embodiment of the present invention.
圖9為本發明第三實施例的單一個影像感測晶片與單一個影像信號處理器相互配合的側視示意圖。 FIG. 9 is a schematic side view of the cooperation between a single image sensing chip and a single image signal processor according to a third embodiment of the present invention.
圖10為本發明第四實施例的全景影像擷取裝置的示意圖。 FIG. 10 is a schematic diagram of a panoramic image capturing device according to a fourth embodiment of the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“具有至少三個鏡頭的全景影像擷取裝置及其全景影像擷取模組”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is a description of the implementation of the “panoramic image capturing device with at least three lenses and its panoramic image capturing module” disclosed by the specific embodiments. Those skilled in the art may The content understands the advantages and effects of the present invention. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely a schematic illustration, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
[第一實施例] [First embodiment]
請參閱圖1與圖2所示,本發明第一實施例提供一種具有至少三個鏡頭的全景影像擷取模組M,其包括:一鏡頭結構1、一光學結構2、一單一個影像感測晶片3以及一單一個影像信號處理器4。 Please refer to FIG. 1 and FIG. 2. A first embodiment of the present invention provides a panoramic image capturing module M having at least three lenses, which includes: a lens structure 1, an optical structure 2, and a single image sensor. The test chip 3 and a single image signal processor 4.
首先,配合圖1與圖2所示,鏡頭結構1包括一用於擷取一第一預定影像光源L1的第一鏡頭組件11、一用於擷取一第二預定影像光源L2的第二鏡頭組件12以及一用於擷取一第三預定影像光源L3的第三鏡頭組件13。舉例來說,如圖1所示,第一鏡頭組件11與第二鏡頭組件12可以彼此相對應設置在所述光學結構2的兩相反側端面的一旁,也就是說第一鏡頭組件11與第二鏡頭組件12並不會相互錯位,此外所述第三鏡頭組件13可以設置在所述光學結構2的上方。另外,如圖1所示,第一鏡頭組件11可由一或者多個第一鏡片110所組成,第二鏡頭組件12可由一或者多個第二鏡片120所組成,並且第三鏡頭組件13可由一或者多個第三鏡片130所組成。圖1所採用的例子是,第一鏡頭組件11是由一第一鏡片110所組成,第二鏡頭組件12是由一第二鏡片120所組成,第三鏡頭組件13是由一第三鏡片130所組成,然而此舉例 並非用來限定本發明。 First, as shown in FIG. 1 and FIG. 2, the lens structure 1 includes a first lens assembly 11 for capturing a first predetermined image light source L1 and a second lens for capturing a second predetermined image light source L2. The component 12 and a third lens component 13 for capturing a third predetermined image light source L3. For example, as shown in FIG. 1, the first lens assembly 11 and the second lens assembly 12 may be disposed on one side of the opposite end faces of the optical structure 2 corresponding to each other, that is, the first lens assembly 11 and the first lens assembly 11 The two lens components 12 are not misaligned with each other, and the third lens component 13 may be disposed above the optical structure 2. In addition, as shown in FIG. 1, the first lens assembly 11 may be composed of one or more first lenses 110, the second lens assembly 12 may be composed of one or more second lenses 120, and the third lens assembly 13 may be composed of one Or a plurality of third lenses 130. The example used in FIG. 1 is that the first lens assembly 11 is composed of a first lens 110, the second lens assembly 12 is composed of a second lens 120, and the third lens assembly 13 is composed of a third lens 130 Composition, however, this example is not intended to limit the invention.
再者,如圖1所示,光學結構2可以被設置在第一鏡頭組件11與第二鏡頭組件12之間。舉例來說,光學結構2可為一合光稜鏡20(例如X-cube稜鏡),光學結構2具有彼此交又設置一第一反射面201以及一第二反射面202,並且第一反射面201與第二反射面202都會形成在合光稜鏡20的內部。 Furthermore, as shown in FIG. 1, the optical structure 2 may be disposed between the first lens assembly 11 and the second lens assembly 12. For example, the optical structure 2 may be a combined light beam 20 (such as X-cube 稜鏡). The optical structure 2 has a first reflection surface 201 and a second reflection surface 202 intersecting each other, and the first reflection Both the surface 201 and the second reflective surface 202 are formed inside the light-combining unit 20.
此外,配合圖1與圖2所示,單一個影像感測晶片3鄰近光學結構2,並且單一個影像感測晶片3具有一第一影像感測區域31、一第二影像感測區域32以及一第三影像感測區域33。更進一步來說,第一預定影像光源L1會通過光學結構2而投向第一影像感測區域31,第二預定影像光源L2會通過光學結構2而投向第二影像感測區域32,並且第三預定影像光源L3會通過光學結構2而投向第三影像感測區域33。也就是說,單一個影像感測晶片3具有通過光學結構2以接收第一預定影像光源L1的一第一影像感測區域31、通過光學結構2以接收第二預定影像光源L2的一第二影像感測區域32以及通過光學結構2以接收第三預定影像光源L3的一第三影像感測區域33。另外,第一預定影像光源L1會通過第一影像感測區域31的擷取而得到一第一影像信號S1,第二預定影像光源L2會通過第二影像感測區域32的擷取而得到一第二影像信號S2,並且第三預定影像光源L3會通過第三影像感測區域33的擷取而得到一第三影像信號S3。值得注意的是,第一影像信號S1、第二影像信號S2以及第三影像信號S3會整合成為單一個未經處理的影像信號S。也就是說,當單一個影像感測晶片3的第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33分別接收第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3後,單一個影像感測晶片3只會產生單一個未經處理的影像信號S。 In addition, as shown in FIG. 1 and FIG. 2, a single image sensing chip 3 is adjacent to the optical structure 2, and a single image sensing chip 3 has a first image sensing area 31, a second image sensing area 32, and A third image sensing area 33. Furthermore, the first predetermined image light source L1 is projected to the first image sensing area 31 through the optical structure 2, the second predetermined image light source L2 is projected to the second image sensing area 32 through the optical structure 2, and the third The predetermined image light source L3 is projected to the third image sensing area 33 through the optical structure 2. That is, a single image sensing chip 3 has a first image sensing area 31 that receives the first predetermined image light source L1 through the optical structure 2 and a second image sensing chip 3 that receives the second predetermined image light source L2 through the optical structure 2. The image sensing area 32 and a third image sensing area 33 through the optical structure 2 to receive a third predetermined image light source L3. In addition, the first predetermined image light source L1 will obtain a first image signal S1 through the capture of the first image sensing area 31, and the second predetermined image light source L2 will obtain a first image signal S1 through the capture of the second image sensing area 32. The second image signal S2 and the third predetermined image light source L3 will obtain a third image signal S3 through the capture of the third image sensing area 33. It is worth noting that the first image signal S1, the second image signal S2, and the third image signal S3 are integrated into a single unprocessed image signal S. That is, when the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 of a single image sensing chip 3 respectively receive the first predetermined image light source L1, the second predetermined image light source After L2 and the third predetermined image light source L3, a single image sensing chip 3 will only generate a single unprocessed image signal S.
舉例來說,配合圖1與圖2所示,單一個影像感測晶片3可 以是預先設置在電路基板(圖未示)上且電性連接於電路基板的CMOS晶片或者任何的光感測晶片。另外,第一影像感測區域31與第二影像感測區域32彼此相對應設置,也就是說第一影像感測區域31與第二影像感測區域32並不會相互錯位,此外所述第三影像感測區域33可以位於所述第一影像感測區域31與所述第二影像感測區32之間。此外,第一預定影像光源L1能通過光學結構2的第一反射面201的反射而投向第一影像感測區域31,第二預定影像光源L2能通過光學結構2的第二反射面202的反射而投向第二影像感測區域32,並且所述第三預定影像光源L3會穿過所述光學結構2而投向所述第三影像感測區域33。 For example, as shown in FIG. 1 and FIG. 2, a single image sensing chip 3 may be a CMOS chip or any light sensing chip that is pre-set on a circuit substrate (not shown) and is electrically connected to the circuit substrate. . In addition, the first image sensing area 31 and the second image sensing area 32 are disposed corresponding to each other, that is, the first image sensing area 31 and the second image sensing area 32 are not misaligned with each other. The three image sensing areas 33 may be located between the first image sensing area 31 and the second image sensing area 32. In addition, the first predetermined image light source L1 can be projected toward the first image sensing area 31 through the reflection of the first reflection surface 201 of the optical structure 2, and the second predetermined image light source L2 can be reflected by the second reflection surface 202 of the optical structure 2. It is projected on the second image sensing area 32, and the third predetermined image light source L3 passes through the optical structure 2 and is projected on the third image sensing area 33.
值得注意的是,第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33之中的任意兩個的面積可以是相同或者相異。舉例來說,當第一影像感測區域31的面積大於第二影像感測區域32的面積時,第一影像感測區域31可以做為主要的影像感測區域,而第二影像感測區域32則可以做為輔助的影像感測區域。當第二影像感測區域32的面積大於第三影像感測區域33的面積時,第二影像感測區域32可以做為主要的影像感測區域,而第三影像感測區域33則可以做為輔助的影像感測區域。 It is worth noting that the areas of any two of the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 may be the same or different. For example, when the area of the first image sensing area 31 is larger than the area of the second image sensing area 32, the first image sensing area 31 can be used as the main image sensing area and the second image sensing area 32 can be used as auxiliary image sensing area. When the area of the second image sensing area 32 is larger than that of the third image sensing area 33, the second image sensing area 32 can be used as the main image sensing area, and the third image sensing area 33 can be used as Assisted image sensing area.
值得注意的是,第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33之中的任意兩個的影像解析度可以是相同或者相異。舉例來說,當第一影像感測區域31的影像解析度大於第二影像感測區域32的影像解析度時,第一影像感測區域31可以做為主要的影像感測區域,而第二影像感測區域32則可以做為輔助的影像感測區域。當第二影像感測區域32的影像解析度大於第三影像感測區域33的影像解析度時,第二影像感測區域32可以做為主要的影像感測區域,而第三影像感測區域33則可以做為輔助的影像感測區域。 It is worth noting that the image resolutions of any two of the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 may be the same or different. For example, when the image resolution of the first image sensing area 31 is greater than the image resolution of the second image sensing area 32, the first image sensing area 31 can be used as the main image sensing area, and the second The image sensing area 32 can be used as an auxiliary image sensing area. When the image resolution of the second image sensing area 32 is greater than the image resolution of the third image sensing area 33, the second image sensing area 32 can be used as the main image sensing area, and the third image sensing area 33 can be used as auxiliary image sensing area.
另外,如圖1所示,單一個影像信號處理器4電性連接於單 一個影像感測晶片3。更進一步來說,單一個未經處理的影像信號S(包含第一影像信號S1、第二影像信號S2以及第三影像信號S3三者)會傳送至單一個影像信號處理器4,並且單一個未經處理的影像信號S(包含第一影像信號S1、第二影像信號S2以及第三影像信號S3三者)會通過單一個影像信號處理器4的處理而得到一全景影像。也就是說,第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者可以通過單一個影像信號處理器4的處理而得到一全景影像。值得注意的是,上述的“全景影像”可以替換成“全景視訊”,並且所謂的全景可以是寬景(panorama)、環景(360° panorama)或是球體環景(spherical panorama)。 In addition, as shown in FIG. 1, a single image signal processor 4 is electrically connected to a single image sensing chip 3. Furthermore, a single unprocessed image signal S (including the first image signal S1, the second image signal S2, and the third image signal S3) will be transmitted to a single image signal processor 4, and a single The unprocessed image signal S (including the first image signal S1, the second image signal S2, and the third image signal S3) is processed by a single image signal processor 4 to obtain a panoramic image. That is, the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3 can obtain a panoramic image through processing by a single image signal processor 4. It is worth noting that the above-mentioned "panoramic image" can be replaced by "panoramic video", and the so-called panorama can be a panorama, 360 ° panorama, or spherical panorama.
值得一提的是,由於第一鏡頭組件11與第二鏡頭組件12是彼此相對應設置,光學結構2的第一反射面201與第二反射面202是彼此相對應設置,並且第一影像感測區域31與第二影像感測區域32是彼此相對應設置,所以第一預定影像光源L1的光學路徑與第二預定影像光源L2的光學路徑也會跟著彼此相對應,也就是說第一預定影像光源L1的光學路徑與第二預定影像光源L2的光學路徑並不會相互錯位。 It is worth mentioning that, because the first lens assembly 11 and the second lens assembly 12 are disposed corresponding to each other, the first reflective surface 201 and the second reflective surface 202 of the optical structure 2 are disposed corresponding to each other, and the first image sense The measurement area 31 and the second image sensing area 32 are set corresponding to each other, so the optical path of the first predetermined image light source L1 and the optical path of the second predetermined image light source L2 will also correspond to each other, that is, the first predetermined The optical path of the image light source L1 and the optical path of the second predetermined image light source L2 are not offset from each other.
因此,本發明只需要使用單一個影像感測晶片3即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的接收,並且本發明只需要使用單一個影像信號處理器4即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的處理而得到一全景影像,藉此以降低本發明全景影像擷取模組M的製作成本。 Therefore, the present invention only needs to use a single image sensing chip 3 to complete the reception of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3, and the present invention only needs to use a single one The image signal processor 4 can complete the processing of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3 to obtain a panoramic image, thereby reducing the panoramic image capture module of the present invention. Production cost of M.
[第二實施例] [Second embodiment]
請參閱圖3至圖7所示,本發明第二實施例提供一種具有至少三個鏡頭的全景影像擷取模組M,其包括:一鏡頭結構1、一光 學結構2、一單一個影像感測晶片3以及一單一個影像信號處理器4。由圖3(加上圖5至圖7)與圖1的比較,以及圖4與圖2的比較可知,本發明第二實施例與第一實施例最大的差別在於:在第二實施例中,相對於一水平基準線(圖未示)並由圖3的視角來觀看,第一鏡頭組件11、第二鏡頭組件12以及第三鏡頭組件13會彼此錯位設置(如圖3所示),光學結構2具有彼此交又設置的一第一反射面201以及一第二反射面202,並且第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33會彼此錯位設置(如圖4所示)。因此,第一預定影像光源L1的光學路徑、第二預定影像光源L2以及第三預定影像光源L3的光學路徑也會跟著彼此錯位。 Please refer to FIG. 3 to FIG. 7. A second embodiment of the present invention provides a panoramic image capturing module M having at least three lenses, which includes: a lens structure 1, an optical structure 2, and a single image sensor. The test chip 3 and a single image signal processor 4. According to the comparison between FIG. 3 (plus FIGS. 5 to 7) and FIG. 1, and the comparison between FIG. 4 and FIG. 2, the biggest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment Relative to a horizontal reference line (not shown) and viewed from the perspective of FIG. 3, the first lens assembly 11, the second lens assembly 12, and the third lens assembly 13 will be offset from each other (as shown in FIG. 3), The optical structure 2 has a first reflective surface 201 and a second reflective surface 202 which are arranged on each other, and the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 are misaligned with each other. Settings (as shown in Figure 4). Therefore, the optical paths of the first predetermined image light source L1, the second predetermined image light source L2, and the optical paths of the third predetermined image light source L3 also follow each other.
藉此,配合圖3與圖5所示,第一預定影像光源L1會通過光學結構2的第一反射面201的反射而投向第一影像感測區域31,並且第一預定影像光源L1會通過第一影像感測區域31的擷取而得到一第一影像信號S1。另外,配合圖3與圖6所示,第二預定影像光源L2會通過光學結構2的第二反射面202的反射而投向第二影像感測區域32,並且第二預定影像光源L2會通過第二影像感測區域32的擷取而得到一第二影像信號S2。此外,配合圖3與圖7所示,所述第三預定影像光源L3會穿過所述光學結構2而投向所述第三影像感測區域33,並且第三預定影像光源L3會通過第三影像感測區域33的擷取而得到一第三影像信號S3。最後,第一影像信號S1、第二影像信號S2以及第三影像信號S3三者都會傳送至單一個影像信號處理器4,並且第一影像信號S1、第二影像信號S2以及第三影像信號S3三者可通過單一個影像信號處理器4的處理而得到一全景影像。 With this, as shown in FIG. 3 and FIG. 5, the first predetermined image light source L1 is projected to the first image sensing area 31 through the reflection of the first reflective surface 201 of the optical structure 2, and the first predetermined image light source L1 passes A first image signal S1 is obtained by capturing the first image sensing area 31. In addition, as shown in FIG. 3 and FIG. 6, the second predetermined image light source L2 will be projected to the second image sensing area 32 through the reflection of the second reflecting surface 202 of the optical structure 2, and the second predetermined image light source L2 will pass through the first The second image sensing area 32 is captured to obtain a second image signal S2. In addition, as shown in FIG. 3 and FIG. 7, the third predetermined image light source L3 passes through the optical structure 2 and is projected toward the third image sensing area 33, and the third predetermined image light source L3 passes through the third A third image signal S3 is obtained by capturing the image sensing area 33. Finally, the first video signal S1, the second video signal S2, and the third video signal S3 are all transmitted to a single video signal processor 4, and the first video signal S1, the second video signal S2, and the third video signal S3 are transmitted. The three can obtain a panoramic image through processing by a single image signal processor 4.
值得一提的是,如圖8所示,相對於一水平基準線(圖未示),第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33也可以採用如圖8的錯位方式。也就是說,依據不同的需求, 本發明的第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33的錯位排列方式可以隨意變換,例如排列成如圖4所示的雙向錯位排列(也就是X與Y方向的錯位排列),或者是如圖8的單向錯位排列(也就是X或Y方向的錯位排列)。 It is worth mentioning that, as shown in FIG. 8, relative to a horizontal reference line (not shown), the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 may also be used. See Figure 8 for misalignment. That is, according to different requirements, the misalignment arrangement of the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 of the present invention can be changed at will, for example, as shown in FIG. 4 The two-way misalignment arrangement shown in the figure (that is, the misalignment arrangement in the X and Y directions), or the unidirectional misalignment arrangement (that is, the misalignment arrangement in the X or Y direction) as shown in FIG. 8.
[第三實施例] [Third embodiment]
請參閱圖9所示,本發明第三實施例提供一單一個影像感測晶片3以及一單一個影像信號處理器4,並且單一個影像感測晶片3具有一單一個影像感測區域30。也就是說,第一實施例與第二實施例中第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33可以相互連接,以形成一單一個影像感測區域30。 Please refer to FIG. 9, a third embodiment of the present invention provides a single image sensing chip 3 and a single image signal processor 4. The single image sensing chip 3 has a single image sensing area 30. That is, the first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 in the first embodiment and the second embodiment may be connected to each other to form a single image sensing area 30.
因此,依據不同的需求,本發明的單一個影像感測晶片3可以使用第一影像感測區域31、第二影像感測區域32以及第三影像感測區域33三者相互搭配(如第一實施例與第二實施例所示),也可以只使用單一個影像感測區域30(如第三實施例所示)。 Therefore, according to different needs, the single image sensing chip 3 of the present invention can use the three first image sensing area 31, the second image sensing area 32, and the third image sensing area 33 (such as the first As shown in the embodiment and the second embodiment), only a single image sensing area 30 may be used (as shown in the third embodiment).
[第四實施例] [Fourth embodiment]
請參閱圖10所示,本發明第四實施例提供一種具有至少三個鏡頭的全景影像擷取裝置D,其包括:一外殼體C以及一全景影像擷取模組M。其中,圖10所顯示的全景影像擷取裝置D可以使用第一實施例或者第二實施例所提供的全景影像擷取模組M。 Please refer to FIG. 10, a fourth embodiment of the present invention provides a panoramic image capturing device D having at least three lenses, which includes: an outer casing C and a panoramic image capturing module M. The panoramic image capturing device D shown in FIG. 10 may use the panoramic image capturing module M provided by the first embodiment or the second embodiment.
舉例來說,配合圖1與圖10所示,圖10所顯示的全景影像擷取裝置D使用第一實施例的全景影像擷取模組M。更進一步來說,外殼體C具有一第一透光視窗W1、一第二透光視窗W2以及一第三透光視窗W3。全景影像擷取模組M設置在外殼體C內,並且全景影像擷取模組包括一鏡頭結構1、一光學結構2、一單一個影像感測晶片3以及一單一個影像信號處理器4。 For example, in conjunction with FIG. 1 and FIG. 10, the panoramic image capturing device D shown in FIG. 10 uses the panoramic image capturing module M of the first embodiment. Furthermore, the outer casing C has a first transparent window W1, a second transparent window W2, and a third transparent window W3. The panoramic image capturing module M is disposed in the casing C, and the panoramic image capturing module includes a lens structure 1, an optical structure 2, a single image sensing chip 3, and a single image signal processor 4.
承上所言,鏡頭結構1包括通過第一透光視窗W1以擷取一 第一預定影像光源L1的一第一鏡頭組件11、通過第二透光視窗W2以擷取一第二預定影像光源L2的一第二鏡頭組件12以及通過第三透光視窗W3以擷取一第三預定影像光源L3的一第三鏡頭組件13。也就是說,第一鏡頭組件11能通過第一透光視窗W1而以一第一預定廣角擷取一第一預定影像光源L1,第二鏡頭組件12能通過第二透光視窗W2而以一第二預定廣角擷取一第二預定影像光源L2,並且第三鏡頭組件13能通過第三透光視窗W3而以一第三預定廣角擷取一第三預定影像光源L3。 As mentioned above, the lens structure 1 includes a first lens assembly 11 through a first transparent window W1 to capture a first predetermined image light source L1, and a second predetermined light source through a second transparent window W2. A second lens component 12 of L2 and a third lens component 13 through a third light transmission window W3 to capture a third predetermined image light source L3. That is, the first lens assembly 11 can capture a first predetermined image light source L1 at a first predetermined wide angle through the first transparent window W1, and the second lens assembly 12 can use a second transparent window W2 to The second predetermined wide-angle captures a second predetermined image light source L2, and the third lens assembly 13 can capture a third predetermined wide-angle light source L3 through a third transparent window W3.
承上所言,光學結構2設置在第一鏡頭組件11、第二鏡頭組件12以及第三鏡頭組件13三者之間。另外,單一個影像感測晶片3鄰近光學結構2,並且單一個影像感測晶片3具有通過光學結構2以接收第一預定影像光源L1的一第一影像感測區域31、通過光學結構2以接收第二預定影像光源L2的一第二影像感測區域32以及通過光學結構2以接收第三預定影像光源L3的一第三影像感測區域33。此外,單一個影像信號處理器4電性連接於單一個影像感測晶片3,並且第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者能通過單一個影像信號處理器4的處理而得到一全景影像。 As mentioned above, the optical structure 2 is disposed between the first lens assembly 11, the second lens assembly 12, and the third lens assembly 13. In addition, a single image sensing wafer 3 is adjacent to the optical structure 2, and a single image sensing wafer 3 has a first image sensing area 31 passing through the optical structure 2 to receive a first predetermined image light source L1, and through the optical structure 2 to A second image sensing area 32 that receives the second predetermined image light source L2 and a third image sensing area 33 that receives the third predetermined image light source L3 through the optical structure 2. In addition, a single image signal processor 4 is electrically connected to a single image sensing chip 3, and three of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3 can pass a single image signal. The processor 4 obtains a panoramic image.
因此,本發明只需要使用單一個影像感測晶片3即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的接收,並且本發明只需要使用單一個影像信號處理器4即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的處理而得到一全景影像,藉此以降低本發明全景影像擷取裝置D的製作成本。 Therefore, the present invention only needs to use a single image sensing chip 3 to complete the reception of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3, and the present invention only needs to use a single one The image signal processor 4 can complete the processing of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3 to obtain a panoramic image, thereby reducing the panoramic image capturing device D of the present invention. Production costs.
[實施例的有益效果] [Advantageous Effects of the Embodiment]
本發明的其中一有益效果在於,本發明所提供的一種具有至少三個鏡頭的全景影像擷取裝置D及其全景影像擷取模組M,其 能通過“單一個影像感測晶片3具有通過光學結構2以接收第一預定影像光源L1的一第一影像感測區域31、通過光學結構2以接收第二預定影像光源L2的一第二影像感測區域32以及通過光學結構2以接收第三預定影像光源L3的一第三影像感測區域33”以及“單一個影像信號處理器4電性連接於單一個影像感測晶片3”的技術方案,以使得第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者能通過單一個影像信號處理器4的處理而得到一全景影像。 One of the beneficial effects of the present invention is that a panoramic image capturing device D and a panoramic image capturing module M having at least three lenses provided by the present invention can pass the “single image sensing chip 3 having The optical structure 2 receives a first image sensing area 31 of the first predetermined image light source L1, the optical structure 2 receives a second image sensing area 32 of the second predetermined image light source L2, and the optical structure 2 receives the first A technical solution of a third image sensing area 33 of the three predetermined image light sources L3 and a "single image signal processor 4 electrically connected to a single image sensing chip 3", so that the first predetermined image light source L1, the first The three predetermined image light sources L2 and the third predetermined image light source L3 can obtain a panoramic image through processing by a single image signal processor 4.
也就是說,本發明只需要使用單一個影像感測晶片3即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的接收,並且本發明只需要使用單一個影像信號處理器4即可完成第一預定影像光源L1、第二預定影像光源L2以及第三預定影像光源L3三者的處理而得到一全景影像,藉此以降低本發明的全景影像擷取裝置D及其全景影像擷取模組M的製作成本。 That is, the present invention only needs to use a single image sensing chip 3 to complete the reception of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3, and the present invention only needs to use A single image signal processor 4 can complete the processing of the first predetermined image light source L1, the second predetermined image light source L2, and the third predetermined image light source L3 to obtain a panoramic image, thereby reducing the panoramic image capture of the present invention. The manufacturing cost of the fetching device D and its panoramic image capturing module M.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The contents disclosed above are only the preferred and feasible embodiments of the present invention, and therefore do not limit the scope of patent application of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.
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| CN111522145A (en) * | 2020-03-30 | 2020-08-11 | 哈尔滨新光光电科技股份有限公司 | High-resolution wide-field-of-view photoelectric array system based on polyhedral prism beam combination |
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| CN101551585A (en) * | 2008-04-01 | 2009-10-07 | 晶宏半导体股份有限公司 | Panorama mode image capture device |
| WO2009133736A1 (en) * | 2008-04-30 | 2009-11-05 | オリンパスイメージング株式会社 | Image forming optical system and electronic image pickup device provided with the same |
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