TW201916060A - Memory bit repair method capable of reducing the amount of redundant memory bits used for repairing - Google Patents
Memory bit repair method capable of reducing the amount of redundant memory bits used for repairing Download PDFInfo
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Abstract
Description
本發明係關於一種用於存儲元件不佳的修復方法,特別是一種關於記憶體位元級的修復方法。The present invention relates to a repair method for a poor storage element, and more particularly to a repair method for a memory bit level.
現在晶片設計中,對於各類記憶體,例如隨機存取記憶體(Random Access Memory,RAM)、唯讀記憶體(Read-Only Memory,ROM)、非揮發性記憶體(Non-Volatile Memory,NVRAM)、動態隨機存取記憶體(Dynamic Random Access Memory,DRAM)、嵌入式 Flash (Embedded Flash)或嵌入式DRAM(Embedded DRAM)等晶片記憶體之需求日益增高,無論是何種產品,在品質、可靠性或成本上的維護,對製造商而言,皆是一門重要的學問,必須在晶片記憶體中,針對晶片內的記憶體元件進行重複且可靠的檢測與修復,以提高之後產品的可靠度,以及提高晶片之品質與競爭力。In the current chip design, for various types of memory, such as random access memory (RAM), read-only memory (ROM), non-volatile memory (Non-Volatile Memory, NVRAM) The demand for chip memory such as Dynamic Random Access Memory (DRAM), Embedded Flash (Embedded Flash) or Embedded DRAM (Embedded DRAM) is increasing, regardless of the product, quality, Reliability or cost maintenance is an important knowledge for manufacturers. Repeated and reliable detection and repair of memory components in the chip must be performed in the chip memory to improve the reliability of the product. Degree, as well as improving the quality and competitiveness of the wafer.
傳統的修復方法中,例如修正錯誤(Error-Correcting Code,ECC)或是修補方法(Redundancy),皆提供過多的修正錯誤位元或是用於替換的位元,例如在錯誤修正中,有一方法是漢明碼(Hamming Code),在2n 個記憶體位元中,需要有n+1個位元,用於做修復一個位元,假設在128個位元中,其係為2的7次方,就需要具有7+1個修復位元,使得一共需要產生128+8個位元,使得此一修復方法需要過多的位元數,新增加的位元數占了原先位元數的6.25%;另外,又一BCH修復方法(Bose-Chaudhuri-Hocquenghem Code),在2n 個記憶體位元中,需要2*n+1個位元,用於修復二個位元。BCH修復方法在需修復的位元數增加時,會快速增加可修復的位元,因此錯誤修正的兩方法皆會需要大量的修正錯誤元或是用於替換的位元。而在修補方法中,除了用於修復的位元數開銷十分龐大之外,因為用於對照之位元位址與保險絲陣列用以存儲缺陷之位址,會使得用以修復組數通常很少,但用於修復組數中的位元密度過大,往往可能是一個位元毀損,就要把整組的位元全都換掉,使得此一修補方法也會耗損過多的位元數。In traditional repair methods, such as Error-Correcting Code (ECC) or Redundancy, there are too many correction error bits or bits for replacement. For example, in error correction, there is a method. It is the Hamming Code. In 2 n memory bits, you need n+1 bits to repair a bit. Assume that in 128 bits, it is 2 to the 7th power. It is necessary to have 7+1 repair bits, so that a total of 128+8 bits need to be generated, so that this repair method requires too many bit numbers, and the newly added bit number accounts for 6.25% of the original number of bits. In addition, another BCH repair method (Bose-Chaudhuri-Hocquenghem Code), in 2 n memory bits, requires 2*n+1 bits for repairing two bits. The BCH repair method will quickly increase the repairable bit when the number of bits to be repaired increases. Therefore, both methods of error correction require a large number of modified error elements or bits for replacement. In the repair method, in addition to the huge amount of bits used for repair, because the bit address used for comparison and the fuse array are used to store the address of the defect, the number of repair groups is usually small. However, the bit density used in the number of repaired groups is too large, and it may often be a bit damage. It is necessary to replace all the bits of the entire set, so that this repair method will also consume too many bits.
因此,本發明有鑑於上述的困擾,提出一種簡易的修復方法,利用此一記憶體位元的修復方法,可以減少額外提供過多的修復位元。Therefore, in view of the above problems, the present invention proposes a simple repair method, and by using the memory bit repair method, it is possible to reduce the provision of excessive repair bits.
本發明的主要目的是在提供一種記憶體位元級的修復方法,提供一種簡易的修復方法,在形成記憶體位元組時,同時就附加用於修復的修復位元,此一組用於修復的修復位元數量,相較於習知的修復方法,提供一種更簡易的修復位元,並且所附加的修復位元數量也低於習知的修復方法。The main object of the present invention is to provide a memory bit level repair method, and provide a simple repair method. When a memory byte is formed, a repair bit for repair is added at the same time, and the set is used for repair. The number of repaired bits provides a simpler repair bit than the conventional repair method, and the number of additional repair bits is also lower than the conventional repair method.
本發明的另一目的是在提供一種記憶體位元級的修復方法,製造記憶體位元組時,為了避免有部分位元不佳,附加最少數量的修復位元,當有位元不佳時,可以利用修復位元替補不佳位元的缺少數量,使得記憶體位元組可以運作順暢。Another object of the present invention is to provide a memory bit level repair method. When manufacturing a memory byte, in order to avoid some bits being poor, a minimum number of repair bits are added. When there are poor bits, The repair bit can be used to replace the missing number of poor bits, so that the memory byte can operate smoothly.
為了達成上述的目的,可以在記憶體上搭配使用位元線和字元線修補方法修補位元線和字元線級缺陷和無法燒毀或是將其寫到記憶狀態0或1以外的第三種狀態位元級缺陷,本發明提供一種記憶體位元級的修復方法,首先提供記憶體中所有複數記憶體位元組,每一記憶體位元組具有M個位元,且M為正整數,相對記憶體位元組附加一修復位元組,其具有N個修復位元供修復之用,N係為正整數,且N小於M,檢測所有記憶體位元組和修復位元組是否具有不佳位元,以結束所有記憶體位元組的修復,或是將所有具有不佳位元的記憶體位元組和修復位元組,對應該記憶體位元組不佳位元的數量以修復位元組中非不佳位元做替補,以完成記憶體中所有該記憶體位元組的修復。In order to achieve the above purpose, the bit line and word line patching methods can be used on the memory to repair the bit line and word line level defects and can not be burned or written to the third level other than the memory state 0 or 1. The state bit level defect, the present invention provides a memory bit level repair method, firstly providing all complex memory bit groups in the memory, each memory byte has M bits, and M is a positive integer, relative The memory byte is appended with a repair byte having N repair bits for repair, N is a positive integer, and N is less than M, detecting whether all memory bytes and repair bytes have poor positions Yuan, to end the repair of all memory bytes, or to all memory bytes and repair bytes with poor bits, corresponding to the number of poor bits of the memory byte to repair the byte A non-poor bit is used as a substitute to complete the repair of all of the memory bytes in the memory.
在本發明中,從修復位元組替補記憶體位元組不佳位元前,先將記憶體位元組不佳位元燒毀或是將其寫到記憶狀態0或1以外的第三種狀態,修復位元組中不佳位元亦先做標記,方法為將不佳位元燒毀或是將其寫到記憶狀態0或1以外的第三種狀態。In the present invention, before the repair byte replaces the memory bit byte, the memory bit is not burned or the memory bit is burned to the third state other than the memory state 0 or 1. The bad bits in the repair byte are also marked first by burning the bad bit or writing it to the third state other than the memory state 0 or 1.
在本發明中,所有記憶體位元組的不佳位元的數量不超過N。In the present invention, the number of poor bits of all memory bytes does not exceed N.
在本發明中,所有記憶體位元組和修復位元組藉由內部讀、寫與擾動(disturb)以及外部溫度、磁場、電場之擾動以檢測是否具有不佳位元。In the present invention, all memory bytes and repair bytes are detected by internal read, write, and disturb and external temperature, magnetic field, and electric field disturbances to detect whether there are poor bits.
在本發明中,所有記憶體位元組完成修復後,會重新排列每一已修復之記憶體位元組中的位元。In the present invention, after all memory bytes are repaired, the bits in each of the restored memory bytes are rearranged.
在本發明中,修復後的記憶體位元組和每一修復位元組,係供資料位元之用,也可以供修正位元(Error-Correction Code, ECC) 使用的校驗位元(parity bit)支用,以提升在使用時的可靠性。In the present invention, the repaired memory byte and each repair byte are used for data bits, and can also be used for parity bits used by the Error-Correction Code (ECC). Bit) is used to improve the reliability in use.
在本發明中,每一記憶體位元組和每一修復位元組係可以搭配使用位元線和字元線修補方法修補含位元線級和字元線級缺陷和無法燒毀或是將其寫到記憶狀態0或1以外的第三種狀態位元級缺陷的記憶體位元組和修復位元組,以做到極佳的修補效率。In the present invention, each memory byte and each repair byte can be used in conjunction with the bit line and word line repair methods to repair defectes containing bit line level and word line level and cannot be burned or A memory byte and a repair byte of a third state bit-level defect other than the memory state 0 or 1 are written to achieve excellent repair efficiency.
底下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The purpose, technical contents, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments and the accompanying drawings.
本發明利用額外附加修復位元,取代習知利用演算法帶來多餘修復位元的負擔,並且也不用因為一不佳位元就要取代整條位置所儲存的位元,十分便利、簡易,也可以降低記憶體位元組的生產成本。The invention utilizes additional additional repairing bits instead of the burden of using the algorithm to bring unnecessary repairing bits, and does not need to replace the bits stored in the entire position because a poor bit is very convenient and simple. It is also possible to reduce the production cost of the memory byte.
首先,請參照本發明第一圖所示,一種記憶體位元組10包含有M個位元12及修復位元組20包含有N個修復位元14供修復之用,M及N皆為正整數,且N的數量小於M,例如M等於64位元,N等於8位元,本發明不以此些數字為發明的限制,僅作為實施例之說明。此外,修復後的記憶體位元組和修復位元組,除了供資料位元之用,也可以供修正位元(Error-Correction Code, ECC) 使用的校驗位元 (parity bit)支用,以提升在使用時的可靠性。First, referring to the first figure of the present invention, a memory byte 10 includes M bits 12 and a repair byte 20 includes N repair bits 14 for repair, and both M and N are positive. An integer, and the number of N is less than M, for example, M is equal to 64 bits, and N is equal to 8 bits. The present invention is not limited by the invention as the description of the embodiments. In addition, the restored memory byte and repair byte, in addition to the data bit, can also be used for the parity bit used by the Error-Correction Code (ECC). To improve the reliability in use.
接著,請參照本發明第二a圖~第二d圖及第三圖所示,並請同時參照第一圖,以詳細說明本發明的記憶體位元級的修復方法如何執行。首先,如步驟S10所示,並請同時參照第二a圖,先提供一記憶體位元組10,在記憶體位元組10中具有M個位元。如步驟S12所示,並請同時參照第二b圖,再附加修復位元組20,在修復位元組20中具有N個修復位元14供修復之用。如步驟S14所示,並請同時參照第二c圖,檢測所有記憶體位元組10及修復位元組20中是否具有不佳位元16,在本實施例中係以內部讀、寫與擾動(disturb)以及外部溫度、磁場、電場之擾動做所有記憶體位元組10及修復位元組20的檢測,例如對記憶體位元組10及修復位元組20進行記憶狀態0與1的檢測,若在記憶體位元組10及修復位元組20中檢測出不佳位元16,則進入到步驟S16。如步驟S16所示,檢測後,發現記憶體位元組10的M個位元12中,具有Q個不佳位元16,則對應此數量Q的不佳位元16,從修復位元組20中非不佳的修復位元14,替補這Q個不佳位元16,替補前先將Q個不佳位元16燒毀或是將其寫到記憶狀態0或1以外的第三種狀態,並先將修復位元組20中所有不佳的修復位元14做標記,方法為將該不佳位元燒毀或是將其寫到記憶狀態0或1以外的第三種狀態,以完成記憶體位元組10的修復。重複上述檢測後修復步驟以完成記憶體中所有記憶體位元組的不佳位元修復和修復位位元組不佳位元的標記。之後,如步驟S18所示,並請同時參照第二d圖,當記憶體位元組10完成修復後,則開始重新排列記憶體位元組10以成為記憶體位元組10’。若檢測後,沒有發現任何不佳位元,則進入到步驟S20。如步驟S20所示,結束記憶體位元組10的修復。Next, please refer to the second to second second and third figures of the present invention, and please refer to the first figure at the same time to explain in detail how the memory bit level repair method of the present invention is performed. First, as shown in step S10, and referring to the second a diagram at the same time, a memory byte 10 is provided first, and there are M bits in the memory byte 10. As shown in step S12, and referring to the second b-picture at the same time, the repair byte 20 is additionally attached, and there are N repair bits 14 in the repair byte 20 for repair. As shown in step S14, and referring to the second c-picture, it is detected whether all the memory bit groups 10 and the repair byte groups 20 have poor bits 16, which are internally read, written, and disturbed in this embodiment. (disturb) and external temperature, magnetic field, electric field disturbances are detected by all memory byte 10 and repair byte 20, for example, memory level 0 and repair byte 20 are tested for memory states 0 and 1, If the bad bit 16 is detected in the memory byte 10 and the repair byte 20, the process proceeds to step S16. As shown in step S16, after the detection, it is found that among the M bits 12 of the memory byte 10, there are Q poor bits 16, and the poor bit 16 corresponding to the quantity Q, from the repair byte 20 The poor repairing bit 14 in Central Africa replaces the Q poor bit 16 and burns the Q poor bit 16 or writes it to the third state other than the memory state 0 or 1 before the substitute. First, all the bad repair bits 14 in the repair byte 20 are marked by burning the bad bit or writing it to the third state other than the memory state 0 or 1, to complete the memory. Repair of the voxel 10. The above-described post-test repair steps are repeated to complete the poor bit repair and repair of the poor bit of the memory bit in the memory. Thereafter, as shown in step S18, and referring to the second d-picture at the same time, when the memory bit group 10 completes the repair, the memory bit group 10 is re-arranged to become the memory bit group 10'. If no bad bits are found after the detection, the process proceeds to step S20. As shown in step S20, the repair of the memory byte 10 is ended.
在本發明中,不以上述不佳位元的數量為限制,主要是不佳位元的數量,以不超過N為主,意思就是,在記憶體位元組中,不佳位元的數量應當低於修復位元的數量,使得無論在哪一種記憶體位元組,皆可進行簡易及有效的修復作業。而本發明中揭露的N之數量,也低於習知的修復位元數量,N 的值決定來自此記憶體的不佳率,例如M=128時,不佳率約10%,則可以用N=13~16,同時也不會超過記憶體位元組的位元數量。倘若一旦記憶體位元組真的具有太多不佳位元時,例如超過修復位元的數量,此一記憶體位元組也非本發明所述的修復方法可簡單修復,恐具有更多生產因素在其中,也非一般記憶體修復或補償可以進行調整。因此,本發明所提供的修復方法,可使用在一般的生產條件下,其中僅有少數記憶體不佳位元,可以所具有的修復位元進行有效替補,甚至未進行替補的修復位元,也可以留在記憶體位元組中,等日後使用時若有發生位元耗損時使用。位元線和字元線修補方法可針對位元線和字元線級缺陷和無法燒毀或是將其寫到記憶狀態0或1以外的第三種狀態位元級缺陷做修補,因此記憶體在使用本發明時,可以搭配使用位元線和字元線修補方法,以做到極佳的修補效率。In the present invention, the number of the above-mentioned poor bits is not limited, and the number of the bad bits is mainly not more than N, meaning that in the memory byte, the number of poor bits should be Below the number of repair bits, simple and effective repair work can be performed regardless of the memory byte. However, the number of Ns disclosed in the present invention is also lower than the number of conventional repairing bits, and the value of N determines the rate of poorness from the memory. For example, when M=128, the unsatisfactory rate is about 10%, then it can be used. N=13~16, and it will not exceed the number of bits in the memory byte. If the memory byte currently has too many bad bits, for example, more than the number of repair bits, the memory byte is not simply repaired by the repair method of the present invention, and there are more production factors. Among them, non-general memory repair or compensation can be adjusted. Therefore, the repairing method provided by the present invention can be used under general production conditions, in which only a few memory poor bits can be effectively replaced by the repairing bits, and even the repairing bits are not replaced. It can also be left in the memory byte and used when there is a bit loss in the future. Bit line and word line patching methods can be patched for bit line and word line level defects and for failure to burn or write to a third state bit level defect other than memory state 0 or 1, thus memory When using the present invention, bit line and word line patching methods can be used in combination to achieve excellent repair efficiency.
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍。The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be covered by the scope of the present invention.
10、10’‧‧‧記憶體位元組10, 10’‧‧‧ Memory Bits
12‧‧‧位元12‧‧‧ bits
14‧‧‧修復位元14‧‧‧Repair Bits
16‧‧‧不佳位元16‧‧‧bad bits
20‧‧‧修復位元組20‧‧‧Repairing tuples
第一圖為本發明記憶體位元級的修復方法之應用架構的示意圖。 第二a圖~第二d圖為本發明執行記憶體位元級的修復方法的步驟示意圖。 第三圖為本發明記憶體位元級的修復方法之步驟流程圖。The first figure is a schematic diagram of an application architecture of a method for repairing a memory bit level of the present invention. The second to second graphs are diagrams showing the steps of the method for repairing the memory bit level of the present invention. The third figure is a flow chart of the steps of the method for repairing the memory bit level of the present invention.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415700A (en) * | 2020-04-24 | 2020-07-14 | 西安紫光国芯半导体有限公司 | Repair method, repair device and computer storage medium |
| CN112825264A (en) * | 2019-11-20 | 2021-05-21 | 珠海南北极科技有限公司 | Method for reordering memory bits, reordering circuit and accumulation circuit |
| TWI764297B (en) * | 2019-11-20 | 2022-05-11 | 大陸商珠海南北極科技有限公司 | accumulator circuit |
| TWI857467B (en) * | 2023-01-19 | 2024-10-01 | 世界先進積體電路股份有限公司 | Memory device and control method for memory device |
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| US12181517B2 (en) * | 2021-09-07 | 2024-12-31 | Nanya Technology Corporation | Method for detecting memory chip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI336890B (en) * | 2007-12-21 | 2011-02-01 | Nat Univ Tsing Hua | Built-in self-repair method for nand flash memory and system thereof |
| US7788528B2 (en) * | 2008-05-23 | 2010-08-31 | Himax Technologies Limited | Repair module for memory, repair device using the same and method thereof |
| CN103390430B (en) * | 2012-05-07 | 2016-04-20 | 中国科学院微电子研究所 | Memory built-in self-repair system and method based on hash table |
| KR102072449B1 (en) * | 2012-06-01 | 2020-02-04 | 삼성전자주식회사 | Storage device including non-volatile memory device and repair method thereof |
| US20140169113A1 (en) * | 2012-12-18 | 2014-06-19 | Lsi Corporation | Enhancing Memory Yield Through Memory Subsystem Repair |
| CN105575441A (en) * | 2015-12-11 | 2016-05-11 | 格科微电子(上海)有限公司 | Defect repair method and circuit for dynamic random access memory |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112825264A (en) * | 2019-11-20 | 2021-05-21 | 珠海南北极科技有限公司 | Method for reordering memory bits, reordering circuit and accumulation circuit |
| TWI764297B (en) * | 2019-11-20 | 2022-05-11 | 大陸商珠海南北極科技有限公司 | accumulator circuit |
| CN112825264B (en) * | 2019-11-20 | 2024-02-02 | 珠海南北极科技有限公司 | Method for reordering memory bits, reordering circuit and accumulation circuit |
| CN111415700A (en) * | 2020-04-24 | 2020-07-14 | 西安紫光国芯半导体有限公司 | Repair method, repair device and computer storage medium |
| TWI857467B (en) * | 2023-01-19 | 2024-10-01 | 世界先進積體電路股份有限公司 | Memory device and control method for memory device |
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| Publication number | Publication date |
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| TWI657459B (en) | 2019-04-21 |
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