TW201914174A - Power supply apparatus - Google Patents

Abstract

A power supply apparatus includes a case, a circuit board, at least one heating element, and at least one internal liquid cooling heat-dissipation structure. The heating element is disposed in the case and electrically connected to the circuit board. The internal liquid cooling heat-dissipation structure is disposed in the case and located in at least one of the two, which is between the case and the circuit board and between the case and the heating element. The internal liquid cooling heat-dissipation structure includes a tank and a heat conducting sheet. The tank includes an internal pipe, wherein a working fluid is adapted to be filled in the internal pipe. The heat conducting sheet is assembled to the tank, wherein the heat generated by the heat element is transmitted to the tank through the heat conducting sheet and is dissipated by the working fluid circulating in the internal pipe.

Description

Power supply unit

The present invention relates to a power supply device, and more particularly to a power supply device having a better heat dissipation effect.

Generally speaking, the internal heat dissipation mode of the power supply device is mainly air-cooled, wherein the air-cooled heat dissipation is to contact a component such as a passive component and a semiconductor component that generates heat energy, and the metal heat sink is radiated through the fan. The block is cooled. However, as the output power of the power supply device increases, the internal temperature rises, for example, a power supply device with an output power of more than 1000 watts, and the fan flow rate needs to be increased accordingly, so that excess waste heat can be discharged from the power supply device through the strong airflow. . The method of increasing the air flow is nothing more than increasing the speed or the number of fans. When the fan speed increases or multiple fans operate at the same time, high noise, high vibration and high energy consumption are often generated, which affects the overall power supply device. Efficiency and cause user discomfort.

In order to solve the above problems, the current power supply device uses a liquid-cooled heat dissipation method instead of the conventional air-cooled heat dissipation method. However, the current liquid-cooled heat dissipation method mainly provides an internal liquid-cooled heat pipe in the casing of the power supply device, wherein the internal liquid-cooled heat pipe is made of metal material and must be in direct contact with the heat-generating component to effectively dissipate heat. Therefore, when the internal liquid-cooled heat-dissipating tube contacts the primary-side heating element and the secondary-side heating element of the circuit, it is easy to cause an arc discharge between the primary side and the secondary side, and there is a concern about safety. In addition, the internal liquid-cooled heat pipe arrangement also needs to be matched with the circuit design and the internal components of the housing, and it is not suitable for the power supply device of all models because of lack of flexibility.

The invention provides a power supply device which has better heat dissipation effect and can avoid high noise generation.

The power supply device of the present invention comprises a casing, a circuit board, at least one heat generating component, and at least one internal liquid cooling heat dissipating structure. The circuit board is disposed in the housing. The heating element is disposed in the housing and electrically connected to the circuit board. The internal liquid-cooled heat dissipation structure is disposed in the housing and is located between the housing and the circuit board and at least one of the housing and the heat generating component. The internal liquid cooling heat dissipation structure includes a tank body and a heat conducting sheet. The tank body includes an internal conduit in which a working fluid is adapted to be filled in the internal conduit. The heat conducting sheet is assembled on the tank body, wherein heat generated by the heat generating component is transmitted to the tank through the heat conducting sheet, and is radiated by the working fluid circulating in the internal pipeline.

In an embodiment of the invention, the power supply device further includes at least one insulating and thermally conductive structure disposed in the housing and located at least between the circuit board and the internal liquid-cooled heat dissipation structure and the heat-generating component and the internal liquid-cooled heat dissipation structure. Between one.

In an embodiment of the invention, the internal liquid-cooling heat dissipation structure is located between the housing and the circuit board, and the insulating and heat-conducting structure is located between the circuit board and the internal liquid-cooled heat dissipation structure, and the insulating and heat-conducting structures are opposite to each other. The two surfaces directly contact the circuit board and the thermal pad.

In an embodiment of the invention, the internal liquid-cooling heat dissipation structure is located between the housing and the heat generating component, and the insulating heat conductive structure is located between the heat generating component and the internal liquid-cooled heat dissipation structure, and the insulating and heat conducting structures are opposite to each other. The two surfaces directly contact the heating element and the heat conductive sheet, respectively.

In an embodiment of the present invention, the tank body of the internal liquid-cooling heat dissipation structure further includes a temperature sensor disposed on a surface of the tank body to detect a temperature of the tank body.

In an embodiment of the present invention, the tank body of the internal liquid-cooling heat dissipation structure further includes a light-emitting diode module disposed on the surface of the tank body for displaying different colors according to the temperature.

In an embodiment of the invention, the LED module is electrically connected to the circuit board through a connector.

In an embodiment of the invention, the power supply device further includes at least one fan module, which is assembled in the housing and electrically connected to the circuit board for displaying different rotational speeds according to the temperature.

In an embodiment of the present invention, the internal liquid-cooling heat dissipation structure further includes a liquid cooling head, and the power supply device further includes at least one external liquid-cooling heat dissipation structure disposed outside the casing and including a heat dissipation row and a heat dissipation row. A cooling fan, a motor, a liquid cooling tank, and an external piping. The liquid cooling head is connected to the external pipeline, the cooling fan is assembled on the heat dissipation row, and the liquid cooling tank is connected to the motor. The external piping is connected between the liquid cooling head and the liquid cooling tank, between the motor and the heat dissipation row, and between the heat dissipation row and the liquid cooling head.

In an embodiment of the invention, the external liquid-cooled heat dissipation structure is connected to the internal liquid-cooled heat dissipation structure to form a circuit. The working fluid circulates through the circuit through the motor of the external liquid-cooled heat sink structure.

In an embodiment of the invention, the heat generating component is a passive component or a semiconductor component.

In an embodiment of the invention, the material of the heat conductive sheet is metal.

In an embodiment of the invention, the working fluid comprises a pure water, a deionized water, a liquid metal or a fluorocarbon organic liquid.

Based on the above, in the design of the power supply device of the present invention, the internal liquid-cooling heat dissipation structure is disposed in the housing and between the housing and the circuit board and at least one of the housing and the heat generating component, wherein the working fluid is suitable for filling In the internal pipeline, the heat generated by the heating element is transmitted to the tank through the heat transfer sheet, and is dissipated by the working fluid circulating in the internal pipeline. In short, the internal liquid-cooled heat dissipation structure of the present invention can be applied to various types of power supply devices, and the power supply device of the present invention can perform heat dissipation in a liquid-cooled manner, in addition to having better heat dissipation. In addition to the effect, it also has high safety of use and can avoid the occurrence of high noise.

The above described features and advantages of the invention will be apparent from the following description.

FIG. 1A is a perspective view of a power supply device according to an embodiment of the invention. FIG. 1B is a schematic side view of the power supply device of FIG. 1A. FIG. 1C is a perspective exploded view showing the internal liquid cooling heat dissipation structure of the power supply device of FIG. 1A. 1D is a bottom perspective view of the internal liquid-cooled heat dissipation structure of FIG. 1C.

Referring to FIG. 1A, FIG. 1B and FIG. 1C, the power supply device 100a of the present embodiment includes a housing 110, a circuit board 120, at least one heating element 130 (three are schematically shown in FIG. 1B), and at least one The internal liquid-cooled heat dissipation structure 140a (one is schematically shown in FIG. 1B). The circuit board 120 is disposed in the housing 110, wherein the circuit board 110 has a component surface and a solder surface. The heating element 130 is disposed in the housing 110 and disposed on the component surface of the circuit board 110 and electrically connected to the circuit board 120 . The internal liquid cooling heat dissipation structure 140 a is disposed in the housing 110 and located between the housing 110 and the circuit board 120 . The internal liquid cooling heat dissipation structure 140a includes a tank body 142a and a heat conducting sheet 144a. The tank 142a includes an internal conduit 143 in which a working fluid F is adapted to be filled in the internal conduit 143. The heat conducting sheet 144a is assembled on the tank body 142a, wherein heat generated by the heat generating component 130 is transmitted to the tank body 142a through the heat conducting sheet 144a, and is radiated by the working fluid F circulating in the internal line 143.

In detail, the heat generating component 130 of the present embodiment may be a capacitor or a transformer. Of course, other passive components and semiconductor components may be used, and are not limited thereto. Further, the working fluid F filled in the internal line 143 of the tank body 142a may be, for example, a pure water, a deionized water, a liquid metal or a fluorocarbon organic liquid. For example, if the working fluid F is pure water or deionized water, since the specific heat capacity of water is much larger than air and other liquids, it is about 4200 J/(kg·K), so water is used as a heat dissipating medium, and its heat dissipation performance is better. A system that directly utilizes air and fans. In addition, the heat conducting sheet 144a of the internal liquid cooling heat dissipating structure 140a of the present embodiment is embodied as a copper sheet or other metal sheet, which transmits the heat energy generated by the heat generating component 130 to the outside of the power supply device 100a in a conductive manner.

As shown in FIG. 1C, the tank body 142a of the internal liquid-cooling heat dissipation structure 140a of the present embodiment further includes a temperature sensor 146 disposed on a surface 141a of the tank body 142a to detect a temperature of the tank body 142a. . Furthermore, the cavity 142a of the internal liquid-cooling heat dissipation structure 140a further includes a light-emitting diode module 148 disposed on the surface 141a of the cavity 142a for detecting the temperature detected by the temperature sensor 146. The height is displayed in different colors. The LED module 148 can be electrically connected to the circuit board 120 through a connector 149. The LED module 148 can be directly or electrically connected to the circuit board 120 through the connector 149. This is not limited. In addition, referring to FIG. 1C and FIG. 1D, the tank body 142a of the internal liquid-cooling heat dissipation structure 140a of the present embodiment may further include a liquid cooling head 145 and a buffer strip 147, wherein the liquid cooling head 145 is assembled in the tank. The body 142a is connected to an external liquid-cooling heat dissipating structure (not shown), and the buffer strip 147 is disposed on a bottom surface 141b of the trough body 142a for buffering two components (such as the housing 110 and the trough body 142a). The impact force between).

Furthermore, the power supply device 100a of the present embodiment further includes at least one insulating and thermally conductive structure 150a disposed in the housing 110 between the circuit board 120 and the internal liquid-cooling heat dissipation structure 140a, wherein the insulating heat-conducting structure 150a has heat conduction. The function of the heat generated by the heat generating component 130 can be conducted to the internal liquid cooled heat sink structure 140a. As shown in FIG. 1B, the internal liquid-cooling heat dissipation structure 140a of the present embodiment is embodied between the housing 110 and the circuit board 120, and the insulating heat-conducting structure 150a is located between the circuit board 120 and the internal liquid-cooled heat dissipation structure 140a. And the two surfaces 152a, 154a of the insulating heat conducting structure 150a facing each other directly contact the solder surface of the circuit board 120 and the heat conducting sheet 144a, respectively. That is, the insulated thermally conductive structure 150a can conduct thermal energy on the circuit board 120 to the internal liquid-cooled heat dissipation structure 140a, and the internal liquid-cooled heat dissipation structure 140a can be circulated by the working fluid F in the internal conduit 143. When heat is taken away, it can effectively dissipate heat. Moreover, since the insulating and thermally conductive structure 150a has insulating properties, the surface 152a of the insulating and thermally conductive structure 150a is in contact with the solder surface of the circuit board 120, and the solder surface of the circuit board 120 and the heat conductive sheet 144a of the internal liquid-cooling heat dissipation structure 140a can be isolated. In the operation, the soldering surface of the circuit board 120 contacts the heat conducting sheet 144a to cause arc discharge, that is, the insulating and heat conducting structure 150a of the present invention has the characteristics of heat conduction and insulation, and can effectively transfer the heat energy of the circuit board to With the internal liquid cooling heat dissipation structure 140a, arc discharge can be avoided. In addition, the arrangement of the internal liquid-cooling heat dissipation structure 140a and the insulating heat-conducting structure 150a of the present embodiment is not limited to the design of the circuit board 120 and the component arrangement position in the housing 110, even if the researcher changes the circuit design or increases or decreases the number of components. The internal liquid-cooling heat dissipation structure 140a does not need to be re-opened, and can be applied to power supply devices of various types, and has better flexibility of use.

In addition, in order to further improve the heat dissipation effect of the power supply device 100a, the power supply device 100a of the present embodiment may further include at least one fan module 160, which is assembled in the housing 110 and electrically connected to the circuit board 120. Different speeds are displayed depending on the temperature. As shown in FIG. 1A and FIG. 1B , the fan module 160 of the present embodiment is specifically disposed above the heating element 130 , but is not limited thereto. In short, the power supply device 100a of the present embodiment is liquid-cooled and air-cooled, meaning that heat is dissipated except by the working fluid F circulating in the internal pipe 143 of the internal liquid-cooling heat dissipation structure 140a. In addition, the fan module 160 is also used to assist heat dissipation, thereby improving the heat dissipation effect of the power supply device 100a.

It is to be noted that the power supply device 100a of the present embodiment is not limited to the use of both liquid-cooled and air-cooled heat dissipation modes, and the power supply device 100a may also use a liquid-cooled heat dissipation method alone. For example, when the power supply device 100a uses two heat dissipation modes at the same time, when the lower load or the heat dissipation requirement is low, the air-cooling heat dissipation fan module 160 is turned off by the design of the permeable circuit. At this time, the power supply is provided. The device 100a uses only liquid-cooled heat dissipation, so that in addition to saving energy, a completely silent effect can be achieved.

Experimental Example: Comparing the power supply device 100a using the liquid cooling type heat dissipation device and the heat generating component in the power supply device using the air cooling type heat dissipation in the present embodiment under the condition that the input voltage is 99 VAC and the output load is 1200 W. temperature. As can be seen from the experimental data in the following table: The heat generating component 130 (such as an electromagnetic interference magnetic core or an isolating transformer) in the power supply device 100a of the present embodiment has a comparison with a heating element (such as an electromagnetic interference magnetic core or an isolation transformer) in a conventional power supply device. The low temperature can effectively reduce the temperature of the heating element from 2 ° C to 9 ° C. That is to say, under the same conditions, the power supply device 100a of the present embodiment can avoid high noise in addition to the better air-cooling power supply device than the conventional air-cooled power supply device. The production.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a side view of a power supply device according to another embodiment of the present invention. Referring to FIG. 1B and FIG. 2, the power supply device 100b of the present embodiment is similar to the power supply device 100a of FIG. 1B. The difference between the two is that the power supply device 100b of the embodiment does not have the fan module 160. The fan module 160 is disposed inside the housing 110 relative to the other side of the liquid cooling head 145, not limited thereto, and the internal liquid cooling heat dissipation structure 140b is located between the housing 110 and the heating element 130. The insulating heat conducting structure 150b is located between the heat generating component 130 and the internal liquid cooling heat dissipating structure 140b, and the two surfaces 152b, 154b of the insulating heat conducting structure 150b opposed to each other directly contact the heat generating component 130 and the heat conducting sheet 144b. That is, the heat generated by the heat generating component 130 is transmitted to the heat conducting sheet 144b of the internal liquid cooling heat dissipating structure 140b through the insulating heat conducting structure 150b, and is circulated by the working fluid F in the internal line 143 of the tank body 142b. By taking away the heat, you can effectively dissipate heat. Therefore, the present embodiment utilizes the insulated and thermally conductive structure 150b to conduct the thermal energy of the heat generating component 130. It is not necessary to use a liquid-cooled heat-dissipating metal tube as a prior art in the prior art to perform heat transfer.

3 is a perspective view of a power supply device according to another embodiment of the present invention. For convenience of explanation, some components, such as a fan module, are omitted in FIG. Referring to FIG. 1B and FIG. 3, the power supply device 100c of the present embodiment is similar to the power supply device 100a of FIG. 1B. The difference between the two is that the power supply device 100c of the embodiment further includes at least one external liquid-cooled heat dissipation. The structure 170 is disposed outside the housing 110 and includes a heat dissipation row 172, a heat dissipation fan 173, a motor 174, a liquid cooling tank 175, and an external line 176. The liquid cooling head 145 of the internal liquid cooling heat dissipation structure 140a is connected to the external line 176 of the external liquid cooling heat dissipation structure 170, the heat dissipation fan 173 is assembled to the heat dissipation row 172, and the liquid cooling tank 175 is connected to the motor 174. The external line 176 is connected between the liquid cooling head 145 of the internal liquid cooling heat dissipation structure 140a and the liquid cooling tank 175, between the motor 174 and the heat dissipation row 172, and the liquid cooling head of the heat dissipation row 172 and the internal liquid cooling heat dissipation structure 140a. Between 145. The external liquid-cooling heat dissipation structure 170 is connected to the internal liquid-cooling heat dissipation structure 140a to form a circuit L, and the working fluid F is circulated through the circuit 174 of the external liquid-cooling heat dissipation structure 170, thereby reducing the power supply device. The temperature of 100c.

4 is a schematic diagram of a liquid cooling system including the power supply device of FIG. 1A. The liquid cooling system 10 of the present embodiment includes a liquid cooling heat dissipating structure 200a corresponding to the position of the display card in the computer main body and a liquid cooling heat dissipating structure 200b corresponding to the corresponding computer main board in addition to the above-mentioned power supply device 100a. . The power supply device 100a and the liquid-cooling heat dissipation structure 200a, 200b are connected through an external pipe 500, wherein the liquid cooling tank 300 is connected to the motor 400, that is, the power supply device 100a, the display card and the motherboard are shared external liquid cooling. The heat dissipation structure (liquid cooling tank 300, heat dissipation row and motor 400), and the external pipeline 500 is connected in series with the power supply device 100a and the liquid cooling heat dissipation structures 200a, 200b to form a loop L', and the working fluid F' is circulated in the loop In L', the temperature of the liquid cooling system 10 is thereby lowered.

In addition, in other embodiments not shown, the power supply device may also include a plurality of internal liquid-cooled heat dissipation structures, such as two internal liquid-cooled heat dissipation structures, one of which is disposed between the housing and the circuit board. The other is disposed between the housing and the heat generating component, which is still within the scope of the present invention. Those skilled in the art can refer to the description of the above embodiments to achieve the desired technical effects according to actual needs.

In summary, in the design of the power supply device of the present invention, the internal liquid-cooling heat dissipation structure is disposed in the housing between the housing and the circuit board and at least one of the housing and the heating element, wherein the working fluid is adapted The inner tube is filled in, and the heat generated by the heat generating component is transmitted to the tank through the heat conducting sheet, and is radiated by the working fluid circulating in the inner tube. In short, the internal liquid-cooled heat dissipation structure of the present invention can be applied to various types of power supply devices, and the power supply device of the present invention can perform heat dissipation in a liquid-cooled manner, in addition to having better heat dissipation. In addition to the effect, it also has high safety of use and can avoid the occurrence of high noise.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Liquid cooling system

100a, 100b, 100c‧‧‧ power supply unit

110‧‧‧shell

120‧‧‧ boards

130‧‧‧heating components

140a, 140b‧‧‧ internal liquid-cooled heat dissipation structure

141a‧‧‧ surface

141b‧‧‧ bottom surface

142a, 142b‧‧‧

143‧‧‧Internal piping

144a, 144b‧‧‧thermal sheet

145‧‧‧ liquid cooling head

146‧‧‧temperature sensor

147‧‧‧ Buffer strip

148‧‧‧Lighting diode module

149‧‧‧Connector

150a, 150b‧‧‧Insulation and heat conduction structure

152a, 152b, 154a, 154b‧‧‧ surface

160‧‧‧Fan module

170‧‧‧External liquid-cooled heat dissipation structure

172‧‧‧ heat sink

173‧‧‧ cooling fan

174‧‧‧Motor

175‧‧‧ liquid cooling tank

176‧‧‧External piping

200a, 200b‧‧‧ liquid-cooled heat dissipation structure

300‧‧‧ liquid cooling tank

400‧‧‧Motor

500‧‧‧External piping

L, L’‧‧‧ loop

F, F’‧‧‧ working fluid

FIG. 1A is a perspective view of a power supply device according to an embodiment of the invention. FIG. 1B is a schematic side view of the power supply device of FIG. 1A. FIG. 1C is a perspective exploded view showing the internal liquid cooling heat dissipation structure of the power supply device of FIG. 1A. 1D is a bottom perspective view of the internal liquid-cooled heat dissipation structure of FIG. 1C. 2 is a side view of a power supply device according to another embodiment of the present invention. 3 is a perspective view of a power supply device according to another embodiment of the present invention. 4 is a schematic diagram of a liquid cooling system including the power supply device of FIG. 1A.

Claims (13)

A power supply device includes: a casing; a circuit board disposed in the casing; at least one heat generating component disposed in the casing and electrically connected to the circuit board; and at least one internal liquid cooling heat dissipation structure Between the housing and the circuit board and at least one of the housing and the heating element, the internal liquid-cooled heat dissipation structure includes: a tank body including an internal pipeline, One of the working fluids is adapted to be filled in the inner tube; and a heat conducting sheet is assembled on the tank body, wherein heat generated by the heat generating component is transmitted to the tank through the heat conducting sheet, by circulating in the inner tube The working fluid in the road dissipates heat. The power supply device of claim 1, further comprising: at least one insulating and heat conducting structure disposed in the housing, and located in the circuit board and the internal liquid cooling heat dissipating structure and the heating element and the internal liquid The cold heat dissipation structure is between at least one of them. The power supply device of claim 2, wherein the internal liquid-cooling heat dissipation structure is located between the housing and the circuit board, and the insulating and thermally conductive structure is located on the circuit board and the internal liquid-cooled heat dissipation structure. The two surfaces of the insulating and heat conducting structure opposite to each other directly contact the circuit board and the heat conducting sheet, respectively. The power supply device of claim 2, wherein the internal liquid-cooling heat dissipation structure is located between the housing and the heat generating component, and the insulating heat conductive structure is located between the heat generating component and the internal liquid cooling heat dissipation structure. The two surfaces of the insulating and heat conducting structure opposite to each other directly contact the heat generating component and the heat conducting sheet, respectively. The power supply device of claim 1, wherein the tank body of the internal liquid-cooled heat dissipation structure further comprises a temperature sensor disposed on a surface of the tank body to detect the tank body. a temperature. The power supply device of claim 5, wherein the tank body of the internal liquid-cooled heat dissipation structure further comprises a light-emitting diode module disposed on the surface of the tank body for The temperature is displayed in different colors. The power supply device of claim 6, wherein the light emitting diode module is electrically connected to the circuit board through a connector. The power supply device of claim 5, further comprising: at least one fan module assembled in the housing and electrically connected to the circuit board for different rotational speeds according to the temperature. The power supply device of claim 1, wherein the internal liquid cooling heat dissipation structure further comprises a liquid cooling head, the power supply device further comprising: at least one external liquid cooling heat dissipation structure disposed outside the housing And comprising a heat dissipation row, a cooling fan, a motor, a liquid cooling tank and an external pipeline, the liquid cooling head is connected to the external pipeline, the cooling fan is assembled on the heat dissipation row, and the liquid cooling tank is connected The motor is connected between the liquid cooling head and the liquid cooling tank, between the motor and the heat dissipation row, and between the heat dissipation row and the liquid cooling head. The power supply device of claim 9, wherein the external liquid-cooling heat dissipation structure is coupled to the internal liquid-cooled heat dissipation structure to form a circuit, and the working fluid passes through the motor of the external liquid-cooled heat dissipation structure. Loop in the loop. The power supply device of claim 1, wherein the heat generating component is a passive component or a semiconductor component. The power supply device of claim 1, wherein the thermal conductive sheet is made of metal. The power supply device of claim 1, wherein the working fluid comprises a pure water, a deionized water, a liquid metal or a fluorocarbon organic liquid.