TW201903000A - Resin particles, conductive particles, conductive materials, adhesives, connection structures, and liquid crystal display elements - Google Patents

Abstract

Provided are resin particles which are capable of effectively suppressing the occurrence of spring back, and which are also capable of effectively suppressing the occurrence of lifting or separation. Resin particles according to the present invention are composed of a polymer of a first polymerizable compound that has one polymerizable functional group and a cyclic organic group and a second polymerizable compound that has two or more polymerizable functional groups and a cyclic organic group. The weight ratio of the content of the structural unit derived from the first polymerizable compound to the content of the structural unit derived from the second polymerizable compound is 7 or more. If the resin particles are heated at 150 DEG C for 1,000 hours, the ratio of the particle diameters of the resin particles after heating to the particle diameters of the resin particles before heating is 0.9 or less.

Description

Resin particles, conductive particles, conductive materials, adhesives, connection structures, and liquid crystal display elements

The present invention relates to a resin particle formed of a resin. The present invention also relates to conductive particles, conductive materials, adhesives, connection structures, and liquid crystal display elements using the resin particles.

Anisotropic conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known. Regarding the anisotropic conductive material, conductive particles are dispersed in a binder.

The anisotropic conductive material is used to electrically connect electrodes of various connection target members such as a flexible printed circuit board (FPC), a glass substrate, a glass epoxy substrate, and a semiconductor wafer to obtain a connection structure. Moreover, as said conductive particle, the conductive particle which has a resin particle and the conductive part arrange | positioned on the surface of this resin particle may be used.

The liquid crystal display element is configured by placing liquid crystal between two glass substrates. In this liquid crystal display element, a spacer is used as a gap control material in order to keep the gap (gap) between two glass substrates uniform and fixed. As the spacer, resin particles are generally used.

As an example of the above-mentioned conductive particles, Patent Document 1 below discloses a conductive particle having polymer particles and a conductive layer covering the surface of the polymer particles. The polymer particles are made of at least one polyfunctional (difunctional (meth) acrylate monomer, trifunctional (meth) acrylate monomer, and tetrafunctional (meth) acrylate monomer) poly ( A copolymerization component of a meth) acrylate and a monofunctional (meth) acrylate monomer is obtained by copolymerization. The difunctional (meth) acrylate monomer is 1,10-decanediol di (meth) acrylate. In the case where the polyfunctional (meth) acrylate includes the difunctional (meth) acrylate monomer, the copolymerization component is contained in an amount of 10 parts by weight based on 100 parts by weight of the difunctional (meth) acrylate monomer. The range of parts to 400 parts by weight contains the above-mentioned monofunctional (meth) acrylate monomer. When the polyfunctional (meth) acrylate includes the tetrafunctional (meth) acrylate monomer, as for the copolymerization component, the tetrafunctional (meth) acrylate monomer and the monofunctional (formaldehyde) The total of 100% by weight of the acrylate) acrylate monomers contains 80% by weight or less of the above-mentioned monofunctional (meth) acrylate monomers. The compression deformation response rate of the polymer particles is 70% or more. The volume expansion ratio of the polymer particles is 1.3 or less.

Moreover, as an example of the resin particle used for the said electroconductive particle or the said spacer, the following patent document 2 discloses the highly recoverable resin particle which contains a crosslinked (meth) acrylate resin. The average particle diameter of the highly recoverable resin particles is 1 μm to 100 μm. The recovery ratio of the highly recoverable resin particles is 22% or more. The 30% compressive strength of the highly recoverable resin particles is 1.5 kgf / mm ² to 5.0 kgf / mm ² . [Prior Art Literature] [Patent Literature]

[Patent Document 1] WO2010 / 013668A1 [Patent Document 2] WO2016 / 039357A1

[Problems to be solved by the invention]

In the case where the previous resin particles are used as conductive particles or used as a spacer, the effect of the compressed resin particles returning to their original shape will be affected, and a spring called spring back appears. Situation. If the resin particles used as the conductive particles rebound, the contact area between the conductive particles and the electrode may decrease and the conduction reliability may decrease. In addition, when springback occurs in the resin particles used as the spacer, the spacer may not sufficiently contact the member for a liquid crystal display element or the like, and the gap control effect may not be sufficiently obtained.

In addition, a conductive material containing conductive particles and an adhesive, or an adhesive containing a spacer and an adhesive may be exposed to a heated environment during use, and the adhesive may harden and shrink. The conventional resin particles may not sufficiently shrink when heated, and may not be able to follow the curing shrinkage of the adhesive. As a result, bumps or peeling may occur between a conductive material and an electrode, or between an adhesive and a member for liquid crystal display elements.

An object of the present invention is to provide a resin particle capable of effectively suppressing the occurrence of springback and effectively suppressing the occurrence of bulging or peeling. Another object of the present invention is to provide conductive particles, conductive materials, adhesives, connection structures, and liquid crystal display elements using the resin particles. [Technical means to solve the problem]

According to a wide aspect of the present invention, there is provided a resin particle comprising a first polymerizable compound having one polymerizable functional group and a cyclic organic group, and a resin particle having two or more polymerizable functional groups and a cyclic organic group. The polymer of the second polymerizable compound has a weight ratio of the content of the structure derived from the first polymerizable compound to the content of the structure derived from the second polymerizable compound of 7 or more, and the resin is heated at 150 ° C. When the particles were heated for 1000 hours, the ratio of the particle diameter of the resin particles after heating to the particle diameter of the resin particles before heating was 0.9 or less.

In a specific aspect of the resin particles of the present invention, the compression response rate when subjected to 60% compression deformation is 10% or less.

In a specific aspect of the resin particles of the present invention, the 10% K value is 3000 N / mm ² or less.

In a specific aspect of the resin particles of the present invention, the 30% K value is 1500 N / mm ² or less.

In a specific aspect of the resin particles of the present invention, when the resin particles are heated at 150 ° C. for 1000 hours, the 30% K value of the resin particles after heating is relative to the 30% K value of the resin particles before heating. The ratio is 0.8 or more and 1.5 or less.

In a specific aspect of the resin particle of the present invention, the cyclic organic group in the first polymerizable compound and the cyclic organic group in the second polymerizable compound are each a hydrocarbon group.

In a specific aspect of the resin particle of the present invention, the cyclic organic group in the first polymerizable compound is a phenylene group, a cyclohexyl group, or an isopropyl group.

In a specific aspect of the resin particle of the present invention, the cyclic organic group in the second polymerizable compound is a phenylene group, a cyclohexyl group, or an isopropyl group.

In a specific aspect of the resin particles of the present invention, the resin particles include an acid phosphate compound.

In a specific aspect of the resin particles of the present invention, the resin particles are used as a spacer, or used to form a conductive portion on a surface to obtain conductive particles having the conductive portion.

According to a wide aspect of the present invention, there is provided a conductive particle including the resin particle and a conductive portion disposed on a surface of the resin particle.

According to a wide aspect of the present invention, there is provided a conductive material including conductive particles and a binder, and the conductive particles include the resin particles and a conductive portion disposed on a surface of the resin particles.

According to a wide aspect of the present invention, there is provided an adhesive agent including the above-mentioned resin particles and a binder.

According to a broad aspect of the present invention, there is provided a connection structure including: a first connection target member having a first electrode on a surface; a second connection target member having a second electrode on a surface; and a connection portion, which The first connection target member and the second connection target member are connected; the material of the connection portion includes the resin particles; and the first electrode and the second electrode are electrically connected through the connection portion.

According to a wide aspect of the present invention, there is provided a liquid crystal display element including a member for a first liquid crystal display element, a member for a second liquid crystal display element, and a member for the first liquid crystal display element and the second liquid crystal display. A spacer between the members for the element, and the spacer is the resin particle. [Effect of the invention]

The resin particle of the present invention is a polymer of a first polymerizable compound having one polymerizable functional group and a cyclic organic group, and a second polymerizable compound having two or more polymerizable functional groups and a cyclic organic group. . In the resin particles of the present invention, the weight ratio of the content of the structure derived from the first polymerizable compound to the content of the structure derived from the second polymerizable compound is 7 or more. In the resin particles of the present invention, when the resin particles are heated at 150 ° C. for 1,000 hours, the ratio of the particle diameter of the resin particles after heating to the particle diameter of the resin particles before heating is 0.9 or less. Since the resin particle of the present invention has the above-mentioned structure, it is possible to effectively suppress the occurrence of springback and effectively suppress the occurrence of bulging or peeling.

Hereinafter, the present invention will be described in detail.

(Resin Particles) The resin particles of the present invention are a first polymerizable compound having one polymerizable functional group and a cyclic organic group, and a second polymerizable property having two or more polymerizable functional groups and a cyclic organic group. Polymer of compounds. In the resin particles of the present invention, the weight ratio (WM / WD) of the content (WM) of the structure derived from the first polymerizable compound to the content (WD) of the structure derived from the second polymerizable compound is 7 the above. In the resin particles of the present invention, when the resin particles are heated at 150 ° C. for 1000 hours, the ratio of the particle diameter of the heated resin particles to the particle diameter of the resin particles before heating (the particle diameter of the resin particles after heating) / The particle diameter of the resin particles before heating) is 0.9 or less.

Since the present invention has the above-mentioned configuration, it is possible to effectively suppress the occurrence of springback and effectively suppress the occurrence of bumps or peeling.

Since the resin particles of the present invention have the above-mentioned structure, the compression response rate is relatively low, and the effect of the compressed resin particles to return to the original shape is relatively difficult to affect, and it is difficult to cause rebound. For example, when the resin particles of the present invention are used as conductive particles, it is possible to effectively prevent a reduction in the contact area between the conductive particles and the electrodes, and to effectively improve the conduction reliability between the electrodes. When the resin particles of the present invention are used as a spacer, the spacer can be sufficiently brought into contact with a member for a liquid crystal display element, and the gap can be controlled with higher accuracy.

In addition, a conductive material containing conductive particles and an adhesive or an adhesive containing a spacer and an adhesive may be exposed to a heating environment during use, and the adhesive may be hardened and contracted by heating. Since the resin particles of the present invention have the above-mentioned structure, the resin particles are relatively easy to shrink by heating. Since the particle diameter of the resin particles after heating is moderately smaller than that of the resin particles before heating, the resin particles can also follow the curing shrinkage of the adhesive. As a result, it is possible to effectively suppress the occurrence of bumps or peeling between a conductive material and an electrode, or between an adhesive and a member for a liquid crystal display element.

In the resin particles of the present invention, the weight ratio (WM / WD) of the content (WM) of the structure derived from the first polymerizable compound to the content (WD) of the structure derived from the second polymerizable compound is 7 the above. From the viewpoint of further effectively suppressing the occurrence of rebound, and from the viewpoint of further effectively suppressing the occurrence of bumps or peeling, the above-mentioned weight ratio (WM / WD) is preferably 9 or more, more preferably 13 or more, and It is preferably 20 or less, and more preferably 17 or less.

Examples of the method for determining the content (WM) of the structure derived from the first polymerizable compound and the content (WD) of the structure derived from the second polymerizable compound include the following methods. Calculate the amount of the polymerized first and second polymerizable compounds based on the amount of the first and second polymerizable compounds used when obtaining the polymer and the remaining amount of the first and second polymerizable compounds after polymerization. And calculated based on the amount of the polymerized first and second polymerizable compounds.

In addition, as a method of obtaining the content (WM) of the structure derived from the first polymerizable compound and the content (WD) of the structure derived from the second polymerizable compound from the resin particles, the following methods can be cited. According to the amount of functional groups in the resin particles of the first and second polymerizable compounds used when obtaining the polymer, or the functions of the first and second polymerizable compounds in the resin particles used when obtaining the polymer The amount of the base obtained from the base reaction is calculated.

In the resin particles of the present invention, when the resin particles are heated at 150 ° C. for 1000 hours, the ratio of the particle diameter of the heated resin particles to the particle diameter of the resin particles before heating (the particle diameter of the resin particles after heating) / The particle diameter of the resin particles before heating) is 0.9 or less. From the viewpoint of further effectively suppressing the occurrence of bulging or peeling, the above ratio (particle diameter of the resin particles after heating / particle diameter of the resin particles before heating) is preferably 0.4 or more, more preferably 0.6 or more, and more than It is preferably 0.85 or less, and more preferably 0.8 or less.

The particle diameter of the resin particles (the particle diameter of the resin particles before the heating) can be appropriately set according to the application. The particle diameter of the resin particles is preferably 0.5 μm or more, more preferably 1 μm or more, and more preferably 500 μm or less, more preferably 300 μm or less, even more preferably 150 μm or less, and still more preferably 100 μm or less. , Particularly preferably below 50 μm. When the particle diameter of the resin particles is greater than or equal to the above lower limit and less than or equal to the above upper limit, the occurrence of springback can be further effectively suppressed, and the occurrence of bumps or peeling can be further effectively suppressed. When the particle diameter of the resin particles is 0.5 μm or more and 500 μm or less, the resin particles can be favorably used for conductive particle applications. When the particle diameter of the said resin particle is 0.5 micrometer or more and 500 micrometer or less, the said resin particle can be used suitably for the use of a spacer.

The particle diameter of the resin particles (the particle diameter of the resin particles before heating and the particle diameter of the resin particles after heating) indicates the diameter when the resin particles are truly spherical, and when the resin particles are not truly spherical, Indicates the maximum diameter.

The particle diameter of the resin particles (the particle diameter of the resin particles before heating and the particle diameter of the resin particles after heating) is preferably an average particle diameter, more preferably a number average particle diameter. The particle diameter of the resin particles is determined using a particle size distribution measuring device or the like. For example, a particle size distribution measuring device using principles such as laser scattered light, resistance change, and image analysis after shooting can be used. Specifically, as a method for measuring the particle diameter of the resin particles, for example, a method of measuring the particle diameter of about 100,000 resin particles using a particle size distribution measuring device ("Multisizer 4" manufactured by Beckman Coulter Co., Ltd.), and calculating the average value. The particle diameter of the resin particles is preferably determined by observing arbitrary 50 resin particles with an electron microscope or an optical microscope and calculating the average value. When measuring the particle diameter of the said resin particle about electroconductive particle, it can measure by the following method, for example.

The "Technovit 4000" manufactured by Kulzer was added and dispersed so that the content of the conductive particles was 30% by weight, and an embedded resin for conducting particle inspection was produced. A cross-section of the conductive particles was cut out using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies) so as to pass through the vicinity of the center of the conductive particles dispersed in the resin for inspection. Then, using a field emission scanning electron microscope (FE-SEM), the image magnification was set to 25,000 times, 50 conductive particles were randomly selected, and the resin particles of each conductive particle were observed. The particle diameter of the resin particles in each conductive particle was measured, and the arithmetic mean of these was calculated as the particle diameter of the resin particles.

From the viewpoint of further effectively suppressing the occurrence of rebound, and from the viewpoint of further effectively suppressing the occurrence of bumps or peeling, the coefficient of variation (CV value) of the particle diameter of the resin particles is preferably 0.5% or more, and more preferably It is 1% or more, preferably 10% or less, and more preferably 7% or less. When the coefficient of variation of the particle diameter of the resin particles is equal to or more than the lower limit and equal to or less than the upper limit, the resin particles can be favorably used for spacers and conductive particles. However, the coefficient of variation of the particle diameter of the resin particles may not reach 0.5%.

The coefficient of variation (CV value) can be measured as follows.

CV value (%) = (ρ / Dn) × 100 ρ: standard deviation of particle diameter of resin particles Dn: average value of particle diameter of resin particles

The shape of the resin particles is not particularly limited. The shape of the resin particles may be a spherical shape or a shape other than a spherical shape such as a flat shape.

The 10% K value of the resin particles is preferably 1000 N / mm ² or more, more preferably 1500 N / mm ² or more, and more preferably 3000 N / mm ² or less, more preferably 2750 N / mm ² or less, and more preferably It is preferably below 2500 N / mm ² . If the 10% K value of the resin particles is greater than or equal to the above lower limit and less than or equal to the above upper limit, it is possible to further effectively suppress the occurrence of springback and further effectively suppress the occurrence of bumps or peeling.

The 30% K value of the resin particles is preferably 300 N / mm ² or more, more preferably 500 N / mm ² or more, and preferably 1500 N / mm ² or less, more preferably 1200 N / mm ² or less, and more preferably It is preferably 1000 N / mm ² or less. If the 30% K value of the resin particles is greater than or equal to the above lower limit and less than or equal to the above upper limit, it is possible to further effectively suppress the occurrence of springback and further effectively suppress the occurrence of bumps or peeling.

When the resin particles are heated at 150 ° C for 1000 hours, the ratio of the 30% K value of the resin particles after heating to the 30% K value of the resin particles before heating (30% K value of the resin particles after heating / heating) The 30% K value of the former resin particles) is preferably 0.8 or more, more preferably 1.15 or more, and even more preferably 1.2 or more. When the resin particles are heated at 150 ° C for 1000 hours, the ratio of the 30% K value of the resin particles after heating to the 30% K value of the resin particles before heating (30% K value of the resin particles after heating / heating) The 30% K value of the former resin particles) is preferably 1.5 or less, more preferably 1.45 or less, and even more preferably 1.4 or less. If the above ratio (30% K value of the resin particles after heating / 30% K value of the resin particles before heating) is above the above lower limit and below the above upper limit, the occurrence of springback can be further effectively suppressed, and it can be further effective In order to suppress the occurrence of bumps or peeling.

The 10% K value and 30% K value of the above resin particles (compressive elastic modulus when the resin particles are compressed at 10% and compression elastic modulus when the resin particles are compressed at 30%) can be measured in the following manner.

Using a micro compression tester, a resin (100 μm diameter, made of diamond) smooth end face of a cylinder was used to compress one resin particle at 25 ° C at a compression speed of 0.3 mN / s and a maximum test load of 20 mN. The load value (N) and compression displacement (mm) at this time were measured. Based on the obtained measured values, the 10% K value or 30% K value at 25 ° C can be obtained according to the following formula. As the micro compression tester, for example, "Micro compression tester MCT-W200" manufactured by Shimadzu Corporation, and "Fischer Scope H-100" manufactured by Fischer Corporation can be used. The 10% K value or 30% K value of the resin particles is preferably calculated by arithmetically averaging the 10% K value or 30% K value of arbitrarily selected 50 resin particles.

10% K value or 30% K value (N / mm ² ) = (3/2 ^1/2 ) ・ F ・ S ^-3/2・ R ^-1/2 F: ^Load of resin particles when they are deformed by 10% compression Value (N) or weight value (N) after 30% compression deformation S: compression displacement (mm) of resin particles after 10% compression deformation or compression displacement (mm) when 30% compression deformation R: resin particles Radius (mm)

The K value described above generally and quantitatively indicates the hardness of the resin particles. By using the K value described above, the hardness of the resin particles can be expressed quantitatively and singly.

From the viewpoint of further effectively suppressing the generation of springback, and from the viewpoint of further effectively suppressing the generation of bulge or peeling, the compression response rate of the resin particles after 60% compression deformation is preferably 2% or more, more preferably It is 4% or more, and preferably 10% or less, more preferably 9.5% or less, and still more preferably 9% or less.

The compression response rate when the resin particles are subjected to 60% compression deformation can be measured as follows.

Disperse resin particles on the sample stand. A small compression tester was used for the dispersed resin particles, and a cylindrical (100 μm diameter, diamond) smooth indenter end face was used to apply the resin particles to the center of the resin particles at 25 ° C until the resin particles were compressed by 60%. Load (reverse load value). Thereafter, it was unloaded to the origin load value (0.40 mN). The load-compression displacement during this period can be measured and the compression response rate at 60 ° compression deformation at 25 ° C can be obtained according to the following formula. The load speed was set to 0.33 mN / s. As the micro compression tester, for example, "Micro compression tester MCT-W200" manufactured by Shimadzu Corporation, and "Fischer Scope H-100" manufactured by Fischer Corporation can be used.

Compression response rate (%) = [L2 / L1] × 100 L1: Compression displacement from the load value at the origin to the reverse load value when the load is applied L2: The load from the reverse load value to the load value at the origin when the load is released Unloading displacement

The use of the resin particles is not particularly limited. The said resin particle can be used suitably for various uses. The resin particles are preferably used as a spacer or to obtain conductive particles having a conductive portion. In the conductive particle, the conductive portion is formed on a surface of the resin particle. The resin particles are preferably used as a spacer. The resin particles are preferably used to obtain conductive particles having a conductive portion. Examples of the method of using the spacer include a spacer for a liquid crystal display element, a spacer for gap control, and a spacer for stress relaxation. The above-mentioned spacers for gap control can be used to control the gaps of the laminated wafers in order to ensure the stand-off height and flatness, and to control the gaps of optical components in order to ensure the smoothness of the glass surface and the thickness of the adhesive layer. The above-mentioned stress relaxation spacer can be used for stress relaxation of a sensor wafer or the like, and stress relaxation of a connection portion connecting two connection target members.

The resin particles are preferably used as a spacer for a liquid crystal display element, and preferably used as a peripheral sealant for a liquid crystal display element. In the above-mentioned peripheral sealant for a liquid crystal display element, the resin particles preferably function as a spacer. The resin particles have good compressive deformation characteristics. Therefore, when the resin particles are used as a spacer and arranged between substrates, or when a conductive portion is formed on the surface and used as conductive particles, the electrodes are electrically connected. The spacers or conductive particles are efficiently arranged between the substrates or between the electrodes. Furthermore, since the resin particles can suppress damage to a member for a liquid crystal display element or the like, in a liquid crystal display element using the spacer for a liquid crystal display element and a connection structure using the conductive particles, it is difficult to cause connection failure and display failure. .

Furthermore, the said resin particle can also be used suitably as an inorganic filler, an additive of a color enhancer, an impact absorber, or a vibration absorber. For example, the above-mentioned resin particles can be used as a substitute for rubber, spring, or the like.

(Other details of the resin particles) The resin particles of the present invention are a first polymerizable compound having one polymerizable functional group and a cyclic organic group, and a second polymerizable compound having two or more polymerizable functional groups and a cyclic organic group. Polymer of polymerizable compound. The resin particles are preferably obtained by polymerizing the first polymerizable compound and the second polymerizable compound.

From the viewpoint of further effectively suppressing the generation of springback, and from the viewpoint of further effectively suppressing the generation of bulge or peeling, it is preferable that the resin particles have the same polymer as the center portion and the surface portion of the resin particles. Make up. The blending ratio of the polymerizable compound in the central portion of the resin particle and the blending ratio of the polymerizable compound in the surface portion of the resin particle may be the same or different. The composition ratio of the constituent components of the central portion of the resin particles and the constitution ratio of the constituent components of the surface portions of the resin particles may be the same or different.

In the resin particles described above, it is preferable that the center portion of the resin particles is formed of a center portion forming material, and the surface portion of the resin particles is formed of a surface portion forming material. From the viewpoint of further effectively suppressing the generation of springback, and from the viewpoint of further effectively suppressing the generation of bumps or peeling, in the resin particles, the component of the center portion forming material is more than the component of the surface portion forming material. Better to be the same. In the resin particles, the component ratio of the center portion forming material and the surface portion forming material may be the same or different. Moreover, it is preferable that the said resin particle exists the area | region containing both the said center part formation material and the said surface part formation material. Among the resin particles, it is preferable that the resin particles include a region including the center portion forming material and not including the surface portion forming material or containing the surface portion forming material in an amount of less than 25% in the center portion. In the resin particles, it is preferable that the resin particles have a region including the surface portion forming material and not including the center portion forming material or containing the center portion forming material in an amount of less than 25% on the surface portion.

Preferably, the resin particles are not core-shell particles having a core and a shell disposed on a surface of the core, and it is preferable that the resin particles have no core-shell interface. It is preferable that the said resin particle does not have an interface in a resin particle, and it is more preferable that it does not have an interface with which different surfaces contact each other. It is preferable that the said resin particle does not have a discontinuous part with a surface, and it is preferable that it does not have a discontinuous part with a structured surface.

In the resin particle of the present invention, the first polymerizable compound has one polymerizable functional group (first polymerizable functional group). The polymerizable functional group (first polymerizable functional group) is not particularly limited, and examples thereof include a vinyl group, an acrylfluorenyl group, and a methacrylfluorenyl group. Examples of the first polymerizable compound include styrene, phenyl methacrylate, phenyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, isomethacrylate, and isoacrylate. The first polymerizable compound may be used alone or in combination of two or more.

In the resin particle of the present invention, the second polymerizable compound has two or more polymerizable functional groups (second polymerizable functional groups). The polymerizable functional group (second polymerizable functional group) is not particularly limited, and examples thereof include a vinyl group, an acrylfluorenyl group, and a methacrylfluorenyl group. Examples of the second polymerizable compound include divinylbenzene, divinylnaphthalene, diethylenecyclohexane, and triethylenecyclohexane. The second polymerizable compound may be used alone or in combination of two or more.

The resin particles are more preferably such that the first polymerizable compound and the second polymerizable compound have a weight ratio (weight of the first polymerizable compound / weight of the second polymerizable compound) of 7 or more, more preferably It is obtained by polymerizing at a ratio of 9 or more, more preferably 13 or more, preferably 20 or less, more preferably 18.5 or less, and still more preferably 17 or less. The resin particles are preferably obtained by polymerizing the first polymerizable compound and the second polymerizable compound at a ratio of 7 or more by weight ratio, more preferably obtained by polymerizing at a ratio of 9 or more, and more preferably It is obtained by polymerization at a ratio of 13 or more. The resin particles are preferably obtained by polymerizing the first polymerizable compound and the second polymerizable compound at a ratio of 20 or less by weight ratio, more preferably obtained by polymerizing at a ratio of 18.5 or less, and more preferably It is obtained by performing polymerization at a ratio of 17 or less. By polymerizing the first polymerizable compound and the second polymerizable compound at a weight ratio in the above-mentioned preferred range to obtain the resin particles, it is possible to further effectively suppress the occurrence of springback, and further effectively suppress the bulge or The occurrence of peeling.

The resin particle of the present invention preferably contains two or more kinds of cyclic organic groups. In the resin particle of the present invention, the first polymerizable compound has a cyclic organic group (first cyclic organic group). The first polymerizable compound has one or more cyclic organic groups. In the resin particle of the present invention, the second polymerizable compound has a cyclic organic group (second cyclic organic group). The second polymerizable compound has one or more cyclic organic groups. In the resin particles of the present invention, the cyclic organic group (the first cyclic organic group) in the first polymerizable compound and the cyclic organic group (the second cyclic organic group) in the second polymerizable compound may be The same or different. The cyclic organic group (first cyclic organic group) in the first polymerizable compound is preferably different from the cyclic organic group (second cyclic organic group) in the second polymerizable compound.

From the viewpoint of further effectively suppressing the occurrence of rebound, and from the viewpoint of further effectively suppressing the occurrence of bumps or peeling, the cyclic organic group (the first cyclic organic group) in the first polymerizable compound is the same as that described above. The cyclic organic group (second cyclic organic group) in the second polymerizable compound is preferably a hydrocarbon group.

Examples of the hydrocarbon group include phenyl, phenylene, naphthyl, naphthyl, cyclopropyl, cyclohexyl, isoyl, and dicyclopentyl.

From the viewpoint of further effectively suppressing the generation of rebound, and from the viewpoint of further effectively suppressing the generation of bumps or peeling, the resin particles of the present invention preferably have two of phenylene, cyclohexyl, or isopropyl groups. The above cyclic organic group.

The cyclic organic group (the first cyclic organic group) in the first polymerizable compound is preferable from the viewpoint of further effectively suppressing the occurrence of rebound and from the viewpoint of further effectively suppressing the occurrence of bumps or peeling. It is phenyl, cyclohexyl or iso.

The cyclic organic group (second cyclic organic group) in the second polymerizable compound is preferable from the viewpoint of further effectively suppressing the occurrence of springback and from the viewpoint of further effectively suppressing the generation of bumps or peeling. It is phenyl, cyclohexyl or iso.

When using the said resin particle as a conductive particle, it is preferable that the said resin particle contains an acidic phosphate compound from a viewpoint of improving the adhesiveness of a resin particle and a plating layer more effectively. The resin particle preferably has a phosphoric acid structure derived from an acid phosphate compound on the surface. By making the said resin particle have the said phosphoric acid structure on the surface, the adhesiveness with a plating layer can be improved more effectively. Furthermore, by making the said resin particle have the said phosphoric acid structure on the surface, even if the said resin particle shrink | contracts by heating, the cracking of a plating layer can be suppressed more effectively. For example, in a conductive material containing conductive particles and a binder produced by electroless plating of resin particles containing an acid phosphate compound, the conductive material is exposed to heat even when the electrodes are connected to each other. The environment can further effectively suppress the cracking of the plating layer, and can further effectively improve the connection reliability between the electrodes. When the resin particles are used to obtain conductive particles, the resin particles preferably contain an acidic phosphate compound. When the resin particles are used to obtain conductive particles, the resin particles preferably have a phosphoric acid structure derived from an acid phosphate compound on the surface. The acid phosphate compound is preferably an acid phosphate compound.

Examples of the above-mentioned acidic phosphate compounds include ethyl acid phosphate, butyl acid phosphate, butoxy ethyl acid phosphate, 2-ethylhexyl acid phosphate, and isotridecyl acid phosphate Esters, acid oleic acid phosphates, behenyl tetraphosphates, ethylene glycol acid phosphates, methacrylic acid 2-hydroxyethyl phosphates, dibutyl acid phosphates, and acid formulas Bis (2-ethylhexyl) phosphate and the like. These acid phosphate compounds may be used alone or in combination of two or more.

From the viewpoint of further effectively improving the adhesion between the resin particles and the plating layer, the content of the acid phosphate compound in 100% by weight of the resin particles is preferably 1% by weight or more, and more preferably 5% by weight or more. It is preferably 20% by weight or less, and more preferably 15% by weight or less.

(Conductive particles) The conductive particles of the present invention include the resin particles described above, and a conductive portion disposed on the surface of the resin particles.

Fig. 1 is a sectional view showing a conductive particle according to a first embodiment of the present invention.

The conductive particles 1 shown in FIG. 1 include resin particles 11 and a conductive portion 2 disposed on the surface of the resin particles 11. The conductive portion 2 is in contact with the surface of the resin particles 11. The conductive portion 2 covers the surface of the resin particles 11. The conductive particles 1 are coated particles obtained by coating the surface of the resin particles 11 with the conductive portion 2. In the conductive particles 1, the conductive portion 2 is a single-layered conductive portion (conductive layer).

Fig. 2 is a sectional view showing a conductive particle according to a second embodiment of the present invention.

The conductive particles 21 shown in FIG. 2 include resin particles 11 and a conductive portion 22 disposed on the surface of the resin particles 11. The conductive portion 22 has a first conductive portion 22A on the resin particle 11 side as a whole, and a second conductive portion 22B on the side opposite to the resin particle 11 side.

Among the conductive particles 1 shown in FIG. 1 and the conductive particles 21 shown in FIG. 2, only the conductive portion 22 is different. That is, in the conductive particle 1, a conductive portion having a single-layer structure is formed, whereas in the conductive particle 21, a first conductive portion 22A and a second conductive portion 22B having a two-layer structure are formed. The first conductive portion 22A and the second conductive portion 22B may be formed as different conductive portions or may be formed as the same conductive portion.

The first conductive portion 22A is disposed on the surface of the resin particle 11. The first conductive portion 22A is disposed between the resin particles 11 and the second conductive portion 22B. The first conductive portion 22A is in contact with the resin particles 11. The second conductive portion 22B is in contact with the first conductive portion 22A. The first conductive portion 22A is disposed on the surface of the resin particle 11, and the second conductive portion 22B is disposed on the surface of the first conductive portion 22A.

Fig. 3 is a sectional view showing a conductive particle according to a third embodiment of the present invention.

The conductive particles 31 shown in FIG. 3 include resin particles 11, a conductive portion 32, a plurality of core materials 33, and a plurality of insulating materials 34. The conductive portion 32 is disposed on the surface of the resin particles 11. The plurality of core substances 33 are arranged on the surface of the resin particles 11. The conductive portion 32 is disposed on the surface of the resin particles 11 so as to cover the resin particles 11 and the plurality of core substances 33. In the conductive particles 31, the conductive portion 32 is a single-layered conductive portion (conductive layer).

The conductive particle 31 has a plurality of protrusions 31 a on the outer surface. In the conductive particle 31, the conductive portion 32 has a plurality of protrusions 32a on the outer surface. The plurality of core materials 33 bulge the outer surface of the conductive portion 32. The outer surface of the conductive portion 32 is raised by the plurality of core materials 33, thereby forming protrusions 31a and 32a. The plurality of core materials 33 are embedded in the conductive portion 32. The core material 33 is arranged inside the protrusions 31a and 32a. In the conductive particles 31, a plurality of core materials 33 are used to form the protrusions 31a and 32a. In the conductive particles, the protrusions may be formed without using a plurality of the core materials. The conductive particles may not include a plurality of the core materials.

The conductive particles 31 include an insulating substance 34 disposed on the outer surface of the conductive portion 32. At least a part of the outer surface of the conductive portion 32 is covered with an insulating substance 34. The insulating substance 34 is made of an insulating material and is an insulating particle. As described above, the conductive particles of the present invention may have an insulating substance disposed on the outer surface of the conductive portion. However, the conductive particles do not necessarily need to have an insulating substance. The conductive particles may not include a plurality of insulating substances.

Conductive portion: The metal used to form the conductive portion is not particularly limited. Examples of the metal include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, cadmium, silicon, Tungsten, molybdenum, and alloys thereof. Examples of the metal include tin-doped indium oxide (ITO) and solder. In terms of being able to further reduce the connection resistance between the electrodes, an alloy containing tin, nickel, palladium, copper or gold is preferred, and nickel or palladium is preferred.

Moreover, it is preferable that nickel is contained in the said conductive part and the outer surface part of the said conductive part from the point which can improve conduction reliability effectively. The content of nickel in 100% by weight of the conductive portion containing nickel is preferably 10% by weight or more, more preferably 50% by weight or more, still more preferably 60% by weight or more, still more preferably 70% by weight or more, particularly preferably 90% by weight or more. The content of nickel in 100% by weight of the above-mentioned conductive portion containing nickel may be 97% by weight or more, 97.5% by weight or more, and 98% by weight or more.

Furthermore, in most cases, hydroxyl groups are present on the surface of the conductive portion due to oxidation. Generally, the surface of the conductive portion made of nickel has hydroxyl groups due to oxidation. An insulating substance can be disposed on the surface of the conductive portion (the surface of the conductive particles) having such a hydroxyl group through a chemical bond.

The conductive portion may be formed of one layer like the conductive particles 1 and 31. The conductive portion may be formed of a plurality of layers like the conductive particles 21. That is, the conductive portion may have a multilayer structure of two or more layers. When the conductive portion is formed of a plurality of layers, the outermost layer is preferably a gold layer, a nickel layer, a palladium layer, a copper layer, or an alloy layer containing tin and silver, and more preferably a gold layer. In the case where the outermost layer is such a preferable conductive portion, the connection resistance between the electrodes can be further effectively suppressed. When the outermost layer is a gold layer, the corrosion resistance can be further effectively improved.

The method for forming the conductive portion on the surface of the resin particle is not particularly limited. Examples of the method for forming the conductive portion include a method using electroless plating, a method using electroplating, a method using physical vapor deposition, and applying a metal powder or a paste containing a metal powder and a binder to a resin. Method of particle surface, etc. The method using electroless plating is preferable because the formation of the conductive portion is simple. Examples of the method using the physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.

The particle diameter of the conductive particles is preferably 0.5 μm or more, more preferably 1.0 μm or more, and more preferably 500 μm or less, more preferably 450 μm or less, even more preferably 100 μm or less, and even more preferably 50 μm. In the following, it is particularly preferably 20 μm or less. If the particle diameter of the conductive particles is above the lower limit and below the upper limit, when the electrodes are connected using the conductive particles, the contact area between the conductive particles and the electrode becomes sufficiently large, and it is difficult to form a conductive portion when the conductive portion is formed. Forms agglomerated conductive particles. In addition, the interval between the electrodes connected via the conductive particles does not become too large, and the conductive portion is not easily peeled from the surface of the resin particles. Moreover, if the particle diameter of the said conductive particle is more than the said lower limit and below the said upper limit, a conductive particle can be used favorably for the use of a conductive material.

The particle diameter of the conductive particles indicates the diameter when the conductive particles are truly spherical, and the maximum diameter when the conductive particles are not truly spherical.

The particle diameter of the conductive particles is preferably an average particle diameter, and more preferably a number average particle diameter. The particle diameter of the conductive particles is obtained, for example, by observing arbitrary 50 conductive particles with an electron microscope or an optical microscope to calculate an average value, or by measuring the laser particle size distribution measurement device with a plurality of laser diffraction types. The average of the obtained measurement results.

The thickness of the conductive portion is preferably 0.005 μm or more, more preferably 0.01 μm or more, and more preferably 10 μm or less, more preferably 1 μm or less, and still more preferably 0.3 μm or less. When the thickness of the conductive portion is not less than the lower limit and not more than the upper limit, sufficient conductivity can be obtained, and the conductive particles will not become too hard, and the conductive particles will be sufficiently deformed during the connection between the electrodes.

In the case where the conductive portion is formed of a plurality of layers, the thickness of the outermost conductive portion is preferably 0.001 μm or more, more preferably 0.01 μm or more, and preferably 0.5 μm or less, and more preferably 0.1 μm or less. If the thickness of the outermost conductive portion is equal to or more than the lower limit and the upper limit, the coating formed by the outermost conductive portion becomes uniform, the corrosion resistance becomes sufficiently high, and the connection resistance between the electrodes becomes sufficiently low. When the outermost layer is a gold layer, the thinner the gold layer, the lower the cost.

The thickness of the conductive portion can be measured, for example, by observing the cross section of the conductive particles using a transmission electron microscope (TEM). Regarding the thickness of the conductive portion, it is preferable to calculate the average value of the thickness of any five conductive portions as the thickness of the conductive portion of one conductive particle, and it is more preferable to calculate the average value of the thickness of the entire conductive portion as one conductive portion. The thickness of the part. In the case where a plurality of conductive particles are used, the thickness of the conductive portion is preferably calculated by calculating an average value of these for any 10 conductive particles.

Core material: The conductive particles preferably have a plurality of protrusions on an outer surface of the conductive portion. By providing the conductive particles with a plurality of protrusions on the outer surface of the conductive portion, it is possible to further improve the conduction reliability between the electrodes. In many cases, an oxide film is formed on the surface of an electrode connected by the conductive particles. Furthermore, in many cases, an oxide film is formed on the surface of the conductive portion of the conductive particles. By using the conductive particles having the protrusions, the conductive particles are arranged between the electrodes and then pressure-bonded, whereby the oxide film is effectively eliminated by the protrusions. Therefore, the electrode and the conductive particles can be further reliably contacted, and the connection resistance between the electrodes can be further effectively reduced. Furthermore, when the above-mentioned conductive particles have an insulating substance on the surface, or when the conductive particles are dispersed in an adhesive resin to be used as a conductive material, the conductive particles are effectively excluded by the protrusions of the conductive particles. Insulating substance or adhesive resin between the particles and the electrode. Therefore, it is possible to further effectively improve the conduction reliability between the electrodes.

By embedding the core substance in the conductive portion, a plurality of protrusions can be easily formed on the outer surface of the conductive portion. However, it is not necessary to use a core substance to form protrusions on the surface of the conductive portion of the conductive particles.

Examples of the method for forming the protrusions include a method of forming a conductive portion by electroless plating after attaching a core substance to the surface of the resin particles; and forming a conductive portion by electroless plating on the surface of the resin particles. A method in which a core substance is adhered and a conductive portion is formed by electroless plating. Other methods of forming the protrusions include a method of forming a first conductive portion on the surface of the resin particle, and then arranging a core substance on the first conductive portion to form a second conductive portion; and on the surface of the resin particle. A method of adding a core substance in the middle of forming a conductive portion (such as a first conductive portion or a second conductive portion). In addition, instead of using the core material described above, protrusions may be formed by forming a conductive portion by electroless plating on resin particles, and depositing a protrusion-like plating layer on the surface of the conductive portion, and then performing electroless plating. Form a conductive portion.

As a method of disposing a core substance on the surface of the resin particle, for example, a method of adding a core substance to a dispersion liquid of the resin particle, and agglomerating the core substance and attaching to the surface of the resin particle by van der Waals force; A method of adding a core substance to a container in which resin particles are placed, and a method of attaching the core substance to the surface of the resin particles by using a mechanical action caused by rotation of the container or the like. In order to easily control the amount of the core substance to be adhered, a method in which the core substance is aggregated and adhered to the surface of the resin particles in the dispersion is preferred.

The material of the core substance is not particularly limited. Examples of the material of the core substance include a conductive substance and a non-conductive substance. Examples of the conductive substance include conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers. Examples of the conductive polymer include polyacetylene. Examples of the non-conductive material include silicon dioxide, aluminum oxide, barium titanate, and zirconia. A metal is preferable at the point which can improve electroconductivity and can reduce connection resistance effectively. The core substance is preferably a metal particle. Regarding the metal as the material of the core substance, metals exemplified as the metal for forming the conductive portion can be suitably used.

Insulating substance: The conductive particles are preferably provided with an insulating substance disposed on a surface of the conductive portion. In this case, if conductive particles are used for connection between the electrodes, a short circuit between adjacent electrodes can be further prevented. Specifically, when a plurality of conductive particles are in contact with each other, since an insulating substance is present between the plurality of electrodes, it is possible to prevent a short circuit between adjacent electrodes in the lateral direction rather than between the upper and lower electrodes. In addition, during the connection between the electrodes, by using two electrodes to pressurize the conductive particles, an insulating substance between the conductive portion of the conductive particles and the electrode can be easily eliminated. When the above-mentioned conductive particles have a plurality of protrusions on the outer surface of the conductive portion, an insulating substance between the conductive portion of the conductive particles and the electrode can be more easily excluded.

In order that the said insulating substance can be more easily excluded at the time of pressure bonding between electrodes, it is preferable that the said insulating substance is an insulating particle.

Examples of the material of the insulating substance include polyolefin compounds, (meth) acrylate polymers, (meth) acrylate copolymers, block polymers, thermoplastic resins, crosslinked products of thermoplastic resins, and thermosetting Resin and water-soluble resin. As the material of the insulating substance, only one kind may be used, or two or more kinds may be used in combination.

Examples of the polyolefin compound include polyethylene, ethylene-vinyl acetate copolymer, and ethylene-acrylate copolymer. Examples of the (meth) acrylate polymer include polymethyl (meth) acrylate, polydodecyl (meth) acrylate, and polystearyl (meth) acrylate. Examples of the block polymer include polystyrene, a styrene-acrylate copolymer, a styrene-butadiene (styrene-butadiene) type styrene-butadiene block copolymer, and an SBS (styrene -butadiene-styrene, styrene-butadiene-styrene) type styrene-butadiene block copolymer, and hydrides thereof. Examples of the thermoplastic resin include a vinyl polymer and a vinyl copolymer. Examples of the thermosetting resin include epoxy resin, phenol resin, and melamine resin. Examples of the crosslinking of the thermoplastic resin include introduction of polyethylene glycol methacrylate, alkoxylated trimethylolpropane methacrylate, or alkoxylated pentaerythritol methacrylate. Examples of the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinylpyrrolidone, polyethylene oxide, and methyl cellulose. Moreover, a chain transfer agent can also be used for adjustment of a polymerization degree. Examples of the chain transfer agent include mercaptans and carbon tetrachloride.

Examples of a method for disposing the insulating substance on the surface of the conductive portion include a chemical method, a physical method, and a mechanical method. Examples of the chemical method include an interfacial polymerization method, a suspension polymerization method in the presence of particles, and an emulsion polymerization method. Examples of the physical or mechanical method include spray drying, mixing, electrostatic adsorption, spraying, dipping, and vacuum evaporation. From the viewpoint that the insulating substance cannot be easily separated, a method of disposing the insulating substance via a chemical bond on the surface of the conductive portion is preferred.

The outer surface of the conductive portion and the surface of the insulating material may be coated with a compound having a reactive functional group, respectively. The outer surface of the conductive portion and the surface of the insulating material may be chemically bonded directly, or may be chemically bonded indirectly through a compound having a reactive functional group. After a carboxyl group is introduced on the outer surface of the conductive portion, the carboxyl group may be chemically bonded to a functional group on the surface of the insulating substance through a polymer electrolyte such as polyethyleneimine.

(Conductive material) The conductive material of the present invention includes the above-mentioned conductive particles and a binder. The conductive particles are preferably dispersed and used in a binder, and are preferably dispersed in a binder and used as a conductive material. The conductive material is preferably an anisotropic conductive material. The conductive material is preferably used for electrical connection between electrodes. The conductive material is preferably a conductive material for circuit connection.

The above-mentioned adhesive is not particularly limited. As the adhesive, a known insulating resin can be used. The adhesive preferably contains a thermoplastic component (thermoplastic compound) or a curable component, and more preferably contains a curable component. Examples of the curable component include a photo-curable component and a thermo-curable component. The photocurable component preferably contains a photocurable compound and a photopolymerization initiator. It is preferable that the said thermosetting component contains a thermosetting compound and a thermosetting agent.

Examples of the adhesive include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers. These adhesives may be used alone or in combination of two or more.

Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin. Examples of the thermoplastic resin include polyolefin resins, ethylene-vinyl acetate copolymers, and polyamide resins. Examples of the curable resin include epoxy resin, urethane resin, polyimide resin, and unsaturated polyester resin. The curable resin may be a room temperature curable resin, a thermosetting resin, a light curable resin, or a moisture curable resin. The said curable resin can also be used together with a hardening | curing agent. Examples of the thermoplastic block copolymer include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, and a styrene-butadiene-styrene. Block copolymer hydride and styrene-isoprene-styrene block copolymer. Examples of the elastomer include a styrene-butadiene copolymer rubber and an acrylonitrile-styrene block copolymer rubber.

The conductive material may include, in addition to the conductive particles and the binder, fillers, extenders, softeners, plasticizers, polymerization catalysts, hardening catalysts, colorants, antioxidants, and thermal stabilizers. , Light stabilizer, ultraviolet absorber, lubricant, antistatic agent and flame retardant.

As a method for dispersing the conductive particles in the binder, a conventionally known dispersion method can be used, and it is not particularly limited. Examples of a method for dispersing the conductive particles in the adhesive include a method of adding the conductive particles to the adhesive, and then kneading the particles with a planetary mixer to disperse them; using a homogenizer, etc. A method of uniformly dispersing the conductive particles in water or an organic solvent, adding the conductive particles to the binder, and kneading the particles with a planetary mixer or the like to disperse them. Further, as a method for dispersing the conductive particles in the adhesive, the conductive particles are diluted with water or an organic solvent, etc., the conductive particles are added, and the mixture is kneaded with a planetary mixer or the like to make them. Dispersion methods, etc.

The aforementioned conductive material can be used as a conductive paste, a conductive film, and the like. When the above-mentioned conductive material is a conductive film, a film containing no conductive particles may be laminated on a conductive film containing conductive particles. The conductive paste is preferably an anisotropic conductive paste. The conductive film is preferably an anisotropic conductive film.

In 100% by weight of the conductive material, the content of the adhesive is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, and more preferably It is 99.99% by weight or less, and more preferably 99.9% by weight or less. When the content of the binder is at least the above lower limit and at most the above upper limit, the conductive particles are efficiently disposed between the electrodes, and the connection reliability of the connection target members connected by the conductive material is further improved.

The content of the conductive particles in 100% by weight of the conductive material is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 80% by weight or less, more preferably 60% by weight or less, and more preferably It is preferably 40% by weight or less, particularly preferably 20% by weight or less, and most preferably 10% by weight or less. When the content of the conductive particles is equal to or more than the lower limit and equal to or less than the upper limit, the conduction reliability between the electrodes is further improved.

(Adhesive) The adhesive of the present invention includes the above-mentioned resin particles and a binder. The resin particles are preferably dispersed in a binder and used, and are preferably dispersed in a binder and used as an adhesive. The resin particles are preferably used as a spacer in a binder. The adhesive may not include conductive particles.

The above-mentioned adhesive is used to form an adhesive layer for adhering two connection target members. Further, the adhesive is used to control the gap of the adhesive layer with high accuracy, or to relax the stress of the adhesive layer.

The above-mentioned adhesive is not particularly limited. As a specific example of the said adhesive, the adhesive etc. which were used for the said conductive material are mentioned. The adhesive preferably contains an epoxy resin as the adhesive.

In the 100% by weight of the adhesive, the content of the adhesive is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, and more preferably It is 99.99% by weight or less, and more preferably 99.9% by weight or less. When the content of the adhesive is above the lower limit and below the upper limit, the adhesive force of the adhesive layer can be further effectively improved, and the resin particles can further effectively function as a spacer.

In 100% by weight of the adhesive, the content of the resin particles is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 80% by weight or less, more preferably 60% by weight or less, and further preferably It is 40% by weight or less, particularly preferably 20% by weight or less, and most preferably 10% by weight or less. When the content of the resin particles is equal to or more than the lower limit and equal to or less than the upper limit, the resin particles can further effectively function as a spacer.

(Connection Structure) A connection structure can be obtained by connecting the members to be connected using the above-mentioned conductive particles or a conductive material containing the above-mentioned conductive particles and a binder.

A connection structure of the present invention includes: a first connection target member having a first electrode on a surface; a second connection target member having a second electrode on a surface; and a connection portion that connects the first connection target member with the above The second connection target member is connected. The material of the connection portion includes the resin particles. The material of the connection portion is preferably the conductive particles or the conductive material. Preferably, the connection portion is a connection structure formed of the conductive particles or a conductive structure.

When the above-mentioned conductive particles are used alone, the connection portion itself is a conductive particle. That is, the first and second connection target members are connected by the above-mentioned conductive particles. The conductive material used to obtain the connection structure is preferably an anisotropic conductive material. The first electrode and the second electrode are preferably electrically connected by the connection portion.

FIG. 4 is a cross-sectional view showing an example of a connection structure using the conductive particles 1 shown in FIG. 1.

The connection structure 41 shown in FIG. 4 includes a first connection target member 42, a second connection target member 43, and a connection portion 44 that connects the first connection target member 42 and the second connection target member 43. The connection portion 44 is formed of a conductive material including the conductive particles 1 and a binder. In FIG. 4, for convenience of illustration, the conductive particles 1 are briefly shown. Instead of the conductive particles 1, other conductive particles such as the conductive particles 21 and 31 may be used.

The first connection target member 42 includes a plurality of first electrodes 42 a on a surface (upper surface). The second connection target member 43 has a plurality of second electrodes 43a on the surface (lower surface). The first electrode 42a and the second electrode 43a are electrically connected by one or a plurality of conductive particles 1. Therefore, the first and second connection target members 42 and 43 are electrically connected by the conductive particles 1.

Fig. 5 is a cross-sectional view showing an example of a connection structure using the resin particles of the present invention.

The connection structure 51 shown in FIG. 5 includes a first connection target member 52, a second connection target member 53, and an adhesive layer 54 that connects the first connection target member 52 and the second connection target member 53.

The adhesive layer 54 includes the resin particles 11 described above. The resin particles 11 are not in contact with both the first and second connection target members 52 and 53. The resin particles 11 are used as a stress relaxation spacer.

The adhesive layer 54 includes gap control particles 61 and a thermosetting component 62. In the adhesion layer 54, the gap control particles 61 are in contact with both the first and second connection target members 52 and 53. The gap control particle 61 may be a conductive particle or a particle having no conductivity. The gap control particle may be the resin particle. The thermosetting component 62 includes a thermosetting compound and a thermosetting agent. The thermosetting component 62 is a cured product of a thermosetting compound. The thermosetting component 62 is formed by curing a thermosetting compound.

The first connection target member may have a first electrode on the surface. The second connection target member may have a second electrode on the surface.

The manufacturing method of the said connection structure is not specifically limited. As an example of a method of manufacturing the connection structure, a method of heating and pressing the laminated body after obtaining the laminated body by disposing the conductive material between the first connecting target member and the second connecting target member is mentioned. The pressure during the above-mentioned pressurization is about 9.8 × 10 ⁴ Pa to 4.9 × 10 ⁶ Pa. The temperature during the above heating is about 120 ° C to 220 ° C. The pressure during the above-mentioned pressing for connecting the electrodes of the flexible printed circuit board, the electrodes arranged on the resin film, and the electrodes of the touch panel is about 9.8 × 10 ⁴ Pa to 1.0 × 10 ⁶ Pa.

Specific examples of the connection target member include electronic components such as semiconductor wafers, capacitors, and diodes, and electronic components such as printed circuit boards, flexible printed substrates, circuit substrates such as glass epoxy substrates, and glass substrates. The connection target member is preferably an electronic component. At least one of the first connection target member and the second connection target member is preferably a semiconductor wafer or a semiconductor wafer. The connection structure is preferably a semiconductor device.

The conductive material is preferably a conductive material used to connect electronic parts. The conductive paste is a paste-like conductive material, and is preferably applied to the connection target member in a paste state.

The conductive particles, the conductive material, and the adhesive can also be used favorably in a touch panel. Therefore, the above-mentioned connection target member is also preferably a flexible substrate or a connection target member in which electrodes are arranged on the surface of the resin film. The connection target member is preferably a flexible substrate, and is preferably a connection target member in which electrodes are arranged on the surface of the resin film. When the above-mentioned flexible substrate is a flexible printed substrate or the like, the flexible substrate generally has electrodes on the surface.

Examples of the electrode provided on the connection target member include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, silver electrodes, SUS electrodes, copper electrodes, molybdenum electrodes, and tungsten electrodes. When the connection target member is a flexible printed circuit board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. When the above-mentioned electrode is an aluminum electrode, it may be an electrode formed of only aluminum or an electrode having an aluminum layer on the surface area of the metal oxide layer. Examples of the material of the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.

(Liquid crystal display element) The said resin particle can be used suitably as a spacer for liquid crystal display elements.

The liquid crystal display element of the present invention includes a member for a first liquid crystal display element, a member for a second liquid crystal display element, and a spacer disposed between the member for the first liquid crystal display element and the member for the second liquid crystal display element. The spacer is the resin particle.

The liquid crystal display element may further include a sealing portion. The sealing portion is in a state where the first liquid crystal display element and the second liquid crystal display element face each other, and the first liquid crystal display element and the first liquid crystal display element are opposed to each other. 2 The outer periphery of the member for a liquid crystal display element is sealed.

The resin particles may be used as a peripheral sealant for a liquid crystal display element. The liquid crystal display element includes a member for a first liquid crystal display element, a member for a second liquid crystal display element, and sealing the first liquid crystal display in a state where the member for the first liquid crystal display element faces the member for the second liquid crystal display element. A sealing portion on the outer periphery of the element member and the second liquid crystal display element member. The liquid crystal display element includes a liquid crystal disposed between the first liquid crystal display element member and the second liquid crystal display element member inside the sealing portion. In this liquid crystal display element, a liquid crystal dropping method is applied, and the sealing portion is formed by thermally curing a sealing agent for a liquid crystal dropping method.

6 is a cross-sectional view showing an example of a liquid crystal display element using the resin particles of the present invention as a spacer for a liquid crystal display element.

The liquid crystal display element 81 shown in FIG. 6 includes a pair of transparent glass substrates 82. The transparent glass substrate 82 has an insulating film (not shown) on the facing surface. Examples of the material of the insulating film include SiO ₂ and the like. A transparent electrode 83 is formed on an insulating film in the transparent glass substrate 82. Examples of the material of the transparent electrode 83 include ITO. The transparent electrode 83 can be formed by patterning by a photolithography method, for example. An alignment film 84 is formed on the transparent electrode 83 on the surface of the transparent glass substrate 82. Examples of the material of the alignment film 84 include polyimide.

A liquid crystal 85 is sealed between a pair of transparent glass substrates 82. A plurality of resin particles 11 are arranged between the pair of transparent glass substrates 82. The resin particles 11 are used as a spacer for a liquid crystal display element. The interval between the pair of transparent glass substrates 82 is restricted by the plurality of resin particles 11. A sealant 86 is arranged between the edges of the pair of transparent glass substrates 82. The sealant 86 prevents the liquid crystal 85 from flowing out. The sealant 86 includes resin particles 11A that differ only in particle diameter from the resin particles 11.

In the above-mentioned liquid crystal display element, the arrangement density of the spacer for a liquid crystal display element per 1 mm ² is preferably 10 pieces / mm ² or more, and preferably 1,000 pieces / mm ² or less. When the arrangement density is 10 pieces / mm ² or more, the cell gap becomes more uniform. When the arrangement density is 1,000 pieces / mm ² or less, the contrast of the liquid crystal display element is further improved.

Hereinafter, the present invention will be specifically described with examples and comparative examples. The present invention is not limited to the following examples.

(Example 1) (1) Production of resin particles Polystyrene particles having an average particle diameter of 6.0 m were prepared as seed particles. 5.0 parts by weight of the polystyrene particles, 900 parts by weight of ion-exchanged water, and 170 parts by weight of a 5% by weight aqueous solution of polyvinyl alcohol were mixed to prepare a mixed solution. After the above-mentioned mixed liquid is dispersed by ultrasonic waves, it is put into a separable flask and stirred until uniform.

In addition, cyclohexyl methacrylate was prepared as the first polymerizable compound 1 having one polymerizable functional group and a cyclic organic group, and isopropyl acrylate was prepared as one having a polymerizable functional group and cyclic organic group. First polymerizable compound 2. Divinylbenzene was prepared as a second polymerizable compound having two or more polymerizable functional groups and a cyclic organic group.

Next, 9 parts by weight of poly 1,4-butanediol diacrylate, 1 part by weight of divinylbenzene, 15 parts by weight of cyclohexyl methacrylate, and 75 parts by weight of isoacrylate were mixed to obtain a mixture. To the obtained mixture, 6.0 parts by weight of benzamidine peroxide ("NYPER BW" manufactured by Nippon Oil Co., Ltd.) was added, and 1,000 parts by weight of ion-exchanged water was further added to prepare an emulsion.

The emulsion was further added to the above-mentioned mixed solution in a separable flask, and stirred for 16 hours to allow the seed particles to absorb the monomers, thereby obtaining a suspension containing the seed particles that swelled due to the absorbed monomers.

Thereafter, 510 parts by weight of a 5% by weight aqueous solution of polyvinyl alcohol was added, heating was started, and a reaction was performed at 85 ° C. for 10 hours to obtain resin particles.

(2) Production of conductive particles The obtained resin particles were washed, classified, and then dried. Thereafter, a nickel layer was formed on the surface of the obtained resin particles by an electroless plating method to produce conductive particles. The thickness of the nickel layer is 0.1 μm.

(3) Production of conductive material (anisotropic conductive paste) In order to produce a conductive material (anisotropic conductive paste), the following materials were prepared.

(Material of conductive material (anisotropic conductive paste)) Thermosetting compound A: Epoxy compound ("EP-3300P" manufactured by Nagase ChemteX Corporation) Thermosetting compound B: Epoxy compound ("EPICLON manufactured by DIC Corporation" HP-4032D ") Thermosetting compound C: Epoxy compound (" EPOGOSEY PT ", poly 1,4-butanediol diglycidyl ether manufactured by Yokkaichi Kasei Co., Ltd.) Thermosetting agent: Thermocation generator (Sanshin Chemical San-Aid "SI-60" manufactured by the company) Filler: Silicon dioxide (average particle size 0.25 μm)

A conductive material (anisotropic conductive paste) was produced as follows.

(Production method of conductive material (anisotropic conductive paste)) 10 parts by weight of thermosetting compound A, 10 parts by weight of thermosetting compound B, 15 parts by weight of thermosetting compound C, 5 parts by weight of thermosetting agent, and 20 parts by weight of filler to obtain a formulation. The obtained conductive particles were further added so that the content of 100% by weight of the formulation became 10% by weight, and then stirred at 2000 rpm for 5 minutes using a planetary mixer to obtain a conductive material (anisotropic conductive paste).

(4) Preparation of connection structure A glass substrate having an aluminum electrode pattern with an L / S of 20 μm / 20 μm on the upper surface was prepared as a first connection target member. Further, a semiconductor wafer having a gold electrode pattern (gold electrode thickness of 20 μm) having an L / S of 20 μm / 20 μm on the lower surface was prepared as a second connection target member.

A conductive material (anisotropic conductive paste) was just coated on the upper surface of the glass substrate to a thickness of 30 μm to form a conductive material (anisotropic conductive paste) layer. Next, the semiconductor wafer is laminated on the upper surface of the conductive material (anisotropic conductive paste) layer so that the electrodes face each other. Thereafter, the temperature of the head was adjusted such that the temperature of the conductive material (anisotropic conductive paste) layer became 170 ° C, and a pressure heating head was placed on the upper surface of the semiconductor wafer to make the conductive material (anisotropic conductive paste) ) Layer was hardened under conditions of 170 ° C., 1.0 MPa, and 15 seconds to obtain a connection structure.

(Example 2) In the production of resin particles, 9 parts by weight of poly 1,4-butanediol diacrylate was changed to 91 parts by weight of methyl methacrylate, and the compounding amount of cyclohexyl methacrylate was changed from 15 parts by weight. Part was changed to 5 parts by weight, and the compounding amount of the isoacrylate was changed from 75 parts by weight to 3 parts by weight. Except for the above-mentioned changes, conductive particles, a conductive material, and a connection structure were obtained in the same manner as in Example 1.

(Example 3) When preparing resin particles, 9 parts by weight of poly 1,4-butanediol diacrylate was changed to 9 parts by weight of 2-methacrylic acid oxyethyl phosphate, and the rest were changed to In the same manner as in Example 1, conductive particles, a conductive material, and a connection structure were obtained.

(Example 4) It was obtained in the same manner as in Example 2 except that 5 parts by weight of cyclohexyl methacrylate was changed to 5 parts by weight of phenoxyethylene glycol methacrylate when producing resin particles. Conductive particles, conductive materials, and connection structures.

(Example 5) In the production of resin particles, conductive particles were obtained in the same manner as in Example 2 except that 5 parts by weight of cyclohexyl methacrylate was changed to 5 parts by weight of dicyclopentenyl acrylate. , Conductive materials and connection structures.

(Example 6) Conductive particles were obtained in the same manner as in Example 1 except that 1 part by weight of divinylbenzene was changed to 1 part by weight of tricyclodecane dimethanol diacrylate when preparing resin particles. Conductive materials and connection structures.

(Comparative Example 1) When preparing resin particles, the amount of poly 1,4-butanediol diacrylate was changed from 9 parts by weight to 10 parts by weight, and divinylbenzene was not prepared. In the same manner as in Example 1, conductive particles, a conductive material, and a connection structure were obtained.

(Comparative Example 2) In the production of resin particles, 9 parts by weight of poly 1,4-butanediol diacrylate was changed to 94 parts by weight of methyl methacrylate, and the compounding amount of cyclohexyl methacrylate was changed from 15 parts by weight. Part was changed to 5 parts by weight, and the isopropyl acrylate was not blended. Except for the above-mentioned changes, conductive particles, a conductive material, and a connection structure were obtained in the same manner as in Example 1.

(Comparative Example 3) When preparing the resin particles, the amount of poly 1,4-butanediol diacrylate was changed from 9 parts by weight to 50 parts by weight, and the amount of isopropyl acrylate was changed from 75 parts by weight to Except for 34 parts by weight, conductive particles, a conductive material, and a connection structure were obtained in the same manner as in Example 1.

(Comparative Example 4) In the same manner as in Comparative Example 1 except that 15 parts by weight of cyclohexyl methacrylate was changed to 15 parts by weight of phenoxyethylene glycol methacrylate when producing resin particles. Conductive particles, conductive materials, and connection structures.

(Evaluation) (1) The content (WM) of the structure derived from the first polymerizable compound and the content (WD) of the structure derived from the second polymerizable compound are based on the first and second polymerizability used in obtaining the polymer. The compounded amount of the compound and the remaining amount of the first and second polymerizable compounds after polymerization. The first and second polymerizable compounds generated by polymerization are obtained, and the structure of the obtained polymer particles derived from the first polymerizable compound is calculated. Content (WM) and content (WD) derived from the structure of the second polymerizable compound. The weight ratio (WM / WD) of the content (WM) of the structure derived from the first polymerizable compound to the content (WD) of the structure derived from the second polymerizable compound was calculated.

(2) Particle diameter The particle diameter (particle diameter before heating) of the resin particles obtained was measured by using a particle size distribution measuring device ("Multisizer 4" manufactured by Beckman Coulter) to calculate the average particle diameter of about 100,000 resin particles. Value.

Next, the resin particles used for particle size measurement were heated at 150 ° C for 1,000 hours. The particle diameter of the resin particles after heating for 1000 hours was measured by the above method. Based on the obtained measurement results, the ratio of the particle diameter of the resin particles after heating to the particle diameter of the resin particles before heating (the particle diameter of the resin particles after heating / the particle diameter of the resin particles before heating) was calculated.

(3) 10% K value and 30% K value The 10% K value and 30% K value (30% K value before heating) of the obtained resin particles were measured by the method described above.

Next, the resin particles used for the 30% K value measurement were heated at 150 ° C for 1000 hours. The 30% K value of the resin particles after 1000 hours of heating was measured by the above method. Based on the obtained measurement results, the ratio of the 30% K value after heating to the 30% K value before heating (30% K value after heating / 30% K value before heating) was calculated.

(4) Compression response rate at 60% compression deformation The compression response rate at 60% compression deformation of the obtained resin particles was measured by the method described above.

(5) Plating state The obtained conductive particles were heated at 150 ° C for 1000 hours. A scanning electron microscope was used to observe the plating state of the 50 conductive particles after heating. The presence or absence of plating unevenness such as plating cracking or plating peeling was evaluated. The plating conditions were judged according to the following criteria.

[Judgment criteria for plating state] ○ ○: It is confirmed that the number of conductive particles with uneven plating is less than 3 ○: It is confirmed that the number of conductive particles with uneven plating is 3 or more and less than 6 ×: plating unevenness is confirmed 6 or more conductive particles

(6) Connection strength The installation strength measurement device was used to measure the connection strength of the obtained connection structure at 260 ° C. Use the following criteria to determine the strength of the connection.

[Judgment criteria for connection strength] ○: Shear strength is 150 N / cm ² or more ○: Shear strength is 100 N / cm ² or more and less than 150 N / cm ² ×: Shear strength is less than 100 N / cm ²

(7) Rebound Using a scanning electron microscope, observe whether or not a rebound occurs in the connection portion of the obtained connection structure. Judge the rebound based on the following criteria.

[Judgment Criteria for Rebound] ○: Rebound did not occur ×: Rebound occurred

(8) Cold and hot cycle characteristics (connection reliability) The process of heating the obtained connecting structure from -65 ° C to 150 ° C and cooling to -65 ° C was performed as one cycle, and a 1,000 cycle cold / hot cycle test was performed. The presence or absence of bulging or peeling at the connection portion was observed with an ultrasonic flaw detection device (SAT). The cold and hot cycle characteristics (connection reliability) are judged according to the following criteria.

[Criterion for cold and heat cycle characteristics (connection reliability)] ○: No bulging or peeling at the connection part ×: No bulging or peeling at the connection part

The results are shown in Tables 1, 2, and 3 below.

[Table 1]

[Table 2]

[table 3]

(9) Example of using STN (Super Twisted Nematic) type liquid crystal display element as a spacer for a liquid crystal display element: In a dispersion medium containing 70 parts by weight of isopropyl alcohol and 30 parts by weight of water, The spacers (resin particles) for the liquid crystal display elements of Examples 1 to 6 were added so that the solid component concentration in 100% by weight of the obtained spacer dispersion liquid was 2% by weight, and stirred to obtain a spacer for a liquid crystal display element.物 dispersion liquid.

A pair of transparent glass plates (length 50 mm, lateral 50 mm, thickness 0.4 mm) of one surface by CVD (Chemical Vapor Deposition, Chemical Vapor Deposition) method deposited SiO ₂ film, the entire surface of the SiO ₂ film by An ITO film is formed by sputtering. A polyimide alignment film composition (manufactured by Nissan Chemical Co., SE3510) was applied to the obtained glass substrate with an ITO film by a spin coating method, and the polyimide was formed by firing at 280 ° C for 90 minutes. Amine alignment membrane. After rubbing the alignment film, the spacers for liquid crystal display elements are wet-dispersed so that the number is 100 per 1 mm ^{2 on} the alignment film side of a substrate. After a sealant is formed on the periphery of another substrate, the substrate and the substrate on which the spacers are dispersed are arranged so that the rubbing direction becomes 90 °, and the two are bonded together. Thereafter, a 90-minute treatment was performed at 160 ° C. to harden the sealant to obtain an empty cell (screen without liquid crystal). An STN type liquid crystal (manufactured by DIC Corporation) to which a chiral agent was added was injected into the obtained empty cell, and the injection port was sealed with a sealant, followed by heat treatment at 120 ° C. for 30 minutes to obtain an STN type liquid crystal display element.

Regarding the obtained liquid crystal display element, the interval between the substrates was well restricted by the spacer (resin particles) for the liquid crystal display element of Examples 1 to 6. In addition, the liquid crystal display element exhibited good display quality. Furthermore, when the resin particles of Examples 1 to 6 were used as the spacer for the liquid crystal display element as the peripheral sealant of the liquid crystal display element, the display quality of the obtained liquid crystal display element was also good.

1‧‧‧ conductive particles

2‧‧‧ conductive section

11‧‧‧resin particles

11A‧‧‧Resin particles

21‧‧‧ conductive particles

22‧‧‧ conductive section

22A‧‧‧The first conductive part

22B‧‧‧The second conductive part

31‧‧‧ conductive particles

31a‧‧‧ protrusion

32‧‧‧ conductive section

32a‧‧‧ protrusion

33‧‧‧ core substance

34‧‧‧ insulating material

41‧‧‧ Connected Structure

42‧‧‧The first connection target component

42a‧‧‧First electrode

43‧‧‧The second connection target component

43a‧‧‧Second electrode

44‧‧‧ Connection Department

51‧‧‧ connected structure

52‧‧‧The first connection target component

53‧‧‧The second connection target component

54‧‧‧ Adjacent layer

61‧‧‧Gap control particle

62‧‧‧thermosetting ingredients

81‧‧‧LCD display element

82‧‧‧ transparent glass substrate

83‧‧‧Transparent electrode

84‧‧‧Alignment film

85‧‧‧ LCD

86‧‧‧ Sealant

Fig. 1 is a sectional view showing a conductive particle according to a first embodiment of the present invention. Fig. 2 is a sectional view showing a conductive particle according to a second embodiment of the present invention. Fig. 3 is a sectional view showing a conductive particle according to a third embodiment of the present invention. 4 is a cross-sectional view showing an example of a connection structure using conductive particles according to the first embodiment of the present invention. Fig. 5 is a cross-sectional view showing an example of a connection structure using the resin particles of the present invention. 6 is a cross-sectional view showing an example of a liquid crystal display element using the resin particles of the present invention as a spacer for a liquid crystal display element.

Claims (15)

A resin particle which is a polymer of a first polymerizable compound having one polymerizable functional group and a cyclic organic group, and a second polymerizable compound having two or more polymerizable functional groups and a cyclic organic group The weight ratio of the content of the structure derived from the first polymerizable compound to the content of the structure derived from the second polymerizable compound is 7 or more. When the resin particles are heated at 150 ° C. for 1,000 hours, The ratio of the particle diameter of the resin particles to the particle diameter of the resin particles before heating is 0.9 or less. For example, the resin particle of claim 1 has a compression response rate of 10% or less when subjected to 60% compression deformation. For example, the resin particles of claim 1 or 2 have a 10% K value of 3000 N / mm ² or less. For example, the resin particles of claim 1 or 2 have a 30% K value of 1500 N / mm ² or less. For example, if the resin particles of claim 1 or 2 are heated at 150 ° C for 1000 hours, the ratio of the 30% K value of the heated resin particles to the 30% K value of the resin particles before heating is 0.8 Above and below 1.5. For example, the resin particles of claim 1 or 2, wherein the cyclic organic group in the first polymerizable compound and the cyclic organic group in the second polymerizable compound are each a hydrocarbon group. For example, the resin particle of claim 1 or 2, wherein the cyclic organic group in the first polymerizable compound is a phenylene group, a cyclohexyl group, or an isopropyl group. The resin particles according to claim 1 or 2, wherein the cyclic organic group in the second polymerizable compound is a phenylene group, a cyclohexyl group or an isoyl group. The resin particle as claimed in claim 1 or 2, comprising an acid phosphate compound. The resin particles as claimed in claim 1 or 2 are used as a spacer or used to form a conductive portion on a surface to obtain conductive particles having the above-mentioned conductive portion. A conductive particle comprising: the resin particle according to any one of claims 1 to 10; and a conductive portion arranged on a surface of the resin particle. A conductive material includes conductive particles and a binder, and the conductive particles include the resin particles according to any one of claims 1 to 10, and a conductive portion disposed on a surface of the resin particles. An adhesive comprising the resin particles according to any one of claims 1 to 10, and a binder. A connection structure comprising: a first connection target member having a first electrode on a surface; a second connection target member having a second electrode on a surface; and a connection portion that connects the first connection target member with the above The second connection target member is connected; the material of the connection portion includes the resin particles according to any one of claims 1 to 10; and the first electrode and the second electrode are electrically connected through the connection portion. A liquid crystal display element comprising: a member for a first liquid crystal display element, a member for a second liquid crystal display element, and a spacer disposed between the member for the first liquid crystal display element and the member for the second liquid crystal display element, The spacer is a resin particle according to any one of claims 1 to 10.