TW201904351A - Ceramic Heater and Method for Manufacturing Thereof - Google Patents
Ceramic Heater and Method for Manufacturing Thereof Download PDFInfo
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- TW201904351A TW201904351A TW107115714A TW107115714A TW201904351A TW 201904351 A TW201904351 A TW 201904351A TW 107115714 A TW107115714 A TW 107115714A TW 107115714 A TW107115714 A TW 107115714A TW 201904351 A TW201904351 A TW 201904351A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- H10P72/00—
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- H10P72/0432—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/345—Heating elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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Abstract
Description
本發明涉及陶瓷加熱器及其製造方法,特別是涉及一種改善發熱體的局部性電阻變化率的陶瓷加熱器及其製造方法。The present invention relates to a ceramic heater and a method of manufacturing the same, and, in particular, to a ceramic heater which improves the local resistance change rate of a heat generating body and a method of manufacturing the same.
陶瓷加熱器用於在預定的加熱溫度下,對半導體晶片、玻璃基板、可撓性基板等多樣目的的熱處理目標對象進行熱處理。為了半導體晶片處理,陶瓷加熱器也可以與靜電吸盤的功能結合使用。一般而言,陶瓷加熱器包括從外部的電極接受電力供應並發熱的陶瓷板。陶瓷板包括埋設於陶瓷燒結體的具有既定電阻的發熱體。The ceramic heater is used for heat-treating a plurality of heat treatment target objects such as a semiconductor wafer, a glass substrate, and a flexible substrate at a predetermined heating temperature. For semiconductor wafer processing, ceramic heaters can also be used in conjunction with the function of electrostatic chucks. In general, a ceramic heater includes a ceramic plate that receives power supply from an external electrode and generates heat. The ceramic plate includes a heat generating body having a predetermined resistance embedded in the ceramic sintered body.
作為相關現有文獻,可參照韓國授權專利號第10-0533471號(2005年12月06日)等。授權專利第10-0533471號公開一種陶瓷加熱器製造方式,在陶瓷板的上下部,以與選自元素周期表4a、5a及6a族元素的1種以上金屬堆疊構件接觸的狀態,燒結成型體,從而抑制內置的發熱體的碳化。但是,這種以往的金屬堆疊方式的陶瓷加熱器製造方法存在多種問題。As related related documents, reference may be made to Korean Patent No. 10-0533471 (December 06, 2005) and the like. Japanese Laid-Open Patent Publication No. 10-0533471 discloses a ceramic heater manufacturing method in which a sintered molded body is in contact with one or more metal stacking members selected from elements of Groups 4a, 5a and 6a of the periodic table of elements in the upper and lower portions of the ceramic plate. Therefore, the carbonization of the built-in heating element is suppressed. However, such a conventional metal stacking method of ceramic heater manufacturing has various problems.
首先,以金屬堆疊方式製造的陶瓷加熱器,根據發熱體部位而具有局部性電阻不均一。其次,在以往的金屬堆疊方式中,金屬堆疊構件在製造後需要去除,是難以再使用的1次性消耗部件。進一步地,在以往的金屬堆疊方式中,因金屬堆疊構件的碳化而形成的碳化物,在與之相接的陶瓷加熱器燒結體表面誘發毀損(damage),隨著毀損部位的去除,存在陶瓷加熱器的厚度需要厚於所需以上的問題。First, the ceramic heater manufactured by the metal stacking method has local resistance unevenness depending on the heat generating body portion. Secondly, in the conventional metal stacking method, the metal stacked member needs to be removed after manufacture, and is a disposable consumable member that is difficult to reuse. Further, in the conventional metal stacking method, the carbide formed by the carbonization of the metal stacked member induces a damage on the surface of the ceramic heater sintered body which is in contact therewith, and the ceramic is present as the damaged portion is removed. The thickness of the heater needs to be thicker than necessary.
解決的技術問題Technical problem solved
本發明的發明人發現,在使用以往的金屬堆疊構件的方式中,金屬堆疊構件在燒結中與碳化物反應而表現出脆性,因而會誘發裂紋。另外,本發明的發明人發現,作為發熱體電阻變化的因素而進行作用的碳源,與粉末內的碳含量相比,更起因於外源,即,碳模具或熔爐(furnace)內的碳構件。因此,在導入的金屬堆疊構件中形成的裂紋,起到了從熔爐內的其他碳源,例如從碳模具或碳構件發生的碳的流入通道作用,結果,不適合抑制來源於成型體外部的碳的流入,無法充分抑制發熱體的碳化。The inventors of the present invention have found that in the method of using the conventional metal stacked member, the metal stacked member exhibits brittleness by reacting with the carbide during sintering, and thus induces cracking. Further, the inventors of the present invention have found that a carbon source that functions as a factor of resistance change of a heating element is caused by an external source, that is, a carbon in a carbon mold or a furnace, compared with a carbon content in a powder. member. Therefore, the crack formed in the introduced metal stack member acts as an inflow passage of carbon from other carbon sources in the furnace, for example, from a carbon mold or a carbon member, and as a result, is not suitable for suppressing carbon derived from the outside of the molded body. Inflow, the carbonization of the heating element cannot be sufficiently suppressed.
本發明正是為了解決該問題而研發的,本發明的目的在於提供一種利用改善發熱體局部性電阻變化率的陶瓷切斷層來進行燒結處理的陶瓷加熱器的製造方法及根據該方法製造的陶瓷加熱器。The present invention has been made to solve the problem, and an object of the present invention is to provide a method for manufacturing a ceramic heater which is subjected to a sintering treatment by using a ceramic cutting layer which improves a local resistance change rate of a heating element, and a ceramic manufactured according to the method. Heater.
另外,本發明目的是提供一種利用了可再使用的碳化抑制用陶瓷切斷層的陶瓷加熱器的製造方法及根據該方法製造的陶瓷加熱器。Further, an object of the present invention is to provide a method for producing a ceramic heater using a reusable ceramic cutting layer for carbonization suppression and a ceramic heater produced by the method.
而且,本發明目的是提供一種能夠適宜地保持燒結體厚度的陶瓷加熱器的製造方法及根據該方法製造的陶瓷加熱器。Further, an object of the present invention is to provide a method for producing a ceramic heater capable of appropriately maintaining the thickness of a sintered body and a ceramic heater manufactured according to the method.
技術方案Technical solutions
首先,如果概括本發明的特徵,旨在達成該目的的本發明一態樣的陶瓷加熱器的製造方法包括:對在第一陶瓷切斷層及第二陶瓷切斷層之間插置有埋設了發熱體的陶瓷粉末層的夾層結構的層疊結構進行成型的步驟;以及燒結該層疊結構的成型體的步驟。First, if the features of the present invention are summarized, a method of manufacturing a ceramic heater according to an aspect of the present invention for achieving the object includes: embedding a heat between the first ceramic cutting layer and the second ceramic cutting layer a step of molding the laminated structure of the sandwich structure of the bulk ceramic powder layer; and a step of sintering the molded body of the laminated structure.
較佳地,該層疊結構的成型步驟包括:提供第一陶瓷切斷層的步驟;在第一陶瓷切斷層上提供埋設了發熱體的陶瓷粉末層的步驟;以及在陶瓷粉末層上提供第二陶瓷切斷層的步驟。Preferably, the step of molding the laminated structure comprises: a step of providing a first ceramic cutting layer; a step of providing a ceramic powder layer in which the heating element is embedded on the first ceramic cutting layer; and providing a second ceramic on the ceramic powder layer The step of cutting the layer.
較佳地,陶瓷粉末層提供步驟包括:提供第一陶瓷粉末層的步驟;在第一陶瓷粉末層上配置發熱體的步驟;及在配置了發熱體的第一陶瓷粉末層上提供第二陶瓷粉末層的步驟。Preferably, the ceramic powder layer providing step includes the steps of: providing a first ceramic powder layer; disposing a heating element on the first ceramic powder layer; and providing a second ceramic on the first ceramic powder layer on which the heating element is disposed The step of the powder layer.
較佳地,在提供第一陶瓷粉末層的步驟中,第一陶瓷粉末層可以為成型體。Preferably, in the step of providing the first ceramic powder layer, the first ceramic powder layer may be a molded body.
較佳地,在提供第二陶瓷粉末層步驟之後,進一步包括對第一陶瓷粉末層、發熱體及第二陶瓷粉末層進行加壓成型的步驟。Preferably, after the step of providing the second ceramic powder layer, the step of press molding the first ceramic powder layer, the heat generating body and the second ceramic powder layer is further included.
較佳地,在第一及第二陶瓷切斷層各自與該陶瓷粉末層之間,插置有包含BN(Boron Nitride)的非活性層。Preferably, an inactive layer containing BN (Boron Nitride) is interposed between each of the first and second ceramic cutting layers and the ceramic powder layer.
較佳地,第一及第二陶瓷切斷層包括稀土族氧化物。Preferably, the first and second ceramic cutting layers comprise a rare earth oxide.
較佳地,第一及第二陶瓷切斷層包含氮化物及稀土族氧化物,該稀土族氧化物為陶瓷切斷層的10重量%以下。Preferably, the first and second ceramic cutting layers comprise a nitride and a rare earth oxide, and the rare earth oxide is 10% by weight or less of the ceramic cutting layer.
較佳地,第一及第二陶瓷切斷層為燒結體。Preferably, the first and second ceramic cutting layers are sintered bodies.
較佳地,第一及第二陶瓷切斷層在燒結過程中,在發熱體中,藉助於與從外部流入的碳的反應而降低碳化物的局部性生成。Preferably, the first and second ceramic cutting layers reduce the localized formation of carbides in the heating element by the reaction with carbon flowing in from the outside during the sintering process.
而且,本發明另一態樣的陶瓷加熱器的特徵在於,包括陶瓷燒結體以及埋設於該陶瓷燒結體的發熱體,陶瓷燒結體在第一陶瓷切斷層及第二陶瓷切斷層之間形成具有埋設了發熱體的陶瓷粉末層插置於其中的夾層結構的層疊結構的成型體後,燒結該陶瓷粉末層而形成。Furthermore, a ceramic heater according to another aspect of the present invention includes a ceramic sintered body and a heat generating body embedded in the ceramic sintered body, and the ceramic sintered body is formed between the first ceramic cut layer and the second ceramic cut layer. After forming a molded body of a laminated structure of a sandwich structure in which a ceramic powder layer of a heating element is embedded, the ceramic powder layer is sintered and formed.
發明效果Effect of the invention
根據本發明的陶瓷加熱器的製造方法,沿埋設發熱體的陶瓷粉末成型體上下形成陶瓷切斷層,從而可以在燒結過程中改善發熱體的局部性電阻變化率。即,由於陶瓷切斷層的使用,切斷局部性發熱體的電阻上升,因而晶片等目標對象加熱面的各位置的溫度偏差顯著減小,具有能夠提高加熱面的溫度均一性的優點。According to the method for producing a ceramic heater of the present invention, the ceramic green layer is formed up and down along the ceramic powder molded body in which the heat generating body is embedded, whereby the local resistance change rate of the heat generating body can be improved during the sintering process. In other words, since the electric resistance of the local heating element is increased by the use of the ceramic cutting layer, the temperature deviation at each position of the heating target surface such as the wafer is remarkably reduced, and the temperature uniformity of the heating surface can be improved.
另外,以往技術為了抑制在製品表面發生毀損,存在需將陶瓷粉末燒結體製作得厚於所需以上的問題,但在本發明中,由於陶瓷切斷層的使用而不發生裂紋,可以使燒結體厚度的加工富餘更小,具有能夠降低陶瓷使用量的優點。Further, in the prior art, in order to suppress the occurrence of damage on the surface of the product, there is a problem that the sintered ceramic powder body needs to be made thicker than necessary. However, in the present invention, the sintered body can be formed by the use of the ceramic cutting layer without cracking. The thickness of the processing is smaller, and has the advantage of reducing the amount of ceramic used.
下面參照圖式,對本發明進行詳細說明。此時,在各個圖中,相同的構成要素儘可能用相同的標記代表。另外,省略對已經公知的功能及/或構成的詳細說明。以下公開的內容,以理解多樣實施例的運轉所需的部分為重點進行說明,省略對可能混淆該說明要旨的要素的說明。另外,圖式的一部分構成要素可以誇張、省略或概略地圖示。各構成要素的大小並非全面反映實際大小,因此,在此記載的內容並非由各個圖中繪製的構成要素的相對大小或間隔所限制。另外,在本發明中,所謂「層疊」,用作規定各層的相對位置關係的意義。「A層上的B層」字樣的表述,表現了A層與B層的相對位置關係,不要求A層與B層必須接觸,也可以在其之間插置有第三層。類似地,「在A層與B層之間插置有C層」的表述,也不排除在A層與C層之間或B層與C層之間插置有第三層的情形。The invention will now be described in detail with reference to the drawings. In this regard, in the respective drawings, the same constituent elements are represented by the same reference numerals as much as possible. In addition, a detailed description of well-known functions and/or configurations will be omitted. The contents of the following disclosure will be explained with a focus on understanding the operation of the various embodiments, and the description of the elements that may obscure the description will be omitted. In addition, some of the components of the drawings may be exaggerated, omitted, or schematically illustrated. The size of each component does not fully reflect the actual size. Therefore, the content described herein is not limited by the relative size or interval of the components drawn in the respective drawings. Further, in the present invention, "stacking" is used as a meaning for defining the relative positional relationship of each layer. The expression "B layer on layer A" expresses the relative positional relationship between layer A and layer B. It is not required that layer A and layer B must be in contact, or a third layer may be interposed between them. Similarly, the expression "the C layer is interposed between the A layer and the B layer" does not exclude the case where the third layer is interposed between the A layer and the C layer or between the B layer and the C layer.
第1圖是用於說明本發明一個實施例的陶瓷加熱器100的圖。Fig. 1 is a view for explaining a ceramic heater 100 according to an embodiment of the present invention.
如果參照第1圖,本發明一個實施例的陶瓷加熱器100包括燒結陶瓷粉末層130而形成的陶瓷燒結體(以下標示為130’)及埋設於該陶瓷燒結體130’的發熱體140。陶瓷燒結體130’及陶瓷燒結體130’中埋設的發熱體140相當於陶瓷板。Referring to Fig. 1, a ceramic heater 100 according to an embodiment of the present invention includes a ceramic sintered body (hereinafter referred to as 130') formed by sintering a ceramic powder layer 130, and a heat generating body 140 embedded in the ceramic sintered body 130'. The heat generating body 140 embedded in the ceramic sintered body 130' and the ceramic sintered body 130' corresponds to a ceramic plate.
在本發明中,陶瓷燒結體130’如第1圖所示,是在插入了發熱體140的陶瓷粉末層130的上下面,形成各個陶瓷切斷層110、150後,將陶瓷粉末層130在碳熔爐或碳模具200中藉由燒結過程進行處理而形成。In the present invention, as shown in Fig. 1, the ceramic sintered body layer 130 is formed on the upper and lower surfaces of the ceramic powder layer 130 in which the heating element 140 is inserted, and after the respective ceramic cutting layers 110 and 150 are formed, the ceramic powder layer 130 is placed on the carbon. The furnace or carbon mold 200 is formed by treatment by a sintering process.
在燒結過程前,作為在陶瓷粉末層130上下面形成的各個陶瓷切斷層,即,作為沿第一陶瓷切斷層110與第二陶瓷切斷層150中某一者以上的內側包含BN(Boron Nitride)的非活性層,可以插置有BN層115/155。BN層115/155用作抑制陶瓷切斷層110、150與陶瓷燒結體130’反應的脫模劑。BN層115/155也可以利用包含BN的物質,以塗覆或噴霧形態形成,或進行燒結過程,以燒結體形態使用。Before the sintering process, each ceramic cutting layer formed on the lower surface of the ceramic powder layer 130, that is, BN (Boron Nitride) is included as the inner side of one or more of the first ceramic cutting layer 110 and the second ceramic cutting layer 150. The inactive layer can be interposed with a BN layer 115/155. The BN layer 115/155 serves as a release agent for suppressing the reaction of the ceramic cutting layers 110, 150 with the ceramic sintered body 130'. The BN layer 115/155 may also be formed in a coating or spray form using a substance containing BN, or subjected to a sintering process, and used in the form of a sintered body.
下面參照第2圖的流程圖,更詳細地說明本發明一個實施例的陶瓷加熱器100的製造過程。Next, the manufacturing process of the ceramic heater 100 of one embodiment of the present invention will be described in more detail with reference to the flowchart of Fig. 2.
第2圖是用於說明本發明一個實施例的陶瓷加熱器100的製造過程的流程圖。Fig. 2 is a flow chart for explaining a manufacturing process of the ceramic heater 100 of one embodiment of the present invention.
如果參照第2圖,首先,在插入了發熱體140的陶瓷粉末層130的上下面,形成第一及第二陶瓷切斷層110、150的層疊結構(步驟S110)。在本發明中,該層疊結構及構成其的組件可以以各種方法製造。Referring to Fig. 2, first, a laminated structure of the first and second ceramic cutting layers 110 and 150 is formed on the upper and lower surfaces of the ceramic powder layer 130 in which the heating element 140 is inserted (step S110). In the present invention, the laminated structure and the components constituting the same can be manufactured in various methods.
例如,第一及/或第二陶瓷切斷層110、150可以在模具內塗覆或藉助於噴霧法而進行噴霧,另外,可以以成型體或燒結體形態提供。較佳地,該第一及/或第二陶瓷切斷層110、150以緻密的燒結體形態提供。脆性大、無燒成變形的緻密燒結體的第一及/或第二陶瓷切斷層110、150可以有效切斷來自外部的碳源的流入。For example, the first and/or second ceramic cutting layers 110, 150 may be coated in a mold or sprayed by means of a spray method, and may be provided in the form of a molded body or a sintered body. Preferably, the first and/or second ceramic cutting layers 110, 150 are provided in the form of a dense sintered body. The first and/or second ceramic cutting layers 110 and 150 of the dense sintered body having high brittleness and no firing deformation can effectively cut off the inflow of the carbon source from the outside.
提供第一陶瓷切斷層110,接著在第一陶瓷切斷層110上形成埋設了發熱體140的陶瓷粉末層130。此時,陶瓷粉末層130可以以各種方式層疊。例如,作為陶瓷粉末層130的一部分而形成第一陶瓷粉末層,在該第一陶瓷粉末層上配置發熱體140後,在配置了發熱體140的第一陶瓷粉末層上覆蓋第二陶瓷粉末層,從而可以形成該陶瓷粉末層130。此時,第一陶瓷粉末層可以用以預定壓力進行加壓而能夠保持形狀的成型體形態提供。當然,整個陶瓷粉末層130也可以以加壓成型的成型體形態提供。在陶瓷粉末層130上,層疊第二陶瓷切斷層150。The first ceramic cut layer 110 is provided, and then the ceramic powder layer 130 in which the heat generating body 140 is buried is formed on the first ceramic cut layer 110. At this time, the ceramic powder layer 130 may be laminated in various ways. For example, a first ceramic powder layer is formed as a part of the ceramic powder layer 130, and after the heat generating body 140 is disposed on the first ceramic powder layer, the second ceramic powder layer is covered on the first ceramic powder layer on which the heat generating body 140 is disposed. Thus, the ceramic powder layer 130 can be formed. At this time, the first ceramic powder layer can be provided in a form of a molded body which can be pressurized by a predetermined pressure to maintain the shape. Of course, the entire ceramic powder layer 130 can also be provided in the form of a press-formed molded body. On the ceramic powder layer 130, the second ceramic cut layer 150 is laminated.
在陶瓷粉末層130的上下面形成的各個陶瓷切斷層,即,在第一陶瓷切斷層110和第二陶瓷切斷層150中某一者與陶瓷粉末層130之間,作為用於脫模劑作用的非活性層,可以塗覆或以噴霧形態形成包含BN(Boron Nitride)的物質,或形成燒結體形態的BN層115/155。Each of the ceramic cut layers formed on the upper and lower surfaces of the ceramic powder layer 130, that is, between the first ceramic cut layer 110 and the second ceramic cut layer 150 and the ceramic powder layer 130, serves as a release agent. The inactive layer may be coated or sprayed to form a material comprising BN (Boron Nitride) or a BN layer 115/155 in the form of a sintered body.
在作為加熱器使用期間,發熱體140中發生熱,因而發熱體140埋設於耐熱性優秀、熱傳遞特性優秀的陶瓷粉末層130。發熱體140可以由導電性材料構成,例如,可以由鎢(W)、鉬(Mo)、銀(Ag)、鎳(Ni)、金(Au)、鈮(Nb)、鈦(Ti)等多樣導電性材料的組合構成,形成為具有適當電阻值的電阻發熱體。When heat is generated in the heating element 140 during use as a heater, the heating element 140 is embedded in the ceramic powder layer 130 having excellent heat resistance and excellent heat transfer characteristics. The heating element 140 may be made of a conductive material, and may be, for example, tungsten (W), molybdenum (Mo), silver (Ag), nickel (Ni), gold (Au), niobium (Nb), or titanium (Ti). The conductive material is combined to form a resistance heating element having an appropriate resistance value.
陶瓷粉末層130例如可以由Al2 O3 、Y2 O3 、Al2 O3 /Y2 O3 、ZrO2 、AlC(Autoclaved lightweight concrete,高壓輕質混凝土)、TiN、AlN、TiC、MgO、CaO、CeO2 、TiO2 、BxCy、BN、SiO2 、SiC、YAG、Mullite(多鋁紅柱石)、AlF3 等或組合他們的多樣陶瓷材料粉末構成。The ceramic powder layer 130 may be, for example, Al 2 O 3 , Y 2 O 3 , Al 2 O 3 /Y 2 O 3 , ZrO 2 , AlC (Autoclaved lightweight concrete), TiN, AlN, TiC, MgO, CaO, CeO 2 , TiO 2 , BxCy, BN, SiO 2 , SiC, YAG, Mullite (mullite), AlF 3 , etc. or a combination of their various ceramic material powders.
如上述,在陶瓷粉末層130中插入的發熱體140在燒結過程中與周圍的碳反應,在發熱體140中形成碳化物,從而會成為提高電阻、引起加熱面溫度不均一的原因。As described above, the heat generating body 140 inserted into the ceramic powder layer 130 reacts with the surrounding carbon during the sintering process to form carbides in the heat generating body 140, which causes an increase in electrical resistance and causes a temperature unevenness of the heating surface.
但是,在本發明中,在燒結前,在陶瓷粉末層130上下形成各個陶瓷切斷層110/150。陶瓷粉末層130存在的碳微少,在發熱體140中生成碳化物的主要原因大部分是從外部流入的碳導致的。However, in the present invention, each ceramic cut layer 110/150 is formed above and below the ceramic powder layer 130 before sintering. The ceramic powder layer 130 has a small amount of carbon, and most of the cause of formation of carbides in the heating element 140 is caused by carbon flowing in from the outside.
在本發明中,覆蓋陶瓷粉末層130下面的第一陶瓷切斷層110與覆蓋陶瓷粉末層130上面的第二陶瓷切斷層150,使得可以在燒結過程中,在發熱體140中抑制因與從外部流入的碳的反應而生成碳化物。In the present invention, the first ceramic cut layer 110 underlying the ceramic powder layer 130 and the second ceramic cut layer 150 overlying the ceramic powder layer 130 are covered so that the heat generation body 140 can be suppressed in the sintering process and from the outside. The influent carbon reacts to form carbides.
第一陶瓷切斷層110和第二陶瓷切斷層150可以包括與陶瓷粉末層130相同的材料。但是,前述的陶瓷材料與碳的反應性低,因而較佳地,添加預定含量的稀土族(rare earth)氧化物,以便能夠與碳反應。例如,較佳地,第一陶瓷切斷層110和第二陶瓷切斷層150像陶瓷粉末層130那樣,包含氮化物,包含稀土族氧化物1~10重量%(wt%)。作為稀土族氧化物,例如可以利用LaAlO3 、La2 O3 、Y2 O3 、LaAl3 O6 等各種稀土族氧化物。The first ceramic cut layer 110 and the second ceramic cut layer 150 may include the same material as the ceramic powder layer 130. However, the aforementioned ceramic material has low reactivity with carbon, and therefore it is preferred to add a predetermined amount of rare earth oxide so as to be able to react with carbon. For example, preferably, the first ceramic cutting layer 110 and the second ceramic cutting layer 150 contain a nitride, like the ceramic powder layer 130, and contain 1 to 10% by weight (wt%) of the rare earth oxide. As the rare earth group oxide, for example, various rare earth oxides such as LaAlO 3 , La 2 O 3 , Y 2 O 3 , and LaAl 3 O 6 can be used.
如此地,形成具有在第一及第二陶瓷切斷層110、150之間插置有埋設了發熱體140的陶瓷粉末層130的夾層結構的層疊結構的成型體後,如第1圖所示,在碳熔爐或碳模具200中進行燒結過程處理,使得陶瓷粉末層130成為陶瓷燒結體(步驟S120)。In this manner, after forming a molded body having a laminated structure in which a ceramic layer 130 in which the heating element 140 is embedded is interposed between the first and second ceramic cutting layers 110 and 150, as shown in FIG. The sintering process is performed in the carbon furnace or the carbon mold 200 so that the ceramic powder layer 130 becomes a ceramic sintered body (step S120).
燒結過程可以藉由將碳熔爐或碳模具200加熱到陶瓷不分解的預定溫度(例如1500∼2500℃)並保持預定時間(例如10小時以下)而實現。另外,較佳地,這種燒結過程在非氧化性氣氛下,例如在真空或N2 氣氛下燒結。另外,該燒結過程可以藉助於通常的熱壓燒結(Hot press)而實現。The sintering process can be achieved by heating the carbon or carbon mold 200 to a predetermined temperature at which the ceramic does not decompose (for example, 1500 ∼ 2500 ° C) for a predetermined time (for example, 10 hours or less). Further, preferably, the sintering process is sintered under a non-oxidizing atmosphere, for example, under a vacuum or a N 2 atmosphere. In addition, the sintering process can be achieved by means of a usual hot press.
經過這種燒結過程後,去除陶瓷切斷層110、150(包括BN層115、155),獲得包括陶瓷粉末層130燒結的陶瓷燒結體130’和埋設於陶瓷燒結體130’的發熱體140的用於陶瓷加熱器100的陶瓷板(步驟S130)。此時,由於如上述的非活性層的插置,而該陶瓷切斷層110、150可以容易地從該陶瓷粉末層130分離。After the sintering process, the ceramic cutting layers 110 and 150 (including the BN layers 115 and 155) are removed, and the ceramic sintered body 130' including the ceramic powder layer 130 and the heating body 140 embedded in the ceramic sintered body 130' are obtained. The ceramic plate of the ceramic heater 100 (step S130). At this time, the ceramic cutting layers 110, 150 can be easily separated from the ceramic powder layer 130 due to the insertion of the inactive layer as described above.
去除的陶瓷切斷層110、150以後可以重新用作新陶瓷加熱器的陶瓷切斷層。例如,陶瓷切斷層110/150在1次以上燒結過程中使用後可以再使用,在使用次數共10次以內可以再使用。The removed ceramic cutting layers 110, 150 can later be reused as ceramic cutting layers for new ceramic heaters. For example, the ceramic cut layer 110/150 can be reused after being used in one or more sintering processes, and can be reused within 10 times of use.
陶瓷燒結體中埋設的發熱體140利用藉由電極(圖上未示出)而從外部供應的電力(例如RF(射頻(Radio Frequency))電力),根據電阻性質而發生熱。陶瓷板的一側面作為用於加熱目標對象的加熱面,可以是用於放置目標對象或在目標對象上方加熱的面。可以藉由陶瓷板的另一側面,結合用於向發熱體140供應電力的電極(圖上未示出)。The heat generating body 140 embedded in the ceramic sintered body generates electric power (for example, RF (Radio Frequency) power) supplied from the outside by an electrode (not shown), and generates heat according to the resistance property. One side of the ceramic plate serves as a heating surface for heating the target object, and may be a surface for placing or heating the target object. An electrode (not shown) for supplying electric power to the heat generating body 140 may be combined by the other side of the ceramic plate.
包括這種陶瓷板的陶瓷加熱器100可以為了將半導體晶片、玻璃基板、可撓性基板等多樣目的的熱處理目標對象在預定加熱溫度下進行熱處理而使用。為了半導體晶片處理,陶瓷加熱器也可以與靜電吸盤的功能結合使用。The ceramic heater 100 including such a ceramic plate can be used for heat treatment of a plurality of heat treatment targets such as a semiconductor wafer, a glass substrate, and a flexible substrate at a predetermined heating temperature. For semiconductor wafer processing, ceramic heaters can also be used in conjunction with the function of electrostatic chucks.
第3圖是用於比較說明以往陶瓷加熱器與本發明一個實施例的陶瓷加熱器100的各條件下電阻變化率的圖。Fig. 3 is a view for comparison of the rate of change in resistance of each of the conventional ceramic heaters and the ceramic heater 100 of one embodiment of the present invention.
在第3圖中,針對在燒結過程中,在沒有堆疊層或切斷層的情況下而進行的情形(比較例#1)、如以往所示使用金屬堆疊層的情形(比較例#2)及使用本發明的陶瓷切斷層110、150的情形(實施例#1~#6),顯示了陶瓷切斷層的使用次數、稀土族含量(wt%)等各條件下的電阻變化率。其中,在陶瓷切斷層110/150中使用了AlN,作為能與碳反應的稀土族氧化物,使用了添加Y2 O3 者。In the third drawing, the case where the stacked layer or the cut layer is not performed in the sintering process (Comparative Example #1), the case where the metal stacked layer is used as shown in the past (Comparative Example #2) In the case of using the ceramic cutting layers 110 and 150 of the present invention (Examples #1 to #6), the rate of change in electrical resistance under various conditions such as the number of times of using the ceramic cutting layer and the content of rare earth (wt%) was shown. Among them, AlN was used for the ceramic cut layer 110/150, and a rare earth oxide capable of reacting with carbon was used, and Y 2 O 3 was added.
如第3圖所示,首先,如果稀土族氧化物的含量超過10 wt%,則在燒結期間,陶瓷切斷層110/150上液態出現升高,與碳熔爐或碳模具200反應,從而經燒結處理的製品難以進行裝拆。因此,較佳地,在陶瓷切斷層110/150中,稀土族氧化物添加10 wt%以下。另外,當稀土族氧化物含量不足1 wt%時,抑制發熱體碳化的效果也會微弱。As shown in Fig. 3, first, if the content of the rare earth oxide exceeds 10 wt%, the liquid state on the ceramic cut layer 110/150 rises during sintering, reacts with the carbon furnace or the carbon mold 200, and is sintered. The processed article is difficult to assemble and disassemble. Therefore, preferably, in the ceramic cut layer 110/150, the rare earth oxide is added in an amount of 10% by weight or less. Further, when the content of the rare earth oxide is less than 1% by weight, the effect of suppressing carbonization of the heating element is also weak.
另外確認了作為原料物質的陶瓷粉末層130內含有的碳含量導致的發熱體140的電阻變化率不大。Further, it was confirmed that the rate of change in electric resistance of the heating element 140 due to the carbon content contained in the ceramic powder layer 130 as the raw material substance was not large.
另外,陶瓷切斷層110/150雖然為了燒結其他陶瓷粉末成型體而可以再使用,但如第3圖所示,確認了如果使用次數達到共10次以上,則發熱體140的電阻變化率開始上升。Further, although the ceramic cutting layer 110/150 can be reused for sintering other ceramic powder molded bodies, as shown in Fig. 3, it has been confirmed that the resistance change rate of the heating element 140 starts to rise if the number of uses reaches 10 or more times. .
而且,如果比較以往在沒有堆疊層或切斷層的情況下進行的情形(比較例#1)、如以往所示使用金屬堆疊層的情形(比較例#2)和本發明,可以確認,在使用了本發明的陶瓷切斷層110、150的實施例#1、#2、#5、#6的情況下,當接入電力而使用陶瓷加熱器100時,陶瓷板加熱面不同位置的溫度偏差得到相當改善,如第3圖所示,在根據本發明實施例而製造的情況下,可以視為這是由於因局部性碳化物生成導致電阻增加而發生的熱區(hot zone)的電阻變化率比以往技術低。Further, in the case where the conventionally carried out without the stacked layer or the cut layer (Comparative Example #1), the case where the metal stacked layer is used as shown in the past (Comparative Example #2), and the present invention, it can be confirmed that it is used. In the case of the examples #1, #2, #5, and #6 of the ceramic cutting layers 110 and 150 of the present invention, when the ceramic heater 100 is used when power is supplied, the temperature deviation at different positions of the heating surface of the ceramic plate is obtained. A considerable improvement, as shown in Fig. 3, in the case of manufacturing according to an embodiment of the present invention, it can be considered that this is due to the rate of change of resistance of a hot zone which occurs due to an increase in resistance due to localized carbide formation. Lower than the previous technology.
在以往技術中,為了減小發熱體的電阻變化,使用金屬堆疊構件(例如4A、5A、6A族金屬),屏蔽從外部的碳流入,可以在某種程度上降低發熱體的電阻。即,這種金屬堆疊構件減少從外部流入的碳,減小發熱體進行碳化的面積,從而可以在某種程度上降低發熱體的電阻。但是,這種以往技術雖然能夠降低發熱體整體的電阻變化,但無法阻止發熱體的電阻變化局部地不均一地發生。另外,以往的金屬堆疊構件一次性使用,由於與碳反應而在燒結過程中急劇碳化並出現脆性,因而在使用時誘發裂紋(crack),發生的裂紋起到碳源的流入路徑的作用。另外,金屬堆疊的碳化反應還在製品表面誘發毀損。因此,只能將粉末燒結體製作得厚於所需以上,而後去除毀損部位。In the prior art, in order to reduce the resistance change of the heat generating body, a metal stacking member (for example, 4A, 5A, and 6A metal) is used to shield the inflow of carbon from the outside, and the electric resistance of the heat generating body can be reduced to some extent. That is, such a metal stacking member reduces carbon flowing in from the outside, and reduces the area in which the heating element is carbonized, so that the electric resistance of the heating element can be reduced to some extent. However, such a conventional technique can reduce the change in resistance of the entire heat generating body, but it is not possible to prevent the resistance change of the heat generating body from being locally unevenly generated. Further, since the conventional metal stacking member is used at once, it is rapidly carbonized and brittle during the sintering process due to reaction with carbon, so that cracks are induced at the time of use, and the generated crack acts as an inflow path of the carbon source. In addition, the carbonization reaction of the metal stack induces damage on the surface of the article. Therefore, the powder sintered body can only be made thicker than necessary, and then the damaged portion is removed.
但是,如上述,根據本發明的陶瓷加熱器100,沿埋設發熱體的陶瓷粉末成型體上下形成陶瓷切斷層110/150,還形成用於脫模劑作用的BN層115/155,從而在燒結過程中,可以降低發熱體140整體的電阻變化,局部性電阻變化率也可以得到改善。即,藉由在本發明中使用陶瓷切斷層110/150,從而在燒結過程中,可以顯著減少脆性碳化物的形成及因此導致裂紋的發生。因此,本發明藉助於陶瓷切斷層110/150的使用而切斷相當部分流入的碳,從而可以在燒結過程中降低發熱體140整體的電阻變化,局部性電阻變化率也可以得到改善。進而,使得用於脫模劑作用的BN層115/155不與陶瓷粉末層130發生反應,從而在切斷來自陶瓷切斷層110/150的碳方面更有利,也有利於陶瓷切斷層110/150的再使用。However, as described above, according to the ceramic heater 100 of the present invention, the ceramic cut layer 110/150 is formed up and down along the ceramic powder molded body in which the heat generating body is embedded, and the BN layer 115/155 for the release agent is formed, thereby sintering. In the process, the resistance change of the entire heating element 140 can be reduced, and the local resistance change rate can also be improved. That is, by using the ceramic cutting layer 110/150 in the present invention, the formation of brittle carbides and thus the occurrence of cracks can be remarkably reduced during the sintering process. Therefore, the present invention cuts off a considerable portion of the inflowing carbon by the use of the ceramic cutting layer 110/150, so that the resistance change of the entire heating element 140 can be reduced during the sintering process, and the local resistance change rate can also be improved. Further, the BN layer 115/155 for the release agent does not react with the ceramic powder layer 130, thereby being more advantageous in cutting carbon from the ceramic cutting layer 110/150, and also favors the ceramic cutting layer 110/150. Reuse.
另外,在發熱體140中局部發生嚴重碳化的部分,在燒結後,當作為加熱器運轉時,在相應部分發熱量增加,在其周圍會形成熱區。根據本發明,切斷了諸如熱區的局部性位置的發熱體電阻上升可能性,因而晶片等目標對象加熱面的各位置的溫度偏差顯著減小,具有可以提高加熱面的溫度均一性的優點。另外,以往技術為了抑制在制品表面發生創傷,存在需要將陶瓷粉末燒結體製作得厚於所需以上的問題,但在本發明中,藉由使用反應性低的陶瓷切斷層110/150,從而可以使燒結體厚度的加工富餘更小,具有能夠降低陶瓷粉末成型體的使用量的優點。Further, in the heat generating body 140, a portion where severe carbonization occurs locally, after the sintering, when operating as a heater, the amount of heat generated in the corresponding portion increases, and a hot region is formed around the portion. According to the present invention, the possibility of increasing the resistance of the heat generating body such as the local position of the hot zone is cut, and thus the temperature deviation at each position of the heating surface of the target object such as the wafer is remarkably reduced, and the temperature uniformity of the heating surface can be improved. . Further, in the prior art, in order to suppress the occurrence of wounds on the surface of the product, there is a problem that it is necessary to make the ceramic powder sintered body thicker than necessary. However, in the present invention, by using the ceramic cutting layer 110/150 having low reactivity, The processing allowance of the thickness of the sintered body can be made smaller, and there is an advantage that the amount of use of the ceramic powder molded body can be reduced.
如上所述,本發明根據諸如具體構成要素等的特定事項和限定的實施例及圖式進行了說明,但這只是為了幫助更全面理解本發明而提供,並非將本發明限定於該實施例,只要是本發明所屬技術領域中具有通常知識者,便可以在不超出本發明的本質性特性的範圍內進行各種修改及變形。因此,本發明的思想並非限於說明的實施例,本發明的範圍應解釋為不僅包含所附發明申請專利範圍中所述之範圍,還包含與發明申請專利範圍中所述之範圍等同或等價的變形的所有技術思想。As described above, the present invention has been described in terms of specific matters, such as specific constituent elements, and the embodiments and the drawings, which are provided to provide a more complete understanding of the present invention, and the present invention is not limited to the embodiment. Various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the inventive concept is not limited to the illustrated embodiments, and the scope of the present invention should be construed as not only the scope of the scope of the appended claims. All technical ideas of the deformation.
100‧‧‧陶瓷加熱器100‧‧‧Ceramic heater
130‧‧‧陶瓷粉末層130‧‧‧Ceramic powder layer
140‧‧‧發熱體140‧‧‧heating body
110、150‧‧‧陶瓷切斷層110, 150‧‧‧ceramic cutting layer
115、155‧‧‧BN(Boron Nitride)層115, 155‧‧‧BN (Boron Nitride) layer
200‧‧‧碳模具200‧‧‧Carbon mould
S110~S130‧‧‧步驟S110~S130‧‧‧Steps
第1圖是用於說明本發明一個實施例的陶瓷加熱器的圖。Fig. 1 is a view for explaining a ceramic heater according to an embodiment of the present invention.
第2圖是用於說明本發明一個實施例的陶瓷加熱器的製造過程的流程圖。Fig. 2 is a flow chart for explaining a manufacturing process of a ceramic heater according to an embodiment of the present invention.
第3圖是用於比較說明以往陶瓷加熱器與本發明一個實施例的陶瓷加熱器的發熱體在各條件下的電阻變化率的圖。Fig. 3 is a view for explaining the comparison of the rate of change in resistance of the heating element of the conventional ceramic heater and the ceramic heater of one embodiment of the present invention under various conditions.
Claims (11)
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| KR1020170068337A KR102272523B1 (en) | 2017-06-01 | 2017-06-01 | Method for Manufacturing Ceramic Heater |
| ??10-2017-0068337 | 2017-06-01 | ||
| KR10-2017-0068337 | 2017-06-01 |
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| KR102783431B1 (en) * | 2023-08-01 | 2025-03-19 | 주식회사 케이에스엠컴포넌트 | Plate type heater and manufacturing method thereof |
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| JP3888531B2 (en) * | 2002-03-27 | 2007-03-07 | 日本碍子株式会社 | Ceramic heater, method for manufacturing ceramic heater, and buried article of metal member |
| TWI247551B (en) * | 2003-08-12 | 2006-01-11 | Ngk Insulators Ltd | Method of manufacturing electrical resistance heating element |
| US8481892B2 (en) * | 2009-03-30 | 2013-07-09 | Ngk Insulators, Ltd. | Ceramic heater and method for producing same |
| JP5341049B2 (en) * | 2010-10-29 | 2013-11-13 | 日本発條株式会社 | Method for manufacturing ceramic sintered body, ceramic sintered body, and ceramic heater |
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| KR102272523B1 (en) | 2021-07-05 |
| WO2018221868A1 (en) | 2018-12-06 |
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