TW201843189A - Removable radiation-curable silicone composition and release sheet - Google Patents
Removable radiation-curable silicone composition and release sheet Download PDFInfo
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- TW201843189A TW201843189A TW107112349A TW107112349A TW201843189A TW 201843189 A TW201843189 A TW 201843189A TW 107112349 A TW107112349 A TW 107112349A TW 107112349 A TW107112349 A TW 107112349A TW 201843189 A TW201843189 A TW 201843189A
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- 239000004651 Radiation Curable Silicone Substances 0.000 title abstract 3
- -1 acryl groups Chemical group 0.000 claims abstract description 131
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 83
- 230000005855 radiation Effects 0.000 claims abstract description 22
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 20
- 125000005358 mercaptoalkyl group Chemical group 0.000 claims abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000003999 initiator Substances 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 150000002430 hydrocarbons Chemical class 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 229910000077 silane Inorganic materials 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 238000000034 method Methods 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 8
- 229920000573 polyethylene Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000010526 radical polymerization reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007870 radical polymerization initiator Substances 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XHVSJCKGMZSWIN-UHFFFAOYSA-N (2-hydroxy-3-prop-1-enoxypropyl) 2-methylprop-2-enoate Chemical compound CC=COCC(O)COC(=O)C(C)=C XHVSJCKGMZSWIN-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- OQZQDGSYKKFLTE-UHFFFAOYSA-N 1-(4-azidophenyl)-3-phenylprop-2-en-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C=CC1=CC=CC=C1 OQZQDGSYKKFLTE-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- HUDYANRNMZDQGA-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]ethanone Chemical compound CN(C)C1=CC=C(C(C)=O)C=C1 HUDYANRNMZDQGA-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- KZMAWJRXKGLWGS-UHFFFAOYSA-N 2-chloro-n-[4-(4-methoxyphenyl)-1,3-thiazol-2-yl]-n-(3-methoxypropyl)acetamide Chemical compound S1C(N(C(=O)CCl)CCCOC)=NC(C=2C=CC(OC)=CC=2)=C1 KZMAWJRXKGLWGS-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SMSVUYQRWYTTLI-UHFFFAOYSA-L 2-ethylhexanoate;iron(2+) Chemical compound [Fe+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O SMSVUYQRWYTTLI-UHFFFAOYSA-L 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- BSMGLVDZZMBWQB-UHFFFAOYSA-N 2-methyl-1-phenylpropan-1-one Chemical compound CC(C)C(=O)C1=CC=CC=C1 BSMGLVDZZMBWQB-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- 239000005874 Bifenthrin Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- YRWXPHAALWEKDX-UHFFFAOYSA-J O=C(O[Ti](OC(=O)c1cccc2ccccc12)(OC(=O)c1cccc2ccccc12)OC(=O)c1cccc2ccccc12)c1cccc2ccccc12 Chemical compound O=C(O[Ti](OC(=O)c1cccc2ccccc12)(OC(=O)c1cccc2ccccc12)OC(=O)c1cccc2ccccc12)c1cccc2ccccc12 YRWXPHAALWEKDX-UHFFFAOYSA-J 0.000 description 1
- NCKRTZSDNFWGRY-UHFFFAOYSA-N OCC1(C(C=CC=C1)CC(C)=O)C Chemical compound OCC1(C(C=CC=C1)CC(C)=O)C NCKRTZSDNFWGRY-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- OMFRMAHOUUJSGP-IRHGGOMRSA-N bifenthrin Chemical compound C1=CC=C(C=2C=CC=CC=2)C(C)=C1COC(=O)[C@@H]1[C@H](\C=C(/Cl)C(F)(F)F)C1(C)C OMFRMAHOUUJSGP-IRHGGOMRSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- XXQBIYASOABGRU-UHFFFAOYSA-N butoxy-dimethoxy-propylsilane Chemical compound CCCCO[Si](OC)(OC)CCC XXQBIYASOABGRU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- UJTGYJODGVUOGO-UHFFFAOYSA-N diethoxy-methyl-propylsilane Chemical compound CCC[Si](C)(OCC)OCC UJTGYJODGVUOGO-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000006232 ethoxy propyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- BFXAWOHHDUIALU-UHFFFAOYSA-M sodium;hydron;difluoride Chemical class F.[F-].[Na+] BFXAWOHHDUIALU-UHFFFAOYSA-M 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/005—Presence of (meth)acrylic polymer in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Abstract
Description
本發明關於放射線硬化性優異,得到對於基材的密著性優異之硬化物的剝離性放射線硬化性聚矽氧組成物及剝離薄片。The present invention relates to a radiation-curable polysiloxane composition and a release sheet that are excellent in radiation curability and obtain a cured product having excellent adhesion to a substrate.
於各種紙、層合紙、合成薄膜、透明樹脂、金屬箔等的基材表面,塗佈有機聚矽氧烷組成物,藉由交聯反應形成硬化皮膜,而製造對於接著性或黏著性物質具有剝離性的剝離紙、剝離薄膜等之剝離薄片。使有機聚矽氧烷組成物硬化之方法係有各式各樣的手段,已知有機金屬化合物所致的縮合反應、使用有機過氧化物的硫化、鉑族金屬觸媒所致的氫矽化反應等。然而,於上述之硬化方式中必須加熱,為了生產性提高或節能化,要求在更低溫或室溫的硬化。另一方面,作為加熱以外之硬化方法,使用放射線所致的硬化方式。Apply the organopolysiloxane composition on the surface of substrates such as various papers, laminated papers, synthetic films, transparent resins, and metal foils, and form a hardened film by cross-linking reaction to produce adhesive or adhesive substances. A release sheet such as a release paper or a release film. Various methods are used to harden the organopolysiloxane composition. It is known that condensation reactions caused by organometallic compounds, sulfurization using organic peroxides, and hydrosilation reactions caused by platinum group metal catalysts are known. Wait. However, it is necessary to heat in the above-mentioned hardening method. In order to improve productivity or save energy, hardening at a lower temperature or room temperature is required. On the other hand, as a hardening method other than heating, a hardening method by radiation is used.
放射線所致的硬化方式可舉出使用丙烯酸改質聚矽氧烷的自由基聚合、環氧改質聚矽氧烷之環氧基的開環所致的陽離子聚合、使用巰基改質聚有機矽氧烷的烯-硫醇反應所致的硬化等。Radiation-based curing methods include radical polymerization using acrylic modified polysiloxane, cationic polymerization due to ring opening of epoxy groups of epoxy modified polysiloxane, and mercapto-modified polyorganosiloxane. Hardening caused by ene-thiol reaction of oxane.
藉由丙烯酸改質聚矽氧烷之使用光自由基起始劑自由基聚合而形成硬化皮膜者,雖然對於基材的密著性高,硬化性亦良好,但是由於氧的存在而阻礙硬化,必須用於減低氧濃度的裝置。Those who form a hardened film by free radical polymerization of acrylic modified polysiloxane using a photo radical initiator, although have high adhesion to the substrate and good hardenability, but the presence of oxygen hinders hardening, Must be used for devices that reduce oxygen concentration.
藉由環氧改質聚矽氧烷之使用光酸產生劑的環氧基之開環所致的陽離子聚合而形成硬化皮膜者,雖然沒有氧所致的硬化阻礙,可在空氣中硬化,但是在基材中含有能阻礙酸發生的化合物時,或因空氣中的濕度影響,而容易發生硬化阻礙。Those who form a hardened film by cationic polymerization of epoxy-modified polysiloxane with photo-acid generator ring-opening, although hardened by oxygen, can harden in air, but When the base material contains a compound that can inhibit the generation of acid, or due to the influence of humidity in the air, the hardening is likely to occur.
藉由巰基改質聚有機矽氧烷之使用光自由基起始劑的烯-硫醇反應而形成硬化皮膜者,係與使用丙烯酸改質聚矽氧烷的情況相同,雖然以自由基聚合進行硬化,但是具有優點為不受到氧濃度之影響,可在空氣中硬化,且與陽離子聚合不同,亦不易受到硬化阻礙物質等之影響。藉此,作為含有各式各樣的添加劑之基材的黏著膠帶之背面處理劑、黏著標籤用剝離劑及膠帶等之展開係亦可能,今後亦可期待市場的擴大。根據以上,與使用巰基改質聚有機矽氧烷的烯-硫醇反應之剝離劑有關的許多發明係被提出。The formation of a hardened film by the ene-thiol reaction of a mercapto-modified polyorganosiloxane using a photo-radical initiator is the same as that in the case of acrylic-modified polysiloxane, although it is performed by radical polymerization Hardening, but has the advantage that it is not affected by the concentration of oxygen, can be hardened in the air, and is different from cationic polymerization, and is not easily affected by hardening inhibitors. Thereby, it is also possible to develop a back surface treatment agent for adhesive tapes, which is a base material containing various additives, a release agent for adhesive labels, an adhesive tape, and the like, and the market expansion can be expected in the future. Based on the above, many inventions related to a release agent for an ene-thiol reaction using a mercapto-modified polyorganosiloxane are proposed.
另一方面,烯-硫醇反應所致的自由基聚合係與丙烯酸基所致的自由基聚合不同,雖然可不受到空氣中的氧濃度之影響而硬化,但由於反應速度係慢於丙烯酸基所致的自由基聚合,因此尤其對於基材的密著性有容易降低之傾向。On the other hand, the radical polymerization caused by the ene-thiol reaction is different from the radical polymerization caused by the acrylic group. Although it can be hardened without being affected by the oxygen concentration in the air, the reaction rate is slower than the acrylic group Induced radical polymerization tends to reduce the adhesion of the substrate, in particular.
日本發明專利第3060868號公報(專利文獻1)中提案一種剝離性紫外線硬化聚矽氧組成物,其特徵為在25℃的黏度為10,000cp以上,主成分為: (A):在1分子中具有至少2個鍵結於矽原子的烯基,在25℃的黏度為100~10,000cp的有機聚矽氧烷, (B):在1分子中具有至少2個鍵結於矽原子的烯基,在25℃的黏度為100萬cp以上的有機聚矽氧烷, (C):在1分子中具有至少2個鍵結於矽原子的巰基烷基之有機聚矽氧烷, (D):光起始劑。 於此發明中,藉由添加(B)成分的高黏度有機聚矽氧烷,而將滑性給予硬化皮膜,對於各種的黏著物質成為輕剝離,由於因(B)成分之添加而交聯密度降低,有對於基材的密著性降低之虞。Japanese Invention Patent No. 3060868 (Patent Document 1) proposes a peelable UV-curable polysiloxane composition, which is characterized in that the viscosity at 25 ° C is 10,000 cp or more and the main component is: (A): in 1 molecule An organopolysiloxane having at least 2 alkenyl groups bonded to a silicon atom and having a viscosity of 100 to 10,000 cp at 25 ° C, (B): Alkenyl having at least 2 silicon atoms bonded in one molecule Organic polysiloxanes having a viscosity at 25 ° C of 1 million cp or more, rhenium (C): organic polysiloxanes having at least two mercaptoalkyl groups bonded to silicon atoms in one molecule, rhenium (D): Light initiator. In this invention, by adding the high-viscosity organopolysiloxane of the component (B), slipperyness is imparted to the hardened film, and various kinds of adhesive substances are lightly peeled off. The crosslinking density is caused by the addition of the component (B) If it decreases, the adhesiveness to the substrate may decrease.
日本發明專利第3394164號公報(專利文獻2)中提案一種剝離性紫外線硬化型聚矽氧組成物,其主成分為: (1):在1分子中平均含有1~3個分枝構造,在25℃的黏度為100~100,000CP之含有烯基的有機聚矽氧烷100重量份 (2):在1分子中含有鍵結於矽原子的至少2個巰基烷基之有機聚矽氧烷1~30重量份 (3):相溶於上述有機聚矽氧烷之光起始劑。 此發明係藉由使用(1)分枝狀之含有烯基的有機聚矽氧烷,而硬化性升高,但由於分枝構造為在1分子中平均含有1~3個而少,密著性難以升高。 [先前技術文獻] [專利文獻]Japanese Patent Publication No. 3394164 (Patent Document 2) proposes a peelable UV-curable polysiloxane composition whose main components are: (1): 1 to 3 branch structures are contained in one molecule on average. 100 parts by weight of an alkenyl-containing organopolysiloxane having a viscosity of 100 to 100,000 CP at 25 ° C (2): An organopolysiloxane containing at least two mercaptoalkyl groups bonded to a silicon atom in one molecule 1 ~ 30 parts by weight (3): a photoinitiator compatible with the above-mentioned organic polysiloxane. This invention uses (1) branched organic alkenyl group-containing organopolysiloxanes to increase the hardenability, but the branch structure is small and contains an average of 1 to 3 molecules per molecule. Sex is difficult to raise. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本發明專利第3060868號公報 [專利文獻2]日本發明專利第3394164號公報 [專利文獻3]日本特開2016-041774號公報[Patent Literature 1] Japanese Invention Patent No. 3060868 [Patent Literature 2] Japanese Invention Patent No. 3394164 [Patent Literature 3] Japanese Patent Laid-Open No. 2016-041774
[發明所欲解決的課題][Problems to be Solved by the Invention]
本發明係鑒於上述情事而完成者,目的在於提供放射線硬化性優異,得到對於基材的密著性優異之硬化物的剝離性放射線硬化性聚矽氧組成物及剝離薄片。 [解決課題的手段]The present invention has been made in view of the foregoing circumstances, and an object thereof is to provide a peelable radiation-curable polysiloxane composition and a release sheet which are excellent in radiation curability and obtain a cured product having excellent adhesion to a substrate. [Means for solving problems]
本發明者們為了達成上述目的而專心致力地檢討,結果發現於含有烯基的有機聚矽氧烷、含有巰基的有機聚矽氧烷中添加有光起始劑的剝離薄片用等之剝離性放射線硬化性組成物中,少量添加在1分子中具有複數的丙烯酸基之化合物作為密著提高劑,不會使剝離特性變化,可製造能顯著提高對於基材的密著性之剝離薄片,可達成上述課題。因此,與以往放射線硬化性聚矽氧組成物比較下,確認本發明之剝離性放射線硬化性聚矽氧組成物得到密著性良好同時能維持剝離特性之硬化物,終於完成本發明。The present inventors conducted an intensive review in order to achieve the above-mentioned object, and as a result, found that the release property for a release sheet to which a photoinitiator is added in an organopolysiloxane containing alkenyl groups and an organopolysiloxane containing mercapto groups is found. In the radiation-curable composition, a small amount of a compound having a plurality of acrylic groups in one molecule is added as an adhesion-enhancing agent without changing the peeling characteristics, and a release sheet that can significantly improve the adhesion to a substrate can be produced. Achieve the above issues. Therefore, in comparison with the conventional radiation-curable polysiloxane composition, it was confirmed that the peelable radiation-curable polysiloxane composition of the present invention obtained a cured product having good adhesion and maintaining peeling properties, and finally completed the present invention.
因此,本發明提供下述發明。 [1].一種剝離性放射線硬化性聚矽氧組成物,其含有下述(A)、(B)、(C)及(D)成分; (A)以下述平均組成式(1)所示的具有烯基之有機聚矽氧烷:100質量份(式中,R1 為相同或異種之碳數1~10的1價烴基;a≧0,b≧0,c≧0,d≧0,且2≦a+b+c+d≦8,000;惟,R1 、a、b、c、d係以在1分子中鍵結於矽原子的烯基成為2個以上之方式選擇); (B)以下述平均組成式(2)所示的具有巰基烷基之有機聚矽氧烷:1~30質量份(式中,R2 為相同或異種之碳數1~10的1價烴基或巰基烷基;e≧0,f≧0,g≧0,h≧0,且2≦e+f+g+h≦300;惟,R2 、e、f、g、h係以在1分子中鍵結於矽原子的巰基烷基成為2個以上之方式選擇); (C)在1分子中具有複數的丙烯酸基之化合物:0.1~5質量份 (D)光聚合起始劑:0.1~15質量份。 [2].如[1]記載之剝離性放射線硬化性聚矽氧組成物,其中(C)成分為在1分子中具有3個以上的丙烯酸基之化合物。 [3].如[2]記載之剝離性放射線硬化性聚矽氧組成物,其中(C)成分為在1分子中具有3個以上的丙烯酸基之烴系化合物。 [4].如[2]記載之剝離性放射線硬化性聚矽氧組成物,其中(C)成分為在1分子中具有3個以上的丙烯酸基之矽烷化合物或其水解縮合物。 [5].一種剝離薄片,其係將如[1]~[4]任一項之剝離性放射線硬化性聚矽氧組成物塗佈於基材上,藉由放射線照射而使其硬化者。 [發明的效果]Therefore, the present invention provides the following inventions. [1]. A peelable radiation-curable polysiloxane composition containing the following components (A), (B), (C), and (D); (A) is represented by the following average composition formula (1) Organic polysiloxane with alkenyl group: 100 parts by mass (In the formula, R 1 is a monovalent hydrocarbon group having the same or different carbon number 1 to 10; a ≧ 0, b ≧ 0, c ≧ 0, d ≧ 0, and 2 ≦ a + b + c + d ≦ 8,000; However, R 1 , a, b, c, and d are selected such that the alkenyl group bonded to the silicon atom in one molecule becomes two or more); (B) has the following average composition formula (2): Mercapto alkyl organic polysiloxane: 1 to 30 parts by mass (In the formula, R 2 is a monovalent hydrocarbon group or mercapto alkyl group having the same or different carbon number 1 to 10; e ≧ 0, f ≧ 0, g ≧ 0, h ≧ 0, and 2 ≦ e + f + g + h ≦ 300; however, R 2 , e, f, g, and h are selected so that the number of mercaptoalkyl groups bonded to the silicon atom in one molecule becomes two or more); (C) a compound having one in plural molecules Acrylic-based compound: 0.1 to 5 parts by mass (D) Photopolymerization initiator: 0.1 to 15 parts by mass. [2]. The peelable radiation-curable polysiloxane composition according to [1], wherein the component (C) is a compound having three or more acrylic groups in one molecule. [3]. The peelable radiation-curable polysiloxane composition according to [2], wherein the component (C) is a hydrocarbon compound having three or more acrylic groups in one molecule. [4]. The peelable radiation-curable polysiloxane composition according to [2], wherein the component (C) is a silane compound or a hydrolyzed condensate thereof having three or more acrylic groups in one molecule. [5]. A release sheet, which is a substrate in which the peelable radiation-curable polysiloxane composition according to any one of [1] to [4] is coated and cured by irradiation with radiation. [Effect of the invention]
依照本發明,可提供放射線硬化性優異,得到對於基材的密著性優異之硬化物的剝離性放射線硬化性聚矽氧組成物及剝離薄片。According to the present invention, it is possible to provide a peelable radiation-curable polysiloxane composition and a release sheet which are excellent in radiation curability and obtain a cured product having excellent adhesion to a substrate.
[實施發明的形態][Mode for Carrying Out the Invention]
以下,詳細說明本發明。本發明之剝離性放射線硬化性聚矽氧組成物含有成分(A)、(B)、(C)及(D)成分。 [(A)成分] (A)成分係以下述平均組成式(1)所示的具有烯基之有機聚矽氧烷,(式中,R1 為相同或異種之碳數1~10的1價烴基;a≧0,b≧0,c≧0,d≧0,且2≦a+b+c+d≦8,000;惟,R1 、a、b、c、d係以在1分子中鍵結於矽原子的烯基成為2個以上之方式選擇);可為單獨1種或適宜組合2種以上而使用。Hereinafter, the present invention will be described in detail. The peelable radiation-curable polysiloxane composition of the present invention contains the components (A), (B), (C), and (D). [(A) component] (A) component is an organic polysiloxane having an alkenyl group represented by the following average composition formula (1), (In the formula, R 1 is a monovalent hydrocarbon group having the same or different carbon number 1 to 10; a ≧ 0, b ≧ 0, c ≧ 0, d ≧ 0, and 2 ≦ a + b + c + d ≦ 8,000; However, R 1 , a, b, c, and d are selected so that the alkenyl group bonded to the silicon atom in one molecule becomes two or more); they may be used alone or in a suitable combination of two or more.
式中,R1 為相同或異種之碳數1~10的1價烴基,以在1分子中含有2個以上的鍵結於矽原子之碳數1~10的烯基之方式選擇。作為碳數1~10的1價烴基,可舉出甲基、乙基、丙基、丁基等之烷基,環己基等之環烷基,乙烯基、烯丙基、丁烯基、己烯基、辛烯基等之烯基,苯基、甲苯基等之芳基等,再者可舉出從此等之基的碳原子所鍵結的氫原子之一部分或全部經氟、氯等的鹵素原子所取代之3,3,3-三氟丙基、全氟丁基乙基、全氟辛基乙基,經丙烯醯氧基、甲基丙烯醯氧基等之(甲基)丙烯酸官能基所取代之3-甲基丙烯醯氧基丙基、3-丙烯醯氧基丙基,經聚氧乙烯基、聚氧丙烯基等所取代之聚氧化烯基,經烷氧基所取代之甲氧基丙基、乙氧基丙基等中選出的非取代或取代之碳數1~10的1價烴基。(A)成分係在1分子中含有2個以上的鍵結於矽原子之烯基者,作為烯基,較佳為乙烯基、烯丙基、己烯基。In the formula, R 1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms of the same or different species, and is selected so as to contain two or more alkenyl groups having 1 to 10 carbon atoms bonded to a silicon atom in one molecule. Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms include alkyl groups such as methyl, ethyl, propyl, and butyl, cycloalkyl groups such as cyclohexyl, vinyl, allyl, butenyl, and hexyl Alkenyl groups such as alkenyl, octenyl, aryl groups such as phenyl, tolyl, and the like, and further include a part or all of hydrogen atoms bonded to carbon atoms of these groups via fluorine, chlorine, etc. 3,3,3-trifluoropropyl, perfluorobutylethyl, perfluorooctylethyl substituted by a halogen atom, (meth) acrylic acid functionalized by propylene alkoxy, methacryl oxy and the like 3-methacryloxypropyl, 3-propenyloxypropyl substituted by a phenyl group, a polyoxyalkylene group substituted with a polyoxyethylene group, a polyoxypropylene group, or the like Unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms selected from methoxypropyl and ethoxypropyl. The component (A) is an alkenyl group containing two or more bonds to silicon atoms in one molecule. The alkenyl group is preferably a vinyl group, an allyl group, or a hexenyl group.
又,作為烯基以外之基,較佳係分子中的全部R1 中之1~10莫耳%為苯基,其他係從剝離特性來看為甲基。苯基未達1莫耳%時,紫外線硬化性降低,超過10莫耳%時,由於重剝離化,不適合剝離薄片用。In addition, as the group other than the alkenyl group, 1 to 10 mole% of all R 1 in the molecule is preferably a phenyl group, and the others are methyl groups from the viewpoint of peeling characteristics. When the phenyl content is less than 1 mol%, the ultraviolet curability is lowered, and when it exceeds 10 mol%, it is not suitable for peeling a sheet due to heavy peeling.
R1 、a、b、c、d係以在1分子中鍵結於矽原子的烯基成為2個以上、較佳成為3個以上之方式選擇,亦可以烯基量與苯基量成為上述所示的值之方式選擇。較佳的範圍為a≧2、b≧50、c≧0、d≧0,更佳為a≧2、b≧100、c≧0、d=0。又,2≦a+b+c+d≦8,000,較佳為2≦a+b+c+d≦5,000。R 1 , a, b, c, and d are selected so that the number of alkenyl groups bonded to a silicon atom in one molecule becomes two or more, preferably three or more, and the amount of alkenyl groups and phenyl groups can be as described above. The way shown values are chosen. The preferred ranges are a ≧ 2, b ≧ 50, c ≧ 0, d ≧ 0, and more preferably a ≧ 2, b ≧ 100, c ≧ 0, and d = 0. In addition, 2 ≦ a + b + c + d ≦ 8,000, and preferably 2 ≦ a + b + c + d ≦ 5,000.
[(B)成分] (B)成分係以下述平均組成式(2)所示的具有巰基烷基之有機聚矽氧烷,(式中,R2 為相同或異種之碳數1~10的1價烴基或巰基烷基;e≧0,f≧0,g≧0,h≧0,且2≦e+f+g+h≦300;惟,R2 、e、f、g、h係以在1分子中鍵結於矽原子的巰基烷基成為2個以上之方式選擇);可為單獨1種或適宜組合2種以上而使用。[(B) component] (B) component is an organopolysiloxane having a mercaptoalkyl group represented by the following average composition formula (2), (In the formula, R 2 is a monovalent hydrocarbon group or mercapto alkyl group having the same or different carbon number 1 to 10; e ≧ 0, f ≧ 0, g ≧ 0, h ≧ 0, and 2 ≦ e + f + g + h ≦ 300; however, R 2 , e, f, g, and h are selected in such a way that the mercaptoalkyl group bonded to the silicon atom in one molecule becomes two or more); it may be one alone or a suitable combination of two Used above.
R2 為相同或異種之碳數1~10、較佳1~3的1價烴基或巰基烷基。作為巰基烷基以外之碳數1~10的1價烴基,例如可舉出甲基、乙基、丙基等之烷基,苯基、甲苯基等之芳基,或此等之基的碳原子所鍵結的氫原子之一部分或全部經氟、氯等的鹵素原子所取代之3,3,3-三氟丙基、全氟丁基乙基、全氟辛基乙基,經烷氧基所取代之甲氧基丙基乙氧基丙基等。(B)成分係在1分子中含有2個以上的鍵結於矽原子之巰基烷基者,鍵結於矽原子的巰基烷基以外之基,從剝離性及與(A)成分的相溶性來看,相對於分子中全部的R2 中,較佳50莫耳%以上為甲基。R 2 is a monovalent hydrocarbon group or mercapto alkyl group having the same or different carbon number of 1 to 10, preferably 1 to 3; Examples of monovalent hydrocarbon groups having 1 to 10 carbon atoms other than mercaptoalkyl groups include alkyl groups such as methyl, ethyl, and propyl, aryl groups such as phenyl and tolyl, and carbons of these groups One or all of the hydrogen atoms to which the atom is bonded are replaced by halogen atoms such as fluorine, chlorine, etc. 3,3,3-trifluoropropyl, perfluorobutylethyl, perfluorooctylethyl, etc. Substituted with methoxypropylethoxypropyl and the like. The component (B) contains one or more mercaptoalkyl groups bonded to a silicon atom in one molecule, and the groups other than the mercaptoalkyl group bonded to the silicon atom are separated from the releasability and compatibility with the component (A). From the viewpoint, it is preferable that at least 50 mol% of methyl groups are present with respect to all of R 2 in the molecule.
作為巰基烷基之例,可舉出巰基甲基、巰基乙基、巰基丙基、巰基己基等,但從原料的取得、合成的容易度來看,較佳為巰基丙基。分子中的全部R2 中之巰基烷基量(相對於鍵結於矽原子的全部有機基而言,鍵結於矽原子的巰基烷基之量),從交聯效率之點來看較佳為10~50莫耳%。Examples of the mercaptoalkyl group include mercaptomethyl, mercaptoethyl, mercaptopropyl, mercaptohexyl, and the like, but from the viewpoint of availability of raw materials and ease of synthesis, mercaptopropyl is preferred. The amount of mercaptoalkyl groups in all R 2 in the molecule (the amount of mercaptoalkyl groups bonded to silicon atoms relative to all organic groups bonded to silicon atoms) is preferred from the viewpoint of crosslinking efficiency It is 10 ~ 50 mol%.
R2 、e、f、g、h係以在1分子中鍵結於矽原子的巰基烷基成為2個以上之方式選擇。e、f、g、h各自較佳為在e=0時,f≧3、g≧0、h=0,在e≠0時,e≧1、f≧0、g≧1、h≧0,更佳為在e=0時,f≧4、g≧0、h=0,在e≠0時,e≧2、f≧0、g≧2、h=0。又,2≦e+f+g+h≦300,較佳為2≦e+f+g+h≦200。R 2 , e, f, g, and h are selected so that the number of mercaptoalkyl groups bonded to the silicon atom in one molecule becomes two or more. Each of e, f, g, and h is preferably f ≧ 3, g ≧ 0, and h = 0 when e = 0, and e ≧ 1, f ≧ 0, g ≧ 1, and h ≧ 0 when e ≠ 0. , More preferably, when e = 0, f ≧ 4, g ≧ 0, h = 0, and when e ≠ 0, e ≧ 2, f ≧ 0, g ≧ 2, and h = 0. In addition, 2 ≦ e + f + g + h ≦ 300, and preferably 2 ≦ e + f + g + h ≦ 200.
相對於(A)成分100質量份,(B)成分之摻合量為1~30質量份,較佳為2~25質量份,更佳為3~20質量份。若(B)成分少於1質量份,則硬化性會降低,另外若多於30質量份,則看不到硬化性之改善,再者剝離性會降低。The blending amount of the component (B) is 1 to 30 parts by mass, preferably 2 to 25 parts by mass, and more preferably 3 to 20 parts by mass with respect to 100 parts by mass of the component (A). When the (B) component is less than 1 part by mass, the hardenability is reduced, and when it is more than 30 parts by mass, no improvement in the hardenability is observed, and further, the peelability is reduced.
[(C)成分] (C)成分係在1分子中具有複數的丙烯酸基之化合物,為本發明之剝離性放射線硬化性聚矽氧組成物的密著提高成分。(C)成分係可為單獨1種,或也可適宜組合2種以上而使用。作為(C)成分,可舉出具有丙烯酸基的烴系化合物、具有丙烯酸基的矽烷化合物或其水解縮合物。在1分子中具有複數的丙烯酸基之化合物係分子中所包含的丙烯酸基之數為2個以上,較佳為3個以上。特別地,若添加在1分子中具有3個以上的丙烯酸基之化合物,則可顯著改良密著性。[(C) component] The (C) component is a compound having a plurality of acrylic groups in one molecule, and is an adhesion-improving component of the peelable radiation-curable polysiloxane composition of the present invention. (C) A component system may be used individually by 1 type, and may be used combining two or more types suitably. Examples of the component (C) include a hydrocarbon compound having an acrylic group, a silane compound having an acrylic group, or a hydrolyzed condensate thereof. The number of acrylic groups contained in a compound-based molecule having a plurality of acrylic groups in one molecule is two or more, and preferably three or more. In particular, when a compound having three or more acrylic groups in one molecule is added, adhesion can be significantly improved.
作為在1分子中具有複數的丙烯酸基之烴系化合物,可舉出2官能、3官能、4官能以上的丙烯酸化合物。Examples of the hydrocarbon-based compound having a plurality of acrylic groups in one molecule include bifunctional, trifunctional, and tetrafunctional acrylic compounds.
作為具有2官能的丙烯酸化合物,可舉出1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,9-壬二醇二丙烯酸酯、1,10-癸二醇二丙烯酸酯、三環癸烷二甲醇二丙烯酸酯、二丙二醇二丙烯酸酯、三丙二醇二丙烯酸酯等。作為製品,可舉出大阪有機化學公司製Viscoat #700HV(雙酚AEO3.8莫耳加成物二丙烯酸酯)等。Examples of the bifunctional acrylic compound include 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, and 1,10-decane Alcohol diacrylate, tricyclodecane dimethanol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and the like. Examples of the product include Viscoat # 700HV (bisphenol AEO3.8 mol adduct diacrylate) manufactured by Osaka Organic Chemical Co., Ltd. and the like.
作為具有3官能的丙烯酸化合物,可舉出三羥甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯。作為製品,可舉出新中村化學製A-9300(乙氧基化異三聚氰酸三丙烯酸酯)、Daicel-Allenx公司製的TMPEOTA(三羥甲基丙烷乙氧基三丙烯酸酯)、Daicel-Allenx公司製的OTA 480(甘油丙氧基三丙烯酸酯)等。Examples of the trifunctional acrylic compound include trimethylolpropane triacrylate and pentaerythritol triacrylate. Examples of the product include A-9300 (ethoxylated isotricyanate triacrylate) manufactured by Shin Nakamura Chemical, TMPEOTA (trimethylolpropane ethoxy triacrylate) manufactured by Daicel-Allenx, and Daicel -OTA 480 (glyceryl propoxy triacrylate) manufactured by Allenx Corporation.
作為具有4官能以上的丙烯酸化合物,可舉出季戊四醇四丙烯酸酯、雙三羥甲基丙烷四丙烯酸酯、二季戊四醇六丙烯酸酯、新中村化學製之A-9550(二季戊四醇聚丙烯酸酯)等。Examples of the acrylic compound having four or more functions include pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol hexaacrylate, and A-9550 (dipentaerythritol polyacrylate) manufactured by Shin Nakamura Chemical.
又,作為在1分子中具有2個以上的丙烯酸基之矽烷化合物,可舉出以下述通式(3)所示者。(式中,n為1~3之整數,m為1~10之整數,X為碳數1~4的烷氧基,R3 為碳數1~4的烷基,R4 為以下述式(4)或(4’)所示的構造基)。(式中,A為直鏈狀、分枝狀或環狀之碳數1~10的2價烴基,為可使氧原子或氮原子介於其間存在,但不包含其以外的雜原子之有機連結基,R5 為氫原子,p為1~5之整數)。(式中,B為直鏈狀、分枝狀或環狀之碳數1~10的3價烴基,為可使氧原子或氮原子介於其間存在,但不包含其以外的雜原子之有機連結基,R5 為氫原子,p’、p”各自為1以上之整數,p’+p”為2~5之整數)。Examples of the silane compound having two or more acrylic groups in one molecule include those represented by the following general formula (3). (Where n is an integer of 1 to 3, m is an integer of 1 to 10, X is an alkoxy group having 1 to 4 carbon atoms, R 3 is an alkyl group having 1 to 4 carbon atoms, and R 4 is represented by the following formula (4) or (4 '). (In the formula, A is a linear, branched, or cyclic divalent hydrocarbon group having 1 to 10 carbon atoms. It is an organic group that allows an oxygen atom or a nitrogen atom to exist therebetween, but does not include other heteroatoms. A linking group, R 5 is a hydrogen atom, and p is an integer of 1 to 5). (In the formula, B is a linear, branched, or cyclic trivalent hydrocarbon group having 1 to 10 carbon atoms. It is an organic group that allows an oxygen atom or a nitrogen atom to exist therebetween, but does not include other heteroatoms. As a linking group, R 5 is a hydrogen atom, p ′ and p ”are each an integer of 1 or more, and p ′ + p” is an integer of 2 to 5).
作為上述式(3),較佳為以下述通式(5)~(8)所示的在1分子中具有2個以上的丙烯酸基之矽烷化合物。式中,X、n係如上述。 The formula (3) is preferably a silane compound having two or more acrylic groups in one molecule, represented by the following general formulae (5) to (8). In the formula, X and n are as described above.
以通式(3)、(5)~(8)所示的在1分子中具有2個以上的丙烯酸基之矽烷化合物係可藉由使如日本特開2016-041774號公報中記載的在同一分子中具有丙烯酸基與羥基的化合物與具有異氰酸酯基的有機矽化合物反應而得。Silane compounds having two or more acrylic groups in one molecule represented by the general formulae (3), (5) to (8) can be made the same as described in Japanese Patent Application Laid-Open No. 2016-041774. It is obtained by reacting a compound having an acrylic group and a hydroxyl group in the molecule with an organic silicon compound having an isocyanate group.
作為上述具有異氰酸酯基的有機矽化合物,可舉出3-異氰酸酯丙基三甲氧基矽烷、3-異氰酸酯丙基甲基二甲氧基矽烷、3-異氰酸酯丙基三乙氧基矽烷、3-異氰酸酯丙基甲基二乙氧基矽烷,從原料的取得容易性來看,較佳為3-異氰酸酯丙基三甲氧基矽烷或3-異氰酸酯丙基三乙氧基矽烷。Examples of the organic silicon compound having an isocyanate group include 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropylmethyldimethoxysilane, 3-isocyanatepropyltriethoxysilane, and 3-isocyanate. The propylmethyldiethoxysilane is preferably 3-isocyanatepropyltrimethoxysilane or 3-isocyanatepropyltriethoxysilane from the viewpoint of availability of raw materials.
作為上述在同一分子中具有丙烯酸基與羥基的化合物,可舉出2-羥基-3-丙烯醯氧基丙基甲基丙烯酸酯等之2官能丙烯醇、季戊四醇三丙烯酸酯、二季戊四醇五丙烯酸酯等之多官能丙烯醇。Examples of the compound having an acrylic group and a hydroxyl group in the same molecule include bifunctional acryl alcohol such as 2-hydroxy-3-propenyloxypropyl methacrylate, pentaerythritol triacrylate, and dipentaerythritol pentaacrylate. And so on.
於在1分子中具有複數的丙烯酸基之矽烷化合物之製造時,視需要可使用觸媒。觸媒係可為一般使用的異氰酸酯之反應觸媒,較佳為錫化合物。相對於具有異氰酸酯基的有機矽化合物1mol,觸媒之使用量為0.0000001~1mol,更佳為0.000001~0.01mol。超過1mol使用時,效果飽和而不經濟的。低於0.0000001mol時,觸媒效果不足,反應速度低,有生產性降低之虞。In the production of a silane compound having a plurality of acrylic groups in one molecule, a catalyst may be used as necessary. The catalyst may be a reaction catalyst of an isocyanate generally used, and a tin compound is preferred. Relative to 1 mol of an organic silicon compound having an isocyanate group, the amount of catalyst used is 0.0000001 to 1 mol, and more preferably 0.000001 to 0.01 mol. When used in excess of 1 mol, the effect is saturated and uneconomical. If it is less than 0.0000001 mol, the catalyst effect is insufficient, the reaction speed is low, and the productivity may be reduced.
於在1分子中具有複數的丙烯酸基之矽烷化合物之製造時,反應為放熱反應,若過度高溫則有發生副反應之虞。因此,製造時的較佳反應溫度為20~150℃,更佳為30~130℃,尤佳為40~110℃之範圍。低於20℃時,反應速度低,生產性降低。另一方面,超過150℃時,有發生具有異氰酸酯基的有機矽化合物之聚合反應、丙烯酸基之聚合等的副反應之虞。In the production of a silane compound having a plurality of acrylic groups in one molecule, the reaction is an exothermic reaction. If the temperature is excessively high, a side reaction may occur. Therefore, the preferred reaction temperature during manufacture is 20 to 150 ° C, more preferably 30 to 130 ° C, and even more preferably 40 to 110 ° C. When it is lower than 20 ° C, the reaction speed is low, and productivity is reduced. On the other hand, when it exceeds 150 ° C., side reactions such as polymerization reaction of an organosilicon compound having an isocyanate group and polymerization of an acrylic group may occur.
亦可將在1分子中具有複數的丙烯酸基之矽烷化合物的水解縮合物使用作為密著提高成分。作為此水解縮合之方法,可採用習知的方法。A hydrolyzed condensate of a silane compound having a plurality of acrylic groups in one molecule may be used as an adhesion-improving component. As a method of this hydrolysis condensation, a conventional method can be adopted.
作為水解縮合之觸媒,可例示鹽酸、硝酸、醋酸、馬來酸等之酸類,NaOH、KOH等之鹼金屬氫氧化物,氨、三乙胺、二丁胺、己胺、辛胺等之胺化合物,及胺化合物之鹽類、氯化苄基三乙銨、氫氧化四甲銨、氫氧化四丁銨等之四級銨鹽等的鹼類,如氟化鉀、氟化鈉之氟化鹽,固體酸性觸媒或固體鹼性觸媒(離子交換樹脂觸媒等),鐵-2-乙基己酸鹽、萘酸鈦、硬脂酸鋅、二丁基錫二乙酸鹽等之有機羧酸的金屬鹽、四丁氧基鈦、二丁氧基-(雙-2,4-戊二酮根)鈦等之有機鈦酯、四丁氧基鋯、二丁氧基-(雙-2,4-戊二酮根)鋯等之有機鋯酯、三異丙氧化鋁等的烷氧基鋁化合物、乙醯丙酮鋁錯合物等之鋁螯合化合物等之有機金屬化合物、3-胺基丙基三甲氧基矽烷、N-(β-胺基乙基)-3-胺基丙基三甲氧基矽烷等之胺基烷基取代烷氧基矽烷,可單獨或混合此等而使用。Examples of the catalyst for hydrolysis and condensation include acids such as hydrochloric acid, nitric acid, acetic acid, and maleic acid; alkali metal hydroxides such as NaOH and KOH; and ammonia, triethylamine, dibutylamine, hexylamine, and octylamine. Amine compounds, and salts of amine compounds, quaternary ammonium salts such as benzyltriethylammonium chloride, tetramethylammonium hydroxide, and tetrabutylammonium hydroxide, such as potassium fluoride and sodium fluoride fluoride Salts, solid acid catalysts or solid basic catalysts (ion exchange resin catalysts, etc.), organic carboxylic acids such as iron-2-ethylhexanoate, titanium naphthalate, zinc stearate, dibutyltin diacetate, etc. Acid metal salts, organic titanium esters of tetrabutoxy titanium, dibutoxy- (bis-2,4-pentanedione) titanium, tetrabutoxy zirconium, dibutoxy- (bis-2 , 4-pentanedionate) organic zirconium esters such as zirconium, alkoxyaluminum compounds such as triisopropyl alumina, organometallic compounds such as aluminum chelate compounds such as acetoacetone aluminum complex, and 3-amine Aminoalkyl-substituted alkoxysilanes such as propylpropyltrimethoxysilane, N- (β-aminoethyl) -3-aminopropyltrimethoxysilane, and the like can be used alone or in combination.
於上述的水解縮合觸媒、水、視需要的有機溶劑之存在下,將在1分子中具有複數的丙烯酸基之矽烷化合物予以水解縮合,而得到目的物。In the presence of the above-mentioned hydrolysis-condensation catalyst, water, and an optional organic solvent, a silane compound having a plurality of acrylic groups in one molecule is hydrolyzed and condensed to obtain a target substance.
相對於(A)成分100質量份,(C)成分之摻合量為0.1~5質量份,較佳為0.2~4質量份,更佳為0.3~3質量份。若(C)成分少於0.1質量份,則沒有密著性提高之效果,另外若多於5質量份,則沒有密著性提高之改善,再者剝離性會降低。The blending amount of the component (C) is 0.1 to 5 parts by mass, preferably 0.2 to 4 parts by mass, and more preferably 0.3 to 3 parts by mass with respect to 100 parts by mass of the component (A). If the (C) component is less than 0.1 parts by mass, there is no effect of improving adhesion, and if it is more than 5 parts by mass, there is no improvement in adhesion, and further, the peelability is reduced.
[(D)成分] (D)成分係因放射線之照射而產生自由基的自由基聚合起始劑。[Component (D)] The (D) component is a radical polymerization initiator that generates radicals by irradiation with radiation.
自由基聚合起始劑只要具有因放射線照射而產生自由基的能力,則使用係沒有特別的限定。具體而言,可舉出二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、4’-異丙基-2-羥基-2-甲基苯丙酮、2-羥基甲基-2-甲基苯丙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、對二甲基胺基苯乙酮、對第三丁基二氯苯乙酮、對第三丁基三氯苯乙酮、對疊氮基苄叉苯乙酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉代丙酮-1、2-苄基-2-二甲基胺基-1-(4-嗎啉代苯基)-丁酮-1、苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻異丙基醚、苯偶姻正丁基醚、苯偶姻異丁基醚、二苯乙二酮、聯茴香醯、二苯基酮、鄰苯甲醯基苯甲酸甲酯、米其勒酮、4,4’-雙二乙基胺基二苯基酮、4,4’-二氯二苯基酮、4-苯甲醯基-4’-甲基二苯基硫化物、噻噸酮、2-甲基噻噸酮、2-乙基噻噸酮、2-氯噻噸酮、2-異丙基噻噸酮、2,4-二乙基噻噸酮、雙(環戊二烯基)-雙(2,6-二氟-3-(吡-1-基)鈦、1-(4-(2-羥基乙氧基)苯基)-2-羥基二-2-甲基-1-丙烷-1-酮等。此等之自由基聚合起始劑係可按照所欲的性能,摻合1種或2種以上者而使用。The radical polymerization initiator is not particularly limited as long as it has the ability to generate radicals due to radiation irradiation. Specific examples thereof include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, and 4'-isopropyl-2-hydroxy-2-methylbenzene. Acetone, 2-hydroxymethyl-2-methylphenylacetone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone, p- Tributyldichloroacetophenone, p-thirdbutyltrichloroacetophenone, p-azidobenzylidene acetophenone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- ( Methylthio) phenyl] -2-morpholinoacetone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, benzoin , Benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, diphenylethylene dione, bifenthrin, Phenyl ketone, methyl o-benzoyl benzoate, Michelin, 4,4'-bisdiethylaminodiphenyl ketone, 4,4'-dichlorodiphenyl ketone, 4-benzene Methylmethyl-4'-methyldiphenylsulfide, thioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone , 2,4-diethylthioxanthone, bis (cyclopentadienyl) -bis (2,6-difluoro-3- (py-1--1-yl) titanium, 1- (4- (2- Hydroxyethoxy) phenyl) -2-hydroxydi-2-methyl-1-propane-1-one, etc. These radical polymerization initiators can be blended with one or more according to the desired performance. Use 2 or more types.
相對於(A)成分100質量份,(D)成分之摻合量為0.1~15質量份,較佳為0.5~13質量份,更佳為1~10質量份。若(C)成分少於0.1質量份,則硬化性會降低,另外若多於15質量份,則沒有硬化性的改善,再者剝離性會降低。The blending amount of the component (D) is 0.1 to 15 parts by mass, preferably 0.5 to 13 parts by mass, and more preferably 1 to 10 parts by mass with respect to 100 parts by mass of the component (A). When (C) component is less than 0.1 mass part, hardenability will fall, and when it is more than 15 mass parts, hardenability will not improve and peelability will fall.
本發明之剝離性放射線硬化性聚矽氧組成物,係藉由摻合上述成分的指定量,混合而得,但除了上述的各成分以外,作為任意成分,可使用聚矽氧樹脂、聚二甲基矽氧烷、填充劑、抗靜電劑、難燃劑、消泡劑、流動調整劑、光安定劑、溶劑、非反應性的樹脂及自由基聚合性化合物等之添加劑。任意成分之添加量係可為在不妨礙本發明的效果之範圍內的通常量。The peelable radiation-curable polysiloxane composition of the present invention is obtained by blending the specified amounts of the above-mentioned components and mixing them, but in addition to the above-mentioned components, as the optional components, polysiloxane resin, polydioxane Additives such as methylsiloxane, fillers, antistatic agents, flame retardants, defoamers, flow modifiers, light stabilizers, solvents, non-reactive resins, and radical polymerizable compounds. The addition amount of an arbitrary component may be a normal amount in the range which does not inhibit the effect of this invention.
本發明之剝離性放射線硬化性聚矽氧組成物中所謂的「剝離性」,就是指聚矽氧組成物的硬化物具有「剝離性」。「剝離性」係於下述實施例1的[剝離性放射線硬化性聚矽氧組成物的剝離力試驗1]之條件下,較佳為0.005~10.0N/25mm,更佳為0.01~8.0N/25mm。The "peelability" in the peelable radiation-curable polysiloxane composition of the present invention means that the cured product of the polysiloxane composition has "peelability". "Peelability" is under the conditions of [Peeling Force Test 1 of Peelable Radiocurable Polysiloxane Composition] of Example 1 below, preferably 0.005 to 10.0 N / 25 mm, and more preferably 0.01 to 8.0 N / 25mm.
[剝離薄片] 所調製的剝離性放射線硬化性聚矽氧組成物係塗佈於各種基材,使其放射線硬化。例如,可得到剝離性的薄片。塗佈於各種基材,使其放射線硬化。作為基材,並沒有特別的限定,可使用一般使用的各種基材,例如可舉出玻璃紙、道林紙、上等紙、聚乙烯層合紙或聚酯薄膜、聚苯乙烯薄膜、聚乙烯薄膜、聚丙烯薄膜等之塑膠薄膜、聚碳酸酯等之透明樹脂、鋁箔等之金屬箔。又,聚矽氧組成物之塗佈量亦沒有特別的限制,但通常只要0.05~3.0g/m2 左右即可。[Peeling Sheet] The prepared peelable radiation-curable polysiloxane composition is applied to various substrates and is cured by radiation. For example, a peelable sheet can be obtained. It is applied to various substrates to harden its radiation. The substrate is not particularly limited, and various substrates that are generally used can be used, and examples thereof include cellophane, dowlin paper, fine paper, polyethylene laminate paper, polyester film, polystyrene film, and polyethylene. Plastic films such as films, polypropylene films, transparent resins such as polycarbonate, metal foils such as aluminum foil. In addition, the coating amount of the polysiloxane composition is not particularly limited, but usually it is only about 0.05 to 3.0 g / m 2 .
於因放射線照射而硬化時,作為放射線能量線,較佳為使用由高壓或超高壓的水銀燈、金屬鹵化物燈、氙燈、碳弧燈、螢光燈、半導體固體雷射、氬雷射、He-Cd雷射、KrF準分子雷射、ArF準分子雷射、F2 雷射等所得之紫外~可見光區域(約100~約800nm)的能量線。較佳為在200~400nm中光線光度強之放射線光源。再者,亦可使用電子線、X射線等之具有高能量的放射線。放射線能量之照射時間通常係在常溫下0.1~10秒左右為充分,但於能量線的穿透性低時或硬化性組成物的膜厚為厚時,較佳為花費其以上的時間。若需要,在能量線之照射後,亦可在室溫~150℃加熱數秒~數小時,進行後硬化。When hardened by radiation, it is preferable to use a high- or ultra-high-pressure mercury lamp, metal halide lamp, xenon lamp, carbon arc lamp, fluorescent lamp, semiconductor solid laser, argon laser, He -Cd laser, KrF excimer laser, ArF excimer laser, F 2 laser and other energy rays in the ultraviolet to visible light region (about 100 to about 800 nm). A radiation light source having a strong light intensity in 200 to 400 nm is preferred. Furthermore, high-energy radiation such as electron beams and X-rays may be used. The irradiation time of the radiation energy is usually about 0.1 to 10 seconds at room temperature. However, when the energy ray permeability is low or the film thickness of the curable composition is thick, it is preferable to take more time. If necessary, after irradiation with energy rays, it can also be heated at room temperature to 150 ° C for several seconds to several hours for post-hardening.
剝離性放射線硬化性聚矽氧組成物係即使在空氣中也可因放射線照射而硬化,但為了提高硬化性,亦可降低氧濃度而使其硬化。由於氧濃度愈低,硬化性愈升高,故氧濃度愈低愈佳。氧濃度為1體積%,較佳為0.1體積%,更佳為0.01體積%。視情況而定,本發明之組成物亦可在有機溶劑中稀釋而使用。 [實施例]The peelable radiation-curable polysiloxane composition can be hardened by radiation irradiation even in the air, but in order to improve the hardenability, the oxygen concentration can be lowered and hardened. The lower the oxygen concentration, the higher the sclerosis, so the lower the oxygen concentration, the better. The oxygen concentration is 1% by volume, preferably 0.1% by volume, and more preferably 0.01% by volume. The composition of the present invention may be used by diluting it in an organic solvent as the case may be. [Example]
以下,顯示合成例、實施例及比較例,具體地說明本發明,惟本發明不受此所限定。又,於下述例中,表中的物性係藉由下述的試驗方法所測定者。黏度係以BN型旋轉黏度計所測定的在25℃之值。The synthesis examples, examples, and comparative examples are shown below to specifically explain the present invention, but the present invention is not limited thereto. In the following examples, the physical properties in the tables are measured by the following test methods. Viscosity is a value at 25 ° C. measured by a BN-type rotary viscometer.
本發明之剝離性放射線硬化性聚矽氧組成物之評價係用下述試驗方法進行。 [剝離性放射線硬化性聚矽氧組成物的剝離力試驗1] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。將所得之硬化皮膜在25℃保管20小時後,於該硬化皮膜表面上貼附寬度25mm的丙烯酸黏著膠帶TESA7475(商品名),使2kg的輥來回一次而進行壓接,製作剝離力測定用的樣品。對於此樣品,一邊施加70g/cm2 的荷重,一邊在70℃使其熟化20~24小時。然後,使用拉伸試驗機,以180°的角度,以0.3m/分鐘的剝離速度,拉扯所貼合的膠帶,測定剝離所需要的力(N/25mm)。表1中顯示結果。The evaluation of the peelable radiation-curable polysiloxane composition of the present invention was performed by the following test method. [Peeling force test 1 of peelable radiation-curable polysiloxane composition] After preparing the peelable radiation-curable polysiloxane composition, it was roll-coated to a thickness of about 1.7 g / m 2 . On a 38 μm polyethylene laminate paper, a high-pressure mercury lamp of 80 W / cm with two lamps was used to irradiate 100 mJ / cm 2 of ultraviolet rays to form a hardened film. After the obtained cured film was stored at 25 ° C. for 20 hours, an acrylic adhesive tape TESA7475 (trade name) having a width of 25 mm was attached to the surface of the cured film, and a 2 kg roller was pressed back and forth once to produce a pressure-measuring film. sample. This sample was aged at 70 ° C for 20 to 24 hours while applying a load of 70 g / cm 2 . Then, using a tensile tester, the attached tape was pulled at an angle of 180 ° at a peeling speed of 0.3 m / min, and the force (N / 25 mm) required for peeling was measured. The results are shown in Table 1.
[剝離性放射線硬化性聚矽氧組成物的殘留接著率試驗1] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。將所得之硬化皮膜在25℃保管20小時後,於該硬化皮膜表面上貼附寬度25mm的丙烯酸黏著膠帶TESA7475(商品名),使2kg的輥來回一次而進行壓接,製作剝離力測定用的樣品。對於此樣品,一邊施加70g/cm2 的荷重,一邊在70℃使其熟化20~24小時。然後,使用拉伸試驗機,以180°的角度,以0.3m/分鐘的剝離速度,剝離所貼合的膠帶,將該膠帶貼附於SUS板。測定使2kg的輥來回一次而進行壓接,在25℃放置30分鐘後,剝離所需要的力(Y)。同樣地測定將未貼合於上述硬化皮膜的TESA7475從SUS板剝離所需要的力(Z),將(Y)除以(Z)而得之值當作殘留接著率。表1中顯示結果。[Residual Adhesion Test of Peelable Radiation Curable Polysiloxane Composition 1] After preparing the peelable radiation curable polysiloxane composition, roll coating was performed so as to obtain a coating amount of about 1.7 g / m 2 . A hardened film was formed on a polyethylene laminated paper having a thickness of 38 μm using a high-pressure mercury lamp of 80 W / cm with two lamps and irradiating ultraviolet rays with an irradiation amount of 100 mJ / cm 2 . After the obtained cured film was stored at 25 ° C. for 20 hours, an acrylic adhesive tape TESA7475 (trade name) having a width of 25 mm was attached to the surface of the cured film, and a 2 kg roller was pressed back and forth once to produce a pressure-sensitive adhesive sample. This sample was aged at 70 ° C for 20 to 24 hours while applying a load of 70 g / cm 2 . Then, using a tensile tester, the attached tape was peeled at an angle of 180 ° and a peeling speed of 0.3 m / min, and the tape was attached to a SUS board. The force (Y) required for peeling was measured by pressing a 2 kg roll back and forth once and leaving it at 25 ° C for 30 minutes. Similarly, the force (Z) required for peeling TESA7475 not bonded to the hardened film from the SUS board was measured, and the value obtained by dividing (Y) by (Z) was taken as the residual adhesion rate. The results are shown in Table 1.
[密著性試驗1] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。以手指擦過該硬化皮膜10次後,藉由目視觀察有無混濁及脫落,用以下之基準評價。表1中顯示結果。 A:看不到混濁及脫落。 B:稍微看到混濁及脫落。 C:看到混濁或脫落。 D:未硬化。[Adhesion Test 1] After preparing a peelable radiation-curable polysiloxane composition, it was roll-coated on a polyethylene laminated paper having a thickness of 38 μm so as to have a coating amount of about 1.7 g / m 2 , and used A two-lamp 80 W / cm high-pressure mercury lamp irradiates 100 mJ / cm 2 of ultraviolet rays to form a hardened film. After the cured film was rubbed with a finger 10 times, the presence or absence of turbidity and peeling was visually observed, and evaluated by the following criteria. The results are shown in Table 1. A: No turbidity or peeling was seen. B: Cloudiness and peeling were slightly observed. C: Cloudiness or peeling was seen. D: Not hardened.
[剝離性放射線硬化性聚矽氧組成物的剝離力試驗2] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,於氧濃度為150ppm的氮氣環境中,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。將所得之硬化皮膜在25℃保管20小時後,於該硬化皮膜表面上貼附寬度25mm的丙烯酸黏著膠帶TESA7475(商品名),使2kg的輥來回一次而進行壓接,製作剝離力測定用的樣品。對於此樣品,一邊施加20g/cm2 的荷重,一邊在70℃使其熟化20~24小時。然後,使用拉伸試驗機,以180°的角度,以0.3m/分鐘的剝離速度,拉扯所貼合的膠帶,測定剝離所需要的力(N/25mm)。表2中顯示結果。[Peeling force test 2 of peelable radiation-curable polysiloxane composition] After preparing the peelable radiation-curable polysiloxane composition, it was roll-coated to a thickness of about 1.7 g / m 2 . A hardened film was formed on a polyethylene laminate paper of 38 μm in a nitrogen environment with an oxygen concentration of 150 ppm using two high-pressure mercury lamps of 80 W / cm to irradiate 100 mJ / cm 2 of ultraviolet light. After the obtained cured film was stored at 25 ° C. for 20 hours, an acrylic adhesive tape TESA7475 (trade name) having a width of 25 mm was attached to the surface of the cured film, and a 2 kg roller was pressed back and forth once to produce a pressure-measuring film. sample. This sample was aged at 70 ° C. for 20 to 24 hours while applying a load of 20 g / cm 2 . Then, using a tensile tester, the attached tape was pulled at an angle of 180 ° at a peeling speed of 0.3 m / min, and the force (N / 25 mm) required for peeling was measured. The results are shown in Table 2.
[剝離性放射線硬化性聚矽氧組成物的殘留接著率試驗2] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,於氧濃度為150ppm的氮氣環境中,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。將所得之硬化皮膜在25℃保管20小時後,於該硬化皮膜表面上貼附寬度25mm的丙烯酸黏著膠帶TESA7475(商品名),使2kg的輥來回一次而進行壓接,製作剝離力測定用的樣品。對於此樣品,一邊施加20g/cm2 的荷重,一邊在70℃使其熟化20~24小時。然後,使用拉伸試驗機,以180°的角度,以0.3m/分鐘的剝離速度,剝離所貼合的膠帶,將該膠帶貼附於SUS板。測定使2kg的輥來回一次而進行壓接,在25℃放置30分鐘後,剝離所需要的力(Y)。同樣地測定將未貼合於上述硬化皮膜的TESA7475從SUS板剝離所需要的力(Z),將(Y)除以(Z)而得之值當作殘留接著率。表2中顯示結果。[Residual Adhesion Test of Peelable Radiation Curable Polysiloxane Composition 2] After preparing the peelable radiation curable polysiloxane composition, a roll coating was performed so as to obtain a coating amount of about 1.7 g / m 2 . A hardened film was formed on a polyethylene laminated paper having a thickness of 38 μm in a nitrogen environment with an oxygen concentration of 150 ppm by using a high-pressure mercury lamp of 80 W / cm with two lamps and irradiating an ultraviolet ray with an irradiation amount of 100 mJ / cm 2 . After the obtained cured film was stored at 25 ° C. for 20 hours, an acrylic adhesive tape TESA7475 (trade name) having a width of 25 mm was attached to the surface of the cured film, and a 2 kg roller was pressed back and forth once to produce a pressure-sensitive adhesive sample. This sample was aged at 70 ° C. for 20 to 24 hours while applying a load of 20 g / cm 2 . Then, using a tensile tester, the attached tape was peeled at an angle of 180 ° and a peeling speed of 0.3 m / min, and the tape was attached to a SUS board. The force (Y) required for peeling was measured by pressing a 2 kg roll back and forth once and leaving it at 25 ° C for 30 minutes. Similarly, the force (Z) required for peeling TESA7475 not bonded to the hardened film from the SUS board was measured, and the value obtained by dividing (Y) by (Z) was taken as the residual adhesion rate. The results are shown in Table 2.
[密著性試驗2] 調製剝離性放射線硬化性聚矽氧組成物後,以成為約1.7g/m2 的塗佈量之方式,輥塗佈於厚度為38μm的聚乙烯層合紙上,於氧濃度為150ppm的氮氣環境中,使用2燈的80W/cm之高壓水銀燈,照射100mJ/cm2 的照射量之紫外線,而形成硬化皮膜。以手指擦過該硬化皮膜10次後,藉由目視觀察有無混濁及脫落,用以下之基準評價。表2中顯示結果。 A:看不到混濁及脫落。 B:稍微看到混濁及脫落。 C:看到混濁或脫落。 D:未硬化。[Adhesiveness Test 2] After preparing a peelable radiation-curable polysiloxane composition, it was roll-coated on a polyethylene laminated paper having a thickness of 38 μm so as to have a coating amount of about 1.7 g / m 2 . In a nitrogen environment with an oxygen concentration of 150 ppm, a two-lamp 80 W / cm high-pressure mercury lamp was used to irradiate 100 mJ / cm 2 of ultraviolet radiation to form a hardened film. After the cured film was rubbed with a finger 10 times, the presence or absence of turbidity and peeling was visually observed, and evaluated by the following criteria. The results are shown in Table 2. A: No turbidity or peeling was seen. B: Cloudiness and peeling were slightly observed. C: Cloudiness or peeling was seen. D: Not hardened.
[實施例1] 均勻混合: (A-1)以下述平均組成式所示的在25℃的黏度為3,500mPa・s之含有乙烯基的聚二甲基矽氧烷100質量份,(式中,Me表示甲基,Ph表示苯基,Vi表示乙烯基) (B-1)以下述平均組成式所示的在25℃的黏度為40mPa・s之含有巰基的聚二甲基矽氧烷10質量份,(式中,Me表示甲基,S表示巰基丙基) (C-1)1,6-己二醇二丙烯酸酯1.0質量份,及 (D)自由基聚合起始劑2-羥基-2-甲基-1-苯基-丙烷-1-酮3質量份, 而得到聚矽氧組成物1。[Example 1] Uniform mixing: (A-1) 100 parts by mass of a vinyl-containing polydimethylsiloxane having a viscosity of 3,500 mPa · s at 25 ° C. as shown in the following average composition formula, (In the formula, Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.) (B-1) A mercapto group-containing polydimethyl silicon having a viscosity at 25 ° C. of 40 mPa · s and represented by the following average composition formula: 10 parts by mass of oxane, (In the formula, Me represents a methyl group, and S represents a mercaptopropyl group) (C-1) 1.0 part by mass of 1,6-hexanediol diacrylate, and (D) a radical polymerization initiator 2-hydroxy-2- 3 parts by mass of methyl-1-phenyl-propane-1-one, and polysiloxane composition 1 was obtained.
[實施例2] 除了(A)成分為(A-2)以下述平均組成式所示的在25℃的黏度為800mPa・s之含有乙烯基的聚二甲基矽氧烷100質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物2。(式中,Me表示甲基,Ph表示苯基,Vi表示乙烯基)。[Example 2] Except for 100 parts by mass of a vinyl group-containing polydimethylsiloxane having a viscosity of 800 mPa · s at 25 ° C. and having a viscosity of 800 mPa · s at 25 ° C. as represented by (A) component (A-2) The same procedure as in Example 1 was performed to obtain a polysiloxane composition 2. (In the formula, Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group).
[實施例3] 除了(B)成分為(B-2)以下述平均組成式所示的在25℃的黏度為50mPa・s之含有巰基的聚二甲基矽氧烷10質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物3。(式中,Me表示甲基,S表示巰基丙基)。[Example 3] Except for 10 parts by mass of a mercapto group-containing polydimethylsiloxane having a viscosity of 50 mPa · s at 25 ° C. and represented by the following average composition formula (B-2) as the component (B-2), The same procedure as in Example 1 was performed to obtain a polysiloxane composition 3. (In the formula, Me represents a methyl group, and S represents a mercaptopropyl group.)
[實施例4] 除了(C-2)三羥甲基丙烷三丙烯酸酯為1.0質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物4。[Example 4] The same procedure as in Example 1 was carried out except that (C-2) trimethylolpropane triacrylate was 1.0 parts by mass, and a polysiloxane composition 4 was obtained.
[實施例5] 除了(A)成分為(A-2)含有乙烯基的聚二甲基矽氧烷100質量份以外,進行與實施例4同樣的程序,得到聚矽氧組成物5。[Example 5] The same procedure as in Example 4 was performed except that (A) component was (A-2) 100 parts by mass of a polydimethylsiloxane containing a vinyl group, and a polysiloxane composition 5 was obtained.
[實施例6] 除了(B)成分為(B-2)含有巰基的聚二甲基矽氧烷10質量份以外,進行與實施例4同樣的程序,得到聚矽氧組成物6。[Example 6] The same procedure as in Example 4 was performed except that (B) component was (B-2) 10 parts by mass of a polydimethylsiloxane containing a mercapto group, and a polysiloxane composition 6 was obtained.
[實施例7] 除了(C)成分為(C-3)二季戊四醇六丙烯酸酯1.0質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物7。[Example 7] The same procedure as in Example 1 was carried out except that the component (C) was 1.0 part by mass of (C-3) dipentaerythritol hexaacrylate, and a polysiloxane composition 7 was obtained.
[實施例8] 除了(A)成分為(A-2)含有乙烯基的聚二甲基矽氧烷100質量份以外,進行與實施例7同樣的程序,得到聚矽氧組成物8。[Example 8] The same procedure as in Example 7 was performed except that (A) component was (A-2) 100 parts by mass of a polydimethylsiloxane containing a vinyl group, and a polysiloxane composition 8 was obtained.
[實施例9] 除了(C)成分為(C-4)以下述通式所示的矽烷化合物1質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物9。(式中,Me表示甲基)。[Example 9] The same procedure as in Example 1 was performed except that the component (C) was (C-4) 1 part by mass of a silane compound represented by the following general formula, and a polysiloxane composition 9 was obtained. (In the formula, Me represents a methyl group).
[實施例10] 除了成為(A-2)含有乙烯基的聚二甲基矽氧烷100質量份以外,進行與實施例9同樣的程序,得到聚矽氧組成物10。[Example 10] The same procedure as in Example 9 was performed except that (A-2) 100 parts by mass of the polydimethylsiloxane containing a vinyl group was obtained, to obtain a polysiloxane composition 10.
[實施例11] 除了(C)成分為(C-5)下述通式所示的矽烷化合物1質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物11。(式中,Me表示甲基)。[Example 11] The same procedure as in Example 1 was performed except that the component (C) was 1 part by mass of a silane compound represented by the following general formula (C-5), and a polysiloxane composition 11 was obtained. (In the formula, Me represents a methyl group).
[實施例12] 除了(A)成分為(A-2)含有乙烯基的聚二甲基矽氧烷100質量份以外,進行與實施例11同樣的程序,得到聚矽氧組成物12。[Example 12] The same procedure as in Example 11 was performed except that (A) component was (A-2) 100 parts by mass of a polydimethylsiloxane containing a vinyl group, and a polysiloxane composition 12 was obtained.
[實施例13] 除了(C)成分為(C-3)二季戊四醇六丙烯酸酯3.0質量份以外,進行與實施例8同樣的程序,得到聚矽氧組成物13。[Example 13] The same procedure as in Example 8 was performed except that the component (C) was 3.0 parts by mass of (C-3) dipentaerythritol hexaacrylate, and a polysiloxane composition 13 was obtained.
[比較例1] 除了不包括實施例1中的(C-1)以外,進行與實施例1同樣的程序,得到聚矽氧組成物14。[Comparative Example 1] Except that (C-1) in Example 1 was not included, the same procedure as in Example 1 was performed to obtain a polysiloxane composition 14.
[比較例2] 除了不包括實施例2中的(C-1)以外,進行與實施例2同樣的程序,得到聚矽氧組成物15。[Comparative Example 2] Except that (C-1) in Example 2 was not included, the same procedure as in Example 2 was performed to obtain a polysiloxane composition 15.
[比較例3] 除了不包括實施例3中的(C-1)以外,進行與實施例3同樣的程序,得到聚矽氧組成物16。[Comparative Example 3] Except that (C-1) in Example 3 was not included, the same procedure as in Example 3 was performed to obtain a polysiloxane composition 16.
[比較例4] 除了代替實施例1中的(C-1),將丙烯酸4-羥基丁酯(X) 設為1質量份以外,進行與實施例1同樣的程序,得到聚矽氧組成物17。[Comparative Example 4] The same procedure as in Example 1 was carried out except that 4-hydroxybutyl acrylate (X) was replaced with 1 part by mass in place of (C-1) in Example 1 to obtain a polysiloxane composition. 17.
[比較例5] 除了代替實施例2中的(C-1),將丙烯酸4-羥基丁酯(X)設為1質量份以外,進行與實施例2同樣的程序,得到聚矽氧組成物18。[Comparative Example 5] Instead of (C-1) in Example 2, except that 4-hydroxybutyl acrylate (X) was 1 part by mass, the same procedure as in Example 2 was performed to obtain a polysiloxane composition. 18.
[比較例6] 除了將比較例4中的丙烯酸4-羥基丁酯(X)設為3質量份以外,進行與比較例4同樣的程序,得到聚矽氧組成物19。[Comparative Example 6] A polysiloxane composition 19 was obtained by performing the same procedure as in Comparative Example 4 except that the 4-hydroxybutyl acrylate (X) in Comparative Example 4 was set to 3 parts by mass.
[比較例7] 除了將比較例5中的丙烯酸4-羥基丁酯(X)設為3質量份以外,進行與比較例5同樣的程序,得到聚矽氧組成物20。比較例7係評價剝離力試驗1、殘留接著率1、密著性試驗1。[Comparative Example 7] A polysiloxane composition 20 was obtained by performing the same procedure as Comparative Example 5 except that the 4-hydroxybutyl acrylate (X) in Comparative Example 5 was 3 parts by mass. Comparative Example 7 evaluated peel force test 1, residual adhesion rate 1, and adhesion test 1.
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| EP (1) | EP3611226B1 (en) |
| JP (1) | JP7107303B2 (en) |
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| JP7414642B2 (en) * | 2020-05-27 | 2024-01-16 | 信越化学工業株式会社 | Photocurable organopolysiloxane composition for release sheet and release sheet |
| WO2022036026A1 (en) * | 2020-08-14 | 2022-02-17 | Evonik Corporation | Process for preparing free-radical cured silicone release coatings |
| US20250206995A1 (en) * | 2022-03-22 | 2025-06-26 | Lg Chem, Ltd. | Release composition |
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| US4052529A (en) * | 1976-03-03 | 1977-10-04 | Dow Corning Corporation | Radiation-curable mercaptoalkyl vinyl polydiorganosiloxanes, method of coating there with and coated article |
| US4070526A (en) * | 1976-05-20 | 1978-01-24 | Dow Corning Corporation | Radiation-curable coating compositions comprising mercaptoalkyl silicone and vinyl monomer, method of coating therewith and coated article |
| US5169879A (en) * | 1983-10-26 | 1992-12-08 | Dow Corning Corporation | Fast ultraviolet radiation curing silicone composition |
| JPS60104115A (en) * | 1983-11-09 | 1985-06-08 | Dainippon Printing Co Ltd | Ionizing radiation-curable urethane composition |
| JPS62161856A (en) * | 1986-01-09 | 1987-07-17 | Shin Etsu Chem Co Ltd | Ultraviolet-curing organopolysiloxane composition |
| JPH01230668A (en) * | 1988-03-11 | 1989-09-14 | Shin Etsu Chem Co Ltd | Radiation-curable organopolysiloxane composition |
| JP2620303B2 (en) * | 1988-05-12 | 1997-06-11 | 東芝シリコーン株式会社 | UV curable silicone resin composition for optical fiber coating |
| US5100993A (en) * | 1989-01-27 | 1992-03-31 | Shin-Etsu Chemical Co., Ltd. | UV curable compositions of organopolysiloxane containing mercaptoalkyl and phenylene groups |
| JPH04198270A (en) * | 1990-11-27 | 1992-07-17 | Toshiba Silicone Co Ltd | Photocurable silicone composition and photocurable adhesive silicone composition |
| DE69131695T2 (en) * | 1990-12-28 | 2001-02-08 | Dow Corning Corp., Midland | Process for visualizing the curing of a UV-curable composition by color change |
| DE4120418A1 (en) * | 1991-06-20 | 1992-12-24 | Wacker Chemie Gmbh | HARDENABLE ORGANO (POLY) SILOXANES |
| JPH0616944A (en) * | 1992-06-29 | 1994-01-25 | Toray Dow Corning Silicone Co Ltd | Organopolysiloxane composition for forming peelable cured coating film |
| JP3060868B2 (en) | 1994-12-09 | 2000-07-10 | 信越化学工業株式会社 | Release ultraviolet curable silicone composition and release paper |
| JP3718942B2 (en) * | 1997-02-27 | 2005-11-24 | 王子製紙株式会社 | Adhesive label for thermal recording |
| JP3394164B2 (en) | 1997-08-14 | 2003-04-07 | 信越化学工業株式会社 | Peelable UV-curable silicone composition |
| US7105584B2 (en) * | 2003-04-18 | 2006-09-12 | Nscg, Inc. | Dual-cure silicone compounds exhibiting elastomeric properties |
| KR101542637B1 (en) * | 2007-12-28 | 2015-08-06 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Copolymers of nanoparticles, vinyl monomers and silicone |
| WO2011136170A1 (en) * | 2010-04-26 | 2011-11-03 | 株式会社スリーボンド | Photocurable silicone gel composition and application thereof |
| PT2657301E (en) * | 2010-12-22 | 2015-03-25 | Momentive Performance Mat Jp | Ultraviolet-curable silicone resin composition and image display device using same |
| JP5883030B2 (en) * | 2010-12-29 | 2016-03-09 | スリーエム イノベイティブ プロパティズ カンパニー | Low tack backsize and method for silicone adhesive articles |
| JP5900253B2 (en) * | 2011-09-29 | 2016-04-06 | 信越化学工業株式会社 | (Meth) acrylic modified organopolysiloxane, radiation curable silicone composition, silicone release paper, and method for producing them |
| JP5587519B1 (en) * | 2013-05-08 | 2014-09-10 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Dam material composition for image display device and image display device using the same |
| US9732239B2 (en) * | 2013-11-11 | 2017-08-15 | Dow Corning Corporation | UV-curable silicone composition, cured products thereof, and methods of using the same |
| US9487677B2 (en) * | 2014-05-27 | 2016-11-08 | Momentive Performance Materials, Inc. | Release modifier composition |
| JP2016041774A (en) | 2014-08-14 | 2016-03-31 | 信越化学工業株式会社 | Surface-treated inorganic particles and curable resin composition |
| JP6426023B2 (en) * | 2015-02-16 | 2018-11-21 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | UV-curable silicone resin composition and image display using the same |
| JP6485262B2 (en) * | 2015-07-16 | 2019-03-20 | 信越化学工業株式会社 | Release paper or silicone composition for release film, release paper and release film |
| EP3365391A4 (en) * | 2015-10-19 | 2019-06-12 | Dow Corning Toray Co., Ltd. | Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film |
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| EP3611226A4 (en) | 2021-01-06 |
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| EP3611226B1 (en) | 2024-11-06 |
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