TW201841562A - Device for mounting electric component and method for manufacturing a display member - Google Patents

Abstract

An objective of the present invention is to provide an apparatus for mounting an electronic component, capable of mounting a flexible electronic component to a flexible display panel high precision. An apparatus (1) for mounting an electronic component includes: a stage (21) having a support part for supporting an edge part of a display panel (P) from a bottom of the edge part; a pre-compression head (41) for holding an electronic component (W) from a top of the electronic component (W); a first photographing device (43A) for photographing an alignment mark provided at the edge part of the display panel (P) from a top of the alignment mark; a second photographing device (43B) for photographing an alignment mark provided at the electronic component (W) from a bottom of the alignment mark; a control device for aligning a position of the display panel (P) with a position of the electronic component (W) based on relative position information obtained from photographed images of both of the alignment marks; and a control unit for allowing the first and second photographing devices (43A, 43B) to receive an image of a correction member (42j4) to recognize relative positional relation, and obtaining a deviation of the positional relation by comparing a recognition result with a reference value to correct the positional relation.

Description

Mounting device for electronic component and method of manufacturing display member

An embodiment of the present invention relates to an electronic component mounting device and a display member manufacturing method for mounting a flexible electronic component on the edge of a flexible display panel.

In the flat panel display market used for displays such as televisions, personal computers, smart phones, and the like, the liquid crystal display has an overwhelming popularity. In this case, in recent years, an organic EL display having a feature that it can be formed on a flexible resin film and can be bent without requiring a backlight can be made thinner, and is attracting attention in the market for small displays for portable terminal devices. Based on this, it is required to be able to suitably use an electronic component mounting device that can be assembled in an organic EL display that can be bent, that is, has flexibility.

An external wire bonding apparatus (hereinafter referred to as an OLB apparatus) for a liquid crystal display is known as a mounting device for a general electronic component (Patent Document 1). However, the OLB device used as an organic EL display is unknown. Therefore, in the mounting process of an electronic component performed when manufacturing an organic EL display, an OLB apparatus for a liquid crystal display is used instead.

An OLB device for a liquid crystal display is a device in which an electronic component is mounted on a display panel made of a glass substrate through an anisotropic conductive tape. In the mounting process of the OLB device for liquid crystal display, first, the edge of the display panel as the mounting electronic component is protruded from the table and held, and the electronic component is brought close to the edge of the display panel and held. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously photographed from the lower side of the display panel by one camera, and the relative positions of the two are recognized. Thereafter, it is held from the lower side of the edge of the display panel by a back up tool, and the display panel is aligned with the position of the electronic component according to the recognized relative position, and is heated by the anisotropic conductive tape. The electronic component is attached to the edge of the liquid crystal panel by pressurization. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2006-135082

[Problems to be solved by the invention]

When the OLB device for the above liquid crystal display is directly applied to the manufacturing process of the organic EL display, the mounting of the electronic component is performed with good precision. In other words, the inventors of the present invention have attempted to directly use the OLB device for the liquid crystal display, and to mount an electronic component on a flexible display panel (hereinafter referred to as an organic EL panel) which is a constituent element of the organic EL display, and to manufacture a display. member. Specifically, an organic EL panel having a size of 5.0 inches and a thickness of about 0.2 mm, which is widely used in smart phones, is equipped with a COF (Chip on Film) having a width of 38 mm as an electronic component. As a result, it is understood that the electronic component can be mounted with good precision in the organic EL panel only by directly using the OLB device for the liquid crystal display. Specifically, the organic EL panel for smart phones requires an installation accuracy of about ±3 μm, and it is understood that such mounting accuracy cannot be satisfied.

The inventors of the present invention confirmed the following two factors to influence the accuracy. (1. The occurrence of the sag of the edge of the organic EL panel) The display panel used for the manufacture of the liquid crystal display (hereinafter referred to as the panel for liquid crystal display) is such that the glass substrates having a thickness of 0.5 to 0.7 mm are bonded to each other. The rigidity is relatively high. Therefore, even if the edge portion of the liquid crystal display panel is held by about 10 mm from the table projection, the edge portion hardly sag due to its own weight.

On the other hand, an organic EL panel is generally used as a member for forming an organic EL element, that is, a polyimide film having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), followed by a thickness of a support member. Since it is a thin resin substrate made of a polyethylene terephthalate (PET) film of about 0.1 to 0.2 mm, the rigidity is extremely low. Further, the resin film may exhibit an elongation due to moisture absorption or a bending or undulation due to stress at the time of the above-mentioned bonding. Therefore, in the organic EL panel, when the edge portion is protruded by 10 mm from the table, the protruding edge portion is liable to sag based on its own weight. When the edge portion of the organic EL panel hangs down, the amount of sag causes the position of the alignment mark formed on the edge portion to deviate in the horizontal direction. Therefore, in the position recognition of the alignment mark of the organic EL panel by the camera, the identification position may be deviated.

The inventors of the present invention have confirmed that the edge portion of the organic EL panel is sagged at the edge portion when the substrate is protruded by 20 mm from the table and held in the same manner as in the case of the liquid crystal display panel of the same size. The position causing the alignment mark produces a positional deviation of about 4 μm in the horizontal direction (toward the stage side). Further, when the edge portion of the organic EL panel is drooped, the alignment mark is inclined with respect to the horizontal state. In the case where the oblique alignment mark is photographed from directly below, the length in the oblique direction of the photographed alignment mark is shortened compared with the case where the photograph is photographed in the horizontal state. That is, the shape of the alignment mark of the photograph is deformed due to the tilt. As a result, a shape difference is generated between the reference mark previously recorded, which also causes an error in the identification position of the alignment mark.

The inventors of the present invention confirmed that the alignment marks held at the horizontal level and the alignment marks inclined by 5° with respect to the horizontal position were compared with each other, and it was confirmed that the alignment marks having an inclination of 5° produced a large error of about 1 μm on average. In addition, the experiment of setting the alignment mark to an inclination of 5° was carried out by measuring the sag caused by the edge portion protruding from the table by 20 mm for the plurality of organic EL panels, and as a result, it was confirmed that the sag was 5° or more.

(2. Variation in reflection of light at the edge of the organic EL panel) When the alignment mark of the organic EL panel is photographed, illumination is performed from a certain lower side of the camera. The irradiation conditions (the amount of irradiation light, the irradiation angle, and the like) of the illumination are set using an organic EL panel (for example, an organic EL panel having a flat edge, hereinafter referred to as a "reference panel"), and the reference panel can be photographed well. Align the conditions of the mark. As a result, the edge portion of the organic EL panel that is actually photographed is sagged or curved, and the edge portion of the reference panel is inclined or the like. Therefore, the reflection state of the illumination at the edge of the organic EL panel is different from that of the reference panel. . As a result, there is a problem that the photographing of the alignment mark cannot be performed clearly, or the photographing cannot be performed in full. As a result of the experiment by the inventors of the present invention, it was confirmed that when the alignment mark could not be clearly photographed, the identification position was largely shifted by about 1 μm.

In order to suppress sagging or bending of the edge portion of the organic EL panel, the inventors of the present invention have processed the portion (support surface) supporting the edge portion of the organic EL panel to be flat, and formed a portion penetrating the portion corresponding to the alignment mark. a through hole for photographing up and down, and a support member that can suck and hold the edge portion is attached to the table so as to be held in a manner that does not cause sagging or bending at the edge of the organic EL panel, and in this state, the electronic component is again tried. installation. However, even if the above measures are taken, the mounting accuracy of ±3 μm cannot be sufficiently satisfied. In the result of the in-depth review, the inventors of the present invention further confirmed the following three factors.

(3. Problems with the surface precision of the organic EL panel) The resin film such as a PI film or a PET film constituting the organic EL panel is usually heated by a solution casting method or a melt extrusion method or by dissolving via a solvent. The resin is thinned and molded to be produced. The resin film thus produced is in a state of being thinned and stretched, and is a state in which a rough product (a direct state after the resin film is formed, a state in which fine processing such as polishing is not performed), and therefore, chemical or physical polishing after molding. Compared with the substrate, the surface has fine irregularities (undulations). Further, the state of the unevenness is different in one surface and the other surface of the resin film. Therefore, when the alignment mark is photographed by the camera, the direction in which the light reflected by the alignment mark proceeds differs depending on the location.

For example, in the organic EL panel, it is considered that the upper portion in which the alignment mark is formed is undulated in a shape in which the curvature is concave. The lower surface of the organic EL panel is set to a substantially horizontal plane. When the alignment mark of the organic EL panel is irradiated with light from the lower side through the through hole of the support member, the light irradiated toward the one end (left end) of the alignment mark first passes through the lower surface of the organic EL panel. At this time, the lower surface of the organic EL panel is a horizontal plane so that incident light is hardly refracted. The light that reaches the interface between the upper surface of the organic EL panel and the alignment mark is reflected in the organic EL panel, and is reflected in the interface. At this time, at the portion at the left end of the alignment mark, the surface of the organic EL panel is inclined downward toward the alignment mark (from left to right), and thus is reflected toward the outside (left direction) at a reflection angle corresponding to the inclination. Then, the reflected light is refracted obliquely with respect to the lower surface of the organic EL panel, and further proceeds to the outside (left direction).

On the other hand, the light irradiated toward the other end (right end) of the alignment mark is directed to the opposite direction at the interface of the upper surface of the organic EL panel and the alignment mark in a direction corresponding to the inclination of the upper surface of the organic EL panel. The (right direction) is reflected, and is further refracted by the lower surface of the organic EL panel and further toward the outside (right direction). When fine irregularities (undulations) are generated on the surface of the resin film on which the alignment mark is formed, the reflected light of the light irradiated toward the alignment mark M is incident on a path different from the path of the incident light. In the camera, the portion of the alignment mark M causes a different path of reflected light. They become the cause of the identification error of the alignment mark, resulting in a decrease in the position recognition accuracy of the alignment mark.

(4. Problem of light transmittance of organic EL panel) As described above, the organic EL panel is formed by bonding a PI film to a PET film by an adhesive. Therefore, when the alignment mark formed on the upper surface side of the organic EL panel is photographed from the lower surface side of the organic EL panel, the light transmittance of the organic EL panel has an influence on the recognition accuracy of the alignment mark. Specifically, no matter how the illumination is adjusted, it is difficult to clearly photograph the edge of the alignment mark.

The inventors of the present invention measured the light transmittance of the glass plate of the liquid crystal display panel and the resin substrate of the organic EL panel with respect to the portion where the alignment mark was formed, and found that the transmittance of the organic EL panel was lower than that of the liquid crystal display panel. About 7.4%. The inventors of the present invention used the liquid crystal display panel and the organic EL panel to repeat the identification of the alignment marks for each of the same liquid crystal display panel and the same organic EL panel, and confirmed the repeatability of the identification position of the alignment mark. . As a result, the error in the position recognition accuracy of the liquid crystal display panel was ±0.3 μm, whereas the position recognition accuracy in the organic EL panel caused an error of ±1.2 μm.

(5. Problems in the structure of the organic EL panel) The organic EL panel is formed by laminating a plurality of resin films of different characteristics by an adhesive or the like. Therefore, the light irradiated toward the organic EL panel is incident on the camera after passing through the interface between the different members at a plurality of times.

Here, a configuration in which a PI film having an organic EL element or an alignment mark formed on its surface is adhered to a PET film through an adhesive is considered. In the case where the alignment mark of the organic EL panel is irradiated with light from the lower side, the irradiated light passes through the interface between the air and the PET film, the interface between the PET film and the adhesive layer, and the interface between the adhesive layer and the PI film. . The light reflected by the interface between the PI film and the alignment mark is incident on the camera through the above-described respective interfaces.

As described above, based on the influence of the surface precision of the organic EL panel, when the interface between the air and the PET film is inclined, the light is obliquely incident on the lower surface of the PET film, so that light refraction is generated at the above-mentioned respective interfaces, and it is sought A path having a different path from which light reflected by the alignment mark is incident is incident on the camera. Therefore, the portion of the light refraction causes the identification position of the alignment mark to deviate. Therefore, the position recognition accuracy of the alignment mark is lowered. Fig. 11 is an image of a circular alignment mark of a photographic organic EL panel (Fig. 11 (A)) and a liquid crystal display panel (Fig. 11 (B)). It was confirmed that the deformation of the peripheral portion of the alignment mark of the organic EL panel was large.

Further, on the back side of the PI film, it is possible to form a film having high reflectance by vapor deposition or the like. In this case, light incident on the organic EL panel is almost reflected by the film. In this case, the photographing of the alignment mark cannot be performed clearly, and the position recognition accuracy is remarkably lowered. Moreover, in order to prevent charging of the organic EL panel, etc., it is possible to contain carbon particles in the PI thin film which becomes a base material. In such a case, the carbon particles block the transmission of light, and the imaging of the alignment mark becomes difficult, and the recognition cannot be performed correctly.

The present invention has been made in order to solve the problem of reducing the mounting accuracy of an electronic component caused by applying the above-described conventional OLB device for liquid crystal display to an organic EL display manufacturing process, and an object of the present invention is to provide a thermal compression bonding. In the case where a flexible display panel is provided with a flexible electronic component, the electronic component mounting device and the display member manufacturing method of the electronic component can be mounted on the display panel with good precision. [Means for solving the problem]

The mounting device for an electronic component according to the embodiment is a plurality of electrodes having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and an edge portion of the flexible display panel. In the flexible electronic component, a plurality of terminals arranged in association with the plurality of electrodes are connected to each other by the bonding member, and the electronic component is mounted on the display panel, and includes a table. The table on which the display panel is placed is provided with a support portion for supporting the edge portion on which the electronic component is mounted from the lower side, and is movable in the horizontal direction simultaneously with the support portion; The connector holds the electronic component from the upper side, and performs thermal compression bonding of the electronic component on the upper surface of the edge portion supported by the support portion, and is movable in a horizontal direction and a vertical direction. The first imaging device is on the display panel. The edge portion is supported by the support portion of the table, and is disposed on the display panel from the upper side. The second imaging device captures an alignment mark provided on the electronic component from a lower side while the electronic component is held by the thermocompression bonding member; and attaches an operation control device to the imaging device; Positioning the display panel and the electronic component in accordance with relative positional information of the display panel and the alignment mark of the electronic component obtained from the image of the first imaging device and the second imaging device a method of adjusting a relative position of the table and the hot-pressing joint, and thermally pressing the electronic component to the display panel by the hot-pressing joint according to the adjusted positional relationship, thereby The hot-pressing joint is controlled; the correcting member is used for recognizing a relative positional relationship between the first photographing device and the second photographing device; and the horizontal moving device is configured such that the position of the correcting member is sequentially located and the first The first imaging device and the second imaging device are configured such that the imaging device and the second imaging device face each other The correction member relatively moves in a horizontal direction; the memory unit stores a reference value of a relative positional relationship between the first imaging device and the second imaging device; and a correction operation control device that causes the first imaging device and the second imaging The device takes in an image of the correction member, and recognizes a relative positional relationship between the first imaging device and the second imaging device based on the captured image, and transmits the identification result and a reference value stored in the memory portion. In comparison, the deviation of the relative positional relationship between the first imaging device and the second imaging device is obtained, and the alignment position of the display panel and the electronic component is corrected based on the obtained deviation.

In the method for producing a display member according to the embodiment, the display panel having a thickness of not less than 500 μm and not more than 500 μm and having a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less is held on the table, and the above-described display panel is provided. A support portion having a plurality of electrodes of the display panel is supported from the lower side by a support portion provided on the table; and a plurality of terminals having a plurality of terminals corresponding to the plurality of electrodes and having flexibility The component is held in the holding process of the thermocompression joint; the first imaging device picks up the alignment mark provided on the edge portion of the display panel from above the display panel supported by the support portion. Photographic engineering; a second imaging project for photographing an alignment mark provided on the electronic component from a lower portion of the electronic component held by the thermocompression bonding device by a second imaging device; and photographing according to the first imaging project An image of the alignment mark of the display panel and the alignment mark of the electronic component captured by the second imaging project An image identifying a relative positional relationship between the display panel and the electronic component; and adjusting a relative position of the table and the hot press joint according to the relative positional relationship identified by the position recognition project And thermoforming the electronic component by thermocompression bonding to the display panel according to the adjusted positional relationship; the manufacturing method of the display member is repeated by performing the support project and the maintenance project In the first photographing project, the second photographing project, the position recognizing project, and the thermocompression bonding project, the electronic component is connected to the plurality of electrodes through the bonding member. In the display member of the plurality of terminals, the method for manufacturing the display member includes: a relative positional relationship between the first imaging device and the second imaging device by the first imaging device and the second imaging device The image of the identification correction member is taken in, and the first imaging device and the above (2) an identification process for identifying the relative positional relationship of the imaging device; and obtaining a deviation of the relative positional relationship between the first imaging device and the second imaging device by comparing the identification result with a predetermined reference value, The above-mentioned deviation corrects the alignment position of the display panel and the electronic component. [Effects of the Invention]

According to the mounting device of the present invention, even in a flexible display panel such as an organic EL panel, when a flexible electronic component is mounted by thermocompression bonding, the electronic component can be mounted with good precision. installation. Further, according to the method of manufacturing a display member of the present invention, it is possible to provide a display member in which an electronic component is mounted on a display panel with good precision. [Simple description of the picture]

Fig. 1 is a plan view showing an apparatus for mounting an electronic component in an embodiment. Fig. 2 is a side view showing the mounting device of the electronic component shown in Fig. 1. Fig. 3 is a perspective view showing a temporary crimping device of the mounting device of the electronic component shown in Fig. 1. Fig. 4 is a plan view showing an organic EL panel and electronic components applied to a mounting device according to an embodiment. Fig. 5 is a perspective view showing a fixing and crimping device of the mounting device for the electronic component shown in Fig. 1. FIG. 6 is a perspective view showing an example of a holder of an organic EL panel in the mounting apparatus for the electronic component shown in FIG. 1. Fig. 7 is a perspective view showing another example of the holding body of the organic EL panel in the mounting device for the electronic component shown in Fig. 1. Fig. 8 is a plan view showing an apparatus for mounting an electronic component in another embodiment. Fig. 9 is a graph showing the variation of the mounting accuracy of the first embodiment. FIG. 10 is a graph showing the variation of the mounting accuracy of Comparative Example 1. FIG. FIG. 11 is a view showing an example of an image in which a circular alignment mark of an organic EL panel and a liquid crystal display panel is photographed using a conventional OLB apparatus.

Hereinafter, an electronic component mounting device and a method of manufacturing a display member according to an embodiment will be described with reference to the drawings. The drawing is a mode representation, and the relationship between the thickness and the plane size, the ratio of the thickness of each portion, and the like may be different from the actual one. In the case where the direction of the upper and lower directions in the description is not particularly indicated, the direction in which the mounting surface of the electronic component of the display panel (organic EL panel) described later is the upper side is referred to.

[Configuration of Mounting Apparatus] Fig. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment, and Fig. 2 is a side view showing an electronic component mounting apparatus of Fig. 1. The mounting device 1 for an electronic component shown in Fig. 1 and Fig. 2 is used by a manufacturer of a constituent member (a member for display) of a display device such as an organic EL display. In other words, the mounting device 1 is used to transmit the flexible electronic component W such as COF stamped by a carrier tape T through the anisotropic conductive tape F as a bonding member. The organic EL panel P of the flexible display panel is used to manufacture a display member in which the electronic component W is mounted on the organic EL panel P.

Here, the organic EL panel P is mainly formed as a member having flexibility. As the member having flexibility, for example, PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate), or the like can be used. These components can be used by adhesive bonding. The organic EL panel P has a thickness of 20 μm or more and 500 μm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less. The organic EL panel P of the present embodiment has a configuration in which a PI film on which an organic EL element is formed is bonded to a support film, that is, a PET film, through an adhesive. The thickness (about 200 μm) of the PET film is 10 times or more with respect to the thickness of the PI film (about 10 μm), and therefore the bending elastic modulus of the organic EL panel P is almost equal to the bending elastic modulus of the PET film.

Here, the bending elastic modulus is a value measured in accordance with the test method specified in JIS K7171: Calculation method of plastic-bending property (revised edition, March 22, 2016). Specifically, the flexural modulus test is performed by a test piece having a length of 80 ± 2 mm, a width of 10.0 ± 0.2 mm, and a thickness of 4.0 ± 0.2 mm, and is supported by a deflection measuring device having a distance between fulcrums adjusted to 64 mm. The support table was lowered at a test speed of 2 mm/min to the center between the fulcrums, and the center of the test piece was flexed. The test atmosphere was set to a standard atmosphere (temperature 23 ° C / humidity 50%) prescribed by JIS K7100.

As the electronic component W, an electronic component having a flexible COF or the like can be used. The COF is a semiconductor element mounted on a flexible film substrate formed of PI (polyimine) or the like. As will be described later, the COF is formed by stamping and slicing a strip-shaped film member. In the display panel of the organic EL panel P, the electronic component W such as a COF is attached to the bonding member such as the anisotropic conductive tape F, and is used as a constituent element of a display device such as an organic EL display. The components used.

The mounting device 1 of the embodiment includes a press device 10 (10A, 10B) for pressing the electronic component W by the tape carrier T, and the electronic component W after the punching is sucked and held, and is transported while intermittently rotating. The intermittent rotation conveyance device 20 is placed at the intermittent stop position in the middle of the conveyance path of the intermittent rotation conveyance device 20, and the anisotropy of the anisotropic conductive tape F as a bonding member is adhered to the electronic component W conveyed by the intermittent rotation conveyance device 20. a conductive tape sticking device (joining member pasting device) 30; a temporary crimping device 40 that temporarily presses the electronic component W to which the anisotropic conductive tape F is adhered to the organic EL panel P through the anisotropic conductive tape F; The pressure bonding device 40 is temporarily pressed against the electronic component W of the organic EL panel P to be fixedly pressed and fixed, and the first pressure is transferred between the pressing device 10 and the intermittent rotary conveying device 20; The device 60; the second transfer device 70 that transfers the electronic component W between the intermittent rotary transfer device 20 and the temporary pressure bonding device 40; and the organic EL panel P for the temporary pressure bonding device 40 The first transport unit 80 that has been carried in; the second transport unit 90 that transports the organic EL panel P from the temporary pressure bonding device 40 to the fixed pressure bonding device 50; and the third transport that transports the organic EL panel P from the fixed pressure bonding device 50. The unit 100 further includes a pair of press device 10, an intermittent rotary transfer device 20, an anisotropic conductive tape attaching device 30, a temporary crimping device 40, a fixed crimping device 50, a first transfer device 60, and a second transfer device. 70. The control device 110 that controls the operations of the respective units such as the first transport unit 80, the second transport unit 90, and the third transport unit 100.

(Pressing Device 10) The press device 10 is a COF that is manufactured as an electronic component W from a tape carrier T, and includes a first press device 10A and a second press device 10B. The first press device 10A and the second press device 10B have the same configuration, and are disposed in a state of being reversed left and right as viewed from the front of the device. The first and second press devices 10A and 10B are alternately used, and the tape carrier T of the other press devices 10A and 10B is exchanged while one of the press devices 10A and 10B is being pressed.

Each of the first and second press devices 10A and 10B includes a supply reel 11 on which a tape carrier T before punching is wound, and a die device 12 that presses the electronic component W from the tape carrier T supplied from the supply reel 11; The winding reel 13 in which the tape carrier T after the electronic component W is punched out by the die device 12 is wound. The tape carrier T fed from the supply reel 11 is changed in direction by a plurality of guide rollers 14 and sprocket 15, and is returned to the winding reel 13 via the die device 12. Further, the sprocket 15 is disposed in the conveyance direction of the tape carrier T near the mold device 12, and can be carried by the rotation drive of a drive motor (not shown) to carry out the tape carrier T and carry out the tape carrier T and Positioning of the mold unit 12.

The mold device 12 includes an upper mold 12a and a lower mold 12b disposed to face the upper mold 12a. The upper mold 12a is provided with a punch 12c below it. On the other hand, the lower mold 12b is formed with a die hole 12d through which the punch 12c is inserted and penetrates the upper and lower sides. In a state in which the tape carrier T is supplied to the mold apparatus 12 and positioned, the upper mold 12a is moved in the vertical direction, whereby the electronic component W is punched out from the tape carrier T. Further, an adsorption hole (not shown) is provided on the front end surface of the punch 12c to constitute an electronic component W that can be sucked and held.

(Intermittent Rotary Transfer Device 20) The intermittent rotary transfer device 20 includes an indexing table 22 having a cross shape in a plan view in which four arm portions 21 having the same shape are arranged in a mutually orthogonal relationship, and an indexing table 22 is a rotationally driven portion 23 that is intermittently rotationally driven at intervals of 90 degrees. A holding head 24 that sucks and holds the electronic component W is provided at the tip end of each arm portion 21 of the index table 22 . At four stop positions A to D every 90 degrees of the index table 22, the receiving position A of the electronic component W punched by the press device 10 is taken, and the electronic component W held by the holding head 24 is positioned ( The aligning/cleaning position B of the cleaning, the bonding position C of the anisotropic conductive tape F to the electronic component W held by the holding head 24, and the electronic component W to which the anisotropic conductive tape F is adhered It is delivered to the delivery position D of the temporary crimping device 40.

(Inertial Conductive Tape Adhesive Device 30) The anisotropic conductive tape attaching device 30 includes a supply reel 31 that is provided corresponding to the adhesive position C of the intermittent rotary transfer device 20, and is wound with a belt-shaped member S. The shape member S is obtained by adhering and supporting the anisotropic conductive tape F to the release tape R; the adhesive head 32 is disposed at a position opposed to the holding head 24 which is aligned with the adhesion position C; and the recovery portion 33 The release tape R after the anisotropic conductive tape F has been removed is accommodated, and the plurality of guide portions 34 guide the tape-shaped member S supplied from the supply reel 31 to the recovery portion 33 along the conveyance path passing through the bonding position C. The chuck delivery portion 35 is disposed on the downstream side of the attachment position C of the plurality of guide portions 34 to the conveyance path of the belt-shaped member S, and reciprocates along the conveyance direction of the belt-shaped member S to cause the belt-shaped member S is intermittently conveyed to a predetermined length; and the cutting portion 36 is disposed on the upstream side of the bonding position C of the transport path of the strip-shaped member S, and only the anisotropic conductive tape F in the strip-shaped member S is cut. .

The pasting head 32 is provided with an adhesive jig 32a which is cut to a predetermined length and which is normally fed and positioned at the pasting position C, and is crimped to the holding head 24 which is positioned at the pasting position C. The terminal portion of the electronic component W; the elevation driving portion 32b moves the bonding fixture 32a up and down; and the heater 32c is built in the bonding fixture 32a, and heats the bonding fixture 32a to adhere the anisotropic conductive tape F The terminal portion of the electronic component W.

(Temperature crimping device 40) The temporary crimping device 40 is provided with a temporary crimping joint 41 as a thermocompression bonding joint, and adsorbs and holds the electronic component W to which the anisotropic conductive tape F has been adhered by the anisotropic conductive tape bonding device 30. And temporarily pressing the organic EL panel P; the table 42 to hold and position the organic EL panel P; and the position identifying unit 43 for holding the organic EL panel P held on the table 42 and holding the temporary pressure joint The relative position of the electronic component W of 41 is identified.

The temporary crimping joint 41 includes a pressurizing jig 41a that sucks and holds the electronic component W from the upper surface side thereof, a jig driving unit 41b that moves the pressurizing jig 41a in the Y, Z, and θ directions, and a built-in The heating fixture 41c that heats the pressure fixture 41a by the press jig 41a. As shown in FIG. 3, the table 42 includes a mounting portion 42a on which the organic EL panel P is placed, and is provided integrally with the mounting portion 42a, and the edge portion on which the electronic component W is mounted is provided from the lower side of the organic EL panel P. The support portion 42b that supports the table 42b and the table drive portion 42c that moves the mounting portion 42a and the support portion 42b in the X, Y, Z, and θ directions.

A plurality of adsorption holes 42e for adsorbing and holding the organic EL panel P are formed on the mounting surface 42d on which the organic EL panel P is placed in the mounting portion 42a. When the organic EL panel P is placed on the mounting surface 42d, the adsorption hole 42e is mainly disposed at a position facing the display region of the image in the organic EL panel P. In this example, an example in which the organic EL panel P is placed on the mounting surface 42d (the region surrounded by the two-dotted line in FIG. 3) is arranged in a matrix at equal intervals. However, the support portion 42b to be described later is used. When at least the edge portion of the supported organic EL panel P is flat and can be adsorbed and held, it is not necessary to adsorb and hold the entire entire region of the organic EL panel P placed on the mounting surface 42d. For example, a half or a half of the length of the organic EL panel P may be adsorbed and held from the support portion 42b side in a direction orthogonal to the edge portion. Since the adsorption hole 42e adsorbs the display region of the organic EL panel P, it is preferable to make the pore diameter smaller so that the adsorption does not cause the adsorption mark to remain in the display region. In the aperture, the relationship between the attraction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to the suction can be determined by an experiment or the like, and the size can be set so that the adsorption mark does not remain. Further, the placement surface 42d may be constituted by a vacuum chuck using a porous member such as porous ceramic.

As described above, the support portion 42b is integrally provided with the placing portion 42a, and the elongated member that supports the edge portion of the organic EL panel P is formed as a flat supporting surface 42f. The height position of the support surface 42f is set to be the same height as the height of the mounting surface 42d of the mounting portion 42a. In the support surface 42f, a plurality of adsorption holes 42g for adsorbing and holding the edge portion of the organic EL panel P are arranged in a plurality of rows along the longitudinal direction thereof. The adsorption hole 42g of the support portion 42b is also preferably smaller as the adsorption hole 42e of the mounting portion 42a. However, the portion of the organic EL panel P supported by the support portion 42b that is connected to the connection electrode of the electronic component W is not a display region. Therefore, it is not necessary to have a small aperture such as the adsorption hole 42e of the mounting portion 42a. However, when the edge portion of the organic EL panel P is deformed by suction at the portion where the alignment mark PM (Fig. 4) is formed, it becomes The reason for the reduced accuracy of position recognition is therefore not good. The pore diameter and the adsorption force of the adsorption hole 42g are preferably such that the edge of the organic EL panel P is not deformed. In addition, the arrangement interval of the adsorption holes 42g is set to be a period of unevenness due to bending or undulation generated at the edge of the organic EL panel P so that the entire edge of the organic EL panel P is in close contact with the support surface 42f. Shorter intervals are better.

Moreover, the correction member 42j is provided in the side portion of the mounting portion 42a and the support portion 42b (the side portion on the left side in the X-axis direction in Fig. 3). The correction member 42j includes a base member 42j1 having a rectangular block shape, and a concave portion 42j2 having a U-shape in a plan view in which the base member 42j1 is vertically extended in the X-axis direction of the support portion 42b. A rectangular plate 42j3 of a square shape such as glass or resin of the concave portion 42j2; and a target mark 42j4 provided at the center of the transparent plate 42j3. The target image 42j4 is imaged by the first imaging unit 43a and the pair of imaging units 43e1 and 43e2, which will be described later, so that the correction values of the relative positional deviations of the imaging units 43a, 43e1, and 43e2 can be obtained.

The table drive unit 42c is a drive unit that is formed by sequentially stacking the lower portion from the lower side, and the X-axis direction drive unit that moves the mounting portion 42a and the support portion 42b in one direction in the horizontal direction, that is, in the X-axis direction. a Y-axis direction drive unit that moves in a horizontal direction orthogonal to the X-axis direction, that is, a Y-axis direction, a Z-axis direction drive unit that moves in a Z-axis direction orthogonal to the horizontal direction, and a θ drive that rotationally moves in a horizontal plane. unit. Further, in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the table driving unit 42c is provided with a linear encoder in the X-axis direction driving unit and the Y-axis direction driving unit.

Next, the position recognizing unit 43 will be described with reference to FIGS. 3 and 4. 4 is a plan view showing a schematic configuration of the organic EL panel P and the electronic component W which are subjected to position recognition by the position recognizing unit 43. In the figure, the X-axis direction will be described as the left-right direction. The organic EL panel P has an electrode array ER formed at an edge portion thereof, and a pair of alignment marks PM respectively provided on the left and right sides of the electrode array ER. The electronic component W has a terminal row TR arranged in correspondence with the electrode row ER and a pair of alignment marks WM respectively provided on the left and right sides of the terminal row TR. The position recognizing unit 43 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment mark WM of the electronic component W.

Such a position recognizing unit 43 includes a first imaging device 43A and a second imaging device 43B. In the first imaging device 43A, the edge of the organic EL panel P is supported by the support portion 42b of the table 42, and the alignment mark PM provided on the edge of the organic EL panel P is photographed from the upper side. In the second imaging device 43B, the electronic component W is held by the temporary pressure contact 41, and the alignment mark WM provided on the electronic component W is photographed from the lower side.

The first imaging device 43A includes a first imaging unit 43a that images the alignment mark PM of the organic EL panel P by a still image method, and an image processing unit 43b that processes the image captured by the first imaging unit 43a. . The first imaging unit 43a includes a camera 43c including a CCD (Charge Coupled Device) camera and the like, and a lens barrel portion 43d including an optical unit such as a telecentric lens. The first imaging unit 43a is supported such that its position is located above the table 42 and is positioned in the vicinity of the pressure jig 41a (near the right side in FIG. 3). The pressure jig 41a has been positioned. A mark recognition position for identifying the alignment marks WM, PM of the electronic component W and the organic EL panel P. Further, the first imaging unit 43a can be fixed to a frame (not shown) that can be supported by the pressure jig 41a in the Y, Z, and θ directions, or can be fixed to a support member that is directly fixed to the gantry of the device. can.

The second imaging device 43B includes a second imaging unit 43e that images the alignment mark WM of the electronic component W in a still image mode, and an image processing unit 43f that processes the image captured by the second imaging unit 43e. Further, the image processing unit 43f may be provided separately from the image processing unit 43b, or may be used as the image processing unit 43b and the image processing unit 43f by one image processing unit, and may be used by the control device 110 to be described later. The functions of the two image processing units 43b and 43f may be.

The second imaging unit 43e includes a pair of imaging units 43e1 and 43e2 that are disposed corresponding to the arrangement interval of the pair of alignment marks WM of the electronic component W. Each of the imaging units 43e1 and 43e2 has a camera 43g and a barrel portion 43h including an optical unit. The respective imaging units 43e1 and 43e2 can individually adjust the opposing intervals of the imaging units 43e1 and 43e2 to match the arrangement intervals of the alignment marks WM of the electronic component W.

The camera 43g is supported by the X-direction moving device 43i such that the optical axis is parallel to the horizontal direction, that is, the X-axis direction. The lens barrel portion 43h that is connected to the camera 43g is provided with a turn 43j as an optical axis conversion portion that is directed upward by the optical axis, and an opening as an image pickup port corresponding to the 稜鏡43j. 43h1. The X-direction moving device 43i synchronously moves the two imaging units 43e1 and 43e2 in the opposite directions in the X-axis direction so that the arrangement interval of the openings 43h1 coincides with the arrangement interval of the alignment marks WM of the electronic component W. Although not shown, a coaxial illumination device is incorporated in the barrel portion 43h.

The image processing unit 43b of the first imaging device 43A receives the imaging signal of the camera 43c, recognizes the alignment mark PM of the organic EL panel P obtained by being taken in the imaging region, and detects the alignment mark. The information related to the location of the PM (hereinafter referred to as "location data"). The image processing unit 43b recognizes an image having a matching ratio of a critical value or more of a reference pattern of the alignment mark PM of the organic EL panel P set in advance in the captured image as an organic EL by a known pattern matching process. The alignment mark PM of the panel P. Next, the positional data of the recognized alignment mark PM is obtained from the camera coordinate system. The obtained position data is transmitted to the control device 110.

The image processing unit 43f of the second imaging device 43B receives the imaging signal of the camera 43g, recognizes the alignment mark WM of the electronic component W obtained by taking in the imaging region, and detects the position of the alignment mark WM. Relevant information (hereinafter referred to as "location data"). The image processing unit 43f recognizes an image having a matching ratio equal to or greater than a critical value of the reference pattern of the alignment mark WM of the electronic component W set in advance in the captured image as an electronic component W by a well-known pattern matching process. Alignment mark WM. Next, the positional data of the recognized alignment mark WM is obtained from the camera coordinate system. The obtained position data is transmitted to the control device 110.

(fixed crimping device 50) As shown in Fig. 5, the fixed crimping device 50 includes a table 51 for holding and positioning the organic EL panel P through which the electronic component W is temporarily pressed by the anisotropic conductive tape F. The organic EL panel P is fixed to the fixed crimping joint 52 of the electronic component W; the lower side of the fixed crimping joint 52 is disposed opposite to the fixed crimping joint 52, and is temporarily suspended in the organic EL panel P during the fixed crimping. A backup portion 53 that supports the edge of the electronic component W from below is crimped, and a position recognizing unit 54 (54a, 54b) that recognizes the position of the organic EL panel P.

The stage 51 includes a placing portion 51a on which the organic EL panel P is placed, and a table driving portion 51b that moves the placing portion 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in a plan view, and a plurality of adsorption holes 51d for adsorbing and holding the organic EL panel P are formed on the mounting surface (upper surface) 51c on which the organic EL panel P is placed. Similarly to the adsorption holes 42e of the table 42 of the temporary pressure bonding device 40, the adsorption holes 51d have a smaller aperture than the adsorption marks of the organic EL panel P. Similarly to the table driving unit 42c of the temporary pressure bonding device 40, the table driving unit 51b is a driving unit configured by sequentially laminating the following from the lower side: an X-axis direction driving unit, a Y-axis direction driving unit, and a Z-axis direction driving unit. And θ drive unit.

The fixed crimping joint 52 includes a pressurizing jig 52a that presses the electronic component W that is temporarily pressed against the organic EL panel P from the upper surface side thereof, and a jig that drives the pressurizing jig 52a to move in the Z-axis direction. The portion 52b; and a heater 52c built in the pressure fixture 52a to heat the pressure fixture 52a. The backup unit 53 includes a backup tool 53a that is provided at a position directly below the pressurizing jig 52a of the fixed press fitting 52, and has a length equal to that of the pressurizing jig 52a, and a support member 53b that supports the backup tool 53a. The upper surface of the backup tool 53a is formed as a flat surface for supporting the lower surface of the edge portion of the organic EL panel P placed on the mounting portion 51a to which the electronic component W is temporarily crimped.

The position recognition unit 54 includes a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached to the upper side of the movement range of the organic EL panel P by the table 51 at a predetermined interval, and the electronic component W is temporarily pressed against the organic EL panel P. The alignment marks provided near the both end portions of the edge portion are photographed. The interval (predetermined interval) between the first and second cameras 54a and 54b is such that the alignment marks are spaced apart from each other. In addition, the alignment mark is an alignment mark different from the alignment mark PM used for the identification of the relative position data in the temporary crimping device 40. The image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b. The position of the alignment mark is detected.

(1st delivery device 60) The 1st delivery device 60 is provided with the receiving part 61 which adsorbs and hold|maintains the electronic component W punched by the tape carrier T from the lower side, and the receiving part 61 in the press apparatus 10A, 10B. The X, Y, Z, and θ drive units 62 that move directly between the position immediately below the mold device 12 and the position directly below the holding head 24 of the intermittent rotary transfer device 20 that has been positioned at the received position A.

(Second delivery device 70) The second delivery device 70 includes a receiving portion 71 that sucks and holds the electronic component W from the lower side, and a holding portion 24 that allows the receiving portion 71 to be positioned at the delivery position D of the intermittent rotary transfer device 20 The X, Y, Z, and θ drive units 72 that move between the position immediately below and the position immediately below the temporary pressure joint 41 of the temporary crimping device 40.

(the first transport unit 80) The first transport unit 80 includes a holder 81 that sucks and holds the organic EL panel P supplied from a supply unit (not shown) from the upper side; and the holder 81 is not shown. The supply unit supplies the position of the organic EL panel P to the XZ driving unit 82 that moves between the organic EL panel P and the loading position of the table 42 of the temporary pressure bonding device 40.

As shown in FIG. 6 , the holder 81 includes an electrode surface adsorption block 81 a for adsorbing and holding an edge portion of the organic EL panel P on which the electrode array ER is formed, and the electrode array ER is used as the mounting electronic component W; The electrode surface adsorption block 81a is disposed adjacent to each other, and the display region adsorption portion 81b that adsorbs and holds a portion other than the portion of the organic EL panel P that is adsorbed by the electrode surface adsorption block 81a. The electrode surface adsorption block 81a is formed so as to be capable of adsorbing and holding the entire area of the edge portion of the organic EL panel P in which the electrode array ER is formed, and is a member having a rectangular parallelepiped shape that is long along the edge portion. The adsorption surface 81c of the electrode surface adsorption block 81a is formed flat, and a plurality of adsorption holes 81d are provided. Similarly to the support portion 42b of the temporary pressure bonding device 40, the size of the aperture of the adsorption hole 81d is such that the edge of the organic EL panel P is not deformed, and the edge of the electrode array ER can be formed on the organic EL panel P. Adsorption retention is performed flat. The display region adsorption portion 81b is formed of a flat porous body or a sponge, and has a plurality of adsorption holes. The adsorption surface of the electrode surface adsorption block 81a and the display region adsorption portion 81b is adjusted so as to be located on the same plane.

One display area adsorption unit 81b is shown in FIG. 6, and a plurality of display area adsorption units 81b may be arranged in parallel. As shown in Fig. 7, the display region adsorption portion 81b is in a direction intersecting with the longitudinal direction of the electrode surface adsorption block 81a (the direction of the edge portion of the organic EL panel P held by the electrode surface adsorption block 81a) (in this embodiment, Two orthogonal directions are arranged side by side. The two display region adsorption portions 81b are supported by the main body portion 81e of the holder 81 so as to be freely adjustable from the gap between the electrode surface adsorption blocks 81a. The display region adsorption portion 81b includes a base portion 81b1 made of a metal such as aluminum, and a flat porous body covering the surface of the base portion 81b1 that holds the organic EL panel P (hereinafter referred to as "below"). Slice 81b2. In the base portion 81b1, a substantially lattice-shaped suction groove that communicates with the vacuum suction hole is formed on the lower surface thereof, and the vacuum suction force can be applied to the entire region of the porous sheet 81b2 provided on the lower surface of the porous portion 81b2, and the porous sheet 81b2 can be applied to the porous sheet 81b2. The entire area holds the organic EL panel P flatly with a substantially uniform attraction. For the porous sheet 81b2, for example, a porous molded body of a resin can be processed into a film shape. With this configuration, the holding body 81 can be adsorbed and held flat and without causing adsorption marks even in the thin organic film panel P having a thin film shape.

When the organic EL panel P is placed on the stage 42 of the temporary pressure bonding apparatus 40, the electrode surface adsorption block 81a presses the upper surface (electrode surface) of the edge portion of the organic EL panel P on which the electrode is formed, on the stage 42. Support portion 42b. Therefore, the electrode surface of the organic EL panel P is sandwiched between the flat adsorption surface 81c of the electrode surface adsorption block 81a and the flat support surface 42f of the support portion 42b, and is adsorbed and held in a state of being flatly corrected. Part 42b. In addition, the organic EL panel P is in contact with the mounting surface 42d of the mounting portion 42a in a state where the display region adsorption portion 81b is in a state where the organic EL panel P is flatly adsorbed and held. Therefore, the organic EL panel P does not have an electrode surface. Wrinkles and the like are generated and adsorbed and held by the placing portion 42a.

(Second transport unit 90) The second transport unit 90 includes a holder 91 that sucks and holds the organic EL panel P in which the electronic component W is temporarily pressed by the temporary pressure bonding device 40 from the upper side, and an XZ drive unit 92. This holding body 91 moves between the unloading position where the organic EL panel P is carried out from the table 42 of the temporary pressure bonding device 40 and the loading position of the organic EL panel P to the table 51 of the fixed pressure bonding device 50. The holding body 91 includes a display region adsorption portion formed by adsorbing and holding substantially the entire region of the upper surface of the organic EL panel P, and having a flat porous body. The display region adsorption portion is configured in the same manner as the display region adsorption portion 81b of the holder 81.

(the third transport unit 100) The third transport unit 100 includes a holder 101 that adsorbs and holds the organic EL panel P to which the electronic component W is fixed and crimped by the fixed crimping device 50, that is, the display member is sucked and held from the upper side; The XZ drive unit 102 that moves the holding body 101 between the carry-out position where the organic EL panel P is carried out from the table 51 of the fixed crimping device 50 and the transfer position to the unloading device (not shown).

(Control Device 110) The control device 110 also serves as a control unit (mounting operation control device) for mounting the electronic component W of the organic EL panel P, and a relative position of the first imaging device 43A and the second imaging device 43B, which will be described later. A control unit (correction operation control device) that controls the correction operation for correcting the relationship. The control device 110 includes a storage unit 111. The memory unit 111 stores, for example, various types of information for controlling the respective units such as the load of the temporary pressure bonding device 40, the heating temperature, or the reference position information of the alignment marks PM and WM. In the memory unit 111, the time interval in which the image of the target mark 42j4 as the correction member is taken in by the first imaging device 43A and the second imaging device 43B is stored as a time interval or the number of times the electronic component W is mounted (installation) number). Here, as the time interval at which the image is taken in, the elapsed time after the mounting of the first electronic component W is performed is set, for example, every 10 minutes or every 30 minutes. The number of installations is set to the number of installations (may also be the number of installations) after the installation of the first electronic component W, for example, every 100 times or every 300 times.

The first and second imaging devices 43A and 43B can take in the image of the target mark 42j4, and can repeat the same time interval or the same number of installations, or increase the interval or the number of times by each time. . For example, in the case where the expansion caused by the heat of the heater 41c built in the press jig 41a causes the relative positional relationship of the photographing portions 43a, 43e1, and 43e2 to change, it is considered that the temperature of the heater 41c is maintained at a certain temperature and then thermally expanded. It becomes saturated, so the time interval or the number of installations may be gradually increased in accordance with the increase in the amount of thermal expansion. On the other hand, when the change in the relative positional relationship between the image capturing units 43a, 43e1, and 43e2 is not saturated, and the temperature is continuously changed, the time interval or the number of times of mounting may be fixed to a predetermined value.

The control device 110 executes the capture of the image of the target mark 42j4 by the first and second imaging devices 43A and 43B in accordance with the time interval or the number of times of storage stored in the storage unit 111. For example, when the memory unit 111 sets a time interval of 30 minutes, the measurement is started from the time when the first electronic component W is mounted, and the image of the target mark 42j4 is taken every 30 minutes, for the first and the first The relative positional relationship between the three imaging units 43a, 43e1, and 43e2 of the imaging devices 43A and 43B is recognized.

[Operation of Mounting Device] Next, the operation of the mounting device 1 of the embodiment will be described. First, the tape carrier T is supplied from the supply reel 11 of the first press device 10A, and the electronic component W is punched by the tape carrier T by the die device 12. The punched electronic component W is adsorbed and held by the punch 12c. The electronic component W held by the punch 12c is delivered to the receiving portion 61 of the first delivery device 60, and is transferred to the receiving position A of the intermittent rotary conveying device 20 by the first delivery device 60. The electronic component W transferred to the received position A is delivered to the holding head 24 of the intermittent rotary conveying device 20 that has been positioned at the receiving position A. Further, in the middle of transferring the electronic component W to the receiving position A, the first transfer device 60 rotates the direction of the electronic component W by 90° so that the edge portion of the terminal row TR and the edge are positioned at the receiving position A. The direction of the outer side of the holding head 24 (Y direction) is aligned.

The electronic component W held by the holding head 24 is sequentially transferred to the calibration/cleaning position B, the pasting position C, and the delivery position D by the intermittent rotation of the indexing table 22. In the transfer/cleaning position B, the electronic component W is positioned by abutting with a positioning mechanism (not shown), and is attached to the terminal by a cleaning mechanism such as a rotating brush (not shown). The cleaning of the dust. Further, in the pasting position C, the anisotropic conductive tape F is adhered to the terminal portion of the electronic component W by the anisotropic conductive tape bonding device 30. Positioning and cleaning at the calibration/cleaning position B. After the electronic component W to which the anisotropic conductive tape F is attached is positioned at the transfer position D, the electronic component W is handed over to the second transfer at the transfer position D. The receiving portion 71 of the device 70. The electronic component W that has been transferred to the receiving portion 71 is transferred to a position directly below the temporary pressure fitting 41 of the temporary pressure bonding device 40, and is transferred to the temporary pressure fitting 41.

On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out by the holding body 81 of the first conveying unit 80 from the supply unit (not shown), and the table 42 placed on the temporary pressure bonding device 40 is supplied. First, the holder 81 of the first conveying unit 80 is moved to a supply unit (not shown), and the holding surface of the holder 81, that is, the adsorption surface 81c of the electrode surface adsorption block 81a and the adsorption surface of the display region adsorption unit 81b are brought into contact with each other. The upper surface of the organic EL panel P that has been prepared in the supply unit. At this time, the adsorption force of the electrode surface adsorption block 81a and the display region adsorption portion 81b is applied in a state where the organic EL panel P is gently pushed by the holding body 81. In this way, even if the organic EL panel P is bent or bent, the organic EL panel P can be held by the holder 81 in a flat state.

The organic EL panel P held by the holding body 81 is conveyed to the table 42 of the temporary pressure bonding device 40. At this time, the table 42 of the temporary pressure bonding device 40 is positioned at a supply position (a position indicated by a dotted line in FIG. 1) that receives the supply of the organic EL panel P from the holder 81. The organic EL panel P transferred to the table 42 is placed on the table 42. At this time, the organic EL panel P is attached to the table 42 and flattened by the lowering of the holding body 81.

More specifically, the organic EL panel P is adsorbed and held by the adsorption surface 81c of the electrode surface adsorption block 81a of the holder 81, and the display region is adsorbed and held by the display region adsorption portion 81b, and is flattened by them. The status is maintained. In this state, the organic EL panel P is pressed against the table 42. Therefore, the organic EL panel P is sandwiched between the adsorption surface 81c of the electrode surface adsorption block 81a of the holder 81 and the adsorption surface of the display region adsorption portion 81b. The support surface 42f of the support portion 42b of the table 42 and the mounting surface 42d of the mounting portion 42a are disposed. Therefore, the organic EL panel P is transferred to the stage 42 while being maintained in a flattened state, and is adsorbed and held on the stage 42.

At this time, in a state where the organic EL panel P is pressed against the table 42, the suction hole 42g of the support portion 42b of the table 42 and the suction hole 42e of the mounting portion 42a are attracted to each other, and then the holding body 81 is released. The attraction force of the electrode surface adsorption block 81a and the display region adsorption portion 81b may be the same, or the attraction force of the holder 81 may be released before the table 42 is attracted to the suction force. In this way, the restraint in the surface direction of the organic EL panel P between the table 42 and the holder 81 is reduced, and therefore, in the case where the holder 81 is held in a state of being bent or bent, the The bending or flexing can be expected to be flattened by the grip correction. Therefore, it is preferable that the holding body 81 is pressed against the force of the table 42 so as not to hinder the above-described correction.

After the organic EL panel P is held by the stage 42, the holding body 81 moves to a supply unit (not shown). The table 42 is moved to a temporary crimping position where the temporary pressure joint 41 is executed. In the process of the movement, the left and right alignment marks PM of the organic EL panel P are moved so as to be positioned directly below the first imaging unit 43a (mark recognition position). Each time the alignment mark PM of the organic EL panel P is positioned directly below, the first imaging unit 43a takes in an image of the organic EL panel P including the alignment mark PM. The captured image of the acquired alignment mark PM is sent to the image processing unit 43b, and processed by the image processing unit 43b to obtain the positional material of each alignment mark PM. The determined position data is transmitted to the control device 110. The organic EL panel P supported by the table 42 is positioned at a temporary pressure contact position for temporarily crimping the electronic component W after the identification of the position data of each alignment mark PM is completed.

On the other hand, the temporary crimping joint 41 holding the electronic component W is moved by the second delivery device 70 from the delivery position of the received electronic component W to the temporary crimping position. During the movement, the electronic component W is moved to the mark recognition position. In order to photograph the alignment mark PM of the organic EL panel P from the upper first imaging device 43A and the alignment mark WM of the electronic component W from the lower second imaging device 43B, the organic EL positioned at the mark identification position is used. The panel P and the electronic component W are in a state of being slightly separated in the horizontal direction as shown in FIG. 4 . That is, the electronic component W of the mark identification position is formed adjacent to the electrode surface of the organic EL panel P which has been positioned at the mark recognition position as shown in FIG. 4, and the edge portion in which the terminal row TR is formed is formed in the horizontal direction. The edge of the electrode row ER is positioned in the opposite direction, and the lower surface of the electronic component W is positioned in a vertical (upper and lower) direction so as to be slightly higher than the position of the electrode surface of the organic EL panel P.

After the electronic component W is positioned at the mark recognition position, the camera 43g of the second imaging device 43B photographs the alignment mark WM of the electronic component W. In other words, the arrangement interval of the openings 43h1 in the pair of imaging units 43e1 and 43e2 of the second imaging device 43B is adjusted to match the arrangement interval of the alignment marks WM of the electronic component W. Therefore, each of the alignment marks WM of the electronic component W that has been positioned at the mark recognition position is in a state of being positioned above the corresponding opening 43h1. In this state, the pair of imaging units 43e1 and 43e2 simultaneously take in the image of the alignment mark WM of the electronic component W. Next, the image of the two alignment marks WM taken in is transferred to the image processing unit 43f, and the position data of the two alignment marks WM is obtained by the image processing unit 43f. The determined position data is transmitted to the control device 110.

The control device 110 is based on the positional data of the left and right alignment marks PM of the organic EL panel P transmitted from the image processing unit 43b and the positional data of the left and right alignment marks WM of the electronic component W transmitted from the image processing unit 43f. The relative positional deviation of the organic EL panel P and the electronic component W in the X, Y, and θ directions is obtained. The organic EL panel P and the organic EL panel P are controlled while moving the organic EL panel P to the temporary pressure-bonding position by controlling the relative positional deviation and the manner in which the positional deviation is eliminated. The position of the electronic component W is aligned.

Specifically, the control device 110 obtains the coordinates of the midpoints of the line points connecting the two points of the organic EL panel P by the positional data of the left and right alignment marks PM of the organic EL panel P (XP, YP). ). Moreover, the control device 110 obtains the coordinates (XW, YW) of the inclination θW of the line points connecting the two points and the midpoint of the line points from the position data of the right and left alignment marks WM of the electronic component W. Here, the difference between the obtained inclination and the coordinates of the midpoint is obtained as the relative positional deviation between the two. The positional deviation correction is performed by the obtained relative position deviation as follows.

First, even if the difference between the inclination θP of the line between the alignment marks PM connecting the organic EL panel P and the inclination θW of the line between the alignment marks WM of the electronic component W is eliminated, even if it becomes θP- The θW=0 is such that the pressurizing jig 41a is rotated in the θ direction. Next, the table 42 (work table) is placed such that the midpoint of the line between the alignment marks PM connecting the organic EL panels P coincides with the midpoint of the line between the alignment marks WM that connect the electronic components W. The drive unit 42c) is driven. At this time, when the center of rotation of the pressing jig 41a in the θ direction is displaced from the position of the midpoint of the line connecting the alignment marks WM of the electronic component W, the pressing jig 41a is used. The rotation of the center point of the line is shifted in the horizontal direction from the rotating portion of the pressing jig 41a, so that the positional deviation amount is taken into consideration in the execution of the moving position of the organic EL panel P.

After the positional deviation of the organic EL panel P and the electronic component W is corrected, the jig 41a is pressed by the driving of the jig driving unit 41b. In this way, the terminal portion of the electronic component W heats and presses the electrode surface of the organic EL panel P through the anisotropic conductive tape F in accordance with the heating temperature, the pressing force, and the pressurization time set in advance, and the electronic component W is temporarily crimped. The organic EL panel P having the edge portion of the electrode row ER supported by the support portion 42b from the lower side. At this time, a backup member that supports the support portion 42b of the table 42 from the lower side is provided, and the backup member may support the support portion 42b from the lower side when the backup member is temporarily crimped. In this way, it is possible to prevent the table 42 from being deflected due to the pressurization, so that the rigidity of the table 42 can be reduced to achieve weight reduction. The load when the table 42 is moved can be reduced, the vibration during movement can be reduced, and the movement and positioning can be performed stably and quickly.

After the pressurization time set in advance has elapsed, the pressurization of the electronic component W by the pressurizing jig 41a is released, and the pressurizing jig 41a is raised. The pressurizing jig 41a moves to the delivery position where the electronic component W is delivered from the second transfer device 70. In addition, the stage 42 on which the organic EL panel P of the electronic component W is temporarily pressed is placed, and the organic EL panel P is transferred to the carry-out position of the second transport unit 90. In the carry-out position, the organic EL panel P is adsorbed and held in the same manner as the holding body 81 of the first transport unit 80 by the holding body 91 of the second transport unit 90, and is fixedly crimped. The table 51 of the apparatus 50 is transported.

The organic EL panel P supplied to the fixed pressure bonding device 50 by the second conveying unit 90 is delivered to the table 51 that has been positioned at the loading position, and is adsorbed and held on the table 51. The operation at the time of the transfer is performed in the same manner as the transfer of the organic EL panel P from the first transfer unit 80 to the table 42. However, there is a difference in the point at which the edge portion of the organic EL panel P in which the electronic component W is temporarily pressed is protruded from the stage 51.

After the organic EL panel P is held on the table 51, the table 51 moves the edge of the organic EL panel P to the upper surface of the backup tool 53a. Further, in the middle of the movement, the position recognition unit 54 performs position recognition of the alignment mark (marker different from the alignment mark PM) of the organic EL panel P. Based on the position recognition result, the table 51 moves in such a manner that the electrode surface of the organic EL panel P and the upper surface of the backup tool 53a are in the correct positional relationship. After the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressurizing fixture 52a is lowered by the driving of the jig driving unit 52b, and the heating temperature, the pressing force, and the pressurizing time set in advance are used. The electronic component W temporarily crimped to the organic EL panel P performs fixed crimping.

After the pressurization time set in advance, the pressurizing jig 52a rises. In addition, the organic EL panel P to which the electronic component W is fixed, that is, the table 51 on which the display member is placed is moved to the carry-out position where the organic EL panel P is transferred to the third transport unit 100. At the carry-out position, the organic EL panel P is sucked and held by the holder 101 of the third transport unit 100, and is transported to a carry-out device (not shown).

The mounting operation of the temporary crimping process and the fixed crimping work of the organic EL panel P including the electronic component W described above is repeated until the organic EL panel P to which the electronic component W is to be mounted does not exist. Further, in the mounting device 1 of the embodiment, it is important to improve the positional accuracy in the temporary crimping process, and it is important to increase the pressure-bonding strength or the reliability of the anisotropic conductive tape F in the fixed crimping process. There are also differences in engineering time. Therefore, by applying the temporary crimping device 40 and the fixed crimping device 50, the temporary crimping process and the fixed crimping process are performed, and the mounting efficiency of the electronic component W can be improved. However, the mounting device 1 of the embodiment is not limited to such a configuration. It is also possible to perform the positioning work to the fixed crimping work in the fixed crimping device 50. In this case, the support portion 42b and the backup portion 53 are provided in parallel on the table 51 of the fixed crimping device 50.

In the process of mounting the electronic component W described above, the control device 110 executes the capture of the image of the target mark 42j4 by the photographing units 43a, 43e1, and 43e2 every time the time interval or the number of times of storage by the storage unit 111 is passed. The correction operation for correcting the positional deviation of the imaging units 43a, 43e1, and 43e2 is performed based on the image data of the target mark 42j4 taken in by the imaging units 43a, 43e1, and 43e2. In other words, when the position of the organic EL panel P and the electronic component W is aligned, the edge portion of the organic EL panel P is supported from the lower side by the support portion 42b, and the alignment of the organic EL panel P is photographed by the first imaging device 43A on the upper side. By marking the PM, the second imaging device 43B on the lower side photographs the alignment mark WM of the electronic component W, and accordingly, as described later in detail, it is possible to suppress the sagging and edge portion of the edge portion of the organic EL panel by the conventional OLB device. The positional recognition is caused by a decrease in the mounting accuracy caused by a change in the reflection of light or the like, or by simultaneously photographing the alignment mark on the upper surface of the organic EL panel and the alignment mark on the lower surface of the electronic component by one camera on the lower side. The mounting accuracy of the surface of the organic EL panel is lowered based on the surface precision, the light transmittance, and the structure of the organic EL panel.

As described above, the alignment mark PM of the organic EL panel P is imaged by the first first imaging device 43A, and the alignment mark WM of the electronic component W is imaged by the lower second imaging device 43B. The relative positions of the organic EL panel P and the electronic component W are identified and aligned according to the image information of the alignment marks, whereby the mounting accuracy within ±3 μm can be obtained. However, the mounting accuracy may be lowered over time when such an installation process is continuously performed. The inventors of the present invention measured the mounting accuracy of the electronic component W after repeating the continuous mounting operation for about 5 hours without performing the correcting operation of the photographing unit, and as a result, it was confirmed that the mounting accuracy was lowered as time passed.

Specifically, the time (working time) required for mounting one electronic component W was set to 10 seconds, and the mounting accuracy at the time of three hours and five hours passed after the start of mounting was measured. As a result, the mounting position is shifted after the start of mounting, that is, the relative positional deviation (X, Y, θ) of the organic EL panel P and the electronic component W is (-0.4 μm, 1.3 μm, -0.0059°), and the mounting accuracy is within ±3 μm. . At the time point of the passage of 3 hours, the mounting position deviation became (1.4 μm, -3.5 μm, -0.0063 °), and the mounting accuracy was more than ±3 μm. In addition, the mounting accuracy at the time of the passage of 5 hours was (2.6 μm, -4.1 μm, -0.0067°), and the mounting accuracy was further increased to more than ±3 μm. Such a mounting accuracy is lowered as time passes, and the sudden decrease in mounting accuracy occurs when the alignment marks PM and WM of the organic EL panel P and the electronic component W are simultaneously photographed by one camera. Therefore, it is considered that by using the upper and lower two photographing devices 43A, 43B, since the relative positions of the photographing devices 43A, 43B are deviated, the mounting accuracy is lowered as time passes. Therefore, in the mounting apparatus 1 of the embodiment, the correction of the positional deviation of the imaging units 43a, 43e1, and 43e2 is performed based on the image data of the target mark 42j4 taken in the imaging units 43a, 43e1, and 43e2.

When the image is taken in, first, the table driving unit 42c is controlled to move the target mark 42j4 to a predetermined position (XY coordinate) directly below the barrel portion 43d of the first imaging unit 43a in Fig. 3 . . Next, when the target mark 42j4 is positioned directly below the barrel portion 43d, the target unit 42j4 is photographed by the first photographing unit 43a. The image processing unit 43b detects the data related to the position of the target mark 42j4 (hereinafter referred to as "position data") based on the captured image of the first imaging unit 43a. Here, the location data is an XY coordinate. When the position of the first imaging unit 43a does not deviate, the position data coincides with the coordinate of the movement position of the target mark 42j4. Further, the image processing unit 43b performs the detection of the positional data of the alignment mark PM, and also has the function of detecting the positional data of the target mark 42j4. The position data of the target mark 42j4 thus detected is transmitted to the control device 110.

After the imaging of the target mark 42j4 is completed, the first imaging unit 43a moves the target mark 42j4 to the position of the predetermined position on the straight side of the opening 43h1 of the imaging unit 43e1 on the right side of FIG. 3, and the table driving unit 42c performs the table driving unit 42c. control. Next, after the target mark 42j4 is positioned directly above the opening 43h1, the target mark 42j4 is photographed by the photographing unit 43e1. Similarly to the image processing unit 43b, the image processing unit 43f detects the positional data of the target mark 42j4 based on the captured image of the imaging unit 43e1, and transmits it to the control device 110. Here, the image processing unit 43f is also a function that detects the positional data of the target mark 42j4.

When the imaging unit 43e1 has finished the imaging of the target mark 42j4, the target mark 42j4 is moved to the position of the predetermined position directly above the opening 43h1 of the imaging unit 43e2 on the left side of the drawing in FIG. 42c performs control. Next, after the target mark 42j4 is positioned directly above the opening 43h1, the target mark 42j4 is photographed by the photographing unit 43e2. Similarly to the above, the image processing unit 43f detects the positional data of the target mark 42j4 based on the captured image of the imaging unit 43e2 and transmits it to the control device 110. Further, the table driving unit 42c also serves as a driving device for the table 42 of the organic EL panel P during the mounting operation, and a moving device for the first and second imaging devices 43A and 43B and the target mark 42j4 during the correcting operation (horizontal movement) Device).

After the detection of the position data of the target mark 42j4 by each of the image capturing units 43a, 43e1, and 43e2 is completed, the control device 110 obtains the deviation of the relative positions of the respective image capturing units 43a, 43e1, and 43e2. In other words, the reference position of the target mark 42j4 is previously stored in the storage unit 111 for each of the imaging units 43a, 43e1, and 43e2. In the present embodiment, the reference position is an XY coordinate, and the XY coordinates can be identified by using the respective imaging units 43a, 43e1, and 43e2 and the position of the target mark 42j4 in the same manner as described above, for example, before the start of mounting of the electronic component W. Acquired.

The control device 110 compares the position data of the target mark 42j4 of each of the image capturing units 43a, 43e1, and 43e2 actually detected, and the reference position corresponding thereto, and obtains the relative positional deviation of each of the image capturing units 43a, 43e1, and 43e2 from the reference position. . Next, the relative positional deviation obtained by each of the imaging units 43a, 43e1, and 43e2 is stored in the storage unit 111 as a correction value for each of the imaging units 43a, 43e1, and 43e2. The correction value stored in the memory unit 111 is used to determine the relative positional deviation of the organic EL panel P and the electronic component W in the X, Y, and θ directions.

In other words, the positional data of the alignment mark PM of the organic EL panel P and the positional data of the alignment mark WM of the electronic component W are obtained by the first imaging device 43A and the second imaging device 43B, and their positional data is obtained. Transfer to control device 110. The relative positional deviation of the organic EL panel P and the electronic component W in the X, Y, and θ directions is obtained by the control device 110. At this time, if the correction value is stored in the storage unit 111, the control device 110 corrects the positional data of each of the alignment marks PM and WM transmitted from the respective imaging devices 43A and 43B in accordance with the correction value stored in the storage unit 111.

More specifically, the positional data of the left and right alignment marks PM of the organic EL panel P recognized by the first imaging device 43A is corrected by using the corrected value stored as the correction value of the imaging unit 43a to obtain correction. The value is set to the position data (correction position data). Among the alignment marks WM of the electronic component W recognized by the second imaging device 43B, the positional material of the right alignment mark WM recognized by the imaging unit 43e1 is memorized using the correction value as the imaging unit 43e1. The correction value is corrected to obtain the value of the correction, and the value of the correction is set as the position data (correction position data). In addition, the position data of the left alignment mark WM recognized by the imaging unit 43e2 is corrected by the correction value stored as the correction value of the imaging unit 43e2, and the correction value is obtained, and the correction value is set. For location data (correction location data).

The relative positional deviation of the organic EL panel P and the electronic component W in the X, Y, and θ directions is obtained based on the corrected position data of each of the alignment marks PM and WM thus obtained. Further, the positional data detected by each of the imaging units 43a, 43e1, and 43e2 is stored in the storage unit 111 as a new reference position, and the reference position of the memory is updated accordingly. In other words, the reference position is updated at any time for the acquisition timing of the image of the target mark 42j4 by each of the imaging units 43a, 43e1, and 43e2.

[Operation and Effect of the Mounting Device] According to the mounting device 1 of the above-described embodiment, the stage 42 including the supporting portion 42b is provided with the flexible organic EL panel P as the edge portion from which the electronic component W is mounted from the lower side. By the first imaging unit 43a of the first imaging device 43A, the alignment mark PM of the organic EL panel P supported by the pair of the table 42 is imaged from above, and the second imaging device 43B is used. The pair of imaging units 43e1 and 43e2 photograph the alignment mark WM of the electronic component W held in the state of the temporary pressure contact 41 from below. Then, according to the photographic images, the relative positional relationship between the organic EL panel P and the electronic component W is recognized, and the positional alignment of the organic EL panel P and the electronic component W is performed according to the recognized relative positional relationship, and the anisotropic conduction is performed. After the electronic component W is temporarily crimped to the organic EL panel P by the tape F, the pressure bonding is performed.

Further, the target unit 42j4 provided on the table 42 is imaged by the first imaging unit 43a of the first imaging device 43A and the pair of imaging units 43e1 and 43e2 of the second imaging device 43B at the timing stored in the memory unit 111. The relative positional relationship between the first imaging unit 43a of the first imaging device 43A and the pair of imaging units 43e1 and 43e2 of the second imaging device 43B is recognized, and the organic EL panel P and the electronic component W are identified based on the identification result. The alignment position is corrected.

With such a configuration, when the relative position data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W is detected, the edge of the organic EL panel P on which the electrode is formed passes through the stage. The support portion 42b of 42 is supported. Therefore, the sag of the edge portion of the organic EL panel P can be prevented, and the position recognition accuracy of the alignment mark PM provided at the edge portion can be improved. Moreover, the alignment mark PM of the organic EL panel P is photographed from the upper side, and the alignment mark WM of the electronic component W is photographed from the lower side. Therefore, the alignment mark PM formed on the upper surface of the organic EL panel P can be imaged without interposing the resin such as PI or PET constituting the organic EL panel P, so that the alignment mark PM can be photographed stably and clearly.

In addition, the relative positions of the first imaging unit 43a of the first imaging device 43A and the pair of imaging devices 43e1 and 43e2 of the second imaging device 43B are compared with each other in the timing (time interval or number of times of installation) of the memory unit 111. The relationship is identified, and the alignment position of the organic EL panel P and the electronic component W is corrected based on the identification result. Therefore, even when the first imaging unit 43a and the pair of imaging units 43e1 and 43e2 are disposed independently of each other, it is possible to recognize the deviation of the relative positional relationship with time. According to this, even if the relative positional relationship between the first imaging unit 43a and the pair of imaging units 43e1 and 43e2 is deviated, the deviation can be corrected. For example, when the continuous installation is repeated for a long period of time, such as a 24-hour operation, the thermal expansion caused by the temperature change in the device due to the friction heat of the movable portion or the heat source such as the heater, and the relative position between the imaging portions 43a, 43e1, and 43e2. When a deviation occurs and a so-called temperature drift occurs, it is possible to maintain high mounting accuracy by correcting it.

According to this, the identification accuracy of the relative positional data of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W can be improved. The positional alignment accuracy of the organic EL panel P and the electronic component W can be improved by using such a relative positional data, and as a result, even in the case where the flexible organic EL panel P is mounted with the flexible electronic component W, This installation accuracy can be improved.

In addition, in the support surface 42f of the support portion 42b for supporting the edge portion of the electronic component W from the lower side of the organic EL panel P, a plurality of adsorption holes 42g are compared with the edge of the organic EL panel P. The resulting irregularities of the irregularities caused by the bending or the undulation are arranged at a shorter interval, and the edge portion of the organic EL panel P is adsorbed and held in a state of being supported by the support surface 42f. According to this, the edge portion of the organic EL panel P can be supported in a flatter state, and therefore the alignment mark PM of the organic EL panel P and its surrounding portion can be stably maintained in a horizontal and flat state, and the position of the alignment mark PM is aligned. The identification accuracy can be further improved.

Further, in the organic EL panel P, as the edge portion on which the electronic component W is mounted, a plurality of adsorption holes 42g provided on the support surface 42f of the support portion 42b are adsorbed from the lower side. Therefore, even if the resin constituting the organic EL panel P is bent or undulated upward at the edge of the organic EL panel P based on moisture absorption or the like, the edge portion of the organic EL panel P may be in close contact with the support surface 42f of the support portion 42b. on. According to this, the alignment mark PM of the organic EL panel P and the surrounding portion thereof are stably maintained in a flat state, and the position recognition accuracy of the alignment mark PM can be improved.

The organic EL panel P is supplied to the holder 81 of the first conveying unit 80 placed on the table 42 by the flat adsorption surface 81c of the electrode surface adsorption block 81a and the flat adsorption surface of the display region adsorption portion 81b. The surface of the organic EL panel P is kept to be a flat surface. According to this, even if the flexible organic EL panel P which is likely to be bent or bent is held by the flat holding surface by suction, it can be held in the holder 81 in a flat state. Therefore, the organic EL panel P can be placed and held on the table 42 in a flat state, whereby the effect of improving the position recognition accuracy of the alignment mark PM performed in the state of being held by the table 42 can be stably obtained.

Further, when the organic EL panel P is placed on the table 42 by the holding body 81, the organic EL panel P is sandwiched by the support surface 42f of the support portion 42b of the table 42 by the holding surface of the holding body 81. Between the mounting surfaces 42d of the mounting portion 42a. According to this, the organic EL panel P can be transferred to the stage 42 while maintaining a flat state. According to this, the organic EL panel P can be held on the table 42 in a flat state, and the effect of improving the position recognition accuracy of the alignment mark PM performed in the state of being held by the table 42 can be further stably obtained.

Moreover, the imaging system of the pair of alignment marks WM of the electronic component W is performed by the pair of imaging parts 43e1 and 43e2, whereas the imaging system of the pair of alignment marks PM of the organic EL panel P is performed by the single imaging part 43a. . That is, the photography system in which the four alignment marks WM and PM are combined is performed using the three imaging units 43a, 43e1, and 43e2. Further, the photographing of the pair of alignment marks PM of the organic EL panel P by the single photographing unit 43a can be performed by moving the organic EL panel P.

There are two cameras for photographing the pair of alignment marks WM of the electronic component W, and two cameras for photographing the pair of alignment marks PM of the organic EL panel P, and four cameras are used for alignment. When the position identification of the marks WM and PM is compared, when the error is corrected by the temperature drift of the target mark 42j4 or the like, the error generated during the so-called calibration can be reduced. In other words, when the position of the target mark 42j4 is recognized by each of the image capturing units 43a, 43e1, and 43e2, the position recognition error of the target mark 42j4 or the positioning error of the target mark 42j4 is generated in each of the image capturing units 43a, 43e1, and 43e2. Therefore, as the number of cameras (photographing sections) increases, the influence of the errors becomes larger. By suppressing the number of the imaging units 43a, 43e1, and 43e2 to three, the above error can be minimized.

When the pair of alignment marks WM of the electronic component W are photographed by the two imaging units 43e1 and 43e2, the distance between the alignment marks WM can be recognized. According to this, the reference interval between the alignment marks WM of the electronic component W can be recognized, for example, the difference between the distances with the design alignment marks WM can be recognized. Thereby, the amount of elongation of the electronic component W can be recognized. Therefore, the amount of elongation of the recognized electronic component W can be reflected in the positioning position at the time of temporary crimping or the thermocompression bonding condition at the time of fixed crimping, and the mounting accuracy of the electronic component W can be improved.

For example, in the terminal row TR of the electronic component W and the electrode row ER of the organic EL panel P, the terminal or the electrode is inclined outward from the center to the outside, and the terminal or the electrode is further inclined. In the manner in which the angle is increased, a splayed terminal column or an electrode column is arranged. When the electronic component W including the terminal row TR or the electrode array ER is mounted on the organic EL panel P, the positioning position in the Y direction is corrected in accordance with the amount of elongation described above, and the mounting accuracy can be improved.

In the thermocompression bonding condition at the time of the fixed pressure bonding, when the elongation of the electronic component W is larger, the thermocompression bonding is performed under the thermocompression bonding conditions in which the elongation of the electronic component W generated during the fixed pressure bonding is strongly suppressed. According to the experimental results of the inventors of the present invention, it is found that the steeper the initial pressure increase (the time until the predetermined pressure is applied), the more the effect of suppressing the elongation of the electronic component W can be improved. Based on this finding, the increase in the pressing force is controlled to be steeper as the amount of elongation of the electronic component W is larger. In this case, the organic EL panel P also takes into account the thermal expansion caused by the heating. Therefore, the elongation of the organic EL panel P due to the heating at the time of the fixed pressure bonding is also grasped by the experiment or the like in advance, and is incorporated into the fixed pressure. The conditions can be considered.

Further, the present invention is not limited to the above embodiment. For example, the display panel is described by taking an organic EL panel as an example, but is not limited thereto. For example, a constituent member of the flexible electronic paper may be used as a display panel.

Further, the connection between the organic EL panel P and the electronic component W is performed using the anisotropic conductive tape F, but is not limited thereto. Other bonding members such as an adhesive containing conductive particles may be used. In the case of using an adhesive, a thermosetting or photocurable adhesive can be used.

The configuration of the first to third transport units 80, 90, and 100 is not limited to the above, and other configurations are also possible. For example, instead of using a porous sheet, a plurality of openings for adsorption may be provided in a soft rubber or a resin material such as foamed urethane rubber or enamel rubber.

The organic EL panel P is transported from the table 42 of the temporary pressure bonding device 40 to the table 51 of the fixed pressure bonding device 50 by the second conveying unit 90, but the invention is not limited thereto. For example, the table 51 of the fixed crimping device 50 is moved to a position close to the table 42 of the temporary crimping device 40, and the fixed crimping device 50 is moved to the close position of the table 42 of the temporary crimping device 40. In the table 51, the organic EL panel P may be transported using the first transport unit 80. In other words, the first transport unit 80 may also serve as the second transport unit 90.

In addition, each of the imaging units 43a, 43e1, and 43e2 is described as being taken once for each of the imaging units 43a, 43e1, and 43e2, but is not limited thereto. For example, each of the imaging units 43a, 43e1, and 43e2 may perform multiple acquisitions, and the average value of the positions of the target marks 42j4 recognized plural times may be used as the position of the target mark 42j4.

Considering the difference in engineering time between the temporary crimping project and the fixed crimping project, a plurality of fixed crimping devices 50 may be provided in the mounting device 1. Further, instead of providing the plurality of fixed crimping devices 50, a fixed platen 50 may be provided with a table 51 on which the plurality of sheets of the organic EL panels P may be placed, and the plurality of sheets are placed side by side. The electronic component W on the organic EL panel P can be integrated or individually fixedly crimped to the fixed crimping joint 52. In the case where the fixed pressure bonding is performed in combination, the fixed crimping joint 52 is provided with a pressurizing jig 52a that can cover the entire length of the plurality of organic EL panels P placed in parallel. In the case where the fixed pressure bonding is performed individually, the fixed crimping joint 52 is provided with a pressurizing jig 52a that can cover the length of the electronic component W mounted on one organic EL panel P in accordance with the mounting interval of the organic EL panel P. Each of the pressurizing jigs 52a is preferably configured to be individually adjustable in pressure.

In the holder 81 of the first conveying unit 80, the edge portion of the organic EL panel P on which the electrode array ER is formed is adsorbed and held, but the invention is not limited thereto. For example, when the electrode row ER of the organic EL panel P is adhered with the anisotropic conductive tape F, the electrode array ER of the organic EL panel P is not in contact with other members, and when the contact is not expected, the organic EL panel P is not used. The edge portion of the electrode array ER is formed to be adsorbed and held, and the edge portion may be held while being protruded from the holder 81. In the case where the edge portion of the electrode array ER is formed to be adhered and held by the organic EL panel P, the soft organic EL having a thickness of 20 μm or more and 500 μm or less and a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less is used. In the panel (display panel), the vicinity of the electrode array ER is adsorbed by the flat adsorption surface 81c of the holder 81. Thus, it is assumed that an influential bending or undulation occurs at the edge portion where the electrode array ER is formed. Next, the flat support surface 42f of the support portion 42b of the table 42 can be adsorbed and held by the edge portion by the adsorption force of the plurality of adsorption holes 42g.

The positional discrimination error of each of the alignment marks PM and WM is corrected in accordance with the relative positional deviation of the imaging units 43a, 43e1, and 43e2 using the target mark 42j4, that is, the so-called temperature drift correction is performed, but the method of temperature drift correction is not limited to The above method can be other methods.

For example, as the reference position of the target mark 42j4, the position of the target mark 42j4 recognized by each of the image capturing units 43a, 43e1, and 43e2 is used in the previous stage in which the mounting of the electronic component W is started, but the designing portion 43a is designed. The positions of the 43e1 and 43e2, more specifically, the position of the center of the field of view of the designed cameras 43c and 43g may be used as the reference position. In other words, it is also possible to set an absolute reference position.

The reference position of the target mark 42j4 is configured to update each of the images of the target mark 42j4 by the imaging units 43a, 43e1, and 43e2, but the reference position initially stored is directly used as the reference position, that is, It is also possible to update the base position. In this case, the same effect can be obtained.

Further, the single target mark 42j4 is fixedly disposed on the placing portion 42a of the table 42, and the target mark 42j4 is aligned with the positions of the respective image capturing portions 43a, 43e1, and 43e2 by moving the table 42, but may be The following structure.

For example, a glass substrate for calibration which is aligned with the arrangement positions of the image forming units 43a, 43e1, and 43e2 on one glass substrate and has three target marks is attached, and the glass substrate for correction is placed in a predetermined positional relationship using a jig. Mounting portion 42a. At this time, the two target marks imaged by the imaging units 43e1 and 43e2 for the electronic component W are protruded by a predetermined amount from the support portion 42b of the table 42 to the side of the temporary crimping joint 41. According to this, the target mark can be photographed from the lower side by the photographing sections 43e1, 43e2. Then, the table 42 on which the glass substrate for calibration is placed is moved so that the three target marks are located at the reference positions of the respective imaging units 43a, 43e1, and 43e2. In this state, each of the imaging units 43a, 43e1, and 43e2 is used to recognize the corresponding target mark, and the relative positional deviation of each of the imaging units 43a, 43e1, and 43e2 with respect to the reference position is recognized.

Further, the target mark for use may be disposed for each of the image capturing units 43a, 43e1, and 43e2. Specifically, the target mark is set in a state where the position can be given and the position can be retracted to the position immediately above the position of the respective imaging units 43a, 43e1, and 43e2. The target mark is aligned from the retracted position to the position immediately above or directly below the respective imaging units 43a, 43e1, and 43e2 at each of the preset timings, and is identified by the respective imaging units 43a, 43e1, and 43e2. The relative positional deviation of each of the imaging units 43a, 43e1, and 43e2 with respect to the reference position may be determined. In this case, in order to prevent the occurrence of the relative positional deviation between the target marks as much as possible, it is preferable to directly support each of the target marks on the frame of the mounting device 1.

Further, an illumination device may be built in the support surface 42f of the support portion 42b of the table 42. Specifically, the illumination device is built in a portion of the support surface 42f that is opposite to the alignment mark PM of the organic EL panel P, and the alignment is performed when the alignment mark PM is photographed by the first imaging portion 43a. The lower side of the PM is illuminated to illuminate the light. In this way, as compared with the case where the alignment mark PM is photographed by the reflected light, a large difference in brightness between the image of the alignment mark PM and the background image can be obtained, and a clearer alignment mark PM can be obtained. Image can improve recognition accuracy. Further, instead of arranging the illuminating device in the support portion 42b, the light transmission window may be provided instead, or the support portion 42b may be formed of a translucent member such as a transparent glass material, and may be irradiated with light.

In the above embodiment, the configuration in which the anisotropic conductive tape F is adhered to the electronic component W is described, but the configuration is not limited thereto. The anisotropic conductive tape F may be adhered to the organic EL panel P, that is, the display panel. In this case, the anisotropic conductive tape attaching device 30 is provided instead of the adhesive position C of the intermittent rotary transfer device 20, and the anisotropic conductive tape is attached to the organic EL panel P on the upstream side of the supply portion of the organic EL panel P. F's anisotropic conductive tape bonding device can also be used. For example, it can be applied to the mounting device 201 shown in FIG. Fig. 8 is a view showing the configuration of a mounting device 201 of another embodiment.

[Mounting device according to another embodiment] The mounting device 201 shown in Fig. 8 has a configuration in which the anisotropic conductive tape attaching device 230, the temporary crimping device 240, and the fixed crimping device 250 are arranged side by side in the X direction. The press device 210 is disposed behind the Y-direction of the crimping device 240, and a transfer device 260 that transports the electronic component W is disposed between the temporary crimping device 240 and the press device 210. The first to fourth transfer units 271, 272, 273, and 274 of the organic EL panel P are disposed between the respective processing devices 230, 240, and 250. The mounting device 201 supplies the four organic EL panels P to the processors in the respective processing devices 230, 240, and 250. The press device 210 is a stamper for the electronic component W by the tape carrier T, and has the same configuration as the press device 10 described in the above embodiment.

In the anisotropic conductive tape attaching device 230, the anisotropic conductive tape F is adhered to the organic EL panel P. In the anisotropic conductive tape attaching device 230, the two placing portions 231 and 232 in which the two organic EL panels P are held in parallel in the X direction are arranged in parallel in the X direction. The mounting portions 231 and 232 are movable in the XYZθ direction. Moreover, the pasting units 233 and 234 of the anisotropic conductive tape F are disposed corresponding to the two mounting portions 231 and 232. Each of the placing portions 231 and 232 sequentially aligns the positions of the organic EL panels P on the placing portions 231 and 232 to the bonding positions of the respective pasting units 233 and 234. Each of the pasting units 233, 234 adheres the anisotropic conductive tape F to the organic EL panel P whose position has been aligned to the pasting position.

The temporary crimping device 240 temporarily crimps the electronic component W to the organic EL panel P to which the anisotropic conductive tape F has been attached. The temporary pressure bonding device 240 includes a mounting portion 241 in which the four organic EL panels P are arranged in parallel in the X direction, and a temporary pressure bonding device that temporarily presses the electronic component W on the organic EL panel P held by the mounting portion 241. 242; and a backup tool (not shown) that supports the organic EL panel P from the lower side when the electronic EL panel P is temporarily pressure-bonded to the organic EL panel P by the temporary crimping joint 242. The placing portion 241 is movable in the XYZθ direction, and sequentially aligns the positions of the four organic EL panels P on the placing portion 241 to the temporary crimping positions of the temporary crimping joints 242. The temporary crimping joint 242 performs temporary crimping of the electronic component W on the organic EL panel P whose position has been aligned to the temporary crimping position. Further, of course, the temporary pressure bonding device 240 includes the same position recognition device as the temporary pressure bonding device 40 described in the above embodiment.

Here, the electronic component W punched out by the press device 210 is sequentially supplied to the temporary crimping joint 242 by the transport device 260. In other words, the transport device 260 is movable in the XYZθ direction by the XYZθ drive unit 261, and includes a receiving portion 262 that sucks and holds the electronic component W from the lower side, receives the electronic component W from the press unit 210, and delivers it to the temporary crimping terminal 242. .

The fixed crimping device 250 performs fixed pressure bonding on the electronic component W that is temporarily crimped to the organic EL panel P. The fixed crimping device 250 is provided in the X direction in which the four mounting portions 251, 252, 253, and 254 of the respective organic EL panels P are individually held. Further, four fixed crimping joints 255, 256, 257, and 258 are provided corresponding to the four placing portions 251, 252, 253, and 254. The fixed crimping joints 255, 256, 257, and 258 are set to be individually adjustable in pressure, and are configured to be integrated with the lifting movement. Each of the placing portions 251, 252, 253, and 254 is movable in the XYZθ direction, and the positioning of the organic EL panel P can be performed for the corresponding fixed crimping joints 255, 256, 257, and 258. The four fixed crimping joints 255, 256, 257, and 258 are fixedly and pressure-bonded to the four organic EL panels P whose positions have been aligned by the four placing portions 251, 252, 253, and 254.

The first to fourth transfer units 271, 272, 273, and 274 simultaneously transfer four organic EL panels P between the respective processing devices 230, 240, and 250. In other words, the first to fourth transfer portions 271, 272, 273, and 274 are provided with four holding portions that simultaneously hold and hold the organic EL panel P from the upper side in the X direction. Next, the first transport unit 271 simultaneously transfers the four organic EL panels P to the anisotropic conductive tape attaching device 230 from a supply unit (not shown). The second transport unit 272 simultaneously transfers the four organic EL panels P from the anisotropic conductive tape attaching device 230 to the temporary pressure bonding device 240. The third transport unit 273 simultaneously delivers four organic EL panels P from the temporary pressure bonding device 240 to the fixed pressure bonding device 250. The fourth transport unit 274 simultaneously delivers four organic EL panels P from the fixed pressure bonding device 250 to a carry-out unit (not shown). The present invention also applies to the mounting device 201 thus constructed. [Examples]

Next, an embodiment of the present invention and its evaluation results will be described.

(Example 1) Using the mounting apparatus 1 of the above-described embodiment, an experiment was performed under the following conditions to confirm the mounting accuracy based on TEG (Test Element Group). Here, TEG is an evaluation member produced as a test, and an evaluation member of the organic EL panel P is produced here. Specifically, a TEG corresponding to an organic EL panel having a size of 5 inches (120 mm × 65 mm) was produced using a glass plate having a thickness of 0.5 mm. The electronic component W uses a COF having a width of 36 mm and a length of 25 mm. In addition, the reason why the TEG of the organic EL panel P is made of a glass plate is to prevent the influence of bending, deflection, and transmittance in order to confirm the positioning accuracy described later. Hereinafter, the TEG of the organic EL panel P is simply referred to as an organic EL panel P. The target accuracy is a general accuracy required in an organic EL panel used for a display panel for a smart phone, and is set to ±3 μm.

<Experimental conditions> Heater of the temporary pressure joint: OFF Working time: 10 seconds (However, the moving speed of the temporary crimping jig 41a and the placing portion 42a is the same as the case where the working time is 5 seconds.) Time (number of times): 4.8 hours temperature drift correction: 360 times for 1 time

In the experiment, the organic EL panel P is placed on the mounting portion 42a in the state of being in the standby position, and the electronic component W is held by the pressing jig 41a. In the standby position, the mounting position of the organic EL panel P is received from the first transport unit 80 in the mounting portion 42a, and the position of the electronic component W is received from the second transfer device 70 in the press fixture 41a. From this state, the positions of the organic EL panel P and the pair of electronic components W are placed at the mark recognition position before the temporary crimping. At this time, the position of the pressing head 41a is in a state of being rotated in the horizontal direction of θ=+5°. This is to confirm the correction accuracy of the rotation deviation.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are identified by the first and second imaging devices 43A and 43B, and the position alignment of the organic EL panel P and the electronic component W is performed based on the identification result. . In addition, the alignment of the position does not cause the edge of the organic EL panel P to coincide with the edge of the electronic component W, but the edge of the organic EL panel P is separated from the edge of the electronic component W by a slight distance. get on. Specifically, the alignment marks PM and WM are aligned at intervals of 3.3 mm from each other. Since the distances from the alignment marks PM and WM to the edge portion are each approximately 0.6 to 1.2 mm, the edge portions are arranged at intervals of 0.9 to 2.1 mm.

After the position alignment is completed, the alignment mark of the organic EL panel P and the alignment mark of the electronic component W are placed in the same field of view from the lower side while photographing is performed, and the organic EL panel P and the electronic component W are used. The relative positional deviation is identified. In other words, the alignment marks on the right side of the organic EL panel P and the electronic component W enter the same field of view of the imaging unit 43e1 of the second imaging device 43B and are simultaneously photographed, so that the alignment marks on the left side enter the second imaging device. The photographing unit 43e2 of 43B performs photographing simultaneously in the same field of view. Next, the relative positional deviation obtained based on the identification result is recorded as the mounting accuracy.

In addition, the support portion 42b that supports the edge portion of the organic EL panel P is provided with a notch portion that penetrates the upper and lower sides at a position corresponding to the alignment mark, and an aligning mark can be recognized from the lower side as an experiment maker. The reason why the organic EL panel P is made of a glass plate is to prevent the bending or undulation of the TEG or the transmittance from affecting the identification accuracy when the alignment mark is recognized by the TEG.

(Comparative Example 1) In Comparative Example 1, there was a difference in the point that only "temperature drift correction" was not performed, and other conditions were the same as in the above-described first embodiment.

In the first embodiment and the comparative example 1, the movement of the organic EL panel P and the electronic component W, the identification of each alignment mark, and the recording of the relative positional deviation are continuously performed between the repetition times (4.8 hours). The measurement results of Example 1 are shown in Table 1 and Figure 9. The measurement results of Comparative Example 1 are shown in Table 2 and FIG. For the results shown in their tables and figures, among the data obtained between the repetition times (about 1800 times), the average of the first to tenth data (1) and the subsequent 10 per 100 times The average value ((2) to (18)) of the sub-data is shown in Tables 1 and 2 as "relative position deviation identification results". The difference between the measurement results and (1) in Table 1 and Table 2 is the value of the first data (1) subtracted from the average value ((2) to (18)) of the data per 100 times. . 9 and 10 show the variation of "the difference from the measurement result of (1)". As can be seen from the comparison between Table 1 and FIG. 9 and Table 2 and FIG. 10, by performing "temperature drift correction", fluctuations in mounting accuracy can be greatly suppressed. Therefore, it is understood that the mounting accuracy of the flexible electronic component can be maintained for a long period of time with respect to the flexible display panel.

Further, the embodiments of the present invention are described, but the embodiments are merely illustrative and are not intended to limit the scope of the invention. The implementation of the new rules can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. The invention or its modifications are also included in the scope of the invention and the scope of the invention as set forth in the appended claims.

1‧‧‧Installation device

10 (10A, 10B) ‧ ‧ stamping device

12‧‧‧Molding device

20‧‧‧Intermittent rotary conveyor

21‧‧‧ Arms

24‧‧‧ Keep head

30‧‧‧Inertial Conductive Tape Adhesive Device (Joint Member Adhesive Device)

32‧‧‧adhesive head

40‧‧‧ Temporary crimping device

41‧‧‧ Temporary pressure joint

42‧‧‧Workbench

42a‧‧‧Loading Department

42b‧‧‧Support

42c‧‧‧Workbench Drive Department

42j‧‧‧Correction components

42j3‧‧‧transparent sheet

42j4‧‧‧target mark

43‧‧‧Location Identification Unit

43A‧‧‧1st camera

43B‧‧‧2nd camera

43a‧‧1st Department of Photography

43e (43e1, 43e2) ‧ ‧ 2nd Department of Photography

43b, 43f‧‧‧Image Processing Department

50‧‧‧Fixed crimping device

51‧‧‧Workbench

52‧‧‧Fixed pressure joint

53‧‧‧Backup Department

60‧‧‧1st junction device

61‧‧‧Acceptance Department

70‧‧‧2nd handover device

71‧‧‧Acceptance Department

80‧‧‧1st transport department

81‧‧‧ Keeping body

81a‧‧‧electrode surface adsorption block

81b‧‧‧Display area adsorption department

90‧‧‧2nd Transport Department

91‧‧‧ Keeping body

100‧‧‧3rd Transport Department

101‧‧‧ Keeping body

110‧‧‧Control device

111‧‧‧Memory Department

F‧‧‧ anisotropic conductive tape

P‧‧‧Organic EL panel

W‧‧‧Electronic components

Claims (12)

A device for mounting an electronic component is a plurality of electrodes arranged to have a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a flexible display panel. The member is connected to a plurality of terminals of the flexible electronic component that are arranged in correspondence with the plurality of electrodes, and the electronic component is mounted on the display panel, and includes a table for loading The table for the display panel includes a support portion for supporting the edge portion on which the electronic component is mounted from the lower side of the display panel, and is movable in the horizontal direction simultaneously with the support portion; The electronic component is held from the upper side, and the electronic component is thermocompression-bonded on the upper surface of the edge portion supported by the support portion, and is movable in the horizontal direction and the vertical direction. The first imaging device is the above-described display panel. The edge portion is supported by the support portion of the table, and is disposed on the display from the upper side. The alignment mark of the edge portion of the panel is imaged; and the second imaging device photographs the alignment mark provided on the electronic component from the lower side while the electronic component is held by the thermocompression bonding member; The device aligns the display panel and the electronic component with respect to relative positional information of the display panel and the alignment mark of the electronic component obtained from the image captured by the first imaging device and the second imaging device a manner of adjusting the relative position of the table and the hot-pressing joint, and thermally pressing the electronic component to the display panel by the hot-pressing joint according to the adjusted positional relationship. The table and the hot press joint are controlled; the correcting member is used for identifying the relative positional relationship between the first photographing device and the second photographing device; and the horizontal moving device is configured such that the position of the correcting member is sequentially located The first imaging device and the second imaging device face each other in a manner 1 that the imaging device and the second imaging device move relative to the correction member in the horizontal direction; the memory portion stores a reference value of the relative positional relationship between the first imaging device and the second imaging device; and the correction operation control device The first imaging device and the second imaging device take in an image of the correction member, and recognize a relative positional relationship between the first imaging device and the second imaging device based on the captured image, and transmit the identification As a result, a deviation of the relative positional relationship between the first imaging device and the second imaging device is obtained in comparison with the reference value stored in the memory portion, and the alignment position of the display panel and the electronic component is determined based on the obtained deviation. Make corrections. The mounting device for an electronic component according to the first aspect of the invention, wherein the alignment mark of the display panel is a pair of alignment marks provided on both sides of the plurality of electrodes of the display panel, the electronic component The alignment mark is a pair of alignment marks provided on both sides of the plurality of terminals of the electronic component, and the first imaging device is disposed at a position higher than the table, and is disposed in the hot pressing The second imaging device includes a pair of imaging devices, and the pair of imaging devices are disposed in the vicinity of the thermal compression bonding position of the electronic component by thermal compression bonding of the edge portion of the display panel. The surface on which the display panel is placed in the table is further below, and is disposed corresponding to the arrangement interval of the pair of alignment marks of the electronic component. The mounting device for an electronic component according to claim 1 or 2, wherein the memory portion further stores a time interval as a timing of taking in an image of the correcting member or mounting of the electronic component by the thermocompression bonding member. The correction operation control device executes the image capturing of the correction member by the first imaging device and the second imaging device based on the time interval or the number of times of storage stored in the memory unit. The mounting device for an electronic component according to the first or second aspect of the invention, wherein the correction operation control device recognizes an image of the correction member via the first imaging device and the second imaging device. The relative positional relationship described above is stored as a new reference value in the memory unit. The mounting device for an electronic component according to claim 1 or 2, wherein the correcting member is provided with a target mark that can be photographed from both the upper and lower directions, and is fixed to the table. The mounting device for an electronic component according to claim 1 or 2, wherein the support portion has a plurality of adsorption holes for adsorbing and holding the edge portion of the display panel. The mounting device for an electronic component according to the first or second aspect of the invention, further comprising: a conveying unit that supplies the display panel to the table, wherein the conveying unit includes a holding body having: a pair of the display panel The electrode surface adsorption block in which the edge portion is adsorbed and held flat, and the display region adsorption portion that adsorbs and holds a portion other than the portion adsorbed by the electrode surface adsorption block in the display panel. The mounting device for an electronic component according to the seventh aspect of the invention, wherein the display region adsorption portion has: a flat adsorption surface; and a porous sheet provided on the adsorption surface. The mounting device for an electronic component according to the seventh aspect of the invention, wherein the display region adsorption portion is arranged in parallel in a direction intersecting with the edge portion of the display panel that is adsorbed and held by the electrode surface adsorption block, Each of them is freely adjusted in such a manner as to be spaced from the above-mentioned electrode surface adsorption block. The mounting device for an electronic component according to claim 1 or 2, further comprising: a press device for punching the electronic component from the tape carrier; and an intermittent rotary transfer device having the electronic component to be punched out by the punching device a plurality of holding heads are held to intermittently rotate the holding head; a bonding member attaching device is disposed in the transfer path of the intermittent rotating conveying device to the electronic component, and the bonding member is adhered to the electronic component; The apparatus includes the above-described work table, the above-described thermocompression bonding device, the first imaging device, and the second imaging device, and the electronic component to which the bonding member is adhered by the bonding member bonding device is temporarily pressure-bonded to the display. a fixed pressure bonding device that fixes and presses the electronic component that has been temporarily pressed against the display panel by the temporary pressure bonding device; and the first delivery device between the pressing device and the intermittent rotary conveying device Performing the above electronic components The second transfer device performs the transfer of the electronic component between the intermittent rotary transfer device and the temporary pressure contact device, and the transfer unit that transports the display panel from the temporary pressure bonding device to the fixed pressure contact device The temporary pressure bonding device is disposed adjacent to the fixed pressure bonding device, and the intermittent rotation conveying device and the pressing device are intermittently rotated in a direction orthogonal to the adjacent direction with respect to the temporary pressure bonding device. The order of the conveying device and the above-described press device is arranged. The mounting device for an electronic component according to claim 1 or 2, further comprising: a press device for punching the electronic component from the tape carrier; and a bonding member pasting device for mounting the stamping device in the display panel The edge portion of the die-cut electronic component is bonded to the bonding member, and the temporary pressure bonding device includes the table, the hot press fitting, the first imaging device, and the second imaging device. The electronic component is temporarily pressure-bonded to the display panel through the bonding member; the pressure bonding device is fixed, and the electronic component that has been temporarily pressed against the display panel by the temporary pressure bonding device is fixedly pressure-bonded; And transferring the electronic component between the pressing device and the temporary pressure bonding device; the conveying unit transfers the display panel to the temporary pressure bonding device from the bonding member bonding device; and the other conveying unit Temporary crimping device moves the above display panel In the above-described joint bonding device, the temporary pressure bonding device and the fixed pressure bonding device are arranged in this order, and the pressing device is disposed in the alignment direction with respect to the temporary pressure bonding device. The direction of the handover. A method for producing a display member, comprising: holding a display panel having a thickness of 20 μm or more and 500 μm or less and having a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and holding the flexible display panel on the table; a support portion of the panel having a plurality of electrodes supported by a support portion provided on the table from the lower side; and a plurality of terminals having a plurality of terminals corresponding to the plurality of electrodes and having flexible electronic components are held The first photographing project for photographing the alignment mark provided on the edge portion of the display panel from above the display panel supported by the support portion by the first photographing device a second imaging project for capturing an alignment mark provided on the electronic component from a lower portion of the electronic component held by the thermocompression bonding device by the second imaging device; and the display according to the first imaging project Using the image of the alignment mark of the panel and the above-mentioned electronic element photographed by the second photography project a position recognition project for identifying the relative positional relationship between the display panel and the electronic component; and the relative positional relationship identified by the position recognition project to the workbench and the heat Adjusting the relative position of the pressure joint, and thermocompression bonding the electronic component to the display panel by the thermocompression bonding joint according to the adjusted positional relationship; the manufacturing method of the display member is repeated The support project, the holding process, the first photographing project, the second photographing project, the position recognizing project, and the thermocompression bonding project, wherein the plurality of electrode transmission joining members of the display panel are continuously manufactured The display member for connecting the plurality of terminals of the electronic component, wherein the first imaging device and the second imaging device are used in the first imaging device and the first 2 diagram of the correction member for identifying the relative positional relationship of the photographing device And an identification process for identifying a relative positional relationship between the first imaging device and the second imaging device; and obtaining the first imaging device and the first by comparing the identification result with a predetermined reference value (2) A deviation correction of the relative positional relationship of the imaging device, which corrects the alignment position of the display panel and the electronic component based on the obtained deviation.