TW201833560A - Socket for inspecting electronic components - Google Patents

Abstract

The present invention relates to an electronic component inspection socket comprising: a cradling table for supporting an electronic component such that terminals of the electronic component are exposed to a first side; a contact pins positioned on the first side of the cradling table and configured to move toward the electronic component and to contact the terminals; and push pins positioned to face the contact pins, wherein, when the contact pins contact the electronic component, the push pins can support the opposite surface of the surface of contact between the electronic component and the contact pins.

Description

Electronic component test socket

The invention relates to an electronic component test socket. Specifically, it relates to an electronic component test socket that minimizes the deformation and stress of the electronic component while preventing the occurrence of damage, and can improve the contact stability when testing the electronic component.

Conventional sockets for testing electronic components such as semiconductors have many problems due to the increase in the number of contact pins as the number of connection terminals of the electronic components increases.

Generally speaking, the contact load of one stylus is about 30 gf. Recently, more than 2,000 stylus are often installed in the socket. Therefore, if a contact load of more than 60 kgf is generated on an electronic component, it will cause a large deformation of the electronic component during the test. Such a contact load causes very large deformation and stress on the electronic component to be tested, thereby causing damage.

Although the contact load of each stylus can be reduced to reduce such deformation and stress, it also reduces the contact stability, which causes problems in the transmission of electronic signals.

FIG. 1 is a cross-sectional view schematically showing a conventional electronic component test socket.

In order to solve the foregoing problem, when the stylus (20) is in contact with the terminal (11) of the electronic component (10) placed on the bracket (13), the following method can also be used: the push block (30) is removed from the electronic component (10) Push the electronic component (10) on the upper side. However, such methods have recently become difficult to use.

The reason is that when electronic components are developed in various types such as CSP and Multi Chip Package, the thickness of the electronic components will become uneven at the same time as the thickness becomes thin, or they need to be tested before the final packaging program. When exposed, bare die may be exposed.

In addition, the leads or balls used as external connection terminals are not evenly distributed and often have an asymmetric distribution; and depending on the purpose of use, various pins (such as ground pins) in the same electronic component , Signal Pin) need to have different contact loads. Therefore, considering all these various conditions, it is necessary to minimize the deformation and stress of the electronic component in order to achieve stable contact and prevent damage to the electronic component.

Because the conventional push block method cannot achieve an average load distribution, the electronic components are deformed. As a result, the chip of the electronic component is damaged or the internal connection circuit of the multi chip is finely connected. (Bonding wire, bump, Cu filler, etc.) damage.

[Problem to be solved]

An electronic component test socket according to an embodiment of the present invention is an invention made in order to solve the existing problems, and its purpose is to provide a method for minimizing deformation and stress of electronic components, preventing damage, And an electronic component test socket that reduces the deformation of the electronic component and improves the contact stability during the test.

The objects of the present invention are not limited to those mentioned above, and those with ordinary knowledge in the technical field to which the present invention pertains can clearly understand other objects not mentioned from the following description. [Means for solving problems]

An electronic component test socket according to an embodiment of the present invention is an electronic component test socket for testing electronic components. The electronic component test socket includes a bracket for supporting the electronic components and exposing the terminals of the electronic components to the first side. The first side of the bracket moves toward the electronic component and contacts the terminal; and the push pin is positioned to face the contact pin. When the stylus is in contact with the electronic component, the push pin can support the opposite side of the surface that is in contact with the electronic component and the stylus.

The push pins may be arranged at positions corresponding to the positions of the stylus.

The stylus includes a contact plunger that is in contact with the terminal of the electronic component, and a contact plunger elastic member that is connected to the contact plunger and applies an elastic force to the contact plunger that is in contact with the terminal of the electronic component. The pressing pin includes a pressing plunger that presses the electronic component, and a pressing plunger elastic member that is connected to the pressing plunger and applies an elastic force to the pressing plunger that is in contact with the electronic component. For the contact pins and the push pins corresponding to each other, the elastic coefficients of the contact plunger elastic member and the push plunger elastic member may be the same.

The pressing plunger may include a pressing end formed at the end portion and in contact with the electronic component.

The pressing end may be formed of a soft non-metal part.

The diameter of the pressing end may be larger than the diameter of the pressing plunger.

The pushing end may have a convex contact surface.

The pushing end may have a flat contact surface. [Effect of the invention]

The efficacy of the electronic component test socket according to an embodiment of the present invention is as follows.

(1) Irrespective of the height and flatness of the entire electronic component, the pushing load can be applied with the same size and distribution as the load of the stylus.

(2) Irrespective of the assembly tolerances produced during the manufacture of electronic components, a pressing load corresponding to the load of the stylus can be applied under a constant load.

(3) Minimize damage to electronic components.

(4) Reduce the deformation of electronic components and improve contact stability.

(5) By using a push pin that can apply a different load to each position, the push load can be partially adjusted to match the uneven load distribution of the stylus.

(6) By changing the shape and material of the push end, it can be used according to various test conditions.

(7) The number and position of the push pins can be adjusted so that their load distribution can be changed according to various uneven loads.

(8) The push pin can be manufactured in the same way as the stylus manufacturing procedure, thus improving production efficiency.

The effects of the present invention are not limited to those mentioned above, and those with ordinary knowledge in the technical field to which the present invention pertains can clearly understand other effects not mentioned from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, when specific descriptions of related conventional functions or configurations are considered to possibly cause unnecessary confusion to the gist of the present invention, detailed descriptions thereof will be omitted.

2 is a cross-sectional view of an electronic component test socket according to an embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a contact pin structure used in an electronic component test socket according to an embodiment of the present invention. 4 is a cross-sectional view schematically showing a structure of a push pin used in an electronic component test socket according to an embodiment of the present invention.

The invention relates to an electronic component test socket (100) for testing electronic components (10), which may include a bracket (110), a contact pin (120), and a push pin (130). The electronic component (10) includes various types of electronic components, and may include, for example, a semiconductor or the like.

The bracket (110) supports the electronic component (10) so that the terminal (11) of the electronic component (10) is exposed on the first side (lower side of FIG. 2). Preferably, the bracket (110) supports the edge of the electronic component (10), so that the terminal (11) is exposed to the lower side through the space formed in the central portion.

The contact pin (120) is located on the first side (lower side of FIG. 2) of the bracket (110), moves upward toward the electronic component (10) and contacts the terminal (11), and transmits the electronic signal to the terminal. The contact pins (120) are arranged at positions corresponding to the terminals (11) to be tested.

The stylus (120) can be formed into various forms including a contact plunger (121) and a contact plunger elastic member (122). That is, it may include a contact plunger (121) that is in contact with the terminal (11) of the electronic component (10) to supply a current; and a contact plunger elastic member (122) that is connected to the contact plunger (121), and An elastic force is applied to the contact plunger (121) that is in contact with the terminal (11) of the electronic component (10). The contact plunger (121) is preferably a cylindrical member, and the contact plunger elastic member (122) is preferably formed by a spring.

The stylus (120) may further include a connecting plunger (123) and a casing (124). The connecting plunger (123) connected to the test device is fixed to one end of the casing (124) that is a tubular member, and the contact plunger elastic member (122) may be located inside the contact plunger (121) of the casing (124). And the connecting plunger (123), and the contact plunger (121) can move along the longitudinal direction of the casing (124). In addition to such a structure, various structures that perform the same function are also applicable. The stylus (120) of the present invention is not limited to the form of the stylus (120) shown in FIG. 3.

The push pin (130) is located on the second side (upper side of FIG. 2) of the bracket (110), which is positioned to face the stylus (120), and moves downward and contacts the electronic component (10) and stylus (120) ) Is in contact with the opposite surface (surface on the second side) of the contact surface (surface on the first side).

When the stylus (120) contacts the first side surface of the electronic component (10), the push pin (130) supports the second side surface of the electronic component (10).

The push pins (130) are preferably arranged at positions corresponding to the positions of the contact pins (120). Due to such an arrangement, it is possible to prevent the uneven load applied to the electronic component (10), and the deformation and stress caused thereby.

The pushing needle (130) may include a pushing plunger (131) and a pushing plunger elastic member (132). That is, the pressing needle (130) may have various structures including: a pressing plunger (131) which presses down the second side surface of the electronic component (10); and a pressing plunger elastic member (132). ), Which is connected to the pressing plunger (131) and applies an elastic force to the pressing plunger (131) that is in contact with the electronic component (10). The pressing plunger (131) is preferably a cylindrical member, and the pressing plunger elastic member (132) is preferably formed by a spring.

The pushing needle (130) may further include a supporting plunger (134) and a pushing shell (135). The supporting plunger (134) connected to and supporting the inspection device is fixed to one end of the pushing shell (135) which is a tubular member, and the pushing plunger elastic member (132) may be located inside the pushing shell (135). Between the pressing plunger (131) and the supporting plunger (134), the pressing plunger (131) can move along the longitudinal direction of the pressing casing (135). In addition to such a structure, various structures that perform the same function are also applicable, and the push pin (130) of the present invention is not limited to the shape of the push pin (130) shown in FIG. 4.

For the contact pins (120) and the push pins (130) corresponding to each other, it is preferable to set the elastic coefficients of the contact plunger elastic member (122) and the push plunger elastic member (132) to be the same. Accordingly, the load applied to the first side surface and the second side surface of the electronic component (10) is the same, the positions of the stylus (120) and the push pin (130) are the same, and the load distribution is also the same. Due to such the same load size and distribution, it is possible to prevent deformation and stress from occurring in the electronic component (10).

The pressing plunger (131) preferably includes a pressing end (133) formed at the end and in contact with the electronic component (10). The pressing end (133) may be an integrally formed member formed of the same material as the pressing plunger (131), or may be a detachable and assembleable member.

The pressing end (133) can have various shapes to protect the electronic component (10) and equalize the pressure distribution.

As shown in (a) and (e) of FIG. 4, the pressing end (133) may have a convex contact surface. This can prevent damage to the electronic component (10) when the pressing end (133) comes into contact with the electronic component (10).

As shown in (b)-(d) and (f)-(h) of FIG. 4, the pressing end (133) may have a flat contact surface. Thereby, the load transferred to the electronic component (10) is dispersed and uniformly applied to a predetermined area by the pressing end (133) to prevent damage and uneven load distribution that may occur in the electronic component (10).

As for the pressing end (133), as shown in (c), (d), (g), and (h) of FIG. 4, the diameter of the pressing end (133) may be larger than the diameter of the pressing plunger (131). It may have a step difference and a larger diameter, or it may have a slope and a larger diameter. Accordingly, the load transmitted to the electronic component (10) is dispersed and uniformly applied to a wide area by the pressing end (133) to prevent damage and uneven load distribution that may occur in the electronic component (10).

As shown in (e)-(h) of FIG. 4, the pressing end (133) may be formed of a soft non-metal part. For example, the soft non-metallic part may be plastic. Accordingly, it is possible to prevent damage to the electronic component (10) when the pressing end (133) comes into contact with the electronic component (10).

FIG. 5 is a diagram showing a load distribution and a deformation state of an electronic component through a test socket using a conventional push block (30) and a test socket using a push end (130) according to an embodiment of the present invention; . FIG. 6 is a diagram showing a load distribution occurring on electronic components of various shapes when an electronic component test socket according to an embodiment of the present invention is used.

Instead of pushing the push block (30) as a pushing load on the upper side of the electronic component (10), according to an electronic component test socket of an embodiment of the present invention, in order to make the The contact load has the same size and distribution. The same number of push pins (130) as the contact pins (120) are arranged at the same position as the contact pins (120). The same load is applied to each contact pin (120). On the other hand, it is possible to prevent deformation and stress of the electronic component (10) shown in FIG. 5.

Accordingly, as shown in FIG. 6, when the upper surface of the electronic component (10) is not flat, or when a bare die is exposed, the load is the same as that of the stylus (120). The distributed arrangement of the push pins (130) can still prevent the deformation of the electronic component (10) and the generation of stress, and minimize the damage.

The specific embodiments have been described above, and it is obvious to those having ordinary knowledge in the technical field to which the present invention pertains that various changes are possible without departing from the scope of the present invention.

10‧‧‧Electronic components

11‧‧‧Terminal

13‧‧‧ bracket

20‧‧‧ Stylus

30‧‧‧ Push Block

100‧‧‧Electronic component test socket

110‧‧‧ bracket

120‧‧‧ Stylus

121‧‧‧ contact plunger

122‧‧‧Contact plunger elastic member

123‧‧‧Connect the plunger

124‧‧‧shell

130‧‧‧Push pin

131‧‧‧Push the plunger

132‧‧‧Pushing plunger elastic member

133‧‧‧Pressing end

134‧‧‧Support plunger

135‧‧‧Pushing the shell

FIG. 1 is a cross-sectional view schematically showing a conventional electronic component test socket. 2 is a cross-sectional view of an electronic component test socket according to an embodiment of the present invention. 3 is a cross-sectional view schematically showing a stylus structure used in an electronic component test socket according to an embodiment of the present invention. 4 is a cross-sectional view schematically showing a structure of a push pin used in an electronic component test socket according to an embodiment of the present invention. FIG. 5 is a diagram showing a load distribution and a deformation state of an electronic component through a test socket using a conventional push block (30) and a test socket using a push end (130) according to an embodiment of the present invention . FIG. 6 is a diagram showing a load distribution generated in electronic components of various shapes when an electronic component test socket according to an embodiment of the present invention is used.

Claims (8)

An electronic component test socket for testing electronic components, comprising: a bracket for supporting the electronic component such that a terminal of the electronic component is exposed to a first side; a contact pin located on a first side of the bracket and facing The electronic component moves and contacts the terminal; and a push pin positioned to face the stylus; wherein when the stylus contacts the electronic component, the push pin supports contact with the electronic component and the stylus The opposite side of the face. The electronic component test socket according to claim 1, wherein the push pins are arranged at positions corresponding to the contacts. The electronic component test socket according to claim 2, wherein the contact pin includes a contact plunger that is in contact with a terminal of the electronic component; and a contact plunger elastic member connected to the contact plunger and directed toward the contact plunger. The contact plunger in contact with the terminal of the electronic component exerts an elastic force; the push pin includes a push plunger that pressurizes the electronic component: and a push plunger elastic member connected to the push plunger and applied to The pressing plunger in contact with the electronic component exerts an elastic force; for the stylus and the pressing pin corresponding to each other's position, the elastic coefficients of the contact plunger elastic member and the pressing plunger elastic member are the same. The electronic component test socket according to claim 1, wherein the push pin includes a push plunger that pressurizes the electronic component; and a push plunger elastic member connected to the push plunger, and An elastic force is applied to the pressing plunger in contact with the electronic component. The electronic component test socket according to claim 4, wherein the pressing plunger includes a pressing end formed at an end portion and in contact with the electronic component, and the pressing end is formed of a soft non-metal portion. The electronic component test socket according to claim 4, wherein the pressing plunger includes a pressing end formed at an end portion and in contact with the electronic component, and the diameter of the pressing end is larger than the diameter of the pressing plunger. The electronic component test socket according to claim 4, wherein the pressing plunger includes a pressing end formed at an end portion and in contact with the electronic component, and the pressing end has a convex contact surface. The electronic component test socket according to claim 4, wherein the pressing plunger includes a pressing end formed at an end portion and in contact with the electronic component, and the pressing end has a flat contact surface.