TW201838003A - Separation device and separation method to increase the degree of freedom in selecting the shape of the interval maintaining member and prevent lacking versatility - Google Patents
Separation device and separation method to increase the degree of freedom in selecting the shape of the interval maintaining member and prevent lacking versatility Download PDFInfo
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Abstract
Description
本發明涉及分離裝置及分離方法。The invention relates to a separation device and a separation method.
歷來,已知增加貼附於接著片的複數個被著體的相互間隔的帶擴展裝置(分離裝置)(例如,專利文獻1參照)。 [先前技術文獻] [專利文獻]Conventionally, it is known to increase the space | interval of a band expansion device (separation device) of the several adherend adhered to an adhesive sheet (for example, refer patent document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2008-140874號公報[Patent Document 1] Japanese Patent Laid-Open No. 2008-140874
[發明所欲解決之問題][Problems to be solved by the invention]
然而,在如記載於專利文獻1的歷來的分離裝置,換到在黏著帶(接著片)的貼附晶圓(被著體)的表面(其中一面)側而貼附(安裝)框體(間隔維持構材),故間隔維持構材方面,需要具有用於避開被著體的內徑(貫通孔)的環狀的構材,因而具有欠缺在分離裝置方面的通用性如此的不妥。However, in the conventional separation device as described in Patent Document 1, the frame (attachment) is attached (mounted) on the surface (one side) of the wafer (subject) on the adhesive tape (adhesive sheet) ( Interval maintaining structure), the interval maintaining structure needs to have a ring-shaped structure for avoiding the inner diameter (through-hole) of the adherend, so it is not suitable for the versatility of the separation device. .
本發明之目的在於提供一種分離裝置及分離方法,可提高間隔維持構材的形狀的選擇自由度,防止欠缺通用性。 [解決問題之技術手段]An object of the present invention is to provide a separation device and a separation method, which can increase the freedom of selection of the shape of the interval maintaining structure and prevent the lack of versatility. [Technical means to solve the problem]
本發明採用記載於請求項的構成。 [對照先前技術之功效]The present invention adopts a configuration described in a claim. [Compared with the efficacy of the prior art]
依本發明時,在其中一面貼附被著體的接著片的另一面安裝間隔維持構材,故不需要採用具有貫通孔的環狀的構材作為間隔維持構材,該貫通孔係用於避開被著體者,可提高該間隔維持構材的形狀的選擇自由度,防止欠缺通用性。 此外,具備切斷手段時,將在接著片上被增加相互間隔的被著體搬送至別的程序之際,可防止接著片的端部成為搬送的障礙。 再者,間隔維持構材方面,採用基材與保持用接著劑層的至少2層的層積體時,可進一步增加間隔維持構材的選擇自由度,可有效防止欠缺通用性。 此外,維持構材安裝手段具備層積手段時,變得不需要預先準備層積基材與保持用接著劑層的間隔維持構材。 再者,間隔維持構材方面,採用其他接著片時,可將該間隔維持構材簡單地安裝於接著片。According to the present invention, the gap maintaining member is installed on the other side of the adhesive sheet to which the adhered body is attached. Therefore, it is not necessary to use a ring-shaped member having a through hole as the gap maintaining member. Avoiding the person to be adhered can increase the freedom of selection of the shape of the interval maintaining structure and prevent lack of versatility. In addition, when the cutting means is provided, when the adherends which are spaced apart from each other on the adhesive sheet are transported to another process, the end portion of the adhesive sheet can be prevented from becoming an obstacle to transport. Furthermore, in the case of the interval maintaining structure, when a laminate of at least two layers of the base material and the holding adhesive layer is used, the freedom of selection of the interval maintaining structure can be further increased, which can effectively prevent the lack of versatility. In addition, when the maintenance member mounting means is provided with the lamination means, it is not necessary to prepare in advance a gap maintaining member between the laminated base material and the holding adhesive layer. In addition, in the case of the gap maintaining member, when another bonding sheet is used, the gap maintaining member can be simply mounted on the bonding sheet.
以下,基於圖式說明本發明的實施方式。 另外,本實施方式中的X軸、Y軸、Z軸存在彼此正交的關係,X軸及Y軸係既定平面內的軸,Z軸係與前述既定平面正交的軸。再者,在本實施方式,以從與Y軸平行的箭頭BD方向視看時的情況為基準,在未舉出作為基準之圖的情況下說明方向時,「上」為Z軸的箭頭方向、「下」為其逆向,「左」為X軸的箭頭方向、「右」為其逆向,「前」為Y軸的箭頭方向、「後」為其逆向。Hereinafter, embodiments of the present invention will be described based on the drawings. In the present embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis and Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. In addition, in the present embodiment, the case when viewed from the direction of the arrow BD parallel to the Y axis is used as a reference, and when the direction is described without referring to the drawing as a reference, "up" is the direction of the Z axis arrow , "Down" is the reverse direction, "left" is the direction of the arrow on the X axis, "right" is the direction of the arrow, "front" is the direction of the arrow on the Y axis, and "rear" is the direction of the reverse.
本發明的分離裝置10具備複數個保持手段20、分離手段30、檢測手段40、維持構材安裝手段50、切斷手段60,該複數個保持手段20係就在其中一面AS1貼附複數個被著體CP的接著片AS的端部進行保持者,該分離手段30係使就接著片AS的端部進行保持的保持手段20相對移動,增加被著體CP的相互間隔者,該檢測手段40係可就被著體CP的相互間隔、各被著體CP的整體的集合形狀等進行檢測的相機、投影機等的攝像手段、光學感測器、音波感測器等的各種感測器等者,該維持構材安裝手段50係將可就透過分離手段30而增加的被著體CP的相互間隔進行維持的間隔維持構材DM安裝於接著片AS者,該切斷手段60係將接著片AS切斷者。 另外,接著片AS係於基材片的其中一面層積接著劑層,並具備如下性質:被賦予張力後,該張力被解除時,傾向接近變形前的狀態。The separation device 10 of the present invention includes a plurality of holding means 20, a separation means 30, a detection means 40, a maintenance member installation means 50, and a cutting means 60. The plurality of holding means 20 are attached on one side of AS1 with a plurality of quilts. The separating means 30 moves the holding means 20 holding the end of the next piece AS relative to the end of the sticking piece AS of the implant CP, and increases the mutual distance between the subject CP and the detecting means 40. Various sensors such as cameras, projectors, optical sensors, acoustic sensors, etc. that can detect the distance between the CPs, the collective shape of the entire CP, etc. Alternatively, the maintenance member installation means 50 is to install the interval maintenance member DM which can maintain the mutual distance of the adhered CP increased by the separation means 30 to the bonding sheet AS, and the cutting means 60 is to continue Slice AS Cutters. In addition, the adhesive sheet AS is formed by laminating an adhesive layer on one surface of the base material sheet, and has the property that when the tension is applied and the tension is released, the adhesive sheet tends to approach a state before deformation.
保持手段20具備:作為被分離手段30支撐的驅動機器的轉動馬達21、被其輸出軸21A支撐的上保持構材22。The holding means 20 includes a rotation motor 21 as a driving device supported by the separating means 30 and an upper holding member 22 supported by its output shaft 21A.
分離手段30具備:作為驅動機器的線性馬達31、被其滑件31A支撐並以上表面側支撐轉動馬達21的下保持構材32。The separating means 30 includes a linear motor 31 as a driving device, and a lower holding member 32 supported by the slider 31A and supporting the rotation motor 21 on the upper surface side.
維持構材安裝手段50係將由兩層的層積體而構成的間隔維持構材DM安裝於接著片AS的另一面AS2者,該兩層的層積體包含作為基材的玻璃板GP及作為保持用接著劑層的雙面接著片BA,該玻璃板GP係具備可勝過接著片AS傾向接近變形前的狀態之力的剛性者,該雙面接著片BA係貼附於該玻璃板GP者。 亦即,維持構材安裝手段50具備作為驅動機器的線性馬達51、作為驅動機器的線性馬達52、作為驅動機器的直線馬達53、支撐台54、層積手段55,該線性馬達51係具備移動於Y軸方向的滑件51A者,該線性馬達52係被滑件51A支撐,具備移動於X軸方向的滑件52A者,該直線馬達53係被滑件52A支撐者,該支撐台54係被其輸出軸53A支撐,具有可透過減壓泵浦、真空噴射器等的未圖示的減壓手段而支撐間隔維持構材DM的支撐面54A者,該層積手段55係於玻璃板GP層積雙面接著片BA,形成間隔維持構材DM者。 層積手段55具備支撐輥55A、導輥55B、剝離板55C、按壓輥55D、第1回收輥55F、驅動輥55H、第2回收輥55K,該支撐輥55A係就雙面接著片BA的其中一面暫著於帶狀的剝離片RL上、另一面暫著遮蓋片CS的原始材料RS進行支撐者,該導輥55B係導引原始材料RS者,該剝離板55C係將剝離片RL翻折,從該剝離片RL將雙面接著片BA剝離的作為剝離手段者,該按壓輥55D係隔著遮蓋片CS向玻璃板GP將雙面接著片BA按壓而貼附,並從雙面接著片BA將遮蓋片CS剝離的作為按壓手段者,該第1回收輥55F係被透過作為驅動機器的轉動馬達55E而驅動,將遮蓋片CS回收者,該驅動輥55H係被透過作為驅動機器的轉動馬達55G而驅動,將剝離片RL夾入壓輪55J之間者,該第2回收輥55K係透過未圖示的驅動機器的驅動,將剝離片RL回收者。The maintenance structure installation means 50 is a device for installing a space maintenance structure DM composed of a two-layer laminate on the other side AS2 of the adhesive sheet AS. The two-layer laminate includes a glass plate GP as a base material and a glass plate GP as a base material. The double-sided adhesive sheet BA of the holding adhesive layer has a rigidity that can surpass the force of the adhesive sheet AS tending to approach the state before deformation. The double-sided adhesive sheet BA is attached to the glass sheet GP. By. That is, the maintenance member mounting means 50 includes a linear motor 51 as a driving device, a linear motor 52 as a driving device, a linear motor 53 as a driving device, a support table 54, and a laminating means 55. In the case of a slider 51A in the Y axis direction, the linear motor 52 is supported by the slider 51A, and in the case of a slider 52A moving in the X axis direction, the linear motor 53 is supported by the slider 52A, and the support table 54 is Supported by its output shaft 53A and having a support surface 54A capable of supporting the interval maintaining member DM through a pressure reducing means (not shown) such as a pressure reducing pump, a vacuum ejector, etc. This lamination means 55 is attached to a glass plate GP The double-sided adhesive sheet BA is laminated to form a spacer DM. The laminating means 55 includes a support roller 55A, a guide roller 55B, a peeling plate 55C, a pressing roller 55D, a first recovery roller 55F, a driving roller 55H, and a second recovery roller 55K. The support roller 55A is a double-sided adhesive sheet BA. One side temporarily rests on the strip-shaped release sheet RL, and the other side temporarily supports the original material RS of the cover sheet CS. The guide roller 55B guides the original material RS, and the release plate 55C folds the release sheet RL. As the peeling means for peeling the double-sided adhesive sheet BA from the release sheet RL, the pressing roller 55D presses and adheres the double-sided adhesive sheet BA to the glass plate GP via the cover sheet CS, and adheres the sheet from the double-sided adhesive sheet. The first peeling roller 55F is driven by a rotating motor 55E as a driving device for the peeling of the cover sheet CS as a pressing means, and the driving roller 55H is transmitted as a driving device when the cover CS is recovered. The motor 55G is driven to sandwich the release sheet RL between the pressure rollers 55J. The second recovery roller 55K is driven by a drive device (not shown) to recover the release sheet RL.
切斷手段60具備:由複數個臂件而構成的作為驅動機器的多關節機器人61、被屬該多關節機器人61的作業部的前端臂61A經由托架62而支撐的作為切斷構材的刀刃63。多關節機器人61可為可於其作業範圍內將以前端臂61A支撐者位移至任一個位置、任一個角度的所謂6軸機器人等,可例示例如例示於日本特開2016-81974的多關節機器人111等。The cutting means 60 includes a articulated robot 61 as a driving device constituted by a plurality of arm members, and a articulated member 61A supported by a front end arm 61A of a work section belonging to the articulated robot 61 via a bracket 62. Blade 63. The articulated robot 61 can be a so-called 6-axis robot that can move the supporter of the front end arm 61A to any position and any angle within its working range. An exemplified example is the articulated robot illustrated in Japanese Patent Application Laid-Open No. 2016-81974 111 etc.
說明以上的分離裝置10的動作。 首先,對各構材在圖1(A)、(B)中以實線表示的初始位置待機的分離裝置10,該分離裝置10的使用者(以下簡稱「使用者」)將原始材料RS如同圖般設定後,經由操作面板、個人電腦等的未圖示的操作手段輸入自動運轉開始的信號。之後,作業員或驅動機器、傳送裝置等的未圖示的搬送手段將玻璃板GP載置於支撐面54A上時,維持構材安裝手段50驅動未圖示的減壓手段,開始該玻璃板GP的吸附保持。另外,本實施方式的玻璃板GP及雙面接著片BA採用不具有用於避開被著體CP的貫通孔之俯視四角形的構材。The operation of the separation device 10 described above will be described. First of all, the separation device 10 of each component standby at the initial position indicated by the solid line in FIGS. 1 (A) and (B), and the user of the separation device 10 (hereinafter referred to as "user") treats the original material RS as After the drawing is set, a signal for starting automatic operation is input via an operation means (not shown) such as an operation panel or a personal computer. After that, when a glass plate GP is placed on the supporting surface 54A by an unillustrated conveyance means such as an operator, a driving device, or a conveyer, the structural member mounting means 50 drives the pressure reducing means (not shown) to start the glass plate. Adsorption of GP is maintained. In addition, the glass plate GP and the double-sided adhesive sheet BA according to this embodiment are formed of a rectangular structure in plan view without a through hole for avoiding the object CP.
並且,作業員或未圖示的搬送手段將貼附複數個被著體CP下的接著片AS載置於下保持構材32上時,保持手段20驅動轉動馬達21,如在圖1(B)中以雙點劃線表示,以上保持構材22與下保持構材32保持接著片AS的端部。接著,分離手段30驅動各線性馬達31,使保持手段20相互分離而增加被著體CP的相互間隔。此時,各被著體CP係如示於圖2(A),有時由於接著片AS的應變等使得相互間隔無法增加至既定之間隔。所以,檢測手段40驅動相機等,就各被著體CP的相互間隔、各被著體CP的整體的集合形狀等進行檢測。接著,以檢測手段40的檢測結果為基礎,分離手段30驅動各線性馬達31,如示於圖2(B),以各被著體CP的相互間隔成為既定間隔的方式,或以各被著體CP的整體的集合形狀相對於基礎的整體的集合形狀成為相似關係的方式,使各保持手段20個別移動。In addition, when an operator or a conveyance means (not shown) attaches the plurality of adhesive sheets AS under the object CP to the lower holding member 32, the holding means 20 drives the rotation motor 21, as shown in FIG. 1 (B ) Is indicated by a two-dot chain line. The upper holding member 22 and the lower holding member 32 hold the ends of the sheet AS. Next, the separating means 30 drives the linear motors 31 to separate the holding means 20 from each other, thereby increasing the distance between the objects CP. At this time, as shown in FIG. 2 (A), each subject CP system may not be able to increase the mutual distance to a predetermined interval due to the strain of the bonding sheet AS or the like. Therefore, the detection means 40 drives a camera or the like to detect the distance between the subject CPs, the collective shape of the entire subject CPs, and the like. Next, based on the detection result of the detection means 40, the separation means 30 drives the linear motors 31, as shown in FIG. 2 (B), so that the interval between the respective objects CP becomes a predetermined interval, or each of the objects CP The overall collective shape of the volume CP is similar to the basic collective shape, and each holding means 20 is moved individually.
被著體CP的相互間隔增加為既定間隔或檢測手段40檢測出各被著體CP的整體的集合形狀成為既定形狀時,維持構材安裝手段50驅動線性馬達52,使支撐玻璃板GP下的支撐台54往左方移動。接著,玻璃板GP到達既定的位置時,維持構材安裝手段50驅動轉動馬達55E、55G,饋送原始材料RS,如在圖1(B)中以雙點劃線表示,於玻璃板GP貼附雙面接著片BA而形成間隔維持構材DM。接著,維持構材安裝手段50驅動線性馬達51、52,如示於圖3(A),將間隔維持構材DM配置於已增加相互間隔的被著體CP的下方後,驅動直線馬達53,如示於圖3(B),於接著片AS的另一面AS2側安裝間隔維持構材DM。When the interval between the objects CP increases to a predetermined interval or when the detection means 40 detects that the entire collective shape of each object CP becomes a predetermined shape, the structural member mounting means 50 drives the linear motor 52 to support the glass plate GP. The support base 54 moves to the left. Next, when the glass plate GP reaches the predetermined position, the maintaining material installation means 50 drives the rotation motors 55E and 55G, and feeds the original material RS, as shown by a two-dot chain line in FIG. 1 (B), and is attached to the glass plate GP. The sheet BA was adhered on both sides to form the gap maintaining member DM. Next, the maintaining member mounting means 50 drives the linear motors 51 and 52. As shown in FIG. 3 (A), the interval maintaining member DM is disposed below the adhered body CP having increased intervals, and then the linear motor 53 is driven. As shown in FIG. 3 (B), the space maintaining member DM is installed on the other side AS2 side of the adhesive sheet AS.
之後,切斷手段60驅動多關節機器人61,如示於圖3(C),將刀刃63對接著片AS進行突刺後,沿著被著體CP整體的外緣使該刀刃63繞一周而將接著片AS切斷,形成被安裝間隔維持構材DM、在接著片AS上已增加被著體CP的相互間隔的一體物WK。接著,切斷手段60驅動多關節機器人61,使刀刃63回歸至初始位置時,維持構材安裝手段50停止未圖示的減壓手段的驅動,解除間隔維持構材DM的吸附保持。然後,作業員或未圖示的搬送手段將一體物WK搬送至別的程序時,保持手段20驅動轉動馬達21,解除利用上保持構材22與下保持構材32進行的接著片AS的保持。之後,作業員或未圖示的搬送手段除去殘留於下保持構材32上的接著片AS部分時,各手段驅動個別的驅動機器,使各構材回歸至初始位置,之後重複上述同樣的動作。After that, the cutting means 60 drives the articulated robot 61. As shown in FIG. 3 (C), the blade 63 is stabbed to the subsequent piece AS, and then the blade 63 is wound around the entire periphery of the subject CP to make one revolution. Subsequently, the sheet AS is cut to form an integrated body WK in which the interval maintaining member DM is mounted, and the adherend CP is spaced apart from each other. Next, when the cutting means 60 drives the articulated robot 61 to return the blade 63 to the initial position, the maintaining structural material mounting means 50 stops driving of a pressure reducing means (not shown), and releases the interval maintaining structural material DM. Then, when the operator or a transporting means (not shown) transports the integrated body WK to another process, the holding means 20 drives the rotation motor 21 to release the holding of the adhesive sheet AS by the upper holding member 22 and the lower holding member 32. . After that, when the operator or a conveying means (not shown) removes the AS portion of the bonding sheet remaining on the lower holding member 32, each means drives an individual driving machine to return each member to the initial position, and then repeats the same operation described above. .
依如以上的分離裝置10時,將間隔維持構材DM安裝於在其中一面AS1貼附被著體CP的接著片AS的另一面AS2,故不需要採用具有貫通孔的環狀的構材作為間隔維持構材DM,該貫通孔係用於避開被著體CP者,可提高該間隔維持構材DM的形狀的選擇自由度,防止欠缺通用性。In the separation device 10 according to the above, the interval maintaining member DM is mounted on the other side AS2 of the adhesive sheet AS on which one side AS1 is attached to the adherent CP. Therefore, it is not necessary to use a ring-shaped member having a through hole as the The space maintaining member DM, the through-hole system is used to avoid the person to be adhered CP, and the freedom of selecting the shape of the space maintaining member DM can be increased to prevent lack of versatility.
在本發明中的手段及程序係只要可發揮就該等手段及程序進行說明的動作、功能或程序則無任何限定,更不論未完全限定於在前述實施方式所示的僅一實施方式的構成物、程序。例如,保持手段,係只要為可保持在其中一面貼附複數個被著體的接著片的端部者,則對照申請時的技術常識,只要為該技術範圍內者即無任何限定(其他手段及程序亦同)。The means and programs in the present invention are not limited as long as the operations, functions, or programs that describe the means and programs can be exerted, and they are not limited to the configuration of only one embodiment described in the foregoing embodiments. Things, procedures. For example, as long as the holding means can hold the ends of the plurality of adhered adhesive sheets on one side, according to the technical common sense at the time of application, there is no limitation as long as it is within the technical scope (other means And procedures are the same).
本發明的分離裝置係如示於圖4(A),亦可為一分離裝置10A,該分離裝置10A具備保持手段20、抵接手段70、分離手段30A、檢測手段40、維持構材安裝手段50A、切斷手段60,該抵接手段70係在接著片AS的比貼附複數個被著體CP的被著體接著區域CE靠外側、在保持手段20保持的保持區域HE的內側扺接於該接著片AS者,該分離手段30A係使保持接著片AS的端部下的保持手段20及抵接手段70相對移動,增加被著體CP的相互間隔者,該維持構材安裝手段50A係將可就透過分離手段30A而增加的被著體CP的相互間隔進行維持的間隔維持構材DM安裝於接著片AS者。 另外,於分離裝置10A,具有與分離裝置10同等的構成、同等的功能者係標注與該分離裝置10相同的編號而省略其構成說明,動作說明係簡略化。As shown in FIG. 4 (A), the separation device of the present invention may be a separation device 10A. The separation device 10A includes a holding device 20, an abutment device 70, a separation device 30A, a detection device 40, and a maintenance member installation device. 50A, cutting means 60, and the abutment means 70 is connected to the outer side of the adherence region CE of the plurality of adherends CP of the adhesive sheet AS, and is connected to the inner side of the retaining region HE held by the retaining means 20. In the case of the bonding sheet AS, the separation means 30A moves the holding means 20 and the abutment means 70 under the end of the holding sheet AS relatively, and increases the distance between the CPs of the object, and the maintenance member mounting means 50A An interval maintaining member DM capable of maintaining the mutual interval of the adherend CP increased by the separation means 30A is attached to the adhesive sheet AS. In addition, in the separation device 10A, those having the same configuration and functions as those of the separation device 10 are denoted by the same reference numerals as those of the separation device 10, and the description of the structure is omitted, and the description of operations is simplified.
分離手段30A具備:支撐於底板BP上的作為驅動機器的直線馬達33、被其輸出軸33A支撐、以上表面側支撐轉動馬達21的下保持構材34。 維持構材安裝手段50A係在具備移動於Y軸方向的滑件56A的作為驅動機器的線性馬達56的該滑件56A上,經由直線馬達53支撐支撐台54。 抵接手段70具備:被支撐於底板BP上,在眼前側形成容許維持構材安裝手段50A的出入的切槽71A的圓筒狀的抵接構材71。The separating means 30A includes a linear motor 33 as a driving device supported on the bottom plate BP, a lower holding member 34 supported by its output shaft 33A, and supporting the rotation motor 21 on the upper surface side. The maintenance member mounting means 50A is provided on the slider 56A which is a linear motor 56 as a driving device and includes a slider 56A that moves in the Y-axis direction, and supports the support table 54 via a linear motor 53. The abutment means 70 includes a cylindrical abutment member 71 that is supported on the bottom plate BP and has a cutout 71A that allows entry and exit of the member attachment means 50A to be formed on the front side of the eye.
如此的分離裝置10A,係預先在玻璃板GP上層積雙面接著片BA的間隔維持構材DM,以雙面接著片BA側成為上側的方式載置於位於抵接構材71的外側(眼前側)的支撐台54上。之後,作成如同分離裝置10,被貼附複數個被著體CP的接著片AS被載置於下保持構材34上時,保持手段20驅動轉動馬達21,如在圖4(B)中以雙點劃線表示,以上保持構材22與下保持構材34保持接著片AS的端部。另外,於接著片AS的端部,如示於圖4,雖貼附環狀的框體RF,惟亦可無該框體RF。接著,分離手段30A驅動直線馬達33,使保持手段20下降而使保持手段20及抵接手段70相對移動,如示於圖4(B),增加被著體CP的相互間隔後,維持構材安裝手段50A驅動線性馬達56,將間隔維持構材DM配置於已增加相互間隔的被著體CP的下方。然後,作成如同分離裝置10,如示於圖4(B),以維持構材安裝手段50A於接著片AS的另一面AS2側安裝間隔維持構材DM,以切斷手段60切斷接著片AS後,將一體物WK搬送至別的程序。Such a separating device 10A is configured by stacking the double-sided adhesive sheet BA on the glass plate GP in advance to maintain the space between the structural members DM, and placing the double-sided adhesive sheet BA on the outer side of the abutting member 71 (in front of the eye). Side). After that, it is made like the separating device 10, and when a plurality of adherent sheets AS to which the object CP is attached are placed on the lower holding member 34, the holding means 20 drives the rotation motor 21, as shown in FIG. 4 (B). The two-dot chain line indicates that the upper holding member 22 and the lower holding member 34 hold the ends of the sheet AS. In addition, as shown in FIG. 4, the end of the adhesive sheet AS is attached with a ring-shaped frame RF, but the frame RF may not be provided. Next, the separating means 30A drives the linear motor 33 to lower the holding means 20 and relatively move the holding means 20 and the abutment means 70. As shown in FIG. 4 (B), the distance between the objects CP is increased, and the structure is maintained. The mounting means 50A drives the linear motor 56 and arranges the interval maintaining member DM below the adhered body CP which has been increased in space from each other. Then, as shown in FIG. 4 (B), the separation device 10 is manufactured to maintain the structural material mounting means 50A on the other side AS2 of the bonding sheet AS, and the maintenance member DM is installed to cut off the bonding sheet AS by the cutting means 60. After that, the integrated WK is transferred to another procedure.
依如此的分離裝置10A,亦可獲得與分離裝置10同樣的效果。According to such a separation device 10A, the same effect as that of the separation device 10 can also be obtained.
保持手段20亦可相對於以圖1、4所示的狀態構成為以接著片AS上下反轉的狀態(被著體CP位於下方的狀態)保持該接著片AS的端部,此情況下,維持構材安裝手段50、50A,係成為於接著片AS之上表面側安裝間隔維持構材DM的構成。 保持手段20亦可為以機械式夾具、夾頭缸等的把持手段、庫侖力、接著劑、黏著劑、磁力、白努力吸附、驅動機器等就接著片AS的端部進行保持的構成。 保持手段20係在分離裝置10的情況下,例如亦能以兩體而構成,該兩體係以往右方移動的該保持手段20為一體、以往左方移動的該保持手段20為一體者,亦可例如以能以往右方、左方及其另一方向移動的三體以上而構成。 保持手段20係在分離裝置10A的情況下,可為一體亦可為兩體以上。The holding means 20 may be configured to hold the end of the bonding sheet AS in a state shown in FIGS. 1 and 4 in a state where the bonding sheet AS is turned upside down (the state of the subject CP is positioned below). In this case, The maintenance member mounting means 50 and 50A have a configuration in which the gap maintenance member DM is mounted on the upper surface side of the bonding sheet AS. The holding means 20 may be configured to hold the end of the sheet AS by a holding means such as a mechanical clamp, a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, a white force adsorption, a driving machine, and the like. In the case of the separation device 10, the holding means 20 may be constituted by, for example, two bodies. The holding means 20 that has been conventionally moved to the right in the two systems is integrated, and the holding means 20 that has been conventionally moved to the left is integrated. For example, it can be comprised of three or more bodies capable of moving conventionally in the right, left, and other directions. In the case of the separation device 10A, the holding means 20 may be integrated or may be two or more.
分離手段30、30A可為單數而非複數,此情況下,例如分離裝置10可構成為以一體的線性馬達的兩個滑件就保持手段20分別按各體進行支撐,增加被著體CP的相互間隔者,亦可構成為將被著體CP的相互間隔僅增加於一軸方向(例如,X軸方向或Y軸方向等)者。 分離手段30亦可構成為將相互間隔增加於3軸以上的方向(例如,X軸方向、Y軸方向及其他的軸方向)者,例如可構成為使予以移動於X軸方向的複數個保持手段20分別移動於Y軸方向(構成為使予以移動於Y軸方向的複數個保持手段20分別移動於X軸方向),增加被著體CP的相互間隔者,亦可構成為無法以被著體CP的相互間隔成為既定間隔的方式而作動,或者構成為無法以各被著體CP的整體的集合形狀相對於基礎的整體的集合形狀成為相似關係的方式而作動者。 分離手段30A亦可一面使保持手段20停止或移動,一面使抵接手段70移動,從而使保持手段20及抵接手段70相對移動,增加被著體CP的相互間隔。 分離手段30、30A係可作業員操作按鍵、桿體等而驅動線性馬達31、直線馬達33,此情況下,例如可構成為將依檢測手段40所得的檢測結果顯示於監視器、檢測器等的顯示器,依顯示於此顯示器的檢測結果,以被著體CP的相互間隔成為既定間隔的方式,或以各被著體CP的整體的集合形狀相對於基礎的整體的集合形狀成為相似關係的方式,作業員將線性馬達31、直線馬達33予以驅動者。The separation means 30 and 30A may be singular rather than plural. In this case, for example, the separation device 10 may be configured as two sliders with an integrated linear motor, and the holding means 20 are supported by each body separately to increase the number of the CP of the subject. Those who are spaced apart from each other may be configured to increase the space between the objects CP only in one axial direction (for example, the X-axis direction or the Y-axis direction). The separation means 30 may be configured to increase the distance between each other in three or more directions (for example, the X-axis direction, the Y-axis direction, and other axial directions). For example, the separation means 30 may be configured to hold a plurality of pieces moving in the X-axis direction. The means 20 are respectively moved in the Y-axis direction (the plurality of holding means 20 are moved in the X-axis direction), and the distance between the objects CP can be increased. The intervals between the body CPs are activated at predetermined intervals, or are configured such that they cannot be operated in such a manner that the entire collective shape of each subject CP has a similar relationship with the basic collective shape. (3) The separation means 30A may also move the contact means 70 while stopping or moving the holding means 20, thereby moving the holding means 20 and the contact means 70 relatively, and increasing the interval between the objects CP. The separation means 30 and 30A can be operated by the operator to operate the linear motor 31 and the linear motor 33 by operating keys, levers, and the like. In this case, for example, the detection results obtained by the detection means 40 can be displayed on a monitor, a detector, or the like. According to the detection result displayed on this display, the distance between the CPs of the subject CP becomes a predetermined interval, or the overall collective shape of each subject CP becomes similar to the basic collective shape. In the method, the operator drives the linear motor 31 and the linear motor 33.
檢測手段40亦可為作業員的目視,例如亦可構成為作業員透過目視,以被著體CP的相互間隔成為既定間隔的方式,或以各被著體CP的整體的集合形狀相對於基礎的整體的集合形狀成為相似關係的方式,操作按鍵、桿體等,驅動線性馬達31、直線馬達33者,可不具備於本發明的分離裝置10、10A。The detection means 40 may be the visual inspection of the operator. For example, the visual inspection may be performed by the operator so that the interval between the CPs of the subject becomes a predetermined interval, or the entire collective shape of each CP is relative to the base. The shape of the overall collection is similar to each other, and the buttons, levers, and the like are operated to drive the linear motor 31 and the linear motor 33, which may not be included in the separation devices 10 and 10A of the present invention.
維持構材安裝手段50、50A可構成為以機械式夾具、夾頭缸等的把持手段、庫侖力、接著劑、黏著劑、磁力、白努力吸附、驅動機器等支撐間隔維持構材DM,間隔維持構材DM方面,亦可構成為採用具備可勝過接著片AS傾向接近變形前的狀態之力的剛性的未圖示的其他接著片,將該未圖示的其他接著片貼附於接著片AS的另一面,間隔維持構材DM方面,亦可採用具有用於避開被著體CP的貫通孔的環狀的構材,間隔維持構材DM方面,亦可採用俯視三角形、五角形以上的多角形者、圓形、橢圓形、其他形狀者。 維持構材安裝手段50、間隔維持構材DM方面,可採用具備可預先安裝於接著片AS者之者,此情況下,可無層積手段55。 維持構材安裝手段50A在間隔維持構材DM方面,採用未預先在玻璃板GP上層積雙面接著片BA者,亦可構成為以與分離裝置10同等的層積手段55將雙面接著片BA層積於玻璃板GP上。The structural material installation means 50 and 50A can be configured to maintain the structural material DM by means of holding means such as mechanical fixtures, chuck cylinders, coulomb force, adhesives, adhesives, magnetic forces, white hard adsorption, and driving machinery. In terms of maintaining the structure DM, it is also possible to adopt another unillustrated adhesive sheet having a rigidity that can surpass the force of the adhesive sheet AS tending to be close to the state before deformation, and attach the other unillustrated adhesive sheet to the adhesive sheet. On the other side of the sheet AS, a ring-shaped structure having a through hole for avoiding the object CP can be used for the space-maintaining material DM. A space-maintaining material DM can also be a triangle or a pentagon in plan view. Polygonal, round, oval, and other shapes. For the maintenance structure installation means 50 and the interval maintenance structure DM, those having a pre-installation on the adhesive sheet AS may be used. In this case, there is no lamination method 55. In the structure maintenance installation means 50A, the double-sided adhesive sheet BA is not laminated on the glass plate GP in advance, and the double-sided adhesive sheet 55 may be formed by the same lamination means 55 as the separation device 10. BA is laminated on the glass plate GP.
切斷手段60係可代替刀刃63採用雷射切割機、離子束、火力、熱、水壓、電熱線、氣體、液體等的吹拂等作為切斷構材,或亦能以將適當的驅動機器進行組合者使切斷構材移動而進行切斷,而可不具備於本發明的分離裝置10、10A。The cutting means 60 can replace the blade 63 with a laser cutter, ion beam, fire power, heat, water pressure, electric heating wire, gas, liquid, etc. as the cutting structure, or it can be driven by a suitable drive machine. The combiner may move the cutting member and cut it, but may not be provided in the separation devices 10 and 10A of the present invention.
抵接手段70除矩形狀、橢圓筒狀等以外,亦可採用圓柱、角柱、橢圓中等的其他形狀的抵接構材71。In addition to the abutting means 70, in addition to a rectangular shape, an elliptical tube shape, or the like, other shapes of abutting members 71 such as a column, a corner column, and an ellipse can also be used.
分離裝置10A亦可構成為將維持構材安裝手段50A配置於抵接構材71的內部,該維持構材安裝手段50A不出入於抵接構材71的內部,此情況下,維持構材安裝手段50A可無線性馬達56,抵接構材71可無切槽71A。The separating device 10A may be configured such that the maintenance member installation means 50A is disposed inside the abutting member 71, and the maintenance member installation means 50A does not enter and exit the inside of the abutting member 71. In this case, the maintenance member installation is maintained The means 50A may be the wireless motor 56, and the abutting member 71 may have no notch 71A.
間隔維持構材DM可代替玻璃板GP而採用例如金屬、樹脂、木材、陶器等的構材,可採用外緣部厚度形成為比其他區域大的杯狀、鍋狀者,只要接著片AS為具備可勝過傾向接近變形前的狀態的力的剛性者則可為任意者,形狀亦可為任意形狀。 保持用接著劑層亦可為於基材片的兩面具有以相同的成分或不同的成分而構成的接著劑層之雙面接著片、液體或凝膠狀的接著劑。 間隔維持構材DM可不使用保持用接著劑層而採用以潤濕性、磁附、吸附、白努力吸附等安裝於接著片AS者。The interval maintaining member DM can replace the glass plate GP with members such as metal, resin, wood, and pottery. The outer edge portion can be cup-shaped or pot-shaped with a thickness greater than that of other regions. Any rigid body having a force capable of overcoming a force that tends to approach the state before deformation may be arbitrary, and the shape may be any shape. The adhesive layer for rhenium holding may be a double-sided adhesive sheet having an adhesive layer composed of the same component or different components on both sides of the substrate sheet, and a liquid or gel-like adhesive. The interval maintaining member DM can be installed on the adhesive sheet AS by using wettability, magnetic adhesion, adsorption, white adhesion, etc. without using a holding adhesive layer.
本發明中的接著片AS、雙面接著片BA、其他接著片及被著體CP的材質、類別、形狀等未特別限定。如此的接著片AS、雙面接著片BA、及其他接著片可為例如圓形、橢圓形、三角形、四角形等的多角形,亦可為其他形狀,可為感壓接著性、感熱接著性等接著方式者,採用感熱接著性者的情況下以設置將其加熱的適當的線圈加熱器、熱管的加熱側等的加熱手段等的適當的方法進行接著即可。此外,接著片AS及其他接著片可為例如僅接著劑層的單層者、在基材與接著劑層之間具有中間層者、在基材之上表面具有遮蓋層等3層以上者,再者亦可為如可將基材從接著劑層剝離的所謂雙面接著片者,如此的雙面接著片、雙面接著片BA可為具有單層或複層之中間層者,亦可為無中間層的單層或複層者。此外,被著體CP方面,例如可為食品、樹脂容器、矽半導體晶圓、化合物半導體晶圓等的半導體晶圓、半導體晶片、電路基板、光碟等的資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等的單體物,亦可為將該等以兩者以上而形成的複合物,任意的方式的構材、物品等亦可作為對象。另外,接著片AS係換功能性、用途性的讀法,例如可為資訊記載用標籤、裝飾用標籤、保護片、切割帶、晶粒接著膜DAF、晶粒接合帶、記錄層形成樹脂片等的任意的薄片、膜、貼帶等。 被著體CP亦可為在接著片AS上預先存在複數個,可為在以分離手段30、30A對接著片AS賦予張力的時點進行單片化,成為在接著片AS上存在複數個者。在對如此的接著片AS賦予張力的時點存在複數個的被著體CP方面,例如為下述者而無任何限定:對半導體晶圓照射雷射,於該半導體晶圓形成線狀、格狀等的脆弱的弱線,在對接著片AS賦予張力的時點進行單片化,成為複數個被著體CP;例如以刀刃切入於樹脂、玻璃板,於該樹脂、玻璃板形成線狀、格狀等的未貫通表背的切斷預定線、穿孔的切斷預定線等,在對接著片AS賦予張力的時點成為複數個被著體CP。The materials, types, shapes, and the like of the adhesive sheet AS, the double-sided adhesive sheet BA, other adhesive sheets, and the subject CP in the present invention are not particularly limited. Such an adhesive sheet AS, a double-sided adhesive sheet BA, and other adhesive sheets may be a polygon such as a circle, an ellipse, a triangle, a quadrangle, or other shapes, and may be pressure-sensitive adhesive, heat-sensitive adhesive, etc. In the case of the bonding method, in the case of using a thermally sensitive adhesive, the bonding may be performed by an appropriate method such as providing a suitable coil heater for heating it, a heating side such as a heating pipe, and the like. In addition, the adhesive sheet AS and other adhesive sheets may be, for example, a single layer having only an adhesive layer, an intermediate layer between the substrate and the adhesive layer, and a three or more layers including a cover layer on the upper surface of the substrate. Furthermore, it may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. Such double-sided adhesive sheet, double-sided adhesive sheet BA may be an intermediate layer having a single layer or multiple layers, or It is a single layer or a multi-layer without an intermediate layer. In addition, as for the object CP, it can be, for example, food wafers, resin containers, silicon semiconductor wafers, compound semiconductor wafers, semiconductor wafers, semiconductor wafers, circuit boards, information recording boards such as optical discs, glass plates, steel plates, and ceramics. Monomers such as wood, wood, and resin may also be composites formed of two or more of these, and structures, articles, and the like in any manner may also be targeted. In addition, the adhesive sheet AS is used for functional and usable reading. For example, it can be an information recording label, a decorative label, a protective sheet, a dicing tape, a die attach film DAF, a die bonding tape, and a recording layer forming resin sheet. Any sheet, film, tape, etc. The target CP may have a plurality of pre-existing pieces on the adhesive sheet AS, and may be singulated when the tension is applied to the adhesive sheet AS by the separation means 30, 30A, thereby becoming a plurality of pieces on the adhesive sheet AS. When there is a plurality of adherent CPs at the time when tension is applied to such an adhesive sheet AS, it is, for example, without limitation: a semiconductor wafer is irradiated with laser light, and the semiconductor wafer is formed into a linear or lattice shape. Such weak lines of weakness are singulated at the point when tension is applied to the adhesive sheet AS, and become a plurality of adherents CP; for example, cut into a resin or glass plate with a blade, and form a linear, grid on the resin or glass plate. When the tension is applied to the adhesive sheet AS, the cut-off line, such as a cut line that does not penetrate the front and back, or a perforation, etc., becomes a plurality of objects CP.
前述實施方式中的驅動機器只要可採用轉動馬達、直線馬達、線性馬達、單軸機器人、多關節機器人等的電動機器、汽缸、油壓缸、無桿缸及旋缸等的致動器等,則亦可採用將該等直接或間接組合者。As long as the driving machine in the foregoing embodiment can use electric motors such as rotary motors, linear motors, linear motors, single-axis robots, articulated robots, actuators such as cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc., It is also possible to use a combination of these directly or indirectly.
10、10A10‧‧‧分離裝置10, 10A10‧‧‧ separation device
2010‧‧‧保持手段2010‧‧‧ Means of retention
30、30A10‧‧‧分離手段30, 30A10‧‧‧ Separation means
50、50A10‧‧‧維持構材安裝手段50, 50A10 ‧ ‧ ‧ maintenance of structural installation methods
5510‧‧‧層積手段5510‧‧‧Layering means
6010‧‧‧切斷手段6010‧‧‧ Cutting means
7010‧‧‧抵接手段7010‧‧‧Abutment means
AS10‧‧‧接著片AS10‧‧‧continued
AS110‧‧‧其中一面One side of AS110‧‧‧
AS210‧‧‧另一面AS210‧‧‧ the other side
BA10‧‧‧雙面接著片(保持用接著劑層)BA10‧‧‧Double-sided adhesive sheet (adhesive layer for holding)
CE10‧‧‧被著體接著區域CE10‧‧‧Body-attached area
CP10‧‧‧被著體CP10‧‧‧ Undercover
HE10‧‧‧保持區域HE10‧‧‧ holding area
DM10‧‧‧間隔維持構材DM10‧‧‧Interval maintenance structure
GP10‧‧‧玻璃板(基材)GP10‧‧‧Glass Plate (Base Material)
[圖1](A)係本發明的實施方式相關的分離裝置的平面圖。(B)係圖1(A)之側視圖。 [圖2](A)、(B)係本發明的實施方式相關的分離裝置的動作說明圖。 [圖3](A)~(C)係本發明的實施方式相關的分離裝置的動作說明圖。 [圖4](A)、(B)係本發明的其他例的說明圖。[Fig. 1] (A) is a plan view of a separation device according to an embodiment of the present invention. (B) is a side view of FIG. 1 (A). [FIG. 2] (A) and (B) are operation explanatory diagrams of the separation device according to the embodiment of the present invention. [FIG. 3] (A) to (C) are operation explanatory diagrams of the separation device according to the embodiment of the present invention. [FIG. 4] (A) and (B) are explanatory diagrams of another example of the present invention.
Claims (8)
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| JP2017-078141 | 2017-04-11 | ||
| JP2017078141A JP6880431B2 (en) | 2017-04-11 | 2017-04-11 | Separation device and separation method |
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| TW201838003A true TW201838003A (en) | 2018-10-16 |
| TWI771376B TWI771376B (en) | 2022-07-21 |
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| JP2005209829A (en) * | 2004-01-22 | 2005-08-04 | Taiyo Yuden Co Ltd | Method and apparatus of fixing semiconductor wafer, and structure to fix semiconductor wafer |
| JP2006013000A (en) * | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | IC chip manufacturing method |
| JP2006054246A (en) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | Wafer separation method |
| JP4772559B2 (en) | 2006-03-31 | 2011-09-14 | 株式会社ディスコ | Chip interval maintaining method and chip interval maintaining apparatus |
| JP2008140874A (en) | 2006-11-30 | 2008-06-19 | Disco Abrasive Syst Ltd | Tape expansion unit |
| JP2008192910A (en) * | 2007-02-06 | 2008-08-21 | Joyo Kogaku Kk | Dicing adhesive sheet and dicing method |
| CN101850538B (en) * | 2009-04-01 | 2012-10-10 | 日月光半导体制造股份有限公司 | Wafer support jig and method for grinding, transporting and cutting wafer |
| JP2011166002A (en) | 2010-02-12 | 2011-08-25 | Disco Abrasive Syst Ltd | Method for processing wafer |
| JP5961047B2 (en) * | 2012-06-22 | 2016-08-02 | 株式会社ディスコ | Wafer processing method |
| JP6045837B2 (en) * | 2012-07-26 | 2016-12-14 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
| JP5992277B2 (en) * | 2012-09-20 | 2016-09-14 | 株式会社ディスコ | Processing method |
| JP6132502B2 (en) * | 2012-09-27 | 2017-05-24 | 株式会社ディスコ | Wafer processing method |
| WO2014136836A1 (en) * | 2013-03-07 | 2014-09-12 | 住友ベークライト株式会社 | Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device |
| JP6096017B2 (en) * | 2013-03-19 | 2017-03-15 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP2016092207A (en) * | 2014-11-05 | 2016-05-23 | 株式会社ディスコ | Method of manufacturing frame unit |
| JP6393596B2 (en) * | 2014-11-19 | 2018-09-19 | リンテック株式会社 | Alignment apparatus and alignment method |
| JP6408366B2 (en) * | 2014-12-05 | 2018-10-17 | リンテック株式会社 | Separation device and separation method |
| JP6417236B2 (en) | 2015-02-26 | 2018-10-31 | 株式会社ディスコ | Wafer dividing method and chuck table |
| TWI603393B (en) * | 2015-05-26 | 2017-10-21 | 台虹科技股份有限公司 | Semiconductor device manufacturing method |
| JP6559013B2 (en) * | 2015-08-20 | 2019-08-14 | リンテック株式会社 | Sheet sticking device and sticking method |
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| KR20180114832A (en) | 2018-10-19 |
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| KR102457844B1 (en) | 2022-10-21 |
| CN108695196B (en) | 2023-03-24 |
| CN108695196A (en) | 2018-10-23 |
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