TW201837250A - Wire saw system for improving a surface profile of a wafer - Google Patents

Abstract

This invention provides a wire saw system for improving a surface profile of a wafer, and the wire saw system comprises a crystal ingot feeding device, a wire saw, and a wire saw driver. Furthermore, the wire saw system comprising: a presser sensor positioned on the crystal ingot feeding device and adapted to detect the pressure of the wire saw provided by a crystal ingot; a first displacement sensor mounted on the crystal ingot feeding device and adapted to detect the movement and position deviations of the crystal ingot; a first temperature sensor adapted to detect the temperature of a region of the wire saw which the crystal ingot contacted with; a speed sensor adapted to detect the movement speed of the wire saw. Via the arrangements of the system described above, the system is capable of detecting the pressure, the temperature and the movement speed in the real time. Via these detected data, any user can regulate functions with respect to wire slicing for improving the surface profile of the wafer.

Description

   Wire cutting system for improving wafer surface cutting morphology   

The invention belongs to the technical field of semiconductor equipment, and particularly relates to a wire cutting system for improving the cutting morphology of a wafer surface.

In the wafer manufacturing process, the ingot needs to be cut to obtain the required wafer. At present, the most commonly used wafer cutting equipment is a wire cutting machine. The structure of an existing wire cutting machine is shown in FIG. 1. As can be seen from FIG. 1, the wire cutting machine includes: a wire saw 11, a clamp rail 12, and a cutting wire guide. 14 and cutting line 15; one end of the clip rail 12 is fixed to the wire saw 11 and the other end is fixed to the ingot 16 to be cut through the bonding resin layer 13, and the clip rail 12 is suitable for Driving the ingot 16 to be moved to the cutting line 15 under driving; the cutting line 15 is wound on the cutting line guide 14 and is suitable for moving under the driving of the cutting line guide 14 and The ingot 16 to be cut is subjected to wire cutting.

However, because the cutting line 15 has surface defects, these surface defects will cause a nanotopology on the surface of the cut wafer. The so-called nanotopology refers to the formation of 0.2mm on the wafer surface. Spatial wavelength deviation of ~ 20mm. However, the existing wire cutting machine cannot improve the nano topological structure caused by cutting the wafer from the ingot 16 to be cut by itself. In order to reduce or improve the deviation of the nano-topological structure topography, an additional process step is generally required to process the cut wafer, but this will undoubtedly cause a waste of time and cost.

In view of the shortcomings of the prior art described above, an object of the present invention is to provide a wire cutting system for improving the cutting surface morphology of a wafer surface, which is used to solve the wafer surface morphology that cannot be improved by the wire cutting machine in the prior art. And the time and cost caused by the extra process steps must be used.

In order to achieve the above object and other related objects, the present invention provides a wire cutting system for improving the cutting surface morphology of a wafer surface. The wire cutting system for improving the cutting surface morphology of a wafer surface includes: an ingot feeding device, a cutting line, and cutting. Line driving device; the ingot feeding device is suitable for fixing the ingot to be cut, and driving the ingot to be cut to move to the cutting line, and the cutting line driving device is suitable for driving the cutting line, and Wire cutting the ingot to be cut; further comprising: a pressure sensor, located on the ingot feeding device, adapted to detect the pressure of the ingot to be cut on the cutting line; a first displacement A sensor is located on the ingot feeding device and is suitable for detecting the movement and position shift of the ingot to be cut; a first temperature sensor is suitable for detecting the ingot to be cut and the cutting The temperature of the line contact area; the speed sensor is adapted to detect the moving speed of the cutting line.

As a preferred solution of the wire cutting system for improving the cutting profile of the wafer surface of the present invention, the ingot feeding device includes a wire saw and a clamping rail; one end of the clamping rail is fixed to the ingot to be cut, and the other end is connected with The wire saw is connected; the wire saw is adapted to drive the clamp rail and the cutting ingot to move.

As a preferred solution of the wire cutting system for improving the cutting morphology of the wafer surface of the present invention, the ingot feeding device further includes a bonding resin layer, and the bonding resin layer is located on the clamping rail and the to-be-cut The ingots are suitable for fixing the ingot to be cut on the clamping rail.

As a preferred solution of the wire cutting system for improving the cutting profile of the wafer surface of the present invention, the first displacement sensor is a six-axis acceleration sensor.

As a preferred solution of the wire cutting system for improving the cutting morphology of the wafer surface of the present invention, the first temperature sensor is an infrared sensor.

As a preferred solution of the wire cutting system for improving the cutting surface morphology of a wafer surface of the present invention, the wire cutting system further includes: a data memory, and the pressure sensor, the first displacement sensor, The first temperature sensor and the speed sensor are communicatively connected, and are suitable for connecting the pressure sensor, the first displacement sensor, the first temperature sensor, and the speed sensor. The data detected by the processor is stored; the processor is connected to the data memory and is adapted to extract the pressure sensor, the first displacement sensor, the first sensor stored in the data memory A temperature sensor and data detected by the speed sensor, and a wire cutting process program is set according to the extracted data to control the wire cutting process.

As a preferred solution of the wire cutting system for improving the cutting surface morphology of a wafer surface of the present invention, the wire cutting system further includes a processor, the processor, the pressure sensor, and the first displacement sensor. The first temperature sensor and the speed sensor are communicatively connected, and are suitable for being connected with the pressure sensor, the first displacement sensor, the first temperature sensor, and the The data detected by the speed sensor sets the wire cutting process program to control the wire cutting process.

As a preferred solution of the wire cutting system for improving the cutting morphology of the wafer surface of the present invention, the cutting wire driving device includes a cutting wire guide, and the cutting wire is wound on the cutting wire guide; the cutting wire guide The number is several, and several of the cutting line guides are located on both sides of the moving path of the ingot to be cut, and are suitable for driving the moving of the cutting line to perform line cutting on the ingot to be cut.

As a preferred solution of the wire cutting system for improving the cutting surface morphology of a wafer surface of the present invention, the wire cutting system further includes: a fixing portion located at both ends of each of the cutting line guide rails; A cooling pipe, the surface of the fixed part is provided with a first inlet and a first outlet connected to the first cooling pipe; a second cooling pipe is provided in the cutting line guide, and the cutting line guide The end surface is provided with a second inlet and a second outlet communicating with the second cooling pipeline; a heat exchanger is connected to the first inlet, the first outlet, the second inlet and the second outlet, and is suitable for supplying to the A cooling liquid is provided in the first cooling pipeline and the second cooling pipeline; a second temperature sensor is located on the end surface of the cutting line guide rail and is connected to the data memory, which is suitable for detecting all The temperature of the cutting line guide and the temperature of the cooling liquid flowing through the cutting line guide, and storing the detected temperature data in the data memory; a third temperature sensor is located on the surface of the fixed part, and With the data memory It is suitable for detecting the temperature of the fixed part and the temperature of the cooling liquid flowing through the fixed part, and storing the detected temperature data in the data memory; a second displacement sensor located in the data memory; The end face of the cutting line guide is connected to the data memory, and is suitable for detecting the movement and axial displacement of the cutting line guide, and storing the detected data in the data memory; a third displacement sensing A processor, located on the surface of the fixed portion and connected to the data memory, adapted to detect the movement of the fixed portion and store the detected data in the data memory; the processor is adapted to Extracting the pressure sensor, the first displacement sensor, the first temperature sensor, the speed sensor, the second temperature sensor, stored in the data memory, The third temperature sensor, the second displacement sensor, and the data detected by the third displacement sensor, and a wire cutting process program is set according to the extracted data to control the wire cutting process.

As described above, the wire cutting system of the present invention for improving the surface cutting morphology of a wafer has the following beneficial effects: The wire cutting system of the present invention is provided with a pressure sensor, a first displacement sensor, and a first temperature sensor by adding a pressure sensor, a first displacement sensor, and a first temperature sensor. And speed sensor, which can detect the pressure of the ingot to be cut on the cutting line, the movement and position deviation of the ingot to be cut, the temperature of the area where the ingot is in contact with the cutting line, and the speed of the cutting line. The user can adjust and set the wire cutting process program according to the detected data, so as to control the wire cutting process, thereby improving the morphology of the wafer surface obtained by cutting and avoiding the nano-topological structure of the surface of the wafer obtained by cutting.

11‧‧‧Wire saw

12‧‧‧ clip rail

13‧‧‧ Bonded resin layer

14‧‧‧Cutting Line Guide

15‧‧‧cut line

16‧‧‧ Ingot to be cut

211‧‧‧Wire saw

212‧‧‧Clip rail

213‧‧‧bonded resin layer

22‧‧‧cut line

23‧‧‧Cutting Line Guide

231‧‧‧Second Import

232‧‧‧Second Exit

24‧‧‧Fixed section

241‧‧‧First Import

242‧‧‧Second Import

25‧‧‧Pressure sensor

26‧‧‧The first displacement sensor

27‧‧‧The first temperature sensor

28‧‧‧speed sensor

29‧‧‧Data Memory

30‧‧‧ processor

31‧‧‧Heat exchanger

32‧‧‧Second temperature sensor

33‧‧‧Third temperature sensor

34‧‧‧Second displacement sensor

35‧‧‧Third displacement sensor

36‧‧‧ Ingot to be cut

FIG. 1 is a schematic structural diagram of a wire cutting system for improving the surface cutting morphology of a wafer in the prior art.

FIG. 2 to FIG. 5 are structural schematic diagrams of a wire cutting system for improving a wafer surface cutting morphology according to the present invention.

The following describes the embodiments of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

See Figures 2 to 5. It should be noted that the illustrations provided in this embodiment only illustrate the basic idea of the present invention in a schematic manner, although the illustrations only show the components related to the present invention and not the number, shape and For size drawing, the type, quantity, and proportion of each component can be changed at will in actual implementation, and the layout of the components may be more complicated.

Please refer to FIG. 2, the present invention provides a wire cutting system for improving the cutting surface morphology of a wafer surface. The wire cutting system for improving the cutting surface morphology of a wafer surface includes an ingot feeding device, a cutting line 22 and a cutting line driving device. The ingot feeding device is suitable for fixing the ingot 36 to be cut and driving the ingot 36 to be moved toward the cutting line 22, and the cutting line driving device is suitable for driving the cutting line 22 to move, And wire cutting the ingot to be cut 36; the wire cutting system further includes: a pressure sensor 25, which is located on the ingot feeding device and is suitable for detecting the ingot Pressure of the ingot to be cut 36 on the cutting line 22; a first displacement sensor 26, the first displacement sensor 26 is located on the ingot feeding device and is suitable for detecting the ingot to be cut Movement and position shift of the ingot 36; a first temperature sensor 27, the first temperature sensor 27 is adapted to detect a temperature in a contact area between the ingot 36 to be cut and the cutting line 22; a sense of speed Detector 28, the speed sensor 28 is adapted to detect the Moving speed.

As an example, the ingot feeding device includes a wire saw 211 and a clamp rail 212; one end of the clamp rail 212 fixes the ingot 36 to be cut and the other end is connected to the wire saw 211; the wire saw 211 It is suitable for driving the clamp rail 212 and the cutting ingot 36 to move.

As an example, the ingot feeding device further includes a bonding resin layer 213, which is located between the clamp rail 212 and the ingot 36 to be cut, and is suitable for the ingot to be cut. The ingot 36 is fixed on the clamping rail 212.

As an example, the first displacement sensor 26 may be, but is not limited to, a six-axis acceleration sensor.

As an example, since the first temperature sensor 27 is used to detect a temperature in a contact area between the ingot to be cut 36 and the cutting line 22, the first temperature sensor 27 does not affect the cutting The line 22 cuts the ingot 36 to be cut, and the first temperature sensor 27 is disposed outside the ingot 36 to be cut. Preferably, in this embodiment, the first temperature sensor 27 may be an infrared sensor.

In an example, as shown in FIG. 3, the wire cutting system further includes: a data memory 29, the data memory 29 and the pressure sensor 25, the first displacement sensor 26, all The first temperature sensor 27 and the speed sensor 28 are communicatively connected, and are suitable for connecting the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, and The data detected by the speed sensor 28 is stored; the data memory 29 and the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, and all The speed sensor 28 can be connected through any wireless communication method or wired communication method. Preferably, in this embodiment, the data memory 29, the pressure sensor 25, and the first The displacement sensor 26, the first temperature sensor 27, and the speed sensor 28 are connected via wireless communication methods such as Bluetooth, 2G, 3G, 4G, or Wi-Fi; the processor 30, The processor 30 is connected to the data memory 29, and is adapted to extract the data stored in the data memory 29. The data detected by the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, and the speed sensor 28, and setting a wire cutting process program according to the extracted data, To control the wire cutting process.

In another example, as shown in FIG. 4, the wire cutting system further includes a processor 30, the processor 30 and the pressure sensor 25, the first displacement sensor 26, the first A temperature sensor 27 and the speed sensor 28 are communicatively connected, and are suitable for being connected with the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, and the sensor. The data detected by the speed sensor 28 sets a wire cutting process program to control the wire cutting process.

The wire cutting system of the present invention can detect the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, and the speed sensor 28 in real time by adding the same. The pressure of the ingot to be cut 36 on the cutting line 22, the movement and positional deviation of the ingot to be cut 36, the temperature of the area where the ingot to be cut 36 contacts the cutting line 22, and the cutting line The moving speed of 22, the user can adjust the wire cutting process program according to the detected data through the processor 30, so as to control the wire cutting process, thereby improving the morphology of the wafer surface obtained by cutting and avoiding cutting. The nanometer topological morphology exists on the surface of the wafer.

As an example, referring to FIG. 5, the cutting line driving device includes a cutting line guide 23, and the cutting line 22 is wound on the cutting line guide 23. The number of the cutting line guides 23 is several The cutting wire guides 23 are located on both sides of the moving path of the ingot 36 to be cut, and are suitable for driving the cutting line 22 to move to perform wire cutting on the ingot 36 to be cut.

As an example, please continue to refer to FIG. 5, the wire cutting system further includes: a fixing portion 24, which is located at both ends of each of the cutting wire guides 23; and a first cooling pipe is provided in the fixing portion 24 (Not shown), a surface of the fixing portion 24 is provided with a first inlet 241 and a first outlet 242 connected to the first cooling pipeline; a second cooling pipeline is provided in the cutting line guide 23 (Not shown), an end surface of the cutting line guide 23 is provided with a second inlet 231 and a second outlet 232 which are in communication with the second cooling pipeline; a heat exchanger 31, and the heat exchanger 31 and the The first inlet 241, the first outlet 242, the second inlet 231, and the second outlet 232 are connected, and are suitable for providing a cooling liquid into the first cooling pipeline and the second cooling pipeline; a second temperature sensing Device 32, the second temperature sensor 32 is located on the end surface of the cutting line guide 23 and is connected to the data memory 29, and is suitable for detecting the temperature of the cutting line guide 23 and flowing through the cutting The temperature of the cooling liquid of the wire guide 23 and stores the detected temperature data in the data memory 29 The third temperature sensor 33 is located on the surface of the fixed portion 24 and is connected to the data memory 29. The third temperature sensor 33 is suitable for detecting the temperature and flow of the fixed portion 24. The temperature of the cooling liquid of the fixing part 24 and storing the detected temperature data in the data memory 29; a second displacement sensor 34, the second displacement sensor 34 is located on the cutting line The end surface of the guide rail 23 is connected to the data memory 29 and is suitable for detecting the movement and axial displacement of the cutting line guide rail 23 and storing the detected data in the data memory 29; third A displacement sensor 35, the third displacement sensor 35 is located on the surface of the fixed portion 24 and is connected to the data memory 29, and is suitable for detecting the movement of the fixed portion 24 and detecting The data is stored in the data memory 29; the processor 30 is adapted to extract the pressure sensor 25, the first displacement sensor 26, the first sensor stored in the data memory 29 A temperature sensor 27, the speed sensor 28, the second temperature sensor 32, the Three temperature sensor 33, the sensor 34 and the second displacement sensor 35 detects the third displacement information, and based on the extracted data program to set cutting process, cutting process in order to be controlled. Of course, in other examples, if the wire cutting system does not include the data memory 29, the pressure sensor 25, the first displacement sensor 26, the first temperature sensor 27, Detected by the speed sensor 28, the second temperature sensor 32, the third temperature sensor 33, the second displacement sensor 34, and the third displacement sensor 35 The data is transmitted directly to the processor 30.

In summary, the present invention provides a wire cutting system for improving the cutting surface morphology of a wafer surface. The wire cutting system for improving the cutting surface morphology of a wafer surface includes: an ingot feeding device, a cutting line, and a cutting line driving device; The ingot feeding device is suitable for fixing the ingot to be cut and driving the ingot to be cut to the cutting line, and the cutting line driving device is suitable for driving the cutting line to move the ingot to be cut. Cutting the ingot for wire cutting; further comprising: a pressure sensor located on the ingot feeding device, adapted to detect the pressure of the ingot to be cut on the cutting line; a first displacement sensor, It is located on the ingot feeding device and is suitable for detecting the movement and position deviation of the ingot to be cut. The first temperature sensor is suitable for detecting the contact area between the ingot to be cut and the cutting line. Temperature; speed sensor, adapted to detect the moving speed of the cutting line. By adding a pressure sensor, a first displacement sensor, a first temperature sensor and a speed sensor, the wire cutting system of the present invention can detect the pressure of the ingot to be cut on the cutting line and the ingot to be cut in real time. Movement and position deviation, the temperature of the contact area between the ingot to be cut and the cutting line, and the speed of the cutting line. The user can adjust and set the wire cutting process program based on the detected data to control the wire cutting process, thereby Improve the morphology of the wafer surface obtained by dicing, and avoid the existence of nano topological structure on the surface of the diced wafer.

The above-mentioned embodiments merely illustrate the principle of the present invention and its effects, but are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field to which they belong without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the scope of patent application of the present invention.

Claims (9)

    A wire cutting system for improving the cutting morphology of a wafer surface includes an ingot feeding device, a cutting line, and a cutting line driving device. The ingot feeding device is suitable for fixing an ingot to be cut and driving the ingot. The cutting ingot moves toward the cutting line, and the cutting line driving device is adapted to drive the cutting line to move and perform line cutting on the ingot to be cut. The wire cutting system for improving the cutting surface of the wafer surface also Including: a pressure sensor located on the ingot feeding device, adapted to detect the pressure of the ingot to be cut on the cutting line; a first displacement sensor located on the ingot feeding On the device, suitable for detecting the movement and position deviation of the ingot to be cut; a first temperature sensor, suitable for detecting the temperature of the contact area between the ingot to be cut and the cutting line; And a speed sensor is suitable for detecting the moving speed of the cutting line.         The wire cutting system for improving the cutting surface morphology of a wafer according to claim 1, wherein the ingot feeding device comprises a wire saw and a clamping rail; one end of the clamping rail fixes the ingot to be cut and the other end It is connected with the wire saw; the wire saw is suitable for driving the clamp rail and the cutting ingot to move.         The wire cutting system for improving the cutting surface morphology of a wafer according to claim 2, wherein the ingot feeding device further includes a bonding resin layer, the bonding resin layer is located on the clamping rail and the target The cutting ingot is suitable for fixing the ingot to be cut on the clamping rail.         The line cutting system for improving the surface cutting morphology of a wafer according to claim 1, wherein the first displacement sensor is a six-axis acceleration sensor.         The wire cutting system for improving the surface cutting morphology of a wafer according to claim 1, wherein the first temperature sensor is an infrared sensor.         The wire cutting system for improving the surface cutting morphology of a wafer according to claim 1, wherein the wire cutting system further comprises: a data memory, the pressure sensor, the first displacement sensor, The first temperature sensor and the speed sensor are communicatively connected, and are suitable for connecting the pressure sensor, the first displacement sensor, the first temperature sensor, and the speed sensor. The data detected by the sensor is stored; a processor is connected to the data memory, and is suitable for extracting the pressure sensor, the first displacement sensor, all sensors stored in the data memory. The data detected by the first temperature sensor and the speed sensor are set, and a wire cutting process program is set according to the extracted data to control the wire cutting process.         The wire cutting system for improving the surface cutting morphology of a wafer according to claim 1, wherein the wire cutting system further includes a processor, the processor, the pressure sensor, and the first displacement sensing Sensor, the first temperature sensor, and the speed sensor are communicatively connected, and are suitable for communication with the pressure sensor, the first displacement sensor, the first temperature sensor, and all sensors. The wire cutting process program is set by the data detected by the speed sensor to control the wire cutting process.         The wire cutting system for improving the surface cutting morphology of a wafer according to claim 6 or 7, wherein the cutting wire driving device comprises a cutting wire guide, and the cutting wire is wound on the cutting wire guide; The number of cutting line guides is several, and several of the cutting line guides are located on both sides of the moving path of the ingot to be cut, and are suitable for driving the cutting line to move to perform line cutting on the ingot to be cut. .         The wire cutting system for improving the cutting surface morphology of a wafer according to claim 8, wherein the wire cutting system further includes: a fixing portion located at both ends of each of the cutting line guide rails; A first cooling pipeline, a first inlet and a first outlet connected to the first cooling pipeline are provided on the surface of the fixed portion; a second cooling pipeline is provided in the cutting line guide; A second inlet and a second outlet communicating with the second cooling pipeline are provided on an end surface of the cutting line guide; a heat exchanger is connected to the first inlet, the first outlet, and the second The inlet and the second outlet are connected, and are suitable for supplying cooling liquid into the first cooling pipeline and the second cooling pipeline; a second temperature sensor is located on an end surface of the cutting line guide, And is connected with the data memory, and is suitable for detecting the temperature of the cutting line guide and the temperature of the cooling liquid flowing through the cutting line guide, and storing the detected temperature data in the data memory; A third temperature sensor located on the fixed And is connected to the data memory, and is suitable for detecting the temperature of the fixed part and the temperature of the cooling liquid flowing through the fixed part, and storing the detected temperature data in the data memory. A second displacement sensor, which is located on the end surface of the cutting line guide and is connected to the data memory, and is suitable for detecting the movement and axial displacement of the cutting line guide, and detecting the data Stored in the data memory; a third displacement sensor located on the surface of the fixed portion and connected to the data memory, and is suitable for detecting the motion of the fixed portion and storing the detected data Stored in the data memory; the processor is adapted to extract the pressure sensor, the first displacement sensor, the first temperature sensor, the Data detected by the speed sensor, the second temperature sensor, the third temperature sensor, the second displacement sensor and the third displacement sensor, and based on the extracted data Set the wire cutting process program to cut the wire The cutting process is controlled.