TW201836002A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

This substrate processing device includes: a liquid processing unit that supplies a processing liquid to an outer surface of a substrate inside a processing chamber and forms a processing liquid film on the outer surface of the substrate; a solidifying unit that solidifies the processing liquid film inside a solidifying chamber and forms a solidified film on the outer surface of the substrate; a removal processing unit that supplies, to the outer surface of the substrate, a removing liquid for removing the solidified film inside a removal chamber; a main conveying unit that conveys the substrate into the processing chamber and conveys the substrate out of the removal chamber; and a local conveying unit that conveys the substrate out of the processing chamber and conveys the substrate into the solidifying chamber.

Description

Substrate processing apparatus and substrate processing method

The present invention relates to an apparatus and method for processing a substrate. The substrate to be processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for a disk, a substrate for a disk, and a magnetic substrate. A substrate for a optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like.

In the manufacturing process of a semiconductor device or the like, a washing process for removing foreign matter adhering to the surface of the substrate is performed. For example, Patent Document 1 discloses a substrate washing system that performs a step of supplying a film forming treatment liquid containing a volatile component to a main surface of a substrate, and curing or curing the film forming treatment liquid by evaporating the volatile component. Forming a film on the main surface of the substrate; and removing the film on the main surface of the substrate with the removal liquid. When the film forming treatment liquid is cured or hardened, volume shrinkage occurs, and if the removal liquid is supplied, volume expansion occurs due to swelling of the film. When the volume shrinks and expands, the stretching force acts on the particles on the substrate, causing the particles to detach from the main surface of the substrate (the surface containing the pattern). Thereby, the particles on the main surface of the substrate can be removed.

In FIG. 14 of Patent Document 1, a substrate washing apparatus including a first processing unit, a second processing unit, and a third processing unit is shown. The substrate taken out from the carrier is carried into the first processing unit by the substrate transfer device. The first processing unit supplies a top coat liquid to the substrate as a film forming processing liquid. The substrate coated with the supplied surface is taken out from the first processing unit by the substrate transfer device, and carried into the third processing unit. The third processing unit heats the substrate by a hot plate to volatilize volatile components in the top coating liquid. Thereby, the top coating liquid is solidified or hardened while being volume-contracted, thereby forming a top coat film. The substrate on which the top coat film is formed is taken out from the third processing unit by the substrate transfer device, and carried into the second processing unit. The second processing unit removes the top coat film by supplying an alkali developer as a removal liquid to the substrate. Thereafter, the substrate is washed in the second processing unit, and the washed substrate is taken out from the second processing unit by the substrate transfer device. The processed substrate is housed on a carrier. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2015-62259 (Fig. 14)

[Problems to be Solved by the Invention] In the prior art of the patent document 1, the same substrate transfer device carries the unprocessed substrate into the first processing unit, and the substrate on which the film forming processing liquid is applied is applied from the first processing unit. The substrate is transported to the third processing unit, and the substrate on which the film is formed by the heat treatment in the third processing unit is transported from the third processing unit to the second processing unit, and the substrate that has finished the processing in the second processing unit is self-owned. The second processing unit is carried out.

Since the surface of the processed substrate in the first processing unit is wetted by the unhardened film forming processing liquid, the film forming processing liquid may adhere to the substrate transfer device. The attached treatment liquid is thereafter transferred to other substrates held by the substrate transfer device to contaminate the substrate. In particular, transfer of the treatment liquid to the substrate that has been processed will destroy the quality of the substrate treatment. Further, since the atmosphere of the film forming processing liquid is enveloped in the space in which the substrate is transported by the substrate transfer device, there is a possibility that the atmosphere adversely affects the substrate.

Accordingly, it is an object of the present invention to provide a substrate processing apparatus and a substrate processing method which have suppressed the influence of a process for forming a cured film on a surface of a substrate from affecting other substrates. [Means for solving the problem]

According to an embodiment of the present invention, a substrate processing apparatus includes: a liquid processing unit that supplies a processing liquid to a surface of a substrate in a processing chamber to form a processing liquid film on a surface of the substrate; and a curing unit that causes the processing liquid in the curing chamber Forming a cured film on the surface of the substrate; removing the processing unit, supplying a removal liquid for removing the cured film to the surface of the substrate in the removal chamber; and moving the main transport unit into the processing chamber And a partial transfer unit that carries out the substrate from the processing chamber and carries the substrate into the curing chamber.

According to the above configuration, after the processing liquid film on the substrate is formed, the substrate is carried into the curing chamber by the partial transfer unit. Therefore, it is possible to prevent the main transport unit from being contaminated by the treatment liquid, so that the transfer of the treatment liquid to other substrates can be suppressed or prevented. Further, it is possible to suppress or prevent the atmosphere of the processing liquid from being enclosed in the space in which the substrate is transported by the main transport unit, and therefore it is possible to prevent the atmosphere of the processing liquid from adversely affecting the substrate. In this way, the substrate processing quality can be improved. Further, regardless of the operating state of the main transport unit, the substrate on which the processing in the processing chamber has been completed can be quickly transported to the curing chamber.

The substrate processing apparatus may also be used to perform a washing process of removing foreign matter on the surface of the substrate. Volume shrinkage occurs when the liquid film is cured on the surface of the substrate for curing. Further, when the removal liquid is supplied to remove the cured film formed on the surface of the substrate, the cured film is swollen to cause volume expansion. When the volume is contracted and expanded, the tensile force acts on foreign matter (fine particles or the like) on the surface of the substrate, whereby foreign matter on the surface of the substrate can be peeled off. The peeled foreign matter can be removed to the outside of the substrate together with the cured film.

In an embodiment of the invention, the curing unit includes a heating unit that heats the substrate. Thereby, the processing liquid film on the substrate can be heated and cured.

More specifically, the curing unit may further include a substrate holding unit that holds the substrate, and the heating unit that heats the substrate held on the substrate holding unit.

The curing unit may also include a decompression unit that decompresses the curing chamber to a pressure below atmospheric pressure. Further, the curing unit may further include a ventilation unit that ventilates the curing chamber. The ventilation unit may also include a low-humidity gas supply unit that supplies a low-humidity gas (for example, an inert gas) to the curing chamber. Thereby, drying of the film formation processing liquid film on the substrate can be promoted, and the curing thereof can be promoted.

In one embodiment of the present invention, the main transport unit is disposed in a main transport chamber, and the partial transport unit is disposed in a partial transport chamber that is isolated from the main transport chamber. Thereby, it is possible to more reliably suppress or prevent the atmosphere of the processing liquid from being enveloped in the main transfer chamber, so that it is possible to suppress or prevent the substrate conveyed by the main transport unit from being affected by the atmosphere of the processing liquid.

In one embodiment of the present invention, the partial transport unit further carries out the substrate from the curing chamber and carries the substrate into the removal chamber. Thereby, it is possible to prevent the substrate of the main transport unit from being self-cured. For example, even if the substrate after the curing process is at a high temperature, heat storage of the main transport unit can be avoided.

In the configuration of Patent Document 1, since the substrate is heated in the third processing unit, the heated substrate is held by the substrate transfer device, and heat may be accumulated in the substrate transfer device. Since the accumulated heat is transferred to the substrate conveyed by the substrate transfer device, there is a possibility that the substrate is adversely affected.

Therefore, by transferring the substrate to the removal chamber from the curing chamber by the partial transfer unit, heat can be prevented from being accumulated in the main transfer unit, so that the influence of heat on the substrate conveyed by the main transfer unit can be suppressed.

In one embodiment of the present invention, the partial transport unit includes a first transport arm that carries out a substrate from the processing chamber, carries the substrate into the curing chamber, and carries out the substrate from the curing chamber to the removal chamber. Move into the second transfer arm of the substrate.

According to this configuration, the substrate on which the liquid film is formed is transported by the first transport arm, and the substrate on which the cured film is formed is transported by the second transport arm. Therefore, even if the treatment liquid adheres to the first transfer arm, the transfer of the treatment liquid to the substrate after the curing treatment can be suppressed or prevented.

It is preferable that the second transfer arm is disposed above the first transfer arm, thereby preventing or preventing the processing liquid on the substrate held by the first transfer arm from adhering to the second transfer arm.

In one embodiment of the present invention, the liquid processing unit includes a substrate holding unit that horizontally holds the substrate, and a processing liquid ejecting unit that ejects the processing liquid to the substrate held by the substrate holding unit. According to this configuration, the treatment liquid can be spread on the substrate held horizontally, thereby forming a treatment liquid film covering the surface of the substrate.

In an embodiment of the invention, the processing chamber and the removal chamber are the same chamber. That is, the treatment liquid and the removal chamber may be different chambers or the same chamber.

In one embodiment of the present invention, the partial transport unit includes a transport arm that holds a substrate and passes through a partial transport chamber, and the substrate processing apparatus further includes a discharge chamber that is disposed in the partial transfer chamber and that ejects the transport arm. The arm washing nozzle of the washing liquid.

According to this configuration, the transport arm of the partial transport unit can be washed, so that the transport arm can be kept in a clean state. Thereby, it is possible to prevent the contamination of the treatment liquid from being accumulated in the transfer arm, and it is possible to convey the substrate while suppressing the contamination caused by the treatment liquid. Further, since the washing of the transfer arm is performed in the partial transfer chamber, it is possible to suppress or prevent the influence of the washing liquid or the processing liquid from being transmitted to the substrate transported by the main transport unit.

In an embodiment of the invention, the partial transfer chamber includes a liquid discharge unit that receives the bottom of the washing liquid and discharges the washing liquid received by the bottom portion. Thereby, since the washing liquid after washing the conveyance arm can be discharged to the partial conveyance chamber, the atmosphere in the partial conveyance chamber can be kept clean. Thereby, the influence of the processing liquid atmosphere on the substrate can be further suppressed.

In one embodiment of the present invention, the partial transport unit has a transport arm that holds a substrate, and the substrate processing apparatus further includes an arm wash that is disposed on the transport arm to eject a washing liquid for washing the transport arm. nozzle. According to this configuration, the conveyance arm can be reliably washed by ejecting the washing liquid from the arm washing nozzle provided on the conveyance arm. Therefore, contamination of the treatment liquid can be prevented from being accumulated on the transfer arm, and the substrate can be transported while suppressing contamination by the treatment liquid. Further, it is possible to suppress or prevent the influence of the washing liquid or the processing liquid from affecting the substrate conveyed by the main transport unit.

In one embodiment of the present invention, the partial transport unit has a transport arm that holds a substrate and passes through a partial transport chamber, and the substrate processing apparatus further includes an arm washing chamber disposed adjacent to the partial transport chamber; a nozzle disposed in the arm washing chamber to eject a washing liquid for washing the conveying arm, and a decompression unit for decompressing the arm washing chamber to a pressure lower than atmospheric pressure to dry the conveying arm.

According to this configuration, the arm washing chamber is provided adjacent to the partial transfer chamber. Therefore, when the partial transport unit does not transport the substrate, the transport arm can be washed in the arm washing chamber. Since the arm washing nozzle is disposed in the arm washing chamber, the transfer arm can be washed while preventing the washing liquid from entering the partial transfer chamber. Thereby, the influence of the washing liquid on the substrate can be suppressed. Further, by depressurizing the arm washing chamber, the transfer arm washed by the washing liquid can be quickly dried.

In one embodiment of the present invention, the removal processing unit includes a substrate holding unit that horizontally holds the substrate in the removal chamber, and a removal liquid discharge unit that discharges the removal liquid to the substrate held by the substrate holding unit. According to this configuration, since the removal liquid is supplied to the substrate held horizontally, the removal liquid can be easily spread over the surface of the substrate, and the removal process of the cured film can be efficiently performed.

An embodiment of the present invention provides a substrate processing method including: a processing liquid film forming step of supplying a processing liquid to a surface of a substrate in a processing chamber to form a processing liquid film on a surface of the substrate; and a first partial conveying step in the After the liquid film forming step, the substrate is transported to a curing chamber; a cured film forming step is performed to cure the processed liquid film in the curing chamber to form a cured film on the surface of the substrate; and a second partial transport step After the solidified film forming step, the substrate is transported to the removal chamber; a removal processing step is performed in which the removal liquid for removing the cured film is supplied to the surface of the substrate; and the main handling In the step, the substrate is carried into the processing chamber by the main transport unit, and the substrate is carried out from the removal chamber.

In an embodiment of the invention, the cured film forming step includes a heating step of heating the substrate by a heating unit.

In one embodiment of the present invention, the substrate is transported by the main transport chamber in the main transport step, and is transported by a partial transport chamber that is isolated from the main transport chamber in the first partial transport step. The substrate.

In an embodiment of the present invention, the first partial transport step and the second partial transport step are performed by a common local transport unit.

In one embodiment of the present invention, the first partial transporting step is performed by the first transport arm of the partial transport unit, and the second partial transport arm of the local transport unit performs the second partial transport Handling steps.

A method according to an embodiment of the present invention further includes an arm washing step of supplying a washing liquid to a conveying arm of the partial conveying unit.

In an embodiment of the invention, the processing chamber and the removal chamber are common chambers.

In an embodiment of the invention, the washing step of washing the substrate is performed before the processing liquid film forming step.

The above and other objects, features, and advantages of the present invention will be apparent from the description of the embodiments described herein.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment] Fig. 1A is a plan view showing a configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention, and Fig. 1B is an elevational view thereof. The substrate processing apparatus 1 includes a carrier holding unit 2, an indexer robot IR, a plurality of liquid processing units M11 to M14, and a liquid processing unit M21 to a liquid processing unit M24 (collectively referred to as "liquid processing unit M" a plurality of curing units D11 to D14, curing unit D21 to curing unit D24 (collectively referred to as "curing unit D"), main transport robot CR, and local transport robot LR11 to local transport robot LR14, local transport robot LR21 to local transport robot LR24 (collectively referred to as "partial transport robot LR"). The main transport robot CR is an example of a main transport unit, and the local transport robot LR is an example of a local transport unit.

The carrier holding portion 2 holds the carrier 3, which is a substrate container that holds a plurality of substrates W in a laminated state. In the present embodiment, the carrier holding portion 2 is configured to hold a plurality of carriers 3. The index robot IR enters the carrier 3 held by the carrier holding portion 2 to pick up and place the substrate W, and transfers the substrate W to and from the main transport robot CR.

In the present embodiment, the plurality of liquid processing units M and the plurality of curing units D are three-dimensionally arranged so as to form a multilayer structure (two-layer structure in the present embodiment). Specifically, as shown in FIG. 1A, in the plan view, the main transport robot CR is disposed in the main transport chamber 5 extending linearly from the carrier holding portion 2, and each side of the main transport chamber 5 is along the main transport chamber 5 Two stacked cell groups G1, a stacked cell group G2, a stacked cell group G3, and a stacked cell group G4 are disposed. Thereby, four laminated unit groups G1 to G4 are disposed around the main transport robot CR in plan view.

In the first layer S1 and the second layer S2 of the substrate processing apparatus 1, four liquid processing units M11 to M14 and a liquid processing unit M21 to a liquid processing unit M24 are disposed, and the substrate processing apparatus 1 has a total of eight liquids. Processing unit M. In the first layer S1, two liquid processing units M11, a liquid processing unit M12, a liquid processing unit M13, and a liquid processing unit M14 are disposed along the main transfer chamber 5 on both sides of the main transfer chamber 5. Four curing units D11 to D14 are disposed in each of the four liquid processing units M11 to M14. Further, in the second layer S2, two liquid processing units M21, a liquid processing unit M22, a liquid processing unit M23, and a liquid processing unit M24 are disposed along the main transfer chamber 5 on both sides of the main transfer chamber 5. Four curing units D21 to D24 are disposed on the four liquid processing units M21 to M24, respectively. A liquid processing unit M forms a corresponding pair with the curing unit D disposed thereon.

The buildup unit group G1 is configured by stacking a liquid processing unit M11, a curing unit D11, a liquid processing unit M21, and a curing unit D21 in this order from the bottom. The build-up unit group G2 is configured by stacking a liquid processing unit M12, a curing unit D12, a liquid processing unit M22, and a curing unit D22 in this order from the bottom. The buildup unit group G3 is configured by stacking a liquid processing unit M13, a curing unit D13, a liquid processing unit M23, and a curing unit D23 in this order from the bottom. The build-up unit group G4 is configured by stacking a liquid processing unit M14, a curing unit D14, a liquid processing unit M24, and a curing unit D24 in this order from the bottom.

The main transport robot CR can enter a total of eight liquid processing units M to deliver the substrate W, and then can exchange the substrate W with the index robot IR. The main transport robot CR may be configured to take in a total of eight curing units D to take out the substrate W.

In the present embodiment, the local transport robot LR includes four in the first layer S1 and four in the second layer S2. More specifically, in the first layer S1, two partial conveyance robots LR11, a partial conveyance robot LR12, a partial conveyance robot LR13, and a partial conveyance robot LR14 are disposed on both sides of the main conveyance chamber 5. More specifically, on the side of the main transfer chamber 5, in the first layer S1, a partial transfer robot LR11 is disposed between the carrier holding portion 2 and the liquid processing unit M11, on the side away from the carrier holding portion 2. The other end is provided with another partial handling robot LR12. The arrangement of the two partial transport robots LR13 and the local transport robot LR14 on the other side of the main transport chamber 5 is also the same. Further, the four partial transport robots LR21, the local transport robot LR22, the local transport robot LR23, and the local transport robot LR24 in the second layer S2 are also arranged in the same manner. The local transport robot LR11 to the local transport robot LR14 and the local transport robot LR21 to the local transport robot LR24 are disposed in the partial transport chamber C11 to the local transport chamber C14 and the partial transport chamber C21 to the local transport chamber C24 (collectively referred to as "partial transport chamber" C"). The partial transport chamber C is formed with a transport space that is divided into (separated) from the main transport chamber 5.

In this way, a partial transfer robot LR is provided for each pair of liquid processing unit M and curing unit D. The local transport robot LR takes out the substrate W processed by the liquid processing unit M from the liquid processing unit M, and transports it to the corresponding curing unit D.

An overview of the operation examples of the index robot IR, the main transport robot CR, and the local transport robot LR is as follows.

That is, the index robot IR takes out the unprocessed substrate W from any one of the carriers 3 and delivers it to the main transport robot CR. The main transport robot CR carries the substrate W received from the index robot IR to any one of the liquid processing units M. The liquid processing unit M performs processing on the loaded substrate W. Specifically, the liquid processing unit M applies a pre-washing treatment to the surface of the substrate, and then supplies the processing liquid for film formation to the substrate W, and forms a liquid film of the processing liquid on the surface of the substrate W. The substrate W processed by the liquid processing unit M, that is, the substrate W on which the processing liquid film is formed on the surface is carried out by the partial transfer robot LR, and transported to the curing unit D disposed directly above the substrate. The curing unit D cures the processed liquid film on the surface of the loaded substrate W to form a cured film on the surface of the substrate W. The substrate W after the curing process is transported to the liquid processing unit M by the partial transfer robot LR. The liquid processing unit M supplies the removal liquid to the substrate W, and removes the cured film of the surface of the substrate W (removal treatment), and then performs a post-washing process. Thereafter, the substrate W is carried out from the liquid processing unit M by the main transport robot CR. The main transport robot CR delivers the substrate W to the indexing robot IR. The index robot IR stores the delivered substrate W in any of the carriers 3.

The substrate W processed by the curing unit D can also be transported by the main transport robot CR. In other words, the main transport robot CR can carry out the substrate W processed by the curing unit D from the curing unit D, and carry it into any liquid processing unit M to perform the removal process. At this time, the liquid processing unit M that supplies the processing liquid for film formation to the substrate W and the liquid processing unit M that performs the removal processing may be different liquid processing units.

The indexing robot IR can also be operated in such a manner that the unprocessed substrate W is delivered to the main transport robot CR, and immediately before, immediately after or at the same time, the autonomous transport robot CR receives the processed substrate W. Similarly, the main transport robot CR can also be operated in such a manner that the unprocessed substrate W is received from the indexing robot IR, and the processed substrate W is delivered to the indexing robot IR immediately before, immediately after or at the same time. . Further, the main transport robot CR can also be operated in such a manner that the unprocessed substrate W is carried into the liquid processing unit M, and the processed substrate W is carried out from the liquid processing unit M immediately after or immediately before it (after The treated substrate W) is washed.

As described above, in the present embodiment, one curing unit D corresponds to one liquid processing unit M. Then, the liquid processing unit M and the curing unit D are laminated. Furthermore, for a pair of a liquid processing unit M and a curing unit D, a partial handling robot LR is provided, to which the partial handling robot LR can enter. The local transport robot LR carries out the substrate W that has been processed by the liquid processing unit M from the liquid processing unit M, and transports it to the curing unit D corresponding to the liquid processing unit M, and carries it into the curing unit D. Specifically, the local transport robot LR transports the substrate W taken out from the liquid processing unit M in the vertical direction (more specifically, upward). Further, the local transport robot LR carries out the substrate W processed by the curing unit D from the curing unit D, transports it to the liquid processing unit M corresponding to the curing unit D, and carries it into the liquid processing unit M. Specifically, the local transport robot LR transports the substrate W taken out from the curing unit D in the vertical direction (more specifically, downward). The main transport robot CR carries the unprocessed substrate W into the liquid processing unit M, and carries out the processed substrate W from the liquid processing unit M.

The liquid processing unit M also has a function as a removal processing unit in the above embodiment.

FIG. 2 is a schematic cross-sectional view for explaining a configuration example of the liquid processing unit M. The liquid processing unit M includes a processing chamber 11. The processing chamber 11 is an example of a processing chamber in which a processing liquid film is formed on the surface of the substrate W, and is also an example of a removal chamber for removing a cured film on the surface of the substrate W. In the processing chamber 11, a spin chuck 12 as a substrate holding unit that horizontally holds the substrate W and rotatably, a cup 13 surrounding the spin chuck 12, and a liquid medicine nozzle 14 are provided. The film forming processing liquid nozzle 15 as the processing liquid discharging unit, the removal liquid nozzle 16 as the removal liquid discharging unit, the cleaning nozzle 29, and the blocking plate 19. The spin chuck 12 is rotated around a vertical rotation axis 18 by a motor 17 as an example of a substrate rotation unit.

A chemical liquid pipe 21 is coupled to the chemical liquid nozzle 14. In the middle of the chemical solution pipe 21, a chemical liquid valve 22 for opening the chemical liquid passage switch is inserted. The chemical liquid supply pipe 23 supplies the chemical liquid to the chemical liquid supply pipe 23. Examples of the chemical solution include hydrogen fluoride (HF), ammonia peroxide mixture (SC1), hydrochloric peroxide mixture (SC2), and sulfuric acid peroxidation. Sulfuric peroxide mixture (SPM), phosphoric acid, nitric acid, fluorine peroxide mixture (FPM), fluorinated ozone mixture (FOM), ammonia ozone mixture (Ammonia ozone mixture, AOM) and so on. The chemical liquid nozzle 14 may also be a moving nozzle that is movable above the substrate W held on the spin chuck 12. Further, the chemical liquid nozzle 14 of Fig. 2 is provided separately from the blocking plate 19, and the chemical liquid nozzle can be assembled to the blocking plate 19.

A film formation processing liquid pipe 26 is bonded to the film formation processing liquid nozzle 15. In the middle of the film formation processing liquid pipe 26, a film forming processing liquid valve 27 for opening the film forming processing liquid path is inserted. The film formation processing liquid piping 26 is supplied from the film forming processing liquid supply source 28 to the film forming processing liquid. The film formation treatment liquid is a liquid which can be cured by a predetermined curing treatment such as heating or decompression to form a cured film, and the cured film can be removed by a predetermined removal liquid. Specifically, as the film formation treatment liquid, a top coat liquid, a resist liquid, a phenol resin liquid, or the like can be used. The top coating liquid refers to a liquid for forming a protective film formed on a resist film. The film formation processing liquid nozzle 15 may be a moving nozzle that is movable above the substrate W held on the spin chuck 12.

The removal liquid pipe 101 is joined to the removal liquid nozzle 16. A liquid removal valve 102 for removing the liquid passage switch is inserted in the middle of the liquid removal pipe 101. The removal liquid is supplied from the removal liquid supply source 103 to the removal liquid pipe 101. The removal liquid is a liquid that can remove a cured film formed by curing the film formation treatment liquid. Specifically, as the removal liquid, an alkaline developer or SC1 (ammonia hydrogen peroxide water) can also be used. The alkaline developing solution may also contain aqueous ammonia, tetramethylammonium hydroxide (TMAH), choline aqueous solution or the like. The removal liquid nozzle 16 may also be a moving nozzle that is movable above the substrate W held on the spin chuck 12.

The cleaning liquid pipe 31A and the organic solvent pipe 31B are joined to the cleaning nozzle 29. More specifically, in the above embodiment, the cleaning liquid pipe 31A is coupled to the cleaning nozzle 29, and the organic solvent pipe 31B is merged with the cleaning liquid pipe 31A. In the middle of the cleaning liquid pipe 31A, a cleaning liquid valve 32A for arranging the cleaning liquid with a passage switch is inserted. In the middle of the organic solvent pipe 31B, an organic solvent valve 32B for opening and closing the organic solvent is inserted. The cleaning liquid is supplied from the cleaning liquid supply source 33A to the cleaning liquid pipe 31A. In the embodiment, the cleaning liquid is deionized water (DIW). Of course, other cleaning solutions such as carbonated water can also be used. The organic solvent is supplied from the organic solvent supply source 33B to the organic solvent pipe 31B. The organic solvent is an example of a liquid having a surface tension lower than that of the cleaning liquid. In the above embodiment, the cleaning liquid and the organic solvent are supplied from the common nozzle 29 through the pipe 31A. However, separate separate pipes and nozzles for supplying the cleaning liquid and the organic solvent may be provided.

The organic solvent is an organic solvent which can be replaced with a cleaning liquid, and more specifically, an organic solvent having affinity with water. As such an organic solvent, isopropyl alcohol (IPA), methanol, ethanol, butanol, acetone, propylene glycol monomethyl ether acetate (PGMEA), ethylene glycol methyl ether acetate ( Ethylene glycol monoethyl ether acetate, EGMEA), and the like.

The blocking plate 19 has an opposing surface 19a opposed to the upper surface of the substrate W held on the spin chuck 12. The shutter 19 is driven by the shutter drive unit 20. The shutter drive unit 20 includes a shutter lift unit 20A and a shutter rotation unit 20B. The shutter lifting unit 20A moves the shutter 19 up and down to bring the facing surface 19a closer to or away from the substrate W held by the spin chuck 12. The shutter rotation unit 20B rotationally drives the shutter 19 around the rotation axis 18 common to the spin chuck 12. More specifically, the blocking plate rotating unit 20B imparts a rotational force to the rotating shaft 25 that supports the blocking plate 19. A cleaning nozzle 29 is disposed at the center of the opposing surface 19a of the blocking plate 19, that is, on the rotation axis 18. The rotating shaft 25 is a hollow shaft, and a cleaning liquid pipe 31A is inserted therein.

An opening 19b that exposes the cleaning nozzle 29 downward is formed in the center of the opposing surface 19a. The opening 19b communicates with the internal space of the rotating shaft 25. An inert gas flow path 45 for allowing an inert gas to flow is formed between the cleaning liquid pipe 31A and the inner wall of the rotating shaft 25. An inert gas pipe 46 is connected to the inert gas flow path 45. In the middle of the inert gas pipe 46, an inert gas valve 47 for the flow path switch is inserted. The inert gas pipe 46 is combined with an inert gas supply source 48. The inert gas supply source 48 supplies an inert gas. The inert gas is a gas which is inert to the substance on the surface of the substrate W, and may be, for example, nitrogen. When the chemical liquid nozzle is assembled to the blocking plate 19, the chemical liquid pipe is further inserted into the rotating shaft 25, and the chemical liquid nozzle exposes the opening 19b downward.

When the shutter plate 19 is moved up and down by the shutter elevating unit 20A, the cleaning nozzle 29 is simultaneously moved up and down, whereby the height from the substrate W held on the spin chuck 12 to the cleaning nozzle 29 fluctuates.

The rotating shaft 130 of the spin chuck 12 is constituted by a hollow shaft. In the rotating shaft 130, a back nozzle 131 is inserted. The upper end of the back surface nozzle 131 is formed with a discharge port 132 that discharges the cleaning liquid toward the center of rotation of the lower surface of the substrate W. A cleaning liquid supply pipe 133 is coupled to the back surface nozzle 131. The cleaning liquid supply pipe 133 is coupled to the cleaning liquid supply source 135 via the cleaning liquid valve 134, and is coupled to the organic solvent supply source 137 via the organic solvent valve 136. The cleaning liquid supply source 135 supplies a cleaning liquid such as DIW. The organic solvent supply source 137 supplies an organic solvent such as IPA.

The space between the back nozzle 131 and the rotating shaft 130 forms an inert gas flow path 140 for supplying an inert gas toward the lower surface of the substrate W. An inert gas supply pipe 141 is coupled to the inert gas flow path 140. An inert gas valve 142 is inserted in the middle of the inert gas supply pipe 141. The inert gas supply pipe 141 is combined with the inert gas supply source 143. The inert gas supply source 143 supplies an inert gas. The inert gas is a gas inert to the material constituting the substrate W, and may be, for example, nitrogen.

In the side wall 35 and the side wall 36 of the processing chamber 11, the substrate loading/unloading opening 37 for loading and unloading the substrate W by the main transport robot CR and the substrate loading and unloading of the substrate W by the partial transport robot LR are respectively formed. / Move out of the opening 38. The shutter 39 and the shutter 40 that open the opening switches are disposed on the substrate loading/unloading opening 37 and the substrate loading/unloading opening 38, respectively. The baffle 39 and the baffle 40 are separately driven and driven by the baffle drive unit 41 and the baffle drive unit 42. The substrate loading/unloading opening 37 is an opening that allows the main transfer chamber 5 to communicate with the processing chamber 11, and is formed on the side wall 35 that divides the main transfer chamber 5 and the processing chamber 11. The substrate loading/unloading opening 38 is an opening that allows the processing chamber 11 to communicate with the partial transfer chamber C, and is formed on the side wall 36 that divides the processing chamber 11 and the partial transfer chamber C.

The outline of the operation of the liquid processing unit M is as follows.

When the main transport robot CR carries the unprocessed substrate W, the shutter 39 opens the substrate loading/unloading opening 37. The hand HC (arm) of the main transport robot CR holding the unprocessed substrate W enters the processing chamber 11 from the substrate loading/unloading opening 37, and delivers the substrate W to the spin chuck 12. For the transfer of the substrate W, the cup 13 or the spin chuck 12 may be moved up and down as needed. The hand HC that has delivered the substrate W to the main transport robot CR of the spin chuck 12 exits from the processing chamber 11 through the substrate loading/unloading opening 37. Then, the shutter driving unit 41 drives the shutter 39 to close the substrate loading/unloading opening 37.

Then, the spin chuck 12 is rotated by the motor 17, and the chemical valve 22 is opened. Thereby, the chemical liquid is supplied to the surface of the substrate W in a rotating state, and the chemical liquid is spread over the entire surface of the surface of the substrate W by centrifugal force. As described above, the chemical liquid step (the liquid chemical step for the pre-washing) for treating the substrate W with the chemical liquid is performed. The supply of the chemical solution is stopped by closing the chemical solution valve 22, and the chemical liquid step is completed.

After the chemical liquid step, the cleaning liquid valve 32A and the cleaning liquid valve 134 are opened while the rotation of the spin chuck 12 is continued. Thereby, the cleaning liquid is supplied to the front and back surfaces of the substrate W in a rotating state. The cleaning liquid supplied to the surface of the substrate W spreads over the entire area of the surface of the substrate W, thereby replacing the chemical liquid on the surface of the substrate W. Moreover, the cleaning liquid supplied to the back surface of the substrate W spreads over the entire area of the back surface of the substrate W, thereby rinsing the cleaning liquid adhering to the back surface of the substrate W. As described above, the washing step is performed. By closing the cleaning liquid valve 32A, the supply of the cleaning liquid is stopped, and the washing step is completed.

The organic solvent valve 32B is opened after the end of the washing step, or just before the end of the washing step. Thereby, an organic solvent is supplied to the surface of the substrate W. The spin chuck 12 is kept in a rotated state. Therefore, the organic solvent spreads over the entire area of the surface of the substrate W, thereby replacing the cleaning liquid on the surface of the substrate W. At this time, the shutter drive unit 20 lowers the shutter 19 and is disposed at a processing position where the opposing surface 19a is close to the surface of the substrate W.

Next, the organic solvent valve 32B is closed to raise the shutter 19 . Then, the film forming processing liquid nozzle 15 is placed above the substrate W, and in this state, the film forming processing liquid valve 27 is opened. Thereby, the film formation processing liquid is supplied to the surface of the substrate W. The spin chuck 12 is kept in a rotated state. Therefore, the film formation treatment liquid spreads over the entire area of the surface of the substrate W, and the liquid film 10 is formed over the entire area of the surface of the substrate W. After the film formation treatment liquid film 10 is formed, the film formation treatment liquid valve 27 is closed.

Then, after the film formation processing liquid nozzle 15 is retracted, the blocking plate 19 is lowered, and the processing position at which the opposing surface 19a and the substrate W are close to each other is disposed. Then, the organic solvent valve 136 is opened. Thereby, an organic solvent is supplied from the back surface nozzle 131 to the back surface (lower surface) of the substrate W, and the organic solvent is spread over the entire area of the back surface of the substrate W by centrifugal force, thereby rinsing the film forming treatment liquid adhering to the back surface of the substrate W. .

Thereafter, the organic solvent valve 136 is closed to accelerate the rotation of the spin chuck 12. Thereby, the liquid component on the back surface of the substrate W is cleaved. At this time, the inert gas valve 47 and the inert gas valve 142 can also be opened. Thereby, volatilization of the volatile component in the film formation processing liquid film 10 is promoted on the surface side of the substrate W, whereby the solidification of the film formation processing liquid film 10 is promoted. Moreover, drying is promoted on the back side of the substrate W.

Thereafter, the shutter driving unit 20 retracts the shutter 19 to the upper side. Then, the rotation of the spin chuck 12 is stopped, and the process for forming the film formation processing liquid film 10 is ended.

Next, the shutter driving unit 42 drives the shutter 40 to open the substrate loading/unloading opening 38. The hand LH (arm) of the local transport robot LR enters the processing chamber 11 from the substrate loading/unloading opening 38, receives the substrate W from the spin chuck 12, and passes the substrate W through the substrate loading/unloading opening 38. Move out to the outside of the processing chamber 11. For the transfer of the substrate W, the cup 13 or the spin chuck 12 may be moved up and down as needed. The local transport robot LR transports the substrate W in a state in which the film formation processing liquid film 10 is formed on the surface to the curing unit D.

After the film formation treatment liquid film 10 is cured by the curing unit D to form the cured film 10S, the substrate W on which the cured film 10S is formed is transported to the liquid processing unit M by the partial transfer robot LR. At this time, the shutter driving unit 42 drives the shutter 40 to open the substrate loading/unloading opening 38. The hand LH (arm) of the local transport robot LR enters the processing chamber 11 from the substrate loading/unloading opening 38, and the substrate W is delivered to the spin chuck 12, and then exits to the outside of the processing chamber 11. For the transfer of the substrate W, the cup 13 or the spin chuck 12 may be moved up and down as needed.

The liquid processing unit M performs a removal step of removing the cured film 10S of the surface and a subsequent washing step (post-washing step) on the substrate W introduced as described above.

Specifically, the spin chuck 12 is rotated by the motor 17, and then the removal liquid nozzle 16 is placed above the substrate W held on the spin chuck 12 in order to perform the removal step. Then, the removal liquid valve 102 is opened. Thereby, the removal liquid is supplied to the surface of the substrate W, and the removal liquid is spread over the entire area of the surface of the substrate W by centrifugal force. The cured film 10S on the surface of the substrate W is peeled off by the action of the removal liquid.

Next, after the removal liquid valve 102 is closed and the removal liquid nozzle 16 is retracted from above the substrate W, a post-washing step is performed. Specifically, the chemical liquid nozzle 22 is opened while the chemical liquid nozzle 14 is placed above the substrate W and the spin chuck 12 is rotated. Thereby, the chemical liquid is supplied to the surface of the substrate W in the rotating state, and the chemical liquid is spread over the entire surface of the surface of the substrate W by the centrifugal force. As described above, the chemical liquid step (the liquid medicine step for post-washing) for treating the substrate W with the chemical liquid is performed. The supply of the chemical solution is stopped by closing the chemical solution valve 22, and the chemical liquid step is completed. The chemical liquid nozzle 14 is retracted from above the spin chuck 12.

After the chemical liquid step, the cleaning liquid valve 32A and the cleaning liquid valve 134 are opened while the rotation of the spin chuck 12 is continued. Thereby, the cleaning liquid is supplied to the front and back surfaces of the substrate W in a rotating state. The cleaning liquid supplied to the surface of the substrate W spreads over the entire area of the surface of the substrate W, thereby replacing the chemical liquid on the surface of the substrate W. Moreover, the cleaning liquid supplied to the back surface of the substrate W spreads over the entire area of the back surface of the substrate W, thereby rinsing the cleaning liquid adhering to the back surface of the substrate W. As described above, the washing step is performed. The supply of the cleaning liquid is stopped by closing the cleaning liquid valve 32A, and the washing step is completed.

After the end of the washing step, or just before the end of the washing step, the organic solvent valve 32B and the organic solvent valve 136 are opened. Thereby, an organic solvent is supplied to the front and back surfaces of the substrate W. The spin chuck 12 is kept in a rotated state. Therefore, the organic solvent spreads over the entire surface of the substrate W and the back surface, and the cleaning liquid on the front and back surfaces of the substrate W is replaced. At this time, the shutter drive unit 20 lowers the shutter 19 and is disposed at a processing position where the opposing surface 19a is close to the surface of the substrate W.

Next, the organic solvent valve 32B and the organic solvent valve 136 are closed, and the inert gas valve 47 and the inert gas valve 142 are opened, and an inert gas is supplied to the front and back surfaces of the substrate W. Further, the rotation of the spin chuck 12 is accelerated. Thereby, the liquid component on the front and back surfaces of the substrate W is cleaved. The inert gas supplied to the front and back surfaces of the substrate W promotes drying of the substrate W.

When the drying process is completed, the rotation of the spin chuck 12 is stopped, and the inert gas valve 47 and the inert gas valve 142 are closed. Then, the shutter driving unit 20 retracts the shutter 19 to the upper side.

Next, the shutter driving unit 41 drives the shutter 39 to open the substrate loading/unloading opening 37. The hand HC (arm) of the main transport robot CR enters the processing chamber 11 from the substrate loading/unloading opening 37, receives the substrate W from the spin chuck 12, and passes the substrate W through the substrate loading/unloading opening 37. Move out to the outside of the processing chamber 11. For the transfer of the substrate W, the cup 13 or the spin chuck 12 may be moved up and down as needed.

The removal of the cured film 10S on the substrate W can also be performed by the chemical liquid supplied from the chemical liquid nozzle 14 depending on the type of the cured film 10S. That is, the chemical liquid supplied from the chemical liquid nozzle 14 can also be used as the removal liquid. At this time, the configuration of the removal liquid nozzle 16 and the removal liquid nozzle 16 can be omitted without distinguishing between the removal step and the post-washing step.

Further, the pre-washing step before the film formation treatment liquid film 10 is formed may be omitted.

Further, when the chemical liquid nozzle is assembled to the blocking plate 19, the blocking plate 19 is always located close to the substrate W during the processing.

3 is a schematic cross-sectional view for explaining a configuration example of the curing unit D. The curing unit D has a curing chamber 51 including a closable decompression chamber (vacuum chamber). The volume of the curing chamber 51 is smaller than the volume of the processing chamber 11 of the liquid processing unit M, whereby the curing chamber 51 has a structure in which the internal space can be efficiently decompressed. In the curing chamber 51, a substrate holder 52 as a substrate holding unit that holds the substrate W is disposed. The substrate holder 52 incorporates a heater 53H as a substrate heating unit and a cooling unit 53C as a substrate cooling unit, thereby constituting a temperature adjustment plate. The heater 53H heats the substrate W by heat transfer or heat radiation. Instead of the heater 53H, an electromagnetic wave irradiation unit that irradiates the substrate with electromagnetic waves (ultraviolet rays, infrared rays, microwaves, laser light, or the like) may be used as the substrate heating unit. Further, a flash lamp can also be used as the substrate heating unit. The cooling unit 53C may have a refrigerant passage through the inside of the substrate holder 52, or may have an electronic cooling element.

A plurality of (three or more) lift pins 54 are disposed through the substrate holder 52. The jacking pin 54 is moved up and down by the jacking up/down unit 55, whereby the substrate W is moved up and down on the substrate holder 52.

The curing chamber 51 includes a base portion 511 and a movable cover portion 512 that is movable up and down with respect to the base portion 511. The movable cover portion 512 moves up and down with respect to the base portion 511 by the cover portion driving unit 56. A curing processing space 50 is defined between the base portion 511 and the movable cover portion 512. The lower end edge portion 58 of the movable cover portion 512 is formed along a plane that mimics the upper surface 59 of the base portion 511. On the base portion 511, an O-ring 60 as a sealing member is disposed at a position opposed to the lower end edge portion 58 of the movable cover portion 512. When the movable cover portion 512 is brought close to the base portion 511 and pressed against the base portion 511, the movable cover portion 512 and the base portion 511 are sealed by the O-ring 60. As described above, the sealed curing treatment space 50 is formed.

An exhaust pipe 62 is coupled to the base portion 511. The exhaust pipe 62 is in communication with the solidification processing space 50. The exhaust pipe 62 is connected to an exhaust unit 63 such as a vacuum pump. An exhaust valve 64 is inserted in the exhaust pipe 62. The exhaust unit 63 is an example of a decompression unit, and by driving the exhaust unit 63 by opening the exhaust valve 64, the solidification processing space 50 can be depressurized to a pressure lower than atmospheric pressure (for example, 0.01 Torr or less).

An inert gas nozzle 71 for introducing an inert gas into the solidification processing space 50 is provided on the movable cover portion 512. An inert gas pipe 72 is incorporated in the inert gas nozzle 71. In the middle of the inert gas pipe 72, an inert gas valve 73 is inserted. The inert gas pipe 72 is combined with an inert gas supply source 74 that supplies an inert gas. The inert gas is an example of a low-humidity gas, and the inert gas nozzle 71 or the like is an example of a low-humidity gas supply unit. For example, before the substrate W is carried into the curing processing space 50, the inert gas is supplied from the inert gas nozzle 71 in advance, and the inside of the curing chamber 51 can be ventilated, whereby an atmosphere in which the film forming processing liquid 10 is easily dried can be formed.

When the operation of the curing unit D is summarized, it is as follows.

The hand LH of the local transport robot LR carries the substrate W in a state in which the film formation processing liquid film 10 is formed on the surface to the curing unit D. When the substrate W is carried in, the movable cover portion 512 is located at an open position away from the base portion 511, whereby a substrate loading opening is formed between the movable cover portion 512 and the base portion 511. At this time, the jacking pin 54 is located at a rising position in which the front end thereof is separated upward from the surface of the substrate holder 52. In this state, the hand LH of the local transport robot LR enters between the movable cover portion 512 and the base portion 511, and the substrate W is delivered to the jacking pin 54. The jacking pin 54 of the substrate W is lowered, and the substrate W is placed on the upper surface of the substrate holder 52.

The lid driving unit 56 lowers the movable lid portion 512 and presses it to the base portion 511 via the O-ring 60. Thereby, the solidification processing space 50 becomes a sealed space. Then, by opening the exhaust valve 64, the exhaust unit 63 is driven to exhaust the atmosphere in the solidification processing space 50, and the solidification processing space 50 is depressurized. The inert gas valve 73 is set to the closed state so as not to impede the pressure reduction.

The evaporation of the film formation treatment liquid film 10 on the surface of the substrate W is promoted by decompressing the inside of the curing treatment space 50. Further, the heater 53H is driven to heat the substrate holder 52 to perform a bake process. As described above, the pressure reduction of the atmosphere of the substrate W and the heating of the substrate W are simultaneously used to rapidly cure the film formation processing liquid film 10. The term "curing" as used herein refers to solidification or hardening, which may be carried out by solidifying or hardening the solvent component in the film-forming treatment liquid by evaporation, or by combining molecules in the film-forming treatment liquid to form a polymer. Thereby solidifying or hardening. By causing volume shrinkage during the curing, the force acts on foreign matter such as fine particles adhering to the surface of the substrate W, whereby the foreign matter is detached from the surface of the substrate W.

After the curing of the film formation processing liquid film 10 is completed, the exhaust unit 63 is stopped, and the inert gas valve 73 is opened as necessary to pressurize the inside of the curing processing space 50 to atmospheric pressure. Then, the heater 53H is stopped by driving, and instead, the cooling unit 53C is operated to cool the substrate holder 52. Thereby, the substrate W is cooled to, for example, normal temperature. Thereafter, the cover driving unit 56 raises the movable cover portion 512 away from the base portion 511. Then, the jacking pin 54 is raised to lift the substrate W to a height that is upward from the upper surface of the substrate holder 52. In the state described above, the hand LH of the partial transport robot LR enters between the movable cover portion 512 and the base portion 511, and the processed substrate W is lifted from the top lift pin 54 to exit to the partial transfer chamber C. When the main transport robot CR transports the substrate W after the curing process, the hand HC of the main transport robot CR enters between the movable cover portion 512 and the base portion 511, and the processed substrate W is removed from the top lift pin 54 and exits to Main handling room 5.

FIG. 4 is a view for explaining a configuration example of the partial transport robot LR. The local transfer robot LR is disposed in the partial transfer chamber C. The partial transfer chamber C faces the processing chamber 11 of the liquid processing unit M and the curing chamber 51 of the curing unit D disposed above the processing chamber 11, and communicates with the curing chamber 51 when the curing chamber 51 is opened.

The local transport robot LR includes a hand LH (arm) for holding the substrate W, and a hand drive unit 90 for driving the opponent LH. In this example, the hand LH includes a pair of hands LH1 and a hand LH2 which are arranged to be staggered in the up and down direction (and further shifted in the horizontal direction as needed). The hand drive unit 90 causes the hand LH1 and the hand LH2 to move horizontally and vertically, and then rotates the hand LH1 and the hand LH2 around the vertical rotation axis 89 as needed.

Thereby, the hand LH1 and the hand LH2 can enter the processing chamber 11 of the liquid processing unit M to receive the substrate W from the spin chuck 12, transport the substrate W to the curing unit D, and carry the substrate W thereto. The inside of the curing chamber 51 is delivered to the jacking pin 54 (refer to FIG. 3), and then exits to the partial carrying chamber C. Further, the hand LH1 and the hand LH2 can enter the curing chamber 51 of the curing unit D to receive the substrate W from the top lifting pin 54, transport the substrate W to the liquid processing unit M, and carry the substrate W into the processing chamber. 11 is delivered to the spin chuck 12 and then exits to the partial transfer chamber C.

The hand drive unit 90 can advance and retreat independently of the pair of hands LH1 and LH2 with respect to the units at least when entering the liquid processing unit M and the curing unit D. For example, when the hand LH1 is used to transport the substrate W on which the film formation processing liquid film 10 is formed from the liquid processing unit M to the curing unit D, the hand LH2 is used to self-cure the substrate W on which the cured film 10S is formed. When D is transported to the liquid processing unit M. At this time, in consideration of the dripping liquid from the film forming processing liquid film 10, the hand LH2 holding the substrate W processed by the curing unit D is preferably disposed in the hand LH1 which is disposed on the substrate W on which the film forming processing liquid film 10 is formed. The upper position.

Since the curing unit D is disposed in the liquid processing unit M, the local transfer robot LR operates in such a manner that after the substrate W is carried out from the liquid processing unit M, the hand LH is raised to the height of the curing unit D. Further, the local transport robot LR operates in such a manner that the hand LH is lowered to the height of the liquid processing unit M after the substrate W is carried out from the curing unit D.

The local transport robot LR may further include a hand heating unit 97A (arm heating unit) that heats the opponent LH1 to form a film forming treatment liquid by the liquid processing unit M. The substrate W of the film 10 is kept warm or heated. The hand heating unit 97A may also be configured to circulate the heat medium in the heat medium passage 98A formed on the hand LH1. Instead of the configuration having such a heat medium passage 98A, a heater (not shown) that heats the opponent LH1 may be provided in the hand LH1. Further, the hand heating unit 97A may be configured to heat the heating plate 99A provided in the partial transfer chamber C. At this time, the hand LH1 is brought into contact with the heating plate 99A while the hand LH1 is not holding the substrate W. Thereby, the opponent LH1 is heated during the non-working movement of the hand LH1. By transporting the substrate W by the heated hand LH1, the substrate W can be heated during transportation, so that the substrate W can be heated to dry and solidify the film formation processing liquid film 10.

The local transport robot LR may further include a hand cooling unit 97B (arm cooling unit) that cools the opponent LH2 to perform the substrate W on which the cured film 10S is formed by the curing unit D. cool down. The hand cooling unit 97B may be configured to circulate the refrigerant in the refrigerant passage 98B formed in the hand LH2. Instead of such a configuration having the refrigerant passage 98B, the hand LH2 may be provided with an electronic cooling element (not shown) for cooling the hand LH2. Further, the hand cooling unit 97B may be configured to cool the cooling plate 99B provided in the partial transfer chamber C. At this time, the hand LH2 is brought into contact with the cooling plate 99B while the hand LH2 is not holding the substrate W. Thereby, the hand LH2 is cooled during the non-working movement of the hand LH2. By transporting the substrate W by the cooled hand LH2, the substrate W can be cooled during transportation, so that the sufficiently cooled substrate W can be carried into the liquid processing unit M. Further, the cooling treatment time in the curing unit D can be shortened.

In order to effectively heat/cool the substrate W held on the hand LH1 and the hand LH2, the hand LH1 and the hand LH2 may be formed in a plate shape corresponding to the shape of the substrate W. The plate-shaped hand LH1 and the hand LH2 may have a notched plate shape formed with a notch for the purpose of handing over the substrate W with the spin chuck 12, and the notch is for avoiding the spin chuck 12 The chuck pin is available in the middle.

For example, as shown in FIG. 4, the hand LH of the local transport robot LR (or the movable part that does not largely change the relative position of the hand LH regardless of the movement of the hand LH) may be arranged to be supplied for washing by the opponent LH. The washing liquid nozzle 91 of the washing liquid. The washing liquid nozzle 91 is connected to the washing liquid pipe 92. In the washing liquid pipe 92, a washing liquid valve 93 is inserted. The washing liquid pipe 92 is connected to the washing liquid supply source 94. The washing liquid supply source 94 supplies the washing liquid for washing with the opponent LH. The washing liquid is preferably a liquid having an affinity with a film forming treatment liquid, for example, an organic solvent.

As shown in FIG. 4, instead of providing the washing liquid nozzle 91 on the hand LH, or in addition to the washing liquid nozzle 91, the washing liquid nozzle 91A may be attached to the partial transfer chamber C.

When the partial transfer robot LR is not transporting the substrate W, the washing liquid valve 93 is opened, and the washing liquid can be ejected from the washing liquid nozzle 91 and the washing liquid nozzle 91A, and washed by the washing liquid opponent LH. Thereby, the film forming processing liquid or the other substance which adheres especially to the hand LH can be removed, and the hand LH can be kept in a clean state.

The bottom 160 of the partial transfer chamber C receives the wash liquid. At the bottom portion 160, a drain pipe 161 as a drain unit is connected. The washing liquid received at the bottom portion 160 is discharged through the drain pipe 161.

An inert gas nozzle 165 for supplying an inert gas to the partial transfer chamber C may be provided. An inert gas pipe 166 is connected to the inert gas nozzle 165. In the middle of the inert gas pipe 166, an inert gas valve 167 is inserted. An inert gas supply source 168 is connected to the inert gas pipe 166. The inert gas supply source 168 supplies an inert gas such as nitrogen. By opening the inert gas valve 167, an inert gas can be supplied to the local transfer chamber C. Thereby, drying of the hand LH after washing can be promoted. Moreover, the inert gas can be supplied to the vicinity of the substrate W held on the hand LH, so that the drying of the film formation processing liquid film 10 on the substrate W held on the hand LH1 can be promoted, thereby promoting the curing.

The inert gas nozzle 165 may also be disposed on the hand LH (or an active portion where the relative position of the hand LH does not largely change regardless of how the hand LH moves). Thereby, the inert gas can be efficiently supplied to the surface of the substrate L and the substrate W held on the hand LH.

In addition, when the substrate W processed by the curing unit D is carried out by the main transport robot CR, the local transport robot LR may have a configuration relating to the hand LH1 and the hand LH1. That is, the configuration of the hand LH2 and the hand LH2 can be omitted.

Further, when the substrate W processed by the curing unit D is transported by the partial transport robot LR, the configuration relating to the hand LH2 and the hand LH2 may be omitted. In other words, the conveyance of the substrate W on which the film formation processing liquid film 10 is formed and the conveyance of the substrate W on which the cured film 10S is formed can be performed by the same hand LH1. At this time, after the substrate W is transported from the liquid processing unit M to the curing unit D, the opponent LH1 may be washed, and thereafter, the cured film 10S is formed by the hand LH1 from the curing unit D to the liquid processing unit M transport surface. Substrate W.

As described above, according to the above embodiment, after the film formation processing liquid film 10 is formed on the substrate W in the processing chamber of the liquid processing unit M, the substrate W is carried into the curing unit by the partial transfer robot LR. The curing chamber 51 of D. Therefore, it is possible to prevent the main conveyance robot CR from being contaminated by the film formation processing liquid, and it is possible to suppress or prevent the film formation processing liquid from being transferred to another substrate conveyed by the main conveyance robot CR. Moreover, since the atmosphere of the film formation processing liquid can be suppressed or prevented from being enclosed in the space in which the substrate W is transported by the main transport robot CR, it is possible to prevent the atmosphere of the film formation processing liquid from adversely affecting the substrate W. In this way, the substrate processing quality can be improved. Further, regardless of the operating state of the main transport robot CR, the local transport robot LR can be used to quickly transport the substrate W from the processing chamber 11 to the curing chamber 51. Therefore, the handling time can be shortened.

In particular, in the above embodiment, the main transport robot CR is disposed in the main transport chamber 5, and the local transport robot LR is disposed in the partial transport chamber C that is isolated from the main transport chamber 5. Thereby, the atmosphere of the film formation processing liquid can be more reliably suppressed or prevented from covering the main conveyance chamber 5, so that the substrate W conveyed by the main conveyance robot CR can be suppressed or prevented from being affected by the atmosphere of the film formation processing liquid.

Further, in the above-described embodiment, the curing unit D decompresses the processing space 50 in the curing chamber 51, and heats the substrate W by the heater 53H to form the film forming processing liquid film 10 on the substrate W. Cured. Therefore, the film forming treatment liquid film 10 can be quickly solidified to form the cured film 10S. In the process, the film formation treatment liquid film 10 is solidified while being subjected to volume shrinkage. Thereby, the tensile force acts on foreign matter such as fine particles on the surface of the substrate W, and foreign matter can be peeled off from the surface of the substrate W.

The liquid processing unit M has a spin chuck 12 and a shutter 19 in the processing chamber 11, and its volume is relatively large. Therefore, it is not practical to decompress the space in the processing chamber 11 to dry the film forming processing liquid film 10. Even if it is possible, it takes a long time to decompress the large volume space. On the other hand, in the above-described embodiment, the substrate W that has been processed in the liquid processing unit M is carried into the curing chamber 51 having a smaller volume, and the reduced-pressure drying treatment in the curing chamber 51 is performed. Thereby, the film formation processing liquid film 10 can be cured in a short time.

The substrate W on which the cured film 10S is formed is carried into the processing chamber 11 of the liquid processing unit M from the curing chamber 51 by the partial transfer robot LR or the main transfer robot CR. At this time, the liquid processing unit M functions as a removal unit for removing the cured film 10S, and the processing chamber 11 functions as a removal chamber that provides a space for performing the removal process. The liquid processing unit M supplies the removal liquid to the substrate W to remove the cured film 10S on the substrate W. At this time, the cured film 10S is swollen by the removal liquid to cause volume expansion. Thereby, the tensile force acts on the foreign matter on the surface of the substrate W, and the foreign matter is peeled off from the surface of the substrate W. The peeled foreign matter is excluded from the substrate W together with the cured film 10S. In this way, the washing process of removing the foreign matter on the surface of the substrate W is achieved.

When the local transport robot LR carries out the solidification processing of the substrate W in the curing unit D from the curing chamber 51 and carries it into the processing chamber 11 of the liquid processing unit M for removal processing, the main handling robot DR can be prevented from self-curing. The treated substrate W is affected. In particular, when the substrate W processed by the curing unit D is at a high temperature, the main transfer robot CR can be prevented from accumulating heat generated by the high-temperature substrate W. Thereby, it is possible to suppress or prevent the influence of heat from affecting the substrate W conveyed by the main transport robot CR.

In the above-described embodiment, the local transport robot LR has a pair of hands LH1 and a hand LH2, and the substrate W is carried out from the processing chamber 11 by the hand LH1 as the first transport arm, and is carried into the curing chamber 51. 2 The hand LH2 of the arm is transported, and the substrate W after the curing process is carried out from the curing chamber 51, and carried into the processing chamber 11 to perform the removal process. Therefore, even if the film formation treatment liquid adheres to the hand LH1, the transfer of the treatment liquid to the substrate W after the curing treatment can be suppressed or prevented. Further, in the above-described embodiment, the hand LH2 is disposed at a position above the hand LH1, so that the film forming treatment liquid on the substrate W held by the hand LH1 can be more reliably suppressed or prevented from adhering to the hand LH2. .

Further, in the above-described embodiment, the washing liquid nozzle 91 and the washing liquid nozzle 91A are provided in the partial transfer chamber C, and the washing liquid can be ejected from the washing liquid nozzle 91 and the washing liquid nozzle 91A to be washed by the opponent LH. Thereby, the hand LH can be kept in a clean state, so that the substrate W can be transported while suppressing contamination of the substrate W by the hand LH. Further, since the washing of the hand LH is performed in the partial transfer chamber C, it is possible to suppress or prevent the influence of the washing liquid or the film forming processing liquid from affecting the substrate W transported by the main transport robot CR.

In particular, in the case where the hand LH of the partial transport robot LR (or the movable portion where the relative position of the hand LH does not largely change regardless of the movement of the hand LH) is provided, the washing liquid nozzle 91 is provided, and the opponent LH can be more surely Washing is carried out. Therefore, it is possible to prevent the contamination of the film formation processing liquid and the like from being accumulated in the hand LH, and it is possible to convey the substrate W while suppressing contamination by the film formation processing liquid. Further, it is possible to suppress or prevent the influence of the washing liquid or the film forming processing liquid from affecting the substrate W transported by the main transport robot CR.

Further, in the above embodiment, the partial transfer chamber C includes a bottom portion 160 that receives the washing liquid, and a drain pipe 161 that discharges the washing liquid received by the bottom portion 160. Thereby, the washing liquid after washing by the opponent LH can be discharged to the outside of the partial transfer chamber C, so that the atmosphere in the partial transfer chamber C can be kept clean. Thereby, the influence of the film formation processing liquid atmosphere on the substrate W can be further suppressed.

The substrate processing method performed by the embodiment includes a processing liquid film forming step of supplying a film forming processing liquid to the surface of the substrate W in the processing chamber 11, and forming a film forming processing liquid film 10 on the surface of the substrate W; In the first partial transport step, after the processing liquid film forming step, the substrate W is transported to the curing chamber 51; in the cured film forming step, the film forming processing liquid film 10 is cured in the curing chamber 51 to be on the substrate W. a cured film 10S is formed on the surface; a second partial transport step, after the cured film forming step, the substrate W is transported to the processing chamber 11 as a removal chamber; and the removal processing step is performed in the processing chamber 11 (removal chamber) The removal liquid for removing the cured film 10S is supplied to the surface of the substrate W; and the main conveyance step, the unprocessed substrate W is carried into the processing chamber 11 by the main transfer robot CR, after the removal processing step, The processing chamber 11 (removal chamber) carries out the substrate W.

In the above embodiment, the cured film forming step includes a heating step of heating the substrate W by the heater 53H as a heating unit. Further, the cured film forming step includes a pressure reducing step of depressurizing the solidification processing space 50 for processing the substrate W.

In the main conveyance step, the substrate W is transported by the main transport chamber 5, and in the first partial transport step, the substrate W is transported by the partial transport chamber C that is separated from the main transport chamber 5.

The first partial transport step and the second partial transport step may be performed by a common local transport robot LR. At this time, the first partial conveyance step is performed by the hand LH1 of the partial conveyance robot LR, and the second partial conveyance step is performed by the hand LH2 of the partial conveyance robot LR.

Further, the first partial conveyance step may be performed by the partial conveyance robot LR, and the second partial conveyance step may be performed by the main conveyance robot CR.

Moreover, the substrate processing method of the above embodiment includes a hand washing step (arm washing step) of supplying the washing liquid to the hand LH of the partial conveying robot LR.

The treatment liquid film forming step and the removal processing step are sometimes performed in a common processing chamber 11. Further, when the processing liquid film forming step and the removing processing step are performed in different liquid processing units M, the processing is performed in different chambers.

[Second Embodiment] Fig. 5A is a schematic plan view for explaining a configuration of a substrate processing apparatus 1A according to a second embodiment of the present invention, and Fig. 5B is an elevational view thereof. In FIGS. 5A and 5B, the same reference numerals are given to the corresponding portions of the respective portions of FIGS. 1A and 1B.

In the present embodiment, a partial transfer chamber C is disposed between the two stacked unit groups G1 and the laminated unit group G2 disposed on one side of the main transfer chamber 5 in a plan view, and the partial transfer chamber C is disposed in the partial transfer chamber C. Partial handling robot LR. Similarly, a partial transfer chamber C is disposed between the two build-up unit groups G3 and the build-up unit group G4 disposed on the other side of the main transfer chamber 5, and a partial transfer robot LR is disposed in the partial transfer chamber C. The plurality of cells constituting the laminated unit group G1 to the laminated unit group G4 and the laminated state of the respective units are the same as those in the first embodiment.

Similarly to the case of the first embodiment, the main transport robot CR can enter a total of eight liquid processing units M to deliver the substrate W, and then can transfer the substrate W to and from the index robot IR. Further, the liquid processing unit M may be configured to be able to enter the total of eight curing units D and take out the substrate W.

In the present embodiment, the local transport robot LR includes two in the first layer S1 and two in the second layer S2. More specifically, in the first layer S1, one partial transfer robot LR11 and a partial transfer robot LR12 are disposed on both sides of the main transfer chamber 5 in plan view. More specifically, on the side of the main transfer chamber 5, in the first layer S1, a partial transfer robot LR11 is disposed between the liquid processing unit M11 and the liquid processing unit M12. Similarly to the other side of the main transfer chamber 5, a partial transfer robot LR12 is disposed between the liquid processing unit M13 and the liquid processing unit M14. The two partial transport robots LR21 and the local transport robot LR22 in the second layer S2 are also arranged in the same manner. The local transport robot LR11, the local transport robot LR12, the local transport robot LR21, and the local transport robot LR22 are disposed in the partial transport chamber C11, the partial transport chamber C12, the partial transport chamber C21, and the partial transport chamber C22, respectively. The partial transport chamber C is formed with a transport space that is divided into (separated) from the main transport chamber 5.

In the first layer S1, the partial transfer robot LR11 disposed on one side of the main transfer chamber 5 is shared by the two liquid processing units M11 and the liquid processing unit M12.

In other words, the local transport robot LR11 takes out the substrate W that has been processed in the liquid processing unit M11 that is close to the side of the carrier holding unit 2, and transports it in the vertical direction (more specifically, above), and carries it into the liquid processing. Curing unit D11 above unit M11. Further, the local transport robot LR11 takes out the substrate W that has been processed in the liquid processing unit M12 that is away from the carrier holding portion 2, and transports it in the vertical direction (more specifically, upward), and carries it into the liquid processing. Curing unit D12 above unit M12.

The local transport robot LR11 can also transport the processed substrate W that has finished in the liquid processing unit M11 close to the carrier holding portion 2 to the curing unit D12 on the liquid processing unit M12 that is away from the carrier holding portion 2. Similarly, the local transport robot LR11 can also transport the processed substrate W in the liquid processing unit M12 that has finished the side away from the carrier holding portion 2 to the solidification on the liquid processing unit M11 on the side close to the carrier holding portion 2. Unit D11.

Further generalization, the local transport robot LR11 can enter the two liquid processing units M11 and the liquid processing unit M12 disposed on one side of the main transport chamber 5 in the first layer S1, and are respectively disposed in the liquid processing. The unit M11, the two curing units D11 above the liquid processing unit M12, and the curing unit D12. Further, a substrate W that has been processed in the liquid processing unit M11 and the liquid processing unit M12 is carried into the two curing units D11 and the curing unit D12 by the partial transfer robot LR11, and is used to make the substrate A curing treatment for curing the film forming treatment liquid film on the surface.

On the other hand, the local transport robot LR11 takes out the solidified substrate W that has been completed in the curing unit D11 on the side close to the carrier holding portion 2, and transports it in the vertical direction (more specifically, lower), and carries it into the curing. Liquid processing unit M11 under unit D11. Further, the local transport robot LR11 takes out the solidified substrate W that has been completed in the curing unit D12 that is away from the carrier holding portion 2, and transports it in the vertical direction (more specifically, downward), and carries it into the curing unit D12. Lower liquid processing unit M12.

The local transport robot LR11 can also transport the processed substrate W that has finished in the curing unit D11 close to the carrier holding portion 2 to the liquid processing unit M12 under the liquid processing unit M12 that is away from the carrier holding portion 2. Similarly, the local transfer robot LR11 can also transport the processed substrate W that has finished the curing unit D12 on the side away from the carrier holding portion 2 to the liquid processing unit M11 under the curing unit D11 on the side close to the carrier holding portion 2. More generally, the substrate W that has been cured in the curing unit D11 and the curing unit D12 is carried into the liquid handling unit M11 and the liquid processing unit M12 by the partial transfer robot LR11. And thus subjected to a removal treatment of the cured film for removing the surface.

The operation of the local transport robot LR12 disposed on the other side of the main transport chamber 5 in the first layer S1 is also the same. That is, the local transfer robot LR12 is configured to be able to enter the two liquid processing units M13, the liquid processing unit M14, the two curing units D13, and the curing unit D14, and perform partial transportation on the opposite side of the main transfer chamber 5 from the units. The same action of the robot LR11.

The operations of the local transport robot LR21 and the local transport robot LR22 disposed in the second layer S2 are also the same. In other words, the local transport robot LR21 is configured to be able to enter the two liquid processing units M21, the liquid processing unit M22, the two curing units D21, and the curing unit D22, and performs the same operations as those of the local transport robot LR11. Further, the local transport robot LR22 is configured to be able to enter the two liquid processing units M23, the liquid processing unit M24, the two curing units D23, and the curing unit D24, and performs the same operations as those of the local transport robot LR11.

In the present embodiment, the two partial transport robots LR11 and the local transport robots LR21 disposed on one side of the main transport chamber 5 are disposed in the two partial transport chambers C11 and the partial transport chambers C21 which are overlapped in plan view. Similarly, in the present embodiment, the two partial transport robots LR12 and the local transport robot LR22 disposed on the other side of the main transport chamber 5 are respectively disposed in two partial transport chambers C12 and a partial transport chamber C22 which are overlapped in plan view. Inside.

The two partial transfer chambers C11, the partial transfer chamber C21, the partial transfer chamber C12, and the partial transfer chamber C22, which are vertically overlapped, may be a partial transfer chamber that communicates vertically. Further, a partial transfer robot LR may be disposed in the one partial transfer chamber C.

At this time, on the side of the main transfer chamber 5, on the side of the carrier holding portion 2 with respect to the partial transfer chamber C, the liquid processing unit M11, the curing unit D11, the liquid processing unit M21, and the curing unit D21 are stacked in this order. The laminated unit group G1 is disposed on the side away from the carrier holding portion 2, and a laminated unit group G2 in which the liquid processing unit M12, the curing unit D12, the liquid processing unit M22, and the curing unit D22 are laminated in this order. One of the partial transfer robots LR disposed in the partial transfer chamber C can enter a total of eight units constituting the pair of the buildup unit group G1 and the buildup unit group G2.

At this time, the local transfer robot LR can also be operated in such a manner that a substrate W that has completed the film forming process liquid film forming process in a certain liquid processing unit M11, liquid processing unit M12, liquid processing unit M21, and liquid processing unit M22 It is carried into the curing unit D11, the curing unit D12, the curing unit D21, and the curing unit D22 which are laminated directly above it. Further, the local transport robot LR can also carry in one of the substrates W that have completed the film forming process liquid film forming process in the liquid processing unit M11, the liquid processing unit M12, the liquid processing unit M21, and the liquid processing unit M22. Any one of the four curing units D11, the curing unit D12, the curing unit D21, and the curing unit D22. In general, productivity can be improved by carrying the substrate W into the curing unit D that is not used for processing.

Further, the local transfer robot LR can also be operated in such a manner that a substrate W in which a curing unit D11, a curing unit D12, a curing unit D21, and a curing unit D22 have finished curing is carried into a liquid processing unit laminated directly below it. M11, liquid processing unit M12, liquid processing unit M21, and liquid processing unit M22. Further, the local transport robot LR can carry one of the substrates W that have been subjected to the curing treatment in the curing unit D11, the curing unit D12, the curing unit D21, and the curing unit D22 to the four liquid processing units M11 and the liquid that can be entered. Any one of the processing unit M12, the liquid processing unit M21, and the liquid processing unit M22. In general, productivity can be improved by carrying out removal processing by moving the substrate W to the liquid processing unit M that is not used for processing.

The other side of the main transport chamber 5 has the same configuration, and a partial transport robot LR shared by the two laminated unit groups G3 and the laminated unit group G4 can be operated in the same manner.

As can be seen from the comparison between FIG. 1A and FIG. 5A, the configuration of the present embodiment can reduce the footprint (footprint) of the substrate processing apparatus 1A.

Further, the conveyance of the substrate W that has finished the curing treatment in the curing unit D may be performed by the main conveyance robot CR. At this time, the main transport robot CR can also be operated by carrying the substrate W into an arbitrary liquid processing unit M and performing a removal process.

[Embodiment 3] FIG. 6A is a schematic plan view for explaining a configuration of a substrate processing apparatus 1B according to a third embodiment of the present invention, and FIG. 6B is an elevational view thereof. In the substrate processing apparatus 1B of the present embodiment, a three-layer structure including the first layer S1, the second layer S2, and the third layer S3 is formed in the cell arrangement.

In the present embodiment, three laminated unit groups G11, a laminated unit group G12, and a laminated unit group G13 are disposed along the main transport chamber 5 on one side of the main transport chamber 5 in the plan view, and the other side of the main transport chamber 5 is disposed. Three laminated unit groups G14, a laminated unit group G15, and a laminated unit group G16 are disposed along the main transfer chamber 5.

The buildup unit group G11 is configured by stacking three liquid processing units M11, a liquid processing unit M21, and a liquid processing unit M31 in this order from the bottom. The buildup unit group G13 is configured by stacking three liquid processing units M12, a liquid processing unit M22, and a liquid processing unit M32 in this order from the bottom. The build-up cell group G12 disposed between the build-up cell group G11 and the build-up cell group G13 is formed by stacking six curing cells D11, curing cells D12, curing cells D21, curing cells D22, curing cells D31, and curing cells D32 in this order from the bottom. Composition. Between the laminated unit group G11 and the laminated unit group G13, a partial transfer chamber C11, a partial transfer chamber C21, and a partial transfer chamber C31 are disposed in this order from the bottom, and a part of each of the partial transfer chambers is disposed. The transport robot LR11, the local transport robot LR21, and the local transport robot LR31. In the present embodiment, the partial transfer chamber C11, the partial transfer chamber C21, and the partial transfer chamber C31 are disposed on the opposite side of the main transfer chamber 5 with respect to the buildup unit group G12.

The buildup unit group G14 is configured by stacking three liquid processing units M13, a liquid processing unit M23, and a liquid processing unit M33 in this order from the bottom. The buildup unit group G16 is configured by stacking three liquid processing units M14 and a liquid processing unit M24 liquid processing unit M34 in this order from the bottom. The build-up cell group G15 disposed between the build-up cell group G14 and the build-up cell group G16 is formed by stacking six curing cells D13, curing cells D14, curing cells D23, curing cells D24, curing cells D33, and curing cells D34 in this order from the bottom. Composition. Between the laminated unit group G14 and the laminated unit group G16, a partial transfer chamber C12, a partial transfer chamber C22, and a partial transfer chamber C32 are disposed in this order from the bottom, and a part of each of the partial transfer chambers is disposed. The transport robot LR12, the local transport robot LR22, and the local transport robot LR32. In the present embodiment, the partial transfer chamber C12, the partial transfer chamber C22, and the partial transfer chamber C32 are disposed on the opposite side of the main transfer chamber 5 with respect to the buildup unit group G15.

In the first layer S1, a pair of liquid processing units M11 and a liquid processing unit M12 are disposed on the side of the main transport chamber 5 along the longitudinal direction of the main transport chamber 5 in a plan view. A pair of curing unit D11, curing unit D12, and one partial conveying robot LR11 are disposed between the pair of liquid processing unit M11 and liquid processing unit M12. In the present embodiment, the pair of curing unit D11 and curing unit D12 are vertically stacked. The curing unit D11 and the curing unit D12 are disposed at positions close to the main transfer chamber 5, and the partial transfer robot LR11 is disposed on the opposite side of the curing unit D11 and the curing unit D12 from the main transfer chamber 5.

The local transport robot LR11 is disposed in the partial transport chamber C11. The local handling robot LR11 can enter a pair of liquid processing units M11, a liquid processing unit M12, a pair of curing units D11, and a curing unit D12.

The local transfer robot LR11 operates by moving out a substrate W that has completed the film forming process liquid film forming process in the liquid processing unit M11 and the liquid processing unit M12, and carries the substrate W into a pair of curing units D11, Any of the curing units D12. Further, the local transfer robot LR11 operates in such a manner that a substrate W that has been subjected to the curing process in the curing unit D11 and the curing unit D12 is carried out, and the substrate W is carried into a pair of liquid processing unit M11 and liquid processing unit M12. Any one of them performs a removal process.

In the first layer S1, the unit arrangement on the other side of the main transport chamber 5 is also the same. In other words, on the other side of the main transport chamber 5, a pair of liquid processing units M13 and a liquid processing unit M14 are disposed along the longitudinal direction of the main transport chamber 5 in a plan view, and the pair of liquid processing units M13 and liquid processing are disposed. A pair of curing unit D13, curing unit D14, and a partial transfer robot LR12 are disposed between the units M14. The pair of curing unit D13 and the curing unit D14 are stacked one on top of the other. The curing unit D13 and the curing unit D14 are disposed at a position close to the main transfer chamber 5, and a partial transfer chamber C12 is defined on the opposite side of the curing unit D13 and the curing unit D14 from the main transfer chamber 5, and is housed therein. Partial handling robot LR12.

The local handling robot LR12 can enter a pair of liquid processing units M13, a liquid processing unit M14, a pair of curing units D13, and a curing unit D14. The local transport robot LR12 operates in such a manner that a substrate W that has been processed in the liquid processing unit M13 and the liquid processing unit M14 is carried out, and the substrate W is carried into any one of a pair of curing unit D13 and curing unit D14. By. Further, the local transfer robot LR12 operates in such a manner that a substrate W that has been subjected to the curing process in the curing unit D13 and the curing unit D14 is carried out, and the substrate W is carried into a pair of liquid processing unit M13 and liquid processing unit M14. Either of them is subjected to removal processing.

The unit arrangement of the second layer S2 and the third layer S3 and the operation of the local transport robot LR of each layer are also the same. The second layer S2 includes a pair of liquid processing units M21, a liquid processing unit M22, a pair of curing units D21, a curing unit D22, and a partial transfer robot LR21 disposed on one side of the main transfer chamber 5, and further includes a main transfer chamber. A pair of liquid processing units M23, a liquid processing unit M24, a pair of curing units D23, a curing unit D24, and a partial transfer robot LR22 on the other side of the fifth. The third layer S3 includes a pair of liquid processing units M31, a liquid processing unit M32, a pair of curing units D31, a curing unit D32, and a partial transfer robot LR31 disposed on one side of the main transfer chamber 5, and further includes a main transfer chamber. A pair of liquid processing units M33, a liquid processing unit M34, a pair of curing units D33, a curing unit D34, and a partial transfer robot LR32 on the other side of 5.

As described above, in the present embodiment, the liquid processing unit M and the curing unit D are arranged in a plane (horizontal arrangement), whereby a plurality of liquid processing units M and curing can be provided while suppressing the total height of the substrate processing apparatus 1B. Unit D.

In the present embodiment, the three partial transport robots LR11, the local transport robot LR21, and the local transport robot LR31 disposed on one side of the main transport chamber 5 are disposed in the three partial transport chambers C11 and the partial transport chambers which are overlapped in plan view. C21, in the local transfer chamber C31. The three partial transfer chambers C11, the partial transfer chamber C21, and the partial transfer chamber C31 may be a partial transfer chamber C that communicates vertically. Further, a partial transfer robot LR may be disposed in the one partial transfer chamber C. At this time, the laminated unit group G11 in which the three liquid processing units M11, the liquid processing unit M21, and the liquid processing unit M31 are stacked is disposed on the side of the carrier holding portion 2 with respect to the partial transfer chamber C, on the side away from the carrier holding portion 2 A stacking unit group G13 in which three liquid processing units M12, a liquid processing unit M22, and a liquid processing unit M32 are stacked is disposed, and six curing units D11, a curing unit D12, and a curing unit D21 are disposed on the main transfer chamber 5 side. The layering unit group G12 of the curing unit D22, the drying unit D31, and the curing unit D32. One of the partial transfer robots LR disposed in the partial transfer chamber C can enter a total of 12 units constituting the three stacked unit groups G11 to G13.

At this time, the local transfer robot LR can also be operated by moving one substrate W, which has been formed in the liquid processing unit M, the film formation process liquid film, to the curing unit D located in the same layer. Further, the local transfer robot LR can also be operated by moving one substrate W that has been subjected to the curing process in a certain curing unit D to the liquid processing unit M located in the same layer to perform the removal process. Further, the local transport robot LR may carry one of the substrates W having completed the film formation process liquid film in a certain liquid processing unit M into any one of the six hardening units D that can be accessed. In general, productivity can be improved by carrying the substrate W into the curing unit D that is not used for processing. Further, the local transport robot LR can also carry one of the six liquid processing units M that have been subjected to the curing process in a certain curing unit D to the one of the six liquid processing units M that can be accessed to perform the removal process. In general, productivity can be improved by carrying the substrate W into the liquid processing unit M that is not used for processing. Of course, the opposite side of the main transfer chamber 5 may have the same configuration.

As can be seen from the comparison between FIG. 1A and FIG. 6A, the configuration of the present embodiment can reduce the footprint (footprint) of the substrate processing apparatus 1B. Further, as can be seen from the comparison of FIG. 5B and FIG. 6B and the like, according to the configuration of the present embodiment, more cells can be arranged in a space of the same height. In other words, it is possible to constitute the same number of substrate processing apparatuses at a lower height.

[Fourth Embodiment] FIG. 7 is a schematic elevational view showing a configuration of a substrate processing apparatus 1C according to a fourth embodiment of the present invention, and shows a configuration of one side of a main transport chamber. A pair of buildup unit groups G21 and a buildup unit group G22 are disposed on one side of the main transfer chamber 5 (see FIG. 5A and the like), and a partial transfer robot LR1 and a portion are disposed between the buildup unit groups G21 and the buildup unit group G22. Handling robot LR2. In this example, one laminated unit group G21 is formed by stacking three liquid processing units M1, a liquid processing unit M2, and a liquid processing unit M3 into three layers. The other laminated unit group G22 includes a liquid processing unit M4 and four curing units D1 to D4 which are sequentially laminated on the liquid processing unit M4. The same configuration is also provided on the opposite side of the main transport chamber 5. The main transport robot CR can enter the four liquid processing units M1 to M4 disposed on one side of the main transport chamber 5, and can enter four liquid processing units that are similarly disposed on the opposite side of the main transport chamber 5. . The main transport robot CR may be configured to be able to enter the four curing units D1 to D4 disposed on one side of the main transport chamber 5, and may enter four curing units that are disposed on the opposite side of the main transport chamber 5 in the same manner. unit.

In this example, two partial transport robots LR1 and a local transport robot LR2 are provided on one side of the main transport chamber 5, and the partial transport robots LR1 and the local transport robots LR2 are disposed in one partial transport chamber C. For example, the lower partial transfer robot LR1 may also enter the three liquid processing units M1, the liquid processing unit M2, the liquid processing unit M4, and the two curing units D1 and the curing unit D2. Further, the upper partial transfer robot LR2 can also enter the two liquid processing units M2, the liquid processing unit M3, and the four curing units D1 to D4. The partial transfer robot LR1 and the local transfer robot LR2 are operated by moving the substrate W on which the film formation processing liquid is formed by the liquid processing unit M1 to the liquid processing unit M4 to any one of the curing units D1 to the curing unit. D4. Further, the local transfer robot LR1 and the local transfer robot LR2 are operated by moving the substrate W subjected to the curing process from the curing unit D1 to the curing unit D4 to any one of the liquid processing units M1 to M4 for removal processing. . The same configuration is also provided on the opposite side of the main transport chamber 5, and the operations of the two partial transport robots are also the same. The conveyance of the substrate W after the curing process can also be performed by the main conveyance robot CR. That is, the main transport robot CR can also be operated in such a manner that the substrate W solidified in a certain curing unit D is carried into any one of the liquid processing units M.

[Fifth Embodiment] FIG. 8 is a schematic plan view for explaining a configuration of a substrate processing apparatus 1D according to a fifth embodiment of the present invention. In the present embodiment, three laminated unit groups G31, a laminated unit group G32, and a laminated unit group G33 are provided. The first buildup unit group G31 is composed of a plurality of layers (three layers in the present embodiment), a liquid processing unit M11, a liquid processing unit M21, and a liquid processing unit M31. The second buildup unit group G32 faces the first buildup unit group G31 along the direction in which the carriers 3 are arranged in the carrier holding portion 2. The second buildup unit group G32 is composed of a multilayered liquid processing unit M12, a liquid processing unit M22, and a liquid processing unit M32. The third buildup cell group G33 is disposed between the first buildup cell group G31 and the second buildup cell group G32. The third build-up cell group G33 is composed of a plurality of layers (6 layers in the present embodiment), and has a build-up curing unit D1 to a curing unit D6, and has a laminate unit group G12 and a build-up unit group G15 shown in FIGS. 6A and 6B. Composition. The partial transfer chamber C is disposed on the side opposite to the main transfer robot CR with respect to the curing unit D1 to the curing unit D6. A partial transfer robot LR is disposed in the partial transfer chamber C. The local transport robot LR may be provided in each of the layers corresponding to the liquid processing unit M11, the liquid processing unit M12, the liquid processing unit M12, the liquid processing unit M22, the liquid processing unit M31, and the liquid processing unit M32. Further, a partial handling robot LR that is commonly used may be provided for the liquid processing unit M disposed on a plurality of layers (for example, all layers).

The main transport robot CR is disposed in the main transport chamber 5A. The main transport chamber 5 is partitioned between the first build-up unit group G31 to the third build-up unit group G33 and the index robot IR. The transfer of the substrate W between the index robot IR and the main transport robot CR can also be performed via the substrate transfer unit 7 that temporarily holds the substrate W. The main transport robot CR carries the unprocessed substrate W received from the index robot IR via the substrate transfer unit 7 into one liquid processing unit M included in the first buildup unit group G31 or the second buildup unit group G32. The substrate W processed by the liquid processing unit M is carried out by the partial transfer robot LR, and is carried into any one of the curing unit D1 to the curing unit D6 that the local transfer robot LR can enter. The substrate W processed by the curing unit D is taken out by the partial transfer robot LR, and is carried into the liquid processing unit M into which the local transfer robot LR can enter to perform the removal process. The substrate W in which the removal processing or the like has been completed in the liquid processing unit M is taken out by the main transport robot CR, and delivered to the index robot IR via the substrate transfer unit 7.

The substrate W cured by the curing unit D can also be carried into the liquid processing unit M by the main transfer robot CR to perform the removal process.

[Embodiment 6] FIG. 9 is a view showing a configuration of a substrate processing apparatus according to a sixth embodiment of the present invention, and shows a configuration example of the curing unit D. The curing unit D has a curing chamber 111 constituting a vacuum chamber. An exhaust pipe 112 is connected to the curing chamber 111. The exhaust pipe 112 is connected to an exhaust unit 113 such as a vacuum pump. An exhaust valve 110 is inserted in the exhaust pipe 112.

In the solidification chamber 111, a substrate loading/unloading opening 114 for loading/unloading the substrate W by the partial transfer robot LR is formed on the side wall 115.

Further, in the solidification chamber 111, a substrate carry-out opening 116 for carrying out the solidified processed substrate W by the main transport robot CR may be formed on the side wall 117. At this time, it is preferable to provide a shutter 118 for opening and closing the substrate carrying-out opening 116, and the shutter 118 is driven by the shutter driving unit 119. Further, it is preferable that an O-ring 120 as a sealing member is provided on a surface of the baffle 118 facing the curing chamber 111. At this time, the shutter 118 is pressed to the side wall 117 of the curing chamber 111, whereby the substrate carrying-out opening 116 is hermetically sealed via the O-ring 120. When the main transport robot CR carries out the substrate W processed by the curing unit D, the shutter driving unit 119 drives the shutter 118 to open the substrate carry-out opening 116. The hand HC of the main transport robot CR enters the opened substrate carry-out opening 116.

On the other hand, the substrate loading/unloading opening 114 is opened and closed by the cover member 125 provided in the hand LH of the partial transfer robot LR. On the surface of the cover member 125 opposed to the curing chamber 111, an O-ring 126 as a sealing member is provided. The local transfer robot LR operates by moving the substrate W on which the film formation processing liquid film 10 is formed by the liquid processing unit M to the curing chamber 111, and then pressing the cover member 125 to the curing chamber via the O-ring 126. Side wall 115 of 111. Thereby, the substrate loading/unloading opening 114 is hermetically sealed.

An inert gas nozzle 71A for introducing an inert gas into a space inside the curing chamber 111 is provided on the top surface of the curing chamber 111. The inert gas nozzle 71A has the same configuration as that of the curing unit shown in FIG. 3, and supplies an inert gas to the inert gas nozzle 71A. In FIG. 9, the same reference numerals are given to the portions corresponding to the respective portions of FIG. 3, and the description thereof is omitted.

The outline of the operation of the curing unit D is as follows.

The partial transfer robot LR carries the substrate W into the curing chamber 111 in a state where the substrate carry-out opening 116 is blocked by the shutter 118. The substrate W is a substrate in a state in which the film formation processing liquid film 10 is formed on the upper surface thereof. The local transport robot LR causes the hand LH to enter the curing chamber 111, and presses the lid member 125 to the outer surface of the side wall 115 of the curing chamber 111 to block the substrate loading/unloading opening 114. As a result, the inside of the curing chamber 111 becomes an airtight sealed space. By opening the exhaust valve 110 in the above state, the exhaust unit 113 is operated to decompress the space in the solidification chamber 111 to a pressure lower than atmospheric pressure. Thereby, the film formation processing liquid film 10 on the substrate W is dried and solidified.

The inert gas valve 73 is opened during the period before the decompression of the space in the curing chamber 111 is started, and the inert gas is supplied from the inert gas nozzle 71 into the curing chamber 111. Thereby, the inside of the curing chamber 111 is maintained in a space of low humidity. When the pressure reduction in the curing chamber 111 is started, the inert gas valve 73 is closed so as not to impede the pressure reduction.

As described above, after the solidification of the film formation processing liquid film 10 on the substrate W is completed, the operation of the exhaust unit 113 is stopped, and the inert gas valve 73 is opened as needed. Thereby, the space in the curing chamber 111 is returned to the atmospheric pressure. Next, the local transfer robot LR retreats the hand LH holding the substrate W on which the cured film 10S is formed, and exits from the curing chamber 111. Then, the local transport robot LR transports the substrate W to the liquid processing unit M to perform a removal process.

When the substrate W after the solidification process is performed by the main transport robot CR, the shutter drive unit 119 retracts the shutter 118 from the substrate carry-out opening 116, thereby opening the substrate carry-out opening 116. Thereafter, the main transport robot CR causes the hand HC to enter the solidification chamber 111, receives the solidified processed substrate W from the hand LH of the local transport robot LR, and carries out the substrate W from the substrate carry-out opening 116.

As described above, by providing the cover member 125 on the hand LH of the partial transport robot LR, the shutter drive mechanism for moving the substrate into/out of the opening 114 can be omitted. Moreover, since the substrate W can be held in the curing chamber 111 by the hand LH of the local transport robot LR, it is not necessary to provide the substrate holding mechanism in the curing chamber 111. The curing of the film forming treatment liquid film 10 by the pressure reduction can be performed in a short time, so that it is impossible to have a large influence on the productivity by maintaining the substrate W in the curing process by the hand LH of the partial handling robot LR. .

In addition, by the operation of transporting the substrate W to the curing chamber 111 by the hand LH, the substrate loading/unloading opening 114 can be sealed by the lid member 125, and the substrate W can be directly held in the curing chamber 111 to be cured. Therefore, the operation dedicated to the switch of the substrate loading/unloading opening 114 and the transfer operation of the substrate W can be omitted, so that the time required for the entire step can be shortened, and the productivity can be improved. Specifically, the shutter switching time for the substrate loading/unloading opening, the time when the hand LH is ejected from the curing chamber 111 when the substrate is loaded, and the time when the hand LH enters the curing chamber 111 when the substrate is carried out can be omitted, and the substrate can be placed. The time of the action on the top lift pin, the time for receiving the action of the substrate from the top lift pin, the time for raising and lowering the jacking pin, and the like. In addition, when the substrate W after the curing process is transported by the local transport robot LR, the switching time of the substrate loading/unloading opening 114 and the time required for the main transport robot CR to transfer the substrate W may be omitted.

Further, the substrate W may be heated simultaneously with the curing treatment under reduced pressure. Specifically, the substrate W may be heated by heating the hand LH of the local transport robot LR by the hand heating unit 97A (see FIG. 4). Further, a heating unit 127 that heats the substrate W by radiant heat or electromagnetic wave irradiation may be provided in the curing chamber 111, and the substrate W held on the hand LH is heated by the heating unit 127.

[Embodiment 7] FIG. 10 is a view for explaining a seventh embodiment of the present invention, and shows a configuration of a hand washing unit (arm washing unit) that washes the hand LH of the partial transport robot LR.

In the embodiment described above, the partial transfer chamber C is provided with a configuration for washing the opponent LH. On the other hand, in the present embodiment, for example, as shown by a virtual line in FIG. 8, a hand washing unit 170 is provided adjacent to the partial transport chamber C.

The hand washing unit 170 includes a hand washing chamber 171 provided adjacent to the partial conveying chamber C, a hand washing nozzle 172 disposed in the hand washing chamber, and an exhaust gas for decompressing the inside of the hand washing chamber 171 to a pressure lower than atmospheric pressure. Unit 173.

The hand washing chamber 171 constitutes a vacuum chamber. At the bottom 175 of the hand washing chamber 171, an exhaust/drain pipe 176 is connected. The exhaust/drain pipe 176 is connected to an exhaust unit 173 such as a vacuum pump via an exhaust pipe 176A. An exhaust valve 177 is inserted in the exhaust pipe 176A. The exhaust/drain pipe 176 is in turn connected to the drain pipe 176B via a drain valve 178.

In the hand washing chamber 171, an opening 180 for inserting the hand LH of the partial handling robot LR is formed on the side wall 181. The opening 180 is opened and closed by the cover member 125 provided on the hand LH of the partial transport robot LR. On the surface of the cover member 125 opposed to the hand washing chamber 171, an O-ring 126 as a sealing member is provided. When the substrate handling robot LR is not transporting the substrate W, it operates in such a manner that the hand LH is inserted from the opening 180 into the hand washing chamber 171, and then the cover member 125 is pressed to the side wall 174 of the hand washing chamber 171 via the O-ring 126. . Thereby, the opening 180 is hermetically sealed.

The hand washing nozzle 172 is disposed, for example, on the top surface of the hand washing chamber 171. The hand washing nozzle 172 ejects the washing liquid to the hand LH that has been inserted into the hand washing chamber 171. The hand washing nozzle 172 may also be a shower nozzle that sprays the washing liquid in a shower. A washing liquid pipe 185 is connected to the hand washing nozzle 172. The washing liquid pipe 185 is connected to the washing liquid supply source 186. The washing liquid supply source 186 supplies a washing liquid which can dissolve the film forming processing liquid, for example, an organic solvent. A washing liquid valve 187 for causing a washing liquid flow path switch is inserted into the washing liquid pipe 185.

The outline of the operation of the hand washing unit 170 is as follows.

The local transport robot LR causes the hand LH to enter the hand washing chamber 171, and presses the cover member 125 to the outer surface of the side wall 181 of the hand washing chamber 171 to block the opening 180. As a result, the inside of the hand washing chamber 171 becomes an airtight sealed space. In this state, the drain valve 178 is opened. Then, the washing liquid is supplied from the hand washing nozzle 172 to the hand LH by opening the washing liquid valve 187. Thereby, the opponent LH performs washing. The washing liquid falls to the bottom 175, passes through the exhaust/drain pipe 176, and is discharged to the drain pipe 176B through the drain valve 178.

When the washing liquid is ejected from the hand washing nozzle 172 for only a predetermined period of time, the washing liquid valve 187 is closed to stop the discharge of the washing liquid. Then, the drain valve 178 is closed, and instead, the exhaust valve 177 is opened to operate the exhaust unit 173. Thereby, the space in the hand washing chamber 171 is decompressed to a pressure lower than atmospheric pressure. Thereby, the liquid component on the hand LH evaporates, thereby drying the hand LH.

After the washing and drying of the hand LH is completed as described above, the operation of the exhaust unit 173 is stopped, and the drain valve 178 is opened as needed. Thereby, the space in the hand washing chamber 171 is returned to the atmospheric pressure. Next, the local transport robot LR retracts the hand LH and exits from the hand washing chamber 171.

The substrate W may be heated simultaneously with the decompression of the hand washing chamber 171. Specifically, the substrate W may be heated by heating the hand LH of the local transport robot LR by the hand heating unit 97A (see FIG. 4). Thereby, the drying of the hand LH can be promoted. Further, the hand washing chamber 171 may be provided with a heating unit 188 that heats the hand LH by radiant heat or electromagnetic wave irradiation to promote drying of the hand LH.

As described above, in the above-described embodiment, the hand washing chamber 171 (arm washing chamber) is provided adjacent to the partial conveying chamber C, so that when the partial conveying robot LR does not carry the substrate W, it can be opponent in the hand washing chamber 171. LH is washed. Further, since the hand washing nozzle 172 (arm washing nozzle) is disposed in the hand washing chamber 171, the washing liquid can be prevented from entering the partial conveying chamber C while being washed by the opponent LH. Thereby, the influence of the washing liquid on the substrate W can be suppressed. Further, by depressurizing the hand washing chamber 171, the hand LH washed by the washing liquid can be quickly dried.

[Embodiment 8] FIG. 11 is a view for explaining a configuration of a substrate processing apparatus according to a seventh embodiment of the present invention, and is a view schematically showing a configuration example of a curing unit that can be used in place of the curing unit described above. Sectional view.

In the above embodiment, the curing unit D has a configuration similar to that shown in Fig. 3, and further includes a cooling plate 80 as a substrate cooling unit. Instead of the configuration shown in FIG. 3, a configuration similar to that shown in FIG. 9 may be used. FIG. 10 shows an example in which a configuration similar to that shown in FIG. 3 is provided.

The cooling plate 80 is disposed on the base portion 81, and holds the substrate W on the upper surface thereof and is cooled from the lower surface. A plurality of (three or more) jacking pins 84 are disposed through the cooling plate 80. The jacking pin 84 is moved up and down by the jacking up/down unit 85, whereby the substrate W is moved up and down on the cooling plate 80.

The substrate processing apparatus further includes a second partial transfer robot 150 that transports the substrate W that has been subjected to the curing process in the curing chamber 51 to the cooling plate 80. The second partial transfer robot 150 includes a hand 151 that holds the substrate W and a hand drive unit 152 that moves the hand 151. The hand drive unit 152 reciprocates the hand 151 between the upper portion (the first substrate holding position) of the substrate holder 52 and the upper portion (the second substrate holding position) of the cooling plate 80. When the transfer of the substrate W between the hand 151 and the jacking pin 54 and the jacking pin 84 is performed, the jacking pin 54 and the jacking pin 84 are raised and lowered. Needless to say, the hand drive unit 152 may be configured to elevate and lower the substrate W and transfer the substrate W to the jacking pin 54 and the jacking pin 84.

In the curing chamber 51, the substrate W is heated by the substrate holder 52, and the curing processing space 50 in the curing chamber 51 is depressurized, whereby the film forming processing liquid film 10 on the surface of the substrate W is solidified to form a solidification. Film 10S.

After the curing treatment, the curing treatment space 50 is returned to atmospheric pressure, and the movable cover portion 512 is opened. As a result, an opening for carrying out the substrate W is formed between the base portion 511 and the movable cover portion 512. Then, the substrate W that has been cured is lifted up above the substrate holder 52 by the lift pins 54. Then, the second partial transfer robot 150 has its hand 151 entered through the opening formed between the base portion 511 and the movable cover portion 512. Thereafter, the solidified substrate W is delivered to the hand 151 by the lifting of the jacking pin 54. Then, the second partial transfer robot 150 is driven by the opponent 151 to move the substrate W to the upper side of the cooling plate 80. In the state described above, the jacking up/down unit 85 raises the jacking pin 84, thereby receiving the substrate W from the hand 151. After the hand 151 is retracted from above the cooling plate 80, the jacking pin 84 is lowered, whereby the substrate W is placed on the cooling plate 80.

The cooling plate 80 cools the substrate W to normal temperature. Thereafter, the jacking pin 84 lifts the substrate W, and the hand LH of the partial transport robot LR receives the substrate W and carries it out of the curing unit D. When the substrate W after the curing process is performed by the main transport robot CR, the hand HC of the main transport robot CR receives the substrate W from the jacking pin 84 and carries it out of the curing unit D.

As described above, in order to cool the substrate W after the curing process by the cooling plate 80, the processing time in the curing unit D can be shortened, so that the productivity can be improved. Since the transport of the substrate W heated in the curing chamber 51 is performed by the second partial transfer robot 150 different from the main transport robot CR, excessive heat accumulation can be prevented from being accumulated in the main transport robot CR, and heat can be suppressed to the main transport robot. The influence of the substrate W carried by the CR.

Although the embodiments of the present invention have been described above, the present invention can be embodied in other forms.

For example, in the above-described embodiment, the curing unit D is configured to decompress the inside of the curing chamber 51 and the curing chamber 111 and to perform drying under reduced pressure. However, the curing unit D does not need to have a configuration for reducing pressure. For example, the curing unit D may be configured to heat the substrate W at atmospheric pressure to cure the film forming treatment liquid film 10. Further, the heated inert gas may be supplied from the inert gas supply source 74, and the drying and solidification of the film formation treatment liquid film 10 may be promoted by the warm air formed by the inert gas.

In the configuration of FIG. 1A, FIG. 1B, FIG. 5A, FIG. 5B, FIG. 6A, FIG. 6B and FIG. 7, a substrate transfer for temporarily holding the substrate W may be disposed between the index robot IR and the main transfer robot CR. In the same manner as in the configuration of FIG. 8, the unit performs substrate transfer between the robots.

The present application corresponds to Japanese Patent Application No. 2017-061381, filed on Jan. 27,,,,,,,,,,,,,

The embodiments of the present invention have been described in detail, but the embodiments are merely specific examples for illustrating the technical contents of the present invention. The present invention is not limited to the specific examples, and the scope of the present invention is only The scope of the patent application is limited.

1, 1A, 1B, 1C, 1D‧‧‧ substrate processing equipment

2‧‧‧Carrier Holder

3‧‧‧ Carrier

5, 5A‧‧‧ main transfer room

7‧‧‧Substrate transfer unit

10‧‧‧ Film forming liquid film

10S‧‧‧ cured film

11‧‧‧Processing room

12‧‧‧ Spin chuck

13‧‧‧ cup body

14‧‧‧Drug nozzle

15‧‧‧ Film forming treatment liquid nozzle

16‧‧‧Removal fluid nozzle

17‧‧‧Motor

18, 89‧‧‧Rotation axis

19‧‧‧ 断板

19a‧‧‧ opposite

19b, 180‧‧‧ openings

20‧‧‧Mask board drive unit

20A‧‧‧Blocking plate lifting unit

20B‧‧‧ rupture plate rotation unit

21‧‧‧Pharmaceutical piping

22‧‧‧Drug valve

23‧‧‧Drug supply source

25‧‧‧Rotary axis/rotation axis of the rupture plate

26‧‧‧ Film forming treatment liquid piping

27‧‧‧ Film forming treatment valve

28‧‧‧ Film processing solution supply source

29‧‧‧Clean nozzle/nozzle

31A‧‧‧Washing fluid piping/pipe

31B‧‧‧Organic solvent piping

32A, 134‧‧‧ cleaning fluid valve

32B, 136‧‧‧Organic Solvent Valve

33A, 135‧‧‧ cleaning fluid supply

33B, 137‧‧‧ Organic solvent supply source

35, 36, 115, 117, 174, 181 ‧ ‧ side walls

37, 38, 114‧‧‧ substrate loading/unloading openings

39, 40, 118‧‧ ‧ baffles

41, 42, 119‧‧ ‧Baffle drive unit

45, 140‧‧‧ inert gas flow path

46, 72, 166‧‧‧ inert gas piping

47, 73, 142, 167‧‧‧ inert gas valves

48, 74, 143, 168‧‧‧ inert gas supply

50‧‧‧Cure processing space/processing space

51, 111‧‧‧Cure room

52‧‧‧Sheet holder

53H‧‧‧heater

53C‧‧‧Cooling unit

54, 84‧‧‧ top sales

55, 85‧‧‧ top lift lifting unit

56‧‧‧Care drive unit

58‧‧‧Bottom edge

59‧‧‧Upper surface

60, 120, 126‧‧‧ O-rings

62‧‧‧Exhaust piping

63, 113, 173‧‧ ‧ exhaust unit

64,110,177‧‧‧ exhaust valve

71, 71A, 165‧‧‧ inert gas nozzle

80, 99B‧‧‧cooling plate

81, 511‧‧‧ base

90, 152‧‧‧Hand drive unit

91, 91A‧‧‧ washing liquid nozzle

92, 185‧‧‧ washing liquid piping

93, 187‧‧ ‧ washing liquid valve

94, 186‧‧ ‧ washing liquid supply source

97A‧‧‧Hand heating unit

97B‧‧‧Hand Cooling Unit

98A‧‧‧Heat media access

98B‧‧‧Refrigerant access

99A‧‧‧heating plate

101‧‧‧Removal piping

102‧‧‧Removal valve

103‧‧‧Removal fluid supply

112, 176A‧‧‧ exhaust pipe

116‧‧‧Substrate removal opening

125‧‧‧covering components

127, 188‧‧‧ heating unit

130‧‧‧Rotary axis

131‧‧‧Back nozzle

132‧‧‧Spray outlet

133‧‧‧cleaning fluid supply piping

141‧‧‧Inert gas supply piping

150‧‧‧2nd partial handling robot

151‧‧‧Hand

160, 175‧‧‧ bottom

161‧‧‧Draining piping

170‧‧‧Hand washing unit

171‧‧‧Hand washing room

172‧‧‧Hand washing nozzle

176‧‧‧Exhaust/Drainage Tube

176B‧‧‧Draining tube

178‧‧‧Drain valve

512‧‧‧ activity cover

C, C11-C14, C21-C24, C31, C32‧‧‧ partial transfer room

CR‧‧‧Main handling robot

D, D1-D6, D11-D14, D21-D24, D31-D34‧‧‧ curing unit

G1-G4, G11-G16, G21, G22, G31-G33‧‧‧ laminated unit groups

HC‧‧‧Hands of the main handling robot

IR‧‧‧ indexing robot

LH, LH1, LH2‧‧‧ Partial Handling Robot Hand

LR, LR1, LR2, LR11-LR14, LR21-LR24, LR31, LR32‧‧‧ local handling robot

M, M1-M4, M11-M14, M21-M24, M31-M34‧‧‧ liquid handling unit

S1‧‧‧1st floor

S2‧‧‧2nd floor

S3‧‧‧3rd floor

W‧‧‧Substrate

1A is a plan view showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention. Fig. 1B is a schematic elevational view for explaining a configuration of a substrate processing apparatus according to the first embodiment. FIG. 2 is a schematic cross-sectional view for explaining a configuration example of a liquid processing unit provided in the substrate processing apparatus. 3 is a schematic cross-sectional view for explaining a configuration example of a curing unit provided in the substrate processing apparatus. FIG. 4 is a view for explaining a configuration example of a partial transport robot included in the substrate processing apparatus. FIG. 5 is a schematic plan view for explaining a configuration of a substrate processing apparatus according to a second embodiment of the present invention. Fig. 5B is a schematic elevational view for explaining a configuration of a substrate processing apparatus according to the second embodiment. FIG. 6 is a schematic plan view for explaining a configuration of a substrate processing apparatus according to a third embodiment of the present invention. Fig. 6B is a schematic elevational view for explaining a configuration of a substrate processing apparatus according to the third embodiment. FIG. 7 is a schematic elevational view showing a configuration of a substrate processing apparatus according to a fourth embodiment of the present invention, and shows a configuration of one side of the main transfer chamber. 8 is a schematic plan view for explaining a configuration of a substrate processing apparatus according to a fifth embodiment of the present invention. FIG. 9 is a view showing a configuration of a substrate processing apparatus according to a sixth embodiment of the present invention, and shows a configuration example of a curing unit. Fig. 10 is a view for explaining a seventh embodiment of the present invention, and shows a configuration of a hand washing unit for washing a hand of a partial transport robot. FIG. 11 is a view for explaining a configuration of a substrate processing apparatus according to an eighth embodiment of the present invention, and is a cross-sectional view schematically showing still another configuration example of the curing unit.

Claims (20)

A substrate processing apparatus comprising: a liquid processing unit that supplies a processing liquid to a surface of a substrate in a processing chamber to form a processing liquid film on a surface of the substrate; and a curing unit that cures the processing liquid film in the curing chamber Forming a cured film on the surface; removing the processing unit, supplying the removal liquid for removing the cured film to the surface of the substrate in the removal chamber; the main transport unit, loading the substrate into the processing chamber, and removing the substrate The chamber carries out the substrate; and the partial transport unit removes the substrate from the processing chamber and carries the substrate into the curing chamber. The substrate processing apparatus according to claim 1, wherein the main transport unit is disposed in a main transport chamber, and the partial transport unit is disposed in a partial transport chamber that is isolated from the main transport chamber. The substrate processing apparatus according to claim 1 or 2, wherein the curing unit includes a heating unit that heats the substrate. The substrate processing apparatus according to the first or second aspect of the invention, wherein the partial transfer unit further carries out the substrate from the curing chamber, and carries the substrate into the removal chamber. The substrate processing apparatus according to claim 4, wherein the partial transport unit includes a first transport arm that carries out a substrate from the processing chamber, carries the substrate into the curing chamber, and carries out the substrate from the curing chamber. And moving the second transfer arm of the substrate to the removal chamber. The substrate processing apparatus according to claim 1 or 2, wherein the liquid processing unit comprises: a substrate holding unit that horizontally holds the substrate; and a processing liquid ejecting unit that is held on the substrate holding unit The substrate is ejected from the treatment liquid. The substrate processing apparatus according to claim 1 or 2, wherein the processing chamber and the removal chamber are the same chamber. The substrate processing apparatus according to claim 1 or 2, wherein the partial transfer unit has a transfer arm that holds the substrate and passes through the partial transfer chamber, and the substrate processing device further includes: an arm washing nozzle, which is disposed at In the partial transfer chamber, a washing liquid that washes the transfer arm is ejected. The substrate processing apparatus according to claim 8, wherein the partial transfer chamber includes a liquid receiving unit that receives the bottom of the washing liquid and discharges the washing liquid received by the bottom portion. The substrate processing apparatus according to claim 1 or 2, wherein the partial transport unit has a transport arm that holds a substrate, and the substrate processing apparatus further includes: an arm wash nozzle disposed on the transport arm And washing the washing liquid for washing the transfer arm. The substrate processing apparatus according to claim 1 or 2, wherein the partial transport unit has a transport arm that holds the substrate and passes through the partial transport chamber, and the substrate processing apparatus further includes: an arm washing chamber, and The partial transfer chamber is disposed adjacent to each other; the arm washing nozzle is disposed in the arm washing chamber to discharge the washing liquid for washing the transfer arm; and the decompression unit is configured to depressurize the arm washing chamber to below atmospheric pressure The transfer arm is dried by pressure. The substrate processing apparatus according to claim 1 or 2, wherein the removal processing unit comprises: a substrate holding unit that horizontally holds the substrate in the removal chamber; and a removal liquid ejection unit that is held in the The substrate on the substrate holding unit ejects the removal liquid. A substrate processing method comprising: a processing liquid film forming step of supplying a processing liquid to a surface of a substrate in a processing chamber to form a processing liquid film on a surface of the substrate; a first partial carrying step, after the processing liquid film forming step, The substrate is transported to the curing chamber; a cured film forming step of curing the processed liquid film in the curing chamber to form a cured film on the surface of the substrate; and a second partial transport step in the cured film forming step Thereafter, the substrate is transported to the removal chamber; a removal processing step is performed in which the removal liquid for removing the cured film is supplied to the surface of the substrate; and a main conveyance step using the main conveyance unit The processing chamber is carried into the substrate, and the substrate is carried out from the removal chamber. The substrate processing method according to claim 13, wherein the substrate is transported by the main transport chamber in the main transport step, and is separated from the main transport chamber in the first partial transport step The substrate is transported by the partial transfer chamber. The substrate processing method according to claim 13 or 14, wherein the cured film forming step includes a heating step of heating the substrate by a heating unit. The substrate processing method according to claim 13 or 14, wherein the first partial transporting step and the second partial transporting step are performed by a common partial transporting unit. The substrate processing method according to claim 16, wherein the first partial conveyance step is performed by the first conveyance arm of the partial conveyance unit, and the second conveyance arm of the partial conveyance unit is used The second partial transport step is performed. The substrate processing method according to claim 13 or 14, further comprising: an arm washing step of supplying a washing liquid to the conveying arm of the partial conveying unit. The substrate processing method according to claim 13 or claim 14, wherein the processing chamber and the removal chamber are common chambers. The substrate processing method according to claim 13 or 14, wherein the washing step of washing the substrate is performed before the processing liquid film forming step.