TW201834000A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The substrate processing apparatus includes: a base that rotates around an axis of rotation in a vertical direction; and a plurality of holding pins disposed on the base at intervals in a rotation direction of the base, more than the base Holding a peripheral portion of the substrate at an upper position; the opposing member is disposed between the base and the substrate, and is spaced apart from the substrate and spaced apart from the substrate Lifting between the approaching positions closer to the substrate, opposite to the substrate from below; and a first entry inhibiting member disposed on the opposing member, the opposing member being located at the approximated position In the state, the airflow is suppressed from entering the space between the lower surface of the substrate and the opposing member.

Description

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate. The substrate to be processed includes, for example, a semiconductor wafer (wafer), a substrate for a liquid crystal display device, a substrate for a flat panel display (FPD) such as an organic electroluminescence (EL) display device, and a disk (disk). A substrate such as a substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, or a solar cell substrate.

A monolithic substrate processing apparatus for processing a substrate piece by piece includes a spin base rotatable about an axis of rotation in a vertical direction, and a holding pin disposed on the spin base to hold the substrate (pin). In the substrate processing using such a substrate processing apparatus, the upper surface of the substrate in a rotating state can be processed by the processing liquid sprayed from the processing liquid nozzle (nozzle).

However, during substrate processing, airflow is sometimes generated around the rotating structure (spin base or retaining pin). The mist (small droplets) of the treatment liquid generated during the substrate processing may be wound around the substrate by the air current, and the treatment liquid may adhere to the lower surface of the substrate. Therefore, even when the treatment liquid is prevented from being guided to the lower surface of the substrate via the upper surface and the peripheral edge of the substrate, the treatment liquid may adhere to the lower surface of the substrate.

Therefore, in the substrate processing apparatus described in the following Patent Document 1, there is proposed a substrate process in which a lower surface of the substrate is protected by providing a protective disk between the lower surface of the substrate and the spin base. The upper surface of the substrate is processed. [Prior Art Document] [Patent Literature]

[Patent Document 1] US Patent Application Publication No. 2016/096205

[Problem to be Solved by the Invention] In the substrate processing apparatus described in Patent Document 1, by moving the protective disk from the spin base to be close to the lower surface of the substrate, it is possible to suppress the mist of the processing liquid from entering the protective disk and The space between the lower surfaces of the substrates. However, even when the protective disk is brought close to the lower surface of the substrate, a gap is provided between the protective disk and the substrate. Therefore, it is possible that the mist of the treatment liquid adheres to the lower surface of the substrate through the gap.

Accordingly, it is an object of the present invention to provide a substrate processing apparatus and a substrate processing method which can well protect the lower surface of a substrate. [Means for solving the problem]

An embodiment of the present invention provides a substrate processing apparatus including: a base that rotates about a rotation axis in a vertical direction; and a plurality of holding pins that are spaced apart from each other in a rotation direction of the base a peripheral portion of the substrate is held at a position higher than the base; the opposite member is disposed between the base and the substrate, and is spaced apart from the substrate a position between the approaching position closer to the substrate than the spaced apart position, opposite to the substrate from below; and a first entry inhibiting member disposed on the opposing member, In a state where the opposing member is located at the approaching position, airflow is prevented from entering the space between the lower surface of the substrate and the opposing member.

According to this configuration, the base can be rotated around the rotation axis in a state where the peripheral edge portion of the substrate is held by the plurality of holding pins. As described above, airflow is generated around the rotating structure. For example, it is easy to generate an airflow from the outer side of the rotation direction of the substrate to the airflow between the lower surface of the substrate and the opposing member. In the state where the opposing member is located close to the position, the first entry suppressing member suppresses the flow of air into the space between the lower surface of the substrate and the opposing member. Therefore, it is also possible to suppress the liquid from entering the space between the lower surface of the substrate and the opposing member by the air current. Therefore, the lower surface of the substrate can be well protected.

Further, the term "rotational radial direction" means an orthogonal direction with respect to the rotation axis. Further, the inner side of the rotation radial direction means a direction toward the rotation axis side in the rotation radial direction. Further, the outer side of the radial direction of rotation refers to a direction that is opposite to the side opposite to the rotation axis side in the radial direction of rotation.

In one embodiment of the present invention, the first entrance suppressing member includes: a first fixing portion that is fixed to the opposing member; and a first elastic contact portion that faces in a radial direction of rotation of the substrate The outer side extends closer to the lower surface of the substrate from the first fixing portion, and elastically contacts the peripheral portion of the lower surface of the substrate.

According to the above configuration, the first elastic contact portion extends from the first fixing portion so as to be closer to the lower surface of the substrate from the first fixing portion toward the outer surface in the rotation radial direction of the substrate. Therefore, when an airflow toward the outside in the radial direction of rotation is generated between the lower surface of the substrate and the opposing member, the airflow easily enters between the first elastic contact portion and the lower surface of the substrate. Further, the airflow elastically deforms the first elastic contact portion so that a gap having a width required between the first elastic contact portion and the lower surface of the substrate is formed on the first elastic contact portion and the lower surface of the substrate. between. Then, the airflow is discharged to the outside through the gap from the space between the lower surface of the substrate and the opposing member. Therefore, the excessive pressure between the lower surface of the substrate and the opposing member can be prevented from being excessively increased, and the airflow can be suppressed from entering the space between the lower surface of the substrate and the opposing member.

In an embodiment of the invention, the first entry suppressing member is formed of a porous material.

According to this configuration, the first entrance suppressing member is formed of a porous material. Therefore, the first entry suppressing member can pass the gas by receiving a pressure equal to or higher than a predetermined value from the gas. An airflow toward the outside of the rotating radial direction is generated between the lower surface of the substrate and the opposing member. Due to the airflow, the pressure between the lower surface of the substrate and the opposing member is present around the first entrance suppressing member. When the time reaches the specified value or more. At this time, the gas in the space between the lower surface of the substrate and the opposing member is discharged to the outside through the first entrance suppressing member. On the other hand, the first entrance suppressing member can suppress the airflow from entering the space between the lower surface of the substrate and the opposing member. Therefore, the excessive pressure between the lower surface of the substrate and the opposing member can be prevented from being excessively increased, and the airflow can be suppressed from entering the space between the lower surface of the substrate and the opposing member.

Further, since the first entrance suppressing member is formed of a porous material, it is difficult to pass the liquid. Therefore, it is possible to further suppress the entry of the liquid from the outside to the space between the lower surface of the substrate and the opposing member.

In one embodiment of the present invention, the substrate processing apparatus further includes a second entrance suppressing member provided on the holding pin to suppress airflow from a peripheral portion of a lower surface of the substrate The retaining pins enter between the peripheral portion of the lower surface of the substrate and the space between the opposing members.

According to this configuration, the second entrance suppressing member suppresses the airflow from entering between the peripheral portion of the lower surface of the substrate and the holding pin to the space between the lower surface of the substrate and the opposing member. Therefore, it is possible to suppress the liquid from entering the space between the peripheral portion of the lower surface of the substrate and the holding pin to the space between the lower surface of the substrate and the opposing member.

In one embodiment of the present invention, the second entrance suppressing member includes: a second fixing portion that is fixed to the holding pin; and a second elastic contact portion that faces outward in a radial direction of rotation of the substrate The side closer to the lower surface of the substrate extends from the second fixing portion and elastically contacts the peripheral portion of the lower surface of the substrate.

According to the above configuration, the second elastic contact portion extends from the second fixing portion so that the second fixing portion approaches the lower surface of the substrate from the outer side in the radial direction of rotation of the substrate. Therefore, when an airflow toward the outside in the radial direction of rotation is generated between the lower surface of the substrate and the opposing member, the airflow easily enters between the second elastic contact portion and the lower surface of the substrate. Further, the airflow elastically deforms the second elastic contact portion so that a gap having a width required between the second elastic contact portion and the lower surface of the substrate is formed on the second elastic contact portion and the lower surface of the substrate. between. Then, the airflow is discharged to the outside from the space between the lower surface of the substrate and the opposing member through the gap. Therefore, it is possible to prevent an excessive increase in pressure between the lower surface of the substrate and the opposing member, and it is possible to suppress airflow from entering between the peripheral portion of the lower surface of the substrate and the holding pin to between the lower surface of the substrate and the opposing member. space.

In an embodiment of the invention, the second entry suppressing member is formed of a porous material.

According to the above configuration, the second entrance suppressing member is formed of a porous material. Therefore, the second entry suppressing member can pass the gas by receiving a pressure equal to or higher than a predetermined value from the gas. An airflow toward the outside of the rotating radial direction is generated between the lower surface of the substrate and the opposing member. Due to the airflow, the pressure between the lower surface of the substrate and the opposing member is present around the second entrance suppressing member. When the time reaches the specified value or more. At this time, the gas in the space between the lower surface of the substrate and the opposing member is discharged to the outside from the space between the lower surface of the substrate and the opposing member. On the other hand, it is possible to suppress the airflow from the outside into the space between the lower surface of the substrate and the opposing member. Therefore, it is possible to prevent an excessive increase in pressure between the lower surface of the substrate and the opposing member, and it is possible to suppress airflow from entering between the peripheral portion of the lower surface of the substrate and the holding pin to between the lower surface of the substrate and the opposing member. space.

Further, since the second entrance suppressing member is formed of a porous material, it is difficult to pass the liquid. Therefore, it is possible to further suppress the entry of the liquid from the outside to the space between the lower surface of the substrate and the opposing member.

In one embodiment of the present invention, the first entrance suppressing member suppresses airflow from entering a lower surface of the substrate and the pair in a region between the holding pins adjacent in the rotational direction. Between the components. Further, the second entrance suppressing member prevents airflow from entering between the lower surface of the substrate and the opposing member around each of the holding pins.

According to this configuration, the first entrance suppressing member prevents the airflow from entering the space between the lower surface of the substrate and the opposing member in the region between the holding pins adjacent in the rotational direction. Further, the second entrance suppressing member prevents the airflow from entering the space between the lower surface of the substrate and the opposing member around the holding pin. Therefore, it is possible to suppress the airflow from entering the space between the lower surface of the substrate and the opposing member in a relatively large range (substantially full circumference) in the rotational direction.

In an embodiment of the invention, the substrate processing apparatus further includes a gas supply unit that supplies a gas between the opposing member and the substrate.

According to the above configuration, the gas can be supplied between the opposing member and the substrate by the gas supply unit. By supplying a gas between the opposing member and the substrate, an air flow from the space between the lower surface of the substrate and the opposing member toward the outside of the space can be generated. Therefore, it is possible to suppress the airflow from entering the space between the lower surface of the substrate and the opposing member.

An embodiment of the present invention provides a substrate processing method including a substrate holding step of being disposed on a plurality of holding pins of a chassis at intervals in a rotation direction around a rotation axis in a vertical direction. The peripheral portion of the substrate is held at a position above the base; the approaching step is such that the elastic member fixed on the opposite member facing the substrate from below contacts the lower surface of the substrate The opposing member is adjacent to the substrate; the substrate rotating step is performed by rotating the base in a state where the plurality of holding pins hold the peripheral portion of the substrate and the elastic member is in contact with the lower surface of the substrate The substrate is rotated, and the processing liquid supply step is performed to supply the processing liquid for processing the substrate to the upper surface of the substrate in a rotating state.

According to the method, the substrate is rotated in a state where the elastic member is in contact with the lower surface of the substrate. As described above, airflow is generated around the rotating structure. For example, it is easy to generate an airflow from the outer side of the rotation direction of the substrate to the airflow between the lower surface of the substrate and the opposing member. By bringing the elastic member into contact with the lower surface of the substrate, the elastic member and the substrate are clogged, so that the lower surface of the substrate and the opposing member are clogged. Thereby, it is possible to suppress the airflow from entering the space between the lower surface of the substrate and the opposing member. Therefore, even when the substrate in the rotating state is processed by the processing liquid, it is possible to suppress the mist of the processing liquid from entering the space between the lower surface of the substrate and the opposing member by the air current. Therefore, the lower surface of the substrate can be well protected.

The above and other objects, features, and advantages of the present invention will be apparent from the description of the embodiments described herein.

1 is a schematic plan view for explaining a layout of the inside of a substrate processing apparatus 1 according to an embodiment of the present invention.

The substrate processing apparatus 1 is a one-chip apparatus that processes a substrate W such as a silicon wafer in a single piece. In the above embodiment, the substrate W is a disk-shaped substrate. The substrate processing apparatus 1 includes a plurality of processing units 2, and the substrate W is processed by a processing liquid such as a chemical liquid or a rinse liquid, and a load port LP is placed, and the processing unit 2 is placed and stored. A carrier C of the substrate W; a robot IR and a transport robot CR, and a substrate W are transported between the load port LP and the processing unit 2; and a controller 3 controls the substrate processing apparatus 1 . The transport robot IR transports the substrate W between the carrier C and the transport robot CR. The transport robot CR transports the substrate W between the transport robot IR and the processing unit 2. The plurality of processing units 2 have the same configuration, for example.

FIG. 2 is a schematic view for explaining a configuration example of the processing unit 2.

The processing unit 2 includes a spin chuck 5, a processing liquid supply unit 8, a washing unit 9, and a protective sheet 10. The spin chuck 5 holds the one substrate W in a horizontal posture, and rotates the substrate W around the vertical rotation axis A1 passing through the central portion of the substrate W. The treatment liquid supply unit 8 supplies a treatment liquid such as deionized water (DIW) to the upper surface of the substrate W. The washing unit 9 rubs the brush 31 on the upper surface of the substrate W to wash the upper surface of the substrate W. The protective disk 10 faces the substrate W from below, and the lower surface of the protective substrate W isolates the mist of the processing liquid generated during the substrate processing.

The protective disk 10 is an example of an opposing member that faces at least the peripheral edge portion of the substrate W from below. The processing unit 2 further includes a gas supply unit 11 that supplies a gas such as nitrogen (N ₂ ) to the space A between the lower surface of the substrate W and the protective disk 10 .

The processing unit 2 further includes a chamber 16 (see FIG. 1) that houses the spin chuck 5. In the chamber 16, an entrance (not shown) for carrying the substrate W into the chamber 16 or carrying out the substrate W from the chamber 16 is formed. A shutter unit (not shown) for opening and closing the inlet and outlet is provided in the chamber 16.

The spin chuck 5 includes a spin base 21 (base) rotatable about the rotation axis A1, a plurality of holding pins 20 that hold the peripheral edge portion of the substrate W at a position higher than the spin base 21, and a spin A rotating shaft 22 that is coupled to the center of the base 21 and an electric motor 23 that imparts a rotational force to the rotating shaft 22 are provided. The rotating shaft 22 extends in the vertical direction along the rotation axis A1. The rotating shaft 22 penetrates the spin base 21 and has an upper end at a position higher than the spin base 21. The spin base 21 has a circular plate shape in the horizontal direction. The plurality of holding pins 20 are spaced apart from each other in the rotational direction S and are provided on the peripheral portion of the upper surface of the spin base 21 (see also FIG. 3 described later).

In order to switch the plurality of holding pins 20, the switching unit 25 is provided. The plurality of holding pins 20 are held (clamped) by the switch unit 25 in a closed state. The plurality of holding pins 20 are held in the open state by the switch unit 25, and the holding of the substrate W is released.

The switch unit 25 includes, for example, a link mechanism (not shown) and a drive source (not shown). The drive source includes, for example, a ball screw mechanism and an electric motor that applies a driving force to the ball screw mechanism. The switch unit 25 may also be configured to open and close a plurality of holding pins 20 by a magnetic force. At this time, the switch unit 25 includes, for example, a first magnet (not shown) attached to the holding pin 20, and a second magnet that imparts a repulsive force or an attractive force to the first magnet by approaching the first magnet (not shown). Show). The switch of the holding pin 20 is switched by the repulsive force or attractive force given to the first magnet by the second magnet.

The rotation base 22 is rotated by the electric motor 23 to rotate the spin base 21. Thereby, the substrate W is rotated in the rotation direction S around the rotation axis A1. The spin chuck 5 is included in a substrate holding rotation unit that holds the substrate W and rotates the substrate W around a rotation axis A1 in the vertical direction.

The processing liquid supply unit 8 includes a processing liquid nozzle 40 that supplies a processing liquid such as DIW to the upper surface of the substrate W, a processing liquid supply tube 41 coupled to the processing liquid nozzle 40, and a processing liquid valve that is inserted into the processing liquid supply tube 41. (valve) 42. The processing liquid supply pipe 41 supplies the processing liquid from the processing liquid supply source.

The treatment liquid nozzle 40 is a fixed nozzle. Unlike the present embodiment, the processing liquid nozzle 40 may be a moving nozzle that is movable in the horizontal direction and the vertical direction.

The treatment liquid supplied from the treatment liquid nozzle 40 is not limited to DIW, and may be carbonated water, ionized water, ozone water, hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm), and reduced. Water (hydrogen water).

The washing unit 9 includes a brush 31 for washing the upper surface of the substrate W, an arm 35 for supporting the brush 31, a rotating shaft 36 for rotating the brush arm 35, and a brush arm for driving the rotating shaft 36. 35 arm moving mechanism 37 that moves in the horizontal direction and the vertical direction.

The brush 31 is held on a brush holder 32 disposed above the brush 31. The brush holder 32 protrudes downward from the brush arm 35.

The brush 31 is an elastically deformable sponge brush made of a synthetic resin such as polyvinyl alcohol (PVA). The brush 31 protrudes downward from the brush holder 32. The brush 31 is not limited to a sponge brush, and may be a brush having a bundle of fibers formed of a plurality of fibers made of resin.

The arm moving mechanism 37 includes a brush horizontal driving mechanism (not shown) that moves the brush arm 35 horizontally by rotating the rotating shaft 36 about the rotation axis A2, and a brush vertical driving mechanism (not shown). The brush arm 35 is vertically moved by causing the rotation shaft 36 to move vertically. The brush horizontal drive mechanism includes, for example, an electric motor that rotates the rotating shaft 36. The brush vertical drive mechanism includes, for example, a ball screw mechanism and an electric motor that drives the ball screw mechanism.

The gas supply unit 11 includes a gas nozzle 50 that supplies a gas such as nitrogen gas to a space A between the lower surface of the substrate W and the protective disk 10, a gas supply pipe 51 coupled to the gas nozzle 50, and a gas valve 52 that is inserted into the gas. On the supply pipe 51, a flow path of the gas is turned on. In the gas supply pipe 51, a gas such as nitrogen gas is supplied from a gas supply source.

The gas supplied to the gas supply pipe 51 from the gas supply source is preferably an inert gas such as nitrogen. The inert gas is not limited to nitrogen, but is a gas inert to the lower surface of the substrate W and the device formed on the lower surface. Examples of the inert gas include, besides nitrogen, a rare gas such as helium or argon, and a homing gas (a mixed gas of nitrogen and hydrogen). Further, air may be used as the gas supplied from the gas supply source to the gas supply pipe 51.

The gas nozzle 50 is inserted into the rotating shaft 22. The upper end of the gas nozzle 50 is exposed from the upper end of the rotating shaft 22. A rectifying member 54 that rectifies the gas ejected from the gas nozzle 50 may be provided at a position above the upper end of the gas nozzle 50.

The protective disk 10 has a substantially annular shape. In the protective disk 10, a rotating shaft 22 is inserted. The protective disk 10 is disposed between the substrate W held by the holding pin 20 and the spin base 21. The protection disc 10 can be moved up and down.

On the protective disk 10, a protective disk lifting unit 60 is incorporated. The protective disk 10 is lifted and lowered by the protective disk lifting unit 60 so as to be close to the lower surface of the substrate W at a spaced apart position from the substrate W and at a position above the spaced apart position. Move between. The protective dish lifting unit 60 is an example of an opposing member lifting unit that moves the opposing member up and down.

The protective dish lifting unit 60 includes, for example, a ball screw mechanism (not shown) and an electric motor (not shown) that applies a driving force to the ball screw mechanism. Further, the protective dish lifting unit 60 may be configured to raise and lower the protective disk 10 by a magnetic force. At this time, the protective disk elevating unit 60 includes, for example, a first magnet (not shown) attached to the protective disk 10, and a repulsive force applied to the first magnet to raise the protective disk 10 together with the first magnet. Second magnet (not shown).

On the lower surface of the protective disk 10, a guide shaft 61 extending in the vertical direction in parallel with the rotation axis A1 is coupled. The guide shafts 61 are arranged at a plurality of locations at equal intervals in the rotation direction S of the substrate W. The guide shaft 61 is combined with a linear bearing 62 provided at a corresponding portion of the spin base 21. The guide shaft 61 is guided by the linear bearing 62 and is movable in a direction perpendicular to the rotation axis A1. Further, in order to combine the guide shaft 61 coupled to the lower surface of the protective disk 10 with the linear bearing 62, the protective disk 10 integrally rotates with the spin base 21 around the rotation axis A1.

The guide shaft 61 penetrates the linear bearing 62. At its lower end, the guide shaft 61 is provided with a flange 63 that protrudes outward. By the flange 63 abutting against the lower end of the linear bearing 62, the upward movement of the guide shaft 61 is restricted, that is, the movement of the protection disk 10 upward. That is, the flange 63 is a restricting member that restricts the movement of the protection disk 10 upward.

FIG. 3 is a schematic plan view of the spin base 21. In FIG. 3, for convenience of explanation, the substrate W is indicated by a two-dot chain line.

Referring to Fig. 3, the protective disk 10 has a circular shape substantially the same size as the substrate W in plan view, and faces the peripheral edge of the substrate W. At a peripheral portion of the protective disk 10, a notch 10a that accommodates at least a part of the holding pin 20 is provided at a portion corresponding to the holding pin 20.

The processing unit 2 further includes a first entry suppressing member 12 and a second entry suppressing member 13 that suppress (restrict) the flow of air from the outside in the radial direction of rotation of the substrate W to the space A between the lower surface of the substrate W and the protective disk 10. .

In addition, the rotation radial direction of the board|substrate W is orthogonal direction with respect to the rotation-axis A1. The inner side of the rotation direction of the substrate W is a direction toward the rotation axis A1 side in the rotation radial direction of the substrate W. Hereinafter, the inner side of the rotation direction of the substrate W is simply referred to as a radially inner side. Further, the outer side of the rotation direction of the substrate W is a direction which is opposite to the side opposite to the rotation axis A1 side in the rotation radial direction of the substrate W. Hereinafter, the outer side of the rotation direction of the substrate W in the radial direction is simply referred to as the radial direction.

The first entrance suppressing member 12 suppresses the airflow from entering between the peripheral portion of the lower surface of the substrate W and the peripheral portion of the protective disk 10 to the space A between the lower surface of the substrate W and the protective disk 10. The second entrance suppressing member 13 prevents the space A between the peripheral portion of the lower surface of the substrate W and the holding pin 20 from entering between the lower surface of the substrate W and the protective disk 10.

A plurality of the first entry suppressing member 12 and the second entry suppressing member 13 are provided. Specifically, the first entry suppressing member 12 is provided on the protective disk 10 one by one in a portion between the holding pins 20 adjacent in the rotational direction S. Each of the first entrance suppressing members 12 is a space between the lower surface of the substrate W and the protective disk 10 in a region between the adjacent holding pins 20 in the rotational direction S. The second entry suppressing members 13 are provided one by one on each of the holding pins 20. Each of the second entrance suppressing members 13 prevents the airflow from entering the space A between the lower surface of the substrate W and the protective disk 10 around the corresponding holding pin 20.

4A is a schematic view of a cross section taken along the line IVA-IVA of FIG. 3. In Fig. 4A, the protective disk 10 located at the approximate position is indicated by a solid line. In Fig. 4A, the protective disk 10 at the spaced position is indicated by a two-dot chain line.

The first entry suppressing member 12 is a resin sheet which is curved in plan view (see FIG. 3 ). The resin constituting the first entry suppressing member 12 is, for example, a synthetic resin. Examples of the synthetic resin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), polypropylene (PP), and polytetrafluoroethylene. Ethylene (PE), etc. The first entry suppressing member 12 is an elastic member. The first entry suppressing member 12 may be an elastic body such as synthetic rubber.

The first entrance suppressing member 12 integrally includes a first fixing portion 80 that is fixed to the protective disk 10 and a first elastic contact portion 81 that elastically contacts the peripheral edge portion of the lower surface of the substrate W. The first elastic contact portion 81 is in contact with a position radially outward of a portion on which the device is formed on the lower surface of the substrate W. Specifically, the portion of the first elastic contact portion 81 between the peripheral portion of the lower surface of the substrate W and the position between the radially outer end and the radially outer end (inwardly about 2 mm) Contact.

The first elastic contact portion 81 extends from the first fixing portion 80 so as to be closer to the lower surface of the substrate W as it goes outward in the radial direction. The distance between the first elastic contact portion 81 and the substrate W in the vertical direction is smaller toward the outer side in the radial direction of rotation. In a region between the holding pins 20 adjacent to each other in the rotational direction S in the peripheral portion of the upper surface of the protective disk 10, a support protrusion 82 that supports each of the first elastic contact portions 81 from below is formed.

The first fixing portion 80 is fixed to the protective disk 10 by, for example, a resin-made screw 83. FIG. 4B is an enlarged view of the periphery of the first fixing portion 80 of FIG. 4A. Referring to Fig. 4B, the screw 83 includes a screw shaft 83a formed with a male screw portion, and a head portion 83b protruding from a direction perpendicular to the axial direction from one end of the screw shaft 83a in the axial direction. The screw shaft 83a is inserted (screwed) into a screw hole 84 formed in the protective disk 10. The male screw portion formed on the screw shaft 83a is screwed to the female screw portion formed on the inner circumferential surface of the screw hole 84. The first fixing portion 80 is formed with an insertion hole 85 through which the screw shaft 83a is inserted, and a receiving hole 86 that communicates with the insertion hole 85 to receive the head portion 83b. The first fixing portion 80 is fixed to the protective disk 10 by sandwiching the bottom of the receiving hole 86 between the head portion 83b and the protective disk 10.

The first fixing portion 80 is in close contact with the protective disk 10 in a state of being fixed to the protective disk 10 by the screw 83. Therefore, regardless of the position of the protective disk 10, it is possible to suppress the airflow F from entering between the first entrance suppressing member 12 and the protective disk 10 to the space A between the lower surface of the substrate W and the protective disk 10.

The first elastic contact portion 81 is spaced apart from the lower surface of the substrate W in a state where the protective disk 10 is at a spaced position (see a two-dot chain line in FIG. 4A). The first elastic contact portion 81 is in close contact with the lower surface of the substrate W in a state in which the protective disk 10 is in the close position (see the solid line in FIG. 4A). Therefore, in a state where the protective disk 10 is in the approaching position, the airflow F is suppressed from entering between the first entrance suppressing member 12 and the lower surface of the substrate W to the space A between the lower surface of the substrate W and the protective disk 10.

As described above, the first entrance suppressing member 12 prevents the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10 in a state where the protective disk 10 is in the approaching position.

Fig. 5 is a schematic view showing a cross section taken along line V-V of Fig. 3.

The second entry suppressing member 13 is a resin sheet. The resin constituting the second entry suppressing member 13 is, for example, a synthetic resin. Examples of the synthetic resin include PTFE, PFA, PP, PE, and the like. The second entry suppressing member 13 is an elastic member. The second entry suppressing member 13 may be an elastic body such as rubber.

The holding pin 20 includes a nip portion 20a that is clamped to the substrate W from the horizontal direction, and an opposing portion 20b that extends in a substantially horizontal direction and is spaced apart from the lower surface of the substrate W.

The second entrance suppressing member 13 integrally includes a second fixing portion 90 fixed to the opposing portion 20b of the holding pin 20, and a second elastic contact portion 91 elastically contacting the peripheral portion of the lower surface of the substrate W; The contact portion 92 comes into contact with the peripheral edge portion of the protective disk 10 from above in a state where the protective disk 10 is in the approaching position. The second elastic contact portion 91 extends from the second fixing portion 90 so as to be closer to the lower surface of the substrate W toward the outside in the radial direction. The distance between the second elastic contact portion 91 in the vertical direction and the substrate W becomes smaller as it goes outward in the radial direction. The second fixing portion 90 is fixed to the holding pin 20 by, for example, being fixed to the opposing portion 20b of the holding pin 20 by a screw 93 made of resin. The opposing portion 20b of the holding pin 20 supports the substrate W from below via the second entrance suppressing member 13.

The second fixing portion 90 is in close contact with the holding pin 20 in a state of being fixed to the corresponding holding pin 20 by the screw 93. Therefore, the airflow F is prevented from entering between the second entrance suppressing member 13 and the holding pin 20 to the space A between the lower surface of the substrate W and the protective disk 10.

The second elastic contact portion 91 is in close contact with the lower surface of the substrate W while holding the substrate W on the plurality of holding pins 20 . Therefore, the airflow F is prevented from entering between the second entrance suppressing member 13 and the lower surface of the substrate W to the space A between the lower surface of the substrate W and the protective disk 10.

The protective disk contact portion 92 extends from the second fixing portion 90 to the side opposite to the second elastic contact portion 91 (inward in the radial direction). The protective disk contact portion 92 may be pushed up by the protective disk 10 to be elastically deformed so that the front end (the radially inner end) moves upward while the protective disk 10 is in the approximate position. The protective disk contact portion 92 overlaps the portion 10b around the notch 10a on the upper surface of the protective disk 10 in plan view.

FIG. 6 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus 1. The controller 3 is provided with a microcomputer, and controls a control target provided in the substrate processing apparatus 1 in accordance with a predetermined program. More specifically, the controller 3 includes a processor (central processing unit (CPU)) 3A and a memory 3B storing the program, and is configured to execute a program by the processor 3A. Various controls for substrate processing are performed. In particular, the controller 3 controls the operations of the transport robot IR, the transport robot CR, the arm moving mechanism 37, the electric motor 23, the protection disc elevating unit 60, the switch unit 25, the valve 42, and the valve 52.

FIG. 7 is a flowchart for explaining an example of substrate processing of the substrate processing apparatus 1, and mainly shows processing performed by the controller 3 executing a program.

In the substrate processing, first, the unprocessed substrate W is carried from the carrier C to the processing unit 2 by the transfer robot IR and the transfer robot CR, and is delivered to the spin chuck 5 (step S1). Thereafter, the substrate W is horizontally held upward from the upper surface of the spin base 21 while being carried out by the transport robot CR. The switch unit 25 holds the periphery of the substrate W on the plurality of holding pins 20 (substrate holding step, step S2). At this time, the substrate W is held by the plurality of holding pins 20 in a state where the device surface on which the device is formed faces downward.

Next, the protection disc elevating unit 60 raises the protective disc 10 to the approaching position (proximity step, step S3). Thereby, the first elastic contact portion 81 of the first entrance suppressing member 12 comes into contact with the lower surface of the substrate W. Next, the gas valve 52 is opened. Thereby, gas such as nitrogen gas is supplied to the space A between the upper surface of the protective disk 10 and the lower surface of the substrate W (step S4). The supply flow rate of the gas at this time is, for example, 100 L/min to 200 L/min. The electric motor 23 rotates the spin base 21 in a state in which the plurality of holding pins 20 hold the peripheral edge portion of the substrate W and the first entrance suppressing member 12 is in contact with the lower surface of the substrate. Thereby, the substrate W held horizontally on the holding pin 20 is rotated (substrate rotation step, step S5). The rotation speed of the substrate W at this time is, for example, 500 rpm. The rotation speed of the substrate W is not limited to 500 rpm, and may be any rotation speed between 100 rpm and 1000 rpm. Then, the processing liquid valve 42 is opened while continuing to supply the gas to the space A between the upper surface of the protective disk 10 and the lower surface of the substrate W. Thereby, the processing liquid such as DIW is supplied to the upper surface of the substrate W in the rotating state (the processing liquid supply process, step S6).

Then, a scrub wash is performed (step S7). Specifically, the arm moving mechanism 37 moves the brush arm 35 to press the brush 31 to the upper surface of the substrate W. Since the substrate W is rotating, the brush 31 is sharpened on the upper surface of the substrate W.

The arm moving mechanism 37 retracts the brush 31 from the upper side of the spin chuck 5 to the side thereof. Then, the processing liquid valve 42 is closed, and the supply of the processing liquid from the processing liquid nozzle 40 is stopped (step S8). Then, the electric motor 23 accelerates the rotation of the spin base 21 (step S9). Thereby, a spin dry process is performed in which the droplets of the upper surface and the peripheral end surface of the substrate W are cleaved by centrifugal force to dry the substrate W. The rotation speed of the substrate W at the spin drying treatment is, for example, 1,500 rpm to 3000 rpm. As described above, the treatment liquid is removed from the substrate W, so that the substrate W is dried. Then, when a predetermined time has elapsed after the high-speed rotation of the substrate W is started, the electric motor 23 stops the rotation of the substrate W by the spin base 21 (step S10).

Then, the gas valve 52 is closed, and the supply of the inert gas to the space A between the lower surface of the substrate W and the upper surface of the protective disk 10 is stopped (step S11). Then, the protective dish lifting unit 60 lowers the protective disk 10 to the spaced position (step S12). Then, the plurality of holding pins 20 are set to the open state by the switch unit 25, and the substrate W is released without being held by the plurality of holding pins 20 (step S13).

Then, the transport robot CR enters the processing unit 2, and the processed substrate W is taken out from the spin chuck 5 and carried out to the outside of the processing unit 2 (step S14). The substrate W is delivered from the transfer robot CR to the transfer robot IR, and is stored in the carrier C by the transfer robot IR.

According to the present embodiment, the spin base 21 can be rotated around the rotation axis A1 in a state where the peripheral edge portion of the substrate W is held by the plurality of holding pins 20. Here, an air flow is generated around the rotating structure. For example, it is easy to generate the airflow F flowing from the radially outer side of the substrate W to the lower surface of the substrate W and the protective disk 10 (refer to FIG. 4A). When the protective disk 10 is placed in the close position, the airflow F can be prevented from entering the space A between the peripheral edge portion of the lower surface of the substrate W and the protective disk 10 by the first entrance suppressing member 12. Specifically, the first entrance suppressing member 12 is elastically brought into contact with the lower surface of the substrate W by positioning the protective disk 10 in the approximate position, whereby the first entrance suppressing member 12 is in close contact with the lower surface of the substrate W. On the other hand, since the first fixing portion 80 of the first entrance suppressing member 12 is fixed to the protective disk 10 by the screw 83, the first entry suppressing member 12 and the protective disk 10 are in close contact with each other regardless of the position of the protective disk 10. Thereby, the lower surface of the substrate W and the protective disk 10 are clogged. Therefore, even when the substrate W in the rotated state is processed by the processing liquid, it is possible to suppress the liquid (the mist of the processing liquid generated by the substrate processing, etc.) from entering the lower surface of the substrate W by the airflow F and protecting it. Space A between the discs 10. Therefore, the lower surface of the substrate W can be well protected.

Further, according to the present embodiment, the gas supply unit 11 supplies gas to the space A between the protective disk 10 and the substrate W. By supplying gas to the space A between the protective disk 10 and the substrate W, an air flow from the space A between the substrate W and the protective disk 10 toward the outside of the space A can be generated (refer to FIG. 4A). Therefore, it is possible to suppress the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10.

Further, the radially outward flow (see FIG. 4A) generated between the lower surface of the substrate W and the protective disk 10 is derived not only from the pushing force generated by the supply of the gas from the gas supply unit 11, but also from The centrifugal force when the substrate W is rotated.

Moreover, according to the present embodiment, the first elastic contact portion 81 extends from the first fixing portion 80 so as to be closer to the lower surface of the substrate W from the first fixing portion 80 toward the outside in the radial direction. Therefore, the airflow radially outward between the lower surface of the substrate W and the protective disk 10 easily enters between the first elastic contact portion 81 and the lower surface of the substrate W. Further, the airflow elastically deforms the first elastic contact portion 81 so that a gap having a width required between the first elastic contact portion 81 and the lower surface of the substrate W is formed in the first elastic contact portion 81 and the substrate. Between the lower surfaces of W. Then, the airflow is discharged to the outside from the space A between the lower surface of the substrate W and the protective disk 10 through the gap. Therefore, the excessive pressure between the lower surface of the substrate W and the protective disk 10 can be prevented from being excessively increased, and the airflow F can be suppressed from entering the space A between the lower surface of the substrate W and the protective disk 10.

Further, since the airflow toward the outside in the radial direction passes between the first elastic contact portion 81 and the lower surface of the substrate W, it is possible to suppress the liquid from being guided through the lower surface of the substrate W to enter the lower surface of the substrate W and the protective disk. Space A between 10.

Further, according to the present embodiment, the second entrance suppressing member 13 suppresses the space A between the peripheral edge portion of the lower surface of the substrate W and the protective disk 10 from the peripheral edge portion of the lower surface of the substrate W and the holding pin 20 from the airflow F. . Specifically, by holding the substrate W on the plurality of holding pins 20, the second entrance suppressing member 13 is elastically brought into contact with the lower surface of the substrate W, and the second entrance suppressing member 13 is in close contact with the lower surface of the substrate W. On the other hand, regardless of the holding state of the substrate W, the second entrance suppressing member 13 and the holding pin 20 are in close contact with each other. Therefore, the lower surface of the substrate W and the protective disk 10 are clogged. Therefore, it is possible to suppress the liquid (the mist of the treatment liquid generated by the substrate treatment, etc.) from entering between the peripheral portion of the lower surface of the substrate W and the holding pin 20 to the lower surface of the substrate W and the protective disk 10 by the air flow F. Space A between.

Moreover, according to the present embodiment, the second elastic contact portion 91 extends from the second fixing portion 90 so as to be closer to the lower surface of the substrate W from the second fixing portion 90 toward the outside in the radial direction. Therefore, the airflow radially outward between the lower surface of the substrate W and the protective disk 10 easily enters between the second elastic contact portion 91 and the lower surface of the substrate W. Further, the airflow causes the second elastic contact portion 91 to be elastically deformed so that a gap having a width required between the second elastic contact portion 91 and the lower surface of the substrate W is formed in the second elastic contact portion 91 and the substrate. Between the lower surfaces of W. Then, the airflow is discharged to the outside from the space A between the lower surface of the substrate W and the protective disk 10 through the gap. Therefore, it is possible to prevent an excessive increase in the pressure between the lower surface of the substrate W and the protective disk 10, and it is possible to suppress the airflow F from entering between the peripheral portion of the lower surface of the substrate W and the holding pin 20 to the lower surface of the substrate W and protection. Space A between the discs 10.

Further, since the airflow toward the outside in the radial direction passes between the second elastic contact portion 91 and the lower surface of the substrate W, the liquid can be prevented from being guided to the substrate through the lower surface of the substrate W around the holding pin 20. The space A between the lower surface of W and the protective disk 10.

Further, according to the present embodiment, the first entrance suppressing member 12 is in the region between the adjacent holding pins 20 in the rotational direction S, and prevents the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10. . Further, the second entrance suppressing member 13 is configured to prevent the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10 around the holding pin 20. Therefore, it is possible to suppress the airflow from entering the space A between the lower surface of the substrate W and the protective disk 10 in a relatively large range (substantially full circumference) in the rotational direction S.

Further, according to the present embodiment, the head portion 83b of the screw 83 is housed in the accommodation hole 86. Therefore, the first entry suppressing member 12 can be fixed to the protective disk 10 by the screw 83 without hindering the flow of the airflow between the lower surface of the substrate W and the protective disk 10 toward the outside in the radial direction.

Further, there may be cases where the gas is not supplied from the gas supply unit 11 unlike the above embodiment. Further, there may be a case where the gas supply unit 11 is not provided in the processing unit 2 unlike the above embodiment. In some cases, in the substrate processing, the supply of the gas (step S3) and the stop of the supply of the gas are not performed (step S10). In these cases, the gas between the lower surface of the substrate W and the protective disk 10 also moves radially outward due to the centrifugal force at the time of rotation of the substrate W. Thereby, the first elastic contact portion 81 is elastically deformed, and is discharged to the outside from the space A between the lower surface of the substrate W and the protective disk 10. Therefore, the pressure between the lower surface of the substrate W and the protective disk 10 is lower than the external pressure, and becomes a negative pressure state. Thereby, the first elastic contact portion 81 is further in close contact with the lower surface of the substrate. Therefore, it is possible to further suppress the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10.

Further, according to the present embodiment, the second entrance suppressing member 13 includes the protective disk contact portion 92 that comes into contact with the peripheral edge portion of the protective disk 10 from above in a state where the protective disk 10 is in the close position. Therefore, the airflow which enters between the protective disk 10 and each of the holding pins 20 and enters the space A between the lower surface of the substrate W and the protective disk 10 can flow into the passage between the lower surface of the substrate W and the protective disk 10. Therefore, generation of airflow flowing from the protective disk 10 and the holding pin 20 to the space A between the lower surface of the substrate W and the protective disk 10 can be suppressed.

When the protective disk 10 is in the close position and the protective disk contact portion 92 is elastically deformed so that the distal end (the radially inner end) moves upward, the self-protecting disk 10 can be further suppressed. The flow of airflow into the space A between the lower surface of the substrate W and the protective disk 10 flows between the holding pin 20.

FIG. 8 is a schematic view of the periphery of the first entrance suppressing member 12P according to the first modification of the embodiment. In FIG. 8 , members that are the same as those described above are denoted by the same reference numerals, and their description is omitted.

Referring to Fig. 8, the first entry suppressing member 12P of the first modification is formed of a sponge-like porous material, unlike the present embodiment. Examples of the porous material include a fluororesin, PVA, PP, PE, and the like. The first entry suppressing member 12P integrally includes a first fixing portion 87 that is fixed to the protective disk 10, and a first contact portion 88 that protects the peripheral portion of the lower surface of the substrate W from the state in which the protective disk 10 is in the approaching position and the protection. The peripheral edge portion of the upper surface of the dish 10 is in contact with each other; and the first connecting portion 89 connects the first fixing portion 87 and the first contact portion 88. Similarly to the first fixing portion 80 (see FIG. 4A) of the first entrance suppressing member 12 of the present embodiment, the first fixing portion 87 is fixed to the protective disk 10 by the screw 83.

According to the first modification, the first entrance suppressing member 12P is formed of a porous material. Therefore, the first entry suppressing member 12P can pass the gas by receiving a pressure equal to or higher than a predetermined value from the gas.

The ejection force generated by the supply of the gas from the gas supply unit 11 or the centrifugal force during the rotation of the substrate W causes an airflow toward the radially outward direction in the space A between the lower surface of the substrate W and the protective disk 10. Due to the air flow, the pressure of the space A between the lower surface of the substrate W and the protective disk 10 may reach a predetermined value or more around the first entrance suppressing member 12P. At this time, the gas in the space A between the lower surface of the substrate W and the protective disk 10 is discharged to the outside through the first entrance suppressing member 12P.

On the other hand, in the space radially outward of the first entry suppressing member 12P, unlike the space A, the gas is not actively supplied by the gas supply unit 11 or the centrifugal force. Therefore, the pressure is more difficult to rise than the portion around the first entrance suppressing member 12P in the space A in the space radially outward of the first entry suppressing member 12P. Therefore, the first entry suppressing member 12P can suppress the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside in the radial direction.

Therefore, the excessive pressure between the lower surface of the substrate W and the protective disk 10 can be prevented from being excessively increased, and the airflow F can be suppressed from entering the space A between the lower surface of the substrate W and the protective disk 10.

Further, the first entry suppressing member 12P is formed of a porous material. Therefore, it is difficult for the mist of the treatment liquid to pass through the first entry suppression member 12P. Therefore, the liquid A can be further prevented from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside.

FIG. 9 is a schematic view of the periphery of the holding pin 20 according to the second modification of the embodiment. In FIG. 9, members that are the same as those described above are denoted by the same reference numerals, and their description is omitted.

Referring to Fig. 9, the second entry suppressing member 13P of the second modification is formed of a sponge-like porous material, unlike the present embodiment. Examples of the porous material include a fluororesin, PVA, PP, PE, and the like.

The second entrance suppressing member 13P integrally includes the second fixing portion 97 fixed to the opposing portion 20b of the holding pin 20, and the second contact portion 98 in contact with the peripheral portion of the lower surface of the substrate W and the opposing portion 20b. The second connecting portion 99 connects the second fixing portion 97 and the second contact portion 98, and protects the disk contact portion 96 from the upper side to the peripheral portion of the protective disk 10 in a state where the protective disk 10 is in the approaching position. contact. Similarly to the second fixing portion 90 (see FIG. 5) of the second entrance suppressing member 13P of the present embodiment, the second fixing portion 97 is fixed to the opposing portion 20b by the screw 93.

The protective disk contact portion 96 extends from the second fixing portion 97 to the side opposite to the second connecting portion 99. The protective disk contact portion 96 overlaps the portion 10b around the notch 10a on the upper surface of the protective disk 10 in plan view.

According to the second modification, since the second entrance suppressing member 13P is formed of a porous material, the gas can pass therethrough. Therefore, the second entry suppressing member 13P can pass the gas by receiving a predetermined pressure from the gas.

The ejection force generated by the supply of the gas from the gas supply unit 11 or the centrifugal force during the rotation of the substrate W causes an airflow toward the outside in the radial direction between the lower surface of the substrate W and the protective disk 10, The airflow may be equal to or higher than a predetermined value between the lower surface of the substrate W and the protective disk 10 around the second entrance suppressing member 13P. At this time, the gas in the space A between the lower surface of the substrate W and the protective disk 10 is discharged to the outside from the space A between the lower surface of the substrate W and the protective disk 10.

On the other hand, the space radially outward of the second entry suppressing member 13P is different from the space A, and the gas is not actively supplied by the gas supply unit 11 or the centrifugal force. Therefore, the pressure is more difficult to rise than the portion around the second entrance suppressing member 13P in the space A in the space radially outward of the second entry suppressing member 13P. Therefore, it is possible to suppress the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside.

Therefore, it is possible to prevent an excessive increase in the pressure between the lower surface of the substrate W and the protective disk 10, and it is possible to suppress the airflow F from entering between the peripheral portion of the lower surface of the substrate W and the holding pin 20 to the lower surface of the substrate W and protection. Space A between the discs 10.

Further, since the second entrance suppressing member 13P is formed of a porous material, it is difficult to pass the mist of the treatment liquid. Therefore, the liquid A can be further prevented from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside.

Further, the second entrance suppressing member 13P includes a protective disk contact portion 96 that comes into contact with the peripheral edge portion of the protective disk 10 from above in a state where the protective disk 10 is in the approaching position. Therefore, the airflow which enters between the protective disk 10 and each of the holding pins 20 and enters the space A between the lower surface of the substrate W and the protective disk 10 can flow into the passage between the lower surface of the substrate W and the protective disk 10. Therefore, generation of airflow flowing from the protective disk 10 and the holding pin 20 to the space A between the lower surface of the substrate W and the protective disk 10 can be suppressed.

FIG. 10 is a schematic view of the periphery of the holding pin 20 according to the third modification of the embodiment. In FIG. 10, members that are the same as those described above are denoted by the same reference numerals, and their description is omitted.

Referring to Fig. 10, the second fixing portion 90 of the second entrance suppressing member 13Q of the third modification is fixed to the extending member 15 that extends substantially horizontally between the substrate W and the protective disk 10, unlike the present embodiment. The extension member 15 is opposed to the protection disk 10 from above.

The extended member 15 has a substantially semi-arc shape in plan view. The extended member 15 overlaps the portion 10b around the notch 10a on the upper surface of the protective disk 10 in plan view. In the third modification, the opposing portion 20b of the holding pin 20 is inclined with respect to the horizontal direction, and abuts against the substrate W from below to support the substrate W. The extending member 15 includes an inclined portion 15a that is coupled to the lower end of the opposing portion 20b and that is inclined with respect to the horizontal direction at substantially the same angle as the opposing portion 20b. The second fixing portion 90 of the third modification is fixed to the inclined portion 15a of the extension member 15. The second fixing portion 90 of the third modification is fixed to the holding pin 20 via the extension member 15 .

The second entry suppressing member 13Q of the third modification is a resin sheet as in the present embodiment. The second entry suppressing member 13Q may be formed of a sponge-like porous material in the same manner as the second entry suppressing member 13P (see FIG. 9) of the second modification, unlike the third modified example.

Further, as shown in FIG. 10, when the protective disk 10 is in the close position, the lower surface of the extending member 15 is in contact with the upper surface (the peripheral portion of the protective disk 10), thereby suppressing the airflow self-protection. The disc 10 and each of the holding pins 20 enter a space A between the lower surface of the substrate W and the protective sheet 10.

The present invention is not limited to the embodiments described above, and can be implemented in other forms.

For example, unlike the above-described embodiment, the processing liquid nozzle 40 is a two-fluid nozzle that ejects droplets of the processing liquid together with the gas onto the upper surface of the substrate W. At this time, a gas supply pipe for supplying a gas such as nitrogen gas to the processing liquid nozzle 40 is connected to the processing liquid nozzle 40, and a gas valve for switching the presence or absence of gas supplied to the processing liquid nozzle 40 is inserted into the gas supply pipe. . Further, the processing liquid nozzle 40 is supplied with gas from a gas supply source via a gas supply pipe.

Further, unlike the above-described embodiment, the washing unit 9 may not be provided, and a chemical liquid supply unit that supplies the chemical liquid may be provided instead. The chemical solution supply unit includes a chemical supply nozzle that supplies a chemical solution to the upper surface of the substrate W. Hydrogen fluoride (Hydrogen Fluoride (HF), sulfuric acid hydrogen peroxide mixture (SPM), and ammonia hydrogen peroxide water mixture (SC1) are mentioned as the chemical liquid supplied from the chemical liquid supply nozzle. Hydrogen peroxide aqueous solution (SC2), etc. The chemical supply nozzle can also be a two-fluid nozzle. In the substrate processing of the substrate processing apparatus of the above-described configuration, the upper surface of the substrate W is processed by the chemical liquid supplied from the chemical liquid supply unit, and then the substrate W is applied to the substrate W by the DIW or the like supplied from the processing liquid supply unit 8. The upper surface is cleaned. Then, in the same manner as the substrate treatment in the above embodiment, the substrate W is dried by spin drying.

In addition, the first entry suppressing member 12, the first entry suppressing member 12P, the second entry suppressing member 13, the second entering suppressing member 13P, and the second entering suppressing member 13Q, the lower surface of the substrate W is spread over the rotational direction S. In the case where the restricted airflow is entered throughout the entire circumference, a gas exhausting unit that excludes the gas in the space A between the lower surface of the substrate W and the protective disk 10 may be provided unlike the above-described embodiment.

Further, the protective disk 10 does not necessarily have to face the peripheral edge portion of the substrate W, and may have a circular shape smaller than the substrate W in a plan view. In this case, it is preferable that the first elastic contact portion 81 and the second elastic contact portion 91 are located on the peripheral portion of the lower surface of the substrate W, and the radially outer end is slightly inward of the radially outer end. The part between the positions (inside of 2 mm) is in contact.

The embodiments of the present invention have been described in detail, but the embodiments are merely specific examples for illustrating the technical contents of the present invention. The present invention is not limited to the specific examples, and the scope of the present invention is only The scope of the patent application is limited.

The present application corresponds to Japanese Patent Application No. Hei. No. Hei. No. Hei. No. Hei. No. Hei.

1‧‧‧Substrate processing unit

2‧‧‧Processing unit

3‧‧‧ Controller

3A‧‧‧ processor

3B‧‧‧ memory

5‧‧‧ Spin chuck

8‧‧‧Processing liquid supply unit

9‧‧‧Washing unit

10‧‧‧Protection disc

10a‧‧‧ gap

Section 10b‧‧‧

11‧‧‧ gas supply unit

12, 12P‧‧‧1st entry suppression member

13, 13P, 13Q‧‧‧ second entry suppression member

15‧‧‧ Extended components

15a‧‧‧ inclined section

16‧‧‧ chamber

20‧‧‧ Keep selling

20a‧‧‧ gripping department

20b‧‧‧ opposite department

21‧‧‧Spin base

22‧‧‧Rotary axis

23‧‧‧Electric motor

25‧‧‧Switch unit

31‧‧‧ brushes

32‧‧‧Brush holder

35‧‧‧ brush arm

36‧‧‧Rotary axis

37‧‧‧ Arm movement mechanism

40‧‧‧Processing liquid nozzle

41‧‧‧Processing liquid supply pipe

42‧‧‧Processing valve/valve

50‧‧‧ gas nozzle

51‧‧‧ gas supply pipe

52‧‧‧Gas valve/valve

54‧‧‧Rectifying components

60‧‧‧protection disc lifting unit

61‧‧‧Guide axis

62‧‧‧Linear bearings

63‧‧‧Flange

80, 87‧‧‧1st fixed department

81‧‧‧1st elastic contact

82‧‧‧Support protrusion

83, 93‧‧‧ screw

83a‧‧‧ Screw shaft

83b‧‧‧ head

84‧‧‧ screw holes

85‧‧‧ inserted through hole

86‧‧‧ receiving holes

88‧‧‧1st contact

89‧‧‧1st link

90, 97‧‧‧2nd fixed department

91‧‧‧2nd elastic contact

92, 96‧‧‧Protection disc contact

98‧‧‧2nd contact

99‧‧‧2nd link

A‧‧‧ space

A1‧‧‧Rotation axis

A2‧‧‧ axis of rotation

C‧‧‧ Carrier

CR, IR‧‧‧ handling robot

F‧‧‧Airflow

LP‧‧‧Load port

S‧‧‧Rotation direction

S1～S14‧‧‧Steps

W‧‧‧Substrate

1 is a schematic plan view for explaining a layout of the inside of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic view for explaining a configuration example of a processing unit provided in the substrate processing apparatus. 3 is a schematic plan view of a spin base provided in the substrate processing apparatus. 4A is a schematic view of a cross section taken along the line IVA-IVA of FIG. 3. Fig. 4B is an enlarged view of the periphery of the first fixing portion of Fig. 4A. Fig. 5 is a schematic view showing a cross section taken along line V-V of Fig. 3. Fig. 6 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus. FIG. 7 is a flowchart for explaining an example of substrate processing of the substrate processing apparatus. FIG. 8 is a schematic view of the periphery of the first entrance suppressing member according to the first modification of the embodiment. FIG. 9 is a schematic view of the periphery of a second entry suppressing member according to a second modification of the embodiment. FIG. 10 is a schematic view of the periphery of a second entry suppressing member according to a third modified example of the embodiment.

Claims (9)

A substrate processing apparatus comprising: a base that rotates about an axis of rotation in a vertical direction; a plurality of holding pins disposed on the base at intervals in a direction of rotation of the base, a peripheral portion of the substrate is held at a position above the base; and the opposing member is disposed between the base and the substrate at a spaced apart position from the substrate and spaced apart from the substrate The open position is raised and lowered between the approximate positions of the substrate, opposite to the substrate from below; and the first entry suppressing member is disposed on the opposite member, and the opposite member is located in the approaching In the positional state, the airflow is suppressed from entering the space between the lower surface of the substrate and the opposing member. The substrate processing apparatus according to claim 1, wherein the first entrance suppressing member includes: a first fixing portion fixed to the opposite member; and a first elastic contact portion facing upward The outer side of the rotation direction of the substrate in the radial direction is closer to the lower surface of the substrate, and extends from the first fixing portion and elastically contacts the peripheral portion of the lower surface of the substrate. The substrate processing apparatus according to claim 1, wherein the first entrance suppressing member is formed of a porous material. The substrate processing apparatus according to claim 1 or 2, further comprising: a second entry suppressing member provided on the holding pin to suppress an air flow from a peripheral portion of the lower surface of the substrate The gap between the retaining pins enters between the lower surface of the substrate and the opposing member. The substrate processing apparatus according to claim 4, wherein the second entrance suppressing member includes: a second fixing portion fixed to the holding pin; and a second elastic contact portion facing the substrate The outer side of the rotating radial direction extends from the second fixing portion as it approaches the lower surface of the substrate, and elastically contacts the peripheral portion of the lower surface of the substrate. The substrate processing apparatus according to claim 4, wherein the second entrance suppressing member is formed of a porous material. The substrate processing apparatus according to claim 4, wherein the first entry suppressing member suppresses airflow into the substrate in a region between the holding pins adjacent in the rotational direction. Between the lower surface and the opposing member, the second entry suppressing member suppresses airflow from entering the space between the lower surface of the substrate and the opposing member around each of the holding pins. The substrate processing apparatus according to claim 1 or 2, further comprising: a gas supply unit that supplies a gas between the opposing member and the substrate. A substrate processing method comprising: a substrate holding step of being disposed on a plurality of holding pins of a base at a position spaced above the base in a rotational direction about a rotation axis in a vertical direction Holding a peripheral portion of the substrate; the approaching step of bringing the elastic member on the opposite member facing the substrate from the bottom into contact with the lower surface of the substrate, so that the opposing member is close to the substrate; a substrate rotating step of rotating the substrate to rotate the substrate while the plurality of holding pins hold the peripheral portion of the substrate and the elastic member is in contact with the lower surface of the substrate; And a processing liquid supply step of supplying the processing liquid for processing the substrate to the upper surface of the substrate in a rotating state.