TW201823125A - Assembly structure connected with nozzle automatically adjusting the vertical shift and holding the nozzle in position horizontally - Google Patents
Assembly structure connected with nozzle automatically adjusting the vertical shift and holding the nozzle in position horizontally Download PDFInfo
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- TW201823125A TW201823125A TW105143608A TW105143608A TW201823125A TW 201823125 A TW201823125 A TW 201823125A TW 105143608 A TW105143608 A TW 105143608A TW 105143608 A TW105143608 A TW 105143608A TW 201823125 A TW201823125 A TW 201823125A
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- 238000007789 sealing Methods 0.000 claims abstract description 42
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 39
- 238000010586 diagram Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002156 adsorbate Substances 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明係提供一種用以連接晶片吸嘴的組裝結構,尤指一種可自動調整整體結構垂直的偏移及水平定位的組裝結構。The invention provides an assembly structure for connecting a wafer suction nozzle, in particular, an assembly structure capable of automatically adjusting the vertical offset and horizontal positioning of the overall structure.
在半導體的封裝製程中需要將切割、研磨後的晶片作吸取與放置的動作,所以會有一裝置去完成吸取與放置的處理,而此裝置上與晶片的吸取與放置的接觸會有一固定座與吸嘴。In the semiconductor packaging process, the cut and polished wafers need to be sucked and placed, so there will be a device to complete the process of sucking and placing, and there will be a fixed seat and contact between the device and the wafer sucking and placing. Nozzle.
隨著晶片的厚度越來越薄,現在市場上常見的規格約在30~50um,而且可能越來越薄,造成吸取與放置的作業會產生因為人為裝置吸嘴疏忽無法平壓,或因為吸嘴無法均勻施力造成晶片與接觸面產生空氣或無法與底膠完全接合,而造成晶片的破損,致使原本吸取與放置的固定座與吸嘴已無法符合生產的需求,除了在吸嘴上以要求平面方式製作外,更有各種不同為解決薄型晶片的固定座與吸嘴產生。As the thickness of the wafer is getting thinner and thinner, the common specifications on the market are about 30 ~ 50um, and it may become thinner and thinner, which will cause the suction and placement operations to be caused by the negligence of the nozzle of the artificial device. The inability of the nozzle to exert force uniformly causes air to be generated between the wafer and the contact surface or cannot be fully bonded with the primer, resulting in damage to the wafer. As a result, the original holders and nozzles that have been sucked and placed can no longer meet the production requirements. In addition to the planar production method, there are a variety of different solutions for fixing the thin wafers and the suction nozzle.
習用常見用來與吸嘴連接組裝的結構,其中之一是在固定座上設有一夾爪,並將吸嘴直接嵌入在夾爪中,但正是因吸嘴是嵌入在固定座上方的夾爪中,使得吸嘴在安裝嵌入後不易取出,造成更換上的難度,於安裝吸嘴時,難免會碰到吸嘴的吸晶面,而造成吸嘴污染,並易有因疏忽而未將吸嘴推置到底,使其與固定座接面平貼呈傾斜,無法確保安裝吸嘴後一定是平面,會造成晶片破裂,且因夾爪與吸嘴之間是以組裝上的緊配來固定,容易使吸嘴會因為夾爪的壓力產生形變,造成晶片壓傷破損。One of the commonly used structures used to connect and assemble the suction nozzle is to provide a clamping jaw on the fixing base and embed the suction nozzle directly into the clamping jaw. However, it is precisely because the suction nozzle is a clamp embedded above the fixing base. In the claw, the suction nozzle is difficult to remove after installation and insertion, which makes it difficult to replace. When installing the suction nozzle, it will inevitably touch the suction crystal surface of the suction nozzle, which will cause the nozzle to be contaminated. The nozzle is pushed to the bottom so that the contact surface with the fixed seat is inclined. It cannot be ensured that the nozzle must be flat after the nozzle is installed, which will cause the chip to break, and because the clamping jaw and the nozzle are closely fitted on the assembly. Fixed, it is easy for the suction nozzle to deform due to the pressure of the clamping claw, which will cause the wafer to be crushed and damaged.
在習用與吸嘴連接組裝的結構中,另有固定座以其位於真空孔底部的凸接結構來與設置在吸嘴的對應內凹結構,雖較夾爪更容易安裝吸嘴,但因吸嘴上需另設有對應的內凹結構,易於其生產過程中變形,也同樣在安裝時有吸嘴污染的問題。再者,吸嘴因其材質,於其製造時易有較大的公差,雖預設有對應凹凸的結構關係,但容易滑動與變形,造成晶片壓傷破損。In the conventional structure for connecting and assembling the suction nozzle, another fixing base uses a convex structure at the bottom of the vacuum hole to correspond to a corresponding concave structure provided on the suction nozzle. Although it is easier to install the suction nozzle than the clamping claw, The mouth needs to be provided with a corresponding concave structure, which is easy to deform during the production process, and also has the problem of contamination of the nozzle during installation. Furthermore, due to the material of the nozzle, it is easy to have a large tolerance when it is manufactured. Although the structural relationship corresponding to the unevenness is preset, it is easy to slide and deform, causing damage to the wafer.
對應的緊配關係來固定吸嘴的組裝結構,亦可在固定座下方延伸出定位腳與吸嘴上定位孔搭配,但亦會因定位腳與吸嘴之間的緊配結構,在吸嘴的安裝與取出上都有難度,且吸嘴與固定座間以緊配合來定位,無法進行結構上的調整,並在安裝時有接觸污染吸嘴的機會。The corresponding tight fitting relationship fixes the assembly structure of the suction nozzle. The positioning foot can be extended below the fixing seat to match the positioning hole on the suction nozzle. However, due to the tight fitting structure between the positioning foot and the suction nozzle, It is difficult to install and take out, and the suction nozzle and the fixed seat are positioned with a tight fit, structural adjustment cannot be performed, and there is a chance of contacting the pollution nozzle during installation.
習用組裝結構中,也有針對上述以對應的緊配關係來固定吸嘴進行改良,而在固定座上鑲嵌有一磁鐵,並在吸嘴上加設有可供磁吸的鐵片或不銹鋼片,來取代緊配合的組裝結構,雖能改善緊配合結構的組裝問題,但也造成其他技術問題,固定座與吸嘴之間的鐵片或不銹鋼片無法完全緊密結合,有洩漏真空之可能性情況,且磁鐵與吸嘴上鐵片或不銹鋼片之間的磁性吸附結構沒有相應的定位處,會造成吸嘴組裝上水平偏移問題。In the conventional assembly structure, there is also an improvement on the above-mentioned fixed fitting nozzle with a corresponding tight fitting relationship, and a magnet is embedded in the fixed seat, and an iron piece or a stainless steel piece for magnetic suction is added to the suction nozzle. Instead of the tight-fitting assembly structure, although it can improve the assembly problem of the tight-fitting structure, it also causes other technical problems. The iron or stainless steel sheet between the fixed seat and the suction nozzle cannot be completely tightly combined, and there is a possibility of leaking vacuum. In addition, the magnetic adsorption structure between the magnet and the iron piece or stainless steel piece on the suction nozzle does not have a corresponding positioning place, which will cause a horizontal offset problem on the suction nozzle assembly.
又,習用以緊配關係來固定吸嘴的組裝結構都是著眼在組裝後吸嘴平面度的問題,但針對所吸取的晶片如果發生有與吸嘴非呈平面的垂直偏移(傾斜)的問題,上述僅對吸嘴與固定座間平面度的結構上改良無法解決垂直偏移(傾斜)的問題,尤其當晶片厚度越來越薄時,此一問題之影響會越來越明顯。In addition, the assembly structures that are used to fix the nozzles with a close fitting relationship all focus on the flatness of the nozzles after assembly. However, if the sucked wafer has a vertical offset (tilt) that is not planar with the nozzles, Problem, the above-mentioned structural improvement of the flatness between the nozzle and the fixed seat cannot solve the problem of vertical offset (tilt), especially when the thickness of the wafer becomes thinner and thinner, the influence of this problem will become more and more obvious.
有鑑於此,係針對習用結構進行改良,提供一種連接吸嘴的組裝結構,用以供吸嘴裝設,該組裝結構包括一固定座,該固定座上具有一導磁的本體並設有至少二定位部,該定位部分別設置在該固定座的不同側處;一吸嘴底座,該吸嘴底座具有一導磁的本體並裝設有該吸嘴,該吸嘴底座對應該定位部各設有一定位柱,且以該定位柱對應插接於該定位部,以將該吸嘴底座組接於該固定座,並限制該固定座與該吸嘴底座組裝結構上的水平位移,以利該吸嘴的操作使用。In view of this, the conventional structure is improved, and an assembly structure for connecting nozzles is provided for the installation of the nozzles. The assembly structure includes a fixing base, which has a magnetically permeable body and is provided with at least Two positioning parts, which are respectively disposed at different sides of the fixed base; a nozzle base, which has a magnetically permeable body and is provided with the nozzle, and the nozzle base corresponds to each of the positioning parts A positioning column is provided, and the positioning column is correspondingly inserted into the positioning portion, so as to connect the nozzle base to the fixing base, and limit the horizontal displacement of the fixing base and the nozzle base assembly structure to facilitate This nozzle is used for operation.
所述的吸嘴底座設有一凹部,用以設置一磁鐵,且該固定座具有導磁性,使該固定座與該吸嘴底座之間透過磁性吸附而組合連接並可防止磁力由該吸嘴下面端外漏,其中該固定座於上端面設有一接合部,該接合部具有一真空通道,該磁鐵設有一開孔,用以與該吸嘴底座共同相通於該真空通道,其中該吸嘴底座設有一密封槽,該密封槽係圍繞在該凹部外側,並夾設於該固定座與該吸嘴底座之間,且於該密封槽設置有一密封件,該密封件係採用具彈性的材料,以確保真空密閉性,該密封件係高出該吸嘴底座且其高度係配合於該固定座下端面與該吸嘴底座上端面之間所預留之一調整空間,該調整空間的高度係用以補償因傾斜而產生的高度落差。The nozzle base is provided with a recess for setting a magnet, and the fixing base has magnetic permeability, so that the fixing base and the nozzle base are combined and connected through magnetic adsorption, and the magnetic force can be prevented from under the nozzle. Leakage, wherein the fixing seat is provided with a joint portion on the upper end surface, the joint portion has a vacuum channel, the magnet is provided with an opening for communicating with the nozzle base in the vacuum channel, and the nozzle base A sealing groove is provided. The sealing groove surrounds the outside of the recess, is sandwiched between the fixing seat and the nozzle base, and a sealing member is provided in the sealing groove. The sealing member is made of elastic material. To ensure vacuum tightness, the seal is higher than the nozzle base and its height is matched with an adjustment space reserved between the lower end surface of the fixed seat and the upper end surface of the nozzle base. The height of the adjustment space is To compensate for the height drop caused by the tilt.
所述的吸嘴底座設有至少一凹部,用以設置一磁鐵,以供該固定座與該吸嘴底座之間以磁性吸附而組合連接,其中該固定座於上端面設有一接合部,該接合部具有一真空通道,該吸嘴底座設有一真空孔,用以相通於該固定座的真空通道,其中該吸嘴底座設有一密封槽,該密封槽係圍繞在該凹部外側,並夾設於該固定座與該吸嘴底座之間,且於該密封槽設置有一密封件,該密封件係採用具彈性的材料,以確保真空密閉性,該密封件係高出該吸嘴底座且其高度係配合於該固定座下端面與該吸嘴底座上端面之間所預留之一調整空間,該調整空間的高度係用以補償因傾斜而產生的高度落差。The suction nozzle base is provided with at least one concave portion for setting a magnet for the fixed connection between the fixing base and the suction nozzle base by magnetic adsorption, wherein the fixing base is provided with a joint portion on an upper end surface, the The joint portion has a vacuum channel, and the nozzle base is provided with a vacuum hole for communicating with the vacuum channel of the fixed base. The nozzle base is provided with a sealing groove, which is surrounded on the outside of the recess and is clamped. A seal is provided between the fixing base and the nozzle base, and a sealing member is provided in the sealing groove. The seal is made of an elastic material to ensure vacuum tightness. The seal is higher than the nozzle base and is The height is matched with an adjustment space reserved between the lower end surface of the fixed seat and the upper end surface of the nozzle base. The height of the adjustment space is used to compensate for the height drop caused by the tilt.
所述的吸嘴底座兩側各設有一把手,以便於裝卸。A handle is provided on each side of the suction nozzle base to facilitate loading and unloading.
本發明所採行的另一技術手段為該組裝結構包括一固定座,該固定座具有一導磁的本體並設有至少二定位部,該定位部係具有一上寬下窄的錐狀孔道,並於該固定座下端面形成有一下端孔;一吸嘴底座,具有一導磁的本體並裝設有該吸嘴,該吸嘴底座對應該定位部各設有一定位柱,且以該定位柱對應插置於該下端孔,以將該吸嘴底座組裝於該固定座,並限制該固定座與該吸嘴底座組裝結構上的水平位移;一密封件,該密封件夾設於該固定座與該吸嘴底座之間,該定位部以該錐狀孔道相對位在該下端孔上方的孔道來提供在該吸嘴底座傾斜時,該定位柱所需的相對位移空間,以利該吸嘴下端面貼合於一呈傾斜的晶片表面,並利用該密封件維持該固定座與該吸嘴底座組裝結構的密合度。Another technical means adopted by the present invention is that the assembly structure includes a fixing base, the fixing base has a magnetically permeable body and is provided with at least two positioning portions, and the positioning portions have a tapered channel with an upper width and a narrow width. And a lower end hole is formed on the lower end surface of the fixed seat; a nozzle base has a magnetically permeable body and is provided with the nozzle, the nozzle base is provided with a positioning column corresponding to the positioning portion, and the positioning is based on the positioning A column is correspondingly inserted into the lower end hole to assemble the nozzle base to the fixing base and limit the horizontal displacement of the fixing base and the nozzle base assembly structure; a seal is clamped to the fixing Between the seat and the nozzle base, the positioning portion uses the cone-shaped channel opposite to the hole above the lower end hole to provide the relative displacement space required by the positioning column when the nozzle base is inclined to facilitate the suction. The lower end surface of the mouth is attached to an inclined wafer surface, and the seal is used to maintain the closeness between the fixing seat and the assembly structure of the nozzle base.
所述的錐狀孔道具有一與垂直線夾有1度至5度的傾斜面,其中該傾斜面與垂直線之夾角較佳的範圍是在2度至2.5度之間。The tapered hole prop has an inclined surface between 1 degree and 5 degrees with a vertical line, and a preferred range of an included angle between the inclined surface and the vertical line is between 2 degrees and 2.5 degrees.
所述的定位部分別設置在該固定座的不同側處。The positioning portions are respectively disposed at different sides of the fixing base.
所述的吸嘴底座設有一凹部與一密封槽,該凹部用以設置一磁鐵,使該固定座與該吸嘴底座之間透過磁性吸附而組合連接,並可防止磁力由該吸嘴下面端外漏,且該密封槽係圍繞在該凹部外側,該密封件設置於該密封槽,該固定座於上端面設有一接合部,該接合部具有一真空通道,該凹部底面設一真空孔,且該磁鐵設有一開孔,用以與該凹部共同相通於該真空通道,該密封件係高出該吸嘴底座且其高度係配合於該固定座下端面與該吸嘴底座上端面之間所預留之一調整空間,該調整空間的高度係用以補償因傾斜而產生的高度落差。The nozzle base is provided with a recessed portion and a sealing groove, and the recessed portion is provided with a magnet, so that the fixed seat and the nozzle base are combined and connected through magnetic adsorption, and the magnetic force can be prevented from passing through the lower end of the nozzle. Leakage, and the sealing groove is surrounded on the outside of the recess, the seal is provided on the sealing groove, the fixing seat is provided with a joint portion on the upper end surface, the joint portion has a vacuum channel, and the bottom surface of the recess portion is provided with a vacuum hole, The magnet is provided with an opening for communicating with the concave portion to the vacuum channel. The seal is higher than the nozzle base and its height is fitted between the lower end surface of the fixing base and the upper end surface of the nozzle base. One of the reserved adjustment spaces is reserved, and the height of the adjustment space is used to compensate for the height drop caused by the tilt.
所述的吸嘴底座亦具有導磁性,設有至少一凹部與一密封槽,該凹部設有一磁鐵,以供該固定座與該吸嘴底座之間以磁性吸附而組合連接,可防止磁力由該吸嘴下面端外漏,且該密封槽係圍繞在該凹部外側,該密封件設置於該密封槽,其中該固定座於上端面設有一接合部,該接合部具有一真空通道,該吸嘴底座設有一真空孔,用以相通於該固定座的真空通道,該密封件係高出該吸嘴底座且其高度係配合於該固定座下端面與該吸嘴底座上端面之間所預留之一調整空間,該調整空間的高度係用以補償因傾斜而產生的高度落差,其中該密封件係採用具彈性的材料,以確保真空密閉性。The nozzle base also has magnetic permeability, and is provided with at least one recessed portion and a sealing groove. The recessed portion is provided with a magnet for the magnetic connection between the fixed seat and the nozzle base to prevent magnetic force from being combined. The lower end of the suction nozzle leaks out, and the sealing groove is surrounded on the outside of the recess. The seal is provided on the sealing groove. The fixing seat is provided with a joint on the upper end surface. The joint has a vacuum channel. The nozzle base is provided with a vacuum hole for communicating with the vacuum channel of the fixed base. The seal is higher than the nozzle base and its height is matched between the lower end of the fixed base and the upper end of the nozzle base. An adjustment space is reserved. The height of the adjustment space is used to compensate for the height drop caused by the inclination. The seal is made of an elastic material to ensure vacuum tightness.
所述的吸嘴底座兩側各設有一把手,以便於裝卸。A handle is provided on each side of the suction nozzle base to facilitate loading and unloading.
本發明相較與先前技術具有以下功效:Compared with the prior art, the present invention has the following effects:
本發明的組裝結構,其固定座利用在不同側處的定位部,配合吸嘴底座的定位柱,以定位柱對應插置於定位部的下端孔之對應結構關係作為組裝固定座以及吸嘴底座的水平定位,使吸嘴不會有水平位移問題。In the assembly structure of the present invention, the fixing base uses positioning parts at different sides and cooperates with the positioning post of the nozzle base, and the corresponding structural relationship of the positioning post correspondingly inserted in the lower end hole of the positioning part is used as the assembly fixing base and the nozzle base. Horizontal positioning so that the nozzle will not have a horizontal displacement problem.
再者,因為吸嘴是直接平貼在吸嘴底座上,取代先前技術中以緊配合組裝吸嘴的結構,而不會有吸嘴變形的問題。Furthermore, because the suction nozzle is directly flatly attached to the nozzle base, it replaces the structure of assembling the suction nozzle with a tight fit in the prior art, and there is no problem of deformation of the suction nozzle.
組裝結構中的吸嘴底座在密封槽中設置有密封件,利用密封件的彈性可將固定座、吸嘴、吸嘴底座、晶片或其吸附物等相關可能產生各種不平整或傾斜進行修正,讓吸嘴可以平整吸附或平貼在晶片或吸附物上,以確保平面度。The nozzle base in the assembly structure is provided with a seal in the sealing groove. The elasticity of the seal can be used to correct various irregularities or tilts related to the fixed seat, the nozzle, the nozzle base, the wafer or its adsorbate. Allow the suction nozzle to be flat or attached to the wafer or the adsorbent to ensure flatness.
由於組裝結構中的吸嘴底座設有磁鐵,配合有導磁性的固定座及吸嘴底座,使固定座與吸嘴底座之間能透過磁性吸附而組合連接,可避免吸嘴面端的磁性外漏,且因為吸嘴底座設有把手,利用把手來操作組裝吸嘴底座,讓操作人員在不碰觸到吸嘴下端面的情況下,能夠快速、方便地將吸嘴底座連同吸嘴安裝到固定座上或是由固定座拆下,且不會汙染吸嘴用以吸晶的下端面,亦無需拆下的固定座來安裝或卸除。Because the nozzle base in the assembly structure is provided with a magnet, and the magnetically conductive fixing base and the nozzle base are matched, the fixed base and the nozzle base can be combined and connected through magnetic adsorption, so as to avoid magnetic leakage at the end of the nozzle surface. And because the nozzle base is provided with a handle, the handle is used to assemble the nozzle base, so that the operator can quickly and easily install the nozzle base together with the nozzle without touching the lower end face of the nozzle. It can be removed from the seat or by the fixed seat, and it will not pollute the lower end surface of the suction nozzle for sucking crystals, and there is no need to remove the fixed seat for installation or removal.
操作環境的溫度雖有機會影響磁鐵的磁力,但因吸嘴使用期限較短,在其需要被更換前,溫度對磁力之影響,不至於會影響到對晶片的吸取放置作業,除非在吸嘴其使用期限到達前,磁鐵已因居禮溫度而造成其完全消磁。Although the temperature of the operating environment may affect the magnetic force of the magnet, due to the short life of the suction nozzle, the temperature will affect the magnetic force before it needs to be replaced, which will not affect the suction and placement of the wafer unless it is placed in the nozzle. Before the end of its useful life, the magnet has been completely demagnetized due to the curie temperature.
於固定座中,其定位部具有的錐狀孔道,錐狀孔道以其傾斜面所圍繞之上寬下窄的錐狀結構空間,提供吸嘴底座在傾斜時,因固定座位置不變,定位柱所需的相對位移空間,使吸嘴底座能配合密封件,藉由傾斜來對應修正因整體組裝以及晶片本身或其他因素等可能產生的垂直偏移問題進行修正。In the fixed seat, the positioning portion has a tapered channel, and the tapered channel has a tapered structure space which is wide and narrow around the inclined surface, so that when the nozzle base is tilted, the position of the fixed seat is not changed. The relative displacement space required by the column enables the nozzle base to cooperate with the seal, and corrects the vertical offset problems that may occur due to the overall assembly and the wafer itself or other factors.
固定座的錐狀孔道,其傾斜面與垂直線的角度乃考量固定座、吸嘴、晶片所有可能產生的垂直偏移最大傾斜度所設計,以利垂直偏移發生時與密封件搭配,修正垂直偏移度為平整。The angle of the inclined surface of the fixed seat to the vertical line is designed by considering the maximum inclination of all possible vertical offsets of the fixed seat, nozzles, and wafers, so that it can be matched with the seal when vertical offset occurs. The vertical offset is flat.
在吸嘴底座傾斜時,其與固定座會因傾斜而有高度上的落差,密封件可用來保持兩者之間的密合度。When the nozzle base is tilted, there will be a height difference between the nozzle and the fixed seat due to the tilt. The seal can be used to maintain the closeness between the two.
請參閱第1至3圖,係本發明第一實施例之立體圖及分解圖,本發明連接吸嘴的組裝結構中之組裝結構包括一固定座10、一吸嘴底座20,並於吸嘴底座20裝設有一吸嘴30,吸嘴30是以其下端面吸咐一晶片40。Please refer to FIGS. 1 to 3, which are perspective views and exploded views of the first embodiment of the present invention. The assembly structure of the assembly structure for connecting nozzles according to the present invention includes a fixing base 10, a nozzle base 20, and a nozzle base. 20 is provided with a suction nozzle 30, which sucks a wafer 40 by its lower end surface.
固定座10具有一金屬本體並其上端面設置有一接合部11,用以接合一真空吸氣機(未圖示),且接合部11具有一真空通道111,真空通道111貫穿接合部11以及下方的固定座10。The fixing base 10 has a metal body and a joint portion 11 provided on an upper end surface thereof for joining a vacuum getter (not shown), and the joint portion 11 has a vacuum passage 111 penetrating the joint portion 11 and below.的 固定座 10。 The fixed seat 10.
同參第5A圖中所示,固定座10設有二定位部12,定位部12分別設置在固定座10的不同側處。定位部12係貫穿固定座10並具有一上寬下窄的錐狀孔道120,使分別於固定座10上下兩端面形成有一上端孔121與一下端孔122,且定位部12的錐狀孔道120具有一與垂直線夾有1度至5度的傾斜面。As shown in FIG. 5A of the same reference, the fixing base 10 is provided with two positioning portions 12, and the positioning portions 12 are respectively disposed at different sides of the fixing base 10. The positioning portion 12 penetrates the fixing base 10 and has a tapered tunnel 120 with an upper width and a narrow width. The upper end hole 121 and the lower end hole 122 are formed on the upper and lower ends of the fixing base 10, respectively, and the cone portion 120 of the positioning portion 12 is formed. It has an inclined surface which is sandwiched between 1 degree and 5 degrees with a vertical line.
依實際需求,錐狀孔道120的傾斜面與垂直線之夾角θ可為2度、2.5度、3度、3.5度、4度或是4.5度,其夾角θ較佳的範圍是在2度至2.5度之間。According to actual needs, the angle θ between the inclined surface of the tapered tunnel 120 and the vertical line may be 2 degrees, 2.5 degrees, 3 degrees, 3.5 degrees, 4 degrees, or 4.5 degrees. The preferred range of the included angle θ is 2 degrees to Between 2.5 degrees.
固定座10可選擇性在定位部12的上端孔121處加設一頂蓋(圖中未示)以防止灰塵或雜物掉入定位部12內而影響其功能,有於需要時,可增加定位部12的數目。The fixing base 10 can optionally add a cover (not shown) at the upper end hole 121 of the positioning portion 12 to prevent dust or debris from falling into the positioning portion 12 and affecting its function. If necessary, it can be increased. Number of positioning portions 12.
此外,本實施例固定座10之定位部12的錐狀孔道120可以只貫通固定座10的下端面,而只形成下端孔122。In addition, the tapered channel 120 of the positioning portion 12 of the fixed base 10 in this embodiment may penetrate only the lower end surface of the fixed base 10 and only form the lower end hole 122.
吸嘴底座20於上端面對應固定座10上各定位部12的位置設有一定位柱21以及一用以與真空通道111相通的真空孔22,且吸嘴底座20於下端面設有一相通於真空孔22的真空空間25與一固定凹部26,固定凹部26可供吸嘴30黏固密合固定。由於吸嘴30因為是平貼固定在吸嘴底座20下方,可確保吸嘴30的平面度。The nozzle base 20 is provided with a positioning post 21 and a vacuum hole 22 for communicating with the vacuum channel 111 at positions of the upper end corresponding to the positioning portions 12 on the fixed base 10, and a nozzle base 20 is provided with a communicating vacuum at the lower end. The vacuum space 25 of the hole 22 and a fixing concave portion 26 can be used for the suction nozzle 30 to be adhered and fixed. Since the suction nozzle 30 is fixed flat under the nozzle base 20, the flatness of the suction nozzle 30 can be ensured.
於吸嘴底座20上端面,利用定位柱21對應插置於固定座10的下端孔122,以將吸嘴底座20組裝於固定座10下方,並藉由定位部12與定位柱21之間插置的結構來限制固定座10與吸嘴底座20組裝結構上的水平位移,使兩者相對位置受限而不能再左右移動,以利吸嘴30於真空下的操作使用。A positioning post 21 is inserted into the lower end hole 122 of the fixing base 10 on the upper end surface of the nozzle base 20 to assemble the nozzle base 20 below the fixing base 10, and is inserted between the positioning part 12 and the positioning post 21. This structure restricts the horizontal displacement on the assembly structure of the fixing base 10 and the nozzle base 20, so that the relative positions of the two are limited and cannot be moved left and right, so as to facilitate the operation of the nozzle 30 under vacuum.
本實施例中的固定座10與吸嘴底座20具有導磁性,且吸嘴底座20於真空通道111下方設有一凹部24,且真空孔22相對位在凹部24底面,並以一磁鐵29設置於凹部24中,使固定座10與吸嘴底座20之間利用磁性吸附而組合連接,且由於固定座10及吸嘴底座20皆為導磁材質,可防止磁力由吸嘴30下面端外漏。In this embodiment, the fixing base 10 and the nozzle base 20 are magnetically permeable, and the nozzle base 20 is provided with a recessed portion 24 below the vacuum channel 111, and the vacuum hole 22 is oppositely positioned on the bottom surface of the recessed portion 24, and a magnet 29 is provided on the In the recess 24, the fixed base 10 and the nozzle base 20 are combined and connected by magnetic adsorption, and since the fixed base 10 and the nozzle base 20 are made of magnetically conductive material, magnetic force can be prevented from leaking from the lower end of the nozzle 30.
吸嘴底座20以磁性吸附於固定座10,能改善習用嵌入式的組合結構,在安裝易有因疏忽而未將吸嘴底座20推置於最底部以與固定座10接面平貼,使得吸嘴底座20所組裝的吸嘴30也一併呈傾斜,於作業時造成所吸附的晶片40破裂的問題The nozzle base 20 is magnetically attached to the fixed base 10, which can improve the conventional embedded combination structure. During installation, it is easy to negligently fail to push the nozzle base 20 to the bottom to be flat with the fixed base 10, so that The nozzle 30 assembled by the nozzle base 20 is also tilted together, which causes the problem that the adsorbed wafer 40 is broken during operation.
磁鐵29亦設有一開孔,用以與凹部24共同相通於真空通道111。The magnet 29 is also provided with an opening for communicating with the vacuum passage 111 in common with the recess 24.
吸嘴底座20另在凹部24外側設有一密封槽23,如第3圖所示,密封槽23係圍繞在凹部24外側,並在密封槽23中黏固密合設置有一密封件28,密封件28上端接合於固定座10之底面,且於組裝後係夾設於固定座10與吸嘴底座20之間。密封件28與密封槽23係對應設成相同外形。The nozzle base 20 is also provided with a sealing groove 23 outside the recessed portion 24. As shown in FIG. 3, the sealing groove 23 is surrounded on the outside of the recessed portion 24, and a sealing member 28 is provided in the sealing groove 23 to tightly adhere to it. The upper end of 28 is connected to the bottom surface of the fixing base 10 and is clamped between the fixing base 10 and the nozzle base 20 after assembly. The seal 28 and the seal groove 23 are provided in the same outer shape correspondingly.
密封件28係採用具彈性的絕緣材質,能確保固定座10與吸嘴底座20之間的結構氣密性(如第4、5圖中所示),使於真空操作下能維持兩者間的真空度,以利吸嘴30於真空下的操作使用。密封件28本身材質的彈性可以將固定座10、吸嘴底座20、吸嘴30以及晶片40相關之可能產生各種結構上不平整或傾斜進行修正,讓吸嘴30可以平整地吸附或平貼在晶片40上。The seal 28 is made of flexible insulating material, which can ensure the airtightness of the structure between the fixed seat 10 and the nozzle base 20 (as shown in Figures 4 and 5), so that the two can be maintained under vacuum operation. The vacuum degree is used to facilitate the operation of the suction nozzle 30 under vacuum. The elasticity of the material of the seal 28 can correct various structural irregularities or tilts that may be caused by the fixing base 10, the nozzle base 20, the nozzle 30, and the wafer 40, so that the nozzle 30 can be flatly adsorbed or stuck on the surface. Wafer 40.
實際上,溫度有機會影響吸嘴底座20中的磁鐵29,進而影響其磁力,但因吸嘴30使用期限較短,在吸嘴30需要被更換前,溫度對磁鐵29磁力之影響,不會影響到吸取放置作業,除非在吸嘴30其使用期限到達前,磁鐵29已因居禮溫度而造成其完全消磁。In fact, temperature may affect the magnet 29 in the nozzle base 20, and then its magnetic force. However, because the life of the nozzle 30 is short, the temperature will affect the magnetic force of the magnet 29 before the nozzle 30 needs to be replaced. Affects the suction and placement operation, unless the magnet 30 has been completely demagnetized due to the courtesy temperature before the suction nozzle 30 has reached the end of its useful life.
同參第4、5圖中所示,吸嘴底座20下端面固定有吸嘴30,吸嘴30頂面設置通道31與複數貫穿吸嘴30的流通孔32,流通孔32相通於吸嘴底座20的真空孔22、真空空間25,而與固定座10的真空通道111相互連通,使得真空通道111與流通孔32形成氣流通道,使吸嘴30利用真空吸氣機(圖中未示)透過真空通道111吸氣時所產生的真空吸力來拾取一晶片40。此時,晶片40會貼合於吸嘴30組裝後用以吸取晶片40的下端面33。As shown in Figures 4 and 5 of the same reference, the suction nozzle 30 is fixed to the lower end surface of the suction nozzle base 20. A channel 31 is provided on the top surface of the suction nozzle 30 and a plurality of circulation holes 32 penetrating through the suction nozzle 30. The circulation holes 32 communicate with the suction nozzle base. The vacuum hole 22 and the vacuum space 25 of 20 communicate with the vacuum channel 111 of the fixing base 10, so that the vacuum channel 111 and the circulation hole 32 form an air flow channel, and the suction nozzle 30 is transmitted through the vacuum aspirator (not shown in the figure). The vacuum suction force generated when the vacuum channel 111 is sucked to pick up a wafer 40. At this time, the wafer 40 is attached to the lower end surface 33 of the wafer 40 after being assembled on the suction nozzle 30.
在通常的操作情況下,吸嘴30能夠以其下端面33直接貼合於晶片40,但在如晶片40本身表面不平整或是晶片40在非正常置放等例外情況下,會造成晶片40表面相對與吸嘴30的下端面33係呈現傾斜狀態。Under normal operating conditions, the suction nozzle 30 can be directly attached to the wafer 40 with its lower end surface 33, but in exceptional circumstances such as the wafer 40 itself is not flat or the wafer 40 is placed abnormally, the wafer 40 may cause the wafer 40 The surface is inclined with respect to the lower end surface 33 of the suction nozzle 30.
在上述情況下,為使吸嘴30的下端面33貼合於相對呈傾斜的晶片40表面,吸嘴30及吸嘴底座20需配合傾斜,以在不損晶片40結構的情況下仍能保持與晶片40貼合。In the above case, in order to make the lower end surface 33 of the suction nozzle 30 adhere to the surface of the wafer 40 which is relatively inclined, the suction nozzle 30 and the nozzle base 20 need to cooperate to incline so as not to damage the structure of the wafer 40 It is bonded to the wafer 40.
同參第6、6A圖中所示,吸嘴底座20以定位柱21插置在固定座10的錐狀孔道120的下端孔122,且錐狀孔道120相對在下端孔122上方具有逐漸加寬孔徑的孔道,此即為錐狀孔道120的傾斜面所圍繞之下窄上寬的錐狀結構空間,且在吸嘴底座20傾斜時,固定座10是維持原位,而是以其錐狀孔道120提供吸嘴底座20在傾斜時,定位柱21所需的相對位移空間,使吸嘴底座20依傾斜方向而能對應上下垂直調整。As shown in Figures 6 and 6A of the same reference, the nozzle base 20 is inserted into the lower end hole 122 of the cone-shaped channel 120 of the fixing base 10 with the positioning post 21, and the cone-shaped channel 120 has a gradually wider width than the lower end hole 122. The diameter of the channel, which is the narrow and wide cone-shaped structure space surrounded by the inclined surface of the cone-shaped channel 120, and when the nozzle base 20 is tilted, the fixing base 10 is maintained in place, but in its cone shape The channel 120 provides the relative displacement space required by the positioning post 21 when the nozzle base 20 is inclined, so that the nozzle base 20 can be vertically adjusted corresponding to the tilt direction.
在吸嘴底座20傾斜時,其與固定座10會因傾斜而有高度上的落差,此時利用夾設於固定座10與吸嘴底座20之間的密封件28來保持兩者之間的密合度。When the nozzle base 20 is inclined, there is a height difference between the nozzle base 20 and the fixed base 10 due to the tilt. At this time, a seal 28 sandwiched between the fixed base 10 and the nozzle base 20 is used to maintain the distance between the two. Closeness.
密封件28高出吸嘴底座20上端面之高度係配合於固定座10下端面與吸嘴底座20上端面間所預留之一調整空間13,其高度係綜合考量晶片40本身以及與晶片40吸取放置相關所需各元件組合之公差來設定,同時利用密封件28的彈性,可用來補償因相對傾斜而產生的垂直高度落差,以在吸嘴底座20傾斜時保持整體結構上的氣密度,並能自動修正因組裝所累積的垂直公差偏移。The height of the seal 28 above the upper end surface of the nozzle base 20 is adapted to an adjustment space 13 reserved between the lower end surface of the fixed base 10 and the upper end surface of the nozzle base 20, and the height is based on a comprehensive consideration of the wafer 40 itself and the wafer 40 Set the tolerances of the various component combinations required for placement, and use the elasticity of the seal 28 to compensate for the vertical height drop caused by the relative tilt to maintain the air density of the overall structure when the nozzle base 20 is tilted. And can automatically correct the vertical tolerance deviation accumulated due to assembly.
定位部12的錐狀孔道120可配合密封件28,修正因結構上組裝公差的垂直偏移,亦可在晶片40表面與吸嘴30呈傾斜的使用情況下搭配調整操作,且錐狀孔道120的下端孔122與吸嘴底座20的定位柱21之間對應的結構關係同時可讓整體組裝結構無相對水平位移。錐狀孔道120的傾斜面與垂直線之角度θ係綜合考量固定座10、吸嘴底座20、吸嘴30與晶片40等可能產生垂直偏移最大傾斜度所設置。The tapered channel 120 of the positioning portion 12 can cooperate with the seal 28 to correct the vertical offset due to structural assembly tolerances. It can also be used for adjustment operations when the surface of the wafer 40 is inclined with the suction nozzle 30, and the tapered channel 120 At the same time, the corresponding structural relationship between the lower end hole 122 and the positioning post 21 of the nozzle base 20 can make the overall assembly structure without relative horizontal displacement. The angle θ between the inclined surface of the tapered tunnel 120 and the vertical line is set in consideration of the maximum inclination of the fixed seat 10, the nozzle base 20, the nozzle 30 and the wafer 40, which may cause vertical offset.
於組裝第一實施例的組裝結構時,先將密封件28置入密封槽23,其次將磁鐵29置於吸嘴底座20的凹部24,再將吸嘴30黏固在吸嘴底座20的固定凹部26,最後,用手抓住吸嘴底座20兩側所設置的把手27,以將吸嘴底座20的定位柱21對準固定座10的定位部12插入,而藉磁鐵29的吸引力,將吸嘴底座20連同黏固的吸嘴30吸附於固定座10下方。反之,於拆卸時,僅用手抓住吸嘴底座20的把手27而向下拔出,即可將吸嘴底座20及吸嘴30一併卸下。When assembling the assembly structure of the first embodiment, the sealing member 28 is first placed in the sealing groove 23, the magnet 29 is placed in the recess 24 of the nozzle base 20, and then the nozzle 30 is fixed to the nozzle base 20 for fixing. The recess 26, finally, hold the handles 27 provided on both sides of the nozzle base 20 by hand to insert the positioning post 21 of the nozzle base 20 into the positioning portion 12 of the fixing base 10, and by the attraction of the magnet 29, The suction nozzle base 20 and the fixed suction nozzle 30 are sucked under the fixing base 10. On the contrary, when disassembling, only holding the handle 27 of the nozzle base 20 by hand and pulling it down, the nozzle base 20 and the nozzle 30 can be removed together.
利用吸嘴底座20的把手27,可讓操作人員在不碰觸到吸嘴30下端面33的情況下,而將吸嘴30直接安裝到固定座10上或是由固定座10取下,不會汙染吸嘴30的下端面33,也不需要拆下設備上的固定座10就可以快速、方便將吸嘴30安裝到固定座10上。The handle 27 of the nozzle base 20 allows the operator to directly install or remove the nozzle 30 to or from the fixed base 10 without touching the lower end surface 33 of the nozzle 30. It will contaminate the lower end surface 33 of the suction nozzle 30, and it is not necessary to remove the fixing base 10 on the device to quickly and conveniently install the suction nozzle 30 on the fixing base 10.
請參閱第7至12圖,其係顯示本發明第二實施例相關圖面,該實施例之結構與第一實施例大部份相同並具有相同功能,為簡化起見,故標以相同符號並省略相關說明。第二實施例的固定座10A、吸嘴30A僅在尺寸大於第一實施例,兩者功能相同。Please refer to FIGS. 7 to 12, which are drawings related to the second embodiment of the present invention. The structure of this embodiment is substantially the same as that of the first embodiment and has the same functions. For simplicity, the same symbols are used. The relevant description is omitted. The fixed base 10A and the suction nozzle 30A of the second embodiment are only larger in size than the first embodiment, and both have the same function.
第二實施例的吸嘴底座20A具有一呈橢圓形的真空孔22A,真空孔22A與真空通道111相通。吸嘴底座20A在真空孔22A以外的上端面設有至少一凹部24A,以分別設置有一磁鐵29A,且設有一圍繞在凹部24A外側呈長方形的密封槽23A,密封槽23A對應設置有一同樣呈長方形的密封件28A。The nozzle base 20A of the second embodiment has an oval-shaped vacuum hole 22A, and the vacuum hole 22A communicates with the vacuum channel 111. The nozzle base 20A is provided with at least one recessed portion 24A on the upper end surface other than the vacuum hole 22A, respectively provided with a magnet 29A, and a sealing groove 23A having a rectangular shape surrounding the recessed portion 24A. The sealing groove 23A is correspondingly provided with a similarly rectangular shape.的 封 件 28A。 The seal 28A.
本實施例的凹部24A其數目,只要配合設置的磁鐵29A所提供的磁性足以讓吸嘴底座20A吸附於固定座10A而組合連接,不限於磁鐵的數量或形狀。依實際需要,密封件28A可選擇性圍繞在所有凹部24A外側或是各別圍繞。The number of the recessed portions 24A in this embodiment is not limited to the number or shape of the magnets as long as the provided magnets 29A are provided with sufficient magnetism to allow the nozzle base 20A to be adsorbed and fixed to the fixed seat 10A. According to actual needs, the sealing members 28A may be selectively surrounded on the outside of all the recesses 24A or individually.
請參閱第13至18圖,其係顯示本發明第三實施例相關圖面,該實施例之結構與第一、二實施例大部份相同並具有相同功能,為簡化起見,故標以相同符號並省略相關說明。第三實施例的固定座10B、吸嘴30B僅在尺寸大於第二實施例,兩者功能相同。Please refer to FIGS. 13 to 18, which are diagrams showing the third embodiment of the present invention. The structure of this embodiment is substantially the same as that of the first and second embodiments and has the same functions. Identical symbols and related descriptions are omitted. The fixed base 10B and the suction nozzle 30B of the third embodiment are only larger in size than the second embodiment, and both have the same function.
第三實施例的吸嘴底座20B具有一呈橢圓形的真空孔22B,真空孔22B與真空通道111相通。吸嘴底座20B在真空孔22B以外的上端面設有至少一凹部24B,以分別設置有一磁鐵29B,且設有一圍繞在凹部24B外側呈長方形的密封槽23B,密封槽23B對應設置有一同樣呈長方形的密封件28B。The nozzle base 20B of the third embodiment has an oval-shaped vacuum hole 22B, and the vacuum hole 22B communicates with the vacuum channel 111. The nozzle base 20B is provided with at least one recessed portion 24B on the upper end surface other than the vacuum hole 22B so as to be provided with a magnet 29B and a sealing groove 23B having a rectangular shape surrounding the recessed portion 24B. The sealing groove 23B is correspondingly provided with an equally rectangular shape. Of seal 28B.
本實施例的凹部24B其數目,只要配合設置的磁鐵29B所提供的磁性足以讓吸嘴底座20B吸附於固定座10B而組合連接,不限於磁鐵的數量或形狀。依實際需要,密封件28B可選擇性圍繞在所有凹部24B外側或是各別圍繞。The number of the recessed portions 24B in this embodiment is not limited to the number or shape of the magnets, as long as the provided magnet 29B is sufficiently magnetic to allow the nozzle base 20B to be attracted to the fixed base 10B and combined. According to actual needs, the sealing members 28B can be selectively surrounded on the outside of all the recesses 24B or individually.
本發明中的組裝結構,依第一至三實施例中所示可配合為三種不同規格使用,亦可依晶片大小更換適合的吸嘴底座使用,且吸嘴亦可依需求更換不同款式、形狀而相同尺寸,而獲得相同之效果者。The assembly structure of the present invention can be used in three different specifications as shown in the first to third embodiments, and can also be replaced with a suitable nozzle base according to the size of the chip, and the nozzle can also be replaced with different styles and shapes as required. And the same size, and get the same effect.
以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內。The above description is only the preferred embodiments of the present invention, and therefore does not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the same way. Within the patent scope of the present invention.
10、10A、10B‧‧‧固定座 10, 10A, 10B‧‧‧Fixed
11‧‧‧接合部 11‧‧‧ Junction
111‧‧‧真空通道 111‧‧‧Vacuum channel
12‧‧‧定位部 12‧‧‧ Positioning Department
120‧‧‧錐狀孔道 120‧‧‧Tapered channel
121‧‧‧上端孔 121‧‧‧ top hole
122‧‧‧下端孔 122‧‧‧ bottom hole
13‧‧‧調整空間 13‧‧‧ adjust space
20、20A、20B‧‧‧吸嘴底座 20, 20A, 20B‧‧‧ Nozzle base
21‧‧‧定位柱 21‧‧‧Positioning post
22、22A、22B‧‧‧真空孔 22, 22A, 22B‧‧‧Vacuum hole
23、23A、23B‧‧‧密封槽 23, 23A, 23B‧‧‧Sealed grooves
24、24A、24B‧‧‧凹部 24, 24A, 24B ‧‧‧ Recess
25‧‧‧真空空間 25‧‧‧Vacuum space
26‧‧‧固定凹部 26‧‧‧Fixed recess
27‧‧‧把手 27‧‧‧handle
28、28A、28B‧‧‧密封件 28, 28A, 28B‧‧‧Seals
29、29A、29B‧‧‧磁鐵 29, 29A, 29B‧‧‧ Magnets
30、30A、30B‧‧‧吸嘴 30, 30A, 30B ‧‧‧ Nozzles
31‧‧‧通道 31‧‧‧channel
32‧‧‧流通孔 32‧‧‧flow hole
33‧‧‧下端面 33‧‧‧ bottom face
40‧‧‧晶片 40‧‧‧Chip
第1圖為本發明第一實施例之立體圖; 第2圖為本發明第一實施例之底視立體圖; 第3圖為本發明第一實施之分解圖; 第4圖為本發明第一實施例之剖面圖; 第5圖為本發明第一實施例之吸取晶片示意圖; 第5A圖為第5圖之局部放大圖; 第6圖為本發明第一實施例之垂直調整示意圖; 第6A圖為第6圖之局部放大圖; 第7圖為本發明第二實施例之立體圖 第8圖為本發明第二實施例之底視立體圖; 第9圖為本發明第二實施例之分解圖; 第10圖為本發明第二實施例之剖面圖; 第11圖為本發明第二實施例吸取晶片示意圖; 第12圖為本發明第二實施例之垂直調整示意圖; 第13圖為本發明第三實施例之立體圖 第14圖為本發明第三實施例之底視立體圖; 第15圖為本發明第三實施例之分解圖; 第16圖為本發明第三實施例之剖面圖; 第17圖為本發明第三實施例吸取晶片示意圖; 第18圖為本發明第三實施例之垂直調整示意圖。Fig. 1 is a perspective view of the first embodiment of the present invention; Fig. 2 is a bottom perspective view of the first embodiment of the present invention; Fig. 3 is an exploded view of the first embodiment of the present invention; A cross-sectional view of the example; FIG. 5 is a schematic diagram of the suction wafer of the first embodiment of the present invention; FIG. 5A is a partially enlarged view of FIG. 5; FIG. 6 is a schematic diagram of the vertical adjustment of the first embodiment of the present invention; FIG. 6 is a partially enlarged view of FIG. 6; FIG. 7 is a perspective view of the second embodiment of the present invention; FIG. 8 is a bottom perspective view of the second embodiment of the present invention; and FIG. 9 is an exploded view of the second embodiment of the present invention; FIG. 10 is a cross-sectional view of a second embodiment of the present invention; FIG. 11 is a schematic diagram of a wafer picking up according to the second embodiment of the present invention; FIG. 12 is a schematic diagram of vertical adjustment of the second embodiment of the present invention; Three-dimensional view of the third embodiment. FIG. 14 is a bottom perspective view of the third embodiment of the present invention. FIG. 15 is an exploded view of the third embodiment of the present invention. FIG. 16 is a cross-sectional view of the third embodiment of the present invention. FIG. Is a schematic diagram of sucking a wafer according to a third embodiment of the present invention; FIG. 18 is a schematic diagram of vertical adjustment of the third embodiment of the present invention.
Claims (18)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105143608A TWI605995B (en) | 2016-12-28 | 2016-12-28 | Connection nozzle assembly structure (a) |
| CN201711167153.5A CN108257904B (en) | 2016-12-28 | 2017-11-21 | Assembling structure for connecting suction nozzle |
| JP2017245536A JP7055339B2 (en) | 2016-12-28 | 2017-12-21 | Assembly structure to connect the suction nozzle |
| KR1020170181918A KR102440282B1 (en) | 2016-12-28 | 2017-12-28 | Assembly structure to connect suction nozzles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105143608A TWI605995B (en) | 2016-12-28 | 2016-12-28 | Connection nozzle assembly structure (a) |
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| Publication Number | Publication Date |
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| TWI605995B TWI605995B (en) | 2017-11-21 |
| TW201823125A true TW201823125A (en) | 2018-07-01 |
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| TW105143608A TWI605995B (en) | 2016-12-28 | 2016-12-28 | Connection nozzle assembly structure (a) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100392229B1 (en) * | 2001-01-09 | 2003-07-22 | 미래산업 주식회사 | Index head of handler for testing semiconductor |
| JP4399863B2 (en) * | 2005-02-21 | 2010-01-20 | セイコーエプソン株式会社 | Holding device |
| CN100535667C (en) * | 2006-09-26 | 2009-09-02 | 富士康(昆山)电脑接插件有限公司 | Tool used for loading and unloading wafer module group |
| TWI391307B (en) * | 2010-01-15 | 2013-04-01 | Advanced Semiconductor Eng | Suction head and transporting machine applying the same |
| TWM461963U (en) * | 2013-05-31 | 2013-09-11 | Flexium Interconnect Inc | Quick disassembling nozzle set |
| TWM543858U (en) * | 2016-12-28 | 2017-06-21 | Yan-Quan Lin | Assembly structure of suction nozzle connection |
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