TW201823049A - Thermal printer head module and method for manufacturing the same - Google Patents

Abstract

A method for manufacturing a thermal printer head module includes steps as follows. Two opposite sides of a silicon pillar are longitudinally cut respectively for obtaining a crystalline silicon substrate. A glaze layer, a heating resistor layer, an electrode pattern layer and an insulating protective layer are sequentially formed on the crystalline silicon substrate. A control circuit module is electrically connected to the electrode pattern layer.

Description

 Thermal head module and manufacturing method thereof  

The invention relates to a thermal head module and a manufacturing method thereof, in particular to a thermal head module of a printer and a manufacturing method thereof.

According to the principle of thermal transfer printing, the printer mainly uses a thermal print head (TPH) module to heat the ribbon, vaporize the dye on the ribbon, and transfer it to a carrier (such as paper or On the plastic), depending on the length of time of heating or the temperature of the heating, a continuous color gradation is formed. In general, the thermal head module includes a ceramic substrate, a printed wiring board, an encapsulant layer, an integrated circuit, and a gold wire (gold wire use).

However, the size of the currently available hot stamping head modules is only about 2-8 inches (hereinafter referred to as small size), and it is impossible to continuously provide a larger size thermal head module, or it is impossible to produce a large size at one time. Printed products.

An object of the present invention is to provide a thermal head module and a manufacturing method thereof for solving the difficulties mentioned in the prior art, that is, to provide a thermal head module having a high-sized and highly flat substrate. In order to solve the above-mentioned thermal energy transfer principle, the printer cannot be enlarged.

According to an embodiment of the present invention, a method of manufacturing such a thermal head module includes the following steps. A pair of opposite sides of the crystal column are longitudinally cut to obtain a twinned substrate. A glaze layer, a heat generating resistor layer, an electrode pattern layer and an insulating protective layer are sequentially formed on the twin crystal substrate. Electrically connecting a control circuit module to the electrode pattern layer.

In one or more embodiments of the invention, the twin column is a single crystal twin column or a polycrystalline germanium column.

In one or more embodiments of the invention, the length of the twinned substrate is 12 to 64 Å or more.

In one or more embodiments of the present invention, the step of longitudinally cutting the opposite sides of the twin crystal column to obtain the twinned substrate further includes the following steps. Along one of the axial directions of the twin column, from one end face of the twin column to the other end face, the opposite sides of the twin column are straightly cut to obtain an intermediate layer between the opposite sides of the twin column. The intermediate laminate is ground to form a twinned substrate comprising two relatively flat surfaces.

In one or more embodiments of the present invention, the steps of sequentially forming the glaze layer, the heat generating resistive layer, the electrode pattern layer, and the insulating protective layer on the twinned substrate further include the following steps. A main glaze layer is formed on one side of the twin crystal substrate. A plurality of spaced-apart enamel ridges are formed on the side of the main glaze layer facing away from the twinned substrate, wherein each enamel ridge is continuous.

In one or more embodiments of the present invention, the steps of sequentially forming the glaze layer, the heat generating resistive layer, the electrode pattern layer, and the insulating protective layer on the twinned substrate further include the following steps. A conductive metal layer is formed on one side of the heat generating resistor layer opposite to the glaze layer. The etched conductive metal layer overlaps the local positions of the enamel ridges respectively to expose the ridge shape of the enamel ridges covered by the heat-generating resist layer.

In one or more embodiments of the present invention, the step of electrically connecting the control circuit module to the electrode pattern layer further includes detailing as follows. The insulating protective layer is etched to form a notch, and the notch exposes a portion of the electrode pattern layer. The control circuit module is electrically connected to the electrode pattern layer via the notch.

According to another embodiment of the present invention, the thermal head module comprises a twinned substrate, a glazed layer, a heat generating resistor layer, an electrode pattern layer, an insulating protective layer and a control circuit module. The twinned substrate has two relatively flat surfaces. The glaze layer comprises a main glaze layer and a plurality of enamel ridges. The main glaze layer covers one of the flat surfaces of the twinned substrate. These enamel ridges are spaced side by side on one side of the main glaze layer relative to the twinned substrate. A heating resistor layer covers the main glaze layer and these enamel ridges. The electrode pattern layer is located on one side of the heat generating resistor layer opposite to the glaze layer. The insulating protective layer is located on the electrode pattern layer. The control circuit module electrically connects the electrode pattern layers.

In one or more embodiments of the invention, the twinned substrate is integrally formed. The maximum length of the twinned substrate is 12吋~64吋.

In one or more embodiments of the invention, the twinned substrate comprises a single twin or multiple twins.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

6-6‧‧‧ segments

10‧‧‧Manufacturing methods

101~106‧‧‧Steps

1011~1013‧‧‧Detailed steps

200‧‧‧矽晶柱

201‧‧‧ first end face

202‧‧‧second end face

203‧‧‧circular surface

210‧‧‧Axis direction

220‧‧‧Small arch cylinder

221‧‧‧Small bow

222‧‧‧ string

223‧‧‧Inferior arc

230‧‧‧ Large arch cylinder

231‧‧‧Big arched face

232‧‧‧string

233‧‧‧Excellent arc

240‧‧‧Intermediate laminate

241‧‧‧The opposite side of the middle layer

250‧‧‧ crystal column cutting machine

260‧‧‧ Thermal head structure

300‧‧‧hot head module

310‧‧‧Crystal substrate

311, 312‧‧ ‧ flat surface

320‧‧‧glaze

321‧‧‧Main glaze

322‧‧‧Enamel ribs

330‧‧‧heating resistance layer

331‧‧‧Uplift appearance

340‧‧‧electrode pattern layer

341‧‧‧ Conductive metal layer

342‧‧‧ etching opening

350‧‧‧Insulation protective layer

351‧‧‧ gap

360‧‧‧Control circuit module

361‧‧‧film flip chip package structure

362‧‧‧Working chip

363‧‧‧ Connection unit

364‧‧‧ solder

365‧‧‧ anisotropic conductive adhesive

370‧‧‧ Heat dissipation structure

G‧‧‧ spacing

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The description of the drawings is as follows: FIG. 1 illustrates a method of manufacturing a thermal head module according to an embodiment of the present invention. FIG. 2A is a detailed flow chart of step 101 of FIG. 1; FIG. 2B to FIG. 2C are diagrams showing operation of FIG. 2A; and FIG. 3A to FIG. 3I are diagrams showing operation of FIG. 4 is a top view of a thermal head according to an embodiment of the present invention; FIG. 5 is a schematic view of a thermal head module according to an embodiment of the present invention; and FIG. 6 is a view along line 5 Sectional view of Section 6-6.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Conventional techniques mostly use a ceramic substrate as a substrate for a thermal head. However, in the process of heating a large-sized ceramic substrate, the inventors have found that a ceramic substrate often has a poor appearance such as warpage due to an excessive size, so that the ceramic substrate cannot be provided. It is used to configure the flat surface of the heating point, so that the yield of the thermal head module cannot be improved. In view of the above, the present invention replaces a conventional ceramic substrate by a crystal plate having a straight characteristic and a high flatness to form a thermal head module having a high-sized and highly flat substrate, so that it can be disposable. Produce large-size printed products. It should be understood that the thermal head module of the present invention can be applied to any printer capable of thermal transfer printing, such as a thermal sublimation printer, a thermal transfer printer, a label printer or a poster printer, and the like. field.

FIG. 1 is a flow chart showing a method of manufacturing a thermal head module according to an embodiment of the present invention. As shown in FIG. 1, in the present embodiment, the manufacturing method 10 of the thermal head module includes steps 101 to 106 as follows. In step 101, a twinned substrate is provided. In step 102, a glazed layer is formed on the twinned substrate. In step 103, a heat generating resistor layer is formed on the glaze layer. In step 104, an electrode pattern layer is formed on the heat generating resistor layer. In step 105, an insulating protective layer is formed on the electrode pattern layer. In step 106, a control circuit module is electrically connected to the electrode pattern layer.

FIG. 2A is a detailed flow chart showing the step 101 of FIG. 1. 2B to 2C are schematic diagrams showing the operation of FIG. 2A. In the present embodiment, as shown in FIG. 2A, the detail steps 1011 to 1013 are further included in the above-described step 101 as follows. In the detail step 1011, as shown in FIG. 2B, a twin column 200 is provided. For example, a crystal column 200 is formed by a crystal growth process. The twin column 200 is approximately a cylinder and includes a first end surface 201, a second end surface 202, and a circumferential surface 203. The first end surface 201 is opposite to the second end surface 202, and the circumferential surface 203 is interposed between the first end surface 201 and the second end surface 202, and surrounds the first end surface 201 and the second end surface 202. In addition, the twin column 200 has an axial direction 210, that is, the twin column 200 extends in the axial direction 210.

Next, in the detail step 1012, as shown in FIGS. 2B and 2C, the opposite sides of the twin column 200 are longitudinally cut. For example, the twin column 200 is sliced by a crystal column cutter 250, specifically, by the crystal column cutter 250 along the axial direction 210 of the twin column 200, from the first column 200 An end surface 201 straightly cuts the twin column 200 twice through the second end surface 202, so that a small arcuate cylinder 220 and a large arcuate cylinder 230 are respectively removed from the twin column 200, thereby obtaining between the two. An intermediate laminate 240. It should be understood that the opposite end faces of the two small arcuate cylinders 220 are the small arcuate faces 221 including the chords 222 and the inferior arcs 223, and the opposite end faces of the two large arcuate cylinders 230 include the chords 232 and the superior arcs 233. Large bow surface 231.

Finally, in the detail step 1013, next, after the intermediate layer plate 240 is obtained, the two opposite main faces 241 of the intermediate layer plate 240 are ground to form the twinned substrate. In this way, compared with the formation of the ceramic substrate, it is necessary to pass the heating process, and the acquisition of the twinned substrate does not need to be performed by the heating process, so that the manufacturing process can be simplified and the manufacturing cost can be reduced.

In addition, in order to improve the production efficiency, in the other embodiments of the detailed step 1012, the crystal column cutter 250 may pass through the axis direction 210 of the twin column 200, and pass through the second end 201 of the twin column 200. The end face 202 straightly cuts the twin column 200 times (not shown) so that two small arcuate cylinders of the same size are removed from the twin column 200 (refer to the small arcuate cylinder 220 of FIG. 2C), Further, a plurality of plate layers arranged in parallel with each other are obtained between the two (refer to the intermediate layer plate 240 of FIG. 2C) for subsequently grinding the opposite main faces of each of the plate layers. Any of the layers after the completion of the grinding can be used as the above-mentioned twinned substrate.

3A to 3H are schematic views showing the operation of Fig. 1. 4 is a top view of a thermal print head in accordance with an embodiment of the present invention. As shown in FIG. 3A, in one embodiment, the removed twin substrate 310 has a rectangular shape, and the twin substrate 310 has two relatively flat surfaces 311, 312, and each flat surface 311 of the twin substrate 310. The length of 312 is, for example, 36 吋; or, in one embodiment, the length of each flat surface 311, 312 of the twinned substrate 310 is, for example, at least in the range of 12 吋 to 64 。.

As shown in FIG. 3A, the above step 102 more specifically includes the detailed steps as follows. A main glaze layer 321 is formed over the entire surface 311 of the twin substrate 310. Specifically, an enamel slurry layer is uniformly coated on the flat surface 311 of the twinned substrate 310 by a screen printing process, and the enamel slurry is sintered and solidified at a high temperature (1000 to 1200 ° C), so that the main glaze layer 321 is used. In order to save heat, it will not be easily lost. Next, as shown in FIGS. 4 and 3B, after the main glaze layer 321 is formed, a plurality of enamel ridges 322 are formed at intervals on the surface of the main glaze layer 321 opposite to the twinned substrate 310. Specifically, a plurality of enamel ridges 322 are uniformly coated by the screen printing process on the side of the main glaze layer 321 facing away from the twinned substrate 310. The enamel ridges 322 are spaced apart from each other on the main glaze layer 321 , and each enamel ridge 322 is linear, and each enamel ridge 322 is continuously formed on the main glaze layer 321 and is substantially as long as, for example, 10 吋. ~64吋.

As shown in Fig. 3C, the above step 103 more specifically includes the detailed steps as follows. A heat generating resistive layer 330 is formed on the main glaze layer 321 and the enamel ridges 322 so that the heat generating resistive layer 330 completely covers the main glaze layer 321 and the enamel ridges 322, and correspondingly forms the matching enamel ridges 322. Uplifted shape 331.

As shown in FIG. 3D, the above step 104 more specifically includes the detailed steps as follows. Forming a conductive metal layer 341 (for example, aluminum, copper, silver or gold) on the surface of the heat-generating resistor layer 330 opposite to the glaze layer 320; then, after forming the conductive metal layer 341, etching the conductive metal layer as shown in FIG. 3E 341 respectively overlap the local positions of the enamel ridges 322, so that the conductive metal layer 341 forms an etch opening 342 corresponding to the local positions of the enamel ridges 322, respectively, so that the conductive metal layer 341 exposes the heat generating resist layer 330 from the etch opening 342 formed therein. The above raised shape 331. Specifically, a photoresist is coated on one surface of the heat-generating resistor layer 330 with respect to the glaze layer 320, and patterning of the photoresist is performed by a PEP (photo engraving process).

As shown in FIG. 3F, the above step 105 specifically includes the detailed steps as follows. The insulating protective layer 350 is entirely covered on the electrode pattern layer 340, wherein one portion of the insulating protective layer 350 partially covers the electrode pattern layer 340, and another portion of the insulating protective layer 350 enters the etching opening 342 to cover the above-mentioned raised shape 331 of the heating resistor layer 330. The heating resistor layer 330 is closely followed. Next, after the insulating protective layer 350 is formed, as shown in FIG. 3G, the insulating protective layer 350 is partially etched to form a notch 351. This notch 351 exposes a portion of the electrode pattern layer 340. As such, a thermal print head structure 260 is formed.

As shown in FIG. 3H, the above step 106 specifically includes the detailed steps as follows. The control circuit module 360 is electrically connected to the electrode pattern layer 340 of the thermal head structure 260 via the notch 351. The control circuit module 360 is, for example, a combination of a chip on film (COF), a work chip 362, and a circuit board (a printed circuit board or a flexible circuit board).

In the present embodiment, in order to allow the thermal head module 300 to dissipate heat efficiently when not in use, after the step of electrically connecting the control circuit module 360, as shown in FIG. 3I, the manufacturing of the present embodiment The method further includes connecting a heat dissipation structure 370 to the other planar surface 312 of the twinned substrate 310, that is, the twinned substrate 310 faces away from one side of the glazed layer 320. It should be noted that, for convenience of naming, the thermal head module 300, which has not been connected to the control circuit module 360 and the heat dissipation structure 370, is temporarily referred to as a thermal head structure 260.

As shown in FIG. 3I , the thermal head module 300 includes a twin substrate 310 , a glaze layer 320 , a heat generating resistor layer 330 , an electrode pattern layer 340 , an insulating protective layer 350 , and a control circuit module 360 . With a heat dissipation structure 370. The twin substrate 310 has two relatively flat surfaces 311, 312. The glaze layer 320 includes a main glaze layer 321 and a plurality of enamel ridges 322. The main glaze layer 321 covers one of the flat surfaces 311 of the twin substrate 310. These enamel ridges 322 are spaced side by side with respect to one side of the main glaze layer 321 with respect to the twinned substrate 310. The heating resistor layer 330 covers the main glaze layer 321 and the enamel ridges 322. The electrode pattern layer 340 is located on one side of the heat-generating resistance layer 330 opposite to the glaze layer 320. The insulating protective layer 350 is located on the electrode pattern layer 340. The control circuit module 360 electrically connects the electrode pattern layer 340. The heat dissipation structure 370 is located on another flat surface 312 of the twin substrate 310. In the present embodiment, the twinned substrate 310 is integrally formed. For example, the maximum length of the twinned substrate 310 is 12 吋 to 64 。. Further, the twinned substrate 310 comprises a single twin or multiple twins. The spacing G (Fig. 4) between any two enamel ribs 322 is 0.5 to 2 cm. However, the invention is not limited thereto.

FIG. 5 is a schematic view of a thermal head module 300 in accordance with an embodiment of the present invention. Figure 6 is a cross-sectional view along line 6-6 of Figure 5. As shown in FIGS. 5 and 6, the control circuit module 360 includes a thin film flip chip package structure 361, a plurality of work wafers 362, and a connection unit 363. The working wafer 362 is disposed on the thin film flip chip package structure 361 and electrically connected to the thin film flip chip package structure 361, for example, electrically connected to the thin film flip chip package structure 361 through the solder 364. The connecting unit 363 is used to connect the internal circuit of the printer. The film flip-chip package structure 361 is electrically connected to the thermal head module 300 and the connection unit 363, for example, electrically connected to the electrode pattern layer 340 of the thermal head module 300 via an anisotropic conductive film 365 (ACF). Connection unit 363. Thus, the thermal head module 300 passes through the internal circuit of the control circuit module 360 printer.

It should be understood that, in the present embodiment, for example, the type of the twin column 200 is a single crystal twin column 200. The reason why the single crystal twin column 200 is selected is that the characteristics of the single crystal twin column 200 can be as long as 90 cm or more, and can be co-fired with the glaze layer material at a high temperature without phase separation. In addition, the warpage and surface flatness of the single-crystal substrate 310 are far superior to those of the ceramic substrate compared to the ceramic substrate. However, the present invention is not limited thereto. In other embodiments, the twin column 200 may also be a multi-twist column.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

 A manufacturing method of a thermal head module comprises: longitudinally cutting two opposite sides of a crystal column to obtain a twinned substrate; sequentially forming a glazed layer, a heating resistor layer, an electrode pattern layer, and an insulation protection Laminating on the twin crystal substrate; and electrically connecting a control circuit module to the electrode pattern layer.    The method of manufacturing the thermal head module of claim 1, wherein the twin column is a single crystal twin column or a multi twin column.    The method of manufacturing the thermal head module of claim 1, wherein the twin substrate has a length of 12 to 64 。.    The method of manufacturing the thermal head module of claim 1, wherein longitudinally cutting the opposite sides of the twin column to obtain the twinned substrate comprises: along an axial direction of the twin column, from the axis One end face of the crystal column to the other end face, straightly cutting the opposite sides of the twin column to obtain an intermediate layer between the opposite sides of the twin column; and grinding the intermediate layer to The twinned substrate comprising two relatively flat surfaces is formed.    The method of manufacturing the thermal head module according to claim 1, wherein the glaze layer, the heat generating resistor layer, the electrode pattern layer, and the insulating protective layer are sequentially formed on the twin crystal substrate, including: comprehensively Forming a main glaze layer on one side of the twin crystal substrate; and forming a plurality of spaced-apart enamel ridges on the side of the main glaze layer facing the twinned substrate, wherein each of the enamel ridges is continuous.    The method of manufacturing the thermal head module according to claim 5, wherein the glaze layer, the heat generating resistor layer, the electrode pattern layer, and the insulating protective layer are sequentially formed on the twin crystal substrate, comprising: forming a a conductive metal layer on a surface of the heat-generating resistor layer opposite to the glaze layer; and etching the conductive metal layer to overlap respective local positions of the enamel ridges to respectively expose the heat-generating resistor layer to cover the enamel ridges Uplifted appearance.    The method of manufacturing the thermal head module of claim 1, wherein electrically connecting the control circuit module to the electrode pattern layer comprises: etching the insulating protective layer to form a notch, the notch exposing a portion of the electrode pattern a layer; and electrically connecting the control circuit module to the electrode pattern layer via the gap.    A thermal print head module comprising: a twin crystal substrate having two relatively flat surfaces; a glazed layer comprising a main glaze layer and a plurality of enamel ridges, the main glaze layer covering one of the flat surfaces The enamel ridges are spaced apart from each other on a side of the main glaze layer opposite to the twin crystal substrate; a heating resistor layer covering the main glaze layer and the enamel ridges; and an electrode pattern layer located on the heat generating resistor layer opposite to the enamel layer One surface of the glaze layer; an insulating protective layer located on the electrode pattern layer; and a control circuit module electrically connecting the electrode pattern layer.    The thermal head module of claim 8, wherein the twin crystal substrate is integrally formed, wherein the twin crystal substrate has a maximum length of 12 吋 64 64 。.    The thermal head module of claim 8, wherein the twinned substrate comprises a single twin or multiple twins.