TW201828224A - Method for manufacturing glass substrate - Google Patents
Method for manufacturing glass substrate Download PDFInfo
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- TW201828224A TW201828224A TW106142661A TW106142661A TW201828224A TW 201828224 A TW201828224 A TW 201828224A TW 106142661 A TW106142661 A TW 106142661A TW 106142661 A TW106142661 A TW 106142661A TW 201828224 A TW201828224 A TW 201828224A
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- glass plate
- glass substrate
- mother glass
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- 239000011521 glass Substances 0.000 title claims abstract description 183
- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000007547 defect Effects 0.000 claims abstract description 169
- 230000002950 deficient Effects 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 abstract description 11
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000006124 Pilkington process Methods 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Mathematical Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
[0001] 本發明有關電子機器中使用之玻璃基板的製造方法。[0001] The present invention relates to a method for manufacturing a glass substrate used in an electronic device.
[0002] 眾所周知,液晶顯示器、電漿顯示器、及有機EL(Electro Luminescence;電激發光)顯示器等平板顯示器(FPD)、有機EL照明、觸控面板、乃至於太陽能電池的面板等電子機器中,廣泛地使用玻璃基板。 [0003] 此種玻璃基板,是藉由從稱為母玻璃的玻璃板(以下稱母玻璃板)切割出而被製造,係為通例(例如參照專利文獻1)。 先前技術文獻 專利文獻 [0004] 專利文獻1:國際公開第03/087923號[0002] As is known, in electronic devices such as flat panel displays (FPDs) such as liquid crystal displays, plasma displays, and organic EL (Electro Luminescence) displays, organic EL lighting, touch panels, and even solar cell panels, Glass substrates are widely used. [0003] Such a glass substrate is manufactured by cutting out a glass plate called a mother glass (hereinafter referred to as a mother glass plate), and is a general example (for example, refer to Patent Document 1). Prior Art Literature Patent Literature [0004] Patent Literature 1: International Publication No. 03/087923
發明所欲解決之問題 [0005] 不過,流通於玻璃基板的製造工程之母玻璃板或玻璃基板中,可能存在氣泡或異物等缺陷。而為了不讓這樣的缺陷肇生電子機器的不良,玻璃基板的製造工程中,會進行母玻璃板或玻璃基板的檢查。然而,即使是通過這樣的檢查而完成了的玻璃基板,在電子機器的製造工程中仍有肇生缺陷所引起的問題之可能性。 [0006] 本發明有鑑於上述情事,其技術性課題在於製造一種在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。 解決問題之技術手段 [0007] 為解決前述問題而創作之本發明之玻璃基板的製造方法,其特徵為,包含從母玻璃板製造玻璃基板之工程,前述製造玻璃基板之工程中,從前述母玻璃板檢測出由在規定的判定基準下被訂為合格之合格缺陷及在前述判定基準下被訂為不合格之不合格缺陷所組成的總合缺陷之後,以複數片前述母玻璃板來形成1個批次,基於對前述批次算出之前述母玻璃板每1片的前述總合缺陷或前述合格缺陷的平均個數,來判定前述批次的合格與否。此處,所謂批次,係複數個母玻璃板的集合體,為進行搬運、製造處理等之單位(以下同)。 [0008] 合格缺陷,為電子機器中肇生致命性不良之可能性低的缺陷,不合格缺陷,為電子機器中肇生致命性不良之可能性高的缺陷。不合格缺陷,相當於習知的缺陷用檢查中被訂為不合格之缺陷,合格缺陷,相當於習知的缺陷用檢查中被訂為合格之缺陷。亦即,通過了習知的缺陷用檢查之玻璃基板中,包含不合格缺陷之玻璃基板會被除去,因此電子機器的製造工程中有肇生問題之可能性的缺陷,多為合格缺陷之情形。按照上述構成,基於總合缺陷(合格缺陷及不合格缺陷)的母玻璃板每1片的平均個數,來判定批次的合格與否時,雖為合格缺陷但每一批次的缺陷個數會受到限制,因此不單能夠抑制電子機器的製造工程中發生不合格缺陷所引起之問題,也能抑制發生合格缺陷所引起之問題。此外,上述構成中,基於合格缺陷的基板每1片的平均個數,來判定批次的合格與否時,說法亦通用。也就是說,按照本發明之玻璃基板的製造方法,能夠製造在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。 [0009] 上述構成中,較佳是,將沒有前述不合格缺陷的前述母玻璃板判定為合格,並且將有前述不合格缺陷的前述母玻璃板判定為不合格,僅以被判定為合格的前述母玻璃板來形成前述批次,當判定前述批次的合格與否時,使用對前述批次算出之前述母玻璃板每1片的前述合格缺陷的平均個數。 [0010] 若為此構成,則批次的母玻璃板中不存在不合格缺陷,故針對批次的母玻璃板便無需考量不合格缺陷導致發生電子機器的製造工程所造成之致命性缺陷。 [0011] 上述構成中,判定前述批次的合格與否時,從由可從前述母玻璃板採取的前述玻璃板的品種所組成之群組中,基於前述母玻璃板每1片的前述合格缺陷的平均個數,來選擇滿足前述品種的判定基準之前述品種亦可。此處,所謂品種,係依尺寸或用途等而決定之玻璃基板的種類(以下同)。 [0012] 對於該品種之判定基準係依每一品種而設定,批次,可能有在某品種下成為不合格但在其他品種下成為合格之情形。是故,若選擇品種,則可使批次的合格增加。如此一來,便可有效活用批次的母玻璃板。 [0013] 上述構成中,依據基於前述母玻璃板每1片的前述合格缺陷的平均個數而算出之前述玻璃基板每1片的合格缺陷的平均個數,來選擇前述品種亦可。 [0014] 若為此構成,則會使用基於母玻璃板每1片的合格缺陷的平均個數而算出之玻璃基板每1片的合格缺陷的平均個數,故可更適當地進行品種之選擇。 [0015] 上述構成中,前述群組,包含可從1片前述母玻璃板製造之最大尺寸的品種、及比前述最大尺寸還小之尺寸的品種亦可。 [0016] 當為比最大尺寸還小尺寸的品種(裁減尺寸(downsize)品種)的情形下,批次成為合格的可能性高,可使批次的合格增加。如此一來,便可更有效活用批次的母玻璃板。 [0017] 上述構成中,當前述母玻璃板中前述合格缺陷的分布有偏頗(bias)的情形下,選擇僅使用前述合格缺陷少的區域之品種亦可。 [0018] 若為此構成,則即使是基於母玻璃板每1片的合格缺陷的平均個數而被訂為不合格之批次,藉由選擇品種也可能成為合格。是故,可使批次的合格增加,可有效活用批次的母玻璃板。 [0019] 上述構成中,當前述母玻璃板的前述合格缺陷的個數增加了的情形下,將前述合格缺陷與前述不合格缺陷之判定基準趨嚴亦可。 [0020] 若為此構成,則能抑制批次的母玻璃板的合格缺陷的個數增加,如此一來,能夠抑制母玻璃板每1片的合格缺陷的平均個數增加。是故,能夠抑制基於母玻璃板每1片的合格缺陷的平均個數之批次的不合格增加。 發明之功效 [0021] 如以上般,按照本發明,能夠製造一種在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。Problems to be Solved by the Invention [0005] However, there may be defects such as bubbles or foreign matter in the mother glass plate or glass substrate that circulates through the manufacturing process of the glass substrate. In order to prevent such defects from causing defects in electronic equipment, a mother glass plate or a glass substrate is inspected during the manufacturing process of the glass substrate. However, even if the glass substrate is completed by such inspection, there is a possibility that problems caused by defects may occur in the manufacturing process of electronic equipment. [0006] In view of the foregoing, the present invention has a technical problem of manufacturing a glass substrate that does not cause problems as much as possible in a manufacturing process of an electronic device. Technical means to solve the problem [0007] The manufacturing method of the glass substrate of the present invention, which is created to solve the aforementioned problem, is characterized by including a process of manufacturing a glass substrate from a mother glass plate, and the aforementioned process of manufacturing a glass substrate from the aforementioned mother The glass plate is formed by a plurality of mother glass plates after detecting a total defect consisting of a qualified defect that is determined to be qualified under a predetermined judgment standard and an unqualified defect that is determined to be unqualified under the foregoing judgment standard. One batch determines the pass or fail of the batch based on the average number of the total defects or the qualified defects per one piece of the mother glass plate calculated for the batch. Here, the batch refers to an assembly of a plurality of mother glass plates, and is a unit for carrying out, manufacturing, and the like (hereinafter the same). [0008] A qualified defect is a defect with a low probability of causing fatal failure in an electronic device, and a defective defect is a defect with a high probability of causing fatal failure in an electronic device. An unqualified defect is equivalent to a defect that is set to be unqualified in a conventional defect inspection, and a qualified defect is equivalent to a defect that is set to pass in a conventional defect inspection. That is, among the glass substrates that have passed the conventional inspection for defects, the glass substrates containing unqualified defects will be removed. Therefore, defects that may cause problems in the manufacturing process of electronic equipment are mostly qualified defects. . According to the above configuration, based on the average number of each mother glass plate with total defects (qualified defects and unqualified defects), if the batch is qualified or not, it is a qualified defect but the number of defects in each batch is The number will be limited, so not only can the problems caused by defective defects occur in the manufacturing process of electronic equipment, but also the problems caused by qualified defects can be suppressed. In addition, in the above-mentioned configuration, when determining whether a lot is qualified based on the average number of qualified substrates per piece, the term is also commonly used. That is, according to the manufacturing method of the glass substrate of this invention, the glass substrate which does not cause a problem as much as possible in the manufacturing process of an electronic device can be manufactured. [0009] In the above configuration, it is preferable that the mother glass plate without the unqualified defect is determined to be qualified, and the mother glass plate with the unqualified defect is determined to be unqualified, and only those that are determined to be qualified are determined to be qualified. The mother glass sheet is used to form the batch, and when the batch is qualified, the average number of the qualified defects per piece of the mother glass sheet calculated for the batch is used. [0010] With this configuration, there are no unqualified defects in the batch of mother glass plates, so there is no need to consider the unqualified defects in batches of fatal defects caused by the manufacturing process of electronic equipment. [0011] In the above configuration, when the pass of the lot is determined, based on the pass of each of the mother glass plates from the group consisting of the types of the glass plates that can be taken from the mother glass plate The average number of defects may be used to select the aforementioned variety that satisfies the criteria for determining the aforementioned variety. Here, the type refers to the type of the glass substrate (the same applies hereinafter) which is determined depending on the size, use, and the like. 001 [0012] The determination criterion for this variety is set for each variety, and batches may become unqualified under one variety but pass under other varieties. Therefore, if the variety is selected, the batch qualification can be increased. In this way, the batch of mother glass plates can be effectively utilized. [0013] In the above configuration, the variety may be selected based on the average number of qualified defects per one piece of the glass substrate calculated based on the average number of qualified defects per one piece of the mother glass plate. [0014] With this configuration, the average number of qualified defects per one piece of the glass substrate calculated based on the average number of qualified defects per one piece of the mother glass plate is used, so that the variety can be selected more appropriately . [0015] In the above-mentioned configuration, the group may include a variety having a maximum size that can be manufactured from one piece of the mother glass plate and a variety having a size smaller than the maximum size. [0016] In the case of a product having a size smaller than the maximum size (downsize product), there is a high possibility that the lot will pass, and the pass of the lot can be increased. In this way, batch mother glass sheets can be used more effectively. [0017] In the above configuration, when the distribution of the qualified defects in the mother glass plate is biased, it is also possible to select a variety that uses only the area with few qualified defects. 00 [0018] With this configuration, even if the lot is determined as an unacceptable lot based on the average number of acceptable defects per mother glass plate, it may become acceptable by selecting a variety. Therefore, the batch qualification can be increased, and the mother glass plate of the batch can be effectively utilized. [0019] In the above configuration, when the number of the qualified defects of the mother glass plate is increased, the criteria for determining the qualified defects and the unqualified defects may be tightened. [0020] With this configuration, it is possible to suppress an increase in the number of qualified defects in a batch of mother glass plates. In this way, it is possible to suppress an increase in the average number of qualified defects per mother glass plate. Therefore, it is possible to suppress an increase in the number of defectives in a batch based on the average number of defective defects per mother glass plate. Effect of the Invention 002 [0021] As described above, according to the present invention, it is possible to manufacture a glass substrate that does not cause problems as much as possible in the manufacturing process of electronic equipment.
[0023] 以下,基於圖面說明本實施方式。 [0024] 圖1為本發明實施形態之玻璃基板的製造方法所包含之製造玻璃基板3的工程1的概略示意流程圖。此外,圖2A~圖2F為母玻璃板2上的玻璃基板3的配置示意概略平面圖。本發明實施形態之玻璃基板的製造方法,包含由母玻璃板2製造玻璃基板3之工程1。作為前工程,亦可包含藉由下引(down draw)法或浮式(float)法等將玻璃帶(ribbon)成形,再由該玻璃帶製造母玻璃板2之工程。 [0025] 玻璃基板3,是藉由從母玻璃板2切割出而被製造。此時,從1片母玻璃板2切割出的玻璃基板3的尺寸或張數,會依玻璃基板3的品種而異。 [0026] 例如,圖2A所示之玻璃基板3,為可從母玻璃板2採取的最大尺寸的品種(以下稱最大尺寸品種3a)。此外,圖2B~圖2F所示之玻璃基板3,為比圖2A的玻璃基板3還小尺寸之裁減尺寸品種3b。 [0027] 此外,圖2A及圖2B所示之玻璃基板3,從1片母玻璃板2切割出的玻璃基板3為1片。圖2C~圖2F所示之玻璃基板3,從1片母玻璃板2切割出的片數,分別為2片、3片、4片、3片。 [0028] 此外,圖2C~圖2E所示之玻璃基板3,從1片母玻璃板2切割出的玻璃基板3,係同一尺寸(同一品種),圖2F所示之玻璃基板3,從1片母玻璃板2切割出的玻璃基板3,係相異尺寸(相異品種)。像這樣可從1片母玻璃板2採取之品種有複數種,較佳是預先形成由該些品種所組成之群組(group),而鑑於需求動向或製造產線的運轉狀況等來選擇。 [0029] 如圖1所示,製造玻璃基板之工程1,具備缺陷檢測工程S1、母玻璃板判定工程S2、批次形成工程S3、資料算出工程S4、批次判定工程S5。 [0030] 缺陷檢測工程S1中,藉由周知的圖像檢查裝置,檢測存在於母玻璃板2上之缺陷。此缺陷,例如為氣泡、異物等,由在規定的判定基準下被判定為合格之合格缺陷、及在前述判定基準下被判定為不合格之不合格缺陷所組成。本實施形態之判定基準,為規定的缺陷尺寸,未滿此尺寸的缺陷為合格缺陷,此尺寸以上的缺陷則為不合格缺陷。作為此判定基準之缺陷尺寸,是因應品種而適當設定,例如若缺陷為氣泡則是50μm~1000μm,若缺陷為異物則是20μm~300μm。另,圖像檢查裝置中,例如若為氣泡,則10數μm以上者會被檢測成為缺陷,若為異物則數μm以上者會被檢測成為缺陷。 [0031] 此外,缺陷檢測工程S1中,係取得藉由周知的圖像檢查裝置檢測出之缺陷種類(氣泡、異物等)、個數、尺寸、座標等資料。 [0032] 母玻璃板判定工程S2,是基於缺陷檢測工程S1中檢測出的不合格缺陷的個數,而1片片地判定母玻璃板2的合格與否。例如,若不合格缺陷的個數為規定的閾值以下,則該母玻璃板2被判定為合格,進入批次形成工程S3。而若不合格缺陷的個數比規定的閾值還多,則該母玻璃板2被判定為不合格,受到處理。另,母玻璃板2的合格與否的判定材料中,亦可加上缺陷檢測工程S1中取得之其他資料(氣泡、異物等不合格缺陷的種類、不合格缺陷的座標等)。不合格缺陷的規定的閾值,例如為每一母玻璃基板為0(零)個,在此情形下,是以不合格缺陷的有無來判定合格與否,無不合格缺陷的母玻璃板2成為合格,有不合格缺陷的母玻璃板2成為不合格。 [0033] 批次形成工程S3中,將僅母玻璃板判定工程S2中被判定為合格之母玻璃板2予以聚集複數片而形成1個批次。 [0034] 資料算出工程S4中,由缺陷檢測工程S1中取得的缺陷的資料,算出批次判定工程S5中受使用之批次判定用資料。此批次判定用資料中,作為主要者,有「1個批次中的母玻璃板2的每1片的缺陷的平均個數」、及「1個批次中的玻璃基板3的每1片的缺陷的平均個數」。該些缺陷的平均個數中,可將合格缺陷及不合格缺陷雙方(總合缺陷)訂為對象,亦可僅將合格缺陷訂為對象。此處,1片母玻璃板中包含之不合格缺陷的個數,相較於合格缺陷的個數而言有較少的傾向。因此,即使是包含不合格缺陷之缺陷平均個數,因合格缺陷占的比例大,能夠評估合格缺陷的個數,而能抑制電子機器的製造工程中發生合格缺陷所引起之問題。 [0035] 「1個批次中的母玻璃板2的每1片的缺陷的平均個數」中,有第1平均個數及第2平均個數。第1平均個數,為對缺陷的全種類的個數而言算出者。第2平均個數,為對缺陷當中特定的種類的個數而言算出者。本實施形態中,第2平均個數,係對「氣泡」而言者及對「異物」而言者這2種類,但亦可為1種類,亦可為3種類以上。 [0036] 「1個批次中的玻璃基板3的每1片的缺陷的平均個數」(以下稱第3平均個數),是基於第1平均個數而依玻璃基板3的每一裁減尺寸品種3b算出。例如,第3平均個數,當將母玻璃板2的面積訂為Sm,將玻璃基板3的面積訂為Sb的情形下,是由第3平均個數=第1平均個數×Sb/Sm這一式子算出。 [0037] 批次判定工程S5中,基於對1個批次算出之母玻璃板2的每1片的缺陷的平均個數(第1平均個數),判定該批次的合格與否。 [0038] 此外,批次判定工程S5中,當母玻璃板2中合格缺陷的分布有偏頗(bias)的情形下,會選擇僅使用合格缺陷少的區域之裁減尺寸品種3b。 [0039] 此外,批次判定工程S5中,由品種的群組,基於第1平均個數,選擇從批次的母玻璃板2製造之玻璃基板3的品種。在此情形下品種的群組中,會包含最大尺寸品種3a及裁減尺寸品種3b。在此情形下的裁減尺寸品種3b,是基於第3平均個數來選擇。另,批次判定工程S5中作為選擇候補之裁減尺寸品種3b,是鑑於需求動向或製造產線的運轉狀況等來選擇。 [0040] 批次判定工程S5中,被判定為合格之批次,會被搬運至切斷產線,受選擇的品種的玻璃基板3,從該批次的母玻璃板2切割出而被製造。另一方面,批次判定工程S5中,被判定為不合格之批次,受到廢棄處分。 [0041] 另,本實施形態中,最大尺寸品種3a的玻璃基板3的判定基準和裁減尺寸品種3b的玻璃基板3的判定基準,可訂為同一,亦可相異。最大尺寸品種3a及裁減尺寸品種3b的判定基準,能夠藉由閾值(缺陷的容許個數)來設定。當將以全種類的合格缺陷為對象之第1平均個數用於判定的情形下,閾值例如能夠訂為0.1~5個。 [0042] 裁減尺寸品種3b中,相較於最大尺寸品種3a,玻璃基板3的面積會減少,因此第3平均個數(玻璃基板3的每1片的缺陷的平均個數)亦減少。同樣地,裁減尺寸品種3中,玻璃基板3的面積愈小之品種,第3平均個數愈減少。是故,若在最大尺寸品種3a和各裁減尺寸品種3b中閾值相同,則玻璃基板3的面積愈小之品種,愈容易滿足品種的判定基準,也就是說,裁減尺寸品種愈能夠滿足判定基準的閾值。 [0043] 接著,基於圖3詳細說明批次判定工程S5。 [0044] 最初,步驟S51中,判定合格缺陷的分布是否有偏頗。當合格缺陷的分布有偏頗的情形下,進入步驟S52,當合格缺陷的分布無偏頗的情形下,進入步驟S53。 [0045] 步驟S52中,判定2種類的第2平均個數(氣泡的平均個數及異物的平均個數)的各者是否滿足最大尺寸品種3a之判定基準。具體而言,當雙方的第2平均個數為規定的閾值以下的情形下,選擇最大尺寸品種3a來作為使用該批次之品種(步驟S54),將該批次訂為合格(步驟S55)。當任一第2平均個數超過規定的閾值的情形下,進入步驟S56。 [0046] 步驟S56中,判定是否有如圖4所示使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b。 [0047] 另,圖4所示的品種(圖2B的品種)中,從母玻璃板2得到的玻璃基板3為1片,但亦可為複數片,此外,亦可為複數片當中僅1片為使用母玻璃板2中僅合格缺陷d少的區域者。此外,本實施形態中,僅使用合格缺陷d少的區域之品種,為裁減尺寸品種3b,但亦可為最大尺寸品種3a。 [0048] 步驟S56中,當有使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b的情形下,選擇該裁減尺寸品種3b來作為使用此批次之品種(步驟S57),將此批次訂為合格(步驟S58)。另,當使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b有複數種的情形下,選擇它們當中優先順位最高者。此優先順位,是藉由需求動向或製造產線的運轉狀況等而預先設定。 [0049] 步驟S56中,當沒有使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b的情形下,將此批次訂為不合格(步驟S59)。 [0050] 另一方面,步驟S53中,判定第1平均個數(全種類的缺陷的平均個數)是否滿足最大尺寸品種3a之判定基準。具體而言,當第1平均個數為規定的閾值以下的情形下,選擇最大尺寸品種3a來作為使用此批次之品種(步驟S60),將此批次訂為合格(步驟S61)。當第1平均個數超過規定的閾值的情形下,進入步驟S62。 [0051] 步驟S62中,判定是否有滿足判定基準之裁減尺寸品種3b。此判定,是將第3平均個數假定為玻璃基板3的製造後的缺陷的個數來進行。 [0052] 詳言之,是將每一品種(玻璃基板3)的第3平均個數、和每一品種的判定基準即閾值(缺陷的容許個數)予以比較,判定是否有第3平均個數為判定基準的閾值以下之裁減尺寸品種3b。 [0053] 步驟S62中,當有滿足判定基準之裁減尺寸品種3b的情形下,選擇該裁減尺寸品種3b來作為使用此批次之品種(步驟S63),將此批次訂為合格(步驟S64)。另,當滿足判定基準之裁減尺寸品種3b有複數種的情形下,選擇它們當中優先順位最高者。此優先順位,是鑑於需求動向或製造產線的運轉狀況等而選擇。 [0054] 步驟S62中,當沒有滿足判定基準之裁減尺寸品種3b的情形下,將此批次訂為不合格(步驟S65)。 [0055] 另一方面,圖5為缺陷檢測工程S1中檢測出的缺陷的尺寸與累積檢測數之關係示意曲線。橫軸為缺陷的尺寸,縱軸為將規定片數的母玻璃板2的缺陷的檢測數予以累積而成者。又,曲線A表示通常的情形,曲線B表示缺陷被連續檢測出多量的情形。 [0056] 如圖5中曲線B所示,當缺陷被連續檢測出多量的情形下,母玻璃板2的缺陷的個數亦當然增加,不僅是不合格缺陷增加,合格缺陷亦增加,若不研擬任何對策,則批次判定工程S5中,第1及第2平均個數會變高,被訂為不合格之批次有增大的可能性。為了避免這樣的事態,當缺陷被檢測出多量的情形下,判別合格缺陷與不合格缺陷之判定基準b,會訂得比通常的情形下判別合格缺陷與不合格缺陷之判定基準a還嚴格(b<a)。也就是說,當缺陷被檢測出多量的情形下會將判別合格缺陷與不合格缺陷之閾值縮小而變更至嚴格側。 [0057] 進一步,會將判定基準b(閾值)設定成,使得當缺陷被檢測出多量的情形下之第1及第2平均個數成為和通常的情形下近乎同等。詳言之,是將判定基準b設定成使得區域R2的面積成為和區域R1的面積近乎同等。區域R1,為比曲線A還下側而比a還左側之區域。區域R2,為比曲線B還下側而比b還左側之區域。 [0058] 區域R1的面積,表示通常的判定基準a下之缺陷的個數的總數。此外,區域R2的面積,表示當缺陷被檢測出多量的情形的判定基準b下之缺陷的個數的總數。是故,若將區域R2的面積設為和區域R1的面積成為同等,則能夠使得當缺陷被檢測出多量的情形之第1及第2平均個數成為和通常的場合近乎同等。 [0059] 如以上般構成之本實施形態之玻璃基板的製造方法1,能夠享受以下的效果。 [0060] 基於缺陷的平均個數(第1平均個數),來判定批次的合格與否,因此能夠抑制電子機器的製造工程中發生合格缺陷所引起之問題。也就是說,按照本實施形態之玻璃基板的製造方法1,能夠製造在電子機器的製造工程中盡可能地不肇生問題之玻璃基板3。 [0061] 本發明並非限定於上述實施形態,於其技術性思想之範圍內可做各種變形。例如,上述實施形態的批次判定工程S5中,當母玻璃板2中合格缺陷的分布有偏頗的情形下,會在步驟S52中進行第2平均個數之判定,但亦可省略步驟S52。[0023] Hereinafter, this embodiment will be described based on the drawings. [0024] FIG. 1 is a schematic schematic flowchart of a process 1 of manufacturing a glass substrate 3 included in a method for manufacturing a glass substrate according to an embodiment of the present invention. 2A to 2F are schematic plan views showing the arrangement of the glass substrate 3 on the mother glass plate 2. The method for manufacturing a glass substrate according to the embodiment of the present invention includes a process 1 of manufacturing a glass substrate 3 from a mother glass plate 2. The pre-process may include a process of forming a glass ribbon by a down draw method, a float method, or the like, and then manufacturing a mother glass plate 2 from the glass ribbon. [0025] The glass substrate 3 is manufactured by cutting out from the mother glass plate 2. At this time, the size or number of glass substrates 3 cut from one mother glass plate 2 varies depending on the type of the glass substrate 3. [0026] For example, the glass substrate 3 shown in FIG. 2A is a product of the largest size that can be taken from the mother glass plate 2 (hereinafter referred to as the largest-size product 3a). In addition, the glass substrate 3 shown in FIGS. 2B to 2F is a reduced-size variety 3b that is smaller in size than the glass substrate 3 in FIG. 2A. [0027] In addition, for the glass substrate 3 shown in FIGS. 2A and 2B, the glass substrate 3 cut from one mother glass plate 2 is one. In the glass substrate 3 shown in FIGS. 2C to 2F, the number of pieces cut from one mother glass plate 2 is respectively 2, 3, 4, and 3. [0028] In addition, the glass substrate 3 shown in FIG. 2C to FIG. 2E, the glass substrate 3 cut from one mother glass plate 2 is of the same size (same species), and the glass substrate 3 shown in FIG. The glass substrate 3 cut from the mother glass plate 2 has different sizes (different types). There are a plurality of types that can be taken from one mother glass plate 2 in this manner, and it is preferable to form a group composed of these types in advance, and it is selected in view of the demand trend or the operating condition of the manufacturing line. [0029] As shown in FIG. 1, a process 1 for manufacturing a glass substrate includes a defect detection process S1, a mother glass plate determination process S2, a batch formation process S3, a data calculation process S4, and a batch determination process S5. [0030] In the defect detection process S1, a defect existing on the mother glass plate 2 is detected by a well-known image inspection device. This defect is, for example, a bubble, a foreign object, and the like, and is composed of a qualified defect that is judged to be qualified under a predetermined judgment criterion, and a defective defect that is judged to be unqualified under the aforementioned judgment criterion. The judgment criterion of this embodiment is a predetermined defect size. Defects smaller than this size are qualified defects, and defects larger than this size are unqualified defects. The size of the defect used as a criterion for this determination is appropriately set according to the type. For example, if the defect is a bubble, it is 50 μm to 1000 μm, and if the defect is a foreign object, it is 20 μm to 300 μm. In the image inspection device, for example, if it is a bubble, a person with a diameter of 10 μm or more is detected as a defect, and if it is a foreign object, a person with a diameter of several μm or more is detected as a defect. [0031] In addition, in the defect detection process S1, information such as the type of defects (bubbles, foreign objects, etc.), the number, the size, and the coordinates detected by a well-known image inspection device is obtained. [0032] The mother glass plate determination process S2 is based on the number of unqualified defects detected in the defect detection process S1, and the pass or fail of the mother glass plate 2 is determined one by one. For example, if the number of defective defects is equal to or less than a predetermined threshold value, the mother glass plate 2 is determined to be acceptable, and the process proceeds to batch forming process S3. On the other hand, if the number of unacceptable defects is more than a predetermined threshold, the mother glass plate 2 is judged as unacceptable and is processed. In addition, other materials obtained from the defect detection process S1 (types of unqualified defects such as bubbles and foreign objects, coordinates of unqualified defects, etc.) may be added to the material for determining the pass or fail of the mother glass plate 2. The predetermined threshold for non-conformity defects is, for example, 0 (zero) per mother glass substrate. In this case, the pass or failure is determined by the presence or absence of non-conformance defects, and the mother glass plate 2 without non-conformity defects becomes A pass, and the mother glass plate 2 with an unacceptable defect becomes unacceptable. [0033] In the batch forming process S3, only the mother glass sheet 2 judged to be qualified in the mother glass sheet determination process S2 is gathered into a plurality of pieces to form one batch. [0034] In the data calculation process S4, from the defect data obtained in the defect detection process S1, the batch determination data used in the batch determination process S5 is calculated. In this batch determination data, the main ones are "the average number of defects per one sheet of the mother glass plate 2 in one batch" and "per one sheet of the glass substrate 3 in one batch" The average number of defects in the film. " Among the average number of these defects, both qualified defects and unqualified defects (total defects) can be targeted, and only qualified defects can be targeted. Here, the number of defective defects contained in one mother glass plate tends to be smaller than the number of defective defects. Therefore, even if the average number of defects including unqualified defects is large, the number of qualified defects can be evaluated, and the problems caused by qualified defects in the manufacturing process of electronic equipment can be suppressed. [0035] Among the "average number of defects per mother glass plate 2 in one batch", there are a first average number and a second average number. The first average number is calculated for the number of all kinds of defects. The second average number is a number calculated for the number of specific types among defects. In this embodiment, the second average number is two types for "bubble" and "foreign body", but it may be one type or three or more types. [0036] "The average number of defects per glass substrate 3 in one batch" (hereinafter referred to as the third average number) is based on each cut of the glass substrate 3 based on the first average number. Calculate the size variety 3b. For example, for the third average number, when the area of the mother glass plate 2 is set to Sm and the area of the glass substrate 3 is set to Sb, the third average number is equal to the first average number = Sb / Sm This formula is calculated. [0037] In the batch determination process S5, the pass or fail of the batch is determined based on the average number of defects (first average number) per one piece of the mother glass plate 2 calculated for one batch. [0038] In addition, in the batch determination process S5, when the distribution of qualified defects in the mother glass plate 2 is biased, a cut-out size 3b that uses only areas with fewer qualified defects is selected. [0039] In addition, in the lot determination process S5, the kind of the glass substrate 3 manufactured from the mother glass plate 2 of the lot is selected from the lot group based on the first average number. In this case, the group of varieties includes the maximum size variety 3a and the reduced size variety 3b. The cut size 3b in this case is selected based on the third average number. In addition, the cut size item 3b as a candidate for selection in the lot determination process S5 is selected in view of the demand trend, the operation status of the manufacturing line, and the like. [0040] In the lot determination process S5, the lot that is judged to be qualified will be transferred to a cutting line, and the glass substrate 3 of the selected variety is cut out from the mother glass plate 2 of the lot and manufactured. . On the other hand, in the lot determination process S5, the lot which is judged as unacceptable is subject to disposal. [0041] In addition, in this embodiment, the determination criterion of the glass substrate 3 of the maximum size variety 3a and the determination criterion of the glass substrate 3 of the reduced size variety 3b may be the same or different. The criterion for determining the maximum size variety 3a and the reduced size variety 3b can be set by a threshold (allowable number of defects). In the case where the first average number of all kinds of qualified defects is used for the determination, the threshold value can be set to, for example, 0.1 to 5. [0042] In the reduced-size variety 3b, the area of the glass substrate 3 is reduced compared to the maximum-size variety 3a, and therefore the third average number (average number of defects per glass substrate 3) is also reduced. Similarly, among the reduced-size varieties 3, the smaller the size of the glass substrate 3 is, the smaller the third average number is. Therefore, if the threshold is the same in the maximum size variety 3a and each of the reduced size varieties 3b, the smaller the area of the glass substrate 3, the easier it is to meet the determination criteria of the variety, that is, the more the reduced size variety can meet the determination criteria The threshold. [0043] Next, the batch determination process S5 will be described in detail based on FIG. 3. [0044] Initially, in step S51, it is determined whether the distribution of qualified defects is biased. When the distribution of qualified defects is biased, the process proceeds to step S52, and when the distribution of qualified defects is not biased, the process proceeds to step S53. [0045] In step S52, it is determined whether each of the two types of the second average number (the average number of bubbles and the average number of foreign objects) satisfies the determination criterion of the maximum size type 3a. Specifically, when the second average number of both parties is equal to or less than a predetermined threshold, the largest size variety 3a is selected as the variety using the batch (step S54), and the batch is qualified (step S55). . When any second average number exceeds a predetermined threshold, the process proceeds to step S56. [0046] In step S56, it is determined whether or not there is a cut-out size item 3b in the area where the number of acceptable defects d is small in the mother glass plate 2 as shown in FIG. 4. [0047] In addition, among the varieties shown in FIG. 4 (the variety shown in FIG. 2B), the glass substrate 3 obtained from the mother glass plate 2 is one piece, but it may be a plurality of pieces. In addition, only one of the plurality of pieces may be used. The sheet is a region in which only a small number of acceptable defects d in the mother glass plate 2 are used. In addition, in the present embodiment, only the variety in the area with a small number of acceptable defects d is used, which is a reduced size variety 3b, but it may also be a maximum size variety 3a. [0048] In step S56, when there is a cut size variety 3b in the mother glass plate 2 where only qualified defects d are small, the cut size variety 3b is selected as the variety used in this batch (step S57), This lot is set as pass (step S58). In addition, when there are multiple types of cut sizes 3b in the area where the mother glass plate 2 has only a small number of qualified defects d, the one with the highest priority is selected among them. This priority is set in advance based on demand trends or operating conditions of manufacturing lines. [0049] In step S56, when the cut-size item 3b of only the area with fewer qualified defects d in the mother glass plate 2 is not used, the lot is set as unqualified (step S59). [0050] On the other hand, in step S53, it is determined whether or not the first average number (average number of defects of all types) satisfies the determination criterion of the maximum size variety 3a. Specifically, when the first average number is equal to or less than a predetermined threshold, the largest size variety 3a is selected as the variety using this batch (step S60), and this batch is set to pass (step S61). When the first average number exceeds a predetermined threshold, the process proceeds to step S62. [0051] In step S62, it is determined whether there is a reduced-size item 3b that satisfies the determination criterion. This determination is performed by assuming that the third average number is the number of defects after the glass substrate 3 is manufactured. [0052] In detail, the third average number of each type (glass substrate 3) is compared with the threshold value (allowable number of defects) which is the criterion for each type to determine whether there is a third average number. The number is the size 3b of the cut-off size below the threshold of the judgment criterion. [0053] In step S62, when there is a cut size variety 3b that satisfies the determination criterion, the cut size variety 3b is selected as the variety using this batch (step S63), and the batch is qualified (step S64) ). In addition, when there are a plurality of cut-size varieties 3b that satisfy the determination criterion, the one with the highest priority is selected among them. This priority order is selected in view of demand trends and operating conditions of manufacturing lines. [0054] In step S62, when the cut-size item 3b that does not satisfy the determination criterion is satisfied, the lot is determined as unacceptable (step S65). [0055] On the other hand, FIG. 5 is a schematic curve showing the relationship between the size of the defects detected in the defect detection process S1 and the cumulative detection number. The horizontal axis represents the size of the defect, and the vertical axis represents the number of defects detected in the mother glass plate 2 having a predetermined number of pieces accumulated. In addition, a curve A indicates a normal case, and a curve B indicates a case where a large number of defects are continuously detected. [0056] As shown by the curve B in FIG. 5, when a large number of defects are continuously detected, the number of defects of the mother glass plate 2 also increases of course, not only the number of defective defects increases, but also the number of qualified defects increases. Develop any countermeasures. In the batch determination process S5, the average number of the first and second batches will increase, and there is a possibility that the batches designated as unqualified will increase. In order to avoid such a situation, when a large number of defects are detected, the determination criterion b for distinguishing qualified defects and unqualified defects is set to be stricter than the determination criterion a for determining qualified defects and unqualified defects under normal circumstances ( b <a). That is, when a large number of defects are detected, the threshold for discriminating a qualified defect and an unqualified defect is reduced and changed to the strict side. [0057] Furthermore, the determination criterion b (threshold value) is set so that the first and second average numbers in the case where a large number of defects are detected become almost the same as in the normal case. Specifically, the determination criterion b is set so that the area of the region R2 is approximately equal to the area of the region R1. The region R1 is a region lower than the curve A and leftward than a. The region R2 is a region lower than the curve B and leftward than b. [0058] The area of the region R1 represents the total number of defects under the normal determination criterion a. In addition, the area of the region R2 indicates the total number of defects under the determination criterion b when a large number of defects are detected. Therefore, if the area of the region R2 is made equal to the area of the region R1, the first and second average numbers in the case where a large number of defects are detected can be made almost the same as in the normal case. [0059] The manufacturing method 1 of the glass substrate of this embodiment configured as described above can enjoy the following effects. [0060] Based on the average number of defects (the first average number), whether the batch is qualified or not is judged, so that problems caused by qualified defects in the manufacturing process of electronic equipment can be suppressed. That is, according to the manufacturing method 1 of the glass substrate of this embodiment, the glass substrate 3 which does not cause a problem as much as possible in the manufacturing process of an electronic device can be manufactured. [0061] The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of its technical idea. For example, in the batch determination process S5 of the above embodiment, if the distribution of qualified defects in the mother glass plate 2 is biased, the second average number is determined in step S52, but step S52 may be omitted.
[0062][0062]
1‧‧‧製造玻璃基板之工程1‧‧‧ Manufacturing of glass substrates
2‧‧‧母玻璃板2‧‧‧ mother glass
3‧‧‧玻璃基板3‧‧‧ glass substrate
3a‧‧‧最大尺寸品種3a‧‧‧The largest size variety
3b‧‧‧裁減尺寸品種3b‧‧‧ cut size varieties
S1‧‧‧缺陷檢測工程S1‧‧‧Defect detection project
S2‧‧‧母玻璃板判定工程S2‧‧‧Mother glass plate determination project
S3‧‧‧批次形成工程S3‧‧‧ Batch formation project
S4‧‧‧資料算出工程S4‧‧‧Data calculation project
S5‧‧‧批次判定工程S5‧‧‧Batch determination project
d‧‧‧合格缺陷d‧‧‧ qualified defect
[0022] [圖1] 本發明實施形態之玻璃基板的製造方法所包含之製造玻璃基板的工程的概略示意流程圖。 [圖2A] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖2B] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖2C] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖2D] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖2E] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖2F] 母玻璃板上的玻璃基板的配置示意概略平面圖。 [圖3] 批次判定說明用流程圖。 [圖4] 母玻璃板上的合格缺陷的分布示意概略平面圖。 [圖5] 缺陷的尺寸與累積檢測數之關係示意曲線。[0022] [FIG. 1] A schematic schematic flowchart of a process for manufacturing a glass substrate included in a method for manufacturing a glass substrate according to an embodiment of the present invention.图 [Fig. 2A] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 2B] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 2C] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 2D] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 2E] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 2F] A schematic plan view showing the arrangement of a glass substrate on a mother glass plate.图 [Fig. 3] A flowchart for explaining batch judgment.图 [Fig. 4] A schematic plan view showing the distribution of qualified defects on the mother glass.图 [Figure 5] Schematic curve of the relationship between the size of the defect and the cumulative detection number.
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2016246960A JP6919779B2 (en) | 2016-12-20 | 2016-12-20 | Glass substrate manufacturing method |
| JP2016-246960 | 2016-12-20 |
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| TW201828224A true TW201828224A (en) | 2018-08-01 |
| TWI802554B TWI802554B (en) | 2023-05-21 |
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| JP (1) | JP6919779B2 (en) |
| KR (1) | KR102390576B1 (en) |
| CN (1) | CN109937193A (en) |
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| WO (1) | WO2018116756A1 (en) |
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| CN216710916U (en) * | 2018-11-01 | 2022-06-10 | 日本电气硝子株式会社 | Glass plate manufacturing device |
| JP2020121911A (en) * | 2019-01-31 | 2020-08-13 | 日本電気硝子株式会社 | Method of manufacturing glass substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0967187A (en) * | 1995-08-25 | 1997-03-11 | Mitsubishi Materials Corp | Single crystal manufacturing equipment |
| JP4347067B2 (en) | 2002-04-03 | 2009-10-21 | AvanStrate株式会社 | Mother glass defect inspection method and apparatus, and liquid crystal display glass substrate manufacturing method |
| JP2004083321A (en) * | 2002-08-26 | 2004-03-18 | Nippon Sheet Glass Co Ltd | Method and apparatus for cutting sheet-like body |
| WO2008004559A1 (en) * | 2006-07-06 | 2008-01-10 | Asahi Glass Company, Limited | Clustering system, and defect kind judging device |
| EP2458371A1 (en) * | 2009-07-24 | 2012-05-30 | Asahi Glass Company, Limited | Glass member quality control method and quality control device, and glass member with mark |
| JP2011075401A (en) * | 2009-09-30 | 2011-04-14 | Hitachi High-Technologies Corp | Method for calibrating optical system of in-line substrate inspection device and in-line substrate inspection device |
| FR2975687A1 (en) * | 2011-05-27 | 2012-11-30 | Saint Gobain | METHOD FOR CUTTING ONE OR MORE WINDOWS |
| JP6191599B2 (en) * | 2013-03-21 | 2017-09-06 | 日本電気硝子株式会社 | Glass substrate production management system and glass substrate production management method |
| JP6094891B2 (en) * | 2013-08-27 | 2017-03-15 | 日本電気硝子株式会社 | Glass substrate production management system and glass substrate production management method |
| JP6140047B2 (en) * | 2013-09-30 | 2017-05-31 | Hoya株式会社 | Manufacturing method of glass substrate for magnetic disk |
| CN105242423B (en) * | 2015-11-11 | 2018-10-19 | 武汉华星光电技术有限公司 | The detection of TFT-LCD coloured silk film glass substrates and restorative procedure and its system |
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| JP2018100199A (en) | 2018-06-28 |
| KR102390576B1 (en) | 2022-04-26 |
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| TWI802554B (en) | 2023-05-21 |
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