TW201825632A - Curable resin composition, image display device and manufacturing method of image display device - Google Patents
Curable resin composition, image display device and manufacturing method of image display device Download PDFInfo
- Publication number
- TW201825632A TW201825632A TW106128813A TW106128813A TW201825632A TW 201825632 A TW201825632 A TW 201825632A TW 106128813 A TW106128813 A TW 106128813A TW 106128813 A TW106128813 A TW 106128813A TW 201825632 A TW201825632 A TW 201825632A
- Authority
- TW
- Taiwan
- Prior art keywords
- curable resin
- image display
- resin layer
- resin composition
- light
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000178 monomer Substances 0.000 claims abstract description 70
- 150000001875 compounds Chemical class 0.000 claims abstract description 42
- 239000003086 colorant Substances 0.000 claims abstract description 39
- 125000005372 silanol group Chemical group 0.000 claims abstract description 21
- 125000005370 alkoxysilyl group Chemical group 0.000 claims abstract description 19
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 110
- 229920005989 resin Polymers 0.000 claims description 110
- 239000011521 glass Substances 0.000 claims description 81
- 239000000758 substrate Substances 0.000 claims description 66
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 41
- 239000003505 polymerization initiator Substances 0.000 claims description 30
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 16
- 239000004973 liquid crystal related substance Substances 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 239000007870 radical polymerization initiator Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 137
- -1 alkoxysilyl compound Chemical class 0.000 description 61
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 60
- 238000002834 transmittance Methods 0.000 description 20
- 150000003254 radicals Chemical class 0.000 description 18
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 17
- 229920000058 polyacrylate Polymers 0.000 description 15
- 239000002585 base Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- 230000003111 delayed effect Effects 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 7
- 238000010526 radical polymerization reaction Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- SCWNYUDYCSFNTK-UHFFFAOYSA-N 1-(9h-fluoren-1-yl)prop-2-en-1-one Chemical group C1C2=CC=CC=C2C2=C1C(C(=O)C=C)=CC=C2 SCWNYUDYCSFNTK-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- LVUNJHSREDQSGA-UHFFFAOYSA-N 2-benzyl-n,n-dimethyl-1-(4-morpholin-4-ylphenyl)butan-2-amine Chemical compound C=1C=C(N2CCOCC2)C=CC=1CC(N(C)C)(CC)CC1=CC=CC=C1 LVUNJHSREDQSGA-UHFFFAOYSA-N 0.000 description 2
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 2
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000005662 Paraffin oil Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 125000005641 methacryl group Chemical group 0.000 description 2
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- IWZLBIVZPIDURM-UHFFFAOYSA-N trimethoxy(3-prop-1-enoxypropyl)silane Chemical compound CO[Si](OC)(OC)CCCOC=CC IWZLBIVZPIDURM-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- UIYCHXAGWOYNNA-UHFFFAOYSA-N vinyl sulfide Chemical group C=CSC=C UIYCHXAGWOYNNA-UHFFFAOYSA-N 0.000 description 2
- VUKQYJWLJNVTSF-UHFFFAOYSA-N (2-nitrophenyl)methyl 2,7-diaminoheptanoate Chemical compound NCCCCCC(N)C(=O)OCC1=CC=CC=C1[N+]([O-])=O VUKQYJWLJNVTSF-UHFFFAOYSA-N 0.000 description 1
- NJMCHQONLVUNAM-UHFFFAOYSA-N (2-nitrophenyl)methyl n-cyclohexylcarbamate Chemical compound [O-][N+](=O)C1=CC=CC=C1COC(=O)NC1CCCCC1 NJMCHQONLVUNAM-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- RXVBJUZEFSAYPW-UHFFFAOYSA-N 1,3-diphenylpropane-1,2,3-trione Chemical class C=1C=CC=CC=1C(=O)C(=O)C(=O)C1=CC=CC=C1 RXVBJUZEFSAYPW-UHFFFAOYSA-N 0.000 description 1
- DVFAVJDEPNXAME-UHFFFAOYSA-N 1,4-dimethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(C)=CC=C2C DVFAVJDEPNXAME-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- VQIPSVLHHAYQJH-UHFFFAOYSA-N 1-(7-acridin-1-ylheptyl)acridine Chemical compound C1=CC=C2C=C3C(CCCCCCCC=4C5=CC6=CC=CC=C6N=C5C=CC=4)=CC=CC3=NC2=C1 VQIPSVLHHAYQJH-UHFFFAOYSA-N 0.000 description 1
- WQHNZXURJISVCT-UHFFFAOYSA-N 1-butoxyethane-1,2-diol Chemical compound CCCCOC(O)CO WQHNZXURJISVCT-UHFFFAOYSA-N 0.000 description 1
- BVEIKFLZWBDLJG-UHFFFAOYSA-N 1-butylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCC BVEIKFLZWBDLJG-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- 125000004066 1-hydroxyethyl group Chemical group [H]OC([H])([*])C([H])([H])[H] 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- HLLGFGBLKOIZOM-UHFFFAOYSA-N 2,2-diphenylacetaldehyde Chemical compound C=1C=CC=CC=1C(C=O)C1=CC=CC=C1 HLLGFGBLKOIZOM-UHFFFAOYSA-N 0.000 description 1
- KPYPNTLKDIYIKB-UHFFFAOYSA-N 2,3-dichloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=C(Cl)C(Cl)=C2 KPYPNTLKDIYIKB-UHFFFAOYSA-N 0.000 description 1
- MDKSQNHUHMMKPP-UHFFFAOYSA-N 2,5-bis(4-methoxyphenyl)-4-phenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC(OC)=CC=2)N1 MDKSQNHUHMMKPP-UHFFFAOYSA-N 0.000 description 1
- CTWRMVAKUSJNBK-UHFFFAOYSA-N 2-(2,4-dimethoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class COC1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 CTWRMVAKUSJNBK-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical class ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- UIHRWPYOTGCOJP-UHFFFAOYSA-N 2-(2-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical class FC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 UIHRWPYOTGCOJP-UHFFFAOYSA-N 0.000 description 1
- XIOGJAPOAUEYJO-UHFFFAOYSA-N 2-(2-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class COC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 XIOGJAPOAUEYJO-UHFFFAOYSA-N 0.000 description 1
- SNFCQJAJPFWBDJ-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 SNFCQJAJPFWBDJ-UHFFFAOYSA-N 0.000 description 1
- GZYZPHPDKCTFFH-UHFFFAOYSA-N 2-(4-methylsulfanylphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(SC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 GZYZPHPDKCTFFH-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- VUDVPVOIALASLB-UHFFFAOYSA-N 2-[(2-cyano-1-hydroxypropan-2-yl)diazenyl]-3-hydroxy-2-methylpropanenitrile Chemical compound OCC(C)(C#N)N=NC(C)(CO)C#N VUDVPVOIALASLB-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- XDEKOZXTBXBBAP-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propoxy]propoxy]propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)CO XDEKOZXTBXBBAP-UHFFFAOYSA-N 0.000 description 1
- ZZEANNAZZVVPKU-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-(2-hydroxypropoxy)propoxy]propoxy]propoxy]propoxy]propoxy]propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)CO ZZEANNAZZVVPKU-UHFFFAOYSA-N 0.000 description 1
- SZGNWRSFHADOMY-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound COCCOCCOCCOCCOCCOCCOCCOCCO SZGNWRSFHADOMY-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- YQZHOBBQNFBTJE-UHFFFAOYSA-N 2-chloro-3-methylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=C(C)C(Cl)=C2 YQZHOBBQNFBTJE-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-hydroxyoctadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- NNAHKQUHXJHBIV-UHFFFAOYSA-N 2-methyl-1-(4-methylthiophen-2-yl)-2-morpholin-4-ylpropan-1-one Chemical compound CC1=CSC(C(=O)C(C)(C)N2CCOCC2)=C1 NNAHKQUHXJHBIV-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- NTZCFGZBDDCNHI-UHFFFAOYSA-N 2-phenylanthracene-9,10-dione Chemical compound C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 NTZCFGZBDDCNHI-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- WGKYSFRFMQHMOF-UHFFFAOYSA-N 3-bromo-5-methylpyridine-2-carbonitrile Chemical compound CC1=CN=C(C#N)C(Br)=C1 WGKYSFRFMQHMOF-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- VDYVHGSLTLORFL-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)-2-[(2-nitrophenyl)methyl]piperidine-1-carboxylic acid Chemical compound [N+](=O)([O-])C1=C(C=CC=C1)CC1N(CCC(C1)OC(C(=C)C)=O)C(=O)O VDYVHGSLTLORFL-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- JUEAUPISFQGDQB-UHFFFAOYSA-N C(=O)(OCCOCC)OC(=O)OCCOCC Chemical compound C(=O)(OCCOCC)OC(=O)OCCOCC JUEAUPISFQGDQB-UHFFFAOYSA-N 0.000 description 1
- TXRXQBGTQUNWDE-UHFFFAOYSA-N C(C(=C)C)(=O)OCO[Si](OC)(OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCO[Si](OC)(OC)CCCCCCCC TXRXQBGTQUNWDE-UHFFFAOYSA-N 0.000 description 1
- FHBUHCVILPATNL-UHFFFAOYSA-N C(C)C=1C(=C(C=2CC3=CC=CC=C3C2C1)OOC1=C(C(=CC=2C3=CC=CC=C3CC12)CC)CC)CC Chemical compound C(C)C=1C(=C(C=2CC3=CC=CC=C3C2C1)OOC1=C(C(=CC=2C3=CC=CC=C3CC12)CC)CC)CC FHBUHCVILPATNL-UHFFFAOYSA-N 0.000 description 1
- KDWRZMHBUZNFCX-UHFFFAOYSA-N C(C1=CC=CC=C1)=C1CC(=CC=C1)C(C(=O)O)C Chemical compound C(C1=CC=CC=C1)=C1CC(=CC=C1)C(C(=O)O)C KDWRZMHBUZNFCX-UHFFFAOYSA-N 0.000 description 1
- LAXHFSKAIRALTO-UHFFFAOYSA-N C(CC)C=1C(=C(C=2CC3=CC=CC=C3C2C1)OOC1=C(C(=CC=2C3=CC=CC=C3CC12)CCC)CCC)CCC Chemical compound C(CC)C=1C(=C(C=2CC3=CC=CC=C3C2C1)OOC1=C(C(=CC=2C3=CC=CC=C3CC12)CCC)CCC)CCC LAXHFSKAIRALTO-UHFFFAOYSA-N 0.000 description 1
- FGROOCNLNDUXBA-UHFFFAOYSA-N C1(CCCCC1)N(C(OC(C)C1=CC=2C(C3=CC=CC=C3C(C=2C=C1)=O)=O)=O)C1CCCCC1 Chemical compound C1(CCCCC1)N(C(OC(C)C1=CC=2C(C3=CC=CC=C3C(C=2C=C1)=O)=O)=O)C1CCCCC1 FGROOCNLNDUXBA-UHFFFAOYSA-N 0.000 description 1
- YYRVEGVDWDWZGG-UHFFFAOYSA-N C1(CCCCC1)N(C(OCC=1C2=CC=CC=C2C=C2C=CC=CC=12)=O)C1CCCCC1 Chemical compound C1(CCCCC1)N(C(OCC=1C2=CC=CC=C2C=C2C=CC=CC=12)=O)C1CCCCC1 YYRVEGVDWDWZGG-UHFFFAOYSA-N 0.000 description 1
- PHGRIHOVBAGCIY-UHFFFAOYSA-N CC1=C(C=2CC3=CC=C(C(=C3C2C=C1CC)CC)C)N1C=CC(C=C1)C1=C(C=CC=C1)[N+](=O)[O-] Chemical compound CC1=C(C=2CC3=CC=C(C(=C3C2C=C1CC)CC)C)N1C=CC(C=C1)C1=C(C=CC=C1)[N+](=O)[O-] PHGRIHOVBAGCIY-UHFFFAOYSA-N 0.000 description 1
- UHBRADGLFUQKBG-UHFFFAOYSA-N CCC1=CC2=C(CC3=C2C(=C(C=C3)C)CC)C(=C1C)N4C=CC(C=C4)C5=C(C=C(C=C5)[N+](=O)[O-])[N+](=O)[O-] Chemical compound CCC1=CC2=C(CC3=C2C(=C(C=C3)C)CC)C(=C1C)N4C=CC(C=C4)C5=C(C=C(C=C5)[N+](=O)[O-])[N+](=O)[O-] UHBRADGLFUQKBG-UHFFFAOYSA-N 0.000 description 1
- KXXKTMJMEDZALH-UHFFFAOYSA-N COC1(CC=C(C(=O)C2=CC=C(C=C2)NC)C=C1)NC Chemical compound COC1(CC=C(C(=O)C2=CC=C(C=C2)NC)C=C1)NC KXXKTMJMEDZALH-UHFFFAOYSA-N 0.000 description 1
- NNOBDPRMXWPAJP-UHFFFAOYSA-N COC1=C(C=C(C(C([PH2]=O)=CC2=C(C=CC=C2OC)OC)C)C(C)(C)C)C(=CC=C1)OC Chemical compound COC1=C(C=C(C(C([PH2]=O)=CC2=C(C=CC=C2OC)OC)C)C(C)(C)C)C(=CC=C1)OC NNOBDPRMXWPAJP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- DFXNRMAOEBEFFH-SOFGYWHQSA-N OC1=C(C=CC=C1)/C=C/CN1CCCCC1 Chemical compound OC1=C(C=CC=C1)/C=C/CN1CCCCC1 DFXNRMAOEBEFFH-SOFGYWHQSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-BREBYQMCSA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C=C)C[C@@H]1C2(C)C PSGCQDPCAWOCSH-BREBYQMCSA-N 0.000 description 1
- NYRVXYOKUZSUDA-UHFFFAOYSA-N [dimethoxy(phenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(OC)(OC)C1=CC=CC=C1 NYRVXYOKUZSUDA-UHFFFAOYSA-N 0.000 description 1
- WYBZFSGKJOYRQH-UHFFFAOYSA-N [nitro(phenyl)methyl] carbamate Chemical compound NC(=O)OC([N+]([O-])=O)C1=CC=CC=C1 WYBZFSGKJOYRQH-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004559 acridin-9-yl group Chemical group C1=CC=CC2=NC3=CC=CC=C3C(=C12)* 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- IVHKZGYFKJRXBD-UHFFFAOYSA-N amino carbamate Chemical compound NOC(N)=O IVHKZGYFKJRXBD-UHFFFAOYSA-N 0.000 description 1
- ZWDNVDDEDBXBMD-UHFFFAOYSA-N anthracen-9-ylmethyl n,n-diethylcarbamate Chemical compound C1=CC=C2C(COC(=O)N(CC)CC)=C(C=CC=C3)C3=CC2=C1 ZWDNVDDEDBXBMD-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- BGOJVALFSNMCFD-UHFFFAOYSA-N benzoic acid;1-butylperoxybutane Chemical compound OC(=O)C1=CC=CC=C1.CCCCOOCCCC BGOJVALFSNMCFD-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- SJBHHYCVWDNTMV-UHFFFAOYSA-N butyl decaneperoxoate Chemical group CCCCCCCCCC(=O)OOCCCC SJBHHYCVWDNTMV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- IGBSAAYMSMEDQY-UHFFFAOYSA-N carboxy hydrogen carbonate;2-propan-2-ylperoxypropane Chemical compound OC(=O)OC(O)=O.CC(C)OOC(C)C IGBSAAYMSMEDQY-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- JAWGVVJVYSANRY-UHFFFAOYSA-N cobalt(3+) Chemical compound [Co+3] JAWGVVJVYSANRY-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- NFCHYERDRQUCGJ-UHFFFAOYSA-N dimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH](OC)CCCOCC1CO1 NFCHYERDRQUCGJ-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UARGAUQGVANXCB-UHFFFAOYSA-N ethanol;zirconium Chemical compound [Zr].CCO.CCO.CCO.CCO UARGAUQGVANXCB-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- TUEYHEWXYWCDHA-UHFFFAOYSA-N ethyl 5-methylthiadiazole-4-carboxylate Chemical compound CCOC(=O)C=1N=NSC=1C TUEYHEWXYWCDHA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- FWQHNLCNFPYBCA-UHFFFAOYSA-N fluoran Chemical compound C12=CC=CC=C2OC2=CC=CC=C2C11OC(=O)C2=CC=CC=C21 FWQHNLCNFPYBCA-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000003349 gelling agent Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-O guanidinium Chemical compound NC(N)=[NH2+] ZRALSGWEFCBTJO-UHFFFAOYSA-O 0.000 description 1
- IIRDTKBZINWQAW-UHFFFAOYSA-N hexaethylene glycol Chemical compound OCCOCCOCCOCCOCCOCCO IIRDTKBZINWQAW-UHFFFAOYSA-N 0.000 description 1
- FHHGCKHKTAJLOM-UHFFFAOYSA-N hexaethylene glycol monomethyl ether Chemical compound COCCOCCOCCOCCOCCOCCO FHHGCKHKTAJLOM-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 239000000413 hydrolysate Substances 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000004283 imidazolin-2-yl group Chemical group [H]N1C(*)=NC([H])([H])C1([H])[H] 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001427 mPEG Polymers 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- MKQLBNJQQZRQJU-UHFFFAOYSA-N morpholin-4-amine Chemical compound NN1CCOCC1 MKQLBNJQQZRQJU-UHFFFAOYSA-N 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 125000002757 morpholinyl group Chemical group 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920000847 nonoxynol Polymers 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920013639 polyalphaolefin Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical group 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- OQXKWNNTBOKHCC-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate 2,2,4,4-tetramethylpentaneperoxoic acid Chemical group C(C)(C)(C)CC(C(=O)OO)(C)C.C(C(C)(C)C)(=O)OOC(C)(C)C OQXKWNNTBOKHCC-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical group 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- JODJRDDQVZMRIY-UHFFFAOYSA-N trityloxyboronic acid Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(OB(O)O)C1=CC=CC=C1 JODJRDDQVZMRIY-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
- G02F2202/022—Materials and properties organic material polymeric
- G02F2202/023—Materials and properties organic material polymeric curable
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Liquid Crystal (AREA)
- Polymerisation Methods In General (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本發明是有關於一種硬化性樹脂組成物、圖像顯示裝置及圖像顯示裝置的製造方法。The present invention relates to a curable resin composition, an image display device, and a method for manufacturing an image display device.
智慧型電話(smart phone)等資訊終端機中所使用的圖像顯示裝置包括具有圖像顯示面的圖像顯示部(包含液晶面板、蓋玻璃等)、及對其進行支撐的框架部,先前,藉由利用感壓接著帶將圖像顯示部與框架部接著固定而製造。作為該感壓接著帶,為了防止因自圖像顯示部與框架部之間漏光所導致的畫質下降,一般使用具有遮光性的黑色的感壓接著帶(例如專利文獻1)。 [現有技術文獻] [專利文獻]An image display device used in an information terminal such as a smart phone includes an image display section (including a liquid crystal panel and a cover glass) having an image display surface, and a frame section for supporting the image display section. , It is manufactured by adhering the image display portion and the frame portion with a pressure-sensitive adhesive tape. As this pressure-sensitive adhesive tape, in order to prevent deterioration of image quality due to light leakage between the image display portion and the frame portion, a light-shielding black pressure-sensitive adhesive tape is generally used (for example, Patent Document 1). [Prior Art Literature] [Patent Literature]
專利文獻1:日本專利第5658072號公報Patent Document 1: Japanese Patent No. 5587072
[發明所欲解決之課題] 近年來,圖像顯示裝置中推進圖像顯示面周圍的裝飾部及遮光層的狹小化,且對該些加以支撐的圖像顯示部的框架部亦推進狹小化。因此,有圖像顯示部與框架部的接著面積狹小化的傾向。用以應對狹小化的接著面積而進行的感壓接著帶的微細加工、及感壓接著帶對狹小化的接著部位的貼合存在困難,因此擔心生產性的降低。[Problems to be Solved by the Invention] In recent years, in image display devices, the size of decorative portions and light shielding layers around the image display surface has been reduced, and the frame portions of the image display portions that support these have also been reduced. . Therefore, the bonding area between the image display portion and the frame portion tends to be smaller. Since the microfabrication of the pressure-sensitive adhesive tape to cope with the narrowed bonding area and the bonding of the pressure-sensitive adhesive tape to the narrowed bonding site are difficult, there is a concern that the productivity will decrease.
本發明的目的在於提供一種於製造圖像顯示裝置時,可用於形成遮光層的硬化性樹脂組成物,所述遮光層具有抑制自圖像顯示部與框架部之間漏光的遮光性,且即便為狹小的區域亦可有效率地形成。 [解決課題之手段]An object of the present invention is to provide a curable resin composition that can be used to form a light-shielding layer when an image display device is manufactured. The light-shielding layer has a light-shielding property that suppresses light leakage from the image display portion and the frame portion. A narrow area can also be formed efficiently. [Means for solving problems]
本發明的一側面提供一種硬化性樹脂組成物,其含有:光起始劑、單體成分、及著色劑,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體。One aspect of the present invention provides a curable resin composition including a photoinitiator, a monomer component, and a coloring agent, and the photoinitiator includes a photoradical polymerization initiator or a photoradical polymerization initiator. The initiator and the photobase generator, and the monomer component includes a monomer having one radical polymerizable group and a silanol group and / or an alkoxysilyl group.
本發明的另一側面提供一種硬化性樹脂組成物,其含有:光起始劑、單體成分、著色劑、及具有矽烷醇基及/或烷氧基矽烷基的化合物,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基的單體。Another aspect of the present invention provides a curable resin composition containing a photoinitiator, a monomer component, a colorant, and a compound having a silanol group and / or an alkoxysilyl group, and a photoinitiator. The monomer component includes a photoradical polymerization initiator, or a photoradical polymerization initiator and a photobase generator, and the monomer component includes a monomer having one radical polymerizable group.
根據本發明的硬化性樹脂組成物,可藉由於圖像顯示裝置的圖像顯示部或框架部塗佈組成物,形成框狀的硬化性樹脂層,對該硬化性樹脂層照射活性能量線後將圖像顯示部與框架部貼合這一簡便的方法,而具有抑制自圖像顯示部與框架部之間漏光的遮光性,且即便為狹小的區域亦可有效率地形成遮光層。According to the curable resin composition of the present invention, a frame-shaped curable resin layer can be formed by applying the composition to an image display portion or a frame portion of an image display device, and the curable resin layer can be irradiated with active energy rays. The simple method of bonding the image display portion and the frame portion has a light-shielding property that suppresses light leakage from the image display portion and the frame portion, and can efficiently form a light-shielding layer even in a narrow area.
關於發揮所述效果的理由,本發明者等人認為如下。本發明的硬化性樹脂組成物藉由具有所述構成,而可繼利用自由基聚合性基的光自由基聚合而生成聚合物鏈之後,進行可由鹼促進的、利用由濕氣(水分)所引起的矽烷醇基及/或烷氧基矽烷基的離子反應(水解反應)來進行的硬化性樹脂層的硬化反應。並且,離子反應以與自由基聚合反應相比相對較慢的反應速度進行。本發明者等人認為:藉由此種延遲硬化,具有遮光性的硬化性樹脂層可藉由活性能量線的照射而形成如下遮光層,該遮光層可兼具適於貼合的彈性係數與貼合後的充分的硬化率、可獲得即便為微細的接著面亦可抑制因落下衝擊及構成圖像顯示裝置的構件(例如撓性配線基板(撓性印刷電路(Flexible Printed Circuit,FPC)))的斥力等所導致的剝離及浮起的接著力、漏光的防止性優異。The reason why the above-mentioned effects are exhibited is considered by the present inventors as follows. The curable resin composition of the present invention has the above-mentioned structure, and can generate a polymer chain by photoradical polymerization using a radical polymerizable group, and then can be promoted by an alkali, and can be used by moisture (water). The curing reaction of the curable resin layer is caused by the ion reaction (hydrolysis reaction) of the silanol group and / or the alkoxysilyl group. In addition, the ion reaction proceeds at a relatively slower reaction rate than the radical polymerization reaction. The inventors believe that by such delayed hardening, a hardening resin layer having a light-shielding property can be irradiated with active energy rays to form a light-shielding layer which can have both an elastic coefficient suitable for bonding and Sufficient curing rate after lamination to obtain a member that can suppress the impact of dropping due to dropping even if it is a fine bonding surface (such as a flexible wiring board (Flexible Printed Circuit (FPC)) ) The peeling and floating adhesion caused by the repulsive force, etc., and the prevention of light leakage are excellent.
所述硬化性樹脂組成物亦可更含有聚合物。若硬化性樹脂組成物含有聚合物,則被照射活性能量線後的硬化性樹脂層可容易地具有圖像顯示部與框架部的貼合變容易的感壓接著性。The curable resin composition may further contain a polymer. When the curable resin composition contains a polymer, the curable resin layer after being irradiated with an active energy ray can easily have pressure-sensitive adhesiveness which facilitates bonding of the image display portion and the frame portion.
所述硬化性樹脂組成物可為被照射活性能量線則顯現感壓接著性者。The curable resin composition may be one that exhibits pressure-sensitive adhesiveness when irradiated with active energy rays.
所述硬化性樹脂組成物可為藉由下述方法而求出的感壓性接著力為10 N/cm2 以上。 於寬度25 mm、長度75 mm、厚度1 mm的第1玻璃基材上塗佈硬化性樹脂組成物,以硬化性樹脂層的長度方向與第1玻璃基材的長邊正交的方式設置寬度0.6 mm、長度25 mm、膜厚50 μm的硬化性樹脂層,以照射強度3000 mW/cm2 且以總照射量成為5000 mJ/cm2 的方式對硬化性樹脂層照射波長365 nm的光,於自光照射起一分鐘以內的硬化性樹脂層上,以第1玻璃基材的長邊與第2玻璃基材的長邊自鉛垂方向觀察一致的方式配置寬度25 mm、長度75 mm、厚度1 mm的第2玻璃基材,施加1 N的負荷10秒鐘來進行貼合,從而獲得測定樣品。於自貼合起1小時以內,對將測定樣品的第1玻璃基材及第2玻璃基材彼此向相反的長邊方向拉離時的試驗力進行測定,將該試驗力除以硬化性樹脂層與第2玻璃基材的接觸面積所得的值設為感壓性接著力。The curable resin composition may have a pressure-sensitive adhesive force determined by the following method of 10 N / cm 2 or more. A curable resin composition was applied to a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and the width was set so that the longitudinal direction of the curable resin layer was orthogonal to the long side of the first glass substrate. The curable resin layer with a length of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm was irradiated with light at a wavelength of 365 nm so that the irradiation intensity was 3000 mW / cm 2 and the total irradiation amount was 5000 mJ / cm 2 . Place a width of 25 mm, a length of 75 mm, on the curable resin layer within one minute from the light irradiation so that the long side of the first glass substrate and the long side of the second glass substrate are aligned from the vertical direction. A second glass substrate having a thickness of 1 mm was bonded by applying a load of 1 N for 10 seconds to obtain a measurement sample. Measure the test force when the first glass substrate and the second glass substrate of the measurement sample are pulled away from each other in the opposite long side direction within 1 hour from the bonding, and divide the test force by the curable resin. The value obtained by the contact area between the layer and the second glass substrate was set as a pressure-sensitive adhesive force.
所述硬化性樹脂組成物可為藉由下述方法而求出的縱橫比(aspect ratio)為0.4以上。 於寬度25 mm、長度75 mm、厚度1 mm的第1玻璃基材上塗佈硬化性樹脂組成物,以硬化性樹脂層的長度方向與第1玻璃基材的長邊正交的方式設置寬度0.6 mm、長度25 mm、膜厚50 μm的硬化性樹脂層,以照射強度3000 mW/cm2 且以總照射量成為5000 mJ/cm2 的方式對硬化性樹脂層照射波長365 nm的光,於自光照射起一分鐘以內的硬化性樹脂層上,以第1玻璃基材的長邊與第2玻璃基材的長邊自鉛垂方向觀察一致的方式配置寬度25 mm、長度75 mm、厚度1 mm的第2玻璃基材,施加1 N的負荷10秒鐘來進行貼合,從而獲得測定樣品。當將測定樣品中與第2玻璃基材接觸的硬化性樹脂層的寬度設為B(單位:mm)時,將B/0.6設為縱橫比。The curable resin composition may have an aspect ratio of 0.4 or more obtained by the following method. A curable resin composition was applied to a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and the width was set so that the longitudinal direction of the curable resin layer was orthogonal to the long side of the first glass substrate. The curable resin layer with a length of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm was irradiated with light at a wavelength of 365 nm so that the irradiation intensity was 3000 mW / cm 2 and the total irradiation amount was 5000 mJ / cm 2 . Place a width of 25 mm, a length of 75 mm, on the curable resin layer within one minute from the light irradiation so that the long side of the first glass substrate and the long side of the second glass substrate are aligned from the vertical direction. A second glass substrate having a thickness of 1 mm was bonded by applying a load of 1 N for 10 seconds to obtain a measurement sample. When the width of the curable resin layer in contact with the second glass substrate in the measurement sample is set to B (unit: mm), B / 0.6 is set to the aspect ratio.
本發明的硬化性樹脂組成物可用於遮光層形成用途。換言之,本發明是有關於一種硬化性樹脂組成物的應用,用於形成遮光層,所述硬化性樹脂組成物含有:光起始劑、單體成分、及著色劑,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體。另外,本發明是有關於一種硬化性樹脂組成物的應用,用於形成遮光層,所述硬化性樹脂組成物含有:光起始劑、單體成分、著色劑、及具有矽烷醇基及/或烷氧基矽烷基的化合物,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基的單體。另外,本發明是有關於一種硬化性樹脂組成物的硬化物的應用,用作遮光層,所述硬化性樹脂組成物含有:光起始劑、單體成分、及著色劑,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體。另外,本發明是有關於一種硬化性樹脂組成物的硬化物的應用,用作遮光層,所述硬化性樹脂組成物含有:光起始劑、單體成分、著色劑、及具有矽烷醇基及/或烷氧基矽烷基的化合物,且光起始劑包含光自由基聚合起始劑、或者包含光自由基聚合起始劑及光鹼產生劑,單體成分包含具有一個自由基聚合性基的單體。The curable resin composition of the present invention can be used for forming a light-shielding layer. In other words, the present invention relates to an application of a curable resin composition for forming a light-shielding layer. The curable resin composition contains: a photoinitiator, a monomer component, and a coloring agent, and the photoinitiator contains The photoradical polymerization initiator, or a photoradical polymerization initiator and a photobase generator, and the monomer component includes a monomer having one radical polymerizable group and a silanol group and / or an alkoxysilyl group. In addition, the present invention relates to an application of a curable resin composition for forming a light-shielding layer. The curable resin composition contains a photoinitiator, a monomer component, a colorant, and a silanol group and / Or an alkoxysilyl compound, and the photoinitiator contains a photoradical polymerization initiator, or a photoradical polymerization initiator and a photobase generator, and the monomer component includes a radical polymerizable group monomer. In addition, the present invention relates to the use of a cured product of a curable resin composition for use as a light-shielding layer. The curable resin composition contains: a photoinitiator, a monomer component, and a coloring agent; The agent includes a photoradical polymerization initiator, or a photoradical polymerization initiator and a photobase generator. The monomer component includes a monomer having a radical polymerizable group and a silanol group and / or an alkoxysilyl group. body. In addition, the present invention relates to the use of a cured product of a curable resin composition as a light-shielding layer. The curable resin composition includes a photoinitiator, a monomer component, a colorant, and a silanol group. And / or an alkoxysilyl compound, and the photoinitiator includes a photoradical polymerization initiator, or a photoradical polymerization initiator and a photobase generator, and the monomer component includes one radical polymerizable Monomer.
本發明的又一側面提供一種圖像顯示裝置,其具備:圖像顯示部,包括具有圖像顯示面的液晶面板、及具有與圖像顯示面對向的透光部的罩構件;框架部,設置於圖像顯示部的周圍、支撐圖像顯示部;以及遮光層,形成於框架部與圖像顯示部之間,且遮光層為包含所述本發明的硬化性樹脂組成物的硬化性樹脂層的硬化物。Still another aspect of the present invention provides an image display device including an image display section including a liquid crystal panel having an image display surface, a cover member having a light-transmitting section facing the image display, and a frame section. Is provided around the image display portion and supports the image display portion; and a light-shielding layer is formed between the frame portion and the image display portion, and the light-shielding layer is made of the curability of the curable resin composition of the present invention Hardened product of resin layer.
本發明的又一側面提供一種方法,其為製造圖像顯示裝置的方法,所述圖像顯示裝置具備:圖像顯示部,包括具有圖像顯示面的液晶面板、及具有與圖像顯示面對向的透光部的罩構件;框架部,設置於圖像顯示部的周圍、支撐圖像顯示部;以及遮光層,形成於框架部與圖像顯示部之間,所述方法依序包括:於圖像顯示部或框架部塗佈所述本發明的硬化性樹脂組成物,形成框狀的硬化性樹脂層的步驟;藉由對硬化性樹脂層照射活性能量線,而進行硬化性樹脂層的硬化反應的步驟;以及使硬化性樹脂層介入的同時將圖像顯示部與框架部貼合的步驟,且所述遮光層為進行了硬化反應的所述硬化性樹脂層。Yet another aspect of the present invention provides a method for manufacturing an image display device, the image display device including: an image display section including a liquid crystal panel having an image display surface and having an image display surface A cover member of an opposite light transmitting portion; a frame portion provided around the image display portion and supporting the image display portion; and a light shielding layer formed between the frame portion and the image display portion, the method sequentially including : A step of applying the curable resin composition of the present invention to an image display portion or a frame portion to form a frame-shaped curable resin layer; irradiating the curable resin layer with active energy rays to perform a curable resin A step of curing reaction of the layer; and a step of bonding the image display portion and the frame portion while interposing the curable resin layer, and the light-shielding layer is the curable resin layer that undergoes a curing reaction.
根據本發明的圖像顯示裝置的製造方法,可效率良好地製造具備即便為狹小的區域亦可充分抑制自圖像顯示部與框架部之間漏光的遮光層的圖像顯示裝置。According to the method of manufacturing an image display device of the present invention, it is possible to efficiently manufacture an image display device including a light shielding layer that can sufficiently suppress light leakage between the image display portion and the frame portion even in a narrow area.
所述方法中,將所述圖像顯示部與所述框架部貼合時的所述硬化性樹脂層可具有感壓接著性。In the method, the curable resin layer when the image display portion is bonded to the frame portion may have pressure-sensitive adhesiveness.
所述方法中,亦可以下述式所表示的縱橫比成為0.4以上的方式將所述圖像顯示部與所述框架部貼合。 縱橫比=B'/A' [式中,A'表示塗佈於所述圖像顯示部及所述框架部中的其中一者的、所述框狀的硬化性樹脂層的規定部位的寬度,B'表示將所述圖像顯示部與所述框架部貼合後的、所述硬化性樹脂層的所述規定部位的與所述圖像顯示部及所述框架部中的另一者接觸的寬度]In the method, the image display portion and the frame portion may be bonded together so that the aspect ratio represented by the following formula becomes 0.4 or more. Aspect ratio = B '/ A' [wherein A 'represents a width of a predetermined portion of the frame-shaped curable resin layer applied to one of the image display portion and the frame portion. , B 'represents the other of the predetermined portion of the curable resin layer and the image display portion and the frame portion after the image display portion and the frame portion are bonded together. Contact width]
所述方法亦可更包括於將圖像顯示部與框架部貼合的步驟後,進一步進行硬化性樹脂層的硬化反應的步驟。藉此,遮光層可以更高的接著力將圖像顯示部與框架部接著,進而可獲得具備漏光的防止性優異的遮光層的圖像顯示裝置。 [發明的效果]The method may further include a step of further performing a curing reaction of the curable resin layer after the step of bonding the image display portion and the frame portion. Thereby, the light-shielding layer can adhere the image display portion and the frame portion with a higher adhesive force, and an image display device having a light-shielding layer excellent in light leakage prevention can be obtained. [Effect of the invention]
根據本發明的一側面,可提供一種於製造圖像顯示裝置時,可用於形成遮光層的硬化性樹脂組成物,所述遮光層具有抑制自圖像顯示部與框架部之間漏光的遮光性,且即便為狹小的區域亦可有效率地形成。According to one aspect of the present invention, a curable resin composition that can be used to form a light-shielding layer when an image display device is manufactured, and the light-shielding layer has a light-shielding property that suppresses light leakage between the image display portion and the frame portion. , And can be efficiently formed even in a narrow area.
以下,視情況參照圖式對本發明的實施形態進行詳細說明。圖式中,對同一或相當部分標注同一符號,有時會省略重覆的說明。上下左右等位置關係只要無特別說明則設為基於圖式所示的位置關係者。圖式的尺寸比率並不限於圖示的比率。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In the drawings, the same or corresponding parts are marked with the same symbols, and repeated explanations may be omitted. Positional relationships such as up, down, left, right, etc. are assumed to be based on positional relationships shown in the drawings unless otherwise specified. The dimensional ratios of the drawings are not limited to the ratios shown in the drawings.
本說明書中,所謂「(甲基)丙烯酸酯」是指「丙烯酸酯」及與其對應的「甲基丙烯酸酯」。同樣地,所謂「(甲基)丙烯酸基」是指「丙烯酸基」及與其對應的「甲基丙烯酸基」,所謂「(甲基)丙烯醯基」是指「丙烯醯基」及與其對應的「甲基丙烯醯基」。In this specification, "(meth) acrylate" means "acrylate" and the corresponding "methacrylate". Similarly, the so-called "(meth) acrylic group" means "acrylic group" and its corresponding "methacryl group", and the so-called "(meth) acryl group" means "acryl group" and its corresponding "Methacryl group".
本實施形態的第1硬化性樹脂組成物可含有:光起始劑(以下亦稱為「(A)成分」)、單體成分(以下亦稱為「(B)成分」)、及著色劑(以下亦稱為「(C)成分」),且單體成分包含具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體(以下亦稱為「(B1)成分」)。The first curable resin composition of this embodiment may contain a photoinitiator (hereinafter also referred to as "(A) component"), a monomer component (hereinafter also referred to as "(B) component"), and a coloring agent. (Hereinafter also referred to as "(C) component"), and the monomer component includes a monomer having one radically polymerizable group and a silanol group and / or an alkoxysilyl group (hereinafter also referred to as "(B1) component ").
本實施形態的第2硬化性樹脂組成物可含有:光起始劑、單體成分、著色劑、及具有矽烷醇基及/或烷氧基矽烷基的化合物(以下亦稱為「(D)成分」),且單體成分包含具有一個自由基聚合性基的單體(以下亦稱為「(B2)成分」)。The second curable resin composition of this embodiment may contain a photoinitiator, a monomer component, a colorant, and a compound having a silanol group and / or an alkoxysilyl group (hereinafter also referred to as "(D) Component "), and the monomer component includes a monomer having one radically polymerizable group (hereinafter also referred to as" (B2) component ").
(A)成分:光起始劑 光起始劑可包含光自由基聚合起始劑(以下亦稱為「(A1)成分」)、或者包含光自由基聚合起始劑及光鹼產生劑(以下亦稱為「(A2)成分」)。(A) Component: Photoinitiator The photoinitiator may include a photoradical polymerization initiator (hereinafter also referred to as "(A1) component"), or a photoradical polymerization initiator and a photobase generator ( Hereinafter also referred to as "(A2) component").
作為(A1)成分的光自由基聚合起始劑是藉由活性能量線的照射而產生游離自由基,並促進利用單體成分的自由基聚合來進行的硬化反應(聚合反應)的成分。此處,活性能量線可自紫外線、電子束、α射線、β射線等中選擇。The photoradical polymerization initiator as the component (A1) is a component that generates free radicals by irradiation with active energy rays and promotes a hardening reaction (polymerization reaction) by radical polymerization of a monomer component. Here, the active energy ray can be selected from ultraviolet rays, electron beams, α rays, β rays, and the like.
作為光自由基聚合起始劑的具體例,可列舉:二苯甲酮、N,N'-四甲基-4,4'-二胺基二苯甲酮(米其勒酮)、N,N-四乙基-4,4'-二胺基二苯甲酮、4-甲氧基-4,4'-二甲基胺基二苯甲酮、α-羥基異丁基苯酮、2-乙基蒽醌、第三丁基蒽醌、1,4-二甲基蒽醌、1-氯蒽醌、2,3-二氯蒽醌、3-氯-2-甲基蒽醌、1,2-苯并蒽醌、2-苯基蒽醌、1,4-萘醌、9,10-菲醌、噻噸酮、2-氯噻噸酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、2,2-二乙氧基苯乙酮等芳香族酮化合物;安息香、甲基安息香、乙基安息香等安息香化合物;安息香甲醚、安息香乙醚、安息香異丁醚、安息香苯醚等安息香醚化合物;苯偶醯、苯偶醯二甲基縮酮等苯偶醯化合物;β-(吖啶-9-基)(甲基)丙烯酸等酯化合物;9-苯基吖啶、9-吡啶吖啶、1,7-二吖啶基庚烷等吖啶化合物;2-(鄰氯苯基)-4,5-二苯基咪唑二聚物、2-(鄰氯苯基)-4,5-二(間甲氧基苯基)咪唑二聚物、2-(鄰氟苯基)-4,5-二苯基咪唑二聚物、2-(鄰甲氧基苯基)-4,5-二苯基咪唑二聚物、2-(對甲氧基苯基)-4,5-二苯基咪唑二聚物、2,4-二(對甲氧基苯基)-5-苯基咪唑二聚物、2-(2,4-二甲氧基苯基)-4,5-二苯基咪唑二聚物、2-(對甲基巰基苯基)-4,5-二苯基咪唑二聚物等2,4,5-三芳基咪唑二聚物;2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙烷等苯烷基酮系化合物;1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基}-2-甲基-丙烷-1-酮、寡聚{2-羥基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙烷}等α-羥基苯烷基酮系化合物;苯基乙醛酸甲酯;雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基氧化膦、2,4,6-三甲基苯甲醯基-二苯基氧化膦等氧化膦系化合物。光自由基聚合起始劑可單獨使用一種,亦可組合使用兩種以上。自硬化性、反應性、及表面硬化性的觀點而言,可自芳香族酮化合物、α-羥基苯烷基酮系化合物、及苯基乙醛酸甲酯中選擇光自由基聚合起始劑。Specific examples of the photo-radical polymerization initiator include benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michlerone), N, N-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4,4'-dimethylaminobenzophenone, α-hydroxyisobutylbenzophenone, 2 -Ethylanthraquinone, third butylanthraquinone, 1,4-dimethylanthraquinone, 1-chloroanthraquinone, 2,3-dichloroanthraquinone, 3-chloro-2-methylanthraquinone, 1 2,2-benzoanthraquinone, 2-phenylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthrenequinone, thioxanthone, 2-chlorothioxanthone, 2,2-dimethoxy-1 Aromatic ketone compounds such as 2,2-diphenylethane-1-one, 2,2-diethoxyacetophenone; benzoin compounds such as benzoin, methyl benzoin, ethyl benzoin; benzoin methyl ether, benzoin ether, Benzoin ether compounds such as benzoin isobutyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, benzophenone dimethyl ketal; ester compounds such as β- (acridin-9-yl) (meth) acrylic acid; 9-phenylacridine, 9-pyridineacridine, 1,7-diacridylheptane and other acridine compounds; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2 -(O-chlorophenyl) -4,5-bis (m-methoxy) Phenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer Substance, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-bis (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methylmercaptophenyl) -4,5-diphenylimidazole dimer, etc. 2, 4,5-triarylimidazole dimer; 2-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) -1-butanone, 2-methyl-1- [4 -(Methylthio) phenyl] -2-morpholinyl-1-propane and other benzoyl ketone compounds; 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl- Propane-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propanyl) -benzyl] phenyl} -2-methyl-propane-1-one, oligomeric {2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propane} and other α-hydroxybenzoyl ketone compounds; methyl phenylglyoxylate; bis (2,4,6-trimethylbenzyl) ) -Phenylphosphine oxide, bis (2,6-dimethoxybenzylidene) -2,4,4-trimethyl-pentylphosphine oxide, 2,4 Phosphine oxide-based compounds such as, 6-trimethylbenzylidene-diphenylphosphine oxide. The photoradical polymerization initiator may be used alone or in combination of two or more. From the standpoints of hardenability, reactivity, and surface hardenability, a photoradical polymerization initiator can be selected from an aromatic ketone compound, an α-hydroxybenzoalkyl ketone compound, and methyl phenylglyoxylate .
光自由基聚合起始劑亦可為產生鹼的化合物。作為產生鹼的光自由基聚合起始劑,可列舉藉由活性能量線的照射而產生游離自由基與鹼(例如二級胺基、三級胺基)此兩者的化合物。作為此種光自由基聚合起始劑的具體例,可列舉:(4-嗎啉基苯甲醯基)-1-苄基-1-二甲基胺基丙烷(「豔佳固(IRGACURE)369」、日本巴斯夫(BASF Japan)公司製造)、4-(甲硫基苯甲醯基)-1-甲基-1-嗎啉基乙烷(「豔佳固(IRGACURE)907」、日本巴斯夫公司製造)、2-(二甲基胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-嗎啉基)苯基]-1-丁烷(「豔佳固(IRGACURE)379」、日本巴斯夫公司製造)等α-胺基苯乙酮化合物;「CGI-325」、「豔佳固(IRGACURE)OXE01」、「豔佳固(IRGACURE)OXE02」(以上為日本巴斯夫公司製造),「N-1919」、「NCI-831」(以上為艾迪科(Adeka)公司製造)等肟酯化合物。該些中,可選擇α-胺基苯乙酮化合物。產生鹼的光自由基聚合起始劑可單獨使用一種,亦可組合使用兩種以上。The photoradical polymerization initiator may be a compound that generates a base. Examples of the photoradical polymerization initiator that generates a base include compounds that generate both a free radical and a base (for example, a secondary amine group and a tertiary amine group) upon irradiation with active energy rays. Specific examples of such a photo-radical polymerization initiator include (4-morpholinylbenzyl) -1-benzyl-1-dimethylaminopropane ("IRGACURE" 369 ", manufactured by BASF Japan), 4- (methylthiobenzyl) -1-methyl-1-morpholinylethane (" IRGACURE "907", BASF Japan (Manufactured by the company), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butane ( Α-Aminoacetophenone compounds such as "IRGACURE 379", manufactured by BASF Japan; "CGI-325", "IRGACURE OXE01", "IRGACURE OXE02" (The above are manufactured by BASF Japan), "N-1919", "NCI-831" (the above are manufactured by Adeka) and other oxime ester compounds. Among these, an α-aminoacetophenone compound can be selected. The photoradical polymerization initiator which generates a base may be used alone, or two or more kinds may be used in combination.
光自由基聚合起始劑可單獨使用一種,亦可組合使用兩種以上。The photoradical polymerization initiator may be used alone or in combination of two or more.
自感壓接著性、可靠性、及硬化性的觀點以及有效率地促進硬化反應的觀點而言,相對於硬化性樹脂組成物的總量,硬化性樹脂組成物中的(A1)成分的含量可為2質量%以上、4質量%以上、或6質量%以上,且可為14質量%以下、12質量%以下、或10質量%以下。The content of the component (A1) in the curable resin composition relative to the total amount of the curable resin composition from the viewpoints of pressure-sensitive adhesiveness, reliability, and hardenability, and a viewpoint of efficiently promoting a curing reaction. It may be 2 mass% or more, 4 mass% or more, or 6 mass% or more, and may be 14 mass% or less, 12 mass% or less, or 10 mass% or less.
作為(A2)成分的光鹼產生劑可列舉藉由活性能量線的照射而分子結構發生變化、或分子開裂,生成可作為矽烷醇基及/或烷氧基矽烷基的離子反應的硬化觸媒而發揮功能的一種以上的鹼性物質的化合物。作為此種光鹼產生劑,亦可自Co-胺錯合物系光鹼產生劑;胺基甲酸酯(carbamic acid ester)系光鹼產生劑;四級銨鹽系光鹼產生劑;具有醯氧基亞胺基、N-甲醯基化芳香族胺基、N-醯基化芳香族胺基、硝基苄基胺基甲酸酯(carbamate)基、烷氧基苄基胺基甲酸酯基等的化合物等中選擇。作為光鹼產生劑的具體例,可列舉:9-蒽基甲基N,N-二乙基胺基甲酸酯(9-anthrylmethyl N,N-diethylcarbamate)、(E)-1-[3-(2-羥基苯基)-2-丙烯醯基]哌啶、2-(3-苯甲醯基苯基)丙酸胍鹽(guanidinium 2-(3-benzoylphenyl)propionate)、1-(蒽醌-2-基)咪唑甲酸乙酯、2-硝基苯基甲基4-甲基丙烯醯氧基哌啶-1-羧酸酯、1-(蒽醌-2-基)-乙基N,N-二環己基胺基甲酸酯、2-(3-苯甲醯基苯基)丙酸二環己基銨鹽、2-(3-苯甲醯基苯基)丙酸環己基銨鹽、9-蒽基甲基N,N-二環己基胺基甲酸酯、2-(3-苯甲醯基苯基)丙酸1,2-二異丙基-3-[雙(二甲基胺基)亞甲基]胍鹽、2-硝基苄基環己基胺基甲酸酯、O-胺甲醯基羥基醯胺、O-胺甲醯基肟、{[(2,6-二硝基苄基)氧基]羰基}環己基胺、雙{[(2-硝基苄基)氧基]羰基}己烷1,6-二胺、4-(甲硫基苯甲醯基)-1-甲基-1-嗎啉基乙烷、(4-嗎啉基苯甲醯基)-1-苄基-1-二甲基胺基丙烷、N-(2-硝基苄氧基羰基)吡咯啶、六胺鈷(III)三(三苯基甲基硼酸酯)、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2,6-二甲基-3,5-二乙醯基-4-(2'-硝基苯基)-1,4-二氫吡啶、2,6-二甲基-3,5-二乙醯基-4-(2',4'-二硝基苯基)-1,4-二氫吡啶。光鹼產生劑可單獨使用一種,亦可組合使用兩種以上。Examples of the photobase generator as the component (A2) include a molecular structure that is changed by irradiation with active energy rays, or molecular cracking to generate a hardening catalyst that can be used as an ionic reaction of a silanol group and / or an alkoxysilyl group. Instead, a compound that functions as one or more basic substances. As such a photobase generator, a Co-amine complex-based photobase generator; a carbamic acid ester-based photobase generator; a quaternary ammonium salt-based photobase generator; Ethoxylimino, N-formamated aromatic amine, N-formamated aromatic amine, nitrobenzylcarbamate, alkoxybenzylamino It is selected from compounds such as an acid ester group. Specific examples of the photobase generator include 9-anthrylmethyl N, N-diethylcarbamate, (E) -1- [3- (2-hydroxyphenyl) -2-propenyl] piperidine, guanidinium 2- (3-benzoylphenyl) propionate, 1- (anthraquinone) 2-yl) ethyl imidazolate, 2-nitrophenylmethyl 4-methacryloxypiperidine-1-carboxylic acid ester, 1- (anthraquinone-2-yl) -ethyl N, N-dicyclohexylcarbamate, 2- (3-benzylidenephenyl) propionic acid dicyclohexylammonium salt, 2- (3-benzylidenephenyl) propionic acid cyclohexylammonium salt, 9-Anthrylmethyl N, N-dicyclohexylcarbamate, 2- (3-benzylidenephenyl) propanoic acid 1,2-diisopropyl-3- [bis (dimethyl Amine) methylene] guanidine salt, 2-nitrobenzylcyclohexylcarbamate, O-carbamylhydroxylamine, O-carbamyloxime, {[(2,6-di Nitrobenzyl) oxy] carbonyl] cyclohexylamine, bis {[(2-nitrobenzyl) oxy] carbonyl} hexane 1,6-diamine, 4- (methylthiobenzyl) 1-methyl-1-morpholinylethane, (4-morpholinylbenzyl) -1-benzyl-1-dimethylaminopropane, N- (2-nitrobenzyloxy carbonyl Yl) pyrrolidine, cobalt (III) hexaamine tris (triphenylmethylborate), 2-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) -butanone , 2,6-dimethyl-3,5-diethylfluorenyl-4- (2'-nitrophenyl) -1,4-dihydropyridine, 2,6-dimethyl-3,5- Diethylfluorenyl-4- (2 ', 4'-dinitrophenyl) -1,4-dihydropyridine. The photobase generator may be used singly or in combination of two or more kinds.
自有效率地促進利用離子反應來進行的硬化反應的觀點而言,相對於硬化性樹脂組成物的總量,硬化性樹脂組成物中的(A2)成分的含量可為2質量%以上、4質量%以上、或6質量%以上,且可為14質量%以下、12質量%以下、或10質量%以下。From the viewpoint of efficiently promoting the curing reaction by the ionic reaction, the content of the (A2) component in the curable resin composition may be 2% by mass or more with respect to the total amount of the curable resin composition. It is at least mass%, or at least 6 mass%, and may be at most 14 mass%, at most 12 mass%, or at most 10 mass%.
(B)成分:單體成分 本實施形態的第1硬化性樹脂組成物中,單體成分可包含具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體。矽烷醇基及烷氧基矽烷基可藉由水分所參與的離子反應(水解反應)來進行硬化反應。例如,可藉由自光鹼產生劑或者產生鹼的光自由基聚合起始劑中產生的鹼來促進該反應。(B) Component: monomer component In the 1st curable resin composition of this embodiment, a monomer component may contain the monomer which has a radical polymerizable group, a silanol group, and / or an alkoxysilyl group. The silanol group and the alkoxysilyl group can undergo a hardening reaction by an ionic reaction (hydrolysis reaction) in which water is involved. For example, the reaction can be promoted by a base generated from a photobase generator or a photoradical polymerization initiator that generates a base.
作為(B1)成分所具有的自由基聚合性基,可列舉:(甲基)丙烯醯基、乙烯基、乙炔基、異丙烯基、乙烯基醚基及乙烯基硫醚基。作為(B1)成分,例如可列舉:3-丙烯醯氧基丙基三甲氧基矽烷(商品名:KBM5103、信越化學股份有限公司)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(商品名:KBM503、信越化學股份有限公司)、甲基丙烯醯氧基辛基三甲氧基矽烷(商品名:KBM5803、信越化學股份有限公司)等具有(甲基)丙烯醯基與三烷氧基矽烷基的化合物。另外,(B3)成分亦可為如甲基丙烯醯氧基丙基甲基二乙氧基矽烷般的具有(甲基)丙烯醯基與二烷氧基矽烷基的化合物。Examples of the radical polymerizable group included in the component (B1) include a (meth) acrylfluorenyl group, a vinyl group, an ethynyl group, an isopropenyl group, a vinyl ether group, and a vinyl sulfide group. Examples of the component (B1) include 3-propenyloxypropyltrimethoxysilane (trade name: KBM5103, Shin-Etsu Chemical Co., Ltd.), and 3-methacryloxypropyltrimethoxysilane ( Trade name: KBM503, Shin-Etsu Chemical Co., Ltd.), methacryloxy octyl trimethoxysilane (trade name: KBM5803, Shin-Etsu Chemical Co., Ltd.), etc. (Meth) acryl fluorenyl and trialkoxy Silyl compounds. The (B3) component may be a compound having a (meth) acrylfluorenyl group and a dialkoxysilyl group, such as methacryloxypropylmethyldiethoxysilane.
(B1)成分可單獨使用一種,或者組合使用兩種以上。(B1) A component may be used individually by 1 type, or may use 2 or more types together.
自反應性的觀點、提升接著力的觀點、以及硬化性樹脂組成物為溶液時的穩定性的觀點而言,相對於硬化性樹脂組成物的總量,(B1)成分的含量可為0.1質量%以上、1質量%以上、或3質量%以上,且可為15質量%以下、10質量%以下、或5質量%以下。From the viewpoint of reactivity, the viewpoint of improving the adhesive force, and the viewpoint of stability when the curable resin composition is a solution, the content of the component (B1) may be 0.1 mass relative to the total amount of the curable resin composition. % Or more, 1 mass% or more, or 3 mass% or more, and may be 15 mass% or less, 10 mass% or less, or 5 mass% or less.
作為(B2)成分,可列舉具有一個自由基聚合性基的單官能單體。作為單體成分所具有的自由基聚合性基,可列舉:(甲基)丙烯醯基、乙烯基、乙炔基、異丙烯基、乙烯基醚基及乙烯基硫醚基。單官能單體可為具有(甲基)丙烯醯基的化合物。Examples of the (B2) component include a monofunctional monomer having one radical polymerizable group. Examples of the radical polymerizable group which the monomer component has include a (meth) acrylfluorenyl group, a vinyl group, an ethynyl group, an isopropenyl group, a vinyl ether group, and a vinyl sulfide group. The monofunctional monomer may be a compound having a (meth) acrylfluorenyl group.
具有(甲基)丙烯醯基的單官能單體可為(甲基)丙烯酸烷基酯,自對硬化性樹脂組成物賦予柔軟性的觀點而言,該情況下的烷基的碳數可為4以上、6以上、或8以上,且可為20以下、18以下、或16以下。(甲基)丙烯酸烷基酯的烷基亦可具有羥基等取代基。The monofunctional monomer having a (meth) acrylfluorenyl group may be an alkyl (meth) acrylate, and from the viewpoint of imparting flexibility to a curable resin composition, the carbon number of the alkyl group in this case may be 4 or more, 6 or more, or 8 or more, and may be 20 or less, 18 or less, or 16 or less. The alkyl group of the alkyl (meth) acrylate may have a substituent such as a hydroxyl group.
作為具有(甲基)丙烯醯基的單官能單體的具體例,可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十三烷基酯等(甲基)丙烯酸烷基酯;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸1-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸1-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸1-羥基丁酯等含羥基的(甲基)丙烯酸烷基酯;二甲基(甲基)丙烯醯胺、異丙基(甲基)丙烯醯胺、二甲基胺基丙基(甲基)丙烯醯胺等(甲基)丙烯醯胺;羥基乙基(甲基)丙烯醯胺等含羥基的(甲基)丙烯醯胺;二乙二醇、三乙二醇等聚乙二醇單(甲基)丙烯酸酯;二丙二醇單(甲基)丙烯酸酯、三丙二醇單(甲基)丙烯酸酯等聚丙二醇單(甲基)丙烯酸酯;二丁二醇單(甲基)丙烯酸酯、三丁二醇單(甲基)丙烯酸酯等聚丁二醇單(甲基)丙烯酸酯;丙烯醯基嗎啉等含嗎啉基的(甲基)丙烯酸酯;(甲基)丙烯酸二環戊基酯、(甲基)丙烯酸二環戊烯氧基乙酯、甲基丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異冰片酯。該些化合物可單獨使用,亦可組合使用兩種以上。自染料的溶解性、接著力、耐濕熱可靠性及硬化後的感壓接著性的觀點而言,單官能單體可包含選自(甲基)丙烯酸二環戊基酯、(甲基)丙烯酸二環戊烯基酯、及(甲基)丙烯酸異冰片酯中的化合物,或者選自(甲基)丙烯酸二環戊烯基酯、及(甲基)丙烯酸異冰片酯中的化合物。Specific examples of the monofunctional monomer having a (meth) acrylfluorenyl group include n-butyl (meth) acrylate, third butyl (meth) acrylate, isobutyl (meth) acrylate, ( N-amyl methacrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, (methyl ) Alkyl (meth) acrylates such as n-hexyl acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, and tridecyl (meth) acrylate; 2-hydroxy (meth) acrylate Ethyl ester, 1-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 1-hydroxypropyl (meth) acrylate, (methyl ) Hydroxyl-containing (meth) acrylates such as 4-hydroxybutyl acrylate, 3-hydroxybutyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 1-hydroxybutyl (meth) acrylate Esters; (meth) acrylamide, such as dimethyl (meth) acrylamide, isopropyl (meth) acrylamide, dimethylaminopropyl (meth) acrylamide; hydroxyethyl Hydroxy-containing (methyl) ) Acrylamide; polyethylene glycol mono (meth) acrylates such as diethylene glycol and triethylene glycol; polypropylene glycol mono (meth) acrylates such as dipropylene glycol mono (meth) acrylate and tripropylene glycol mono (meth) acrylate (Meth) acrylates; polybutylene glycol mono (meth) acrylates such as dibutyl glycol mono (meth) acrylate, tributyl glycol mono (meth) acrylate, etc. Morpholinyl (meth) acrylates; dicyclopentyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentenyl ethyl methacrylate, (methyl Based) isobornyl acrylate. These compounds may be used alone or in combination of two or more. From the viewpoints of the solubility of the dye, adhesion, moist heat resistance reliability, and pressure-sensitive adhesiveness after hardening, the monofunctional monomer may include a dicyclopentyl (meth) acrylate, (meth) acrylic acid A compound selected from the group consisting of dicyclopentenyl ester and isobornyl (meth) acrylate, or a compound selected from dicyclopentenyl (meth) acrylate and isobornyl (meth) acrylate.
(B2)成分可單獨使用一種,亦可組合使用兩種以上。(B2) A component may be used individually by 1 type, and may use 2 or more types together.
本實施形態的第1硬化性樹脂組成物中,(B)成分可除(B1)成分以外亦包含一種以上的(B2)成分。再者,本實施形態的第1硬化性樹脂組成物中,(B2)成分為(B1)成分以外的化合物。In the first curable resin composition of the present embodiment, the component (B) may include one or more components (B2) in addition to the component (B1). In the first curable resin composition of the present embodiment, the (B2) component is a compound other than the (B1) component.
自獲得具有適度的黏度的硬化性樹脂組成物的觀點、調整硬化收縮率及硬化物的彈性係數的觀點、以及著色劑的溶解性的觀點而言,相對於硬化性樹脂組成物的總量,(B2)成分的含量可為10質量%以上、15質量%以上、或20質量%以上,且可為80質量%以下、70質量%以下、或60質量%以下。若(B2)成分的含量為10質量%以上,則容易獲得具有有助於良好的塗佈性的適度的黏度的硬化性樹脂組成物,並且有著色劑的溶解性提升的傾向。若(B2)成分的含量為80質量%以下,則有硬化收縮率變低的傾向。若硬化收縮率低,則可抑制由應力引起的接著力的下降。From the viewpoint of obtaining a curable resin composition having a moderate viscosity, the viewpoint of adjusting the cure shrinkage and the elastic coefficient of the cured product, and the viewpoint of the solubility of the colorant, the total amount of the curable resin composition is, (B2) The content of the component may be 10% by mass or more, 15% by mass or more, or 20% by mass or more, and may be 80% by mass or less, 70% by mass or less, or 60% by mass or less. When the content of the (B2) component is 10% by mass or more, a curable resin composition having a moderate viscosity that contributes to good coatability is easily obtained, and the solubility of the colorant tends to be improved. When the content of the (B2) component is 80% by mass or less, the curing shrinkage rate tends to be low. When the curing shrinkage rate is low, a decrease in the adhesive force due to stress can be suppressed.
(B)成分的單體成分亦可更包含具有兩個以上的自由基聚合性基的多官能單體。該情況下,相對於單體成分((B)成分)的總量,多官能單體的含量可為5質量%以下。The monomer component of the component (B) may further include a polyfunctional monomer having two or more radical polymerizable groups. In this case, the content of the polyfunctional monomer may be 5% by mass or less based on the total amount of the monomer component ((B) component).
(C)成分:著色劑 著色劑是對硬化性樹脂組成物及遮光層進行著色,對所形成的遮光層賦予適當的遮光性的成分。著色劑的色相並無特別限制,可使用具有各種色相的著色劑,但著色劑典型而言呈黑色。著色劑例如可包含染料、及/或顏料。自獲得均勻的硬化性樹脂組成物的觀點而言,可選擇溶解於單體成分中的著色劑。(C) Component: Colorant A colorant is a component which colors a curable resin composition and a light-shielding layer, and provides a suitable light-shielding property to the formed light-shielding layer. The hue of the colorant is not particularly limited, and a colorant having various hue can be used, but the colorant is typically black. The colorant may include, for example, a dye and / or a pigment. From the viewpoint of obtaining a uniform curable resin composition, a coloring agent dissolved in a monomer component can be selected.
著色劑溶解於單體成分中可藉由以下方法來確認。於50 mL的燒杯中加入單體成分10 mL(溫度25℃)及著色劑10 mg(固體成分質量),使用玻璃棒攪拌1分鐘。然後,於目視無法確認到著色劑的固體成分的情況下,判斷為該著色劑溶解於單體成分中。The dissolution of the colorant in the monomer component can be confirmed by the following method. In a 50 mL beaker, add 10 mL of monomer component (temperature 25 ° C) and 10 mg of coloring agent (solid content mass), and stir with a glass rod for 1 minute. Then, when the solid content of the colorant cannot be visually confirmed, it is determined that the colorant is dissolved in the monomer component.
自遮光性的觀點而言,著色劑的可見光的平均透射率可為50%以下、45%以下、或40%以下。此處,所謂可見光的平均透射率,是指波長400 nm~700 nm的光的平均透射率。可見光的平均透射率可藉由以下方法來測定:使用分光測色計(例如柯尼卡美能達(Konica Minolta)股份有限公司製造的「CM-3700A」),於400 nm~700 nm的範圍以1 nm為單位來測定包含溶解著色劑的溶劑100質量份與著色劑0.1質量份的著色劑溶液的透光率,求出所獲得的各測定值的平均值,作為平均透射率。著色劑溶解於溶劑中可藉由與所述「著色劑溶解於單體成分中」相同的方法來確認。From the viewpoint of light-shielding properties, the average transmittance of visible light of the colorant may be 50% or less, 45% or less, or 40% or less. Here, the average transmittance of visible light refers to the average transmittance of light having a wavelength of 400 nm to 700 nm. The average transmittance of visible light can be measured by using a spectrophotometer (such as "CM-3700A" manufactured by Konica Minolta Co., Ltd.) in the range of 400 nm to 700 nm. The light transmittance of the toner solution containing 100 parts by mass of the solvent in which the colorant was dissolved and 0.1 part by mass of the colorant was measured in units of 1 nm, and the average value of each obtained measurement value was determined as the average transmittance. The dissolution of the colorant in the solvent can be confirmed by the same method as the "colorant is dissolved in the monomer component".
為了進行硬化反應而照射的光(活性能量線)的峰值波長下的著色劑的透光率(以下亦稱為「照射透射率」)可較可見光的平均透射率高10%以上、20%以上、30%以上。照射光透射率可為60%以上、65%以上、或70%以上。藉由使用具有高照射光透射率的著色劑,可於確保充分的遮光性的同時,有效率地進行利用光自由基聚合來進行的硬化反應。著色劑的照射光透射率可藉由以下方法來決定:於分解波長為1 nm的條件下,對包含溶解著色劑的溶劑100質量份與著色劑0.1質量份的著色劑溶液的、為了進行硬化反應而照射的光(活性能量線)的峰值波長下的著色劑的透光率進行測定。作為測定裝置,可使用可見紫外分光光度計(例如島津製作所股份有限公司製造的「UV-2400PC」)。測定範圍例如設定為300 nm~780 nm。The light transmittance (hereinafter also referred to as "irradiation transmittance") of the toner at the peak wavelength of light (active energy ray) irradiated for the curing reaction may be 10% or more and 20% or more than the average transmittance of visible light 30% or more. The irradiation light transmittance may be 60% or more, 65% or more, or 70% or more. By using a coloring agent having a high light transmittance, it is possible to efficiently perform a curing reaction by photoradical polymerization while ensuring sufficient light shielding properties. The light transmittance of the colorant can be determined by a method for curing the colorant solution containing 100 parts by mass of a solvent in which the colorant is dissolved and 0.1 part by mass of the colorant under a condition of a decomposition wavelength of 1 nm. The light transmittance of the toner at the peak wavelength of the light (active energy ray) irradiated by the reaction was measured. As a measuring device, a visible ultraviolet spectrophotometer (for example, "UV-2400PC" manufactured by Shimadzu Corporation) can be used. The measurement range is set to, for example, 300 nm to 780 nm.
著色劑例如可包含選自由酞青藍(phthalocyanine blue)、酞青綠、碘綠(iodine green)、二偶氮黃、苯胺黑、苝黑(perylene black)、及螢光黃母體(fluoran)所組成的群組中的至少一種。The colorant may include, for example, a member selected from the group consisting of phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, aniline black, perylene black, and fluoran. At least one of the group.
自獲得將可見光遮光的效果的觀點而言,相對於硬化性樹脂組成物的總量,著色劑的含量可為0.1質量%以上、0.3質量%以上、或0.5質量%以上,且可為10質量%以下、7.5質量%以下、或5質量%以下。From the viewpoint of obtaining an effect of blocking visible light, the content of the colorant may be 0.1% by mass or more, 0.3% by mass or more, or 0.5% by mass or more with respect to the total amount of the curable resin composition, and may be 10% by mass. % Or less, 7.5% by mass or less, or 5% by mass or less.
作為(D)成分,例如可列舉:具有羧酸酐基與三甲氧基矽烷基的化合物(例如「X-12-967C」,信越化學(股)製造)、具有異氰脲酸酯基與三甲氧基矽烷基的化合物(例如「KBM9659」,信越化學(股)製造)、具有環氧基與三甲氧基矽烷基的化合物(例如「KBM403」,信越化學(股)製造)、具有巰基與三甲氧基矽烷基的化合物(例如「KBM803」,信越化學(股)製造)等具有三烷氧基矽烷基的化合物;二甲基二甲氧基矽烷、3-縮水甘油氧基丙基二甲氧基矽烷、3-巰基丙基甲基二甲氧基矽烷等具有二烷氧基矽烷基的化合物;四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷等四烷氧基矽烷或其寡聚物等。具有矽烷醇基及/或烷氧基矽烷基的化合物可單獨使用一種,亦可組合使用兩種以上。該些中,自提高反應性的觀點而言,可選擇具有三烷氧基矽烷基的化合物、四烷氧基矽烷或其寡聚物。自提高硬化性樹脂組成物為溶液時的穩定性的觀點而言,亦可將具有三烷氧基矽烷基的化合物、四烷氧基矽烷或其寡聚物與具有二烷氧基矽烷基的化合物組合。Examples of the component (D) include a compound having a carboxylic anhydride group and a trimethoxysilyl group (for example, "X-12-967C", manufactured by Shin-Etsu Chemical Co., Ltd.), an isocyanurate group, and trimethoxy group. Silyl-based compounds (eg "KBM9659", manufactured by Shin-Etsu Chemical Co., Ltd.), compounds having epoxy groups and trimethoxysilyl groups (eg, "KBM403", manufactured by Shin-Etsu Chemical Co., Ltd.), mercapto groups and trimethoxy groups Silyl-based compounds (such as "KBM803", manufactured by Shin-Etsu Chemical Co., Ltd.) and other compounds having trialkoxysilyl; dimethyldimethoxysilane, 3-glycidyloxypropyldimethoxy Silane, 3-mercaptopropylmethyldimethoxysilane, and other compounds having a dialkoxysilane; tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, etc. Alkoxysilanes or oligomers thereof. The compound having a silanol group and / or an alkoxysilyl group may be used alone or in combination of two or more. Among these, from the viewpoint of improving reactivity, a compound having a trialkoxysilyl group, a tetraalkoxysilane, or an oligomer thereof may be selected. From the viewpoint of improving the stability when the curable resin composition is a solution, a compound having a trialkoxysilyl group, a tetraalkoxysilane or an oligomer thereof, and a compound having a dialkoxysilyl group can also be used. Compound combination.
作為(D)成分的其他例子,可列舉:選自具有三烷氧基矽烷基的化合物、具有二烷氧基矽烷基的化合物、以及四烷氧基矽烷及其寡聚物中的至少一種化合物的部分水解物(例如四甲氧基矽烷寡聚物的部分水解物、四乙氧基矽烷與二甲基二甲氧基矽烷的部分水解物);選自具有三烷氧基矽烷基的化合物、具有二烷氧基矽烷基的化合物、以及四烷氧基矽烷及其寡聚物中的至少一種與四烷氧基鈦及/或四烷氧基鋯的反應物(例如四甲氧基矽烷寡聚物與四丁氧基鈦的反應物、四乙氧基矽烷與四丁氧基鈦的反應物、四乙氧基矽烷與四乙氧基鋯的反應物)等。該些可單獨使用一種,亦可組合使用兩種以上。該些中,自提高反應性的觀點而言,可選擇選自具有三烷氧基矽烷基的化合物、具有二烷氧基矽烷基的化合物、以及四烷氧基矽烷及其寡聚物中的至少一種化合物的部分水解物。(D)成分亦可為具有矽烷醇基及/或烷氧基矽烷基的寡聚物。Other examples of the component (D) include at least one compound selected from the group consisting of a compound having a trialkoxysilyl group, a compound having a dialkoxysilyl group, and a tetraalkoxysilane and an oligomer thereof. Partial hydrolysates (such as partial hydrolysates of tetramethoxysilane oligomers, partial hydrolysates of tetraethoxysilane and dimethyldimethoxysilane); selected from compounds having trialkoxysilyl groups , A compound having a dialkoxysilyl group, and a reaction product of at least one of the tetraalkoxysilane and its oligomer with a tetraalkoxytitanium and / or a tetraalkoxyzirconium (for example, tetramethoxysilane Reactants of oligomers and tetrabutoxytitanium, reactants of tetraethoxysilane and tetrabutoxytitanium, reactants of tetraethoxysilane and tetraethoxyzirconium) and the like. These may be used alone or in combination of two or more. Among these, from the viewpoint of improving reactivity, a compound selected from a compound having a trialkoxysilyl group, a compound having a dialkoxysilyl group, and a tetraalkoxysilane and an oligomer thereof may be selected. A partial hydrolysate of at least one compound. The component (D) may be an oligomer having a silanol group and / or an alkoxysilyl group.
(D)成分可單獨使用一種,亦可組合使用兩種以上。(D) A component may be used individually by 1 type, and may use 2 or more types together.
自反應性的觀點、提升接著力的觀點、以及硬化性樹脂組成物為溶液時的穩定性的觀點而言,相對於硬化性樹脂組成物的總量,本實施形態的第2硬化性樹脂組成物中的(D)成分的含量可為1質量%以上、5質量%以上、或10質量%以上,且可為70質量%以下、50質量%以下、或30質量%以下。From the viewpoint of reactivity, the viewpoint of improving adhesion, and the viewpoint of stability when the curable resin composition is a solution, the second curable resin composition of the present embodiment is relative to the total amount of the curable resin composition. The content of the (D) component may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and may be 70% by mass or less, 50% by mass or less, or 30% by mass or less.
本實施形態的第1硬化性樹脂組成物可更包含(D)成分。該情況下,自硬化性的觀點而言,相對於硬化性樹脂組成物的總量,(D)成分的含量可為0.1質量%以上、1質量%以上、或3質量%以上,且自保存穩定性的觀點而言,相對於硬化性樹脂組成物的總量,(D)成分的含量可為15質量%以下、10質量%以下、或5質量%以下。The first curable resin composition of the present embodiment may further contain a component (D). In this case, from the viewpoint of hardenability, the content of the (D) component may be 0.1% by mass or more, 1% by mass or more, or 3% by mass or more with respect to the total amount of the curable resin composition, and self-preserved From the viewpoint of stability, the content of the (D) component may be 15% by mass or less, 10% by mass or less, or 5% by mass with respect to the total amount of the curable resin composition.
本實施形態的硬化性樹脂組成物亦可更含有聚合物(以下亦稱為「(E)成分」)。硬化性樹脂組成物中所含的聚合物可為寡聚物。本說明書中,所謂「寡聚物」是指重量平均分子量為1×104 以上的聚合物。若硬化性樹脂組成物含有聚合物(特別是寡聚物),則光照射後的硬化性樹脂層容易具有適度的感壓接著性。本說明書中,重量平均分子量是指藉由凝膠滲透層析法(Gel Permeation Chromatography)所測定的標準聚苯乙烯換算的值。本說明書中,作為(E)成分的「聚合物」是除所述(A)成分~(D)成分以外的成分。The curable resin composition of the present embodiment may further contain a polymer (hereinafter also referred to as "(E) component"). The polymer contained in the curable resin composition may be an oligomer. In the present specification, the "oligomer" means a polymer having a weight average molecular weight of 1 × 10 4 or more. When the curable resin composition contains a polymer (especially an oligomer), the curable resin layer after light irradiation is likely to have a moderate pressure-sensitive adhesiveness. In the present specification, the weight average molecular weight refers to a value converted into a standard polystyrene measured by gel permeation chromatography (Gel Permeation Chromatography). In this specification, a "polymer" as a component (E) is a component other than said (A) component-(D) component.
作為聚合物(寡聚物)的具體例,可列舉:丁二烯橡膠、異戊二烯橡膠、矽橡膠、苯乙烯丁二烯橡膠、氯丁二烯橡膠、腈橡膠、丁基橡膠、乙烯丙烯橡膠、胺甲酸乙酯橡膠、丙烯酸橡膠、氯磺化聚乙烯橡膠、氟橡膠、氫化腈橡膠、表氯醇橡膠等各種橡膠的液狀物或固體成分;聚丁烯等聚α-烯烴;氫化聚丁烯等氫化α-烯烴寡聚物;雜排聚丙烯(atactic polypropylene)等聚乙烯基系寡聚物;聯苯、聯三苯等芳香族系寡聚物;氫化液狀聚丁二烯等氫化聚烯系寡聚物;石蠟油、氯化石蠟油等石蠟系寡聚物;環烷油等環烷烴(cycloparaffin)系寡聚物;可藉由於兩末端具有羥基的化合物與於兩末端具有酯基或羧基的化合物的酯交換、或者縮聚反應來製造的聚酯系寡聚物;可藉由於兩末端具有羥基的聚醚、聚碳酸酯、或聚酯與聚異氰酸酯的聚合反應來製造的聚胺甲酸乙酯系寡聚物;(甲基)丙烯酸系聚合物。該些中,自感壓接著性的觀點而言,較佳為(甲基)丙烯酸系聚合物。Specific examples of the polymer (oligomer) include butadiene rubber, isoprene rubber, silicone rubber, styrene butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, and ethylene. Liquid or solid components of various rubbers such as acrylic rubber, urethane rubber, acrylic rubber, chlorosulfonated polyethylene rubber, fluorine rubber, hydrogenated nitrile rubber, epichlorohydrin rubber, etc .; polyα-olefins such as polybutene; Hydrogenated α-olefin oligomers such as hydrogenated polybutene; polyvinyl oligomers such as atactic polypropylene; aromatic oligomers such as biphenyl and bitriphenyl; hydrogenated liquid polybutadiene Hydrogenated polyene oligomers such as olefin; paraffin oligomers such as paraffin oil and chlorinated paraffin oil; cycloparaffin oligomers such as naphthenic oil; Polyester oligomer produced by transesterification or polycondensation reaction of a compound having an ester group or a carboxyl group at the terminal; it can be obtained by polymerization reaction of polyether, polycarbonate, or polyester with polyisocyanate having hydroxyl groups at both ends. Urethane Ester oligomer; (meth) acrylic polymer. Among these, from the viewpoint of pressure-sensitive adhesiveness, a (meth) acrylic polymer is preferred.
(甲基)丙烯酸系聚合物是包含一種或兩種以上的源自具有一個(甲基)丙烯醯基的單體的單體單元的聚合物。於不明顯有損於本發明的效果的範圍內,(甲基)丙烯酸系聚合物亦可包含具有兩個以上的(甲基)丙烯醯基的化合物、不具有(甲基)丙烯醯基的聚合性化合物(例如,丙烯腈、苯乙烯、乙酸乙烯酯、乙烯、丙烯等於分子內具有一個聚合性不飽和鍵的化合物、二乙烯基苯等於分子內具有兩個以上的聚合性不飽和鍵的化合物)作為共聚單體。The (meth) acrylic polymer is a polymer containing one or two or more kinds of monomer units derived from a monomer having one (meth) acrylfluorene group. To the extent that the effects of the present invention are not significantly impaired, the (meth) acrylic polymer may include a compound having two or more (meth) acrylfluorenyl groups, and a compound having no (meth) acrylfluorenyl group. Polymerizable compounds (for example, acrylonitrile, styrene, vinyl acetate, ethylene, propylene is equal to a compound having one polymerizable unsaturated bond in the molecule, and divinylbenzene is equal to one having two or more polymerizable unsaturated bonds in the molecule. Compounds) as comonomers.
作為構成(甲基)丙烯酸系聚合物的單體的具體例,可列舉:(甲基)丙烯酸;(甲基)丙烯酸醯胺;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正月桂酯、(甲基)丙烯酸硬脂酯等(甲基)丙烯酸烷基酯;(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯等具有芳香環的(甲基)丙烯酸酯;(甲基)丙烯酸丁氧基乙二醇酯、(甲基)丙烯酸丁氧基二乙二醇酯、(甲基)丙烯酸甲氧基三乙二醇酯等具有烷氧基的(甲基)丙烯酸酯;(甲基)丙烯酸環己酯、(甲基)丙烯酸四氫糠基酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸二環戊基酯等具有脂環式基的(甲基)丙烯酸酯;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯等具有羥基的(甲基)丙烯酸酯;四乙二醇單甲醚(甲基)丙烯酸酯、六乙二醇單甲醚(甲基)丙烯酸酯、八乙二醇單甲醚(甲基)丙烯酸酯、九乙二醇甲醚(甲基)丙烯酸酯等聚乙二醇單甲醚(甲基)丙烯酸酯;七丙二醇單甲醚(甲基)丙烯酸酯等聚丙二醇單甲醚(甲基)丙烯酸酯;四乙二醇乙醚(甲基)丙烯酸酯等聚乙二醇乙醚(甲基)丙烯酸酯;四乙二醇單(甲基)丙烯酸酯、六乙二醇單(甲基)丙烯酸酯、八丙二醇單(甲基)丙烯酸酯、具有(甲基)丙烯醯基的聚酯寡聚物、具有(甲基)丙烯醯基的胺甲酸乙酯聚合物、聚乙二醇單(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇單(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、具有(甲基)丙烯醯基的丁二烯聚合物、具有(甲基)丙烯醯基的異戊二烯聚合物等。(甲基)丙烯酸系聚合物亦可為包含該些單體作為單體單元的均聚物或共聚物。(甲基)丙烯酸系聚合物亦可為包含具有一個(甲基)丙烯醯基的單官能單體作為單體單元的均聚物或共聚物。(甲基)丙烯酸系聚合物亦可包含具有烷基的(甲基)丙烯酸酯作為單體單元,亦可包含具有碳數4~18的烷基的(甲基)丙烯酸酯作為單體單元。Specific examples of the monomer constituting the (meth) acrylic polymer include (meth) acrylic acid; ammonium (meth) acrylate; methyl (meth) acrylate, ethyl (meth) acrylate, N-butyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, ( (Meth) acrylic acid alkyl esters such as n-lauryl methacrylate and stearyl (meth) acrylate; benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, and other aromatic ( (Meth) acrylates; butoxyethylene glycol (meth) acrylate, butoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, etc. have alkoxy (Meth) acrylate; cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentyl (meth) acrylate, etc. (Meth) acrylic acid esters of alicyclic group; 2-methyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc. Base) acrylic ; Tetraethylene glycol monomethyl ether (meth) acrylate, hexaethylene glycol monomethyl ether (meth) acrylate, octaethylene glycol monomethyl ether (meth) acrylate, nonaethylene glycol methyl ether ( Polyethylene glycol monomethyl ether (meth) acrylates such as meth) acrylates; Polypropylene glycol monomethyl ether (meth) acrylates such as heptapropylene glycol monomethyl ether (meth) acrylates; tetraethylene glycol ether ( Polyethylene glycol ether (meth) acrylates such as meth) acrylates; tetraethylene glycol mono (meth) acrylates, hexaethylene glycol mono (meth) acrylates, octapropylene glycol mono (meth) acrylates Ester, polyester oligomer with (meth) acrylfluorene group, urethane polymer with (meth) acrylfluorene group, polyethylene glycol mono (meth) acrylate, polyethylene glycol di (Meth) acrylate, polypropylene glycol mono (meth) acrylate, polypropylene glycol di (meth) acrylate, butadiene polymer with (meth) acrylfluorenyl group, and (meth) acrylfluorene Isoprene polymer and so on. The (meth) acrylic polymer may be a homopolymer or a copolymer containing these monomers as monomer units. The (meth) acrylic polymer may be a homopolymer or a copolymer containing a monofunctional monomer having one (meth) acrylfluorene group as a monomer unit. The (meth) acrylic polymer may include a (meth) acrylic acid ester having an alkyl group as a monomer unit, and may also include a (meth) acrylic acid ester having an alkyl group having 4 to 18 carbons as a monomer unit.
相對於(甲基)丙烯酸系聚合物的質量,(甲基)丙烯酸系聚合物每一分子中的作為單體單元所包含的具有烷基的(甲基)丙烯酸酯的比例可為5質量%以上、10質量%以上,且可為95質量%以下、90質量%以下。若具有烷基的(甲基)丙烯酸酯的比例為所述範圍內,則有硬化後的硬化性樹脂層(遮光層)的對玻璃、塑膠、偏光板、聚碳酸酯等被附著體的密接性提升的傾向。Relative to the mass of the (meth) acrylic polymer, the proportion of the (meth) acrylic acid ester having an alkyl group contained as a monomer unit in each molecule of the (meth) acrylic polymer may be 5% by mass It is more than 10 mass%, and it can be 95 mass% or less and 90 mass% or less. When the ratio of the (meth) acrylate having an alkyl group is within the above range, the hardened resin layer (light-shielding layer) after hardening adheres to adherends such as glass, plastic, polarizing plate, and polycarbonate. Sexual tendency.
自與塑膠等基材的感壓接著性提升的觀點而言,(甲基)丙烯酸系聚合物亦可為包含具有羥基、嗎啉基、胺基、羧基、氰基、羰基、硝基等極性基的(甲基)丙烯酸酯作為單體單元的共聚物。From the viewpoint of improving pressure-sensitive adhesiveness with substrates such as plastics, the (meth) acrylic polymer may include polarities such as hydroxyl, morpholino, amine, carboxyl, cyano, carbonyl, and nitro groups. Copolymers of (meth) acrylic acid esters as monomer units.
(甲基)丙烯酸系聚合物(寡聚物)的重量平均分子量可為1×104 ~1×107 。若使重量平均分子量為所述範圍內,則於高溫(例如80℃以上)、高濕(例如90%以上)的環境下,可特別容易地獲得不會於基材等產生剝離的感壓接著力。另外,容易獲得具有適於塗佈的黏度、且加工性良好的硬化性樹脂組成物。The weight average molecular weight of the (meth) acrylic polymer (oligomer) may be 1 × 10 4 to 1 × 10 7 . When the weight average molecular weight is within the above range, a pressure-sensitive adhesive that does not cause peeling on a substrate or the like can be obtained particularly easily in an environment of high temperature (for example, 80 ° C or higher) and high humidity (for example, 90% or higher). force. In addition, it is easy to obtain a curable resin composition having a viscosity suitable for coating and good processability.
(甲基)丙烯酸系聚合物可使用溶液聚合、乳化聚合、懸浮聚合、塊狀聚合等已知的聚合方法來製備。The (meth) acrylic polymer can be prepared by known polymerization methods such as solution polymerization, emulsion polymerization, suspension polymerization, and block polymerization.
作為該些聚合方法中的聚合起始劑,可使用藉由熱而產生自由基的化合物。作為其具體例,可列舉:過氧化苯甲醯基、過氧化苯甲酸第三丁酯、氫過氧化枯烯、過氧化二碳酸二異丙酯、過氧化二碳酸二正丙酯、過氧化二碳酸二(2-乙氧基乙基)酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三丁酯(t-butyl peroxypivalate)、(3,5,5-三甲基己醯基)過氧化物、二丙醯基過氧化物、二乙醯基過氧化物、二-十二烷基過氧化物等有機過氧化物;2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-甲基丁腈)、1,1'-偶氮雙(環己烷-1-甲腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基-4-甲氧基戊腈)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙(4-氰基戊酸)、2,2'-偶氮雙(2-羥基甲基丙腈)、2,2'-偶氮雙[2-(咪唑啉-2-基)丙烷]等偶氮系化合物。As a polymerization initiator in these polymerization methods, a compound that generates a radical by heat can be used. Specific examples thereof include benzamyl peroxide, third butyl peroxide benzoate, cumene hydroperoxide, diisopropyl peroxide dicarbonate, di-n-propyl peroxydicarbonate, and peroxidation. Di (2-ethoxyethyl) dicarbonate, tertiary butyl peroxydecanoate, tert-butyl peroxypivalate (t-butyl peroxypivalate), (3,5,5-trimethyl Hexamyl) peroxide, dipropylfluorenyl peroxide, diethylfluorenyl peroxide, di-dodecyl peroxide and other organic peroxides; 2,2'-azobisisobutyronitrile , 2,2'-azobis (2-methylbutyronitrile), 1,1'-azobis (cyclohexane-1-carbonitrile), 2,2'-azobis (2,4- Dimethylvaleronitrile), 2,2'-azobis (2,4-dimethyl-4-methoxyvaleronitrile), 2,2'-azobis (2-methylpropionic acid) di Methyl ester, 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis (2-hydroxymethylpropionitrile), 2,2'-azobis [2- ( Azo compounds such as imidazolin-2-yl) propane].
相對於硬化性樹脂組成物的總量,(E)成分的含量可為1質量%以上、5質量%以上、10質量%以上,且可為90質量%以下、80質量%以下、70質量%以下。若聚合物的含量為所述範圍內,則容易獲得具有適於塗佈的黏度且加工性良好的硬化性樹脂組成物。另外,有光照射後的硬化樹脂層的對玻璃、塑膠、偏光板、聚碳酸酯等被附著物的感壓接著性變得特別良好的傾向。The content of the (E) component may be 1 mass% or more, 5 mass% or more, and 10 mass% or more with respect to the total amount of the curable resin composition, and may be 90 mass% or less, 80 mass% or less, and 70 mass%. the following. When the content of the polymer is within the above range, it is easy to obtain a curable resin composition having viscosity suitable for coating and good processability. In addition, the pressure-sensitive adhesiveness of the hardened resin layer after light irradiation to adherends such as glass, plastic, polarizing plates, and polycarbonate tends to be particularly good.
硬化性樹脂組成物亦可代替聚合物、或與聚合物一併而含有1,2-羥基硬脂酸等凝膠化劑、觸變劑(thixotropic agent)。The curable resin composition may contain a gelling agent such as 1,2-hydroxystearic acid and a thixotropic agent in place of the polymer or in combination with the polymer.
硬化性樹脂組成物視需要亦可更含有其他添加劑。作為其他添加劑,例如可列舉矽烷偶合劑等接著改善劑、熱聚合起始劑、抗氧化劑、鏈轉移劑、穩定劑、光增感劑。The curable resin composition may further contain other additives as needed. Examples of the other additives include adhesion improving agents such as silane coupling agents, thermal polymerization initiators, antioxidants, chain transfer agents, stabilizers, and photosensitizers.
自耐濕熱可靠性的觀點、及抑制硬化物中的氣泡產生的觀點而言,硬化性樹脂組成物亦可實質上不含有機溶劑。本說明書中,所謂「有機溶劑」是指不具有自由基聚合性基的於25℃下為液狀、且大氣壓下的沸點為250℃以下的有機化合物。本說明書中,所謂「實質上不含有機溶劑」是指不含有意添加的有機溶劑,不排除硬化性樹脂組成物中存在微量的有機溶劑的態樣。具體而言,相對於硬化性樹脂組成物的總量,硬化性樹脂組成物中的有機溶劑的含量可為1.0×103 ppm以下、5.0×102 ppm以下、或1.0×102 ppm以下。硬化性樹脂組成物亦可完全不含有機溶劑。The curable resin composition may not substantially contain an organic solvent from the viewpoint of reliability in damp heat resistance and the viewpoint of suppressing generation of bubbles in the cured product. In the present specification, the "organic solvent" refers to an organic compound that does not have a radical polymerizable group and is liquid at 25 ° C and has a boiling point of 250 ° C or lower at atmospheric pressure. In the present specification, "substantially free of an organic solvent" means that the organic solvent is not added intentionally, and a state in which a small amount of an organic solvent is present in the curable resin composition is not excluded. Specifically, the content of the organic solvent in the curable resin composition may be 1.0 × 10 3 ppm or less, 5.0 × 10 2 ppm or less, or 1.0 × 10 2 ppm or less with respect to the total amount of the curable resin composition. The curable resin composition may be completely free of organic solvents.
自加工性的觀點而言,硬化性樹脂組成物的於25℃~70℃中至少一部分範圍的溫度下的黏度可為10 mPa·s以上、4.0×102 mPa·s以上、5.0×102 mPa·s以上、1.0×103 mPa·s以上、2.0×103 mPa·s以上、或3.0×103 mPa·s以上,且可為5.0×104 mPa·s以下、2.0×104 mPa·s以下、1.5×104 mPa·s以下、1.25×104 mPa·s以下、或1.0×104 mPa·s以下。25℃下的黏度是基於日本工業標準(Japanese Industrial Standards,JIS)Z 8803而測定的值,具體而言是使用B型黏度計(例如東機產業(股)製造、BL2)而測定的值。B型黏度計的校正可基於JIS Z 8809-JS14000來進行。超過25℃的溫度下的黏度可依據25℃下的黏度的測定方法進行測定。From the viewpoint of processability, the viscosity of the curable resin composition at a temperature in at least a part of the range of 25 ° C. to 70 ° C. may be 10 mPa · s or more, 4.0 × 10 2 mPa · s or more, and 5.0 × 10 2 mPa · s or more, 1.0 × 10 3 mPa · s or more, 2.0 × 10 3 mPa · s or more, or 3.0 × 10 3 mPa · s or more, and may be 5.0 × 10 4 mPa · s or less, 2.0 × 10 4 mPa · S or less, 1.5 × 10 4 mPa · s or less, 1.25 × 10 4 mPa · s or less, or 1.0 × 10 4 mPa · s or less. The viscosity at 25 ° C. is a value measured based on Japanese Industrial Standards (JIS) Z 8803, and specifically a value measured using a B-type viscosity meter (for example, manufactured by Toki Sangyo Co., Ltd., BL2). The B-type viscometer can be calibrated based on JIS Z 8809-JS14000. The viscosity at a temperature exceeding 25 ° C can be measured according to a method for measuring the viscosity at 25 ° C.
硬化性樹脂組成物被照射活性能量線,則可顯現感壓接著性。When the curable resin composition is irradiated with active energy rays, pressure-sensitive adhesiveness can be exhibited.
硬化性樹脂組成物較佳為感壓性接著力為10 N/cm2 以上,更佳為20 N/cm2 以上,進而更佳為40 N/cm2 。感壓性接著力的測定是藉由下述方法及條件來進行。The curable resin composition preferably has a pressure-sensitive adhesive force of 10 N / cm 2 or more, more preferably 20 N / cm 2 or more, and even more preferably 40 N / cm 2 . The measurement of the pressure-sensitive adhesive force was performed by the following method and conditions.
(感壓性接著力的測定方法) 於寬度25 mm、長度75 mm、厚度1 mm的第1玻璃基材上塗佈硬化性樹脂組成物,以硬化性樹脂層的長度方向與第1玻璃基材的長邊正交的方式設置寬度0.6 mm、長度25 mm、膜厚50 μm的硬化性樹脂層,以照射強度3000 mW/cm2 且以總照射量成為5000 mJ/cm2 的方式對硬化性樹脂層照射波長365 nm的光,於自光照射起一分鐘以內的硬化性樹脂層上,以第1玻璃基材的長邊與第2玻璃基材的長邊自鉛垂方向觀察一致的方式配置寬度25 mm、長度75 mm、厚度1 mm的第2玻璃基材,施加1 N的負荷10秒鐘來進行貼合,從而獲得測定樣品(圖1)。於自貼合起1小時以內,對將測定樣品的第1玻璃基材及第2玻璃基材彼此向相反的長邊方向拉離時的試驗力進行測定,將該試驗力除以硬化性樹脂層與第2玻璃基材的接觸面積所得的值設為感壓性接著力。再者,圖1中,101表示第1玻璃基材,102表示第2玻璃基材,103表示硬化性樹脂層,D表示拉離方向。(Measurement method of pressure-sensitive adhesive force) A curable resin composition was applied to a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm, and the lengthwise direction of the curable resin layer and the first glass substrate were applied. orthogonal to the long side width of material disposed 0.6 mm, a length of 25 mm, a thickness of 50 μm of the resin layer, an irradiation intensity of 3000 mW / cm 2 and the total irradiation amount becomes 5000 mJ / cm 2 for curing mode The flexible resin layer is irradiated with light having a wavelength of 365 nm. On the hardening resin layer within one minute from the light irradiation, the long sides of the first glass substrate and the long sides of the second glass substrate are consistent when viewed from the vertical direction. A second glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm was arranged, and a load of 1 N was applied for 10 seconds to perform bonding, thereby obtaining a measurement sample (FIG. 1). Measure the test force when the first glass substrate and the second glass substrate of the measurement sample are pulled away from each other in the opposite long side direction within 1 hour from the bonding, and divide the test force by the curable resin. The value obtained by the contact area between the layer and the second glass substrate was set as a pressure-sensitive adhesive force. In FIG. 1, 101 indicates a first glass substrate, 102 indicates a second glass substrate, 103 indicates a curable resin layer, and D indicates a pulling-out direction.
另外,自樹脂的潤濕性的觀點而言,硬化性樹脂組成物較佳為具有如所形成的硬化性樹脂層的貼合後的縱橫比變高般的樹脂特性。作為具體的縱橫比的值,較佳為0.4以上,更佳為0.6以上,進而更佳為0.8以上。若縱橫比為0.4以上,則容易確保潤濕性,容易獲得對構件的接著性。再者,縱橫比的值的測定是藉由下述方法及條件來進行。From the viewpoint of the wettability of the resin, the curable resin composition preferably has resin characteristics such that the aspect ratio after bonding of the formed curable resin layer becomes high. The specific aspect ratio value is preferably 0.4 or more, more preferably 0.6 or more, and even more preferably 0.8 or more. When the aspect ratio is 0.4 or more, it is easy to ensure wettability, and it is easy to obtain adhesiveness to a member. The measurement of the value of the aspect ratio was performed by the following method and conditions.
(縱橫比的測定方法) 於寬度25 mm、長度75 mm、厚度1 mm的第1玻璃基材上塗佈硬化性樹脂組成物,以硬化性樹脂層的長度方向與第1玻璃基材的長邊正交的方式設置寬度0.6 mm、長度25 mm、膜厚50 μm的硬化性樹脂層,以照射強度3000 mW/cm2 且以總照射量成為5000 mJ/cm2 的方式對硬化性樹脂層照射波長365 nm的光,於自光照射起一分鐘以內的硬化性樹脂層上,以第1玻璃基材的長邊與第2玻璃基材的長邊自鉛垂方向觀察一致的方式配置寬度25 mm、長度75 mm、厚度1 mm的第2玻璃基材,施加1 N的負荷10秒鐘來進行貼合,從而獲得測定樣品(圖2(a)及圖2(b))。當將測定樣品中與第2玻璃基材接觸的硬化性樹脂層的寬度設為B(單位:mm)時,將B/0.6設為縱橫比。再者,圖2(a)、圖2(b)中,104表示第1玻璃基材,106表示第2玻璃基材,105表示硬化性樹脂層,A表示0.6(硬化性樹脂層的寬度)。(Measurement method of aspect ratio) A curable resin composition was applied to a first glass substrate having a width of 25 mm, a length of 75 mm, and a thickness of 1 mm. The lengthwise direction of the curable resin layer was equal to the length of the first glass substrate. A curable resin layer having a width of 0.6 mm, a length of 25 mm, and a film thickness of 50 μm was provided orthogonally, and the curable resin layer was irradiated with an intensity of 3000 mW / cm 2 and a total irradiation amount of 5000 mJ / cm 2 . The light is irradiated with a wavelength of 365 nm, and the width is arranged on the curable resin layer within one minute from the light irradiation so that the long side of the first glass substrate and the long side of the second glass substrate are viewed from the vertical direction. A second glass substrate having a length of 25 mm, a length of 75 mm, and a thickness of 1 mm was bonded by applying a load of 1 N for 10 seconds to obtain a measurement sample (Fig. 2 (a) and Fig. 2 (b)). When the width of the curable resin layer in contact with the second glass substrate in the measurement sample is set to B (unit: mm), B / 0.6 is set to the aspect ratio. 2 (a) and 2 (b), 104 indicates the first glass substrate, 106 indicates the second glass substrate, 105 indicates the curable resin layer, and A indicates 0.6 (the width of the curable resin layer). .
本實施形態的硬化性樹脂組成物於製造圖像顯示裝置時,可用於形成遮光層,所述遮光層具有抑制自圖像顯示部與框架部之間漏光的遮光性,且即便為狹小的區域亦可有效率地形成。The curable resin composition according to this embodiment can be used to form a light-shielding layer when an image display device is manufactured, and the light-shielding layer has a light-shielding property that suppresses light leakage from the image display portion and the frame portion, and even in a narrow area It can also be formed efficiently.
其次,對具備由硬化性樹脂組成物所形成的遮光層的圖像顯示裝置及其製造方法進行說明。Next, an image display device including a light-shielding layer formed of a curable resin composition and a method for manufacturing the same will be described.
圖3是表示圖像顯示裝置的一實施形態的剖面圖。圖3所示的圖像顯示裝置100具備:圖像顯示部1,包括具有圖像顯示面41S的液晶面板41、罩構件20、及透光性感壓接著層42;背光部43,對液晶面板41供給光;框架部5,支撐圖像顯示部1並且收容液晶面板41及背光部43;以及遮光層3,形成於框架部5與圖像顯示部1之間。罩構件20包括:蓋玻璃21,具有與圖像顯示面41S對向的透光部25;以及邊框部22,設置於蓋玻璃21的圖像顯示面41S側的主表面的周緣部上。透光性感壓接著層42於介於液晶面板41與罩構件20之間的同時將該些結合。一般而言,透光性感壓接著層42有時被稱為光學性透明黏著劑(Optical clear adhesive,OCA)。背光部43具有:光源45、及用以將光源45的光供給至液晶面板41的光學片材部46。FIG. 3 is a sectional view showing an embodiment of the image display device. The image display device 100 shown in FIG. 3 includes an image display unit 1 including a liquid crystal panel 41 having an image display surface 41S, a cover member 20, and a light-transmissive pressure-sensitive adhesive layer 42. A backlight portion 43 is provided to the liquid crystal panel. 41 supplies light; the frame portion 5 supports the image display portion 1 and houses the liquid crystal panel 41 and the backlight portion 43; and the light shielding layer 3 is formed between the frame portion 5 and the image display portion 1. The cover member 20 includes a cover glass 21 having a light-transmitting portion 25 facing the image display surface 41S, and a frame portion 22 provided on a peripheral portion of the main surface on the image display surface 41S side of the cover glass 21. The light-transmissive pressure-sensitive adhesive layer 42 combines the liquid crystal panel 41 and the cover member 20 at the same time. In general, the light-transmissive pressure-sensitive adhesive layer 42 is sometimes referred to as an optical clear adhesive (OCA). The backlight portion 43 includes a light source 45 and an optical sheet portion 46 for supplying light from the light source 45 to the liquid crystal panel 41.
框架部5具有:設置於液晶面板41及背光部43的周圍的樹脂框架51;於樹脂框架51的外側收容背光部43的背光框架52;以及收容背光框架52的殼體框架53。樹脂框架51藉由於使遮光層3介入的同時與液晶面板41的周緣部及罩構件20的邊框部22接著,而支撐圖像顯示部1。背光框架52藉由於使遮光層3介入的同時與邊框部22接著,而支撐圖像顯示部1。殼體框架53藉由於使遮光層3介入的同時與邊框部22接著,而支撐圖像顯示部1。The frame portion 5 includes a resin frame 51 provided around the liquid crystal panel 41 and the backlight portion 43, a backlight frame 52 that houses the backlight portion 43 outside the resin frame 51, and a case frame 53 that houses the backlight frame 52. The resin frame 51 supports the image display portion 1 by being in contact with the peripheral edge portion of the liquid crystal panel 41 and the frame portion 22 of the cover member 20 while interposing the light shielding layer 3. The backlight frame 52 supports the image display section 1 by adhering to the frame section 22 while interposing the light shielding layer 3. The housing frame 53 supports the image display unit 1 by adhering to the frame portion 22 while interposing the light shielding layer 3.
圖3的圖像顯示裝置100具有四個遮光層3,該些分別設置於液晶面板41或罩構件20(邊框部22)與框架部5之間。遮光層3可具有實質上不能視認來自背光部43的漏光的程度的透光性。具體而言,遮光層3的於400 nm~700 nm下的平均透光率可小於10%。該平均透光率例如可為於對遮光層3的厚度方向照射光的條件下所測定的值。The image display device 100 in FIG. 3 includes four light-shielding layers 3 which are respectively provided between the liquid crystal panel 41 or the cover member 20 (the frame portion 22) and the frame portion 5. The light-shielding layer 3 may have a light-transmitting property to such an extent that the light leakage from the backlight portion 43 is substantially invisible. Specifically, the average light transmittance of the light shielding layer 3 at 400 nm to 700 nm may be less than 10%. This average light transmittance can be a value measured under the condition that light is irradiated to the thickness direction of the light shielding layer 3, for example.
遮光層3可形成將背光部43的周圍完全包圍的封閉的框狀體,亦可以可充分抑制漏光的範圍形成包圍背光部43的周圍的一部分的開放的框狀體。如下文所述,可藉由包括硬化性樹脂組成物的塗佈與活性能量線的照射的方法,來形成選自樹脂框架51、背光框架52及殼體框架53中的至少一者與圖像顯示部1之間的遮光層3。圖像顯示裝置所具有的遮光層的一部分亦可由感壓接著帶形成。The light-shielding layer 3 may form a closed frame body that completely surrounds the periphery of the backlight portion 43, or may form an open frame body that surrounds a part of the periphery of the backlight portion 43 in a range where light leakage is sufficiently suppressed. As described below, at least one selected from the resin frame 51, the backlight frame 52, and the case frame 53 and an image can be formed by a method including coating of a curable resin composition and irradiation of active energy rays. The light-shielding layer 3 between the display portions 1. A part of the light-shielding layer included in the image display device may be formed of a pressure-sensitive adhesive tape.
各個遮光層3的與遮光層3延伸的方向垂直的方向上的寬度W可為0.5 mm以下。若寬度W窄,則可獲得具有更窄的邊框部、設計性優異的圖像顯示裝置。寬度W的下限並無特別限制,可為0.2 mm左右。The width W of each light-shielding layer 3 in a direction perpendicular to the direction in which the light-shielding layer 3 extends may be 0.5 mm or less. When the width W is narrow, an image display device having a narrower bezel portion and excellent designability can be obtained. The lower limit of the width W is not particularly limited, and may be about 0.2 mm.
構成圖像顯示部1及框架部5的各構件可自圖像顯示裝置領域中通常所採用者中適宜選擇。一般而言,背光部43的光學片材部46包含透鏡片、擴散片、導光板、反射片等。光學片材類圖像顯示裝置的構成並不限於圖3的構成,框架的數量及形狀、設置遮光層的部位等可適宜變更。例如,亦可不設置邊框部22,而將蓋玻璃21的周緣部與框架部5於使遮光層3介入的同時接著。Respective members constituting the image display section 1 and the frame section 5 can be appropriately selected from those generally used in the field of image display devices. Generally, the optical sheet portion 46 of the backlight portion 43 includes a lens sheet, a diffusion sheet, a light guide plate, a reflection sheet, and the like. The configuration of the optical sheet-type image display device is not limited to the configuration shown in FIG. 3, and the number and shape of the frames and the portion where the light-shielding layer is provided can be appropriately changed. For example, instead of providing the frame portion 22, the peripheral portion of the cover glass 21 and the frame portion 5 may be adhered while the light shielding layer 3 is interposed.
圖4(a)、圖4(b)及圖5(a)、圖5(b)是表示製造圖像顯示裝置的方法的一實施形態的立體圖。圖4(a)、圖4(b)及圖5(a)、圖5(b)中所示的方法依序包括:於圖像顯示部1(例如罩構件)的規定部分(背面側的主表面的周緣部)塗佈硬化性樹脂組成物,形成框狀的硬化性樹脂層3A的步驟(圖4(a)、圖4(b));藉由對硬化性樹脂層3A照射活性能量線hν,而進行硬化性樹脂層3A的硬化反應的步驟(圖4(b));以及於使進行了硬化反應的硬化性樹脂層3A介入的同時將圖像顯示部1與框架部5貼合的步驟(圖5(a)、圖5(b))。藉由於硬化性樹脂層3A中進行硬化反應,而形成遮光層3。4 (a), 4 (b), 5 (a), and 5 (b) are perspective views illustrating an embodiment of a method of manufacturing an image display device. The method shown in FIG. 4 (a), FIG. 4 (b), FIG. 5 (a), and FIG. 5 (b) includes, in order, a prescribed portion (on the back side) of the image display unit 1 (for example, a cover member). The peripheral edge portion of the main surface) is a step of applying a curable resin composition to form a frame-shaped curable resin layer 3A (FIG. 4 (a), FIG. 4 (b)); irradiating the curable resin layer 3A with active energy Line hν to perform the curing reaction of the curable resin layer 3A (FIG. 4 (b)); and the image display portion 1 and the frame portion 5 are attached while the curable resin layer 3A subjected to the curing reaction is interposed. (5 (a), 5 (b)). The light-shielding layer 3 is formed by the curing reaction in the curable resin layer 3A.
圖6(a)、圖6(b)及圖7(a)、圖7(b)亦是表示製造圖像顯示裝置的方法的一實施形態的立體圖。於該方法的情況下,將硬化性樹脂組成物塗佈於框架部5而形成框狀的硬化性樹脂層3A。除此以外的方面與圖4(a)、圖4(b)及圖5(a)、圖5(b)的方法相同。6 (a), 6 (b), 7 (a), and 7 (b) are perspective views showing an embodiment of a method of manufacturing an image display device. In the case of this method, a curable resin composition is applied to the frame portion 5 to form a frame-shaped curable resin layer 3A. The other points are the same as the methods of FIGS. 4 (a), 4 (b), and 5 (a), 5 (b).
以下,以圖4(a)、圖4(b)及圖5(a)、圖5(b)的方法為例,更詳細地對製造圖3的圖像顯示裝置100的方法的實施形態進行說明。Hereinafter, embodiments of the method of manufacturing the image display device 100 of FIG. 3 will be described in more detail by taking the methods of FIGS. 4 (a), 4 (b), 5 (a), and 5 (b) as examples. Instructions.
步驟(I)(塗敷步驟) 如圖4(a)、圖4(b)所示,於圖像顯示部1的主表面的周緣部塗佈所述本實施形態的硬化性樹脂組成物,形成框狀的硬化性樹脂層3A。可藉由調整塗佈的機構而於狹小的區域有效率地形成硬化性樹脂層。例如,可藉由自開口噴出液狀的硬化性樹脂組成物的方法,而有效率地且以高精度塗佈硬化性樹脂組成物。Step (I) (coating step) As shown in FIGS. 4 (a) and 4 (b), the peripheral portion of the main surface of the image display unit 1 is coated with the curable resin composition of the present embodiment. A frame-shaped curable resin layer 3A is formed. It is possible to efficiently form a curable resin layer in a narrow area by adjusting a coating mechanism. For example, a method of spraying a liquid curable resin composition from an opening can be used to efficiently and accurately apply the curable resin composition.
步驟(II)(活性能量線照射步驟) 然後,對硬化性樹脂層3A照射活性能量線hν,進行硬化性樹脂層3A的硬化反應。就硬化性樹脂層3A而言,於照射活性能量線後,即刻主要進行利用自由基聚合反應來進行的硬化反應。藉由該硬化反應的進行,可對硬化性樹脂層3A賦予適當的感壓接著性。硬化性樹脂層3A中所含的矽烷醇基及烷氧基矽烷基藉由濕氣(水分)所參與的離子反應(水解反應)而進行硬化反應,該反應可藉由活性能量線的作用而被自光鹼產生劑或者產生鹼的光自由基聚合起始劑中產生的鹼所催化,但該離子反應以與自由基聚合反應相比相對較慢的反應速度進行。因此,於照射活性能量線的階段,硬化性樹脂層3A亦可藉由自由基聚合反應而進行半硬化。Step (II) (active energy ray irradiation step) Then, the curable resin layer 3A is irradiated with the active energy ray hν to perform a curing reaction of the curable resin layer 3A. In the curable resin layer 3A, after the active energy ray is irradiated, a curing reaction by a radical polymerization reaction is mainly performed immediately. With the progress of the curing reaction, an appropriate pressure-sensitive adhesiveness can be imparted to the curable resin layer 3A. The silanol group and alkoxysilyl group contained in the curable resin layer 3A undergo a hardening reaction by an ionic reaction (hydrolysis reaction) in which moisture (water) participates, and this reaction can be effected by the action of active energy rays Catalyzed by a base generated from a photobase generator or a photoradical polymerization initiator that generates a base, the ionic reaction proceeds at a relatively slower reaction rate than the radical polymerization reaction. Therefore, at the stage of irradiating the active energy ray, the curable resin layer 3A can also be semi-cured by a radical polymerization reaction.
步驟(III)(貼合步驟) 如圖5(a)所示,於使被照射活性能量線、具有感壓接著性的硬化性樹脂層3A介入的同時,將圖像顯示部1與框架部5貼合。視需要亦可於對硬化性樹脂層3A進行加熱的同時,將圖像顯示部1與框架部5貼合。Step (III) (adhesion step) As shown in FIG. 5 (a), the image display section 1 and the frame section are interposed while the curable resin layer 3A having pressure-sensitive adhesiveness is irradiated with the active energy ray, and 5 fit. If necessary, the image display portion 1 and the frame portion 5 may be bonded together while heating the curable resin layer 3A.
自使階差吸收性、感壓性接著力(黏著力)、及用以顯現接著力的潤濕性平衡的觀點而言,貼合時硬化性樹脂層的於25℃下的儲存彈性係數較佳為10000 Pa~500000 Pa,更佳為30000 Pa~250000 Pa,進而更佳為50000 Pa~200000 Pa。From the viewpoint of making the step absorbency, pressure-sensitive adhesive force (adhesive force), and the wettability balance to show the adhesive force, the storage elasticity coefficient of the hardening resin layer at 25 ° C at the time of bonding is higher than It is preferably 10,000 Pa to 500,000 Pa, more preferably 30,000 Pa to 250,000 Pa, and even more preferably 50,000 Pa to 200,000 Pa.
貼合步驟中,較佳為以下述式所表示的縱橫比成為0.4以上的方式將圖像顯示部1與框架部5貼合。下述縱橫比更佳為0.6以上,進而更佳為0.8以上。 縱橫比=B'/A' 式中,A'表示塗佈於圖像顯示部1的框狀的硬化性樹脂層3A的規定部位的寬度,B'表示將圖像顯示部1與框架部5貼合後的硬化性樹脂層3A的規定部位的與框架部5接觸的寬度。此處,A'及B'表示與圖2(a)、圖2(b)所示的A及B相同的位置處的寬度。In the bonding step, the image display portion 1 and the frame portion 5 are preferably bonded so that the aspect ratio represented by the following formula becomes 0.4 or more. The following aspect ratio is more preferably 0.6 or more, and even more preferably 0.8 or more. Aspect ratio = B '/ A' In the formula, A 'represents the width of a predetermined portion of the frame-shaped curable resin layer 3A applied to the image display portion 1, and B' represents the image display portion 1 and the frame portion 5 The width of the predetermined portion of the cured curable resin layer 3A that is in contact with the frame portion 5. Here, A 'and B' represent widths at the same positions as A and B shown in Figs. 2 (a) and 2 (b).
關於A'及B'的寬度,例如於規定的部位為於與硬化性樹脂層3A延伸的方向垂直的同一面將貼合圖像顯示部1與框架部5前後的硬化性樹脂層3A切斷時的切斷面的情況下,貼合前的硬化性樹脂層3A與圖像顯示部1相接的線寬為A',貼合後的硬化性樹脂層3A與框架部5相接的線寬為B'。再者,於框架部5上形成硬化性樹脂層3A的情況下,所述切斷面中貼合前的硬化性樹脂層3A與框架部5相接的線寬為A',貼合後的硬化性樹脂層3A與圖像顯示部1相接的線寬為B'。Regarding the widths of A ′ and B ′, for example, the curable resin layer 3A before and after the image display portion 1 and the frame portion 5 are bonded to each other at a predetermined position on the same surface perpendicular to the direction in which the curable resin layer 3A extends. In the case of a cut surface, the line width of the curable resin layer 3A before bonding and the image display portion 1 is A ′, and the line of the curable resin layer 3A after bonding and the frame portion 5 is connected. The width is B '. In addition, when the curable resin layer 3A is formed on the frame portion 5, the line width of the curable resin layer 3A before the bonding on the cut surface and the frame portion 5 is A '. The line width of the curable resin layer 3A in contact with the image display portion 1 is B ′.
若縱橫比(B'/A')為所述範圍內,則容易確保潤濕性,容易獲得對圖像顯示部1或框架部5的接著性。When the aspect ratio (B '/ A') is within the above range, it is easy to ensure wettability, and it is easy to obtain adhesion to the image display section 1 or the frame section 5.
步驟(IV)(硬化步驟) 如圖5(b)所示,亦可於具有圖像顯示部1與框架部5且該些已被貼合的積層體的狀態下,使硬化性樹脂層3A的硬化反應進一步硬化。本說明書中,有時將於貼合後進行的硬化反應稱為「延遲硬化」。延遲硬化例如可於10℃以上、15℃以上、或20℃以上的環境下,濕度為30%以上、40%以上、或50%以上的環境下,歷時12小時以上來進行。關於用以進行延遲硬化的環境,溫度可為80℃以下,濕度可為95%以下。於進行延遲硬化期間,亦可進行進一步對圖像顯示裝置進行加工的步驟、及/或對圖像顯示裝置進行檢查的步驟等其他所需的步驟。Step (IV) (Hardening step) As shown in FIG. 5 (b), the curable resin layer 3A may be formed in a state where the laminated body having the image display portion 1 and the frame portion 5 is bonded. The hardening reaction is further hardened. In this specification, the curing reaction which progresses after bonding may be called "retarded hardening." The delayed hardening can be performed in an environment of 10 ° C. or higher, 15 ° C. or higher, or 20 ° C. or higher, and humidity of 30% or higher, 40% or higher, or 50% or higher, for 12 hours or longer. Regarding the environment for delayed hardening, the temperature may be 80 ° C or lower, and the humidity may be 95% or lower. During the delayed curing, other necessary steps such as a step of further processing the image display device and / or a step of inspecting the image display device may be performed.
延遲硬化可為自由基聚合,更典型而言為利用反應速度較自由基聚合更慢的離子反應(水解反應)來進行的硬化反應。藉由硬化性樹脂層3A中所含的(B1)成分或(D)成分所具有矽烷醇基及/或烷氧基矽烷基的離子反應(水解反應)而進行延遲硬化。可藉由自光鹼產生劑或者產生鹼的光自由基聚合起始劑中產生的鹼來促進該離子反應(水解反應)。延遲硬化後的硬化性樹脂層3A(即遮光層3)可以更高的接著力將罩構件與圖像顯示部接著。 [實施例]The delayed hardening may be a radical polymerization, and more typically a hardening reaction using an ionic reaction (hydrolysis reaction) having a slower reaction rate than the radical polymerization. Delayed curing is performed by the ion reaction (hydrolysis reaction) of the silanol group and / or alkoxysilyl group in the component (B1) or (D) contained in the curable resin layer 3A. The ion reaction (hydrolysis reaction) can be promoted by a base generated from a photobase generator or a photoradical polymerization initiator that generates a base. The hardening resin layer 3A (that is, the light-shielding layer 3) after the delayed hardening can adhere the cover member to the image display portion with a higher adhesive force. [Example]
以下,列舉實施例及比較例來更具體地說明本發明。但是,本發明並不限定於該些。Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to these.
硬化性樹脂組成物的原料 (A)光起始劑 (A1)光自由基聚合起始劑: ·IRG-651(日本巴斯夫股份有限公司製造、豔佳固(IRGACURE)-651、2,2-二甲氧基-1,2-二苯基乙烷-1-酮) 產生鹼的光自由基聚合起始劑: ·IRG-907(日本巴斯夫股份有限公司製造、豔佳固(IRGACURE)-907、2-甲基-1-(4-甲硫基苯基)-2-嗎啉基丙烷-1-酮) (B)單體成分 (B1)具有一個自由基聚合性基與矽烷醇基及/或烷氧基矽烷基的單體 ·KBM-5103(信越化學工業股份有限公司製造、KBM-5103、3-丙烯醯氧基丙基三甲氧基矽烷) (B2)具有一個自由基聚合性基的單官能單體 ·NOAA(大阪有機化學工業股份有限公司製造、NOAA、丙烯酸正辛酯) ·IBXA(共榮社化學股份有限公司製造、萊特丙烯酸酯(Light Acrylate)IB-XA、丙烯酸異冰片酯) ·HPA(大阪有機化學工業股份有限公司製造、HPA、丙烯酸羥基丙酯) (C)著色劑 ·艾立薩黑(elixa Black)850(東方化學工業(Orient Chemical Industries)股份有限公司製造、黑色染料)Raw material of hardening resin composition (A) Photoinitiator (A1) Photoradical polymerization initiator: IRG-651 (manufactured by BASF Corporation, IRGACURE) -651, 2,2- Dimethoxy-1,2-diphenylethane-1-one) Photo-radical polymerization initiator for generating base: IRG-907 (manufactured by BASF Corporation, Japan, IRGACURE) -907 2, 2-methyl-1- (4-methylthiophenyl) -2-morpholinylpropane-1-one) (B) The monomer component (B1) has a radical polymerizable group and a silanol group and Monomer of alkoxysilyl group · KBM-5103 (manufactured by Shin-Etsu Chemical Industry Co., Ltd., KBM-5103, 3-propenyloxypropyltrimethoxysilane) (B2) has one radical polymerizable group Monofunctional monomer · NOAA (manufactured by Osaka Organic Chemical Industry Co., Ltd., NOAA, n-octyl acrylate) · IBXA (manufactured by Kyoeisha Chemical Co., Ltd., Light Acrylate IB-XA, isobornyl acrylate Esters) · HPA (manufactured by Osaka Organic Chemical Industry Co., Ltd., HPA, hydroxypropyl acrylate) (C Colorants Sa · Eric Black (elixa Black) 850 (Orient Chemical Industries (Orient Chemical Industries) Limited manufacturing, black dye)
(E)聚合物(寡聚物) 藉由下述順序來合成寡聚物(丙烯酸2-乙基己酯與丙烯酸2-羥基乙酯的共聚物)。 於容器中投入丙烯酸2-乙基己酯(90.0 g)、丙烯酸2-羥基乙酯(10.0 g)、甲基乙基酮(30.0 g)、及乙酸乙酯(170.0 g),一邊以100 mL/分鐘的流量進行氮氣置換,一邊自常溫(25℃)加熱至65℃。於到達65℃後,添加偶氮雙異丁腈(0.3 g),於保持該溫度的同時保溫8小時。 繼而,添加丙烯酸異硬脂酯(100.0 g),並將溶劑甲基乙基酮及乙酸乙酯溜去,藉此而獲得丙烯酸2-乙基己酯與丙烯酸2-羥基乙酯的共聚物(重量平均分子量600,000)的丙烯酸異硬脂酯溶液(加熱殘留物50%)。(E) Polymer (oligomer) An oligomer (copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate) was synthesized by the following procedure. Put 2-ethylhexyl acrylate (90.0 g), 2-hydroxyethyl acrylate (10.0 g), methyl ethyl ketone (30.0 g), and ethyl acetate (170.0 g) into the container. Nitrogen was replaced at a flow rate per minute, and heated to 65 ° C from normal temperature (25 ° C). After reaching 65 ° C, azobisisobutyronitrile (0.3 g) was added, and the temperature was maintained for 8 hours while maintaining the temperature. Next, isostearyl acrylate (100.0 g) was added, and the solvents methyl ethyl ketone and ethyl acetate were slipped away, thereby obtaining a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate ( Weight average molecular weight 600,000) isostearyl acrylate solution (heating residue 50%).
硬化性樹脂組成物的製備 以表1所示的含量將各原料混合,一邊加熱30分鐘一邊進行攪拌,製備硬化性樹脂組成物。表1所示的各成分的含量為以硬化性樹脂組成物的總質量為基準的含量(單位:質量%)。Preparation of curable resin composition Each raw material was mixed with the content shown in Table 1, and it stirred while heating for 30 minutes, and prepared the curable resin composition. The content of each component shown in Table 1 is a content (unit: mass%) based on the total mass of the curable resin composition.
評價方法 1.接著力(初期、延遲硬化後) 圖8及圖9是表示接著力的測定方法的示意圖。如圖8所示,於25 cm×75 cm×0.1 cm的長條狀的玻璃基底60的中央的兩端部塗佈硬化性樹脂組成物,於玻璃基底60上形成對向的兩個硬化性樹脂層3A(高度0.05 mm、寬度0.4 mm~0.6 mm、長度30 mm~40 mm)。對所形成的硬化性樹脂層3A,使用紫外線照射裝置(艾古飛(Eyegraphics)(股)製造、US5-X0401,使用光源:艾古飛(Eyegraphics)(股)製造、金屬鹵化物燈(metal halide lamp)M04-L41),以照射強度400 mW/cm2 且以總照射量成為2000 mJ/cm2 的方式照射紫外線,使硬化性樹脂層3A的硬化反應部分進行。利用照度計(牛尾(USHIO)電機股份有限公司製造的「UIT-250」)來測定照射輸出。Evaluation method 1. Adhesive force (initial phase, after delayed hardening) FIGS. 8 and 9 are schematic diagrams showing a method for measuring an adhesive force. As shown in FIG. 8, a curable resin composition is applied to both ends of the center of the long glass substrate 60 having a length of 25 cm × 75 cm × 0.1 cm, and two opposite curable properties are formed on the glass substrate 60. Resin layer 3A (0.05 mm height, 0.4 mm to 0.6 mm width, 30 mm to 40 mm length). For the formed curable resin layer 3A, an ultraviolet irradiation device (manufactured by Eyegraphics Co., Ltd., US5-X0401) was used. A light source was used: manufactured by Eyegraphics Co., Ltd., and metal halide lamps (metal halide lamp) M04-L41), irradiating ultraviolet rays at an irradiation intensity of 400 mW / cm 2 and a total irradiation amount of 2000 mJ / cm 2 to advance the curing reaction portion of the curable resin layer 3A. The illuminance meter ("UIT-250" manufactured by Ushio Electric Co., Ltd.) was used to measure the irradiation output.
其次,如圖9所示,於使紫外線照射後的硬化性樹脂層3A介入的同時,將玻璃基底60與長條狀的另一玻璃基底61(25 cm×75 cm×0.1 cm),以玻璃基底60的短邊與玻璃基底61的長邊平行的朝向,一邊施加負荷5 kgf一邊進行貼合。Next, as shown in FIG. 9, while the curable resin layer 3A after the ultraviolet irradiation is interposed, the glass substrate 60 and another long glass substrate 61 (25 cm × 75 cm × 0.1 cm) are made of glass. The short side of the base 60 is oriented parallel to the long side of the glass base 61, and bonding is performed while applying a load of 5 kgf.
以玻璃基底61相對於地面為水平、且玻璃基底60位於玻璃基底61的下側的狀態將所獲得的玻璃接合體的玻璃基底61的兩端部61E固定。於該狀態下,對玻璃基底60於鉛垂方向上朝下(箭頭F的方向)施加負荷,並增加負荷直至玻璃基底60剝離為止。測定玻璃基底60剝離時的試驗力(負荷),並將該試驗力除以硬化性樹脂層3A(或遮光層3)與玻璃基底61的接著面積所得的值記錄為接著力。Both ends 61E of the glass substrate 61 of the obtained glass bonded body were fixed in a state where the glass substrate 61 was horizontal with respect to the ground and the glass substrate 60 was positioned below the glass substrate 61. In this state, a load is applied to the glass substrate 60 in the vertical direction (in the direction of the arrow F), and the load is increased until the glass substrate 60 is peeled. The test force (load) when the glass substrate 60 was peeled off was measured, and the value obtained by dividing the test force by the bonding area between the curable resin layer 3A (or the light shielding layer 3) and the glass substrate 61 was recorded as the bonding force.
藉由該方法來測定獲得玻璃接合體後2小時以內所測定的初期接著力,以及將玻璃接合體於25℃、50%RH的室內靜置48小時後所測定的延遲硬化後接著力。According to this method, the initial adhesion force measured within 2 hours after obtaining the glass bonded body, and the post-cured adhesion force measured after the glass bonded body was allowed to stand in a room at 25 ° C. and 50% RH for 48 hours were measured.
2.遮光性 利用浸入了丙酮的不織布(旭化成纖維股份有限公司製造的「本科特(Bemcot)」)仔細擦拭板狀的鈉玻璃62(浮法玻璃,松浪玻璃製造的「微載玻片(MICRO SLIDE GLASS)S9213」,尺寸76 mm×52 mm、厚度1.2 mm~1.5 mm、照射光透射率90%),將其用作試驗用玻璃基材。如圖10所示,沿鈉玻璃62的其中一主面的四片貼附帶(岡本(okamoto)股份有限公司製造的「No.402布帶」、寬度50 mm),形成框狀的導件65。2. Light-shielding property Use a non-woven fabric ("Bemcot" manufactured by Asahi Kasei Fiber Co., Ltd.) impregnated with acetone to carefully wipe the plate-shaped soda glass 62 (float glass, "MICRO glass slide made by Songlang glass" SLIDE GLASS) S9213 ", size 76 mm x 52 mm, thickness 1.2 mm to 1.5 mm, and 90% transmittance of irradiated light). It was used as a glass substrate for testing. As shown in FIG. 10, four pieces of stickers along one of the main surfaces of the soda glass 62 are attached ("No. 402 tape", 50 mm width, manufactured by okamoto Co., Ltd.) to form a frame-shaped guide 65 .
其次,於導件65內側的鈉玻璃62的表面62S滴加硬化性樹脂組成物(1 mL),利用玻璃棒進行擴展,形成硬化性樹脂層。對所形成的硬化性樹脂層,使用紫外線照射裝置(艾古飛(Eyegraphics)(股)製造、US5-X0401,使用光源:艾古飛(Eyegraphics)(股)製造、金屬鹵化物燈M04-L41),以照射強度400 mW/cm2 且以總照射量成為2000 mJ/cm2 的方式進行照射,使硬化性樹脂層的硬化反應進行。利用照度計(牛尾(USHIO)電機股份有限公司製造的「UIT-250」)來測定照射輸出。光照射後的硬化性樹脂層的厚度為150 μm。Next, a hardening resin composition (1 mL) was dropped on the surface 62S of the soda glass 62 inside the guide 65, and the hardening resin composition was expanded by a glass rod to form a hardening resin layer. For the formed curable resin layer, an ultraviolet irradiation device (manufactured by Eyegraphics Co., Ltd., US5-X0401) was used, and a light source was used: manufactured by Eyegraphics Co., Ltd., metal halide lamp M04-L41 ), Irradiation was performed at an irradiation intensity of 400 mW / cm 2 and the total irradiation amount became 2000 mJ / cm 2 to advance the curing reaction of the curable resin layer. The illuminance meter ("UIT-250" manufactured by Ushio Electric Co., Ltd.) was used to measure the irradiation output. The thickness of the curable resin layer after light irradiation was 150 μm.
使用可見紫外分光光度計(島津製作所股份有限公司製造的「UV-2400PC」)來測定光照射後的硬化性樹脂層的波長400 nm~700 nm的透光率。基於400 nm~700 nm下的平均透光率,以下述基準來評價遮光性。 A:400 nm~700 nm下的平均透光率小於10% F:400 nm~700 nm下的平均透光率為10%以上A visible ultraviolet spectrophotometer ("UV-2400PC" manufactured by Shimadzu Corporation) was used to measure the light transmittance of the curable resin layer at a wavelength of 400 nm to 700 nm after light irradiation. Based on the average light transmittance at 400 nm to 700 nm, the light-shielding property was evaluated on the following basis. A: The average light transmittance at 400 nm to 700 nm is less than 10% F: The average light transmittance at 400 nm to 700 nm is more than 10%
[表1]
表1表示與各硬化性樹組成物相關的接著力及遮光性的評價結果。確認到:各實施例中,藉由塗佈硬化性樹脂組成物的方法,可於狹窄的區域容易地形成具有充分的遮光性的遮光層。進而,所形成的遮光層顯現出高接著力。 [產業上之可利用性]Table 1 shows the evaluation results of the adhesion and light-shielding properties related to each hardenable tree composition. It was confirmed that in each of the examples, a light-shielding layer having sufficient light-shielding properties can be easily formed in a narrow area by a method of applying a curable resin composition. Furthermore, the formed light-shielding layer exhibited high adhesion. [Industrial availability]
根據本發明,可提供一種於製造圖像顯示裝置時,可用於形成遮光層的硬化性樹脂組成物,所述遮光層具有抑制自圖像顯示部與框架部之間漏光的遮光性,且即便為狹小的區域亦可有效率地形成。另外,根據本發明,可提供一種具備遮光層的圖像顯示用裝置的製造方法,所述遮光層可獲得即便為微細的接著面亦可抑制因落下衝擊及構成圖像顯示裝置的構件(例如撓性配線基板(FPC))的斥力等所導致的剝離及浮起的接著力、漏光的防止性優異。該些對於智慧型電話、觸控板(touch pad)、個人電腦(personal computer)、電視機等資訊終端機的工業性製造而言有用。According to the present invention, it is possible to provide a curable resin composition that can be used to form a light-shielding layer when an image display device is manufactured. A narrow area can also be formed efficiently. In addition, according to the present invention, it is possible to provide a method for manufacturing an image display device having a light-shielding layer, which can obtain a member (for example, a fine adhesive surface) that can suppress a drop impact and constitute an image display device (for example, The peeling and floating adhesion caused by the repulsive force of a flexible wiring board (FPC)), and the prevention of light leakage are excellent. These are useful for the industrial manufacture of information terminals such as smart phones, touch pads, personal computers, and televisions.
1‧‧‧圖像顯示部1‧‧‧Image display section
3‧‧‧遮光層3‧‧‧ shading layer
3A、103、105‧‧‧硬化性樹脂層3A, 103, 105‧‧‧‧curable resin layer
5‧‧‧框架部5‧‧‧Frame Department
20‧‧‧罩構件20‧‧‧Cover member
21‧‧‧蓋玻璃21‧‧‧ cover glass
22‧‧‧邊框部22‧‧‧Frame section
25‧‧‧透光部25‧‧‧Transmission Department
41‧‧‧液晶面板41‧‧‧LCD Panel
41S‧‧‧圖像顯示面41S‧‧‧Image display surface
42‧‧‧透光性感壓接著層42‧‧‧Translucent sexy laminating layer
43‧‧‧背光部43‧‧‧ backlight
45‧‧‧光源45‧‧‧light source
46‧‧‧光學片材部46‧‧‧Optical Sheet Division
51‧‧‧樹脂框架51‧‧‧ resin frame
52‧‧‧背光框架52‧‧‧ backlight frame
53‧‧‧殼體框架53‧‧‧shell frame
60、61‧‧‧玻璃基底60, 61‧‧‧ glass substrate
61E‧‧‧玻璃基底61的兩端部61E‧‧‧ glass substrate 61 both ends
62‧‧‧鈉玻璃62‧‧‧Sodium glass
62S‧‧‧鈉玻璃62的表面62S‧‧‧ Surface of Sodium Glass 62
65‧‧‧導件65‧‧‧Guide
100‧‧‧圖像顯示裝置100‧‧‧Image display device
101、104‧‧‧第1玻璃基材101, 104‧‧‧The first glass substrate
102、106‧‧‧第2玻璃基材102, 106‧‧‧ 2nd glass substrate
A‧‧‧硬化性樹脂層的寬度A‧‧‧Width of hardening resin layer
B‧‧‧與第2玻璃基材接觸的硬化性樹脂層的寬度B‧‧‧ width of the curable resin layer in contact with the second glass substrate
D‧‧‧拉離方向D‧‧‧Pull off direction
F‧‧‧箭頭F‧‧‧ Arrow
hν‧‧‧活性能量線hν‧‧‧ Active Energy Ray
W‧‧‧遮光層的寬度W‧‧‧ Width of light-shielding layer
圖1是用以對測定硬化性樹脂層的感壓性接著力的方法進行說明的圖。 圖2(a)、圖2(b)是用以對測定硬化性樹脂層的貼合時的縱橫比的方法進行說明的圖。 圖3是表示圖像顯示裝置的一實施形態的剖面圖。 圖4(a)、圖4(b)是表示製造圖像顯示裝置的方法的一實施形態的立體圖。 圖5(a)、圖5(b)是表示製造圖像顯示裝置的方法的一實施形態的立體圖。 圖6(a)、圖6(b)是表示製造圖像顯示裝置的方法的一實施形態的立體圖。 圖7(a)、圖7(b)是表示製造圖像顯示裝置的方法的一實施形態的立體圖。 圖8是表示測定接著力的方法的立體圖。 圖9是表示測定接著力的方法的立體圖。 圖10是表示評價遮光性的方法的立體圖。FIG. 1 is a diagram for explaining a method for measuring the pressure-sensitive adhesive force of a curable resin layer. 2 (a) and 2 (b) are diagrams for describing a method for measuring the aspect ratio at the time of bonding of the curable resin layer. FIG. 3 is a sectional view showing an embodiment of the image display device. 4 (a) and 4 (b) are perspective views showing an embodiment of a method of manufacturing an image display device. 5 (a) and 5 (b) are perspective views showing an embodiment of a method of manufacturing an image display device. 6 (a) and 6 (b) are perspective views illustrating an embodiment of a method of manufacturing an image display device. 7 (a) and 7 (b) are perspective views showing an embodiment of a method of manufacturing an image display device. FIG. 8 is a perspective view showing a method of measuring an adhesive force. FIG. 9 is a perspective view showing a method of measuring an adhesive force. FIG. 10 is a perspective view showing a method of evaluating light shielding properties.
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/074714 WO2018037516A1 (en) | 2016-08-24 | 2016-08-24 | Curable resin composition, image display device and manufacturing method of image display device |
| ??PCT/JP2016/074714 | 2016-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201825632A true TW201825632A (en) | 2018-07-16 |
Family
ID=61244994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106128813A TW201825632A (en) | 2016-08-24 | 2017-08-24 | Curable resin composition, image display device and manufacturing method of image display device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2018038226A1 (en) |
| KR (1) | KR20190044641A (en) |
| CN (1) | CN109641980A (en) |
| TW (1) | TW201825632A (en) |
| WO (2) | WO2018037516A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7345107B2 (en) | 2019-04-15 | 2023-09-15 | パナソニックIpマネジメント株式会社 | photocurable composition |
| JPWO2025075037A1 (en) * | 2023-10-05 | 2025-04-10 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920030B2 (en) | 1979-10-09 | 1984-05-10 | アキレス株式会社 | Synthetic leather with excellent flexibility and durability |
| JP2011006620A (en) * | 2009-06-29 | 2011-01-13 | Sanyo Chem Ind Ltd | Composition for hard coat |
| US9062224B2 (en) * | 2013-02-06 | 2015-06-23 | Xerox Corporation | Stretchable ink composition |
| JP6158028B2 (en) * | 2013-10-09 | 2017-07-05 | 株式会社トクヤマ | Radiation shielding ink |
| JP2015110745A (en) * | 2013-11-01 | 2015-06-18 | セメダイン株式会社 | Photocurable conductive composition |
| JP6273839B2 (en) * | 2013-12-27 | 2018-02-07 | 三菱ケミカル株式会社 | Laminate and optical film |
| JP2016069476A (en) * | 2014-09-29 | 2016-05-09 | 株式会社日本触媒 | Curable resin composition and use thereof |
-
2016
- 2016-08-24 WO PCT/JP2016/074714 patent/WO2018037516A1/en not_active Ceased
-
2017
- 2017-08-24 WO PCT/JP2017/030401 patent/WO2018038226A1/en not_active Ceased
- 2017-08-24 CN CN201780051380.3A patent/CN109641980A/en active Pending
- 2017-08-24 KR KR1020197008418A patent/KR20190044641A/en not_active Withdrawn
- 2017-08-24 TW TW106128813A patent/TW201825632A/en unknown
- 2017-08-24 JP JP2018535766A patent/JPWO2018038226A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018038226A1 (en) | 2019-07-11 |
| WO2018038226A1 (en) | 2018-03-01 |
| WO2018037516A1 (en) | 2018-03-01 |
| CN109641980A (en) | 2019-04-16 |
| KR20190044641A (en) | 2019-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI830400B (en) | Use of double-sided adhesive sheets, laminated bodies containing components for forming image display devices, laminated body forming sets, and double-sided adhesive sheets | |
| TWI610998B (en) | Optical adhesive resin composition, optical adhesive sheet, image display device, manufacturing method of optical adhesive sheet and manufacturing method of image display device | |
| TWI803811B (en) | Adhesive layer and adhesive film | |
| JP6866956B2 (en) | Method for manufacturing photo-curable adhesive sheet laminate, photo-curable adhesive sheet laminate, and method for manufacturing image display panel laminate | |
| KR20170008804A (en) | Transparent adhesive sheet | |
| WO2017183334A1 (en) | Polarizing film, method for producing same, optical film, and image display device | |
| JP6866880B2 (en) | Photo-curable adhesive sheet | |
| TW201816053A (en) | Curable resin composition, image display device and manufacturing method of image display device | |
| JP2022097577A (en) | Adhesive sheet, laminate for image display device configuration, and image display device | |
| JP5793855B2 (en) | Photo-curable adhesive and display element | |
| WO2017183335A1 (en) | Polarizing film, method for producing same, optical film, and image display device | |
| JP2017193633A (en) | Active energy ray-curable adhesive composition, laminated polarization film and method for producing the same, laminated optical film and image display device | |
| JP5991531B2 (en) | Manufacturing method of pressure-sensitive adhesive sheet for image display device | |
| TW201723115A (en) | Solventless adhesive composition, adhesive, adhesive sheet and display capable of exhibiting excellent blister resistance | |
| TWI734768B (en) | Adhesive plate, display body and manufacturing method of the objects | |
| TW201825632A (en) | Curable resin composition, image display device and manufacturing method of image display device | |
| CN106575052A (en) | Method for producing optical member and curable resin composition used therein | |
| CN116802245A (en) | Adhesive sheet and display body | |
| JP2019137710A (en) | Curable resin composition, image display device and method for manufacturing image display device | |
| JPWO2015132876A1 (en) | Adhesive sheet for image display device, method for manufacturing image display device using the same, and image display device | |
| TW201815580A (en) | Manufacturing method of image display device | |
| WO2019016960A1 (en) | Method for producing joined body, joined body, liquid crystal display and image display device | |
| WO2018038222A1 (en) | Curable resin composition, image display device and manufacturing method of image display device | |
| WO2018038217A1 (en) | Curable resin composition | |
| WO2019064385A1 (en) | Curable resin composition, image display device, and method for manufacturing image display device |