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TW201819501A - Curable composition, cured product, and production method for cured product - Google Patents

Curable composition, cured product, and production method for cured product Download PDF

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TW201819501A
TW201819501A TW106131365A TW106131365A TW201819501A TW 201819501 A TW201819501 A TW 201819501A TW 106131365 A TW106131365 A TW 106131365A TW 106131365 A TW106131365 A TW 106131365A TW 201819501 A TW201819501 A TW 201819501A
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acid
compound
carbon atoms
curable composition
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TW106131365A
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TWI781112B (en
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Toyofumi Shinozuka
Masumi Shinagawa
Sho Rokuya
Taiki Mihara
Keisuke Matsuhira
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Adeka Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Graft Or Block Polymers (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

A curable composition containing wet silica particles (A) having an average particle size of no more than 50 nm, a polymerizable compound (B), a polymerization initiator (C), and a colorant (D). The metal content in the wet silica particles (A) is ideally no more than 1,000 ppm. In addition, the wet silica particles (A) are ideally colloidal-dispersed silica particles.

Description

硬化性組合物、硬化物及硬化物之製造方法Curing composition, cured product and cured product manufacturing method

本發明係關於一種含有二氧化矽粒子及著色劑之硬化性組合物。The present invention relates to a curable composition containing cerium oxide particles and a coloring agent.

含有聚合性化合物及聚合起始劑之硬化性組合物(有視需要含有著色劑之情形)可藉由紫外線等活性能量線之照射、或者進行加熱而進行聚合硬化，因此於顯示器材料等各種用途中有用。 近年來，對於IPS/FFS(In-Plane Switching/Fringe Field Switching，橫向電場效應/邊緣電場切換)模式之液晶顯示器所應用之彩色濾光片用黑色光阻，要求高遮光性且高電阻(高絕緣性)、高精細，但存在如下問題，即並無以較高等級兼顧有高電阻與高精細之彩色濾光片。 於專利文獻1、2、3及4中揭示有可製作高電阻之硬化物之組合物。於專利文獻1中揭示有含有光硬化性樹脂、丙烯酸系樹脂粒子、遮光性顏料，且可獲得高電阻之硬化物之感光性組合物。於專利文獻2中揭示有藉由使用經二氧化矽被覆之著色劑而可獲得高電阻之硬化物之著色組合物。於專利文獻3中揭示有藉由使用被碳黑內包之二氧化矽而可獲得高電阻之硬化物之著色組合物。於專利文獻4中揭示有藉由含有利用氣相反應所合成之粒狀二氧化矽、黑色有機顏料及光硬化性樹脂而可獲得高電阻之硬化物的黑色光阻用感光性樹脂組合物。 [先前技術文獻] [專利文獻] 專利文獻1：日本專利特開2010-256589號公報 專利文獻2：日本專利特開2001-115043號公報 專利文獻3：日本專利特開2008-150428號公報 專利文獻4：日本專利特開2008-304583號公報The curable composition containing a polymerizable compound and a polymerization initiator (when a coloring agent is contained as needed) can be polymerized and cured by irradiation with an active energy ray such as ultraviolet rays or by heating, and thus can be used for various purposes such as display materials. Useful in the middle. In recent years, black light resists for color filters applied to liquid crystal displays of IPS/FFS (In-Plane Switching/Fringe Field Switching) mode require high light blocking and high resistance (high Insulation), high precision, but there is a problem that there is no color filter with high resistance and high precision at a higher level. Patent Documents 1, 2, 3 and 4 disclose compositions which can produce a cured product of high electrical resistance. Patent Document 1 discloses a photosensitive composition containing a photocurable resin, acrylic resin particles, and a light-blocking pigment, and a cured product having high electrical resistance can be obtained. Patent Document 2 discloses a coloring composition which can obtain a cured product having high electrical resistance by using a coloring agent coated with cerium oxide. Patent Document 3 discloses a coloring composition which can obtain a cured product having high electrical resistance by using cerium oxide encapsulated in carbon black. Patent Document 4 discloses a photosensitive resin composition for a black photoresist which can obtain a cured product having high electrical resistance by containing particulate cerium oxide, a black organic pigment, and a photocurable resin synthesized by a gas phase reaction. [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. 4: Japanese Patent Laid-Open Publication No. 2008-304583

然而，由專利文獻1所記載之感光性組合物獲得之硬化物存在遮光性較低之問題。由專利文獻2所記載之著色感光性物獲得之硬化物存在如下問題：由於著色劑之表面經二氧化矽被覆，故而呈現出偏白之顏色，而不易獲得漆黑性較高之硬化物。由專利文獻3所記載之著色組合物獲得之硬化物存在未獲得充分之電阻之問題。專利文獻4所記載之光硬化性樹脂存在保存穩定性之問題，進而所獲得之硬化物之平滑性存在問題。 因此，本發明之目的在於提供一種可製作如下硬化物之硬化性組合物，該硬化物能夠達成可滿足高電阻及高精細圖案之製作之等級。又，於使用黑色顏料作為著色劑之硬化性組合物之情形時，可製作高遮光之硬化物。 本發明係藉由提供下述[1]～[8]而達成上述目的者。 [1]一種硬化性組合物，其含有：平均粒徑為50 nm以下之濕式二氧化矽粒子(A)[以下，亦記載為二氧化矽粒子(A)]、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)。 [2]如上述[1]記載之硬化性組合物，其中上述二氧化矽粒子(A)之金屬之含量為1000 ppm以下。 [3]如上述[1]或[2]記載之硬化性組合物，其中聚合性化合物(B)為下述通式(I)所表示之化合物、 具有使下述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物、或者 具有如下結構之不飽和化合物，該結構係使具有使下述通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成。 [化1](式中，M表示直接鍵、碳原子數1～20之烴基、-O-、-S-、-SO2 -、-SS-、-SO-、-CO-、-OCO-、選自下述式(a)、(b)、(c)或(d)所表示之群中之取代基， M所表示之基中之氫原子有被取代為鹵素原子之情形， R1 、R2 、R3 、R4 、R5 、R6 、R7 及R8 (以下，亦記載為R1 ～R8 )分別獨立地表示氫原子、碳原子數1～20之烴基或鹵素原子， R1 ～R8 所表示之基中之亞甲基亦有於不與氧相鄰之條件下被取代為-O-之情形， n為0～10之數， 於n為0以外之情形時，存在複數個之R1 ～R8 及M有各自相同之情形，亦有各自不同之情形)。 [化2](式中，R9 表示碳原子數1～20之烴基， R10 、R11 、R12 、R13 、R14 、R15 、R16 、R17 、R18 、R19 、R20 、R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R35 、R36 、R37 及R38 (以下，亦記載為R10 ～R38 )分別獨立地表示氫原子、碳原子數1～20之烴基、含有雜環之碳原子數2～20之基、或鹵素原子， R10 ～R38 所表示之基中之亞甲基有於不與氧相鄰之條件下被取代為-O-或-S-之情形， R10 與R11 、R11 與R12 、R12 與R13 、R13 與R14 、R22 與R15 、R15 與R16 、R30 與R23 、R23 與R24 、R24 與R25 、R38 與R31 、R31 與R32 、R32 與R33 、R34 與R35 、R35 與R36 及R36 與R37 有鍵結而形成環之情形， 式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。 [4]如上述[1]至[3]中任一項記載之硬化性組合物，其中上述聚合起始劑(C)為具有下述通式(II)所表示之基之化合物。 [化3](式中，R41 及R42 分別獨立地表示氫原子、鹵素原子、硝基、氰基、碳原子數1～20之烴基或含有雜環之碳原子數2～20之基， R41 及R42 所表示之碳原子數1～20之烴基或含有雜環之碳原子數2～20之基中之氫原子有被取代為鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯醚基、巰基、異氰酸基或含有雜環之碳原子數2～20之基之情形， R41 及R42 所表示之基中之亞甲基亦有被取代為-O-、-CO-、-COO-、-OCO-、-NR43 -、-NR43 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-或CSO-之情形， R43 表示氫原子、碳原子數1～20之烴基， m表示0或1， 式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。 [5]如上述[1]至[4]中任一項記載之硬化性組合物，其中上述著色劑(D)為黑色顏料。 [6]一種硬化物之製造方法，其具有如下步驟：使用如上述[1]至[5]中任一項記載之硬化性組合物並使該硬化性組合物硬化。 [7]一種硬化物，其係如上述[1]至[5]中任一項記載之硬化性組合物之硬化物。 [8]一種彩色濾光片，其含有如上述[7]記載之硬化物。However, the cured product obtained from the photosensitive composition described in Patent Document 1 has a problem that the light-shielding property is low. The cured product obtained from the colored photosensitive material described in Patent Document 2 has a problem in that since the surface of the coloring agent is coated with cerium oxide, it exhibits a white color, and it is not easy to obtain a cured product having a high blackening property. The cured product obtained from the colored composition described in Patent Document 3 has a problem that sufficient resistance is not obtained. The photocurable resin described in Patent Document 4 has a problem of storage stability, and further, there is a problem in the smoothness of the obtained cured product. Accordingly, it is an object of the present invention to provide a curable composition which can produce a cured product which can achieve a level which can satisfy the production of high resistance and high definition patterns. Further, in the case of using a black pigment as a curable composition for a colorant, a cured product having high light-shielding can be produced. The present invention has been achieved by providing the following [1] to [8]. [1] A curable composition comprising: wet cerium oxide particles (A) having an average particle diameter of 50 nm or less (hereinafter also referred to as cerium oxide particles (A)], and a polymerizable compound (B) , a polymerization initiator (C) and a color former (D). [2] The curable composition according to the above [1], wherein the content of the metal of the cerium oxide particles (A) is 1000 ppm or less. [3] The curable composition according to the above [1] or [2] wherein the polymerizable compound (B) is a compound represented by the following formula (I) and has a formula represented by the following formula (I) a structural unsaturated compound obtained by esterifying a compound with an unsaturated monobasic acid, or an unsaturated compound having a structure which has an epoxy compound represented by the following general formula (I) and an unsaturated compound The unsaturated compound of the structure obtained by esterification of a monobasic acid is further esterified with a polybasic acid anhydride. [Chemical 1] (wherein M represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, -O-, -S-, -SO 2 -, -SS-, -SO-, -CO-, -OCO-, selected from the group consisting of The substituent in the group represented by the formula (a), (b), (c) or (d), wherein the hydrogen atom in the group represented by M is substituted with a halogen atom, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 (hereinafter also referred to as R 1 to R 8 ) each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms or a halogen atom, and R 1 The methylene group in the group represented by -R 8 is also substituted with -O- under the condition that it is not adjacent to oxygen, and n is a number from 0 to 10, and exists when n is other than 0. A plurality of R 1 to R 8 and M have their own identical cases, and there are also different cases). [Chemical 2] (wherein R 9 represents a hydrocarbon group having 1 to 20 carbon atoms, and R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 and R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 and R 38 (hereinafter also referred to as R 10 to R 38 ) each independently represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a group having 2 to 20 carbon atoms containing a hetero ring, or a halogen atom, and R 10 to The methylene group in the group represented by R 38 is substituted with -O- or -S- under the condition that it is not adjacent to oxygen, R 10 and R 11 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 22 and R 15 , R 15 and R 16 , R 30 and R 23 , R 23 and R 24 , R 24 and R 25 , R 38 and R 31 , R 31 and R 32 , R 32 and R 33 , R 34 and R 35 , R 35 and R 36 and R 36 are bonded to R 37 to form a ring, wherein * means that the group represented by the equation is * part adjacent to The base is bonded). [4] The curable composition according to any one of the above [1] to [3] wherein the polymerization initiator (C) is a compound having a group represented by the following formula (II). [Chemical 3] (wherein R 41 and R 42 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a hetero ring, and R 41 and The hydrocarbon group having 1 to 20 carbon atoms represented by R 42 or the hydrogen atom in the group having 2 to 20 carbon atoms containing a hetero ring is substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group or a carboxyl group. a methacryloyl fluorenyl group, an acryl fluorenyl group, an epoxy group, a vinyl group, a vinyl ether group, a decyl group, an isocyanate group or a group having 2 to 20 carbon atoms containing a hetero ring, represented by R 41 and R 42 The methylene group in the group is also substituted with -O-, -CO-, -COO-, -OCO-, -NR 43 -, -NR 43 CO-, -S-, -CS-, -SO 2 In the case of -, -SCO-, -COS-, -OCS- or CSO-, R 43 represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, and m represents 0 or 1, wherein * means The base of the representation is bonded with the * part and the adjacent base). [5] The curable composition according to any one of the above [1] to [4] wherein the coloring agent (D) is a black pigment. [6] A method for producing a cured product, which comprises the step of using the curable composition according to any one of the above [1] to [5], and curing the curable composition. [7] A cured product of the curable composition according to any one of the above [1] to [5]. [8] A color filter comprising the cured product according to [7] above.

以下，針對本發明之硬化性組合物，基於較佳之實施形態進行說明。 本發明之硬化性組合物含有：平均粒徑為50 nm以下之濕式二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)。以下，針對各成分，依序進行說明。 ＜二氧化矽粒子(A)＞ 本發明之硬化性組合物所使用之二氧化矽粒子(A)係包含平均粒徑為50 nm以下之濕式二氧化矽之粒子。所謂濕式二氧化矽，係於液體中合成之非晶質二氧化矽。本發明之硬化性組合物所使用之二氧化矽粒子(A)係例如藉由利用無機酸將矽酸鈉進行中和之沈澱法或凝膠法、或者使烷氧基矽烷水解之溶膠凝膠法等而獲得。 於本發明中，就對於聚合性化合物或溶劑之分散性良好之方面而言，濕式二氧化矽中，尤佳為經膠體分散之二氧化矽粒子，就相同之觀點而言，較佳為表面處理二氧化矽。 本發明之硬化性組合物所使用之二氧化矽粒子(A)其作為雜質之金屬之含量並無特別規定，但較佳為金屬之含量較少。關於二氧化矽粒子(A)中之金屬濃度，可於分散至適當之分散介質中後，藉由ICP-MS(Inductively coupled plasma-Mass spectrometry，感應耦合電漿-質譜測定)法而高感度地進行測定。 又，作為包含於二氧化矽粒子(A)中欠佳之金屬，可列舉：鐵、鈉、鈦、鋁、鉀、鈣、鋯及鎂。二氧化矽粒子(A)中之金屬含量較佳為1000 ppm以下，更佳為100 ppm以下，進而較佳為1 ppm以下。 本發明之硬化性組合物所使用之二氧化矽粒子(A)係平均粒徑為50 nm以下，就可獲得無損著色劑之分散性之穩定之硬化性組合物、以及自硬化性組合物獲得之硬化物變得高精細之方面而言，較佳為平均粒徑為30 nm以下，更佳為20 nm以下。作為二氧化矽粒子(A)之平均粒徑之下限值，並無特別限制，可設為10 nm以上。二氧化矽粒子之平均粒徑可使用雷射繞射式粒度分佈測定裝置進行測定，作為雷射繞射式粒度分佈測定裝置，可列舉：日機裝(股)製造之Microtrac粒度分佈計。 所謂上述表面處理二氧化矽，係二氧化矽粒子表面之矽烷醇基之一部分或全部進行化學反應而成者，例如可列舉：藉由添加二氧化矽粒子與烷氧基矽烷化合物等有機矽化合物、溶劑、及視需要用以使上述有機矽化合物水解之作為觸媒之酸或鹼並進行加熱而獲得之二氧化矽粒子。 作為上述二氧化矽粒子(A)，可較佳地使用市售品，例如可列舉：PL-1-IPA、PL-1-TOL、PL-2L-PGME、PL-2L-MEK(以上，扶桑化學工業製造)；YA010C-LDI、YA050C-LHI、YA010C-SP3(Admatechs公司製造)；有機矽溶膠MA-ST-M、MA-ST-L、IPA-ST、IPA-ST-L、IPA-ST-UP、EG-ST、NPC-ST-30、PGM-ST、DMAC-ST、MEK-ST-40、MEK-ST-UP、MIBK-ST、MIBK-ST-L、CHO-ST-M、EAC-ST、PMA-ST、TOL-ST、MEK-AC-2140Z、MEK-AC-4130Y、MEK-AC-5140Z、PGM-AC-2140Y、PGM-AC-4130Y、MIBK-AC-4130Y、MIBK-AC-2140Y、MIBK-SD-L、MEK-EC-2130Y、MEK-EC-6150P、MEK-EC-7150P、EP-F2130Y、EP-F6140P、EP-F7150P(以上，日產化學工業公司製造)等。 於本發明之硬化性組合物中，上述二氧化矽粒子(A)之含量並無特別限定，相對於上述著色劑(D)100質量份，較佳為0.1～70質量份，更佳為0.5～50質量份，進而較佳為5～20質量份。於二氧化矽粒子(A)之含量為上述範圍之情形時，可獲得二氧化矽粒子及著色劑之分散性優異之硬化性組合物以及電阻較高且具備高精細之硬化物，故而較佳。 例如於形成厚度1～3 μm之硬化物之情形時，上述二氧化矽粒子(A)之含量並無特別限定，相對於上述著色劑(D)100質量份，較佳為0.1～70質量份，更佳為0.5～50質量份，進而較佳為5～20質量份。 ＜聚合性化合物(B)＞ 本發明之硬化性組合物所使用之聚合性化合物(B)係具有自由基聚合、陽離子聚合及陰離子聚合等聚合性之化合物，就反應性良好，聚合性化合物之種類較多之方面而言，可較佳地使用自由基聚合性化合物及陽離子聚合性化合物。 作為自由基聚合性化合物，並無特別限定，可使用先前已知之具有自由基聚合性之化合物，例如可列舉：乙烯、丙烯、丁烯、異丁烯、氯乙烯、偏二氯乙烯、偏二氟乙烯及四氟乙烯等不飽和脂肪族烴；(甲基)丙烯酸、α-氯丙烯酸、伊康酸、馬來酸、檸康酸、富馬酸、雙環庚烯二甲酸、丁烯酸、異丁烯酸、乙烯基乙酸、烯丙基乙酸、桂皮酸、己二烯酸、中康酸、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸單[2-(甲基)丙烯醯氧基乙基]酯及ω-羧基聚己內酯單(甲基)丙烯酸酯等於兩末端具有羧基與羥基之聚合物之單(甲基)丙烯酸酯；(甲基)丙烯酸羥基乙酯・馬來酸酯、(甲基)丙烯酸羥基丙酯・馬來酸酯、二環戊二烯・馬來酸酯及具有1個羧基與2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯等不飽和一元酸；(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸縮水甘油酯、下述化合物No.A1～No.A4、(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸環己基、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸二甲胺基甲酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸二甲胺基丙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸聚(乙氧基)乙酯、(甲基)丙烯酸丁氧基乙氧基乙酯、(甲基)丙烯酸乙基己酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸四氫呋喃酯、(甲基)丙烯酸乙烯酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸苄酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二氫芳樟醇二(甲基)丙烯酸酯、異氰尿酸三[(甲基)丙烯醯基乙基]酯及(甲基)丙烯酸聚酯低聚物等不飽和一元酸及多元醇或多酚之酯；(甲基)丙烯酸鋅及(甲基)丙烯酸鎂等不飽和多元酸之金屬鹽；馬來酸酐、伊康酸酐、檸康酸酐、甲基四氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、三烷基四氫鄰苯二甲酸酐、5-(2,5-二側氧四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二烯基琥珀酸酐及甲基雙環庚烯二甲酸酐等不飽和多元酸之酸酐；(甲基)丙烯醯胺、亞甲基雙-(甲基)丙烯醯胺、二伸乙基三胺三(甲基)丙烯醯胺、苯二甲基雙(甲基)丙烯醯胺、α-氯丙烯醯胺及N-2-羥基乙酯(甲基)丙烯醯胺等不飽和一元酸與多元胺之醯胺；丙烯醛等不飽和醛；(甲基)丙烯腈、α-氯丙烯腈、偏氰二乙烯及烯丙基氰等不飽和腈；苯乙烯、4-甲基苯乙烯、4-乙基苯乙烯、4-甲氧基苯乙烯、4-羥基苯乙烯、4-氯苯乙烯、二乙烯苯、乙烯基甲苯、乙烯基苯甲酸、乙烯基苯酚、乙烯基磺酸、4-乙烯苯磺酸、乙烯基苄基甲醚及乙烯基苄基縮水甘油醚等不飽和芳香族化合物；甲基乙烯基酮等不飽和酮；乙烯胺、烯丙基胺、N-乙烯基吡咯啶酮及乙烯基哌啶等不飽和胺化合物；烯丙醇及巴豆醇等乙烯醇；乙烯基甲醚、乙烯基乙醚、正丁基乙烯醚、異丁基乙烯醚及烯丙基縮水甘油醚等乙烯醚；馬來醯亞胺、N-苯基馬來醯亞胺及N-環己基馬來醯亞胺等不飽和醯亞胺類；茚及1-甲基茚等茚類；1,3-丁二烯、異戊二烯及氯丁二烯等脂肪族共軛二烯類；聚苯乙烯、聚(甲基)丙烯酸甲酯、聚(甲基)丙烯酸正丁酯及聚矽氧烷等於聚合物分子鏈之末端具有單(甲基)丙烯醯基之巨單體類；氯乙烯、偏二氯乙烯、二乙烯琥珀醯、鄰苯二甲酸二烯丙酯、磷酸三烯丙酯、異氰尿酸三烯丙酯、乙烯基硫醚、乙烯基咪唑、乙烯基㗁唑啉、乙烯基咔唑、乙烯基吡咯啶酮、乙烯基吡啶、含羥基之乙烯基單體、聚異氰酸酯化合物之乙烯基胺基甲酸酯化合物、含羥基之乙烯基單體及多聚環氧化合物等乙烯基環氧化合物。 作為上述自由基聚合性化合物，亦可使用市售品，例如可列舉：Kayarad DPHA、DPEA-12、PEG400DA、THE-330、RP-1040、NPGDA、PET30(以上，日本化藥製造)；ARONIX M-215、M-350(以上，東亞合成製造)；NK Ester A-DPH、A-TMPT、A-DCP、A-HD-N、TMPT、DCP、NPG及HD-N(以上，新中村化學工業製造)；SPC-1000、SPC-3000(以上，昭和電工製造)；等。 [化4][化5][化6][化7]就獲得著色劑(D)之分散性良好之硬化性組合物及耐熱性良好之硬化物的方面而言，較理想為上述聚合性化合物(B)為上述通式(I)所表示之化合物；具有使上述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物；或者具有使具有使上述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成之結構的不飽和化合物。尤其理想為上述聚合性化合物(B)為具有使上述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構，且具有[下述(g)]之結構之不飽和化合物；或者具有使具有使上述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成之結構，且具有[下述(h)]之結構之不飽和化合物。 本發明之組合物較理想為如上所述含有「通式(I)所表示之環氧化合物」、「具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物」或者「具有如下結構之不飽和化合物，該結構係使具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成」作為聚合性化合物(B)。於本發明中，可如下所述使用多種多樣之化合物作為不飽和一元酸及多元酸酐。因此，上述「具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物」及「具有如下結構之不飽和化合物，該結構係使具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成」之結構根據該聚合性化合物(B)之製造時所使用之原料之結構而有較大差異。因此，現狀為根本無法一律用某一種之通式表示作為上述聚合性化合物(B)較理想之不飽和化合物的結構，此情況係業者之技術常識。而且，若不特定出結構，則亦難以知曉由其結構所決定之其物質特性，因此亦無法於特性上進行表述。因此，於本發明中，不得不將作為上述聚合性化合物(B)較理想之不飽和化合物定義為如下表述：「具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物」、「具有如下結構之不飽和化合物，該結構係使具有使通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成」。即，關於本發明中所使用之較理想之聚合性化合物(B)，存在如下情況，即「於申請專利時將環氧丙烯酸酯根據其結構或特性直接進行特定之情況」無法實現或不太現實。 [化8](式中，Y1 表示不飽和一元酸之殘基，Y2 表示多元酸酐之殘基， 式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。 上述通式(I)中之M所表示之碳原子數1～20之烴基並無特別限定，較佳為表示碳原子數1～20之伸烷基、碳原子數3～20之伸環烷基等。 作為上述原子數1～20之伸烷基，例如可列舉：亞甲基、伸乙基、伸丙基、伸丁基、伸戊基、伸己基、伸庚基、伸辛基、伸壬基、伸癸基、伸十一烷基、伸十二烷基、伸十三烷基、伸十四烷基、伸十五烷基、伸十六烷基、伸十七烷基、伸十八烷基、伸十九烷基、伸二十烷基等。 作為上述碳原子數3～20之伸環烷基，可列舉：伸環丙基、伸環戊基、伸環己基、伸環庚基、伸環辛基等。 上述通式(I)中之R1 ～R38 所表示之碳原子數1～20之烴基並無特別限定，較佳為表示碳原子數1～20之烷基、碳原子數2～20之烯基、碳原子數3～20之環烷基、碳原子數4～20之環烷基烷基、碳原子數6～20之芳基及碳原子數7～20之芳烷基等，就用作聚合性化合物(B)之情形時之感度良好之方面而言，更佳為碳原子數1～10之烷基、碳原子數2～10之烯基、碳原子數1～10之烷二基、碳原子數3～10之環烷基、碳原子數4～10之環烷基烷基、碳原子數6～10之芳基及碳原子數7～10之芳烷基等。 作為上述碳原子數1～20之烷基，例如可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、異戊基、第三戊基、己基、庚基、辛基、異辛基、2-乙基己基、第三辛基、壬基、異壬基、癸基、異癸基、十一烷基、十二烷基、十四烷基、十六烷基、十八烷基及二十烷基等，作為上述碳原子數1～10之烷基，例如可列舉：甲基、乙基、丙基、異丙基、丁基、異丁、第二丁基、第三丁基、戊基、異戊基、第三戊基、己基、庚基、辛基、異辛基、2-乙基己基、第三辛基、壬基、異壬基、癸基及異癸基等。 作為上述碳原子數2～20之烯基，例如可列舉：乙烯基、2-丙烯基、3-丁烯基、2-丁烯基、4-戊烯基、3-戊烯基、2-己烯基、3-己烯基、5-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基、4-癸烯基、3-十一烯基、4-十二烯基、3-環己烯基、2,5-環己二烯基-1-甲基、及4,8,12-十四-三烯基烯丙基等，作為上述碳原子數2～10之烯基，例如可列舉：乙烯基、2-丙烯基、3-丁烯基、2-丁烯基、4-戊烯基、3-戊烯基、2-己烯基、3-己烯基、5-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基及4-癸烯基等。 所謂上述碳原子數3～20之環烷基，意指具有3～20之碳原子之飽和單環式或飽和多環式烷基。例如可列舉：環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基、金剛烷基、十氫萘、八氫并環戊二烯、二環[1.1.1]戊基及四-十二氫蒽基等，作為上述碳原子數3～10之環烷基，例如可列舉：環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基、金剛烷基、十氫萘、八氫并環戊二烯及二環[1.1.1]戊基等。 所謂上述碳原子數4～20之環烷基烷基，意指烷基之氫原子經環烷基取代之具有4～20之碳原子之基。例如可列舉：環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基、環癸基甲基、2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、2-環壬基乙基、2-環癸基乙基、3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、3-環辛基丙基、3-環壬基丙基、3-環癸基丙基、4-環丁基丁基、4-環戊基丁基、4-環己基丁基、4-環庚基丁基、4-環辛基丁基、4-環壬基丁基、4-環癸基丁基、3-3-金剛烷基丙基及十氫萘丙基等，作為上述碳原子數4～10之環烷基烷基，例如可列舉：環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基、2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、4-環丁基丁基、4-環戊基丁基及4-環己基丁基等。 作為上述碳原子數6～20之芳基，例如可列舉：苯基、甲苯基、二甲苯基、乙基苯基、萘基、蒽基、菲基等、或經1個以上之上述烷基、上述烯基或羧基、鹵素原子等取代之苯基、聯苯基、萘基、蒽基等，例如4-氯苯基、4-羧基苯基、4-乙烯基苯基、4-甲基苯基、2,4,6-三甲基苯基等，作為上述碳原子數6～10之芳基，例如可列舉：苯基、甲苯基、二甲苯基、乙基苯基及萘基等、或經1個以上之上述烷基、上述烯基或羧基、鹵素原子等取代之苯基、聯苯基、萘基、蒽基等，例如4-氯苯基、4-羧基苯基、4-乙烯基苯基、4-甲基苯基、2,4,6-三甲基苯基等。 所謂上述碳原子數7～20之芳烷基，意指烷基之氫原子經芳基取代之具有7～30個碳原子之基。例如可列舉：苄基、α-甲基苄基、α,α-二甲基苄基、苯基乙基及萘基丙基等，所謂上述碳原子數7～20之芳烷基，意指烷基之氫原子經芳基取代之具有7～20個碳原子之基。例如可列舉：苄基、α-甲基苄基、α,α-二甲基苄基及苯基乙基等。 上述通式(I)中之R10 ～R38 所表示之含有雜環之碳原子數2～20之基並無特別限定，例如可列舉：吡咯基、吡啶基、吡啶基乙基、嘧啶基、嗒𠯤基、哌嗪基、哌啶基、吡喃基、吡喃基乙基、吡唑基、三嗪基、三嗪基甲基、吡咯啶基、喹啉基、異喹啉基、咪唑基、苯并咪唑基、三唑基、呋喃基、呋喃基、苯并呋喃基、噻吩基(thienyl)、苯硫基(thiophenyl)、苯并噻吩基、噻二唑基、噻唑基、苯并噻唑基、㗁唑基、苯并㗁唑基、異噻唑基、異㗁唑基、吲哚基、嗎啉基、硫代嗎啉基、2-吡咯啶酮-1-基、2-哌啶酮-1-基、2,4-二氧基咪唑啶-3-基及2,4-二氧基㗁唑啶-3-基等，若包括取代基等在內具體地進行記載，則可列舉具有下述結構之基等。 [化9](上述式中，R分別獨立地表示氫原子或碳原子數1～6之烷基，Z表示直接鍵或碳原子數1～6之伸烷基。再者，式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。 作為上述碳原子數1～6之烷基，可列舉：作為碳原子數1～20之烷基於上述中所例示者之中之碳原子數1～6者。 作為碳原子數1～6之伸烷基，可列舉：作為M所表示之碳原子數1～20之伸烷基所例示者之中的碳原子數1～6者。 作為通式(I)中之鹵素原子，可列舉：氟、氯、溴、碘。 作為上述通式(I)中之R10 與R11 、R11 與R12 、R12 與R13 、R13 與R14 、R22 與R15 、R15 與R16 、R30 與R23 、R23 與R24 、R24 與R25 、R38 與R31 、R31 與R32 、R32 與R33 、R34 與R35 、R35 與R36 及R36 與R37 鍵結所形成之環，例如可列舉：環戊烷、環己烷、環戊烯、苯、吡咯啶、吡咯、哌𠯤、嗎啉、硫代嗎啉、四氫吡啶、內酯環及內醯胺環等5～7員環以及萘及蒽等縮合環等。 所謂上述不飽和一元酸，係表示於結構中具有不飽和鍵，且每1分子具有1個能夠游離而成為氫離子之氫原子之酸。作為上述不飽和一元酸，例如可列舉：丙烯酸、甲基丙烯酸、丁烯酸、桂皮酸、己二烯酸及甲基丙烯酸羥基乙酯・馬來酸酯、甲基丙烯酸羥基丙酯・馬來酸酯、丙烯酸羥基丙酯・馬來酸酯及二環戊二烯・馬來酸酯等。 所謂上述多元酸酐，係表示每1分子具有2個以上之能夠游離而成為氫離子之氫原子之多元酸的酸酐。 作為上述多元酸酐，例如可列舉：聯苯四羧酸二酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、聯苯四甲酸酐、琥珀酸酐、馬來酸酐、偏苯三甲酸酐、均苯四甲酸酐、2,2'-3,3'-二苯甲酮四羧酸酐、乙二醇雙脫水偏苯三酸酯、甘油三脫水偏苯三酸酯、六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、耐地酸酐、甲基耐地酸酐、三烷基四氫鄰苯二甲酸酐、5-(2,5-二側氧四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二烯基琥珀酸酐及甲基雙環庚烯二甲酸酐等。 上述通式(I)所表示之環氧化合物與上述不飽和一元酸及上述多元酸酐之反應比率較佳為設為如下。 即，較佳為設為如下比率：於具有相對於上述環氧化合物之環氧基1個，加成上述不飽和一元酸之羧基0.1～1.0個而成之結構的環氧加成物中，相對於該環氧加成物之羥基1個，使上述多元酸酐之多元酸酐結構成為0.1～1.0個。 將上述環氧化合物、上述不飽和一元酸及上述多元酸酐之反應例示於以下，但本發明並非限定於下述反應方案1者。 [化10]作為上述聚合性化合物(B)，就獲取容易性或於將碳黑作為著色劑添加之情形時成為高OD值之方面而言，上述之反應生成物之中，較佳為使用R1 ～R8 為氫原子者作為通式(I)所表示之環氧化合物。又，就同樣之觀點而言，亦較佳為使用：M為(c)所表示之基且R10 ～R14 所表示之基為氫原子或苯基者、M為(d)所表示之基且R15 ～R22 為氫原子或苯基者、M為(e)所表示之基且R23 ～R30 為氫原子或苯基者、或者M為(f)所表示之基且R31 ～R38 為氫原子或苯基者。尤其是就硬化物之體積電阻較高之方面而言，更佳為M為(d)所表示之基之情形。 又，作為上述不飽和一元酸，較佳為使用碳原子數5以下者之不飽和一元酸，尤佳為使用丙烯酸、甲基丙烯酸等之不飽和一元酸。又，作為多元酸酐，較佳為具有苯環或飽和脂肪環者，尤佳為使用聯苯四羧酸二酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐及聯苯四甲酸酐等之多元酸酐。 作為本發明之聚合性化合物(B)，就著色劑之分散性、硬化性良好之方面而言，較佳為使用基於下述製造方法之生成物，但並不限於該等。 具體而言，例如選擇1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿作為上述通式(I)所表示之環氧化合物，選擇丙烯酸作為不飽和一元酸，選擇聯苯四甲酸酐作為多元酸酐而成之生成物； 選擇1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿作為上述通式(I)所表示之環氧化合物，選擇丙烯酸作為不飽和一元酸，選擇四氫鄰苯二甲酸酐作為多元酸酐而成之生成物； 選擇1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿作為上述通式(I)所表示之環氧化合物，選擇丙烯酸作為不飽和一元酸，選擇鄰苯二甲酸酐作為多元酸而成之生成物； 選擇1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿作為上述通式(I)所表示之環氧化合物，選擇丙烯酸作為不飽和一元酸，選擇聯苯四甲酸酐及四氫鄰苯二甲酸酐作為多元酸酐而成之生成物及 選擇1,1-雙[4-(2,3-環氧丙氧基)苯基]-3-苯基茚滿作為上述通式(I)所表示之環氧化合物，選擇丙烯酸作為不飽和一元酸，選擇聯苯四甲酸酐及四氫鄰苯二甲酸酐作為多元酸酐而成之生成物等。 上述自由基聚合性化合物之中，於使用具有酸值之化合物之情形時，可對本發明之硬化性組合物賦予鹼顯影性。於使用上述具有酸值之化合物之情形時，關於其使用量，較佳為相對於上述具有自由基聚合性之聚合性化合物100質量份，使之成為50～99質量份。 又，上述具有酸值之化合物亦可藉由進而使單官能或多官能環氧化合物進行反應而調整酸值後使用。藉由調整上述具有酸值之化合物之酸值，可改良硬化性組合物之鹼顯影性。上述具有酸值之化合物(即賦予鹼顯影性之具有自由基聚合性之聚合性化合物)較佳為固形物成分之酸值為5～120 mgKOH/g之範圍，單官能或多官能環氧化合物之使用量較佳為以滿足上述酸值之方式選擇。 作為上述單官能環氧化合物，可列舉：甲基丙烯酸縮水甘油酯、甲基縮水甘油醚、乙基縮水甘油醚、丙基縮水甘油醚、異丙基縮水甘油醚、丁基縮水甘油醚、異丁基縮水甘油醚、第三丁基縮水甘油醚、戊基縮水甘油醚、己基縮水甘油醚、庚基縮水甘油醚、辛基縮水甘油醚、壬基縮水甘油醚、癸基縮水甘油醚、十一烷基縮水甘油醚、十二烷基縮水甘油醚、十三烷基縮水甘油醚、十四烷基縮水甘油醚、十五烷基縮水甘油醚、十六烷基縮水甘油醚、2-乙基己基縮水甘油醚、烯丙基縮水甘油醚、炔丙基縮水甘油醚、對甲氧基乙基縮水甘油醚、苯基縮水甘油醚、對甲氧基縮水甘油醚、對丁基苯酚縮水甘油醚、甲苯基縮水甘油醚、2-甲基甲苯基縮水甘油醚、4-壬基苯基縮水甘油醚、苄基縮水甘油醚、對異丙苯基苯基縮水甘油醚、三苯甲基縮水甘油醚、甲基丙烯酸2,3-環氧丙酯、環氧化大豆油、環氧化亞麻仁油、丁酸縮水甘油酯、一氧化乙烯基環己烷、1,2-環氧-4-乙烯基環己烷、環氧苯乙烷、氧化蒎烯、甲基環氧苯乙烷、氧化環己烯、環氧丙烷、上述化合物No.A1～No.A4等。 作為上述多官能環氧化合物，若使用選自由雙酚型環氧化合物及縮水甘油醚類所組成之群中之一種以上之化合物，則可獲得特性進一步良好之硬化性組合物，故而較佳。 作為上述雙酚型環氧化合物，可使用上述通式(I)所表示之雙酚型環氧化合物，除此以外，亦可使用例如氫化雙酚型環氧化合物等雙酚型環氧化合物。 又，作為上述縮水甘油醚類，可使用乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、1,8-辛二醇二縮水甘油醚、1,10-癸二醇二縮水甘油醚、2,2-二甲基-1,3-丙二醇二縮水甘油醚、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、四乙二醇二縮水甘油醚、六乙二醇二縮水甘油醚、1,4-環己烷二甲醇二縮水甘油醚、1,1,1-三(縮水甘油氧基甲基)丙烷、1,1,1-三(縮水甘油氧基甲基)乙烷、1,1,1-三(縮水甘油氧基甲基)甲烷及1,1,1,1-四(縮水甘油氧基甲基)甲烷等。 此外，亦可使用酚系酚醛清漆型環氧化合物、聯苯酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、二環戊二烯酚醛清漆型環氧化合物等酚醛清漆型環氧化合物；3,4-環氧-6-甲基環己烷羧酸3,4-環氧-6-甲基環己基甲酯、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯及1-環氧乙基-3,4-環氧環己烷等脂環式環氧化合物；鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯及二聚酸縮水甘油酯等縮水甘油酯類；四縮水甘油基二胺基二苯甲烷、三縮水甘油基對胺基苯酚及N,N-二縮水甘油基苯胺等縮水甘油胺類；1,3-二縮水甘油基-5,5-二甲基乙內醯脲及三縮水甘油基異氰尿酸酯等雜環式環氧化合物；二氧化二環戊二烯等二氧化物化合物；萘型環氧化合物；三苯甲烷型環氧化合物及二環戊二烯型環氧化合物等。 作為上述陽離子聚合性化合物，可列舉：環氧化合物、氧雜環丁烷化合物及乙烯醚化合物等。 作為上述環氧化合物，例如可列舉：甲基縮水甘油醚、2-乙基己基縮水甘油醚、丁基縮水甘油醚、癸基縮水甘油醚、C12～13混合烷基縮水甘油醚、苯基-2-甲基縮水甘油醚、鯨蠟基縮水甘油醚、硬脂基縮水甘油醚、對第二丁基苯基縮水甘油醚、對第三丁基苯基縮水甘油醚、甲基丙烯酸縮水甘油酯、異丙基縮水甘油醚、烯丙基縮水甘油醚、乙基縮水甘油醚、2-甲基辛基縮水甘油醚、苯基縮水甘油醚、4-正丁基苯基縮水甘油醚、4-苯基苯酚縮水甘油醚、甲苯基縮水甘油醚、二溴甲苯基縮水甘油醚、癸基縮水甘油醚、甲氧基聚乙二醇單縮水甘油醚、乙氧基聚乙二醇單縮水甘油醚、丁氧基聚乙二醇單縮水甘油醚、苯氧基聚乙二醇單縮水甘油醚、二溴苯基縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,5-戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,1,2,2-四(縮水甘油氧基苯基)乙烷及季戊四醇四縮水甘油醚等縮水甘油醚化物；乙酸縮水甘油酯、硬脂酸縮水甘油酯等縮水甘油酯類;2-(3,4-環氧環己基-5,5-螺-3,4-環氧)環己烷-1,3-二㗁烷、亞甲基雙(3,4-環氧環己烷)、丙烷-2,2-二基雙(3,4-環氧環己烷)、2,2-雙(3,4-環氧環己基)丙烷、伸乙基雙(3,4-環氧環己烷羧酸酯)、己二酸雙(3,4-環氧環己基甲基)酯、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧-1-甲基己烷羧酸3,4-環氧-1-甲基環己酯、6-甲基-3,4-環氧環己烷羧酸6-甲基-3,4-環氧環己基甲酯、3,4-環氧-3-甲基環己烷羧酸3,4-環氧-3-甲基環己基甲酯、3,4-環氧-5-甲基環己烷羧酸3,4-環氧-5-甲基環己基甲酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧-2-環氧乙基環己烷、二環氧化二環戊二烯、羧酸3,4-環氧-6-甲基環己酯、α-氧化蒎烯、環氧苯乙烷、氧化環己烯及氧化環戊烯等環氧環烷基型化合物及N-縮水甘油基鄰苯二甲醯亞胺等。 作為上述環氧化合物，亦可使用環氧化聚烯烴。所謂環氧化聚烯烴，係利用含環氧基之單體對聚烯烴進行改性而導入有環氧基之聚烯烴。可藉由利用共聚法及接枝法中之任一方法使乙烯或碳數3～20之α-烯烴、含環氧基之單體、及視需要之其他單體進行共聚合而製造。乙烯或碳數3～20之α-烯烴、含環氧基之單體及其他單體可分別單獨地進行聚合，亦可以複數個與其他單體進行聚合。又，亦可藉由過乙酸法使末端具有羥基之非共軛聚丁二烯之雙鍵進行環氧化而獲得，亦可使用分子內具有羥基者。又，亦可利用異氰酸酯對羥基進行胺基甲酸酯化，於此處使之與含有一級羥基之環氧化合物進行反應而導入環氧基。 作為上述乙烯或碳數3～20之α-烯烴，可列舉：乙烯、丙烯、丁烯、異丁烯、1,3-丁二烯、1,4-丁二烯、1,3-戊二烯、2,3-二甲基-1,3-丁二烯、戊二烯、3-丁基-1,3-辛二烯及異戊二烯等。 作為上述含環氧基之單體，例如可列舉：α,β-不飽和酸之縮水甘油酯、乙烯基苄基縮水甘油醚及烯丙基縮水甘油醚等。作為α,β-不飽和酸之縮水甘油酯，具體而言，可列舉：丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯及乙基丙烯酸縮水甘油酯等，尤佳為甲基丙烯酸縮水甘油酯。 作為上述其他單體，可列舉：氯乙烯、偏二氯乙烯、偏二氟乙烯及四氟乙烯等不飽和脂肪族烴；(甲基)丙烯酸、α-氯丙烯酸、伊康酸、馬來酸、檸康酸、富馬酸、雙環庚烯二甲酸、丁烯酸、異丁烯酸、乙烯基乙酸、烯丙基乙酸、桂皮酸、己二烯酸、中康酸、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸單[2-(甲基)丙烯醯氧基乙基]酯、ω-羧基聚己內酯單(甲基)丙烯酸酯等於兩末端具有羧基與羥基之聚合物之單(甲基)丙烯酸酯、(甲基)丙烯酸羥基乙酯・馬來酸酯、(甲基)丙烯酸羥基丙酯・馬來酸酯、二環戊二烯・馬來酸酯及具有1個羧基與2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯等不飽和多元酸；(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸二甲胺基甲酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸二甲胺基丙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸聚(乙氧基)乙酯、(甲基)丙烯酸丁氧基乙氧基乙酯、(甲基)丙烯酸乙基己酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸四氫呋喃酯、(甲基)丙烯酸乙烯酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸苄酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二氫芳樟醇二(甲基)丙烯酸酯、異氰尿酸三[(甲基)丙烯醯基乙基]酯及(甲基)丙烯酸聚酯低聚物等不飽和一元酸及多元醇或多酚之酯；(甲基)丙烯酸鋅、(甲基)丙烯酸鎂等不飽和多元酸之金屬鹽；馬來酸酐、伊康酸酐、檸康酸酐、甲基四氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、三烷基四氫鄰苯二甲酸酐、5-(2,5-二側氧四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二烯基琥珀酸酐及甲基雙環庚烯二甲酸酐等不飽和多元酸之酸酐；(甲基)丙烯醯胺、亞甲基雙-(甲基)丙烯醯胺、二伸乙基三胺三(甲基)丙烯醯胺、苯二甲基雙(甲基)丙烯醯胺、α-氯丙烯醯胺、N-2-羥基乙酯(甲基)丙烯醯胺等不飽和一元酸及多元胺之醯胺；丙烯醛等不飽和醛；(甲基)丙烯腈、α-氯丙烯腈、偏氰二乙烯、烯丙基氰等不飽和腈；苯乙烯、4-甲基苯乙烯、4-乙基苯乙烯、4-甲氧基苯乙烯、4-羥基苯乙烯、4-氯苯乙烯、二乙烯苯、乙烯基甲苯、乙烯基苯甲酸、乙烯基苯酚、乙烯基磺酸、4-乙烯苯磺酸、乙烯基苄基甲醚及乙烯基萘等不飽和芳香族化合物；甲基乙烯基酮等不飽和酮；乙烯胺、烯丙基胺、N-乙烯基吡咯啶酮及乙烯基哌啶等不飽和胺化合物；烯丙醇及巴豆醇等乙烯醇；乙烯基甲醚、乙烯基乙醚、正丁基乙烯醚及異丁基乙烯醚等乙烯醚；馬來醯亞胺、N-苯基馬來醯亞胺及N-環己基馬來醯亞胺等不飽和醯亞胺類；茚及1-甲基茚等茚類；聚苯乙烯、聚(甲基)丙烯酸甲酯、聚(甲基)丙烯酸正丁酯及聚矽氧烷等於聚合物分子鏈之末端具有單(甲基)丙烯醯基之巨單體類；氯乙烯、偏二氯乙烯、二乙烯琥珀醯、鄰苯二甲酸二烯丙酯、磷酸三烯丙酯、異氰尿酸三烯丙酯、乙烯基硫醚、乙烯基咪唑、乙烯基㗁唑啉、乙烯基咔唑、乙烯基吡咯啶酮、乙烯基吡啶、含羥基之乙烯基單體及聚異氰酸酯化合物之乙烯基胺基甲酸酯化合物、含羥基之乙烯基單體及多聚環氧化合物之乙烯基環氧化合物、季戊四醇三丙烯酸酯及二季戊四醇五丙烯酸酯等含羥基之多官能丙烯酸酯；甲苯二異氰酸酯及六亞甲基二異氰酸酯等多官能異氰酸酯之反應物；作為季戊四醇三丙烯酸酯及二季戊四醇五丙烯酸酯等含羥基之多官能丙烯酸酯與琥珀酸酐、鄰苯二甲酸酐及四氫鄰苯二甲酸酐等二元酸酐之反應物的具有酸值之多官能丙烯酸酯。 作為上述環氧化聚烯烴，亦可使用市售品，例如可列舉：Epolead PB3600、Epolead PB4700(以上，Daicel製造)；BF-1000、FC-3000(以上，ADEKA製造)；Bondfast 2C、Bondfast E、Bondfast CG5001、Bondfast CG5004、Bondfast 2B、Bondfast 7B、Bondfast 7L、Bondfast 7M、Bondfast VC40(以上，住友化學製造)；JP-100、JP-200(以上，日本曹達製造)；Poly bd R-45HT、Poly bd R-15HT(以上，出光興產製造)；及Ricon657(Arkema製造)；等。 作為上述氧雜環丁烷化合物，例如可列舉：3,7-雙(3-氧雜環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁基甲氧基)己烷、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷及3-乙基-3-(氯甲基)氧雜環丁烷等。 作為上述乙烯醚化合物，例如可列舉：二乙二醇單乙烯醚、三乙二醇二乙烯醚、正十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚及1,6-環己烷二甲醇二乙烯醚等。 作為上述陽離子聚合性化合物，亦可使用市售品，例如可列舉：Epolight 40E、1500NP、1600、80MF、4000及3002(以上，共榮社化學製造)；ADEKA Glycyrol ED-503、ED-503D、ED-503G、ED-523T、ED-513、ED-501、ED-502、ED-509、ED-518、ED-529、Adeka Resin EP-4000、EP-4005、EP-4080及EP-4085(以上，ADEKA製造)；DENACOL EX-201、EX-203、EX-211、EX-212、EX-221、EX-251、EX-252、EX-711、EX-721、DENACOL EX-111、EX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-171、EX-192及EX-731(以上，長瀨化成製造)；EHPE-3150、Celloxide 2021P、2081、2000及3000(以上，Daicel製造)；EPIOL M、EH、L-41、SK、SB、TB及OH(以上，日油製造)；Epolight M-1230及100MF(以上，共榮社化學製造)；ARONE OXETANE OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211及OXT-212(以上，東亞合成製造)；ETERNACOLL OXBP及OXTP(以上，宇部興產製造)；2-羥基乙基乙烯醚、二乙二醇單乙烯醚及4-羥基丁基乙烯醚(以上，丸善石油化學製造)；DENACOL EX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-201、EX-203、EX-711、EX-721、Oncoat EX-1020、EX-1030、EX-1040、EX-1050、EX-1051、EX-1010、EX-1011及1012(以上，長瀨化成製造)；OGSOL PG-100、EG-200、EG-210及EG-250(以上，Osaka Gas Chemicals製造)；HP4032、HP4032D及HP4700(以上，DIC製造)；ESN-475V(東都化成製造)；Epikote YX8800(三菱化學製造)；Marproof G-0105SA及G-0130SP(以上，日油製造)；EPICLON N-665及HP-7200(以上，DIC製造)；EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H及NC-7000L(以上，日本化藥製造)；等。 於本發明之硬化性組合物中，聚合性化合物(B)之含量並無特別限定，相對於二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)之合計100質量份，就硬化性良好之方面而言，較佳為10～70質量份，更佳為20～50質量份，進而較佳為30～50質量份。於聚合性化合物(B)之含量為上述範圍內之情形時，所獲得之硬化物之硬化性及遮光性優異，故而較佳。 例如於形成厚度1～3 μm之硬化物之情形時，聚合性化合物(B)之含量並無特別限定，相對於二氧化矽粒子(A)、聚合性化合物(B)及聚合起始劑(C)之合計100質量份，較佳為10～70質量份，更佳為30～60質量份，進而較佳為30～50質量份。 ＜聚合起始劑(C)＞ 作為本發明之硬化性組合物所使用之聚合起始劑(C)，可使用先前已知之自由基聚合起始劑及陽離子聚合起始劑。 所謂上述自由基聚合起始劑，係光自由基聚合起始劑與熱自由基聚合起始劑。就反應性較高之方面而言，更佳為光自由基聚合起始劑。 作為光自由基聚合起始劑，只要為藉由光照射而產生自由基者，則無特別限制，可使用先前已知之化合物，例如可例示苯乙酮系化合物、苯偶醯系化合物、二苯甲酮系化合物、9-氧硫系化合物及肟酯系化合物等作為較佳者。 作為苯乙酮系化合物，例如可列舉：二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、4'-異丙基-2-羥基-2-甲基苯丙酮、2-羥基甲基-2-甲基苯丙酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、對二甲基胺基苯乙酮、對第三丁基二氯苯乙酮、對第三丁基三氯苯乙酮、對疊氮苯亞甲基苯乙酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙酮-1、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、息香異丁醚及1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮等。 作為苯偶醯系化合物，可列舉苯偶醯等。 作為二苯甲酮系化合物，例如可列舉：二苯甲酮、鄰苯甲醯苯甲酸甲酯、米其勒酮、4,4'-雙二乙基胺基二苯甲酮、4,4'-二氯二苯甲酮及4-苯甲醯基-4'-甲基二苯硫醚等。 作為9-氧硫系化合物，可列舉：9-氧硫、2-甲基9-氧硫𠮿、2-乙基9-氧硫𠮿、2-氯9-氧硫𠮿、2-異丙基9-氧硫𠮿、2,4-二乙基9-氧硫𠮿等。 所謂肟酯系化合物，意指具有上述通式(II)所表示之基之化合物，上述光自由基聚合起始劑之中，該肟酯系化合物之感度良好，因此可較佳地用於本發明之硬化性組合物。 上述通式(II)中之R41 ～R43 所表示之碳原子數1～20之烴基分別與R1 ～R38 所表示之碳原子數1～20的烴基相同。 有修飾上述通式(II)中之R41 及R42 以及R41 或R42 所表示之基之情形的含有雜環之碳原子數2～20之基係與R10 ～R38 所表示之含有雜環之碳原子數2～20的基相同。 上述通式(II)中之鹵素原子係與上述通式(I)中之鹵素原子相同。 具有上述通式(II)所表示之基之化合物之中，下述通式(III)所表示之化合物尤其是感度較高，故而更佳為用於本發明之硬化性組合物。 [化11](式中，R41 、R42 及m分別與通式(II)中之R41 、R42 及m相同， R51 及R52 分別獨立地表示氫原子、氰基、碳原子數1～20之烷基、碳原子數6～20之芳基、碳原子數7～20之芳烷基或碳原子數2～20之雜環基， X1 表示氧原子、硫原子、硒原子、CR53 R54 、CO、NR55 或PR56 ， R51 ～R56 分別獨立地表示氫原子、碳原子數1～20之烴基或含有雜環之碳原子數2～20之基，R53 ～R56 所表示之基中之氫原子亦有被取代為鹵素原子、硝基、氰基、羥基、羧基或雜環基之情形， R51 ～R56 所表示之基中之亞甲基亦有於不與氧相鄰之條件下被取代為-O-之情形， R51 ～R56 亦有分別獨立地與鄰接之任一個苯環一併形成環之情形， g表示0～5之數， h表示0～4之數)。 通式(III)中之R51 及R52 所表示之碳原子數1～20之烷基、碳原子數6～20之芳基、碳原子數7～20之芳烷基及含有雜環之碳原子數2～20之基係與R1 ～R38 所表示之碳原子數1～20之烷基、碳原子數6～20之芳基、碳原子數7～20之芳烷基及含有雜環之碳原子數2～20之基相同。 通式(III)中之鹵素原子係與上述通式(I)中之鹵素原子相同。 上述通式(III)中之R53 ～R56 所表示之碳原子數1～20之烴基係分別與R1 ～R38 所表示之碳原子數1～20之烴基相同。 上述通式(III)中之R53 ～R56 所表示之含有雜環之碳原子數2～20之基係與R10 ～R38 所表示之含有雜環之碳原子數2～20的基相同。 上述作為通式(III)所表示之化合物，例如可列舉下述所示之化合物。但是，本發明並不受以下化合物任何限制。 [化12]作為其他自由基聚合起始劑，可列舉：2,4,6-三甲基苯甲醯基二苯基氧化膦等氧化膦系化合物及雙(環戊二烯基)-雙[2,6-二氟-3-(吡咯-1-基)]鈦等二茂鈦系化合物等。 作為市售之自由基起始劑，可列舉：Adeka Optomer N-1414、N-1717、N-1919、Adeka Arkls NCI-831、NCI-930(以上，ADEKA製造)；IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACURE OXE 02、IRGACURE784(以上，BASF製造)；TR-PBG-304、TR-PBG-305、TR-PBG-309及TR-PBG-314(以上，Tronly製造)；等。 作為熱自由基聚合起始劑，只要為藉由加熱而產生自由基者，則無特別限制，可使用先前已知之化合物，例如可例示偶氮系化合物、過氧化物及過硫酸鹽等作為較佳者。 作為偶氮系化合物，可列舉：2,2'-偶氮二異丁腈、2,2'-偶氮雙(甲基異丁酸酯)、2,2'-偶氮二-2,4-二甲基戊腈、1,1'-偶氮雙(1-乙醯氧基-1-苯乙烷)等。 作為過氧化物，可列舉：過氧化苯甲醯基、過氧化二-第三丁基苯甲醯基、過氧化特戊酸第三丁酯及過氧化二碳酸二(4-第三丁基環己基)酯等。 作為過硫酸鹽，可列舉：過硫酸銨、過硫酸鈉及過硫酸鉀等過硫酸鹽等。 所謂上述陽離子起始劑，係表示光陽離子起始劑與熱陽離子起始劑。 上述光陽離子聚合起始劑只要為藉由光照射而能夠釋出使陽離子聚合開始之物質的化合物，則無特別限制，可使用既有之化合物，較佳為作為藉由能量線之照射而釋出路易斯酸之鎓鹽之複鹽、或其衍生物。作為該化合物之具代表性者，可列舉下述通式所表示之陽離子與陰離子之鹽： [A]r+ [B]r- 。 上述陽離子[A]r+ 較佳為鎓，其結構例如可由下述通式表示： [(R58 )e Q]r+ 。 進而，此處，R58 係碳原子數為1～60，且可包含若干碳原子以外之原子之有機基。e係1～5中之任一整數。e個R58 分別獨立，可相同亦可不同。又，R58 之至少1個較佳為具有芳香環之如上述之有機基。例如可列舉：可經烷基、烷氧基、羥基、羥基烷氧基、鹵素原子、苄基、硫代苯氧基、4-苯甲醯基苯硫基、2-氯-4-苯甲醯基苯硫基等取代之苯基。Q係選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所組成之群中之原子或原子団。又，將陽離子[A]r+ 中之Q之原子價設為q時，必須r＝e－q之關係成立(其中，N=N係視為原子價0)。 又，陰離子[B]r- 較佳為鹵化物錯合物，其結構例如可由下述通式[LXf ]r- 表示。 進而，此處，L係作為鹵化物錯合物之中心原子之金屬或半金屬(Metalloid)，係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn及Co等。X係鹵素原子或者可經鹵素原子或烷氧基等取代之苯基。f係3～7之整數。又，將陰離子[B]r- 中之L之原子價設為p時，必須r＝f－p之關係成立。 作為上述通式之陰離子[LXf ]r- 之具體例，可列舉：四(五氟苯基)硼酸鹽、四(3,5-二氟-4-甲氧基苯基)硼酸鹽、四氟硼酸鹽(BF4 )- 、六氟磷酸鹽(PF6 )- 、六氟銻酸鹽(SbF6 )- 、六氟砷酸鹽(AsF6 )- 及六氯銻酸鹽(SbCl6 )- 等。 又，陰離子[B]r- 亦可較佳地使用下述通式： [LXf － 1 (OH)]r- 所表示之結構者。L、X、f係與上述相同。又，作為其他可使用之陰離子，可列舉：過氯酸根離子(ClO4 )- 、三氟甲基亞硫酸根離子(CF3 SO3 )- 、氟磺酸根離子(FSO3 )- 、甲苯磺酸根陰離子、三硝基苯磺酸根陰離子、樟腦磺酸鹽、九氟丁烷磺酸鹽、十六氟辛烷磺酸鹽、四芳基硼酸鹽及四(五氟苯基)硼酸鹽等。 於本發明中，此種鎓鹽之中，使用下述之(1)～(3)之芳香族鎓鹽特別有效。可自該等之中單獨地使用1種，或者將2種以上混合使用。 (1)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽及4-甲基苯基重氮鎓六氟磷酸鹽等芳基重氮鎓鹽。 (2)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-第三丁基苯基)錪六氟磷酸鹽及甲苯基異丙苯基錪四(五氟苯基)硼酸鹽等二芳基錪鹽。 (3)下述群I或群II所表示之鋶陽離子與六氟銻離子、四(五氟苯基)硼酸根離子等鋶鹽 [化13][化14]作為其他較佳者，亦可列舉：(η5-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯]-鐵-六氟磷酸鹽等鐵-芳烴錯合物；三(乙醯丙酮)鋁、三(乙基乙醯基丙酮酸)鋁、三(水楊醛酸)鋁等鋁錯合物；與三苯基矽烷醇等矽烷醇類之混合物等。 作為上述光陽離子聚合起始劑，亦可使用市售品，例如可列舉：IRUGACURE261(BASF製造)；Adeka Optomer SP-150、SP-151、SP-152、SP-170、SP-171、SP-172(以上，ADEKA製造)；UVE-1014(General Electronics製造)；CD-1012(Sartomer製造)；CI-2064、CI-2481(以上，日本曹達製造)；Uvacure1590、1591(以上，DaicelUCB製造)；CYRACURE UVI-6990(以上，Union Carbide製造)；BBI-103、MPI-103、TPS-103、MDS-103、DTS-103、NAT-103及NDS-103(以上，Midori Kagaku製造)；等。 該等之中，就實用方面與光感度之觀點而言，較佳為使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物。 所謂上述熱陽離子起始劑，只要為藉由加熱而產生陽離子種或路易斯酸之化合物，則無特別限制，可使用既有之化合物。作為此種化合物之具代表性者，可列舉：鋶鹽、噻吩鎓(Thiophenium)鹽、硫雜環戊鎓(thiolanium)鹽、苄胺、吡啶鎓鹽及𨥙鹽等鹽；二伸乙基三胺、三伸乙基三胺及四伸乙基五胺等聚烷基聚胺類；1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷及異佛爾酮二胺等脂環式聚胺類；間苯二甲胺、二胺基二苯基甲烷及二胺基二苯基碸等芳香族聚胺類；藉由常規方法使上述聚胺類與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚及雙酚F-二縮水甘油醚等縮水甘油醚類或羧酸之縮水甘油酯類等各種環氧樹脂進行反應而製造之多聚環氧加成改性物；藉由常規方法使上述有機聚胺類與鄰苯二甲酸、異鄰苯二甲酸及二聚酸等羧酸類進行反應而製造之醯胺化改性物；藉由常規方法使上述聚胺類與甲醛等醛類；苯酚、甲酚、二甲苯酚、第三丁基苯酚及間苯二酚等於核具有至少一個醛化反應性部位之苯酚類進行反應而製造之曼尼希化改性物；多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸及二聚酸等脂肪族二羧酸類；鄰苯二甲酸、對苯二甲酸、異鄰苯二甲酸及萘二羧酸等芳香族二羧酸類；環己烷二羧酸等脂環式二羧酸類；偏苯三甲酸、均苯三酸及蓖麻油脂肪酸等三聚物等之三羧酸類；均苯四甲酸等四羧酸類等)之酸酐；雙氰胺、咪唑類、羧酸酯、磺酸酯及胺醯亞胺等。 作為上述熱陽離子起始劑，亦可使用市售品，例如可列舉：Adekaopton CP-77、Adekaopton CP-66(以上，ADEKA製造)；CI-2639、CI-2624(以上，日本曹達製造)；San-Aid SI-60L、San-Aid SI-80L、San-Aid SI-100L(以上，三新化學工業製造)；等。 上述聚合起始劑(C)可將此前所例示之一種或兩種以上進行混合而使用。 於本發明之硬化性組合物中，上述聚合起始劑(C)之含量並無特別限定，相對於二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)之合計100質量份，就硬化性良好之方面而言，較佳為0.3～20質量份，更佳為0.5～10質量份，更佳為1～5質量份。於聚合性化合物(B)之含量為上述範圍內之情形時，可獲得硬化性良好且不會伴有聚合起始劑之析出之保存穩定性優異的硬化性組合物，故而較佳。 例如於形成厚度1～3 μm之硬化膜之情形時，聚合起始劑(C)之含量並無特別限定，相對於二氧化矽粒子(A)、聚合性化合物(B)及聚合起始劑(C)之合計100質量份，較佳為0.3～20質量份，更佳為0.5～10質量份，更佳為1～5質量份。 ＜著色劑(D)＞ 作為本發明之硬化性組合物所使用之著色劑(D)，可使用顏料及染料。作為顏料及染料，可分別使用無機色料或有機色料，可將該等單獨地使用，或者混合2種以上使用。此處，所謂顏料，係指不溶於下述之溶劑之著色劑，無機或有機色料之中，亦包括不溶於溶劑者、或者使無機或有機染料進行色澱化而成者。 作為上述顏料，可列舉：藉由爐法、導槽法或thermal法所獲得之碳黑、或者乙炔黑、科琴黑或燈黑等碳黑、上述碳黑經環氧樹脂調整或被覆者、預先於溶劑中將上述碳黑分散處理至樹脂中並利用20～200 mg/g之樹脂被覆而成者、上述碳黑經酸性或鹼性表面處理者、平均粒徑為8 nm以上且DBP吸油量為90 ml/100 g以下之碳黑、自950℃下之揮發分中之CO及CO2 算出之總氧量每表面積100 m2 為9 mg以上之碳黑、石墨化碳黑、石墨、活性碳、碳纖維、奈米碳管、螺旋碳纖維、碳奈米角、碳氣凝膠、富勒烯、苯胺黑、顏料黑7、鈦黑、內醯胺黑、苝黑等所代表之黑色顏料、氧化鉻綠、米洛麗藍、鈷綠、鈷青、錳系、亞鐵氰化物、磷酸鹽群青、鐵藍、群青、天藍、濃綠色、翡翠綠、硫酸鉛、黃丹、鋅黃、鐵丹(紅色氧化鐵(III))、鎘紅、合成鐵黑、棕土、色澱顏料等有機或無機顏料，就遮光性較高之方面而言，較佳為使用黑色顏料，進而較佳為使用碳黑作為黑色顏料。 上述碳黑之中，可較佳地使用碳黑經環氧樹脂調整或被覆者、預先於溶劑中將碳黑分散處理至樹脂中並利用20～200 mg/g之樹脂被覆而成者。 又，碳黑之中，就可獲得分散性優異之著色劑分散液，及可獲得遮光性優異且對於玻璃等基材之密接性良好之硬化物之方面而言，較佳為於碳黑表面具有磺酸基之碳黑。 作為對上述碳黑表面賦予磺酸基之方法，可列舉：藉由過氧二硫酸或其鹽使碳黑氧化之方法(1)或者利用磺化劑對碳黑進行處理之方法(2)。 上述藉由過氧二硫酸或其鹽使碳黑氧化之方法(1)可藉由公知任意之方法進行，例如可藉由如下方法進行：視需要，使用界面活性劑或分散劑將碳黑、過氧二硫酸或其鹽、水系介質(水或水與水溶性溶劑之混合物)進行混合，將該混合物於未達100℃、較佳為40～90℃下進行未達24小時、較佳為2～20小時加熱，且視需要中和至pH值≧7。 作為上述過氧二硫酸之鹽，可列舉：鋰、鈉、鉀、鋁等之金屬鹽或銨鹽。 過氧二硫酸或其鹽之使用量相對於碳黑1質量份，較佳為0.5～5質量份之範圍。 利用磺化劑對上述碳黑進行處理之方法(2)可藉由公知任意之方法進行，例如可藉由如下方法進行：將碳黑及磺化劑進行混合或者使碳黑及磺化劑溶解於溶劑中，並於200℃以下、較佳為0～100℃下進行攪拌。 作為上述磺化劑，可列舉：濃硫酸、發煙硫酸、三氧化硫、鹵化硫酸、醯胺硫酸、亞硫酸氫鹽、亞硫酸鹽、SO3 -二㗁烷錯合物、SO3 -酮錯合物、胺基磺酸、磺化吡啶鹽等。 作為上述溶劑，可使用水；硫酸、發煙硫酸、甲酸、乙酸、丙酸、乙酸酐等酸性溶劑；吡啶、三乙胺、三甲胺等鹼性溶劑；四氫呋喃、二㗁烷、二乙醚等醚類；二甲基甲醯胺、二甲基乙醯胺、N-甲基吡咯啶酮、環丁碸、硝基甲烷、丙酮、乙腈、苯甲腈等極性溶劑；乙酸乙酯、乙酸丁酯等酯類；苯、甲苯、二甲苯、硝基苯等芳香族系溶劑；甲醇、乙醇、異丙醇等醇系溶劑；氯仿、三氯氟甲烷、二氯甲烷、氯苯等氯系溶劑等，亦可使用該等之混合溶劑。 磺化劑之使用量相對於碳黑1質量份，較佳為0.5～20質量份之範圍，於使用複數種磺化劑之情形時，較佳為複數種磺化劑之合計量成為上述範圍。 又，為了抑制作為磺化反應之副反應之公知之碸的生成，亦可於不會抑制反應之範圍內添加0.01～5%之公知之碸抑制劑，例如脂肪酸、有機過酸、酸酐、乙酸、酮等。 作為上述顏料，亦可使用市售品，例如可列舉：顏料紅1、2、3、9、10、14、17、22、23、31、38、41、48、49、88、90、97、112、119、122、123、144、149、166、168、169、170、171、177、179、180、184、185、192、200、202、209、215、216、217、220、223、224、226、227、254、228、240及254；顏料橙13、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、65及71；顏料黃1、3、12、13、14、16、17、20、24、55、60、73、81、83、86、93、95、97、98、100、109、110、113、114、117、120、125、126、127、129、137、138、139、147、148、150、151、152、153、154、166、168、175、180及185；顏料綠7、10、36及58；顏料藍15、15：1、15：2、15：3、15：4、15：5、15：6、22、24、56、60、61、62及64；顏料紫1、19、23、27、29、30、32、37、40及50等。 作為上述染料，例如可列舉：亞硝基化合物、硝基化合物、偶氮化合物、二偶氮化合物、𠮿化合物、喹啉化合物、蒽醌化合物、香豆素化合物、花青化合物、酞菁化合物、異吲哚啉酮化合物、異吲哚啉化合物、喹吖啶酮化合物、蒽締蒽酮化合物、紫環酮化合物、苝化合物、吡咯并吡咯二酮化合物、硫靛藍化合物、二㗁𠯤化合物、三苯甲烷化合物、喹酞酮化合物、萘四羧酸、偶氮染料、花青染料之金屬錯合物化合物等。 於本發明之硬化性組合物中，上述著色劑(D)之含量並無特別限定，相對於上述聚合性化合物(B)100質量份，較佳為50～500質量份，更佳為150～350質量份，進而較佳為150～300質量份。於著色劑之含量為上述範圍內之情形時，成為不會伴有著色劑之凝集之保存穩定性優異之硬化性組合物，且硬化性組合物之硬化物之遮光性較高，故而較佳。 例如於形成厚度1～3 μm之硬化膜之情形時，著色劑(D)之含量並無特別限定，相對於上述聚合性化合物(B)100質量份，較佳為50～500質量份，更佳為150～350質量份，進而較佳為150～300質量份。 又，本發明之硬化性組合物亦可含有不具有自由基聚合性而賦予鹼顯影性之化合物，作為此種化合物，只要為藉由具有酸值而可溶於鹼性水溶液之化合物，則無特別限定，可列舉：鹼可溶性酚醛清漆樹脂(以下，簡稱為「酚醛清漆樹脂」)作為具代表性者。酚醛清漆樹脂係使苯酚類與醛類於酸觸媒之存在下進行縮聚而獲得。 作為上述苯酚類，例如可使用苯酚、鄰甲酚、間甲酚、對甲酚、鄰乙基苯酚、間乙基苯酚、對乙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚、2,3,5-三甲基苯酚、對苯基苯酚、對苯二酚、鄰苯二酚、間苯二酚、2-甲基間苯二酚、鄰苯三酚、α-萘酚、雙酚A、二羥基苯甲酸酯及沒食子酸酯等，該等苯酚類中，較佳為苯酚、鄰甲酚、間甲酚、對甲酚、2,5-二甲苯酚、3,5-二甲苯酚、2,3,5-三甲基苯酚、間苯二酚、2-甲基間苯二酚及雙酚A等。該等苯酚類可單獨地使用，或者混合2種以上使用。 作為上述醛類，例如可使用甲醛、對甲醛、乙醛、丙醛、苯甲醛、苯乙醛、α-苯丙醛、β-苯丙醛、鄰羥基苯甲醛、間羥基苯甲醛、對羥基苯甲醛、鄰氯苯甲醛、間氯苯甲醛、對氯苯甲醛、鄰硝基苯甲醛、間硝基苯甲醛、對硝基苯甲醛、鄰甲基苯甲醛、間甲基苯甲醛、對甲基苯甲醛、對乙基苯甲醛及對正丁基苯甲醛等，該等化合物中，較佳為甲醛、乙醛及苯甲醛等。該等醛類可單獨地使用，或者混合2種以上使用。醛類係以苯酚類每1莫耳，較佳為0.7～3莫耳、尤佳為0.7～2莫耳之比例使用。 作為上述酸觸媒，例如可使用鹽酸、硝酸、硫酸等無機酸、或者甲酸、草酸、乙酸等有機酸。該等酸觸媒之使用量係苯酚類每1莫耳，較佳為1×10-4 ～5×10-1 莫耳。於縮合反應中，通常使用水作為反應介質，但於縮合反應所使用之苯酚類不會溶解於醛類之水溶液中，而自反應初期開始成為非均相系統之情形時，亦可使用親水性溶劑作為反應介質。作為該等親水性溶劑，例如可列舉：甲醇、乙醇、丙醇及丁醇等醇類；或者四氫呋喃及二㗁烷等環狀醚類。關於該等反應介質之使用量，通常反應原料每100質量份，為20～1000質量份。縮合反應之反應溫度可視反應原料之反應性而適當進行調整，但通常為10～200℃，較佳為70～150℃。於縮合反應結束後，為了將存在於系統內之未反應原料、酸觸媒及反應介質去除，一般而言，使內溫上升至130～230℃，於減壓下將揮發分蒸餾去除，繼而使已熔融之酚醛清漆樹脂於鋼製傳送帶等之上進行流涎而回收。 又，於縮合反應結束後，使反應混合物溶解於上述親水性溶劑中，並添加至水、正己烷及正庚烷等沈澱劑中，藉此使酚醛清漆樹脂析出，將析出物分離，進行加熱乾燥，藉此亦可進行回收。 作為上述酚醛清漆樹脂以外之例，可列舉：聚羥基苯乙烯及其衍生物、苯乙烯-馬來酸酐共聚物以及聚乙烯羥基苯甲酸酯等。 於本發明之硬化性組合物中可進而含有溶劑。作為該溶劑，可列舉：通常視需要可使上述各成分(二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)等溶解或分散之溶劑，例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮及2-庚酮等酮類；乙醚、二㗁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷及二丙二醇二甲醚等醚系溶劑；乙酸甲酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯及TEXANOL等酯系溶劑；乙二醇單甲醚及乙二醇單乙醚等溶纖劑系溶劑；甲醇、乙醇、異或正丙醇、異或正丁醇及戊醇等醇系溶劑；乙二醇單乙酸甲酯、乙二醇單乙酸乙酯、丙二醇-1-單甲醚(PGM)、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯及丙酸乙氧基乙酯等醚酯系溶劑；苯、甲苯及二甲苯等BTX(Benzene-Toluene-Xylene)系溶劑；己烷、庚烷、辛烷及環己烷等脂肪族烴系溶劑；松節油、D-檸檬烯及蒎烯等萜烯系烴油；礦油精、Swasol＃310(以上，科斯莫松山石油製造)；及Solvesso＃100(以上，Exxon化學製造)；等石蠟系溶劑；四氯化碳、氯仿、三氯乙烯、二氯甲烷及1,2-二氯乙烷等鹵化脂肪族烴系溶劑；氯苯等鹵化芳香族烴系溶劑；卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸及水等，該等溶劑可單獨地使用，或者以2種以上之混合溶劑之形式使用。該等之中，酮類及醚酯系溶劑等、尤其是PGMEA及環己酮等由於在硬化性組合物中與抗蝕劑及聚合起始劑之相溶性良好，故而較佳。 於本發明之硬化性組合物中，上述溶劑之使用量並無特別限定，相對於硬化性組合物總量，較佳為成為70～95質量%。於溶劑之含量為上述範圍之情形時，可適當地控制操作性(硬化性組合物之黏度或潤濕性)及液穩定性(不會伴有組合物所包含之成分之析出或沈澱)優異之硬化性組合物以及硬化物之厚度，故而較佳。 於本發明之硬化性組合物中可進而使用分散劑。作為該分散劑，只要為能夠使著色劑(D)分散、穩定者即可，可使用市售之分散劑、例如BYK-Chemie製造之BYK系列等，可較佳地使用包含具有鹼性官能基之聚酯、聚醚、聚胺基甲酸酯之高分子分散劑、具有氮原子作為鹼性官能基且具有氮原子之官能基為胺及/或其四級鹽，且胺值為1～100 mgKOH/g者。 於本發明之硬化性組合物中可進而含有無機化合物。作為該無機化合物，例如可列舉：氧化鎳、氧化鐵、氧化銥、氧化鈦、氧化鋅、氧化鎂、氧化鈣、氧化鉀、二氧化矽及氧化鋁等金屬氧化物；層狀黏土礦物、米洛麗藍、碳酸鈣、碳酸鎂、鈷系、錳系、玻璃粉末、雲母、滑石、高嶺土、亞鐵氰化物、各種金屬硫酸鹽、硫化物、硒化物、鋁矽酸鹽、鈣矽酸鹽、氫氧化鋁、鉑、金、銀及銅等，該等之中，較佳為氧化鈦、二氧化矽、層狀黏土礦物、及銀等。於本發明之硬化性組合物中，無機化合物之含量相對於上述聚合性化合物100質量份，較佳為0.1～50質量份，更佳為0.5～20質量份，該等無機化合物可使用1種或2種以上。 藉由使本發明之硬化性組合物含有無機化合物，而可用作感光性糊劑組合物。該感光性糊劑組合物可用以形成電漿顯示器面板之間隔壁圖案、介電體圖案、電極圖案及黑矩陣圖案等焙燒物圖案。 又，該等無機化合物例如亦可較佳地用作填充劑、抗反射劑、導電劑、穩定劑、阻燃劑、機械強度提高劑、特殊波長吸收劑及撥油墨劑等。 又，於本發明之硬化性組合物中，可視需要添加對大茴香醚、對苯二酚、兒茶酚、第三丁基鄰苯二酚及啡噻𠯤等熱聚合抑制劑；塑化劑；助黏劑；填充劑；消泡劑；調平劑；表面調整劑；抗氧化劑；紫外線吸收劑；分散助劑；抗凝集劑；觸媒；效果促進劑；交聯劑；増黏劑等慣用之添加物。 於本發明之硬化性組合物中，可進而併用偶合劑、鏈轉移劑、增感劑、界面活性劑及三聚氰胺等。 藉由添加上述偶合劑而提高硬化物與基材間之密接性，故而較佳。例如可使用：二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等烷基官能性烷氧基矽烷；乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等烯基官能性烷氧基矽烷；3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷等(甲基)丙烯酸酯官能性烷氧基矽烷；γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-(3,4-環氧環己基)丙基三甲氧基矽烷等環氧基官能性烷氧基矽烷；N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等胺基官能性烷氧基矽烷；γ-巰基丙基三甲氧基矽烷等巰基官能性烷氧基矽烷；3-異氰酸基丙基三乙氧基矽烷等異氰酸基官能性烷氧基矽烷；3-脲基丙基三烷氧基矽烷等脲基官能性烷氧基矽烷；三-(三甲氧基矽烷丙基)異氰尿酸酯等異氰尿酸酯官能性烷氧基矽烷；四異丙醇鈦、四正丁醇鈦等烷醇鈦類；二辛氧基鈦雙(辛二醇)、二異丙醇鈦雙(乙醯乙酸乙酯)等鈦螯合物類；四乙醯丙酮酸鋯、三丁氧基單乙醯丙酮酸鋯等鋯螯合物類；三丁氧基單硬脂酸鋯等鋯醯化物類；甲基三異氰酸基矽烷等異氰酸基矽烷類等。 作為上述偶合劑，可使用市售品，例如可列舉：KA-1003、KBM-1003、KBE-1003、KBM-303、KBM-403、KBE-402、KBE-403、KBM-1403、KBM-502、KBM-503、KBE-502、KBE-503、KBM-5103、KBM-602、KBM-603、KBE-603、KBM-903、KBE-903、KBE-9103、KBM-573、KBM-575、KBM-6123、KBE-585、KBM-703、KBM-802、KBM-803、KBE-846、KBE-9007、KBM-04、KBE-04、KBM-13、KBE-13、KBE-22、KBE-103、HMDS-3、KBM-3063、KBM-3103C、KPN-3504及KF-99(以上，Shin-Etsu Silicones製造)等。 作為上述鏈轉移劑、增感劑，一般使用含硫原子之化合物。例如可列舉：硫代乙醇酸、硫代蘋果酸、硫代水楊酸、2-巰基丙酸、3-巰基丙酸、3-巰基丁酸、N-(2-巰基丙醯基)甘胺酸、2-巰基菸鹼酸、3-[N-(2-巰基乙基)胺甲醯基]丙酸、3-[N-(2-巰基乙基)胺基]丙酸、N-(3-巰基丙醯基)丙胺酸、2-巰基乙烷磺酸、3-巰基丙烷磺酸、4-巰基丁烷磺酸、十二烷基(4-甲硫基)苯醚、2-巰基乙醇、3-巰基-1,2-丙二醇、1-巰基-2-丙醇、3-巰基-2-丁醇、巰基苯酚、2-巰基乙基胺、2-巰基咪唑、2-巰基苯并咪唑、2-巰基-3-羥基吡啶、2-巰基苯并噻唑、巰基乙酸、三羥甲基丙烷三(3-巰基丙酸酯)及季戊四醇四(3-巰基丙酸酯)等巰基化合物；使該巰基化合物氧化所得之二硫醚化合物、碘乙酸、碘丙酸、2-碘乙醇、2-碘乙烷磺酸及3-碘丙烷磺酸等烷基碘化合物；三羥甲基丙烷三(3-巰基異丁酸酯)、丁二醇雙(3-巰基異丁酸酯)、己二硫醇、癸二硫醇、1,4-二甲基巰基苯、丁二醇雙硫代丙酸酯、丁二醇雙硫代乙醇酸酯、乙二醇雙硫代乙醇酸酯、三羥甲基丙烷三硫代乙醇酸酯、丁二醇雙硫代丙酸酯、三羥甲基丙烷三硫代丙酸酯、三羥甲基丙烷三硫代乙醇酸酯、季戊四醇四硫代丙酸酯、季戊四醇四硫代乙醇酸酯、三羥基乙基三硫代丙酸酯、下述化合物No.P1、昭和電工製造Karenz PE1及NR1等。 [化15]作為上述界面活性劑，可使用全氟烷基磷酸酯、全氟烷基羧酸鹽等氟界面活性劑；高級脂肪酸鹼鹽、烷基磺酸鹽、烷基硫酸鹽等陰離子系界面活性劑；高級胺氫鹵酸鹽、四級銨鹽等陽離子系界面活性劑；聚乙二醇烷基醚、聚乙二醇脂肪酸酯、山梨醇酐脂肪酸酯、脂肪酸單甘油酯等非離子界面活性劑；兩性界面活性劑及聚矽氧系界面活性劑等界面活性劑，該等亦可組合使用。 作為上述三聚氰胺化合物，可列舉：(聚)羥甲基三聚氰胺、(聚)羥甲基甘脲、(聚)羥甲基苯胍胺及(聚)羥甲基脲等氮化合物中之活性羥甲基(CH2 OH基)之全部或一部分(至少2個)經烷基醚化之化合物。此處，作為構成烷基醚之烷基，可列舉：甲基、乙基及丁基，可相互相同，亦可互不相同。又，未被烷基醚化之羥甲基可於一分子內自縮合，亦可於兩分子間縮合，其結果形成低聚物成分。具體而言，可使用六甲氧基甲基三聚氰胺、六丁氧基甲基三聚氰胺、四甲氧基甲基甘脲及四丁氧基甲基甘脲等。該等之中，較佳為六甲氧基甲基三聚氰胺及六丁氧基甲基三聚氰胺等經烷基醚化之三聚氰胺。 於本發明之硬化性組合物中，關於二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)、著色劑(D)及溶劑以外之任意成分之含量，係視其使用目的而適當選擇，並無特別限制，較佳為相對於二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)之合計值100質量份，合計為20質量份以下。 本發明之硬化性組合物可用於硬化性塗料、清漆、硬化性接著劑、印刷基板、或彩色電視、PC顯示器、攜帶型資訊終端及數位相機等彩色顯示之液晶顯示面板中之彩色濾光片、攜帶型資訊終端及數位相機等彩色顯示之液晶顯示面板中之黑色間隔柱、各種顯示用途用之黑色間隔柱、有機EL之黑色間隔壁、CCD(Charge Coupled Device，電荷耦合元件)影像感測器之彩色濾光片、觸控面板、電漿顯示面板用之電極材料、粉末塗層、印刷油墨、印刷版、接著劑、凝膠塗層、電子工學用之光阻劑、電鍍阻劑、蝕刻阻劑、焊料阻劑、絕緣膜、黑矩陣、各種顯示用途用之彩色濾光片、電漿顯示面板、電發光顯示裝置、及用以於LCD之製造步驟中形成結構之抗蝕劑、用以封入電氣及電子零件之組合物、阻焊劑、磁性記錄材料、微小機械零件、波導、光開關、鍍敷用遮罩、蝕刻遮罩、彩色試驗系統、玻璃纖維纜線塗層、篩網印刷用模板、用以藉由立體光刻製造三維物體之材料、全像術記錄用材料、圖像記錄材料、微細電子電路、脫色材料、用於圖像記錄材料之脫色材料、使用微膠囊之圖像記錄材料用之脫色材料、印刷配線板用光阻劑材料、UV及可見雷射直接圖像系用之光阻劑材料、印刷電路基板之逐次積層中之介電層形成所使用之光阻劑材料及保護膜等各種用途，該等用途並無特別限制。 關於使用本發明之硬化性組合物之硬化物之製造方法，將較佳之塗佈方法、硬化條件示於以下。 硬化性組合物之塗佈方法係輥式塗佈、簾幕式塗佈、各種印刷、浸漬等公知之方法，且應用於玻璃、金屬、紙、塑膠等支持基體上。又，亦可暫時施加於膜等支持基體上，之後轉印至其他支持基體上，即以乾膜之形態使用，其應用方法並無限制。 又，作為使本發明之硬化性組合物硬化時所使用之活性光之光源，可使用發出波長300～450 nm之光者，例如可使用超高壓水銀、水銀蒸汽電弧、碳弧及氙弧等。 進而，藉由曝光光源使用雷射光而不使用遮罩並根據電腦等之數位資訊直接形成圖像的雷射直接刻寫法就不僅謀求生產性之提高，亦謀求解像性或位置精度等之提高的方面而言有用，作為該雷射光，較佳地使用340～430 nm之波長之光，但亦可使用氬離子雷射、氦氖雷射、YAG雷射、及半導體雷射等發出可見光至紅外光範圍之光者。於使用該等雷射之情形時，可添加吸收可見光至紅外光之範圍的增感色素。 使用本案發明之硬化性組合物，反覆進行下述(1)～(4)之步驟，將2種顏色以上之圖案進行組合，而可製造用於液晶顯示面板等之彩色濾光片。 (1)將本發明之著色聚合性組合物之塗膜形成於基板上之步驟 (2)經由具有圖案形狀之遮罩而對該塗膜照射活性光之步驟 (3)利用顯影液(尤其是鹼性顯影液)將硬化後之覆膜進行顯影之步驟 (4)將顯影後之該覆膜進行加熱之步驟 使用本發明之硬化性組合物而成之硬化物可用於硬化性塗料、清漆、硬化性接著劑、印刷基板、或彩色電視、PC顯示器、攜帶型資訊終端及數位相機等彩色顯示之液晶顯示面板中之彩色濾光片、CCD影像感測器之彩色濾光片、觸控面板、電漿顯示面板用之電極材料、粉末塗層、印刷油墨、印刷版、接著劑、凝膠塗層、電子工學用之光阻劑、電鍍阻劑、蝕刻阻劑、焊料阻劑、絕緣膜、黑矩陣、各種顯示用途用之彩色濾光片、電漿顯示面板、電發光顯示裝置、及用以於LCD之製造步驟中形成結構之抗蝕劑、用以封入電氣及電子零件之組合物、阻焊劑、磁性記錄材料、微小機械零件、波導、光開關、鍍敷用遮罩、蝕刻遮罩、彩色試驗系統、玻璃纖維纜線塗層、篩網印刷用模板、用以藉由立體光刻製造三維物體之材料、全像術記錄用材料、圖像記錄材料、微細電子電路、脫色材料、用於圖像記錄材料之脫色材料、使用微膠囊之圖像記錄材料用之脫色材料、印刷配線板用光阻劑材料、UV及可見雷射直接圖像系統用之光阻劑材料、印刷電路基板之逐次積層中之介電層形成所使用之光阻劑材料及保護膜等各種用途，該等用途並無特別限制。 本發明之硬化性組合物於使用黑色顏料作為著色劑(D)之情形時，係用以形成黑矩陣，該黑矩陣尤其是對於液晶顯示面板等圖像顯示裝置用之顯示裝置用彩色濾光片有用。 上述黑矩陣較佳為藉由如下步驟而形成：(1)將本發明之硬化性組合物之塗膜形成於基板上之步驟、(2)經由具有特定圖案形狀之遮罩而對該塗膜照射活性光之步驟、(3)利用顯影液(尤其是鹼性顯影液)將曝光後之覆膜進行顯影之步驟、(4)對顯影後之該覆膜進行加熱之步驟。又，本發明之硬化性組合物亦作為無顯影步驟之噴墨方式組合物有用。 關於液晶顯示面板等所使用之彩色濾光片之製造，可使用本發明或其以外之硬化性組合物，反覆進行上述(1)～(4)之步驟，將2種顏色以上之圖案進行組合而製作。 將使用本發明之硬化性組合物而成之硬化物之具體製造方法示於以下。 即，將本發明之硬化性組合物旋轉塗佈於玻璃基板(10 cm×10 cm)上，於100℃下進行100秒鐘加熱，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用Microtec公司製造之近接式曝光機，隔著形成有1～20 μm之圖案之負型遮罩，以曝光量40 mJ/cm2 (Gap 100 μm)進行曝光。利用23℃之0.04質量%KOH水溶液將曝光後之膜進行40秒鐘顯影後，於230℃下進行30分鐘焙燒處理。 [實施例] 以下，列舉實施例等對本發明進一步詳細地進行說明，但本發明並不受該等實施例等限定。 [製造例1]聚合性化合物No.1之PGMEA溶液製備 添加1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿184 g、丙烯酸58 g、2,6-二-第三丁基-對甲酚0.26 g、四-正丁基溴化銨0.11 g及PGMEA 105 g，於120℃下攪拌16小時。將反應液冷卻至室溫，添加PGMEA 160 g、聯苯四甲酸酐59 g及四-正丁基溴化銨0.24 g，於120℃下攪拌4小時。進而添加四氫鄰苯二甲酸酐20 g，於120℃下攪拌4小時，於100℃下攪拌3小時，於80℃下攪拌4小時，於60℃下攪拌6小時，於40℃下攪拌11小時後，添加PGMEA 128 g，而獲得聚合性化合物No.1之PGMEA溶液(Mw＝5000，Mn＝2100，酸值(固形物成分)92.7 mgKOH/g)。 [製造例2]聚合性化合物No.2之PGMEA溶液製備 添加1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿43 g、丙烯酸13.5 g、2,6-二-第三丁基-對甲酚0.05 g、四丁基乙酸銨0.11 g及PGMEA 23 g，於120℃下攪拌16小時。冷卻至室溫，添加PGMEA 35 g及聯苯四甲酸酐11.5 g，於120℃下攪拌8小時。進而添加四氫鄰苯二甲酸酐7.4 g，於120℃下攪拌4小時，於100℃下攪拌3小時，於80℃下攪拌4小時，於60℃下攪拌6小時，於40℃下攪拌11小時後，添加PGMEA 34.4 g，而獲得聚合性化合物No.2之PGMEA溶液(Mw＝4000，Mn＝2100，酸值(固形物成分)86 mgKOH/g)。 [製造例3]聚合性化合物No.3之PGMEA溶液製造 添加9,9-雙(4-縮水甘油氧基苯基)茀75.0 g、丙烯酸23.8 g、2,6-二-第三丁基-對甲酚0.273 g、四丁基氯化銨0.585 g、及PGMEA 65.9 g，於90℃下攪拌1小時，於100℃下攪拌1小時，於110℃下攪拌1小時及於120℃下攪拌14小時。冷卻至室溫，添加琥珀酸酐25.9 g、四丁基氯化銨0.427 g、及PGMEA 1.37 g，於100℃下攪拌5小時。進而添加9,9-雙(4-縮水甘油氧基苯基)茀30.0 g、2,6-二-第三丁基-對甲酚0.269 g、及PGMEA 1.50 g，於90℃下攪拌90分鐘，於120℃下攪拌4小時後，添加PGMEA 122.2 g，而獲得聚合性化合物No.3之PGMEA溶液(Mw＝4190，Mn＝2170，酸值(固形物成分)52 mg・KOH/g)。 [製造例4]碳黑No.1之製造 將MA100(三菱化學公司製造之碳黑)150 g及過氧二硫酸鈉去離子水溶液(濃度2.0 N)3000 ml進行混合，於60℃下攪拌10小時。進行過濾，利用氫氧化鈉將所獲得之漿料進行中和，藉由膜滲濾進行處理，將所獲得之固體於75℃下乾燥一夜，而獲得作為黑色粉末之碳黑No.1。 [製造例5]碳黑No.2之製造 將MA100(三菱化學公司製造之碳黑)150 g及環丁碸400 ml進行混合，添加醯胺硫酸15 g，於140～150℃下攪拌10小時。利用氫氧化鋰將所獲得之漿料進行中和，藉由膜滲濾進行處理，將所獲得之固體於75℃下乾燥一夜，而獲得作為黑色粉末之碳黑No.2。 [製造例6]碳黑分散液No.1之製造 分別稱量碳黑No.1 16 g、聚合性化合物No.1之PGMEA溶液3.6 g、DISPERBYK-161(BYK-Chemie製造，分散劑)2.4 g及PGMEA 78 g並加以調合，藉由珠磨機進行處理而獲得碳黑分散液No.1。 [製造例7]碳黑分散液No.2之製造 分別稱量碳黑No.2 16 g、聚合性化合物No.1之PGMEA溶液3.6 g、DISPERBYK-161 2.4 g及PGMEA 78 g並加以調合，藉由珠磨機進行處理而獲得碳黑分散液No.2。 [實施例1～16及比較例1～4]硬化性組合物之製備 依據[表2]～[表4]之調配將各成分進行混合，而獲得硬化性組合物(實施例1～16及比較例1～4)。再者，表中之調配之數值係表示質量份。 又，表中之各成分之符號係表示下述之成分。 A-1 PL-2L-PGME(膠體二氧化矽；扶桑化學公司製造) A-2 YA010C-LDI(膠體二氧化矽；Admatechs公司製造) A-3 PMA-ST(膠體二氧化矽；日產化學公司製造) A-4 YA050C-LHI(膠體二氧化矽；Admatechs公司製造) A-5 YA010C-SP3(粉末二氧化矽；Admatechs公司製造) A'-1 AEROSIL 100(粉末二氧化矽；Aerosil公司製造) A'-2 AEROSIL OX-50(粉末二氧化矽；Aerosil公司製造) A'-3 SC2050-MB(膠體二氧化矽；Admatechs公司製造) B-1 聚合性化合物No.1之PGMEA溶液(固形物成分 45 wt%) B-2 聚合性化合物No.2之PGMEA溶液(固形物成分 45 wt%) B-3 聚合性化合物No.3之PGMEA溶液(固形物成分 45 wt%) B-4 Kayarad DPHA(聚合性化合物；日本化藥公司製造) C-1 化合物No.C1 C-2 化合物No.C2 D-1 碳黑分散液 No.1 D-2 碳黑分散液 No.2 E-1 PGMEA F-1 KBM-403(偶合劑；信越化學公司製造) 將上述二氧化矽粒子之參數彙總至[表1]中。 [表1] [表2] [表3] [表4] [評價例1～16及比較評價例1～4] 針對實施例1～16中所獲得之硬化性組合物No.1～No.16及比較例1～4中所獲得之比較硬化性組合物No.1～No.4，藉由下述方式進行最小密接線寬、表面粗糙度Ra、體積電阻率、傾斜角及OD值之評價。將結果示於[表5]～[表7]。 (最小密接線寬) 將硬化性組合物旋轉塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下加熱100秒鐘，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用Microtec公司製造之近接式曝光機，隔著形成有1～20 μm之圖案之負型遮罩，以曝光量40 mJ/cm2 (Gap 100 μm)進行曝光。利用23℃之0.04質量%KOH水溶液將曝光後之膜進行40秒鐘顯影後，於230℃下進行30分鐘焙燒處理。利用光學顯微鏡進行觀察，將殘留於玻璃基板上之最小光罩圖案設為最小密接線寬。若最小密接線寬為6 μm以下，則為高精細。另一方面，於最小密接線寬為7 μm以上之情形時，不可謂高精細。 (表面粗糙度Ra) 將硬化性組合物旋轉塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下加熱100秒鐘，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，於230℃下進行30分鐘焙燒處理。利用ULVAC公司之表面輪廓儀(DEKTAK 6M)對膜之表面粗糙度Ra進行測定。若表面粗糙度Ra為100 Å以下，則表示已充分地分散著色劑與二氧化矽，表面變得平滑，而獲得了充分之遮光性。另一方面，於表面粗糙度Ra為100 Å以上之情形時，未充分地分散著色劑與二氧化矽，表面粗燥，未獲得充分之遮光性(OD值)。 (體積電阻率) 以硬化性組合物之膜厚成為4 μm之方式旋轉塗佈於濺鍍有鉻之基板上，作為預烘烤，於110℃下進行2分鐘焙燒後，使用高壓水銀燈作為光源，以100 mJ/cm2 進行曝光，繼而作為曝光後烘烤，於230℃下進行180分鐘焙燒而製作硬化物。藉由濺鍍處理而於硬化物之上製作鉑電極。將鉻部位與鉑電極用導線連接上，並連接電阻測定器而進行體積電阻率之測定。單位為Ω・cm。 體積電阻率為1010 Ω・cm以上之硬化物可用作IPS液晶顯示器之彩色濾光片用高電阻黑矩陣，體積電阻率為1011 Ω・cm以上之硬化物可更佳地用作黑矩陣。 (OD值) 將上述硬化性組合物或比較硬化性組合物旋轉塗佈(1300 rpm，50秒鐘)於基板上並進行乾燥後，於100℃下進行100秒鐘預烘烤。使用超高壓水銀燈作為光源，以100 mJ/cm2 進行曝光後，於230℃下進行30分鐘烘烤而製作硬化物。使用麥克貝思透過濃度計測定所獲得之膜之OD值，用該OD值除以曝光後烘烤後之厚度，算出每單位厚度之OD值。 每單位厚度之OD值為3.0以上之硬化物可用作黑矩陣，每單位厚度之OD值為3.5以上之硬化物可較佳地用作黑矩陣。 (傾斜角) 將硬化性組合物旋轉塗佈於玻璃基板(10 cm×10 cm)，於100℃下進行100秒鐘加熱，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用Microtec公司製造之近接式曝光機，隔著形成有6 μm之圖案之負型遮罩，以曝光量40 mJ/cm2 (Gap 100 μm)進行曝光。利用23℃之0.04質量%KOH水溶液將曝光後之膜進行40秒鐘顯影後，於230℃下進行30分鐘焙燒處理，利用掃描式電子顯微鏡對圖案與基板之間之接合角度(傾斜角)進行測定。該傾斜角係對應於下述所示之圖1之(a)及(b)中的角θ。於(a)傾斜角為銳角之情形時，意指於圖案中不存在底切，於(b)傾斜角為鈍角之情形時，意指於圖案中存在底切。於傾斜角為70～90°之情形時，所獲得之硬化物之圖案變得高精細，故而良好。 [表5] [表6] [表7] 根據以上之結果明確，本發明之硬化性組合物由於可提供高體積電阻及高遮光性(OD值)優異，且具有高精細(最小密接線寬、傾斜角)之圖案形狀之硬化物，故而有用。因此，本發明之硬化性樹脂及硬化物對於電子材料用硬化性樹脂組合物、尤其是黑矩陣有用。 [產業上之可利用性] 本發明之硬化性組合物可獲得達到能夠滿足高電阻及高精細圖案之形成之水準的硬化物，因此作為彩色濾光片用途之抗蝕劑有用。又，於使用黑色顏料作為著色劑之硬化性組合物之情形時，能夠製作高遮光之硬化物，因此作為黑矩陣形成材料尤其有用。Hereinafter, the curable composition of the present invention will be described based on preferred embodiments. The curable composition of the present invention contains wet cerium oxide particles (A) having an average particle diameter of 50 nm or less, a polymerizable compound (B), a polymerization initiator (C), and a color former (D). Hereinafter, each component will be described in order. <Ceria Group Particles (A)> The ceria particles (A) used in the curable composition of the present invention are particles containing wet ceria having an average particle diameter of 50 nm or less. The so-called wet cerium oxide is an amorphous cerium oxide synthesized in a liquid. The cerium oxide particles (A) used in the curable composition of the present invention are, for example, a precipitation method or a gel method by neutralizing sodium citrate with a mineral acid, or a sol-gel which hydrolyzes alkoxy decane. Obtained by law. In the present invention, in the case of a good dispersibility of a polymerizable compound or a solvent, in the wet cerium oxide, a colloid-dispersed cerium oxide particle is preferable, and from the same viewpoint, it is preferably Surface treatment of cerium oxide. The content of the metal as the impurity of the cerium oxide particles (A) used in the curable composition of the present invention is not particularly limited, but the content of the metal is preferably small. The concentration of the metal in the cerium oxide particles (A) can be highly sensitive by ICP-MS (Inductively coupled plasma-Mass spectrometry) after being dispersed in a suitable dispersion medium. The measurement was carried out. Moreover, as a metal which is inferior in the cerium oxide particle (A), iron, sodium, titanium, aluminum, potassium, calcium, zirconium, and magnesium are mentioned. The content of the metal in the cerium oxide particles (A) is preferably 1000 ppm or less, more preferably 100 ppm or less, still more preferably 1 ppm or less. When the cerium oxide particles (A) used in the curable composition of the present invention have an average particle diameter of 50 nm or less, a curable composition which is stable in dispersibility of the coloring agent and a self-curable composition can be obtained. In terms of high-hardness, the average particle diameter is preferably 30 nm or less, more preferably 20 nm or less. The lower limit of the average particle diameter of the cerium oxide particles (A) is not particularly limited, and may be 10 nm or more. The average particle diameter of the cerium oxide particles can be measured by a laser diffraction type particle size distribution measuring apparatus. Examples of the laser diffraction type particle size distribution measuring apparatus include a Microtrac particle size distribution meter manufactured by Nikkiso Co., Ltd. The surface-treated cerium oxide is a chemical reaction of a part or all of a stanol group on the surface of the cerium oxide particle, and examples thereof include an organic cerium compound such as a cerium oxide particle and an alkoxy decane compound. And a cerium oxide particle obtained by heating and heating the above-mentioned organic hydrazine compound as an acid or a base as a catalyst. As the cerium oxide particle (A), a commercially available product can be preferably used, and examples thereof include PL-1-IPA, PL-1-TOL, PL-2L-PGME, and PL-2L-MEK (above, Fuso Chemical industry manufacturing); YA010C-LDI, YA050C-LHI, YA010C-SP3 (manufactured by Admatechs); organic bismuth sol MA-ST-M, MA-ST-L, IPA-ST, IPA-ST-L, IPA-ST -UP, EG-ST, NPC-ST-30, PGM-ST, DMAC-ST, MEK-ST-40, MEK-ST-UP, MIBK-ST, MIBK-ST-L, CHO-ST-M, EAC -ST, PMA-ST, TOL-ST, MEK-AC-2140Z, MEK-AC-4130Y, MEK-AC-5140Z, PGM-AC-2140Y, PGM-AC-4130Y, MIBK-AC-4130Y, MIBK-AC -2140Y, MIBK-SD-L, MEK-EC-2130Y, MEK-EC-6150P, MEK-EC-7150P, EP-F2130Y, EP-F6140P, EP-F7150P (above, manufactured by Nissan Chemical Industries, Ltd.). In the curable composition of the present invention, the content of the cerium oxide particles (A) is not particularly limited, and is preferably 0.1 to 70 parts by mass, more preferably 0.5, based on 100 parts by mass of the coloring agent (D). It is 50 parts by mass, and more preferably 5 to 20 parts by mass. When the content of the cerium oxide particles (A) is in the above range, a curable composition excellent in dispersibility of cerium oxide particles and a coloring agent, and a cured product having high electrical resistance and high fineness can be obtained, which is preferable. . For example, when the cured product having a thickness of 1 to 3 μm is formed, the content of the cerium oxide particles (A) is not particularly limited, and is preferably 0.1 to 70 parts by mass based on 100 parts by mass of the coloring agent (D). More preferably, it is 0.5 to 50 parts by mass, and further preferably 5 to 20 parts by mass. <Polymerizable compound (B)> The polymerizable compound (B) used in the curable composition of the present invention has a polymerizable compound such as radical polymerization, cationic polymerization or anionic polymerization, and has good reactivity, and a polymerizable compound From the viewpoint of a large variety, a radical polymerizable compound and a cationically polymerizable compound can be preferably used. The radically polymerizable compound is not particularly limited, and a previously known compound having radical polymerizability may be used, and examples thereof include ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, and vinylidene fluoride. And unsaturated aliphatic hydrocarbons such as tetrafluoroethylene; (meth)acrylic acid, α-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, bicycloheptene dicarboxylic acid, crotonic acid, methacrylic acid , vinyl acetate, allyl acetic acid, cinnamic acid, hexadienoic acid, mesaconic acid, succinic acid mono [2-(methyl) propylene methoxyethyl] ester, phthalic acid mono [2-(methyl) Propylene methoxyethyl ester and ω-carboxy polycaprolactone mono(meth) acrylate are equal to mono (meth) acrylate of a polymer having a carboxyl group and a hydroxyl group at both terminals; hydroxyethyl (meth) acrylate・Maleate, hydroxypropyl (meth)acrylate, maleate, dicyclopentadiene, maleate, and polyfunctional one having one carboxyl group and two or more (meth) acrylonitrile groups Unsaturated monobasic acid such as (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxy (meth) acrylate Propyl ester, glycidyl (meth)acrylate, the following compounds No. A1 to No. A4, methyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, (A) Tertiary butyl acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, stearic acid (meth) acrylate Ester, lauryl (meth)acrylate, methoxyethyl (meth)acrylate, dimethylaminomethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, (meth)acrylic acid Aminopropyl propyl ester, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly(ethoxy)ethyl (meth) acrylate, butoxy (meth) acrylate Ethoxyethyl ester, ethylhexyl (meth)acrylate, phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, vinyl (meth)acrylate, allyl (meth)acrylate Ester, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol (meth) acrylate, Diol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolethane tris(methyl) ) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (a) Unsaturated monobasic acid such as acrylate, dihydrolinarol di(meth)acrylate, tris((meth)acryloylethyl)isocyanurate and (meth)acrylic polyester oligomer And a polyhydric alcohol or a polyphenol ester; a metal salt of an unsaturated polybasic acid such as zinc (meth)acrylate or magnesium (meth)acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyltetrahydroortylene Formic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5-(2,5-di-oxo-tetrahydrofuranyl)-3-methyl-3-cyclohexene-1,2 - an anhydride of an unsaturated polybasic acid such as a dicarboxylic anhydride, a trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecenyl succinic anhydride or methylbicycloheptene dicarboxylic anhydride; (methyl) Acrylamide, methylene Bis-(meth)acrylamide, di-ethyltriamine tris(meth)acrylamide, benzyldimethylbis(methyl)propenamide, alpha-chloropropenylamine and N-2- An unsaturated monobasic acid such as hydroxyethyl (meth) acrylamide and a polyamine; an unsaturated aldehyde such as acrolein; (meth)acrylonitrile, α-chloroacrylonitrile, metacyanylene and allyl Unsaturated nitrile such as cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyl toluene , unsaturated aromatic compounds such as vinyl benzoic acid, vinyl phenol, vinyl sulfonic acid, 4-vinyl benzene sulfonic acid, vinyl benzyl methyl ether and vinyl benzyl glycidyl ether; methyl vinyl ketone, etc. Saturated ketone; unsaturated amine compounds such as vinylamine, allylamine, N-vinylpyrrolidone and vinylpiperidine; vinyl alcohol such as allyl alcohol and crotyl alcohol; vinyl methyl ether, vinyl ethyl ether, n-butyl Vinyl ethers such as vinyl ether, isobutyl vinyl ether and allyl glycidyl ether; maleic imine, N-phenyl maleimide and N-cyclohexyl maleimide Anthraquinones; anthraquinones such as hydrazine and 1-methylhydrazine; aliphatic conjugated dienes such as 1,3-butadiene, isoprene and chloroprene; polystyrene, poly(methyl) Methyl acrylate, n-butyl poly(meth)acrylate and polyoxymethane are equal to macromonomers having a mono(meth)acrylonitrile group at the end of the polymer molecular chain; vinyl chloride, vinylidene chloride, and Ethylene amber oxime, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrole A vinyl epoxy compound such as a ketone, a vinyl pyridine, a hydroxyl group-containing vinyl monomer, a polyisocyanate compound, a vinyl urethane compound, a hydroxyl group-containing vinyl monomer, and a polyepoxy compound. Commercially available products may be used as the radically polymerizable compound, and examples thereof include Kayarad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, and PET30 (above, manufactured by Nippon Kayaku Co., Ltd.); ARONIX M -215, M-350 (above, East Asia Synthetic Manufacturing); NK Ester A-DPH, A-TMPT, A-DCP, A-HD-N, TMPT, DCP, NPG and HD-N (above, Xinzhongcun Chemical Industry) Manufacturing); SPC-1000, SPC-3000 (above, manufactured by Showa Denko); [Chemical 4][Chemical 5][Chemical 6][Chemistry 7]In view of obtaining a curable composition having good dispersibility of the colorant (D) and a cured product having good heat resistance, it is preferred that the polymerizable compound (B) is a compound represented by the above formula (I); An unsaturated compound having a structure obtained by esterifying a compound represented by the above formula (I) with an unsaturated monobasic acid; or having a compound represented by the above formula (I) and an unsaturated monobasic acid An unsaturated compound having a structure in which an unsaturated compound having an esterified structure is further esterified with a polybasic acid anhydride. In particular, it is preferable that the polymerizable compound (B) has a structure in which a compound represented by the above formula (I) is esterified with an unsaturated monobasic acid, and has an unsaturated structure of the following [g]. And a compound having an unsaturated compound having a structure in which a compound represented by the above formula (I) and an unsaturated monobasic acid are esterified, and further esterified with a polybasic acid anhydride, and having the following (h)] Structure of unsaturated compounds. The composition of the present invention preferably contains an "epoxy compound represented by the formula (I)" and "haves an esterification of an epoxy compound represented by the formula (I) with an unsaturated monobasic acid as described above. "unsaturated compound of structure" or "unsaturated compound having a structure which is an unsaturated compound having a structure obtained by esterifying an epoxy compound represented by the general formula (I) with an unsaturated monobasic acid Further, it is esterified with a polybasic acid anhydride to form a polymerizable compound (B). In the present invention, a wide variety of compounds can be used as the unsaturated monobasic acid and polybasic acid anhydride as described below. Therefore, the above-mentioned "unsaturated compound having a structure obtained by esterifying an epoxy compound represented by the general formula (I) with an unsaturated monobasic acid" and "an unsaturated compound having a structure having a structure The structure in which the unsaturated compound of the structure in which the epoxy compound represented by the formula (I) is esterified with an unsaturated monobasic acid is further esterified with a polybasic acid anhydride is produced according to the structure of the polymerizable compound (B). There is a large difference in the structure of the raw materials used. Therefore, the current state of the art is that it is impossible to uniformly express the structure of the above-mentioned polymerizable compound (B) as an unsaturated compound by a certain general formula, which is a technical common knowledge of the manufacturer. Further, if the structure is not specified, it is difficult to know the material properties determined by the structure, and therefore, the characteristics cannot be expressed. Therefore, in the present invention, the unsaturated compound which is preferably a polymerizable compound (B) is preferably defined as follows: "having an ester of an epoxy compound represented by the formula (I) with an unsaturated monobasic acid "Unsaturated compound having a structure", "an unsaturated compound having a structure obtained by esterifying an epoxy compound represented by the general formula (I) with an unsaturated monobasic acid) The unsaturated compound is further esterified with a polybasic acid anhydride. In other words, the polymerizable compound (B) which is preferably used in the present invention may be such that "the epoxy acrylate is directly specified depending on its structure or characteristics at the time of filing a patent" cannot be realized or is not so much. reality. [化8](in the formula, Y1 Represents the residue of an unsaturated monobasic acid, Y2 A residue representing a polybasic acid anhydride, wherein * means that the group represented by the equation is bonded to an adjacent group by a * moiety). The hydrocarbon group having 1 to 20 carbon atoms represented by M in the above formula (I) is not particularly limited, and preferably represents an alkylene group having 1 to 20 carbon atoms and a cycloalkane having 3 to 20 carbon atoms. Base. Examples of the above alkylene group having 1 to 20 atomic atoms include a methylene group, an ethylidene group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an exopeptide group, and a fluorenyl group. , anthracene, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, and an extension An alkyl group, a nonadecyl group, an eicosyl group, and the like. Examples of the above-mentioned cycloalkylene group having 3 to 20 carbon atoms include a cyclopropyl group, a cyclopentylene group, a cyclohexylene group, a cycloheptyl group, and a cyclooctyl group. R in the above formula (I)1 ~R38 The hydrocarbon group having 1 to 20 carbon atoms is not particularly limited, and preferably represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, or a cycloalkyl group having 3 to 20 carbon atoms. The sensitivity of the case where the cycloalkylalkyl group having 4 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the aralkyl group having 7 to 20 carbon atoms are used as the polymerizable compound (B) In a good aspect, it is more preferably an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkanediyl group having 1 to 10 carbon atoms or a cycloalkyl group having 3 to 10 carbon atoms. And a cycloalkylalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, and an aralkyl group having 7 to 10 carbon atoms. Examples of the alkyl group having 1 to 20 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a second butyl group, a tert-butyl group, a pentyl group and a different group. Pentyl, third amyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, decyl, isodecyl, decyl, isodecyl, undecyl, The dodecyl group, the tetradecyl group, the hexadecyl group, the octadecyl group, the eicosyl group, etc., and the alkyl group having 1 to 10 carbon atoms are exemplified by a methyl group, an ethyl group, and a propyl group. , isopropyl, butyl, isobutyl, t-butyl, tert-butyl, pentyl, isopentyl, tert-amyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl , third octyl, fluorenyl, isodecyl, fluorenyl and isodecyl. Examples of the alkenyl group having 2 to 20 carbon atoms include a vinyl group, a 2-propenyl group, a 3-butenyl group, a 2-butenyl group, a 4-pentenyl group, a 3-pentenyl group, and a 2- Hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-decenyl, 4-decene , 3-undecyl, 4-dodecenyl, 3-cyclohexenyl, 2,5-cyclohexadienyl-1-methyl, and 4,8,12-tetradec-triene Examples of the alkenyl group having 2 to 10 carbon atoms include a vinyl group, a 2-propenyl group, a 3-butenyl group, a 2-butenyl group, a 4-pentenyl group, and the like. Pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-decene Base and 4-decenyl and the like. The above-mentioned cycloalkyl group having 3 to 20 carbon atoms means a saturated monocyclic or saturated polycyclic alkyl group having 3 to 20 carbon atoms. For example, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclodecyl, cyclodecyl, adamantyl, decahydronaphthalene, octahydrocyclopentadiene And a bicyclo[1.1.1]pentyl group and a tetra-dodecylhydroquinone group, and the cycloalkyl group having 3 to 10 carbon atoms, and examples thereof include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, and a ring. Hexyl, cycloheptyl, cyclooctyl, cyclodecyl, cyclodecyl, adamantyl, decahydronaphthalene, octahydrocyclopentadiene and bicyclo[1.1.1]pentyl. The above-mentioned cycloalkylalkyl group having 4 to 20 carbon atoms means a group having 4 to 20 carbon atoms in which a hydrogen atom of an alkyl group is substituted by a cycloalkyl group. For example, cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclodecylmethyl, cyclodecylmethyl, 2 -cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 2-cyclodecylethyl, 2-cycloindole Ethylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-cyclodecylpropyl 3-cyclodecylpropyl, 4-cyclobutylbutyl, 4-cyclopentylbutyl, 4-cyclohexylbutyl, 4-cycloheptylbutyl, 4-cyclooctylbutyl, 4- Examples of the cycloalkylidene group, the 4-cyclodecylbutyl group, the 3-3-adamantylpropyl group, the decalinylpropyl group, and the like, and the cycloalkylalkyl group having 4 to 10 carbon atoms, for example, Cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclodecylmethyl, 2-cyclobutylethyl, 2-ring Amyl ethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl 3-cycloheptylpropyl , 4-cyclobutylbutyl, 4-cyclopentylbutyl, 4-cyclohexylbutyl, and the like. Examples of the aryl group having 6 to 20 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, and the like, or one or more of the above alkyl groups. a phenyl group, a biphenyl group, a naphthyl group or a fluorenyl group substituted with an alkenyl group, a carboxyl group or a halogen atom, etc., for example, 4-chlorophenyl group, 4-carboxyphenyl group, 4-vinylphenyl group, 4-methyl group Examples of the aryl group having 6 to 10 carbon atoms, such as a phenyl group, a 2,4,6-trimethylphenyl group, and the like, may, for example, be a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group or a naphthyl group. Or a phenyl group, a biphenyl group, a naphthyl group or a fluorenyl group substituted with one or more of the above alkyl group, the above alkenyl group or a carboxyl group, a halogen atom or the like, for example, 4-chlorophenyl group, 4-carboxyphenyl group, 4 - vinylphenyl, 4-methylphenyl, 2,4,6-trimethylphenyl, and the like. The above-mentioned aralkyl group having 7 to 20 carbon atoms means a group having 7 to 30 carbon atoms in which a hydrogen atom of an alkyl group is substituted with an aryl group. Examples thereof include a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, a phenylethyl group, and a naphthylpropyl group. The above-mentioned aralkyl group having 7 to 20 carbon atoms means The hydrogen atom of the alkyl group is substituted with an aryl group and has a group of 7 to 20 carbon atoms. For example, a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, a phenylethyl group, etc. are mentioned. R in the above formula (I)10 ~R38 The group having 2 to 20 carbon atoms and containing a hetero ring is not particularly limited, and examples thereof include a pyrrolyl group, a pyridyl group, a pyridylethyl group, a pyrimidinyl group, a decyl group, a piperazinyl group, and a piperidinyl group. Pyranyl, pyranylethyl, pyrazolyl, triazinyl, triazinylmethyl, pyrrolidinyl, quinolinyl, isoquinolinyl, imidazolyl, benzimidazolyl, triazolyl, furan Base, furanyl, benzofuranyl, thienyl, thiophenyl, benzothienyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl , isothiazolyl, isoxazolyl, indolyl, morpholinyl, thiomorpholinyl, 2-pyrrolidone-1-yl, 2-piperidin-1-yl, 2,4-dioxo Examples of the imidazolidin-3-yl group and the 2,4-dioxyoxazolidin-3-yl group, and the like, include a substituent having the following structure, and the like. [Chemistry 9](In the above formula, R each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and Z represents a direct bond or an alkylene group having 1 to 6 carbon atoms. Further, * in the formula means such The base represented by the formula is bonded to the adjacent group by a * portion. The alkyl group having 1 to 6 carbon atoms is exemplified as the alkyl group having 1 to 20 carbon atoms and 1 to 6 carbon atoms among the above-exemplified ones. Examples of the alkylene group having 1 to 6 carbon atoms include those having 1 to 6 carbon atoms among those exemplified as the alkylene group having 1 to 20 carbon atoms represented by M. Examples of the halogen atom in the formula (I) include fluorine, chlorine, bromine and iodine. As the R in the above formula (I)10 With R11 , R11 With R12 , R12 With R13 , R13 With R14 , Rtwenty two With R15 , R15 With R16 , R30 With Rtwenty three , Rtwenty three With Rtwenty four , Rtwenty four With R25 , R38 With R31 , R31 With R32 , R32 With R33 , R34 With R35 , R35 With R36 And R36 With R37 Examples of the ring formed by the bond include cyclopentane, cyclohexane, cyclopentene, benzene, pyrrolidine, pyrrole, piperidine, morpholine, thiomorpholine, tetrahydropyridine, lactone ring, and the like. 5 to 7 member rings such as amidoxime ring, and condensed rings such as naphthalene and anthracene. The unsaturated monobasic acid is an acid having an unsaturated bond in the structure and having one hydrogen atom which can be freed to become a hydrogen ion per molecule. Examples of the unsaturated monobasic acid include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, hexadienoic acid, hydroxyethyl methacrylate, maleic acid ester, hydroxypropyl methacrylate, and maleic acid ester. Hydroxypropyl acrylate, maleic acid ester, dicyclopentadiene, maleic acid ester, etc. The polybasic acid anhydride is an acid anhydride having two or more polybasic acids capable of being free as hydrogen atoms of hydrogen ions per molecule. Examples of the polybasic acid anhydride include biphenyltetracarboxylic dianhydride, phthalic anhydride, tetrahydrophthalic anhydride, biphenyltetracarboxylic anhydride, succinic anhydride, maleic anhydride, and trimellitic anhydride. Pyromellitic anhydride, 2,2'-3,3'-benzophenonetetracarboxylic anhydride, ethylene glycol bis-dehydrated trimellitate, glycerol trihydrate trimellitate, hexahydrophthalic anhydride , methyltetrahydrophthalic anhydride, methicillic acid anhydride, methyl benzoic anhydride, trialkyltetrahydrophthalic anhydride, 5-(2,5-dihydrotetrahydrofuranyl)-3-methyl 3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecenylsuccinic anhydride, methylbicycloheptene anhydride, and the like. The reaction ratio of the epoxy compound represented by the above formula (I) to the above unsaturated monobasic acid and the above polybasic acid anhydride is preferably as follows. In other words, it is preferably an epoxy resin addition product having a structure in which 0.1 to 1.0 of the carboxyl groups of the unsaturated monobasic acid are added to the epoxy group of the epoxy compound. The polybasic acid anhydride structure of the polybasic acid anhydride is 0.1 to 1.0 per one hydroxyl group of the epoxy adduct. The reaction examples of the above epoxy compound, the above unsaturated monobasic acid, and the above polybasic acid anhydride are shown below, but the present invention is not limited to the following reaction scheme 1. [化10]In the case where the polymerizable compound (B) is easy to obtain or has a high OD value when carbon black is added as a coloring agent, it is preferable to use R among the above-mentioned reaction products.1 ~R8 The hydrogen atom is an epoxy compound represented by the formula (I). Also, from the same point of view, it is also preferred to use: M is the base represented by (c) and R10 ~R14 Where the indicated group is a hydrogen atom or a phenyl group, M is a group represented by (d) and R15 ~Rtwenty two Is a hydrogen atom or a phenyl group, M is a group represented by (e) and Rtwenty three ~R30 Is a hydrogen atom or a phenyl group, or M is a group represented by (f) and R31 ~R38 It is a hydrogen atom or a phenyl group. In particular, in the case where the volume resistance of the cured product is high, it is more preferable that M is a group represented by (d). Further, as the unsaturated monobasic acid, an unsaturated monobasic acid having a carbon number of 5 or less is preferably used, and an unsaturated monobasic acid such as acrylic acid or methacrylic acid is preferably used. Further, as the polybasic acid anhydride, those having a benzene ring or a saturated aliphatic ring are preferred, and it is particularly preferred to use biphenyltetracarboxylic dianhydride, phthalic anhydride, tetrahydrophthalic anhydride, and biphenyltetracarboxylic anhydride. Polybasic anhydride. In the polymerizable compound (B) of the present invention, it is preferred to use a product based on the following production method in terms of dispersibility and curability of the colorant, but it is not limited thereto. Specifically, for example, 1,1-bis[4-(2,3-epoxypropoxy)phenyl]indane is selected as the epoxy compound represented by the above formula (I), and acrylic acid is selected as the unsaturated unary unit. a product obtained by selecting a biphenyltetracarboxylic anhydride as a polybasic acid anhydride; selecting 1,1-bis[4-(2,3-epoxypropoxy)phenyl]indane as the above formula (I) An epoxy compound represented by selecting acrylic acid as an unsaturated monobasic acid and selecting tetrahydrophthalic anhydride as a polybasic acid anhydride; selecting 1,1-bis[4-(2,3-epoxypropoxyl) Phenyl] indane is an epoxy compound represented by the above formula (I), and acrylic acid is selected as an unsaturated monobasic acid, and phthalic anhydride is selected as a polybasic acid; a 1,1-double is selected [ 4-(2,3-epoxypropoxy)phenyl]indane as the epoxy compound represented by the above formula (I), acrylic acid is selected as the unsaturated monobasic acid, and biphenyltetracarboxylic anhydride and tetrahydrogen neighbor are selected. A product of phthalic anhydride as a polybasic acid anhydride and 1,1 -bis[4-(2,3-epoxypropoxy)phenyl]-3-phenylindole as the above formula (I) The epoxy compound represented, choose C Acid as unsaturated monocarboxylic acid, biphenyl tetracarboxylic acid anhydride selected and tetrahydrophthalic anhydride as a polybasic acid anhydride obtained by the product and the like. Among the above-mentioned radical polymerizable compounds, when a compound having an acid value is used, alkali developability can be imparted to the curable composition of the present invention. When the compound having an acid value is used, the amount thereof is preferably 50 to 99 parts by mass based on 100 parts by mass of the polymerizable compound having a radical polymerizable property. Further, the compound having an acid value may be used by adjusting a acid value by further reacting a monofunctional or polyfunctional epoxy compound. The alkali developability of the curable composition can be improved by adjusting the acid value of the above acid-containing compound. The compound having an acid value (that is, a polymerizable compound having a radical polymerizability imparting alkali developability) is preferably a solid component having an acid value of from 5 to 120 mgKOH/g, and a monofunctional or polyfunctional epoxy compound. The amount used is preferably selected in such a manner as to satisfy the above acid value. Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, and the like. Butyl glycidyl ether, tert-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, decyl glycidyl ether, decyl glycidyl ether, ten Monoalkyl glycidyl ether, lauryl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-B Hexyl hexyl glycidyl ether, allyl glycidyl ether, propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxyglycidyl ether, p-butyl phenol glycidol Ether, cresyl glycidyl ether, 2-methyltolyl glycidyl ether, 4-mercaptophenyl glycidyl ether, benzyl glycidyl ether, p-cumyl phenyl glycidyl ether, trityl shrinkage Glycerol ether, methacrylic acid 2 , 3-glycidyl ester, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinyl oxycyclohexane, 1,2-epoxy-4-vinylcyclohexane, epoxy Ethylbenzene, decene oxide, methyl oxirane, cyclohexene oxide, propylene oxide, the above-mentioned compounds No. A1 to No. A4, and the like. When a compound selected from the group consisting of a bisphenol type epoxy compound and a glycidyl ether is used as the polyfunctional epoxy compound, a curable composition having further excellent properties can be obtained, which is preferable. As the bisphenol type epoxy compound, a bisphenol type epoxy compound represented by the above formula (I) can be used, and a bisphenol type epoxy compound such as a hydrogenated bisphenol type epoxy compound can also be used. Further, as the glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, or 1 can be used. , 8-octanediol diglycidyl ether, 1,10-nonanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, Triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, 1,1,1-three (shrinkage) Glyceryloxymethyl)propane, 1,1,1-tris(glycidoxymethyl)ethane, 1,1,1-tris(glycidoxymethyl)methane and 1,1,1,1 - Tetra(glycidoxymethyl)methane or the like. Further, a phenol novolak type epoxy compound, a biphenol novolak type epoxy compound, a cresol novolac type epoxy compound, a bisphenol A novolac type epoxy compound, or a dicyclopentadiene novolac type may be used. A novolac type epoxy compound such as an epoxy compound; 3,4-epoxy-6-methylcyclohexanecarboxylic acid 3,4-epoxy-6-methylcyclohexylmethyl ester, 3,4-epoxy ring An alicyclic epoxy compound such as 3,4-epoxycyclohexylmethyl hexane carboxylic acid or 1-epoxyethyl-3,4-epoxycyclohexane; diglycidyl phthalate, tetrahydrogen Glycidyl esters such as diglycidyl phthalate and glycidyl dimerate; tetraglycidyldiaminediphenylmethane, triglycidyl-p-aminophenol, and N,N-diglycidylaniline And other glycidylamines; heterocyclic epoxy compounds such as 1,3-diglycidyl-5,5-dimethylhydantoin and triglycidyl isocyanurate; dicyclopentane dioxide a dioxide compound such as a olefin; a naphthalene type epoxy compound; a triphenylmethane type epoxy compound; and a dicyclopentadiene type epoxy compound. Examples of the cationically polymerizable compound include an epoxy compound, an oxetane compound, and a vinyl ether compound. Examples of the epoxy compound include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, and phenyl group. 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, p-t-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, glycidyl methacrylate , isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl glycidyl ether, 4- Phenylphenol glycidyl ether, cresyl glycidyl ether, dibromomethylglycidyl ether, decyl glycidyl ether, methoxy polyethylene glycol monoglycidyl ether, ethoxypolyethylene glycol monoglycidyl ether , butoxy polyethylene glycol monoglycidyl ether, phenoxy polyethylene glycol monoglycidyl ether, dibromophenyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,5-pentyl Glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl a glycidyl ether compound such as ether, 1,1,2,2-tetrakis(glycidoxyphenyl)ethane or pentaerythritol tetraglycidyl ether; glycidyl esters such as glycidyl acetate and glycidyl stearate; 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-1,3-dioxane, methylenebis(3,4-epoxycyclohexane Alkane), propane-2,2-diylbis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, extended ethyl bis (3,4- Epoxycyclohexane carboxylate), bis(3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylhexanecarboxylic acid 3,4-epoxy-1-methylcyclohexyl ester, 6-methyl-3,4-epoxycyclohexanecarboxylic acid 6-methyl -3,4-epoxycyclohexylmethyl ester, 3,4-epoxy-3-methylcyclohexanecarboxylic acid 3,4-epoxy-3-methylcyclohexylmethyl ester, 3,4-epoxy -5-methylcyclohexanecarboxylic acid 3,4-epoxy-5-methylcyclohexylmethyl ester, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy- 2-epoxyethylcyclohexane, dicyclopentadienyl dicyclopentadiene, 3,4-epoxy-6-methylcyclohexyl carboxylate, α-pinene oxide, styrene oxide, oxidation ring Ring of hexene and oxidized cyclopentene Cycloalkyl glycidyl compound and N- phthaloyl acyl imine. As the epoxy compound, an epoxidized polyolefin can also be used. The epoxidized polyolefin is obtained by modifying a polyolefin with an epoxy group-containing monomer to introduce an epoxy group-containing polyolefin. It can be produced by copolymerizing ethylene, an α-olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer, and optionally other monomers by any of a copolymerization method and a grafting method. Ethylene or an α-olefin having 3 to 20 carbon atoms, a monomer having an epoxy group, and other monomers may be separately polymerized, or may be polymerized in plurality with other monomers. Further, it may be obtained by epoxidizing a double bond of a non-conjugated polybutadiene having a hydroxyl group at the terminal by a peracetic acid method, or a group having a hydroxyl group in the molecule. Further, the hydroxyl group may be subjected to urethane formation by an isocyanate, and then reacted with an epoxy compound containing a primary hydroxyl group to introduce an epoxy group. Examples of the ethylene or the α-olefin having 3 to 20 carbon atoms include ethylene, propylene, butylene, isobutylene, 1,3-butadiene, 1,4-butadiene, and 1,3-pentadiene. 2,3-Dimethyl-1,3-butadiene, pentadiene, 3-butyl-1,3-octadiene, and isoprene. Examples of the epoxy group-containing monomer include glycidyl esters of α,β-unsaturated acids, vinylbenzyl glycidyl ether, and allyl glycidyl ether. Specific examples of the glycidyl ester of the α,β-unsaturated acid include glycidyl acrylate, glycidyl methacrylate, and glycidyl ethacrylate, and more preferably glycidyl methacrylate. Examples of the other monomer include unsaturated aliphatic hydrocarbons such as vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene; (meth)acrylic acid, α-chloroacrylic acid, itaconic acid, and maleic acid. , citraconic acid, fumaric acid, bicycloheptene dicarboxylic acid, crotonic acid, methacrylic acid, vinyl acetic acid, allyl acetic acid, cinnamic acid, hexadienoic acid, mesaconic acid, succinic acid mono [2-(methyl) Propylene oxiranyl ethyl ester, phthalic acid mono [2-(methyl) propylene oxiranyl ethyl] ester, ω-carboxy polycaprolactone mono (meth) acrylate equivalent to having carboxyl groups at both ends Mono (meth) acrylate, hydroxyethyl (meth) acrylate, maleate, hydroxypropyl (meth) acrylate, maleate, dicyclopentadiene, maleic acid An ester and an unsaturated polybasic acid such as a polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acrylonitrile groups; 2-hydroxyethyl (meth)acrylate, (meth)acrylic acid -2-hydroxypropyl ester, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, (meth) propylene Cyclohexyl ester, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, (a) Base) methoxyethyl acrylate, dimethylaminomethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, aminopropyl (meth) acrylate, dimethyl (meth) acrylate Aminopropyl propyl ester, ethoxyethyl (meth) acrylate, poly(ethoxy)ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, (meth) acrylate Hexyl hexyl ester, phenoxyethyl (meth) acrylate, tetrahydrofuran (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene Alcohol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(methyl) Acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolethane tri(meth)acrylate, trishydroxy Methylpropane tri(meth)acrylate, two Pentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dihydro linalool di (meth) acrylate An ester of an unsaturated monobasic acid such as an ester, an isocyanuric acid tris[(meth)acrylinylethyl]ester or a (meth)acrylic acid polyester oligomer, and an ester of a polyhydric alcohol or a polyphenol; zinc (meth)acrylate, a metal salt of an unsaturated polybasic acid such as magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrogen Phthalic anhydride, 5-(2,5-di-oxo-tetrahydrofuranyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride- An anhydride of an unsaturated polybasic acid such as a maleic anhydride adduct, dodecenyl succinic anhydride, and methyl biscycloheptylene anhydride; (meth) acrylamide, methylene bis-(meth) acrylamide , di-ethyltriamine tris(meth)acrylamide, benzyldimethylbis(methyl)propene decylamine, α-chloropropenylamine, N-2-hydroxyethyl (meth) decylamine Iso-unsaturated monobasic acid and polyamine Anthracene; unsaturated aldehyde such as acrolein; unsaturated nitrile such as (meth)acrylonitrile, α-chloroacrylonitrile, metacyanylene, allyl cyanide; styrene, 4-methylstyrene, 4-B Styrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinylphenol, vinylsulfonic acid, 4-vinylbenzene Unsaturated aromatic compounds such as sulfonic acid, vinylbenzyl methyl ether and vinyl naphthalene; unsaturated ketones such as methyl vinyl ketone; vinylamine, allylamine, N-vinylpyrrolidone and vinylpiperidine Iso-unsaturated amine compounds; vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether and isobutyl vinyl ether; maleic imine, N-phenyl Unsaturated quinone imines such as maleic imine and N-cyclohexylmaleimide; anthraquinones such as hydrazine and 1-methylhydrazine; polystyrene, poly(methyl) methacrylate, poly(methyl) N-butyl acrylate and polyoxymethane are equal to macromonomers having a mono(meth)acrylonitrile group at the end of the polymer molecular chain; vinyl chloride, vinylidene chloride, and Alkene amber, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl sulfide, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrole Vinyl ketone compound of vinyl ketone, vinyl pyridine, hydroxyl group-containing vinyl monomer and polyisocyanate compound, vinyl epoxy compound containing hydroxyl group and polyepoxy compound, pentaerythritol III a hydroxyl group-containing polyfunctional acrylate such as acrylate or dipentaerythritol pentaacrylate; a reaction product of a polyfunctional isocyanate such as toluene diisocyanate or hexamethylene diisocyanate; and a hydroxyl group such as pentaerythritol triacrylate and dipentaerythritol pentaacrylate A polyfunctional acrylate having an acid value of a reaction of a polyfunctional acrylate with a dibasic acid anhydride such as succinic anhydride, phthalic anhydride or tetrahydrophthalic anhydride. Commercially available products may be used as the epoxidized polyolefin, and examples thereof include Epolead PB3600, Epolead PB4700 (above, manufactured by Daicel), BF-1000, FC-3000 (above, manufactured by ADEKA), Bondfast 2C, Bondfast E, and Bondfast CG5001, Bondfast CG5004, Bondfast 2B, Bondfast 7B, Bondfast 7L, Bondfast 7M, Bondfast VC40 (above, manufactured by Sumitomo Chemical); JP-100, JP-200 (above, manufactured by Japan Soda); Poly bd R-45HT, Poly Bd R-15HT (above, Idemitsu Kosan Co., Ltd.); and Ricon 657 (manufactured by Arkema); Examples of the above oxetane compound include 3,7-bis(3-oxetanyl)-5-oxa-decane and 1,4-bis[(3-ethyl-3-). Oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl) 3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxalate Cyclobutylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl- 3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl) Oxetane and 3-ethyl-3-(chloromethyl)oxetane and the like. Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, and 2-chloro Ethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexane dimethanol monovinyl Ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, and 1,6-cyclohexane dimethanol divinyl ether. Commercially available products may be used as the above-mentioned cationically polymerizable compound, and examples thereof include Epolight 40E, 1500 NP, 1600, 80 MF, 4000, and 3002 (above, manufactured by Kyoeisha Chemical Co., Ltd.); ADEKA Glycyrol ED-503, ED-503D, ED-503G, ED-523T, ED-513, ED-501, ED-502, ED-509, ED-518, ED-529, Adeka Resin EP-4000, EP-4005, EP-4080 and EP-4085 ( Above, manufactured by ADEKA); DENACOL EX-201, EX-203, EX-211, EX-212, EX-221, EX-251, EX-252, EX-711, EX-721, DENACOL EX-111, EX- 121, EX-141, EX-142, EX-145, EX-146, EX-147, EX-171, EX-192, and EX-731 (above, manufactured by Nagase Kasei); EHPE-3150, Celloxide 2021P, 2081 , 2000 and 3000 (above, made by Daicel); EPIOL M, EH, L-41, SK, SB, TB and OH (above, manufactured by Nippon Oil); Epolight M-1230 and 100MF (above, manufactured by Kyoeisha Chemical Co., Ltd.) ; ARONE OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211 and OXT-212 (above, manufactured by Toago); ETERNACOLL OXBP and OXTP (above, manufactured by Ube Industries); -hydroxyethyl vinyl ether, diethylene glycol monovinyl ether and 4-hydroxybutyl B Ether (above, manufactured by Maruzen Petrochemical); DENACOL EX-121, EX-141, EX-142, EX-145, EX-146, EX-147, EX-201, EX-203, EX-711, EX-721 , Oncoat EX-1020, EX-1030, EX-1040, EX-1050, EX-1051, EX-1010, EX-1011 and 1012 (above, manufactured by Changchun Huacheng); OGSOL PG-100, EG-200, EG -210 and EG-250 (above, manufactured by Osaka Gas Chemicals); HP 4032, HP4032D and HP4700 (above, manufactured by DIC); ESN-475V (manufactured by Tohto Kasei); Epikote YX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA and G -0130SP (above, Nippon Oil Manufacturing); EPICLON N-665 and HP-7200 (above, manufactured by DIC); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN -501H, EPPN-501HY, EPPN-502H, and NC-7000L (above, manufactured by Nippon Kayaku Co., Ltd.); The content of the polymerizable compound (B) in the curable composition of the present invention is not particularly limited, and is equivalent to the cerium oxide particles (A), the polymerizable compound (B), the polymerization initiator (C), and the color former. The total amount of the component (D) is preferably from 10 to 70 parts by mass, more preferably from 20 to 50 parts by mass, even more preferably from 30 to 50 parts by mass, from the viewpoint of good curability. When the content of the polymerizable compound (B) is within the above range, the cured product obtained is excellent in curability and light-shielding property, which is preferable. For example, when a cured product having a thickness of 1 to 3 μm is formed, the content of the polymerizable compound (B) is not particularly limited, and is relative to the cerium oxide particles (A), the polymerizable compound (B), and a polymerization initiator ( The total amount of C) is 100 parts by mass, preferably 10 to 70 parts by mass, more preferably 30 to 60 parts by mass, still more preferably 30 to 50 parts by mass. <Polymerization initiator (C)> As the polymerization initiator (C) used in the curable composition of the present invention, a previously known radical polymerization initiator and a cationic polymerization initiator can be used. The above-mentioned radical polymerization initiator is a photoradical polymerization initiator and a thermal radical polymerization initiator. In terms of higher reactivity, a photoradical polymerization initiator is more preferred. The photoradical polymerization initiator is not particularly limited as long as it generates a radical by light irradiation, and a previously known compound can be used, and examples thereof include an acetophenone-based compound, a benzoin-based compound, and a diphenyl group. Ketone compound, 9-oxo sulfurA compound, an oxime ester compound, etc. are preferable. Examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 4'-isopropyl-2-hydroxy-2. -methylpropiophenone, 2-hydroxymethyl-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone , p-tert-butyldichloroacetophenone, p-tert-butyltrichloroacetophenone, p-azidobenzylidene acetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4-(Methylthio)phenyl]-2-morpholinylacetone-1, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1 , benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, isoamyl ether and 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2- Methyl-1-propan-1-one and the like. Examples of the benzoin-based compound include benzoin and the like. Examples of the benzophenone-based compound include benzophenone, methyl phthalic acid benzoate, rice ketone, 4,4'-bisdiethylamino benzophenone, and 4,4. '-Dichlorobenzophenone and 4-benzylidene-4'-methyldiphenyl sulfide. 9-oxosulfura compound, which can be exemplified by 9-oxosulfur2-methyl 9-oxothione2-ethyl 9-oxothione2-chloro 9-oxosulfuron2-isopropyl 9-oxothiolane2,4-Diethyl 9-oxothioneWait. The oxime ester-based compound means a compound having a group represented by the above formula (II), and among the photoradical polymerization initiators, the oxime ester-based compound has a good sensitivity, and therefore can be preferably used in the present invention. A curable composition of the invention. R in the above formula (II)41 ~R43 The hydrocarbon group having 1 to 20 carbon atoms represented by R and1 ~R38 The hydrocarbon groups having 1 to 20 carbon atoms are the same. Modification of R in the above formula (II)41 And R42 And R41 Or R42 In the case of the indicated group, a heterocyclic ring having 2 to 20 carbon atoms and R10 ~R38 The group having 2 to 20 carbon atoms and containing a hetero ring is the same. The halogen atom in the above formula (II) is the same as the halogen atom in the above formula (I). Among the compounds having the group represented by the above formula (II), the compound represented by the following formula (III) is particularly preferably used in the curable composition of the present invention because of its high sensitivity. [11](where, R41 , R42 And m and R in the general formula (II)41 , R42 Same as m, R51 And R52 Each independently represents a hydrogen atom, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms or a heterocyclic ring having 2 to 20 carbon atoms. Base, X1 Indicates oxygen atom, sulfur atom, selenium atom, CR53 R54 , CO, NR55 Or PR56 , R51 ~R56 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a group having 2 to 20 carbon atoms containing a hetero ring, R53 ~R56 The hydrogen atom in the represented group is also substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group, R51 ~R56 The methylene group in the group represented is also substituted with -O- under the condition that it is not adjacent to oxygen, R51 ~R56 There are also cases in which a ring is formed separately from any adjacent benzene ring, and g represents a number from 0 to 5, and h represents a number from 0 to 4. R in the general formula (III)51 And R52 The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, the aralkyl group having 7 to 20 carbon atoms, and the group having 2 to 20 carbon atoms having a hetero ring and R1 ~R38 The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, the aralkyl group having 7 to 20 carbon atoms, and the group having 2 to 20 carbon atoms containing a hetero ring are the same. The halogen atom in the formula (III) is the same as the halogen atom in the above formula (I). R in the above formula (III)53 ~R56 The hydrocarbon groups of 1 to 20 carbon atoms are represented by R and R, respectively.1 ~R38 The hydrocarbon groups having 1 to 20 carbon atoms are the same. R in the above formula (III)53 ~R56 The group having a carbon number of 2 to 20 containing a hetero ring and R10 ~R38 The group having 2 to 20 carbon atoms and containing a hetero ring is the same. The compound represented by the formula (III) is exemplified by the compounds shown below. However, the present invention is not limited by any of the following compounds. [化12]Examples of other radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzimidyldiphenylphosphine oxide and bis(cyclopentadienyl)-bis[2,6 a titanocene compound such as difluoro-3-(pyrrol-1-yl)]titanium or the like. As a commercially available radical initiator, Adeka Optomer N-1414, N-1717, N-1919, Adeka Arkls NCI-831, NCI-930 (above, manufactured by ADEKA); IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907 IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE 784 (above, manufactured by BASF); TR-PBG-304, TR-PBG-305, TR-PBG-309, and TR-PBG-314 (above, manufactured by Trond); The thermal radical polymerization initiator is not particularly limited as long as it generates a radical by heating, and a conventionally known compound can be used, and examples thereof include an azo compound, a peroxide, and a persulfate. Good. Examples of the azo compound include 2,2'-azobisisobutyronitrile, 2,2'-azobis(methylisobutyrate), and 2,2'-azobis-2,4. - dimethyl valeronitrile, 1,1 '-azobis(1-ethenyloxy-1-phenylethane), and the like. Examples of the peroxide include benzammonium peroxide, di-t-butylbenzylidene peroxide, tert-butyl peroxypivalate, and di(4-tert-butylperoxy)peroxydicarbonate. Cyclohexyl) ester and the like. Examples of the persulfate include persulfate such as ammonium persulfate, sodium persulfate, and potassium persulfate. The above cationic initiator is a photocationic initiator and a thermal cation initiator. The photocationic polymerization initiator is not particularly limited as long as it can release a substance which initiates cationic polymerization by light irradiation, and an existing compound can be used, and it is preferably released by irradiation with an energy ray. A double salt of a Lewis acid salt or a derivative thereof. As a representative of the compound, a salt of a cation and an anion represented by the following formula: [A]r+ [B]R- . Above cation [A]r+ Preferably, the structure is, for example, represented by the following formula: [(R58 )e Q]r+ . Further, here, R58 It is an organic group having 1 to 60 carbon atoms and may contain atoms other than carbon atoms. e is any integer from 1 to 5. e R58 They are independent and can be the same or different. Also, R58 At least one of them is preferably an organic group having an aromatic ring as described above. For example, it may be exemplified by alkyl group, alkoxy group, hydroxyl group, hydroxyalkoxy group, halogen atom, benzyl group, thiophenoxy group, 4-benzylidenephenylthio group, 2-chloro-4-benzene group. A phenyl group substituted with a mercaptophenylthio group or the like. Q is selected from an atom or atomic group in a group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N=N. Again, the cation [A]r+ When the atomic price of Q is set to q, the relationship of r=e-q must be established (where N=N is regarded as the atomic price of 0). Again, anion [B]R- A halide complex is preferred, and its structure can be, for example, the following formula [LX]f ]R- Said. Further, here, L is a metal or a semimetal which is a central atom of a halide complex, and is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, and the like. An X-based halogen atom or a phenyl group which may be substituted by a halogen atom or an alkoxy group or the like. f is an integer from 3 to 7. Also, the anion [B]R- When the atomic price of L is set to p, the relationship of r=f-p must be established. As an anion of the above formula [LXf ]R- Specific examples thereof include tetrakis(pentafluorophenyl)borate, tetrakis(3,5-difluoro-4-methoxyphenyl)borate, and tetrafluoroborate (BF).4 )- Hexafluorophosphate (PF)6 )- Hexafluoroantimonate (SbF)6 )- Hexafluoroarsenate (AsF6 )- And hexachloroantimonate (SbCl)6 )- Wait. Again, anion [B]R- It is also preferred to use the following formula: [LXf - 1 (OH)]R- The structure represented. L, X, and f are the same as described above. Moreover, as another anion which can be used, a perchlorate ion (ClO) is mentioned.4 )- , trifluoromethyl sulfite ion (CF3 SO3 )- Fluorosulfonate ion (FSO3 )- , tosylate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate and tetrakis(pentafluorophenyl)borate Salt and so on. In the present invention, among the above-mentioned onium salts, the aromatic onium salts (1) to (3) described below are particularly effective. One type may be used alone or two or more types may be used in combination. (1) An aryldiazonium salt such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate or 4-methylphenyldiazonium hexafluorophosphate. (2) Diphenylphosphonium hexafluoroantimonate, bis(4-methylphenyl)phosphonium hexafluorophosphate, bis(4-t-butylphenyl)phosphonium hexafluorophosphate and tolylcumene a diarylsulfonium salt such as tetrakis(pentafluorophenyl)borate. (3) a phosphonium cation represented by the following group I or group II, and a phosphonium salt such as a hexafluoroantimonium ion or a tetrakis(pentafluorophenyl)borate ion;[Chemistry 14]Other preferred ones are: (η5-2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl An iron-aromatic complex such as benzene]-iron-hexafluorophosphate; aluminum mismatched with aluminum such as tris(acetonitrile)aluminum, tris(ethylethionylpyruvate)aluminum, and tris(salicylic acid)aluminum a mixture with a decyl alcohol such as triphenyl stanol or the like. As the photocationic polymerization initiator, a commercially available product can also be used, and examples thereof include IRUGACURE 261 (manufactured by BASF); Adeka Optomer SP-150, SP-151, SP-152, SP-170, SP-171, SP-. 172 (above, manufactured by ADEKA); UVE-1014 (manufactured by General Electronics); CD-1012 (manufactured by Sartomer); CI-2064, CI-2481 (above, manufactured by Japan Soda); Uvacure 1590, 1591 (above, manufactured by Daicel UCB); CYRACURE UVI-6990 (above, manufactured by Union Carbide); BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, and NDS-103 (above, manufactured by Midori Kagaku); Among these, from the viewpoint of practical use and light sensitivity, an aromatic sulfonium salt, an aromatic sulfonium salt, and an iron-aromatic hydrocarbon complex are preferably used. The thermal cation initiator is not particularly limited as long as it is a compound which generates a cationic species or a Lewis acid by heating, and an existing compound can be used. Typical examples of such a compound include a salt of a phosphonium salt, a Thiophenium salt, a thiolanium salt, a benzylamine, a pyridinium salt, and a phosphonium salt; Polyalkyl polyamines such as amine, tri-ethyltriamine and tetra-ethylpentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclo An alicyclic polyamine such as hexane or isophorone diamine; an aromatic polyamine such as m-xylylenediamine, diaminodiphenylmethane or diaminodiphenylphosphonium; Various rings such as polyglycols, glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, and bisphenol F-diglycidyl ether, or glycidyl esters of carboxylic acid A polyepoxy addition modification produced by reacting an oxyresin; and the organic polyamine is reacted with a carboxylic acid such as phthalic acid, isophthalic acid or dimer acid by a conventional method. Amidoxime modification; the above polyamines and aldehydes such as formaldehyde are obtained by a conventional method; phenol, cresol, xylenol, t-butylphenol, and resorcinol are equal to the core Mannich modification produced by reacting at least one phenolic reactive site phenol; polycarboxylic acid (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, bisphenol) Acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipate, 3-methyladipate, 3-methylglutaric acid, 2-methyl Aliphatic dicarboxylic acids such as octyl diacid, 3,8-dimethyl azelaic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid and dimer acid; phthalic acid, terephthalic acid Aromatic dicarboxylic acids such as formic acid, isophthalic acid and naphthalene dicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexane dicarboxylic acid; terpolymers such as trimellitic acid, trimesic acid and castor oil fatty acid An acid anhydride such as a tricarboxylic acid or a tetracarboxylic acid such as pyromellitic acid; dicyandiamide, an imidazole, a carboxylic acid ester, a sulfonic acid ester or an amine sulfimine. Commercially available products can be used as the thermal cation initiator, and examples thereof include Adekaopton CP-77, Adekaopton CP-66 (above, manufactured by ADEKA), CI-2639, CI-2624 (above, manufactured by Soda, Japan); San-Aid SI-60L, San-Aid SI-80L, San-Aid SI-100L (above, manufactured by Sanshin Chemical Industry); The above polymerization initiator (C) can be used by mixing one or two or more of the groups exemplified above. In the curable composition of the present invention, the content of the polymerization initiator (C) is not particularly limited, and is equivalent to the cerium oxide particles (A), the polymerizable compound (B), and the polymerization initiator (C). The total amount of the colorant (D) is preferably from 0.3 to 20 parts by mass, more preferably from 0.5 to 10 parts by mass, even more preferably from 1 to 5 parts by mass, in terms of good curability. When the content of the polymerizable compound (B) is within the above range, a curable composition having excellent curability and excellent storage stability without precipitation of a polymerization initiator can be obtained, which is preferable. For example, when a cured film having a thickness of 1 to 3 μm is formed, the content of the polymerization initiator (C) is not particularly limited, and is relative to the cerium oxide particles (A), the polymerizable compound (B), and a polymerization initiator. The total of (C) is 100 parts by mass, preferably 0.3 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, still more preferably 1 to 5 parts by mass. <Colorant (D)> As the coloring agent (D) used for the curable composition of the present invention, a pigment and a dye can be used. As the pigment and the dye, an inorganic coloring material or an organic coloring material may be used, and these may be used alone or in combination of two or more. Here, the term "pigment" refers to a coloring agent which is insoluble in the following solvents, inorganic or organic coloring materials, and also includes those which are insoluble in a solvent or which are subjected to laked inorganic or organic dyes. Examples of the pigment include carbon black obtained by a furnace method, a channel method, or a thermal method, or carbon black such as acetylene black, ketjen black, or lamp black, and the carbon black is adjusted or coated with an epoxy resin. The carbon black is dispersed in a solvent in a solvent and coated with a resin of 20 to 200 mg/g, and the carbon black is subjected to an acidic or alkaline surface treatment, and an average particle diameter of 8 nm or more and a DBP oil absorption amount. Carbon black of 90 ml/100 g or less, CO and CO in volatile matter at 950 ° C2 Calculated total oxygen content per surface area 100 m2 It is carbon black of more than 9 mg, graphitized carbon black, graphite, activated carbon, carbon fiber, carbon nanotube, spiral carbon fiber, carbon nanohorn, carbon aerogel, fullerene, nigrosine, pigment black 7, titanium Black pigment, chrome oxide green, milorie blue, cobalt green, cobalt blue, manganese, ferrocyanide, phosphate green, iron blue, ultramarine blue, sky blue, etc. represented by black, indoleamine black, black Organic or inorganic pigments such as concentrated green, emerald green, lead sulfate, yellow dan, zinc yellow, iron oxide (red iron oxide (III)), cadmium red, synthetic iron black, brown earth, lake pigment, etc. In terms of aspect, it is preferred to use a black pigment, and it is preferred to use carbon black as a black pigment. Among the above carbon blacks, those obtained by adjusting or coating carbon black with an epoxy resin, and dispersing carbon black in a solvent in a solvent in advance and coating it with a resin of 20 to 200 mg/g can be preferably used. Further, among the carbon blacks, a colorant dispersion liquid having excellent dispersibility and a cured product having excellent light-shielding property and excellent adhesion to a substrate such as glass are preferable, and the carbon black surface is preferable. Carbon black having a sulfonic acid group. Examples of the method of imparting a sulfonic acid group to the surface of the carbon black include a method (1) of oxidizing carbon black by peroxodisulfuric acid or a salt thereof, or a method (2) of treating carbon black with a sulfonating agent. The above method (1) for oxidizing carbon black by peroxodisulfuric acid or a salt thereof can be carried out by any known method, for example, by performing a method of using a surfactant or a dispersing agent to carbon black, Peroxydisulfuric acid or a salt thereof, an aqueous medium (water or a mixture of water and a water-soluble solvent) is mixed, and the mixture is allowed to stand at less than 100 ° C, preferably 40 to 90 ° C, for less than 24 hours, preferably Heat for 2 to 20 hours and neutralize to pH ≧7 as needed. The salt of peroxodisulfuric acid may, for example, be a metal salt or an ammonium salt of lithium, sodium, potassium or aluminum. The amount of peroxydisulfuric acid or a salt thereof is preferably in the range of 0.5 to 5 parts by mass based on 1 part by mass of the carbon black. The method (2) of treating the above carbon black with a sulfonating agent can be carried out by any known method, for example, by mixing carbon black and a sulfonating agent or dissolving carbon black and a sulfonating agent. The mixture is stirred at 200 ° C or lower, preferably 0 to 100 ° C in a solvent. Examples of the sulfonating agent include concentrated sulfuric acid, fuming sulfuric acid, sulfur trioxide, halogenated sulfuric acid, guanamine sulfuric acid, hydrogensulfite, sulfite, and SO.3 -dioxane complex, SO3 a ketone complex, an aminosulfonic acid, a sulfonated pyridinium salt or the like. As the solvent, water, an acidic solvent such as sulfuric acid, fuming sulfuric acid, formic acid, acetic acid, propionic acid or acetic anhydride; an alkaline solvent such as pyridine, triethylamine or trimethylamine; or an ether such as tetrahydrofuran, dioxane or diethyl ether can be used. a polar solvent such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, cyclobutyl hydrazine, nitromethane, acetone, acetonitrile or benzonitrile; ethyl acetate, butyl acetate And other esters; aromatic solvents such as benzene, toluene, xylene, and nitrobenzene; alcohol solvents such as methanol, ethanol, and isopropanol; chlorine solvents such as chloroform, trichlorofluoromethane, dichloromethane, and chlorobenzene; These mixed solvents can also be used. The amount of the sulfonating agent to be used is preferably from 0.5 to 20 parts by mass based on 1 part by mass of the carbon black. When a plurality of sulfonating agents are used, it is preferred that the total amount of the plurality of sulfonating agents is in the above range. . Further, in order to suppress the formation of a known ruthenium which is a side reaction of the sulfonation reaction, it is also possible to add 0.01 to 5% of a known ruthenium inhibitor such as a fatty acid, an organic peracid, an acid anhydride or an acetic acid within a range in which the reaction is not inhibited. , ketone, etc. Commercially available products can also be used as the pigment, and examples thereof include pigment red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, and 97. , 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223 , 224, 226, 227, 254, 228, 240 and 254; Pigment Orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 , 65 and 71; Pigment Yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 95, 97, 98, 100, 109, 110 , 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 166, 168, 175, 180 and 185; Pigment Green 7 , 10, 36 and 58; Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:5, 15:6, 22, 24, 56, 60, 61, 62 and 64; pigment Purple 1, 19, 23, 27, 29, 30, 32, 37, 40 and 50, etc. Examples of the dye include a nitroso compound, a nitro compound, an azo compound, a diazo compound, and an anthracene.a compound, a quinoline compound, an anthraquinone compound, a coumarin compound, a cyanine compound, a phthalocyanine compound, an isoindolinone compound, an isoporphyrin compound, a quinacridone compound, an indolinone compound, a purple ring Ketone compound, hydrazine compound, pyrrolopyrroledione compound, thioindigo compound, diterpene compound, triphenylmethane compound, quinophthalone compound, naphthalenetetracarboxylic acid, azo dye, cyanine dye metal complex compound Wait. In the curable composition of the present invention, the content of the coloring agent (D) is not particularly limited, and is preferably 50 to 500 parts by mass, more preferably 150 to 100 parts by mass based on 100 parts by mass of the polymerizable compound (B). 350 parts by mass, and more preferably 150 to 300 parts by mass. When the content of the coloring agent is within the above range, the curable composition is excellent in storage stability without aggregation of the coloring agent, and the cured product of the curable composition has high light-shielding property, so that it is preferable. . For example, when the cured film having a thickness of 1 to 3 μm is formed, the content of the colorant (D) is not particularly limited, and is preferably 50 to 500 parts by mass based on 100 parts by mass of the polymerizable compound (B). It is preferably from 150 to 350 parts by mass, more preferably from 150 to 300 parts by mass. Moreover, the curable composition of the present invention may contain a compound which does not have radical polymerizability and imparts alkali developability, and as such a compound, as long as it is a compound which is soluble in an alkaline aqueous solution by having an acid value, In particular, an alkali-soluble novolak resin (hereinafter, simply referred to as "novolac resin") is exemplified. The novolac resin is obtained by polycondensing a phenol and an aldehyde in the presence of an acid catalyst. As the phenol, for example, phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butyl can be used. Phenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethyl Phenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2-methyl resorcinol, pyrogallol, α-naphthol, bisphenol A, dihydroxybenzene An acid ester, a gallic acid ester or the like, and among the phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, 2 are preferable. , 3,5-trimethylphenol, resorcinol, 2-methylresorcinol, bisphenol A, and the like. These phenols may be used singly or in combination of two or more. As the aldehyde, for example, formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropanal, β-phenylpropanal, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxyl group can be used. Benzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, para Examples of the compounds include benzaldehyde, p-ethylbenzaldehyde and p-n-butylbenzaldehyde, and formaldehyde, acetaldehyde and benzaldehyde are preferred. These aldehydes may be used singly or in combination of two or more. The aldehyde is used in a ratio of phenol per 1 mole, preferably 0.7 to 3 moles, and particularly preferably 0.7 to 2 moles. As the acid catalyst, for example, an inorganic acid such as hydrochloric acid, nitric acid or sulfuric acid or an organic acid such as formic acid, oxalic acid or acetic acid can be used. The amount of the acid catalyst used is 1 mol per gram of phenol, preferably 1 x 10-4 ~5×10-1 Moor. In the condensation reaction, water is usually used as the reaction medium, but the phenol used in the condensation reaction is not dissolved in the aqueous solution of the aldehyde, and when it is a heterogeneous system from the initial stage of the reaction, hydrophilicity can also be used. The solvent serves as a reaction medium. Examples of the hydrophilic solvent include alcohols such as methanol, ethanol, propanol, and butanol; and cyclic ethers such as tetrahydrofuran and dioxane. The amount of use of the reaction medium is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material. The reaction temperature of the condensation reaction can be appropriately adjusted depending on the reactivity of the reaction raw material, but it is usually 10 to 200 ° C, preferably 70 to 150 ° C. After the condensation reaction is completed, in order to remove the unreacted raw materials, the acid catalyst, and the reaction medium existing in the system, generally, the internal temperature is raised to 130 to 230 ° C, and the volatile matter is distilled off under reduced pressure, and then, The molten novolak resin is flowed on a steel conveyor belt or the like and recovered. Further, after completion of the condensation reaction, the reaction mixture is dissolved in the hydrophilic solvent and added to a precipitating agent such as water, n-hexane or n-heptane to precipitate a novolak resin, and the precipitate is separated and heated. It is dried and can be recycled. Examples of the non-novolac resin include polyhydroxystyrene and its derivatives, styrene-maleic anhydride copolymer, and polyvinyl hydroxybenzoate. The curable composition of the present invention may further contain a solvent. The solvent which dissolves or disperses the above-mentioned each component (cerium oxide particle (A), the polymerizable compound (B), the polymerization initiator (C), the coloring agent (D), etc., etc. can be used, if necessary. , for example, methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone and other ketones; ether, two An ether solvent such as decane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane or dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, An ester solvent such as isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate or TEXANOL; a cellosolve solvent such as ethylene glycol monomethyl ether or ethylene glycol monoethyl ether; An alcohol solvent such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol or pentanol; ethylene glycol monoacetate, ethylene glycol monoacetate, propylene glycol-1-monomethyl ether (PGM), An ether ester solvent such as propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate or ethoxyethyl propionate; benzene, Toluene and xylene BTX (Benzene-Toluene-Xylene) solvent; aliphatic hydrocarbon solvent such as hexane, heptane, octane or cyclohexane; terpene hydrocarbon oil such as turpentine, D-limonene and terpene; mineral spirits, Swasol #310(above, Cosmo Matsuyama Petroleum Manufacturing); and Solvesso #100 (above, manufactured by Exxon Chemical); and other paraffinic solvents; carbon tetrachloride, chloroform, trichloroethylene, dichloromethane, and 1,2-dichloro Halogenated aliphatic hydrocarbon solvent such as ethane; halogenated aromatic hydrocarbon solvent such as chlorobenzene; carbitol solvent, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide And N,N-dimethylacetamide, N-methylpyrrolidone, dimethylhydrazine, water, etc., and these solvents may be used singly or in the form of a mixture of two or more. Among them, ketones and ether ester solvents, especially PGMEA and cyclohexanone, are preferred because they have good compatibility with a resist and a polymerization initiator in the curable composition. In the curable composition, the amount of the solvent to be used is not particularly limited, and is preferably based on the total amount of the curable composition. When the content of the solvent is in the above range, the handleability (viscosity or wettability of the curable composition) and liquid stability can be appropriately controlled (without inclusion of the composition) The thickness of the curable composition and the cured product which are excellent in the precipitation or precipitation of the component are preferable. The dispersing agent can be further used in the curable composition of the present invention. As the dispersing agent, a coloring agent (D) can be used. For dispersing and stabilizing, a commercially available dispersing agent such as BYK series manufactured by BYK-Chemie, or the like can be used, and a polyester, a polyether, a polyurethane containing a basic functional group can be preferably used. The polymer dispersant, a functional group having a nitrogen atom as a basic functional group and having a nitrogen atom is an amine and/or a quaternary salt thereof, and an amine value of from 1 to 100 mgKOH/g. The curable composition of the present invention may further contain an inorganic compound. Examples of the inorganic compound include metal oxides such as nickel oxide, iron oxide, cerium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, cerium oxide, and aluminum oxide; layered clay minerals and rice. Lolita Blue, calcium carbonate, magnesium carbonate, cobalt, manganese, glass powder, mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenides, aluminosilicates, calcium citrate Among them, aluminum hydroxide, platinum, gold, silver, copper, etc., among these, titanium oxide, cerium oxide, layered clay mineral, silver, and the like are preferable. In the curable composition of the present invention, the content of the inorganic compound is preferably 0.1 to 50 parts by mass, more preferably 0.5 to 20 parts by mass, per 100 parts by mass of the polymerizable compound, and one type of the inorganic compound may be used. Or two or more. The curable composition of the present invention can be used as a photosensitive paste composition by containing an inorganic compound. The photosensitive paste composition can be used to form a burned pattern such as a partition pattern, a dielectric pattern, an electrode pattern, and a black matrix pattern of a plasma display panel. Further, these inorganic compounds can be preferably used, for example, as a filler, an antireflection agent, a conductive agent, a stabilizer, a flame retardant, a mechanical strength improving agent, a special wavelength absorber, and a toner repellent. Further, in the curable composition of the present invention, a thermal polymerization inhibitor such as anisole, hydroquinone, catechol, tert-butyl catechol, and morphine may be added as needed; a plasticizer Adhesive; filler; defoamer; leveling agent; surface conditioner; antioxidant; ultraviolet absorber; dispersing aid; anti-agglomerating agent; catalyst; effect accelerator; cross-linking agent; Additives such as the usual ones. In the curable composition of the present invention, a coupling agent, a chain transfer agent, a sensitizer, a surfactant, a melamine or the like can be used in combination. It is preferred to increase the adhesion between the cured product and the substrate by adding the above coupling agent. For example, dimethyl dimethoxy decane, dimethyl diethoxy decane, methyl ethyl dimethoxy decane, methyl ethyl diethoxy decane, methyl trimethoxy decane, A can be used. An alkyl functional alkoxy decane such as triethoxy decane, ethyl trimethoxy decane or ethyl trimethoxy decane; vinyl trichloro decane, vinyl trimethoxy decane, vinyl triethoxy decane Alkenyl functional alkoxydecane such as allyltrimethoxydecane; 3-methylpropenyloxypropyltriethoxydecane, 3-methylpropoxypropyltrimethoxydecane, 3 -methacryloxypropylmethyldiethoxydecane, 3-methylpropenyloxypropylmethyldimethoxydecane, 2-methylpropenyloxypropyltrimethoxydecane, etc. (Meth)acrylate functional alkoxydecane; γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldiethoxydecane, β-(3,4-ring Cyclooxy-functional alkoxydecanes such as oxycyclohexyl)ethyltrimethoxydecane, γ-(3,4-epoxycyclohexyl)propyltrimethoxydecane; N-β(aminoethyl)- An amino-functional alkoxydecane such as γ-aminopropyltrimethoxydecane, γ-aminopropyltriethoxydecane, N-phenyl-γ-aminopropyltrimethoxydecane; γ- a mercapto functional alkoxydecane such as mercaptopropyltrimethoxydecane; an isocyanato functional alkoxydecane such as 3-isocyanatopropyltriethoxydecane; and a 3-ureidopropyltrialkoxide Urea-functional alkoxydecane such as decane; isocyanurate functional alkoxy decane such as tris-(trimethoxydecanepropyl)isocyanurate; titanium tetraisopropoxide, tetra-n-butanol Titanium alkoxides such as titanium; titanium chelates such as dioctyloxy titanium bis(octanediol), titanium diisopropoxide bis(acetonitrile); zirconium tetraacetate pyruvate, tributoxy A zirconium chelate such as zirconium pyruvate or a zirconium chelate such as zirconium butyl monostearate; an isocyanatodecane such as methyl triisocyanatodecane or the like. Commercially available products can be used as the coupling agent, and examples thereof include KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, and KBM-502. , KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-573, KBM-575, KBM -6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007, KBM-04, KBE-04, KBM-13, KBE-13, KBE-22, KBE-103 HMDS-3, KBM-3063, KBM-3103C, KPN-3504, and KF-99 (above, manufactured by Shin-Etsu Silicones). As the chain transfer agent and the sensitizer, a compound containing a sulfur atom is generally used. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N-(2-amidinopropyl)glycolamine Acid, 2-mercaptonicotinic acid, 3-[N-(2-mercaptoethyl)amine-methylhydrazine]propionic acid, 3-[N-(2-mercaptoethyl)amino]propionic acid, N-( 3-mercaptopropyl)alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-mercaptobutanesulfonic acid, dodecyl(4-methylthio)phenyl ether, 2-mercapto Ethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, nonylphenol, 2-mercaptoethylamine, 2-mercaptoimidazole, 2-mercaptobenzophenone a mercapto compound such as imidazole, 2-mercapto-3-hydroxypyridine, 2-mercaptobenzothiazole, thioglycolic acid, trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis(3-mercaptopropionate); An alkyl iodide compound such as a disulfide compound obtained by oxidizing the mercapto compound, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid or 3-iodopropanesulfonic acid; trimethylolpropane trisole (3-mercaptoisobutyrate), butanediol bis(3-mercaptoisobutyrate), hexanedithiol, decanedithiol, 1,4-dimethylhydrazine , butanediol dithiopropionate, butanediol dithioglycolate, ethylene glycol dithioglycolate, trimethylolpropane trithioglycolate, butanediol dithiopropyl Acid ester, trimethylolpropane trithiopropionate, trimethylolpropane trithioglycolate, pentaerythritol tetrathiopropionate, pentaerythritol tetrathioglycolate, trihydroxyethyl trithio Propionate, the following compound No. P1, and Showa Electric made Karenz PE1 and NR1. [化15]As the above surfactant, a fluorosurfactant such as a perfluoroalkyl phosphate or a perfluoroalkyl carboxylate; an anionic surfactant such as a higher fatty acid alkali salt, an alkyl sulfonate or an alkyl sulfate; a cationic surfactant such as a higher amine hydrohalide or a quaternary ammonium salt; a nonionic interface such as a polyethylene glycol alkyl ether, a polyethylene glycol fatty acid ester, a sorbitan fatty acid ester, or a fatty acid monoglyceride; An active agent; an amphoteric surfactant and a surfactant such as a polyoxyn surfactant; these may also be used in combination. Examples of the melamine compound include active hydroxyl groups in nitrogen compounds such as (poly)methylol melamine, (poly)methylol glycoluril, (poly)hydroxymethylbenzamide, and (poly)hydroxymethylurea. Base (CH2 All or a portion (at least 2) of the OH group) are alkyl etherified compounds. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group, which may be the same or different from each other. Further, the methylol group which is not etherified by the alkyl group can be self-condensed in one molecule or condensed between the two molecules, and as a result, an oligomer component is formed. Specifically, hexamethoxymethyl melamine, hexabutoxymethyl melamine, tetramethoxymethyl glycoluril, tetrabutoxymethyl glycoluril or the like can be used. Among these, melamine which is alkyl etherified, such as hexamethoxymethyl melamine and hexabutoxymethyl melamine, is preferable. In the curable composition of the present invention, the content of any component other than the cerium oxide particles (A), the polymerizable compound (B), the polymerization initiator (C), the coloring agent (D), and the solvent is determined. The purpose of use is appropriately selected, and is not particularly limited, and is preferably 100% by mass based on the total of the cerium oxide particles (A), the polymerizable compound (B), the polymerization initiator (C), and the coloring agent (D). The total amount is 20 parts by mass or less. The curable composition of the present invention can be used for a color filter in a curable coating, a varnish, a curable adhesive, a printed substrate, or a color display liquid crystal display panel such as a color television, a PC display, a portable information terminal, and a digital camera. Black spacers for color display liquid crystal display panels such as portable information terminals and digital cameras, black spacers for various display purposes, black partition walls for organic EL, and CCD (Charge Coupled Device) image sensing Color filter, touch panel, electrode material for plasma display panel, powder coating, printing ink, printing plate, adhesive, gel coating, photoresist for electronic engineering, plating resist Etching resist, solder resist, insulating film, black matrix, color filter for various display purposes, plasma display panel, electroluminescent display device, and resist for forming a structure in the manufacturing steps of the LCD , a composition for sealing electrical and electronic parts, a solder resist, a magnetic recording material, a micro mechanical part, a waveguide, an optical switch, a plating mask, an etching mask Color test system, glass fiber cable coating, template for screen printing, material for manufacturing three-dimensional object by stereolithography, holographic recording material, image recording material, fine electronic circuit, decolorizing material, Decolorizing material for image recording material, decolorizing material for image recording material using microcapsule, photoresist material for printed wiring board, photoresist material for UV and visible laser direct image system, printed circuit The use of the dielectric layer and the protective film used for forming the dielectric layer in the successive layers of the substrate is not particularly limited. Regarding the method for producing a cured product using the curable composition of the present invention, preferred coating methods and curing conditions are shown below. The coating method of the curable composition is a known method such as roll coating, curtain coating, various printing, and dipping, and is applied to a support substrate such as glass, metal, paper, or plastic. Further, it may be temporarily applied to a support substrate such as a film, and then transferred to another support substrate, that is, in the form of a dry film, and the application method is not limited. Further, as the light source for the active light used for curing the curable composition of the present invention, those emitting light having a wavelength of 300 to 450 nm can be used, and for example, ultrahigh pressure mercury, mercury vapor arc, carbon arc, xenon arc, etc. can be used. . Further, laser direct scribe method which uses laser light by an exposure light source without using a mask and directly forms an image based on digital information such as a computer not only improves productivity, but also improves image quality or positional accuracy. In terms of the laser light, it is preferable to use light of a wavelength of 340 to 430 nm, but it is also possible to emit visible light by using an argon ion laser, a krypton laser, a YAG laser, and a semiconductor laser. The light of the infrared range. In the case of using such lasers, a sensitizing dye that absorbs visible light to infrared light may be added. By using the curable composition of the present invention, the following steps (1) to (4) are repeated, and a pattern of two or more colors is combined to produce a color filter for a liquid crystal display panel or the like. (1) a step (2) of forming a coating film of the colored polymerizable composition of the present invention on a substrate, and a step (3) of irradiating the coating film with active light through a mask having a pattern shape, using a developing solution (especially Step (4) of developing the cured film after the curing process (4) Step of heating the film after development The cured product obtained by using the curable composition of the present invention can be used for a curable coating, a varnish, Curable adhesive, printed circuit board, color filter in color display liquid crystal display panel such as color TV, PC display, portable information terminal and digital camera, color filter of CCD image sensor, touch panel Electrode material for plasma display panel, powder coating, printing ink, printing plate, adhesive, gel coating, photoresist for electronic engineering, plating resist, etching resist, solder resist, insulation a film, a black matrix, a color filter for various display purposes, a plasma display panel, an electroluminescence display device, and a resist for forming a structure in a manufacturing process of an LCD, for enclosing a combination of electrical and electronic parts Object Solder resist, magnetic recording material, micro mechanical parts, waveguide, optical switch, plating mask, etch mask, color test system, fiberglass cable coating, screen printing template, for stereolithography Materials for manufacturing three-dimensional objects, materials for holographic recording, image recording materials, fine electronic circuits, decolorizing materials, decolorizing materials for image recording materials, decolorizing materials for image recording materials using microcapsules, and printed wiring Various materials such as a photoresist material for a plate, a photoresist material for a UV and visible laser direct image system, a photoresist material used for forming a dielectric layer in a successive layer of a printed circuit board, and a protective film, There are no special restrictions on the use. When the black pigment is used as the colorant (D), the curable composition of the present invention is used to form a black matrix, which is especially used for color display of a display device for an image display device such as a liquid crystal display panel. The film is useful. The black matrix is preferably formed by the steps of: (1) forming a coating film of the curable composition of the present invention on a substrate, and (2) passing the coating film through a mask having a specific pattern shape. a step of irradiating the active light, (3) a step of developing the exposed film by a developing solution (particularly an alkaline developing solution), and (4) a step of heating the film after development. Further, the curable composition of the present invention is also useful as an ink jet type composition having no development step. For the production of a color filter used in a liquid crystal display panel or the like, the steps (1) to (4) described above can be repeated using the curable composition of the present invention or other, and the patterns of two or more colors can be combined. And making. A specific method for producing a cured product obtained by using the curable composition of the present invention is shown below. Specifically, the curable composition of the present invention was spin-coated on a glass substrate (10 cm × 10 cm) and heated at 100 ° C for 100 seconds to form a coating film of 1.0 μm on the surface of the glass substrate. Thereafter, a proximity type exposure machine manufactured by Microtec Corporation was used, and a negative type mask having a pattern of 1 to 20 μm was formed, with an exposure amount of 40 mJ/cm.2 (Gap 100 μm) for exposure. The exposed film was developed by a 0.04 mass% KOH aqueous solution at 23 ° C for 40 seconds, and then baked at 230 ° C for 30 minutes. [Examples] Hereinafter, the present invention will be described in further detail by way of examples and the like, but the present invention is not limited to the examples and the like. [Manufacturing Example 1] Preparation of PGMEA solution of polymerizable compound No. 1 Addition of 1,1-bis[4-(2,3-epoxypropoxy)phenyl]indane 184 g, acrylic acid 58 g, 2,6 2-di-tert-butyl-p-cresol 0.26 g, tetra-n-butylammonium bromide 0.11 g and PGMEA 105 g were stirred at 120 ° C for 16 hours. The reaction liquid was cooled to room temperature, and 160 g of PGMEA, 59 g of biphenyltetracarboxylic anhydride, and 0.24 g of tetra-n-butylammonium bromide were added, and the mixture was stirred at 120 ° C for 4 hours. Further, 20 g of tetrahydrophthalic anhydride was added, and the mixture was stirred at 120 ° C for 4 hours, at 100 ° C for 3 hours, at 80 ° C for 4 hours, at 60 ° C for 6 hours, and at 40 ° C for 11 hours. After the hour, PGMEA 128 g was added to obtain a PGMEA solution of the polymerizable compound No. 1 (Mw = 5000, Mn = 2100, acid value (solid content) 92.7 mgKOH/g). [Production Example 2] Preparation of PGMEA solution of polymerizable compound No. 2 Addition of 1,1-bis[4-(2,3-epoxypropoxy)phenyl]indane 43 g, acrylic acid 13.5 g, 2,6 - bis-t-butyl-p-cresol 0.05 g, tetrabutylammonium acetate 0.11 g, and PGMEA 23 g, and stirred at 120 ° C for 16 hours. After cooling to room temperature, PGMEA 35 g and biphenyltetracarboxylic anhydride 11.5 g were added, and the mixture was stirred at 120 ° C for 8 hours. Further, 7.4 g of tetrahydrophthalic anhydride was added, and the mixture was stirred at 120 ° C for 4 hours, at 100 ° C for 3 hours, at 80 ° C for 4 hours, at 60 ° C for 6 hours, and at 40 ° C for 11 hours. After the hour, PGMEA 34.4 g was added to obtain a PGMEA solution of polymerizable compound No. 2 (Mw = 4000, Mn = 2100, acid value (solid content component) 86 mgKOH/g). [Production Example 3] PGMEA solution of polymerizable compound No. 3 was produced by adding 95.0 g of 9,9-bis(4-glycidoxyphenyl)phosphonium, 23.8 g of acrylic acid, and 2,6-di-t-butyl group- 0.273 g of p-cresol, 0.585 g of tetrabutylammonium chloride and 65.9 g of PGMEA were stirred at 90 ° C for 1 hour, at 100 ° C for 1 hour, at 110 ° C for 1 hour and at 120 ° C for 14 hours. hour. After cooling to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride, and 1.37 g of PGMEA were added, and the mixture was stirred at 100 ° C for 5 hours. Further, 90.0 g of 9,9-bis(4-glycidoxyphenyl)phosphonium, 0.269 g of 2,6-di-t-butyl-p-cresol, and 1.50 g of PGMEA were added, and the mixture was stirred at 90 ° C for 90 minutes. After stirring at 120 ° C for 4 hours, 122.2 g of PGMEA was added to obtain a PGMEA solution of polymerizable compound No. 3 (Mw = 4190, Mn = 2170, acid value (solid content) 52 mg / KOH / g). [Production Example 4] Production of carbon black No. 1 150 g of MA100 (carbon black manufactured by Mitsubishi Chemical Corporation) and 3000 ml of deionized water solution (concentration 2.0 N) of sodium peroxodisulfate were mixed, and stirred at 60 ° C. hour. Filtration was carried out, and the obtained slurry was neutralized with sodium hydroxide, treated by membrane percolation, and the obtained solid was dried at 75 ° C overnight to obtain carbon black No. 1 as a black powder. [Production Example 5] Production of carbon black No. 2 150 g of MA100 (carbon black manufactured by Mitsubishi Chemical Corporation) and 400 ml of cyclobutyl hydrazine were mixed, 15 g of guanamine sulfuric acid was added, and the mixture was stirred at 140 to 150 ° C for 10 hours. . The obtained slurry was neutralized with lithium hydroxide, treated by membrane percolation, and the obtained solid was dried at 75 ° C overnight to obtain carbon black No. 2 as a black powder. [Production Example 6] Production of carbon black dispersion No. 1 Weighed carbon black No. 1 16 g, PGMEA solution of polymerizable compound No. 1 3.6 g, DISPERBYK-161 (manufactured by BYK-Chemie, dispersant) 2.4 g and PGMEA 78 g were blended and treated by a bead mill to obtain carbon black dispersion No. 1. [Production Example 7] Production of carbon black dispersion No. 2: Carbon black No. 2 16 g, polymerized compound No. 1 PGMEA solution 3.6 g, DISPERBYK-161 2.4 g, and PGMEA 78 g were weighed and blended, respectively. The carbon black dispersion No. 2 was obtained by treatment with a bead mill. [Examples 1 to 16 and Comparative Examples 1 to 4] Preparation of a curable composition The components were mixed according to the preparation of [Table 2] to [Table 4] to obtain a curable composition (Examples 1 to 16 and Comparative Examples 1 to 4). Furthermore, the numerical values in the tables indicate the parts by mass. Further, the symbols of the respective components in the table indicate the following components. A-1 PL-2L-PGME (colloidal cerium oxide; manufactured by Fuso Chemical Co., Ltd.) A-2 YA010C-LDI (colloidal cerium oxide; manufactured by Admatechs) A-3 PMA-ST (colloidal cerium oxide; Nissan Chemical Co., Ltd. Manufactured) A-4 YA050C-LHI (colloidal cerium oxide; manufactured by Admatechs) A-5 YA010C-SP3 (powder cerium oxide; manufactured by Admatechs) A'-1 AEROSIL 100 (powder cerium oxide; manufactured by Aerosil) A'-2 AEROSIL OX-50 (powdered cerium oxide; manufactured by Aerosil) A'-3 SC2050-MB (colloidal cerium oxide; manufactured by Admatechs) B-1 PGMEA solution of polymerizable compound No. 1 (solid matter) Component: 45 wt%) B-2 PGMEA solution of polymerizable compound No. 2 (solid content: 45 wt%) B-3 PGMEA solution of polymerizable compound No. 3 (solid content: 45 wt%) B-4 Kayarad DPHA (Polymerizable compound; manufactured by Nippon Kayaku Co., Ltd.) C-1 Compound No. C1 C-2 Compound No. C2 D-1 Carbon black dispersion No. 1 D-2 Carbon black dispersion No. 2 E-1 PGMEA F -1 KBM-403 (coupling agent; manufactured by Shin-Etsu Chemical Co., Ltd.) The parameters of the above-mentioned cerium oxide particles were summarized in [Table 1]. [Table 1] [Table 2] [table 3] [Table 4] [Evaluation Examples 1 to 16 and Comparative Evaluation Examples 1 to 4] Comparatively curable compositions obtained in the curable compositions No. 1 to No. 16 and Comparative Examples 1 to 4 obtained in Examples 1 to 16 No. 1 to No. 4 were evaluated for the minimum dense wiring width, surface roughness Ra, volume resistivity, inclination angle, and OD value by the following methods. The results are shown in [Table 5] to [Table 7]. (Minimum dense wiring width) The curable composition was spin-coated on a glass substrate (10 cm × 10 cm) and heated at 100 ° C for 100 seconds to form a coating film of 1.0 μm on the surface of the glass substrate. . Thereafter, a proximity type exposure machine manufactured by Microtec Corporation was used, and a negative type mask having a pattern of 1 to 20 μm was formed, with an exposure amount of 40 mJ/cm.2 (Gap 100 μm) for exposure. The exposed film was developed by a 0.04 mass% KOH aqueous solution at 23 ° C for 40 seconds, and then baked at 230 ° C for 30 minutes. Observation with an optical microscope was performed to minimize the minimum mask width remaining on the glass substrate. If the minimum dense wiring width is 6 μm or less, it is high-definition. On the other hand, when the minimum dense wiring width is 7 μm or more, it is not high-definition. (Surface roughness Ra) The curable composition was spin-coated on a glass substrate (10 cm × 10 cm) and heated at 100 ° C for 100 seconds to form a coating film of 1.0 μm on the surface of the glass substrate. . Thereafter, the baking treatment was carried out at 230 ° C for 30 minutes. The surface roughness Ra of the film was measured using a surface profiler (DEKTAK 6M) from ULVAC. When the surface roughness Ra is 100 Å or less, it means that the coloring agent and the cerium oxide are sufficiently dispersed, and the surface becomes smooth, and sufficient light-shielding property is obtained. On the other hand, when the surface roughness Ra is 100 Å or more, the coloring agent and the cerium oxide are not sufficiently dispersed, the surface is rough, and sufficient light blocking property (OD value) is not obtained. (Volume Resistivity) The composition of the curable composition was spin-coated on a substrate sputtered with chromium so as to have a film thickness of 4 μm, and was baked at 110 ° C for 2 minutes, and then a high-pressure mercury lamp was used as a light source. To 100 mJ/cm2 The exposure was carried out, followed by baking after exposure, and baking was performed at 230 ° C for 180 minutes to prepare a cured product. A platinum electrode is formed on the cured material by a sputtering process. The chromium portion was connected to the platinum electrode by a wire, and a resistance measuring device was connected to measure the volume resistivity. The unit is Ω·cm. Volume resistivity is 1010 The hardened material of Ω·cm or more can be used as a high-resistance black matrix for color filters of IPS liquid crystal displays, and the volume resistivity is 1011 A cured product of Ω·cm or more can be more preferably used as a black matrix. (OD value) The above curable composition or comparatively curable composition was spin-coated (1300 rpm, 50 seconds) on a substrate and dried, and then prebaked at 100 ° C for 100 seconds. Use ultra-high pressure mercury lamp as the light source at 100 mJ/cm2 After the exposure, the film was baked at 230 ° C for 30 minutes to prepare a cured product. The OD value of the obtained film was measured by a benmeter using a concentrating meter, and the OD value was divided by the thickness after the post-exposure baking to calculate the OD value per unit thickness. A cured product having an OD value of 3.0 or more per unit thickness can be used as the black matrix, and a cured product having an OD value of 3.5 or more per unit thickness can be preferably used as the black matrix. (Tilt angle) The curable composition was spin-coated on a glass substrate (10 cm × 10 cm), and heated at 100 ° C for 100 seconds to form a coating film of 1.0 μm on the surface of the glass substrate. Thereafter, using a proximity exposure machine manufactured by Microtec, a negative mask formed with a pattern of 6 μm was applied at an exposure amount of 40 mJ/cm.2 (Gap 100 μm) for exposure. The film after exposure was developed by a 0.04 mass% KOH aqueous solution at 23 ° C for 40 seconds, and then baked at 230 ° C for 30 minutes, and the bonding angle (tilt angle) between the pattern and the substrate was performed by a scanning electron microscope. Determination. This inclination angle corresponds to the angle θ in (a) and (b) of Fig. 1 shown below. In the case where (a) the inclination angle is an acute angle, it means that there is no undercut in the pattern, and when (b) the inclination angle is an obtuse angle, it means that there is an undercut in the pattern. When the inclination angle is 70 to 90°, the pattern of the hardened material obtained is high in fineness, so it is good. [table 5] [Table 6] [Table 7] According to the above results, the curable composition of the present invention is excellent in high volume resistance and high light-shielding property (OD value), and has a high-definition (minimum dense line width, inclination angle) pattern shape of a cured product. it works. Therefore, the curable resin and the cured product of the present invention are useful for a curable resin composition for an electronic material, particularly a black matrix. [Industrial Applicability] The curable composition of the present invention is useful as a resist for color filter applications because it can obtain a cured product which can satisfy the formation of a high electric resistance and a high-definition pattern. Further, in the case of using a black pigment as a curable composition for a colorant, a cured product having high light-shielding can be produced, and thus it is particularly useful as a black matrix forming material.

圖1(a)、(b)係表示對應於形成於基板之圖案與基板之間之傾斜角的角θ之模式圖。1(a) and 1(b) are schematic diagrams showing an angle θ corresponding to a tilt angle between a pattern formed on a substrate and a substrate.

Claims (8)

一種硬化性組合物，其含有：平均粒徑為50 nm以下之濕式二氧化矽粒子(A)、聚合性化合物(B)、聚合起始劑(C)及著色劑(D)。A curable composition comprising: wet cerium oxide particles (A) having an average particle diameter of 50 nm or less, a polymerizable compound (B), a polymerization initiator (C), and a color former (D). 如請求項1之硬化性組合物，其中上述濕式二氧化矽粒子(A)中之金屬之含量為1000 ppm以下。The curable composition according to claim 1, wherein the content of the metal in the wet cerium oxide particles (A) is 1000 ppm or less. 如請求項1之硬化性組合物，其中聚合性化合物(B)為下述通式(I)所表示之化合物； 具有使下述通式(I)所表示之化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物；或者 具有如下結構之不飽和化合物，該結構係使具有使下述通式(I)所表示之環氧化合物與不飽和一元酸進行酯化而成之結構之不飽和化合物進而與多元酸酐進行酯化而成，(式中，M表示直接鍵、碳原子數1～20之烴基、-O-、-S-、-SO2 -、-SS-、-SO-、-CO-、-OCO-、選自下述式(a)、(b)、(c)或(d)所表示之群中之取代基， M所表示之基中之氫原子有被取代為鹵素原子之情形， R1 、R2 、R3 、R4 、R5 、R6 、R7 及R8 (以下，亦記載為R1 ～R8 )分別獨立地表示氫原子、碳原子數1～20之烴基或鹵素原子， R1 ～R8 所表示之基中之亞甲基亦有於不與氧相鄰之條件下被取代為-O-之情形， n為0～10之數， 於n為0以外之情形時，存在複數個之R1 ～R8 及M有各自相同之情形，亦有各自不同之情形)，(式中，R9 表示碳原子數1～20之烴基， R10 、R11 、R12 、R13 、R14 、R15 、R16 、R17 、R18 、R19 、R20 、R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R35 、R36 、R37 及R38 (以下，亦記載為R10 ～R38 )分別獨立地表示氫原子、碳原子數1～20之烴基、含有雜環之碳原子數2～20之基、或者鹵素原子， R10 ～R38 所表示之基中之亞甲基有於不與氧相鄰之條件下被取代為-O-或-S-之情形， R10 與R11 、R11 與R12 、R12 與R13 、R13 與R14 、R22 與R15 、R15 與R16 、R30 與R23 、R23 與R24 、R24 與R25 、R38 與R31 、R31 與R32 、R32 與R33 、R34 與R35 、R35 與R36 及R36 與R37 有鍵結而形成環之情形， 式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。The curable composition of claim 1, wherein the polymerizable compound (B) is a compound represented by the following formula (I); and having a compound represented by the following formula (I) and an unsaturated monobasic acid An unsaturated compound having a structure; or an unsaturated compound having a structure obtained by esterifying an epoxy compound represented by the following formula (I) with an unsaturated monobasic acid The unsaturated compound is further esterified with a polybasic acid anhydride. (wherein M represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, -O-, -S-, -SO 2 -, -SS-, -SO-, -CO-, -OCO-, selected from the group consisting of The substituent in the group represented by the formula (a), (b), (c) or (d), wherein the hydrogen atom in the group represented by M is substituted with a halogen atom, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 (hereinafter also referred to as R 1 to R 8 ) each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms or a halogen atom, and R 1 The methylene group in the group represented by -R 8 is also substituted with -O- under the condition that it is not adjacent to oxygen, and n is a number from 0 to 10, and exists when n is other than 0. A plurality of R 1 to R 8 and M have the same situation, and each has a different situation) (wherein R 9 represents a hydrocarbon group having 1 to 20 carbon atoms, and R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 and R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 and R 38 (hereinafter also referred to as R 10 to R 38 ) each independently represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a group having 2 to 20 carbon atoms containing a hetero ring, or a halogen atom, and R 10 to The methylene group in the group represented by R 38 is substituted with -O- or -S- under the condition that it is not adjacent to oxygen, R 10 and R 11 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 22 and R 15 , R 15 and R 16 , R 30 and R 23 , R 23 and R 24 , R 24 and R 25 , R 38 and R 31 , R 31 and R 32 , R 32 and R 33 , R 34 and R 35 , R 35 and R 36 and R 36 are bonded to R 37 to form a ring, wherein * means that the group represented by the equation is * part adjacent to The base is bonded). 如請求項1之硬化性組合物，其中聚合起始劑(C)為具有下述通式(II)所表示之基之化合物，(式中，R41 及R42 分別獨立地表示氫原子、鹵素原子、硝基、氰基、碳原子數1～20之烴基或含有雜環之碳原子數2～20之基， R41 及R42 所表示之碳原子數1～20之烴基或含有雜環之碳原子數2～20之基中之氫原子有被取代為鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯醚基、巰基、異氰酸基或含有雜環之碳原子數2～20之基之情形， R41 及R42 所表示之基中之亞甲基亦有被取代為-O-、-CO-、-COO-、-OCO-、-NR43 -、-NR43 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-或CSO-之情形， R43 表示氫原子、碳原子數1～20之烴基， m表示0或1， 式中之﹡意指該等式所表示之基以﹡部分與鄰接之基進行鍵結)。The sclerosing composition of claim 1, wherein the polymerization initiator (C) is a compound having a group represented by the following formula (II), (wherein R 41 and R 42 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a hetero ring, and R 41 and The hydrocarbon group having 1 to 20 carbon atoms represented by R 42 or the hydrogen atom in the group having 2 to 20 carbon atoms containing a hetero ring is substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group or a carboxyl group. a methacryloyl fluorenyl group, an acryl fluorenyl group, an epoxy group, a vinyl group, a vinyl ether group, a decyl group, an isocyanate group or a group having 2 to 20 carbon atoms containing a hetero ring, represented by R 41 and R 42 The methylene group in the group is also substituted with -O-, -CO-, -COO-, -OCO-, -NR 43 -, -NR 43 CO-, -S-, -CS-, -SO 2 In the case of -, -SCO-, -COS-, -OCS- or CSO-, R 43 represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, and m represents 0 or 1, wherein * means The base of the representation is bonded with the * part and the adjacent base). 如請求項1之硬化性組合物，其中上述著色劑(D)為黑色顏料。The curable composition of claim 1, wherein the coloring agent (D) is a black pigment. 一種硬化物之製造方法，其使用如請求項1之硬化性組合物。A method of producing a cured product using the curable composition of claim 1. 一種硬化物，其係如請求項1之硬化性組合物之硬化物。A cured product which is a cured product of the curable composition of claim 1. 一種彩色濾光片，其含有如請求項7之硬化物。A color filter containing the cured product of claim 7.
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KR102374939B9 (en) 2023-05-11

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