TW201819333A - Method for manufacturing reinforced glass plate, film-coated glass plate, and reinforced glass plate - Google Patents
Method for manufacturing reinforced glass plate, film-coated glass plate, and reinforced glass plate Download PDFInfo
- Publication number
- TW201819333A TW201819333A TW106133057A TW106133057A TW201819333A TW 201819333 A TW201819333 A TW 201819333A TW 106133057 A TW106133057 A TW 106133057A TW 106133057 A TW106133057 A TW 106133057A TW 201819333 A TW201819333 A TW 201819333A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass plate
- mask
- flat surface
- main surface
- manufacturing
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 45
- 238000005342 ion exchange Methods 0.000 claims abstract description 50
- 150000003839 salts Chemical class 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims description 61
- 239000006058 strengthened glass Substances 0.000 claims description 61
- 230000015572 biosynthetic process Effects 0.000 claims description 24
- 150000002500 ions Chemical class 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 229910001414 potassium ion Inorganic materials 0.000 claims description 6
- 229910001415 sodium ion Inorganic materials 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 5
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000005764 inhibitory process Effects 0.000 abstract 2
- 230000002265 prevention Effects 0.000 abstract 2
- 230000035882 stress Effects 0.000 description 46
- 239000005341 toughened glass Substances 0.000 description 34
- 238000005728 strengthening Methods 0.000 description 30
- 238000005498 polishing Methods 0.000 description 18
- 238000012545 processing Methods 0.000 description 14
- 230000035515 penetration Effects 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 4
- 229910001413 alkali metal ion Inorganic materials 0.000 description 4
- 229910001416 lithium ion Inorganic materials 0.000 description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 4
- 238000007670 refining Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 235000010333 potassium nitrate Nutrition 0.000 description 2
- 239000004323 potassium nitrate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000005345 chemically strengthened glass Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
Abstract
Description
[0001] 本發明係關於強化玻璃板的製造方法,更具體而言,係關於藉由離子交換法進行玻璃板的化學強化的強化玻璃板的製造方法、附膜玻璃板及強化玻璃板。[0001] The present invention relates to a method for manufacturing a strengthened glass plate, and more specifically, to a method for manufacturing a strengthened glass plate that is chemically strengthened by an ion exchange method, a coated glass plate, and a strengthened glass plate.
[0002] 近年來,於行動電話、照相機等電子機器,或是大型顯示器或個人電腦等顯示面或手錶等之穿戴式終端的蓋玻璃,係使用受到化學強化的強化玻璃板。 [0003] 如此之強化玻璃板,一般而言,係將包含鹼金屬作為組成之玻璃板藉由強化液作化學性處理,而在表面形成壓縮應力層而藉此製造。如此之強化玻璃板,因在表面具有壓縮應力層,故衝擊耐性等獲得提升。然而,即使是如此之強化玻璃板,與主表面的衝擊耐性相比,邊緣部或周緣部的衝擊耐性低,會成為強化玻璃板破損的原因。在為了防止如此破損而使強化玻璃板表面的壓縮應力層整體變深的情形下,於玻璃板內部形成的拉伸應力會變得過大,而有因該拉伸應力所導致的破損(即所謂自我破壞)容易產生之問題。 [0004] 為了解決前述般之問題,開發了僅在強化玻璃板表面的一部分選擇性地將壓縮應力層形成得較深的技術。例如,於專利文獻1所揭示的方法中,係僅將主表面的中央部分以遮罩材料進行屏蔽,藉此能夠僅使未受到屏蔽的周緣部進行離子交換而進行強化處理(第一強化處理)。之後將屏蔽去除,並再度進行強化處理(第二強化處理),藉此能夠於預先受到強化處理的邊緣部形成比主表面更深的壓縮應力層。 [先前技術文獻] [專利文獻] [0005] [專利文獻1]日本特表2014-510012號公報[0002] In recent years, the cover glass of electronic devices such as mobile phones, cameras, display surfaces such as large displays, personal computers, and wearable terminals such as watches uses chemically strengthened glass plates. [0003] Generally, such a strengthened glass plate is produced by forming a compressive stress layer on the surface of a glass plate containing an alkali metal as a composition through chemical treatment with a strengthening liquid. Since such a strengthened glass plate has a compressive stress layer on the surface, impact resistance and the like are improved. However, even with such a strengthened glass plate, the impact resistance of the edge portion or the peripheral portion is lower than the impact resistance of the main surface, which may cause the damage of the strengthened glass plate. When the entire compressive stress layer on the surface of the strengthened glass sheet is deepened in order to prevent such breakage, the tensile stress formed inside the glass sheet becomes excessively large, and there is damage due to the tensile stress (so-called Self-destructive). [0004] In order to solve the above-mentioned problems, a technology for selectively forming a deep compressive stress layer only on a part of the surface of a strengthened glass plate has been developed. For example, in the method disclosed in Patent Document 1, only the central portion of the main surface is shielded with a masking material, whereby the peripheral portion that is not shielded can be strengthened by ion exchange (first strengthening treatment). ). After that, the shield is removed, and the strengthening process (second strengthening process) is performed again, so that a compressive stress layer deeper than the main surface can be formed on the edge portion that has been strengthened in advance. [Prior Art Literature] [Patent Literature] [0005] [Patent Literature 1] Japanese Patent Publication No. 2014-510012
[發明所欲解決的技術課題] [0006] 然而,在使用如專利文獻1之手法的情形下,會有玻璃板產生無法預期的變形,而生產性降低之虞。 [0007] 例如,如第9圖所示,在玻璃板的剖面形狀於厚度方向為非對稱的情形下,會有於離子交換之際玻璃板以翹曲的方式彎曲變形之虞。以下,參照第9圖,針對以往之強化玻璃板的製造方法及其問題點進行具體說明。 [0008] 第9A圖,係表示剖面形狀在厚度方向非對稱的玻璃板G10的步驟。玻璃板G10,係在板厚方向以中央線(該圖中的單點虛線)X10作為軸而表裏為非對稱形狀。第9B圖,係表示獲得了在玻璃板G10的表裏的主表面分別設置具有相同厚度及相同面積的屏蔽Mc的附膜玻璃板G20的步驟。第9C圖,係表示將附膜玻璃板G20浸漬於熔鹽T10,進行離子交換處理而獲得在表層部具有壓縮應力層CP的強化玻璃板G30的強化步驟(第一強化處理)。 [0009] 若依據該等處理,雖然強化玻璃板G30的剖面形狀在厚度方向非對稱,亦即表裏面形狀不同,然而因所形成的屏蔽Mc的面積等在表裏為相同,故強化玻璃板G30的表裏的應力平衡會成為不均衡的狀態。因此,強化玻璃板G30會朝向應力平衡為均衡的形狀自行變形(參照第9C圖)。 [0010] 本發明,係考慮到如此情事所完成者,以提供一種能夠穩定製造具有高平坦性且局部具有高強度的強化玻璃板之強化玻璃的製造方法及附膜玻璃板為目的。另外,本發明,係以提供一種具有高平坦性且局部具有高強度的強化玻璃板為目的。 [用以解決課題的技術方案] [0011] 本發明係用以解決前述課題者,係一種強化玻璃板的製造方法,其係交換在表裏分別具有第一主表面及第二主表面且在厚度方向具有非對稱的剖面形狀的玻璃板表層的離子的強化玻璃板的製造方法,其特徵為,具備:遮罩步驟,係分別在前述第一主表面的至少一部分設置抑制或是防止前述離子的交換的第一遮罩,在前述第二主表面的至少一部分設置抑制或是防止前述離子的交換的第二遮罩;以及離子交換步驟,係在前述遮罩步驟後,將該玻璃板浸漬於用以交換前述離子的熔鹽;於前述遮罩步驟中,前述第一主表面的前述第一遮罩的形成面積,以及前述第二主表面的前述第二遮罩的形成面積,係對應於前述剖面形狀而設定為不同大小。 [0012] 如前述般,對於在厚度方向具有非對稱形狀的玻璃板(原料玻璃板),對應於其非對稱形狀,將面積不同的第一遮罩及第二遮罩形成在各主表面,藉此能夠使在進行離子交換法所致之強化時之玻璃板的變形盡可能地小。藉此,能夠穩定製造具有高平坦性且局部具有高強度的強化玻璃板。 [0013] 於前述製造方法中,前述第一主表面,係具有第一平坦面,前述第二主表面,係具有比前述第一平坦面更大的第二平坦面,前述第一遮罩,係設置於前述第一平坦面內,前述第二遮罩,係設置於前述第二平坦面內,前述第二遮罩的形成面積,係比前述第一遮罩的形成面積更大為佳。 [0014] 如此,對於構成為第一平坦面的面積小、第二平坦面的面積大的原料玻璃板,將面積小的第一遮罩形成於第一平坦面,並將面積大的第二遮罩形成於第二平坦面,藉此能夠使在進行離子交換法所致之強化時之玻璃板的變形盡可能地小。 [0015] 進而,於本製造方法中,前述第一平坦面係位於前述第一主表面的中央部,前述第一遮罩係設置於前述第一平坦面的中央部,前述第二平坦面係位於前述第二主表面的中央部,前述第二遮罩係設置於前述第二平坦面的中央部,前述第一主表面,係具備沿著前述第一平坦面的外緣設置的第一倒角面,前述第二主表面,係具備沿著前述第二平坦面的外緣設置的第二倒角面,前述第一倒角面的面積,係比前述第二倒角面的面積更大為佳。 [0016] 依據該構成,藉由沿著面積比第二平坦面更小的第一平坦面的外緣,形成面積比第二倒角面更大的第一倒角面,能夠對於具有第一平坦面及第一倒角面的第一主表面、具有第二平坦面及第二倒角面的第二主表面均勻地施加離子交換的處理。 [0017] 於前述製造方法中,前述第一遮罩及前述第二遮罩,係包含以質量%計SiO2 60~100%、以及Al2 O3 0~40%作為組成的無機膜層為佳。藉由使用該組成之第一遮罩及第二遮罩,能夠確實遮蔽或抑制離子交換時之離子的穿透。 [0018] 第一遮罩的厚度與第二遮罩的厚度,設定為相同亦可,為不同亦可。例如,於前述製造方法中,相對於前述第一遮罩的厚度,前述第二遮罩的厚度為0.8~1.2倍為佳。 [0019] 於前述製造方法中,前述玻璃板表層的離子係鈉離子,前述熔鹽係包含鉀離子,前述熔鹽,係以濃度為20質量%的方式與水混合成水溶液時,pH值為6.5~11為佳。如此,藉由恰當地進行離子交換,能夠確保玻璃板達到所要求的強度。 [0020] 於前述製造方法中,前述玻璃板,係含有以質量%計SiO2 45~75%、Al2 O3 1~30%、Na2 O 1~20%、以及K2 O 0~20%作為玻璃板組成的玻璃板為佳。藉此,容易以高程度兼顧離子交換性能及耐失透性。 [0021] 另外,前述玻璃板,雖能夠構成為各種形狀,然而考慮其加工性等,特別是構成為俯視觀察圓盤狀或是矩形為佳。 [0022] 本發明係用以解決前述課題者,係一種附膜玻璃板,其係在表裏分別具有第一主表面及第二主表面且在厚度方向具有非對稱的剖面形狀的附膜玻璃板,其特徵為,具備:形成在前述第一主表面的至少一部分,並且抑制或是防止離子的交換的第一遮罩,以及形成在前述第二主表面的至少一部分,並且抑制或是防止離子的交換的第二遮罩;前述第一主表面的前述第一遮罩的形成面積,以及前述第二主表面的前述第二遮罩的形成面積,係對應於前述剖面形狀而設定為不同大小。 [0023] 如前述般,對於在厚度方向具有非對稱形狀的玻璃板,對應於其非對稱形狀,將面積不同的第一遮罩及第二遮罩形成在各主表面,藉此能夠使在進行離子交換法所致之強化時之玻璃板的變形盡可能地小。藉此,能夠穩定製造具有高平坦性且局部具有高強度的強化玻璃板。 [0024] 於前述附膜玻璃板中,前述第一主表面,係具有第一平坦面,前述第二主表面,係具有比前述第一平坦面更大的第二平坦面,前述第一遮罩,係設置於前述第一平坦面內,前述第二遮罩,係設置於前述第二平坦面內,前述第二遮罩的形成面積,係比前述第一遮罩的形成面積更大為佳。如此,對於構成為第一平坦面的面積小、第二平坦面的面積大的玻璃板,將面積小的第一遮罩形成於第一平坦面,並將面積大的第二遮罩形成於第二平坦面,藉此能夠使在進行離子交換法所致之強化時之玻璃板的變形盡可能地小。 [0025] 本發明係用以解決前述課題者,係一種強化玻璃板,其係在表裏分別具有第一主表面及第二主表面且在厚度方向具有非對稱的剖面形狀的強化玻璃板,其特徵為,具備:前述第一主表面,係具有第一平坦面,前述第二主表面,係具有比前述第一平坦面更大的第二平坦面,前述第一平坦面,係具有形成於其周緣部的第一壓縮應力層,以及形成在其中央部並且層深度比前述第一壓縮應力層更小的第二壓縮應力層,前述第二平坦面,係具有形成於其周緣部的第一壓縮應力層,以及形成在其中央部並且層深度比前述第一壓縮應力層更小的第二壓縮應力層,前述第二平坦面的前述第二壓縮應力層的形成面積,係比前述第一平坦面的前述第二壓縮應力層的形成面積更大。 [0026] 如前述般,對應於強化玻璃板的非對稱形狀,將面積不同的第二壓縮應力層,形成在面積不同的第一平坦面及第二平坦面,藉此能夠對於該強化玻璃板賦予高平坦性。進而,在各平坦面的周緣部,形成層深度比第二壓縮應力層更大的第一壓縮應力層,藉此,強化玻璃板係在局部具有高強度。 [發明之效果] [0027] 依據本發明,能夠穩定製造具有高平坦性且局部具有高強度的強化玻璃板。[Technical Problems to be Solved by the Invention] [0006] However, when a method such as Patent Document 1 is used, the glass plate may be deformed unexpectedly and productivity may be reduced. [0007] For example, as shown in FIG. 9, when the cross-sectional shape of the glass plate is asymmetric in the thickness direction, the glass plate may be warped and deformed during the ion exchange. Hereinafter, a conventional method for manufacturing a strengthened glass plate and its problems will be specifically described with reference to FIG. 9. [0008] FIG. 9A shows a step of a glass plate G10 whose cross-sectional shape is asymmetric in the thickness direction. The glass plate G10 has an asymmetrical shape on the front and back with the central line (one-dot chain line in the figure) X10 as the axis in the thickness direction. FIG. 9B shows a step of obtaining a film-coated glass plate G20 having a shield Mc having the same thickness and the same area on the main surface of the glass plate G10. FIG. 9C shows a strengthening step (first strengthening treatment) in which a coated glass plate G20 is immersed in molten salt T10 and subjected to ion exchange treatment to obtain a strengthened glass plate G30 having a compressive stress layer CP in the surface layer portion. [0009] If according to these treatments, although the cross-sectional shape of the strengthened glass plate G30 is asymmetric in the thickness direction, that is, the shape of the front and back surfaces is different, but because the area of the shield Mc formed is the same on the front and back, the strengthened glass plate G30 The internal and external stress balance will become unbalanced. Therefore, the tempered glass plate G30 deforms itself toward a shape where the stress balance is balanced (see FIG. 9C). [0010] The present invention has been made in consideration of such circumstances, and an object thereof is to provide a method for manufacturing a strengthened glass and a film-coated glass plate capable of stably manufacturing a strengthened glass plate having high flatness and locally high strength. Moreover, this invention aims at providing the tempered glass plate which has high flatness and high strength locally. [Technical Solution to Solve the Problem] [0011] The present invention is to solve the aforementioned problem, and is a method for manufacturing a strengthened glass plate, which is exchanged in the surface with a first main surface and a second main surface, respectively, in thickness. The manufacturing method of an ion-reinforced glass plate with a glass surface layer having an asymmetrical cross-sectional shape in the direction includes a masking step in which at least a part of the first main surface is provided to suppress or prevent the ions. An exchanged first mask is provided with at least a part of the second main surface to provide a second mask that suppresses or prevents the exchange of the ions; and an ion exchange step is performed after the mask step is immersed in the glass plate The molten salt used to exchange the aforementioned ions; in the aforementioned masking step, the formation area of the first mask on the first main surface and the formation area of the second mask on the second main surface correspond to The cross-sectional shape is set to different sizes. [0012] As described above, for the glass plate (raw glass plate) having an asymmetric shape in the thickness direction, the first mask and the second mask having different areas are formed on the main surfaces in accordance with the asymmetric shape, Thereby, the deformation | transformation of the glass plate at the time of strengthening by the ion exchange method can be made as small as possible. Thereby, a tempered glass plate having high flatness and locally high strength can be stably manufactured. [0013] In the manufacturing method, the first main surface has a first flat surface, the second main surface has a second flat surface larger than the first flat surface, and the first mask has The second mask is disposed in the first flat surface, and the second mask is disposed in the second flat surface. The formation area of the second mask is preferably larger than the formation area of the first mask. [0014] In this way, for a raw glass plate having a small area on the first flat surface and a large area on the second flat surface, a first mask having a small area is formed on the first flat surface, and a second area having a large area is formed. The mask is formed on the second flat surface, thereby making it possible to minimize the deformation of the glass plate when the strengthening by the ion exchange method is performed. [0015] Furthermore, in the manufacturing method, the first flat surface is located at a central portion of the first main surface, the first mask is provided at a central portion of the first flat surface, and the second flat surface is The second mask is located at a central portion of the second main surface, and the second mask is provided at a central portion of the second flat surface. The first main surface includes a first cover disposed along an outer edge of the first flat surface. The corner surface, the second main surface includes a second chamfered surface provided along an outer edge of the second flat surface, and an area of the first chamfered surface is larger than an area of the second chamfered surface. Better. [0016] According to this configuration, by forming the first chamfered surface having a larger area than the second chamfered surface along the outer edge of the first flat surface having an area smaller than that of the second flat surface, the first chamfered surface having the first chamfered surface can be formed. The first main surface of the flat surface and the first chamfered surface, and the second main surface having the second flat surface and the second chamfered surface are uniformly subjected to ion exchange treatment. [0017] In the aforementioned manufacturing method, the first mask and the second mask are composed of an inorganic film layer having a composition of SiO 2 60 to 100% and Al 2 O 3 0 to 40% in mass% as follows: good. By using the first mask and the second mask of this composition, it is possible to reliably shield or suppress the penetration of ions during ion exchange. [0018] The thickness of the first mask and the thickness of the second mask may be set to be the same or different. For example, in the manufacturing method, the thickness of the second mask is preferably 0.8 to 1.2 times the thickness of the first mask. [0019] In the aforementioned manufacturing method, when the ionic sodium ions on the surface of the glass plate, the molten salt system contains potassium ions, and the molten salt is mixed with water to form an aqueous solution at a concentration of 20% by mass, the pH value is 6.5 to 11 is preferred. In this way, by performing the ion exchange appropriately, it is possible to ensure that the glass plate has the required strength. [0020] In the aforementioned manufacturing method, the glass plate contains 45 to 75% by mass of SiO 2 , Al 2 O 3 1 to 30%, Na 2 O 1 to 20%, and K 2 O 0 to 20 % A glass plate composed of a glass plate is preferred. This makes it easy to achieve a high degree of balance between ion exchange performance and devitrification resistance. [0021] Although the glass plate can be configured in various shapes, in consideration of workability and the like, it is particularly preferably configured in a disc shape or a rectangular shape in plan view. [0022] The present invention is intended to solve the aforementioned problems, and is a film-coated glass plate having a first main surface and a second main surface on the surface and an asymmetrical cross-sectional shape in the thickness direction, respectively. , Characterized in that it includes a first mask formed on at least a part of the first main surface and inhibiting or preventing ion exchange, and a first mask formed on at least a part of the second main surface and inhibiting or preventing ions Exchanged second mask; the formation area of the first mask of the first main surface and the formation area of the second mask of the second main surface are set to different sizes corresponding to the cross-sectional shape . [0023] As described above, for a glass plate having an asymmetric shape in the thickness direction, corresponding to the asymmetric shape, the first mask and the second mask having different areas are formed on the main surfaces, thereby enabling the The deformation of the glass plate during the strengthening by the ion exchange method is as small as possible. Thereby, a tempered glass plate having high flatness and locally high strength can be stably manufactured. [0024] In the film-coated glass plate, the first main surface has a first flat surface, the second main surface has a second flat surface larger than the first flat surface, and the first cover The cover is disposed in the first flat surface, the second mask is disposed in the second flat surface, and a formation area of the second mask is larger than that of the first mask. good. In this way, for a glass plate configured to have a small area on the first flat surface and a large area on the second flat surface, a first mask having a small area is formed on the first flat surface, and a second mask having a large area is formed on the glass plate. The second flat surface can thereby minimize the deformation of the glass plate during the strengthening by the ion exchange method. [0025] The present invention is intended to solve the aforementioned problems, and is a strengthened glass plate having a first main surface and a second main surface on the surface thereof and an asymmetric cross-sectional shape in the thickness direction. It is characterized in that the first main surface has a first flat surface, the second main surface has a second flat surface larger than the first flat surface, and the first flat surface has a shape formed on A first compressive stress layer on the peripheral edge portion thereof, and a second compressive stress layer formed on the central portion thereof with a layer depth smaller than that of the first compressive stress layer, and the second flat surface has a first compressive stress layer formed on the peripheral edge portion. A compressive stress layer, and a second compressive stress layer formed at a central portion thereof with a layer depth smaller than that of the first compressive stress layer, and an area of formation of the second compressive stress layer on the second flat surface is larger than that of the first The formation area of the second compressive stress layer on a flat surface is larger. [0026] As described above, in accordance with the asymmetric shape of the strengthened glass plate, the second compressive stress layers having different areas are formed on the first flat surface and the second flat surface having different areas, so that the strengthened glass plate can be processed. Gives high flatness. Furthermore, a first compressive stress layer having a layer depth greater than that of the second compressive stress layer is formed on the peripheral edge portion of each flat surface, whereby the strengthened glass sheet has high strength locally. [Effects of the Invention] According to the present invention, it is possible to stably produce a strengthened glass plate having high flatness and locally high strength.
[0029] 以下,針對用以實施本發明之強化玻璃板的製造方法的形態,一邊參照圖式一邊進行說明。第1圖至第6圖,係表示本發明之強化玻璃板的製造方法之第一實施形態。 [0030] 本發明之板玻璃的製造方法,係具備:原料玻璃板的準備步驟;將原料玻璃板的一部分選擇性強化的選擇強化步驟;以及在該選擇強化步驟後,將該玻璃板整體強化的整體強化步驟。以下,針對各步驟進行說明。首先,實施第1A圖所示之準備步驟的處理。該準備步驟,係準備預定形狀之原料玻璃板G1的步驟。 [0031] 原料玻璃板G1,係能夠使用離子交換法強化,且剖面形狀在厚度方向非對稱的玻璃板。於本實施形態中,係以原料玻璃板G1為如第2圖所示般的圓盤狀的玻璃板之情形作為一例進行說明。原料玻璃板G1,係具備彼此為表裏關係之第一主表面Sa,以及第二主表面Sb。又,於本實施形態中,以第一主表面Sa側為表面側,以第二主表面Sb側作為裏面側進行說明。 [0032] 第一主表面Sa,係具備第一平坦面Fa、第一倒角面Ca。第一平坦面Fa,係設置於第一主表面Sa的中央部的平坦的圓形面。第一倒角面Ca,係沿著第一平坦面Fa的外緣設置的平坦的傾斜面。 [0033] 第二主表面Sb,係具備第二平坦面Fb、第二倒角面Cb。第二平坦面Fb,係設置於第二主表面Sb的中央部的平坦的圓形面。第二倒角面Cb,係沿著第二平坦面Fb的外緣設置的平坦的傾斜面。 [0034] 第一倒角面Ca及第二倒角面Cb,係藉由所謂C倒角加工所形成的平坦面。第一倒角面Ca的面積,係比第二倒角面Cb的面積更大。另外,第一平坦面Fa的面積,係比第二平坦面Fb的面積更小。藉由該構成,原料玻璃板G1的剖面,係如第1A圖所示般對於板厚方向的中央線(該圖中的單點虛線)X在第一主表面Sa側及第二主表面Sb側為表裏非對稱形狀。 [0035] 又,前述形狀係一例,第一倒角面Ca及第二倒角面Cb,係藉由所謂R倒角加工形成的彎曲面亦可,藉由具有複數個曲率半徑的曲面構成亦可。另外,原料玻璃板G1,係不限於圓盤狀之任意的形狀,例如矩形狀的玻璃板亦可。另外,原料玻璃板G1,係具有從第一平坦面Fa貫穿至第二平坦面Fb的孔的構成亦可。 [0036] 原料玻璃板G1,係含有以質量%計SiO2 45~75%、Al2 O3 1~30%、Na2 O 1~20%、以及K2 O 0~20%作為玻璃板組成為佳。若如前述般限制玻璃板的組成範圍,則容易高程度地兼顧離子交換性能及耐失透性。 [0037] 原料玻璃板G1的板厚,係例如為2.0mm以下,較佳為1.5mm以下、1.3mm以下、1.0mm以下、0.8mm以下、0.7mm以下、0.6mm以下、0.5mm以下、0.4mm以下、0.3mm以下、0.2mm以下,特別是0.1mm以下。原料玻璃板G1的板厚越小,越能夠使強化玻璃板基板輕量化,因此,能夠達成裝置的薄型化、輕量化。又,若考慮到生產性等,原料玻璃板G1的板厚為0.01mm以上為佳。 [0038] 原料玻璃板G1,係例如使用溢流下拉法成形,使用切割刀尖切斷,並藉由旋轉磨石工具受到倒角及端面研磨加工。又,原料玻璃板G1的成形方法或加工方法可任意選擇。例如,原料玻璃板G1係使用浮製法成形亦可,使用雷射光切斷亦可,使用研磨帶受到研磨加工亦可。 [0039] 接著,在前述準備步驟之後,實施第1B圖、第1C圖所示之選擇強化步驟的處理。選擇強化步驟,係包含第1B圖所示之遮罩步驟,以及第1C圖所示之選擇離子交換步驟。 [0040] 遮罩步驟,係在原料玻璃板G1的第一主表面Sa及第二主表面Sb的一部分形成第一遮罩Ma及第二遮罩Mb而獲得附膜玻璃板G2的步驟。第一遮罩Ma及第二遮罩Mb,係於後述之選擇離子交換步驟中,在進行原料玻璃板G1表層離子交換之際抑制或遮蔽離子的穿透的膜層。 [0041] 如第3圖所示,第一遮罩Ma,係以被覆第一平坦面Fa的中央部Fa1,並使第一平坦面Fa的周緣部Fa2以及第一倒角面Ca露出的方式,形成於第一主表面Sa。又,第一平坦面Fa的周緣部Fa2,係包含對於第一倒角面Ca的第一平坦面Fa的邊界部,自該邊界部起數mm~數十mm的範圍之第一平坦面Fa的一部分(以下,於第二平坦面Fb亦同)。 [0042] 第一平坦面Fa的周緣部Fa2,係以包圍第一平坦面Fa的中央部Fa1的周圍的方式構成為環狀。在第一平坦面Fa為圓形的情形,周緣部Fa2亦對應於形狀而構成為圓形(圓環狀)。當然,在第一平坦面Fa為矩形的情形,周緣部Fa2亦對應此而構成為矩形。 [0043] 如第4圖所示,第二遮罩Mb,係以被覆第二平坦面Fb的中央部Fb1,並使第二平坦面Fb的周緣部Fb2以及第二倒角面Cb露出的方式,形成於第二主表面Sb。 [0044] 如第3圖及第4圖所示,第一遮罩Ma及第二遮罩Mb,係以對應於第一平坦面Fa及第二平坦面Fb的形狀的方式構成為圓形。第一遮罩Ma的直徑Wma,係比第一平坦面Fa的直徑Wfa更小,第二遮罩Mb的直徑Wmb,係比第二平坦面Fb的直徑Wfb更小。因此,第一遮罩Ma的面積,係比第一平坦面Fa的面積更小,第二遮罩Mb的面積,係比第二平坦面Fb的面積更小。另外,第二遮罩Mb的直徑Wmb,係比第一遮罩Ma的直徑Wma更大。因此,第二遮罩Mb的面積,係比第一遮罩Ma的面積更大。 [0045] 第一平坦面Fa的直徑Wfa與第一遮罩Ma的直徑Wma的差(Wfa-Wma),係0.1mm以上且5mm以下為佳。另外,第二平坦面Fb的直徑Wfb與第二遮罩Mb的直徑Wmb的差(Wfb-Wmb),係0.1mm以上且10mm以下為佳。另外,第一遮罩Ma的直徑Wma與第二遮罩Mb的直徑Wmb的差(Wmb-Wma),係0.1mm以上且3mm以下為佳。然而,該等數值,係不限於前述的範圍,能夠對應於原料玻璃板G1的尺寸而適當設定。 [0046] 第一遮罩Ma,係位於第一平坦面Fa的面內,具體而言,係位於與第一平坦面Fa呈同心狀。同樣地,第二遮罩Mb,係位於第二平坦面Fb的面內,並位於與第二平坦面Fb呈同心狀。又,於第3圖及第4圖中,為強調第一遮罩Ma及第二遮罩Mb,於該等施加影線。 [0047] 作為第一遮罩Ma及第二遮罩Mb的材質,只要能夠抑制或遮蔽受到離子交換的離子的穿透,使用任意的材質皆可。在受到交換的離子為鹼金屬離子的情形下,第一遮罩Ma及第二遮罩Mb,係例如金屬氧化物、金屬氮化物、金屬碳化物、金屬氧氮化物、金屬氧碳化物、金屬碳氮化物膜等為佳。另外,亦能夠使用耐熱性或化學耐久性優異的碳材料或金屬、合金作為第一遮罩Ma及第二遮罩Mb。更詳細言之,作為第一遮罩Ma及第二遮罩Mb的材質,係能夠為包含例如SiO2 、Al2 O3 、SiN、SiC、AlN、ZrO2 、TiO2 、Ta2 O5 、Nb2 O5 、HfO2 、SnO2 、碳奈米管、石墨烯、類鑽碳、不鏽鋼之中1種以上的膜。 [0048] 特別是,若以SiO2 作為第一遮罩Ma及第二遮罩Mb的主成分,則能夠廉價且輕易地形成第一遮罩Ma及第二遮罩Mb,並能夠發揮作為防反射膜的功能,故較佳。第一遮罩Ma及第二遮罩Mb,係可為僅由SiO2 所成的膜。具體而言,第一遮罩Ma及第二遮罩Mb係可為具有以質量%計含有99%以上的SiO2 的組成者。 [0049] 另外,在欲確實遮蔽離子的穿透的情形下,使用以SiO2 作為主成分並含有Al2 O3 的無機膜層作為第一遮罩Ma及第二遮罩Mb為佳。此時,第一遮罩Ma及第二遮罩Mb,係質量%計含有SiO2 20~99%、以及Al2 O3 1~80%,更佳為SiO2 60~99%、以及Al2 O3 1~40%的組成。 [0050] 作為第一遮罩Ma及第二遮罩Mb的厚度,只要能夠遮蔽及抑制離子穿透,為任意的厚度皆可。然而,若第一遮罩Ma及第二遮罩Mb的厚度過大,則成膜時間或材料成本等會增大,故在能夠遮蔽及抑制離子穿透的範圍內形成為盡可能地薄為佳。具體而言,第一遮罩Ma及第二遮罩Mb的膜厚,例如1~5000nm為佳,更佳為50~4000nm。第一遮罩Ma的膜厚與第二遮罩Mb的膜厚,設定為相同亦可,設定為不同亦可。例如,相對於第一遮罩Ma的厚度,第二遮罩Mb的厚度為0.8~1.2倍為佳。 [0051] 第一遮罩Ma及第二遮罩Mb的成膜方法,係能夠使用濺鍍法或真空蒸鍍法等PVD法(物理氣相沉積法)、熱CVD法或電漿CVD法等CVD法(化學氣相沉積法)、浸漬塗佈法或狹縫塗佈法等濕式塗佈法。特別以濺鍍法、浸漬塗佈法為佳。在使用濺鍍法的情形下,能夠輕易地均勻形成第一遮罩Ma及第二遮罩Mb。第一遮罩Ma及第二遮罩Mb的成膜部位,係可藉由任意的手法設定。另外,將預先成形為薄片狀的第一遮罩Ma及第二遮罩Mb接合於原料玻璃板G1的主表面Sa、Sb而成膜亦可。 [0052] 又,於本實施形態中,係將形成了含有SiO2 及Al2 O3 、膜厚為100nm以上、能夠遮蔽鹼金屬離子的穿透之第一遮罩Ma及第二遮罩Mb的情形作為一例進行說明。 [0053] 接著,在前述遮罩步驟之後,實施第1C圖所示之選擇離子交換步驟的處理。選擇離子交換步驟,係將附膜玻璃板G2藉由離子交換法進行化學強化而獲得附膜強化玻璃板G3的步驟。具體而言,係將附膜玻璃板G2浸漬於含有鹼金屬離子的熔鹽T1而進行離子交換。本實施形態中之熔鹽T1,係例如硝酸鉀熔鹽。該熔鹽T1,係以濃度為20質量%的方式與水混合成水溶液時,pH值為6.5~11為佳。 [0054] 於該選擇離子交換步驟中,係將受到各遮罩Ma、Mb所被覆的各主表面Sa、Sb的一部分作為非選擇區域,並將未受到各遮罩Ma、Mb所被覆而露出的部分作為選擇區域。具體而言,非選擇區域,係第一平坦面Fa的中央部Fa1及第二平坦面Fb的中央部Fb1。選擇區域,係第一平坦面Fa的周緣部Fa2、第二平坦面Fb的周緣部Fb2、第一倒角面Ca、第二倒角面Cb及端面E。 [0055] 選擇離子交換步驟中之熔鹽T1的溫度可任意訂定,例如350~500℃,較佳為370~480℃,更佳為380~450℃,又更佳為380~400℃。另外,將附膜玻璃板G2浸漬於熔鹽T1中的時間可任意訂定,例如0.1~150小時,較佳為0.3~100小時,更佳為0.5~50小時。 [0056] 於前述選擇離子交換步驟中,於附膜玻璃板G2的表面當中,在未設置有第一遮罩Ma及第二遮罩Mb的選擇區域,玻璃板中的鈉離子與熔鹽T1中的鉀離子係受到交換。藉此,於選擇區域形成有第一壓縮應力層CP1。另一方面,於附膜玻璃板G2的表面當中,在設置有第一遮罩Ma及第二遮罩Mb的中央部Fa1、Fb1,因離子受到遮蔽,故未形成壓縮應力層。藉由以上之選擇離子交換步驟,獲得於選擇區域形成有第一壓縮應力層CP1而成的附膜強化玻璃板G3。 [0057] 接著,在前述選擇離子交換步驟之後,實施第1D圖所示之遮罩去除步驟的處理。遮罩去除步驟,係從附膜強化玻璃板G3去除各遮罩Ma、Mb的步驟。具體而言,係藉由研磨去除各遮罩Ma、Mb。作為研磨裝置,係能夠使用週知之研磨裝置,特別是使用兩面研磨裝置為佳。 [0058] 又,不限於研磨,使用其他手法去除各遮罩Ma、Mb亦可。例如,使蝕刻液附著而去除各遮罩Ma、Mb亦可。在各遮罩Ma、Mb為含有SiO2 的膜之情形下,能夠使用含有例如氟、四甲基氫氧化銨(TMAH)、乙二胺鄰苯二酚(EDP)、氫氧化鉀、氫氧化鈉等的溶液作為蝕刻液,特別是使用氫氟酸溶液作為蝕刻液為佳。又,在欲使用氫氟酸溶液,且不變更玻璃尺寸地僅去除各遮罩Ma、Mb的情形下,使該氫氟酸溶液的HF濃度為10%以下為佳。 [0059] 若藉由前述遮罩去除步驟的處理去除各遮罩Ma、Mb,則獲得在各平坦面Fa、Fb的各中央部Fa1、Fb1未形成壓縮應力層,並在各平坦面Fa、Fb的各周緣部Fa2、Fb2、各倒角面Ca、Cb及端面E形成有第一壓縮應力層CP1而成的強化玻璃板G4(參照第1D圖)。 [0060] 接著,為了將該強化玻璃板G4整體強化,係實施整體強化步驟的處理。整體強化步驟,係如第1E圖所示,為使強化玻璃板G4的表面整體接觸熔鹽T2而使表層的離子交換的步驟。具體而言,係將強化玻璃板G4浸漬於含有鹼金屬離子的熔鹽T2而進行離子交換,並於各平坦面Fa、Fb的各中央部Fa1、Fb1形成第二壓縮應力層CP2。進而,於第一壓縮應力層CP1亦進行離子交換,而使其深度增大。又,熔鹽T2,係例如為硝酸鉀熔鹽。 [0061] 整體強化步驟中之熔鹽T2的溫度可任意訂定,例如350~500℃,較佳為370~480℃,更佳為380~450℃。另外,將強化玻璃板G4浸漬於熔鹽T2中的時間可任意訂定,例如0.1~72小時,較佳為0.3~50小時,更佳為0.5~24小時。 [0062] 熔鹽T2,為與前述之熔鹽T1相同者亦可。亦即,將強化玻璃板G4再度浸漬於選擇強化步驟中所使用的熔鹽T1亦可。此時,因能夠藉由單一的鹽浴進行複數步驟的處理,故能夠抑制製造設備的成本。 [0063] 另外,熔鹽T2,為與熔鹽T1不同者亦可,於整體強化步驟中的處理溫度及處理時間,與選擇離子交換步驟的處理溫度及處理時間不同亦可。例如,整體強化步驟的離子交換的處理時間,比選擇離子交換步驟的處理時間更短為佳。藉由如此之處理,使各平坦面Fa、Fb的各中央部Fa1、Fb1的第二壓縮應力層CP2的深度不致過剩,而能夠抑制拉伸應力的增加。 [0064] 藉由以上之整體強化步驟,獲得在半徑方向的端部(各周緣部Fa2、Fb2、各倒角面Ca、Cb及端面E)形成有層深度(DOL1)大的第一壓縮應力層CP1,並在其中央部(各平坦面Fa、Fb的各中央部Fa1、Fb1)形成有層深度(DOL2)小的第二壓縮應力層CP2而成的強化玻璃板G5。於該強化玻璃板G5的各主表面Sa、Sb,係以對應於第一遮罩Ma及第二遮罩Mb的面積的方式,形成有面積不同的第二壓縮應力層CP2。亦即,強化玻璃板G5的第二平坦面Fb的第二壓縮應力層CP2的形成面積,係變得比第一平坦面Fa的第二壓縮應力層CP2的形成面積更大。第一壓縮應力層CP1的層深度(DOL1),係強化玻璃板G5的厚度的1/4以下為佳。另外,第二壓縮應力層CP2的層深度(DOL2),係強化玻璃板G5的厚度的1/8以下為佳。 [0065] 如以上般,於本實施形態之強化玻璃板G5的製造方法中,對於在厚度方向具有非對稱形狀的原料玻璃板G1,對應於其非對稱形狀,將面積不同的第一遮罩Ma及第二遮罩Mb形成在各主表面Sa、Sb,藉此能夠使在進行離子交換法所致之強化時之玻璃板(附膜玻璃板G2)的變形盡可能地小。具體而言,在構成為第一平坦面Fa的面積小、第二平坦面Fb的面積大的原料玻璃板G1的情形下,係將面積小的第一遮罩Ma形成於第一平坦面Fa,並將面積大的第二遮罩Mb形成於第二平坦面Fb,而構成附膜玻璃板G2為佳。藉此,能夠穩定製造具有高平坦性且局部具有高強度的強化玻璃板G5。 [0066] 在本實施形態的情形下,原料玻璃板G1,係與各倒角面Ca、Cb相比,第一平坦面Fa及第二平坦面Fb的面積更大,故在離子交換時形成於各倒角面Ca、Cb的壓縮應力層對於附膜玻璃板G2的變形所造成的影響,比形成於第一平坦面Fa及第二平坦面Fb的壓縮應力層所造成的影響可謂極小。因此,於本實施形態,僅藉由在各主表面Sa、Sb當中,第一平坦面Fa及第二平坦面Fb的中央部Fa1、Fb1形成面積不同的第一遮罩Ma及第二遮罩Mb,便能夠防止附膜玻璃板G2的變形。 [0067] 另外,於整體強化步驟中,雖亦將去除各遮罩Ma、Mb而成的強化玻璃板G4浸漬於熔鹽T2以進行離子交換,然而因於選擇強化步驟中選擇區域受到強化,故整體強化步驟中強化玻璃板G4的變形係極度輕微。 [0068] 前述之事項,係不僅限於形成具有各倒角面Ca、Cb的圓盤狀之強化玻璃板G5的情形,而能夠運用於製造各種形狀的強化玻璃板G5的情形。第5圖,係表示製造不具有倒角面Ca、Cb的強化玻璃板G5的情形的原料玻璃板G1及附膜玻璃板G2之例。 [0069] 如第5A圖所示,原料玻璃板G1,係半徑方向的端部的厚度構成為比中途部的厚度更大。該端部係構成為於剖面觀察下為大致圓形,且其直徑構成為比原料玻璃板G1的中途部的厚度更大。藉由該構成,原料玻璃板G1,係於第一主表面Sa具有與第一平坦面Fa連接之凸狀的曲面CS。另外,附膜玻璃板G2的第一遮罩Ma,係以不僅被覆第一平坦面Fa,亦被覆該曲面CS的一部分的方式形成。除此之外,於該例中,係將第一遮罩Ma的面積(直徑Wma)設定為比第二遮罩Mb的面積(直徑Wmb)更大。另外,於第5B圖所示之原料玻璃板G1,係以連接至其第一主表面Sa的第一平坦面Fa的方式形成傾斜面IS。於該例中,附膜玻璃板G2的第一遮罩Ma,係不僅第一平坦面Fa,亦形成於該傾斜面IS的一部分。 [0070] 又,整體強化步驟之後,進一步實施精製加工步驟的處理亦可。依據本實施形態之強化玻璃板G5的製造方法,於選擇強化步驟的選擇離子交換步驟中,不僅防止附膜強化玻璃板G3的變形,藉由調整第一遮罩Ma與第二遮罩Mb的面積的大小關係,亦能夠調整附膜強化玻璃板G3的變形量。因此,亦能夠使經過整體強化步驟而成的強化玻璃板G5成為若干變形的狀態,並對其施予精製加工步驟。 [0071] 以下,針對該精製加工步驟,以藉由兩面研磨裝置PA研磨強化玻璃板G5的情形為例進行說明。如第6圖所示,兩面研磨裝置PA,係具備:保持強化玻璃板G5的遊星輪CA、研磨強化玻璃板G5的第一主表面Sa的上研磨定盤SP1、研磨第二主表面Sb的下研磨定盤SP2。遊星輪CA,係具有將強化玻璃板G5保持為無法旋轉的保持孔CAh。 [0072] 強化玻璃板G5,係如第6圖所示,在以第一平坦面Fa為上側、以第二平坦面Fb為下側的情形下,以上方凸出若干的方式變形的狀態,嵌合於遊星輪CA的保持孔CAh。在該狀態,使上研磨定盤SP1接觸第一主表面Sa,使下研磨定盤SP2接觸第二主表面Sb。之後,使上研磨定盤SP1、下研磨定盤SP2及遊星輪CA相對移動,而研磨強化玻璃板G5的兩面Sa、Sb。 [0073] 如前述般,藉由在強化玻璃板G5殘留有若干變形的狀態進行兩面研磨,能夠使各主表面Sa、Sb皆獲得良好的研磨面。例如,在不使強化玻璃板G5變形的狀態而進行相同的兩面研磨的情形下,因其上下位置關係,位於下方側的第二主表面Sb會比第一主表面Sa受到過剩地研磨,故有在上側的第一主表面Sa及下側的第二主表面Sb研磨量變得不平均之虞。對此,因藉由如前述般進行研磨,能夠使各主表面Sa、Sb的研磨量平均,故能夠進行高精度的兩面研磨。 [0074] 第7圖,係表示強化玻璃板的製造方法之第二實施形態。於前述第一實施形態,係藉由選擇強化步驟及整體強化步驟,將玻璃板(附膜玻璃板G2、強化玻璃板G4)浸漬於熔鹽T1、T2兩次,於本實施形態中,係藉由一次浸漬製造強化玻璃板G5。 [0075] 於本實施形態,在如第7A圖所示,準備原料玻璃板G1後,如第7B圖所示,在各主表面Sa、Sb形成第一遮罩Ma及第二遮罩Mb而獲得附膜玻璃板G2。與第一實施形態不同,於本實施形態,係使用抑制離子穿透的功能性膜作為第一遮罩Ma及第二遮罩Mb。 [0076] 之後,如第7C圖所示,將具有各遮罩Ma、Mb的附膜玻璃板G2浸漬於熔鹽T1。藉此,於未受各遮罩Ma、Mb被覆的各平坦面Fa、Fb的各周緣部Fa2、Fb2、各倒角面Ca、Cb及端面E進行離子交換,並且在受到各遮罩Ma、Mb被覆的中央部Fa1、Fb1亦於離子穿透受到抑制的狀態實施離子交換。藉此,獲得在半徑方向的端部(各周緣部Fa2、Fb2、各倒角面Ca、Cb及端面E)形成有層深度(DOL1)大的第一壓縮應力層CP1,並在其中央部(各平坦面Fa、Fb的各中央部Fa1、Fb1)形成有層深度(DOL2)小的第二壓縮應力層CP2而成的附膜強化玻璃板G3(參照第7C圖)。之後,藉由去除附膜強化玻璃板G3的第一遮罩Ma及第二遮罩Mb,獲得第7D圖所示之強化玻璃板G4。 [0077] 又,本發明,係不限於前述實施形態之構成,亦不限於前述之作用效果。本發明,可在不脫離本發明的主旨的範圍內進行各種變更。 [0078] 於前述實施形態,雖例示將鈉離子與鉀離子進行離子交換而化學強化的情形,然而不限於此,能夠交換任意的離子。例如,藉由鋰離子與鈉離子的離子交換,或是鋰離子與鉀離子的離子交換來製造強化玻璃板G4、G5亦可。此時,強化玻璃板G4、G5,係較佳為以質量%計以0.5~7.5%含有LiO2 ,更佳為含有3.0%,或是4.5%的LiO2 作為組成。 [0079] 強化玻璃板的應力特性,係能夠使用例如折原製作所製之FSM-6000進行測定。在矽鋁酸鹽系玻璃的壓縮應力層的深度超過100μm的情形,或是在進行鋰離子與鈉離子的離子交換或鋰離子與鉀離子的離子交換的情形,強化玻璃板的應力特性,係能夠使用例如折原製作所製之SLP-1000進行測定。在能夠將強化玻璃板切斷等而製作剖面試料的情形下,使用例如Photonic Lattice公司製之WPA-micro或Tokyo Instruments公司製之Abrio觀測內部應力分佈並確認應力深度為佳。 [實施例] [0080] 本發明者們,係以使用本製造方法所製造的情形之強化板玻璃作為實施例,將未運用本製造方法(未於原料玻璃板形成遮罩)製造的情形之強化板玻璃作為比較例,並藉由運算(模擬)求取各例中翹曲(垂直方向位移)的大小。實施例及比較例之各強化玻璃板,係具有在厚度方向非對稱的剖面形狀的圓盤。實施例及比較例的強化玻璃板的尺寸,係厚度1mm,外徑40mm。另外,使實施例所使用之第一遮罩的直徑為30mm,使第二遮罩的直徑為36mm。 [0081] 運算的結果,可知相對於實施例之翹曲為0.0μm,比較例之翹曲為23.7μm。第8圖,係將該運算結果藉由灰階作可視化。第8A圖係表示實施例,而第8B圖係表示比較例。如第8A圖及第8B圖所示,可知比較例之強化玻璃板係翹曲量(垂直方向位移)隨著朝向半徑方向外方變大,而實施例之強化玻璃板完全未產生翹曲。又,第8A圖所示之實施例之強化玻璃板,其邊緣係以實線鑲邊而顯示。該實線係用以使強化玻璃板的邊界明確而附加者,與強化玻璃板的翹曲並無關係。[0029] Hereinafter, an embodiment of a method for manufacturing a strengthened glass plate according to the present invention will be described with reference to the drawings. Figures 1 to 6 show the first embodiment of the method for manufacturing a strengthened glass plate of the present invention. [0030] The method for producing a sheet glass of the present invention includes: a step of preparing a raw glass sheet; a selective strengthening step of selectively strengthening a part of the raw glass sheet; and, after the selective strengthening step, strengthening the entire glass sheet Overall strengthening steps. Each step will be described below. First, the processing of the preparation steps shown in FIG. 1A is performed. This preparation step is a step of preparing a raw glass plate G1 having a predetermined shape. [0031] The raw glass plate G1 is a glass plate that can be strengthened by an ion exchange method and has an asymmetric cross-sectional shape in the thickness direction. In this embodiment, a case where the raw glass plate G1 is a disc-shaped glass plate as shown in FIG. 2 will be described as an example. The raw glass plate G1 includes a first main surface Sa and a second main surface Sb, which are in a front-back relationship. In the present embodiment, the first main surface Sa side is referred to as the surface side, and the second main surface Sb side is referred to as the back side. [0032] The first main surface Sa includes a first flat surface Fa and a first chamfered surface Ca. The first flat surface Fa is a flat circular surface provided at a central portion of the first main surface Sa. The first chamfered surface Ca is a flat inclined surface provided along the outer edge of the first flat surface Fa. [0033] The second main surface Sb includes a second flat surface Fb and a second chamfered surface Cb. The second flat surface Fb is a flat circular surface provided at a central portion of the second main surface Sb. The second chamfered surface Cb is a flat inclined surface provided along the outer edge of the second flat surface Fb. [0034] The first chamfered surface Ca and the second chamfered surface Cb are flat surfaces formed by a so-called C-chamfering process. The area of the first chamfered surface Ca is larger than the area of the second chamfered surface Cb. The area of the first flat surface Fa is smaller than the area of the second flat surface Fb. With this configuration, the cross section of the raw glass plate G1 is as shown in FIG. 1A with respect to the center line in the plate thickness direction (a single dotted line in the figure) X on the first main surface Sa side and the second main surface Sb The sides are asymmetrical on the front and back. [0035] Moreover, the aforementioned shape is an example. The first chamfered surface Ca and the second chamfered surface Cb may be curved surfaces formed by a so-called R-chamfering process, and may also be formed by a curved surface having a plurality of curvature radii. can. In addition, the raw glass plate G1 is not limited to a disc-shaped arbitrary shape, and for example, a rectangular glass plate may be used. In addition, the raw glass plate G1 may have a structure having a hole penetrating from the first flat surface Fa to the second flat surface Fb. [0036] The raw glass plate G1 contains 45 to 75% by mass of SiO 2 , Al 2 O 3 1 to 30%, Na 2 O 1 to 20%, and K 2 O 0 to 20% as a glass plate group. Become better. When the composition range of the glass plate is limited as described above, it is easy to achieve both ion exchange performance and devitrification resistance to a high degree. [0037] The thickness of the raw glass plate G1 is, for example, 2.0 mm or less, preferably 1.5 mm or less, 1.3 mm or less, 1.0 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, and especially 0.1 mm or less. The smaller the thickness of the raw glass plate G1 is, the more the tempered glass plate substrate can be made lighter. Therefore, the device can be made thinner and lighter. Moreover, considering productivity and the like, the thickness of the raw glass plate G1 is preferably 0.01 mm or more. [0038] The raw glass plate G1 is formed by, for example, an overflow down-draw method, is cut by a cutting edge, and is subjected to chamfering and end surface grinding processing by a rotary grindstone tool. The method of forming or processing the raw glass plate G1 can be arbitrarily selected. For example, the raw glass plate G1 may be formed by a float method, may be cut by laser light, or may be subjected to a grinding process using a polishing tape. [0039] Next, after the aforementioned preparatory steps, the processing of the selective strengthening step shown in FIGS. 1B and 1C is performed. The selective enhancement step includes a masking step shown in FIG. 1B and a selective ion exchange step shown in FIG. 1C. [0040] The masking step is a step of forming a first mask Ma and a second mask Mb on a part of the first main surface Sa and the second main surface Sb of the raw glass plate G1 to obtain a film-coated glass plate G2. The first mask Ma and the second mask Mb are film layers that suppress or shield the penetration of ions during the ion exchange of the surface layer of the raw glass plate G1 in a selective ion exchange step described later. [0041] As shown in FIG. 3, the first mask Ma covers the central portion Fa1 of the first flat surface Fa and exposes the peripheral edge portion Fa2 of the first flat surface Fa and the first chamfered surface Ca. Is formed on the first main surface Sa. The peripheral edge portion Fa2 of the first flat surface Fa is a first flat surface Fa including a boundary portion of the first flat surface Fa to the first chamfered surface Ca, and a range of several mm to several tens mm from the boundary portion. (Hereinafter, the same applies to the second flat surface Fb). [0042] The peripheral edge portion Fa2 of the first flat surface Fa is configured in a ring shape so as to surround the periphery of the central portion Fa1 of the first flat surface Fa. When the first flat surface Fa is circular, the peripheral edge portion Fa2 is also formed in a circular shape (ring shape) according to the shape. Of course, in the case where the first flat surface Fa is rectangular, the peripheral edge portion Fa2 is also configured to be rectangular corresponding to this. [0043] As shown in FIG. 4, the second mask Mb covers the central portion Fb1 of the second flat surface Fb and exposes the peripheral edge portion Fb2 and the second chamfered surface Cb of the second flat surface Fb. Is formed on the second main surface Sb. [0044] As shown in FIG. 3 and FIG. 4, the first mask Ma and the second mask Mb are formed in a circular shape so as to correspond to the shapes of the first flat surface Fa and the second flat surface Fb. The diameter Wma of the first mask Ma is smaller than the diameter Wfa of the first flat surface Fa, and the diameter Wmb of the second mask Mb is smaller than the diameter Wfb of the second flat surface Fb. Therefore, the area of the first mask Ma is smaller than the area of the first flat surface Fa, and the area of the second mask Mb is smaller than the area of the second flat surface Fb. The diameter Wmb of the second mask Mb is larger than the diameter Wma of the first mask Ma. Therefore, the area of the second mask Mb is larger than that of the first mask Ma. [0045] The difference (Wfa-Wma) between the diameter Wfa of the first flat surface Fa and the diameter Wma of the first mask Ma is preferably 0.1 mm or more and 5 mm or less. The difference (Wfb-Wmb) between the diameter Wfb of the second flat surface Fb and the diameter Wmb of the second mask Mb is preferably 0.1 mm or more and 10 mm or less. The difference (Wmb-Wma) between the diameter Wma of the first mask Ma and the diameter Wmb of the second mask Mb is preferably 0.1 mm or more and 3 mm or less. However, these numerical values are not limited to the aforementioned range, and can be appropriately set in accordance with the size of the raw glass plate G1. [0046] The first mask Ma is located in the plane of the first flat surface Fa, specifically, it is located in a concentric shape with the first flat surface Fa. Similarly, the second mask Mb is located in the plane of the second flat surface Fb, and is located concentrically with the second flat surface Fb. In FIGS. 3 and 4, in order to emphasize the first mask Ma and the second mask Mb, hatching is applied to these. [0047] As the material of the first mask Ma and the second mask Mb, any material can be used as long as it can suppress or shield the penetration of ions subjected to ion exchange. When the ion being exchanged is an alkali metal ion, the first mask Ma and the second mask Mb are, for example, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxycarbide, or a metal. Carbonitride films and the like are preferred. In addition, a carbon material, a metal, or an alloy excellent in heat resistance or chemical durability can be used as the first mask Ma and the second mask Mb. In more detail, the materials of the first mask Ma and the second mask Mb can include, for example, SiO 2 , Al 2 O 3 , SiN, SiC, AlN, ZrO 2 , TiO 2 , Ta 2 O 5 , One or more films of Nb 2 O 5 , HfO 2 , SnO 2 , carbon nanotube, graphene, diamond-like carbon, and stainless steel. [0048] In particular, if SiO 2 is used as a main component of the first mask Ma and the second mask Mb, the first mask Ma and the second mask Mb can be formed inexpensively and easily, and can be used as an antimonitor. The function of the reflective film is preferred. The first mask Ma and the second mask Mb may be films made of only SiO 2 . Specifically, the first mask Ma and the second mask Mb may be a composition having 99% or more of SiO 2 by mass%. [0049] In a case where the penetration of ions is to be surely shielded, an inorganic film layer containing SiO 2 as a main component and containing Al 2 O 3 is preferably used as the first mask Ma and the second mask Mb. At this time, the first mask Ma and the second mask Mb contain SiO 2 20 to 99% and Al 2 O 3 1 to 80%, more preferably SiO 2 60 to 99%, and Al 2 O 3 has a composition of 1 to 40%. [0050] The thicknesses of the first mask Ma and the second mask Mb may be any thickness as long as they can shield and suppress ion penetration. However, if the thicknesses of the first mask Ma and the second mask Mb are too large, the film formation time, material cost, and the like may increase. Therefore, it is better to form as thin as possible within a range capable of shielding and suppressing ion penetration . Specifically, the film thicknesses of the first mask Ma and the second mask Mb are, for example, preferably from 1 to 5000 nm, and more preferably from 50 to 4000 nm. The film thickness of the first mask Ma and the film thickness of the second mask Mb may be set to be the same, or may be set to be different. For example, the thickness of the second mask Mb is preferably 0.8 to 1.2 times the thickness of the first mask Ma. [0051] The film formation method of the first mask Ma and the second mask Mb can be a PVD method (physical vapor deposition method) such as a sputtering method or a vacuum evaporation method, a thermal CVD method, or a plasma CVD method. Wet coating methods such as a CVD method (chemical vapor deposition method), a dip coating method, or a slit coating method. Particularly, a sputtering method and a dip coating method are preferred. When the sputtering method is used, the first mask Ma and the second mask Mb can be easily and uniformly formed. The film formation sites of the first mask Ma and the second mask Mb can be set by any method. In addition, the first mask Ma and the second mask Mb, which are formed into a sheet shape in advance, may be bonded to the main surfaces Sa and Sb of the raw glass plate G1 to form a film. [0052] In this embodiment, a first mask Ma and a second mask Mb, which contain SiO 2 and Al 2 O 3 and have a film thickness of 100 nm or more, can shield the penetration of alkali metal ions. The case will be described as an example. [0053] Next, after the aforementioned masking step, the processing of the selective ion exchange step shown in FIG. 1C is performed. The selective ion exchange step is a step of chemically strengthening the coated glass plate G2 by an ion exchange method to obtain a coated glass plate G3. Specifically, ion-exchange is performed by immersing the coated glass plate G2 in a molten salt T1 containing an alkali metal ion. The molten salt T1 in this embodiment is, for example, a potassium nitrate molten salt. When the molten salt T1 is mixed with water to form an aqueous solution at a concentration of 20% by mass, the pH is preferably 6.5 to 11. [0054] In this selective ion exchange step, a part of each of the main surfaces Sa and Sb covered by the masks Ma and Mb is used as a non-selected area, and exposed without being covered by the masks Ma and Mb. As a selection area. Specifically, the non-selected region is a central portion Fa1 of the first flat surface Fa and a central portion Fb1 of the second flat surface Fb. The selection area is a peripheral edge portion Fa2 of the first flat surface Fa2, a peripheral edge portion Fb2 of the second flat surface Fb2, a first chamfered surface Ca, a second chamfered surface Cb, and an end surface E. [0055] The temperature of the molten salt T1 in the selective ion exchange step can be arbitrarily set, for example, 350 to 500 ° C, preferably 370 to 480 ° C, more preferably 380 to 450 ° C, and still more preferably 380 to 400 ° C. In addition, the time for immersing the coated glass plate G2 in the molten salt T1 can be arbitrarily set, for example, 0.1 to 150 hours, preferably 0.3 to 100 hours, and more preferably 0.5 to 50 hours. [0056] In the aforementioned selective ion exchange step, in the surface of the glass-coated glass plate G2, in the selection area where the first mask Ma and the second mask Mb are not provided, the sodium ion and the molten salt T1 in the glass plate Potassium ions are exchanged. Thereby, the first compressive stress layer CP1 is formed in the selected area. On the other hand, in the surface of the film-coated glass plate G2, in the central portions Fa1 and Fb1 where the first mask Ma and the second mask Mb are provided, since the ions are shielded, a compressive stress layer is not formed. Through the above-mentioned selective ion exchange step, a film-reinforced glass plate G3 having a first compressive stress layer CP1 formed in a selected region is obtained. [0057] Next, after the aforementioned selective ion exchange step, the processing of the mask removal step shown in FIG. 1D is performed. The mask removing step is a step of removing each of the masks Ma and Mb from the film-reinforced glass plate G3. Specifically, each of the masks Ma and Mb is removed by polishing. As the polishing device, a well-known polishing device can be used, and it is particularly preferable to use a double-sided polishing device. [0058] It is not limited to polishing, and the masks Ma and Mb may be removed by other methods. For example, the masks Ma and Mb may be removed by attaching an etching solution. When each of the masks Ma and Mb is a film containing SiO 2 , for example, fluorine, tetramethylammonium hydroxide (TMAH), ethylenediamine catechol (EDP), potassium hydroxide, and hydroxide can be used. A solution such as sodium is used as the etching solution, and a hydrofluoric acid solution is particularly used as the etching solution. When it is desired to use a hydrofluoric acid solution without removing the masks Ma and Mb without changing the glass size, the HF concentration of the hydrofluoric acid solution is preferably 10% or less. [0059] If each of the masks Ma and Mb is removed by the process of the mask removal step, no compressive stress layer is formed on each of the central portions Fa1 and Fb1 of the flat surfaces Fa and Fb, and the flat surfaces Fa, A strengthened glass plate G4 (see FIG. 1D) in which a first compressive stress layer CP1 is formed in each peripheral edge portion Fa2, Fb2, each chamfered surface Ca, Cb, and end surface E of Fb (see FIG. 1D). [0060] Next, in order to strengthen the tempered glass sheet G4 as a whole, the entire tempering step is performed. The whole strengthening step is a step of exchanging the surface of the strengthened glass plate G4 with the molten salt T2 as a whole, as shown in FIG. 1E, to exchange ions on the surface layer. Specifically, the strengthened glass plate G4 is immersed in a molten salt T2 containing an alkali metal ion to perform ion exchange, and a second compressive stress layer CP2 is formed at each central portion Fa1 and Fb1 of each flat surface Fa, Fb. Furthermore, ion exchange is performed on the first compressive stress layer CP1 to increase its depth. The molten salt T2 is, for example, a potassium nitrate molten salt. [0061] The temperature of the molten salt T2 in the overall strengthening step can be arbitrarily set, for example, 350 to 500 ° C, preferably 370 to 480 ° C, and more preferably 380 to 450 ° C. In addition, the time for immersing the strengthened glass plate G4 in the molten salt T2 can be arbitrarily set, for example, 0.1 to 72 hours, preferably 0.3 to 50 hours, and more preferably 0.5 to 24 hours. [0062] The molten salt T2 may be the same as the aforementioned molten salt T1. That is, the tempered glass plate G4 may be immersed again in the molten salt T1 used in the selective tempering step. In this case, since a plurality of steps can be processed by a single salt bath, the cost of manufacturing equipment can be suppressed. [0063] In addition, the molten salt T2 may be different from the molten salt T1, and the processing temperature and processing time in the overall strengthening step may be different from the processing temperature and processing time in the selective ion exchange step. For example, the processing time of the ion exchange in the overall strengthening step is preferably shorter than the processing time of the selective ion exchange step. By doing so, the depth of the second compressive stress layer CP2 of each central portion Fa1, Fb1 of each flat surface Fa, Fb is not excessive, and an increase in tensile stress can be suppressed. [0064] Through the above-mentioned overall strengthening step, a first compressive stress having a large layer depth (DOL1) is formed at the radial end portions (each peripheral edge portion Fa2, Fb2, each chamfered surface Ca, Cb, and end surface E) Layer CP1, and a strengthened glass plate G5 formed by a second compressive stress layer CP2 having a small layer depth (DOL2) is formed in the central portion (the central portions Fa1 and Fb1 of the flat surfaces Fa and Fb). A second compressive stress layer CP2 having a different area is formed on each of the main surfaces Sa and Sb of the strengthened glass plate G5 so as to correspond to the areas of the first mask Ma and the second mask Mb. That is, the formation area of the second compressive stress layer CP2 of the second flat surface Fb of the strengthened glass plate G5 becomes larger than the formation area of the second compressive stress layer CP2 of the first flat surface Fa. The layer depth (DOL1) of the first compressive stress layer CP1 is preferably 1/4 or less of the thickness of the strengthened glass plate G5. The layer depth (DOL2) of the second compressive stress layer CP2 is preferably 1/8 or less of the thickness of the strengthened glass plate G5. [0065] As described above, in the manufacturing method of the strengthened glass plate G5 of this embodiment, the raw material glass plate G1 having an asymmetric shape in the thickness direction corresponds to the asymmetric shape, and the first masks having different areas are covered. Ma and the second mask Mb are formed on each of the main surfaces Sa and Sb, so that the deformation of the glass plate (film-coated glass plate G2) during the strengthening by the ion exchange method can be made as small as possible. Specifically, in the case of the raw glass plate G1 having a small area of the first flat surface Fa and a large area of the second flat surface Fb, a first mask Ma having a small area is formed on the first flat surface Fa. The second mask Mb having a large area is formed on the second flat surface Fb, and the film-coated glass plate G2 is preferably formed. Thereby, it is possible to stably manufacture a tempered glass plate G5 having high flatness and locally high strength. [0066] In the case of this embodiment, the raw glass plate G1 has a larger area of the first flat surface Fa and the second flat surface Fb than each of the chamfered surfaces Ca and Cb, and thus is formed during ion exchange. The influence of the compressive stress layers on the chamfered surfaces Ca and Cb on the deformation of the coated glass plate G2 is much smaller than the influence of the compressive stress layers formed on the first flat surface Fa and the second flat surface Fb. Therefore, in this embodiment, the first mask Ma and the second mask having different areas are formed only in the central portions Fa1 and Fb1 of the first flat surface Fa and the second flat surface Fb among the main surfaces Sa and Sb. Mb can prevent deformation of the coated glass plate G2. [0067] In the overall strengthening step, although the strengthened glass plate G4 obtained by removing each of the masks Ma and Mb is immersed in molten salt T2 for ion exchange, the selected area is strengthened in the selective strengthening step. Therefore, the deformation system of the strengthened glass plate G4 in the overall strengthening step is extremely slight. [0068] The foregoing matters are not limited to the case of forming a disc-shaped reinforced glass plate G5 having each chamfered surface Ca, Cb, but can be applied to the case of producing a reinforced glass plate G5 of various shapes. FIG. 5 shows an example of a raw glass plate G1 and a coated glass plate G2 when a tempered glass plate G5 having no chamfered surfaces Ca and Cb is manufactured. [0069] As shown in FIG. 5A, the thickness of the end portion of the raw glass plate G1 in the radial direction is configured to be larger than the thickness of the halfway portion. This end portion is configured to have a substantially circular shape in a cross-sectional view, and its diameter is configured to be larger than the thickness of the middle portion of the raw glass plate G1. With this configuration, the raw glass plate G1 is attached to the first main surface Sa and has a convex curved surface CS connected to the first flat surface Fa. In addition, the first mask Ma of the coated glass plate G2 is formed so as to cover not only the first flat surface Fa but also a part of the curved surface CS. In addition, in this example, the area (diameter Wma) of the first mask Ma is set larger than the area (diameter Wmb) of the second mask Mb. In addition, the raw glass plate G1 shown in FIG. 5B is formed with an inclined surface IS so as to be connected to the first flat surface Fa of the first main surface Sa thereof. In this example, the first mask Ma of the coated glass plate G2 is formed not only on the first flat surface Fa, but also on a part of the inclined surface IS. [0070] Further, after the overall strengthening step, a process of further performing a refining processing step may be performed. According to the manufacturing method of the strengthened glass plate G5 of this embodiment, in the selective ion exchange step of the selective strengthening step, not only the deformation of the reinforced glass plate G3 with a film is prevented, but also the The size relationship of the area can also adjust the amount of deformation of the film-reinforced glass plate G3. Therefore, the tempered glass plate G5 that has been subjected to the entire tempering step can also be brought into a deformed state, and a refining process step can be applied to it. [0071] Hereinafter, a case where the tempered glass plate G5 is polished by the double-side polishing device PA will be described as an example of this refining processing step. As shown in FIG. 6, the double-side polishing device PA includes a star wheel CA holding a strengthened glass plate G5, an upper grinding plate SP1 that grinds the first main surface Sa of the strengthened glass plate G5, and a second grinding surface SPb Lower grinding plate SP2. The star wheel CA is provided with a holding hole CAh for holding the tempered glass plate G5 so as not to rotate. [0072] As shown in FIG. 6, the tempered glass plate G5 is deformed in a manner that it protrudes slightly above the first flat surface Fa as the upper side and the second flat surface Fb as the lower side. It fits into the holding hole CAh of the star wheel CA. In this state, the upper polishing platen SP1 is brought into contact with the first main surface Sa, and the lower polishing platen SP2 is brought into contact with the second main surface Sb. Thereafter, the upper polishing platen SP1, the lower polishing platen SP2, and the star wheel CA are relatively moved, and both sides Sa and Sb of the tempered glass plate G5 are polished. [0073] As described above, by performing double-side polishing in a state where some deformation of the tempered glass plate G5 remains, it is possible to obtain a good polished surface for each of the main surfaces Sa and Sb. For example, when the same double-side polishing is performed without deforming the strengthened glass plate G5, the second main surface Sb located on the lower side is excessively polished than the first main surface Sa due to its vertical positional relationship, so There is a possibility that the polishing amounts of the first main surface Sa on the upper side and the second main surface Sb on the lower side may become uneven. On the other hand, since the polishing amount of each of the main surfaces Sa and Sb can be averaged by polishing as described above, it is possible to perform high-precision double-sided polishing. [0074] FIG. 7 shows a second embodiment of the method for manufacturing a strengthened glass plate. In the aforementioned first embodiment, the glass plate (film-coated glass plate G2, strengthened glass plate G4) is immersed in the molten salt T1 and T2 twice by selecting the strengthening step and the overall strengthening step. In this embodiment, the system A tempered glass plate G5 is produced by one-time dipping. [0075] In this embodiment, after preparing the raw glass plate G1 as shown in FIG. 7A, as shown in FIG. 7B, a first mask Ma and a second mask Mb are formed on each of the main surfaces Sa and Sb. A film-coated glass plate G2 was obtained. Different from the first embodiment, in this embodiment, a functional film that suppresses ion penetration is used as the first mask Ma and the second mask Mb. [0076] Thereafter, as shown in FIG. 7C, the coated glass plate G2 having the respective masks Ma and Mb is immersed in the molten salt T1. Thereby, ion exchange is performed on the peripheral edges Fa2, Fb2, the chamfered surfaces Ca, Cb, and the end face E of the flat surfaces Fa, Fb not covered by the respective masks Ma, Mb, and when receiving the respective masks Ma, The Mb-covered central portions Fa1 and Fb1 are also ion-exchanged in a state where ion penetration is suppressed. As a result, a first compressive stress layer CP1 having a large layer depth (DOL1) is formed at the radial end portions (each peripheral edge portion Fa2, Fb2, each chamfered surface Ca, Cb, and end surface E), and the central portion is formed at the central portion thereof. (The central portions Fa1 and Fb1 of each of the flat surfaces Fa and Fb) are formed with a film-reinforced glass plate G3 (see FIG. 7C) with a second compressive stress layer CP2 having a small layer depth (DOL2). Thereafter, by removing the first mask Ma and the second mask Mb of the film-reinforced glass plate G3, a tempered glass plate G4 shown in FIG. 7D is obtained. [0077] The present invention is not limited to the configuration of the aforementioned embodiment, nor is it limited to the aforementioned effects. The present invention can be variously modified without departing from the gist of the present invention. [0078] In the embodiment described above, the case where the sodium ion and the potassium ion are ion-exchanged to chemically strengthen it is exemplified. However, the present invention is not limited to this, and arbitrary ions can be exchanged. For example, tempered glass plates G4 and G5 may be produced by ion exchange of lithium ions and sodium ions, or ion exchange of lithium ions and potassium ions. At this time, the tempered glass plates G4 and G5 preferably contain LiO 2 in an amount of 0.5 to 7.5% by mass%, and more preferably contain 3.0% or 4.5% LiO 2 as a composition. [0079] The stress characteristics of the strengthened glass plate can be measured using, for example, FSM-6000 manufactured by Ohara Corporation. When the depth of the compressive stress layer of aluminosilicate glass exceeds 100 μm, or when ion exchange between lithium ions and sodium ions, or ion exchange between lithium ions and potassium ions, the stress characteristics of the glass plate are strengthened. The measurement can be performed using, for example, SLP-1000 manufactured by Ohara Corporation. When a cross-section sample can be produced by cutting a strengthened glass plate or the like, it is preferable to use WPA-micro manufactured by Photonic Lattice or Abrio manufactured by Tokyo Instruments to observe the internal stress distribution and confirm the stress depth. [Examples] [0080] The present inventors took the reinforced sheet glass produced using the present manufacturing method as an example, and manufactured the sheet without using the present manufacturing method (without forming a mask on the raw glass sheet). The tempered glass was used as a comparative example, and the magnitude of the warpage (displacement in the vertical direction) in each example was obtained by calculation (simulation). Each of the tempered glass plates of Examples and Comparative Examples is a disc having a cross-sectional shape that is asymmetrical in the thickness direction. The dimensions of the tempered glass plates of the examples and comparative examples were 1 mm in thickness and 40 mm in outer diameter. In addition, the diameter of the first mask used in the examples was 30 mm, and the diameter of the second mask was 36 mm. [0081] As a result of the calculation, it was found that the warpage with respect to the example was 0.0 μm, and the warpage with the comparative example was 23.7 μm. Fig. 8 is a visualization of the operation result by gray scale. FIG. 8A shows an example, and FIG. 8B shows a comparative example. As shown in FIGS. 8A and 8B, it can be seen that the warped amount (displacement in the vertical direction) of the tempered glass sheet of the comparative example becomes larger as it goes outward in the radial direction, and the tempered glass sheet of the example has no warp at all. In addition, the tempered glass plate of the embodiment shown in FIG. 8A is shown with a solid border. This solid line is used to make the boundary of the tempered glass sheet clear and appended, and has nothing to do with the warping of the tempered glass sheet.
[0082][0082]
Ca‧‧‧第一倒角面Ca‧‧‧First chamfered surface
Cb‧‧‧第二倒角面Cb‧‧‧Second chamfered surface
Fa‧‧‧第一平坦面Fa‧‧‧First flat surface
Fb‧‧‧第二平坦面Fb‧‧‧ second flat surface
G1‧‧‧原料玻璃板G1‧‧‧ raw glass plate
G2‧‧‧附膜玻璃板G2‧‧‧ with glass
G3‧‧‧附膜強化玻璃板G3 ‧‧‧ with strengthened glass plate
G4‧‧‧強化玻璃板G4‧‧‧Tempered glass
G5‧‧‧強化玻璃板G5‧‧‧Tempered glass
Ma‧‧‧第一遮罩Ma‧‧‧First Mask
Mb‧‧‧第二遮罩Mb‧‧‧Second Mask
Sa‧‧‧第一主表面Sa‧‧‧First major surface
Sb‧‧‧第二主表面Sb‧‧‧Second major surface
T1‧‧‧熔鹽T1‧‧‧ molten salt
T2‧‧‧熔鹽T2‧‧‧ molten salt
[0028] [第1A圖]第1A圖,係表示本發明之第一實施形態之強化玻璃板的製造方法。 [第1B圖]第1B圖,係表示本發明之第一實施形態之強化玻璃板的製造方法。 [第1C圖]第1C圖,係表示本發明之第一實施形態之強化玻璃板的製造方法。 [第1D圖]第1D圖,係表示本發明之第一實施形態之強化玻璃板的製造方法。 [第1E圖]第1E圖,係表示本發明之第一實施形態之強化玻璃板的製造方法。 [第2圖]第2圖,係原料玻璃板的立體圖。 [第3圖]第3圖,係附膜玻璃板的俯視圖。 [第4圖]第4圖,係附膜玻璃板的仰視圖。 [第5A圖]第5A圖,係表示附膜玻璃板的其他例的特取部分剖面圖。 [第5B圖]第5B圖,係表示附膜玻璃板的其他例的特取部分剖面圖。 [第6圖]第6圖,係表示精製加工步驟的圖。 [第7A圖]第7A圖,係表示本發明之第二實施形態之強化玻璃板的製造方法。 [第7B圖]第7B圖,係表示本發明之第二實施形態之強化玻璃板的製造方法。 [第7C圖]第7C圖,係表示本發明之第二實施形態之強化玻璃板的製造方法。 [第7D圖]第7D圖,係表示本發明之第二實施形態之強化玻璃板的製造方法。 [第8A圖]第8A圖,係表示強化玻璃板的實施例的俯視圖。 [第8B圖]第8B圖,係表示強化玻璃板的比較例的俯視圖。 [第9A圖]第9A圖,係表示以往之強化板玻璃的製造方法。 [第9B圖]第9B圖,係表示以往之強化板玻璃的製造方法。 [第9C圖]第9C圖,係表示以往之強化板玻璃的製造方法。[0028] [FIG. 1A] FIG. 1A illustrates a method for manufacturing a strengthened glass plate according to a first embodiment of the present invention. [Fig. 1B] Fig. 1B shows a method for manufacturing a strengthened glass plate according to the first embodiment of the present invention. [FIG. 1C] FIG. 1C shows a method for manufacturing a strengthened glass plate according to the first embodiment of the present invention. [Fig. 1D] Fig. 1D shows a method for manufacturing a strengthened glass plate according to the first embodiment of the present invention. [Fig. 1E] Fig. 1E shows a method for manufacturing a strengthened glass plate according to the first embodiment of the present invention. [Fig. 2] Fig. 2 is a perspective view of a raw glass plate.第 [Fig. 3] Fig. 3 is a plan view of a film-attached glass plate.第 [Fig. 4] Fig. 4 is a bottom view of the attached glass plate. [Fig. 5A] Fig. 5A is a special cross-sectional view showing another example of a coated glass plate. [FIG. 5B] FIG. 5B is a special partial cross-sectional view showing another example of the coated glass plate.第 [FIG. 6] FIG. 6 is a view showing a refining process step. [FIG. 7A] FIG. 7A shows a method for manufacturing a strengthened glass plate according to a second embodiment of the present invention. [FIG. 7B] FIG. 7B shows a method for manufacturing a strengthened glass plate according to a second embodiment of the present invention. [FIG. 7C] FIG. 7C shows a method for manufacturing a strengthened glass plate according to a second embodiment of the present invention. [FIG. 7D] FIG. 7D shows a method for manufacturing a strengthened glass plate according to a second embodiment of the present invention. [FIG. 8A] FIG. 8A is a plan view showing an example of a tempered glass plate. [FIG. 8B] FIG. 8B is a plan view showing a comparative example of a tempered glass plate. [Fig. 9A] Fig. 9A shows a method for manufacturing a conventional tempered glass sheet. [Fig. 9B] Fig. 9B shows a method for manufacturing a conventional tempered glass sheet. [Fig. 9C] Fig. 9C shows a conventional method for manufacturing tempered glass.
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016199086 | 2016-10-07 | ||
| JP2016-199086 | 2016-10-07 |
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| TW201819333A true TW201819333A (en) | 2018-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106133057A TW201819333A (en) | 2016-10-07 | 2017-09-27 | Method for manufacturing reinforced glass plate, film-coated glass plate, and reinforced glass plate |
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| Country | Link |
|---|---|
| JP (1) | JPWO2018066314A1 (en) |
| TW (1) | TW201819333A (en) |
| WO (1) | WO2018066314A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024137251A1 (en) * | 2022-12-21 | 2024-06-27 | Akhan Semiconductor, Inc. | Glass modification process usable with cvd diamond deposition |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10899660B2 (en) | 2016-05-19 | 2021-01-26 | Apple Inc. | Asymmetric chemical strengthening |
| US11639307B2 (en) | 2018-07-13 | 2023-05-02 | Apple Inc. | Patterned asymmetric chemical strengthening |
| US11447416B2 (en) | 2018-12-20 | 2022-09-20 | Apple Inc. | Strengthened covers for electronic devices |
| US11655178B2 (en) * | 2019-06-28 | 2023-05-23 | Corning Incorporated | Methods and apparatus for manufacturing a glass-based article |
| CN114616216B (en) | 2019-08-29 | 2025-03-07 | 康宁股份有限公司 | Foldable device, foldable substrate and method for manufacturing the same |
| KR20220056860A (en) | 2019-08-29 | 2022-05-06 | 코닝 인코포레이티드 | Foldable device, ribbon, and manufacturing method thereof |
| CN118954976A (en) | 2019-10-14 | 2024-11-15 | 康宁股份有限公司 | Foldable device and manufacturing method |
| US12408282B2 (en) | 2022-01-19 | 2025-09-02 | Apple Inc. | Electronic devices having differentially strengthened cover members |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263739A (en) * | 1989-04-05 | 1990-10-26 | Seiko Epson Corp | Glass strengthening method for high temperature baked printed glass |
| US20110129648A1 (en) * | 2009-11-30 | 2011-06-02 | Yabei Gu | Glass sheet article with double-tapered asymmetric edge |
| TWI398423B (en) * | 2010-05-28 | 2013-06-11 | Wintek Corp | Method for strengthening glass and glass using the same |
| JP5926749B2 (en) * | 2011-03-16 | 2016-05-25 | アップル インコーポレイテッド | Controlled chemical strengthening of thin glass |
| JP2012193092A (en) * | 2011-03-17 | 2012-10-11 | Asahi Glass Co Ltd | Glass plate and method for producing the same |
| US10723651B2 (en) * | 2015-03-25 | 2020-07-28 | Nippon Electric Glass Co., Ltd. | Method for manufacturing reinforced glass plate, and method for manufacturing glass plate for reinforcement |
-
2017
- 2017-09-11 WO PCT/JP2017/032673 patent/WO2018066314A1/en not_active Ceased
- 2017-09-11 JP JP2018543802A patent/JPWO2018066314A1/en active Pending
- 2017-09-27 TW TW106133057A patent/TW201819333A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024137251A1 (en) * | 2022-12-21 | 2024-06-27 | Akhan Semiconductor, Inc. | Glass modification process usable with cvd diamond deposition |
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| Publication number | Publication date |
|---|---|
| WO2018066314A1 (en) | 2018-04-12 |
| JPWO2018066314A1 (en) | 2019-07-18 |
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