TW201819110A - 用於使化學機械拋光墊表面成形之裝置 - Google Patents
用於使化學機械拋光墊表面成形之裝置 Download PDFInfo
- Publication number
- TW201819110A TW201819110A TW106132145A TW106132145A TW201819110A TW 201819110 A TW201819110 A TW 201819110A TW 106132145 A TW106132145 A TW 106132145A TW 106132145 A TW106132145 A TW 106132145A TW 201819110 A TW201819110 A TW 201819110A
- Authority
- TW
- Taiwan
- Prior art keywords
- cmp polishing
- polishing layer
- pad
- platen
- cmp
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 218
- 239000000126 substance Substances 0.000 title claims abstract description 14
- 238000007493 shaping process Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000003082 abrasive agent Substances 0.000 claims abstract description 44
- 229920000642 polymer Polymers 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000001143 conditioned effect Effects 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 118
- 238000000034 method Methods 0.000 description 34
- 235000012431 wafers Nutrition 0.000 description 11
- 230000003746 surface roughness Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- XQMTUIZTZJXUFM-UHFFFAOYSA-N tetraethoxy silicate Chemical compound CCOO[Si](OOCC)(OOCC)OOCC XQMTUIZTZJXUFM-UHFFFAOYSA-N 0.000 description 4
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/279,677 | 2016-09-29 | ||
| US15/279,677 US20180085891A1 (en) | 2016-09-29 | 2016-09-29 | Apparatus for shaping the surface of chemical mechanical polishing pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201819110A true TW201819110A (zh) | 2018-06-01 |
Family
ID=61564486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106132145A TW201819110A (zh) | 2016-09-29 | 2017-09-19 | 用於使化學機械拋光墊表面成形之裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20180085891A1 (de) |
| JP (1) | JP2018058203A (de) |
| KR (1) | KR20180035697A (de) |
| CN (1) | CN107877359A (de) |
| DE (1) | DE102017008997A1 (de) |
| FR (1) | FR3056431A1 (de) |
| TW (1) | TW201819110A (de) |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3001054B1 (ja) * | 1998-06-29 | 2000-01-17 | 日本電気株式会社 | 研磨装置及び研磨パッドの表面調整方法 |
| JP2000079551A (ja) * | 1998-07-06 | 2000-03-21 | Canon Inc | コンディショニング装置及びコンディショニング方法 |
| TW383644U (en) * | 1999-03-23 | 2000-03-01 | Vanguard Int Semiconduct Corp | Dressing apparatus |
| US6302772B1 (en) * | 1999-04-01 | 2001-10-16 | Mitsubishi Materials Corporation | Apparatus and method for dressing a wafer polishing pad |
| US6350183B2 (en) * | 1999-08-10 | 2002-02-26 | International Business Machines Corporation | High pressure cleaning |
| US6857942B1 (en) * | 2000-01-11 | 2005-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for pre-conditioning a conditioning disc |
| US6969305B2 (en) * | 2000-02-07 | 2005-11-29 | Ebara Corporation | Polishing apparatus |
| DE10025173A1 (de) * | 2000-05-24 | 2001-11-29 | Swarovski Tyrolit Schleif | Verfahren zum Schleifen von insbesondere Nickel enthaltenden metallischen Werkstücken |
| US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| JP2002144218A (ja) * | 2000-11-09 | 2002-05-21 | Ebara Corp | 研磨装置 |
| US6896583B2 (en) * | 2001-02-06 | 2005-05-24 | Agere Systems, Inc. | Method and apparatus for conditioning a polishing pad |
| TWI260256B (en) | 2002-03-25 | 2006-08-21 | Thomas West Inc | Conditioner and conditioning methods for smooth pads |
| US6899612B2 (en) * | 2003-02-25 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad apparatus and methods |
| US20050178666A1 (en) * | 2004-01-13 | 2005-08-18 | Applied Materials, Inc. | Methods for fabrication of a polishing article |
| JP2007069323A (ja) * | 2005-09-08 | 2007-03-22 | Shinano Denki Seiren Kk | 定盤表面調整用砥石及び表面調整方法 |
| US20070135024A1 (en) * | 2005-12-08 | 2007-06-14 | Itsuki Kobata | Polishing pad and polishing apparatus |
| DE602008002445D1 (de) * | 2007-01-30 | 2010-10-28 | Ebara Corp | Poliervorrichtung |
| KR101916492B1 (ko) * | 2011-03-07 | 2018-11-07 | 엔테그리스, 아이엔씨. | 화학 및 기계적 평탄화 패드 컨디셔너 |
| JP5898420B2 (ja) * | 2011-06-08 | 2016-04-06 | 株式会社荏原製作所 | 研磨パッドのコンディショニング方法及び装置 |
| CN106463379B (zh) * | 2014-03-21 | 2019-08-06 | 恩特格里斯公司 | 具有细长切割边缘的化学机械平坦化垫调节器 |
| JP6328977B2 (ja) * | 2014-03-31 | 2018-05-23 | 株式会社荏原製作所 | 基板研磨装置 |
| CN105500208A (zh) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Cmp工艺抛光垫的修整装置 |
| CN106041741B (zh) * | 2016-06-21 | 2018-09-04 | 大连理工大学 | 一种含有多孔结构的cmp抛光垫修整器 |
-
2016
- 2016-09-29 US US15/279,677 patent/US20180085891A1/en not_active Abandoned
-
2017
- 2017-09-19 TW TW106132145A patent/TW201819110A/zh unknown
- 2017-09-21 CN CN201710860660.0A patent/CN107877359A/zh not_active Withdrawn
- 2017-09-26 DE DE102017008997.3A patent/DE102017008997A1/de not_active Withdrawn
- 2017-09-26 JP JP2017184624A patent/JP2018058203A/ja active Pending
- 2017-09-27 KR KR1020170125003A patent/KR20180035697A/ko not_active Withdrawn
- 2017-09-28 FR FR1759036A patent/FR3056431A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20180085891A1 (en) | 2018-03-29 |
| CN107877359A (zh) | 2018-04-06 |
| DE102017008997A1 (de) | 2018-03-29 |
| JP2018058203A (ja) | 2018-04-12 |
| FR3056431A1 (fr) | 2018-03-30 |
| KR20180035697A (ko) | 2018-04-06 |
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