TW201816565A - Touch sensing module and method for fabricating the same - Google Patents

Abstract

A method of fabricating the touch-sensing module includes providing a base material having sub-substrates, in which each of the sub-substrates includes a touch-sensing area, a peripheral area and touch sensing electrodes disposing on the touch-sensing area; forming patterned circuit sets on the peripheral area, each of the patterned circuit sets includes a first patterned circuit and a second patterned circuit, a void region being formed between an end of the first patterned circuit proximal to an end of the second patterned circuit, in which another end of the first patterned circuit is connected to one of the touch sensing electrodes, and another end of the second patterned circuit is configured to connect with control chip; subsequently, proceeding a front end fabricating process; and then, forming conductive feature on the void region of each of the patterned circuit sets, in which the conductive feature is configured to lap joint the first patterned circuit and the second patterned circuit.

Description

Touch module and manufacturing method thereof

The disclosure relates to a method for manufacturing a touch module, and more particularly to a method for manufacturing a transmission line formed on a substrate of the touch module.

For common electronic products with a touch module, in order to meet users' demand for light and thin electronic products, the manufacturing of touch modules that reduce the thickness of the touch sensing layer and the size of features formed thereon Methods are also becoming more common. However, while reducing the thickness of the touch module and reducing the thickness of the touch sensing layer and the size of the feature patterns formed thereon, the touch sensing layer is also made more fragile. More specifically, the touch-sensing layer is more sensitive to and vulnerable to current, noise, and the like. However, in the process of assembling the touch module, the front-end process will produce a large amount of electrostatic charges accumulated on the substrate with poor conductivity, and the electrostatic charges cannot be released through the interface between the substrate and the air. On the contrary, the accumulated electrostatic charges will flow to An element with better conductivity on the substrate. For example, the touch sensing layer and / or a metal circuit electrically connected to the touch sensing layer. That is, a large amount of undischarged electrostatic charges may directly enter the touch sensing layer or the interface between the touch sensing layer and the metal circuit, causing excessive current to damage the touch sensing layer. That ’s why the previous question Problems will reduce the yield of manufacturing touch modules, and increase the time and material costs required to manufacture touch modules. And this problem needs to be improved by those with ordinary knowledge in related fields to make up for the shortcomings of the existing architecture.

A technical aspect of the present invention relates to a method for manufacturing a touch module, which uses a connection circuit between a touch sensing electrode and other components (such as a control chip) during the manufacturing process of the touch module An empty area is formed above to electrically connect the touch sensing electrodes to other components. Furthermore, it is possible to reduce or avoid the electrostatic charges to be released during the previous process from entering the touch sensing electrodes through the connection circuit and damaging the touch sensing electrodes. Successively, after the end of the current process, a conductive feature is formed in the empty area, and the connection circuit is connected to conduct the electrical signals between the touch sensing electrode and other components. In this way, in addition to the normal operation of the touch module manufactured by the present invention, at the same time, it also reduces or avoids the damage of the touch sensing electrode during the manufacturing process, increasing the yield of the touch module, further Reduce manufacturing costs.

According to one or more embodiments of the present invention, a method for manufacturing a touch module is provided. A method for manufacturing a touch module includes providing a substrate, the substrate including a plurality of sub-substrates, the sub-substrates including a touch sensing area, a peripheral area, and a plurality of touch sensing electrodes disposed in the touch sensing area; A plurality of patterning circuit groups are formed in the peripheral region of the sub-substrate. The patterning circuit group includes a first patterning circuit and a second patterning circuit. The first end of the first patterning circuit is connected to one of the touch sensing electrodes. The first end of the second patterning circuit is configured to be connected to the control chip, wherein the second end of the first patterning circuit is connected to the second patterning circuit. An empty region is formed between the second ends to insulate the first patterned circuit from the second patterned circuit; successively, a previous process is performed; and a conductive feature is formed in the empty region of the patterned circuit group so that the conductive features overlap Connected between the first patterning circuit and the second patterning circuit.

In one or more embodiments of the present invention, the foregoing step of performing the preceding process includes dividing the sub-substrate from the base material to form a plurality of touch modules, respectively.

In one or more embodiments of the present invention, the step of performing the preceding process may further include bonding a plurality of flexible printed circuit boards to a plurality of touch modules, respectively, so as to connect each touch module to the control. Wafer.

In one or more embodiments of the present invention, the step of forming a conductive feature in the empty region includes printing a conductive material in the empty region; and curing the conductive material to form the conductive feature.

In one or more embodiments of the present invention, the materials of the first patterned circuit and the second patterned circuit are different from those of the conductive material.

In one or more embodiments of the present invention, the step of forming the patterned circuit group described above may further include forming a first connection region at a second end of the first patterned circuit of the patterned circuit group; The second end of the second patterning circuit of the circuit group forms a second connection region.

In one or more embodiments of the present invention, the step of forming a conductive feature in the empty region includes forming a conductive feature overlapped between the first connection region and the second connection region of the patterned circuit group.

In one or more embodiments of the present invention, the first patterning circuit and the second patterning circuit of the patterning circuit group described above are formed on opposite sides of the empty region, respectively.

In one or more embodiments of the present invention, the above-mentioned method for manufacturing a touch module may further include forming a touch sensing electrode on a substrate, wherein the touch sensing electrodes are insulated from each other on the substrate.

According to one or more embodiments of the present invention, a touch module is provided. The touch module includes a touch substrate, a plurality of touch sensing electrodes, a control chip, and a plurality of patterned circuit groups. The touch substrate has a touch sensing area and a peripheral area. The touch sensing electrodes are disposed on the touch sensing area. The patterning circuit group is disposed in a peripheral area, and the patterning circuit group is connected between the touch sensing electrode and the control chip. Each patterning circuit group includes a first patterning circuit, a second patterning circuit, and a conductive feature. The first patterning circuit is electrically connected to one of the touch sensing electrodes. The second patterning circuit is electrically connected to the control chip. The conductive features are overlapped between the first patterning circuit and the second patterning circuit to electrically connect the first patterning circuit and the second patterning circuit.

In one or more embodiments of the present invention, the touch sensing electrodes are insulated from each other on the touch substrate.

In one or more embodiments of the present invention, the touch sensing electrodes described above include a touch sensing area and a trace. The trace is connected between the touch sensing area and the first patterning circuit.

In one or more embodiments of the present invention, in the touch module described above, the first patterned circuit of each patterned circuit group on the touch substrate is The circuits are substantially insulated from each other, and the second patterned circuits of each patterned circuit group are substantially insulated from each other.

In one or more embodiments of the present invention, the materials of the first patterned circuit and the second patterned circuit described above are different from those of the conductive features.

In one or more embodiments of the present invention, the first patterning circuit and the second patterning circuit are located on two sides with different conductive characteristics.

In one or more embodiments of the present invention, the above-mentioned first patterning circuit may include a first connection region, and the second patterning circuit may include a second connection region. A conductive feature is formed over at least one of the first connection region and the second connection region.

100‧‧‧ manufacturing method of touch module

200‧‧‧ substrate

220‧‧‧ daughter board

222‧‧‧surrounding area

224‧‧‧Touch sensing area

300‧‧‧Touch Module

320‧‧‧ touch sensing electrode

322‧‧‧touch sensing area

324‧‧‧route

340‧‧‧Patternized circuit set

342‧‧‧The first patterning circuit

342A‧‧‧First end

342B‧‧‧Second End

342C‧‧‧First connection zone

344‧‧‧Second patterning circuit

344A‧‧‧First end

344B‧‧‧Second End

344C‧‧‧Second connection zone

346‧‧‧vacant area

350‧‧‧Conductive features

370‧‧‧flexible printed circuit board

380‧‧‧control chip

A-A’‧‧‧ line segment

S101 ~ S104‧‧‧step

FIG. 1 illustrates a flowchart of a method for manufacturing a touch module according to various embodiments of the present invention; and FIGS. 2 to 7 illustrate a touch module according to various embodiments of the present invention. FIG. 8 is a simplified schematic diagram of a touch module according to other embodiments of the present invention at different stages of the manufacturing method of the touch module.

FIG. 9 is a side cross-sectional view of a line segment A-A 'of the touch module according to FIG. 7. FIG.

Unless otherwise indicated, the same numbers and symbols in different drawings are usually regarded as corresponding parts. The illustrations are shown to clearly illustrate the relevant associations of the embodiments and not to illustrate the actual dimensions.

In the following, a plurality of embodiments of the present invention will be disclosed graphically. For the sake of clarity, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.

In this article, the terms first, second, third, etc. are used to describe various elements, components, regions, layers, and / or blocks that are understandable. However, these elements, components, regions, layers and / or blocks should not be limited by these terms. These terms are limited to identifying single elements, components, regions, layers, and / or blocks. Therefore, a first element, component, region, layer, and / or block in the following may also be referred to as a second element, component, region, layer, and / or block without departing from the intention of the present invention.

FIG. 1 is a flowchart of a method 100 for manufacturing a touch module according to various embodiments of the present invention. As shown in FIG. 1, the method 100 for manufacturing a touch module starts from step S101. In step S101, a substrate is provided. The substrate may include a plurality of sub-substrates. The sub-substrate includes a touch sensing area, a peripheral area, and a plurality of touch sensing electrodes disposed in the touch sensing area (see FIG. 3). Subsequently, step S102 is performed. In step S102, in the peripheral area of the sub substrate The domain forms a plurality of patterned circuit groups. In various embodiments, the patterning circuit group includes a first patterning circuit and a second patterning circuit. A first end of the first patterning circuit is configured to be connected to one of the touch sensing electrodes, and a first end of the second patterning circuit is configured to be connected to a control chip. An empty area is formed between the second end of the first patterning circuit and the second end of the second patterning circuit, so that the first patterning circuit and the second patterning circuit are insulated from each other. In other words, in step S102, an empty area is formed between two adjacent ends of the first patterning circuit and the second patterning circuit in the same patterning circuit group to insulate the first patterning circuit from the second patterning Circuit. In addition, in other embodiments, the patterning circuit group may further include a third patterning circuit electrically connected to the ground terminal.

Subsequently, step S103 of the method 100 for manufacturing a touch module is performed. In step S103, a previous process is performed. In various embodiments, the front-end process may include dividing a plurality of sub-substrates from a substrate to form a plurality of touch modules, respectively. In other embodiments, the front-end process may further include attaching a plurality of flexible printed circuit boards to a plurality of touch modules to connect each touch module to a control chip. Subsequently, step S104 is performed. In step S104, a conductive feature is formed in the empty area, and the conductive feature is overlapped between the first patterned circuit and the second patterned circuit in the patterned circuit group.

In the cutting substrate and flexible printed circuit board manufacturing processes in the previous stage, it is easy to manufacture and accumulate a large amount of electrostatic charges to be discharged on the sub-substrate. A large amount of electrostatic charges cannot pass from the second patterned circuit to the less conductive. The empty area enters the first patterning circuit connected to the touch sensing electrode. Therefore, it is possible to prevent the accumulated electrostatic charge from causing an excessive current to the touch sensing electrode, thereby damaging the touch sensing electrode or the interface between the touch sensing electrode and the first patterning circuit. Wait. Therefore, the manufacturing method 100 of the touch module can reduce or avoid damage caused by the passage of electrostatic charges through the finer structures at the interface between the touch sensing electrode and the first patterning circuit or in the touch sensing electrode. Furthermore, the yield of the touch module manufactured by the touch module manufacturing method 100 can be improved, and the manufacturing cost can be reduced.

In addition, after the end of the current process, conductive features are subsequently formed in the empty area. The conductive pattern is overlapped between the first patterned circuit and the second patterned circuit, so that the touch sensing electrode can pass through the first patterned circuit and the second patterned circuit or other components connected to the second patterned circuit. (Such as a control chip) and other electrical connections. In this way, the touch module can work normally.

FIG. 2 to FIG. 7 are simple schematic diagrams of the touch module 300 at different stages of the touch module manufacturing method 100 according to various embodiments of the present invention. As shown in FIG. 2, the substrate 200 is provided. In various embodiments, the substrate 200 includes a sub-substrate 220. The sub-substrate 220 includes a touch sensing area 224 and a peripheral area 222. Referring to FIG. 2 and FIG. 3, the method 100 for manufacturing a touch module further includes forming a touch sensing electrode 320 on the touch sensing area 224 of the sub-substrate 220 of the substrate 200. In various embodiments, the touch sensing electrodes 320 of the touch module 300 are formed in a single touch sensing layer. In other words, the stacked structure of the touch module 300 is a sub-substrate 220 and a single-layer touch sensing layer, but it is not limited thereto. In other embodiments, the touch module 300 may also have a plurality of touch sensing layers.

As shown in FIG. 3, the touch sensing electrode 320 includes a touch sensing area 322 and a trace 324. The trace 324 is configured to be connected between the touch sensing area 322 and the first patterning circuit 342 (see FIG. 4). In various embodiments, touch The sensing area 322 may further include a suitable touch sensing pattern configured to generate a corresponding electrical change according to the position touched by the user. Those skilled in the art can select the type of the touch sensing pattern according to actual needs. state. In various embodiments, the touch sensing electrodes 320 are insulated from each other on the sub-substrate 220 so that the touch module 300 can better sense the position touched by the user. More specifically, the touch sensing area 322 and the trace 324 of a single touch sensing electrode 320 are electrically connected to each other, and between different touch sensing electrodes 320, the touch sensing area 322 and the trace are electrically connected to each other. 324 are insulated from each other.

Referring to FIG. 4, in a plurality of embodiments, a plurality of patterned circuit groups 340 are formed in the peripheral region 222 of the sub substrate 220. In various embodiments, the patterning circuit group 340 may include a first patterning circuit 342 and a second patterning circuit 344. A first terminal 342A of the first patterning circuit 342 is connected to one of the touch sensing electrodes 320. The first end 344A of the second patterning circuit 344 is configured to be connected to the control chip 380 (see FIG. 7). Wherein, the patterning circuit group 340 further includes a vacant region 346 formed between the second end 342B of the first patterning circuit 342 and the second end 344B of the second patterning circuit 344 so that the first patterning circuit 342 and The second patterning circuits 344 are maintained in an insulated state. In various embodiments, the first patterning circuit 342 and the second patterning circuit 344 may be formed on opposite sides of the empty region 346, respectively. In addition, in other embodiments, the patterning circuit group 340 may be formed first, and then the touch sensing electrodes 320 are formed, and the touch sensing electrodes 320 are electrically connected to the first patterning circuit 342, but Not limited to this.

In various embodiments, forming the patterned circuit group 340 may further include forming a first connection region at the second end 342B of the first patterned circuit 342. 342C; and forming a second connection region 344C at the second end 344B of the second patterning circuit 344 to increase the connection area between the first patterning circuit 342 and the second patterning circuit 344.

Referring to FIG. 5, in various embodiments, the sub-substrate 220 is divided from the base material 200 to form touch modules 300 respectively. In various embodiments, the substrate 200 may be cut by a computerized numerically controlled cutting machine (CNC) or other suitable cutting methods.

In the touch module 300, in order to allow the touch sensing areas 322 and the traces 324 between different touch sensing electrodes 320 in a single touch sensing layer to be insulated from each other, the touch module The minimum line width of the group 300 needs to be reduced in size, and relatively, the sensitivity of the touch sensing electrodes 320 to current is also improved. For example, in various embodiments, the minimum line width of the touch sensing electrode 320 is less than 400 μm. Furthermore, in some embodiments, the minimum line width of the touch sensing electrode 320 may be 70 μm. Therefore, by forming the empty area 346 between the first patterning circuit 342 and the second patterning circuit 344, the electrostatic charges accumulated by cutting the substrate 200 or other subsequent previous processes can be reduced or avoided through the second patterning. The circuit 344 enters the touch sensing electrode 320 and causes damage.

Referring to FIG. 6, successively, in various embodiments, a conductive feature 350 is formed in the empty region 346. The conductive feature 350 is overlapped between the first patterning circuit 342 and the second patterning circuit 344 in the patterning circuit group 340. In other embodiments, the formed conductive feature 350 may be further overlapped between the first connection region 342C and the second connection region 344C of the patterned circuit group 340 to increase the conductive feature 350 and the first patterned circuit. The contact area between 342 and the second patterning circuit 344 increases the conductivity of the patterning circuit group 340.

In various embodiments, a conductive material may be printed in the empty area 346 first; then, the conductive material is cured to form the conductive feature 350, but is not limited thereto. In other embodiments, a conductive material may be printed on the first connection region 342C and the second connection region 344C. In various embodiments, the conductive material forming the conductive features 350 may be different from the materials of the first patterning circuit 342 and the second patterning circuit 344. For example, the conductive material may be silver, a silver alloy, or other suitable conductive materials. For example, the material of the first patterning circuit 342 and the second patterning circuit 344 may be copper, a copper alloy, or other suitable conductive materials.

Referring to FIG. 7, successively, in various embodiments, the control chip 380 can be electrically connected to the second patterning circuit 344 through the flexible printed circuit board 370, so that the control chip 380 can communicate with the patterning circuit group 340 and The touch-sensing electrodes 320 are electrically connected, and the touch-sensing electrodes 320 are driven thereby, so that the touch-sensing module 300 can operate normally. It should be understood that the method for connecting the control chip 380 and the second patterning circuit 344 through the flexible printed circuit board 370 described here is merely an example, and is not intended to limit the aspect of the present invention. In other embodiments, other conductive elements for electrical connection may be further connected between the control chip 380 and the second patterning circuit 344. For example, a suitable connection element such as an anisotropic conductive film (ACF).

FIG. 8 is a simple schematic diagram of the touch module 300 according to another embodiment of the present invention at different stages of the method of manufacturing the touch module. Referring to FIG. 7 and FIG. 8 at the same time, in other embodiments, the control chip 380 may be connected to the touch mode through the flexible printed circuit board 370 first. The second patterning circuit 344 of the group 300; successively, a conductive feature 350 is formed in the empty area 346 to connect the control chip 380 to the touch sensing electrode 320 through the patterning circuit group 340. In this way, the manufacturing process of manufacturing the touch module 300 can further prevent the electrostatic charge generated when the flexible printed circuit board 370 is connected from entering the touch sensing electrode 320. Furthermore, damage to the touch sensing electrodes 320 can be reduced or avoided.

FIG. 9 is a side cross-sectional view of the line module A-A 'of the touch module 300 shown in FIG. 7. As shown in FIG. 9, in various embodiments, the conductive feature 350 is formed in the empty region 346 between the first patterning circuit 342 and the second patterning circuit 344. In other embodiments, the conductive feature 350 may be further formed on the first connection region 342C and / or the second connection region 344C, and overlap the first patterning circuit 342 and the second patterning circuit 344.

Referring to FIG. 7, the touch module 300 may include a touch substrate (the sub substrate 220 may be regarded as a touch substrate), a plurality of touch sensing electrodes 320, a control chip 380, and a plurality of patterned circuit groups 340. The touch substrate has a touch sensing area 224 and a peripheral area 222. The touch sensing electrodes 320 are disposed on the touch sensing area 224. The patterning circuit group 340 is disposed in the peripheral region 222, and the patterning circuit group 340 is connected between the touch sensing electrode 320 and the control chip 380. The patterning circuit group 340 includes at least a first patterning circuit 342, a second patterning circuit 344, and a conductive feature 350. The first patterning circuit 342 is electrically connected to one of the touch sensing electrodes 320. The second patterning circuit 344 is electrically connected to the control chip 380. The conductive feature 350 is overlapped between the first patterning circuit 342 and the second patterning circuit 344 to electrically connect the first patterning circuit 342 and the second patterning circuit 344.

In summary, the present invention provides a method for manufacturing a touch module, including providing a substrate, the substrate including a plurality of sub-substrates, the sub-substrates including a touch sensing area, a peripheral area, and a plurality of the touch sensing areas. Touch sensing electrodes; successively, a patterned circuit group is formed in the peripheral region of the sub-substrate, the patterned circuit group includes a first patterned circuit and a second patterned circuit, and the first end of the first patterned circuit is connected to One of the touch sensing electrodes, the first end of the second patterning circuit is configured to be connected to the control chip, and a gap is formed between the second end of the first patterning circuit and the second end of the second patterning circuit. To insulate the first patterned circuit and the second patterned circuit; successively, perform a previous process; and form conductive features in the empty area of the patterned circuit group, and the conductive features overlap between the first patterned circuit and the first Between two patterned circuits. In the manufacturing process of the touch module, an empty area is first formed on the connection circuit between the touch sensing electrode and other components (such as a control chip), and the electrical connection between the touch sensing electrode and other components is insulated. Furthermore, it is possible to reduce or avoid the electrostatic charge accumulated in the previous process from entering the touch sensing electrode through the connection circuit and damaging the touch sensing electrode. Successively, after the end of the current process, conductive features are formed in the empty area, and the touch sensing electrodes and other components are connected to conduct electrical signals. In this way, in addition to the normal operation of the touch module manufactured by the present invention, at the same time, it also reduces or avoids damage to the touch sensing electrodes during the manufacturing process, increases the yield of the touch module, and further reduces manufacturing. cost.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the attached patent application.

Claims (16)

A method for manufacturing a touch module includes: providing a substrate including a plurality of sub-substrates, wherein each of the sub-substrates includes a touch-sensing area, a peripheral area, and a plurality of the touch-sensing areas; Touch sensing electrodes; forming a plurality of patterned circuit groups in the peripheral area of each of the sub-substrates, wherein each of the patterned circuit groups includes a first patterned circuit and a second patterned circuit, A first end of the first patterning circuit is connected to one of the touch sensing electrodes, a first end of the second patterning circuit is configured to be connected to a control chip, wherein the first patterning circuit is An empty area is formed between a second end of the second patterned circuit and a second end of the second patterned circuit to insulate the first patterned circuit and the second patterned circuit; perform a previous process; and in each of the A conductive feature is formed in the empty area of the patterned circuit groups, and the conductive feature is overlapped between the first patterned circuit and the second patterned circuit. The method for manufacturing a touch module according to item 1 of the scope of the patent application, wherein the step of performing the preceding process includes: dividing the sub-substrates from the substrate to form a plurality of touch modules, respectively. The method for manufacturing a touch module according to item 2 of the scope of patent application, wherein the step of performing the preceding process further includes: A plurality of flexible printed circuit boards are respectively attached to the touch modules to connect each of the touch modules to the control chip. The method of manufacturing a touch module according to item 1 of the scope of patent application, wherein the step of forming the conductive feature in each of the empty regions includes: printing a conductive material in each of the empty regions; and The conductive material is cured to form the conductive feature. The method for manufacturing a touch module according to item 4 of the scope of patent application, wherein the materials of the first patterned circuit and the second patterned circuit are different from those of the conductive material. The method of manufacturing a touch module according to item 1 of the scope of patent application, wherein the step of forming the patterned circuit groups further comprises: the first patterned circuit of each of the patterned circuit groups. A second connection region is formed on the second end; and a second connection region is formed on the second end of the second patterned circuit of each of the patterned circuit groups. The method for manufacturing a touch module according to item 6 of the scope of patent application, wherein the step of forming the conductive features in each of the empty regions includes forming the conductive features to overlap each of the patterned circuits. Between the first connection area and the second connection area of the group. The method for manufacturing a touch module according to item 1 of the scope of patent application, wherein the first patterned circuit and the second patterned circuit of each of the patterned circuit groups are respectively formed in two opposite areas of the empty area. side. The method for manufacturing a touch module according to item 1 of the patent application scope further comprises: forming the touch sensing electrodes on the substrate, wherein the touch sensing electrodes are insulated from each other on the substrate . A touch module includes: a touch substrate having a touch sensing area and a peripheral area; a plurality of touch sensing electrodes disposed on the touch sensing area; a control chip; and a plurality of The patterned circuit groups are disposed in the peripheral area, and the patterned circuit groups are connected between the touch sensing electrodes and the control chip, wherein each of the patterned circuit groups includes: a first patterned A circuit that is electrically connected to one of the touch sensing electrodes; a second patterning circuit that is electrically connected to the control chip; and a conductive feature that is overlapped between the first patterning circuit and the second The patterning circuits are electrically connected to the first patterning circuit and the second patterning circuit. The touch module according to item 10 of the application, wherein the touch sensing electrodes on the touch substrate are insulated from each other. According to the touch module described in item 10 of the application, each of the touch sensing electrodes includes: a touch sensing area; and a wiring connected between the touch sensing area and the first touch sensing area. A patterned circuit. The touch module according to item 10 of the scope of patent application, wherein the first patterned circuits of each of the patterned circuit groups on the touch substrate are substantially insulated from each other, and each of the patterned circuits The second patterned circuits of the circuit group are substantially insulated from each other. The touch module according to item 10 of the application, wherein a material of the first patterned circuit and a second patterned circuit are different from a material of the conductive feature. The touch module according to item 10 of the application, wherein the first patterning circuit and the second patterning circuit are located on two sides of the conductive features with different characteristics. The touch module according to item 10 of the application, wherein the first patterned circuit includes a first connection area, and the second patterned circuit includes a second connection area, and the conductive feature is formed on the first A connection region and at least one of the second connection regions is above.