TW201816445A - 具有對準模組的光學收發器 - Google Patents
具有對準模組的光學收發器 Download PDFInfo
- Publication number
- TW201816445A TW201816445A TW106136903A TW106136903A TW201816445A TW 201816445 A TW201816445 A TW 201816445A TW 106136903 A TW106136903 A TW 106136903A TW 106136903 A TW106136903 A TW 106136903A TW 201816445 A TW201816445 A TW 201816445A
- Authority
- TW
- Taiwan
- Prior art keywords
- alignment
- optical
- waveguide
- integrated circuit
- holder
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 385
- 239000013307 optical fiber Substances 0.000 claims abstract description 146
- 239000000835 fiber Substances 0.000 claims description 183
- 239000000758 substrate Substances 0.000 claims description 133
- 238000000034 method Methods 0.000 claims description 38
- 230000005540 biological transmission Effects 0.000 claims description 24
- 238000005253 cladding Methods 0.000 claims description 24
- 238000004891 communication Methods 0.000 claims description 24
- 230000000007 visual effect Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 description 28
- 238000010168 coupling process Methods 0.000 description 28
- 238000005859 coupling reaction Methods 0.000 description 28
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000001568 sexual effect Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- BIXHRBFZLLFBFL-UHFFFAOYSA-N germanium nitride Chemical compound N#[Ge]N([Ge]#N)[Ge]#N BIXHRBFZLLFBFL-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662413161P | 2016-10-26 | 2016-10-26 | |
| US62/413,161 | 2016-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201816445A true TW201816445A (zh) | 2018-05-01 |
Family
ID=62025458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106136903A TW201816445A (zh) | 2016-10-26 | 2017-10-26 | 具有對準模組的光學收發器 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201816445A (fr) |
| WO (1) | WO2018081340A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI827817B (zh) * | 2019-03-20 | 2024-01-01 | 美商Ｐｐｃ寬頻股份有限公司 | 資訊和通訊系統封閉件 |
| TWI830793B (zh) * | 2018-12-11 | 2024-02-01 | 美商波音公司 | 航空電子可插拔主動光學連接器 |
| TWI848118B (zh) * | 2019-06-05 | 2024-07-11 | 美商太谷康奈特提威提公司 | 具光學模組之電子組件 |
| TWI878813B (zh) * | 2022-09-14 | 2025-04-01 | 台灣積體電路製造股份有限公司 | 光學引擎之封裝體及其形成方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11009727B2 (en) | 2018-11-13 | 2021-05-18 | International Business Machines Corporation | Integrated waveguide structure with pockels layer having a selected crystal orientation |
| WO2020187034A1 (fr) * | 2019-03-18 | 2020-09-24 | 佑胜光电股份有限公司 | Module émetteur-récepteur optique et module de câble à fibre optique |
| CN112055485B (zh) * | 2019-06-05 | 2024-06-07 | 泰连公司 | 具有光学模块的电子组件 |
| EP4587876A1 (fr) * | 2022-09-14 | 2025-07-23 | SENKO Advanced Components, Inc. | Module de connecteur optique configurable |
| CN115993689A (zh) * | 2022-12-28 | 2023-04-21 | 讯芸电子科技(中山)有限公司 | 光电收发器件及光模块 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6866426B1 (en) * | 2000-04-07 | 2005-03-15 | Shipley Company, L.L.C. | Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts |
| WO2011044090A2 (fr) * | 2009-10-09 | 2011-04-14 | Corning Incorporated | Composants, sous-assemblages et assemblages de câbles optiques actifs à photonique intégrée sur silicium |
| US20130230274A1 (en) * | 2012-03-05 | 2013-09-05 | Gregory Alan Fish | Photonic flexible interconnect |
| US9529154B2 (en) * | 2014-03-21 | 2016-12-27 | Imec Vzw | Method for optical coupling between a photonic integrated circuit and an external optical element |
| EP3213133B1 (fr) * | 2014-10-27 | 2019-12-25 | Elenion Technologies, LLC | Interface photonique pour circuit électronique |
-
2017
- 2017-10-26 TW TW106136903A patent/TW201816445A/zh unknown
- 2017-10-26 WO PCT/US2017/058402 patent/WO2018081340A1/fr not_active Ceased
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI830793B (zh) * | 2018-12-11 | 2024-02-01 | 美商波音公司 | 航空電子可插拔主動光學連接器 |
| TWI827817B (zh) * | 2019-03-20 | 2024-01-01 | 美商Ｐｐｃ寬頻股份有限公司 | 資訊和通訊系統封閉件 |
| US12204159B2 (en) | 2019-03-20 | 2025-01-21 | Ppc Broadband, Inc. | Information and communication system closure |
| TWI848118B (zh) * | 2019-06-05 | 2024-07-11 | 美商太谷康奈特提威提公司 | 具光學模組之電子組件 |
| TWI878813B (zh) * | 2022-09-14 | 2025-04-01 | 台灣積體電路製造股份有限公司 | 光學引擎之封裝體及其形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018081340A1 (fr) | 2018-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201816445A (zh) | 具有對準模組的光學收發器 | |
| US11782225B2 (en) | Multi-fiber interface apparatus for photonic integrated circuit | |
| US11275225B2 (en) | Method and system for an optical coupler for silicon photonics devices | |
| US10466433B2 (en) | Optical module including silicon photonics chip and coupler chip | |
| US12379555B2 (en) | Detachable connector for co-packaged optics | |
| CN111566532B (zh) | 用于单模电光模块的表面安装封装 | |
| US8412052B2 (en) | Surface mount (SMT) connector for VCSEL and photodiode arrays | |
| TWI675229B (zh) | 包含矽光晶片和耦合器晶片的光學模組 | |
| CN108885321A (zh) | 光收发器 | |
| WO2018213042A1 (fr) | Module d'interconnexion optique à base de fpc sur interposeur en verre | |
| US10012809B2 (en) | Printed circuit board assembly with a photonic integrated circuit for an electro-optical interface | |
| US20060251360A1 (en) | Flip-chip mountable optical connector for chip-to-chip optical interconnectability | |
| US11415761B2 (en) | Optical fiber guide component, optical connection structure and method for producing same | |
| US9036955B2 (en) | Optical interposer | |
| CN107003487A (zh) | 光模块 | |
| Bundalo et al. | PIXAPP photonics packaging pilot line–development of a silicon photonic optical transceiver with pluggable fiber connectivity | |
| TW201937223A (zh) | 混合光纖整合式ｓｏｉ／ｉｉｉ-ｖ模組 | |
| CN113589447B (zh) | 光电系统以及组装光电系统的方法 | |
| US9651749B1 (en) | Interposer with opaque substrate | |
| TWI485455B (zh) | 光電混合連接器 | |
| US12474529B2 (en) | Interposer | |
| EP4682603A1 (fr) | Puce optique, appareil de conversion photoélectrique, puce optique co-encapsulée et dispositif de communication optique | |
| WO2024198913A1 (fr) | Puce optique, procédé d'encapsulation pour puce optique et dispositif associé | |
| Lee et al. | Optoelectronic packaging for optical interconnects | |
| KR100937246B1 (ko) | 광학벤치를 이용한 수동정렬형 광부모듈 및 그 제조방법 |