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TW201815567A - Reflective electrode and aluminum alloy sputtering target - Google Patents

Reflective electrode and aluminum alloy sputtering target Download PDF

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TW201815567A
TW201815567A TW106128892A TW106128892A TW201815567A TW 201815567 A TW201815567 A TW 201815567A TW 106128892 A TW106128892 A TW 106128892A TW 106128892 A TW106128892 A TW 106128892A TW 201815567 A TW201815567 A TW 201815567A
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reflective electrode
film
reflective
atomic
aluminum alloy
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TWI650230B (en
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田內裕基
日野綾
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日商神戶製鋼所股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • H10K59/80518Reflective anodes, e.g. ITO combined with thick metallic layers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023Alloys based on aluminium
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本發明之目的係提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。本發明係一種由鋁(Al)合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%。An object of the present invention is to provide a reflective electrode having an organic electroluminescence (EL) display device, an organic electroluminescence lighting, and the like, which can sufficiently reduce its driving voltage and has a high reflectance. The present invention is a reflective electrode composed of a reflective film composed of an aluminum (Al) alloy and a transparent conductive film, characterized in that the main surface of the reflective film is in contact with the main surface of the transparent conductive film, and the aluminum alloy is The ratio contains 3 to 12 atomic% of zinc (Zn) and 0.01 to 0.5 atomic% of rare earth elements.

Description

反射電極及鋁合金濺鍍靶Reflective electrode and aluminum alloy sputtering target

[0001] 本發明係有關用於有機電致發光(EL)顯示裝置或有機電致發光照明等元件之反射電極及供在該反射電極形成反射膜用之鋁(Al)合金濺鍍靶。[0001] The present invention relates to a reflective electrode for an organic electroluminescence (EL) display device or an organic electroluminescence lighting element, and an aluminum (Al) alloy sputtering target for forming a reflective film on the reflective electrode.

[0002] 有機電致發光(EL)顯示裝置或有機電致發光照明,係利用有機材料的電場發光現象之裝置,對該等謀求以提升元件的光取出效率來減低消耗電力。   [0003] 在從與基板相反方向取出光之頂放射型有機電致發光顯示裝置等之元件,係在反射電極上層積有機材料。為了使以有機材料發生的光於基板側反射,提高取出效率,而在反射電極適於使用光反射率高的材料,作為構成該反射電極之反射膜,可以使用於可見光波長領域反射率高的銀(Ag)或鋁(Al)。此外,反射膜,由於有作為電極之角色、或兼任一部分配線之場合,所以也同時謀求低的電性電阻率。   [0004] 銀係金屬之中具有最高反射率者,但為貴金屬即材料價格高。於是,鋁係次於銀的反射率高的金屬,適合作為反射膜材料。但是,利用鋁作為反射膜之場合,該反射膜會因為該透明導電膜中的氧而被氧化,在反射膜的表面不可避免地形成鋁氧化膜。由於鋁氧化膜的存在,在上述頂放射型有機電致發光顯示裝置等的元件,相較於把銀用在反射膜之元件,前者的驅動電壓較高。   [0005] 於是,在專利文獻1,提出在鋁反射膜與透明導電膜之間,介在由鎢或鉬所構成的金屬膜,利用該金屬膜來防止因透明導電膜中的氧造成的鋁反射膜氧化。 [先前技術文獻] [專利文獻]   [0006] [專利文獻1] 日本特開2012-110904號公報[0002] Organic electroluminescence (EL) display devices or organic electroluminescence lighting are devices that utilize the electric field emission phenomenon of organic materials, and seek to reduce the power consumption by improving the light extraction efficiency of the elements. [0003] In a device such as a top emission organic electroluminescence display device that takes out light from the opposite direction to the substrate, an organic material is laminated on the reflective electrode. In order to reflect the light generated by the organic material on the substrate side and improve the extraction efficiency, a material with high light reflectivity is suitable for the reflective electrode. As a reflective film constituting the reflective electrode, it can be used in a high reflectance range in the visible light wavelength range. Silver (Ag) or aluminum (Al). In addition, since the reflective film may serve as an electrode or may be used as a part of wiring, it is also required to have a low electrical resistivity. [0004] Among silver-based metals, those having the highest reflectivity are precious metals, that is, the materials are expensive. Therefore, an aluminum-based metal having a higher reflectance than silver is suitable as a reflective film material. However, when aluminum is used as the reflective film, the reflective film is oxidized by oxygen in the transparent conductive film, and an aluminum oxide film is inevitably formed on the surface of the reflective film. Due to the existence of the aluminum oxide film, the driving voltage of the former element is higher than that of the element using silver as the reflective film in the top emission organic electroluminescence display device. [0005] Therefore, in Patent Document 1, it is proposed that a metal film made of tungsten or molybdenum be interposed between an aluminum reflective film and a transparent conductive film, and the metal film be used to prevent aluminum reflection due to oxygen in the transparent conductive film. Film oxidation. [Prior Art Document] [Patent Document] [0006] [Patent Document 1] Japanese Patent Laid-Open No. 2012-110904

[發明所欲解決之課題]   [0007] 然而,在專利文獻1記載之方法,在鋁(Al)反射膜與透明導電膜之間,由於介在電阻率高的鎢膜或鉬膜,並無法充分減低元件全體的驅動電壓。   本發明之目的係提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。 [供解決課題之手段]   [0008] 本案發明人等為解決上述課題進行了銳意檢討。結果發現,藉由將反射膜作成在鋁(Al)添加鋅(Zn)及稀土族元素之鋁合金,可以一面維持作為反射電極・配線所謀求的高反射率及低電性電阻率,一面減低有機電致發光(EL)發光元件的驅動電壓。   [0009] 亦即,本發明係有關一種由鋁合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%。   [0010] 根據本發明,構成反射電極的反射膜之鋁合金是依指定的比例包含鋅。該鋅,係偏在反射膜的表面,使在反射膜的表面被形成的鋁氧化膜的緻密性降低而劣化其絕緣性。從而,在將該反射電極用於有機電致發光顯示裝置或有機電致發光照明等的元件之場合,可以減低該元件的驅動電壓。   [0011] 此外,從前的鋁反射膜,其表面平滑性低,因而降低該反射膜的反射率。此外,在以上述方式包含鋅時可以減低驅動電壓,另一方面,因表面平滑性降低而使反射率下降。再者,在使用包含鋁反射膜的反射電極來形成元件之場合,則有有機層的膜厚不均一、導致具有包含鋁反射膜的反射電極之元件短路之疑慮。   [0012] 然而,在本發明,由於構成反射膜的鋁合金是依指定的比例包含稀土族元素,即使含有鋅,也能提升該反射膜的表面平滑性。從而,可以抑制上述之類的、反射膜反射率的降低。此外,有機層的平滑化,進而基於此可以抑制元件的短路。   又,在本發明之一態樣,鋁合金所包含之稀土族元素,可以是從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素。   [0013] 在本發明之一態樣,鋁合金,係含有鎳(Ni)及銅(Cu)之至少1種合計0.05~5.0原子%。鎳及銅,係在提升反射電極的反射率時的熱處理,可以抑制或結晶粒增大、或生成副生成物之化合物。從而,可以抑制鋁合金,亦即該鋁合金構成的反射膜,進而反射電極之、在熱處理後的電阻率降低,可以抑制具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。   [0014] 本發明之構成反射電極之反射膜,係能以任意方法來形成,例如可以使用同組成的鋁合金濺鍍靶,並利用濺鍍法來形成。   [0015] 又,顯示數值範圍之「~」,係於包含以在其前後所記載之數值作為下限值及上限值之意味下使用,並不以特定段規定為限,在本案說明書,「~」的使用具有同樣的意味。 [發明之效果]   [0016] 上述,根據本發明,可以提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。[Problems to be Solved by the Invention] 000 [0007] However, in the method described in Patent Document 1, a tungsten film or a molybdenum film having a high resistivity is not sufficiently interposed between an aluminum (Al) reflective film and a transparent conductive film. Reduce the driving voltage of the entire device.目的 An object of the present invention is to provide a reflective electrode having an organic electroluminescence (EL) display device or an organic electroluminescence device, which can sufficiently reduce its driving voltage and has a high reflectance. [Means for Solving Problems] [0008] The inventors of this case conducted an intensive review in order to solve the above problems. As a result, it was found that by forming the reflective film as an aluminum alloy containing aluminum (Al) and zinc (Zn) and a rare earth element, the high reflectance and low electrical resistivity required as a reflective electrode and wiring can be maintained while being reduced. Driving voltage of an organic electroluminescence (EL) light emitting element. [0009] That is, the present invention relates to a reflective electrode composed of a reflective film composed of an aluminum alloy and a transparent conductive film, characterized in that the main surface of the reflective film is in contact with the main surface of the transparent conductive film, and The aforementioned aluminum alloy-based proportion contains 3 to 12 atomic percent of zinc (Zn) and 0.01 to 0.5 atomic percent of rare earth elements. [0010] According to the present invention, the aluminum alloy of the reflective film constituting the reflective electrode contains zinc in a specified ratio. This zinc is biased on the surface of the reflective film, and reduces the density of the aluminum oxide film formed on the surface of the reflective film, thereby deteriorating its insulation. Therefore, when the reflective electrode is used for an element such as an organic electroluminescence display device or an organic electroluminescence lighting, the driving voltage of the element can be reduced. [0011] In addition, the conventional aluminum reflective film has low surface smoothness, and thus reduces the reflectance of the reflective film. In addition, when zinc is contained in the above-mentioned manner, the driving voltage can be reduced, and on the other hand, the reflectance is reduced due to the decrease in surface smoothness. When a reflective electrode including an aluminum reflective film is used to form an element, there is a concern that the thickness of the organic layer is not uniform, which may cause a short circuit in an element including the reflective electrode including an aluminum reflective film. [0012] However, in the present invention, since the aluminum alloy constituting the reflective film contains a rare earth element in a specified ratio, even if zinc is contained, the surface smoothness of the reflective film can be improved. Accordingly, it is possible to suppress the above-described decrease in the reflectance of the reflective film. In addition, smoothing of the organic layer can further suppress short-circuiting of the element based on this. In one aspect of the present invention, the rare earth element contained in the aluminum alloy may be at least 1 selected from the group consisting of neodymium (Nd), lanthanum (La), cerium (Ce), and yttrium (Y). Kind of element. [0013] In one aspect of the present invention, the aluminum alloy contains at least one of nickel (Ni) and copper (Cu) in a total amount of 0.05 to 5.0 atomic%. Nickel and copper are heat treatments that increase the reflectivity of the reflective electrode, and can suppress or increase the size of crystal grains or compounds that form by-products. Therefore, it is possible to suppress the aluminum alloy, that is, the reflective film made of the aluminum alloy, and further reduce the resistivity of the reflective electrode after heat treatment, and to suppress the organic electroluminescence display device or organic electroluminescence lighting having the reflective electrode. The driving voltage of the components increases. [0014] The reflective film constituting the reflective electrode of the present invention can be formed by any method, for example, an aluminum alloy sputtering target of the same composition can be used and formed by a sputtering method. [0015] In addition, "~", which displays a numerical range, is used for the purpose of including the numerical value recorded before and after as a lower limit value and an upper limit value, and is not limited to a specific paragraph. In this specification, The use of "~" has the same meaning. [Effects of the Invention] [0016] As described above, according to the present invention, it is possible to provide a reflective electrode having high reflectance in an organic electroluminescence (EL) display device or an organic electroluminescence device, which can sufficiently reduce its driving voltage. .

[0017] 以下,詳細說明本發明之實施型態。又,於下述,「原子%」與「at原子%」為同義。   [0018] <反射膜> (鋅(Zn)量)   構成反射電極的反射膜之鋁合金,係於3原子%以上12原子%以下之範圍包含鋅。在未滿3原子%,與氧化銦錫(ITO)等透明導電膜之電性接續的改善效果並不充分,具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等之元件的驅動電壓沒有改善效果。在超過12原子%,會造成反射率降低,再者鋁合金的電阻率增大,結果,導致反射膜、亦即反射電極的電阻率增大,使具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件的驅動電壓升高。   [0019] 又,鋅量於超過12原子%之範圍會使元件的驅動電壓升高之原因並不明確,認為是鋅的濃化太大,會增加氧化膜的膜厚等而增加障壁之緣故。鋅量,最好為4原子%以上、且最好是11原子%以下。   [0020] 此外,如上述,構成反射電極的反射膜之鋁合金藉由依上述比例包含鋅來減低元件的驅動電壓,係由於鋅偏在反射膜的表面,使形成在反射膜表面的鋁氧化膜的緻密性降低、劣化其絕緣性,而改善與透明導電膜的電性接續之緣故。   [0021] (稀土族元素)   構成反射電極的反射膜之鋁合金,係於合計0.01原子%以上0.5原子%以下之範圍含有稀土族元素。利用鋅的添加,例如在100nm以上的高膜厚成膜之場合有表面龜裂變大之傾向,而藉由利用稀土族元素的添加來抑制成膜中的結晶粒增加、微細化薄膜的組織,而改善膜表面的平滑性。此外,抑制因熱處理造成的結晶成長,即使在熱處理後也有維持高平滑性之效果。從而,藉由於上述範圍含有稀土族元素,可以充分高地保持反射膜、亦即反射電極的反射率,而且,在使用反射膜來形成元件等之場合,可以迴避元件的短路。   [0022] 稀土族元素的含有量合計,最好為0.05原子%以上、且最好是0.3原子%以下。此外,添加元素之稀土族元素之中,從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素特佳。   [0023] 又,在稀土族元素的含有量合計為未滿0.01原子%,微細化的效果少;在超過0.5原子%,則反射率降低的程度增加。   [0024] (鎳及銅)   構成反射電極的反射膜之鋁合金,最好是含有鎳(Ni)及銅(Cu)之至少1種合計0.05原子%以上5.0原子%以下。反射電極,為了提高其反射率,例如在250℃左右進行熱處理。然而,藉由反射膜依上述的含有比例包含鎳及銅之至少一方,可以抑制在反射膜表面形成氧化層而擔保導電性,抑制結晶粒增大而使之微細化,再者分散副生成物之化合物。從而,可以抑制鋁合金,亦即該鋁合金構成的反射膜,進而反射電極之、在熱處理後的電阻率降低,可以抑制具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。   [0025] 藉由鎳及銅之添加量合計設為0.05原子%以上,可以充分地發揮上述之作用效果因而較佳。此外,藉由設為5.0原子%以下,可以維持反射率高度因而較佳。更好是0.1原子%以上、且更好是3.0原子%以下。   [0026] (反射電極的特性)   反射電極的電性電阻率為10μΩ・cm以下佳,9μΩ・cm以下較佳,8μΩ・cm以下更佳。藉此,可以抑制有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。   [0027] 此外,使用作為反射電極之場合,於膜厚100nm以上的薄膜於測定之波長550nm下代表的反射率為85%以上佳,88%以上更佳。藉此,可以提升有機電致發光顯示裝置或有機電致發光照明等的元件之、以有機材料所發生的光的取出效率。   此外,作成有機電致發光元件之場合之驅動電壓,在50mA/cm2 之面積電流密度,以9V以下為佳。   [0028] <透明導電膜>   透明導電膜,其主面與反射膜的主面相接觸,一般上,在有機電致發光顯示裝置或有機電致發光照明等的元件,係在反射膜上層積透明導電膜。   [0029] 透明導電膜,可以使用泛用之材料,例如ITO(Sn摻入In2 O3 )、Ga摻入ZnO、Sb摻入SnO等之材料。   [0030] <反射電極之製造>   構成反射電極之反射膜及透明導電膜,可以採用濺鍍法或離子鍍(ion plating)法等之物理蒸鍍法、CVD法等之化學蒸鍍法等泛用方法進行成膜,因而可以形成反射電極。該等之中則以控制容易、也可簡單地控制膜厚或組成之濺鍍法為佳。   [0031] 採用濺鍍法形成反射電極之場合,在例如形成由上述的成分組成的鋁合金所構成的反射膜時,藉由準備與構成該反射膜的鋁合金相同成分組成的濺鍍靶,將該濺鍍靶於指定的條件下進行濺鍍,可以得到目的之反射膜。   具體而言,準備於3原子%以上12原子%以下之範圍包含鋅、並且於0.01原子%以上0.5原子%以下之範圍包含稀土族元素,進而因應必要,於合計含有量之0.05原子%以上5.0原子%以下之範圍包含鎳及銅之至少任何一方之鋁合金濺鍍靶,將該濺鍍靶於指定條件下進行濺鍍而得到目的之反射膜。此外,因應必要,準備在上述加上包含從稀土族元素之釹、鑭、鈰、及釔構成的群所選出的至少1種元素之鋁合金濺鍍靶,將該濺鍍靶於指定條件下進行濺鍍得到目的之反射膜。   [0032] 採用濺鍍法形成透明導電膜之場合,也是準備與該透明導電膜相同成分組成的濺鍍靶,將該濺鍍靶於指定的條件下進行濺鍍,可以得到目的之透明導電膜。   [0033] 又,在將透明導電膜等的氧化物膜以濺鍍進行成膜之場合,由於有產生膜中氧缺損等之場合,而適宜在成膜中供給氧氣等反應性氣體。   [0034] 上述之鋁合金濺鍍靶等,在上述的成分組成之外,包含於製造過程等不可避免地混入之元素,例如鐵、矽等。又,此類之不可避免不純物的比例,一般上為0.03重量%以下,最好是0.01重量%以下。   [0035] 上述靶的形狀,對應於濺鍍裝置的形狀或構造可以包含加工成任意形狀(例如,方板狀、圓板狀及環型板狀等)之靶。   [0036] 作為上述靶之製造方法,例如,可舉出以溶解鑄造法、粉末燒結法、噴覆成型(spray forming)法來製造由鋁基合金所構成的鑄錠而得到之方法,及在製造出由鋁基合金所構成的預成形(得到最終的緻密體之前的中間體)之後利用緻密化手段將該預成形緻密化而得到之方法。 [實施例]   [0037] (1)有機電致發光(EL)元件之製造   在玻璃基板(康寧公司製造的EagleXG)上,在將表1及表2所示之成分組成之由鋁合金所構成之反射膜(陽極電極)形成厚度200nm之後,接著形成透明導電膜之氧化銦錫(ITO)10nm。之後,進行圖案化形成2mm幅寬的配線。接著,使用紅外線燈熱處理爐,於氮氣體氛圍中、250℃進行1小時熱處理。之後,進行利用UV燈照射之表面清潔。   [0038] 其次,在透明導電膜上,在利用真空蒸鍍法形成60nm膜厚之正電孔輸送層之α-NPD(α-naphtyl phenil diamine)後,形成50nm厚度之發光層之Alq3(8-hydroxy quinorine alminum),形成0.6nm厚度之電子注入層之LiF,最後,形成100nm厚度之陰極電極之鋁。該等的蒸鍍層係使用2mm幅寬的遮罩形成,製作出具有2mm ×2mm的發光面積之有機電致發光元件。   [0039] 又,反射膜,係使用直徑4吋的鋁合金靶,於3~6W/cm2 的投入電力進行濺鍍而成膜。同樣地,透明導電膜,係使用直徑4吋的氧化銦錫靶,於3~6W/cm2 的投入電力進行濺鍍而成膜。   [0040] (2)測定及評價   上述作法得到的有機電致發光元件之驅動電壓及反射膜(反射電極)之反射率、電阻率,係如下述作法測定。   反射率:利用日本分光(股)(JASCO Corporation)製V-570分光光度計測定絕對反射率,表的數值為波長450nm之數值(代表值)   電阻率:4探針法   驅動電壓:使用HP(股)製造半導體參數分析儀(HP4156A),設定電壓掃掠(sweep)範圍為0V-14V來測定元件的電流電壓,得到各元件之電壓―電流特性。   [0041] 根據諸如上述的測定,設定反射率85%以上、電性電阻率9μΩ・cm以下者為合格。此外,驅動電壓,在50mA/cm2 之面積電流密度,以9V以下者為合格。測定結果顯示於表1及表2。   [0042][0043][0044] 由表1可知,在構成反射電極的反射膜之鋁合金中的鋅量、稀土族元素量及鎳、銅量滿足本發明之要件之實施例1~7,即使在熱處理後,也顯示良好的反射率、電性電阻率及驅動電壓。   [0045] 另一方面,由表2可知,在由純鋁構成反射膜而成的比較例1及比較例4,由於反射膜、亦即反射電極不含鋅元素,顯示出元素的驅動電壓為超過14V或者為10.2V之較高數值。   [0046] 此外,在不含稀土族元素的比較例2、3、5、6及7,由於反射膜的表面平滑性不足,而降低反射率。   [0047] 再者,在不含鋅、而含有較多鎳的比較例8,反射膜、亦即反射電極之反射率低。在鋅量超過本發明的範圍之比較例9,反射膜、亦即反射電極之反射率也是低,再者驅動電壓高。   [0048] 以上,根據上述具體例詳細說明本發明,但本發明並不以上述具體例為限,在不逸脫本發明之範疇下,可以進行種種變形或變更。本申請案係根據2016年8月26日申請之日本專利申請案(特願2016-166148),其內容作為參照而在本說明書中援用。[0017] Hereinafter, embodiments of the present invention will be described in detail. In the following description, "atomic%" and "at atomic%" are synonymous. [Reflection Film] (Amount of Zinc (Zn)) The aluminum alloy constituting the reflection film of the reflection electrode includes zinc in a range of 3 atomic% or more and 12 atomic% or less. At less than 3 atomic%, the effect of improving the electrical continuity with transparent conductive films such as indium tin oxide (ITO) is not sufficient. For organic electroluminescence display devices or organic electroluminescence devices with the reflective electrode, The driving voltage has no improvement. Above 12 atomic%, the reflectance will decrease, and the resistivity of the aluminum alloy will increase. As a result, the resistivity of the reflective film, that is, the reflective electrode, will increase, and the organic electroluminescence display device having the reflective electrode The driving voltage of elements such as organic electroluminescence lighting is increased. [0019] In addition, the reason why the amount of zinc exceeds 12 atomic% may increase the driving voltage of the device is not clear. It is considered that the concentration of zinc is too large, the thickness of the oxide film is increased, and the barrier is increased. . The amount of zinc is preferably 4 atomic% or more, and more preferably 11 atomic% or less. [0020] In addition, as described above, the aluminum alloy of the reflective film constituting the reflective electrode reduces the driving voltage of the element by including zinc in the above proportion because zinc is biased on the surface of the reflective film, so that the aluminum oxide film The reason is that the compactness is lowered, the insulation is deteriorated, and the electrical connection with the transparent conductive film is improved. [0021] (Rare Earth Element) The aluminum alloy constituting the reflective film of the reflective electrode contains a rare earth element in a range of 0.01 atomic% to 0.5 atomic% in total. With the addition of zinc, for example, when forming a film with a high film thickness of 100 nm or more, the surface cracking tends to be large. The addition of rare earth elements is used to suppress the increase of crystal grains in the film formation and to refine the structure of the thin film. While improving the smoothness of the film surface. In addition, it suppresses crystal growth due to heat treatment, and has the effect of maintaining high smoothness even after heat treatment. Therefore, since the above-mentioned range contains a rare earth element, the reflectance of the reflective film, that is, the reflective electrode can be kept sufficiently high, and when the reflective film is used to form an element or the like, short circuit of the element can be avoided. [0022] The total content of the rare earth elements is preferably 0.05 atomic% or more, and more preferably 0.3 atomic% or less. Among the rare-earth elements of the additive element, at least one element selected from the group consisting of neodymium (Nd), lanthanum (La), cerium (Ce), and yttrium (Y) is particularly preferable. [0023] In addition, the total content of the rare earth element is less than 0.01 atomic%, and the effect of miniaturization is small; if it exceeds 0.5 atomic%, the degree of decrease in reflectance increases. [0024] (Nickel and copper) The aluminum alloy constituting the reflective film of the reflective electrode preferably contains at least one of nickel (Ni) and copper (Cu) in a total of 0.05 atomic% or more and 5.0 atomic% or less. In order to increase the reflectivity of the reflective electrode, heat treatment is performed at, for example, about 250 ° C. However, by including at least one of nickel and copper in the above-mentioned content ratio of the reflective film, it is possible to suppress the formation of an oxide layer on the surface of the reflective film and ensure the conductivity, suppress the increase of crystal grains to make it finer, and disperse byproducts Of compounds. Therefore, it is possible to suppress the aluminum alloy, that is, the reflective film made of the aluminum alloy, and further reduce the resistivity of the reflective electrode after heat treatment, and to suppress the organic electroluminescence display device or organic electroluminescence lighting having the reflective electrode. The driving voltage of the components increases. [0025] When the total amount of nickel and copper added is set to be 0.05 atomic% or more, the above-mentioned effects can be fully exerted, so it is preferable. In addition, it is preferable that the reflectance can be maintained at a height of 5.0 atomic% or less. It is more preferably 0.1 atomic% or more, and still more preferably 3.0 atomic% or less. [Characteristics of Reflective Electrode] The electrical resistivity of the reflective electrode is preferably 10 μΩ · cm or less, more preferably 9 μΩ · cm or less, and even more preferably 8 μΩ · cm or less. Thereby, it is possible to suppress an increase in driving voltage of an element such as an organic electroluminescence display device or an organic electroluminescence lighting. [0027] In the case of using as a reflective electrode, a thin film having a film thickness of 100 nm or more at a measured wavelength of 550 nm preferably has a reflectance of 85% or more, and more preferably 88% or more. Thereby, it is possible to improve the extraction efficiency of light generated by organic materials among elements such as organic electroluminescence display devices or organic electroluminescence lighting. In addition, when an organic electroluminescence element is used, the driving voltage is preferably an area current density of 50 mA / cm 2 or less, and preferably 9 V or less. [0028] <Transparent conductive film> The transparent conductive film has its main surface in contact with the main surface of the reflective film. Generally, elements such as organic electroluminescence display devices or organic electroluminescence lighting are transparently laminated on the reflective film. Conductive film. [0029] For the transparent conductive film, materials that are commonly used, such as ITO (Sn doped with In 2 O 3 ), Ga doped with ZnO, Sb doped with SnO, and the like can be used. [0030] <Production of Reflective Electrode> The reflective film and the transparent conductive film constituting the reflective electrode may be formed by a physical vapor deposition method such as a sputtering method or an ion plating method, or a chemical vapor deposition method such as a CVD method. Since the film is formed by a method, a reflective electrode can be formed. Among these, a sputtering method that is easy to control and can also simply control the film thickness or composition is preferred. [0031] When a reflective electrode is formed by a sputtering method, for example, when forming a reflective film made of an aluminum alloy composed of the above-mentioned components, a sputtering target having the same composition as that of the aluminum alloy constituting the reflective film is prepared. This sputtering target is subjected to sputtering under predetermined conditions to obtain a desired reflective film. Specifically, zinc is contained in a range of 3 atomic% to 12 atomic%, and a rare earth element is included in a range of 0.01 atomic% to 0.5 atomic%. If necessary, it is 0.05 atomic% or more and 5.0 as the total content. The atomic% or lower range includes an aluminum alloy sputtering target including at least one of nickel and copper, and the sputtering target is subjected to sputtering under specified conditions to obtain a desired reflective film. In addition, if necessary, an aluminum alloy sputtering target including at least one element selected from the group consisting of neodymium, lanthanum, cerium, and yttrium of the rare-earth elements is prepared, and the sputtering target is prepared under specified conditions. Perform sputtering to obtain the desired reflective film. [0032] When a transparent conductive film is formed by a sputtering method, a sputtering target having the same composition as that of the transparent conductive film is also prepared, and the sputtering target is subjected to sputtering under specified conditions to obtain a desired transparent conductive film. . [0033] In the case where an oxide film such as a transparent conductive film is formed by sputtering, a reactive gas such as oxygen is preferably supplied to the film because oxygen deficiency in the film may occur. [0034] The above-mentioned aluminum alloy sputtering target and the like, in addition to the above-mentioned component composition, include elements inevitably mixed in the manufacturing process and the like, such as iron and silicon. The proportion of such inevitable impurities is generally 0.03% by weight or less, and preferably 0.01% by weight or less. [0035] The shape of the target may include a target processed into an arbitrary shape (for example, a square plate shape, a circular plate shape, a ring plate shape, or the like) corresponding to the shape or structure of the sputtering apparatus. [0036] Examples of the method for producing the target include a method of producing an ingot made of an aluminum-based alloy by a dissolution casting method, a powder sintering method, and a spray forming method, and A method in which a preform (an intermediate body before a final dense body is obtained) composed of an aluminum-based alloy is manufactured and then the preform is densified by a densification method. [Examples] [0037] (1) Production of organic electroluminescence (EL) elements On a glass substrate (EagleXG manufactured by Corning Corporation), the components shown in Tables 1 and 2 were composed of aluminum alloy. After forming a reflective film (anode electrode) with a thickness of 200 nm, a transparent conductive film of indium tin oxide (ITO) was formed at 10 nm. After that, patterning was performed to form a 2 mm wide wiring. Next, an infrared lamp heat treatment furnace was used to perform heat treatment in a nitrogen gas atmosphere at 250 ° C. for 1 hour. After that, the surface was irradiated with a UV lamp. [0038] Next, on a transparent conductive film, a 60-nm-thick α-NPD (α-naphtyl phenil diamine) is formed by a vacuum evaporation method, and then a 50-nm-thick Alq3 (8 -hydroxy quinorine alminum) to form LiF of the electron injection layer with a thickness of 0.6 nm, and finally, aluminum with a thickness of 100 nm for the cathode electrode. Such a vapor deposition layer is formed using a mask having a width of 2 mm, and an organic electroluminescence device having a light emitting area of 2 mm × 2 mm is produced. [0039] Further, a reflective film, line 4 inch diameter aluminum alloy target, to 3 ~ 6W / cm 2 electric power input formed by sputtering. Similarly, the transparent conductive film is formed by sputtering using an indium tin oxide target having a diameter of 4 inches at an input power of 3 to 6 W / cm 2 . [0040] (2) The measurement and evaluation of the driving voltage of the organic electroluminescence element obtained by the above method, and the reflectance and resistivity of the reflective film (reflective electrode) are measured as follows. Reflectance: Absolute reflectance was measured with a V-570 spectrophotometer manufactured by JASCO Corporation. The value in the table is a value (representative value) with a wavelength of 450 nm. Resistivity: 4 probe method. Driving voltage: HP ( The semiconductor parameter analyzer (HP4156A) was manufactured, and the voltage sweep range was set to 0V-14V to measure the current and voltage of the components, and the voltage-current characteristics of each component were obtained. [0041] According to a measurement such as the above, it is acceptable to set a reflectance of 85% or more and an electrical resistivity of 9 μΩ · cm or less. In addition, the drive voltage was acceptable at an area current density of 50 mA / cm 2 or lower at 9 V or less. The measurement results are shown in Tables 1 and 2. [0042] [0043] [0044] As can be seen from Table 1, Examples 1 to 7 in which the amount of zinc, the amount of rare earth elements, and the amount of nickel and copper in the aluminum alloy constituting the reflective film of the reflective electrode satisfy the requirements of the present invention, even after heat treatment, Display good reflectivity, electrical resistivity and driving voltage. [0045] On the other hand, it can be seen from Table 2 that in Comparative Examples 1 and 4 in which the reflective film is made of pure aluminum, since the reflective film, that is, the reflective electrode does not contain zinc element, the driving voltage of the element is Exceeding 14V or a higher value of 10.2V. [0046] In Comparative Examples 2, 3, 5, 6, and 7 that did not contain a rare earth element, the reflectance of the reflective film was reduced due to insufficient surface smoothness. [0047] Furthermore, in Comparative Example 8 which does not contain zinc and contains a large amount of nickel, the reflectance of the reflective film, that is, the reflective electrode is low. In Comparative Example 9 in which the amount of zinc exceeds the range of the present invention, the reflectance of the reflective film, that is, the reflective electrode is also low, and the driving voltage is high. [0048] The present invention has been described in detail based on the above specific examples, but the present invention is not limited to the above specific examples, and various modifications or changes can be made without departing from the scope of the present invention. This application is based on a Japanese patent application filed on August 26, 2016 (Japanese Patent Application No. 2016-166148), the contents of which are incorporated herein by reference.

Claims (5)

一種反射電極,由以鋁(Al)合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係   前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%。A reflective electrode is a reflective electrode composed of a reflective film made of an aluminum (Al) alloy and a transparent conductive film, characterized in that the main surface of the reflective film is in contact with the main surface of the transparent conductive film, and the aluminum The alloy system contains 3 to 12 atomic percent of zinc (Zn) and 0.01 to 0.5 atomic percent of rare earth elements. 如申請專利範圍第1項記載之反射電極,其中   前述稀土族元素,係從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素。The reflective electrode according to item 1 of the scope of patent application, wherein the aforementioned rare earth element is at least one element selected from the group consisting of neodymium (Nd), lanthanum (La), cerium (Ce), and yttrium (Y). . 如申請專利範圍第1項記載之反射電極,其中   前述鋁合金,係含有鎳(Ni)及銅(Cu)之至少1種合計0.05~5.0原子%。For example, the reflective electrode described in item 1 of the patent application range, wherein the aforementioned aluminum alloy contains at least one of nickel (Ni) and copper (Cu) in a total amount of 0.05 to 5.0 atomic%. 如申請專利範圍第2項記載之反射電極,其中   前述鋁合金,係含有鎳及銅之至少1種合計0.05~5.0原子%。For example, the reflective electrode described in item 2 of the scope of patent application, in which the foregoing aluminum alloy contains at least one of nickel and copper in a total amount of 0.05 to 5.0 atomic%. 一種鋁合金濺鍍靶,其特徵係   形成如申請專利範圍第1~4項任1項記載之反射電極之前述反射膜。An aluminum alloy sputtering target is characterized in that the aforementioned reflective film is formed as a reflective electrode as described in any one of items 1 to 4 of the scope of patent application.
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