TW201803817A - 脆性基板之分斷方法 - Google Patents
脆性基板之分斷方法 Download PDFInfo
- Publication number
- TW201803817A TW201803817A TW106118267A TW106118267A TW201803817A TW 201803817 A TW201803817 A TW 201803817A TW 106118267 A TW106118267 A TW 106118267A TW 106118267 A TW106118267 A TW 106118267A TW 201803817 A TW201803817 A TW 201803817A
- Authority
- TW
- Taiwan
- Prior art keywords
- line
- crack
- brittle substrate
- substrate
- breaking
- Prior art date
Links
Classifications
-
- H10P54/00—
-
- H10W10/00—
-
- H10W10/01—
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Engineering & Computer Science (AREA)
- Dicing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2016-128426 | 2016-06-29 | ||
| JP2016128426A JP6760641B2 (ja) | 2016-06-29 | 2016-06-29 | 脆性基板の分断方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201803817A true TW201803817A (zh) | 2018-02-01 |
Family
ID=60945736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106118267A TW201803817A (zh) | 2016-06-29 | 2017-06-02 | 脆性基板之分斷方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6760641B2 (ja) |
| KR (1) | KR20180002495A (ja) |
| CN (1) | CN107538627A (ja) |
| TW (1) | TW201803817A (ja) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11116261A (ja) * | 1997-10-09 | 1999-04-27 | Ishizuka Glass Co Ltd | ガラスの加工方法 |
| JP2011046581A (ja) * | 2009-08-28 | 2011-03-10 | Seiko Instruments Inc | 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計 |
| TW201425243A (zh) * | 2012-12-25 | 2014-07-01 | Luminous Optical Technology Co Ltd | 大面積強化玻璃基材的切割方法 |
| JP6327823B2 (ja) * | 2013-09-30 | 2018-05-23 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法及び円盤形状のガラス基板 |
| JP6288260B2 (ja) * | 2014-05-30 | 2018-03-07 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
| JP6350669B2 (ja) * | 2014-09-25 | 2018-07-04 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
| JP6432245B2 (ja) * | 2014-09-26 | 2018-12-05 | 三星ダイヤモンド工業株式会社 | 基板分断方法 |
-
2016
- 2016-06-29 JP JP2016128426A patent/JP6760641B2/ja not_active Expired - Fee Related
-
2017
- 2017-05-30 KR KR1020170066703A patent/KR20180002495A/ko not_active Withdrawn
- 2017-06-02 TW TW106118267A patent/TW201803817A/zh unknown
- 2017-06-23 CN CN201710491435.4A patent/CN107538627A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP6760641B2 (ja) | 2020-09-23 |
| JP2018001474A (ja) | 2018-01-11 |
| CN107538627A (zh) | 2018-01-05 |
| KR20180002495A (ko) | 2018-01-08 |
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