TW201802225A - Entry sheet for boring drill hole, and method for boring drill hole using same - Google Patents

Abstract

An entry sheet for boring a drill hole, comprising a metallic film and a layer of a resin composition formed on at least one surface of the metallic film, wherein the resin composition includes a cleavable solid lubricant (A) and a thermoplastic resin (B), and the thermal conductivity of the solid lubricant (A) is within a range from 100 to 5,000 W/m,K.

Description

Auxiliary plate for drilling and drilling processing method using the auxiliary plate

The present invention relates to an auxiliary plate for drilling and a drilling processing method using the auxiliary plate.

In general, a method of drilling a laminated board or a multilayer board used as a printed circuit board material is to stack one or more laminated boards or multilayer boards, and arrange the laminated board or aluminum sheet as an abutment board on the aluminum foil sheet. A method in which a sheet of a resin composition layer is formed on the surface of a body or an aluminum foil (hereinafter, this "sheet" is referred to as an "auxiliary board for drilling") and a method of performing a hole-cutting process.

In recent years, along with the requirements for the reliability improvement of printed circuit boards and the progress of high density, the drilling of laminated or multilayer boards requires the reduction of inner wall roughness during hole drilling and the improvement of hole position accuracy. Quality drilling.

In order to respond to the above-mentioned requirements for reduction of inner wall roughness and improvement of hole position accuracy during the drilling process, for example, Patent Document 1 discloses a hole obtained by forming a water-soluble resin layer on an aluminum foil on which a thermosetting resin film has been formed. Use auxiliary board. In addition, Patent Document 2 discloses a lubricant sheet for openings obtained by blending a halogen-free coloring agent into a resin composition.

Moreover, an auxiliary plate for drilling using a solid lubricant has also been disclosed. For example, Patent Document 3 discloses an auxiliary plate for openings, which is composed of a lubricating layer, a composite material containing a nano-structure powder such as tungsten disulfide, a wear-resistant lubricating layer with a solid of a high heat transfer compound, and a support. Further, Patent Document 4 discloses an auxiliary plate for drilling including a layer of a resin composition obtained by mixing a water-soluble resin, a water-soluble lubricant, and carbon powder. Furthermore, Patent Document 5 discloses a heat-lubricating and lubricating aluminum cover sheet for perforation containing graphite as an inorganic filler in a composite material. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-136485 Patent Document 2: Japanese Patent Application Laid-Open No. 2004-230470 Patent Literature 3: Japanese Patent Application Laid-Open No. 2007-281404 Patent Literature 4: Japanese Patent Application Laid-Open No. 2008-222762 5: Japanese Patent Laid-Open No. 2006-346912

[Problems to be Solved by the Invention] With the advancement of semiconductor technology, demands for higher density and higher reliability of printed circuit boards are increasing. The range of drill diameter used in mass production is mostly 0.5mm to 0.105mm. Specifically, there are 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, 0.25mm, 0.2mm, 0.15mm, 0.105mm, and the like. In addition, the minimum drill diameter has gradually shifted from 0.105mm to 0.075mm, and in order to compete with the laser drilling technology, very few have also tried 0.05mm drilling. In addition, in the printed circuit board processing with a drill diameter of 0.2mm and 0.15mm, the improvement of the inner wall roughness and the accuracy of the hole position is strongly required, and the requirements for the inner wall roughness are particularly significant. In addition, because of the competition caused by globalization and the needs of emerging countries, there is a constant demand for increased productivity and reduced costs.

In the past, when the auxiliary plate for drilling was used for processing, the frictional heat of the drill and the laminated board or the multilayer board was used to melt the resin composition containing a water-soluble resin and the like around the drill, thereby exhibiting lubricity. However, the conventional auxiliary plate for drilling, the effect of the lubricity of the resin composition layer is insufficient, and it cannot fully meet the requirements of improving the inner wall roughness and the accuracy of the hole position. That is, it is desired to develop an auxiliary plate for drilling that can respond to higher requirements of the inner wall roughness and the accuracy of the hole position.

The present invention has been made in view of the above problems, and an object thereof is to provide an auxiliary plate for drilling which can reduce the roughness of the inner wall during drilling and can improve the accuracy of hole position, and a drilling process using the auxiliary plate for drilling. method. [Solution to the problem]

The present inventors have conducted various studies in order to solve the above-mentioned problems, and as a result, they have found that a metal foil and a layer of a resin composition formed on at least one side of the metal foil are provided, and the resin composition contains a solid lubricant and thermoplastic A resin auxiliary plate for drilling can solve the above-mentioned problems and complete the present invention.

式(1)中，R₁ 、R₂ 、R₃ 各自獨立地表示氫原子或甲基，m與n各自獨立地為1以上之整數。 [11] 如[9]或[10]之鑽孔用輔助板，其中，該乙烯-(甲基)丙烯酸共聚物中之來自乙烯之構成單元之莫耳數與來自(甲基)丙烯酸之構成單元之莫耳數之比，按來自乙烯之構成單元之莫耳數：來自(甲基)丙烯酸之構成單元之莫耳數表達，為60：40~99：1之範圍。 [12] 如[8]~[11]中任一項之鑽孔用輔助板，其中，該樹脂組成物中之該聚烯烴樹脂(C-1)之含量相對於該熱塑性樹脂(B)100質量份為25質量份以上80質量份以下。 [13] 如[8]~[12]中任一項之鑽孔用輔助板，其中，該聚烯烴樹脂(C-1)之重量平均分子量為5×10³ 以上1×10⁵ 以下。 [14] 如[1]~[13]中任一項之鑽孔用輔助板，其中，該熱塑性樹脂(B)含有水溶性樹脂(D)。 [15] 如[14]之鑽孔用輔助板，其中，該水溶性樹脂(D)含有選自於由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮、纖維素衍生物、聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚氧乙烯之單醚化合物、聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚甘油單硬脂酸酯、聚環氧乙烷-聚環氧丙烷共聚物及它們的衍生物構成之群組中之1種或2種以上。 [16] 如[14]或[15]之鑽孔用輔助板，其中，該水溶性樹脂(D)之含量相對於該熱塑性樹脂(B)100質量份為20質量份以上100質量份以下。 [17] 如[14]~[16]中任一項之鑽孔用輔助板，其中， 該水溶性樹脂(D)含有重量平均分子量5×10⁴ 以上1.5×10⁶ 以下之高分子水溶性樹脂(d1)及重量平均分子量5×10² 以上3×10⁴ 以下之低分子水溶性樹脂(d2)， 該高分子水溶性樹脂(d1)含有選自於由聚環氧乙烷、聚環氧丙烷、聚乙烯基吡咯烷酮及纖維素衍生物構成之群組中之1種或2種以上， 該低分子水溶性樹脂(d2)係選自於由聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚氧乙烯油醚、聚氧乙烯鯨蠟醚、聚氧乙烯硬脂醚、聚氧乙烯月桂基醚、聚氧乙烯壬基苯醚、聚氧乙烯辛基苯醚、聚氧乙烯單硬脂酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐單月桂酸酯、聚甘油單硬脂酸酯、聚環氧乙烷-聚環氧丙烷共聚物及它們的衍生物構成之群組中之1種或2種以上。 [18] 如[17]之鑽孔用輔助板，其中，該高分子水溶性樹脂(d1)之含量相對於該熱塑性樹脂(B)100質量份為2質量份以上50質量份以下。 [19] 如[17]或[18]之鑽孔用輔助板，其中，該低分子水溶性樹脂(d2)之含量相對於該熱塑性樹脂(B)100質量份為3質量份以上60質量份以下。 [20] 如[1]~[19]中任一項之鑽孔用輔助板，其中，該樹脂組成物之層之厚度為0.02~0.3mm。 [21] 如[1]~[20]中任一項之鑽孔用輔助板，其中，該金屬箔之厚度為0.05mm~0.5mm。 [22] 一種鑽孔加工方法，係使用如[1]~[21]中任一項之鑽孔用輔助板於疊層板或多層板形成孔。 [發明之效果]That is, the present invention is as follows. [1] An auxiliary plate for drilling, comprising: a metal foil; and a layer of a resin composition formed on at least one side of the metal foil, the resin composition containing a decomposable solid lubricant (A) and The thermal conductivity of the thermoplastic resin (B) and the solid lubricant (A) is 100 to 5000 W / m · K. [2] The auxiliary plate for drilling according to [1], wherein the solid lubricant (A) has a median diameter of 1 μm or more and 10 μm or less, and 90% of the particle diameter and 10% of the solid lubricant (A) The difference in diameter is 1 μm or more and 20 μm or less. [3] The auxiliary plate for drilling according to [1] or [2], wherein the content of the solid lubricant (A) in the resin composition is 5 parts by mass relative to 100 parts by mass of the thermoplastic resin (B) Above 150 parts by mass. [4] The auxiliary plate for drilling according to any one of [1] to [3], wherein the solid lubricant (A) has a median diameter of 1 μm or more and 8 μm or less, and The difference between the 90% particle size and the 10% particle size is 1 μm or more and 17 μm or less. [5] The auxiliary plate for drilling according to any one of [1] to [4], wherein the content of the solid lubricant (A) in the resin composition is relative to 100 parts by mass of the thermoplastic resin (B) It is 15 mass parts or more and 120 mass parts or less. [6] The auxiliary plate for drilling according to any one of [1] to [5], wherein the thermoplastic resin (B) contains a water-insoluble resin (C). [7] The auxiliary board for drilling according to [6], wherein the content of the water-insoluble resin (C) is 25 parts by mass or more and 80 parts by mass or less based on 100 parts by mass of the thermoplastic resin (B). [8] The auxiliary plate for drilling according to [6] or [7], wherein the water-insoluble resin (C) contains a polyolefin resin (C-1). [9] The auxiliary board for drilling according to [8], wherein the polyolefin resin (C-1) contains an ethylene- (meth) acrylic copolymer. [10] The auxiliary plate for drilling according to [9], wherein the ethylene- (meth) acrylic copolymer contains a polymer having a structure of the following general formula (1);

In formula (1), R ₁ , R ₂ , and R ₃ each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more. [11] The auxiliary plate for drilling according to [9] or [10], wherein the molar number of the constituent units derived from ethylene and the constituents derived from (meth) acrylic acid in the ethylene- (meth) acrylic copolymer The ratio of the mole number of the unit is expressed in terms of the mole number of the constituent unit derived from ethylene: the mole number of the constituent unit derived from (meth) acrylic acid, and ranges from 60:40 to 99: 1. [12] The auxiliary plate for drilling according to any one of [8] to [11], wherein the content of the polyolefin resin (C-1) in the resin composition is 100 with respect to the thermoplastic resin (B) The mass part is 25 mass parts or more and 80 mass parts or less. [13] The auxiliary plate for drilling according to any one of [8] to [12], wherein the weight average molecular weight of the polyolefin resin (C-1) is 5 × 10 ³ or more and 1 × 10 ⁵ or less. [14] The auxiliary plate for drilling according to any one of [1] to [13], wherein the thermoplastic resin (B) contains a water-soluble resin (D). [15] The auxiliary board for drilling according to [14], wherein the water-soluble resin (D) contains a material selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, cellulose derivatives, and poly Glycol, polypropylene glycol, polytetramethylene glycol, monoether compounds of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan One or more types of monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymer, and their derivatives. [16] The auxiliary plate for drilling according to [14] or [15], wherein the content of the water-soluble resin (D) is 20 to 100 parts by mass relative to 100 parts by mass of the thermoplastic resin (B). [17] The auxiliary plate for drilling according to any one of [14] to [16], wherein the water-soluble resin (D) contains a polymer water-soluble having a weight average molecular weight of 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less Resin (d1) and low-molecular-weight water-soluble resin (d2) having a weight average molecular weight of 5 × 10 ² or more and 3 × 10 ⁴ or less. The polymer water-soluble resin (d1) contains a polymer selected from the group consisting of polyethylene oxide and polycyclic ring. One or two or more of the group consisting of oxypropane, polyvinylpyrrolidone, and cellulose derivatives. The low-molecular-weight water-soluble resin (d2) is selected from the group consisting of polyethylene glycol, polypropylene glycol, and polytetramethylene. Methyl glycol, polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene Ethylene monostearate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymer And one or more of them in a group of their derivatives. [18] The auxiliary board for drilling according to [17], wherein the content of the polymer water-soluble resin (d1) is 2 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the thermoplastic resin (B). [19] The auxiliary plate for drilling according to [17] or [18], wherein the content of the low-molecular-weight water-soluble resin (d2) is 3 parts by mass or more and 60 parts by mass relative to 100 parts by mass of the thermoplastic resin (B). the following. [20] The auxiliary plate for drilling according to any one of [1] to [19], wherein the thickness of the layer of the resin composition is 0.02 to 0.3 mm. [21] The auxiliary plate for drilling according to any one of [1] to [20], wherein the thickness of the metal foil is 0.05 mm to 0.5 mm. [22] A method for drilling processing, which uses a secondary plate for drilling according to any one of [1] to [21] to form holes in a laminated board or a multilayer board. [Effect of the invention]

According to the present invention, it is possible to provide an auxiliary plate for drilling which can reduce the roughness of the inner wall during drilling, and can further improve the accuracy of the hole position, and a drilling processing method using the auxiliary plate for drilling.

Hereinafter, an embodiment of the present invention (hereinafter referred to as "this embodiment") will be described in detail, but the present invention is not limited thereto, and various modifications can be made without departing from the gist thereof.

[Auxiliary plate for drilling] The auxiliary plate for drilling (hereinafter also referred to simply as the "auxiliary plate") in this embodiment includes a metal foil and a layer of a resin composition formed on at least one side of the metal foil, The resin composition contains a solid lubricant (A) and a thermoplastic resin (B) having cleavability, and the solid lubricant (A) has a thermal conductivity of 100 to 5000 W / m · K.

FIG. 1 shows an aspect of a drilling auxiliary plate and a drilling processing method using the auxiliary plate according to this embodiment. As shown in FIG. 1, the auxiliary plate of this embodiment includes a metal foil 2 and a layer 1 of a resin composition disposed on at least one side of the metal foil 2. By using the layer 1 of the resin composition containing the solid lubricant (A) and the thermoplastic resin (B), it is possible to reduce the inner wall roughness of the processed hole during drilling. The reason is that the frictional heat generated during the drilling process melts the thermoplastic resin (B) contained in the resin composition, and as a result, the solid lubricant (A) dispersed in the resin composition penetrates into the processing hole. And the friction between the drill and the inner wall of the processing hole is reduced, and the friction between the cutting chips of the printed circuit board and the inner wall of the processing hole caused by the drilling process can be reduced.

In addition, at the point where the drill bit contacts the layer of the resin composition included in the auxiliary plate, the blade of the tip of the rotating drill bit will bite the surface of the layer of the resin composition while sliding. At this time, the auxiliary plate that simply improves the lubricity has a tendency that the blade at the front end of the drill bit slides laterally, so the core is low and the accuracy of the hole position is deteriorated. In addition, in this specification, "core property" means straightness of a cutting direction at the time of a cutting process.

In contrast, the auxiliary plate of this embodiment has an excellent core-alignment property because of the layer of the resin composition, so it can obtain excellent hole position accuracy during drilling. As a result, a higher density design can be obtained in the manufacture of a printed circuit board, and a high-quality hole-cutting process can be performed with high quality. In addition, the excellent hole position accuracy can increase the number of substrates that can be processed at a time, which can contribute to productivity improvement and cost reduction.

The composition of the auxiliary board in this embodiment will be described in detail below.

[Metal Foil] The metal foil is not particularly limited, and it is preferred that the metal material has high adhesion to the layer of the resin composition and can withstand the impact caused by the drill. The metal type of the metal foil is considered from the viewpoints of availability, cost, and processability, such as aluminum. The material of the aluminum foil is preferably aluminum with a purity of 95% or more. Such aluminum foils are, for example: 5052, 3004, 3003, 1N30, 1N99, 1050, 1070, 1085, 8021 stipulated in JIS-H4160. The use of aluminum foil with a purity of 95% or more for metal foils reduces the impact caused by the drill and improves the bite properties of the drill's front end. It interacts with the lubricating effect of the drill due to the resin composition, which can further improve the processing hole. Hole position accuracy.

The thickness of the metal foil is preferably 0.05 to 0.5 mm, more preferably 0.05 to 0.3 mm, and still more preferably 0.07 mm to 0.15 mm. When the thickness of the metal foil is 0.05 mm or more, it is possible to suppress the occurrence of burrs in the object to be drilled (for example, a laminated board) for drilling. In addition, when the thickness of the metal foil is 0.5 mm or less, the cutting powder tends to be more easily discharged during the drilling process.

The method for measuring the thickness of each layer constituting the auxiliary plate is not particularly limited, and it can be measured, for example, as follows. First, use a cross-section polisher (trade name: "CROSS-SECTION POLISHER SM-09010" made by Japan Electronic Data Corporation) or an ultra-micro-cutting knife (model "EM UC7" made by Leica) to pass the auxiliary plate along each layer. The stacking direction is cut. Then, using a SEM (Scanning Electron Microscope, Model "VE-7800" manufactured by KEYENCE Corporation), the section is viewed from a direction perpendicular to the section that appears when cut, and the constituent layers such as metal foil, The thickness of the adhesive layer and the layer of the resin composition will be described later. At this time, the thicknesses at five locations were measured with respect to one visual field, and the average thickness was defined as the thickness of each layer.

[Adhesive Layer] From the standpoint of adhesion with the resin composition layer, a metal foil in which a resin film having the function of an adhesive layer is formed on the surface of the metal foil in advance may also be used. That is, the auxiliary plate of this embodiment may have an adhesive layer based on a resin film between the metal foil and the layer of the resin composition.

From the viewpoints of adhesion, cost, and opening characteristics, the thickness of the adhesive layer is preferably 0.002 to 0.02 mm, and more preferably 0.002 to 0.01 mm.

The resin used in the adhesive layer is not particularly limited as long as it can improve the adhesion between the metal foil and the resin composition layer, and may be any of a thermoplastic resin and a thermosetting resin, or an adhesive resin. Examples of the thermoplastic resin include a urethane-based polymer, a vinyl acetate-based polymer, a vinyl chloride-based polymer, a polyester-based polymer, an acrylic polymer, and a copolymer thereof. Examples of the thermosetting resin include epoxy-based resins and cyanate-based resins. Examples of the adhesive resin include synthetic resins such as melamine resin, urea resin, and phenol resin, synthetic resins such as chloroprene rubber, nitrile rubber, styrene butadiene rubber, and silicone rubber. These may be used individually by 1 type, and may use 2 or more types together. When the layer of the resin composition has an adhesive function with a metal foil, an adhesive layer may or may not be used.

[Layer composition layer] The resin composition layer is not particularly limited as long as it is a layer composed of a resin composition containing a solid lubricant (A) and a thermoplastic resin (B).

The thickness of the layer of the resin composition can be appropriately selected depending on the diameter of the drill used in the drilling process, the structure of the object to be opened (for example, a printed circuit board material such as a laminated board or a multilayer board), and the like. The thickness of the layer of such a resin composition is preferably 0.02 to 0.3 mm, and more preferably 0.02 to 0.2 mm. When the thickness of the layer of the resin composition is 0.02 mm or more, a more sufficient lubricating effect can be obtained, the load on the drill bit can be reduced, and the drill bit breakage can be further suppressed. In addition, when the thickness of the layer of the resin composition is 0.3 mm or less, the coiling of the resin composition to the drill can be suppressed.

(Solid Lubricant (A)) The resolvable solid lubricant (A) used in the auxiliary plate of this embodiment is in the form of a film or powder in order to suppress the abrasion speed of the drill and reduce friction during the drilling process. The solid used can be cleaved by contacting the drill bit during the drilling process, which can reduce the cutting resistance during drilling and reduce the wear of the drill bit. In addition, by using the solid lubricant (A) and the thermoplastic resin (B) in combination, the uniform dispersion of the solid lubricant (A) in the layer of the resin composition is further improved, and the resolvability can be more effectively used. In addition, "cleavability" refers to the property that the solid lubricant (A) easily breaks in a specific direction.

As the solid solid lubricant (A), an inorganic solid lubricant and / or an organic solid lubricant can be used. There are no special restrictions on inorganic solid lubricants, such as: inorganic solid lubricants such as graphite, boron nitride, carbon nanotubes, and graphene oxide; organic solids such as melamine cyanurate Lubricant. Among them, inorganic solid lubricants are more preferable, and graphite is more preferable. By using such a solid lubricant (A), resolvability, dispersibility, and thermal conductivity are further improved, and the inner wall roughness and / or hole position accuracy during the drilling process tends to be more improved.

There are no special restrictions on graphite, such as natural graphite such as flaky graphite, earthy graphite, scaly graphite, and semi-scaly graphite; artificial graphite such as coal coke and pyrolytic graphite. The thermally decomposable graphite refers to, for example, a product obtained by subjecting a charcoal coal coke to heat treatment at 2,500 ° C or higher and pulverizing it. Among them, scaly graphite, earthy graphite, and scaly graphite are more preferable, and scaly graphite and earthy graphite are more preferable. Such graphite tends to have excellent resolvability, dispersibility, and thermal conductivity in consideration of properties such as shape and / or crystal. Therefore, during the drilling process, the frictional heat generated can be prevented and the layer of the resin composition can be prevented from being excessively softened. As a result, the core of the resin composition layer can be further enhanced, and the friction inside the processing hole can be reduced. As a result, the inner wall roughness and hole position accuracy at the time of hole processing tend to be further improved. Here, flaky graphite is not particularly limited, and for example, scaly graphite having naturally occurring high crystallinity is used. In addition, earthy graphite is not particularly limited, and refers to finely crystalline graphite having lower crystallinity than flaky graphite. The solid lubricant (A) may be used singly or in combination of two or more kinds.

The solid lubricant (A) should preferably have lubricity and have a high melting point. The melting point of the solid lubricant (A) is preferably 700 ° C or higher, more preferably 500 ° C or higher, and even more preferably 400 ° C or higher. By using such a solid lubricant (A), lubricity can be exhibited even if high frictional heat is generated, so there is a tendency that the contact area between the drill and the inner wall of the processing hole can be reduced, and frictional heat can be increased. As a result, the inner wall roughness and / or hole position accuracy during the drilling process tends to be further improved.

The thermal conductivity of the solid lubricant (A) is 100 to 5000 W / m · K, preferably 100 to 4500 W / m · K, more preferably 100 to 3000 W / m · K, and even more preferably 100 to 2000 W / m · K, more preferably 100 to 1000 W / m · K, and even more preferably 100 to 250 W / m · K. When the thermal conductivity of the solid lubricant (A) is within the above range, the frictional heat generated during the drilling process can be efficiently diffused, and there is a tendency that the frictional heat may cause the resin composition layer to be excessively softened. In addition, although there is no particular limitation, the thermal conductivity of graphite is 100 to 250 W / m · K. For reference, the thermal conductivity of boron nitride is 30 ~ 99W / m · K, the thermal conductivity of carbon nanotubes is 3000 ~ 5500W / m · K, and the thermal conductivity of graphene oxide is 3000 ~ 5000W / m · K. The thermal conductivity of melamine melamine is 0.5 ~ 3.0W / m · K. The method for measuring the thermal conductivity of the solid lubricant (A) is not particularly limited as long as it is a general method, such as the flash method and DSC method described in JIS-R16011.

Among the above, the solid lubricant (A) is a solid that is solvable and uniformly dispersed in the resin composition, has lubricity, does not melt in the range of 25 ° C to 400 ° C, and is an inorganic substance with a thermal conductivity of 100 ~ 5000W / m · K solid is particularly preferred. When the layer of the resin composition in this embodiment contains such a solid lubricant (A), the inner wall roughness and / or the accuracy of the hole position during the drilling process tend to be further improved.

The median diameter (average particle diameter) of the solid lubricant (A) is preferably 1 μm or more and 10 μm or less, more preferably 1 μm or more and 8 μm or less, still more preferably 1 μm or more and 6 μm or less, still more preferably 1 μm or more and 5 μm or less. It is preferably 1 μm or more and 4 μm or less. When the median diameter of the solid lubricant (A) is 1 μm or more, the solid lubricant particles are not agglomerated with each other and are uniformly dispersed in the layer of the resin composition, so they exhibit high core-centricity, and the hole position during drilling processing The accuracy tends to be more improved. In addition, when the median diameter of the solid lubricant (A) is 8 μm or less, the unevenness on the surface of the layer of the resin composition becomes smoother and the core property is improved. Therefore, the accuracy of the hole position during drilling is improved. The tendency to improve. In addition, the inner wall roughness tends to be further reduced during the drilling process. Here, the median diameter refers to a particle diameter (D50) having a height of 50% in a cumulative distribution curve (number basis) of the particle diameter measured according to a particle diameter measurement method such as a laser diffraction method.

The particle distribution of the solid lubricant (A) can be expressed by the difference between the 90% particle size and the 10% particle size (hereinafter, this specification may be represented by “ΔD”). ΔD is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 17 μm or less, more preferably 1 μm or more and 14 μm or less, still more preferably 1 μm or more and 9 μm or less, and even more preferably 1 μm or more and 5 μm or less. △ D is 1 μm or more, the solid lubricant particles do not aggregate with each other but are more uniformly dispersed in the layer of the resin composition, so the core property of the layer of the resin composition is improved, and the accuracy of the hole position during drilling is improved. There is a tendency to improve. In addition, ΔD is 20 μm or less, which makes it difficult for a large hole to deviate due to the drill bit following large solid lubricant particles during drilling (hereinafter sometimes referred to as “drill chute”). The hole position accuracy tends to be improved. In addition, the inner wall roughness tends to be further reduced during the drilling process. Here, the "90% particle diameter" is, for example, the cumulative distribution curve (number basis) of the particle diameter measured by a particle diameter measurement method such as laser diffraction method, and accumulated from the smaller side to a height of 90% Particle diameter (D90). In addition, the "10% particle size" refers to the cumulative distribution curve (number basis) of the particle diameter measured by a particle diameter measurement method such as laser diffraction method, from the smaller side to the height of 10%. Particle diameter (D10). △ D is calculated by subtracting the D10 from D90.

D90 of the solid lubricant (A) is preferably 2 μm or more and 20 μm or less, more preferably 2 μm or more and 15 μm or less, more preferably 3 μm or more and 10 μm or less, and even more preferably 3 μm or more and 7 μm or less. Since D90 is 2 μm or more, solid lubricant particles are not aggregated with each other and are uniformly dispersed in the layer of the resin composition. Therefore, D90 exhibits high core characteristics, and the hole position accuracy during drilling processing tends to be more improved. In addition, when D90 is 20 μm or less, the surface unevenness of the layer of the resin composition is smoother, the core is more excellent, and the hole position accuracy during the drilling process tends to be more improved. In addition, the inner wall roughness tends to be further reduced during the drilling process.

D10 of the solid lubricant (A) is preferably 0.08 μm or more and 4.0 μm or less, more preferably 0.5 μm or more and 3.0 μm or less, and more preferably 0.5 μm or more and 2.0 μm or less. With D10 being 0.08 μm or more, the solid lubricant particles are not aggregated with each other but are uniformly dispersed in the layer of the resin composition. Therefore, D10 exhibits a high core property, and the hole position accuracy during the drilling process tends to be further improved. In addition, since D10 is 4.0 μm or less, solid lubricant particles can be dispersed in the resin composition layer at a high density, so the hole position accuracy during the drilling process tends to be further improved. In addition, the inner wall roughness tends to be further reduced during the drilling process.

In particular, the solid lubricant (A) should preferably have a median diameter of 1 μm or more and 10 μm or less and a difference between 90% and 10% particle size of 1 μm or more and 20 μm or less, and a median diameter of 1 μm or more and 8 μm or less and 90% particles. The difference between the diameter and the 10% particle diameter is more preferably from 1 μm to 17 μm. When the median diameter of the solid lubricant (A) and the difference between the 90% particle diameter and the 10% particle diameter fall within the above range, the solid lubricant (A) is appropriately dispersed in the layer containing the resin composition without agglomeration. In the layer of the resin composition of the thermoplastic resin (B), the effect as a solid lubricant (A) can be fully exerted, and the inner wall roughness tends to be further reduced. In addition, it is difficult for a drill chute (drill shoot) to occur, and the solid lubricant does not melt but is retained at the drill bit, and the hole position accuracy during the drilling process tends to be extremely excellent.

The particle size distribution measurement method for measuring the median diameter (D50), D90, and D10 of the solid lubricant (A) is not particularly limited, and a known method can be adopted. Specifically, a laser diffraction / scattering method can be used in which the diffraction light pattern and the scattered light pattern obtained by irradiating the solid lubricant particles with laser light are used to measure the particle size and the content ratio. The method for adjusting the median diameter (D50), D90, and D10 of the solid lubricant (A) is not particularly limited, and it can be controlled by pulverizing and classifying the solid lubricant (A).

The content of the solid lubricant (A) in the resin composition is not particularly limited. By setting the content to 5 parts by mass or more and 150 parts by mass or less based on 100 parts by mass of the thermoplastic resin (B), the inner wall roughness during drilling is good. . Among them, in order to attach importance to the inner wall roughness when processing the inner wall roughness, it is more preferable that the content of the solid lubricant (A) is 5 to 50 parts by mass relative to 100 parts by mass of the thermoplastic resin (B). . On the other hand, when processing hole position accuracy is taken into consideration, from the viewpoint of hole position accuracy, the content of the solid lubricant (A) is preferably 15 mass parts or more and 120 mass parts or less with respect to 100 mass parts of the thermoplastic resin (B). 35 mass parts to 100 mass parts is more desirable, and 45 mass parts to 60 mass parts is more preferred. When the content of the solid lubricant (A) is 15 parts by mass or more, the core of the drill bit is further improved, so the hole position accuracy during the drilling process tends to be further improved. When the content of the solid lubricant (A) is 120 parts by mass or less, agglomeration of the solid lubricant (A) is further suppressed, and the hole position accuracy during drilling processing tends to be more improved. In particular, when the content of the solid lubricant (A) is 40 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin (B), both the inner wall roughness and the hole position accuracy tend to be excellent.

The state of the solid lubricant (A) when the auxiliary plate of this embodiment is manufactured, that is, the state of the solid lubricant (A) when the layer of the resin composition is formed is not particularly limited. For example, it can be in the form of a powder. use. The powder manufacturing method of the solid lubricant (A) is not particularly limited, and a known method can be adopted. Such a method is, for example, a method of obtaining a fine powder of a solid lubricant using a pulverizing device such as a jet mill or a bead mill.

In this case, the solid lubricant (A) may be further used with a pulverizing device such as a jet mill or a bead mill, if necessary, and it is preferable to use the pulverizing device after pulverizing it to the above-mentioned median diameter and ΔD.

(Thermoplastic resin (B)) By containing the thermoplastic resin (B) in the resin composition, it is easy to soften the layer of the resin composition due to frictional heat generated during the drilling process, and the resistance to the direction of the drill bit is reduced, and the drilling process is performed. The inner wall roughness is further reduced, and the hole position accuracy is further improved.

The content of the thermoplastic resin (B) in the resin composition is preferably 70 parts by mass to 100 parts by mass, and more preferably 80 parts by mass to 100 parts by mass, relative to 100 parts by mass of the total amount of the resin components forming the resin composition layer. ideal. Here, the "resin component" means the total amount of the remaining portion after removing the solid lubricant (A) from the constituent components of the layer of the resin composition.

The thermoplastic resin (B) is not particularly limited, and examples thereof include a water-insoluble resin (C) and / or a water-soluble resin (D). Either one of the water-insoluble resin (C) and the water-soluble resin (D) may be used alone, or both of them may be used in combination. Among them, it is preferable to use a water-insoluble resin (C) and a water-soluble resin (D) together. By using such a thermoplastic resin (B), the inner wall roughness during drilling is further reduced, and the hole position accuracy tends to be more improved. Hereinafter, the water-insoluble resin (C) and the water-soluble resin (D) will be described.

(Water-insoluble resin (C)) The water-insoluble resin (C) is not particularly limited as long as it is a water-insoluble thermoplastic resin, for example, polyolefin resin (C-1), polyurethane resin (C-2) ), Polyester resin (C-3). Among them, polyolefin resin (C-1) is more preferable. By using such a water-insoluble resin (C), the uniform dispersibility of the solid lubricant (A) in the resin composition is further improved, so that the inner wall roughness is further reduced during the drilling process, and the hole position accuracy is improved. There is a tendency to improve, which is ideal. Moreover, by using a polyolefin resin (C-1), the adhesive strength of the layer of a metal foil and a resin composition tends to increase. The term "water-insoluble" refers to a resin having a solubility of less than 1 g in 100 g of water at 25 ° C and 1 atmosphere.

The content of the water-insoluble resin (C) in the resin composition is preferably 25 parts by mass or more and 80 parts by mass or less, more preferably 25 parts by mass or more and 60 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin (B). It is preferably 30 parts by mass or more and 50 parts by mass or less. When the content of the water-insoluble resin (C) is 80 parts by mass or less, the inner wall roughness during the drilling process tends to be further reduced. In addition, when the content of the water-insoluble resin (C) is 25 parts by mass or more, the dispersibility of the solid lubricant (A) in the resin composition-containing layer is improved, and the hole position accuracy during drilling processing tends to be improved.

(Polyolefin resin (C-1)) The polyolefin resin (C-1) is not particularly limited, for example: a homopolymer of an olefin; a copolymer of an olefin and other comonomers copolymerizable with the olefin. Examples of the olefin include ethylene, propylene, butene, hexene, and octene. Among them, ethylene and propylene are more preferable, and ethylene is more preferable. Polyolefin resin (C-1) may be used individually by 1 type, and may use 2 or more types together.

The homopolymer of the olefin is not particularly limited, and examples thereof include polyethylene resins, polypropylene resins, polybutadiene resins, cycloolefin resins, and polybutene resins.

In addition, the comonomer constituting the copolymer of olefin is not particularly limited as long as it has a functional group capable of polymerizing with olefin, for example, vinyl monomers such as vinyl acetate and vinyl alcohol; acrylic acid, methacrylic acid, and horse Unsaturated carboxylic acid monomers such as maleic acid, itaconic acid, and fumaric acid; unsaturated ester monomers such as methacrylate and acrylate. Among them, unsaturated carboxylic acid monomers are preferable, acrylic acid and methacrylic acid are better, and acrylic acid is better. Further, resins having constituent units derived from two kinds of olefins, such as ethylene-propylene copolymer resins, are also included in olefin copolymers.

Among them, the polyolefin resin (C-1) is a copolymer (hereinafter also referred to as an "olefin-unsaturated carboxylic acid copolymer") containing a constituent unit derived from an olefin and a constituent unit derived from an unsaturated carboxylic acid monomer. Preferably, a copolymer containing a structural unit derived from an olefin and a structural unit derived from acrylic acid and / or methacrylic acid is more preferable, and a copolymer containing a structural unit derived from ethylene and a structural unit derived from acrylic acid and / or methacrylic acid (hereinafter also referred to as a copolymer) More preferably, it is referred to as an "ethylene- (meth) acrylic copolymer", and a copolymer containing a structural unit derived from ethylene and a structural unit derived from acrylic acid is particularly preferred. By using such a polyolefin resin (C-1), the adhesive strength of the layer of the metal foil and the resin composition is further improved, and in addition, the dispersibility of the solid lubricant (A) in the layer of the resin composition is further improved. Therefore, the accuracy of the hole position during the drilling process tends to be more improved. The copolymer may be used singly or in combination of two or more kinds.

The manufacturing method of the homopolymer polyolefin resin (A) is not particularly limited, and a conventionally known method can be used. The method for producing the copolymer polyolefin resin (A) is not particularly limited, and a method of polymerizing an olefin monomer and a comonomer can be used according to a conventionally known method. For example, the method for producing the olefin-unsaturated carboxylic acid copolymer is not particularly limited, and it can be produced by copolymerizing an olefin monomer such as an ethylene monomer and a propylene monomer with an unsaturated carboxylic acid-based monomer.

式(1)中，R₁ 、R₂ 、R₃ 各自獨立地表示氫原子或甲基，m與n各自獨立地為1以上之整數。The ethylene- (meth) acrylic copolymer is not particularly limited, and examples thereof include an ethylene- (meth) acrylic copolymer having a structure of the following general formula (1). By using such an ethylene- (meth) acrylic copolymer, the adhesion strength of the layer of the metal foil and the resin composition is further improved, and the hole position accuracy during the drilling process tends to be more improved. [Chemical 2]

In formula (1), R ₁ , R ₂ , and R ₃ each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more.

In the general formula (1), m is 1 or more, preferably 200 or more, and more preferably 500 or more. The upper limit of m is not particularly limited, but is preferably 3400 or less, more preferably 2500 or less, and even more preferably 2000 or less. In the general formula (1), n is 1 or more, preferably 50 or more, and more preferably 100 or more. The upper limit of n is not particularly limited, but is preferably 870 or less, more preferably 750 or less, and even more preferably 500 or less.

The ethylene- (meth) acrylic copolymer may be used singly or in combination of two or more polymers having different R ₁ , R ₂ , R ₃ , m, and n.

In the above olefin-unsaturated carboxylic acid copolymer, the ratio of the mole number (α) of the constituent unit derived from the olefin in the copolymer to the mole number (β) of the constituent unit derived from the unsaturated carboxylic acid monomer ( α: β) is preferably 60:40 to 99: 1, more preferably 65:35 to 95: 5, and even more preferably 80:20 to 95: 5. When the molar ratio of the constituent unit from the olefin is 60 or more, the copolymer has sufficient crystallinity, and will melt with good efficiency during drilling processing, so the cutting chip dischargeability is good. As a result, the hole position accuracy is excellent. tendency. On the other hand, when the molar ratio of the constituent units derived from the unsaturated carboxylic acid-based monomer is 1 or more, the stability when the copolymer is made into an aqueous dispersion tends to be more improved.

Further, in the ethylene- (meth) acrylic acid copolymer represented by the general formula (1), the molar number (α ′) of the structural unit derived from ethylene and the structural unit derived from (meth) acrylic acid in the copolymer The molar ratio (β ') ratio (α': β ') is preferably 60:40 to 99: 1, more preferably 65:35 to 95: 5, and even more preferably 80:20 to 95: 5. When the molar ratio of the constituent unit from ethylene is 60 or more, the copolymer has sufficient crystallinity, and will melt with good efficiency during drilling processing, so the cutting chip dischargeability is good, whereby the hole position accuracy is excellent. tendency. On the other hand, when the molar ratio of the structural unit derived from (meth) acrylic acid is 1 or more, the stability when the copolymer is made into an aqueous dispersion tends to be more improved. In particular, when the ratio (α ': β') in the ethylene- (meth) acrylic acid copolymer is in the range of 80:20 to 95: 5, the hole position accuracy during the drilling process tends to be more excellent.

In addition, when the ethylene- (meth) acrylic acid copolymer represented by the general formula (1) is an ethylene-acrylic acid copolymer, the molar number (α '') of the constituent units derived from ethylene and The molar ratio (β '') of the constituent units (α '': β '') is preferably 60:40 to 99: 1, more preferably 65:35 to 95: 5, and even more preferably 80. : 20 ~ 95: 5. When the molar ratio of the constituent unit from ethylene is 60 or more, the copolymer has sufficient crystallinity and will melt with good efficiency during drilling. Therefore, the chip discharge is good, and the hole position accuracy tends to be excellent. . On the other hand, when the molar ratio of the constituent units derived from acrylic acid is 1 or more, the stability of the copolymer when it is made into an aqueous dispersion tends to be improved. In particular, the ratio of the molar number of the constituent units derived from ethylene to the molar number of constituent units derived from acrylic acid in the ethylene-acrylic acid copolymer is in a range of 80:20 to 95: 5. , The hole position accuracy during drilling has a better tendency.

The weight average molecular weight of the polyolefin resin (C-1) is not particularly limited, but it is preferably 5 × 10 ³ or more and 1 × 10 ⁵ or less, more preferably 2 × 10 ⁴ or more and 8 × 10 ⁴ or less, and more preferably 4 × 10. ⁴ or more and 8 × 10 ⁴ or less. When the weight average molecular weight is 5 × 10 ³ or more, blocking is more suppressed, and the workability tends to be more improved. On the other hand, when the weight-average molecular weight is 1 × 10 ⁵ or less, the dischargeability of cutting chips during drilling is further improved, and the hole position accuracy tends to be more improved. The weight average molecular weight of the polyolefin resin can be determined according to a predetermined method using a GPC column with polystyrene as a standard substance.

The content of the polyolefin resin (C-1) in the resin composition is preferably 25 parts by mass or more and 80 parts by mass or less, more preferably 30 parts by mass or more and 60 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin (B). More preferably, it is 35 mass parts or more and 55 mass parts or less. When the content of the polyolefin resin (C-1) is 80 parts by mass or less, the inner wall roughness during the drilling process tends to be further reduced. In addition, when the content of the polyolefin resin (C-1) is 25 parts by mass or more, the dispersibility of the solid lubricant (A) in the layer of the resin composition is improved, and the hole position accuracy during drilling is improved. tendency. In particular, when the content of the polyolefin resin (C-1) is 30 parts by mass or more and 60 parts by mass or less, the high thermal conductivity possessed by the solid lubricant (A) in the layer of the resin composition will effectively function, so the hole processing is performed. The position accuracy of the hole tends to be better. Moreover, the adhesive strength of the layer of a metal foil and a resin composition tends to become favorable. In other words, since the content of the polyolefin resin (C-1) is 30 parts by mass or more and 60 parts by mass or less, both the adhesion strength of the metal foil and the resin composition layer and the hole position accuracy during the drilling process are excellent. tendency.

(Polyurethane Resin (C-2)) The polyurethane resin (C-2) is not particularly limited, and for example, a resin obtained by reacting a polyisocyanate compound, a polyol compound, and other compounds as necessary. Examples of the synthetic reaction of the polyurethane resin include an acetone method, a prepolymer mixing method, a ketamine method, and a hot-melt dispersion method.

The polyisocyanate compound is not particularly limited, for example, an organic polyisocyanate compound having two or more isocyanate groups in a molecule is generally used in the production of a polyurethane resin. Specific examples include 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate (HDI), 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, Aliphatic compounds such as methylcyclohexyl-2,4-diisocyanate, methylcyclohexyl-2,6-diisocyanate, xylene diisocyanate (XDI), tetramethylxylene diisocyanate, lysine diisocyanate Diisocyanates; 1,5'-cycloalkane diisocyanates, ditoluidine diisocyanates, diphenylmethylmethane diisocyanates, tetraalkyldiphenylmethane diisocyanates, 4,4'-dibenzyl diisocyanates, Aromatic diisocyanates such as 1,3-phenylene diisocyanate; lysine triisocyanate, triphenylmethane triisocyanate, 1,6,11-undecane triisocyanate, 1,8-isocyanate-4, 4-isocyanate methyloctane, 1,3,6-hexamethylene triisocyanate, dicycloheptane triisocyanate, adduct of trimethylolpropane and toluene diisocyanate, trimethylolpropane and 1,6 -Triisocyanates such as hexamethylene diisocyanate adducts. These compounds may be used individually by 1 type, and may use 2 or more types together.

The polyol compound is not particularly limited. For example, a polyol compound having two or more hydroxyl groups in the molecule is generally used in the production of polyurethane. Specific examples include polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, trimethylolpropane, and glycerol; Polyether polyol compounds such as polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol; from adipic acid, sebacic acid, itaconic acid, maleic anhydride, terephthalic acid, isophthalic acid, Fumar Acid, succinic acid, oxalic acid, malonic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid and other dicarboxylic acids, and ethylene glycol, diethylene glycol, propylene glycol, 1,4-butanediol , 1,6-hexanediol, neopentyl glycol, 1,2-propylene glycol, 1,3-propanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 1,3 Polyester polyol compounds obtained from polyols such as propylene glycol, tripropylene glycol, trimethylolpropane, and glycerol; polycaprolactone polyols, polyβ-methyl-δ-valerolactone-based polyester polyols Alcohol compounds; polybutadiene polyols or hydrides thereof, polycarbonate polyols, polythioether polyols, polyacrylate polyols, and the like. These compounds can be used individually by 1 type or in combination of 2 or more types.

(Polyester resin (C-3)) The polyester resin (C-3) is not particularly limited. For example, a raw material composed of a polyhydric alcohol compound having two or more hydroxyl groups and a polycarboxylic acid having two or more carboxyl groups is reduced. Resin obtained by polymerization.

It is not particularly limited as long as it is a polyol compound having two or more hydroxyl groups, for example, ethylene glycol, diethylene glycol, 1,3-propanediol, 1,2-propylene glycol, triethylene glycol, 2- Methyl-1,3-propanediol, 2,2-dimethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,4-butanediol, 2-methyl 1,4-butanediol, 2-methyl-3-methyl-1,4-butanediol, 3-methyl-1,5-pentanediol, 1,5-pentanediol, 3 -Alkane diols such as methyl-1,5-pentanediol and 1,6-hexanediol; ethylene oxide adducts of bisphenol A, propylene oxide adducts of bisphenol A, sorbitol, 1,2,3,6-hexanetetraol, 1,4-sorbitan, neopentaerythritol, dipentaerythritol, trinepentaerythritol, 1,2,4-butanetriol, 1,2 , 5-pentatriol, glycerol, 2-methylpropanetriol, 2-methyl-1,2,4-butanetriol, trimethylolethane, trimethylolpropane, 1,3, Diols with aromatic structures such as 5-trihydroxymethylbenzene. These compounds may be used alone or in combination of two or more.

It is not particularly limited as long as it is a polycarboxylic acid having two or more carboxyl groups, for example: terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, 1,2-cyclohexane Dicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2,4-benzenetricarboxylic acid, 2,5,7-naphthalenetricarboxylic acid, 1, 2,4-naphthalenetricarboxylic acid, 1,2,4-butanetricarboxylic acid, 1,2,5-hexanetricarboxylic acid, 1,3-dicarboxy-2-methyl-2-methylene Carboxypropane, 1,2,4-cyclohexanetricarboxylic acid, tetra (methylenecarboxy) methane, 1,2,7,8-octanetetracarboxylic acid, pyromellitic acid. These compounds may be used individually by 1 type, and may use 2 or more types together.

(Water-soluble resin (D)) The water-soluble resin (D) is not particularly limited as long as it is a water-soluble thermoplastic resin, and is selected, for example, from a derivative derived from polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, and cellulose. Diol compounds such as polymers, polyethylene glycol, polypropylene glycol, polytetramethylene glycol; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, poly Monoether compounds of polyoxyethylene such as oxyethylene nonylphenyl ether, polyoxyethylene octyl phenyl ether; polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan Monolaurate, polyglycerol monostearate; one or more of polyethylene oxide-polypropylene oxide copolymers and their derivatives. These compounds and copolymers may be used alone or in combination of two or more. By using such a water-soluble resin (D), the pore position accuracy is further improved, and the inner wall roughness tends to be further reduced. The "water-soluble resin" means a resin having a solubility of 100 g or more in water at 25 ° C and 1 atmosphere.

The content of the water-soluble resin (D) in the resin composition is preferably 20 to 100 parts by mass, more preferably 20 to 75 parts by mass, and more preferably 100 parts by mass of the thermoplastic resin (B). It is 25 mass parts or more and 70 mass parts or less. When the content of the water-soluble resin (D) is within the above range, the inner wall roughness during the drilling process tends to be further reduced. In particular, when the content of the water-soluble resin (D) is 20 parts by mass or more and 75 parts by mass or less, the hole position accuracy during drilling processing tends to be more improved.

The water-soluble resin (D) should preferably contain a polymer water-soluble resin (d1) having a weight average molecular weight of 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less and / or a low molecular weight of 5 × 10 ² or more and 3 × 10 ⁴ or less. A water-soluble resin (d2) is preferable, and a polymer-containing water-soluble resin (d1) and a low-molecular-weight water-soluble resin (d2) are more preferable. The use of such a water-soluble resin (D) tends to improve the accuracy of hole positions during drilling.

(Polymer water-soluble resin (d1)) The polymer water-soluble resin (d1) is a water-soluble thermoplastic resin having a weight average molecular weight of 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less. By using such a high-molecular-weight water-soluble resin (d1), the sheet formability of the resin composition layer is improved, a stronger resin composition layer can be formed, and the thickness of the resin composition layer can be uniform Furthermore, the adhesion between the surface of the layer of the resin composition and the surface of the metal foil is increased. As a result, the accuracy of the hole position during drilling is improved, and the adhesion between the layer of the metal foil and the resin composition is enhanced.

The polymer water-soluble resin (d1) is not particularly limited. For example, one or two or more selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, and cellulose derivatives. Among them, polyethylene oxide is more preferable. By using such a polymer water-soluble resin (d1), the sheet formability is further improved, and the hole position accuracy during drilling processing tends to be more improved. The polymer water-soluble resin (d1) may be used singly or in combination of two or more kinds.

The weight average molecular weight of the polymer water-soluble resin (d1) is 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less, preferably 1 × 10 ⁵ or more and 1.5 × 10 ⁶ or less, and more preferably 2 × 10 ⁵ or more and 1.5 × 10 ⁶ or more. the following. When the weight-average molecular weight of the polymer water-soluble resin (d1) is within the above range, the film forming property of the resin composition layer is improved when the auxiliary plate is manufactured, the inner wall roughness is reduced during drilling, and the hole position is reduced. The accuracy tends to be improved. The weight average molecular weight can be measured by a general method such as liquid chromatography equipped with a GPC column.

The content of the polymer water-soluble resin (d1) is preferably 2 to 50 parts by mass, more preferably 3 to 20 parts by mass, and more preferably 5 to 100 parts by mass of the thermoplastic resin (B). Above 15 parts by mass. When the content of the polymer water-soluble resin (d1) is 2 parts by mass or more and 50 parts by mass or less, the inner wall roughness during the drilling process tends to be further reduced. In addition, when the content of the polymer water-soluble resin (d1) is 3 parts by mass or more and 20 parts by mass or less, the hole position accuracy at the time of drilling processing tends to be further improved.

(Low-molecular-weight water-soluble resin (d2)) Among the low-molecular-weight water-soluble resin (d2) is a water-soluble thermoplastic resin, the weight average molecular weight is 5 × 10 ² or more and 3 × 10 ⁴ or less. By using such a low-molecular-weight water-soluble resin (d2), the effect as a lubricating material of the auxiliary plate is further improved, and the hole position accuracy during drilling processing tends to be further improved.

The low-molecular-weight water-soluble resin (d2) is not particularly limited, and is selected, for example, from diol compounds such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, Mono-ether compounds of polyoxyethylene such as polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether; polyoxyethylene monostearate, polyoxyethylene Sorbitan monostearate, polyoxyethylene sorbitan monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymers and their derivatives One or more of them. Among them, diol compounds are more preferable, and polyethylene glycol is more preferable. By using such a low-molecular-weight water-soluble resin (d2), the effect as a lubricating material of the auxiliary plate is further improved, and the hole position accuracy during drilling processing tends to be further improved. The low-molecular-weight water-soluble resin (d2) may be used singly or in combination of two or more kinds.

The weight average molecular weight of the low molecular weight water-soluble resin (d2) is 5 × 10 ² or more and 3 × 10 ⁴ or less, preferably 1 × 10 ³ or more and 3 × 10 ⁴ or less, and more preferably 1 × 10 ³ or more and 1 × 10 ⁴ the following. The weight-average molecular weight of the low-molecular-weight water-soluble resin (d2) is within the above range, and the lubricity during drilling is further improved, the inner wall roughness is reduced during drilling, and the accuracy of the hole position is improved. Propensity. The weight average molecular weight can be measured according to a general method such as liquid chromatography equipped with a GPC column.

The content of the low-molecular-weight water-soluble resin (d2) is preferably 3 to 60 parts by mass, more preferably 20 to 60 parts by mass, and more preferably 30 to 100 parts by mass of the thermoplastic resin (B). At least 55 parts by mass. When the content of the low-molecular-weight water-soluble resin (d2) is within the above-mentioned range, both the adhesive strength between the metal foil and the resin composition and the accuracy of the hole position during the hole-opening process tend to be excellent.

Among the above, the water-soluble resin (D) contains a polymer water-soluble resin (d1) having a weight average molecular weight of 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less and a low-molecular-weight water-soluble resin having a weight average molecular weight of 5 × 10 ² or more and 3 × 10 ⁴ or less. Polymer (d2) polymer water-soluble resin (d1) is one or two or more selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone and cellulose derivatives, The low-molecular-weight water-soluble resin (d2) is selected from glycol compounds such as polyethylene glycol, polypropylene glycol, and polytetramethylene glycol, polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, and polyoxyethylene stearin. Ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, and other polyoxyethylene monoether compounds, polyoxyethylene monostearate, polyoxyethylene sorbitan monohard 1 or 2 of the group consisting of fatty acid esters, polyoxyethylene sorbitan monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymers, and their derivatives More than one kind is better. By using such a water-soluble resin (D), the inner wall roughness and / or hole position accuracy during the drilling process tends to be more improved. Among them, the weight average molecular weight of the polymer water-soluble resin (d1) is 1 × 10 ⁵ or more and 1.5 × 10 ⁶ or less, and further 2 × 10 ⁵ or more and 1.5 × 10 ⁶ or less, and the weight average molecular weight of the low-molecular water-soluble resin (d2). When it is 1 × 10 ³ or more and 3 × 10 ⁴ or less, the hole position accuracy during the drilling process tends to be particularly excellent, and therefore it is particularly preferable.

(Other components) The resin composition may contain additives as needed. The types of additives are not particularly limited, such as: surface modifiers, levelling agents, antistatic agents, emulsifiers, defoamers, wax additives, coupling agents, rheology control agents, preservatives, antifungal agents, antioxidants, Light stabilizers, nucleating agents such as sodium formate, heat stabilizers, and coloring agents.

[Manufacturing method of auxiliary plate for drilling] There is no particular limitation on the manufacturing method of auxiliary plate for drilling in this embodiment, as long as it is a method of forming a layer of a resin composition on at least one side of a metal foil, it can be used generally Manufacturing method.

The method for forming the layer of the resin composition is not particularly limited, and a known method can be used. In such a method, for example, a solution of the resin composition obtained by dissolving or dispersing the solid lubricant (A), the water-insoluble resin (C), the water-soluble resin (D), and the additive added as necessary in a solvent is applied. A method such as a method of coating on a metal foil, and then drying and / or cooling and solidification. Here, the water-insoluble resin (C) may be added, for example, in the form of an aqueous dispersion of a polyolefin resin (C-1).

When a solution of the resin composition is coated on a metal foil by a coating method or the like and dried to form a layer of the resin composition, the solvent used for the solution of the resin composition is preferably water. Among them, ion-exchanged water More ideal. A mixed solution of water and a solvent having a lower boiling point than water may be used. By using a mixed solution of water and a solvent having a lower boiling point than water, it is possible to effectively reduce the residual air bubbles in the layer of the resin composition. The type of the solvent having a lower boiling point than water is not particularly limited, and examples thereof include alcohol compounds such as ethanol, methanol, and isopropanol, and low boiling point solvents such as methyl ethyl ketone and acetone may also be used. Further, as other solvents, solvents such as tetrahydrofuran and acetonitrile, which have a high compatibility with a resin composition in a part mixed with water and an alcohol compound, may be used.

In addition, the state of the polyolefin resin (C-1) when the auxiliary plate for drilling is manufactured, that is, the state of the polyolefin resin (C-1) when a layer of the resin composition is formed is not particularly limited, and it is preferably water The state of the dispersion is better. The manufacturing method of the aqueous dispersion of a polyolefin resin (C-1) is not specifically limited, A well-known method can be used. For example, a method of stirring the above-mentioned olefin-unsaturated carboxylic acid copolymer, an aqueous solvent, and optionally other components such as an alkali and an emulsifier using a solid-liquid stirring device or the like.

There are no special restrictions on the bases used in the manufacture of aqueous dispersions of polyolefin resin (C-1), such as ammonia, diethylamine, triethylamine, monoethanolamine, dimethylethanolamine, diethylethanolamine and other amine compounds, hydrogen Alkali metal hydroxides such as sodium oxide and potassium hydroxide. Among them, in consideration of the compatibility of solvents when preparing a solution of a resin composition for forming a layer of a resin composition described later, diethylamine, triethylamine, monoethanolamine, dimethylethanolamine, and diethylethanolamine are compared with good.

There are no special restrictions on the emulsifiers used in the manufacture of aqueous dispersions of polyolefin resin (C-1), such as: saturated fatty acids such as stearic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, and linolenic acid unsaturated fatty acids such as linolenic acid, linoleic acid, and oleic acid. Among these, stearic acid is preferred from the viewpoints of compatibility with aqueous solvents and oxidation resistance.

As the aqueous dispersion of the polyolefin resin (C-1), a commercially available product can also be used. Examples of commercially available products of the aqueous dispersion of a polyolefin resin (C-1) include HITECH S3121 (ethylene-acrylic acid copolymer, weight average molecular weight 6 × 10 ⁴ , molybdenum derived from ethylene) produced by Toho Chemical Industry Co., Ltd. Number of ears: Molar number from acrylic units = 90: 10, blended with stearic acid as emulsifier), Zaikthene L (ethylene-acrylic acid copolymer, weight average molecular weight 5 × 10, manufactured by Sumitomo SEIKA CO., LTD.) ⁴ , Molar number from the constituent unit of ethylene: Molar number from the constituent unit of acrylic acid = 70:30, dimethylethanolamine is blended as a base).

[Drilling processing method] The drilling processing method of this embodiment includes a hole forming step of forming a hole in a laminated board or a multilayer board using the above-mentioned auxiliary board for drilling. In addition, generally, a "copper-clad laminate" is usually used for a laminate. However, the laminate of this embodiment may be a "laminate without a copper foil on the outer layer." That is, if there is no special instruction in this embodiment, the laminated board means a "copper-clad laminated board" and / or a "laminated board having no copper foil on the outer layer". During drilling, as shown in FIG. 1, the drilling rig 3 can enter from the layer side of the resin composition of the auxiliary plate, and the drilling rig can also enter from the metal foil side.

The drilling method can be performed by a known method without any particular limitation. In consideration of the viewpoint of more effectively and surely exerting the purpose of this embodiment, the diameter (bit diameter) of the drill is preferably 0.50 mmφ or less, more preferably 0.05 mmφ or more and 0.50 mmφ or less, and still more preferably 0.05 mmφ or more and 0.20 mmφ or less. Among them, a drill with a small diameter of 0.05 mmφ or more and 0.20 mmφ or less, where the accuracy of the position of the hole is important, is more effective and surely used for the purpose of this embodiment. In addition, the drill life is also greatly improved, which is ideal. . In addition, the drill diameter of 0.05mmφ is the lower limit of the drill diameter that can be obtained. If a drill with a smaller diameter can be obtained, this is not the limit. In addition, the auxiliary plate of this embodiment has no problem in the drilling process using a drill having a diameter exceeding 0.50 mmφ.

The auxiliary board for drilling according to the present embodiment is suitably used for drilling a printed circuit board material, more specifically, a laminated board or a multilayer board. Specifically, an auxiliary board can be arranged on at least the topmost surface of a laminated board or a multilayer board or a plurality of sheets (printed circuit board materials) such that the metal foil side contacts the printed circuit board materials, and from this The top surface (layer side of the resin composition) is drilled. [Example]

The effects of the embodiments of the present invention and comparative examples that fall outside the scope of the present invention are compared and explained below. Moreover, "polyethylene glycol" may be abbreviated as "PEG" and "polyethylene oxide" may be abbreviated as "PEO".

The methods for measuring the inner wall roughness and hole position accuracy of the examples and comparative examples will be described below.

<Measurement of inner wall roughness> The inner wall roughness was measured in the following manner. On the top surface of a copper-clad laminated board (HL830, copper foil thickness 12 μm, two panels, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with a thickness of 0.8 mm, an auxiliary plate for drilling is arranged to make the auxiliary plate for drilling The layer side of the resin composition becomes the top surface, and an abutment plate (paper phenol laminated plate SPB-W, Japan Decoluxe (stock) ) Company system). Then, a 0.25 mm φ drill (trade name: NEUL026, manufactured by Uniontool Co., Ltd.) was used, and the hole-forming process was performed under the conditions of a rotation speed: 160,000 rpm, and a conveying speed: 14.1 μm / rev. The drilling process uses a single drill to make 3,000 holes. The evaluation of the inner wall roughness was performed as follows. After the uppermost plate of the copper-clad laminated plate that has been subjected to the drilling process is subjected to a plating treatment, the cross-section grinding is performed until the processed hole is seen. An inverted optical microscope GX51 (manufactured by Olympus) was used to take a photograph of the cross section of the substrate, and a measurement system attached to the inverted optical microscope was used to measure the maximum roughness of the inner wall of each through hole. At the measurement point, 10 through holes from the 2,991th hole to the 3,000th hole were calculated, and an average of 20 points was calculated.

The inner wall roughness was determined based on the average 値 obtained as described above. The criteria for determining the hole position accuracy are as follows. A: less than 14.0 μm B: more than 14.0 μm and less than 15.0 μm C: more than 15.0 μm and less than 16.0 μm D: more than 16.0 μm and less than 17.0 μm E: more than 17.0 μm

<Measurement of Hole Position Accuracy> The hole position accuracy was measured in the following manner. An auxiliary plate for drilling is arranged on the top surface of five copper-clad laminates (trade name: HL832NXA-EX, copper foil thickness 12 μm, two panels, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with a thickness of 0.2 mm. The layer side of the resin composition of the auxiliary board for drilling is made the top surface, and a contact plate (paper phenol laminated plate) with a thickness of 1.5 mm is arranged on the back surface (top surface) of the lowermost plate of the overlapped copper-clad laminated plate. PS1160-G, Lichang Co., Ltd.). Then, a 0.2 mmφ drill (trade name: MCL897W, manufactured by Uniontool Co., Ltd.) was used, and the hole-forming process was performed under the conditions of a rotation speed: 200,000 rpm and a conveying speed: 2.6 m / min. The drilling process uses two drills to implement 3,000 holes, and a total of 6,000 holes are drilled.

(在此，n代表使用之鑽機之根數。)The evaluation of the hole position accuracy was performed as follows. On the back surface (bottom surface) of the lowermost plate of the overlapped copper-clad laminate, a hole analyzer (model: HA-1AM, Hitachi viamechanics (KK) Co., Ltd.) was used to measure the deviation between the hole position and the designated coordinates. For the weight of one drill bit, calculate the average 値 and standard deviation (σ) for the deviation, and calculate "average 値 + 3σ". Then, in terms of the accuracy of the hole position of the entire drilling process, the average 値 for the two drill bits used is calculated relative to the 値 of "average 値 + 3σ". The working formula used when calculating the hole position accuracy is as follows. [Number 1]

(Here, n represents the number of rigs used.)

Determine the hole position accuracy based on the hole position accuracy calculated according to the above formula. The criterion for judging the accuracy of hole position is as follows. A: 10.0 μm or less B: 10.0 μm or more and 12.0 μm C: 12.0 μm or more and 15.0 μm D: 15.0 μm or more and 17.5 μm E: 17.5 μm or more

<Raw Materials> Table 1 shows the specifications of the raw materials used in the manufacture of the auxiliary plate for drilling in Examples, Reference Examples, and Comparative Examples. As the solid lubricant (A), flaky graphite, earthy graphite, artificial graphite, boron nitride, and melamine melamine were used. The symbols are used to show the raw materials used in Table 4 or 5.

【Table 1】

Table 2 shows the solid lubricants (A) used in the examples, reference examples, and comparative examples, and carbon black and alumina in the comparative example, which replaced the solid lubricants (A) as fillers, and shows the use of raw materials, the presence or absence of pretreatment, and Specification of particle size. Regarding the solid lubricant (A), the untreated product was used, and pretreatment such as pulverization treatment was further performed, and adjusted to the median diameter (D50), 10% particle diameter (D10), and 90% particle diameter (D90) described in Table 2. , And △ D. In addition, the symbols are used to indicate the raw materials used in Table 4 or 5.

The median diameter, 10% particle diameter, and 90% particle diameter were determined as follows. The substance for measuring the particle size was dispersed in isopropanol, and projection was performed using a laser diffraction type particle size distribution measuring device, and the maximum length of the particles of the substance for measuring the particle size was measured. Then, a cumulative distribution curve of particle diameters (number basis) was calculated. The median diameter (D50) is defined as the particle diameter that becomes 50% of the height in this cumulative distribution curve (number basis). In addition, a particle diameter in which the particle diameter is accumulated from a smaller side to a height of 10% is defined as a 10% particle diameter (D10). In addition, a particle diameter in which the particle diameter is accumulated from the smaller side to a height of 90% is defined as a 90% particle diameter (D90). ΔD is calculated by subtracting D10 from D90.

【Table 2】

Table 3 shows the specifications of the polyolefin resin (C-1). The appearance of these polyolefin resins (C-1) is an aqueous dispersion, and the solid content concentration of the resin in the aqueous dispersion is shown in Table 3. The polyolefin resin (C-1) is an ethylene-acrylic acid copolymer. The ratio of the number of structural units (m) derived from ethylene to the number of structural units (n) derived from (meth) acrylic acid (m: n), and the weight The average molecular weight is shown below. The ratio (m: n) is calculated by the ¹ H-NMR method and the DQF-COSY method, which are nuclear magnetic resonance spectroscopic methods. The weight average molecular weight is measured by a method described later. In addition, the symbols are used to indicate the raw materials used in Table 4 or 5.

※(α’：β’)；來自乙烯之結構單元數(α’)與來自(甲基)丙烯酸之結構單元數(β’)之比【table 3】

※ (α ': β'); the ratio of the number of structural units (α ') derived from ethylene to the number of structural units (β') derived from (meth) acrylic acid

<Method for measuring weight average molecular weight of polyolefin resin (C-1)> The weight average molecular weight of polyolefin resin (C-1) is a liquid chromatography equipped with a GPC column (manufactured by Shimadzu Corporation). Polystyrene was measured as a reference material, and the relative average molecular weight was calculated. The equipment and analysis conditions are shown below. (Used equipment) Shimadzu high-speed liquid chromatography ProminenceLIQUID System controller: CBM-20A Infusion unit: LC-20AD Online degasser: DGU-20A3 Automatic sampler: SIL-20AHT column oven: CTO-20A Differential refractive index Detector: RIO-10A LC Workstation: LC Solution (Analytical Conditions) Columns: Phenogel 5μ 10E5A 7.8 × 300 × 1 Phenogel 5μ 10E4A 7.8 × 300 × 1 Phenogel 5μ 10E3A 7.8 × 300 × 1 protection column: Phenogel guard column 7.8 × 50 × 1 protection by Phenomenex Eluent: Tetrahydrofuran for high-speed liquid chromatography manufactured by Kanto Chemical Co., Ltd. Flow rate: 1.00mL / min Column temperature: 45 ° C (Polystyrene for calibration line production) Weight average molecular weight of Shodex standard SL105, SM105 standard polystyrene manufactured by Showa Denko: 580, 1390, 2750, 6790, 13200, 18500, 50600, 123000, 259000, 639000, 1320000, 240,000

Hereinafter, the manufacturing method of the auxiliary board for drilling in an Example, a reference example, and a comparative example is demonstrated.

<Example 1> An aqueous dispersion of a polyolefin resin (C-1) (HITECH S3121, manufactured by Toho Chemical Industry Co., Ltd., weight average molecular weight 6 × 10 ⁴ , m: n = 90: 10) was used as a resin solid. Component content: 35 parts by mass, 8 parts by mass of high molecular weight water-soluble resin (d1) polyethylene oxide (AlkoxE-45, manufactured by Mingcheng Chemical Industry Co., Ltd., weight average molecular weight 5.6 × 10 ⁵ ), low molecular weight water-soluble 57 parts by mass of resin (d2) polyethylene glycol (PEG4000S, manufactured by Sanyo Chemical Industry Co., Ltd., weight average molecular weight 3.3 × 10 ³ ) was dissolved in water to obtain an aqueous solution. In the obtained aqueous solution, 18 parts by mass of solid lubricant (A) graphite (a-1) (W-5, manufactured by Ito Solid Lubricants Industrial Co., Ltd., median diameter of 3.4 μm, ΔD = 4.65 μm), This was dispersed to obtain a solution having a concentration of 30% by mass of the solid content (including the solid lubricant) of the resin composition.

100 parts by mass of the resin solid content (excluding the solid lubricant) in this solution was added with 1.2 parts by mass of a surface conditioner (BYK349, BYK Chemie Japan Co., Ltd.) and uniformly dispersed to obtain a resin composition. A solution of a resin composition of an object layer.

The obtained solution of the resin composition was applied to an aluminum foil (using aluminum foil: JIS-A1100H18, thickness 0.1 mm, manufactured by Mitsubishi Aluminum Corporation) using a coating rod, and the thickness of the layer of the resin composition after drying and curing was applied. It is 0.05mm. Next, it dried at 120 degreeC for 3 minutes using the dryer, and it was made to cool and solidify, and it was set as the auxiliary board for drilling.

The inner wall roughness and hole position accuracy were measured according to the above method, and the results are shown in Table 4 or 5. In Table 4 or 5, the content of the water-insoluble resin (C) is the content of the resin solid content.

〈Examples 2 ~ 24, 26〉 According to Example 1, the resin composition solution was prepared with the types and contents of the raw materials shown in Table 4 or 5. The layers of the dried and cured resin composition were prepared. Auxiliary plate for drilling with a thickness of 0.05mm. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured, and the results are shown in Table 4 or 5.

<Example 25> In Example 1, the aluminum foil was replaced with an aluminum foil with an adhesive layer (using aluminum foil: JIS-A1100H18, thickness 0.1 mm, made by Mitsubishi Aluminum Corporation, adhesive layer: epoxy resin), and According to Example 1, a solution of the resin composition was prepared with the types and contents of the raw materials shown in Table 5 and an auxiliary plate for drilling having a thickness of 0.05 mm of the layer of the dried and cured resin composition was prepared. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured. Table 5 shows these results.

〈Examples 27 to 28〉 According to Example 1, the resin composition solution was prepared with the types and contents of the raw materials shown in Table 5 and the thickness of the dried and cured resin composition layer was 0.05 mm. Auxiliary plate for drilling. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured. Table 5 shows these results.

<Comparative Examples 1, 2, 4> According to Example 1, the resin composition solution was prepared with the types and contents of the raw materials shown in Table 5 and the thickness of the dried and cured resin composition layer was 0.05. Auxiliary plate for drilling in mm. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured. Table 5 shows these results.

<Comparative Example 3> The aluminum foil in Example 1 was replaced with an aluminum foil with an adhesive layer (using aluminum foil: JIS-A1100H18, thickness 0.1 mm, manufactured by Mitsubishi Aluminum Corporation, adhesive layer: epoxy resin), and According to Example 1, a solution of the resin composition was prepared with the types and contents of the raw materials shown in Table 5 and an auxiliary plate for drilling with a thickness of 0.05 mm of the layer of the dried and cured resin composition was prepared. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured. Table 5 shows these results.

<Comparative Examples 5 to 6> According to Example 1, the resin composition solution was prepared with the types and contents of the raw materials shown in Table 5 and the thickness of the dried and cured resin composition layer was 0.05 mm. Auxiliary plate for drilling. For the obtained auxiliary plate for drilling, the inner wall roughness and hole position accuracy were measured. Table 5 shows these results.

【Table 4】

【table 5】

From Examples 1 to 26 in Table 4, it can be seen that the resin composition that forms the resin composition layer in the auxiliary plate for drilling includes the solid lubricant (A) and the thermoplastic resin (B). The inner wall has good roughness.

In particular, the solid lubricant (A) contained in the resin composition has a median diameter of 1 μm or more and 8 μm or less, and if the difference between the 90% and 10% particle diameters of the solid lubricant (A) is 1 μm or more and 17 μm or less, drilling The hole position accuracy during machining tends to be excellent.

The reference examples 1 and 2 using melamine melamine and boron nitride as the solid lubricant (A) had a relatively poor inner wall roughness compared to Examples 1 to 26. In addition, Reference Example 3 in which the water-insoluble resin (C) was not used was a result in which the inner wall roughness was good but the hole position accuracy was slightly inferior. In Reference Example 4, the hole position accuracy was slightly inferior.

When the solid lubricant (A) was replaced with Comparative Examples 1 and 2 using carbon black and alumina, the inner wall roughness was poor. Among them, Comparative Example 1 in which carbon black different from the solid lubricant (A) and non-dissolvable carbon black was used, the hole position accuracy was particularly poor.

Further, Comparative Examples 3 and 4 in which the thermoplastic resin (B) forming the layer of the resin composition did not contain the solid lubricant (A) did not improve the lubricity due to the solid lubricant (A), so the inner wall roughness was poor.

From the results of the above examples, it can be said that the solid lubricant disclosed by the present invention exerts a special effect. That is, it can be seen that the auxiliary plate for drilling includes a metal foil and a layer of a resin composition formed on at least one side of the metal foil. When the resin composition contains a solid lubricant (A) and a thermoplastic resin (B), The inner wall roughness of the machined hole during drilling is good. In addition, it can be seen that if the median diameter of the solid lubricant (A) is 1 μm or more and 8 μm or less and the difference between the 90% particle diameter and the 10% particle diameter of the solid lubricant (A) is 1 μm or more and 17 μm or less, the hole during drilling is Position accuracy tends to be excellent.

This application is based on a Japanese patent application filed in the Japan Patent Office on May 31, 2016 (Japanese Patent Application No. 2016-108437), the contents of which are incorporated herein by reference. [Industrial availability]

The drilling processing of the auxiliary plate for drilling of the present invention on a laminated board or a multilayer board has industrial applicability.

1‧‧‧ layer of resin composition
2‧‧‧ metal foil
3‧‧‧ Rig

FIG. 1 is a schematic diagram showing an aspect of a drilling auxiliary plate and a drilling processing method using the auxiliary plate according to the present embodiment.

no

Claims (22)

An auxiliary plate for drilling, comprising: a metal foil and a layer of a resin composition formed on at least one side of the metal foil, the resin composition containing a solid lubricant (A) having cleavability and The thermal conductivity of the thermoplastic resin (B) and the solid lubricant (A) is 100 to 5000 W / m · K. For example, the auxiliary plate for drilling of item 1 of the patent application scope, wherein the solid lubricant (A) has a median diameter of 1 μm or more and 10 μm or less, and 90% of the particle diameter and 10% of the solid lubricant (A) The difference in diameter is 1 μm or more and 20 μm or less. For example, the auxiliary plate for drilling according to item 1 or 2 of the scope of patent application, wherein the content of the solid lubricant (A) in the resin composition is 5 parts by mass or more relative to 100 parts by mass of the thermoplastic resin (B) 150 Mass parts or less. For example, the auxiliary plate for drilling according to item 1 or 2 of the patent application scope, wherein the solid lubricant (A) has a median diameter of 1 μm or more and 8 μm or less, and 90% of the particle diameter of the solid lubricant (A) and 10 The difference in% particle size is 1 μm or more and 17 μm or less. For example, the auxiliary plate for drilling according to item 1 or 2 of the scope of patent application, wherein the content of the solid lubricant (A) in the resin composition is 15 parts by mass or more relative to 100 parts by mass of the thermoplastic resin (B) 120 Mass parts or less. For example, in the auxiliary plate for drilling according to item 1 or 2, the thermoplastic resin (B) contains a water-insoluble resin (C). For example, the auxiliary plate for drilling according to item 6 of the patent application, wherein the content of the water-insoluble resin (C) is 25 parts by mass or more and 80 parts by mass or less based on 100 parts by mass of the thermoplastic resin (B). For example, the auxiliary board for drilling according to item 6 of the patent application, wherein the water-insoluble resin (C) contains a polyolefin resin (C-1). For example, in the auxiliary plate for drilling according to item 8 of the patent application scope, the polyolefin resin (C-1) contains an ethylene- (meth) acrylic copolymer. For example, the auxiliary plate for drilling according to item 9 of the scope of patent application, wherein the ethylene- (meth) acrylic copolymer contains a polymer having a structure of the following general formula (1);

(1) In formula (1), R ₁ , R ₂ , and R ₃ each independently represent a hydrogen atom or a methyl group, and m and n are each independently an integer of 1 or more. For example, the auxiliary plate for drilling in item 9 of the scope of patent application, wherein the mole number of the constituent unit derived from ethylene and the mole of the constituent unit derived from (meth) acrylic acid in the ethylene- (meth) acrylic acid copolymer The ratio of the numbers is expressed in terms of the number of moles from the constituent units of ethylene: the number of moles from the constituent units of (meth) acrylic acid, and ranges from 60:40 to 99: 1. For example, in the auxiliary plate for drilling according to item 8 of the scope of patent application, the content of the polyolefin resin (C-1) in the resin composition is 25 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin (B). Mass parts or less. For example, the auxiliary plate for drilling according to item 8 of the scope of patent application, wherein the weight average molecular weight of the polyolefin resin (C-1) is 5 × 10 ³ or more and 1 × 10 ⁵ or less. For example, the auxiliary plate for drilling according to item 1 or 2 of the patent application scope, wherein the thermoplastic resin (B) contains a water-soluble resin (D). For example, the auxiliary board for drilling according to item 14 of the patent application scope, wherein the water-soluble resin (D) contains a material selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, cellulose derivative, and polymer. Glycol, polypropylene glycol, polytetramethylene glycol, monoether compounds of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan One or more types of monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymer, and their derivatives. For example, in the auxiliary plate for drilling according to the scope of application for item 14, the content of the water-soluble resin (D) is 20 mass parts or more and 100 mass parts or less based on 100 mass parts of the thermoplastic resin (B). For example, the auxiliary plate for drilling according to item 14 of the patent application scope, wherein the water-soluble resin (D) contains a polymer water-soluble resin (d1) having a weight average molecular weight of 5 × 10 ⁴ or more and 1.5 × 10 ⁶ or less and a weight average molecular weight. A low-molecular water-soluble resin (d2) of 5 × 10 ² or more and 3 × 10 ⁴ or less. The high-molecular water-soluble resin (d1) contains a material selected from the group consisting of polyethylene oxide, polypropylene oxide, polyvinylpyrrolidone, and One or two or more of the group consisting of cellulose derivatives. The low-molecular-weight water-soluble resin (d2) is selected from the group consisting of polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polyoxyethylene. Oil ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene monostearate, poly Group consisting of oxyethylene sorbitan monostearate, polyoxyethylene sorbitan monolaurate, polyglycerol monostearate, polyethylene oxide-polypropylene oxide copolymer, and derivatives thereof One or more of the group. For example, the auxiliary board for drilling of item 17 of the scope of patent application, wherein the content of the polymer water-soluble resin (d1) is 2 to 50 parts by mass relative to 100 parts by mass of the thermoplastic resin (B). For example, in the auxiliary plate for drilling according to the scope of application for item 17, the content of the low-molecular-weight water-soluble resin (d2) is 3 to 60 parts by mass relative to 100 parts by mass of the thermoplastic resin (B). For example, the auxiliary plate for drilling according to item 1 or 2 of the scope of patent application, wherein the thickness of the layer of the resin composition is 0.02 to 0.3 mm. For example, the auxiliary plate for drilling according to item 1 or 2 of the patent application scope, wherein the thickness of the metal foil is 0.05 mm to 0.5 mm. A drilling processing method is to form a hole in a laminated board or a multilayer board using an auxiliary board for drilling according to any one of claims 1 to 21 of the patent application scope.