TW201732092A - Adjustment plate and plating device and plating method therewith - Google Patents

Abstract

Provided are: a regulation plate capable of preventing a plurality of substrates which differ in properties and treatment conditions from being reduced in in-plane uniformity due to the terminal effect; and a plating apparatus provided with the same. According to one embodiment in the present invention, a regulation plate is provided for adjusting a current between an anode and a substrate to be plated . This regulation plate comprises: a plate main body having an opening through which the current passes; a plurality of first blades for restricting the diameter of the opening; and a first movement mechanism for moving the plurality of first blades in a translational manner in the radial direction of the opening.

Description

Adjustment plate and plating device and plating method therewith

The present invention relates to an adjustment plate and a plating apparatus and a plating method including the same.

Conventionally, a wiring for forming a fine wiring groove, a hole, or a resist opening provided on a surface of a substrate such as a semiconductor wafer is formed, and a bump (protrusion electrode) electrically connecting a package electrode or the like is formed on the surface of the substrate. As a method of forming the wiring and the bump, for example, an electrolytic plating method, a vapor deposition method, a printing method, a ball bump method, or the like is known. As the number of I/Os of semiconductor wafers increases and the pitch is finer, an electrolytic plating method which is finer and relatively stable in performance is often used.

In the case where wiring or bumps are formed by electrolytic plating, a seed layer (power supply layer) having a low electric resistance is formed on the surface of the barrier metal provided in the wiring trench, the hole or the resist opening portion on the substrate. On the surface of the seed layer, the plating film grows. In recent years, as wiring and bumps have been miniaturized, a seed layer having a thinner film thickness has been used. When the film thickness of the seed layer is thinned, the electric resistance (thin film resistance) of the seed layer is increased.

Generally, the plated substrate has electrical contacts at its peripheral portion. Therefore, a current flows in the central portion of the substrate, and this current corresponds to the combined resistance of the resistance value of the plating solution and the resistance value of the seed layer from the central portion of the substrate to the electrical contact. On the other hand, in the peripheral portion of the substrate (near the electrical contact), almost a current corresponding to the resistance value of the plating liquid flows. That is, in the central portion of the substrate, the current is hard to flow only from the central portion of the substrate to the resistance value of the seed layer of the electrical contact. The phenomenon in which current concentrates on the peripheral portion of the substrate is called a terminal effect.

In a substrate having a seed layer having a relatively thin film thickness, the resistance value of the seed layer from the central portion of the substrate to the electrical contact is relatively large. Therefore, in the case of plating a substrate having a seed layer having a relatively thin film thickness, the terminal effect becomes remarkable. As a result, the plating speed at the central portion of the substrate is lowered, and the thickness of the plating film at the central portion of the substrate is thinner than the plating film at the peripheral portion of the substrate, and the in-plane uniformity of the film thickness is lowered.

In order to suppress the in-plane uniformity of the film thickness due to the terminal effect, it is necessary to adjust the electric field applied to the substrate. For example, a plating apparatus is known in which an adjustment plate for adjusting a potential distribution between an anode and a substrate is provided between an anode and a substrate (see Patent Document 1).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] JP-A-2005-029863

However, the effect of the terminal effect differs depending on the film thickness of the substrate seed layer. Specifically, as described above, when the film thickness of the seed layer is relatively thin, the sheet resistance is relatively large, so that the effect of the terminal effect is remarkable. On the other hand, in the case where the film thickness of the seed layer is relatively thick, the sheet resistance is relatively small, so that the influence of the terminal effect becomes relatively small.

Moreover, the effect of the terminal effect is not only different depending on the film thickness of the seed layer, but also varies depending on other factors. For example, in the case where the resist opening ratio of the substrate (the ratio of the area of the portion (the resist opening portion) not covering the protective layer in the area of the region where the outer edge of the protective layer is in contact) is relatively high, on the substrate The area of the formed plating film is relatively large. Therefore, as a plating film is formed on the substrate, current is also likely to flow in the central portion of the substrate by the formed plating film. In other words, as the plating film is formed on the substrate, the resistance value from the central portion of the substrate to the electrical contact becomes small, so that the influence of the terminal effect is gradually reduced. On the other hand, when the resist opening ratio of the substrate is relatively low, even if a plating film is formed on the substrate, the resistance from the central portion of the substrate to the electrical contact is higher than when the resist opening ratio of the substrate is relatively high. The change in value becomes smaller, and the effect of the terminal effect continues to increase.

Further, when the resistance value of the plating liquid for processing the substrate is relatively large, the influence of the terminal effect is small as compared with the case where the resistance value of the plating liquid of the processing substrate is relatively small. Specifically, when the resistance value of the plating solution is R1 and the resistance value of the seed layer from the central portion of the substrate to the electrical contact is R2, there is a corresponding composite resistance value (R1+R2) at the center of the substrate. Current flows. On the other hand, in the peripheral portion of the substrate (near the electric contact), almost a current corresponding to the resistance value R1 of the plating liquid flows. Therefore, when the resistance value R1 is increased, the influence of the resistance value R2 of the current flowing in the central portion of the substrate is small, and the influence of the terminal effect is small.

As described above, the influence of the terminal effect differs depending on the characteristics of the substrate, the conditions for processing the substrate, and the like. Therefore, in the case of a single plating apparatus, in the case where the influence of the terminal effect is sequentially plated on a plurality of different substrates, in order to suppress the in-plane uniformity of the film thickness due to the terminal effect, it is necessary to match the characteristics of the individual substrates. The conditions of the substrate are processed and the like, and the electric field applied to the substrate is adjusted. However, in order to adjust the electric field by the adjustment plate-matching substrate characteristics and the processing substrate conditions as described in Patent Document 1, it is necessary to prepare a plurality of adjustment plates that match the substrate characteristics and the processing substrate conditions.

Further, even when a plurality of adjustment plates are prepared, when the substrate having different characteristics and processing conditions is processed, the adjustment plate is taken out from the plating tank, and another adjustment plate or the like is provided, which takes time.

The present invention has been made in view of the above problems, and an object thereof is to provide an adjustment plate and a plating apparatus and a plating method including the same, which can suppress a terminal when plating a plurality of substrates having different characteristics and processing conditions The effect of the effect causes the in-plane uniformity to decrease.

According to a first aspect, there is provided an adjustment plate for adjusting a current between an anode and a substrate to be plated, comprising: a plate body portion having a rim portion, the edge portion forming a first opening through which current flows; a plate for reducing a diameter of the first opening; and a first moving mechanism for synchronously moving the plurality of first plates in a radial direction of the first opening.

According to the first aspect, the diameter of the opening can be adjusted by reducing the diameter of the opening of the adjustment plate by the first plate. Thereby, in the case where the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect. Specifically, when the substrate is plated under the condition that the influence of the terminal effect is remarkable, the film formation speed of the peripheral edge portion of the substrate can be suppressed by reducing the diameter of the opening of the adjustment plate, and the in-plane of the substrate can be made. Uniformity is improved. Further, since the first plate is configured to move in synchronization, the angular relationship with the other first plates can be maintained, and the plurality of first plates move in the radial direction. Therefore, compared with a diaphragm mechanism such as a camera, when a plurality of aperture blades are rotated around a specific axis to reduce the diameter of the opening, the complete circular shape of the opening formed by the first plate can be maintained.

According to a second aspect, in the first aspect, the first moving mechanism includes: a ring member disposed along the edge portion; and the ring member and the plurality of first plates each have a sliding long hole and a relative Inclining in the radial direction of the aforementioned first opening; the aforementioned ring member and the front The other of the plurality of first plates has a slide pin that slides in the sliding long hole.

According to the second aspect, the slide pin provided in any one of the ring member and the plurality of first plates slides on the sliding long hole provided in the ring member and the other of the plurality of first plates. Therefore, by rotating the ring member in the circumferential direction, the slide pin slides in the sliding long hole, and the first plate can be moved in the radial direction of the opening.

According to a third aspect, in the second aspect, the first moving mechanism includes a plate pressing member that is fixed to an opposite side of the ring member of the plurality of first plates, and the plate pressing member and the plurality of first plates Either having: a guiding elongated hole formed in a synchronous moving direction parallel to the first plate; the other of the pressing member and the plurality of first plates having: a guiding pin, in the guiding Long holes slide.

According to the third aspect, the guide pin provided in any one of the plate pressing member and the plurality of first plates is a guide long hole sliding provided on the other of the plate pressing member and the plurality of first plates . Therefore, when the plurality of first plates are moved by the moving mechanism, the plurality of first plates can be prevented from rotating and the first plate can be synchronously moved in a specific direction.

According to a fourth aspect, in the second aspect and the third aspect, the first moving mechanism includes: a rotating member that rotates the ring member in a circumferential direction; and the rotating member includes a ring portion that is fixed to the ring member; The rod portion rotates the ring portion in the circumferential direction.

According to the fourth aspect, the ring portion can be rotated in the circumferential direction by the actuator or the manual operation of the rod portion. Since the ring portion is fixed to the ring member, the ring member rotates as the ring portion rotates. Thereby, the sliding long hole or the sliding pin provided in the ring member slides on the sliding pin or the sliding long hole provided in the plurality of first plates, so that the plurality of first plates can be synchronously moved.

According to a fifth aspect, in the fourth aspect, the plate body and the ring portion have a support long hole formed along a rotation direction of the ring portion, and the other of the plate body and the ring portion And having a support pin slidably engaged with the aforementioned support long hole.

According to the fifth aspect, the support pin provided in any one of the plate main body portion and the ring portion is slidably engaged with the support long hole provided in the other of the plate main body portion and the ring portion. The ring portion is supported by the plate body portion by the support pin engaging the support long hole. Since the support long hole is formed along the rotation direction of the ring portion, the ring portion can be rotated by the support pin sliding in the support long hole.

According to the sixth aspect, in any of the first to fifth forms, the plurality of the foregoing Each of the first plates has an inner peripheral edge formed in an arc shape, and the other first plates overlap each other to form a substantially circular inner peripheral edge.

According to the sixth aspect, when the plurality of first plates are synchronously moved in the radial direction of the opening and the diameter of the opening is reduced, the inner peripheral edges of the plurality of first plates can be kept substantially circular.

According to a seventh aspect, in any one of the first to sixth aspects, the adjustment plate has: a plurality of second plates disposed at positions offset from the plurality of first plates in a direction perpendicular to a radial direction of the first opening, a diameter for reducing the first opening; and a second moving mechanism for synchronously moving the plurality of second plates in a radial direction of the first opening.

According to a seventh aspect, the adjustment plate has an opening having a first diameter formed by a plurality of first plates and an opening having a second diameter formed by the plurality of second plates. The current passing through the opening of the regulating plate can be more appropriately adjusted by appropriately adjusting the sizes of the one diameter and the second diameter, respectively.

According to an eighth aspect, in the seventh aspect, the straight line connecting the center of the opening formed by the plurality of first plates and the center of the opening formed by the plurality of second plates is perpendicular to the diameter of the openings The first plate and the second plate are disposed.

According to the eighth aspect, the first plate and the second plate are disposed so that the center of the opening formed by the first plate and the center of the opening formed by the second plate coincide with each other. Therefore, when the adjustment plate is positioned in the plating groove, it is not necessary to separately position the center of the opening formed by the plurality of first plates and the center of the opening formed by the plurality of second plates. Therefore, even if the position of the center of the opening of the adjustment plate requires high precision, the adjustment plate can be easily positioned.

According to a ninth aspect, there is provided an adjustment plate for adjusting a current between an anode and a substrate to be plated. The adjustment plate has: a first plate body portion having: a first edge portion forming a first opening through which current flows; and a plurality of first plates for reducing a diameter of the first opening; and a second plate body portion having a second edge portion forming a second opening through which current flows; and a plurality of second plates for reducing a diameter of the second opening, wherein the first plate body portion and the second plate body portion are connected to each other in a plurality of The lines connecting the centers of the openings formed by the first plates and the centers of the openings formed by the plurality of second plates are perpendicular to the radial direction of the openings.

According to a ninth aspect, the adjustment plate has an opening having a first diameter formed by a plurality of first plates and an opening having a second diameter formed by the plurality of second plates. By appropriately adjusting the sizes of the first diameter and the second diameter, respectively, the current passing through the opening of the adjustment plate can be more appropriately adjusted. Further, the first plate and the second plate are disposed so that the center of the opening formed by the first plate and the center of the opening formed by the second plate coincide with each other. Therefore, when the adjustment plate is positioned in the plating groove, it is not necessary to separately position the center of the opening formed by the plurality of first plates and the center of the opening formed by the plurality of second plates. Therefore, even if the position of the center of the opening of the adjustment plate requires high precision, the adjustment plate can be easily positioned.

According to a tenth aspect, in any one of the seventh to ninth aspects, the diameter of the opening formed by the plurality of first plates is different from the diameter of the opening formed by the plurality of second plates Adjustment.

According to the tenth aspect, the diameter of the opening defined by the plurality of first plates can be different from the diameter of the opening defined by the plurality of second plates. Thereby, for example, the diameter of the opening defined by the plate close to the substrate can be made small, and the diameter of the opening defined by the plate far from the substrate can be increased, and the diameter of the opening can be matched with the characteristics of the substrate or the processing conditions. Sexually smaller.

According to an eleventh aspect, a plating apparatus is provided. The plating apparatus has an anode holder configured to hold the anode, a substrate holder facing the anode support, and configured to hold the substrate, and an anode cover having a second opening integrally mounted to the anode holder, the anode and the anode And a current flowing between the substrates; and any one of the above adjustment plates, wherein the anode cover has an adjustment mechanism for adjusting a diameter of the second opening.

According to the eleventh aspect, the diameter of the second opening of the anode cover can be adjusted for the first substrate and the second substrate, respectively. Thereby, in the case where the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect. Specifically, when the second substrate is plated under the condition that the influence of the terminal effect is remarkable, the film thickness of the central portion of the substrate can be increased by reducing the diameter of the second opening and concentrating the electric field on the central portion of the substrate. Further, when the diameter of the first opening of the regulating plate is reduced, the film forming speed at the peripheral portion of the substrate can be suppressed. Therefore, the in-plane uniformity of the substrate W can be further improved by adjusting both the diameter of the first opening of the adjustment plate and the diameter of the second opening of the anode cover.

According to a twelfth aspect, a plating method is provided. The plating method step includes: arranging an anode holder in the plating tank, wherein the anode holder integrally includes an anode cover having a first opening through which an electric current flowing between the anode and the substrate passes; and configuring the first substrate to be held a substrate holder is disposed in the plating tank; and an adjustment plate is disposed between the anode cover and the substrate The node plate has a second opening and a third opening through which the current flowing between the anode and the substrate passes; adjusting the diameter of the first opening to a first diameter, plating on the first substrate; and maintaining the second substrate The substrate holder is disposed in the plating tank; and the diameter of the first opening is adjusted to be smaller than the first diameter, and the diameters of the second opening and the third opening of the adjusting plate are respectively changed to be plated The aforementioned second substrate.

According to the twelfth aspect, the diameter of the first opening of the anode cover can be adjusted for the first substrate and the second substrate, respectively. Thereby, in the case where the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect. Specifically, when the second substrate is plated under the condition that the effect of the terminal effect is remarkable, the film thickness of the central portion of the substrate can be increased by reducing the diameter of the first opening and concentrating the electric field on the central portion of the substrate. Moreover, by changing the diameter of the second opening of the adjustment plate and the diameter of the third opening, the film formation speed at the peripheral edge portion of the substrate can be suppressed, and the in-plane uniformity of the substrate W can be improved.

10‧‧‧ plating device

18‧‧‧Agitator

19‧‧‧Agitator drive

20‧‧‧Anode holder

21‧‧‧Anode

25‧‧‧anode cover

25a, 60a, 60A, 60B‧‧‧ openings

25b‧‧‧Anode cover installation

26‧‧‧Edge

27‧‧‧ aperture blades

40‧‧‧Substrate support

50‧‧‧ plating tank

52‧‧‧ plating treatment tank

54‧‧‧ plating solution draining tank

55‧‧‧ partition wall

56‧‧‧ plating solution supply port

57‧‧‧ plating solution discharge

58‧‧‧ plating liquid circulation device

59‧‧‧ plating power supply

60‧‧‧Adjustment board

61‧‧‧ board body

61A‧‧‧First board body

61B‧‧‧Second board body

62‧‧‧ hanging lower part

63‧‧‧ Opening adjustment department

63A‧‧‧First opening adjustment

63B‧‧‧Second opening adjustment

64‧‧‧Edge

65‧‧‧ pinhole

66, 92, 111‧‧‧ screw holes

67‧‧‧stop

68A‧‧‧ cavity

69A, 69B‧‧‧ openings

70, 70A, 70B‧‧‧ board

71A‧‧‧ first board

71B‧‧‧ second board

72, 72A, 72B‧‧‧ sliding pin

73‧‧‧ Guide pin

80, 80A, 80B‧‧‧ ring parts

81, 81A, 81B‧‧‧ sliding long holes

81a‧‧‧Minimum diameter section

81b‧‧‧Maximum diameter section

90, 90A, 90B‧‧‧ plate pressing parts

91‧‧‧ Guided long hole

100, 100A, 100B‧‧‧ rotating parts

101‧‧‧ Ring Department

102‧‧‧ pole

103‧‧‧Support long holes

104‧‧‧ convex

105‧‧‧Support pins

105A, 105B‧‧‧Handle

110, 110A, 110B‧‧‧ protective parts

120‧‧‧Fixed means

169A‧‧‧first opening

169B‧‧‧ second opening

Q‧‧‧ plating solution

W‧‧‧Substrate

W1‧‧‧coated surface

The first figure is a schematic side cross-sectional view of the plating apparatus of the present embodiment.

The second figure is a schematic front view of the anode cover.

The third figure is a schematic front view of the anode cover.

The fourth figure is a front side oblique view of the adjustment plate in which the diameter of the opening is relatively large.

The fifth figure is a rear side oblique view of the regulating plate whose opening diameter is relatively large.

The sixth drawing is a front side oblique view of the regulating plate whose opening diameter is relatively small.

The seventh figure is an exploded perspective view of the adjustment plate.

The eighth figure is a front side oblique view of the plate body portion.

The ninth drawing is a rear side oblique view of the plate body portion.

The tenth diagram shows a front side oblique view of the ring member.

The eleventh figure shows a front side oblique view of the rotating member.

Fig. 12 is a front perspective view showing the first plate constituting the plate body.

The thirteenth view is a front side oblique view of the plate pressing member.

Figure 14 is a front side oblique view of the protective member.

The fifteenth diagram is a partial front view seen from the front side of the adjustment plate.

Figure 16 is a rear view of the adjustment plate having the opening with the largest inner diameter.

Figure 17 is a rear view of the adjustment plate having the opening with the smallest inner diameter.

Fig. 18 is a front perspective view showing an adjustment plate having a plurality of first plates and a plurality of second plates in accordance with another embodiment.

Fig. 19 is a rear perspective view showing an adjustment plate having a plurality of first plates and a plurality of second plates in another embodiment.

Fig. 20 is an exploded perspective view showing the first plate body portion and the second plate body portion of the adjusting plate of the other embodiment.

The twenty-first figure is an exploded perspective view of the first plate body portion of the adjustment plate of the other embodiment.

Fig. 22 is an exploded perspective view showing the second plate main body portion of the adjusting plate of the other embodiment.

Fig. 23 is a view showing the outline of a plating film of a substrate having a high resist opening ratio and a substrate having a low resist opening ratio.

The twenty-fourth graph shows a contour view of a plating film of a substrate having a thick seed layer and a substrate having a thin seed layer.

Fig. 25 is a contour view showing a plating film of a substrate plated with a plating liquid having a relatively high electric resistance and a substrate plated with a plating liquid having a relatively low electric resistance.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same or corresponding components are designated by the same reference numerals, and the repeated description is omitted.

The first figure is a schematic side cross-sectional view of the plating apparatus of the present embodiment. As shown in the figure, the plating apparatus 10 of the present embodiment includes an anode holder 20 configured to hold the anode 21, a substrate holder 40 configured to hold the substrate W, and a plating tank 50 for housing the anode holder 20 therein. With the substrate holder 40.

As shown in the first figure, the plating tank 50 has a plating treatment tank 52 that accommodates a plating liquid Q containing an additive, a plating liquid discharge tank 54, and receives a plating liquid Q overflowing from the plating treatment tank 52. Discharge; and a partition wall 55 separating the plating treatment tank 52 and the plating liquid discharge tank 54.

The anode holder 20 holding the anode 21 and the substrate holder 40 holding the substrate W face each other so as to be plated with the plating liquid Q immersed in the plating treatment tank 52, and is substantially parallel to the plated surface W1 of the anode 21 and the substrate W. The anode 21 and the substrate W are immersed in the plating treatment tank 52 In the state of the plating solution Q, a voltage is applied to the plating power source 59. Thereby, the metal ions are reduced on the plated surface W1 of the substrate W, and a film is formed on the surface to be plated W1.

The plating treatment tank 52 has a plating liquid supply port 56 for supplying the plating liquid Q inside the tank. The plating solution discharge tank 54 has a plating liquid discharge port 57 for discharging the plating liquid Q overflowing from the plating treatment tank 52. The plating solution supply port 56 is disposed at the bottom of the plating treatment tank 52, and the plating liquid discharge port 57 is disposed at the bottom of the plating solution discharge tank 54.

When the plating solution Q is supplied from the plating solution supply port 56 to the plating treatment tank 52, the plating solution Q overflows from the plating solution processing tank 52, and flows into the plating liquid discharge tank 54 over the partition wall 55. The plating solution Q that has flowed into the plating solution discharge tank 54 is discharged from the plating liquid discharge port 57, and a filter or the like provided in the plating liquid circulation device 58 removes impurities. The plating solution Q from which the impurities are removed is supplied to the plating solution processing tank 52 by the plating liquid circulation device 58 via the plating liquid supply port 56.

The anode holder 20 has an anode cover 25 for adjusting an electric field between the anode 21 and the substrate W. The anode cover 25 is, for example, a substantially plate-like member composed of a dielectric material, and is provided on the front surface of the anode holder 20. Here, the front surface of the anode holder 20 refers to a surface facing the side of the substrate holder 40. That is, the anode cover 25 is disposed between the anode 21 and the substrate holder 40. The anode cover 25 has an opening 25a (an example corresponding to the second opening) at a substantially central portion, and has a current flowing between the anode 21 and the substrate W. The diameter of the opening 25a is preferably smaller than the diameter of the anode 21. As will be described later, the anode cover 25 is configured to adjust the diameter of the opening 25a.

The anode cover 25 has an anode cover mounting portion 25b on its outer periphery for integrally mounting the anode cover 25 to the anode holder 20. Further, the position of the anode cover 25 may be between the anode holder 20 and the substrate holder 40, but it is preferably closer to the anode holder 20 than the intermediate position between the anode holder 20 and the substrate holder 40. Further, for example, the anode cover 25 may be disposed on the front surface of the anode holder 20 without being attached to the anode holder 20. However, in the present embodiment, when the anode cover 25 is attached to the anode holder 20, since the relative position of the anode cover 25 of the anode holder 20 is fixed, the position of the anode 21 can be prevented from deviating from the position of the opening 25a.

The anode 21 held by the anode holder 20 is preferably an insoluble anode. When the anode 21 is an insoluble anode, even if the plating treatment is performed, the anode 21 does not dissolve, and the shape of the anode 21 does not change. Therefore, since the positional relationship (distance) between the anode cover 25 and the surface of the anode 21 does not change, the positional relationship between the anode cover 25 and the surface of the anode 21 can be prevented from being changed. The resulting change in electric field between the anode 21 and the substrate W.

The plating apparatus 10 further has an adjustment plate 60 for adjusting the current between the anode 21 and the substrate W. The adjustment plate 60 is, for example, a substantially plate-like member composed of a dielectric material, and is disposed between the anode cover 25 and the substrate holder 40 (substrate W). The adjustment plate 60 has an opening 60a (corresponding to an example of the first opening), and has a current flowing between the anode 21 and the substrate W. The diameter of the opening 60a is preferably smaller than the diameter of the substrate W. As will be described later, the adjustment plate 60 is configured to adjust the diameter of the opening 60a.

The adjustment plate 60 is preferably located closer to the substrate holder 40 than the intermediate position between the anode holder 20 and the substrate holder 40. The adjustment plate 60 is disposed closer to the substrate holder 40, and by adjusting the diameter of the opening 60a of the adjustment plate 60, the film thickness of the peripheral portion of the substrate W can be more accurately controlled.

Between the adjustment plate 60 and the substrate holder 40, a stirrer 18 for stirring the plating liquid Q in the vicinity of the plated surface W1 of the substrate W is provided. The agitator 18 is a substantially rod-shaped member and is disposed in the plating treatment tank 52 so as to face in the vertical direction. One end of the agitator 18 is fixed to the agitator drive unit 19. The agitator 18 is horizontally moved by the agitator driving device 19 along the plated surface W1 of the substrate W, thereby stirring the plating solution W.

Next, the anode cover 25 shown in the first figure will be described in detail. The second and third figures are schematic front views of the anode cover 25. The second figure shows the anode cover 25 when the diameter of the opening 25a is relatively large. The third figure shows the anode cover 25 in which the diameter of the opening 25a is relatively small. Here, the smaller the opening 25a of the anode cover 25 is, the more the current flowing from the anode 21 to the substrate W is concentrated toward the central portion of the plated surface W1 of the substrate W. Therefore, when the opening 25a is small, the film thickness of the center portion of the plated surface W1 of the substrate W tends to increase.

As shown in the second figure, the anode cover 25 has a substantially annular edge portion 26. The diameter of the opening 25a of the anode cover 25 as shown in the second figure is the largest. The diameter of the opening 25a in this case coincides with the inner diameter of the edge portion 26.

As shown in the third figure, the anode cover 25 has a plurality of aperture blades 27 (corresponding to an example of an adjustment mechanism), and is configured to be an adjustable opening 25a. The aperture blades 27 cooperate to define the opening 25a. The aperture blades 27 respectively expand or contract the diameter of the opening 25a (the diameter of the opening 25a) by the same structure as the aperture mechanism of the camera. The opening of the anode cover 25 as shown in the third figure 25a is formed into a non-circular shape (for example, a polygonal shape) by the aperture blade 27. The diameter of the opening 25a in this case means the shortest distance of the opposite side of the polygon or the diameter of the inscribed circle. Alternatively, the diameter of the opening 25a may be defined by a circle having an area equal to the opening area. Further, the distance between the anode 21 and the surface of the diaphragm blade 27 facing the anode 21 is, for example, 0 mm or more and 8 mm or less.

Each of the diaphragm blades 27 is formed by, for example, manually expanding or reducing the diameter of the opening 25a. Further, each of the diaphragm blades 27 may be configured to be driven by air pressure or electric driving force. The adjustment mechanism using the aperture blade 27 has a feature that can change the opening 25a relatively widely. Further, when the substrate is circular, it is preferable that the opening 25a of the anode cover 25 is circular. However, in the opening 25a of the diameter which can be changed over a relatively wide range, maintaining the complete circular shape from the minimum diameter to the maximum diameter of the opening 25a is accompanied by structural difficulties. In general, when the opening through which the current flowing between the anode 21 and the substrate W passes is not completely circular, the azimuth distribution of the electric field is uneven, and the shape of the opening is formed by the peripheral portion of the substrate W. The possibility of plating the thickness of the film. However, since the anode cover 25 is integrally attached to the anode holder 20, the distance from the substrate can be sufficiently obtained, and even when the opening is not completely circular, the thickness distribution of the plating film can be suppressed to the utmost extent. influences.

Next, the adjustment plate 60 shown in the first figure will be described in detail. The fourth diagram shows a front side oblique view of the adjustment plate 60 in which the diameter of the opening 60a is relatively large, and the fifth diagram shows a rear side oblique view of the adjustment plate 60 in which the diameter of the opening 60a is relatively large. Further, the sixth diagram shows a front side oblique view of the adjustment plate 60 in which the diameter of the opening 60a is relatively small.

As shown in the fourth to sixth figures, the adjustment plate 60 has a substantially plate-shaped plate body portion 61. The plate main body portion 61 has a pair of hanging lower portions 62 on the left and right end faces of the upper portion thereof for suspending and hoisting the edge of the plating plate 60 of the plating treatment groove 52 shown in the first figure. Further, the plate main body portion 61 has an opening 60a at a substantially central portion thereof. The opening 60a is formed by the opening adjusting portion 63 provided in the plate main body portion 61.

As shown in FIG. 5, a rotating member 100 is attached to the back side of the adjusting plate 60, and the rotating member 100 constitutes a part of the opening adjusting portion 63. Further, as shown in the sixth diagram, the adjustment plate 60 has a plate body 70 which is configured to reduce the diameter of the opening 60a. Details of the rotating member 100 and the plate body 70 will be described later.

The seventh diagram is an exploded perspective view of the adjustment plate 60. As shown in the seventh figure, the adjustment board The 60 has a plate main body portion 61, a plate body 70, a ring member 80, a plate pressing member 90, a rotating member 100, and a protective member 110. The opening adjustment portion 63 is constituted by the plate body 70, the ring member 80, the plate pressing member 90, the rotating member 100, and the protective member 110. Further, the adjustment plate 60 has an edge portion 64 that forms an opening 60a together with the plate body portion 61.

The plate body 70 has a plurality of first plates 71 for reducing the opening 60a on the front side of the edge portion 64 of the regulating plate 60. Further, in the present embodiment, the front side of the adjustment plate 60 refers to the surface facing the substrate holder 40 shown in the first figure. However, in other embodiments, the adjustment plate 60 may be disposed on the front side surface of the adjustment plate 60 in the plating treatment tank 52 shown in the first figure to the anode holder 20 shown in the first figure.

The ring member 80 is configured to synchronously move a plurality of first plates 71 in the radial direction of the opening 60a. The ring member 80 is disposed along the edge portion 64 of the adjustment plate 60. In the present embodiment, the ring member 80 is disposed along the inner circumferential surface of the edge portion 64 of the adjustment plate 60. However, the present invention is not limited thereto, and the ring member 80 may be disposed, for example, on the front side of the edge portion 64 of the adjustment plate 60.

The plate pressing member 90 is disposed on the front side of the plate body 70 (opposite to the ring member 80). The rotating member 100 is disposed on the rear side of the plate body portion 61, and is coupled to the ring member 80 as will be described later. The respective components constituting the adjustment plate 60 will be described in detail below.

The eighth diagram shows a front side oblique view of the board body portion 61, and the ninth diagram shows a rear side oblique view of the board body portion 61. As shown in the eighth figure, the plate main body portion 61 is a substantially plate-shaped member, and has an opening 60a at a substantially central portion thereof. An edge portion 64 is fixed to the front side of the plate body portion 61, and the edge portion 64 has substantially the same opening as the opening 60a. The edge portion 64 forms an opening 60a together with the plate body portion 61. As shown in the ninth diagram, the plate body portion 61 has a plurality of pin holes 65 on the rear side, and the pin holes 65 are for inserting a support pin that slidably supports the rotary member 100. Further, the edge portion 64 has a plurality of screw holes 66 on the front side thereof, and the screw holes 66 are used to screw the screw for fixing the plate pressing member 90 and the protective member 110.

The tenth diagram shows a front side oblique view of the ring member 80. As described above, the ring member 80 is disposed along the inner circumferential surface of the opening 60a of the plate main body portion 61 shown in the eighth and ninth views. Therefore, the outer diameter of the ring member 80 is configured to substantially coincide with the inner diameter of the edge portion 64 of the opening 60a constituting the plate main body portion 61. Therefore, the inner diameter of the ring member 80 becomes the maximum inner diameter of the opening 60a. As shown, the ring member 80 (corresponding to the first moving mechanism) has a plurality of sliding elongated holes 81 on the front side thereof. in In the present embodiment, eight ring-shaped elongated holes 81 are provided in the ring member 80, and the number of the sliding long holes 81 corresponds to the number of the first plates 71 constituting the plate body 70. The sliding long hole 81 may penetrate toward the rear side of the ring member 80, or may not. The sliding long hole 81 is configured to be inclined with respect to the radial direction of the opening 60a. In other words, the sliding long hole 81 is inclined such that the long direction of the long hole does not face the center of the opening 60a. Each of the sliding elongated holes 81 is provided in the ring member 80 so as to be rotationally symmetrical with respect to each other with respect to the central axis of the opening 60a. In the present embodiment, since eight sliding long holes 81 are provided, each of the sliding long holes 81 has eight rotational symmetry.

The eleventh diagram shows a front side oblique view of the rotating member 100. The rotating member 100 has a ring portion 101 and a plate-shaped rod portion 102 that is placed on the ring portion 101. The ring portion 101 is fixed to the ring member 80 shown in the tenth diagram. The inner diameter of the ring portion 101 is configured to substantially coincide with the inner diameter of the ring member 80. The rod portion 102 is coupled to the outer peripheral surface of the ring portion 101, and the ring portion 101 is rotated in the circumferential direction of the range of the rocking angle by swinging the rod portion 102 in the circumferential direction of the ring portion 101.

Four convex portions 104 are provided on the outer circumference of the ring portion 101, and support long holes 103 along the circumferential direction of the ring portion 101 are formed in the convex portions 104. As will be described later, the support long hole 103 is supported to be slidable by a support pin fixed by the pin hole 65 of the plate main body portion 61 shown in FIG.

Fig. 12 is a front perspective view showing the first plate 71 constituting the plate body 70. As shown in the figure, the first plate 71 is a sector-shaped member in which an inner peripheral edge is formed in an arc shape. The first plate 71, as shown in the seventh figure, overlaps with the other first plates 71, and all form a substantially circular inner circumference of the plate body 70. In the present embodiment, the plate body 70 is constituted by the eight first plates 71. However, the present invention is not limited thereto, and the plate body 70 may be configured by any number of the first plates 71.

On the rear side of the first plate 71, a slide pin 72 is provided, and the slide pin 72 is configured to slide in the sliding long hole 81 of the ring member 80 shown in FIG. In the present embodiment, one slide pin 72 is provided on the first plate 71. However, the present invention is not limited thereto, and two or more slide pins 72 may be provided on the first plate 71. In this case, the number of the sliding long holes 81 of the ring member 80 shown in the tenth figure needs to match the number of the two or more sliding pins 72.

Further, on the front side of the first plate 71, a guide pin 73 is provided, and the guide pin 73 is configured to slide on the guide long hole 91 of the plate pressing member 90 shown in the thirteenth drawing to be described later. In the present embodiment, the two guide pins 73 are provided on the first plate 71. However, the present invention is not limited thereto, and one or three or more guide pins 73 may be provided on the first plate 71.

The thirteenth drawing is a front side oblique view of the plate pressing member 90. The plate pressing member 90 is a substantially plate-shaped member, and an opening 60a is formed in a substantially central portion thereof. The diameter of the opening 60a of the plate pressing member 90 has a diameter substantially the same as the inner diameter of the ring member 80 shown in the tenth diagram. The plate pressing member 90 has a plurality of guiding elongated holes 91. In the present embodiment, 16 guide long holes 91 are provided in the plate pressing member 90, and the two guide long holes 91 correspond to the two guide pins 73 of the first plate 71 shown in Fig. 12, respectively. The number of the guide long holes 91 can be appropriately changed corresponding to the number of the guide pins 73. The guide long hole 91 is formed in a synchronous moving direction parallel to the first plate 71. Further, the plate pressing member 90 has a plurality of screw holes 92. The position of the screw hole 66 formed in the edge portion 64 of the plate main body portion 61 shown in FIG. 8 is matched with the position of the screw hole 92, and the plate pressing member 90 can be fixed to the plate main body portion 61 by screwing the screw. .

The plate pressing member 90 is disposed such that its rear side contacts the front side of the plate body 70. Therefore, when the first plate 71 of the plate body 70 moves synchronously in the radial direction of the opening 60a, the first plate 71 contacts the plate pressing member 90 and moves in synchronization. In order to reduce the wear of the plate pressing member 90 and the first plate 71, the plate pressing member 90 is preferably made of a low friction resin such as PTFE.

The fourteenth view is a front side oblique view of the protective member 110. The protective member 110 is a substantially plate-shaped member, and an opening 60a is formed in a substantially central portion thereof. The diameter of the opening 60a of the protective member 110 has a diameter substantially the same as the inner diameter of the ring member 80 shown in FIG. The protective member 110 is disposed on the front side of the plate pressing member 90. The protective member 110 has a plurality of screw holes 111. The screw hole 66 shown in FIG. 8 and the screw hole 92 shown in FIG. 13 are engaged with the position of the screw hole 11, and the protective member 110 can be fixed to the plate main body portion 61 by screwing the screw. The protective member 110 is made of, for example, vinyl chloride or the like, and protects the front side of the plate pressing member 90.

Next, a mechanism for causing the first plate 71 shown in Fig. 12 to move in synchronization will be described in detail. The fifteenth diagram is a partial front view as seen from the front side of the adjustment plate 60. In the fifteenth diagram, the rotating member 100, the plurality of first plates 71, the plate pressing members 90, and the sliding long holes 81 of the ring member 80 are respectively transmitted, and the other members are omitted for simplification of illustration.

As shown in the fifteenth diagram, the plurality of first plates 71 are configured to have overlapping portions 75 that partially overlap each other with the other first plates 71. The inner circumference of the plurality of first plates 71 is formed in a substantially circular shape. In the illustrated state, the slide pin 72 of the plurality of first plates 71 is located at a substantially intermediate portion of the slide long hole 81, and the guide pin 73 is located at a substantially intermediate portion of the guide long hole 91. In the illustrated state, the inner diameter of the inner circumference of the plurality of first plates 71 is smaller than the inner diameter of the opening 60a of the adjustment plate 60. Therefore, the plurality of first plates 71 reduce the inner diameter of the opening 60a of the adjustment plate 60.

When the rod portion 102 of the rotating member 100 moves in the direction of the arrow A1 or A2, that is, in the circumferential direction of the ring portion 101, the ring member 80 not shown in the figure of the ring portion 101 also rotates in the circumferential direction. For example, when the lever portion 102 moves in the direction of the arrow A1 (clockwise in the drawing), the ring member 80 rotates in the clockwise direction. Thereby, the slide pin 72 of the first plate 71 slides in the slide long hole 81, and the minimum diameter portion 81a of the slide long hole 81 moves toward the slide pin 72. At this time, as the minimum diameter portion 81a of the sliding long hole 81 moves toward the slide pin 72, the first plate 71 moves toward the inner side in the radial direction of the opening 60a. Since the guide pin 73 of the first plate 71 slides inside the guide long hole 90, the circumferential movement and the rotational movement of the first plate 71 are prevented. Therefore, the first plate 71 can be surely moved in the radial direction.

Further, for example, when the lever portion 102 moves in the direction of the arrow A2 (counterclockwise direction in the drawing), the ring member 80 rotates in the counterclockwise direction. Thereby, the slide pin 72 of the first plate 71 slides in the slide long hole 81, and the largest diameter portion 81b of the slide long hole 81 moves toward the slide pin 72. At this time, as the maximum diameter portion 81b of the sliding long hole 81 moves toward the slide pin 72, the first plate 71 moves synchronously toward the outer side in the radial direction of the opening 60a.

The plurality of first plates 71 are also synchronously moved in the radial direction. Therefore, maintaining the angular relationship between the first plate 71 and the other first plates 71, the plurality of first plates 71 can be moved in the radial direction. Thereby, compared with the aperture mechanism such as a camera, when a plurality of aperture blades rotate around a specific axis to reduce the diameter of the opening, the inner circumference of the first plate 71 can be maintained in a perfect circle.

Fig. 16 is a rear view of the regulating plate 60 having the opening 60a having the largest inner diameter, and Fig. 17 is a rear view of the regulating plate 60 having the opening 60a having the smallest inner diameter. As shown in Fig. 16, when the regulating plate 60 has the opening 60a having the largest inner diameter, the rod portion 102 of the rotating member 100 is located in the rightward direction, and the stopper 67 provided in the plate body portion 61 limits the movable range thereof. In the state shown in Fig. 16, the first plate 71 not shown is located at the outermost position in the radial direction of the opening 60a, and the inner periphery of the first plate 71 substantially coincides with the inner periphery of the ring portion 101 of the rotary member 100.

Four support pins 105 are provided in the plate body portion 61. The support pin 105 is slidably engaged with the support long hole 103 provided in the convex portion 104 of the ring portion 101. Thereby, when the lever portion 102 is operated, the ring portion 101 is guided to rotate in the circumferential direction along the support long hole 103.

As shown in FIG. 17, when the adjustment plate 60 has the opening 60a having the smallest inner diameter, The rod portion 102 of the rotating member 100 is located in the leftward direction, and the stopper 67 provided in the plate body portion 61 limits the movable range. In the state shown in Fig. 17, the plurality of first plates 71 are located at the innermost position in the radial direction of the opening 60a, and the first plate 71 narrows the opening 60a of the regulating plate 60.

The stem 102 can also be operated automatically by, for example, a mechanical actuator or manually by an operator. Further, the rod portion 102 may be fixed at any position between the pair of stoppers 67.

As described above, according to the adjustment plate 60 of the present embodiment, the diameter of the opening 60a can be adjusted by reducing the diameter of the opening 60a by the plurality of first plates 71. Thereby, in the case where the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect. Specifically, when the substrate is plated under the condition that the effect of the terminal effect is remarkable, by reducing the diameter of the opening 60a of the adjustment plate 60, the film formation speed at the peripheral portion of the substrate can be suppressed, and the in-plane uniformity of the substrate can be made. Upgrade. Further, since the first plate 71 is configured to move in synchronization, the angle relationship with the other first plates 71 is maintained, and the plurality of first plates 71 are movable in the radial direction. Therefore, compared with the aperture mechanism such as a camera, a plurality of aperture blades are rotated around a specific axis to reduce the diameter of the opening, and the inner circumference of the first plate 71 can be maintained in a perfect circular shape.

Further, in the present embodiment, the first plate 71 has the slide pin 72, and the ring member 80 has the slide long hole 81. However, it is not limited thereto, and the ring member 80 may have a slide pin 72, and the first plate 71 may have a sliding long hole 81 corresponding thereto. As described above, even when the first plate 71 and the ring member 80 are formed, the ring member 80 is rotated in the circumferential direction, and the slide pin 72 slides in the sliding long hole 81, so that the first plate 71 can move in the radial direction.

In the present embodiment, the first plate 71 has the guide pin 73, and the plate pressing member 90 has the guide long hole 91. However, it is not limited thereto, and the plate pressing member 90 may have the guide pin 73, and the first plate 71 may have the guide elongated hole 91 corresponding thereto. Thus, even in the case where the first plate 71 and the plate pressing member 90 are formed, when the first plate 71 is moved by the ring member 80, the guide pin 73 slides in the guide slit 91, and the first plate 71 can be prevented. The movement and rotation of the circumferential direction.

In the present embodiment, the convex portion 104 having the long hole 103 is formed in the ring portion 101 of the rotating member 100, and the support pin 105 is fixed to the plate main portion 61. However, the ring portion 101 of the rotating member 100 may have a support pin 105, and the plate body portion 61 may have a support long hole 103 corresponding thereto. Thus, even when the rotating member 100 and the board body portion 61 are formed In the case where the ring portion 101 is rocked by the rod portion 102, the support pin 105 slides in the support long hole 103, and the ring portion 101 can be rotated in the circumferential direction.

Further, in the present embodiment, the adjustment plate 60 serves as means for reducing the diameter of the opening 60a, and has only the plate body 70 (a plurality of first plates 71). However, the adjustment plate 60 may have a mechanism for moving the plurality of second plates different from the plurality of first plates 71 in synchronization with the plurality of second plates. In this case, the plurality of second plates are disposed at positions deviated from the plurality of first plates 71 in a direction perpendicular to the radial direction of the opening 60a. The mechanism for synchronously moving the plurality of second plates is the same as the mechanism for moving the plurality of first plates 71 in synchronization, whereby a plurality of second plates are synchronously moved in the radial direction of the opening 60a. Hereinafter, a specific example will be described with reference to the drawings.

Fig. 18 is a front perspective view showing an adjustment plate having a plurality of first plates and a plurality of second plates in another embodiment, and Fig. 19 is a rear perspective view of the same adjustment plate. The components corresponding to the portions shown in the fourth to seventeenth drawings of the drawings described below are denoted by the symbols used in the fourth to seventeenth drawings, and the overlapping description will be omitted.

As shown in Figs. 18 and 19, the adjustment plate 60 of the present embodiment has a first plate main portion 61A and a second plate main portion 61B. The first plate body portion 61A has a first opening adjustment portion 63A, and the second plate body portion 61B has a second opening adjustment portion 63B. The first plate main body portion 61A and the second plate main body portion 61B are connected to each other by any fixing means 120 such as a screw or a nut. In the illustrated adjustment plate 60, the first plate body portion 61A and the second plate body portion 61B are in close contact with each other without a gap therebetween, and are connected to each other by the fixing means 120. However, the first plate body portion 61A and the second plate body portion 61B may have gaps to be connected to each other. Further, the fixing means 120 may have an adjustment mechanism for adjusting the size of the gap between the first plate main portion 61A and the second plate main portion 61B. Thereby, the distance between the plurality of first plates 71A (refer to the twenty-first diagram) and the plurality of second plates 71B (see the twenty-second diagram) to be described later can be arbitrarily adjusted.

The first plate main body portion 61A has an opening portion 69A for exposing the handle portion 105A of the rotating member 100A to the outside. Further, the second plate body portion 61B has an opening portion 69B for exposing the handle portion 105B of the rotating member 100B to the outside. The handle portion 105A exposed from the opening portion 69A and the handle portion 105B exposed from the opening portion 69B can be independently operated by using an arbitrary actuator or manually. Thereby, the plurality of first plates 71A and the plurality of second plates 71B shown in FIG. 11 can be independently moved in the radial direction.

Fig. 20 is an exploded perspective view of the first plate body portion 61A and the second plate body portion 61B. As shown in the figure, the first plate body portion 61A and the second plate body portion 61B are connected to each other such that the surface on which the rotating member 100A is provided faces the face on which the rotating member 100B is provided. The first plate main body portion 61A has a cavity 68A that can accommodate the rotating member 100A and the rotating member 100B. When the first plate main portion 61A and the second plate main portion 61B are connected, the cavity 68A is configured to house the rotating member 100A and the rotating member 100B.

The first plate body portion 61A has a first opening 169A through which a current passes at a substantially central portion thereof. Further, the second plate main body portion 61B has a second opening 169B through which a current passes at a substantially central portion thereof. The first plate body portion 61A and the second plate body portion 61B are connected to each other such that the center of the first opening 169A is concentric with the center of the second opening 169B. In other words, the first plate body portion 61A and the second plate body portion 61B are connected to each other such that a line connecting the center of the first opening 169A and the center of the second opening 169B is perpendicular to the radial direction of each opening.

The twenty-first figure is an exploded perspective view of the first plate body portion 61A. As shown in the figure, the first plate body portion 61A has a plate body 70A, a ring member 80A, a plate pressing member 90A, a rotating member 100A, and a protective member 110A. In the present embodiment, the plurality of first plates 71A constituting the plate body 70A have two slide pins 72A. The ring member 80A has a pair of sliding elongated holes 81A corresponding to the two sliding pins 72A.

The twenty-second figure is an exploded perspective view of the second plate body portion 61B. As shown in the figure, the second plate body portion 61B has a plate body 70B, a ring member 80B, a plate pressing member 90B, a rotating member 100B, and a protective member 110B. In the present embodiment, the plurality of first plates 71B constituting the plate body 70B have two slide pins 72B. The ring member 80B has two sets of sliding elongated holes 81B corresponding to the two slide pins 72B.

The first plate body portion 61A and the second plate body portion 61B are connected to each other as a center of the opening formed by the plurality of first plates 71A shown in FIG. 11 and a plurality of the plurality shown in the twenty-second diagram. The center of the opening formed by the second plate 71B is concentric. In other words, the first plate body portion 61A and the second plate body portion 61B are connected to each other as the center of the opening formed by the plurality of first plates 71A shown in FIG. 11 and the second twenty-first figure. A straight line connecting the centers of the openings formed by the plurality of second plates 71B is perpendicular to the radial direction of each of the openings.

Thus, according to the plurality of first plates 71A and the plurality of second plates 71B The adjustment plate 60 can reduce the diameter of the opening 60a by the plurality of first plates 71A and the plurality of second plates 71B. In this case, by the plurality of first plates 71A and the plurality of second plates 71B, the film formation speed of the peripheral portion of the substrate can be suppressed. Therefore, it is possible to improve the in-plane uniformity of the substrate having a tendency to increase the thickness of the peripheral portion of the substrate.

When a plurality of conventional adjustment plates are installed in the plating tank, it is necessary to perform positioning of the center of each of the plurality of adjustment plates, which takes time. On the other hand, in the case where the common adjustment plate 60 is provided with a plurality of first plates 71A and a plurality of second plates 71B, the center of the opening formed by the first plate 71A and the center of the opening formed by the second plate 71B are Relatively fixed. Therefore, in positioning the adjustment plate 60 in the plating groove, the center of the opening formed by the plurality of first plates 71A and the center of the opening formed by the plurality of second plates 71B do not need to be individually positioned. Therefore, even in the case where high precision is required for the position of the center of the opening of the adjustment plate 60, the adjustment plate 60 can be easily positioned.

Further, since the plate 70A of the adjustment plate 60 is composed of a plurality of first plates 71A, the opening shape is not strictly round. Therefore, it is difficult to completely remove the electric field dispersion applied to the substrate W due to the shape of the opening. However, since there are a plurality of second plates 71B, the electric field dispersion due to the opening shape of the plurality of first plates 71A and the electric field dispersion due to the opening shapes of the plurality of second plates 71B cancel each other, thereby alleviating the electric field dispersion. The plating film formed on the substrate W can be made close to a perfect circle.

Further, as shown in the fifteenth diagram, the plurality of first plates 71 have overlapping portions 75 with the adjacent first plates 71 and portions that do not overlap with the adjacent first plates 71. Since the overlapping portion 75 is thicker than the portion that does not overlap, the electric field suppressing effect is different between the overlapping portion 75 and the non-overlapping portion. Therefore, electric field dispersion can be generated in the circumferential direction of the opening. On the other hand, in the case where the adjustment plate 60 has a plurality of second plates 71B in addition to the plurality of first plates 71A, the circumferential position of the overlapping portion of the plurality of second plates 71B is deviated from the plurality of first plates 71A. Since the position of the overlapping portion is in the circumferential direction, the electric field dispersion due to the overlapping portions of the two plates can be alleviated. It is preferable that the circumferential direction of the overlapping portion of the plurality of second plates 71B and the circumferential direction of the overlapping portion of the plurality of first plates 71A are alternately arranged, whereby the electric field dispersion can be further alleviated.

Further, according to the adjustment plate having the plurality of first plates 71A and the plurality of second plates 71B, the diameter of the opening 60A defined by the plurality of first plates 71A and the plurality of second plates 71B can be made. The diameter of the defined opening 60B is different. Thereby, for example, the diameter of the opening defined by the plate close to the substrate is reduced, and the diameter of the opening which is defined by the plate which is away from the substrate becomes large, and the diameter of the opening can be reduced stepwise.

Next, the procedure for the plating process of the substrate W will be described using the plating apparatus 10 shown in the first figure. As described above, the influence of the terminal effect differs depending on the characteristics of the substrate W and the conditions of the substrate W to be processed. Therefore, in the case where a plurality of substrates W having different influences on the terminal effect are plated by the single plating apparatus 10, in order to suppress the in-plane uniformity of the film thickness due to the terminal effect, it is necessary to match the characteristics and processing of the respective substrates W. The electric field applied to the substrate W is adjusted by the conditions of the substrate W and the like.

In the plating apparatus 10 of the present embodiment, by adjusting the characteristics of the substrate W or the condition of the processing substrate W, at least the diameter of the opening 25a of the anode cover 25 can be adjusted, and the in-plane uniformity of the plating film of the substrate W can be suppressed. reduce.

Specifically, in the case where the resist opening ratio of the second substrate is lower than the resist opening ratio of the first substrate, as described above, even if the second substrate forms a plating film on the substrate, the resist opening ratio is compared with The relatively high first substrate has a small change in resistance value from the central portion of the substrate to the electrical contact. Therefore, even if a certain degree of plating film is formed on the second substrate, the influence on the terminal effect of the second substrate continues to be large. Therefore, the conditions other than the resist opening ratio of the substrate are the same, and the first substrate and the second substrate are plated. The second substrate is thicker than the first substrate, and the film is thicker at the peripheral portion of the substrate. The film thickness is relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode cover 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thereby, the film thickness of the central portion of the substrate of the second substrate can be increased. Therefore, in both the first substrate and the second substrate, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect.

Further, in the case where the seed layer of the second substrate is thinner than the seed layer of the first substrate, as described above, the terminal effect on the second substrate becomes remarkable. Therefore, when the first substrate and the second substrate are plated in the same conditions except for the thickness of the seed layer, the thickness of the second substrate is thicker than that of the first substrate, and the film at the central portion of the substrate is thicker. Thick and relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode cover 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thereby, the film thickness of the central portion of the substrate of the second substrate can be increased. Therefore, both the first substrate and the second substrate can suppress the influence due to the terminal effect The resulting in-plane uniformity is reduced.

Further, in the case where the second substrate is plated with a plating solution having a lower resistance value than the plating solution for the first substrate, as described above, the terminal effect with respect to the second substrate becomes remarkable. Therefore, when the first substrate and the second substrate are plated under the same conditions except for the resistance value of the plating solution, the second substrate has a thicker thickness at the peripheral portion of the substrate than the first substrate, and the film at the central portion of the substrate Thick and relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode cover 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thereby, the film thickness of the central portion of the substrate of the second substrate can be increased. Therefore, in both the first substrate and the second substrate, it is possible to suppress a decrease in in-plane uniformity due to the influence of the terminal effect.

Further, in the plating apparatus 10 of the present embodiment, in addition to adjusting the diameter of the opening 25a of the anode cover 25, the in-plane uniformity of the plating film of the substrate W can be adjusted by adjusting the diameter of the opening 60a of the regulating plate 60. Upgrade.

The adjustment plate 60 is provided at a position closer to the substrate W than the anode cover 25. Therefore, it becomes difficult to diffuse to the peripheral portion of the substrate W by the plating current of the opening 60a of the adjustment plate 60. Therefore, when the diameter of the opening 60a of the adjustment plate 60 is small, the film thickness of the peripheral portion of the substrate W can be made thin, and when the diameter of the opening 60a is increased, the film thickness of the peripheral portion of the substrate W can be increased.

The diameter of the opening 60a of the adjusting plate 60 is preferably appropriately adjusted in accordance with the film thickness distribution of the substrate W which is changed by adjusting the diameter of the opening 25a of the anode cover 25. Therefore, when the second substrate having different characteristics of the first substrate or the condition for processing the first substrate is plated, the diameter of the opening 25a of the anode cover 25 is made smaller or smaller than the diameter when the first substrate is processed. The diameter is adjusted to be large, and the diameter of the opening 60a of the regulating plate 60 is appropriately changed. In the case where the adjustment plate 60 has the plurality of first plates 71A and the plurality of second plates 71B as shown in the eighteenth to twenty-secondth embodiments, the opening portions 69A formed by the respective plates can be appropriately changed independently, 69B. Therefore, when a plurality of substrates having different characteristics and processing conditions are plated, it is possible to configure a device that can control the reduction in in-plane uniformity due to the influence of the terminal effect.

Next, the change in the diameter of the opening 25a of the anode cover 25 and the diameter of the opening 60a of the adjustment plate 60 will be specifically described to cause a change in the profile of the plating film of the substrate W. Hereinafter, an example in which the adjustment plate 60 shown in the fourth to seventeenth drawings is used will be described.

Figure 23 shows the substrate with high resist opening ratio (80%) and low resist Outline view of the plating film of the substrate W at an aperture ratio (10%). In the figure, "AM" indicates the diameter of the opening 25a of the anode cover 25, "RP" indicates the diameter of the opening 60a of the adjustment plate 60, "HDP" indicates the substrate W having a high resist opening ratio, and "LDP" indicates a low resist opening. Rate of substrate W. Further, the substrate W having a high resist opening ratio and the seed layer thickness of the substrate W having a low resist opening ratio are both 50 nm to 100 nm, and the outline of the 23rd drawing is plated with a relatively low-resistance plating solution. Under the contour.

As shown in the figure, when the diameter W of the opening 25a is 230 mm and the diameter of the opening 60a is 276 mm, the substrate W having a high resist opening ratio is plated (hereinafter referred to as condition A), and the film thickness at the central portion of the substrate is used. The thickness is increased, and the film thickness at the peripheral portion of the substrate is reduced. On the other hand, in the case where the diameter of the opening 25a is 270 mm and the diameter of the opening 60a is 276 mm, the substrate W having a high resist opening ratio is plated (hereinafter referred to as condition C) because the condition C is the diameter of the opening 25a. Since the thickness is larger than the condition A, the film thickness at the central portion of the substrate is reduced. In addition, when the diameter W of the opening 25a is 270 mm and the diameter of the opening 60a is 280 mm, the substrate W having a high resist opening ratio is plated (hereinafter referred to as condition B) because the condition B is the diameter ratio of the opening 60a. Since the condition C is large, the film thickness at the peripheral portion of the substrate is increased.

When the diameter W of the opening 25a is 270 mm and the diameter of the opening 60a is 276 mm, the substrate W having a low resist opening ratio is plated (hereinafter referred to as condition E), and the film thickness at the center portion of the substrate is thinned, and the periphery of the substrate is thinned. The film thickness of the part is thick. This means that the film thickness at the peripheral portion of the substrate becomes thick due to the influence of the terminal effect. On the other hand, in the case where the diameter of the opening 25a is 220 mm and the diameter of the opening 60a is 276 mm, the substrate W having a low resist opening ratio is plated (hereinafter referred to as condition F) because the condition F is the diameter of the opening 25a. Since the thickness is smaller than the condition E, the film thickness at the central portion of the substrate is reduced. In addition, when the diameter W of the opening 25a is 220 mm and the diameter of the opening 60a is 274 mm, the substrate W having a low resist opening ratio is plated (hereinafter referred to as condition D) because the condition D is the diameter ratio of the opening 60a. Since the condition F is large, the film thickness at the peripheral portion of the substrate is reduced.

As shown in the twenty-third figure, even the substrate W having a low resist opening ratio which exhibits a relatively significant effect of the terminal effect is suitable for the opening of the substrate W due to the opening ratio of the opening 25a. Since the diameter of 25a (270 mm, conditions B and C) is smaller, it is possible to suppress the in-plane uniformity of the film thickness of the substrate W due to the terminal effect (see conditions D and F). Further, by adjusting the diameter of the opening 60a of the regulating plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the in-plane uniformity of the film thickness of the substrate W due to the end effect can be further suppressed. According to condition D).

The twenty-fourth graph shows a profile of a plating film of a substrate W having a thick seed layer (500 nm or more) and a substrate W having a thin seed layer (50 to 100 nm). Further, the substrate W having a thick seed layer and the substrate W having a thin seed layer have a resist opening ratio of 10%, and the twenty-fourth sheet is plated with a relatively low-resistance plating solution. profile.

As shown in the figure, when the diameter W of the opening 25a is 230 mm and the diameter of the opening 60a is 276 mm, the substrate W having a thick seed layer is plated (hereinafter referred to as condition A), and the film thickness at the central portion of the substrate is obtained. The thickness is increased, and the film thickness at the peripheral portion of the substrate is reduced. On the other hand, in the case where the diameter of the opening 25a is 270 mm and the diameter of the opening 60a is 276 mm, the substrate W having a thick seed layer is plated (hereinafter referred to as condition C) because the condition C is the diameter of the opening 25a. Since the thickness is larger than the condition A, the film thickness at the central portion of the substrate is reduced. In addition, when the diameter W of the opening 25a is 270 mm and the diameter of the opening 60a is 278 mm, the substrate W having a thick seed layer is plated (hereinafter referred to as condition B) because the condition B is the diameter ratio of the opening 60a. Since the condition C is large, the film thickness at the peripheral portion of the substrate is increased.

When the diameter of the opening 25a is 270 mm and the diameter of the opening 60a is 276 mm, the substrate W having a thin seed layer is plated (hereinafter referred to as condition E), and the film thickness at the center portion of the substrate is thinned, and the periphery of the substrate is thinned. The film thickness of the part is thick. This means that the film thickness at the peripheral portion of the substrate becomes thick due to the influence of the terminal effect. On the other hand, in the case where the diameter of the opening 25a is 220 mm and the diameter of the opening 60a is 276 mm, the substrate W having the thin seed layer is plated (hereinafter referred to as condition F) because the condition F is the diameter of the opening 25a. Since the thickness is smaller than the condition E, the film thickness at the central portion of the substrate is increased. In addition, when the diameter W of the opening 25a is 220 mm and the diameter of the opening 60a is 274 mm, the substrate W having a thin seed layer is plated (hereinafter referred to as condition D) because the condition D is the diameter ratio of the opening 60a. Since the condition F is large, the film thickness at the peripheral portion of the substrate is reduced.

As shown in the twenty-fourth embodiment, even the substrate W having a thin seed layer is relatively remarkable in the effect of the terminal effect, because the opening of the opening 25a is larger than the opening suitable for the plating treatment of the substrate W having the thick seed layer. Since the diameter of 25a (270 mm, conditions B and C) is smaller, it is possible to suppress the in-plane uniformity of the film thickness of the substrate W due to the terminal effect (see conditions D and F). Further, by adjusting the diameter of the opening 60a of the regulating plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the in-plane uniformity of the film thickness of the substrate W due to the end effect can be further suppressed. According to condition D).

The twenty-fifth diagram shows a plated film of a substrate W plated with a plating solution having a relatively high resistance (type A) and a substrate W plated with a plating solution having a relatively low resistance (type B). Outline map. Further, the substrate W plated with the plating liquid having a relatively high electric resistance and the substrate W plated with the plating liquid having a relatively low electric resistance have a resist opening ratio of 10%, and the thickness of the seed layer is 50 nm. ~100nm.

As shown in the figure, in the case where the diameter of the opening 25a is 230 mm and the diameter of the opening 60a is 276 mm, the substrate W coated with the plating liquid having a relatively high electric resistance is plated (hereinafter referred to as condition A). The film thickness at the central portion of the substrate is increased, and the film thickness at the peripheral portion of the substrate is reduced. On the other hand, in the case where the diameter of the opening 25a is 260 mm and the diameter of the opening 60a is 276 mm, the substrate W coated with the plating liquid having a relatively high electric resistance is plated (hereinafter referred to as condition C) because In the condition C, the diameter of the opening 25a is larger than the condition A, and therefore the film thickness at the central portion of the substrate is reduced. In addition, in the case where the diameter of the opening 25a is 260 mm and the diameter of the opening 60a is 272 mm, the substrate W coated with the plating liquid having a relatively high electric resistance (hereinafter referred to as condition B) is plated. B is that the diameter of the opening 60a is smaller than the condition C, so the film thickness at the peripheral portion of the substrate is reduced.

In the case where the diameter of the opening 25a is 270 mm and the diameter of the opening 60a is 276 mm, the substrate W coated with the plating liquid having a relatively low resistance (hereinafter referred to as condition E) is plated, and the center portion of the substrate is used. The film thickness is reduced, and the film thickness at the peripheral portion of the substrate is increased. This means that the film thickness at the peripheral portion of the substrate becomes thick due to the influence of the terminal effect. On the other hand, in the case where the diameter of the opening 25a is 220 mm and the diameter of the opening 60a is 276 mm, the substrate W coated with the plating liquid having a relatively low resistance is plated (hereinafter referred to as condition F) because The condition F is that the diameter of the opening 25a is smaller than the condition E, and therefore the film thickness at the central portion of the substrate is increased. In addition, in the case where the diameter of the opening 25a is 220 mm and the diameter of the opening 60a is 274 mm, the substrate W coated with the plating liquid having a relatively low resistance (hereinafter referred to as condition D) is plated. D is that the diameter of the opening 60a is smaller than the condition F, so that the film thickness of the peripheral portion of the substrate is reduced.

As shown in the twenty-fifth figure, even if the substrate W is plated with a plating liquid having a relatively low resistance, the diameter of the opening 25a is plated with a plating liquid having a relatively high electric resistance. The diameter (260 mm, conditions B, C) of the opening 25a suitable for the plating treatment of the substrate W is made smaller, so that the in-plane uniformity of the film thickness of the substrate W due to the end effect can be suppressed from being lowered. (Refer to conditions D and F). Further, by adjusting the diameter of the opening 60a of the adjustment plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the in-plane uniformity of the film thickness of the substrate W due to the end effect can be further suppressed (refer to Condition D). .

As shown in the twenty-third to twenty-fifth diagrams, in order to perform uniform plating under various conditions in which the effects of the terminal effect are different, the variation of the diameter of the opening 25a of the anode cover 25 is larger than the opening of the regulating plate 60. The degree of change in the diameter of 60a is much better. In order to adjust the diameter of the opening 25a of the anode cover 25 with a large degree of change, a mechanism such as the aforementioned diaphragm blade 27 is preferable. Since the anode cover 25 is separated from the substrate W, even if the opening 25a of the anode cover 25 is made small, the electric flux is spread between the anode cover 25 and the substrate W, and the film thickness distribution of the plating film over a wide range of the substrate W can be adjusted. .

Even if the influence of the end effect is removed in the peripheral portion of the substrate W, the electric flux diffused to the outside between the anode cover 25 and the substrate W is concentrated on the peripheral portion of the substrate W, so that the plating film tends to be thick. The plating film thickness adjustment in the relatively narrow region of the peripheral portion of the substrate W as described above is achieved by the opening adjustment portion 63 of the adjustment plate 60. Since the adjustment plate 60 is close to the substrate W, the electric field of the peripheral portion of the substrate W can be directly shielded, and the plating film thickness of the peripheral portion of the substrate W can be adjusted even if the opening diameter is relatively small.

The embodiments of the present invention have been described above, and the embodiments of the invention described above are intended to facilitate the understanding of the invention and are not intended to limit the invention. The present invention can be modified and improved without departing from the spirit thereof. Of course, the present invention also includes equivalents thereof. Further, any combination or omission of each constituent element described in the patent application scope and the specification can be made within the scope of at least a part of the above-mentioned problems, or at least a part of the effect. For example, in the above embodiment, a plurality of aperture blades 27 are used as a mechanism for adjusting the diameter of the opening 25a of the anode cover 25, and a plurality of first plates 71A are used as a mechanism for adjusting the diameter of the opening 60a of the adjustment plate 60. And a plurality of second plates 71B. However, the plurality of first plates 71A and the plurality of second plates 71B may be used to adjust the diameter of the opening 25a of the anode cover 25. Further, it is not limited to a plurality of aperture blades 27, a plurality of first plates 71A, and a plurality of second plates 71B, and other types of adjustment mechanisms may be employed.

60‧‧‧Adjustment board

60a‧‧‧ openings

61‧‧‧ board body

62‧‧‧ hanging lower part

63‧‧‧ Opening adjustment department

70‧‧‧ board

Claims (12)

An adjustment plate for adjusting a current between an anode and a substrate to be plated, having: a plate body portion having a rim portion, the edge portion forming a first opening through which current flows; and a plurality of first plates for reducing a diameter of the first opening; and a first moving mechanism that synchronously moves the plurality of first plates in a radial direction of the first opening. The adjustment plate according to claim 1, wherein the first moving mechanism includes a ring member disposed along the edge portion; and the ring member and any one of the plurality of first plates has a sliding long hole. It is inclined with respect to the radial direction of the first opening; the other of the ring member and the plurality of first plates has a slide pin that slides in the sliding long hole. The adjustment plate according to claim 2, wherein the first moving mechanism includes a plate pressing member fixed to an opposite side of the ring member of the plurality of first plates; the plate pressing member and the plurality of the plurality of Any one of the plates has a guide elongated hole formed in a synchronous moving direction parallel to the first plate; the other of the plate pressing member and the plurality of first plates has a guide pin, which is long in the guide The hole slides. The adjustment plate according to claim 2, wherein the first moving mechanism includes a rotating member for rotating the ring member in a circumferential direction; the rotating member has a ring portion and a rod portion, and the ring portion is fixed In the ring member, the rod portion rotates the ring portion in the circumferential direction. The adjustment plate according to claim 4, wherein: any one of the plate body and the ring portion has a support long hole formed along a rotation direction of the ring portion; and the plate body and the ring portion are further One has a support pin that slidably engages the aforementioned support slot. The adjustment plate according to claim 1, wherein an inner circumference of each of the first plates is formed in an arc shape, and the other first plates overlap each other to form a substantially circular inner circumference. The adjustment plate according to claim 1 of the patent application has: a plurality of second plates disposed at positions offset from the plurality of first plates in a direction perpendicular to a radial direction of the first opening, for reducing a diameter of the first opening; and a second moving mechanism for making the plurality of The two plates move synchronously in the radial direction of the first opening. The adjustment plate of claim 7, wherein the first plate and the second plate are disposed such that a center of the opening formed by the plurality of first plates is formed by the plurality of second plates The line connecting the centers of the openings is perpendicular to the radial direction of these openings. An adjustment plate for adjusting a current between the anode and the substrate to be plated, comprising: a first plate body portion having: a first edge portion, a first opening through which a current flows; and a plurality of first plates, a second plate body portion having: a second edge portion forming a second opening through which current flows; and a plurality of second plates for reducing a diameter of the second opening, wherein the foregoing The first plate body portion and the second plate body portion are connected to each other such that a line connecting the center of the opening formed by the plurality of first plates and a center of the opening formed by the plurality of second plates is perpendicular to the The radial direction of the opening. The adjustment plate according to any one of claims 7 to 9 is configured such that the diameter of the opening formed by the plurality of first plates and the diameter of the opening formed by the plurality of second plates can be independently adjusted. A plating apparatus having: an anode holder configured to hold an anode; a substrate holder configured to hold the substrate facing the anode holder, and an anode cover having a second opening integrally mounted to the anode holder for the foregoing And an adjustment plate according to any one of claims 1 to 10, wherein the anode cover has an adjustment mechanism for adjusting a diameter of the second opening. A plating method, comprising: disposing an anode holder in a plating tank, wherein the anode holder integrally includes an anode cover having a first opening through which an electric current flowing between the anode and the substrate passes; a substrate holder of the substrate is disposed in the plating tank; an adjustment plate is disposed between the anode cover and the substrate, the adjustment plate has a second opening and a third opening through which a current flowing between the anode and the substrate passes; Adjusting a diameter of the first opening to a first diameter, plating on the first substrate; disposing the substrate holder holding the second substrate in the plating tank; and adjusting a diameter of the first opening to be larger than the first diameter The second diameter is smaller, and the diameters of the second opening and the third opening of the adjusting plate are respectively changed to plate the second substrate.