TW201731129A - Light-emitting device - Google Patents

Abstract

An embodiment of present invention discloses a light-emitting device which includes a light source, a transparent covering structure, a reflective structure and an optical conversion structure. The light source includes a light-emitting surface, a bottom surface opposite to the light-emitting surface, a side surface, a first electrode and a second electrode. The first electrode and the second electrode are located at the bottom surface. The transparent covering structure covers the light-emitting surface and the side surface. The reflective structure has a first reflective structure surrounding the transparent covering structure, and a second reflective structure directly contacting the first reflective structure. The optical conversion structure is formed on the reflective structure and the transparent covering structure.

Description

Illuminating device

The present invention discloses a light emitting device, and more particularly to a light emitting device having a reflective structure surrounding a transparent package structure.

Light-Emitting Diode (LED) has the characteristics of low energy consumption, long life, small volume, and fast response speed, and is gradually being used in various lighting devices instead of the conventional illumination source.

In the illumination applications of various types of light-emitting diodes, fluorescent powders are often used in combination with light-emitting diodes to emit various color lights, but the combination of phosphor powder and light-emitting diodes tends to be less efficient than expected. Therefore, how to improve the efficiency when using phosphor powder in a lighting device becomes an important issue.

An embodiment of the invention discloses a light emitting device comprising a light emitting body, a transparent package structure, a reflective structure and an optical conversion structure. The illuminating body comprises a light emitting surface, a bottom surface opposite to the light emitting surface, a side surface, a first electrode, and a second electrode, wherein the first electrode and the second electrode are located on the bottom surface. A transparent package structure covers the light exit surface and the side surface. The reflective structure has a first reflective structure surrounding the transparent package structure and a second reflective structure in direct contact with the first reflective structure. The optical conversion structure is formed on the reflective structure and the transparent package structure.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Embodiments of the invention are described below in conjunction with the drawings. In the drawings or the description, similar or identical elements are designated by the same reference numerals.

Fig. 1A is a schematic cross-sectional view showing a light-emitting element 100 in an embodiment of the present invention. Fig. 1B is a view showing the lower side of the light-emitting element 100 in an embodiment of the present invention. The light emitting device 100 includes a light emitting body 1, a first reflective structure 2, a second reflective structure 3, a transparent package structure 6, and an optical conversion structure 5. The light-emitting body 1 has a light-emitting surface 12, and two conductive electrodes 4 are located on a lower surface of the light-emitting body 1 with respect to the light-emitting surface 12, and a plurality of side surfaces 11. The conductive electrode 4 includes an upper portion 41 closer to the light-emitting surface and a lower portion 42 farther from the light-emitting surface 12, and the outermost edge of the conductive electrode 4 does not exceed the outermost edge of the light-emitting body 1 (ie, the conductive electrode 4) It may be flush with the outermost edge of the illuminating body 1 or retracted from the outermost edge). The first reflective structure 2 surrounds the side surface 11 of the light-emitting body 1 and the upper portion 41 of the conductive electrode 4. The first reflective structure 2 has a lower surface 21, an upper surface 22, an inner surface 23, and an outer surface 24. The inner surface 23 and the outer surface 24 may have the same or different reflection coefficients due to process or material differences. The lower surface 21 has a width W1 and the upper surface 22 has a width W2, W1 > W2. The inner surface 23 is a sloped surface which is not parallel to the side surface 11 of the light-emitting body 1 and has an inclination angle θ with the lower surface 21, and θ is an acute angle between 0 and 90. The outer surface 24 is substantially perpendicular to the lower surface 21. That is, the cross section of the first reflective structure 2 has a ladder-shaped structure with a narrow upper and a lower width. The upper surface 22 of the first reflective structure 2 is not horizontal with the light-emitting surface 12 of the light-emitting body 1, and the upper surface 22 is located above the light-emitting surface 12, and has a height difference L greater than 0 between the light-emitting surface 12. The second reflective structure 3 is located below the first reflective structure 2 and includes a first portion 31 surrounding the lower portion 42 of the conductive electrode 4 and a second portion 32 covering the region between the two conductive electrodes 4. The first portion 31 is adjacent to one end of the light-emitting body 1 and covers one outer side of the lower portion 42 of the conductive electrode 4, and the upper end is located below the first reflective structure 2 and is in direct contact with the lower surface 21. The second portion 32 is filled in a region between the two conductive electrodes 4, and both ends of the second portion 32 are in direct contact with the sides of the two conductive electrodes 4. Therefore, most or all of the lower surface of the light-emitting body 1 not covered by the conductive electrode 4 is covered by the second reflective structure 3. Referring to FIG. 1B, the second reflective structure 3 surrounds the two conductive electrodes 4 as viewed from the lower side of the light-emitting element 100. In another embodiment, the first reflective structure 2 and the second reflective structure 3 are formed by one step. The lower surface of the second reflective structure 3 is substantially coplanar with the lower surface 43 of the two conductive electrodes 4. In another embodiment, the first portion 31 and/or the second portion 32 of the second reflective structure 3 has an arcuate lower surface (eg, viewed from a side view) such that the second reflective structure 3 is underneath. The surface is not coplanar with the lower surface 43 of the two conductive electrodes 4.

In one embodiment, the transparent package structure 6 in the light-emitting element 100 includes or does not include a wavelength converting material (eg, phosphor powder, dye, nano particles, etc.), and is located in the first reflective structure 2 and the second reflective structure 3 And between the illuminating bodies 1. The transparent package structure 6 surrounds the side surface 11 of the light-emitting body 1 and the upper portion 41 of the conductive electrode 4, and completely covers the light-emitting surface 12. The optical conversion structure 5 is located above the transparent package structure 6 and covers the first reflective structure 2, the transparent package structure 6, and the illuminating body 1. The lower surface 52 of the optical conversion structure 5 is substantially coplanar and interengaged with the upper surface 61 of the transparent package structure 6 and the upper surface 22 of the first reflective structure. In other words, the transparent material 6 is located between the first reflective structure 2, the second reflective structure 3, and the optical conversion structure 5, and surrounds the light-emitting body 1. The side surface 51 of the optical conversion structure 5, the outer surface 24 of the first reflective structure 2, and the outer surface 33 of the second reflective structure 3 are substantially coplanar (as shown in Figure 1A, at least in a cross-sectional view). In another embodiment, the outer surface 33 of the second reflective structure 3 is not coplanar with the outer surface 24 of the first reflective structure 2 and is located below the lower surface 21 of the first reflective structure 2. However, the periphery of the transparent package structure 6 is still completely covered by the optical conversion structure 5, the first reflection structure 2, and the second reflection structure 3, and is not in direct contact with the external environment. Generally, the first reflective structure 2 and the second reflective structure 3 form a structure such as a reflective cup, which can reflect the light emitted by the illuminating body 1 and guide it to the upper surface 61 of the transparent package structure 6, and then pass through the optical conversion structure. 5 converting and/or mixing into the desired light to cause the light-emitting element 100 to illuminate upward. When the wavelength conversion material is included in the transparent package structure 6, the light emitted by the light-emitting body 1 can also be converted, and the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 can be the same material. If the materials are the same, the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 may have different concentrations, for example, the wavelength conversion material concentration in the transparent package structure 6 is higher than the wavelength conversion material concentration in the optical conversion structure 5. The wavelength conversion material in the transparent package structure 6 may also be different from the wavelength conversion material in the optical conversion structure 5. For example, the optical conversion structure 5 includes a shorter radiation wavelength phosphor (for example, yellow/yellow green phosphor), and is transparent. The package structure 6 contains a longer radiation wavelength phosphor (for example, red phosphor). In another embodiment, a portion of the transparent package structure 6 extends between the two conductive electrodes 4, for example, between the second portion 32 of the second reflective structure 3 and the illuminating body 1.

Referring to Figure 1A, in one embodiment, light-emitting element 100 has a total height T. T is not more than 650 μm. In another embodiment T is no greater than 570 μm. The light-emitting body 1 has a height H1 (the distance between the lower surface 43 of the conductive electrode 4 and the light-emitting surface 12), the first reflective structure 2 and the second reflective structure 3 have a height H2 as a whole, and the optical conversion structure 5 has a height H3. The lower surface 52 of the optical conversion structure 5 has a distance L greater than zero from the light exit surface 12 of the light-emitting body 1. In one embodiment, 0 < L ≦ 200 μm. Among them, H2>H1, and H2 is about 1.2 to 2.5 times that of H1. In an embodiment, H2/H1 = 1.2, 1.55, or 2. T is about 1.2 to 4.7 times that of H3. In one embodiment, T is about 1.6 to 4.5 times H3, such as 1.7, 2.1, and 4.3 times. The light-emitting surface 12 of the light-emitting body 1 has a width W3, the upper surface 61 of the transparent package structure 6 has a width W4, and the optical conversion structure 5 has a width W5, W5>W4>W3. In other words, the optical conversion structure 5 completely covers the transparent package structure 6 and the light-emitting body 1, and the transparent package structure 6 completely covers the light-emitting body 1. Among them, W5 is about 1.2 to 3 times that of W3. In one embodiment, W5 is approximately 1.3 to 2.6 times, 1.4, 2, 2.1, or 2.4 times W3. W5 is about 1 to 1.4 times that of W4. In one embodiment, W5/W4 = 1.25, 1.27, or 1.31. The inner surface 23 of the first reflective structure 2 and the side surface 11 of the illuminating body 1 have a distance D greater than 0, for example 50 μm ≦D ≦ 300 μm, wherein W3 is 2 to 11 times D. In one embodiment, W3/D = 2.24, 3.13, 3.4, 6.6, 7.62, 7.8, 9, 10.2, or 13.2, and the like. When the size is in the above numerical range, the light-emitting element 100 can generally have better optical characteristics such as luminous efficiency, light field and color temperature.

In one embodiment, the illuminating body 1 is a semiconductor illuminating element capable of emitting non-coherent light, and includes a carrier, a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first type semiconductor layer and the second type semiconductor layer are, for example, a cladding layer or a confinement layer, and respectively provide electrons and holes to combine electrons and holes in the active layer to emit light. The first type semiconductor layer, the active layer, and the second type semiconductor layer may comprise a III-V semiconductor material such as Al _x In _y Ga _{( 1-xy )} N or Al _x In _y Ga _{( 1-xy )} P, wherein 0≦x, y≦1; (x+y)≦1. According to the material of the active layer, the illuminating body 1 emits a red light with a peak between 610 nm and 650 nm, a green light with a peak between 530 nm and 570 nm, and a peak between 450 nm and 490 nm. The blue light, or near-ultraviolet light with a peak between 405 nm and 450 nm, or ultraviolet light with a peak between 280 nm and 400 nm. The carrier can be used as a growth substrate of a first type semiconductor layer, an active layer, and a second type semiconductor layer, or as a first type semiconductor layer, an active layer, and a second type after removing the grown substrate. A carrier of a semiconductor layer. The material of the substrate includes, but is not limited to, germanium (Ge), gallium arsenide (GaAs), indium phosphate (InP), sapphire (Sapphire), tantalum carbide (SiC), germanium (Si), lithium aluminate (LiAlO ₂ ), Zinc oxide (ZnO), gallium nitride (GaN), aluminum nitride (AlN), metal, glass, composite, diamond, CVD diamond, and diamond-like carbon (DLC).

In one embodiment, the material of the conductive electrode 4 may be a metal such as gold (Au), silver (Ag), copper (Cu), chromium (Cr), aluminum (Al), platinum (Pt), nickel (Ni), Titanium (Ti), tin (Sn), or an alloy thereof, or a combination thereof. The transparent package structure 6 comprises Silicone, Epoxy, Polyimine (PI), benzocyclobutene (BCB), Perfluorocyclobutane (PFCB), SU8, Acrylic Resin ), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide (Polyetherimide), fluorocarbon polymer (Fluorocarbon Polymer), oxidation Aluminum (Al ₂ O ₃ ), SINR, spin-on glass (SOG).

In one embodiment, the optical conversion structure 5 comprises a substrate and a wavelength converting material, and the optical conversion structure 5 comprises the same or different wavelength converting material as the transparent packaging structure 6, and the wavelength converting material may comprise a dispersion in a matrix. A plurality of phosphor materials. Alternatively, the optical conversion structure 5 may further comprise diffusion particles. The matrix comprises epoxy resin (Epoxy), silicone (Silicone), polyamidamine (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), Su8, acrylic resin (Acrylic Resin), poly Methyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), or polyetherimide. Fluorescent powder materials include, but are not limited to, yellow-green phosphor powder and red phosphor powder. The composition of the yellow-green phosphor is, for example, an aluminum oxide (for example, yttrium aluminum garnet (YAG) or yttrium aluminum garnet (TAG)), silicate, vanadate, alkaline earth metal selenide, or metal nitride. The components of the red phosphor are, for example, citrate, vanadate, alkaline earth metal sulfide, metal oxynitride, or a mixture of tungsten molybdate salts. The components of the diffusing particles include, but are not limited to, titanium dioxide, zirconium oxide, zinc oxide or aluminum oxide.

In one embodiment, the materials of the first reflective structure 2 and the second reflective structure 3 comprise a mixture of a matrix and a high reflectivity material. The substrate can be a silicone-based or epoxy-based; the high reflectivity material can comprise titanium dioxide, ceria or alumina.

1C is a schematic cross-sectional view showing a light-emitting element according to another embodiment of the present invention. The technical feature of the light-emitting element 100' can be described in the foregoing description about the light-emitting element 100, except that the inner surface 23' of the first reflective structure 2 has a curved surface close to the optical conversion structure 5. The same symbols and symbols as those in the foregoing embodiments denote similar or identical elements or devices, and are not described herein again.

2A to 2G are schematic views showing a manufacturing process of a light-emitting element according to an embodiment of the present invention. Referring to FIG. 2A, a first temporary carrier 7 having adhesiveness is first provided, and two conductive electrodes 4 of the plurality of light-emitting bodies 1 are disposed on the first temporary carrier 7, and the lower portion 42 of the conductive electrode 4 is buried. The first temporary carrier 7. The area between adjacent illuminating bodies 1 is defined as a walkway area, wherein the accuracy of the illuminating body 1 placed on the first temporary carrier 7 depends mainly on the accuracy of the Pick & Place system, and is generally selected and placed. The system error will not exceed ±15μm. Next, a transparent package structure 6 is formed to fill the aisle region between the light-emitting bodies 1 and cover the light-emitting surface 12 of the light-emitting body 1 and the upper surface of the first temporary carrier 7 not covered by the light-emitting body 1. The transparent package structure 6 can be formed by using steel plate printing, coating, brushing, spin coating, inkjet printing, dispensing, mold filling, and the like. The material of the first temporary carrier 7 includes, but is not limited to, a thermal dissociation glue. As shown in FIG. 2B, a second temporary carrier 8 having adhesiveness is adhered to the upper surface 61 of the transparent package structure 6. Thereafter, the first temporary carrier 7 is removed, the lower portion 42 and the lower surface 43 of the conductive electrode 4, and the lower surface 63 of the transparent package structure 6 are exposed. The removal method can be performed by laser peeling, heating separation, dissolution, and the like. It is important to note that the lower surface 63 of the transparent package structure 6 is not coplanar with the lower surface 43 of the conductive electrode 4. Specifically, the lower portion 42 of the conductive electrode 4 protrudes beyond the transparent package structure 6. The material of the second temporary carrier 8 may be a thermal release tape, a UV tape, a chemical release tape, a heat resistant tape or a blue film.

As shown in Fig. 2C, the structure in Fig. 2B is flipped. The transparent package structure 6 is cut using a cutter to form an upper width and a lower narrow cut path 62. The width of the cutting track 62 away from the second temporary carrier 8 is greater than the width of the second temporary carrier 8. In other words, the dicing street 62 causes the transparent package structure 6 to form a structure having an upper narrow width and a substantially trapezoidal shape. The narrower bottom edge of the transparent package structure 6 is in direct contact with the side edges of the conductive electrodes 4 of the light-emitting body 1. It is important to note that the cutter may create cuts on the second temporary carrier 8, but does not substantially separate the second temporary carrier 8. In other words, the respective light-emitting bodies 1 covered by the transparent package structure 6 are still attached to the second temporary carrier 8. Next, as shown in FIG. 2D, a reflective structure 2' is formed in the dicing street 62, and covers the conductive electrode 4 of the illuminating body 1 and the lower surface 63 of the transparent package structure 6, and the gap between the two conductive electrodes 4. . The reflective structure 2' can be formed by pattern printing, coating, brushing, spin coating, inkjet printing, dispensing, sputtering, or mold potting. Subsequently, as shown in Fig. 2E, a polish process is performed to expose the lower surface 43 of the conductive electrode 4, and the reflective structure 2' is substantially coplanar with the lower surface 43 of the conductive electrode 4. In an embodiment, the reflective structure 2' comprises a first reflective structure 2 and a second reflective structure 3 similar to those shown in FIG.

Next, as shown in FIG. 2F, the structure in FIG. 2E is inverted, and the second temporary carrier 8 is removed by laser peeling, heating separation, dissolution, irradiation of ultraviolet light, or the like. Here, a planarization process, such as a polish process, may be performed to planarize the upper surface 61 of the transparent package structure 6, and by this step, the second temporary carrier 8 on the transparent package structure 6 may be removed. the remains. Thereafter, the optical conversion structure 5 is formed over the upper surface 61 of the transparent package structure 6 by means of steel plate printing, coating, brushing, spin coating, ink jet printing, dispensing, pressing or mold potting. Here, a polishing process may also be performed to planarize the upper surface of the optical conversion structure 5. Finally, as shown in Fig. 2G, cutting is performed between the dicing streets 62 to separate the light-emitting elements. In the step of Fig. 2G, the structure in Fig. 2F can be selectively flipped (i.e., the optical conversion structure 5 is directed downward) and then diced. In another embodiment, in the step of FIG. 2F, a third temporary carrier (not shown) is first adhered to the other side of the optical conversion structure 5 relative to the second temporary carrier 8, and then the first Two temporary vehicles 8. In the step of FIG. 2G, the cutting process is completed and the third temporary carrier is removed. The method of removing the third carrier is the same as removing the second temporary carrier 8 , and details are not described herein again.

In the step of FIG. 2A, the transparent package structure 6 is filled between the two conductive electrodes 4 of the light-emitting body 1. Therefore, as shown in FIG. 2G, a transparent package structure 6 exists between the upper portions 41 of the two conductive electrodes 4, and is connected to the reflective structure 2' between the two adjacent conductive electrodes 4 of the light-emitting body 1 to cause light emission. A transparent encapsulation structure 6 is present between the two conductive electrodes 4 of the main body 1. In another embodiment, in the step of FIG. 2A, the transparent package structure 6 is not formed between the two conductive electrodes 4 of the light-emitting body 1. Therefore, in the step of FIG. 2G, the transparent package structure 6 is not present under the light-emitting body 1, and the light-emitting element 100 as shown in FIG. 1A is formed.

3A to 3I are schematic views showing another manufacturing process of a light-emitting element according to an embodiment of the present invention. The same symbols and symbols as those in the foregoing manufacturing process are similar or identical elements, and the corresponding descriptions of the front opening are referred to, and will not be described again. The steps in Figures 3A to 3C are the same as those in Figures 2A to 2C. Next, as shown in FIG. 3D, a fourth temporary carrier 7' is provided on the other side of the second temporary carrier 8, and then the second temporary carrier 8 is removed. The fourth temporary carrier 7' has similar material properties as the first temporary carrier 7, and the lower portion 42 of the conductive electrode 4 is buried in the fourth temporary carrier 7'. Subsequently, as shown in FIG. 3E, the structure in the 3D drawing is reversed and formed by pattern printing, coating, brushing, spin coating, inkjet printing, dispensing, sputtering, or mold filling. The first reflective structure 2 is in the scribe line 62. Here, a polish process may also be performed to planarize the upper surface 61 of the transparent package structure 6 and to remove the first reflective structure 2 overflowing onto the transparent package structure 6. Next, as shown in FIG. 3F, the optical conversion structure 5 is formed above the upper surface 61 of the transparent package structure 6 and the first reflective structure 2. As shown in Fig. 3G, the structure in Fig. 3F is reversed, the fourth temporary carrier 7' is removed, the lower portion 42 and the lower surface 43 of the conductive electrode 4, and the lower surface 63 of the transparent package structure 6 are exposed. Next, as shown in FIG. 3H, the second reflective structure 3 is formed on the other surface of the transparent package structure 6 with respect to the optical conversion structure 5 by means of steel plate printing, coating, brushing, spin coating, inkjet printing, or the like. The second reflective structure 3 surrounds the outer surface of the conductive electrode 4, covers the lower surface 63 of the transparent package structure 6, and the lower surface 21 of the first reflective structure 2. Wherein, the second reflective structure 3 does not cover the lower surface 43 of the conductive electrode 4 or does not cover all of the lower surface 43. As shown in Fig. 3I, cutting is performed between the dicing streets 62 to form a plurality of light-emitting elements that are separated from each other. In the step of FIG. 3H, another temporary carrier (not shown) may be selectively provided on the optical conversion structure 5 to form the second reflective structure 3. In the step of FIG. 3I, the temporary carrier (not shown) may also be removed after the cutting process is completed, and the removal is performed as if the second temporary carrier 8 is removed.

In the step of FIG. 3A, the transparent package structure 6 is filled between the adjacent conductive electrodes 4 of the light-emitting body 1. Therefore, as shown in FIG. 3H, a transparent package structure 6 exists between the upper portions 41 of the adjacent conductive electrodes 4, so that the second portion 32 of the second reflective structure 3 between the conductive electrodes 4 and the light-emitting body 1 There is a transparent package structure 6. In another embodiment, in the step of FIG. 3A, the transparent package structure 6 is not filled between the adjacent conductive electrodes 4 of the light-emitting body 1. Therefore, in the step of FIG. 3H, only the second portion 32 of the second reflective structure 3 exists between the adjacent conductive electrodes 4 without the transparent package structure 6 being filled, and the light-emitting element 100 as shown in FIG. 1 is formed. .

In the step of FIG. 2C or FIG. 3C, if the cutting edge of the tool has an arc-shaped cross section, the transparent packaging structure 6 has an arc shape near the second temporary carrier 8. When the first reflective structure 2 is subsequently formed, the inner surface 23' thereof has an arc-shaped surface or line near the optical conversion structure 5, such as the light-emitting element 100' shown in FIG. 1C.

In another embodiment of the present invention, the optical conversion structure 5 of the light-emitting element 100 has a multilayer structure as shown in FIG. The light-emitting element 200 approximates the light-emitting element 100, wherein the optical conversion structure 5 comprises a first optical conversion structure 5' and a second optical conversion structure 5". The first optical conversion structure 5' comprises a phosphor material different from the second optical conversion Structure 5". For example, the first optical conversion structure 5' includes a component of yellow-green fluorescent powder, and the second optical conversion structure 5" includes a component of red fluorescent powder or a mixture of yellow-green fluorescent powder and red fluorescent powder. The composition or density or thickness ratio of the conversion structure 5' and the second optical conversion structure 5" may change the color or color temperature of the light emitted by the light-emitting element 200.

In another embodiment of the present invention, the light-emitting element 300 has an optical element disposed above the optical conversion structure 5, as shown in FIG. The light-emitting element 300 has an optical element 9 disposed above the optical conversion structure 5. The optical element 9, such as a convex lens, a concave lens, or a Fresnel lens, can be used to change the light type of light from the optical conversion structure 5 or to increase the brightness of the light-emitting element 300. The lower surface of the optical element 9 is in contact with the upper surface 53 of the optical conversion structure 5 and completely covers the transparent package structure 6, the first reflective structure 2 and the illuminating body 1. In an embodiment, the optical element 9 has an arcuate convex surface. In other embodiments, the upper surface of the optical element 9 may have other shapes depending on the desired light type, such as: a curved concave surface, a flat surface, a V-shaped concave surface, a convex surface having a sharp point, etc., but the above shape The scope of the invention is not limited. The material of the optical element 9 comprises Sapphire, Diamond, Glass, Epoxy, Quartz, Acrylic Resin, Oxide (SiOX), Alumina (Al). ₂ O ₃ ), zinc oxide (ZnO), or silicone (Silicone).

In another embodiment of the present invention, an extension electrode is disposed under the conductive electrode 4 of the light-emitting element 400, as shown in FIG. The light emitting element 400 has the extension electrode 10 formed on the lower surface 43 of each of the conductive electrodes 4 and electrically connected to the conductive electrode 4. The extension electrode 10 extends along the first portion 31 of the second reflective structure 3 toward the outermost side 4001 of the light emitting element 400. Specifically, the extension electrode 10 covers the lower surface 43 of the conductive electrode 4 and the lower surface of the second reflective structure 3. The width or/and the area of the extension electrode 10 are larger than that of the conductive electrode 4 to increase the convenience and reliability of subsequent assembly and soldering of the light-emitting element 400. In an embodiment, the outer side 101 of the extended electrode 10 is substantially coplanar with the outermost side 4001. In another embodiment, the outer side 101 of the extension electrode 10 is not coplanar with the outermost side 4001 of the light emitting element 400, or is retracted or convex. The material of the extension electrode 10 includes a metal such as gold (Au), silver (Ag), copper (Cu), chromium (Cr), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), Tin (Sn) or an alloy thereof or a combination thereof. In another embodiment (not shown), the second reflective structure 3 of the light-emitting element 400 has an arcuate lower surface, the apex of which is lower than the lower surface 43 of the conductive electrode 4, thus extending the electrode 10 and the conductive electrode 4 The portion of the contact is surrounded by the second reflective structure 3. If the first portion 31 of the second reflective structure 3 has a curved lower surface, the extended electrode 10 overlying it will thus form a similar profile with an arcuate upper or lower surface.

In another embodiment of the present invention, the transparent package structure 6 of the light-emitting element 500 and the optical conversion structure 5 have another sub-transparent package structure 6' as shown in FIG. The light-emitting element 500 has a primary transparent package structure 6' above the transparent package structure 6 and completely covers the transparent package structure 6 and the light-emitting body 1. The optical conversion structure 5 is conformally formed on the sub-transparent package structure 6' and completely covers the sub-transparent package structure 6', the transparent package structure 6, and the light-emitting body 1. The material of the sub-transparent package structure 6' may be the same as or different from the transparent package structure 6. The sub-transparent package structure 6' does not comprise a wavelength converting material, but may optionally comprise diffusing particles. In one embodiment, the sub-transparent package structure 6' and the transparent package structure 6 are formed by one step, and the material of the sub-transparent package structure 6' is the same as that of the transparent package structure 6. As shown in FIG. 7, since the sub-transparent package structure 6' has an arc-shaped upper convex surface, the distance between the light-emitting main body 1 and the optical conversion structure 5 in each direction is relatively close, so that the light is self-illuminating from all sides. The light path to the optical conversion structure 5 is also relatively uniform, and the light characteristics (for example, light intensity, color temperature, and color) of the light-emitting element 500 at each angle are also relatively uniform. The sub-transparent package structure 6' can change the light pattern of the light emitted from the light-emitting body 1 and then enter the optical conversion structure 5 for conversion or mixing. The sub-transparent package structure 6' can select different structures according to the desired light type, for example, a concave lens, a Fresnel lens, a square, a cylinder, a frustum, etc., but the above structure is not limited The scope of the invention.

Figure 8A is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention. The light-emitting element 600 includes a light-emitting body 1, a first reflective structure 2, a second reflective structure 3, a transparent package structure 6, and an optical conversion structure 5. The light-emitting body 1 has a light-emitting surface 12, and the positive and negative conductive electrodes 4 are located on a lower surface of the light-emitting body 1 with respect to the light-emitting surface 12, and a plurality of side surfaces 11. The conductive electrode 4 includes an upper portion 41 closer to the light-emitting surface and a lower portion 42 farther from the light-emitting surface 12, and the outermost edge of the conductive electrode 4 does not exceed the outermost edge of the side surface 11 (ie, the conductive electrode 4) It may be flush with the outermost edge of the side surface 11 or retracted from the outermost edge). The first reflective structure 2 surrounds the side surface 11 of the light-emitting body 1 and the upper portion 41 of the conductive electrode 4. The first reflective structure 2 has a lower surface 21, an upper surface 22, an inner surface 23, and an outer surface 24 having a similar reflection coefficient to the inner surface 23. The inner surface 23 of the first reflective structure 2 is substantially perpendicular to the lower surface 21, and the upper surface 22 has a different horizontal level from the light-emitting surface 12 of the light-emitting body 1, and the upper surface 22 is located above the light-emitting surface 12, and between the light-emitting surface 12 Has a height difference L greater than zero. The second reflective structure 3 is located below the first reflective structure 2 and is substantially perpendicular to the first reflective structure 2. The second reflective structure 3 includes a region in which the first portion 31 surrounds the lower portion 42 of the conductive electrode 4 (viewed from a lower view, refer to FIG. 1B), and the second portion 32 is located between the positive and negative conductive electrodes 4. The first portion 31 is adjacent to one end of the light-emitting body 1 and covers one outer surface of the lower portion 42 of the conductive electrode 4. The upper surface of the first portion 31 is located below the first reflective structure 2, and has a portion and a lower surface. 21 direct contact. The second portion 32 is filled in a region between the positive and negative conductive electrodes 4, and both ends of the second portion 32 are in direct contact with an outer side surface of the conductive electrode 4 and cover a region where the light-emitting body 1 is located between the conductive electrodes 4. In another embodiment, the first reflective structure 2 and the second reflective structure 3 are formed by one step. The lower surface of the second reflective structure 3 is substantially coplanar with the lower surface 43 of the conductive electrode 4. In another embodiment, the second reflective structure 3 has an arcuate lower surface, and thus, the lower surface of the second reflective structure 3 may be lower or higher than the lower surface 43 of the conductive electrode 4.

In an embodiment, the transparent package structure 6 in the light-emitting element 600 includes or does not include a wavelength conversion material, and is located between the first reflective structure 2, the second reflective structure 3, and the light-emitting body 1. The transparent package structure 6 surrounds the side surface 11 of the light-emitting body 1 and the upper portion 41 of the conductive electrode 4, and completely covers the light-emitting surface 12. The optical conversion structure 5 is located above the transparent package structure 6 and covers the first reflective structure 2, the transparent package structure 6, and the illuminating body 1. The lower surface 52 of the optical conversion structure 5, the upper surface 61 of the transparent package structure 6, and the upper surface 22 of the first reflective structure are substantially coplanar and joined to each other. In other words, the transparent package structure 6 is filled between the first reflective structure 2, the second reflective structure 3, and the optical conversion structure 5, and surrounds the light-emitting body 1. The side surface 51 of the optical conversion structure 5, the outer surface 24 of the first reflective structure 2, and the outer surface 33 of the second reflective structure 3 are substantially coplanar (as shown in Fig. 8A, at least in a straight line in a cross-sectional view) Aligned with each other). In another embodiment, the outer surface 33 of the second reflective structure 3 is not coplanar with the outer surface 24 of the first reflective structure 2, but is still below the lower surface 21 of the first reflective structure 2. At this time, the periphery of the transparent package structure 6 is still completely covered by the optical conversion structure 5, the first reflection structure 2, and the second reflection structure 3, and is not in direct contact with the external environment. In general, the first reflective structure 2 and the second reflective structure 3 can reflect the light emitted by the light-emitting body 1 and guide it to the upper surface 61 of the transparent package structure 6, and then be converted and/or mixed by the optical conversion structure 5. The required light causes the light-emitting element 100 to emit light upward. If the transparent package structure 6 includes a wavelength conversion material, the light emitted by the light-emitting body 1 can also be converted, and the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 can be the same material. If the materials are the same, the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 may have different densities. The wavelength conversion material in the transparent package structure 6 may also be different from the wavelength conversion material in the optical conversion structure 5. For example, the optical conversion structure 5 includes a shorter radiation wavelength phosphor (for example, yellow/yellow green phosphor), and is transparent. The package structure 6 contains a longer radiation wavelength phosphor (for example, red phosphor). In another embodiment, between the adjacent conductive electrodes 4, a transparent package structure 6 is present between the second portion 32 of the second reflective structure 3 and the illuminating body 1. For the manufacturing process of the light-emitting element 600, reference may be made to the front opening sheets 2 and 3 and their corresponding descriptions. If the transparent encapsulating material 6 is cut by a tool without a bevel, a transparent encapsulating structure 6 having the same upper and lower width as shown in FIG. 8A can be formed. In another embodiment, when the light-emitting element 600 is fabricated by using FIG. 2 or FIG. 3, when the non-beveled tool has an arc-shaped cross section, the light-emitting element 600' as shown in FIG. 8B can be formed. . The inner surface 23' of the first reflective structure 2 has a curved surface near the optical conversion structure 5. In detail, the upper surface 22 of the first reflective structure 2 of the light-emitting element 600' is smaller than the lower surface 21. Fig. 8C is a schematic cross-sectional view showing a light-emitting element of another embodiment. The inner surface 23 of the first reflective structure 2 has a curved surface near the second reflective structure 3. In detail, the lower surface 21 of the first reflective structure 2 of the light-emitting element 600" is smaller than the upper surface 22. For the method of fabricating the light-emitting element 600", reference can be made to the figures 9A to 9G described later.

The optical conversion structure 5 of the light-emitting element 600 may be a single layer structure or a multilayer structure. For a multilayer structure, reference may be made to FIG. 4 and its corresponding description. Furthermore, the light-emitting element 600 may have an optical element disposed above the optical conversion structure 5, and reference may be made to FIG. 5 and its corresponding description. The light-emitting element 600 can also be provided with an extension electrode under the conductive electrode 4. Referring to FIG. 6 and its corresponding description. The transparent package structure 6 of the light-emitting element 600 and the optical conversion structure 5 may also have a sub-transparent package structure, which can be referred to FIG. 7 and its corresponding description.

9A to 9H are schematic views showing a manufacturing process of a light-emitting element according to an embodiment of the present invention. The same symbols and symbols as those in the above-described production process are similar or identical components, and will not be described again. Referring to FIG. 9A, a first temporary carrier 7 having adhesiveness is first provided, and two conductive electrodes 4 of a plurality of light-emitting bodies 1 are disposed on the first temporary carrier 7, and the lower portion 42 of the conductive electrode 4 is buried. The first temporary carrier 7 is included. The area between adjacent light-emitting bodies 1 is defined as a walkway area. Next, the transparent package structure 6 is formed to fill the walkway area of the light-emitting body 1, and cover the light-emitting surface 12 of the light-emitting body 1 and the upper surface of the first temporary carrier 7 not covered by the light-emitting body 1. As shown in Fig. 9B, the transparent package structure 6 is cut using a cutter to form a dicing street 62. It is important to note that the tool may create a cut on the first temporary carrier 7, but will not substantially cut the first temporary carrier 7. In other words, the respective light-emitting bodies 1 covered by the transparent package structure 6 are still attached to the first temporary carrier 7. As described above, a tool having a beveled edge can be selected to produce a light-emitting element having a transparent trapezoidal-shaped transparent package structure 6 as shown in Fig. 1A. Alternatively, a tool having no beveled edge is selected to produce a light-emitting element having a substantially square-shaped transparent package structure 6 as shown in Fig. 8A.

As shown in FIG. 9C, the first reflective structure 2 is formed between the dicing streets 62. Here, a polish process may also be performed to planarize the upper surface 61 of the transparent package structure 6, and thereby the polishing step may remove the first reflective structure 2 overflowing onto the transparent package structure 6. Next, as shown in FIG. 9D, the optical conversion structure 5 is formed above the upper surface 61 of the transparent package structure 6 and the first reflective structure 2. As shown in FIG. 9E, a second temporary carrier 8 having adhesiveness is adhered to the other surface of the optical conversion structure 5 with respect to the first temporary carrier 7. Thereafter, the first temporary carrier 7 is removed, exposing the lower portion 42 and the lower surface 43 of the conductive electrode 4, and the lower surface 63 of the transparent package structure 6. At this time, the lower surface 63 of the transparent package structure 6 is not coplanar with the lower surface 43 of the conductive electrode 4. Specifically, the lower portion 42 of the conductive electrode 4 protrudes beyond the transparent package structure 6. Subsequently, as shown in FIG. 9F, the structure in FIG. 9E is flipped to form a second reflective structure 3 on the other side of the transparent package structure 6 with respect to the second temporary carrier 8, and the second reflective structure 3 is surrounded by each The outer surface of the conductive electrode 4, the lower surface 63 of the transparent package structure 6, and the lower surface 21 of the first reflective structure 2. Wherein, the second reflective structure 3 does not cover all of the lower surface 43 of the conductive electrode 4. As shown in Fig. 9G, the first reflective structure 2 and the optical conversion structure 5 located in the dicing street 62 are cut, and the second temporary carrier 8 is removed to form a plurality of individual illuminating elements. In another embodiment, in the step of FIG. 9B, when the cutting edge of the tool has an arc-shaped cross section, the transparent packaging structure 6 is adjacent to the first temporary carrier 7 to generate an arc-shaped surface or line. The light-emitting element of FIG. 8C can be formed, and the first reflective structure 2 of the light-emitting element 600'' has a curved surface at a surface close to the second reflective structure 3.

Figure 10 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention. The light-emitting element 700 includes a light-emitting body 1, a first reflective structure 2, a second reflective structure 3, a transparent package structure 6, and an optical conversion structure 5. The light-emitting body 1 has a light-emitting surface 12, and the positive and negative conductive electrodes 4 are located on a lower surface of the light-emitting body 1 with respect to the light-emitting surface 12, and a plurality of side surfaces 11. The conductive electrode 4 includes an upper portion 41 that is closer to the light-emitting surface and a lower portion 42 that is farther from the light-emitting surface 12 . The outermost edge of the conductive electrode 4 does not exceed the outermost edge of the side surface 11 (i.e., the conductive electrode 4 may be flush with the outermost edge of the side surface 11 or retracted from the outermost edge). The transparent package structure 6 includes or does not include a wavelength converting material, surrounds the side surface 11, the light exit surface 12, and the upper portion 41 of the conductive electrode 4 of the light emitting body 1, and completely covers the light surface 12. The upper surface 61 of the transparent package structure 6 is located above the light-emitting surface 12 and is spaced apart from the light-emitting surface 12 by a distance L greater than zero. The optical conversion structure 5 is located above the transparent package structure 6 and covers the transparent package structure 6 and the illuminating body 1. The optical conversion structure 5 has a larger width than the transparent package structure 6. In detail, the side surface 64 of the transparent package structure 6 is not coplanar with the side surface 51 of the optical conversion structure 5 (as shown in FIG. 10, the side surface 64 and the side surface 51 are not aligned with each other in a straight line), and the side surface The 64 side surface 51 is adjacent to the light-emitting body 1. The side surface 64 of the transparent package structure 6 and the lower surface 52 of the optical conversion structure are substantially perpendicular to each other, and the upper surface 61 of the transparent package structure 6 is substantially in contact with the lower surface 52 of the optical conversion structure 5. The first reflective structure 2 surrounds the transparent package structure 6 and the optical conversion structure 5, the inner surface 23 of which has a similar reflection coefficient to the outer surface 24. The lower surface 21 of the first reflective structure 2 is substantially coplanar with and in contact with the lower surface 63 of the transparent package structure 6.

In an embodiment, the first reflective structure 2 has an uneven width. The inner surface 23 of the first reflective structure 2 comprises three portions 231, 232, 233 (the number three is merely exemplary here, and is not intended to limit the scope of the invention or to apply other quantities). In Fig. 10, the three portions 231, 232, 233 are not aligned with each other in a straight line. The first portion 231 and the third portion 233 are substantially parallel to the side surface 11 of the light-emitting body 1. The second portion 232 is coupled and substantially perpendicular to the first portion 231 and the third portion 233. The first portion 231 of the inner surface 23 is substantially perpendicular to the lower surface 21 (the first portion 231 and the third portion 233 may also be inclined inward or outward to the lower surface 21 due to process conditions) and surrounds the transparent package structure 6 and the illuminating body. Side surface 11 of 1. The first portion 231 has a distance greater than 0 from the side surface 11 of the light-emitting body 1 and is in contact with the side surface 64 of the transparent package structure 6. The second portion 232 is in contact with the lower surface 52 of the optical conversion structure 5. In detail, the second portion 232 overlaps a portion of the lower surface 52 adjacent to the side surface 51. The third portion 233 surrounds and contacts the side surface 51 of the optical conversion structure 5. The first portion 231 has a distance W7 from the outer surface 24. The third portion 233 has a distance W6 from the outer surface 24. W7 is different and larger than W6. In other words, the first reflective structure 2 has two portions of different thicknesses, the thickness W7 of the first portion 25 is greater than the thickness W6 of the second portion 26, and surrounds the transparent package structure 6; the second portion 26 surrounds the optical conversion structure 5 . Among them, W7 is greater than 1.3 times W6, and more preferably, W6 is more than 2 times. In one embodiment, W7 = 100 or 129 μm, W6 = 45.2 or 82.8 μm. The upper surface 22 of the first reflective structure 2, i.e., the upper surface of the second portion 26, is generally coplanar with the upper surface 53 of the optical conversion structure 5. Therefore, the optical conversion structure 5 is disposed in the first reflective structure 2 and exposes the upper surface 53. A portion of the upper surface of the first portion 25 is covered by the lower surface 52 of the optical conversion structure 5. In detail, a portion of the optical conversion structure 5 near the side surface 51 is in contact with the recess below the first reflective structure 2, and the lower surface 52 of the optical conversion structure 5 at the middle contacts the transparent package structure 6 to make the first The contact surface of the reflective structure 2 and the optical conversion structure 5 is formed in an L-shaped shape. In other words, the cross-sections of the second portion 232 and the third portion 233 exhibit an L-shaped profile (as in the cross-sectional view shown in FIG. 10).

Referring to FIG. 10, in an embodiment, the second reflective structure 3 is located below the first reflective structure 2 and perpendicular to the first reflective structure 2. The second reflective structure 3 includes a region in which the first portion 31 surrounds the lower portion 42 of the conductive electrode 4 and the second portion 32 covers the two conductive electrodes 4. The first portion 31 is adjacent to one end of the light-emitting body 1 and covers one outer surface of the lower portion 42 of the conductive electrode 4, and the upper surface is located below the first reflective structure 2 and is in direct contact with the lower surface 21, 63. The second portion 32 is filled in a region between adjacent conductive electrodes 4, and both ends of the second portion 32 are in direct contact with the outer surface of the conductive electrode 4. Therefore, most or all of the lower surface of the light-emitting body 1 not covered by the conductive electrode 4 is covered by the second reflective structure 3. In another embodiment, the first reflective structure 2 and the second reflective structure 3 are formed by one step. The lower surface of the second reflective structure 3 is substantially coplanar with the lower surface 43 of the two conductive electrodes 4. In another embodiment, the second reflective structure 3 has an arcuate lower surface, and the lower surface of the second reflective structure 3 is thus generally higher or lower than the lower surface 43 of the conductive electrode 4. In another embodiment, between the adjacent conductive electrodes 4, a transparent package structure 6 is stored between the second portion 32 of the second reflective structure 3 and the illuminating body 1. The first reflective structure 2 and the second reflective structure 3 can reflect the light emitted by the light-emitting body 1 and guide it to the upper surface 61 of the transparent package structure 6, and then be converted and/or mixed into the desired light by the optical conversion structure 5. The light-emitting element 700 is caused to emit light upward. If the transparent package structure 6 includes a wavelength conversion material, the light emitted by the light-emitting body 1 can also be converted, and the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 can be the same material. If the materials are the same, the wavelength conversion material of the optical conversion structure 5 and the transparent package structure 6 may have different densities. The wavelength conversion material in the transparent package structure 6 may also be different from the wavelength conversion material in the optical conversion structure 5. For example, the optical conversion structure 5 includes a shorter radiation wavelength phosphor (for example, yellow/yellow green phosphor), and is transparent. The package structure 6 contains a longer radiation wavelength phosphor (for example, red phosphor). The first reflective structure 2 of the light-emitting element 700 surrounds the optical conversion structure 5, and therefore, the light-emitting element 700 has a smaller light-emitting angle than the light-emitting elements 100-600. In one embodiment, the illumination element 700 has an illumination angle of less than 125 degrees, preferably no more than 120 degrees. The angle of illumination described herein is defined as the range of angles that are included when the brightness is 50% of the maximum brightness. For a detailed description of the illuminating angle, refer to the contents of the Taiwan application 104103105 and refer to it as the content of this case. In another embodiment, the light-emitting element 700 has no second reflective structure 3, and the lower portion 42 of the two conductive electrodes 4 is exposed.

In another embodiment of the present invention, the first reflective structure 2 of the light-emitting element 800 has a first portion 25 and a second portion 26 having different thicknesses, and a third portion 27 located at the first portion 25 and the second portion. Between portions 26, in other words, second portion 232 of inner surface 23 of first reflective structure 2 is a bevel as shown in FIG. The light-emitting element 800 includes a light-emitting body 1, a first reflective structure 2, a second reflective structure 3, a transparent package structure 6, and an optical conversion structure 5. The first portion 25 and the second portion 26 of the first reflective structure 2 have a quadrangular cross section, and the third portion 27 has a trapezoidal cross section. The wider lower base of the third portion 27 is in contact with the first portion 25, and the narrower upper base and the second portion 26 are in contact with each other. The third portion 27 has a beveled edge 271 extending from the inner surface 251 of the first portion 25 to the inner surface 261 of the second portion 26. One end 2711 of the bevel 271 of the third portion 27 is in contact with the inner surface 261 of the second portion 26. In other words, the inner surface 23 of the first reflective structure 2 comprises three portions 231, 232, 233 that are not aligned with one another in a straight line. The first portion 231 and the third portion 233 are substantially parallel to the side surface 11 of the light-emitting body 1 (the first portion 231 and the third portion 233 may also be inclined inward or outward due to process conditions, and are not parallel to the side surface 11) . The second portion 232 is connected and not perpendicular to the first portion 231 and the third portion 233. The distance of the second portion 232 from the outer surface 24 decreases in a direction from the first portion 231 to the third portion 233. One end 234 of the third portion 233 is in contact with the second portion 232. Therefore, the lower surface 52 of the optical conversion structure 5 is not in contact with the first reflective structure 2, and the upper surface 61 of the transparent package structure 6 is substantially equal in width to the lower surface 52 of the optical conversion structure 5. The transparent package structure 6 has a trapezoidal shape near the upper portion of the optical conversion structure 5. The width of the transparent package structure 6 is increased along the direction from the first portion 231 to the third portion 233. In another embodiment (not shown), one end 2711 of the beveled edge 271 of the third portion 27 is in contact with the lower surface 52 of the optical conversion structure 5 and is not in contact with the inner surface 261 of the second portion 26. Therefore, the portion of the lower surface 52 of the optical conversion structure 5 close to the side surface 51 is in contact with the first reflective structure 2. The position where the first reflective structure is in contact with the optical conversion structure exhibits an L-shaped line similar to that of FIG. That is, the one end 234 of the second portion 232 is in contact with the lower surface 52 of the optical conversion structure 5 and is not in contact with the third portion 233. A detailed description of the light-emitting body 1, the second reflective structure 3, the transparent package structure 6, and the optical conversion structure 5 can be referred to the corresponding paragraph of the previously developed optical element 700.

The optical conversion structure 5 of the light-emitting elements 700, 800 may be a single layer or a multi-layer structure. If it is a multi-layer structure, reference may be made to FIG. 4 and its corresponding description. If the light-emitting elements 700, 800 have an optical element disposed above the optical conversion structure 5, reference may be made to FIG. 5 and its corresponding description. If the light-emitting elements 700, 800 are provided with extension electrodes under the conductive electrodes 4, reference can be made to FIG. 6 and its corresponding description. If there is another sub-transparent package structure between the transparent package structure 6 of the light-emitting elements 700, 800 and the optical conversion structure 5, reference can be made to FIG. 7 and its corresponding description.

12A to 12I are views showing a manufacturing process of a light-emitting element 700 according to an embodiment of the present invention. Referring to FIG. 12A, a carrier board 13 is provided, and an adhesive first temporary carrier 7 is disposed thereon. The conductive electrodes 4 of the plurality of illuminating bodies 1 are adhered to the carrier board 13 by the first temporary carrier 7. The lower portion 42 of the conductive electrode 4 is buried in the first temporary carrier 7. The area between adjacent light-emitting bodies 1 is defined as a walkway area. Next, the transparent package structure 6 is formed to fill the walkway area between the light-emitting bodies 1, and to cover the light-emitting surface 12 of the light-emitting body 1 and the upper surface of the first temporary carrier 7 not covered by the light-emitting body 1. The material of the carrier plate 13 may be a transparent hard material such as glass or sapphire. As shown in FIG. 12B, the optical conversion structure 5 is formed above the upper surface 61 of the transparent package structure 6. Further, a second temporary carrier 8 having adhesiveness is provided on the optical conversion structure 5. Next, as shown in FIG. 12C, the structure in FIG. 12B is reversed, the first temporary carrier 7 and the carrier plate 13 are removed, the carrier plate 13 is separated from the light-emitting body 1 and the transparent package structure 6, and the conductive electrode is exposed. The lower portion 42 and the lower surface 43 of the fourth surface and the lower surface 63 of the transparent package structure 6. The removal method can be performed by laser peeling, heating separation, dissolution, and the like. Subsequently, as shown in FIG. 12D, a fourth temporary carrier 7' is provided on the other side of the conductive electrode 4 and the transparent package structure 6 with respect to the second temporary carrier 8. The fourth temporary carrier 7' and the first temporary carrier 7 may have similar or identical material properties, so that the lower portion 42 of the conductive electrode 4 is also buried in the fourth temporary carrier 7'.

Next, as shown in FIG. 12E, the fourth temporary carrier 7' and the transparent package structure 6 are cut using a cutter to form a dicing street 62. The tool may create cuts on the optical conversion structure 5, but will not cut the optical conversion structure 5 to be substantially separated. In other words, the light-emitting body 1 covered by the transparent package structure 6 is still attached to the optical conversion structure 5. Then, as shown in Fig. 12F, the optical conversion structure 5 is cut at the dicing street 62 using another narrower cutter to form a secondary scribe line 54 that is narrower than the dicing street 62. In other words, the two unequal width dicing streets 62 and the secondary dicing streets 54 make the width of the transparent package structure 6 surrounding the illuminating body 1 smaller than that of the optical conversion structure 5. This narrower tool may create a cut on the second temporary carrier 8, but does not cut the second temporary carrier 8 to substantially separate it. In other words, the light-emitting body 1 covered by the transparent package structure 6 and the separated optical conversion structure 5 are still attached to the second temporary carrier 8. Subsequently, as shown in FIG. 12G, the first reflective structure 2 is formed on the dicing street by means of steel plate printing, coating, brushing, spin coating, inkjet printing, dispensing, sputtering, or mold potting. 62. Between the secondary scribe lines 54, and the lower surface 21 of the first reflective structure is substantially coplanar with the lower surface 63 of the transparent package structure 6. As shown in FIG. 12H, the fourth temporary carrier 7' is removed, exposing the lower portion 42 and the lower surface 43 of the conductive electrode 4, and the lower surface 63 of the transparent package structure 6. Next, as shown in FIG. 12I, the second reflective structure 3 is formed on the other surface of the transparent package structure 6 with respect to the second temporary carrier 8 by means of steel plate printing, coating, brushing, spin coating, or inkjet printing. The second reflective structure 3 surrounds a side surface of the conductive electrode 4, covers a lower surface 63 of the transparent package structure 6, and a lower surface 21 of the first reflective structure 2. The second reflective structure 3 does not cover all of the lower surface 43 of the conductive electrode 4. As shown in FIG. 12I, the first reflective structure 2 and the second reflective structure 3 located in the scribe line 62 and the secondary scribe line 54 are cut, and then removed by laser stripping, heating separation, dissolution, and irradiation of ultraviolet light. The second temporary carrier 8 forms a plurality of independent light-emitting elements.

In the step of FIG. 12A, the transparent package structure 6 is filled between the adjacent conductive electrodes 4 of the light-emitting body 1. Therefore, as shown in FIG. 12I, a transparent package structure 6 exists between the upper portions 41 of the adjacent conductive electrodes 4, so that the second portion 32 of the second reflective structure 3 between the conductive electrodes 4 and the light-emitting body 1 There is a transparent package structure 6. In another embodiment, in the step of FIG. 12A, the transparent package structure 6 is not filled between the adjacent conductive electrodes 4 of the light-emitting body 1. Therefore, in the step of Fig. 12I, only the second portion 32 of the second reflective structure 3 exists between the conductive electrodes 4, and the light-emitting element 700 as shown in Fig. 10 is formed. In another embodiment, in the step of FIG. 12E, a scribe line 62 and/or a secondary scribe line 54 are produced using a tool having a width (lower) and a beveled edge (not shown) to make the transparent package structure 6 close to the optical conversion. The portion of the structure 5 is formed in the shape of the oblique side 271 as shown in FIG. The structure as the optical element 800 can be formed by the subsequent steps. In another embodiment, in the steps of FIG. 12E and/or FIG. 12F, if the tool tip or the turning point of the tool used has an arc-shaped cross section, like the light-emitting element 600' and/or 600", FIG. The light-emitting element 700 and the first reflective structure 2 of the light-emitting element 800 in FIG. 11 have one or more curved faces near the inner surface of the optical conversion structure 5.

Figure 13A is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention. The light-emitting element 900 includes a light-emitting body 1, a first reflective structure 2, an optical conversion structure 5, and a diffusion layer 14. The light-emitting body 1 has a light-emitting surface 12, and the positive and negative conductive electrodes 4 are located on a lower surface of the light-emitting body 1 with respect to the light-emitting surface 12, and a plurality of side surfaces 11. The conductive electrode 4 includes an upper portion 41 that is closer to the light-emitting surface and a lower portion 42 that is farther from the light-emitting surface 12 . The optical conversion structure 5 is located above the illuminating body 1 and completely covers the illuminating surface 12, and contains wavelength converting materials (55' and 55''). The optical conversion structure 5 is in direct contact with the light-emitting surface 12, that is, there is no additional bonding substance between the optical conversion structure 5 and the light-emitting body 1. The side surface 51 of the optical conversion structure 5 is not coplanar with the side surface 11 of the light-emitting body 1. The optical conversion structure 5 has a width W5, 1000 μm ≦ W5 ≦ 1250 μm. In one embodiment, W5 = 1100 μm, or 1150 μm. The illuminating body 1 has a width W3, where W5 > W3. That is, the lower surface of the optical conversion structure 5 includes a first lower surface 521 that is in direct contact with the light emitting surface 12 of the light emitting body 1, and a second lower surface 522 that is not in direct contact with the light emitting body 1 and extends outward beyond the light. The outermost edge of the body 1.

The optical conversion structure 5 includes a first optical conversion structure 5' and a second optical conversion structure 5". The second optical conversion structure 5" is located above the first optical conversion structure 5'. That is, the first optical conversion structure 5' is directly in direct contact with the light-emitting surface 12 of the light-emitting body, and the second optical conversion structure 5" is not in direct contact with the light-emitting surface 12 of the light-emitting body. The first optical conversion structure 5' has the first The wavelength converting material 55', the second optical converting structure 5" has a second wavelength converting material 55". The first wavelength converting material 55' has the same composition as the second wavelength converting material 55'', that is, the wavelength converting materials 55' and 55'' have similar excitation and emission spectra. Wherein, most of the first wavelength converting material 55' has a particle diameter greater than 7 μm. In one embodiment, more than 95% of the first wavelength converting material 55' has a particle diameter greater than 10 μm. More than 95% of the second wavelength converting material 55'' has a particle size of less than 10 μm. In one embodiment, the second wavelength converting material 55" has a particle size of less than 5 [mu]m. In other words, the largest particle size in the first wavelength converting material 55' is a, and the largest particle size in the second wavelength converting material 55'' is b, a>b. The shape of the phosphor material may be a circular, elliptical, or irregularly shaped particle. Particle size herein refers to the largest outer diameter of a single particle measured in a 2-dimensional plane (eg, a cross-sectional view) or a 3-dimensional space. Furthermore, the wavelength converting material 55' has a first weight percentage relative to the first optical converting structure 5', and the wavelength converting material 55" has a second weight percentage relative to the second optical converting structure 5". The first weight percentage is greater than the second The weight percentage, for example, the first weight percentage is more than 5 times the second weight percentage. In one embodiment, the first weight percentage is greater than 90% and the second weight percentage is less than 10%. In other words, the second optical conversion structure 5" Most of the composition is a matrix, and only a small-sized wavelength-converting material is dispersed in a small proportion in the matrix. Or, in a side view, the area density of the first wavelength converting material 55' in the first optical converting structure 5' is greater than the area of the second wavelength converting material 55'' in the second optical converting structure 5' Density, for example: more than five times. The measurement of the weight percentage may be by way of, but not limited to, thermogravimetric analysis (TGA), and the particle size of the phosphor powder material may be measured by means of, but not limited to, an electron microscope. The area density of the phosphor material in the optical conversion structure can be measured by means of, but not limited to, an electron microscope.

There is no obvious boundary between the first optical conversion structure 5' and the second optical conversion structure 5". As shown in Fig. 13A, the first optical conversion structure 5' is close to the uppermost surface of the second optical conversion structure 5" A horizontal line is generally depicted such that the first optical conversion structure 5' has a substantially uniform first thickness T1 from the leftmost side to the rightmost side. Furthermore, the second optical conversion structure 5" also has a substantially uniform second thickness T2 from the leftmost side to the rightmost side as the first optical conversion structure 5', T1 being greater than T2. The optical conversion structure 5 has a thickness (T1 and The sum of T2), 50 μm < (T1 + T2) < 80 μm. In one embodiment, T1 + T2 ≈ 70 μm; 25 μm < T1 < 60 μm, 5 μm < T2 < 35 μm. The first lower surface 521 of the optical conversion structure 5 and The second lower surface 522 has a different surface roughness. The first lower surface 521 is in direct contact with the light emitting surface 12 of the light emitting body 1 and has a first surface roughness R1, and the second lower surface 522 is not directly connected to the light emitting body 1. Contacted and having a second surface roughness R2, R2 > R1. In detail, the first lower surface 521 is substantially a flat surface, and the second lower surface 522 has a plurality of minute concave surfaces and convex surfaces (for example, the concave surfaces) The maximum height difference of the convex surface is >100 nm or 150 nm. Further, the upper surface 53 of the optical conversion structure 5 has a third surface roughness R3, and the side surface 51 of the optical conversion structure 5 has a fourth surface roughness R4. In the example, R2>R3>R 4.

The surface roughness can be obtained by measuring the curve of the rough surface in the cross-sectional view. Figure 14 illustrates a cross-sectional view of a rough surface. The curve of the rough surface can be divided into N-segment sample lengths (S ₁ , S ₂ , S ₃ ... S _N ), and each sample length can define a reference line R _L (reference line ). Wherein, the reference line R _L (reference line) is a straight line, crossing the curve of the rough surface of the rough surface, and generating a plurality of intersection points with the curve to divide the curve into two parts on the upper and lower sides (left and right) of the reference line R _L (the first curve) With the second curve). Wherein, the area formed by the first curve and the reference line R _L is equal to the area formed by the second curve and the reference line. Each segment of the sample length can be measured relative to the baseline to have a highest peak Rp and a lowest trough Rv. Maximum Height of the Profile Ry=|Rp|+|Rv| for each length of the sample. Therefore, the average roughness height Ry of all sample lengths can define the surface roughness of this surface. The larger the Ry, the rougher the surface. In other words, from the naked eye, the difference between the height of the plurality of concave surfaces and the convex surface on the rough surface is larger.

The diffusion layer 14 is located above the optical conversion structure 5, is in direct contact with the optical conversion structure 5, and is substantially the same width as the optical conversion structure 5 or has a similar shape (as viewed from above). That is, the side surface 51 of the optical conversion structure 5 is substantially coplanar with the side surface 141 of the diffusion layer 14. Referring to Fig. 13A, the diffusion layer 14 has a thickness T3, 10 μm ≦ T3 ≦ 35 μm. In one embodiment, T3 = 30 μm. The diffusion layer 14 includes a matrix and diffusion particles. The matrix comprises epoxy resin (Epoxy), silicone (Silicone), polyamidamine (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), Su8, acrylic resin (Acrylic Resin), poly Methyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), or polyetherimide. The components of the diffusing particles include, but are not limited to, ceria, titania, zirconia, zinc oxide or aluminum oxide. In one embodiment, the diffusion layer 14 has a high percentage by weight (w/w) of cerium oxide, for example, a concentration by weight greater than 20%, for example, greater than 25%, greater than 30%, Or greater than 35%. The high weight percent concentration of the diffusion layer 14 allows the light-emitting element 900 to have better color uniformity at different viewing angles. The color uniformity can be represented by the value of Δu'v', and the smaller the value of Δu'v', the better the color uniformity. u' and v' respectively represent the color coordinates under the CIE 1976 color system. The reference values (u ₀ ', v ₀ ') are defined as the average of the color coordinates at all angles, and Δu' is u'- u ₀ '. Δv' is v'- v ₀ ', Δu'v' = (Δu' ² + Δv' ² ) ^1/2 . In one embodiment, the Δu'v' value of the light-emitting element 900 at a viewing angle of 0° to 70° is less than 0.003. In addition, the diffusion layer 14 has a lower surface 142 in direct contact with the optical conversion structure 5, and an upper surface 143 which is available to emit light and is opposite to the lower surface 142. The surface roughness of the lower surface 142 is equal to or approximate to the optical conversion structure 5. The surface roughness R3 of the upper surface 53. The upper surface 143 has a sixth surface roughness R6, where R6 < R2 and R6 is substantially similar to R3. The surface roughness of the side surface 141 is substantially equal to or approximates the surface roughness R4 of the side surface 51 of the optical conversion structure 5. That is, the side surface 141 of the diffusion layer 14 has the same or similar surface roughness as the side surface 51 of the optical conversion structure 5. In one embodiment, the upper surface 143 of the diffusion layer 14 has an approximate surface roughness to the lower surface 142 and is flatter than the second lower surface 522 of the optical conversion structure 5.

The first reflective structure 2 surrounds and directly contacts the side surface 11 of the light-emitting body 1, the side surface 51 of the optical conversion structure 5, and the side surface 141 of the diffusion layer 14. The first reflective structure 2 has an uneven width. The inner surface 23 of the first reflective structure 2 comprises three portions 231, 232, 233 that are not aligned with one another in a straight line (the third is merely exemplary here, and is not intended to limit the scope of the invention or to other quantities) . The first portion 231 and the third portion 233 are substantially parallel to the side surface 11 of the light-emitting body 1. The second portion 232 is coupled and substantially perpendicular to the first portion 231 and the third portion 233. The first portion 231 of the inner surface 23 is substantially perpendicular to the lower surface 21 and surrounds and contacts the side surface 11 of the light-emitting body 1. The second portion 232 is in contact with the second lower surface 522 of the optical conversion structure 5. In particular, the second portion 232 completely overlaps the second lower surface 522 and has the same roughness. The third portion 233 surrounds and contacts the side surfaces 141, 51 of the optical conversion structure 5 and the diffusion layer 14. The first portion 231 has a distance W7 from the outer surface 24. The third portion 233 has a distance W6 from the outer surface 24. W7 is different and larger than W6. The upper surface 22 of the first reflective structure 2 is substantially coplanar with the upper surface 143 of the diffusion layer 14. That is, the first reflective structure 2 does not cover the upper surface 143 of the diffusion layer 14 such that light emitted by the light-emitting body 1 can be emitted upward from the upper surface 143 of the diffusion layer 14 after passing through the optical conversion structure 5 and the diffusion layer 14. The light-emitting element 900 has a width W8 which is approximately equal to the maximum width of the first reflective structure 2, and W8 is approximately 1.2 to 3 times W3. In one embodiment, W8/W3 = 1.3 to 2.6. Also. W8 > W5 > W3. The material of the first reflective structure 2 can be referred to the description of the pre-opening embodiment. The light-emitting element 900 has a total height T, and T is not more than 300 μm. In one embodiment, T is no greater than 260 μm, or 250 μm. The total height (T1+T2+T3) of the optical conversion structure 5 and the diffusion layer 14 is preferably not more than 150 μm. The height of the optical conversion structure 5 and the diffusion layer 14 is a key parameter relating to the color temperature and color uniformity of the light emitted by the light-emitting element 900. In one embodiment, T1+T2+T3=120 μm, 100 μm, or 80 μm. FIG. 13B shows a top view of the light-emitting element 900, around which the diffusion layer 14 is surrounded by the first reflective structure 2. Therefore, similarly to the light-emitting element 700, or 800, the optical conversion structure 5 located under the diffusion layer 14 in the light-emitting element 900 is surrounded by the first reflection structure 2, and therefore, the light-emitting element 900 has a small illumination angle. In one embodiment, the illumination element 900 has an illumination angle of less than 120 degrees, preferably no more than 115 degrees. The first reflective structure 2 also surrounds the diffusion layer 14 overlying the optical conversion structure 5, which allows the optical element 900 to have a better concentrating effect and better color uniformity.

In another embodiment, the second portion 232 of the inner surface 23 of the first reflective structure 2 is a bevel as shown in FIG. 15A. Referring to FIG. 15A, the light-emitting element 1000 is similar to the light-emitting element 900, and includes a light-emitting body 1, a first reflective structure 2, an optical conversion structure 5, and a diffusion layer 14. The same symbols and symbols as those of the foregoing embodiments denote similar or identical elements or devices, and reference may be made to the aforementioned related drawings or paragraphs. The optical conversion structure 5 includes a first optical conversion structure 5' and a second optical conversion structure 5". The first optical conversion structure 5' and the phosphor material in the second optical conversion structure 5" have different weight percentage concentrations. Wherein the second optical conversion structure 5" having a lower weight percent concentration is located above the first optical conversion structure 5' having a higher concentration by weight. As shown in Fig. 15A, the inside of the first reflective structure 2 The surface includes three portions that are not aligned with each other in a straight line. The first portion 231 and the third portion 233 are substantially parallel to the side surface 11 of the light-emitting body 1. The second portion 232 is connected and not perpendicular to the first portion 231 and the third portion 233. The distance of the second portion 232 from the outer surface 24 decreases in a direction from the first portion 231 to the third portion 233. The first portion 231 surrounds and contacts the side surface 11 of the light-emitting body 1, and the second portion 232 surrounds and contacts the first portion a lower portion of an optical conversion structure 5' (a region closer to the light-emitting body 1). The third portion 233 surrounds and contacts the diffusion layer 14, the second optical conversion structure 5", and the upper portion of the first optical conversion structure 5' (more Keep away from the area of the illuminating body 1).

Referring to Fig. 15A, the optical conversion structure 5 of the optical element 1000 has a cross section of an inverted frustum. The optical conversion structure 5 has a lower surface 52 that is in direct contact with the light-emitting body 1, an upper surface 53 that is in direct contact with the diffusion layer 14 with respect to the lower surface 52, and a side surface 51 that is in contact with the upper surface 53 (the side surface 51 can A slope 57 that connects the side surface 51 and the lower surface 52 due to the process conditions being inclined inwardly or nearly vertically. The first inclined surface 15B show an enlarged view of FIG. 57, the inclined surface 57 is a rough surface having a reference line R _L1, R _L1 is substantially a straight line. The inclined surface 57 has a plurality of minute concave surfaces and convex surfaces, and has a second surface roughness R2. The characteristics of the roughness can be referred to the description of the preceding paragraph. In detail, the reference line R _L1 of the slope 57 of the optical conversion structure 5 has an inclination angle θ with the lower surface 52, and the inclination angle θ is an obtuse angle. In another embodiment, as shown in FIG. 16A, the slope 57' has an arcuate profile and has a plurality of minute concave surfaces and convex surfaces. FIG. 16B show the inclined surface 57 'of the enlarged view of the inclined surface 57' is a rough surface having a reference line R _L2, R _L2 is substantially an arc. The reference line reference line R _L2 of the slope 57' of the optical conversion structure 5 in the light-emitting element 1000' has an inclination angle θ' with the lower surface 52 of the optical conversion structure 5, and the inclination angle θ' gradually moves away from the light-emitting body 1 with the inclined surface 57. increase. In an embodiment, the ramps 57, 57' can also be designed as a smooth surface.

17A to 17H are schematic views showing a manufacturing process of a light-emitting element according to an embodiment of the present invention. The same symbols or symbols as those in the foregoing production process indicate similar or identical elements or devices, and may refer to the aforementioned drawings or related paragraphs. Referring to FIG. 17A, a carrier board 13 is provided, and an adhesive first temporary carrier 7 is disposed thereon. The conductive electrodes 4 of the plurality of illuminating bodies 1 are adhered to the carrier board 13 by the first temporary carrier 7. The lower portion 42 of the conductive electrode 4 is buried in the first temporary carrier 7. The area between adjacent light-emitting bodies 1 is defined as a walkway area. Next, the reflective structure 2' is formed to fill the aisle region between the light-emitting bodies 1, and covers the light-emitting surface 12 of the light-emitting body 1 and the upper surface of the first temporary carrier 7 that is not covered by the light-emitting body 1. As shown in FIG. 17B, a portion of the reflective structure 2' is removed to expose the light exit surface 12 of the light-emitting body 1 to form a reflective structure 2". The manner in which the reflective structure 2' is removed includes a wet stripping process such as Water Jet Deflash or Wet Blasting Deflash. The principle of the waterjet de-glue method is to use a nozzle to spray a liquid, such as water, against the reflective structure 2'. The wet blasting de-geling process adds specific particles to the liquid while removing the reflective structure 2' with the pressure of the liquid and the surface of the particles colliding with the reflective structure 2'. The thickness of the reflective structure 2' can be controlled by the size of the particles and the pressure of the liquid to control the removal of the reflective structure 2' by the length of the particle collision time. In one embodiment, by controlling the particle collision force magnitude and the collision time, the thickness of the reflective structure located above the illuminating body 1 is removed thicker than the thickness of the reflective structure located on the aisle. Therefore, the upper surface 28 of the reflective structure 2'' located on the aisle is higher than the light exiting surface 12 of the illuminating body 1, as shown in Fig. 17B. In one embodiment, the upper surface 28 of the reflective structure 2'' located in the aisle region is substantially coplanar with the light exiting surface of the light-emitting body 1, such that a light-emitting element as in FIG. 13A is formed. In addition, the particles may collide with a plurality of minute relief structures on the surface 28 of the reflective structure 2".

Next, as shown in Fig. 17C, the optical conversion structure 5 is formed above the light-emitting surface 12 of the light-emitting body 1 and the upper surface 28 of the reflective structure 2". In the figure, the wavelength conversion materials (55' and 55'') of different particle sizes are uniformly distributed in the optical conversion structure 5, but not limited thereto, and the particles of large particle size can also be smaller than the small particle size. The particles are formed at a lower position, or the particles of a small particle size are formed at a position lower than the particles of the large particle size. As shown in Fig. 17D, the wavelength conversion material 55' having a larger particle diameter is stacked on the lower layer of the optical conversion structure 5 with a larger sedimentation rate, and has a smaller particle diameter, as shown in Fig. 17D. The wavelength converting material 55'' is located on the upper layer of the optical conversion structure 5 because of a small sedimentation rate, so that the optical conversion structure 5 forms a substantially dissistantshable first optical conversion structure 5' and a second optical conversion structure. 5". After the optical conversion structure 5 is completely cured, a polishing process is performed to planarize the upper surface 53 of the optical conversion structure 5, and the total thickness of the optical conversion layer 5 (T1+T2) can be further adjusted. Next, a diffusion layer 14 is formed over the optical conversion structure 5. Subsequently, as shown in Fig. 17E, the diffusion layer 14 and the optical conversion structure 5 are cut through using a cutter, and a small portion of the reflective structure 2'' is removed to form The cutting track 62. In other words, the cutting track 62 separates the diffusion layer 14 and the optical conversion structure 5 located above the different light-emitting bodies 1 from each other. The diffusion layer 14 and the optical conversion structure 5 above the light main body 1 have a larger width than the light-emitting body 1. Next, as shown in Fig. 17F, a reflection structure 2"" is formed between the dicing streets 62, so that the reflection structure 2 The upper surface of ''' is substantially coplanar with the upper surface of the diffusion layer 14, forming a first reflective structure 2. At this time, a polishing process may also be performed, on the one hand, the first reflective structure 2 and the diffusion are planarized. The total thickness of the light-emitting elements can be further adjusted on the upper surface of the layer 14. Finally, as shown in Fig. 17G, the first reflective structure 2, the first temporary carrier 7, and/or between the two adjacent optical bodies 1 are cut. Or the carrier plate 13, and then removing the second temporary carrier 7 and the carrier board 13 by means of laser stripping, heating separation, dissolution, irradiation of ultraviolet light, etc., to form a plurality of independent light-emitting elements.

In another embodiment, the light emitting element 900, 1000, or 1000' may include a second reflective structure (not shown) located below the first reflective structure 2 and surrounding the conductive electrode 4. For more information, refer to the first. 10, 11 map and its corresponding description. Furthermore, the light-emitting element 900, 1000, or 1000' may have an optical element disposed above the diffusion layer 14, as described in FIG. 5 and its corresponding description. The light-emitting element 900, 1000, or 1000' may also be provided with an extension electrode under the conductive electrode 4, and reference may be made to FIG. 6 and its corresponding description.

It is to be understood that the various embodiments described above may be combined or substituted with each other as appropriate, and are not limited to the specific embodiments described. The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any obvious modifications or variations of the present invention are possible without departing from the spirit and scope of the invention.

1‧‧‧Lighting subject
2‧‧‧First reflection structure
11, 51, 64, 141‧‧‧ side surfaces
12‧‧‧Glossy
13‧‧‧Loading board
21, 43, 52, 63, 142‧‧‧ lower surface
22, 53, 61, 143‧‧‧ upper surface
23, 23', 23", 251, 261‧ ‧ inner surface
24, 33‧‧‧ outer surface
25, 231‧‧‧ first part
26, 232‧‧‧ Part II
27, 233‧‧‧ third part
234, 2711‧‧‧ one end
14‧‧‧Diffusion layer
3‧‧‧Second reflective structure
31‧‧‧The first part
32‧‧‧Part II
4‧‧‧Conductive electrode
41‧‧‧ upper part
42‧‧‧ lower part
5‧‧‧Optical conversion structure
521‧‧‧First lower surface
522‧‧‧Second lower surface
55'‧‧‧First wavelength conversion material
55''‧‧‧ Second wavelength conversion material
57, 57'‧‧‧ Bevel
6‧‧‧Transparent package structure
54, 62‧‧ ‧ cutting road
6'‧‧‧ times transparent package structure
2', 2''‧‧‧ reflection structure
5'‧‧‧First optical conversion structure
5''‧‧‧Second optical conversion structure
7'‧‧‧fourth temporary vehicle
7‧‧‧ First temporary vehicle
8‧‧‧Second temporary vehicle
9‧‧‧Optical components
101‧‧‧ outside side
10‧‧‧Extended electrode
271‧‧‧ oblique sides
4001‧‧‧ outermost side
100, 100', 200, 300, 400, 500, 600, 600', 600", 700, 800‧‧‧ light-emitting elements
900, 1000, 1000'‧‧‧Lighting elements
W1, W2, W3, W4, W5, W6, W7, W8, W9‧‧ Width
H1, H2, H3‧‧‧ height θ, θ'‧‧‧ tilt angle
T1, T2, T3‧‧‧ thickness
T‧‧‧ total height
D, L‧‧‧ distance
Rp‧‧·Crest
Rv‧‧‧ trough
S ₁ , S ₂ , S _N ‧‧‧ sample length
R _L , R _L1 , R _L2 ‧‧‧ baseline

1A is a schematic cross-sectional view showing a light-emitting element according to an embodiment of the present invention.

Fig. 1B is a bottom view of a light-emitting element according to an embodiment of the present invention.

1C is a schematic cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

2A to 2G are schematic views showing a manufacturing process of a light-emitting element according to an embodiment of the present invention.

3A to 3I are schematic views showing another manufacturing process of a light-emitting element according to an embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 5 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 6 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 7 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 8A is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 8B is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 8C is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

9A to 9G are schematic views showing a manufacturing process of a light-emitting element according to still another embodiment of the present invention.

Figure 10 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

Figure 11 is a cross-sectional view showing a light-emitting element according to another embodiment of the present invention.

12A to 12I are schematic diagrams showing a manufacturing process of a light-emitting element according to another embodiment of the present invention.

Figure 13A is a cross-sectional view showing a light-emitting element according to an embodiment of the present invention.

Figure 13B is a top plan view of a light-emitting element in accordance with an embodiment of the present invention.

Figure 14 illustrates a cross-sectional view of a rough surface.

15A is a cross-sectional view showing a light-emitting element according to an embodiment of the present invention.

Figure 15B is a partial enlarged view of a light-emitting element according to an embodiment of the present invention.

Figure 16A is a cross-sectional view showing a light-emitting element according to an embodiment of the present invention.

Figure 16B is a partial enlarged view of a light-emitting element according to an embodiment of the present invention.

17A to 17H are schematic views showing a manufacturing process of a light-emitting element according to another embodiment of the present invention.

1‧‧‧Lighting subject

2‧‧‧First reflection structure

12‧‧‧Glossy

22‧‧‧ upper surface

21‧‧‧ Lower surface

23‧‧‧ inner surface

24‧‧‧ outer surface

3‧‧‧Second reflective structure

31‧‧‧The first part

32‧‧‧Part II

33‧‧‧ outer surface

4‧‧‧Conductive electrode

41‧‧‧ upper part

42‧‧‧ upper part

43‧‧‧ lower surface

5‧‧‧Optical conversion structure

51‧‧‧ side surface

52‧‧‧ lower surface

6‧‧‧Transparent package structure

61‧‧‧ upper surface

100‧‧‧Lighting elements

θ‧‧‧Tilt angle

W1, W2, W3, W4, W5‧‧‧ width

H1, H2, H3‧‧‧ height

T‧‧‧ total height

D, L‧‧‧ distance

Claims (10)

An illuminating device comprises: a illuminating body comprising a light emitting surface, a bottom surface opposite to the light emitting surface, a side surface, a first electrode, and a second electrode, wherein the first electrode and the second electrode are located a transparent package structure covering the light exit surface and the side surface; a reflective structure having a first reflective structure surrounding the transparent package structure and a second reflective structure in direct contact with the first reflective structure The second reflective structure surrounds and covers the outer surface of the first electrode and the second electrode; and an optical conversion structure is formed on the reflective structure and the transparent package structure; wherein the transparent package structure does not include Optical conversion material. The light-emitting device of claim 1, wherein the first reflective structure has an inner surface and a lower surface, the inner surface having an oblique angle with the lower surface, the oblique angle being an acute angle. The illuminating device of claim 1, wherein the second reflecting structure has a portion between the first electrode and the second electrode. The illuminating device of claim 1, further comprising an extension electrode connected to the first electrode and extending along the second reflection structure toward an outermost side of the illuminating device. The light-emitting device of claim 1, further comprising a primary transparent package structure formed between the transparent package structure and the optical conversion structure, wherein the sub-transparent package structure has an arc-shaped upper surface. In the illuminating device of claim 1, the outermost edge of the first electrode and the second electrode does not exceed the outermost edge of the illuminating body. The light-emitting device according to claim 1, wherein the height of the first reflective structure is 1.2 to 2.5 times the height of the light-emitting body. The light-emitting device of claim 1, wherein an inner surface of the first reflective structure and the side surface have a distance greater than 0, and the width of the light-emitting body is 2 to 11 times the distance. The illuminating device of claim 1, wherein the first reflective structure comprises an inner surface and an outer surface, the inner surface comprising a first portion and a third portion, wherein the third portion surrounds The optical conversion structure has a distance from the outer surface that is less than a distance between the first portion and the outer surface. The illuminating device of claim 9, wherein the inner surface of the first reflective structure further comprises a second portion connecting the first portion and the third portion, the second portion being a slope.