TW201737327A - Laser processing device - Google Patents

Abstract

SUMMARY OF THE INVENTION The object of the present invention is to provide a laser processing apparatus capable of continuing a desired processing even if laser light irradiated by a laser beam irradiation means is deviated from the center of a dividing line. According to the present invention, a laser processing apparatus includes: an X-axis direction moving means for relatively maintaining a holding means of a wafer and a laser beam illuminating means having a concentrator for irradiating a laser beam to the held wafer toward Moving in the X-axis direction; and moving in the Y-axis direction to move in the Y-axis direction orthogonal to the X-axis direction; and imaging means disposed adjacent to the concentrator in the X-axis direction; and control means; a photographing means for photographing a processing groove that is processed along the X-axis direction and a feature portion of the device adjacent to the processing groove, the control means, based on the image captured by the image capturing means, the processing groove and the Y of the feature portion When the interval in the axial direction exceeds the allowable value, the Y-axis direction moving means is activated to adjust the relative position of the concentrator and the holding means in the Y-axis direction so that the machining groove and the feature point The interval in the Y-axis direction falls within the allowable value.

Description

Laser processing device

The present invention relates to a laser processing apparatus that applies laser processing to a workpiece such as a semiconductor wafer held on a chuck platform.

In the semiconductor device manufacturing process, the surface of the semiconductor wafer having a substantially circular shape is divided into a plurality of regions by a predetermined dividing line arranged in a lattice shape, and devices such as ICs and LSIs are formed in the regions separated by the regions. Then, the semiconductor wafer is cut along the line to be divided, whereby the area in which the device is formed is divided to manufacture each semiconductor device, and is used in a mobile phone, a computer, or the like.

As a method of dividing a wafer such as a semiconductor wafer along a predetermined dividing line, a technique of introducing a pulsed laser beam having a wavelength that is absorptive to a wafer along a dividing line is used. This is subjected to ablation processing to form a laser processing groove, and an external force is applied along a line to be divided in which a laser processing groove as a starting point of the cutting is formed, thereby being cut.

The above-described laser processing apparatus is provided by at least a holding means for holding a workpiece and a workpiece to be held by the holding means a laser beam illuminating means for illuminating a laser beam irradiated with a laser beam, a moving means for moving the holding means relative to the laser beam illuminating means, and a calibrating means for detecting a processing area In the configuration, it is designed to appropriately irradiate the laser beam to the processing region and apply appropriate processing to the workpiece (see, for example, Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-190779

However, due to the influence of heat generated by the laser beam irradiation means, the parts constituting the laser processing apparatus, in particular, the parts constituting the laser beam irradiation means are thermally expanded, or are rotatably driven by means of holding. Unintentional yawing (yawing, shaking in a horizontal plane), etc., there may be cases where the wafer is positioned at a desired position of the holding means but the condensed point of the laser ray is deviated from the center of the dividing line. Further, in the case where the amount of deviation from the center is large, the laser beam is erroneously irradiated to the device and the device is damaged, and there is a problem that the desired processing or the like cannot be continued.

The present invention has been developed in view of the above facts, and its main technical object is to provide a laser light that can be continuously expected even if it is deviated from the center of the dividing line by the laser beam irradiation means. Laser processing equipment for processing.

In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a laser processing apparatus which is formed by forming a plurality of predetermined dividing lines on a surface in a lattice shape, and forming a plurality of regions separated by the plurality of divided predetermined line regions. A laser processing apparatus for processing a wafer of a device, comprising: a holding means for holding a wafer; and a laser beam irradiation means, a concentrator for irradiating the wafer held by the holding means with a laser beam; and X The axial direction moving means moves the holding means in the X-axis direction with respect to the laser beam irradiation means; and the Y-axis direction moving means causes the holding means to face the X-axis direction with respect to the laser beam irradiation means Moving in the Y-axis direction; and means for photographing, disposed adjacent to the concentrator in the X-axis direction; and control means; the photographing means capturing the laser beam irradiated from the concentrator along the X The axial direction is subjected to the processing groove of the machining and the characteristic portion of the device adjacent to the machining groove, and the control means is based on the image captured by the imaging means in the Y-axis direction of the machining groove and the feature portion When the interval exceeds the allowable value, the Y-axis direction moving means is activated to adjust the position of the concentrator and the holding means in the Y-axis direction so that the Y-axis direction of the machining groove and the feature portion The interval falls within the allowable value.

Preferably, the photographing means is constituted by a line type sensor, and is preferably disposed on the forward path side and the return path side with respect to the concentrating means.

A laser processing apparatus according to the present invention includes: a holding means for holding a wafer; and a laser beam irradiation means having a concentrator for irradiating a laser beam held by the holding means with a laser beam; and an X-axis direction moving means; The holding means moves in the X-axis direction with respect to the laser beam irradiation means, and the Y-axis direction moving means causes the holding means to face the Y-axis direction orthogonal to the X-axis direction with respect to the laser beam irradiation means And a photographing means disposed adjacent to the concentrator and disposed in the X-axis direction; and a control means for photographing the laser beam irradiated from the concentrator and being processed along the X-axis direction a processing groove and a feature portion of the device adjacent to the processing groove, wherein the control means is based on an image captured by the imaging means, and the interval between the machining groove and the characteristic portion in the Y-axis direction during the laser processing exceeds an allowable value In the case of the Y-axis direction moving means, the position of the concentrator and the holding means in the Y-axis direction is adjusted so that the interval between the machining groove and the Y-axis direction of the feature portion falls. allow Continuous laser processing, so that even when the wafer is clearly positioned to the desired position of the holding means, but the spot of the laser light is deviated from the center of the dividing line, the following control can be performed, that is, The Y-axis direction moving means is activated during the laser processing to adjust the position of the concentrator and the holding means in the Y-axis direction so that the interval between the machining groove and the characteristic portion in the Y-axis direction falls within an allowable value, so that Laser processing continues steadily.

1‧‧‧ Laser processing equipment

2‧‧‧Standing abutment

3‧‧‧Maintaining platform institutions

4‧‧‧Laser light irradiation unit

5‧‧‧Laser light exposure

6‧‧‧ Calibration means

7‧‧‧Photographing means

71‧‧‧To road shooting

72‧‧‧Re-shooting

8‧‧‧Control means

10‧‧‧Semiconductor wafer

11‧‧‧Division line

12‧‧‧ device

T‧‧‧Adhesive tape

F‧‧‧ box

Fig. 1 is a perspective view of a laser processing apparatus constructed in accordance with the present invention.

Fig. 2 is a block diagram showing a control means provided in the laser processing apparatus shown in Fig. 1.

Fig. 3 is a perspective view of a semiconductor wafer as a workpiece.

Fig. 4 is an explanatory view of a laser processing project carried out by the laser processing apparatus shown in Fig. 1.

[Fig. 5] An explanatory view for explaining control for correcting the deviation of the laser processing groove in the laser processing project.

Fig. 6 is a flow chart of a control program executed in accordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of a laser processing apparatus constructed in accordance with the present invention will be described in detail with reference to the accompanying drawings.

A perspective view of a laser processing apparatus provided by the present invention is shown in FIG. The laser processing apparatus 1 shown in Fig. 1 includes a stationary base 2 and a holding platform mechanism 3 disposed on the stationary base 2 so as to be in the X-axis direction indicated by an arrow X and the Y-axis direction indicated by an arrow Y. The movement is performed as a means for holding the workpiece; and the laser beam irradiation unit 4 is disposed on the stationary base 2 as a laser beam irradiation means.

The holding platform mechanism 3 includes a pair of guide rails 31 and 31 which are arranged in parallel on the stationary base 2 in the X-axis direction, and a first sliding block 32 which is disposed on the guide rails 31 and 31 so as to be movable toward the X-axis. Moving in the direction; and the second slider 33 is disposed on the first slider 32 so as to be movable in the Y-axis direction indicated by an arrow Y orthogonal to the X-axis direction; and the support platform 35 is The second slide block 33 is rotatably supported by a cylindrical member 34 having a cylindrical shape and having a pulse motor therein. A support plate platform 36 is provided on the support platform 35. In the laser processing apparatus shown in Fig. 1, a semiconductor wafer 10 on which a workpiece, that is, a device is formed, is placed on the chuck table 36.

The chuck table 36 is provided with an adsorption chuck 361 made of a porous material, and the semiconductor wafer 10 having a workpiece, that is, a circular shape, is held on the upper surface of the adsorption chuck 361. It is maintained by the role of attraction. The chuck stage 36 configured as described above is rotated by a pulse motor disposed in the cylindrical member 34. Further, a clamp 362 is disposed on the chuck table 36 for fixing an annular frame F (see FIG. 3) which supports the semiconductor wafer 10, which is a workpiece, through the protective tape T.

The first slider 32 is provided with a pair of guided grooves 321 and 321 which are fitted to the pair of guide rails 31 and 31 on the lower surface, and a pair of guide rails 322 and 322 are formed in parallel on the upper surface in the Y-axis direction. . The first slide block 32 configured as described above is configured to be movable in the X-axis direction along the pair of guide rails 31 and 31 by being fitted to the pair of guide rails 31 and 31 by the guide grooves 321 and 321 . The holding platform mechanism 3 shown in the drawing includes an X-axis direction moving means 37, and means for moving the first sliding block 32 in the X-axis direction along the pair of guide rails 31, 31. The X-axis direction moving means 37 includes a male screw 371 which is disposed in parallel between the pair of guide rails 31 and 31, and a drive source such as a pulse motor 372 for rotationally driving the male screw 371. a male screw 371 having one end supported by a bearing block fixed to the stationary base 2 The other end of the pulse motor 372 is rotatably coupled to the output shaft of the pulse motor 372. Further, the male screw 371 is screwed to the through female screw hole formed in the female nut block (not shown) which is protruded from the lower surface of the central portion of the first slider 32. Therefore, the male screw 371 is rotated forward and reverse by the pulse motor 372, whereby the first slider 32 is moved in the X-axis direction along the guide rails 31, 31.

The second sliding block 33 is provided with a pair of guided grooves 331 and 331 which are fitted to the pair of guide rails 322 and 322 provided on the upper surface of the first sliding block 32, and the guided groove 331 and 331 are formed by the guiding groove. 331 and 331 are fitted to the pair of guide rails 322 and 322, and are configured to be movable in the Y-axis direction orthogonal to the X-axis. The holding platform mechanism 3 shown in the drawing includes a Y-axis direction moving means 38, and means for moving the second sliding block 33 in the Y-axis direction along the one of the first sliding blocks 32 that moves the guide rails 322 and 322. . The Y-axis direction moving means 38 includes a male screw 381 which is disposed in parallel between the pair of guide rails 322 and 322, and a drive source such as a pulse motor 382 for rotationally driving the male screw 381. The male screw 381 is rotatably supported at one end by a bearing block 383 fixed to the upper surface of the first slider 32, and the other end is coupled to an output shaft of the pulse motor 382. Further, the male screw 381 is screwed into the through female screw hole formed in the female nut block (not shown) which is protruded from the center of the second sliding block 33, and the male screw 381 is rotated forward and reversed. The second slider 33 is moved in the Y-axis direction along the guide rails 322 and 322.

Each of the first slider 32 and the second slider 33 includes an X-axis direction position detecting hand that detects a position in the X-axis direction (not shown). a segment and a Y-axis direction position detecting means for detecting a position in the Y-axis direction, wherein a drive signal is transmitted to each of the drive sources based on the detected position of each of the first and second slide blocks by a control means to be described later, and the chuck can be driven. Platform 36 is controlled at the desired location.

The laser beam unit 4 includes a support member 41 disposed on the stationary base 2, and a casing 42 supported by the support member 41 to extend substantially horizontally; and a laser beam irradiation means 5 The housing 42; and the calibration means 6 are disposed at the front end portion of the outer casing 42 for detecting a processing area to be subjected to laser processing for calibration; and the photographing means 7 is adjacent to the laser light irradiation means 5, Shoot the position of the machining groove in the X-axis direction.

The calibration means 6 includes an illumination means for illuminating the workpiece, an optical system for capturing a region illuminated by the illumination means, and an imaging element (CCD) for capturing an image captured by the optical system. The signal is sent to the control means 8 described later. Further, the imaging means 7 for photographing the position of the processing groove is constituted by a line sensor (not shown) and an illumination means for irradiating the area detected by the line sensor, and the chuck platform 36 is attached to the X. The axial direction is moved to capture a processing groove of a predetermined dividing line formed on the wafer, and the image information input to the control means 8 can be processed at high speed and high resolution by processing the captured image information. Degree to analyze the processing groove formation area. Further, the photographing means 7 in the present embodiment is disposed adjacent to the laser beam illuminating means 5 and on the side of the bearing block 373 supporting the male screw 371 (on the side of the road). The chuck platform 36 is moved toward the side of the road In the case of performing laser processing while moving; and the re-routing means 72 is disposed on the side of the pulse motor 372 (reroute side), and laser processing is performed while moving the chuck platform 36 toward the reversing side. In the case where the laser processing is performed while moving the chuck platform 36 in the direction of the road, or when the laser processing is performed in the direction of the return path, the laser processing side can be performed. The position of the newly formed machining groove is detected.

The laser beam irradiation means 5 includes a concentrator 51 for condensing the laser beam oscillated from the pulsed laser beam oscillating means housed inside the casing 42 and irradiating it to the chuck platform 36. The processed object. Although not shown in the drawings, the pulsed laser ray oscillating means in the casing 42 is controlled by the output adjustment means of the pulsed laser ray, the pulsed laser ray oscillator, and the overlying frequency setting means attached thereto. The position of the condensed spot of the pulsed laser light can be adjusted to be perpendicular to the upper surface of the holding platform, that is, the holding surface.

The laser processing apparatus according to the present embodiment includes the control means 8 shown in Fig. 2 . The control means 8 is composed of a computer, and includes a central processing unit (CPU) 81 that performs arithmetic processing in accordance with a control program, a read-only memory (ROM) 82 that stores a control program, and the like, and a readable reading such as a calculation result at any time. Write random access memory (RAM) 83; and input interface 84 and output interface 85. In addition to the detection signals from the calibration means 6, the road imaging means 71, and the multiplexing imaging means 72, the input interface 84 of the control means 8 receives an X-axis from the unillustrated first sliding block 32. Position detection position of the X-axis direction of the position The segment and the position signal of the Y-axis direction position detecting means of the Y-axis direction position of the second slider 33 are detected. Further, from the output interface of the control means 8, the X-axis direction moving means 37, the Y-axis direction moving means 38, the laser beam irradiation means 5, the calibration means 6, and the image information captured by the imaging means 7 are displayed. The output signal such as the means M is displayed.

The laser processing apparatus according to the present embodiment is basically configured as described above, and its operation will be described below. FIG. 3 is a perspective view showing a semiconductor wafer 10 as a workpiece processed by the above-described laser processing apparatus. The semiconductor wafer 10 shown in FIG. 3 is composed of a tantalum wafer, and a plurality of divided planned lines 11 are formed in a lattice shape on the surface 10a, and a plurality of regions partitioned by the plurality of divided planned lines 11 are formed. A device (LSI) 12 is formed.

In order to divide the semiconductor wafer 10 along the dividing line 11 first, the surface of the adhesive tape T made of synthetic resin is first attached to the back surface 10b of the semiconductor wafer 10, and the adhesive tape is supported by the annular frame F. The outer circumference of T. That is, as shown in FIG. 3, the back surface 10b of the semiconductor wafer 10 is attached to the surface of the adhesive tape T, and the outer peripheral portion of the adhesive tape T is attached so as to cover the inner opening of the annular frame F. Further, the adhesive tape T is formed of a polyvinyl chloride (PVC) sheet in the present embodiment.

After the semiconductor wafer 10 is supported by the frame F through the adhesive tape T, the adhesive tape T side of the semiconductor wafer 10 is placed on the chuck platform 36 of the laser processing apparatus shown in FIG. The attraction means thereby attracting and fixing the semiconductor wafer 10 to the chuck platform 36. Further, the annular frame F supporting the semiconductor wafer 10 is fixed by the clamp 362 disposed on the chuck table 36.

After the semiconductor wafer 10 is attracted and fixed to the chuck platform 36, the X-axis direction moving means 37 is activated. Once the chuck platform 36 that holds and holds the semiconductor wafer 10 is positioned directly below the calibration means 6, the calibration is performed. The means 6 and the control means 8 perform a calibration process, that is, a processing area of the semiconductor wafer 10 to be subjected to laser processing. That is, the calibration means 6 and the control means 8 perform image processing such as pattern matching for illuminating the laser beam with the predetermined dividing line 11 formed in the predetermined direction of the semiconductor wafer 10. The concentrator 51 of the light illuminating means 5 is aligned to complete the calibration of the laser beam irradiation position. Further, the alignment of the laser light irradiation position is performed in the same manner as the planned dividing line 11 formed on the semiconductor wafer 10 in a direction orthogonal to the predetermined direction.

As described above, after detecting the planned dividing line 11 formed on the semiconductor wafer 10 held by the chuck table 36 and aligning the position of the laser beam irradiation, the chuck stage 36 is moved to FIG. 4(a). The laser beam irradiation region where the concentrator 51 of the laser beam irradiation means 5 is located is positioned at one end (the left end in FIG. 4(a)) of the predetermined division line 11 to the positive of the concentrator 51. Below. Then, the condensed spot P of the pulsed laser light irradiated from the concentrator 51 is positioned near the surface (upper surface) 10a of the semiconductor wafer 10. Next, the concentrator 51 of the laser beam irradiation means 5 is irradiated with pulsed laser light having a wavelength (355 nm in the present embodiment) which is absorptive to the semiconductor wafer, and the chuck platform is made on one side. 36 moves at a predetermined moving speed in the direction indicated by an arrow X1 in Fig. 4(a), and causes the concentrator 51 to relatively move along the dividing line 11 of the semiconductor wafer 10, and then, as shown in Fig. 4(b) The other end of the divisional predetermined line 11 (the right end in Fig. 4) reaches directly below the concentrator 51, and the irradiation of the pulsed laser light is stopped and the movement of the chuck platform 36 is stopped. As a result, as shown in FIG. 4(c), the laser processing groove 110 is formed along the center of the dividing line 11 in the dividing line 11 between the devices 12 of the semiconductor wafer 10 (laser processing) .

The above laser processing engineering is carried out, for example, according to the following processing conditions.

Light source: YVO laser or YAG laser

Laser light wavelength: 355nm

Repeat frequency: 50kHz

Average output: 5W

Converging spot diameter: φ10μm

Processing feed speed: 500mm / sec

Here, the laser processing apparatus according to the present invention is configured to perform the above-described laser processing of the processing groove 110 along the dividing line 11 and to illuminate the spot P of the irradiated light. When the center of the dividing line 11 is deviated and the formed processing groove deviates from the allowable range, the deviation can be corrected immediately, and the device is prevented from erroneously illuminating the laser beam and the device is damaged, and is executed to continuously form the processing groove. The above laser processing control. The details will be described below with reference to Figs.

As described above, in the present embodiment, the chuck stage 36 is first positioned so as to have a positional relationship between the chuck stage 36 and the concentrator 51 shown by a broken line as shown in Fig. 5(a). Then, the concentrator 51 of the laser beam irradiation means 5 irradiates the pulsed laser beam having an absorptive wavelength to the semiconductor wafer 10, and moves the chuck stage 36 at a predetermined moving speed in the direction indicated by the arrow X1. . In the laser processing project shown in Fig. 5, the chuck table 36 is moved toward the bearing block 373 side, that is, in the direction of the forward direction. Therefore, in order to photograph the processing groove immediately after processing, it is adjacent to the concentrator 51 and is located in the direction of the arrow X1. The imaging means 71 is activated, and the image information captured by the forward imaging means 71 is input to the control means 8, and the image information is displayed on the display means M by the control means 8.

As described above, the forward path imaging means 71 and the return path imaging means 72 of the present embodiment are constituted by a line sensor and have a predetermined range in the Y-axis direction orthogonal to the X-axis direction (display means M of FIG. 5). The range in which the upper and lower directions are displayed is continuously captured by the imaging elements arranged in a line at predetermined time intervals (for example, every 100 μs), and is stored in the random access memory (RAM) of the control means 8. By continuously displaying the image captured at the predetermined time interval, the planar image displayed in the display means M of FIG. 5 can be displayed, and the captured material can be processed at high speed and high resolution.

At the same time as the laser processing starts, the shooting by the path shooting means 71 is also started, and the obtained image signals are sequentially sent to the control means 8 for storage. In the display means M of FIG. 5, pulsed laser light irradiated along the dividing line 11 of the semiconductor wafer 10 is displayed. The laser processing groove 110 is formed. In the present embodiment, the electrode 121 as a feature portion is formed at a predetermined interval along the line dividing line 11 of the device 12 formed on the semiconductor wafer 10. The line sensor that forms the above-described path detecting means 71 is set to include a dividing line 11 for forming the laser processing groove 110 and an electrode 121 constituting the characteristic portion.

The read-only memory (ROM) 82 of the control means 8 stores a control program created in accordance with the flowchart shown in Fig. 6, and the control program is executed every predetermined time interval. The control based on this flowchart will be described below.

After the start of the laser processing, the control signal executed at the predetermined time by the control means 8 is analyzed, and the image signal acquired by the path shooting means 71 is analyzed, and the pattern is compared with the known technique. The electrode 121 and the laser processing groove 110 which are the characteristic portions registered in advance are detected. With the detection information, the position of the laser processing groove 110 with respect to the center of the electrode 121 is calculated in step S1, and more specifically, the distance between the electrode 121 and the laser processing groove 110 in the Y-axis direction is input to The control program. In the present embodiment, the distance between the center of the electrode 121 and the center of the laser processing groove is designed to be 55 μm, and the allowable range is set to 50 μm to 60 μm.

Once the distance (interval A) between the electrode 121 and the laser processing groove 110 is input, it is determined in step S2 whether or not the interval A falls within the allowable range (50 μm - 60 μm) which has been memorized in advance. In the step S2, when it is determined that the interval A falls within the allowable range (Yes), the process returns to the above step. In step S1, steps S1 and S2 are repeated.

As shown in FIG. 5(b), in the present embodiment, if the interval A is assumed to be 40 μm, for example, the determination in step S2 does not fall within the allowable range (No), and the process proceeds to the next step S3, and the electrode 121 is calculated. The amount of deviation between the center and the center of the laser processing groove and the design value (55 μm).

In step S3, the amount of deviation is calculated (-15 μm), whereby in the next step S4, the driving signal is output to the Y-axis direction moving means 38 so that the center of the laser processing groove 110 faces the center of the division planned line 11. The side correction is -15μm, and the previous drive signal will be corrected. Thereafter, return to the beginning of the flowchart. As a result, as shown in FIG. 5(b), once the deviation is detected, the laser processing groove 110 is immediately corrected toward the center of the division planned line 11. Therefore, even if the position of the laser processing groove 110 deviates from the position specified in the design for some reason, the device 12 is not damaged. Further, the display image displayed on the display means M shown in FIG. 5(b) is displayed after the correction of the drive signal of the Y-axis direction moving means 38 is performed after the determination interval A does not fall within the allowable range. The state of the specified time.

In the present embodiment, as shown in FIG. 4(b), the laser processing groove is formed in the direction of the arrow X1 to form the laser processing groove to the right end in the drawing, and the laser platform is used to perform the laser processing of the adjacent dividing line 11. After the index feeding is performed in the Y-axis direction 36, the chuck table 36 is subjected to the laser processing as described above while moving in the direction opposite to the direction of the arrow X1, that is, in the reversing direction. In this case, the laser processing groove will appear in the opposite direction to the direction of moving it in the direction of the road, so it will be used to shoot the mine. The photographing means 7 of the shot processing groove 110 is switched to the return path photographing means 72 disposed on the side opposite to the path photographing means 71 via the concentrator 51, and the chuck platform 36 is moved in the reversing direction. The image signal detected by the multiplexing path detecting means 72 is input to the control means 8, and the same control is performed based on the above control program.

In the present embodiment, a linear sensor is used as the imaging means 7. However, the present invention is not limited thereto, and a so-called area sensor camera capable of capturing a constant rectangular area can be used. However, when a zone sensor camera is employed, it is more time consuming to detect the deviation of the laser processing groove 110 from the line dividing line 11 as compared with the case of using the line type sensor. worry. Therefore, as the photographing means 7, it is preferable to use a line type sensor.

Further, in the present embodiment, the approaching and re-routing means are disposed in front of and behind the X-axis direction via the concentrator 51. However, when the laser processing is performed, the chuck platform 36 is moved only in a single direction. When the processing is performed, the photographing means 7 can be provided only in one direction corresponding to the direction.

Further, in the present embodiment, the characteristic portion for calculating the position of the processing groove in the division planned line is an electrode formed in the device, but the present invention is not limited thereto. Depending on the device to be formed, there is a case where the electrode is not formed along the dividing line as in the present embodiment. In this case, it is also possible to arrange the pattern by printing or the like at a position close to the dividing line. The object of the shape detected by the peer control.

51‧‧‧ concentrator

71‧‧‧To road shooting

72‧‧‧Re-shooting

8‧‧‧Control means

10‧‧‧Semiconductor wafer

10a‧‧‧ surface

11‧‧‧Division line

12‧‧‧ device

36‧‧‧Chuck platform

M‧‧‧ display means

P‧‧‧ spotlight

T‧‧‧Adhesive tape

110‧‧‧Laser processing ditch

121‧‧‧electrode

Claims (3)

A laser processing apparatus is a laser processing apparatus which is formed by forming a plurality of divided planned lines on a surface in a lattice shape, and forming a wafer of a device in a plurality of areas separated by the plurality of divided predetermined line areas. And having: holding means for holding the wafer; and means for irradiating the laser light, having a concentrator for irradiating the wafer held by the holding means with the laser beam; and means for moving the X-axis direction, and the holding means and the thunder The light irradiation means relatively moves in the X-axis direction; and the Y-axis direction moving means moves the holding means to the Y-axis direction orthogonal to the X-axis direction with respect to the laser beam irradiation means; and the imaging means, and The concentrator is disposed adjacent to the X-axis direction; and a control means for capturing a processing groove that is processed along the X-axis direction by the laser beam irradiated from the concentrator and the processing groove In the characteristic portion of the adjacent device, the control means is based on the image captured by the imaging means, and when the interval between the machining groove and the characteristic portion in the Y-axis direction exceeds the allowable value, the following control is performed, that is, Start the Y-axis direction of the condenser means to adjust the relative position of the holding means of the Y-axis direction such that the interval Y-axis direction of the feature point machining grooves falls within the allowable value. The laser processing apparatus according to claim 1, wherein the photographing means is constituted by a line type sensor. The laser processing apparatus according to claim 1 or 2, wherein the photographing means is disposed on the forward side and the return side with respect to the concentrator.