TW201724569A - Light emitting diode package structure and light emitting diode module - Google Patents

Abstract

A light emitting diode package structure includes a first transparent plate, a light emitting unit and a first molding compound. The light emitting unit is disposed above the first transparent plate. The first molding compound is disposed between the light emitting unit and the first transparent plate and covers a part of the light emitting unit. A first side surface of the first molding compound and a second side surface of the first transparent plate are coplanar. At least a part of light emitted by the light emitting unit passes through the first molding compound and the first transparent plate sequentially, so as to be emitted out.

Description

Light-emitting diode package structure and light-emitting diode module

The invention relates to a light emitting diode package structure and a light emitting diode module, in particular to a light emitting diode package structure and a light emitting diode module capable of realizing a package without a package substrate.

Please refer to FIG. 1 , which is a schematic diagram of a prior art light emitting diode package structure 1 . As shown in FIG. 1 , the LED package structure 1 includes a package substrate 10 , a light emitting diode chip 12 , and an encapsulant 14 . The LED chip 12 is disposed on the package substrate 10, and the encapsulant 14 is dispensed on the package substrate 10 and the LED substrate 12 to encapsulate the LED chip 12, that is, the LED The bulk wafer 12 is located between the package substrate 10 and the encapsulant 14. Since the LED chip 12 needs to be disposed on the package substrate 10 before being packaged, the fabrication is inconvenient, and the throughput cannot be improved.

The invention provides a light emitting diode package structure and a light emitting diode module capable of realizing a package without a package substrate, so as to solve the above problems.

According to an embodiment, the LED package structure of the present invention comprises a first light transmissive plate, a light emitting unit and a first encapsulant. The light emitting unit is disposed on the first light transmissive plate. The first encapsulant is disposed between the light emitting unit and the first light transmissive plate and covers a portion of the light emitting unit. One of the first side surfaces of the first encapsulant is aligned with the second side surface of one of the first light transmissive plates. At least a portion of the light emitted by the light emitting unit sequentially passes through the first encapsulant and the first light transmissive plate to be emitted.

Preferably, the first encapsulating gel is doped with a plurality of first fluorescent particles, and the emission wavelength of the first fluorescent particles is greater than the main emission wavelength of the light emitting unit.

Preferably, the first encapsulant comprises a first portion and a second portion, the first portion being located between the light emitting unit and the second portion, and the concentration of the first fluorescent particles in the first portion is less than the first in the second portion The concentration of fluorescent particles.

Preferably, the first encapsulating gel further comprises a plurality of second fluorescent particles, and the first fluorescent particles have a radiation wavelength smaller than a radiation wavelength of the second fluorescent particles.

Preferably, the first encapsulant comprises a first portion and a second portion, the first portion is located between the light emitting unit and the second portion, the first portion is doped with a plurality of first fluorescent particles, and the second portion is doped with a plurality of first fluorescent particles The second fluorescent particles have a radiation wavelength of the first fluorescent particles greater than a primary emission wavelength of the light emitting unit, and the emission wavelength of the first fluorescent particles is smaller than the emission wavelength of the second fluorescent particles.

Preferably, the distance between the light emitting unit and the first side surface of the first encapsulant is greater than the distance between the light emitting unit and the first bottom surface of the first encapsulant, and the first transparent plate is connected to the first encapsulant. a bottom surface.

In accordance with another embodiment, a light emitting diode module of the present invention includes a carrier and a light emitting diode package structure as described above. The LED package structure is disposed on the carrier and electrically connected to the carrier.

In summary, the present invention can directly package a plurality of light-emitting units by using a package colloid and a light-transmitting plate, thereby completing the fabrication of the light-emitting diode package structure, thereby realizing the package without the package substrate. In the light-emitting diode package structure after cutting, the side surface of the encapsulant is aligned with the side surface of the light-transmitting plate. Since the present invention is a package without a package substrate, the light-emitting diode packaged by the package gel and the light-transmissive plate can be cut to complete the fabrication of the light-emitting diode package structure, and thus the light-emitting diode package structure of the present invention. The production is quite convenient and can effectively increase the production capacity. In addition, the present invention utilizes a light-transmitting plate to shape the encapsulant, which eliminates the need for additional molds, thereby saving costs. Since the hardness of the light-transmitting plate is greater than the hardness of the package colloid, when the light-emitting diode package structure is disposed on the carrier, the light-transmitting plate can protect the light-emitting unit, thereby preventing the light from being affected by external force damage. Furthermore, the present invention can dope the phosphor particles in the encapsulating gel, and adjust the light efficiency and the light color by adjusting the concentration and/or the radiation wavelength of the phosphor particles. Similarly, the light transmissive plate can also be used. It protects the fluorescent particles and has the effect of preventing the fluorescent particles on the surface of the encapsulant from falling off.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1, 2, 3, 4, 5, 6, 7, 11‧‧‧Lighting diode package structure

8, 9, ‧ ‧ light-emitting diode modules

10‧‧‧Package substrate

12‧‧‧Light Emitter Wafer

14‧‧‧Package colloid

20‧‧‧First light-transmissive plate

22‧‧‧Lighting unit

24‧‧‧First encapsulant

60‧‧‧Second light-transmissive plate

62‧‧‧Second encapsulant

80‧‧‧ bearing seat

82‧‧‧ first type joint pad

84‧‧‧Second type joint pad

24a‧‧‧Part 1

24b‧‧‧Part II

200‧‧‧ second side surface

220‧‧‧Substrate

222‧‧‧First type semiconductor layer

224‧‧‧Lighting layer

226‧‧‧Second type semiconductor layer

228‧‧‧first type electrode

230‧‧‧Second type electrode

232‧‧‧reflective layer

240‧‧‧First side surface

242‧‧‧ first bottom surface

244‧‧‧First fluorescent particles

246‧‧‧Second fluorescent particles

600‧‧‧ fourth side surface

620‧‧‧ third side surface

622‧‧‧second bottom surface

L‧‧‧Light

D1, D2, D3‧‧‧ distance

Figure 1 is a schematic illustration of a prior art light emitting diode package structure.

Fig. 2 is a schematic view showing a light emitting diode package structure according to a first embodiment of the present invention.

FIG. 3 is a schematic diagram of encapsulating a plurality of light emitting units with a first encapsulant and a first light transmissive plate.

Fig. 4 is a schematic view showing a light emitting diode package structure according to a second embodiment of the present invention.

Fig. 5 is a schematic view showing a light emitting diode package structure according to a third embodiment of the present invention.

Fig. 6 is a schematic view showing a light emitting diode package structure according to a fourth embodiment of the present invention.

Fig. 7 is a schematic view showing a light emitting diode package structure according to a fifth embodiment of the present invention.

Fig. 8 is a schematic view showing a light emitting diode package structure according to a sixth embodiment of the present invention.

Figure 9 is a schematic view of a light emitting diode module in accordance with a seventh embodiment of the present invention.

Figure 10 is a schematic view of a light emitting diode module in accordance with an eighth embodiment of the present invention.

Figure 11 is a schematic view showing a light emitting diode package structure according to a ninth embodiment of the present invention.

Figure 12 is a schematic view of a light emitting diode module in accordance with a tenth embodiment of the present invention.

Please refer to FIG. 2, which is a schematic diagram of a light emitting diode package structure 2 according to a first embodiment of the present invention. As shown in FIG. 2, the LED package structure 2 includes a first light-transmissive plate 20, a light-emitting unit 22, and a first encapsulant 24. The light emitting unit 22 is disposed on the first light transmissive plate 20 , and the first encapsulant 24 is disposed between the light emitting unit 22 and the first light transmissive plate 20 and covers the partial light emitting unit 22 .

In this embodiment, the light emitting unit 22 includes a substrate 220, a first type semiconductor layer 222, a light emitting layer 224, a second type semiconductor layer 226, a first type electrode 228, a second type electrode 230, and a Reflective layer 232. The light emitting unit 22 can be a flip-chip light emitting diode chip, and the base The material of the plate 220 may be sapphire, but is not limited thereto. The first type semiconductor layer 222 is on the substrate 220, the light emitting layer 224 is on the first type semiconductor layer 222, the second type semiconductor layer 226 is on the light emitting layer 224, and the reflective layer 232 is on the second type semiconductor layer 226. The electrode 228 is electrically connected to the first type semiconductor layer 222 , the second type electrode 230 is electrically connected to the second type semiconductor layer 226 , and the first type electrode 228 and the second type electrode 230 are exposed outside the first encapsulant 24 . In other words, the first encapsulant 24 does not cover the first type electrode 228 and the second type electrode 230 of the light emitting unit 22. The first type semiconductor layer 222 may be an N type semiconductor layer (for example, an N type gallium nitride layer), and the second type semiconductor layer 226 may be a P type semiconductor layer (for example, a P type gallium nitride layer). At this time, the first type electrode 228 is an N type electrode, and the second type electrode 230 is a P type electrode. It should be noted that the principle of illumination of the illumination unit 22 is well known to those skilled in the art and will not be described herein.

The reflective layer 232 may have a reflectance of more than 90%, and the material of the reflective layer 232 may be selected from the group consisting of gold, silver, aluminum, copper, nickel, and chromium, but is not limited thereto. The reflective layer 232 can reflect light, thereby increasing the overall light extraction efficiency of the light emitting unit 22. It should be noted that the present invention can determine whether to provide the reflective layer 232 according to actual light demand.

Please refer to FIG. 3 . FIG. 3 is a schematic diagram of encapsulating a plurality of light emitting units 22 with the first encapsulant 24 and the first transparent plate 20 . As shown in FIG. 3, the present invention can directly package the plurality of light emitting units 22 with the first encapsulant 24 and then cover the first light transmissive plate 20 for shaping. Then, cutting is performed for each of the light-emitting units 22 to complete the fabrication of the light-emitting diode package structure 2 as shown in FIG. 2, thereby realizing the package without the package substrate. In the lithographic LED package structure 2 after cutting, the first side surface 240 of the first encapsulant 24 is aligned with the second side surface 200 of the first light transmissive plate 20. Since the present invention is a package without a package substrate, the light-emitting diode package structure 2 of the present invention is relatively convenient to manufacture and can effectively increase the productivity. In addition, the present invention utilizes the first light-transmitting sheet 20 to shape the first encapsulant 24, thereby eliminating the need for additional molds, thereby saving cost.

As shown in FIG. 2, when the light-emitting unit 22 emits light, at least a part of the light L emitted from the light-emitting unit 22 sequentially passes through the first encapsulant 24 and the first light-transmitting plate 20 to be emitted. In this embodiment, the light transmittance of the light L emitted by the first light-transmitting plate 20 for the light-emitting unit 22 may be greater than 90%. The material of the first light-transmitting plate 20 may be glass or ceramic, but is not limited thereto. Preferably, the distance D1 between the light-emitting unit 22 and the first side surface 240 of the first encapsulant 24 is greater than the distance D2 between the light-emitting unit 22 and the first bottom surface 242 of the first encapsulant 24, which is used for illuminating. The light-emitting shape of the unit 22 is designed to increase the overall light-emitting efficiency and the light-emitting angle of the light-emitting unit 22, wherein the first light-transmitting plate 20 is connected to the first bottom surface 242 of the first encapsulant 24.

In this embodiment, the first encapsulant 24 may be doped with a plurality of first phosphor particles 244. Preferably, the emission wavelength of the first fluorescent particles 244 may be greater than the main emission wavelength of the light emitting unit 22. The first fluorescent particles 244 can convert the wavelength of the light L emitted by the light emitting unit 22 into another wavelength, thereby changing the color of the light L emitted by the light emitting unit 22, preferably, the light emitting unit 22 and the first encapsulant 24 The distance D1 between the one side surface 240 can be greater than the distance D2 between the light emitting unit 22 and the first bottom surface 242 of the first encapsulant 24, so that the light emitting diode package structure 2 can have better light uniformity. And light intensity. It should be noted that, according to the actual light-emitting requirement, the present invention can determine whether the first phosphor particles 244 are doped in the first encapsulant 24 .

Referring to FIG. 2, please refer to FIG. 4, which is a schematic diagram of a light emitting diode package structure 3 according to a second embodiment of the present invention. The main difference between the LED package structure 3 and the above-mentioned LED package structure 2 is that the first encapsulant 24 of the LED package 3 includes a first portion 24a and a second portion 24b. A portion 24a is located between the light emitting unit 22 and the second portion 24b, and the concentration of the first fluorescent particles 244 in the first portion 24a is less than the concentration of the first fluorescent particles 244 in the second portion 24b. Thereby, the overall light extraction efficiency of the light emitting unit 22 can be further increased. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.

Referring to FIG. 2, please refer to FIG. 5. FIG. 5 is a schematic diagram of a light emitting diode package structure 4 according to a third embodiment of the present invention. The LED package structure 4 is different from the above-described LED package structure 2 in that the first encapsulant 24 of the LED package 4 further includes a plurality of second phosphor particles 246. In this embodiment, the emission wavelength of the first fluorescent particles 244 may be smaller than the emission wavelength of the second fluorescent particles 246. In other words, the present invention can be made by the first The fluorescent particles 244 and the second fluorescent particles 246 convert the wavelength of the light L emitted from the light emitting unit 22 into a two-phase wavelength, thereby converting the color of the light L emitted from the light emitting unit 22 into a two-phase color, and the light emitting unit 22 When the emitted light L is mixed, the color saturation of the light emitting diode package structure 4 can be improved. It should be noted that the components of the same reference numerals as those shown in FIG. 2 are substantially the same, and will not be described again.

Referring to FIG. 2, please refer to FIG. 6. FIG. 6 is a schematic diagram of a light emitting diode package structure 5 according to a fourth embodiment of the present invention. The LED package structure 5 is different from the above-mentioned LED package structure 2 in that the first encapsulant 24 of the LED package 5 includes a first portion 24a and a second portion 24b. A portion 24a is located between the light emitting unit 22 and the second portion 24b. The first portion 24a is doped with a plurality of first fluorescent particles 244, and the second portion 24b is doped with a plurality of second fluorescent particles 246. In this embodiment, the emission wavelength of the first fluorescent particles 244 may be greater than the main emission wavelength of the light emitting unit 22, and the emission wavelength of the first fluorescent particles 244 may be smaller than the emission wavelength of the second fluorescent particles 246. The color of the light L emitted by the light-emitting unit 22 can be converted into another color by the first fluorescent particles 244, and then converted into another color by the second fluorescent particles 246, thereby generating different luminous effects, and after mixing The color saturation of the LED package structure 5 can be improved. Preferably, the difference between the absorption wavelength of the first phosphor particles 244 and the main emission wavelength of the illumination unit 22 is less than 150 nm, and the absorption wavelength of the second phosphor particles 246. The difference from the emission wavelength of the first fluorescent particles 244 is less than 150 nm, which may have a better fluorescence conversion efficiency. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.

Referring to FIG. 2, please refer to FIG. 7. FIG. 7 is a schematic diagram of a light emitting diode package structure 6 according to a fifth embodiment of the present invention. The LED package structure 6 is different from the above-mentioned LED package structure 2 in that the LED package 6 further includes a second light-transmissive plate 60 and a second encapsulant 62, and The first phosphor particles 244 are not doped in an encapsulant 24. As shown in FIG. 7 , the second encapsulant 62 covers the first transparent plate 20 and the first encapsulant 24 , and the second transparent plate 60 is connected to a second bottom surface 622 of the second encapsulant 62 , and second Package One of the third side surfaces 620 of the colloid 62 is aligned with one of the fourth side surfaces 600 of the second light transmissive plate 60. In this embodiment, the second encapsulant 62 may be doped with a plurality of first fluorescent particles 244, and the first fluorescent particles 244 may have a larger emission wavelength than the main emission wavelength of the light emitting unit 22, and the first fluorescent particles 244. The particle size can range from 3 microns to 50 microns. In addition, the distance D2 between the light emitting unit 22 and the first bottom surface 242 of the first encapsulant 24 may be 1 to 30 times the distance D3 between the first light transmitting plate 20 and the second bottom surface 622 of the second encapsulant 62, due to The light L emitted from the light-emitting unit 22 passes through the first encapsulant 24 and the first transparent plate 20 to excite the first fluorescent particles 244, so that the thickness ratio of the first encapsulant 24 to the second encapsulant 62 is here. The light guiding effect is better in the range, so that more light L can be derived to excite the first fluorescent particles 244. With the above configuration, the overall light extraction efficiency can be further improved and different light extraction effects can be changed. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.

Referring to FIG. 7, reference is made to FIG. 8, which is a schematic diagram of a light emitting diode package structure 7 according to a sixth embodiment of the present invention. The LED package structure 7 is different from the above-described LED package structure 6 in that the second encapsulant 62 of the LED package 7 further includes a plurality of second phosphor particles 246. In this embodiment, the emission wavelength of the second fluorescent particles 246 may be greater than the emission wavelength of the first fluorescent particles 244. In other words, the first fluorescent particle 244 and the second fluorescent particle 246 can convert the wavelength of the light L emitted by the light emitting unit 22 into a two-phase wavelength, thereby converting the color of the light L emitted by the light emitting unit 22 into The two-phase color can improve the color saturation of the light-emitting diode package structure 7 after color mixing. It should be noted that the components of the same reference numerals as those shown in FIG. 8 have substantially the same operation principle, and are not described herein again.

Referring to FIG. 2, please refer to FIG. 9. FIG. 9 is a schematic diagram of a light-emitting diode module 8 according to a seventh embodiment of the present invention. As shown in FIG. 9, the LED module 8 includes a carrier 80, a light emitting diode package structure 2, a first type bond pad 82, and a second type bond pad 84. The LED package 2 is disposed on the carrier 80 and electrically connected to the carrier 80. In this embodiment, the first type bond pads 82 can be N-type bond pads, and the second type bond pads 84 can be P-type bond pads. The first type bonding pad 82 and the second type bonding pad 84 are disposed on the carrier 80, and the first The bonding pads 82 and the bonding pads 84 are electrically connected to the LED package 2 . As shown in FIG. 9 , the first type electrode 228 of the light emitting unit 22 is electrically connected to the first type bonding pad 82 , and the second type electrode 230 of the light emitting unit 22 is electrically connected to the second type bonding pad 84 . In this embodiment, the carrier 80 can have flexibility, such as a flexible circuit board, and can be applied to various shapes of the socket, but not limited thereto. In addition, the LED package structure 2 in FIG. 9 can also be replaced by the LED package structure 3-7 in FIGS. 4 to 8 depending on the practical application. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.

Referring to FIG. 9, reference is made to FIG. 10, which is a schematic diagram of a light-emitting diode module 9 according to an eighth embodiment of the present invention. The main difference between the LED module 9 and the LED module 8 is that the LED module 9 further includes a plurality of first bonding pads 82 and a plurality of second bonding pads 84. . As shown in FIG. 10 , a plurality of first bonding pads 82 and a plurality of second bonding pads 84 are disposed on the carrier 80 for electrically connecting a plurality of LED packages 2 . In other words, the present invention can provide more than one LED package structure 2 on the carrier 80 according to the actual light-emitting requirements. In addition, the LED package structure 2 in FIG. 10 can also be replaced by the LED package structure 3-7 in FIGS. 4 to 8 depending on the practical application. It should be noted that the components of the same reference numerals as those shown in FIG. 10 are substantially the same, and will not be described again.

Referring to FIGS. 2 and 3, reference is made to FIG. 11, which is a schematic diagram of a light emitting diode package structure 11 according to a ninth embodiment of the present invention. As shown in FIG. 3, the present invention can directly package the plurality of light emitting units 22 with the first encapsulant 24 and then cover the first light transmissive plate 20 for shaping. Then, the plurality of light-emitting units 22 are further diced to complete the fabrication of the light-emitting diode package structure 11 as shown in FIG. 11, thereby realizing the package without the package substrate. As shown in FIG. 11 , the light-emitting diode package structure 11 after the dicing includes three light-emitting units 22 , but is not limited thereto. The present invention can also perform cutting for two, four or more light-emitting units to complete the fabrication of the light-emitting diode package structure 11 including the plurality of light-emitting units 22. In addition, after the LED package structure 11 is cut, the first side surface 240 of the first encapsulant 24 and the first light transmissive plate 20 A second side surface 200 is aligned. It should be noted that the components of the same reference numerals as those shown in FIG. 2 are substantially the same, and will not be described again.

Referring to FIGS. 10 and 11, reference is made to FIG. 12, which is a schematic diagram of a light-emitting diode module 13 according to a tenth embodiment of the present invention. As shown in FIG. 12, the LED module 13 includes a carrier 80, a light emitting diode package structure 11, a plurality of first type bonding pads 82, and a plurality of second type bonding pads 84, wherein a plurality of The first type of bonding pads 82 and the plurality of second type bonding pads 84 are disposed on the carrier 80 for electrically connecting the plurality of light emitting units 22 of the LED package structure 11. Comparing the light-emitting diode module 9 of FIG. 10 with the light-emitting diode module 13 of FIG. 12, the present invention can provide a plurality of light-emitting diode package structures 2 having a single light-emitting unit 22 on the carrier 80. The LED module 13 having the plurality of light-emitting units 22 can also be disposed on the carrier 80 depending on the actual application. It should be noted that the components of the same reference numerals as those shown in FIGS. 10 and 11 in FIG. 12 have substantially the same principle of operation, and are not described herein again.

In summary, the present invention can directly package a plurality of light-emitting units by using a light-transmitting plate and a package colloid, thereby completing the fabrication of the light-emitting diode package structure, thereby realizing the package without the package substrate. In the light-emitting diode package structure after cutting, the side surface of the encapsulant is aligned with the side surface of the light-transmitting plate. Since the present invention is a package without a package substrate, the light-emitting diode package structure can be completed by cutting the packaged light-emitting unit. Therefore, the light-emitting diode package structure of the present invention is relatively convenient to manufacture and can be effectively improved. Capacity. In addition, the present invention utilizes a light-transmitting plate to shape the encapsulant, which eliminates the need for additional molds, thereby saving costs. Since the hardness of the light-transmitting plate is greater than the hardness of the package colloid, when the light-emitting diode package structure is disposed on the carrier, the light-transmitting plate can protect the light-emitting unit, thereby preventing the light from being affected by external force damage. Furthermore, the present invention can dope fluorescent particles in the encapsulating gel, and adjust the light efficiency and the color of the light by adjusting the concentration and/or the radiation wavelength of the fluorescent particles. Similarly, the transparent plate can also protect the fluorescent light. The particles have the effect of preventing the falling off of the fluorescent particles on the surface of the encapsulant. In addition, the light-transmitting plate and the encapsulant have a light guiding function, which can improve light extraction efficiency.

The above description is only a preferred embodiment of the present invention, and the scope of the patent application according to the present invention is Equal variations and modifications are intended to be within the scope of the present invention.

2‧‧‧Light emitting diode package structure

20‧‧‧First light-transmissive plate

22‧‧‧Lighting unit

24‧‧‧First encapsulant

200‧‧‧ second side surface

220‧‧‧Substrate

222‧‧‧First type semiconductor layer

224‧‧‧Lighting layer

226‧‧‧Second type semiconductor layer

228‧‧‧first type electrode

230‧‧‧Second type electrode

232‧‧‧reflective layer

240‧‧‧First side surface

242‧‧‧ first bottom surface

244‧‧‧First fluorescent particles

L‧‧‧Light

D1, D2‧‧‧ distance

Claims (6)

A light-emitting device includes: a light-emitting unit, comprising: at least one light-emitting diode chip, each of the light-emitting diode chips includes a first electrode and a second electrode, wherein the first electrode and the second electrode are disposed on The same side of the light emitting diode chip, and the first electrode and the second electrode have a gap; a light transmissive layer covering the light emitting diode chip; and an encapsulant disposed on the light emitting diode Between the wafer and the light transmissive layer, the encapsulant encapsulates the LED chips, and exposes the first electrode and the second electrode of each of the LED chips; and a carrier plate, the illumination The unit is disposed on the carrier board, wherein the encapsulant and the carrier board are spaced apart. A light-emitting device includes: a light-emitting unit, comprising: at least one light-emitting diode chip, each of the light-emitting diode chips includes a first electrode and a second electrode, wherein the first electrode and the second electrode are disposed on The same side of the light emitting diode chip, and the first electrode and the second electrode have a gap; a light transmissive layer covering the light emitting diode chip; and an encapsulant disposed on the light emitting diode Between the wafer and the light transmissive layer, the encapsulant encapsulates the LED chips, and exposes the first electrode and the second electrode of each of the LED chips; and a carrier plate, the light emitting unit The package body is disposed on the carrier board, and the package colloid is bonded to the LED chip without being bonded to the carrier board. A light emitting device includes: a light emitting unit, comprising: a phosphor material layer; at least one light emitting diode chip disposed on the phosphor material layer, each of the light emitting diode chips includes a first electrode and a second electrode, wherein the first electrode and the second electrode The electrode is disposed on the same side of the light emitting element, and the first electrode and the second electrode have a space therebetween; and a light transmissive layer covers the phosphor material layer and the light emitting diode chip and exposes the light emitting The first electrode and the second electrode of the diode chip; and a carrier board, the light emitting unit is disposed on the carrier board, wherein the encapsulant and the carrier board have a space therebetween. A light-emitting device comprising: a light-emitting unit comprising: a layer of phosphor material; at least one light-emitting diode chip disposed on the layer of phosphor material, each of the light-emitting diode chips comprising a light-emitting element, a first electrode, and a second electrode, wherein the first electrode and the second electrode are disposed on a same side of the light emitting element, and the first electrode and the second electrode have a space therebetween; and a light transmitting layer covers the fluorescent material layer And the light emitting diode chip, and exposing the first electrode and the second electrode of each of the light emitting diode chips; and a carrier plate, wherein the light emitting unit is disposed on the carrier board, wherein the fluorescent material layer Bonding to the LED chip without bonding to the carrier. The illuminating device of claim 1 or 2, wherein the illuminating unit has a flat side surface comprising a side surface of the encapsulant and a side surface of the light transmissive layer. The illuminating device of claim 3, wherein the illuminating unit has a flat side surface comprising a side surface of the phosphor layer and a side surface of the light transmissive layer.