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TW201724330A - Substrate processing system - Google Patents

Substrate processing system Download PDF

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Publication number
TW201724330A
TW201724330A TW105127851A TW105127851A TW201724330A TW 201724330 A TW201724330 A TW 201724330A TW 105127851 A TW105127851 A TW 105127851A TW 105127851 A TW105127851 A TW 105127851A TW 201724330 A TW201724330 A TW 201724330A
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Taiwan
Prior art keywords
substrate processing
unit
substrate
foup
processing apparatus
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TW105127851A
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Chinese (zh)
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TWI612607B (en
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大橋泰彥
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思可林集團股份有限公司
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    • H10P72/3218
    • H10P72/30
    • H10P72/3202

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  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

A substrate processing system that can suppress the contamination of a substrate and that has a high degree of freedom in layout is provided. An FOUP transportation section 300 is configured of length-adjustable rails 32 and a self-movable FOUP support part 30. Because of this, it is possible to perform extension or reduction of a substrate processing system 1 (addition or removal of a substrate processing apparatus 20) through an easy task of attaching or detaching a unit rail 320 and adding or removing the substrate processing apparatus 20. Also, the FOUP transportation section 300 transports an FOUP 80 in which a substrate is stored in each substrate processing apparatus 20. Therefore, the time for which the substrate is exposed to the atmosphere outside the FOUP 80 is short, thus making it possible to effectively suppress contamination of the substrate.

Description

基板處理系統 Substrate processing system

本發明係關於一種基板處理系統。 The present invention is directed to a substrate processing system.

自習知以來,已知有搬送收納有複數個基板之載體,且自該載體取出基板進行處理之基板處理系統。 Since the prior art, a substrate processing system that transports a carrier containing a plurality of substrates and takes out the substrate from the carrier for processing has been known.

例如,引用文獻1中揭示有如下技術,即,於裝載、卸載部收容載體,且裝載、卸載部使載體移動至與基板處理系統鄰接之位置,基板處理系統內之搬送機構自載體取出基板,且將自該載體取出之基板搬送至基板處理系統內之各處理裝置進行處理。 For example, Patent Document 1 discloses a technique in which a carrier is accommodated in a loading and unloading portion, and a loading and unloading portion moves a carrier to a position adjacent to a substrate processing system, and a conveying mechanism in the substrate processing system takes out a substrate from the carrier. The substrate taken out from the carrier is transferred to each processing device in the substrate processing system for processing.

又,引用文獻2中揭示有如下技術,即,使用自共有搬入埠朝向共有搬出埠延伸之專用搬送路徑搬送載體,於該搬送過程中於各處理裝置中自載體取出基板進行處理。 Further, in the cited document 2, there is disclosed a technique in which a carrier is transported from a dedicated transport path extending from a shared transport cassette toward a common carry-out port, and the substrate is taken out from the carrier in each processing device during the transfer.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2006-237559號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-237559

[專利文獻2]日本專利第5392190號公報 [Patent Document 2] Japanese Patent No. 5392190

然而,於專利文獻1之技術中,存在如下問題,即, 雖說係基板處理系統內,但由於以自載體取出之狀態將基板搬送至各處理裝置,故而基板暴露於載體外部之環境氣體之時間變長,基板容易被污染。 However, in the technique of Patent Document 1, there is a problem that In the substrate processing system, since the substrate is transferred to each processing device in a state of being taken out from the carrier, the time during which the substrate is exposed to the ambient gas outside the carrier becomes long, and the substrate is easily contaminated.

於引用文獻2之技術中,由於載體搬送係沿著一方向進行,故而例如必須按照處理順序配置各處理裝置等,使各處理裝置之配置受到限制。又,於引用文獻2之技術中,於追加或去除處理裝置之情形時,共有搬入埠或共有搬出埠之至少一者會移動。因此,於引用文獻2之技術中,基於進行基板處理系統與外部裝置之間之載體之交接之觀點,必須以抵消上述移動之影響之方式執行外部裝置之驅動控制,伴隨著基板處理系統之擴大或縮小(處理裝置之追加或去除)之勞力和時間增大。即,於引用文獻2之技術中,基板處理系統中之佈局之自由度較低。 In the technique of Citation 2, since the carrier transport system is performed in one direction, for example, it is necessary to arrange each processing device or the like in the order of processing, and the arrangement of each processing device is restricted. Further, in the technique of Citation 2, at the time of adding or removing the processing device, at least one of the total carry-in or the shared carry-out moves. Therefore, in the technique of Citation 2, based on the viewpoint of the transfer of the carrier between the substrate processing system and the external device, it is necessary to perform the drive control of the external device in a manner that counteracts the influence of the above-described movement, accompanied by the expansion of the substrate processing system. The labor and time of shrinking (adding or removing the processing device) is increased. That is, in the technique cited in Document 2, the degree of freedom in the layout in the substrate processing system is low.

因此,於本發明中,目的在於提供一種能夠抑制基板之污染且佈局之自由度較高之基板處理系統。 Therefore, in the present invention, it is an object of the invention to provide a substrate processing system capable of suppressing contamination of a substrate and having a high degree of freedom in layout.

本發明之第1態樣之基板處理系統係自收納有基板之載體取出基板進行處理者,其特徵在於,其具備有:第1交接部,其於該基板處理系統與其外部之間交接上述載體;基板處理裝置群,其將複數個基板處理裝置配置成一行,且上述第1交接部沿著該排列方向於上述複數個基板處理裝置之一側鄰接;及載體搬送部,其沿著上述第1交接部及上述基板處理裝置群之排列方向於雙方向搬送上述載體;構成上述基板處理裝置群之各基板處理裝置具有:第2交接部,其於基板處理裝置與上述載體搬送部之間交接上述載體;複數個處理部,其對上述基板執行處理;及至少一個基板 搬送部,其於配置於上述第2交接部之上述載體與上述複數個處理部之間搬送上述基板。 In the substrate processing system according to the first aspect of the present invention, the substrate is taken out from the carrier in which the substrate is housed, and the substrate is provided with a first transfer portion that transfers the carrier between the substrate processing system and the outside thereof. a substrate processing apparatus group in which a plurality of substrate processing apparatuses are arranged in a row, and the first delivery unit is adjacent to one side of the plurality of substrate processing apparatuses along the arrangement direction; and a carrier transport unit along the first Each of the substrate processing apparatuses that constitute the substrate processing apparatus group has a second delivery unit that is transferred between the substrate processing apparatus and the carrier transport unit. The carrier; a plurality of processing portions that perform processing on the substrate; and at least one substrate The transport unit transports the substrate between the carrier disposed in the second delivery unit and the plurality of processing units.

本發明之第2態樣之基板處理系統係如本發明之第1態樣之基板處理系統,其中,上述載體搬送部具有:軌道,其於自上述第1交接部至上述基板處理裝置群中之另一側之基板處理裝置之區間,沿著上述排列方向延伸;及載體保持部,其能夠沿著上述軌道自行推進且保持上述載體。 A substrate processing system according to a second aspect of the present invention is the substrate processing system according to the first aspect of the present invention, wherein the carrier transport unit includes a rail from the first transfer unit to the substrate processing apparatus group. The section of the substrate processing apparatus on the other side extends along the arrangement direction; and the carrier holding portion is capable of self-propelling along the track and holding the carrier.

本發明之第3態樣之基板處理系統係如第2態樣之基板處理系統,其中,上述軌道係將複數個單位軌道於上述排列方向上連結而構成,藉由上述單位軌道之裝卸而能夠調整上述軌道之上述排列方向上之長度。 A substrate processing system according to a second aspect of the present invention is the substrate processing system according to the second aspect, wherein the rail system is configured by connecting a plurality of unit tracks in the arrangement direction, and the unit rail can be attached or detached. The length of the above-mentioned track in the above arrangement direction is adjusted.

本發明之第4態樣之基板處理系統係如本發明之第3態樣之基板處理系統,其中,上述單位軌道之上述排列方向之長度為基準長度,各基板處理裝置之上述排列方向之長度為與上述基準長度之整數倍對應之長度,該基板處理系統能夠執行:追加調整,其於對上述基板處理裝置群追加新的基板處理裝置之情況下,追加與該新的基板處理裝置之上述排列方向上之長度對應之數量之上述單位軌道而增加上述軌道之上述排列方向上之長度;及去除調整,其於自上述基板處理裝置群去除既有之基板處理裝置之情況下,將與該既有之基板處理裝置之上述排列方向上之長度對應之數量之上述單位軌道去除而縮短上述軌道之上述排列方向上之長度。 A substrate processing system according to a fourth aspect of the present invention is the substrate processing system according to the third aspect of the present invention, wherein the length of the arrangement direction of the unit track is a reference length, and the length of the arrangement direction of each substrate processing apparatus The substrate processing system can perform an additional adjustment to add a new substrate processing apparatus to the substrate processing apparatus group, and add the above-described new substrate processing apparatus to the length corresponding to the integer multiple of the reference length. And increasing the length of the track in the direction of the arrangement corresponding to the number of the unit tracks in the direction of the arrangement; and removing and adjusting, in the case of removing the existing substrate processing device from the substrate processing device group, The number of the unit tracks corresponding to the length in the arrangement direction of the substrate processing apparatus is reduced to shorten the length of the track in the arrangement direction.

本發明之第5態樣之基板處理系統係如本發明之第1態樣之基板處理系統,其中,上述基板處理裝置群中之至少一個基板處理裝置具有處理內容互不相同之複數個處理部,且於該至少一 個基板處理裝置中,各基板於上述複數個處理部中依序被執行不同之處理。 A substrate processing system according to a fifth aspect of the present invention is the substrate processing system according to the first aspect of the present invention, wherein at least one of the substrate processing apparatuses includes a plurality of processing units having different processing contents And at least one In each of the substrate processing apparatuses, each of the substrates is sequentially processed differently in the plurality of processing units.

本發明之第6態樣之基板處理系統係如本發明之第1態樣至第5態樣中任一項之基板處理系統,其中,上述基板處理裝置群中之至少一個基板處理裝置具有在配置於上述第2交接部之上述載體與上述複數個處理部之中間位置所配置之1個基板搬送部,且上述1個基板搬送部藉由使複數個基板保持手段分別個別地驅動,不自上述中間位置移動地,在配置於上述第2交接部之上述載體與上述複數個處理部之間搬送上述基板。 The substrate processing system according to any one of the first aspect to the fifth aspect of the present invention, wherein at least one substrate processing apparatus of the substrate processing apparatus group has a substrate transporting unit disposed at an intermediate position between the carrier and the plurality of processing units in the second transfer unit, wherein the one substrate transport unit is individually driven by a plurality of substrate holding means The intermediate position is moved, and the substrate is transported between the carrier disposed in the second delivery unit and the plurality of processing units.

於本發明中,於基板處理系統之一側配置第1交接部。因此,可不移動第1交接部之位置而進行基板處理系統之擴張或縮小。於第1交接部之位置移動之情況下,基於進行基板處理系統與外部裝置之間之載體之交接之觀點,必須以抵消上述移動之影響之方式執行外部裝置之驅動控制。因此,本發明之態樣與例如日本專利第5392190號公報般伴隨著基板處理系統之擴張或縮小而第1交接部之位置移動之態樣相比,不需要上述驅動控制而較理想。 In the present invention, the first delivery portion is disposed on one side of the substrate processing system. Therefore, the expansion or reduction of the substrate processing system can be performed without moving the position of the first transfer portion. In the case where the position of the first transfer unit is moved, it is necessary to perform drive control of the external device so as to cancel the influence of the above-described movement based on the viewpoint of the transfer of the carrier between the substrate processing system and the external device. Therefore, in the aspect of the present invention, it is preferable that the above-described drive control is not required as compared with the case where the position of the first transfer portion is moved as the substrate processing system is expanded or reduced as in the case of Japanese Patent No. 5392190.

又,於本發明中,載體搬送部能夠沿著第1交接部及基板處理裝置群之排列方向於雙方向搬送載體。因此,於本發明之態樣中,與載體搬送部僅能沿著上述排列方向於一方向搬送載體之態樣相比,各基板處理裝置之配置之自由度較高而較理想。 Further, in the present invention, the carrier transport unit can transport the carrier in both directions along the arrangement direction of the first transfer unit and the substrate processing apparatus group. Therefore, in the aspect of the present invention, it is preferable that the degree of freedom in arrangement of the substrate processing apparatuses is higher than that in which the carrier conveying unit can transport the carrier in only one direction along the arrangement direction.

又,於本發明中,收納有基板之載體藉由載體搬送部而被搬送至各基板處理裝置之第2交接部。因此,基板暴露於載體外部之環境氣體之時間較短,從而可有效地抑制對基板之污染。 Moreover, in the present invention, the carrier in which the substrate is housed is transported to the second delivery portion of each substrate processing apparatus by the carrier transfer unit. Therefore, the time during which the substrate is exposed to the ambient gas outside the carrier is short, so that contamination of the substrate can be effectively suppressed.

1‧‧‧基板處理系統 1‧‧‧Substrate processing system

10‧‧‧裝載埠 10‧‧‧Loading

10a‧‧‧載置面 10a‧‧‧Loading surface

11‧‧‧擋板 11‧‧‧Baffle

20‧‧‧基板處理裝置 20‧‧‧Substrate processing unit

21‧‧‧第2交接部 21‧‧‧2nd handover

22‧‧‧開閉部 22‧‧‧Opening and closing department

23‧‧‧處理部 23‧‧‧Processing Department

24‧‧‧基板搬送部 24‧‧‧Substrate Transfer Department

25‧‧‧裝置壁 25‧‧‧ device wall

30、30A‧‧‧FOUP保持部 30, 30A‧‧‧FOUP Maintenance Department

31‧‧‧抓持部 31‧‧‧ gripping department

32‧‧‧軌道 32‧‧‧ Track

50‧‧‧控制單元 50‧‧‧Control unit

51‧‧‧記憶體 51‧‧‧ memory

52‧‧‧CPU 52‧‧‧CPU

80‧‧‧FOUP 80‧‧‧FOUP

81‧‧‧框體 81‧‧‧ frame

82‧‧‧凸緣 82‧‧‧Flange

83‧‧‧蓋 83‧‧‧ Cover

85‧‧‧第1凹部 85‧‧‧1st recess

87‧‧‧第2凹部 87‧‧‧2nd recess

88‧‧‧底部 88‧‧‧ bottom

100‧‧‧裝載、卸載部 100‧‧‧Loading and Unloading Department

130、130a、130b‧‧‧搬送機器人 130, 130a, 130b‧‧‧ transport robot

131‧‧‧支柱 131‧‧‧ pillar

132‧‧‧導軌 132‧‧‧rails

134a、134b、134c‧‧‧旋轉軸 134a, 134b, 134c‧‧‧ rotating shaft

136‧‧‧固定台 136‧‧‧ fixed table

138a、138b‧‧‧臂 138a, 138b‧‧‧ arms

139‧‧‧前端部 139‧‧‧ front end

139a‧‧‧突起部 139a‧‧‧Protruding

140‧‧‧支架排列部 140‧‧‧ bracket arrangement

141‧‧‧收容空間 141‧‧‧ accommodating space

141a、141b、141c‧‧‧支架構件 141a, 141b, 141c‧‧‧ bracket members

142‧‧‧突起部 142‧‧‧Protruding

143‧‧‧上表面 143‧‧‧ upper surface

145‧‧‧框架 145‧‧‧Frame

146‧‧‧開口部 146‧‧‧ openings

150、160‧‧‧載置部 150, 160‧‧‧Loading Department

200‧‧‧基板處理裝置群 200‧‧‧Substrate processing unit group

211‧‧‧載置板 211‧‧‧Loading board

212‧‧‧升降部 212‧‧‧ Lifting Department

221‧‧‧閂鎖部 221‧‧‧Latch

222‧‧‧驅動部 222‧‧‧ Drive Department

241‧‧‧手 241‧‧‧Hand

242‧‧‧手驅動機構 242‧‧‧Hand drive mechanism

300‧‧‧FOUP搬送部 300‧‧‧FOUP Transport Department

301‧‧‧框體 301‧‧‧ frame

301A‧‧‧框體 301A‧‧‧ frame

302‧‧‧致動器(馬達) 302‧‧‧Actuator (motor)

303‧‧‧小齒輪 303‧‧‧ pinion

304、307‧‧‧馬達 304, 307‧‧ ‧ motor

305‧‧‧狹縫 305‧‧‧Slit

306‧‧‧螺帽 306‧‧‧ Nuts

308‧‧‧滾珠螺桿 308‧‧‧Ball screw

320‧‧‧單位軌道 320‧‧‧ unit track

AR1‧‧‧箭頭 AR1‧‧‧ arrow

圖1係表示基板處理裝置之整體構成之立體圖。 Fig. 1 is a perspective view showing the overall configuration of a substrate processing apparatus.

圖2係表示FOUP之構成之立體圖。 Fig. 2 is a perspective view showing the configuration of the FOUP.

圖3係表示基板處理系統之整體構成之俯視圖。 Fig. 3 is a plan view showing the overall configuration of a substrate processing system.

圖4係FOUP保持部及軌道之剖視圖。 4 is a cross-sectional view of the FOUP holding portion and the rail.

圖5係裝載、卸載部之俯視圖。 Fig. 5 is a plan view of the loading and unloading portion.

圖6係裝載、卸載部之前視圖。 Figure 6 is a front view of the loading and unloading section.

圖7係支架構件及FOUP之剖視圖。 Figure 7 is a cross-sectional view of the bracket member and the FOUP.

圖8係FOUP搬送部及基板處理裝置之側視圖。 Fig. 8 is a side view of the FOUP transport unit and the substrate processing apparatus.

圖9係FOUP搬送部及基板處理裝置之側視圖。 Fig. 9 is a side view of the FOUP transport unit and the substrate processing apparatus.

圖10係FOUP搬送部及基板處理裝置之側視圖。 Fig. 10 is a side view of the FOUP transport unit and the substrate processing apparatus.

圖11係表示FOUP保持部及其周邊部之構成之俯視圖。 Fig. 11 is a plan view showing the configuration of the FOUP holding portion and its peripheral portion.

圖12係FOUP保持部及軌道之剖視圖。 Figure 12 is a cross-sectional view of the FOUP holding portion and the rail.

以下,一面參照圖式一面對本發明之實施形態進行說明。於圖式中,對具有同樣之構成及功能之部分附註相同之符號,並省略重複說明。再者,以下之實施形態係將本發明具體化之一例,並非限定本發明之技術範圍之事例。又,於圖式中,為了容易理解,存在將各部之尺寸或數量誇張或簡化地圖示之情況。又,於圖式中,為了說明方向,存在附加XYZ正交座標軸之情況。座標軸中之+Z方向係鉛垂上方向,XY平面係水平面。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals are given to the parts having the same components and functions, and the repeated description is omitted. Further, the following embodiments are examples of the present invention and are not intended to limit the scope of the technical scope of the present invention. Further, in the drawings, for the sake of easy understanding, there is a case where the size or number of each part is exaggerated or simplified. Further, in the drawings, in order to explain the direction, there is a case where an XYZ orthogonal coordinate axis is added. The +Z direction in the coordinate axis is in the vertical direction, and the XY plane is the horizontal plane.

<1 實施形態> <1 Embodiment> <1.1 基板處理系統之概略構成> <1.1 Outline Configuration of Substrate Processing System>

圖1係表示基板處理系統1之整體構成之立體圖。圖2係表示FOUP80之構成之立體圖。圖3係表示基板處理系統1之整體構成之俯視圖。圖4係以ZX平面切割FOUP保持部30及軌道32所得之剖視圖。圖5係裝載、卸載部100之俯視圖。圖6係裝載、卸載部100之前視圖。圖7係支架構件141a及FOUP80之剖視圖。 1 is a perspective view showing the overall configuration of a substrate processing system 1. Fig. 2 is a perspective view showing the configuration of the FOUP 80. 3 is a plan view showing the overall configuration of the substrate processing system 1. 4 is a cross-sectional view showing the FOUP holding portion 30 and the rail 32 cut in a ZX plane. FIG. 5 is a plan view of the loading and unloading unit 100. Fig. 6 is a front view of the loading and unloading unit 100. Fig. 7 is a cross-sectional view showing the bracket member 141a and the FOUP 80.

基板處理系統1係自分批次收納有複數個基板之前開式晶圓傳送盒(FOUP,front opening unified pod)80取出基板並對該複數個基板進行處理之系統。基板處理系統1主要具備裝載埠10、裝載、卸載部100、基板處理裝置群200、及FOUP搬送部300(載體搬送部)。 The substrate processing system 1 is a system that takes out a substrate and processes the plurality of substrates by a front opening unified pod (FOUP) before storing a plurality of substrates in a batch. The substrate processing system 1 mainly includes a loading cassette 10, a loading/unloading unit 100, a substrate processing apparatus group 200, and a FOUP conveying unit 300 (carrier conveying unit).

首先,參照圖2對FOUP80之構成進行說明。於FOUP80之框體81之內部形成有分別保持1片基板之複數個槽(未圖示),可藉由該等複數個槽以於上下方向相互隔開之狀態保持數片基板。又,於FOUP80之框體81上部附設有凸緣82。下述FOUP保持部30(載體保持部)抓持該凸緣82,藉此,FOUP80以懸吊之狀態被保持。 First, the configuration of the FOUP 80 will be described with reference to Fig. 2 . A plurality of grooves (not shown) for holding one substrate are formed in the frame 81 of the FOUP 80, and a plurality of grooves can be held in a state in which the plurality of grooves are spaced apart from each other in the vertical direction. Further, a flange 82 is attached to the upper portion of the casing 81 of the FOUP 80. The FOUP holding portion 30 (carrier holding portion) described below grips the flange 82, whereby the FOUP 80 is held in a suspended state.

又,於框體81之一面(自圖2中之箭頭AR1之朝向觀察之面)設置蓋83。於蓋83設置有相對於框體81之鎖定機構。若於將蓋83安裝於框體81之狀態下使鎖定機構發揮功能,則蓋83被固定於框體81而框體81內部成為被密閉之閉空間。藉此,可將蓋83安裝於框體81並使鎖定機構發揮功能從而將框體81內部設為密閉空間。因此,無論設置有基板處理系統1之無塵室之潔淨度如何,FOUP80內部維持為較高之潔淨度。另一方面,若解除上述 鎖定機構,則能夠將蓋83自框體81卸除,從而能夠自框體81之內部取出基板及將基板收納於框體81之內部。再者,例如,將25片基板使其各自之主面沿著水平方向並於上下方向相隔而收納於框體81。 Further, a cover 83 is provided on one surface of the casing 81 (the surface viewed from the direction of the arrow AR1 in Fig. 2). The cover 83 is provided with a locking mechanism with respect to the frame 81. When the lock mechanism is activated in a state where the cover 83 is attached to the casing 81, the cover 83 is fixed to the casing 81, and the inside of the casing 81 is a closed space. Thereby, the cover 83 can be attached to the frame 81, and the lock mechanism can function, and the inside of the frame 81 can be made into a sealed space. Therefore, the FOUP 80 maintains a high degree of cleanliness regardless of the cleanliness of the clean room provided with the substrate processing system 1. On the other hand, if you lift the above In the lock mechanism, the lid 83 can be removed from the casing 81, and the substrate can be taken out from the inside of the casing 81 and the substrate can be housed inside the casing 81. Further, for example, the 25 main substrates are housed in the casing 81 so as to be spaced apart from each other in the horizontal direction in the horizontal direction.

又,於框體81之底部88,於靠近框體81之兩側面之位置形成有一對第1凹部85。進而,於底部88之中心位置附近形成有3個第2凹部87。於圖2中,以假想線示出有第1凹部85及第2凹部87之形成位置。3個第2凹部87以將其等連接而形成之三角形之一邊與蓋83之平面平行之方式形成。 Further, a pair of first recesses 85 are formed in the bottom portion 88 of the casing 81 at positions close to both side faces of the casing 81. Further, three second recesses 87 are formed in the vicinity of the center position of the bottom portion 88. In FIG. 2, the formation positions of the first recessed portion 85 and the second recessed portion 87 are shown by imaginary lines. The three second recesses 87 are formed such that one side of the triangle formed by connecting them is parallel to the plane of the cover 83.

裝載埠10係載置自基板處理系統1之外部之搬送裝置(例如,高架起重傳輸(OHT,Overhead Hoist Transfer))或基板處理系統1之操作員交接之FOUP80之載置台。如圖1所示,於裝載、卸載部100並設2台裝載埠10,於各裝載埠10之載置面10a上載置各1個FOUP80。 The loading cassette 10 is placed on a transfer unit (for example, overhead lifting conveyor (OHT)) that is external to the substrate processing system 1 or a mounting table of the FOUP 80 that is delivered by an operator of the substrate processing system 1. As shown in FIG. 1, two loading cassettes 10 are provided in the loading/unloading unit 100, and one FOUP 80 is placed on each mounting surface 10a of each loading cassette 10.

裝載、卸載部100作為將FOUP80暫時收容於其內部之FOUP收容部(緩衝區)發揮功能。如圖1及圖5所示,於裝載、卸載部100之裝載埠10側之側面設置有2個擋板11。若將擋板11打開,則形成連通基板處理系統1之外部空間與裝載、卸載部100之內部空間之開口部。 The loading and unloading unit 100 functions as a FOUP housing unit (buffer) that temporarily stores the FOUP 80 therein. As shown in FIGS. 1 and 5, two baffles 11 are provided on the side surface of the loading/unloading unit 100 on the side of the loading cassette 10. When the shutter 11 is opened, an opening that communicates with the external space of the substrate processing system 1 and the internal space of the loading and unloading unit 100 is formed.

因此,裝載、卸載部100之搬送機器人130a能夠經由該開口部而於裝載埠10與裝載、卸載部100之內側空間之間進行FOUP80之搬送。於本實施形態中,如圖1所示,裝載、卸載部100配置於由裝載埠10與基板處理裝置群200夾持之部位。包含裝載埠10及裝載、卸載部100之構成作為於基板處理系統1與其外 部之間交接FOUP80之第1交接部發揮功能。 Therefore, the transport robot 130a of the loading and unloading unit 100 can transfer the FOUP 80 between the loading cassette 10 and the inner space of the loading and unloading unit 100 via the opening. In the present embodiment, as shown in FIG. 1, the loading/unloading unit 100 is disposed at a portion sandwiched between the loading cassette 10 and the substrate processing apparatus group 200. The structure including the loading cassette 10 and the loading and unloading unit 100 is used as the substrate processing system 1 and the outside thereof. The first transfer unit that transfers the FOUP 80 between the functions functions.

如圖1所示,基板處理裝置群200係6個基板處理裝置20配置成一行而構成。沿著複數個基板處理裝置20之排列方向(Y方向),於複數個基板處理裝置20之一側(-Y方向側)供裝載、卸載部100鄰接。 As shown in FIG. 1, the substrate processing apparatus group 200 is configured by arranging six substrate processing apparatuses 20 in a row. The loading and unloading unit 100 is adjacent to one side (the −Y direction side) of the plurality of substrate processing apparatuses 20 along the arrangement direction (Y direction) of the plurality of substrate processing apparatuses 20.

於基板處理裝置群200中,可為於各基板處理裝置20中執行不同之基板處理之態樣,亦可為於各基板處理裝置20中執行相同之基板處理之態樣。以下,對在各基板處理裝置20中執行相同之基板處理(例如,基板清潔處理)之態樣進行說明。 In the substrate processing apparatus group 200, different substrate processing may be performed in each substrate processing apparatus 20, or the same substrate processing may be performed in each substrate processing apparatus 20. Hereinafter, an aspect in which the same substrate processing (for example, substrate cleaning processing) is performed in each substrate processing apparatus 20 will be described.

如圖3及圖5所示,FOUP搬送部300具有:軌道32,其於自裝載、卸載部100至基板處理裝置群200中之+Y方向側之基板處理裝置20之區間沿著Y方向延伸;及FOUP保持部30,其能夠沿著軌道32自行推進,且保持FOUP80。因此,FOUP搬送部300能夠於Y軸之雙方向(±Y方向)上搬送FOUP80。 As shown in FIG. 3 and FIG. 5, the FOUP transport unit 300 includes a rail 32 extending in the Y direction from the loading/unloading unit 100 to the substrate processing apparatus 20 on the +Y direction side of the substrate processing apparatus group 200. And the FOUP holding portion 30, which is capable of self-propelling along the track 32 and holding the FOUP 80. Therefore, the FOUP transport unit 300 can transport the FOUP 80 in both directions (±Y direction) of the Y-axis.

收納未處理之基板之FOUP80首先自基板處理系統1之外部經由裝載埠10而被搬入至基板處理系統1。該FOUP80自裝載埠10移動至裝載、卸載部100且暫時保持於設置於裝載、卸載部100內之複數個收容空間141(參照圖5、圖6)之任一者之後,藉由FOUP搬送部300而被搬送至基板處理裝置群200中之任一基板處理裝置20。基板處理裝置20對自FOUP80取出之各基板執行清潔處理,且將經處理過之各基板再次收納於FOUP80。收納經處理過之基板之FOUP80係藉由FOUP搬送部300而自基板處理裝置20被搬送至裝載、卸載部100。該FOUP80於裝載、卸載部100中暫時被保持之後,被移動至裝載埠10。然後,將該FOUP80(收納經 處理過之基板之FOUP)自裝載埠10向基板處理系統1之外部搬出。 The FOUP 80 that houses the unprocessed substrate is first carried into the substrate processing system 1 from the outside of the substrate processing system 1 via the loading cassette 10 . The FOUP 80 is moved from the loading cassette 10 to the loading/unloading unit 100 and temporarily held by any of the plurality of housing spaces 141 (see FIGS. 5 and 6) provided in the loading/unloading unit 100, and then the FOUP conveying unit. 300 is transported to any of the substrate processing apparatuses 200 in the substrate processing apparatus group 200. The substrate processing apparatus 20 performs a cleaning process on each of the substrates taken out from the FOUP 80, and stores the processed substrates in the FOUP 80 again. The FOUP 80 that houses the processed substrate is transported from the substrate processing apparatus 20 to the loading and unloading unit 100 by the FOUP transport unit 300. The FOUP 80 is temporarily held in the loading and unloading unit 100, and then moved to the loading cassette 10. Then, the FOUP80 The FOUP of the processed substrate is carried out from the outside of the substrate processing system 1 from the loading cassette 10.

圖1所示之控制單元50具備:記憶體51,其儲存程式或變數等;及CPU52,其執行依據儲存於記憶體51之程式之控制。又,基板處理系統1內之各部藉由未圖示之信號線而與控制單元50電性連接。因此,CPU52按照儲存於記憶體51之程式使該等各部(控制對象)於既定之時點動作。儲存於記憶體51之程式例如係關於FOUP搬送之程式,藉由執行該程式,搬送機器人130於裝載、卸載部100內搬送FOUP80或FOUP保持部30於FOUP搬送部300之內部搬送FOUP80。或者,儲存於記憶體51之程式係關於基板搬送之程式,藉由執行該程式,基板搬送部24(下述)於FOUP80與處理單元24之間搬送基板。 The control unit 50 shown in FIG. 1 is provided with a memory 51 for storing programs or variables, and the like, and a CPU 52 for executing control according to a program stored in the memory 51. Further, each unit in the substrate processing system 1 is electrically connected to the control unit 50 by a signal line (not shown). Therefore, the CPU 52 operates the respective units (control objects) at a predetermined timing in accordance with the program stored in the memory 51. The program stored in the memory 51 is, for example, a program for transferring the FOUP. By executing the program, the transport robot 130 transports the FOUP 80 or the FOUP holding unit 30 to the inside of the FOUP transport unit 300 in the loading/unloading unit 100 to transport the FOUP 80. Alternatively, the program stored in the memory 51 is a program for transferring the substrate, and by executing the program, the substrate transfer unit 24 (described later) transfers the substrate between the FOUP 80 and the processing unit 24.

<1.2 各部之詳細之構成> <1.2 Detailed composition of each department>

如圖5及圖6所示,裝載、卸載部100主要具備2個搬送機器人130(130a、130b)、支架排列部140、及載置部150、160。 As shown in FIGS. 5 and 6, the loading/unloading unit 100 mainly includes two transport robots 130 (130a and 130b), a rack array unit 140, and mounting units 150 and 160.

如圖5所示,於裝載、卸載部100內配置有於XZ平面排列有複數個支架構件141之支架排列部140。又,於裝載、卸載部100內,搬送機器人130a及載置部150配置於支架排列部140與裝載埠10之間,搬送機器人130b及載置部160配置於支架排列部140與基板處理裝置群200之間。 As shown in FIG. 5, a rack arranging portion 140 in which a plurality of bracket members 141 are arranged in the XZ plane is disposed in the loading and unloading portion 100. Further, in the loading and unloading unit 100, the transport robot 130a and the placing unit 150 are disposed between the rack arranging unit 140 and the loading cassette 10, and the transport robot 130b and the placing unit 160 are disposed in the rack arranging unit 140 and the substrate processing apparatus group. Between 200.

支架排列部140係收容複數個(本實施形態中為16個)FOUP80之收容部。即,於支架排列部140中不僅收容有收容未處理基板之FOUP80,亦收容將基板取出之後之空的FOUP80。如圖5及圖6所示,支架排列部140係使複數個支架沿著鉛垂方向(Z 軸方向)及水平方向(X軸方向)二維地排列者。 The rack arranging unit 140 accommodates a plurality of (16 in the present embodiment) accommodating portions of the FOUP 80. In other words, not only the FOUP 80 that accommodates the unprocessed substrate but also the empty FOUP 80 after the substrate is taken out is accommodated in the holder array portion 140. As shown in FIGS. 5 and 6, the bracket arranging portion 140 is such that a plurality of brackets are along the vertical direction (Z The axis direction) and the horizontal direction (X-axis direction) are two-dimensionally arranged.

複數個支架之各者具備一對支架構件141a。如圖7所示,各支架構件141a具有大致L字形之形狀,且以各支架構件141a之長條方向與Y軸方向大致平行之方式安裝於對應之框架145。又,對於支架構件141a,於載置FOUP80之側之面設置有與設置於FOUP80之底部88之第1凹部85對應之突起部142。因此,可藉由於FOUP80之第1凹部85嵌合一對支架構件141a之突起部142,而將FOUP80穩定地保持於一對支架構件141a。 Each of the plurality of brackets includes a pair of bracket members 141a. As shown in FIG. 7, each of the bracket members 141a has a substantially L-shape and is attached to the corresponding frame 145 such that the longitudinal direction of each of the bracket members 141a is substantially parallel to the Y-axis direction. Further, the holder member 141a is provided with a projection 142 corresponding to the first recess 85 provided in the bottom portion 88 of the FOUP 80 on the side on which the FOUP 80 is placed. Therefore, the FOUP 80 can be stably held by the pair of bracket members 141a by fitting the protrusions 142 of the pair of bracket members 141a to the first recesses 85 of the FOUP 80.

如此,於本實施形態中,一對支架構件141a作為收容FOUP80之收容支架而使用,又,由一對支架構件141a夾持之區域作為收容FOUP80之收容空間141而使用。 As described above, in the present embodiment, the pair of bracket members 141a are used as the storage brackets for housing the FOUP 80, and the region sandwiched by the pair of bracket members 141a is used as the housing space 141 for housing the FOUP 80.

又,於構成收容支架之2個支架構件141a之間形成有較搬送機器人130(130a、130b)之前端部139之尺寸大之開口部146。而且,如圖6所示,各開口部146沿著鉛垂方向(Z軸方向)配置。 Further, an opening portion 146 having a larger size than the front end portion 139 of the transport robot 130 (130a, 130b) is formed between the two bracket members 141a constituting the storage bracket. Further, as shown in FIG. 6, each of the openings 146 is arranged along the vertical direction (Z-axis direction).

因此,搬送機器人130之前端部139通過該等開口部146並且於支架排列部140之內部升降。即,支架排列部140所包含之複數個收容支架之各自之開口部146成為能夠使前端部139於鉛垂方向通過之通過部。 Therefore, the front end portion 139 of the transfer robot 130 passes through the openings 146 and rises and falls inside the holder arranging portion 140. In other words, the respective opening portions 146 of the plurality of storage holders included in the holder array portion 140 are passage portions through which the distal end portion 139 can pass in the vertical direction.

如圖5所示,搬送機器人130a、130b自支架排列部140觀察係分別配置於裝載埠10側及基板處理裝置群200側之搬送FOUP80之部分。即,搬送機器人130a隔著支架排列部140配設於與搬送機器人130b相反側。 As shown in FIG. 5, the transport robots 130a and 130b are partially disposed on the side of the loading cassette 10 and the side of the substrate processing apparatus group 200, and are transported from the rack array unit 140. In other words, the transport robot 130a is disposed on the opposite side of the transport robot 130b via the rack array unit 140.

再者,於本實施形態中,兩機器人130a、130b具有 大致相同之硬體構成。因此,於以下說明中,於不對搬送機器人130a及搬送機器人130b進行區別之情況下,簡稱為「搬送機器人130」。 Furthermore, in the present embodiment, the two robots 130a, 130b have Approximately the same hardware composition. Therefore, in the following description, when the transfer robot 130a and the transfer robot 130b are not distinguished, it is simply referred to as "transport robot 130".

搬送機器人130之前端部139係自下側保持FOUP80之保持要素,且具有大致三角形狀。於前端部139之上表面側之各頂點附近,設置有突起部139a。又,如前述般,於FOUP80之底部88設置有與突起部139a對應之3個第2凹部87(參照圖7:為便於圖示,記載3個中之2個)。又,前端部139經由與Z軸大致平行地設置之旋轉軸134b而安裝於臂138a,且能夠以旋轉軸134b為中心旋轉。因此,搬送機器人130藉由一面使前端部139旋轉一面使3個突起部139a嵌合於FOUP80之對應之第2凹部87而穩定地保持FOUP80。 The front end portion 139 of the transport robot 130 holds the holding elements of the FOUP 80 from the lower side and has a substantially triangular shape. A protrusion 139a is provided in the vicinity of each vertex on the upper surface side of the distal end portion 139. Further, as described above, three second recesses 87 corresponding to the protrusions 139a are provided on the bottom portion 88 of the FOUP 80 (see FIG. 7: two of the three are described for convenience of illustration). Further, the distal end portion 139 is attached to the arm 138a via a rotating shaft 134b provided substantially parallel to the Z-axis, and is rotatable about the rotating shaft 134b. Therefore, the transport robot 130 stably holds the FOUP 80 by fitting the three protrusions 139a to the corresponding second recesses 87 of the FOUP 80 while rotating the distal end portion 139.

進而,臂138a經由與Z軸大致平行地設置之旋轉軸134c而安裝於臂138b,臂138b經由旋轉軸134a而安裝於固定台136。又,固定台136可升降地設置於沿鉛垂方向(Z軸方向)延伸之支柱131。進而,支柱131能夠沿著於水平方向(X軸方向)延伸之導軌132滑動。 Further, the arm 138a is attached to the arm 138b via a rotating shaft 134c that is provided substantially parallel to the Z-axis, and the arm 138b is attached to the fixing table 136 via the rotating shaft 134a. Further, the fixing table 136 is provided to be lifted and lowered on the pillar 131 extending in the vertical direction (Z-axis direction). Further, the pillar 131 can slide along the guide rail 132 that extends in the horizontal direction (X-axis direction).

藉此,搬送機器人130(130a、130b)使保持於前端部139之FOUP80沿著支架排列部140於水平方向移動並且於鉛垂方向升降。因此,搬送機器人130a於支架排列部140之收容支架、裝載埠10、及載置部150之間搬送FOUP80。又,搬送機器人130b於支架排列部140之收容支架與載置部160之間搬送FOUP80。 Thereby, the transport robot 130 (130a, 130b) moves the FOUP 80 held by the front end portion 139 in the horizontal direction along the rack alignment portion 140 and ascends and descends in the vertical direction. Therefore, the transport robot 130a transports the FOUP 80 between the storage bracket of the rack alignment unit 140, the loading cassette 10, and the placing unit 150. Further, the transport robot 130b transports the FOUP 80 between the storage bracket of the rack alignment unit 140 and the placing unit 160.

搬送機器人130a進行如下處理:將載置於裝載埠10之FOUP80向支架排列部140搬送之處理;將載置於裝載埠10之FOUP80向載置部150搬送之處理;將載置於載置部150之FOUP80 向支架排列部140搬送之處理;將收納於支架排列部140之FOUP80向裝載埠10搬送之處理;及將載置於載置部150之FOUP80向裝載埠10搬送之處理。再者,搬送機器人130a於將FOUP80載置於載置部150之情況下,以蓋83之朝向成為+X朝向之狀態之方式載置FOUP80。又,搬送機器人130a於將FOUP80載置於裝載埠10及支架排列部140之情況下,以蓋83之朝向成為+Y朝向之方式載置FOUP80。 The transport robot 130a performs a process of transporting the FOUP 80 placed on the loading cassette 10 to the rack arranging unit 140, and a process of transporting the FOUP 80 placed on the loading cassette 10 to the placing unit 150, and placing it on the mounting unit. 150 FOUP80 The process of transporting to the rack arranging unit 140; the process of transporting the FOUP 80 stored in the rack arranging unit 140 to the loading cassette 10; and the process of transporting the FOUP 80 placed on the mounting unit 150 to the loading cassette 10. In the case where the FOUP 80 is placed on the placing unit 150, the transport robot 130a mounts the FOUP 80 so that the orientation of the lid 83 is in the +X orientation. Further, when the FOUP 80 is placed on the loading cassette 10 and the holder array portion 140, the transfer robot 130a mounts the FOUP 80 so that the orientation of the lid 83 becomes the +Y orientation.

又,搬送機器人130b進行如下處理:將收納於支架排列部140之FOUP80向載置部160搬送之處理;及將載置於載置部160之FOUP80向支架排列部140搬送之處理。再者,搬送機器人130b於將FOUP80載置於載置部160之情況下,以蓋83之朝向成為+X朝向之狀態之方式載置FOUP80。又,搬送機器人130b於將FOUP80載置於支架排列部140之情形時,以蓋83之朝向成為+Y朝向之方式載置FOUP80。 Further, the transport robot 130b performs a process of transporting the FOUP 80 stored in the rack arranging unit 140 to the placing unit 160, and a process of transporting the FOUP 80 placed on the placing unit 160 to the rack arranging unit 140. In the case where the FOUP 80 is placed on the placing unit 160, the transfer robot 130b mounts the FOUP 80 so that the orientation of the lid 83 is in the +X orientation. Further, when the transport robot 130b is placed on the rack arranging unit 140, the FOUP 80 is placed such that the orientation of the lid 83 is in the +Y orientation.

於本實施形態中,搬送機器人130a、130b隔著支架排列部140對向地配置。因此,可藉由搬送機器人130a、130b大致同時執行複數個FOUP80之搬送,從而可提高作為裝載、卸載部100整體之處理量。又,除去存取於同一收容支架之情況,搬送機器人130a、130b可於空間上不相互干涉而執行FOUP80之搬送。因此,可不考慮搬送機器人130a、130b之干涉而設定各機器人之動作。 In the present embodiment, the transport robots 130a and 130b are disposed to face each other across the rack alignment unit 140. Therefore, the transfer of the plurality of FOUPs 80 can be performed substantially simultaneously by the transfer robots 130a and 130b, whereby the amount of processing as the entire loading/unloading unit 100 can be improved. Further, when the access to the same storage holder is removed, the transfer robots 130a and 130b can perform the transfer of the FOUP 80 without interfering with each other spatially. Therefore, the operation of each robot can be set regardless of the interference of the transfer robots 130a and 130b.

再者,於搬送機器人130(130a、130b)與支架排列部140之各收容支架之間進行之FOUP80之搬送係如下述般進行。即,於將FOUP80自搬送機器人130交接至收容支架之情況下,首 先,以收容於收容支架之FOUP80之底部88之高度位置(Z軸方向位置)高於支架構件141a(141b、141c)之上表面143(參照圖7)之高度位置之方式,使搬送機器人130之前端部139移動。其次,使前端部139下降,於FOUP80之第1凹部85嵌合一對支架構件141a(141b、141c)之突起部142。 Further, the transfer of the FOUP 80 between the transfer robot 130 (130a, 130b) and each of the holders of the holder array portion 140 is performed as follows. That is, in the case where the FOUP 80 is transferred from the transfer robot 130 to the storage stand, the first First, the transport robot 130 is placed such that the height position (Z-axis direction position) of the bottom portion 88 of the FOUP 80 housed in the storage bracket is higher than the height position of the upper surface 143 (see FIG. 7) of the bracket members 141a (141b, 141c). The front end 139 moves. Next, the front end portion 139 is lowered, and the protruding portions 142 of the pair of bracket members 141a (141b, 141c) are fitted into the first recessed portion 85 of the FOUP 80.

然後,藉由使前端部139進而下降,而將FOUP80載置於一對支架構件141a(141b、141c)之上表面143,並且藉由使前端部139之突起部139a與第2凹部87隔離而完成將FOUP80自搬送機器人130交接至收容支架之處理。 Then, by lowering the front end portion 139, the FOUP 80 is placed on the upper surface 143 of the pair of bracket members 141a (141b, 141c), and the projection portion 139a of the front end portion 139 is separated from the second recess portion 87 by the projection portion 139a. The process of transferring the FOUP 80 self-transporting robot 130 to the storage rack is completed.

另一方面,於將FOUP80自收容支架交接至搬送機器人130之情況下,首先,使搬送機器人130之前端部139移動至載置於收容支架之FOUP80之下方。其次,使前端部139上升,使前端部139之突起部139a嵌合於FOUP80之第2凹部87。 On the other hand, when the FOUP 80 is delivered from the storage stand to the transfer robot 130, first, the front end portion 139 of the transfer robot 130 is moved to the lower side of the FOUP 80 placed on the storage holder. Next, the distal end portion 139 is raised, and the protruding portion 139a of the distal end portion 139 is fitted to the second concave portion 87 of the FOUP 80.

然後,藉由使前端部139進而上升,而將FOUP80保持於前端部139,藉由使突起部142與第1凹部85隔離,而完成將FOUP80自收容支架交接至搬送機器人130之處理。 Then, the front end portion 139 is further raised to hold the FOUP 80 at the distal end portion 139, and the projection portion 142 is separated from the first concave portion 85, thereby completing the process of transferring the FOUP 80 from the storage holder to the transfer robot 130.

如此,於在搬送機器人130與收容支架之間進行FOUP80之搬送之過程中,FOUP80移動至支架構件141a(141b、141c)之上方。因此,收容空間141之高度以大於FOUP80之高度之方式設定。 As described above, during the transfer of the FOUP 80 between the transfer robot 130 and the storage holder, the FOUP 80 moves above the holder members 141a (141b, 141c). Therefore, the height of the accommodating space 141 is set to be larger than the height of the FOUP 80.

載置部160作為暫時保持自支架排列部140向基板處理裝置20搬送之FOUP80之載置部發揮功能。又,載置部160亦作為暫時保持自基板處理裝置20向支架排列部140搬送之FOUP80之載置部發揮功能。 The placing unit 160 functions as a placing unit that temporarily holds the FOUP 80 that is transported from the rack arranging unit 140 to the substrate processing apparatus 20 . Further, the placing unit 160 also functions as a placing portion that temporarily holds the FOUP 80 that is transported from the substrate processing apparatus 20 to the rack arranging unit 140.

載置部160具有載置FOUP80之支架構件141b。支架構件141b係具有-X方向觀察之側面形狀具有大致L字形之一對長條構件,且於載置FOUP80之面具有複數個(本實施形態中為3個)突起部之構件。如圖5及圖6所示,以支架構件141b之長條方向成為與X軸方向大致平行之方式配設。 The mounting portion 160 has a holder member 141b on which the FOUP 80 is placed. The holder member 141b has a pair of substantially L-shaped side members having a side shape as viewed in the -X direction, and has a plurality of (three in the present embodiment) projections on the surface on which the FOUP 80 is placed. As shown in FIGS. 5 and 6, the strip direction of the holder member 141b is disposed substantially parallel to the X-axis direction.

載置部150作為暫時保持自裝載埠10及支架排列部140向基板處理裝置20搬送之FOUP80之載置部發揮功能。又,載置部150亦作為於將自基板處理裝置20搬送之FOUP80向裝載埠10及支架排列部140搬送時暫時保持FOUP80之載置部發揮功能。 The placing unit 150 functions as a placing unit that temporarily holds the FOUP 80 that is transported from the loading cassette 10 and the holder array unit 140 to the substrate processing apparatus 20 . Moreover, the mounting unit 150 also functions as a mounting portion that temporarily holds the FOUP 80 when the FOUP 80 transported from the substrate processing apparatus 20 is transported to the loading cassette 10 and the holder array unit 140.

載置部150具有載置FOUP80之支架構件141c。支架構件141c係如下構件,即,具有-X方向觀察之側面形狀具有大致L字形之一對長條構件,且於載置FOUP80之面具有複數個(本實施形態中為3個)突起部。如圖5及圖6所示,支架構件141c以其長條方向與X軸方向大致平行之方式配設。 The mounting portion 150 has a holder member 141c on which the FOUP 80 is placed. The holder member 141c is a member having a side shape viewed in the -X direction and having a substantially L-shaped one-to-length member, and has a plurality of (three in the present embodiment) projections on the surface on which the FOUP 80 is placed. As shown in FIGS. 5 and 6, the bracket member 141c is disposed such that its longitudinal direction is substantially parallel to the X-axis direction.

如圖3所示,FOUP搬送部300具有:軌道32,其於自裝載、卸載部100至基板處理裝置群200中之+Y方向側之基板處理裝置20之區間沿著Y方向延伸;及FOUP保持部30,其能夠沿著軌道32自行推進,且保持FOUP80。 As shown in FIG. 3, the FOUP transport unit 300 includes a rail 32 extending in the Y direction from the loading/unloading unit 100 to the section of the substrate processing apparatus 20 on the +Y direction side of the substrate processing apparatus group 200; and FOUP The retaining portion 30, which is capable of self-propelling along the track 32, holds the FOUP 80.

使用圖4對FOUP保持部30進行詳述。FOUP保持部30具有:中空之矩形剖面之框體301、安裝於框體301之內壁之致動器302、安裝於框體301之內壁且能夠於正反方向旋轉之馬達304、及安裝於該馬達304之旋轉軸之小齒輪303。於框體301中軌道32於Y軸方向貫通。於該軌道32之上表面切開有與小齒輪303齒合之齒條(未圖示)。藉此,若馬達302使小齒輪303於正反方向 旋轉,則FOUP保持部30沿著軌道32於±Y方向自行推進。 The FOUP holding unit 30 will be described in detail using FIG. The FOUP holding unit 30 includes a frame 301 having a hollow rectangular cross section, an actuator 302 attached to the inner wall of the frame 301, a motor 304 attached to the inner wall of the frame 301 and rotatable in the forward and reverse directions, and mounting. A pinion 303 of the rotating shaft of the motor 304. The rail 32 penetrates in the Y-axis direction in the casing 301. A rack (not shown) that meshes with the pinion 303 is cut into the upper surface of the rail 32. Thereby, if the motor 302 causes the pinion gear 303 to be in the forward and reverse directions When rotated, the FOUP holding portion 30 advances itself in the ±Y direction along the rail 32.

於框體301之與FOUP80對向之側之側面,於上下方向切開有長條之狹縫305。保持FOUP80之2個抓持部31經由狹縫305而連結於致動器302。致動器302使2個抓持部31相互接近分離並且於上下方向移動。 A slit 305 having a slit is cut in the vertical direction on the side of the frame 301 opposite to the side opposite to the FOUP 80. The two grip portions 31 that hold the FOUP 80 are coupled to the actuator 302 via the slit 305. The actuator 302 moves the two grip portions 31 close to each other and moves in the up and down direction.

軌道32係將複數個單位軌道320於Y方向上連結而構成。更具體而言,軌道32係將配置於最靠-Y方向側且相對較短之1個單位軌道320與相對較長且具有與各基板處理裝置20相同之Y方向長度之6個單位軌道320連結而構成。軌道32能夠藉由單位軌道320之裝卸而調整Y方向上之長度。 The rail 32 is configured by connecting a plurality of unit rails 320 in the Y direction. More specifically, the track 32 is a unit track 320 which is disposed on the most -Y direction side and relatively short, and a unit track 320 which is relatively long and has the same Y direction length as each substrate processing apparatus 20. Connected to form. The track 32 can be adjusted in length in the Y direction by the loading and unloading of the unit rail 320.

於基板處理系統1中,於在基板處理裝置群200追加新的基板處理裝置20之情況下,執行根據該新的基板處理裝置20之Y方向上之長度追加單位軌道320而增加軌道32之Y方向上之長度之追加調整。又,於在基板處理系統1中自基板處理裝置群200去除既有之基板處理裝置20之情況下,執行根據該既有之基板處理裝置20之Y方向上之長度去除單位軌道320而縮短軌道32之Y方向上之長度之去除調整。 In the substrate processing system 1, when a new substrate processing apparatus 20 is added to the substrate processing apparatus group 200, the addition of the unit track 320 in accordance with the length of the new substrate processing apparatus 20 in the Y direction is performed to increase the Y of the track 32. Additional adjustments in the length of the direction. When the substrate processing apparatus 1 removes the existing substrate processing apparatus 20 from the substrate processing apparatus group 200, the unit track 320 is removed in accordance with the length in the Y direction of the conventional substrate processing apparatus 20, and the track is shortened. The removal of the length in the Y direction of 32 is adjusted.

於如本實施形態般FOUP搬送部300係由能夠調整長度之軌道32及能夠自行推進之FOUP保持部30構成之情況下,如上述般,可藉由單位軌道320之裝卸及基板處理裝置20之追加或去除之容易之作業,而進行基板處理系統1之擴張或縮小(基板處理裝置20之追加或去除)。 In the case where the FOUP transport unit 300 is constituted by the rail 32 capable of adjusting the length and the FOUP holding unit 30 capable of self-propelling as in the present embodiment, as described above, the unit rail 320 can be attached and detached and the substrate processing apparatus 20 can be used. The substrate processing system 1 is expanded or reduced (addition or removal of the substrate processing apparatus 20) by an easy addition or removal operation.

於本實施形態中,基板處理系統1於與OHT等外部之FOUP搬送手段之間,於設置於基板處理系統1之一側(-Y方向 側)之第1交接部(裝載埠10及裝載、卸載部100)中進行FOUP80之交接。即便於基板處理系統1追加、去除基板處理裝置20,基板處理系統1之長度僅於另一側(+Y方向側)變化,第1交接部之位置不會變化。假設若根據基板處理裝置20之追加、去除,於與外部之FOUP搬送手段之間交接FOUP80之交接位置變化,則必須以補償該變化之方式驅動FOUP搬送手段。於此情況下,FOUP搬送手段之控制變得複雜。於本實施形態中,無論基板處理裝置20之追加、去除,FOUP80之交接位置不會變化,因此FOUP搬送手段不會變得複雜。此種態樣例如與如專利第5392190號公報般伴隨著基板處理系統之擴張或縮小而第1交接部之位置移動之態樣相比而較理想。 In the present embodiment, the substrate processing system 1 is disposed on one side of the substrate processing system 1 between the external FOUP transfer means such as OHT (-Y direction). The first transfer unit (the load cassette 10 and the loading/unloading unit 100) of the side) performs the transfer of the FOUP 80. That is, it is easy to add or remove the substrate processing apparatus 20 in the substrate processing system 1, and the length of the substrate processing system 1 changes only on the other side (+Y direction side), and the position of the first delivery portion does not change. If the transfer position of the FOUP 80 is changed between the external FOUP transport means and the FOUP transfer means by the addition or removal of the substrate processing apparatus 20, it is necessary to drive the FOUP transport means to compensate for the change. In this case, the control of the FOUP transport means becomes complicated. In the present embodiment, the transfer position of the FOUP 80 does not change regardless of the addition or removal of the substrate processing apparatus 20, and therefore the FOUP transfer means does not become complicated. Such an aspect is preferable, for example, as in the case of the expansion or reduction of the substrate processing system and the movement of the position of the first interface portion as in Patent No. 5392190.

FOUP保持部30保持沿X方向延伸且於Y方向相隔之2個棒狀之抓持部31。FOUP保持部30可保持該2個抓持部31且使其等於其遠近方向(Y方向)位移。因此,FOUP保持部30能夠切換藉由使2個抓持部31靠近而抓持凸緣82之狀態與藉由使2個抓持部31遠離而不抓持凸緣82之狀態。 The FOUP holding portion 30 holds two rod-shaped grip portions 31 that extend in the X direction and are spaced apart in the Y direction. The FOUP holding portion 30 can hold the two grip portions 31 and make them equal to the displacement in the near-far direction (Y direction). Therefore, the FOUP holding unit 30 can switch the state in which the flange 82 is gripped by bringing the two grip portions 31 closer together and the state in which the flanges 82 are not gripped by moving the two grip portions 31 away.

又,如圖6所示,FOUP保持部30包含使抓持部31沿著Z方向升降之升降機構(前述致動器302)。進而,FOUP保持部30可藉由馬達304(參照圖4)而沿著軌道32於Y方向滑動。因此,FOUP保持部30能夠沿著Y方向及Z方向移動。 Further, as shown in FIG. 6, the FOUP holding unit 30 includes an elevating mechanism (the aforementioned actuator 302) that elevates and lowers the grip portion 31 in the Z direction. Further, the FOUP holding unit 30 is slidable in the Y direction along the rail 32 by the motor 304 (see FIG. 4). Therefore, the FOUP holding unit 30 can move in the Y direction and the Z direction.

圖8係自圖3之A-A剖面觀察之基板處理裝置20及FOUP搬送部300之側視圖。圖8~圖10係表示直至將藉由FOUP搬送部300搬送之FOUP80交接至基板處理裝置20,並對FOUP80內之各基板執行處理為止之流程之側視圖。 Fig. 8 is a side view of the substrate processing apparatus 20 and the FOUP transport unit 300 viewed from the A-A cross section of Fig. 3 . 8 to 10 are side views showing a flow until the FOUP 80 transported by the FOUP transport unit 300 is transferred to the substrate processing apparatus 20 and the processing is performed on each of the substrates in the FOUP 80.

構成基板處理裝置群200之各基板處理裝置20具有:第2交接部21,其於基板處理裝置20與FOUP搬送部300之間交接FOUP80;開閉部22,其相對於配置於第2交接部21之FOUP80進行蓋83之開閉;複數個處理部23,其等對基板執行處理;及基板搬送部24,其於配置於第2交接部21之FOUP80與複數個處理部23之間搬送基板。 Each of the substrate processing apparatuses 20 constituting the substrate processing apparatus group 200 includes a second delivery unit 21 that transfers the FOUP 80 between the substrate processing apparatus 20 and the FOUP transport unit 300, and an opening and closing unit 22 that is disposed on the second interface 21 The FOUP 80 opens and closes the lid 83. The plurality of processing units 23 perform processing on the substrate, and the substrate transport unit 24 transports the substrate between the FOUP 80 disposed between the second delivery unit 21 and the plurality of processing units 23.

第2交接部21具有:載置板211,於其上表面載置FOUP80;及升降部212,其使載置板211升降。 The second delivery unit 21 includes a mounting plate 211 on which the FOUP 80 is placed, and a lifting portion 212 that moves the mounting plate 211 up and down.

藉由升降部212而移動至最上方時之載置板211之高度位置(交接位置)係藉由FOUP搬送部300而搬送之FOUP80之下表面之高度與載置板211之上表面之高度大致一致之位置。圖8係表示載置於裝載、卸載部100內之載置部150或載置部160(參照圖4)之FOUP80由FOUP搬送機構300沿Y方向搬送至與基板處理裝置群200內之所需之基板處理裝置20對向之第2交接部21之載置部211之後該FOUP80載置於載置部211之狀態之基板處理裝置20及FOUP搬送部300之側視圖。 The height position (delivery position) of the placing plate 211 when moving to the uppermost position by the lifting portion 212 is the height of the lower surface of the FOUP 80 and the upper surface of the placing plate 211 which are conveyed by the FOUP conveying unit 300. Consistent location. 8 is a view showing that the FOUP 80 placed on the mounting unit 150 or the mounting unit 160 (see FIG. 4) placed in the loading/unloading unit 100 is transported in the Y direction to the substrate processing apparatus group 200 by the FOUP transport mechanism 300. The substrate processing apparatus 20 is a side view of the substrate processing apparatus 20 and the FOUP transport unit 300 in a state in which the FOUP 80 is placed on the mounting unit 211 after the mounting unit 211 of the second delivery unit 21 is placed.

於將FOUP80自FOUP保持部30交接至第2交接部21時,於處於交接位置之載置板211之正上方,自FOUP保持部30保持FOUP80之狀態使2個抓持部31隔開。藉此,自FOUP80被FOUP保持部30抓持之狀態向FOUP80載置於載置板211之狀態切換。另一方面,於將FOUP80自第2交接部21交接至FOUP保持部30時,於交接位置,於載置有FOUP80之載置板211之正上方FOUP保持部30使2個抓持部31靠近。藉此,自FOUP80載置於載置板211之狀態向FOUP80由FOUP保持部30抓持之狀態 切換。 When the FOUP 80 is transferred from the FOUP holding unit 30 to the second delivery unit 21, the two grip portions 31 are separated from each other in the state in which the FOUP 80 is held by the FOUP holding unit 30 directly above the placing plate 211 at the delivery position. Thereby, the state in which the FOUP 80 is gripped by the FOUP holding unit 30 is switched to the state in which the FOUP 80 is placed on the placing board 211. On the other hand, when the FOUP 80 is delivered from the second delivery unit 21 to the FOUP holding unit 30, the FOUP holding unit 30 brings the two gripping portions 31 closer to the front side of the mounting plate 211 on which the FOUP 80 is placed at the delivery position. . Thereby, the state in which the FOUP 80 is placed on the placing plate 211 and the FOUP 80 is gripped by the FOUP holding portion 30 Switch.

於本實施形態中,如圖3所示,於各基板處理裝置20中,2個載置板211於Y方向鄰接設置,升降部212使該等2個載置板211個別地升降。藉此,於各基板處理裝置20中,可於在Y方向上鄰接之2個部位進行FOUP保持部30與第2交接部21之間之FOUP80之交接。 In the present embodiment, as shown in FIG. 3, in each of the substrate processing apparatuses 20, the two mounting plates 211 are adjacently disposed in the Y direction, and the elevating portion 212 individually raises and lowers the two mounting plates 211. Thereby, in each of the substrate processing apparatuses 20, the FOUP 80 can be transferred between the FOUP holding unit 30 and the second transfer unit 21 at two adjacent positions in the Y direction.

若將FOUP80交接至載置板211,則如圖8所示,載置板211藉由升降部212下降至最下方之高度位置(待機位置)。該待機位置係基板搬送部24能夠相對於載置於載置板211上之FOUP80內交接基板之位置。圖9係載置板211位於待機位置時之基板處理裝置20及FOUP搬送部300之側視圖。 When the FOUP 80 is transferred to the placing plate 211, as shown in FIG. 8, the placing plate 211 is lowered to the lowest height position (standby position) by the lifting portion 212. The standby position is a position at which the substrate transfer unit 24 can transfer the substrate to the FOUP 80 placed on the mounting plate 211. FIG. 9 is a side view of the substrate processing apparatus 20 and the FOUP transport unit 300 when the placing board 211 is in the standby position.

基板搬送部24將配置於待機位置之FOUP80內之基板依序向各處理部23搬送,且將於各處理部23處理完成之基板依序向配置於待機位置之FOUP80內搬送。FOUP80於對原來收納於其內部之全部基板(1批次之基板)實施處理且經處理過之全部基板返回該FOUP80內之前於待機位置待機。若經處理過之全部基板返回FOUP80內,則升降部212使載置板211上升而該FOUP80移動至交接位置。然後,收納經處理過基板之該FOUP80由FOUP搬送部300向裝載、卸載部100搬送,且通過裝載埠10向基板處理系統1之外部搬送。 The substrate transfer unit 24 sequentially transports the substrates placed in the FOUP 80 at the standby position to the respective processing units 23, and sequentially transports the substrates processed by the respective processing units 23 to the FOUPs 80 placed in the standby position. The FOUP 80 waits in the standby position before processing all the substrates (one batch of substrates) originally stored therein and returning the processed substrates to the inside of the FOUP 80. When all of the processed substrates are returned to the FOUP 80, the lifting portion 212 raises the placing plate 211 and the FOUP 80 moves to the delivery position. Then, the FOUP 80 that has stored the processed substrate is transported to the loading/unloading unit 100 by the FOUP transport unit 300, and is transported to the outside of the substrate processing system 1 by the loading cassette 10.

再者,載置板211基本上維持於待機位置,僅於與FOUP保持部30之間進行FOUP80之交接之時點上升至交接位置。藉此,可有效地抑制利用FOUP保持部30之FOUP80之搬送因位於交接位置之其他FOUP80之存在而被妨礙之事態。 Further, the placing plate 211 is basically maintained at the standby position, and is raised to the delivery position only when the FOUP 80 is transferred to and from the FOUP holding unit 30. Thereby, it is possible to effectively suppress the situation in which the transfer of the FOUP 80 by the FOUP holding unit 30 is hindered by the presence of the other FOUPs 80 located at the delivery position.

於基板處理裝置20中設置有收容開閉部22、處理部23、及基板搬送部24之裝置壁25,第2交接部21與裝置壁25之-X側鄰接設置。於裝置壁25之-X側之側壁中,於與配置於位於待機位置之2個載置板211上之2個FOUP80之2個蓋83對應之位置設置有未圖示之2個擋板。若將該擋板打開,則形成連通裝置壁25之外部空間與裝置壁25之內部空間之開口部。 The substrate processing apparatus 20 is provided with a device wall 25 that houses the opening and closing unit 22, the processing unit 23, and the substrate conveying unit 24, and the second delivery unit 21 is disposed adjacent to the -X side of the device wall 25. In the side wall on the -X side of the apparatus wall 25, two baffles (not shown) are provided at positions corresponding to the two covers 83 of the two FOUPs 80 disposed on the two mounting plates 211 located at the standby position. When the shutter is opened, an opening portion communicating with the outer space of the device wall 25 and the inner space of the device wall 25 is formed.

開閉部22主要具有閂鎖部221、及使閂鎖部221於Z方向及X方向移動之驅動部222。閂鎖部221以能夠與FOUP80之蓋83嵌合之形狀構成。因此,藉由驅動部222使閂鎖部221移動而閂鎖部221經由上述開口部到達至蓋83。於閂鎖部221被移動而到達至蓋83並嵌合之後,保持有蓋83之閂鎖部221返回至裝置壁25內之定位置,藉此,FOUP80之蓋83成為被打開之狀態。圖10係該時點之基板處理裝置20及FOUP搬送部300之側視圖。 The opening and closing portion 22 mainly has a latch portion 221 and a driving portion 222 that moves the latch portion 221 in the Z direction and the X direction. The latch portion 221 is configured to be engageable with the cover 83 of the FOUP 80. Therefore, the latch portion 221 is moved by the driving portion 222, and the latch portion 221 reaches the lid 83 through the opening portion. After the latch portion 221 is moved to reach the cover 83 and fitted, the latch portion 221 holding the cover 83 is returned to a predetermined position in the device wall 25, whereby the cover 83 of the FOUP 80 is opened. FIG. 10 is a side view of the substrate processing apparatus 20 and the FOUP transport unit 300 at this time.

於自基板搬送部24開始將FOUP80內之複數個基板搬送至各處理部23至基板搬送部24將於各處理部23經執行處理之複數個基板搬回至FOUP80內之期間,蓋83維持被打開之狀態。而且,若經處理過之全部基板返回至FOUP80內,則開閉部22相對於FOUP80安裝蓋83,從而將FOUP80密閉。 The plurality of substrates in the FOUP 80 are transferred from the substrate transfer unit 24 to the respective processing units 23 to the substrate transfer unit 24, and the cover 83 is maintained while the plurality of substrates processed by the respective processing units 23 are carried back into the FOUP 80. Open state. Then, when all the processed substrates are returned to the FOUP 80, the opening and closing portion 22 is attached to the cover 83 with respect to the FOUP 80, thereby sealing the FOUP 80.

基板搬送部24具備用以支持基板之2根手241(基板保持手段)、及使2根手241獨立地移動之手驅動機構242。各手241藉由被手驅動機構242驅動而進行進退移動及升降移動,從而經由上述開口部與處於待機位置之載置板211上之FOUP80進行基板之交接。又,各手241藉由被手驅動機構242驅動而進行進退移動及升降移動,從而於與各處理部23之間進行基板之交接。 The substrate transfer unit 24 includes two hands 241 (substrate holding means) for supporting the substrate, and a hand drive mechanism 242 that moves the two hands 241 independently. Each of the hands 241 is moved by the hand drive mechanism 242 to move forward and backward and move up and down, and the substrate is transferred to the FOUP 80 on the mounting plate 211 at the standby position via the opening. Further, each hand 241 is moved by the hand drive mechanism 242 to move forward and backward and move up and down, and the substrate is transferred to and from the respective processing units 23.

處理部23係於腔室內對基板執行清潔處理等既定之處理之部分。於本實施形態中,於各基板處理裝置20中,於上下方向堆積有4個處理部23之多段構成於Y方向鄰接設置有2個,合計設置8個處理部23(圖3及圖8~圖10)。再者,能夠對處理部23之數量或配置適當地進行設定。又,於本實施形態中,對各處理部23進行同一處理(基板清潔處理)之態樣進行說明,但亦可為各處理部23進行互不相同之處理之態樣。 The processing unit 23 is a part that performs a predetermined process such as a cleaning process on the substrate in the chamber. In the present embodiment, in the substrate processing apparatus 20, a plurality of stages in which four processing units 23 are stacked in the vertical direction are provided adjacent to each other in the Y direction, and a total of eight processing units 23 are provided (FIG. 3 and FIG. 8). Figure 10). Furthermore, the number or arrangement of the processing units 23 can be appropriately set. In the present embodiment, the same processing (substrate cleaning processing) is performed for each processing unit 23, but the processing unit 23 may perform processing different from each other.

於本實施形態中,以將未處理基板收納於FOUP80之狀態搬送至第2交接部21。第2交接部21為處理部23之附近,因此,可將未處理基板以與外部環境氣體隔離之狀態搬送至處理部23之附近。因此,基板暴露於FOUP80之外部環境氣體之期間為自基板搬送部24開始將FOUP80內之複數個基板搬送至各處理部23至基板搬送部24將於各處理部23經執行處理之複數個基板搬回至FOUP80內之期間。因此,於本實施形態中,與於裝載、卸載部100中將FOUP80打開之其他態樣(例如日本專利特開2006-237559號公報中記載之態樣)相比,基板暴露於FOUP80外部之環境氣體之時間較短,可有效地抑制對基板之污染。 In the present embodiment, the unprocessed substrate is transported to the second delivery portion 21 in a state where the unprocessed substrate is stored in the FOUP 80. Since the second delivery unit 21 is in the vicinity of the processing unit 23, the unprocessed substrate can be transported to the vicinity of the processing unit 23 in a state of being separated from the external ambient gas. Therefore, during the period in which the substrate is exposed to the external ambient gas of the FOUP 80, the plurality of substrates in the FOUP 80 are transferred from the substrate transfer unit 24 to the processing units 23 to the substrate transfer unit 24, and the plurality of substrates processed by the respective processing units 23 are processed. Move back to the period of FOUP80. Therefore, in the present embodiment, the substrate is exposed to the environment outside the FOUP 80 as compared with the other aspect in which the FOUP 80 is opened in the loading/unloading unit 100 (for example, in the aspect described in Japanese Laid-Open Patent Publication No. 2006-237559). The short time of the gas can effectively suppress the contamination of the substrate.

又,於本實施形態中,基板處理裝置群200之各基板處理裝置20具有於配置於第2交接部21之FOUP80與複數個處理部23之中間位置配置之1個基板搬送部24。而且,該1個基板搬送部24藉由使2根手241於水平方向分別個別地驅動,不自中間位置移動而於配置於第2交接部21之FOUP80與複數個處理部23之間搬送基板。如此,於藉由不會自中央位置移動之1個基板搬送部24進行各基板之搬送之本實施形態之態樣中,與經由複數個基 板搬送部搬送基板之態樣、或以保持有基板之狀態使基板搬送部移動之態樣相比,基板暴露於FOUP80外部之環境氣體之時間較短,從而可更有效地抑制對基板之污染。 In the present embodiment, each of the substrate processing apparatuses 20 of the substrate processing apparatus group 200 has one substrate transport unit 24 disposed at an intermediate position between the FOUP 80 and the plurality of processing units 23 disposed in the second delivery unit 21. In addition, the two substrate transport units 24 are individually driven in the horizontal direction, and the substrate is transported between the FOUP 80 and the plurality of processing units 23 disposed in the second transfer unit 21 without moving from the intermediate position. . In the embodiment of the present embodiment in which the substrate transfer unit 24 does not move from the center position, the substrate is transported through a plurality of substrates. The substrate transporting unit transports the substrate or the substrate transport unit moves in a state in which the substrate is held, and the substrate is exposed to the ambient gas outside the FOUP 80 for a shorter period of time, thereby more effectively suppressing contamination of the substrate. .

<2 變形例> <2 Modifications>

以上,對本發明之實施形態進行了說明,但本發明能夠於不脫離其主旨之範圍內於上述以外進行各種變更。 The embodiments of the present invention have been described above, but the present invention can be variously modified without departing from the spirit and scope of the invention.

於上述實施形態中,對使用FOUP作為逐批次收納基板之載體之態樣進行了說明,但亦可使用其他基板收容器作為載體。 In the above embodiment, the aspect in which the FOUP is used as the carrier for storing the substrate in batches has been described. However, other substrate storage containers may be used as the carrier.

於上述實施形態中,對於各基板處理裝置20中執行相同基板處理(基板清潔處理)之態樣進行了說明,但亦可於各基板處理裝置20中執行不同之基板處理。於在各基板處理裝置20中執行相同之基板處理之態樣中,收納於某一基板處理裝置20中被執行基板處理之1批次之基板之FOUP80經由裝載、卸載部100而被搬送至裝載埠10,並向基板處理系統1之外部搬出。另一方面,於在各基板處理裝置20中執行不同之基板處理之態樣中,收納於某一基板處理裝置20中被執行基板處理之1批次之基板之FOUP80亦可被搬送至另一基板處理裝置20進而執行其他基板處理。於該情況下,於如上述實施形態般FOUP搬送部300能夠沿著基板處理裝置群200之排列方向於雙方向(±Y方向)搬送FOUP80之態樣中,與僅能夠沿著一方向搬送FOUP80之態樣不同,可不將各基板處理裝置20之配置限定於基板處理順序而自由地進行。 In the above embodiment, the same substrate processing (substrate cleaning processing) is performed in each substrate processing apparatus 20. However, different substrate processing may be performed in each substrate processing apparatus 20. In the case where the same substrate processing is performed in each of the substrate processing apparatuses 20, the FOUP 80 of one of the substrates stored in the substrate processing apparatus 20 to be subjected to the substrate processing is transferred to the loading via the loading/unloading unit 100.埠10 and carried out to the outside of the substrate processing system 1. On the other hand, in the case where different substrate processing is performed in each of the substrate processing apparatuses 20, the FOUP 80 of one of the substrates stored in the substrate processing apparatus 20 to be subjected to the substrate processing can be transferred to another one. The substrate processing apparatus 20 further performs other substrate processing. In this case, in the above-described embodiment, the FOUP transport unit 300 can transport the FOUP 80 in the two directions (±Y direction) along the arrangement direction of the substrate processing apparatus group 200, and can only transport the FOUP 80 in one direction. The aspect is different, and the arrangement of each substrate processing apparatus 20 can be freely performed without being limited to the substrate processing order.

又,於上述實施形態中,對於各基板處理裝置20中 配置處理內容相同之複數個處理部23之態樣進行了說明,但亦可為於各基板處理裝置20中配置處理內容不同之複數個處理部23之態樣。於各處理部23中處理內容相同之態樣中,利用某一處理部23被執行基板處理之基板未經由其他處理部23而返回至FOUP80。另一方面,於各處理部23中處理內容不同之態樣中,利用某一處理部23執行了第1基板處理之基板亦可被搬送至另一處理部23而執行與第1基板處理不同之第2基板處理。如此,於複數個處理部中依序執行不同之處理之態樣中,與於複數個處理裝置中依序執行不同之處理之態樣相比,自某一處理至下一處理之時間間隔較短。因此,基板處理裝置具有處理內容不同之複數個處理部之態樣例如於在將基板加熱至既定溫度之加熱處理之後對該基板實施清潔處理之情況等欲縮短各處理間之時間間隔之情況下尤其有效。 Moreover, in the above embodiment, in each of the substrate processing apparatuses 20 Although the aspect in which a plurality of processing units 23 having the same processing contents are arranged has been described, it is also possible to arrange a plurality of processing units 23 having different processing contents in each substrate processing apparatus 20. In the case where the processing contents are the same in each processing unit 23, the substrate on which the substrate processing is performed by the certain processing unit 23 is returned to the FOUP 80 without passing through the other processing unit 23. On the other hand, in the case where the processing contents of the processing units 23 are different, the substrate on which the first substrate processing is performed by the one processing unit 23 can be transported to the other processing unit 23 to perform the processing different from the first substrate processing. The second substrate is processed. In this manner, in the case where the different processing is sequentially performed in the plurality of processing units, the time interval from the certain processing to the next processing is compared with the manner in which the different processing is sequentially performed in the plurality of processing devices. short. Therefore, the substrate processing apparatus has a plurality of processing sections having different processing contents, for example, a case where the substrate is subjected to a cleaning process after heating the substrate to a predetermined temperature, and the like, in order to shorten the time interval between the processes. Especially effective.

於上述實施形態中,對於各基板處理裝置20中配置1個基板搬送部24之態樣進行了說明,但亦可為於各基板處理裝置20配置複數個基板搬送部24之態樣。 In the above-described embodiment, the configuration in which one substrate transport unit 24 is disposed in each of the substrate processing apparatuses 20 has been described. However, a plurality of substrate transport units 24 may be disposed in each of the substrate processing apparatuses 20.

於上述實施形態中,對第2交接部21包含載置板211及升降部212之態樣進行了說明,但並不限於此。亦可為如下態樣,即,第2交接部21除載置板211及升降部212以外進而具有暫時保持FOUP80之緩衝區部。 In the above embodiment, the second delivery portion 21 includes the mounting plate 211 and the elevation portion 212, but the invention is not limited thereto. Alternatively, the second delivery unit 21 may have a buffer portion that temporarily holds the FOUP 80 in addition to the mounting plate 211 and the elevation portion 212.

於上述實施形態中,對軌道32係將配置於最靠-Y側且相對較短之1個單位軌道320與相對較長且具有與各基板處理裝置20相同之Y方向長度之6個單位軌道320連結而構成之態樣進行了說明,但並不限於此。例如,亦可為各單位軌道320之長度為 相同之長度(基準長度),各基板處理裝置20之Y方向之長度為與基準長度之整數倍相應之長度。而且,於基板處理裝置群200追加新的基板處理裝置20之情形時,執行追加與該新的基板處理裝置20之Y方向上之長度相應之數量之單位軌道320而增加軌道32之Y方向上之長度之追加調整。又,於自基板處理裝置群200去除既有之基板處理裝置20之情況下,執行去除與該既有之基板處理裝置20之Y方向上之長度相應之數量之單位軌道320而縮短軌道32之Y方向上之長度之去除調整。於該態樣中,由於各單位軌道320之長度相同,故而各單位軌道320之管理較容易。又,由於各基板處理裝置20之Y方向之長度為與基準長度之整數倍相應之長度,故而藉由根據基板處理裝置20之追加或去除裝卸整複數個單位軌道320,能夠使基板處理裝置群200之Y方向上之長度與軌道32之Y方向上之長度對應。 In the above-described embodiment, the track 32 is a unit track which is disposed on the most -Y side and relatively short, and which is relatively long and has the same Y-direction length as the substrate processing apparatus 20 The configuration in which the 320 is connected is described, but it is not limited thereto. For example, the length of each unit track 320 may also be The same length (reference length), the length of each substrate processing apparatus 20 in the Y direction is a length corresponding to an integral multiple of the reference length. Further, when a new substrate processing apparatus 20 is added to the substrate processing apparatus group 200, the number of unit tracks 320 corresponding to the length of the new substrate processing apparatus 20 in the Y direction is added to increase the Y direction of the track 32. Additional adjustment of the length. Further, when the existing substrate processing apparatus 20 is removed from the substrate processing apparatus group 200, the unit track 320 is removed by the number corresponding to the length of the existing substrate processing apparatus 20 in the Y direction, and the track 32 is shortened. Removal adjustment of the length in the Y direction. In this aspect, since the lengths of the unit tracks 320 are the same, the management of each unit track 320 is relatively easy. Further, since the length of the substrate processing apparatus 20 in the Y direction is a length corresponding to an integral multiple of the reference length, the substrate processing apparatus group can be mounted by loading or unloading a plurality of unit tracks 320 in accordance with the addition or removal of the substrate processing apparatus 20. The length in the Y direction of 200 corresponds to the length in the Y direction of the track 32.

於上述實施形態中,對藉由配設於內部之馬達304而沿著軌道32自行推進之FOUP保持部30進行了說明,但FOUP保持部30之移動手段並不限於此。例如,亦可於軌道32之±Y方向兩端配置滑輪,於該等一對滑輪間架設驅動帶,使該驅動帶連結FOUP保持部30,藉此而構成FOUP保持部30之移動手段。 In the above embodiment, the FOUP holding unit 30 that is self-propelled along the rail 32 by the motor 304 disposed inside is described. However, the moving means of the FOUP holding unit 30 is not limited thereto. For example, a pulley may be disposed at both ends of the rail 32 in the ±Y direction, and a driving belt may be placed between the pair of pulleys to connect the driving belt to the FOUP holding portion 30, thereby constituting a moving means of the FOUP holding portion 30.

又,亦可代替上述實施形態之FOUP保持部30而使用圖11及圖12所示之FOUP保持部30A。於本變形例中,沿著軌道32配置滾珠螺桿308。該滾珠螺桿308於Y方向貫通FOUP保持部30A之框體301A,且與配設於FOUP保持部30A之內部之螺帽306螺合。滾珠螺桿308之(-Y方向)側之端部連結於配置於裝載、卸載部100之馬達307。因此,藉由使馬達307之旋轉軸於正 反方向旋轉,滾珠螺桿308旋轉,從而可使FOUP保持部30沿著軌道32於±Y方向移動。 Further, instead of the FOUP holding unit 30 of the above-described embodiment, the FOUP holding unit 30A shown in FIGS. 11 and 12 may be used. In the present modification, the ball screw 308 is disposed along the rail 32. The ball screw 308 penetrates the frame body 301A of the FOUP holding portion 30A in the Y direction, and is screwed to the nut 306 disposed inside the FOUP holding portion 30A. The end portion of the ball screw 308 on the (-Y direction) side is coupled to the motor 307 disposed in the loading and unloading unit 100. Therefore, by making the rotation axis of the motor 307 positive Rotating in the opposite direction, the ball screw 308 is rotated, so that the FOUP holding portion 30 can be moved in the ±Y direction along the rail 32.

以上,對實施形態及其變形例之基板處理系統進行了說明,但其等係本發明較佳之實施形態之例,並不限定本發明之實施範圍。本發明於該發明之範圍內能夠進行各實施形態之自由之組合、或各實施形態之任意之構成要素之變形、或於各實施形態中進行任意之構成要素之省略。 Although the substrate processing system of the embodiment and its modifications has been described above, the examples of the preferred embodiments of the present invention are not limited to the scope of the present invention. The present invention can be combined with any of the free combinations of the embodiments, or any of the constituent elements of the respective embodiments, or any constituent elements omitted in the respective embodiments.

1‧‧‧基板處理系統 1‧‧‧Substrate processing system

10‧‧‧裝載埠 10‧‧‧Loading

20‧‧‧基板處理裝置 20‧‧‧Substrate processing unit

21‧‧‧第2交接部 21‧‧‧2nd handover

22‧‧‧開閉部 22‧‧‧Opening and closing department

23‧‧‧處理部 23‧‧‧Processing Department

24‧‧‧基板搬送部 24‧‧‧Substrate Transfer Department

30‧‧‧FOUP保持部 30‧‧‧FOUP Maintenance Department

31‧‧‧抓持部 31‧‧‧ gripping department

32‧‧‧軌道 32‧‧‧ Track

80‧‧‧FOUP 80‧‧‧FOUP

82‧‧‧凸緣 82‧‧‧Flange

100‧‧‧裝載、卸載部 100‧‧‧Loading and Unloading Department

200‧‧‧基板處理裝置群 200‧‧‧Substrate processing unit group

300‧‧‧FOUP搬送部 300‧‧‧FOUP Transport Department

320‧‧‧單位軌道 320‧‧‧ unit track

Claims (6)

一種基板處理系統,其係自收納有基板之載體取出基板並進行處理者,其特徵在於,其具備有:第1交接部,其於該基板處理系統與其外部之間交接上述載體;基板處理裝置群,其將複數個基板處理裝置配置成一行,且上述第1交接部沿著該排列方向於上述複數個基板處理裝置之一側鄰接;及載體搬送部,其沿著上述第1交接部及上述基板處理裝置群之排列方向於雙方向搬送上述載體;構成上述基板處理裝置群之各基板處理裝置具有:第2交接部,其於基板處理裝置與上述載體搬送部之間交接上述載體;複數個處理部,其等對上述基板執行處理;及至少一個基板搬送部,其於配置於上述第2交接部之上述載體與上述複數個處理部之間搬送上述基板。 A substrate processing system for taking out and processing a substrate from a carrier in which a substrate is housed, comprising: a first transfer portion that transfers the carrier between the substrate processing system and an outside thereof; and a substrate processing device a plurality of substrate processing apparatuses arranged in a row, wherein the first delivery unit is adjacent to one side of the plurality of substrate processing apparatuses along the alignment direction, and a carrier transport unit along the first delivery unit and The substrate processing apparatus group is arranged to transport the carrier in both directions; and each of the substrate processing apparatuses constituting the substrate processing apparatus group has a second delivery unit that transfers the carrier between the substrate processing apparatus and the carrier transport unit; The processing unit performs processing on the substrate, and at least one substrate transport unit that transports the substrate between the carrier disposed in the second delivery unit and the plurality of processing units. 如請求項1之基板處理系統,其中,上述載體搬送部具有:軌道,其於自上述第1交接部至上述基板處理裝置群中之另一側之基板處理裝置之區間,沿著上述排列方向延伸;及載體保持部,其能夠沿著上述軌道自行推進,且保持上述載體。 The substrate processing system according to claim 1, wherein the carrier transport unit includes a track along a section of the substrate processing apparatus from the first transfer unit to the other of the substrate processing apparatus groups, along the arrangement direction And extending; and a carrier holding portion capable of self-propelling along the track and holding the carrier. 如請求項2之基板處理系統,其中,上述軌道係將複數個單位軌道於上述排列方向上連結而構成,藉由上述單位軌道之裝卸,能夠調整上述軌道之上述排列方向上之長度。 The substrate processing system according to claim 2, wherein the track system is configured by connecting a plurality of unit tracks in the arrangement direction, and the length of the track in the arrangement direction can be adjusted by attaching and detaching the unit track. 如請求項3之基板處理系統,其中,上述單位軌道之上述排列方向之長度為基準長度,各基板處理裝置之上述排列方向之長度為與上述基準長度之整數倍相應之長度,該基板處理系統能夠執行:追加調整,其於對上述基板處理裝置群追加新的基板處理裝置之情況下,追加與該新的基板處理裝置之上述排列方向上之長度相應之數量之上述單位軌道,而增加上述軌道之上述排列方向上之長度;及去除調整,其於自上述基板處理裝置群去除既有之基板處理裝置之情況下,去除與該既有之基板處理裝置之上述排列方向上之長度相應之數量之上述單位軌道,縮短上述軌道之上述排列方向上之長度。 The substrate processing system of claim 3, wherein the length of the arrangement direction of the unit track is a reference length, and the length of the arrangement direction of each substrate processing device is a length corresponding to an integral multiple of the reference length, the substrate processing system In addition, when a new substrate processing apparatus is added to the substrate processing apparatus group, the number of the unit tracks corresponding to the length of the new substrate processing apparatus in the array direction is added, and the above-mentioned unit track is added. The length of the track in the direction of the arrangement; and the removal adjustment, in the case of removing the existing substrate processing device from the substrate processing device group, removing the length corresponding to the length of the arrangement direction of the existing substrate processing device The number of the above unit tracks shortens the length of the above-mentioned track in the above-mentioned arrangement direction. 如請求項1之基板處理系統,其中,上述基板處理裝置群中之至少一個基板處理裝置具有處理內容互不相同之複數個處理部,於該至少一個基板處理裝置中,各基板於上述複數個處理部中依序被執行不同之處理。 The substrate processing system of claim 1, wherein at least one of the substrate processing device groups has a plurality of processing units having different processing contents, and in the at least one substrate processing device, each of the substrates is in the plurality of substrates Different processing is executed sequentially in the processing unit. 如請求項1至5中任一項之基板處理系統,其中,上述基板處理裝置群中之至少一個基板處理裝置具有在配置於上述第2交接部之上述載體與上述複數個處理部之中間位置所配置之1個基板搬送部,上述1個基板搬送部藉由使複數個基板保持手段分別個別地驅動,不自上述中間位置移動地,在配置於上述第2交接部之上述載體與上述複數個處理部之間搬送上述基板。 The substrate processing system according to any one of claims 1 to 5, wherein at least one of the substrate processing apparatus groups has a middle position between the carrier disposed in the second delivery unit and the plurality of processing units In the one substrate transport unit, the one substrate transport unit is driven by the plurality of substrate holding means individually, and is moved from the intermediate position to the carrier and the plurality of the second transfer unit. The substrate is transferred between the processing units.
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