TW201700660A - Organic-inorganic composite-forming composition having high surface hardness and transparency properties and capable of reducing yellow coloring on a metal compound - Google Patents
Organic-inorganic composite-forming composition having high surface hardness and transparency properties and capable of reducing yellow coloring on a metal compound Download PDFInfo
- Publication number
- TW201700660A TW201700660A TW105112329A TW105112329A TW201700660A TW 201700660 A TW201700660 A TW 201700660A TW 105112329 A TW105112329 A TW 105112329A TW 105112329 A TW105112329 A TW 105112329A TW 201700660 A TW201700660 A TW 201700660A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- organic
- compound
- inorganic composite
- formula
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 43
- 150000002736 metal compounds Chemical class 0.000 title claims abstract description 15
- 238000004040 coloring Methods 0.000 title description 2
- -1 organic acid salt Chemical class 0.000 claims abstract description 115
- 150000001875 compounds Chemical class 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 32
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000003999 initiator Substances 0.000 claims abstract description 22
- 150000004696 coordination complex Chemical class 0.000 claims abstract description 15
- 125000000962 organic group Chemical group 0.000 claims abstract description 6
- 150000003304 ruthenium compounds Chemical class 0.000 claims description 55
- 239000002131 composite material Substances 0.000 claims description 48
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 27
- 238000004090 dissolution Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 238000004422 calculation algorithm Methods 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- FZOQFFKSSVABEJ-UHFFFAOYSA-N CO.CO.C=1(C(C(C=CC1)=O)=O)C1=CC=CC=C1 Chemical compound CO.CO.C=1(C(C(C=CC1)=O)=O)C1=CC=CC=C1 FZOQFFKSSVABEJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001622 bismuth compounds Chemical class 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract description 8
- 238000004383 yellowing Methods 0.000 abstract description 6
- SPEUIVXLLWOEMJ-UHFFFAOYSA-N 1,1-dimethoxyethane Chemical compound COC(C)OC SPEUIVXLLWOEMJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004305 biphenyl Substances 0.000 abstract description 4
- 235000010290 biphenyl Nutrition 0.000 abstract description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 125000000217 alkyl group Chemical group 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 14
- 150000002430 hydrocarbons Chemical group 0.000 description 14
- 150000001785 cerium compounds Chemical class 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 125000003545 alkoxy group Chemical group 0.000 description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 125000003342 alkenyl group Chemical group 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Natural products CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- 150000001721 carbon Chemical group 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 125000006612 decyloxy group Chemical group 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000193 polymethacrylate Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000304 alkynyl group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 125000000392 cycloalkenyl group Chemical group 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 230000003301 hydrolyzing effect Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000000466 oxiranyl group Chemical group 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 2
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- DBJFSFSBHGPDPG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC DBJFSFSBHGPDPG-UHFFFAOYSA-N 0.000 description 2
- 101150065749 Churc1 gene Proteins 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical group C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 102100038239 Protein Churchill Human genes 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 2
- 125000005018 aryl alkenyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 125000001246 bromo group Chemical group Br* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 125000001316 cycloalkyl alkyl group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005417 glycidoxyalkyl group Chemical group 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000006606 n-butoxy group Chemical group 0.000 description 2
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000002923 oximes Chemical group 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- OTGGHZUEAWMAAK-UHFFFAOYSA-N (1,1-dimethoxy-1-phenyldecan-2-yl)benzene Chemical compound C1(=CC=CC=C1)C(C(OC)(OC)C1=CC=CC=C1)CCCCCCCC OTGGHZUEAWMAAK-UHFFFAOYSA-N 0.000 description 1
- ZYZZTJTXWRMMRA-UHFFFAOYSA-N (2,3,3,4,4-pentafluoro-1,1,1-trimethoxydecan-2-yl)benzene Chemical compound FC(C(C(C(OC)(OC)OC)(C1=CC=CC=C1)F)(F)F)(CCCCCC)F ZYZZTJTXWRMMRA-UHFFFAOYSA-N 0.000 description 1
- VJNSCINLGYURMF-UHFFFAOYSA-N 1,1,1-trichloro-2-methyldecane Chemical compound CCCCCCCCC(C)C(Cl)(Cl)Cl VJNSCINLGYURMF-UHFFFAOYSA-N 0.000 description 1
- AGGJWJFEEKIYOF-UHFFFAOYSA-N 1,1,1-triethoxydecane Chemical compound CCCCCCCCCC(OCC)(OCC)OCC AGGJWJFEEKIYOF-UHFFFAOYSA-N 0.000 description 1
- KSEOVJFZRVEFHT-UHFFFAOYSA-N 1,1,1-trifluoro-2-(trimethoxymethyl)decane Chemical compound FC(F)(F)C(C(OC)(OC)OC)CCCCCCCC KSEOVJFZRVEFHT-UHFFFAOYSA-N 0.000 description 1
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 1
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- HDPNBNXLBDFELL-UHFFFAOYSA-N 1,1,1-trimethoxyethane Chemical compound COC(C)(OC)OC HDPNBNXLBDFELL-UHFFFAOYSA-N 0.000 description 1
- NCRNCSZWOOYBQF-UHFFFAOYSA-N 1,1-Dimethoxydecane Chemical compound CCCCCCCCCC(OC)OC NCRNCSZWOOYBQF-UHFFFAOYSA-N 0.000 description 1
- HUDYANRNMZDQGA-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]ethanone Chemical compound CN(C)C1=CC=C(C(C)=O)C=C1 HUDYANRNMZDQGA-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- CCWGVKSAROFKKH-UHFFFAOYSA-N 1-hydroxyhexyl 3-methylbut-2-enoate Chemical compound CC(=CC(=O)OC(CCCCC)O)C CCWGVKSAROFKKH-UHFFFAOYSA-N 0.000 description 1
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- CEYHHQSTMVVZQP-UHFFFAOYSA-N 2-ethenoxyethanamine Chemical compound NCCOC=C CEYHHQSTMVVZQP-UHFFFAOYSA-N 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- SVIQBUBNVYWIDV-UHFFFAOYSA-N 2-methoxy-2-(2-methoxyphenyl)-1-phenylethanone Chemical compound C=1C=CC=C(OC)C=1C(OC)C(=O)C1=CC=CC=C1 SVIQBUBNVYWIDV-UHFFFAOYSA-N 0.000 description 1
- OWXRDALCCNTBRI-UHFFFAOYSA-N 2-methyl-1-(3-methylthiophen-2-yl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CSC(C(=O)C(C)(C)N2CCOCC2)=C1C OWXRDALCCNTBRI-UHFFFAOYSA-N 0.000 description 1
- CFSRYSNJOVVGIH-UHFFFAOYSA-N 3-(trichloromethyl)undec-1-ene Chemical compound C(=C)C(C(Cl)(Cl)Cl)CCCCCCCC CFSRYSNJOVVGIH-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- GNPSQUCXOBDIDY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane Chemical compound C(CCCCCCC)C(C(OC)(OC)OC)CCC GNPSQUCXOBDIDY-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- XCBWXLSZHRNZOS-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCC XCBWXLSZHRNZOS-UHFFFAOYSA-N 0.000 description 1
- DAANBQRKZYVAKA-UHFFFAOYSA-N C(=O)(C(=C)C)OC(C(OC)(OC)OC)(CCCCCCCC)CCC Chemical compound C(=O)(C(=C)C)OC(C(OC)(OC)OC)(CCCCCCCC)CCC DAANBQRKZYVAKA-UHFFFAOYSA-N 0.000 description 1
- CBGIVLMTXYBTAE-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OCC)(OCC)C)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OCC)(OCC)C)CCCCCCCC CBGIVLMTXYBTAE-UHFFFAOYSA-N 0.000 description 1
- NKVKSPVATWBKJL-UHFFFAOYSA-N C(C)C(C(OC(C)C)(OC(C)C)OC(C)C)CCCCCCCC Chemical compound C(C)C(C(OC(C)C)(OC(C)C)OC(C)C)CCCCCCCC NKVKSPVATWBKJL-UHFFFAOYSA-N 0.000 description 1
- CGJVSZKVBJDURV-UHFFFAOYSA-N C(C)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC Chemical compound C(C)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC CGJVSZKVBJDURV-UHFFFAOYSA-N 0.000 description 1
- HVZOCWYXJGLQHI-UHFFFAOYSA-N C(C1CO1)OCCCC(C(OCC)(OCC)CCC)CCCCCCCC Chemical compound C(C1CO1)OCCCC(C(OCC)(OCC)CCC)CCCCCCCC HVZOCWYXJGLQHI-UHFFFAOYSA-N 0.000 description 1
- MTDLVDBRMBSPBJ-UHFFFAOYSA-N C(C1CO1)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(C1CO1)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC MTDLVDBRMBSPBJ-UHFFFAOYSA-N 0.000 description 1
- GHTQBJZRHNNLIS-UHFFFAOYSA-N C(CCC)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(CCC)C(C(OC)(OC)OC)CCCCCCCC GHTQBJZRHNNLIS-UHFFFAOYSA-N 0.000 description 1
- JSGRIFNBTXDZQU-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OC)(OC)OC)CCCCCCCC JSGRIFNBTXDZQU-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- UFUYDYUQFXMKFB-UHFFFAOYSA-N CC(C(Cl)(Cl)C)CCCCCCCC Chemical compound CC(C(Cl)(Cl)C)CCCCCCCC UFUYDYUQFXMKFB-UHFFFAOYSA-N 0.000 description 1
- ZWFMTQIAJBRYJD-UHFFFAOYSA-N CC(C(N)(N)C)CCCCCCCC Chemical compound CC(C(N)(N)C)CCCCCCCC ZWFMTQIAJBRYJD-UHFFFAOYSA-N 0.000 description 1
- CFUYIPCYSLPPMS-UHFFFAOYSA-N CC(C(OC=CCC)(OC=CCC)OC=CCC)CCCCCCCC Chemical compound CC(C(OC=CCC)(OC=CCC)OC=CCC)CCCCCCCC CFUYIPCYSLPPMS-UHFFFAOYSA-N 0.000 description 1
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 1
- PZKBIVOXIFYDRI-UHFFFAOYSA-N CC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)OCC)CCCCCCCC PZKBIVOXIFYDRI-UHFFFAOYSA-N 0.000 description 1
- YUZGIPQAWWJBTO-UHFFFAOYSA-N CC(C(OCC1CO1)(OCC1CO1)OCC1CO1)CCCCCCCC Chemical compound CC(C(OCC1CO1)(OCC1CO1)OCC1CO1)CCCCCCCC YUZGIPQAWWJBTO-UHFFFAOYSA-N 0.000 description 1
- DJUZRLZFAOOONK-UHFFFAOYSA-N CC(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC Chemical compound CC(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC DJUZRLZFAOOONK-UHFFFAOYSA-N 0.000 description 1
- APLICIPKNDJONT-UHFFFAOYSA-N CC(C(OCCOCCOC(C(=C)C)=O)(OCCOCCOC(C(=C)C)=O)OCCOCCOC(C(=C)C)=O)CCCCCCCC Chemical compound CC(C(OCCOCCOC(C(=C)C)=O)(OCCOCCOC(C(=C)C)=O)OCCOCCOC(C(=C)C)=O)CCCCCCCC APLICIPKNDJONT-UHFFFAOYSA-N 0.000 description 1
- KOFKZXUKYHHISM-UHFFFAOYSA-N CC1(COC1)COCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound CC1(COC1)COCCCC(C(OC)(OC)OC)CCCCCCCC KOFKZXUKYHHISM-UHFFFAOYSA-N 0.000 description 1
- QHJSCTNRFWNYID-UHFFFAOYSA-N CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC QHJSCTNRFWNYID-UHFFFAOYSA-N 0.000 description 1
- PYKRRFPSMQECDC-UHFFFAOYSA-N CCC=COCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CCC=COCCCC(C(OCC)(OCC)OCC)CCCCCCCC PYKRRFPSMQECDC-UHFFFAOYSA-N 0.000 description 1
- MBASTQWFRLABAV-UHFFFAOYSA-N COC(C(OC)(OC)C)(CCCCCCCC)CCC.CCC=C Chemical compound COC(C(OC)(OC)C)(CCCCCCCC)CCC.CCC=C MBASTQWFRLABAV-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical class CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- XEEHRQPQNJOFIQ-UHFFFAOYSA-N N(C1=CC=CC=C1)CCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound N(C1=CC=CC=C1)CCCC(C(OC)(OC)OC)CCCCCCCC XEEHRQPQNJOFIQ-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 description 1
- KTGXWDZUZLWXOF-UHFFFAOYSA-N NCCNCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound NCCNCCCC(C(OC)(OC)C)CCCCCCCC KTGXWDZUZLWXOF-UHFFFAOYSA-N 0.000 description 1
- PEXBBTCNDBSFHT-UHFFFAOYSA-N NCCNCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCNCCCC(C(OC)(OC)OC)CCCCCCCC PEXBBTCNDBSFHT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- KFVPJMZRRXCXAO-UHFFFAOYSA-N [He].[O] Chemical compound [He].[O] KFVPJMZRRXCXAO-UHFFFAOYSA-N 0.000 description 1
- XVEUJTIZHZIHJM-UHFFFAOYSA-N a828782 Chemical compound CCOC(N)=O.CCOC(N)=O XVEUJTIZHZIHJM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- PXXJHWLDUBFPOL-UHFFFAOYSA-N benzamidine Chemical group NC(=N)C1=CC=CC=C1 PXXJHWLDUBFPOL-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000000649 benzylidene group Chemical group [H]C(=[*])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- WTVNFKVGGUWHQC-UHFFFAOYSA-N decane-2,4-dione Chemical compound CCCCCCC(=O)CC(C)=O WTVNFKVGGUWHQC-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- NORXUZMSXYUPAT-UHFFFAOYSA-N diazanium 2-methylprop-2-enoate Chemical compound [NH4+].[NH4+].CC(=C)C([O-])=O.CC(=C)C([O-])=O NORXUZMSXYUPAT-UHFFFAOYSA-N 0.000 description 1
- CKKXWJDFFQPBQL-UAIGNFCESA-N diazanium;(z)-but-2-enedioate Chemical compound [NH4+].[NH4+].[O-]C(=O)\C=C/C([O-])=O CKKXWJDFFQPBQL-UAIGNFCESA-N 0.000 description 1
- 125000004639 dihydroindenyl group Chemical group C1(CCC2=CC=CC=C12)* 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Chemical group C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- ILPNRWUGFSPGAA-UHFFFAOYSA-N heptane-2,4-dione Chemical compound CCCC(=O)CC(C)=O ILPNRWUGFSPGAA-UHFFFAOYSA-N 0.000 description 1
- DGCTVLNZTFDPDJ-UHFFFAOYSA-N heptane-3,5-dione Chemical compound CCC(=O)CC(=O)CC DGCTVLNZTFDPDJ-UHFFFAOYSA-N 0.000 description 1
- NDOGLIPWGGRQCO-UHFFFAOYSA-N hexane-2,4-dione Chemical compound CCC(=O)CC(C)=O NDOGLIPWGGRQCO-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005246 nonafluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- GJYXGIIWJFZCLN-UHFFFAOYSA-N octane-2,4-dione Chemical compound CCCCC(=O)CC(C)=O GJYXGIIWJFZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000004022 organic phosphonium compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- OGHBATFHNDZKSO-UHFFFAOYSA-N propan-2-olate Chemical compound CC(C)[O-] OGHBATFHNDZKSO-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- WMOVHXAZOJBABW-UHFFFAOYSA-N tert-butyl acetate Chemical compound CC(=O)OC(C)(C)C WMOVHXAZOJBABW-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000001712 tetrahydronaphthyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
本發明係關於一種於1層中含有有機成分與無機成分且表面側經無機化之有機無機複合體之形成用組合物。 The present invention relates to a composition for forming an organic-inorganic composite in which an organic component and an inorganic component are contained in one layer and the surface side is inorganicized.
本申請案係對在2015年4月24日提出申請之日本專利申請案第2015-089382號主張優先權,並將其內容援用於本文中。 The present application claims priority to Japanese Patent Application No. 2015-089382, filed on Apr. 24, 2015, the content of which is incorporated herein.
目前,作為市售品之矽烷系塗佈劑之原料,主要使用三官能之矽烷,藉由該三官能矽烷而形成具有適度之硬度與柔軟性之聚矽氧烷。然而,關於三官能矽烷之膜,硬塗性尚且不足,為了彌補該缺陷,藉由於三官能矽烷中混合四官能矽烷或膠體二氧化矽而補足,但若使膜變硬,則有變得容易開裂,而使密接性變差之問題。例如,作為矽烷系之塗佈劑,提出有含有具有環氧基之三官能烷氧基矽烷化合物之防污膜形成用組合物(例如參照專利文獻1)。 At present, as a raw material of a commercially available decane-based coating agent, a trifunctional decane is mainly used, and a polyfunctional siloxane having a moderate hardness and flexibility is formed by the trifunctional decane. However, the trifunctional decane film is not sufficiently hard-coating, and it is easy to compensate for this defect by mixing tetrafunctional decane or colloidal cerium oxide in trifunctional decane. However, if the film is hardened, it becomes easy. Cracking, which makes the adhesion worse. For example, a composition for forming an antifouling film containing a trifunctional alkoxydecane compound having an epoxy group is proposed as a coating agent for a decane-based coating (see, for example, Patent Document 1).
目前為止,本發明者等人提供一種藉由在感光性化合物之存在下對有機矽化合物照射紫外線,而使表面具有非常高之硬度,並且使內部及背面側具有適當之硬度,且與基材之密接性優異之有機無機複合體(專利文獻2),進而,提供一種藉由在聚矽氧烷系之有機無機複合體中調配作為紫外線硬化性樹脂之丙烯酸酯系樹脂,而使表面具有非常高之硬度,並且與基材之密接性及耐濕性優異之有機無機複合體(專利文獻3)。 Heretofore, the present inventors have provided a method of irradiating an organic ruthenium compound with ultraviolet rays in the presence of a photosensitive compound to have a surface having a very high hardness and having an appropriate hardness on the inner and back sides, and a substrate. The organic-inorganic composite having excellent adhesion (Patent Document 2) further provides an acrylate-based resin which is an ultraviolet curable resin in a polysiloxane-based organic-inorganic composite, and has a very excellent surface. An organic-inorganic composite which is high in hardness and excellent in adhesion to a substrate and moisture resistance (Patent Document 3).
[專利文獻1]日本專利特開平10-195417號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-195417
[專利文獻2]WO2006/088079號說明書 [Patent Document 2] WO2006/088079
[專利文獻3]WO2008/069217號說明書 [Patent Document 3] WO2008/069217 Specification
然而,由於先前之有機無機複合體包含作為矽烷醇縮合觸媒之金屬化合物或酸等,故而有於所形成之有機無機複合體產生源自金屬化合物之黃著色之問題。本發明之目的在於提供一種可形成保持表面硬度且與先前相比黃著色較少之有機無機複合體之有機無機複合體形成用組合物。 However, since the conventional organic-inorganic composite contains a metal compound or an acid or the like as a decyl alcohol condensation catalyst, there is a problem that the formed organic-inorganic composite produces yellow coloration derived from a metal compound. An object of the present invention is to provide a composition for forming an organic-inorganic composite which can form an organic-inorganic composite which maintains surface hardness and which has less yellow coloration than before.
本發明者為了解決上述課題而進行努力研究,結果發現:若使用聯苯醯縮二甲醇系光聚合起始劑作為光聚合起始劑,則不會引起因與作為矽烷醇縮合觸媒之金屬化合物之錯合物形成所導致之變質,於形成薄膜時可減少黃著色,從而完成本發明。 In order to solve the above problems, the inventors of the present invention have conducted intensive studies and found that when a biphenyl fluorenated dimethanol photopolymerization initiator is used as a photopolymerization initiator, it does not cause a metal due to condensation with a stanol. The deterioration caused by the formation of the complex of the compound can reduce the yellow coloration when the film is formed, thereby completing the present invention.
即,本發明係關於:(1)一種有機無機複合體形成用組合物,其含有:a)式(I)RnSiX4-n‧‧‧(I) That is, the present invention relates to: (1) A composition for forming an organic-inorganic composite, comprising: a) Formula (I) R n SiX 4-n ‧‧‧(I)
(式(I)中,R表示碳原子直接鍵結於式(I)中之Si上之有機基,X分別表示羥基或水解性基;n表示1或2,n為2時,各R可相同亦可不同,(4-n)為2以上時,各X可相同亦可不同)所表示,且i)包含式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比電磁線硬化性化合物之藉由Fedors之推算法所求出之溶解參數(SP2)小1.6以上之有機矽化合物(Si1)之至少1種之有機矽化合物及/或其縮 合物;或者ii)包含式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比電磁線硬化性化合物之藉由Fedors之推算法所求出之溶解參數(SP2)小1.6以上之有機矽化合物(Si1)之至少1種、與式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比上述溶解參數(SP2)小未達1.6或者等於或大於上述溶解參數(SP2)之有機矽化合物(Si2)之至少1種,且上述有機矽化合物(Si1)與上述有機矽化合物(Si2)之莫耳比Si1:Si2為5:5~10:0之有機矽化合物及/或其縮合物;b)選自由金屬錯合物、金屬有機酸鹽、具有2個以上之羥基或水解性基之金屬化合物、其等之水解物、及其等之縮合物所組成之群中之至少1種之對350nm以下之波長之光感應之感光性化合物;c)聯苯醯縮二甲醇系光聚合起始劑;及d)電磁線硬化性化合物;(2)如(1)中記載之有機無機複合體形成用組合物,其中感光性化合物之金屬為Ti、Al、Zr、或Sn;(3)如(1)或(2)中記載之有機無機複合體形成用組合物,其中聯苯醯縮二甲醇系光聚合起始劑為2,2'-二甲氧基-1,2-二苯基乙烷-1-酮;(4)如(1)或(2)中記載之有機無機複合體形成用組合物,其中電磁線硬化性化合物為(甲基)丙烯酸酯系化合物。 (In the formula (I), R represents an organic group in which a carbon atom is directly bonded to Si in the formula (I), and X represents a hydroxyl group or a hydrolyzable group; n represents 1 or 2, and when n is 2, each R may be The same or different, when (4-n) is 2 or more, each X may be the same or different), and i) contains the dissolution parameter of R in formula (I) by Fedors' push algorithm. (SP1) at least one organic ruthenium compound of the organic ruthenium compound (Si1) having a dissolution parameter (SP2) of 1.6 or more, which is determined by the Fedors' push algorithm, and/or its shrinkage Or ii) a dissolution parameter (SP1) obtained by the Fedors method of R in the formula (I), and a dissolution parameter obtained by a Fedors algorithm of the electromagnet-curable compound ( SP2) at least one of the organic ruthenium compound (Si1) having a size of 1.6 or more, and the dissolution parameter (SP1) obtained by the Fedors algorithm of R in the formula (I) is smaller than the above dissolution parameter (SP2). At least one of the organic cerium compound (Si2) having a solubility parameter (SP2) of 1.6 or more, and the molar ratio of the organic cerium compound (Si1) to the organic cerium compound (Si2) of Si1:Si2 is 5: 5~10:0 organic hydrazine compound and/or its condensate; b) selected from metal complexes, metal organic acid salts, metal compounds having two or more hydroxyl groups or hydrolyzable groups, hydrolyzates thereof, Photosensitive compound of at least one of the group consisting of condensates thereof and the like for light having a wavelength of 350 nm or less; c) a biphenyl condensed dimethanol photopolymerization initiator; and d) electromagnetic wire hardening (2) The composition for forming an organic-inorganic composite according to (1), wherein the metal of the photosensitive compound is T (3) The composition for forming an organic-inorganic composite according to (1) or (2), wherein the biphenyl quinone dimethanol photopolymerization initiator is 2, 2' The composition for forming an organic-inorganic composite according to the above aspect (1) or (2), wherein the electromagnet curable compound is (Meth) acrylate compound.
進而,本發明係關於:(5)一種積層體,其係於基材塗佈如(1)至(4)中任一項記載之有機無機複合體形成用組合物所獲得。 Furthermore, the present invention relates to a (5) laminated body obtained by coating the composition for organic-inorganic composite formation according to any one of (1) to (4).
根據本發明,可提供一種與基材之密接性、耐熱黃變性、及耐光黃變性優異且具有較高之表面硬度與透明性之有機無機複合體。 According to the present invention, it is possible to provide an organic-inorganic composite which is excellent in adhesion to a substrate, heat-resistant yellowing, and yellowing resistance, and has high surface hardness and transparency.
(1)有機矽化合物及/或其縮合物 (1) Organic hydrazine compound and/or its condensate
本發明之有機矽化合物係包含以下之式(I)所表示之有機矽化合物之至少1種以上之有機矽化合物。又,本發明之有機矽化合物之縮合物係指有機矽化合物彼此進行水解縮合而形成有矽氧烷鍵之二聚物等。 The organic ruthenium compound of the present invention contains at least one organic ruthenium compound of the organic ruthenium compound represented by the following formula (I). Further, the condensate of the organic hydrazine compound of the present invention means a dimer obtained by hydrolyzing and condensing an organic hydrazine compound to form a decane bond.
RnSiX4-n‧‧‧(I) R n SiX 4-n ‧‧‧(I)
式(I)中,R表示碳原子直接鍵結於式(I)中之Si上之有機基,X分別表示羥基或水解性基。n表示1或2,n為2時,各R可相同亦可不同,(4-n)為2以上時,各X可相同亦可不同。 In the formula (I), R represents an organic group in which a carbon atom is directly bonded to Si in the formula (I), and X represents a hydroxyl group or a hydrolyzable group, respectively. n represents 1 or 2, and when n is 2, each R may be the same or different, and when (4-n) is 2 or more, each X may be the same or different.
此處,作為R所表示之「碳原子直接鍵結於Si上之有機基」,可列舉「可經取代之烴基」或「包含聚合物部分之烴基」。 Here, examples of the "organic group in which a carbon atom is directly bonded to Si" include a "hydrocarbon group which may be substituted" or a "hydrocarbon group containing a polymer moiety".
作為上述「可經取代之烴基」之烴基,通常為碳數1~30之烴基,例如可列舉:烷基、環烷基、烯基、環烯基、炔基、環烷基烷基、芳基、芳基烷基、芳基烯基等。 The hydrocarbon group of the above-mentioned "hydrocarbon group which may be substituted" is usually a hydrocarbon group having 1 to 30 carbon atoms, and examples thereof include an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, a cycloalkylalkyl group, and an aromatic group. Alkyl, arylalkyl, arylalkenyl, and the like.
較佳為碳數1~10之烷基、碳數3~8之環烷基、碳數2~10之烯基、碳數3~8之環烯基、碳數2~10之炔基。 Preferred are an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 8 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkenyl group having 3 to 8 carbon atoms, and an alkynyl group having 2 to 10 carbon atoms.
又,上述「烴基」亦可含有氧原子、氮原子、或矽原子。 Further, the above "hydrocarbon group" may contain an oxygen atom, a nitrogen atom or a ruthenium atom.
作為「碳數1~10之烷基」,具體而言,可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正戊基、異戊基、新戊基、正己基、異己基、正庚基、正辛基、正壬基、異壬基、正癸基等。 Specific examples of the "alkyl group having 1 to 10 carbon atoms" include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and a n-pentyl group. Isoamyl, neopentyl, n-hexyl, isohexyl, n-heptyl, n-octyl, n-decyl, isodecyl, n-decyl and the like.
作為「碳數3~8之環烷基」,具體而言,可列舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基等。 Specific examples of the "cycloalkyl group having 3 to 8 carbon atoms" include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a cyclooctyl group.
作為「碳數2~10之烯基」,具體而言,可列舉:乙烯基、1-丙烯-1-基、2-丙烯-1-基、1-丙烯-2-基、1-丁烯-1-基、2-丁烯-1-基、3-丁烯-1-基、1-丁烯-2-基、3-丁烯-2-基、1-戊烯-1-基、4-戊烯-1-基、1-戊烯-2-基、4-戊烯-2-基、3-甲基-1-丁烯-1-基、1-己烯-1-基、5-己烯-1-基、1-庚烯-1-基、6-庚烯-1-基、1-辛烯-1-基、7-辛烯-1-基等。 Specific examples of the "alkenyl group having 2 to 10 carbon atoms" include a vinyl group, a 1-propen-1-yl group, a 2-propen-1-yl group, a 1-propen-2-yl group, and a 1-butene group. -1-yl, 2-buten-1-yl, 3-buten-1-yl, 1-buten-2-yl, 3-but-2-yl, 1-penten-1-yl, 4-penten-1-yl, 1-penten-2-yl, 4-penten-2-yl, 3-methyl-1-buten-1-yl, 1-hexen-1-yl, 5-hexen-1-yl, 1-hepten-1-yl, 6-hepten-1-yl, 1-octen-1-yl, 7-octene-1-yl and the like.
作為「碳數3~8之環烯基」,具體而言,可列舉:1-環戊烯-1-基、2-環戊烯-1-基、1-環己烯-1-基、2-環己烯-1-基、3-環己烯-1-基等。 Specific examples of the "cycloalkenyl group having 3 to 8 carbon atoms" include 1-cyclopenten-1-yl group, 2-cyclopenten-1-yl group, and 1-cyclohexen-1-yl group. 2-cyclohexen-1-yl, 3-cyclohexen-1-yl and the like.
作為「碳數2~10之炔基」,具體而言,可列舉:乙炔基、1-丙炔-1-基、2-丙炔-1-基、1-丁炔-1-基、3-丁炔-1-基、1-戊炔-1-基、4-戊炔-1-基、1-己炔-1-基、5-己炔-1-基、1-庚炔-1-基、1-辛炔-1-基、7-辛炔-1-基等。 Specific examples of the "alkynyl group having 2 to 10 carbon atoms" include an ethynyl group, a 1-propyn-1-yl group, a 2-propyn-1-yl group, a 1-butyn-1-yl group, and 3 -butyn-1-yl, 1-pentyn-1-yl, 4-pentyn-1-yl, 1-hexyn-1-yl, 5-hexyn-1-yl, 1-heptyne-1 -yl, 1-octyn-1-yl, 7-octyn-1-yl and the like.
作為「環烷基烷基」,可列舉碳數3~10之環烷基與碳數1~10之烷基鍵結而成之基。 Examples of the "cycloalkylalkyl group" include a group in which a cycloalkyl group having 3 to 10 carbon atoms is bonded to an alkyl group having 1 to 10 carbon atoms.
「芳基」意指單環或多環之芳基,於多環芳基之情形時,除完全不飽和環以外,亦包含具有部分飽和環之基。具體而言,可列舉:苯基、萘基、薁基、茚基、二氫茚基、四氫萘基等,較佳為碳數6~10之芳基。 "Aryl" means a monocyclic or polycyclic aryl group, and in the case of a polycyclic aryl group, in addition to a fully unsaturated ring, a group having a partially saturated ring. Specific examples thereof include a phenyl group, a naphthyl group, an anthracenyl group, an anthracenyl group, a dihydroindenyl group, and a tetrahydronaphthyl group, and an aryl group having 6 to 10 carbon atoms is preferable.
作為「芳基烷基」,可列舉碳數6~10之芳基與碳數1~10之烷基鍵結而成之基。 Examples of the "arylalkyl group" include a group in which an aryl group having 6 to 10 carbon atoms is bonded to an alkyl group having 1 to 10 carbon atoms.
作為「芳基烯基」,可列舉碳數6~10之芳基與碳數2~10之烯基鍵結而成之基。 Examples of the "arylalkenyl group" include a group in which an aryl group having 6 to 10 carbon atoms is bonded to an alkenyl group having 2 to 10 carbon atoms.
作為「具有氧原子之烴基」,可列舉:烷氧基烷基;環氧基、環氧烷基、縮水甘油氧基烷基等具有環氧乙烷環(環氧基)之基;丙烯醯氧基甲基、甲基丙烯醯氧基甲基等。 Examples of the "hydrocarbon group having an oxygen atom" include an alkoxyalkyl group; a group having an oxirane ring (epoxy group) such as an epoxy group, an alkylene oxide group or a glycidoxyalkyl group; and an acrylonitrile group; Oxymethyl group, methacryloxymethyl group, and the like.
此處,作為「烷氧基烷基」,可列舉碳數1~6之烷氧基與碳數1 ~6之烷基鍵結而成之基。具體而言,可列舉:甲氧基甲基、甲氧基丙基、乙氧基乙基、乙氧基丁基等。 Here, examples of the "alkoxyalkyl group" include alkoxy groups having 1 to 6 carbon atoms and carbon number 1. The alkyl group of ~6 is bonded to the base. Specific examples thereof include a methoxymethyl group, a methoxypropyl group, an ethoxyethyl group, and an ethoxybutyl group.
作為「環氧烷基」,較佳為碳數3~10之環氧烷基,具體而言,可列舉:縮水甘油基、縮水甘油基甲基、2-縮水甘油基乙基、3-縮水甘油基丙基、4-縮水甘油基丁基、3,4-環氧丁基、4,5-環氧戊基、5,6-環氧己基等包含環氧基之直鏈狀之烷基;β-甲基縮水甘油基、β-乙基縮水甘油基、β-丙基縮水甘油基、2-縮水甘油基丙基、2-縮水甘油基丁基、3-縮水甘油基丁基、2-甲基-3-縮水甘油基丙基、3-甲基-2-縮水甘油基丙基、3-甲基-3,4-環氧丁基、3-乙基-3,4-環氧丁基、4-甲基-4,5-環氧戊基、5-甲基-5,6-環氧己基等包含環氧基之支鏈狀之烷基等。 The "alkylene oxide group" is preferably an alkylene oxide group having 3 to 10 carbon atoms, and specific examples thereof include glycidyl group, glycidylmethyl group, 2-glycidylethyl group, and 3-condensed water. a linear alkyl group containing an epoxy group such as glycerylpropyl group, 4-glycidylbutyl group, 3,4-epoxybutyl group, 4,5-epoxypentyl group, 5,6-epoxyhexyl group or the like ; β-methyl glycidyl, β-ethyl glycidyl, β-propyl glycidyl, 2-glycidylpropyl, 2-glycidylbutyl, 3-glycidylbutyl, 2 -methyl-3-glycidylpropyl, 3-methyl-2-glycidylpropyl, 3-methyl-3,4-epoxybutyl, 3-ethyl-3,4-epoxy A branched alkyl group containing an epoxy group, such as a butyl group, a 4-methyl-4,5-epoxypentyl group or a 5-methyl-5,6-epoxyhexyl group.
作為縮水甘油氧基烷基,具體而言,可列舉:縮水甘油氧基甲基、縮水甘油氧基丙基等。 Specific examples of the glycidoxyalkyl group include a glycidoxymethyl group and a glycidoxypropyl group.
作為「具有氮原子之烴基」,可列舉:具有-NR'2(式中,R'表示氫原子、烷基或芳基,各R'可相互相同亦可不同)之烴基、或具有-N=CR"2(式中,R"表示氫原子、烷基、或芳基,各R"可相互相同亦可不同)之烴基。 The "hydrocarbon group having a nitrogen atom" may be a hydrocarbon group having -NR' 2 (wherein R' represents a hydrogen atom, an alkyl group or an aryl group, and each R' may be the same or different), or has -N =CR" 2 (wherein R" represents a hydrogen atom, an alkyl group, or an aryl group, and each R" may be the same or different).
例如,作為具有-NR'2之烴基,具體而言,可列舉:胺基甲基、1-胺基乙基、N-甲基胺基甲基等。作為具有-N=CR"2之基,具體而言,可列舉:-CH2N=CHCH3基、-CH2N=C(CH3)2基、-CH2CH2N=CHCH3基、-CH2N=CHPh基、-CH2N=C(Ph)CH3基等。 For example, examples of the hydrocarbon group having -NR' 2 include an aminomethyl group, a 1-aminoethyl group, and an N-methylaminomethyl group. Specific examples of the group having -N=CR" 2 include -CH 2 N=CHCH 3 group, -CH 2 N=C(CH 3 ) 2 group, and -CH 2 CH 2 N=CHCH 3 group. , -CH 2 N=CHPh group, -CH 2 N=C(Ph)CH 3 group, and the like.
作為上述「可經取代」之取代基,可列舉:鹵基、烷基、烯基、芳基、烷氧基、環氧基、縮水甘油氧基、丙烯醯氧基、甲基丙烯醯氧基、具有-NR'2之基(式中,R'表示氫原子、烷基或芳基,各R'可相互相同亦可不同)等。 Examples of the substituent which may be substituted include a halogen group, an alkyl group, an alkenyl group, an aryl group, an alkoxy group, an epoxy group, a glycidoxy group, an acryloxy group, and a methacryloxy group. And a group having -NR' 2 (wherein R' represents a hydrogen atom, an alkyl group or an aryl group, and each R' may be the same or different) or the like.
詳細而言,作為上述「可經取代」之取代基,可列舉:鹵基、 碳數1~10之烷基、碳數2~10之烯基、碳數6~10之芳基、碳數1~6之烷氧基、環氧基、縮水甘油氧基、丙烯醯氧基、甲基丙烯醯氧基、具有-NR'2之基(式中,R'表示氫原子、碳數1~10之烷基或碳數6~10之芳基,各R'可相互相同亦可不同)等。作為烷基、烯基、芳基,可列舉與R中者相同之烴基。 Specifically, examples of the substituent which may be substituted include a halogen group, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, and a carbon number. 1 to 6 alkoxy group, epoxy group, glycidoxy group, acryloxy group, methacryloxy group, and group having -NR' 2 (wherein R' represents a hydrogen atom, a carbon number of 1~ 10 alkyl or carbon 6 to 10 aryl, each R' may be the same or different) and the like. Examples of the alkyl group, the alkenyl group and the aryl group include the same hydrocarbon groups as those of R.
作為「碳數1~6之烷氧基」,具體而言,可列舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第三丁氧基、正戊氧基、異戊氧基、新戊氧基、正己氧基、異己氧基等。 Specific examples of the "alkoxy group having 1 to 6 carbon atoms" include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a n-butoxy group, an isobutoxy group, and a third group. Butoxy, n-pentyloxy, isopentyloxy, neopentyloxy, n-hexyloxy, isohexyloxy and the like.
作為「鹵基」,具體而言,可列舉:氟基、氯基、溴基、碘基等。 Specific examples of the "halogen group" include a fluorine group, a chlorine group, a bromine group, and an iodine group.
上述中,就有機無機複合體之表面之無機化之觀點而言,乙烯基、具有環氧乙烷環(環氧基)之基、具有-NR'2之基、或具有-N=CR"2之基為較佳之基。 In the above, from the viewpoint of the inorganication of the surface of the organic-inorganic composite, a vinyl group, a group having an oxirane ring (epoxy group), a group having -NR' 2 or having -N=CR" 2 is a preferred group of the group.
又,式(I)中,n表示1或2,尤佳為n為1者。n為2時,各R可相同亦可不同。 Further, in the formula (I), n represents 1 or 2, and particularly preferably n is 1. When n is 2, each R may be the same or different.
於式(I)中,X表示羥基或水解性基。式(I)之(4-n)為2以上時,各X可相同亦可不同。所謂水解性基,例如意指藉由於無觸媒、過量之水之共存下,於25℃~100℃下加熱,可進行水解而生成矽烷醇基之基或可形成矽氧烷縮合物之基,可列舉烷氧基、醯氧基、鹵基、異氰酸酯基、胺基或取代胺基等,較佳為碳數1~4之烷氧基或碳數1~6之醯氧基。 In the formula (I), X represents a hydroxyl group or a hydrolyzable group. When (4-n) of the formula (I) is 2 or more, each X may be the same or different. The hydrolyzable group means, for example, a base which can be hydrolyzed to form a stanol group or a base of a siloxane condensate by heating at 25 to 100 ° C in the coexistence of no catalyst or excess water. The alkoxy group, the decyloxy group, the halogen group, the isocyanate group, the amine group or the substituted amine group may, for example, be preferably an alkoxy group having 1 to 4 carbon atoms or a decyloxy group having 1 to 6 carbon atoms.
作為「碳數1~4之烷氧基」,具體而言,可列舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第三丁氧基等。 Specific examples of the "alkoxy group having 1 to 4 carbon atoms" include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a n-butoxy group, an isobutoxy group, and a third group. Butoxy and the like.
作為「碳數1~6之醯氧基」(其中,碳數中不包含羰基之碳),具體而言,可列舉:乙醯氧基、苯甲醯氧基等。 Specific examples of the "oxyl group having 1 to 6 carbon atoms" (wherein the carbon number does not include a carbonyl group) include an ethoxycarbonyl group and a benzamidine group.
作為「鹵基」,具體而言,可列舉:氟基、氯基、溴基、碘基等。 Specific examples of the "halogen group" include a fluorine group, a chlorine group, a bromine group, and an iodine group.
作為式(1)所表示之有機矽化合物,具體而言,可列舉:甲基三氯矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三丁氧基矽烷、乙基三甲氧基矽烷、乙基三異丙氧基矽烷、乙基三丁氧基矽烷、丁基三甲氧基矽烷、五氟苯基三甲氧基矽烷、苯基三甲氧基矽烷、九氟丁基乙基二甲氧基矽烷、三氟甲基三甲氧基矽烷、二甲基二胺基矽烷、二甲基二氯矽烷、二甲基二乙醯氧基矽烷、二甲基二甲氧基矽烷、二苯基二甲氧基矽烷、二丁基二甲氧基矽烷、乙烯基三甲氧基矽烷、3-(甲基)丙烯醯氧基正丙基三甲氧基矽烷、3-(3-甲基-3-氧雜環丁烷甲氧基)正丙基三甲氧基矽烷、4-氧雜環己基三甲氧基矽烷、甲基三[(甲基)丙烯醯氧基]矽烷、甲基三[2-(甲基)丙烯醯氧基乙氧基]矽烷、甲基-三縮水甘油氧基矽烷、甲基三(3-甲基-3-氧雜環丁烷甲氧基)矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基正丙基三甲氧基矽烷、3-縮水甘油氧基正丙基甲基二乙氧基矽烷、3-縮水甘油氧基正丙基三乙氧基矽烷、對苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、3-苯胺基丙基三甲氧基矽烷等。 Specific examples of the organic phosphonium compound represented by the formula (1) include methyltrichlorodecane, methyltrimethoxydecane, methyltriethoxydecane, methyltributoxydecane, and ethyl. Trimethoxy decane, ethyl triisopropoxy decane, ethyl tributoxy decane, butyl trimethoxy decane, pentafluorophenyl trimethoxy decane, phenyl trimethoxy decane, nonafluorobutyl B Dimethoxy decane, trifluoromethyl trimethoxy decane, dimethyl diamino decane, dimethyl dichloro decane, dimethyl diethoxy decane, dimethyl dimethoxy decane, Diphenyldimethoxydecane, dibutyldimethoxydecane, vinyltrimethoxydecane, 3-(methyl)propenyloxyn-propyltrimethoxydecane, 3-(3-methyl 3-oxetanyl methoxy)-n-propyltrimethoxydecane, 4-oxecyclohexyltrimethoxydecane, methyltris[(methyl)propenyloxy]decane, methyltri [ 2-(Methyl)acryloxyethoxyethoxy]decane, methyl-triglycidoxydecane, methyltris(3-methyl-3-oxetanemethoxy)decane, vinyl Trichlorodecane, B Triethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-glycidoxy-n-propyltrimethoxydecane, 3-glycidoxy-propyl-propyl Diethoxy decane, 3-glycidoxy n-propyl triethoxy decane, p-styryl trimethoxy decane, 3-methyl propylene methoxy propyl methyl dimethoxy decane, 3 -Methacryloxypropylmethyldiethoxydecane, 3-methylpropenyloxypropyltriethoxydecane, N-(2-aminoethyl)-3-aminopropyl Methyldimethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, N-(2-aminoethyl)-3-aminopropyltriethoxy Baseline, 3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, 3-triethoxydecyl-N-(1,3-dimethyl-butylene)propane Alkylamine, 3-anilinopropyltrimethoxydecane, and the like.
所謂R為包含聚合物部分之烴基之有機矽化合物,係表示使具有聚合性官能基之有機矽化合物視需要與其他具有聚合性官能基之單體進行共聚合所獲得之聚合物,可列舉:使3-甲基丙烯醯氧基丙基三甲氧基矽烷與甲基丙烯酸甲酯、甲基丙烯酸丁酯等甲基丙烯酸酯、或甲基丙烯酸等進行共聚合所獲得之聚合物等。 The organic ruthenium compound in which R is a hydrocarbon group containing a polymer moiety is a polymer obtained by copolymerizing an organic ruthenium compound having a polymerizable functional group with another monomer having a polymerizable functional group, and examples thereof include: A polymer obtained by copolymerizing 3-methacryloxypropyltrimethoxydecane with a methacrylate such as methyl methacrylate or butyl methacrylate or methacrylic acid or the like.
又,作為R為包含聚合物部分之烴基之有機矽化合物之另一例,係表示利用高分子反應導入有機矽部分所獲得之聚合物,可列舉:使聚甲基丙烯酸與3-縮水甘油氧基丙基三甲氧基矽烷反應而於側鏈導入有烷氧基矽烷部位之聚合物、藉由利用三甲氧基氫矽烷等之矽氫化而於1,2-聚丁二烯側鏈雙鍵導入有矽烷基之聚合物等。 Further, another example of the organic ruthenium compound in which R is a hydrocarbon group containing a polymer moiety is a polymer obtained by introducing an organic oxime moiety by a polymer reaction, and examples thereof include polymethacrylic acid and 3-glycidoxy group. a polymer obtained by reacting propyltrimethoxydecane with alkoxy decane in a side chain, and introducing a 1,2-polybutadiene side chain double bond by hydrogenation using trimethylhydrohydrohalane or the like a polymer of a decyl group or the like.
作為能夠與具有聚合性官能基之有機矽化合物聚合之單體,具體而言,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯等(甲基)丙烯酸酯;(甲基)丙烯酸、伊康酸、反丁烯二酸等羧酸及順丁烯二酸酐等酸酐;(甲基)丙烯酸縮水甘油酯等環氧化合物;(甲基)丙烯酸二乙基胺基乙酯、胺基乙基乙烯醚等胺基化合物;(甲基)丙烯醯胺、伊康酸二醯胺、α-乙基丙烯醯胺、巴豆醯胺、反丁烯二酸二醯胺、順丁烯二酸二醯胺、N-丁氧基甲基(甲基)丙烯醯胺等醯胺化合物;丙烯腈、苯乙烯、α-甲基苯乙烯、氯乙烯、乙酸乙烯酯、丙酸乙烯酯、雙酚A型環氧樹脂、酚系酚醛清漆型環氧樹脂、異氰尿酸三縮水甘油酯等。 Specific examples of the monomer capable of polymerizing the organic ruthenium compound having a polymerizable functional group include methyl (meth)acrylate, ethyl (meth)acrylate, and butyl (meth)acrylate. (meth) acrylate such as 2-ethylhexyl acrylate or cyclohexyl (meth) acrylate; carboxylic acid and maleic anhydride such as (meth)acrylic acid, itaconic acid, and fumaric acid An acid anhydride; an epoxy compound such as glycidyl (meth)acrylate; an amine compound such as diethylaminoethyl (meth)acrylate or aminoethyl vinyl ether; (meth) acrylamide, Ikon Diamine, α-ethyl acrylamide, crotonamide, diammonium methacrylate, diammonium maleate, N-butoxymethyl (meth) acrylamide, etc. Indoleamine compound; acrylonitrile, styrene, α-methylstyrene, vinyl chloride, vinyl acetate, vinyl propionate, bisphenol A epoxy resin, phenolic novolac epoxy resin, isocyanuric acid Glycidyl ester and the like.
又,作為能夠藉由高分子反應而導入有機矽部分之聚合物,具體而言,可列舉:聚(甲基)丙烯酸、對羥基苯乙烯、聚丁二烯等。 In addition, examples of the polymer which can be introduced into the organic oxime portion by a polymer reaction include poly(meth)acrylic acid, p-hydroxystyrene, and polybutadiene.
有機矽化合物及/或其縮合物之調配量係相對於有機矽化合物及/或其縮合物、感光性化合物、光聚合起始劑、及電磁線硬化性化合物之全部固形物成分,為2~98質量%,較佳為5~50質量%,更佳為5~30質量%。 The amount of the organic ruthenium compound and/or the condensate thereof is 2% to the total solid content of the organic ruthenium compound and/or its condensate, the photosensitive compound, the photopolymerization initiator, and the electromagnet curable compound. 98% by mass, preferably 5 to 50% by mass, more preferably 5 to 30% by mass.
又,有機矽化合物之縮合物之平均粒徑較佳為2nm~100nm,更佳為5nm~30nm。於平均粒徑大於100nm之情形時,形成用組合物本身變得不穩定而變得容易凝膠化,且所獲得之有機無機複合體白濁。於平均粒徑小於2nm之情形時,有對塗膜性造成不良影響之情形。 Further, the average particle diameter of the condensate of the organic cerium compound is preferably from 2 nm to 100 nm, more preferably from 5 nm to 30 nm. When the average particle diameter is more than 100 nm, the composition for formation itself becomes unstable and becomes easy to gel, and the obtained organic-inorganic composite is cloudy. When the average particle diameter is less than 2 nm, there is a case where the film properties are adversely affected.
(2)感光性化合物 (2) Photosensitive compounds
本發明之感光性化合物係選自由金屬錯合物、金屬有機酸鹽、具有2個以上之羥基或水解性基之金屬化合物、其等之水解物、及其等之縮合物所組成之群中之至少1種之對350nm以下之波長之光感應之感光性化合物。 The photosensitive compound of the present invention is selected from the group consisting of a metal complex, a metal organic acid salt, a metal compound having two or more hydroxyl groups or a hydrolyzable group, a hydrolyzate thereof, and the like, and the like. At least one photosensitive compound that induces light at a wavelength of 350 nm or less.
本發明之感光性化合物催化矽烷醇縮合而有助於有機矽化合物之縮合。 The photosensitive compound of the present invention catalyzes the condensation of stanol to contribute to the condensation of the organic hydrazine compound.
所謂350nm以下之波長之光,係指使用以350nm以下之任一種波長之光作為成分之光源而成之光,較佳為使用以350nm以下之任一種波長之光作為主成分之光源而成之光、即使用成分量最多之波長為350nm以下之光源而成之光。 The light having a wavelength of 350 nm or less is light using a light source having a wavelength of 350 nm or less as a component, and is preferably a light source using light having a wavelength of 350 nm or less as a main component. Light, that is, light obtained by using a light source having a wavelength of 350 nm or less.
作為上述金屬錯合物,較佳為具有羥基或水解性基之金屬錯合物,更佳為具有2個以上之羥基或水解性基之金屬錯合物。再者,所謂具有2個以上之羥基或水解性基,意指水解性基及羥基之合計為2個以上。又,作為上述金屬錯合物,較佳為β-酮羰基化合物、β-酮酯化合物、及α-羥基酯化合物配位而成之化合物,具體而言,可列舉:乙醯乙酸甲酯、乙醯乙酸正丙酯、乙醯乙酸異丙酯、乙醯乙酸正丁酯、乙醯乙酸第二丁酯、乙醯乙酸第三丁酯等β-酮酯類;乙醯丙酮、己烷-2,4-二酮、庚烷-2,4-二酮、庚烷-3,5-二酮、辛烷-2,4-二酮、壬烷-2,4-二酮、5-甲基-己烷-2,4-二酮等β-二酮類;乙醇酸、乳酸等羥基羧酸等配位而成之化合物。 The metal complex compound is preferably a metal complex having a hydroxyl group or a hydrolyzable group, and more preferably a metal complex having two or more hydroxyl groups or hydrolyzable groups. In addition, the term "having two or more hydroxyl groups or a hydrolyzable group" means that the total of the hydrolyzable group and the hydroxyl group is two or more. Further, the metal complex is preferably a compound in which a β-ketocarbonyl compound, a β-ketoester compound, and an α-hydroxyester compound are coordinated, and specific examples thereof include methyl ethyl acetate. Β-ketoesters such as n-propyl acetate, isopropyl acetate, n-butyl acetate, second butyl acetate, and tert-butyl acetate; acetonitrile, hexane- 2,4-dione, heptane-2,4-dione, heptane-3,5-dione, octane-2,4-dione, decane-2,4-dione, 5-A A β-diketone such as a hexane-hexane-2,4-dione; a compound obtained by coordination of a hydroxycarboxylic acid such as glycolic acid or lactic acid.
上述金屬有機酸鹽係由金屬離子與有機酸所獲得之鹽,作為有機酸,可列舉:乙酸、草酸、酒石酸、苯甲酸等羧酸類;磺酸、亞磺酸等含硫有機酸;酚化合物;烯醇化合物;肟化合物;醯亞胺化合物;芳香族磺醯胺等顯現酸性之有機化合物。 The metal organic acid salt is a salt obtained from a metal ion and an organic acid, and examples of the organic acid include carboxylic acids such as acetic acid, oxalic acid, tartaric acid, and benzoic acid; sulfur-containing organic acids such as sulfonic acid and sulfinic acid; and phenolic compounds; An enol compound; an anthracene compound; a quinone imine compound; an aromatic sulfonamide or the like which exhibits an acidic organic compound.
又,上述具有2個以上之羥基或水解性基之金屬化合物係除上述金屬錯合物及上述金屬有機酸鹽以外者,例如可列舉:金屬氫氧化 物、或金屬正丙氧化物、金屬異丙氧化物、金屬正丁氧化物等金屬醇化物等。 Further, the metal compound having two or more hydroxyl groups or hydrolyzable groups is, in addition to the metal complex and the metal organic acid salt, for example, metal hydroxide a metal alkoxide such as metal n-propoxide, metal isopropoxide or metal n-butoxide.
作為上述金屬錯合物、上述金屬有機酸鹽、或上述具有2個以上之羥基或水解性基之金屬化合物中之水解性基,例如可列舉:烷氧基、醯氧基、鹵基、異氰酸酯基,較佳為碳數1~4之烷氧基、碳數1~4之醯氧基。再者,所謂具有2個以上之羥基或水解性基,意指水解性基及羥基之合計為2個以上。 Examples of the hydrolyzable group in the metal complex, the metal organic acid salt, or the metal compound having two or more hydroxyl groups or hydrolyzable groups include alkoxy groups, decyloxy groups, halogen groups, and isocyanates. The group is preferably an alkoxy group having 1 to 4 carbon atoms and a decyloxy group having 1 to 4 carbon atoms. In addition, the term "having two or more hydroxyl groups or a hydrolyzable group" means that the total of the hydrolyzable group and the hydroxyl group is two or more.
作為具有2個以上之羥基或水解性基之金屬化合物之水解物及/或縮合物,較佳為相對於具有2個以上之羥基或水解性基之金屬化合物1莫耳,使用0.5莫耳以上之水進行水解而成者,更佳為使用0.5~2莫耳之水進行水解而成者。 The hydrolyzate and/or condensate of the metal compound having two or more hydroxyl groups or hydrolyzable groups is preferably 0.5 mol or more with respect to the metal compound 1 mol having two or more hydroxyl groups or hydrolyzable groups. The water is hydrolyzed, and it is more preferably hydrolyzed using 0.5 to 2 moles of water.
又,作為金屬錯合物之水解物及/或縮合物,較佳為相對於金屬錯合物1莫耳,使用5~100莫耳之水進行水解而成者,更佳為使用5~20莫耳之水進行水解而成者。 Further, the hydrolyzate and/or condensate of the metal complex is preferably hydrolyzed with 5 to 100 moles of water per mole of the metal complex 1 mol, more preferably 5 to 20 The water of Moer is hydrolyzed.
又,作為金屬有機酸鹽之水解物及/或縮合物,較佳為相對於金屬有機酸鹽1莫耳,使用5~100莫耳之水進行水解而成者,更佳為使用5~20莫耳之水進行水解而成者。 Further, the hydrolyzate and/or condensate of the metal organic acid salt is preferably hydrolyzed with 5 to 100 moles of water relative to the metal organic acid salt 1 mol, more preferably 5 to 20 The water of Moer is hydrolyzed.
又,作為該等金屬錯合物、金屬有機酸鹽、或具有2個以上之羥基或水解性基之金屬化合物中之金屬,可列舉:鈦(Ti)、鋯(Zr)、鋁(Al)、矽(Si)、鍺(Ge)、銦(In)、錫(Sn)、鉭(Ta)、鋅(Zn)、鎢(W)、鉛(Pb)等,該等中,較佳為鈦(Ti)、鋁(Al)、鋯(Zr)、錫(Sn),尤佳為鈦(Ti)。該等可單獨使用一種,亦可使用兩種以上。 Further, examples of the metal in the metal complex, the metal organic acid salt, or the metal compound having two or more hydroxyl groups or hydrolyzable groups include titanium (Ti), zirconium (Zr), and aluminum (Al). , bismuth (Si), germanium (Ge), indium (In), tin (Sn), tantalum (Ta), zinc (Zn), tungsten (W), lead (Pb), etc., among which titanium is preferred. (Ti), aluminum (Al), zirconium (Zr), tin (Sn), and more preferably titanium (Ti). These may be used alone or in combination of two or more.
本發明中所使用之感光性化合物較佳為水解物及/或縮合物,尤佳為金屬錯合物之水解物及/或縮合物,作為其平均粒徑,較佳為20nm以下,更佳為10nm以下。藉此,可提高有機無機複合體之透明性。 The photosensitive compound used in the present invention is preferably a hydrolyzate and/or a condensate, and particularly preferably a hydrolyzate and/or a condensate of a metal complex, and the average particle diameter thereof is preferably 20 nm or less, more preferably It is 10 nm or less. Thereby, the transparency of the organic-inorganic composite can be improved.
作為感光性化合物之含量,亦取決於其種類,通常較佳為相對 於有機矽化合物中之Si,感光性化合物中之金屬原子為0.01~0.5莫耳當量、較佳為0.05~0.2莫耳當量。 The content of the photosensitive compound depends on the kind thereof, and it is usually preferred to be relatively In the Si in the organic cerium compound, the metal atom in the photosensitive compound is 0.01 to 0.5 mol equivalent, preferably 0.05 to 0.2 mol equivalent.
(3)聯苯醯縮二甲醇系光聚合起始劑 (3) Biphenyl condensate dimethanol photopolymerization initiator
本發明中所使用之聯苯醯縮二甲醇系光聚合起始劑係相對於包含波長375nm至420nm之光之能量線而吸光係數較小之光聚合起始劑,例如可列舉2,2'-二甲氧基-1,2-二苯基乙烷-1-酮(BASF製造之「Irgacure(註冊商標)651」)等。 The biphenyl fluorene dimethanol photopolymerization initiator used in the present invention is a photopolymerization initiator having a small absorption coefficient with respect to an energy line containing light having a wavelength of 375 nm to 420 nm, and examples thereof include 2, 2'. -Dimethoxy-1,2-diphenylethane-1-one ("Irgacure (registered trademark) 651" manufactured by BASF).
本發明中所使用之光聚合起始劑之調配量係相對於電磁線硬化性化合物,較佳為調配0.01~20質量%,進而較佳為0.1~10質量%。 The amount of the photopolymerization initiator to be used in the present invention is preferably 0.01 to 20% by mass, and more preferably 0.1 to 10% by mass based on the amount of the electromagnet curable compound.
再者,於本發明中,視需要可添加增感劑,例如可使用三甲基胺、甲基二甲醇胺、三乙醇胺、對二甲基胺基苯乙酮、對二甲基胺基苯甲酸乙酯、對二甲基胺基苯甲酸異戊酯、N,N-二甲基苄胺、及4,4'-雙(二乙基胺基)二苯甲酮等。 Further, in the present invention, a sensitizer may be added as needed, and for example, trimethylamine, methyldimethanolamine, triethanolamine, p-dimethylaminoacetophenone, p-dimethylaminobenzene may be used. Ethyl formate, p-amyldimethylammonium benzoate, N,N-dimethylbenzylamine, and 4,4'-bis(diethylamino)benzophenone.
(4)電磁線硬化性化合物 (4) Electromagnetic wire hardening compound
本發明之電磁線硬化性化合物係具有於上述光聚合起始劑之存在下藉由電磁線之照射而引起聚合反應之官能基之化合物或樹脂。 The electromagnet curable compound of the present invention is a compound or resin having a functional group which causes polymerization reaction by irradiation of a magnet wire in the presence of the photopolymerization initiator.
作為電磁線,可使用紫外線、X射線、放射線、離子化放射線、游離放射線(α射線、β射線、γ射線、中子射線、電子束),較佳為包含350nm以下之波長之光。 As the electromagnetic wire, ultraviolet rays, X-rays, radiation, ionized radiation, free radiation (α-ray, β-ray, γ-ray, neutron beam, or electron beam) can be used, and light having a wavelength of 350 nm or less is preferable.
於電磁線之照射中,可使用超高壓水銀燈、高壓水銀燈、低壓水銀燈、金屬鹵化物燈、準分子燈、碳弧燈、氙弧燈等公知之裝置進行,作為進行照射之光源,較佳為包含150~350nm之範圍中之任一種波長之光之光源,更佳為包含250~310nm之範圍中之任一種波長之光之光源。 In the irradiation of the electromagnetic wire, a known device such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a metal halide lamp, an excimer lamp, a carbon arc lamp, or a xenon arc lamp can be used as the light source for illumination, preferably A light source comprising light of any one of wavelengths in the range of 150 to 350 nm is more preferably a light source containing light of any one of wavelengths in the range of 250 to 310 nm.
又,為了使有機無機複合體形成用組合物充分硬化而進行照射之光之照射光量為0.1~100J/cm2左右,若考慮組合物之硬化效率(照 射能量與組合物之硬化程度之關係),則較佳為0.4~10J/cm2左右,更佳為0.4~5J/cm2左右。 In addition, the amount of light to be irradiated in order to sufficiently cure the composition for forming an organic-inorganic composite is about 0.1 to 100 J/cm 2 , and the curing efficiency of the composition (the relationship between the irradiation energy and the degree of hardening of the composition) is considered. It is preferably about 0.4 to 10 J/cm 2 , more preferably about 0.4 to 5 J/cm 2 .
作為電磁線硬化性化合物,具體而言,可列舉包含(甲基)丙烯酸酯系化合物之乙烯系化合物、環氧樹脂等。藉由電磁線之照射而引起聚合反應之官能基之數量只要為1個以上,則並無特別限定。 Specific examples of the electromagnet curable compound include a vinyl compound containing a (meth) acrylate compound, an epoxy resin, and the like. The number of the functional groups which cause the polymerization reaction by the irradiation of the electromagnetic wires is not particularly limited as long as it is one or more.
作為(甲基)丙烯酸酯系化合物,具體而言,可列舉:聚(甲基)丙烯酸胺基甲酸酯、聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、聚醯胺(甲基)丙烯酸酯、聚丁二烯(甲基)丙烯酸酯、聚苯乙烯(甲基)丙烯酸酯、聚碳酸酯二丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、具有(甲基)丙烯醯氧基之矽氧烷聚合物等,較佳為聚酯(甲基)丙烯酸酯、聚(甲基)丙烯酸胺基甲酸酯、環氧聚(甲基)丙烯酸酯,更佳為聚(甲基)丙烯酸胺基甲酸酯。 Specific examples of the (meth) acrylate-based compound include poly(meth)acrylic acid urethane, polyester (meth) acrylate, epoxy (meth) acrylate, and polydecylamine. (Meth) acrylate, polybutadiene (meth) acrylate, polystyrene (meth) acrylate, polycarbonate diacrylate, tripropylene glycol di(meth) acrylate, hexane diol di ( Methyl)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, helium oxygen with (meth)acryloxyloxy group An alkane polymer or the like, preferably a polyester (meth) acrylate, a poly(meth) acrylate urethane, an epoxy poly(meth) acrylate, more preferably a poly(meth) acrylate amine group. Formate.
環氧(甲基)丙烯酸酯可藉由低分子量之雙酚型環氧樹脂或酚醛環氧樹脂之環氧乙烷環與丙烯酸之酯化反應而獲得。 Epoxy (meth) acrylate can be obtained by esterification of a low molecular weight bisphenol type epoxy resin or an oxirane ring of a novolac epoxy resin with acrylic acid.
聚酯(甲基)丙烯酸酯係藉由將藉由多元羧酸與多元醇之縮合所獲得之於兩末端具有羥基之聚酯低聚物之羥基利用丙烯酸進行酯化而獲得。又,藉由將對多元羧酸加成環氧烷所獲得之低聚物之末端之羥基利用丙烯酸進行酯化而獲得。 The polyester (meth) acrylate is obtained by esterifying a hydroxyl group of a polyester oligomer having a hydroxyl group at both terminals obtained by condensation of a polyvalent carboxylic acid and a polyhydric alcohol with acrylic acid. Further, it is obtained by esterifying a hydroxyl group at the terminal of the oligomer obtained by adding an alkylene oxide to a polyvalent carboxylic acid with acrylic acid.
(甲基)丙烯酸胺基甲酸酯係使多元醇與二異氰酸酯反應所獲得之異氰酸酯化合物、與具有羥基之丙烯酸酯單體之反應產物,作為多元醇,可列舉:聚酯多元醇、聚醚多元醇、聚碳酸酯二醇等。 The (meth)acrylic acid urethane is a reaction product of an isocyanate compound obtained by reacting a polyhydric alcohol with a diisocyanate and an acrylate monomer having a hydroxyl group, and examples of the polyhydric alcohol include polyester polyol and polyether. Polyol, polycarbonate diol, and the like.
又,作為丙烯酸酯系化合物以外之乙烯系化合物,可列舉:N-乙烯基吡咯啶酮、N-乙烯基己內醯胺、乙酸乙烯酯、苯乙烯、不飽和聚酯等,作為環氧樹脂,可列舉:氫化雙酚A二縮水甘油醚、3,4-環 氧環己烷羧酸3,4-環氧環己基甲酯、2-(3,4-環氧環己基-5,5-螺環-3,4-環氧)環己烷間二烷、己二酸雙(3,4-環氧環己基甲基)酯等。 In addition, examples of the vinyl compound other than the acrylate compound include N-vinylpyrrolidone, N-vinyl caprolactam, vinyl acetate, styrene, and unsaturated polyester. , for example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester, 2-(3,4-epoxycyclohexyl-5,5 - spiro-3,4-epoxy)cyclohexane Alkane, bis(3,4-epoxycyclohexylmethyl) adipate, and the like.
電磁線硬化性化合物之分子量係只要於有機無機複合體形成用組合物中溶解,則並無限度,通常作為質量平均分子量,為500~50,000,較佳為1,000~10,000。 The molecular weight of the electromagnet curable compound is not particularly limited as long as it is dissolved in the composition for forming an organic-inorganic composite, and is usually 500 to 50,000, preferably 1,000 to 10,000, as the mass average molecular weight.
本發明中所使用之電磁線硬化性化合物之調配量係相對於有機矽化合物及/或其縮合物、感光性化合物、光聚合起始劑、及電磁線硬化性化合物之全部固形物成分,為2~98質量%,較佳為5~95質量%。 The amount of the electromagnet curable compound used in the present invention is a total solid content of the organic ruthenium compound and/or its condensate, the photosensitive compound, the photopolymerization initiator, and the electromagnet curable compound. 2 to 98% by mass, preferably 5 to 95% by mass.
(5)基於藉由Fedors之推算法所求出之溶解參數之有機矽化合物與電磁線硬化性化合物之組合 (5) Combination of an organic cerium compound and a magnetostatic compound based on the dissolution parameter determined by the Fedors' push algorithm
本發明中所使用之有機矽化合物較佳為式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比電磁線硬化性化合物之藉由Fedors之推算法所求出之溶解參數(SP2)小1.6以上之有機矽化合物(Si1)。SP1與SP2之差較佳為1.6~8.5,更佳為1.6~7.2。 The organic ruthenium compound used in the present invention is preferably a dissolution parameter (SP1) obtained by the Fedors method of R in the formula (I), which is obtained by the Fedors algorithm of the electromagnetic sclerosing compound. An organic ruthenium compound (Si1) having a dissolution parameter (SP2) of 1.6 or more is obtained. The difference between SP1 and SP2 is preferably 1.6 to 8.5, more preferably 1.6 to 7.2.
本發明中所使用之有機矽化合物亦可進而包含SP1比SP2小未達1.6之有機矽化合物、或SP1比SP2大之有機矽化合物(Si2),Si1與Si2之比(Si1:Si2)為5:5~10:0,較佳為9:1~10:0。 The organic ruthenium compound used in the present invention may further comprise an organic ruthenium compound having a SP1 ratio smaller than that of SP2 or an organic ruthenium compound (Si2) having a SP1 ratio larger than SP2, and a ratio of Si1 to Si2 (Si1:Si2) of 5 : 5~10:0, preferably 9:1~10:0.
即,本發明之有機無機複合體形成用組合物係除上述有機矽化合物以外,含有上述感光性化合物、上述聯苯醯縮二甲醇系光聚合起始劑、及上述電磁線硬化性化合物。 In other words, the composition for forming an organic-inorganic composite of the present invention contains the photosensitive compound, the biphenyl fluorene dimethanol photopolymerization initiator, and the electromagnet curable compound in addition to the organic ruthenium compound.
有機矽化合物根據電磁線硬化性化合物之種類而不同。由於有機矽化合物及電磁線硬化性化合物之溶解參數(SP值)可基於Fedors之推算法進行計算,故而可根據預先所計算之SP值,決定有機矽化合物與電磁線硬化性化合物之組合。 The organic ruthenium compound differs depending on the type of the electromagnet curable compound. Since the dissolution parameter (SP value) of the organic ruthenium compound and the electromagnet curable compound can be calculated based on the Fedors' calculation algorithm, the combination of the organic ruthenium compound and the electromagnet curable compound can be determined based on the SP value calculated in advance.
於上述式(I)中,於n為2且R不同之情形時,以數值較大者之SP值 作為上述SP1,決定與電磁線硬化性化合物之組合。 In the above formula (I), when n is 2 and R is different, the SP value is larger As the above SP1, a combination with a magnetostrictive compound is determined.
將可用於本發明之有機矽化合物之一例與SP值一同列記於以下之表1。 An example of an organic ruthenium compound which can be used in the present invention is listed together with the SP value in Table 1 below.
繼而,將可用於本發明之代表性之電磁線硬化性化合物之SP值列記於表2。 Next, the SP values of the representative electromagnet curable compounds usable in the present invention are shown in Table 2.
關於上述化合物以外之聚(甲基)丙烯酸胺基甲酸酯、聚酯(甲基)丙烯酸酯、環氧聚(甲基)丙烯酸酯、聚醯胺(甲基)丙烯酸酯、聚丁二烯(甲基)丙烯酸酯、聚苯乙烯(甲基)丙烯酸酯、聚碳酸酯二丙烯酸酯等丙烯酸酯系化合物,其SP值亦取決於所含有之官能基之種類,為9~11之範圍內。 Poly(meth)acrylic acid urethane, polyester (meth) acrylate, epoxy poly(meth) acrylate, polydecyl (meth) acrylate, polybutadiene other than the above compounds Acrylate-based compounds such as (meth) acrylate, polystyrene (meth) acrylate, and polycarbonate diacrylate, the SP value of which depends on the type of functional group contained, and is in the range of 9 to 11. .
於本發明中,於電磁線硬化性化合物為(甲基)丙烯酸酯系化合物之情形時,作為有機矽化合物(Si1)與(Si2)之組合,較佳為乙烯基三甲氧基矽烷與3-甲基丙烯醯氧基正丙基三甲氧基矽烷之組合、乙烯基三甲氧基矽烷與3-縮水甘油氧基正丙基三甲氧基矽烷之組合等。 In the case of the present invention, in the case where the electromagnet curable compound is a (meth) acrylate compound, as a combination of the organic ruthenium compound (Si1) and (Si2), vinyltrimethoxydecane and 3- are preferable. A combination of methacryloxyl n-propyltrimethoxydecane, a combination of vinyltrimethoxynonane and 3-glycidoxy-n-propyltrimethoxydecane, and the like.
(6)其他成分 (6) Other ingredients
作為用於本發明之溶劑,並無特別限制,例如可列舉:苯、甲 苯、二甲苯等芳香族烴類;己烷、辛烷等脂肪族烴類;環己烷、環戊烷等脂環族烴類;丙酮、甲基乙基酮、環己酮等酮類;四氫呋喃、二烷等醚類;乙酸乙酯、乙酸丁酯等酯類;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺胺等醯胺類;二甲基亞碸等亞碸類;甲醇、乙醇等醇類;乙二醇單甲醚、乙二醇單甲醚乙酸酯等多元醇衍生物類等。該等溶劑可單獨使用1種,或將兩種以上組合而使用。 The solvent to be used in the present invention is not particularly limited, and examples thereof include aromatic hydrocarbons such as benzene, toluene, and xylene; aliphatic hydrocarbons such as hexane and octane; and alicyclic rings such as cyclohexane and cyclopentane. Hydrocarbons; ketones such as acetone, methyl ethyl ketone, cyclohexanone; tetrahydrofuran, Ethers such as alkyl ethers; esters such as ethyl acetate and butyl acetate; decylamines such as N,N-dimethylformamide and N,N-dimethylacetamide; Anthraquinones; alcohols such as methanol and ethanol; polyol derivatives such as ethylene glycol monomethyl ether and ethylene glycol monomethyl ether acetate. These solvents may be used alone or in combination of two or more.
於本發明之有機無機複合體形成用組合物中,此外亦可添加原甲酸甲酯、原乙酸甲酯、四乙氧基矽烷等公知之脫水劑、各種界面活性劑、上述以外之矽烷偶合劑、鈦偶合劑、染料、分散劑、增黏劑、調平劑等添加劑。 In the composition for forming an organic-inorganic composite of the present invention, a known dehydrating agent such as methyl orthoformate, methyl orthoacetate or tetraethoxysilane may be added, various surfactants, and a decane coupling agent other than the above. Additives such as titanium coupling agents, dyes, dispersants, tackifiers, leveling agents, etc.
作為本發明之有機無機複合體形成用組合物中之固形物成分(有機矽化合物及/或其縮合物、感光性化合物、光聚合起始劑、及電磁線硬化性化合物),較佳為1~75質量%,更佳為10~60質量%。 The solid content component (organoquinone compound and/or condensate thereof, photosensitive compound, photopolymerization initiator, and magnetostrictive compound) in the composition for forming an organic-inorganic composite of the present invention is preferably 1 ~75% by mass, more preferably 10 to 60% by mass.
(7)有機無機複合體形成用組合物之製備方法 (7) Method for preparing composition for organic-inorganic composite formation
本發明之有機無機複合體形成用組合物可視需要添加水及/或溶劑,並混合有機矽化合物、感光性化合物、光聚合起始劑、及電磁線硬化性化合物而製備。 The composition for forming an organic-inorganic composite of the present invention can be prepared by adding water and/or a solvent, and mixing an organic hydrazine compound, a photosensitive compound, a photopolymerization initiator, and a magneto-hardening compound, as needed.
例如,將感光性化合物混合於溶劑中,添加特定量之水,進行(部分)水解,繼而添加有機矽化合物進行(部分)水解。另一方面,可列舉將電磁線硬化性化合物溶解於溶劑中並添加光聚合起始劑,其後混合兩溶液之方法。又,亦可於溶劑中添加有機矽化合物與感光性化合物並攪拌,繼而添加特定量之水進行(部分)水解後,與於溶劑中添加有電磁線硬化性化合物與光聚合起始劑之溶液混合。 For example, a photosensitive compound is mixed in a solvent, a specific amount of water is added, (partial) hydrolysis is carried out, and then an organic hydrazine compound is added for (partial) hydrolysis. On the other hand, a method in which a magnetic wire curable compound is dissolved in a solvent and a photopolymerization initiator is added, and then the two solutions are mixed. Further, an organic ruthenium compound and a photosensitive compound may be added to a solvent and stirred, and then a specific amount of water may be added to carry out (partial) hydrolysis, and a solution of a magnetic line-curable compound and a photopolymerization initiator may be added to the solvent. mixing.
該等四種成分亦可同時混合,又,關於有機矽化合物與感光性化合物之混合方法,可列舉:將有機矽化合物與感光性化合物混合後添加水而進行(部分)水解之方法;或混合將有機矽化合物及感光性化 合物分別進行(部分)水解而成者之方法。水或溶劑並非必須添加,但較佳為添加水而預先製成(部分)水解物。作為特定量之水之量,亦取決於感光性化合物之種類,例如於感光性化合物為具有2個以上之羥基或水解性基之金屬化合物之情形時,較佳為相對於金屬化合物1莫耳,使用0.5莫耳以上之水,更佳為使用0.5~2莫耳之水。又,於感光性化合物為金屬錯合物或有機酸金屬鹽化合物之情形時,較佳為相對於金屬錯合物或金屬有機酸鹽化合物1莫耳,使用5~100莫耳之水,更佳為使用5~20莫耳之水。 These four components may be mixed at the same time, and a method of mixing the organic ruthenium compound and the photosensitive compound may be a method of performing (partial) hydrolysis by mixing an organic ruthenium compound and a photosensitive compound, or by mixing water; or mixing Organic bismuth compound and sensitization The method of separately (partially) hydrolyzing the compound. Water or a solvent is not necessarily added, but it is preferred to add water to prepare a (partial) hydrolyzate. The amount of the specific amount of water depends on the kind of the photosensitive compound. For example, when the photosensitive compound is a metal compound having two or more hydroxyl groups or hydrolyzable groups, it is preferably 1 molar relative to the metal compound. Use more than 0.5 moles of water, more preferably 0.5 to 2 moles of water. Further, in the case where the photosensitive compound is a metal complex or an organic acid metal salt compound, it is preferred to use 5 to 100 moles of water with respect to the metal complex or the metal organic acid salt compound 1 mole. Jia uses 5 to 20 moles of water.
作為本發明之有機矽化合物之縮合物,亦可使用將有機矽化合物使用公知之矽烷醇縮合觸媒進行(部分)水解而成者。 The condensate of the organic hydrazine compound of the present invention may be obtained by (partially) hydrolyzing an organic hydrazine compound using a known decyl alcohol condensation catalyst.
縮合物之平均粒徑較佳為2nm~100nm,更佳為5nm~30nm。若平均粒徑大於100nm,則組合物白濁,組合物變得不穩定而變得容易凝膠化。若平均粒徑小於2nm,則有對塗膜性產生不良影響之情形。 The average particle diameter of the condensate is preferably from 2 nm to 100 nm, more preferably from 5 nm to 30 nm. When the average particle diameter is more than 100 nm, the composition becomes cloudy, and the composition becomes unstable and becomes easily gelled. When the average particle diameter is less than 2 nm, there is a case where the coating property is adversely affected.
(8)有機無機複合體及其製造方法 (8) Organic-inorganic composite and manufacturing method thereof
本發明之有機無機複合體係例如於基材上塗佈上述有機無機複合體形成用組合物所獲得之有機無機複合薄膜等。 The organic-inorganic composite film of the present invention is, for example, an organic-inorganic composite film obtained by coating the composition for forming an organic-inorganic composite described above on a substrate.
作為能夠形成本發明之有機無機複合體之基體,可列舉:金屬、陶瓷、玻璃、塑膠等。該等中,可較佳地列舉塑膠,具體而言,可列舉觸控面板用塑膠基板等。先前,薄膜於塑膠基體之形成較為困難,限定於玻璃等無機基體,但本發明之薄膜即便為難以形成之塑膠基體亦可容易地形成,對於塑膠製光學零件亦合適。作為該塑膠基材,例如可列舉:聚碳酸酯基材、丙烯酸系樹脂基材、聚醯亞胺基材、聚酯基材、環氧樹脂基材、液晶聚合物基材、聚醚碸基材。 Examples of the substrate capable of forming the organic-inorganic composite of the present invention include metals, ceramics, glass, and plastics. In the above, plastics are preferably exemplified, and specific examples thereof include plastic substrates for touch panels. Conventionally, it has been difficult to form a film on a plastic substrate, and it is limited to an inorganic substrate such as glass. However, the film of the present invention can be easily formed even if it is a plastic substrate which is difficult to form, and is also suitable for a plastic optical component. Examples of the plastic substrate include a polycarbonate substrate, an acrylic resin substrate, a polyimide substrate, a polyester substrate, an epoxy resin substrate, a liquid crystal polymer substrate, and a polyether fluorenyl group. material.
又,作為有機無機複合體形成用組合物之塗佈方法,可使用公知之塗佈方法,例如可列舉:浸漬法、噴霧法、硬塗法、輥塗法、旋 轉塗佈法、淋幕式塗佈法、凹版印刷法、絲網印刷法、噴墨法等。又,作為所形成之薄膜之膜厚,並無特別限制,例如為0.05~200μm左右。 Moreover, as a coating method of the composition for forming an organic-inorganic composite, a known coating method can be used, and examples thereof include a dipping method, a spray method, a hard coating method, a roll coating method, and a spinning method. A spin coating method, a curtain coating method, a gravure printing method, a screen printing method, an inkjet method, or the like. Further, the film thickness of the formed film is not particularly limited, and is, for example, about 0.05 to 200 μm.
作為塗佈有機無機複合體形成用組合物所形成之薄膜之乾燥處理,例如較佳為於40~200℃下進行1~120分鐘左右,更佳為於60~120℃下進行10~60分鐘左右。 The drying treatment of the film formed by coating the composition for forming an organic-inorganic composite is preferably carried out at 40 to 200 ° C for about 1 to 120 minutes, more preferably at 60 to 120 ° C for 10 to 60 minutes. about.
作為本發明之有機無機複合體之硬化方法,可列舉:對上述有機無機複合體形成用組合物照射包含350nm以下之波長之光之方法。 The method of curing the organic-inorganic composite of the present invention is a method of irradiating the composition for forming an organic-inorganic composite with light having a wavelength of 350 nm or less.
包含350nm以下之波長之光之照射例如可使用高壓水銀燈、低壓水銀燈、金屬鹵化物燈、準分子燈等公知之裝置進行,作為所照射之光,較佳為含有150~350nm之範圍之任一種波長之光,更佳為含有250~310nm之範圍之任一種波長之光。若為對該範圍之波長感應且對超過350nm、較佳為超過310nm之光不反應者,則幾乎不受太陽光影響。又,作為所照射之光之照射光量,例如可列舉0.1~100J/cm2左右,若考慮硬化效率(照射能量與膜硬化程度之關係),則較佳為0.2~20J/cm2左右,更佳為0.5~10J/cm2左右。 The irradiation of light having a wavelength of 350 nm or less can be carried out, for example, by using a known apparatus such as a high pressure mercury lamp, a low pressure mercury lamp, a metal halide lamp, or an excimer lamp, and the irradiated light preferably contains any one of 150 to 350 nm. The light of the wavelength is more preferably light of any wavelength in the range of 250 to 310 nm. If it is inductive to the wavelength of the range and does not react to light exceeding 350 nm, preferably more than 310 nm, it is hardly affected by sunlight. Further, as the irradiation light amount of the irradiated light of, for example, 0.1 ~ 100J / cm 2 or so, in view of hardening efficiency (relationship between the energy and degree of film hardening irradiation) is preferably 0.2 ~ 20J / cm 2 or so, more Good is about 0.5~10J/cm 2 .
再者,所謂350nm以下之波長之光之照射,係指使用以350nm以下之任一種波長之光作為成分之光源之照射,較佳為使用以350nm以下之任一種波長之光作為主成分之光源之照射。 In addition, the irradiation of light having a wavelength of 350 nm or less is a light source using a light having a wavelength of 350 nm or less as a component, and it is preferable to use a light source having a wavelength of 350 nm or less as a main component. Irradiation.
本發明之有機無機複合體含有:a)式(I)RnSiX4-n‧‧‧(I) The organic-inorganic composite of the present invention contains: a) Formula (I) R n SiX 4-n ‧‧‧(I)
(式(I)中,R表示碳原子直接鍵結於式(I)中之Si上之有機基,X分別表示羥基或水解性基;n表示1或2,n為2時,各R可相同亦可不同,(4-n)為2以上時,各X可相同亦可不同)所表示,且i)包含式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1) 比電磁線硬化性化合物之藉由Fedors之推算法所求出之溶解參數(SP2)小1.6以上之有機矽化合物(Si1)之至少1種之有機矽化合物之縮合物;或者ii)包含式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比電磁線硬化性化合物之藉由Fedors之推算法所求出之溶解參數(SP2)小1.6以上之有機矽化合物(Si1)之至少1種、與式(I)中之R之藉由Fedors之推算法所求出之溶解參數(SP1)比上述溶解參數(SP2)小未達1.6或者等於或大於上述溶解參數(SP2)之有機矽化合物(Si2)之至少1種,且上述有機矽化合物(Si1)與上述有機矽化合物(Si2)之莫耳比Si1:Si2為5:5~10:0之有機矽化合物之縮合物;b)選自由金屬錯合物、金屬有機酸鹽、具有2個以上之羥基或水解性基之金屬化合物、其等之水解物、及其等之縮合物所組成之群中之至少1種之對350nm以下之波長之光感應之感光性化合物及/或其衍生物;c)聯苯醯縮二甲醇系光聚合起始劑;及d)電磁線硬化性化合物之硬化物。 (In the formula (I), R represents an organic group in which a carbon atom is directly bonded to Si in the formula (I), and X represents a hydroxyl group or a hydrolyzable group; n represents 1 or 2, and when n is 2, each R may be The same or different, when (4-n) is 2 or more, each X may be the same or different), and i) contains the dissolution parameter of R in formula (I) by Fedors' push algorithm. (SP1) a condensate of at least one organic ruthenium compound having at least one organic ruthenium compound (Si1) having a dissolution parameter (SP2) of 1.6 or more, which is obtained by a Fedors' push algorithm, or a ii) inclusion formula ( I) The solubility parameter (SP1) obtained by Fedors' algorithm is higher than the dissolution parameter (SP2) of the electromagnet curable compound by the Fedors algorithm. At least one of (Si1) and the dissolution parameter (SP1) determined by Fedors' push algorithm of R in the formula (I) are smaller than the above dissolution parameter (SP2) by 1.6 or equal to or greater than the above dissolution parameter. At least one of the organic cerium compound (Si2) of (SP2), and the organic cerium compound of the organic cerium compound (Si1) and the organic cerium compound (Si2) having a molar ratio of Si1:Si2 of 5:5 to 10:0 a condensate; b) selected from the group consisting of a metal complex, a metal organic acid salt, a metal compound having two or more hydroxyl groups or a hydrolyzable group, a hydrolyzate thereof, and the like At least one photosensitive compound that induces light at a wavelength of 350 nm or less and/or a derivative thereof; c) Dimethyl acetal XI-based photopolymerization initiator; and d) the cured curable compound of magnet wire.
作為原料之有機無機複合體形成用組合物中之有機矽化合物或其縮合物及電磁線硬化性化合物於有機無機複合體中分別成為有機矽化合物之縮合物及電磁線硬化性化合物之硬化物。 The organic ruthenium compound, the condensate thereof, and the electromagnet curable compound in the composition for forming an organic-inorganic composite as a raw material are each a condensate of an organic ruthenium compound and a cured product of a magneto-hardening compound in the organic-inorganic composite.
有機無機複合體中所含之感光性化合物包含:感光性化合物及/或其衍生物以非鍵結狀態分散於有機矽化合物之縮合物中而成者、或感光性化合物及/或其衍生物鍵結於有機矽化合物之縮合物上而成者(例如,具有Si-O-M鍵者(M表示感光性化合物中之金屬原子))、或包含其混合狀態者。 The photosensitive compound contained in the organic-inorganic composite includes a photosensitive compound and/or a derivative thereof dispersed in a condensate of an organic ruthenium compound in a non-bonded state, or a photosensitive compound and/or a derivative thereof It is bonded to a condensate of an organic cerium compound (for example, a person having a Si-OM bond (M represents a metal atom in a photosensitive compound)) or a mixed state thereof.
上述各成分之調配比率與有機無機複合體形成用組合物之固形 物成分中之各成分之調配比率相同。 The compounding ratio of each of the above components and the solid form of the composition for forming an organic-inorganic composite The composition ratio of each component in the composition is the same.
本發明之有機無機複合體於形成過程中作為無機成分之有機矽化合物之縮合物於表面部分偏析。相對地作為有機成分之電磁線硬化性化合物於表面部分減少。因此,表面部分係碳濃度與內部相比較低,矽濃度反而升高。即,表面側與內部相比成為經無機化之狀態,表面側具有較高之硬度。 The organic-inorganic composite of the present invention is segregated on the surface portion of the condensate of the organic cerium compound as an inorganic component in the formation process. The magnetic wire curable compound which is relatively an organic component is reduced in the surface portion. Therefore, the carbon concentration of the surface portion is lower than that of the interior, and the concentration of rhodium is increased. That is, the surface side is in a state of being mineralized as compared with the inside, and the surface side has a high hardness.
因此,藉由將本發明之有機無機複合體形成用組合物塗佈於基材並使其硬化,可獲得表面側具有較高之硬度之積層體。 Therefore, the composition for forming an organic-inorganic composite of the present invention is applied to a substrate and cured, whereby a laminate having a high hardness on the surface side can be obtained.
以下,藉由實施例更具體地說明本發明,但本發明之技術範圍並不限定於該等例示。 Hereinafter, the present invention will be specifically described by way of examples, but the technical scope of the present invention is not limited to the examples.
(有機無機複合體形成用組合物之製備) (Preparation of composition for forming an organic-inorganic composite)
於混合乙烯基三甲氧基矽烷(信越化學工業(股)製造之「KBM-1003」)5.95g與3-甲基丙烯醯氧基丙基三甲氧基矽烷(信越化學工業(股)製造之「KBM-503」)4.07g而成之液體中,添加工業用乙醇(Japan Alcohol Trading製造之「Solmix(註冊商標)AP-7」)10.63g與二異丙氧基雙乙醯丙酮鈦(日本曹達(股)製造之「T-50」,氧化鈦換算固形物成分:16.5質量%)2.78g,進行30分鐘攪拌。其後,添加超純水3.10g,進而於室溫下進行2小時攪拌而獲得聚矽氧烷溶液[A-1]。 Mixed with vinyl trimethoxy decane ("KBM-1003" manufactured by Shin-Etsu Chemical Co., Ltd.) 5.95g and 3-methacryloxypropyltrimethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd.) KBM-503") 4.07g of liquid was added with industrial ethanol ("Solmix (registered trademark) AP-7" manufactured by Japan Alcohol Trading) 10.63g and titanium diisopropoxy acetonate (Japan Soda "T-50" manufactured by the company (trademark: solid content of 16.5% by mass) of 2.78 g, and stirred for 30 minutes. Thereafter, 3.10 g of ultrapure water was added, and further stirred at room temperature for 2 hours to obtain a polyoxyalkylene solution [A-1].
將丙烯酸胺基甲酸酯低聚物(日本合成化學工業(股)製造之「UV1700B」)12.16g溶解於甲基異丁基酮17.88g中。於該溶液中添加作為光聚合起始劑之2,2'-二甲氧基-1,2-二苯基乙烷-1-酮(BASF製造之「Irgacure(註冊商標)651」)0.446g(相對於全固形物成分濃度為3.2質量%),而獲得溶液[B-1]。 12.16 g of an urethane urethane oligomer ("UV1700B" manufactured by Nippon Synthetic Chemical Co., Ltd.) was dissolved in 17.88 g of methyl isobutyl ketone. To this solution, 2,2'-dimethoxy-1,2-diphenylethane-1-one ("Irgacure (registered trademark) 651" manufactured by BASF) was added as a photopolymerization initiator 0.446 g. (The concentration of the whole solid component was 3.2% by mass), and the solution [B-1] was obtained.
以固形物成分濃度之比率成為[A-1]/[B-1]=10質量%/90質量%之 方式,將[A-1]4.47g與[B-1]30.49g混合,製備有機無機複合體形成用組合物[C-1](固形物成分濃度39.9質量%)。 The ratio of the solid content concentration is [A-1] / [B-1] = 10% by mass / 90% by mass In the manner, [A-1] 4.47 g and [B-1] 30.49 g were mixed to prepare a composition [C-1] (solid content concentration: 39.9 mass%) of the organic-inorganic composite.
於實施例1之[B-1]之製備中,將光聚合起始劑變更為2-甲基-1-(甲硫基苯基)-2-嗎啉基丙烷-1-酮(BASF製造之「Irgacure(註冊商標)907」),除此以外,以與實施例1相同之方式製備而獲得有機無機複合體形成用組合物[RC-1]。 In the preparation of [B-1] of Example 1, the photopolymerization initiator was changed to 2-methyl-1-(methylthiophenyl)-2-morpholinylpropan-1-one (manufactured by BASF). The composition for forming an organic-inorganic composite [RC-1] was prepared in the same manner as in Example 1 except that "Irgacure (registered trademark) 907") was used.
(有機無機複合體形成基板之製作) (Production of organic-inorganic composite forming substrate)
將實施例1中所獲得之有機無機複合體形成用組合物[C-1]於白色丙烯酸基板上以成為約6μm之方式進行硬塗成膜,藉由溫風循環型乾燥機於80℃下進行3分鐘加熱後,利用聚光型高壓水銀燈(以365nm、313nm、254nm之波長之光作為主成分之UV光,EYE GRAPHICS公司製造,1燈型,120W/cm,燈高9.8cm,輸送器速度4.6m/分鐘)以累計照射量成為400mJ/cm2之方式照射紫外線,獲得有機無機複合體形成基板[D-1]。 The organic-inorganic composite-forming composition [C-1] obtained in Example 1 was hard-coated on a white acrylic substrate to have a thickness of about 6 μm, and was dried at 80 ° C by a warm air circulation type dryer. After heating for 3 minutes, a concentrating high-pressure mercury lamp (UV light having a wavelength of 365 nm, 313 nm, and 254 nm as a main component, manufactured by EYE GRAPHICS, 1 lamp type, 120 W/cm, and a lamp height of 9.8 cm) was used. At a speed of 4.6 m/min, ultraviolet rays were irradiated so that the total irradiation amount became 400 mJ/cm 2 to obtain an organic-inorganic composite-forming substrate [D-1].
作為有機無機複合體形成用組合物,使用[RC-1]代替[C-1],除此以外,以與實施例2相同之方式進行,獲得有機無機複合體形成基板[RD-1]。 The organic-inorganic composite-forming substrate [RD-1] was obtained in the same manner as in Example 2 except that [RC-1] was used instead of [C-1].
對於所獲得之基板[D-1]及[RD-1]進行以下之評價。 The following evaluations were performed on the obtained substrates [D-1] and [RD-1].
(著色之評價) (evaluation of coloring)
為了調查基板[D-1]、基板[RD-1]、及未處理基板之著色之程度,使用色彩濁度測定器(COH400,日本電色工業)測定b*值(黃色調)。將結果示於表3。可知本發明之[D-1]與[RD-1]相比著色降低。 In order to investigate the degree of coloration of the substrate [D-1], the substrate [RD-1], and the untreated substrate, the b* value (yellow tone) was measured using a color turbidity measuring device (COH400, Nippon Denshoku Industries Co., Ltd.). The results are shown in Table 3. It is understood that [D-1] of the present invention has a lower coloration than [RD-1].
(耐熱性評價) (heat resistance evaluation)
將基板[D-1]及基板[RD-1]藉由溫度管理為100℃之溫風循環型乾燥機分別進行10分鐘、30分鐘、60分鐘、120分鐘加熱處理後,於室溫下進行5分鐘冷卻,使用色彩濁度測定器測定加熱處理前後之b*值。將結果示於表4。可知本發明之基板[D-1]與基板[RD-1]相比加熱處理前後之著色變化較少,耐熱黃變性優異。 The substrate [D-1] and the substrate [RD-1] were respectively subjected to heat treatment for 10 minutes, 30 minutes, 60 minutes, and 120 minutes by a warm air circulation type dryer having a temperature management of 100 ° C, and then at room temperature. After cooling for 5 minutes, the b* value before and after the heat treatment was measured using a color turbidity meter. The results are shown in Table 4. It is understood that the substrate [D-1] of the present invention has less color change before and after heat treatment than the substrate [RD-1], and is excellent in heat yellowing resistance.
(耐光性評價) (light resistance evaluation)
對基板[D-1]及基板[RD-1],以與實施例2相同之條件以累計照射量分別成為500mJ/cm2、1500mJ/cm2、3000mJ/cm2、5000mJ/cm2之方式照射紫外線後,於室溫下進行5分冷卻,使用色彩濁度測定器測定照射前後之b*值。將結果示於表5。可知本發明之基板[D-1]與基板[RD-1]相比藉由紫外線照射之著色變化較少,耐光黃變性優異。 With respect to the substrate [D-1] and the substrate [RD-1], the cumulative irradiation amount was 500 mJ/cm 2 , 1500 mJ/cm 2 , 3000 mJ/cm 2 , and 5000 mJ/cm 2 under the same conditions as in the second embodiment. After the ultraviolet rays were irradiated, the mixture was cooled at room temperature for 5 minutes, and the b* value before and after the irradiation was measured using a color turbidity measuring instrument. The results are shown in Table 5. It is understood that the substrate [D-1] of the present invention has less color change by ultraviolet irradiation than the substrate [RD-1], and is excellent in light yellowing resistance.
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015089382 | 2015-04-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201700660A true TW201700660A (en) | 2017-01-01 |
| TWI586769B TWI586769B (en) | 2017-06-11 |
Family
ID=57143889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105112329A TWI586769B (en) | 2015-04-24 | 2016-04-20 | And a composition for forming an organic-inorganic complex |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2016170771A1 (en) |
| TW (1) | TWI586769B (en) |
| WO (1) | WO2016170771A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005179499A (en) * | 2003-12-19 | 2005-07-07 | Olympus Corp | Organic-inorganic composite material and optical system using the same |
| WO2007119627A1 (en) * | 2006-04-10 | 2007-10-25 | Ube Industries, Ltd. | Curable composition, cured silsesquioxanes, and process for production of both |
| JP4959627B2 (en) * | 2007-05-25 | 2012-06-27 | 住友ベークライト株式会社 | Resin composition, resin spacer film and semiconductor device |
| CN102924630A (en) * | 2011-08-09 | 2013-02-13 | 陈婷 | UV light curing application system containing amino ketone compound 1-([1,1'-biphenyl]-4-yl)-2-methyl-2-morpholinopropan-1-one |
| JP2014001342A (en) * | 2012-06-20 | 2014-01-09 | Momentive Performance Materials Inc | Ultraviolet curable silicone resin composition and image display device using the same |
| JP2014015547A (en) * | 2012-07-10 | 2014-01-30 | Nippon Soda Co Ltd | Organic and inorganic composite thin-film |
| CN104937055B (en) * | 2013-01-28 | 2018-04-13 | 日本曹达株式会社 | Coating agent |
-
2016
- 2016-04-18 JP JP2017513967A patent/JPWO2016170771A1/en not_active Withdrawn
- 2016-04-18 WO PCT/JP2016/002072 patent/WO2016170771A1/en not_active Ceased
- 2016-04-20 TW TW105112329A patent/TWI586769B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2016170771A1 (en) | 2017-11-30 |
| WO2016170771A1 (en) | 2016-10-27 |
| TWI586769B (en) | 2017-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101290057B1 (en) | Thermosetting protective film composition with excellent coating and recoating properties | |
| KR101910308B1 (en) | Compositions comprising copolymer, and film and laminate obtained therefrom | |
| TWI467247B (en) | A method for forming a hardening resin composition, a protective film and a protective film | |
| TWI447136B (en) | Organic and inorganic composite film | |
| WO2000078879A1 (en) | Coated article | |
| CN101120055B (en) | Organic-inorganic composite body | |
| CN104411773B (en) | Organic-inorganic composite and composition for forming the same | |
| TW201743086A (en) | Polarizing film, method for producing same, optical film, image display device, and adhesion improvement-treated polarizer | |
| JP6072230B2 (en) | Film made of copolymer or composition | |
| CN101688051A (en) | Epoxy resin-forming liquid preparation containing inorganic particle | |
| JPWO2010082566A1 (en) | Coating composition, method for producing the composition, and laminate having a hard coat layer | |
| TWI586708B (en) | Thermosetting composition with photo-aligning characteristic, cured film, color filter, liquid crystal display element, solid imaging element and optical device | |
| CN104428135B (en) | Thin film laminate with self-organized film | |
| CN100387652C (en) | Resin composition for protective film | |
| TWI586769B (en) | And a composition for forming an organic-inorganic complex | |
| TW200904899A (en) | Composition and method of forming protecting film, laminate and method for manufacturing same | |
| TW201336342A (en) | Light-emitting element and resin composition for forming light-emitting element | |
| TWI589646B (en) | Organic-inorganic complex | |
| TW201037006A (en) | Thermosetting resin composition for forming protective film, protective film and method for forming protective film | |
| TW201930387A (en) | Thermosetting composition, cured film and display device capable of forming a protective film excellent in flatness, heat resistance, chemical resistance, adhesion, hardness, electrical reliability and transparency | |
| CN116419848A (en) | Hard coat film, method for producing same, and image display device | |
| TW201726839A (en) | Coating agent | |
| JP2016040353A (en) | Organic inorganic composite and composition for forming the same | |
| TW200906934A (en) | Resin composition and film-shape optical part using the same | |
| JP2018123218A (en) | Organic-inorganic complex |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |