TW201708397A - Thermal-conductive polysilo-putty composition having a significantly increased pump-out resistance and excellent flowability - Google Patents
Thermal-conductive polysilo-putty composition having a significantly increased pump-out resistance and excellent flowability Download PDFInfo
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- TW201708397A TW201708397A TW105117384A TW105117384A TW201708397A TW 201708397 A TW201708397 A TW 201708397A TW 105117384 A TW105117384 A TW 105117384A TW 105117384 A TW105117384 A TW 105117384A TW 201708397 A TW201708397 A TW 201708397A
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- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 25
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000008096 xylene Substances 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 13
- -1 polysiloxane Polymers 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 9
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 9
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 7
- 229910052582 BN Inorganic materials 0.000 claims abstract description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- 241000566146 Asio Species 0.000 abstract 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 10
- 239000004615 ingredient Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000008282 halocarbons Chemical group 0.000 description 2
- ZKVLEFBKBNUQHK-UHFFFAOYSA-N helium;molecular nitrogen;molecular oxygen Chemical compound [He].N#N.O=O ZKVLEFBKBNUQHK-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000004812 organic fluorine compounds Chemical class 0.000 description 2
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000005817 fluorobutyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本發明有關耐偏移性優異之熱傳導性聚矽氧油灰組成物。 The present invention relates to a thermally conductive polyxanthine putty composition excellent in offset resistance.
一般電氣/電子零件於使用中發生熱，故為使電氣零件適當動作而有必要除熱，已提案除熱用之各種熱傳導性材料。該熱傳導性材料大致分為1)處理容易之薄片狀者，2)糊狀者之2種形態。 In general, electrical/electronic parts generate heat during use. Therefore, in order to properly operate the electric parts, it is necessary to remove heat, and various heat conductive materials for heat removal have been proposed. The heat conductive material is roughly classified into 1) a sheet having an easy handling, and 2) a form having a paste.
薄片狀者有處理容易且安定性優異之優點，但由於接觸熱阻力就性質上較大，故散熱性能比糊狀者差。又，為了保持薄片狀而需要某程度之強度/硬度，無法吸收元件與框體之間產生之公差，亦有因該等應力而破壞元件之情況。 The flaky one has the advantages of easy handling and excellent stability. However, since the contact thermal resistance is large in nature, the heat dissipation performance is inferior to that of the paste. Further, in order to maintain the sheet shape, a certain degree of strength/hardness is required, and the tolerance generated between the element and the frame cannot be absorbed, and the element may be broken by the stress.
另一方面，糊狀者若使用塗佈裝置等，亦可適應大量生產且由於接觸熱阻力低，故散熱性能優異。惟，藉由網版印刷等大量生產時，該糊之黏度較低為佳，但該情況下，因元件之冷熱衝擊等會使該糊偏移(抽空(pump out)現象)，無法充分散熱，故結果有引起元件誤動作般之情 況。 On the other hand, if a paste is used, a coating apparatus or the like can be used for mass production and the heat resistance is low due to low contact heat resistance. However, when mass production is performed by screen printing or the like, the viscosity of the paste is preferably low, but in this case, the paste is offset (pump out phenomenon) due to thermal shock or the like of the element, and sufficient heat is not dissipated. Therefore, the result is that the component is malfunctioning. condition.
且，作為以往技術雖提案如下者，但均無法獲得充分性能。 Further, as the prior art, the following are proposed, but sufficient performance cannot be obtained.
[專利文獻1]日本專利第3948642號公報 [Patent Document 1] Japanese Patent No. 3946642
[專利文獻2]日本專利第3195277號公報 [Patent Document 2] Japanese Patent No. 3195277
[專利文獻3]日本特開2000-169873號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2000-169873
[專利文獻4]日本特開2006-143978號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2006-143978
[專利文獻5]日本特開2004-210856號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2004-210856
[專利文獻6]日本特開2005-162975號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2005-162975
[專利文獻7]日本專利第5300408號公報 [Patent Document 7] Japanese Patent No. 5300408
本發明係鑑於上述情況而完成者，其目的在於提供耐偏移性優異之熱傳導性聚矽氧油灰組成物。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a thermally conductive polymerized putative ash composition excellent in offset resistance.
本發明人等為達上述目的而積極檢討之結果，發現混合特定之有機聚矽氧烷，且於熱傳導性聚矽氧油灰組成物中以某特定比例以上混合粒徑較小之氫氧化鋁，則具有流動性同時可飛躍性地提高耐偏移性。 The present inventors have actively reviewed the results for the above-mentioned purposes, and found that a specific organopolyoxane is mixed, and a small-sized aluminum hydroxide having a smaller particle diameter is mixed in a specific ratio or more in the thermally conductive polyxanthine ash composition. It has fluidity and can dramatically improve the offset resistance.
因此，本發明提供下述之熱傳導性聚矽氧油灰組成物。 Accordingly, the present invention provides the following thermally conductive polyoxyxene putty composition.
[1]一種熱傳導性聚矽氧油灰組成物，其含有下述成分(A)~(D)而成：(A)以下述通式(1)表示之於25℃之動黏度為10~100,000mm2/s之有機聚矽氧烷：100質量份R1 aSiO(4-a)/2 (1) [1] A thermally conductive polyoxyanthracene ash composition comprising the following components (A) to (D): (A) having a dynamic viscosity at 25 ° C of 10 to 100,000 represented by the following general formula (1) Organic polyoxane of mm 2 /s: 100 parts by mass of R 1 a SiO (4-a)/2 (1)
[式中，R1係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基，a係1.8≦a≦2.2]、(B)將二甲苯可溶之有機聚矽氧烷以30質量%溶解於二甲苯時，於25℃之絕對黏度為5,000~40,000mPa．s之有機聚矽氧烷生橡膠：1~50質量份、(C)平均粒徑為0.5~10μm之氫氧化鋁粉末：10~200質量份、(D)平均粒徑為0.5~100μm之自鋁粉末、氧化鋅粉末、氧化鋁粉末、氮化硼粉末、氮化鋁粉末中選擇之1種以上之無機化合物粉末：500~3,000質量份。 Wherein R 1 is one or more selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, a is 1.8≦a≦2.2], and (B) xylene is acceptable. When the dissolved organopolyoxane is dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 5,000 to 40,000 mPa. s organic polyoxane raw rubber: 1 to 50 parts by mass, (C) aluminum hydroxide powder having an average particle diameter of 0.5 to 10 μm: 10 to 200 parts by mass, and (D) an average particle diameter of 0.5 to 100 μm. One or more inorganic compound powders selected from the group consisting of aluminum powder, zinc oxide powder, alumina powder, boron nitride powder, and aluminum nitride powder: 500 to 3,000 parts by mass.
[2]如[1]之熱傳導性聚矽氧油灰組成物，其中對於成分(A)100質量份含有1~50質量份之(E)以下述通式(2)表示之單末端3官能之水解性有機聚矽氧烷：
(式中，R2係碳數1~6之烷基，R3係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基，b係5~120之整數)。 (wherein R 2 is an alkyl group having 1 to 6 carbon atoms, and R 3 is one or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, and b is 5 to 5; An integer of 120).
[3]如[1]或[2]之熱傳導性聚矽氧油灰組成物，其中對於成分(A)100質量份含有1~100質量份之可分散或溶解成分(A)、(B)、(E)之溶劑(F)。 [3] The thermally conductive polyxanthene putty composition according to [1] or [2], wherein the component (A) contains 1 to 100 parts by mass of the dispersible or soluble component (A), (B), and 100 parts by mass of the component (A). (E) Solvent (F).
[4]如[1]~[3]中任一項之熱傳導性聚矽氧油灰組成物，其中前述成分(F)係沸點為80~260℃之異烷烴系溶劑。 [4] The thermally conductive polyxanthene putty composition according to any one of [1] to [3] wherein the component (F) is an isoparaffin-based solvent having a boiling point of 80 to 260 °C.
本發明之熱傳導性聚矽氧油灰組成物具有流動性並且確認大幅提高耐偏移性。 The thermally conductive polyxanthene putty composition of the present invention has fluidity and is confirmed to greatly improve the offset resistance.
以下，針對本發明更詳細說明。 Hereinafter, the present invention will be described in more detail.
成分(A)之有機聚矽氧烷係以下述通式(1)表示之於25℃之動黏度為10~100,000mm2/s者：R1 aSiO(4-a)/2 (1) The organopolyoxyalkylene of the component (A) is represented by the following formula (1): the dynamic viscosity at 25 ° C is 10 to 100,000 mm 2 /s: R 1 a SiO (4-a) / 2 (1)
[式中，R1係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基，a係1.8≦a≦2.2]。 In the formula, R 1 is one or two or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, and a is 1.8≦a≦2.2].
上述式(1)中，R1係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基。作為此種基舉例為例如甲基、乙基、丙基、己基、辛基、癸基、十二烷基、十四烷基、十六烷基、十八烷基等之烷基，環戊基、環己基等之環烷基、乙烯基、烯丙基等之烯基、苯基、甲苯基等之芳基、2-苯基乙基、2-甲基-2-苯基乙基等之芳烷基、3,3,3-三氟丙基、2-(全氟丁基)乙基、2-(全氟辛基)乙基、對-氯苯基等之鹵化烴基。基於聚矽氧烷油脂組成物所要求之稠度之觀點，a較好為1.8~2.2之範圍，特佳為1.9~2.1。 In the above formula (1), R 1 is one or two or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms. As such a group, for example, an alkyl group such as methyl, ethyl, propyl, hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl or the like, cyclopentane An alkenyl group such as a cycloalkyl group, a vinyl group or an allyl group such as a cyclohexyl group; an aryl group such as a phenyl group or a tolyl group; a 2-phenylethyl group; a 2-methyl-2-phenylethyl group; A halogenated hydrocarbon group such as an aralkyl group, a 3,3,3-trifluoropropyl group, a 2-(perfluorobutyl)ethyl group, a 2-(perfluorooctyl)ethyl group or a p-chlorophenyl group. From the viewpoint of the consistency required for the polyoxyalkylene oil composition, a is preferably in the range of 1.8 to 2.2, particularly preferably 1.9 to 2.1.
又，本發明使用之有機聚矽氧烷於25℃之動黏度低於10mm2/s時，作成油灰組成物時，易於出現滲油，大於100,000mm2/s時，作成油灰組成物時缺乏佈膠性，故有必要於25℃為10~100,000mm2/s，特佳為30~10,000mm2/s。又，有機聚矽氧烷之動黏度係以奧氏黏度計測定於25℃之值。 Furthermore, if the present invention is the use of organopolysiloxane silicon alumoxane below 10mm 2 / s dynamic viscosity at 25 deg.] C, the putty composition when made, prone to permeability, is larger than 100,000mm 2 / s, the lack of putty composition when made It has a colloidal property, so it is necessary to be 10 to 100,000 mm 2 /s at 25 ° C, and particularly preferably 30 to 10,000 mm 2 /s. Further, the dynamic viscosity of the organopolyoxane was measured at 25 ° C by an Oswald viscometer.
成分(B)之有機聚矽氧烷生橡膠為二甲苯可溶，以30質量%溶解於二甲苯時，於25℃之絕對黏度為5,000~40,000mPa．s者。構造本身與成分(A)相同，係以上述通式(1)表示。但，矽氧烷之聚合度大於成分(A)，一般亦稱為聚矽氧生橡膠。 The organopolyoxane raw rubber of the component (B) is soluble in xylene, and when dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 5,000 to 40,000 mPa. s. The structure itself is the same as the component (A) and is represented by the above formula (1). However, the degree of polymerization of the decane is greater than that of the component (A), and is also generally referred to as polyoxyn rubber.
以30質量%溶解於二甲苯時，於25℃之絕對 黏度小於5,000mPa．s時，耐偏移性差，大於40,000mPa．s時，佈膠性變差，故宜為5,000~40,000mPa．s之範圍，較好為10,000~35,000mPa．s之範圍。 When dissolved in xylene at 30% by mass, absolute at 25 ° C Viscosity is less than 5,000mPa. When s, the offset resistance is poor, greater than 40,000 mPa. When s, the lagging property is deteriorated, so it should be 5,000~40,000 mPa. The range of s is preferably 10,000 to 35,000 mPa. The range of s.
又，該成分(B)之含量小於1質量份時，耐偏移性變差，大於50質量份時，處理性變差，故宜為1~50質量份之範圍，更好為5~30質量份之範圍。又，以30質量%溶解於二甲苯之黏度係以BH型旋轉計測定於25℃之值。 In addition, when the content of the component (B) is less than 1 part by mass, the offset resistance is deteriorated, and when it is more than 50 parts by mass, the handleability is deteriorated, so it is preferably in the range of 1 to 50 parts by mass, more preferably 5 to 30 parts. The range of parts by mass. Further, the viscosity at 30% by mass dissolved in xylene was measured at a value of 25 ° C by a BH type rotation meter.
本發明之成分(C)之氫氧化鋁粉末係提高本發明之聚矽氧散熱油灰之耐偏移性。本發明中使用之氫氧化鋁粉末之平均粒徑若小於0.5μm，則流動性變差且處理性變差，若大於10μm則耐偏移性變差，故宜為0.5~10μm之範圍，較好為1~5μm之範圍。 The aluminum hydroxide powder of the component (C) of the present invention improves the offset resistance of the polyoxygenated heat-dissipating putty of the present invention. When the average particle diameter of the aluminum hydroxide powder used in the present invention is less than 0.5 μm, the fluidity is deteriorated and the handleability is deteriorated. When the average particle diameter is more than 10 μm, the offset resistance is deteriorated, so it is preferably in the range of 0.5 to 10 μm. It is preferably in the range of 1 to 5 μm.
又，本發明中，平均粒徑為體積平均粒徑，可藉由雷射繞射/散射式粒度分佈測定機Microtrack MT3300EX等測定(以下同)。 Further, in the present invention, the average particle diameter is a volume average particle diameter, and can be measured by a laser diffraction/scattering particle size distribution measuring machine Microtrack MT3300EX or the like (the same applies hereinafter).
且，成分(C)之調配量小於10質量份時，耐偏移性變差，大於20質量份時流動性變差且處理性變差，故宜為10~200質量份之範圍，較好為30~100質量份。 Further, when the amount of the component (C) is less than 10 parts by mass, the offset resistance is deteriorated, and when the amount is more than 20 parts by mass, the fluidity is deteriorated and the handleability is deteriorated, so it is preferably in the range of 10 to 200 parts by mass. It is 30 to 100 parts by mass.
本發明所用之氫氧化鋁粉末若需要亦可經有機矽烷、有機矽氮烷、有機聚矽氧烷、有機氟化合物等施以疏水化處理。疏水化處理法可為一般習知方法，例如以 TRIMIX、TWINMIX、PLANETARY MIXER(均為井上製作所(股)製混合機之註冊商標)、ULTRAMIXER(MIZUHO工業(股)製混合機之註冊商標)、HIVISDISPER MIX(特殊機化工業(股)製混合機之註冊商標)等之混合機混合氫氧化鋁粉末與有機矽烷或其部分水解物。若需要亦可加熱至50~150℃。又，混合時亦可使用甲苯、二甲苯、石油醚、礦油精、異烷烴、異丙醇、乙醇等之溶劑，該情況下，較好使用真空裝置等去除混合後溶劑。 The aluminum hydroxide powder used in the present invention may be subjected to a hydrophobizing treatment by an organic decane, an organic decane, an organopolyoxane, an organic fluorine compound or the like, if necessary. The hydrophobization treatment can be a conventional method, for example, TRIMIX, TWINMIX, PLANETARY MIXER (all registered trademarks of Inoue Co., Ltd.), ULTRAMIXER (registered trademark of MIZUHO Industrial Co., Ltd.), HIVISDISPER MIX (Special Machine Industry Co., Ltd.) The mixer of the registered trademark or the like mixes the aluminum hydroxide powder with the organic decane or a partial hydrolyzate thereof. If necessary, heat to 50~150 °C. Further, a solvent such as toluene, xylene, petroleum ether, mineral spirits, isoparaffin, isopropanol or ethanol may be used for the mixing. In this case, it is preferred to remove the solvent after mixing using a vacuum apparatus or the like.
成分(D)所使用之無機化合物粉末必須為熱傳導率高者，可使用自鋁粉末、氧化鋅粉末、氧化鋁粉末、氮化硼粉末、氮化鋁粉末中選擇之1種或2種以上。亦可使用將該等無機化合物粉末之表面根據需要以有機矽烷、有機矽氮烷、有機聚矽氧烷、有機氟化合物等施以疏水化處理者。 The inorganic compound powder to be used in the component (D) must have a high thermal conductivity, and one or two or more selected from the group consisting of aluminum powder, zinc oxide powder, alumina powder, boron nitride powder, and aluminum nitride powder can be used. The surface of the inorganic compound powder may be hydrophobized by using an organosilane, an organic decane, an organopolyoxane, an organic fluorine compound or the like as needed.
成分(D)之無機化合物粉末之平均粒徑由於小於0.5μm或大於100μm均無法提高所得油脂組成物之填充率，故宜為0.5~100μm之範圍，較好為1~50μm之範圍。 The average particle diameter of the inorganic compound powder of the component (D) is not more than 0.5 μm or more than 100 μm, and the filling ratio of the obtained fat or oil composition cannot be increased, so it is preferably in the range of 0.5 to 100 μm, preferably in the range of 1 to 50 μm.
成分(D)之無機化合物粉末之調配量，於熱傳導性聚矽氧油灰組成物中，若小於500質量份，則所得組成物之熱傳導率變差，大於3,000質量份時，則流動性變差且處理性變差，故較好為500~3,000質量份之範圍，更好為1,000~2,500質量份。 When the amount of the inorganic compound powder of the component (D) is less than 500 parts by mass, the thermal conductivity of the obtained composition is deteriorated, and when it is more than 3,000 parts by mass, the fluidity is deteriorated. Further, the handleability is deteriorated, so it is preferably in the range of 500 to 3,000 parts by mass, more preferably 1,000 to 2,500 parts by mass.
作為成分(E)，使用以下述通式(2)表示之單末
端3官能之水解性有機聚矽氧烷：
(式中，R2係碳數1~6之烷基，R3係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基，b係5~120之整數)。 (wherein R 2 is an alkyl group having 1 to 6 carbon atoms, and R 3 is one or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, and b is 5 to 5; An integer of 120).
通式(2)之有機聚矽氧烷係用以處理成分(C)、成分(D)之熱傳導性無機填充劑表面所用者，由於不僅有助於粉末之高填充化，亦藉由覆蓋粉末表面而不易引起粉末彼此凝集，即使於高溫下亦可持續其效果，故有提高本熱傳導性聚矽氧油灰組成物之耐熱性之作用。 The organopolyoxyalkylene of the formula (2) is used for treating the surface of the thermally conductive inorganic filler of the component (C) and the component (D), and not only contributes to high filling of the powder but also covers the powder. The surface does not easily cause the powders to aggregate with each other, and the effect can be sustained even at a high temperature, so that the heat resistance of the heat conductive polyfluorene ash composition is improved.
上述式(2)中，R2舉例為例如甲基、乙基、丙基等之碳數1~6之烷基，但特佳為甲基、乙基。R3係自碳數1~18之飽和或不飽和一價烴基之群選擇之1種或2種以上之基，作為此種基例為例如甲基、乙基、丙基、己基、辛基、癸基、十二烷基、十四烷基、十六烷基、十八烷基等之烷基、環戊基、環己基等之環烷基、乙烯基、烯丙基等之烯基、苯基、甲苯基等之芳基、2-苯基乙基、2-甲基-2-苯基乙基等之芳烷基、3,3,3-三氟丙基、2-(全氟丁基)乙基、2-(全氟辛基)乙基、對-氯苯基等之鹵化烴基，特佳為甲基。通式(2)之b為5~120之整數，較好為0~90之整數。 In the above formula (2), R 2 is, for example, an alkyl group having 1 to 6 carbon atoms such as a methyl group, an ethyl group or a propyl group, and particularly preferably a methyl group or an ethyl group. R 3 is one or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, and examples of such a compound are, for example, a methyl group, an ethyl group, a propyl group, a hexyl group, and an octyl group. An alkyl group such as an alkyl group such as a mercapto group, a dodecyl group, a tetradecyl group, a hexadecyl group or an octadecyl group; a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group; an alkenyl group such as a vinyl group or an allyl group; An aryl group such as a phenyl group or a tolyl group, an aralkyl group such as a 2-phenylethyl group or a 2-methyl-2-phenylethyl group, a 3,3,3-trifluoropropyl group or a 2-(all) A halogenated hydrocarbon group such as fluorobutyl)ethyl, 2-(perfluorooctyl)ethyl or p-chlorophenyl is particularly preferably a methyl group. b of the formula (2) is an integer of 5 to 120, preferably an integer of 0 to 90.
調配該通式(2)之有機聚矽氧烷時之添加量，若相對於成分(A)100質量份小於1質量份，則無法成為期望之油灰組成物，若大於50重量份則耐偏移性變差，故宜為1~50質量份之範圍，較好為3~30質量份之範圍。 When the amount of the organopolyoxane of the formula (2) is adjusted to less than 1 part by mass based on 100 parts by mass of the component (A), the desired putty composition cannot be obtained, and if it is more than 50 parts by weight, the resistance is biased. The shiftability is deteriorated, so it is preferably in the range of 1 to 50 parts by mass, preferably in the range of 3 to 30 parts by mass.
又，於本熱傳導性聚矽氧油灰組成物中亦可根據需要添加成分(F)。藉由添加成分(F)，由於使本熱傳導性聚矽氧油灰變柔軟，故提高佈膠性。又，塗佈後，由於藉由所塗佈之裝置等之動作溫度等使成分(F)揮發，故對於耐偏移性不會有影響。 Further, the component (F) may be added as needed in the present thermally conductive polyasoxy ash composition. By adding the component (F), since the heat conductive polyoxygen ash ash is softened, the smear property is improved. Further, since the component (F) is volatilized by the operating temperature of the applied device or the like after the application, the offset resistance is not affected.
成分(F)的溶劑若為可分散或溶解前述成分(A)、(B)、(E)者則未特別限制，舉例為例如甲苯、二甲苯、丙酮、甲基乙基酮、環己酮、正己烷、正庚烷、丁醇、IPA、異烷烴等。尤其基於環境面之觀點，較好使用異烷烴系之溶劑。異烷烴系溶劑之沸點若未達80℃，則揮發過於快速而於保存性產生問題。且沸點超過260℃時，熱傳導性聚矽氧油灰組成物中易殘存溶劑，而產生發生孔隙等以致熱特性降低等之缺陷，故期望在80~260℃之沸點範圍內。 The solvent of the component (F) is not particularly limited as long as it can disperse or dissolve the components (A), (B), and (E), and is exemplified by, for example, toluene, xylene, acetone, methyl ethyl ketone, and cyclohexanone. , n-hexane, n-heptane, butanol, IPA, isoalkane, and the like. The isoparaffin-based solvent is preferably used from the viewpoint of environmental aspects. If the boiling point of the isoparaffin-based solvent is less than 80 ° C, the volatilization is too fast and there is a problem in preservability. When the boiling point exceeds 260 ° C, the heat conductive polyoxygen ash ash composition tends to remain as a solvent, and defects such as voids are caused to cause deterioration of thermal characteristics, and therefore it is desirable to be in the boiling point range of 80 to 260 ° C.
上述溶劑之調配量相對於成分(A)100質量份，若少於1質量份，則佈膠塗佈性變差，若超過100質量份，則塗佈後變難以揮發，故較好為1~100質量份，更好為5~60質量份。 When the amount of the solvent is less than 1 part by mass based on 100 parts by mass of the component (A), the coating property of the cloth is deteriorated, and if it exceeds 100 parts by mass, the coating becomes difficult to volatilize after coating, so it is preferably 1 ~100 parts by mass, more preferably 5 to 60 parts by mass.
製造本發明之熱傳導性聚矽氧油灰組成物時，以TRIMIX、TWINMIX、PLANETARY MIXER(均為 井上製作所(股)製混合機之註冊商標)、ULTRAMIXER(MIZUHO工業(股)製混合機之註冊商標)、HIVISDISPER MIX(特殊機化工業(股)製混合機之註冊商標)等之混合機混合上述各成分30分鐘~4小時。若有需要亦可加熱至50~150℃。 When manufacturing the thermally conductive polyphthalate ash composition of the present invention, TRIMIX, TWINMIX, PLANETARY MIXER (all Mixer of registered trademarks of Inoue Co., Ltd., ULTRAMIXER (registered trademark of MIZUHO Industrial Co., Ltd.), and HIVISDISPER MIX (registered trademark of Hybrid Machine of Special Machine Chemical Industry Co., Ltd.) Each of the above ingredients is 30 minutes to 4 hours. Heat to 50~150 °C if necessary.
本發明之熱傳導性散熱油灰組成物亦有可佈膠塗佈之特徵。用於佈膠塗佈所使用之容器並未特別限定，一般而言可填充於市售之稱為針筒或匣者，於使用時藉由空氣或機械所致之壓力塗佈於期望部位。 The thermally conductive heat dissipating putty composition of the present invention is also characterized by a coatable coating. The container used for the coating of the cloth is not particularly limited, and it can be generally filled with a commercially available syringe or a crucible, and is applied to a desired portion by air or mechanical pressure at the time of use.
以下，藉由實施例及比較例更詳細描述本發明，但本發明不限於該等。基於更明確本發明之優異性之目的，顯示具體實施例加以證明。 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited thereto. Specific examples are shown for the purpose of more clearly defining the superiority of the invention.
本發明有關之試驗係如下般進行。 The test relating to the present invention was carried out as follows.
熱傳導率係藉由京都電子工業股份有限公司製之TPS-2500S，均於25℃測定。 The thermal conductivity was measured at 25 ° C by TPS-2500S manufactured by Kyoto Electronics Industry Co., Ltd.
粒徑測定係藉由日機裝股份有限公司製之粒度分析計的Microtrack MT3300EX測定之體積基準之累積平均徑。 The particle size measurement is a cumulative average diameter of a volume basis measured by Microtrack MT3300EX of a particle size analyzer manufactured by Nikkiso Co., Ltd.
於設有1mm間隔之2片蓋玻璃板之間，以成為直徑1.5cm之圓狀之方式夾住熱傳導性聚矽氧油灰組成物，將該試驗片以相對於地面傾斜90度之方式，配置於以交互重複0℃與100℃(各15分鐘)之方式設定之ESPEC股份有限公司製之熱衝擊試驗機(型號：TSE-11-A)中，進行100次循環試驗。100次循環後，測定熱傳導性聚矽氧油灰組成物自最初處所偏移多少。 Between the two cover glass plates having a gap of 1 mm, the thermally conductive polyxanthene putty composition was sandwiched so as to have a circular shape of 1.5 cm in diameter, and the test piece was placed at an angle of 90 degrees with respect to the ground. A 100-cycle test was carried out in a thermal shock tester (model: TSE-11-A) manufactured by ESPEC Co., Ltd., which was set to alternately repeat 0 ° C and 100 ° C (15 minutes each). After 100 cycles, the amount of thermally conductive polyxanthene putty composition was offset from the original position.
若為1mm以下則可說耐偏移性優異。 When it is 1 mm or less, it can be said that it is excellent in offset resistance.
於NORDSON股份有限公司製之30cc針筒(商品名：OPTIMUM)中放入熱傳導性聚矽氧油灰組成物30g，在KOKUSAN股份有限公司製之離心機(商品名：HL-7)以2,000rpm脫氣10分鐘。隨後，在未附針之狀態，以0.4MPa之空氣壓佈膠5秒。進行5次佈膠，將其佈膠重量之平均作為噴出量。 Into a 30 cc syringe (trade name: OPTIMUM) manufactured by NORDSON Co., Ltd., 30 g of a thermally conductive polyoxyanthracene ash composition was placed in a centrifuge (trade name: HL-7) manufactured by KOKUSAN Co., Ltd. at 2,000 rpm. Gas for 10 minutes. Subsequently, in the state where the needle was not attached, the rubber was pressure-coated at 0.4 MPa for 5 seconds. The cloth was applied 5 times, and the average weight of the cloth was used as the discharge amount.
若超過0.5g，則可說佈膠性優異。 When it exceeds 0.5 g, it can be said that it is excellent in the sizing property.
如表1、2、3所示將各成分饋入行星式混合機中(表中數字表示g)，於25℃均勻混合30分鐘，調製熱傳導性油灰組成物。使用所得組成物進行上述各種試驗。結果一併記於表1、2、3。又，使用之成分(A)~(F)如下述所示。 Each component was fed into a planetary mixer as shown in Tables 1, 2, and 3 (the number in the table indicates g), and uniformly mixed at 25 ° C for 30 minutes to prepare a thermally conductive putty composition. The above various tests were carried out using the obtained composition. The results are also shown in Tables 1, 2, and 3. Further, the components (A) to (F) used are as follows.
兩末端以三甲基矽烷基封端之直鏈、動黏度1,000mm2/s之二甲基聚矽氧烷。 A linear, viscous viscosity of 1,000 mm 2 /s of dimethyl polyoxyalkylene terminated with a trimethyldecyl group at both ends.
兩末端以三甲基矽烷基封端之直鏈、動黏度5,000mm2/s之二甲基聚矽氧烷。 A linear, kinetic viscosity of 5,000 mm 2 /s of dimethyl polyoxane terminated with a trimethyldecyl group at both ends.
以30質量%溶解於二甲苯時，於25℃之絕對黏度為11,000mPa．s之兩末端具有乙烯基之二甲基聚矽氧烷生橡膠。 When dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 11,000 mPa. The two ends of s have a vinyl dimethyl polyoxane raw rubber.
以30質量%溶解於二甲苯時，於25℃之絕對黏度為33,000mPa．s之兩末端具有羥基之二甲基聚矽氧烷生橡膠。 When dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 33,000 mPa. A dimethylpolyoxane raw rubber having a hydroxyl group at both ends of s.
以30質量%溶解於二甲苯時，於25℃之絕對黏度為4,500mPa．s之兩末端具有乙烯基之二甲基聚矽氧烷生橡膠。<比較例用> When dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 4,500 mPa. The two ends of s have a vinyl dimethyl polyoxane raw rubber. <Comparative example>
以30質量%溶解於二甲苯時，於25℃之絕對黏度為41,000mPa．s之兩末端具有羥基之二甲基聚矽氧烷生橡膠。 When dissolved in xylene at 30% by mass, the absolute viscosity at 25 ° C is 41,000 mPa. A dimethylpolyoxane raw rubber having a hydroxyl group at both ends of s.
(C-1)平均粒徑1.0μm，不定形 (C-1) average particle diameter 1.0 μm, amorphous
(C-2)平均粒徑2.5μm，不定形 (C-2) average particle size 2.5 μm, amorphous
(C-3)平均粒徑14.5μm，不定形<比較例用> (C-3) Average particle diameter 14.5 μm, amorphous <comparative example>
(C-4)平均粒徑0.4μm，不定形<比較例用> (C-4) average particle diameter 0.4 μm, amorphous <for comparative examples>
(D-1)鋁粉末(平均粒徑：30μm) (D-1) aluminum powder (average particle diameter: 30 μm)
(D-2)氧化鋅粉末(平均粒徑：1.0μm) (D-2) zinc oxide powder (average particle diameter: 1.0 μm)
(D-3)氧化鋁粉末(平均粒徑：15.7μm) (D-3) Alumina powder (average particle diameter: 15.7 μm)
(D-4)氮化硼粉末(平均粒徑：2.0μm) (D-4) boron nitride powder (average particle diameter: 2.0 μm)
(D-5)氮化鋁粉末(平均粒徑：6.8μm) (D-5) Aluminum nitride powder (average particle diameter: 6.8 μm)
IP溶劑2028(沸點210~254℃之異烷烴系溶劑，出光興產股份有限公司之商品名) IP solvent 2028 (isoalkane solvent with a boiling point of 210-254 °C, trade name of Idemitsu Kosan Co., Ltd.)
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| TWI848098B (en) * | 2019-04-23 | 2024-07-11 | 美商哈尼威爾國際公司 | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| TWI852975B (en) * | 2019-01-10 | 2024-08-21 | 日商信越化學工業股份有限公司 | Thermally conductive polysilicone composition |
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| EP3708613B1 (en) * | 2017-11-09 | 2022-11-23 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone grease composition |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| JP6866877B2 (en) * | 2018-05-31 | 2021-04-28 | 信越化学工業株式会社 | Low heat resistance silicone composition |
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| JP2024129730A (en) * | 2023-03-13 | 2024-09-27 | コスモ石油ルブリカンツ株式会社 | Thermally conductive grease composition |
| CN116731689B (en) * | 2023-08-14 | 2023-10-27 | 南方电网调峰调频(广东)储能科技有限公司 | Silicone oil-based immersion coolants for electronic components |
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| JPH0639570B2 (en) * | 1988-10-18 | 1994-05-25 | 信越化学工業株式会社 | Putty-like curable organopolysiloxane composition |
| JP4130091B2 (en) * | 2002-04-10 | 2008-08-06 | 信越化学工業株式会社 | Silicone grease composition for heat dissipation |
| JP4656340B2 (en) * | 2008-03-03 | 2011-03-23 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
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| JP5574532B2 (en) * | 2009-10-08 | 2014-08-20 | 信越化学工業株式会社 | Thermally conductive silicone rubber composite sheet |
| JP5664563B2 (en) * | 2012-01-23 | 2015-02-04 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| JP5729882B2 (en) * | 2012-10-23 | 2015-06-03 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
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| TWI852975B (en) * | 2019-01-10 | 2024-08-21 | 日商信越化學工業股份有限公司 | Thermally conductive polysilicone composition |
| TWI848098B (en) * | 2019-04-23 | 2024-07-11 | 美商哈尼威爾國際公司 | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
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