TW201707128A - Substrate holding device, film forming device, and substrate holding method - Google Patents

Abstract

The present invention provides a substrate holding device that can ensure adhesion between a mask and a substrate. The substrate holding device (30) includes a mask plate (311), an intermediate plate (32), a holding plate (33), and a pressing mechanism (34). The mask plate (311) is made of a magnetic material. The intermediate plate (32) has a first surface facing the mask plate (311) and a second surface opposite to the first surface, and the first surface is configured to be disposed on the mask plate The substrate (W) on (311) is in contact. The holding plate (33) supports the intermediate plate (32) so as to be relatively movable in the axial direction orthogonal to the mask plate (311), and is configured to be magnetically permeable through the intermediate plate (32) and the substrate (W). A magnet (331) of the mask plate (311). The pressing mechanism (34) is disposed in the second facing direction, and is configured to be capable of pressing at least a part of the second surface along the axial direction.

Description

Substrate holding device, film forming device, and substrate holding method

The present invention relates to a substrate holding device that uses a magnet to hold a mask and a substrate for film formation, a film forming apparatus including the substrate holding device, and a substrate holding method.

As a technique of forming a thin film in a predetermined region of a substrate, a method of using a mask for film formation is known. For example, Patent Document 1 discloses an in-line type film forming apparatus that transports a substrate having a plate-shaped mask on a film formation surface into a film forming chamber while performing vapor deposition. The vapor deposition material generated by the source is vapor-deposited on the film formation surface.

In such a film forming apparatus, in order to prevent the vapor of the vapor deposition material from being swung from the gap between the mask and the substrate, it is necessary to ensure the adhesion between the mask and the substrate. For this reason, a method of sandwiching a substrate and holding the substrate flatly between the mask and the magnet plate that magnetically adsorbs the mask is known (for example, refer to Patent Document 2) ).

On the other hand, with the increase in size of substrates in recent years, the thickness required for the substrate holder to obtain flatness is increased, and as a result, the magnetic force for bringing the magnet plate to the mask is lowered, and the substrate and the mask are made. The difference in adhesion is reduced. In order to solve this problem, Patent Document 2 discloses that a mask pressing mechanism for pressing a mask against a substrate is provided on the evaporation source side of the mask, whereby the mask is adhered to the substrate.

[Previous Technical Literature]

[Patent Document]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-118157.

Patent Document 2: Japanese Laid-Open Patent Publication No. 2013-247040.

However, in the configuration described in Patent Document 2, since the mechanism portion constituting the mask pressing mechanism is provided on the evaporation source side of the mask, there is a fear that the mechanism portion is coated and the operation failure is caused. Moreover, when the aperture ratio of the mask is large or the interval between the openings is narrow, it is difficult to arrange the mechanism portion without shielding the opening.

In view of the above circumstances, an object of the present invention is to provide a substrate holding device, a film forming apparatus, and a substrate holding method which can ensure the adhesion between a mask and a substrate without providing a mechanism portion on the evaporation source side of the mask.

In order to achieve the above object, a substrate holding device according to an aspect of the present invention includes a mask plate, an intermediate plate, a holding plate, and a pressing mechanism.

The mask plate described above is made of a magnetic material.

The intermediate plate has a first surface facing the mask plate and a second surface opposite to the first surface, and the first surface is configured to be disposed on the mask plate The substrate is in contact.

The holding plate supports the intermediate plate so as to be relatively movable in an axial direction orthogonal to the mask plate. The holding plate has a magnet configured to be capable of magnetically adsorbing the mask through the intermediate plate and the substrate.

The pressing mechanism is disposed in the second facing direction. The pressing mechanism is configured to be capable of pressing at least a part of the second surface along the axial direction.

In the substrate holding device described above, the intermediate plate has a function of maintaining a planar state of the substrate by contacting a non-film-forming surface of the substrate opposed to the mask. On the other hand, there is a fear that the intermediate plate is enlarged, or the thickness of the intermediate plate is smaller, so that the flatness of the intermediate plate itself is caused by insufficient strength of the intermediate plate or heat input in the film formation. The deformation is reduced and the more it is reduced. Then, the substrate holding device includes a pressing mechanism that presses at least a part of the intermediate plate toward the mask plate side. Thereby, the flatness of the intermediate plate can be improved, and as a result, the flatness of the substrate contacting the intermediate plate can be maintained, and excellent adhesion to the intermediate plate can be ensured. Moreover, since the intermediate plate can be made thinner, it is possible to ensure a stable adhesion between the mask plate and the substrate regardless of the substrate size.

In the substrate holding device described above, since the pressing mechanism is disposed in the second facing direction of the intermediate plate, it is possible to provide a contact between the mask and the substrate without providing any mechanism portion on the evaporation source side of the mask. Therefore, the adhesion between the mask and the substrate can be stably maintained without depending on the aperture ratio of the mask or the arrangement of the mask openings.

The above axial direction is typically an axial direction parallel to the direction of gravity. In this case, since the flatness caused by the deflection deformation of the substrate or the intermediate plate can be prevented by the pressing mechanism, the desired film formation accuracy can be stably obtained.

The pressing mechanism is typically provided on the holding plate. By providing the pressing mechanism to the holding plate, the device configuration can be simplified, and the desired position of the intermediate plate can be stably pressed.

The pressing mechanism may include a plurality of pressing units configured to be capable of pressing a plurality of portions of the second surface. The flatness of the intermediate plate can be easily improved by being able to press a plurality of positions on the intermediate plate in such a manner. The pressing position of the intermediate plate is not particularly limited, and a central portion and/or a peripheral portion of the intermediate plate (second surface) are typically exemplified.

The intermediate plate may be configured to be movable in the axial direction between the contact position and the holding position. The contact position is set to be the first At least a portion of the surface contacts the substrate and a relative distance from the holding plate is a first distance, and the holding position is a relative distance from the holding plate that is a second distance smaller than the first distance position. In this case, the pressing mechanism presses the second surface along the axial direction while the intermediate plate is moving from the contact position toward the holding position.

According to the above configuration, the second surface can be pressed by the pressing mechanism while the magnet is brought close to the second surface of the intermediate plate while the first surface of the intermediate plate has contacted the substrate. Therefore, the positional displacement of the substrate to the mask is not generated, and the substrate can be closely attached to the mask with a high degree of flatness.

The pressing unit has, for example, a pressing member and an elastic member. The pressing member is disposed in the second facing direction. The elastic member is disposed between the pressing member and the second surface, and is elastically deformable in the axial direction.

Thereby, since the desired pressing force can be stably applied to a plurality of positions on the intermediate plate, the intermediate plate and the substrate can be maintained at the intended flatness.

The constituent material of the intermediate plate is not particularly limited, and may be a magnetic material or a non-magnetic material. In the case where the intermediate plate is made of a magnetic material, since the magnetic path through which the magnetic field from the magnet passes is formed, the magnetic attraction force to the mask can be improved. On the other hand, in the case where the intermediate plate is made of a non-magnetic material, it can be released by magnetization after film formation. When the substrate is held by the iron, the holding plate is separated from the mask in a state where the intermediate plate is brought into contact with the substrate.

A film forming apparatus according to an aspect of the present invention includes a film forming chamber, a film forming source, a mask sheet, an intermediate sheet, a holding plate, and a pressing mechanism.

The film formation source is disposed in the film formation chamber.

The mask plate is disposed opposite to the film formation source and is made of a magnetic material.

The intermediate plate has a first surface facing the mask plate and a second surface opposite to the first surface, and the first surface is configured to be disposed on the mask plate The substrate is in contact.

The holding plate supports the intermediate plate so as to be relatively movable in an axial direction orthogonal to the mask plate. The holding plate has a magnet configured to be capable of magnetically adsorbing the mask through the intermediate plate and the substrate.

The pressing mechanism is disposed in the second facing direction, and is configured to be capable of pressing at least a portion of the second surface along the axial direction.

A substrate holding method according to an aspect of the present invention includes the step of disposing a substrate on a mask formed of a magnetic material.

The intermediate plate is brought into contact with the upper side of the substrate.

At least a portion of the intermediate plate is pressed toward the mask by a pressing mechanism.

A holding plate having a magnet that magnetically adsorbs the mask is disposed above the intermediate plate, thereby integrally holding the intermediate plate, the substrate, and the upper plate The mask plate.

According to the present invention, the adhesion between the mask and the substrate can be ensured.

10‧‧‧filming room

20‧‧‧ evaporation source

30‧‧‧Substrate holder

31‧‧‧Mask members

32‧‧‧Intermediate board

32a‧‧‧ lower surface (first side)

32b‧‧‧Upper surface (second side)

33‧‧‧Maintenance board

34‧‧‧ Pressing mechanism

35, 37‧‧‧ Press unit

36‧‧‧Support unit

40‧‧‧Control Department

100‧‧‧ film forming device

311‧‧‧ mask board

312‧‧‧Framework

312a‧‧‧ escaping department

321‧‧‧Axis

321h‧‧‧ head

331‧‧‧ Magnet

332‧‧‧through holes

351‧‧‧Press parts

352‧‧‧Bolt components

353‧‧‧Support

354‧‧‧ Nut components

355‧‧‧Flexible components

G1, G2, G3‧‧‧ distance (gap)

W‧‧‧Substrate

Fig. 1 is a schematic cross-sectional view showing a film forming apparatus according to an embodiment of the present invention.

2 is a schematic enlarged view of the substrate holding device in the film forming apparatus described above, and shows a state before the substrate is held.

Fig. 3 is a schematic enlarged view of the substrate holding device in the film forming apparatus, and shows a state in which the substrate is held.

4 is a side view schematically showing a positional relationship between a mask plate, a substrate, an intermediate plate, and a magnet (holding plate) in the substrate holding device.

Fig. 5 is a schematic side view showing a state in which the substrate is held when the intermediate plate is deformed.

Fig. 6 is a schematic side view showing the action of the above substrate holding device.

Fig. 7 is a schematic side cross-sectional view showing a configuration example of a pressing mechanism in the substrate holding device, and shows a non-holding state of the substrate.

8 is a schematic side cross-sectional view showing a configuration example of a pressing mechanism in the substrate holding device, and shows a state immediately before the substrate is held.

FIG. 9 is a schematic side cross-sectional view showing a configuration example of a pressing mechanism in the substrate holding device, and shows a state in which the substrate is held.

Figure 10 is a view showing the pressing of the intermediate plate by the above pressing mechanism A schematic plan view of an example of a part site.

Fig. 11 is a schematic plan view showing an intermediate plate of a modification of the above pressing mechanism.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a schematic cross-sectional view showing a film forming apparatus 100 according to an embodiment of the present invention. In the figure, the X-axis, the Y-axis, and the Z-axis display three-axis directions orthogonal to each other, the X-axis and the Y-axis show the horizontal direction, and the Z-axis shows the height direction (even in the following figures) .

[The overall structure of the film forming apparatus]

The film forming apparatus 100 of the present embodiment is configured as a vacuum vapor deposition apparatus, and includes a film forming chamber 10, an evaporation source 20 (film forming source), and a substrate holding device 30.

The film forming chamber 10 is composed of a vacuum chamber. In other words, a vacuum pump (not shown) is connected to the film forming chamber 10, and the inside of the film forming chamber 10 can be exhausted and maintained in a predetermined low-pressure atmosphere.

The film forming apparatus 100 is configured, for example, by a cluster type vacuum film forming apparatus in which a plurality of processing chambers including the film forming chamber 10 are disposed through a gate valve around a transfer chamber. In this case, as shown in FIG. 1, it is possible to pass through a substrate transporter (not shown) provided in the transfer chamber. The person transports the substrate W from the transfer chamber toward the film forming chamber 10 or from the film forming chamber 10 toward the transfer chamber.

The evaporation source 20 is a vapor source for generating a vapor deposition material (or an evaporation material), and can be applied to various evaporation sources such as a resistance heating type, an induction heating type, and an electron beam heating type. As the vapor deposition material, a metal compound material such as a metal material, a metal oxide or a metal sulfide, a synthetic resin material, or an organic EL (electroluminescence) material can be used.

In addition, the evaporation source 20 may also include a shutter that prevents vapor from reaching the substrate W held by the substrate holding device 30. Further, the evaporation source 20 may be fixed to the bottom of the film forming chamber 10, or may be configured to relatively move the bottom of the film forming chamber 10 and the substrate holding device 30 in the horizontal direction.

[Substrate holding device]

The substrate holding device 30 is disposed at a position directly above the evaporation source 20, and is configured to be capable of holding the substrate W to be formed in a position facing the evaporation source 20. The substrate holding device 30 includes a mask member 31, an intermediate plate 32, a holding plate 33, and a pressing mechanism 34.

2 and 3 are schematic enlarged views of the substrate holding device 30, wherein FIG. 2 shows a state before the substrate W is held, and FIG. 3 shows a state after the substrate W is held.

The mask member 31 is disposed opposite to the evaporation source 20. The mask member 31 is fixed to the inside of the film forming chamber 10 through a fixing portion (not shown).

The mask member 31 has a mask plate 311 facing the film formation of the substrate W, and a frame portion 312 supporting the periphery of the mask plate 311.

The mask sheet 311 is composed of a thin plate composed of a magnetic material having a prescribed opening pattern. The constituent material of the mask plate 311 is not particularly limited, and typically, Fe (iron), Co (cobalt), Ni (nickel), or the like, such as an alloy having high magnetic permeability (soft magnetic property) can be used. Strong magnetic material. Further, in order to suppress thermal deformation of the mask sheet 311 caused by the amount of heat input from the film formation source (evaporation source 20), it is also possible to use an iron-nickel alloy (ivar) having a small coefficient of thermal expansion. The alloy is used as a constituent material of the mask plate 311. The mask plate 311 is formed to have a size that can cover the film formation surface of the substrate W. The size of the substrate W is not particularly limited, and in the present embodiment, rectangular glass substrates of the fourth to fifth generations (G4 to G5) are employed (for example, 680 mm to 1200 mm in the longitudinal direction and 730 mm to 1300 mm in the lateral direction).

The frame portion 312 is fixed to the fixing portion for holding the mask plate 311 in a horizontal posture. The frame portion 312 may be formed of a magnetic material similarly to the mask plate 311. However, the frame portion 312 is not limited thereto and may be composed of a non-magnetic member.

The intermediate plate 32 is disposed above the mask member 31 and is formed of a rectangular plate material having a specified thickness larger than the substrate W. In the present embodiment, the intermediate plate 32 is made of austenite-based stainless steel or a non-magnetic material such as aluminum or copper. The intermediate plate 32 has a lower surface 32a (first surface) opposite to the mask plate 311; and an opposite surface upper surface 32b (second surface). The lower surface 32a of the intermediate plate 32 is configured to be able to contact the back surface (non-vapor-deposited surface) of the substrate W opposed to the mask 311 while the substrate is held (FIG. 3).

A circulation flow path of cooling water may be formed inside the intermediate plate 32. Thereby, it is possible to suppress an excessive rise in the temperature of the substrate W during film formation, and it is possible to cool the substrate W to a predetermined temperature or lower.

The holding plate 33 is disposed above the intermediate plate 32 and is supported to be capable of relatively moving the intermediate plate 32 in the axial direction (Z-axis direction) orthogonal to the mask plate 31. The holding plate 33 has a magnet 331 configured to be capable of magnetically absorbing the mask 311 through the intermediate plate 32 and the substrate W. The magnet 331 is composed of a plate-shaped permanent magnet disposed on the lower surface of the holding plate 33 and larger than the substrate W.

The holding plate 33 is configured to be relatively movable in the Z-axis direction by a lifting mechanism (not shown). The holding plate 33 is in a state before the substrate W is held, as shown in FIG. 2, a position (upward position) that has been moved away from the mask plate 311, and when the substrate W is held, as shown in FIG. The position of the mask plate 311 adjacent (down position). As described later, The intermediate plate 32 is configured such that the lower surface 32a is moved away from the mask plate 311 by a predetermined distance in the raised position, and the lower surface 32a is brought into contact with the mask plate 311 (or the substrate W) at the lowered position.

The pressing mechanism 34 has a plurality of pressing units 35 configured to be capable of pressing at least a part of the upper surface 32b of the intermediate plate 32 in the Z-axis direction. As will be described later, the plurality of pressing units 35 are respectively disposed on the holding plate 33 so as to face the upper surface 32b of the intermediate plate 32.

The pressing mechanism 34 is for preventing a gap from being generated between the substrate W and the intermediate plate 32 due to the deflection or deformation of the intermediate plate 32, and has a function of: at a specified pressure when the holding plate 33 has reached the lowered position The upper surface of the intermediate plate 32 which has been in contact with the non-vapor-deposited surface of the substrate W is pressed, whereby the shape of the intermediate plate 32 is corrected to be flat.

4 is a side view schematically showing the positional relationship between the mask plate 311, the substrate W, the intermediate plate 32, and the magnet 331 (holding plate 33). When the substrate W is held, the intermediate plate 32 is brought into contact with the non-vapor-deposited surface of the substrate W by the movement of the holding plate 33 toward the lowered position, and the mask plate 311 is magnetically attracted by the magnet 331 and the intermediate plate 32 and the mask plate are moved. The substrate W is sandwiched between 311.

At this time, as shown in FIG. 5, when a gap is generated between the substrate W and the intermediate plate 32 due to the deformation of the intermediate plate 32, even if the holding plate 33 has moved to the lowered position, that is, the substrate has been held. State, mask 311 The distance from the magnet 331 is still large, and the magnetic force of the magnet 331 required to bring the mask plate 311 into close contact with the substrate W is insufficient. Therefore, in the present embodiment, as shown in FIG. 6, at least a part of the upper surface 32b of the intermediate plate 32 is directed toward the substrate W (the mask plate 311) in a state where the holding plate 33 has moved to the lowered position. The side is pressed, thereby reducing the amount of deformation of the intermediate plate 32, and thereby maintaining the flatness of the intermediate plate 32.

The plurality of pressing units 35 are configured to be capable of partially pressing the upper surface of the intermediate plate 32, respectively. Since the pressing mechanism 34 is provided with a plurality of pressing units 35, the flatness of the intermediate plate 32 can be easily improved. The pressing position of the intermediate plate 32 (the position at which the pressing unit 35 is disposed) is not particularly limited, and typical examples thereof include a central portion or a peripheral portion of the intermediate plate 32, or both of them.

The plurality of pressing units 35 typically have the same configuration, respectively. 7 to 9 are side cross-sectional views schematically showing the configuration of the pressing mechanism 35, wherein Fig. 7 shows a state before the substrate W is held, Fig. 8 shows a state immediately before the substrate is held, and Fig. 9 shows that the substrate W is held. status.

Here, FIG. 7 shows a state in which the substrate W and the holding plate 33 are lowered from the rising position of the holding plate 33 shown in FIG. 2, and the substrate W has been placed on the upper surface of the mask plate 311, and the intermediate plate is not provided. The state in which the substrate W is contacted.

Moreover, in order to facilitate understanding of the action of the pressing unit 35, in FIGS. 7 and 8, the intermediate plate 32 is drawn in a slightly deformed state (a state in which deflection has occurred), and the substrate shown in FIG. W in the state of retention It is depicted in a state (planar state) in which the deflection of the intermediate plate 32 has been corrected.

A plurality of shaft portions 321 extending in the Z-axis direction are provided on the upper surface 32b of the intermediate plate 32, and a plurality of through holes 332 are provided in the holding plate 33 and the magnet 331 so as to correspond to the positions of the shaft portion 321. Each of the plurality of shaft portions 321 passes through the plurality of through holes 332, and a head portion 321h that can abut against the peripheral edge of the opening portion of the through hole 332 from the upper side of the through hole 332 is provided at the upper end portion thereof.

Each of the shaft portions 321 is formed of the same length and is suspended by the weight of the intermediate plate 32 (for example, when the holding plate 33 is at the raised position), and is set to the upper surface 32b of the intermediate plate 32 and the magnet. A length of the distance G1 is formed between the lower surfaces of 331. Thereby, the intermediate plate 32 can be relatively moved so as to be supported by the holding plate 33 so as to be longest in the Z-axis direction by only the distance G1.

In the present embodiment, the head portion 321h of the shaft portion 321 is formed in an inverted conical trapezoidal shape. With this configuration, in the suspended state of the intermediate plate 32 shown in FIG. 7, the axial center of each of the shaft portions 321 can be aligned with the axial center of each of the through holes 332, so that the intermediate plate 32 can be stably maintained to the holding plate 33. Hanging posture. In addition, in order to further improve the above-described effects, the opening portion of the through hole 332 on the holding plate 33 side may be formed in an inverted conical shape (ditch shape) corresponding to the shape of the head portion 321h as illustrated.

On the other hand, a plurality of pressing units 35 are provided on the holding plate 33 and are disposed at the through positions of the plurality of shaft portions 321 , respectively. Each of the pressing units 35 has a pressing member 351 disposed at a position directly above the head portion 321h of the shaft portion 321, and an elastic member 355 disposed between the pressing member 351 and the upper surface 32b of the intermediate plate 32.

The pusher 351 is disposed on the head portion 321h of the shaft portion 321 so as to face the Z-axis direction. The pressing member 351 is composed of, for example, a circular plate material, and a bolt member 352 that extends in the Z-axis direction is fixed to the center portion thereof. The bolt member 352 penetrates the top of the support portion 353 provided on the upper surface of the holding plate 33 so as to surround the head portion 321h of the shaft portion 321, and is screwed to the nut member 354 fixed to the upper surface of the support portion 353. . Therefore, by rotating the bolt member 352 about the nut member 354, the relative distance between the pressing member 351 and the head portion 321h of the shaft portion 321 can be adjusted.

The elastic member 355 is elastically deformable in the Z-axis direction and is provided on the upper surface of the head portion 321h of the shaft portion 321. Although the elastic member 355 is typically constituted by a coil spring, it is not limited thereto, and may be composed of an elastic material such as a rubber or an elastomer. In the present embodiment, when the holding plate 33 is at the first position, a distance G2 is formed between the upper surface of the elastic member 355 and the lower surface of the pressing member 351. The distance G2 is set to a value smaller than the distance G1. The value of the distance G2 can also be zero. In addition, the elastic member 355 may not be disposed on the upper surface of the head portion 321h of the shaft portion 321 but may be disposed on the pressing member 351. Under the surface.

In the present embodiment, the intermediate plate 32 has a first position shown in FIG. 7 with respect to the holding plate 33 (magnet 331); a second position (contact position) shown in FIG. 8; and Three positions (hold position). The intermediate plate 32 is configured to be movable between the first position and the third position along the Z-axis direction via the second position.

In the first position, the intermediate plate 32 is suspended by the holding plate 33, the lower surface 32a of the intermediate plate 32 does not contact the substrate W, and the upper surface 32b of the intermediate plate 32 is separated from the gap G1 by the relative distance. The plate 33 (magnet 331) is opposed.

In the second position, the lower surface 32a of the intermediate plate 32 contacts the substrate W, and the holding plate 33 is lowered until the pressing member 351 contacts the upper surface of the elastic member 355, and the upper surface 32b of the intermediate plate 32 is separated by a gap (G1). The relative distance (first distance) of -G2) is opposite to the holding plate 33 (magnet 331).

In the third position, at least a portion of the lower surface 32a of the intermediate plate 32 contacts the substrate W, and the holding plate 33 further reduces the elastic member 355 by a predetermined amount while being compressed and deformed, and the upper surface 32b of the intermediate plate 32 is separated. The relative distance (second distance) of the gap G3 smaller than the gap (G1-G2) is opposed to the holding plate 33 (the magnet 331).

Since the pressing unit 35 is configured as described above, the pressing mechanism 34 can be in the intermediate position 32 from the second position (contact position) toward the third position. During the movement of the (holding position), the upper surface 32b of the intermediate plate 32 is pressed in the Z-axis direction.

The lowered position of the holding plate 33 is set at a position at a predetermined height from the mask plate 311. In this case, the pressing force of the intermediate plate 32 caused by the pressing mechanism 34 (pressing unit 35) can be set by the magnitude of the distance G2. Therefore, the above pressing force can be easily adjusted by changing the distance G2.

As shown in FIGS. 2 and 3, the substrate holding device 30 further includes a support unit 36 for supporting the substrate W conveyed into the film forming chamber 10 between the mask plate 311 and the intermediate plate 32. The support unit 36 is, for example, a plurality of hooks for supporting the peripheral portion of the lower surface of the substrate W. The support unit 36 is configured to be movable up and down between a substrate receiving position ( FIG. 2 ) of the substrate transfer device (not shown) and a substrate mounting position ( FIG. 3 ) in which the substrate is placed on the mask plate 311 . Moreover, the support unit 36 is configured to be movable in the horizontal direction so that the alignment of the substrate W to the mask plate 311 can be performed.

The film forming apparatus 100 further includes an evaporation source 20, a substrate holding device 30, and a control unit 40 that controls the operation of the support unit 36 and the like. The control unit 40 is typically constituted by a computer and controls the operations of the respective units by executing a designated program.

[Operation of film forming apparatus]

Next, a typical operation of the film forming apparatus 100 of the present embodiment configured as described above will be described.

The substrate W transported to the film forming chamber 10 through a gate valve (not shown) is supported by the support unit 36 that has been placed in the substrate receiving position by the film forming surface facing downward. At this time, the holding plate 33 is moved to the raised position as shown in FIG. 2, and the intermediate plate 32 is suspended from the holding plate 33 by its own weight. The substrate W is disposed between the intermediate plate 32 and the mask plate 311 by the support unit 36. Thereafter, the alignment of the substrate W in the horizontal direction of the mask plate 311 is performed.

After the alignment of the substrate W, the support unit 36 is lowered toward the substrate mounting position, and the substrate W is placed on the upper surface of the mask plate 311. Further, a plurality of relief portions (recesses) 312a for avoiding collision with the support unit 36 that is lowered toward the substrate placement position are provided on the upper surface of the frame portion 312 of the mask member 31.

Thereafter, the holding plate 33 is moved from the raised position shown in FIG. 2 toward the lowered position shown in FIG. Thereby, the lower surface 32a of the intermediate plate 32 contacts the non-vapor-deposited surface (non-film-forming surface) of the substrate W, and by the relative movement of the holding plate 33 to the intermediate plate 22, the magnet 331 is adjacent to the intermediate plate 32. Upper surface 32b. At this time, the magnet 331 is stopped by a slight gap (G3) with respect to the upper surface 32b of the intermediate plate.

On the other hand, a plurality of portions of the upper surface 32b of the intermediate plate 32 are partially pressed in the Z-axis direction from the respective pressing units 35 toward the substrate W and the mask plate 311 until the first portion shown in FIG. The position is moved toward the third position (holding position) shown in FIG. 9 via the second position (contact position) shown in FIG. In the present embodiment, the intermediate plate 32 is pressed toward the mask plate 311 by the pressing amount of each pressing unit 35 at a distance corresponding to (G1-G2-G3). At this time, in the case where the intermediate plate 32 has been bent or deformed, the deflection or deformation is corrected to be flat, so that the flatness of the intermediate plate 32 can be improved (Fig. 9). Thereby, since the contact area of the lower surface 32a of the intermediate plate 32 with respect to the substrate W can be increased, the relative distance between the magnet 331 and the mask plate 311 is also shortened, and the mask plate 311 caused by the magnet 331 can be improved. As a result of the magnetic attraction force, the adhesion between the substrate W and the mask sheet 311 can be improved.

As described above, the intermediate plate 32, the substrate W, and the mask plate 311 can be held integrally. Thereafter, the film formation process of the substrate W can be performed. According to the present embodiment, since the adhesion between the substrate W and the mask plate 311 can be ensured by the substrate holding device 30, the gap between the substrate W and the mask plate 311 can be made extremely small, and the vapor deposition material can be prevented thereby. Wrap from this gap.

Further, the flatness of the intermediate plate 32 is increased by the pressing unit 35, and the flatness of the substrate W which follows the lower surface 32a of the intermediate plate 32 can be ensured. Thereby, a high-precision mask film formation process can be realized on the film formation surface of the substrate W. Furthermore, by reciprocating the evaporation source 20 while moving in the horizontal direction By performing the film formation treatment, it is possible to improve the in-plane uniformity of the film formation process over the entire film formation surface of the substrate W.

After the film formation process is completed, the substrate holding device 30 moves the holding plate 33 from the lowered position shown in FIG. 3 toward the raised position shown in FIG. 2 . At this time, the substrate W can be maintained pressed by the pressing force of the pressing unit 35 and the weight of the intermediate unit until the holding plate 33 is moved by the predetermined distance (corresponding to the distance of G1 - G3). The state of the cover plate 311. Thereby, since the positional shift of the board|substrate W to the masking board 311 can be prevented, it can prevent that the vapor-deposition pattern formed in the film formation surface is damaged in the mask opening part. Further, since the intermediate plate 32 is made of a non-magnetic material, the pulling operation of the magnet 331 to the mask plate 311 is facilitated.

After the holding plate 33 is moved to the raised position, the support unit 36 is raised toward the substrate receiving position (Fig. 2). Then, the substrate W on which the film formation is completed is carried out toward the outside of the film forming chamber 10 through a substrate transfer device (not shown). Thereafter, the new substrate W to be formed into a film is conveyed toward the support unit 36, and the substrate W is held and film-formed by the same operation as described above.

As described above, the intermediate plate 32 has a function of maintaining the planar state of the substrate W by contacting the non-film-forming surface of the substrate W opposed to the mask plate 311. On the other hand, the larger the intermediate plate 32 is, or the smaller the thickness of the intermediate plate 32 is, the lower the flatness of the intermediate plate 32 itself is. Therefore, the substrate holding device 30 of the present embodiment is provided with at least the intermediate plate 32 A part of the pressing mechanism 34 that is pressed toward the side of the mask plate 311. Thereby, the flatness of the intermediate plate 32 can be improved, and as a result, the flatness of the substrate contacting the intermediate plate 32 can be maintained, and excellent adhesion to the mask plate 311 can be ensured. Moreover, since the intermediate plate 32 can be made thinner, it is possible to ensure a stable adhesion between the mask plate 311 and the substrate W regardless of the substrate size.

Further, in the substrate holding device 30 of the present embodiment, since the pressing mechanism 34 (pressing unit 35) is disposed opposite to the upper surface 32b of the intermediate plate 32, it is possible to provide any mechanism portion on the side of the evaporation source 20 without using any mechanism portion. Adhesion between the mask 311 and the substrate W is sought. Therefore, the adhesion between the mask plate 311 and the substrate W can be stably maintained without depending on the aperture ratio of the mask plate 311 or the arrangement of the mask openings.

Further, since the pressing mechanism 34 is provided on the holding plate 33, the device configuration can be simplified, and the desired position of the intermediate plate 32 can be stably pressed.

Further, in the substrate holding device 30 of the present embodiment, the intermediate plate 32 can be pressed in the direction of gravity by the pressing mechanism 34. Thereby, the flatness of the intermediate plate 32 can be prevented by the deflection of the substrate W or the intermediate plate 32, so that the desired film formation accuracy can be stably obtained.

Although the embodiments of the present invention have been described above, The present invention is not limited to the above-described embodiments, and various changes can be applied thereto.

For example, in the above embodiment, the vacuum vapor deposition apparatus has been described as an example of a film formation apparatus. However, the present invention is not limited thereto, and the present invention is also applicable to other film formation such as a sputtering apparatus. Device. In this case, a sputtering cathode that holds a sputtering target is configured as a film forming source.

Further, the plurality of pressing units 35 constituting the pressing mechanism 34 are not limited to being disposed in the central portion and/or the peripheral portion of the intermediate plate 32. As shown in FIG. 10, the shape, size, thickness, and the like of the intermediate plate 32 may be in addition to the central portion, the peripheral portion, and the four corner portions of the intermediate plate 32, and may be at the intermediate positions. The pressing unit 35 is configured. The number of the pressing units 35 is not particularly limited. In the case of pressing any part of the intermediate plate, at least one may be used, and in the case of pressing substantially the entire area of the intermediate plate, it is only necessary to arrange more at a narrow pitch. The pressing unit can be. Further, as shown in FIG. 11, a frame-shaped pressing unit 37 capable of pressing the peripheral edge portion of the intermediate plate 32 in a batch manner may be employed.

In the above embodiment, the example in which the pressing mechanism 34 is provided on the holding plate 33 has been described. However, the present invention is not limited thereto, and may be configured to be independent of the holding plate 33.

31‧‧‧Mask members

32‧‧‧Intermediate board

33‧‧‧Maintenance board

34‧‧‧ Pressing mechanism

35‧‧‧ Press unit

36‧‧‧Support unit

311‧‧‧ mask board

312‧‧‧Framework

312a‧‧‧ escaping department

331‧‧‧ Magnet

W‧‧‧Substrate

Claims (9)

A substrate holding device comprising: a mask plate made of a magnetic material; the intermediate plate having a first surface facing the mask plate and a second surface opposite to the first surface, and the One surface is configured to be in contact with a substrate disposed on the mask plate, and the holding plate is configured to support the intermediate plate so as to be relatively movable in an axial direction orthogonal to the mask plate, and configured to be permeable The intermediate plate and the substrate magnetically adsorb the magnet of the mask; and the pressing mechanism is disposed in the second facing direction, and is configured to be capable of pressing at least a part of the second surface along the axial direction. The substrate holding device according to claim 1, wherein the pressing mechanism is provided on the holding plate. The substrate holding device according to claim 2, wherein the pressing mechanism includes a plurality of pressing units configured to be capable of pressing a plurality of portions of the second surface. The substrate holding device according to claim 2, wherein the intermediate plate is configured such that at least a part of the first surface contacts the substrate, and a relative distance from the holding plate is a contact distance of a first distance, And moving between the holding positions of the second distance that is smaller than the aforementioned first distance with respect to the aforementioned holding plate; The pressing mechanism presses the second surface along the axial direction while the intermediate plate moves from the contact position toward the holding position. The substrate holding device according to claim 4, wherein the pressing unit has a pressing member disposed in the second facing direction, and the elastic member is disposed between the pressing member and the second surface, and is capable of being disposed between the pressing member and the second surface It is elastically deformed in the aforementioned axial direction. The substrate holding device according to claim 3, wherein the pressing unit is configured to be capable of pressing a central portion and/or a peripheral portion of the second surface. The substrate holding device according to claim 1, wherein the intermediate plate is made of a non-magnetic material. A film forming apparatus comprising: a film forming chamber; a film forming source disposed in the film forming chamber; a mask plate disposed opposite to the film forming source and configured by a magnetic material; and an intermediate plate having the covering a first surface facing the cover plate and a second surface opposite to the first surface, wherein the first surface is configured to be in contact with a substrate disposed on the mask plate; and a holding plate for The intermediate plate is supported to be movable in an axial direction orthogonal to the mask plate, and has a magnet configured to be capable of magnetically adsorbing the mask plate through the intermediate plate and the substrate; The pressing mechanism is disposed in the second facing direction and configured to be capable of pressing at least a portion of the second surface along the axial direction. A substrate holding method comprising: disposing a substrate on a mask plate made of a magnetic material; contacting an intermediate plate above the substrate; and guiding at least a portion of the intermediate plate toward the mask plate by a pressing mechanism Pressing; and a holding plate having a magnet that magnetically adsorbs the mask plate is disposed above the intermediate plate, thereby integrally holding the intermediate plate, the substrate, and the mask plate.