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TW201706800A - Touch panel and method of its manufacturing - Google Patents

Touch panel and method of its manufacturing Download PDF

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Publication number
TW201706800A
TW201706800A TW105110082A TW105110082A TW201706800A TW 201706800 A TW201706800 A TW 201706800A TW 105110082 A TW105110082 A TW 105110082A TW 105110082 A TW105110082 A TW 105110082A TW 201706800 A TW201706800 A TW 201706800A
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Taiwan
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film
layer
touch panel
adhesive
conductive
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TW105110082A
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Chinese (zh)
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Takeshi Isoda
Hitoshi Ao
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Hosiden Corp
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Publication of TW201706800A publication Critical patent/TW201706800A/en

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  • Push-Button Switches (AREA)
  • Manufacture Of Switches (AREA)
  • Position Input By Displaying (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A touch panel includes a panel member and a multilayer film (10) joined to a front face of the panel member (11), the multilayer film (10) including a conductive film (1, 2) having a conductive layer (1a, 2a) and a protective film (4). In the multilayer film (10), the respective films are laminated to each other via an adhesive layer (5, 6, 7) formed of a thermosetting type adhesive agent and formed in a three-dimensional shape along the front face.

Description

觸控面板及其製造方法 Touch panel and method of manufacturing same

本發明係關於觸控面板及其製造方法。 The present invention relates to a touch panel and a method of fabricating the same.

從以往即使用觸控面板作為汽車的音響機器、家電製品、電子機器等的輸入裝置。觸控面板係通常藉由分別印刷並層合在絕緣性薄膜的表面檢測出電容變化的導電層及裝飾用的加飾層而形成。藉由使用觸控面板,具有可使操作面平坦及可省略用於輸入操作的各種開關構件等的優點。 In the past, a touch panel has been used as an input device for an audio device, a home appliance, an electronic device, or the like of a car. The touch panel is usually formed by printing and laminating a conductive layer that changes capacitance on the surface of the insulating film and a decorative layer for decoration. By using the touch panel, there is an advantage that the operation surface can be made flat and various switching members for input operations and the like can be omitted.

設置在觸控面板的加飾層係配合觸控面板的用途或嗜好等而從多種中選擇。然而,在1片薄膜印刷並層合加飾層與導電層者,並不容易實現導電層與加飾層的多樣組合。因此,存在著將具備加飾層的加飾薄膜與具備導電層的導電薄膜以黏接劑接合的觸控面板(例如專利文獻1)。藉由分別設置加飾薄膜與導電薄膜,而可容易實現導電層與加飾層的多樣組合。 The selection of the touch panel is matched with the use or preference of the touch panel, and the like. However, in a film printed and laminated with a decorative layer and a conductive layer, it is not easy to achieve various combinations of the conductive layer and the decorative layer. Therefore, there is a touch panel in which a decorative film having a decorative layer and a conductive film having a conductive layer are bonded by an adhesive (for example, Patent Document 1). Various combinations of the conductive layer and the decorative layer can be easily realized by separately providing the decorative film and the conductive film.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

[專利文獻1]日本特開第2014-2450號 [Patent Document 1] Japanese Patent Laid-Open No. 2014-2450

觸控面板具有按照設置處所考慮到設計上或視覺上的理由而設成曲面等三維形狀為較佳的情況。在專利文獻1的觸控面板,利用薄膜嵌入法或TOM工法(Three Dimension Overlay Method)等,使加飾薄膜經由黏接劑而成的黏接層而被接合到導電薄膜。在使用薄膜嵌入法等將觸控面板成形為三維形狀時,雙方的薄膜在由黏接層接合而扭曲變形。因此,硬化的黏接層可能會在變形時破裂。為了防止黏接層破裂,若使用黏接膠帶取代黏接層的話,則可簡單貼合各種薄膜材。然而,由於黏接膠帶的黏接力通常小於黏接劑,所以例如有在起伏較大的三維成形部位各薄膜從黏接膠帶剝離之虞。因此,在觸控面板,經層合的薄膜形狀之自由度會受到限制。 It is preferable that the touch panel has a three-dimensional shape such as a curved surface in consideration of design or visual considerations in the installation. In the touch panel of Patent Document 1, the decorative film is bonded to the conductive film via an adhesive layer formed of an adhesive by a film embedding method, a Three Dimension Overlay Method, or the like. When the touch panel is formed into a three-dimensional shape by a film embedding method or the like, both films are twisted and deformed by being bonded by the adhesive layer. Therefore, the hardened adhesive layer may break when deformed. In order to prevent the adhesive layer from rupturing, if an adhesive tape is used instead of the adhesive layer, various film materials can be easily attached. However, since the adhesive force of the adhesive tape is usually smaller than that of the adhesive, for example, the film is peeled off from the adhesive tape at a three-dimensionally formed portion having a large undulation. Therefore, in the touch panel, the degree of freedom of the laminated film shape is limited.

本發明係鑒於上述實際情況而成者,目的在於提供一種即使將經層合的薄膜成形為三維形狀,其形狀也可被穩定保持的觸控面板及其製造方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a touch panel and a method of manufacturing the same that can be stably maintained even if a laminated film is formed into a three-dimensional shape.

本發明的觸控面板之特徵構成為具備:面板材;及複層薄膜,其接合至前述面板材的表面,並包含具 有導電層的導電薄膜及保護薄膜,前述複層薄膜係使各薄膜經由利用熱硬化性黏接劑所形成的黏接層而層合,並且以沿著前述表面的三維形狀成形。 The touch panel of the present invention is characterized in that: a surface plate; and a multi-layer film bonded to the surface of the surface plate and including The conductive film having a conductive layer and the protective film are formed by laminating the respective films through an adhesive layer formed using a thermosetting adhesive, and are formed in a three-dimensional shape along the surface.

在本構成,複層薄膜係包含導電薄膜及保護薄膜,各薄膜經由熱硬化性黏接劑而成的黏接層而層積,因此在加熱前的常溫時,黏接層不會硬化。因此,可在黏接層不破裂的情況下使複層薄膜變形,並在加熱複層薄膜的同時,於成形為三維形狀之中或之後使黏接層硬化。因此,可將包含導電薄膜及保護薄膜的複層薄膜,在各薄膜經由黏接層密接的狀態,而成形為三維形狀。藉此,複層薄膜在成形為三維形狀時不易產生成形扭曲,引發各薄膜與黏接層之剝離的內部應力降低。結果,在觸控面板中,複層薄膜的三維形狀可被穩定保持。 In the present configuration, the multi-layer film includes a conductive film and a protective film, and each film is laminated via an adhesive layer made of a thermosetting adhesive. Therefore, the adhesive layer is not cured at normal temperature before heating. Therefore, the multi-layer film can be deformed without breaking the adhesive layer, and the adhesive layer can be hardened during or after forming into a three-dimensional shape while heating the multi-layer film. Therefore, the multilayer film including the conductive film and the protective film can be formed into a three-dimensional shape in a state in which the respective films are in close contact via the adhesive layer. Thereby, when the multi-layer film is formed into a three-dimensional shape, formation distortion is less likely to occur, and internal stress which causes peeling of each film and the adhesion layer is lowered. As a result, in the touch panel, the three-dimensional shape of the multi-layer film can be stably maintained.

本發明的觸控面板之其他特徵構成係在於前述保護薄膜為具有加飾層的加飾薄膜之點。 Another feature of the touch panel of the present invention is that the protective film is a decorative film having a decorative layer.

如本構成所示,在複層薄膜中,保護薄膜為具有加飾層的加飾薄膜的話,可藉由選擇加飾薄膜在觸控面板中輕易實現導電層與加飾層的多樣組合。 As shown in the present invention, in the multi-layer film, if the protective film is a decorative film having a decorative layer, various combinations of the conductive layer and the decorative layer can be easily realized in the touch panel by selecting the decorative film.

本發明的觸控面板之製造方法的特徵手段為具有:薄膜製造步驟,其將具有導電層的導電薄膜及保護薄膜經由熱硬化性黏接劑所形成的黏接層來層合而製造複層薄膜;薄膜成形步驟,其將前述複層薄膜加熱並使其變形為三維形狀;及面板一體化步驟,其將成形後的前述複層薄膜配置在射出成形用的模具,然後在前述模具內射出 熔融樹脂以使面板材成形,並且將前述複層薄膜與前述面板材一體化。 A method for manufacturing a touch panel of the present invention has a film manufacturing step of laminating a conductive film having a conductive layer and a protective film via an adhesive layer formed of a thermosetting adhesive to form a multilayer layer. a film forming step of heating and deforming the multi-layer film into a three-dimensional shape; and a panel integration step of disposing the formed multi-layer film in a mold for injection molding and then ejecting in the mold The resin is melted to form a face sheet, and the above-mentioned multi-layer film is integrated with the above-mentioned face sheet.

按照本特徵手段,藉由利用薄膜成形步驟在複層薄膜成形之後將其配置在模具並加以射出成形,而製造觸控面板。在此,複層薄膜係藉由薄膜製造步驟而製造,該薄膜製造步驟經由以熱硬化性黏接劑所形成的黏接層層合具有導電層的導電薄膜及保護薄膜。在薄膜製造步驟的完結時點,雖然複合薄膜的黏接層未硬化,但藉由其黏性可接合導電薄膜及保護薄膜。而且,在薄膜成形步驟加熱而引發三維形狀的成形中或成形後,複層薄膜的溫度超過熱硬化性黏接劑之硬化溫度的話,黏接層會硬化。如此一來,對於複層薄膜,因為在薄膜成形步驟中黏接層會硬化,所以在成形時可抑制各個薄膜發生扭曲。藉此,可製造使穩定的三維形狀之複層薄膜與面板材一體化的觸控面板。又,即使在薄膜成形步驟的加熱所導致的黏接層之硬化並未完成的情況,也可在面板一體化步驟中藉由加熱複層薄膜而使黏接層硬化。 According to the present feature, the touch panel is manufactured by disposing the multi-layer film in a mold after the formation of the multi-layer film by the film forming step and subjecting it to injection molding. Here, the multi-layer film is produced by a film manufacturing step of laminating a conductive film having a conductive layer and a protective film via an adhesive layer formed of a thermosetting adhesive. At the end of the film manufacturing step, although the adhesive layer of the composite film is not cured, the conductive film and the protective film can be bonded by the adhesiveness. Further, when the temperature of the multi-layer film exceeds the curing temperature of the thermosetting adhesive during or after the film forming step is heated to cause the three-dimensional shape, the adhesive layer is hardened. As a result, in the multi-layer film, since the adhesive layer is hardened in the film forming step, distortion of each film can be suppressed at the time of molding. Thereby, a touch panel in which a stable three-dimensional shape multi-layer film and a face sheet are integrated can be manufactured. Further, even in the case where the hardening of the adhesive layer due to the heating in the film forming step is not completed, the adhesive layer can be cured by heating the multi-layer film in the panel integration step.

1、2‧‧‧導電薄膜 1, 2‧‧‧ conductive film

1a‧‧‧第1導電層 1a‧‧‧1st conductive layer

1b‧‧‧黏合劑 1b‧‧‧Binder

2a‧‧‧第2導電層 2a‧‧‧2nd conductive layer

3‧‧‧加飾薄膜 3‧‧‧Plus film

3a‧‧‧加飾層 3a‧‧‧plus layer

4‧‧‧保護薄膜 4‧‧‧Protective film

4a‧‧‧保護層 4a‧‧‧Protective layer

5、6、7‧‧‧黏接層 5, 6, 7‧‧‧ adhesive layer

10‧‧‧複層薄膜 10‧‧‧Multilayer film

11‧‧‧面板材 11‧‧‧Face plate

12‧‧‧開口 12‧‧‧ openings

13‧‧‧端部 13‧‧‧End

14‧‧‧區隔部 14‧‧‧section

15‧‧‧透光性區域 15‧‧‧Translucent area

20~22‧‧‧觸控面板 20~22‧‧‧Touch panel

30‧‧‧模具 30‧‧‧Mold

31、32‧‧‧成形模 31, 32‧‧‧ Forming Die

33‧‧‧凸部 33‧‧‧ convex

34‧‧‧腔室 34‧‧‧ chamber

35‧‧‧閘門 35‧‧‧ gate

第1圖為表示複層薄膜的構成之圖。 Fig. 1 is a view showing the structure of a multilayer film.

第2圖為第1實施型態的觸控面板之立體圖。 Fig. 2 is a perspective view of the touch panel of the first embodiment.

第3圖為第2圖的III-III線箭號剖面圖。 Fig. 3 is a cross-sectional view of the arrow III-III in Fig. 2.

第4圖為表示預備成形後的複層薄膜之圖。 Fig. 4 is a view showing a multi-layer film after preliminary forming.

第5圖為表示觸控薄膜的成形步驟之圖。 Fig. 5 is a view showing a forming step of the touch film.

第6圖為表示觸控薄膜的成形步驟之圖。 Fig. 6 is a view showing a forming step of the touch film.

第7圖為表示觸控薄膜的成形步驟之圖。 Fig. 7 is a view showing a forming step of the touch film.

第8圖為表示觸控薄膜之成形步驟的另一形態之圖。 Fig. 8 is a view showing another form of a forming step of the touch film.

第9圖為表示觸控薄膜之成形步驟的另一形態之圖。 Fig. 9 is a view showing another form of a forming step of the touch film.

第10圖為第2實施型態的觸控面板之立體圖。 Fig. 10 is a perspective view of the touch panel of the second embodiment.

第11圖為第10圖的XI-XI線箭號剖面圖。 Figure 11 is a cross-sectional view of the arrow XI-XI of Figure 10.

第12圖為其他實施型態的觸控面板之立體圖。 Fig. 12 is a perspective view of a touch panel of another embodiment.

以下基於圖式說明本發明的實施型態。 The embodiments of the present invention will be described below based on the drawings.

(第1實施型態) (first embodiment)

觸控面板20係如第1圖~第3圖所示構成為複層薄膜10層合在面板材11的表面。面板材11及複層薄膜10一起形成為三維形狀。在本實施型態,觸控面板20的表面形成為三維曲面形狀。在面板材11的中央,形成有成為觸控面板20的操作畫面之開口12。 The touch panel 20 is configured such that the multi-layer film 10 is laminated on the surface of the face sheet 11 as shown in FIGS. 1 to 3 . The top sheet 11 and the multi-layer film 10 are formed together in a three-dimensional shape. In the present embodiment, the surface of the touch panel 20 is formed in a three-dimensional curved shape. An opening 12 that serves as an operation screen of the touch panel 20 is formed in the center of the face sheet 11.

如第1圖所示,複層薄膜10係依序使具有導電層1a、2a的導電薄膜1、2、黏接層6、具有加飾層3a的加飾薄膜3層合。加飾薄膜3的表面側(第1圖的上方側),經由黏接層7進一步使具有保護層4a的保護薄膜4層合。 As shown in Fig. 1, the multi-layer film 10 sequentially laminates the electroconductive thin films 1 and 2 having the conductive layers 1a and 2a, the adhesive layer 6, and the decorative film 3 having the decorative layer 3a. The surface side (upper side of the first drawing) of the decorative film 3 is further laminated with the protective film 4 having the protective layer 4a via the adhesive layer 7.

第1導電薄膜1及第2導電薄膜2在基膜的 表面側分別具備第1導電層1a及第2導電層2a。第1導電薄膜1與第2導電薄膜2係經由黏接層5而層合。由於第1導電層1a係例如檢測規定的一方向之座標位置,第2導電層2a係檢測與前述一方向交叉的方向之座標位置,所以第1導電薄膜1與第2導電薄膜2的組合具有作為觸控感測器的功能。在本實施型態,雖然觸控感測器由2片導電薄膜1、2構成,但觸控感測器可由1片導電薄膜構成。 The first conductive film 1 and the second conductive film 2 are on the base film The first conductive layer 1a and the second conductive layer 2a are provided on the front side. The first conductive film 1 and the second conductive film 2 are laminated via the adhesive layer 5 . Since the first conductive layer 1a detects, for example, a coordinate position in a predetermined direction, and the second conductive layer 2a detects a coordinate position in a direction intersecting the one direction, the combination of the first conductive film 1 and the second conductive film 2 has As a function of the touch sensor. In this embodiment, although the touch sensor is composed of two conductive films 1 and 2, the touch sensor may be composed of one conductive film.

加飾薄膜3係在基膜的背面側具有加飾層3a。加飾層3a係藉由網版印刷或轉印等而形成。加飾層3a係為非透光性並且被施加例如對應觸控面板20的設計或色調。 The decorative film 3 has a decorative layer 3a on the back side of the base film. The decorative layer 3a is formed by screen printing, transfer, or the like. The decorative layer 3a is non-transparent and is applied, for example, to the design or color tone of the touch panel 20.

保護薄膜4係在基膜的表面側具有保護層4a。作為保護層4a,例如塗佈有硬質材,藉此而具有耐刮、低反射、防眩、防指紋、傷痕修復、折射率調整、遲滯調整等功能。 The protective film 4 has a protective layer 4a on the surface side of the base film. The protective layer 4a is coated with a hard material, for example, and has functions such as scratch resistance, low reflection, anti-glare, anti-fingerprint, flaw repair, refractive index adjustment, and hysteresis adjustment.

保護薄膜4可僅由不具有保護層4a之以下的基膜構成。 The protective film 4 can be composed only of the base film which does not have the protective layer 4a below.

各薄膜1~4的基膜並未特別限定,可使用例如聚乙烯對苯二甲酸酯(PET)、聚碳酸酯(PC)、丙烯酸酯(PMMA)、環烯烴聚合物(COP)、聚丙烯(PP)、聚萘二甲酸乙二酯(PEN)、三醋酸纖維素(TAC)、聚醯胺(PI)等。各薄膜1~4的基膜可為全部同種材料,也可為不同材料。 The base film of each of the films 1 to 4 is not particularly limited, and for example, polyethylene terephthalate (PET), polycarbonate (PC), acrylate (PMMA), cycloolefin polymer (COP), poly Propylene (PP), polyethylene naphthalate (PEN), cellulose triacetate (TAC), polyamine (PI), and the like. The base film of each of the films 1 to 4 may be all of the same material or different materials.

黏接層5~7皆由熱硬化性黏接劑形成。熱硬化性黏接劑在常溫下具有黏著性者為較佳。熱硬化性黏接劑的種類並未特別限定,但使用例如熱硬化型光學透明黏接劑(Optical Clear Adhesive;OCA)為較佳。 The adhesive layers 5 to 7 are all formed of a thermosetting adhesive. It is preferred that the thermosetting adhesive has adhesiveness at normal temperature. The type of the thermosetting adhesive is not particularly limited, but for example, an optically clear optical transparent adhesive (OCA) is preferably used.

熱硬化性黏接劑可在硬化後具有一定程度的黏彈性。各薄膜1~4的相鄰薄膜之間有時會存在微妙的成形性之差異或熱收縮性、線膨脹係數等物性的差異。此時,若熱硬化性黏接劑為具有黏彈性者的話,則黏接層5~7成為緩衝體,可吸收各薄膜1~4的成形性之差異或物性之差異。藉此,可防止各薄膜1~4的剝離。 The thermosetting adhesive can have a certain degree of viscoelasticity after hardening. There may be a difference in subtle formability between the adjacent films of the respective films 1 to 4, or a difference in physical properties such as heat shrinkability and linear expansion coefficient. In this case, if the thermosetting adhesive is viscoelastic, the adhesive layers 5 to 7 serve as a buffer, and the difference in formability or physical properties of each of the films 1 to 4 can be absorbed. Thereby, peeling of each film 1~4 can be prevented.

熱硬化性黏接劑可為硬化後具有剛性者。此時,在各薄膜1~4發生的扭曲之相互作用會因黏接層5~7之剛性而斷絕,而可防止各薄膜1~4的剝離。 The thermosetting adhesive may be rigid after hardening. At this time, the interaction of the distortion occurring in each of the films 1 to 4 is broken by the rigidity of the adhesive layers 5 to 7, and the peeling of the respective films 1 to 4 can be prevented.

複層薄膜10係在第1導電薄膜1、第2導電薄膜2、加飾薄膜3的表面側分別塗佈黏接層5~7並使各薄膜1~4層合而形成。尚且,在導電薄膜1的背面側,塗佈有適合與面板材11黏接的黏合劑1b。 The multilayer film 10 is formed by applying the adhesive layers 5 to 7 on the surface sides of the first conductive film 1, the second conductive film 2, and the decorative film 3, and laminating the films 1 to 4. Further, on the back side of the electroconductive thin film 1, an adhesive 1b suitable for bonding to the top sheet 11 is applied.

(觸控面板的製造方法) (Manufacturing method of touch panel)

接著,說明使用薄膜嵌入法的觸控薄膜20的製造方法。觸控薄膜20的製造方法係如第4圖~第7圖所示具有:薄膜製造步驟,其製造複層薄膜10;薄膜成形步驟,其將複層薄膜10加熱並使其變形為三維形狀;及面板一體化步驟,其將成形後的複層薄膜10配置在射出成 形用的模具30,然後在模具30內射出熔融樹脂以使面板材11成形,並且將成形後的複層薄膜10與前述面板材11一體化。 Next, a method of manufacturing the touch film 20 using the film embedding method will be described. The manufacturing method of the touch film 20 has a film manufacturing step for manufacturing a multi-layer film 10, and a film forming step of heating and deforming the multi-layer film 10 into a three-dimensional shape as shown in FIGS. 4 to 7; And a panel integration step of disposing the formed multi-layer film 10 in an injection process The mold 30 is formed, and then molten resin is injected into the mold 30 to form the face sheet 11, and the formed multi-layer film 10 is integrated with the above-mentioned sheet material 11.

在不圖示的薄膜製造步驟,使具有導電層1a、2a的導電薄膜1、2、具有加飾層3a的加飾薄膜3、具有保護層4a的保護薄膜4經由熱硬化性黏接劑而形成的黏接層5~7層合。在薄膜製造步驟的完成時點,雖然黏接層5~7不硬化,但可藉由該黏性使薄膜1~4接合。在第2圖所示的複層薄膜10,至少在重疊於面板材11之開口12的透光性區域15不形成加飾層3a。也可取代第2圖的型態,在複層薄膜10之透光性區域15的一部分形成加飾層3a。 In the film manufacturing step (not shown), the conductive film 1 having the conductive layers 1a and 2a, the decorative film 3 having the decorative layer 3a, and the protective film 4 having the protective layer 4a are passed through a thermosetting adhesive. The formed adhesive layer 5~7 is laminated. At the completion of the film manufacturing step, although the adhesive layers 5 to 7 are not hardened, the films 1 to 4 can be joined by the adhesiveness. In the multi-layer film 10 shown in Fig. 2, at least the decorative layer 3a is not formed in the light-transmitting region 15 which is overlapped with the opening 12 of the facing sheet 11. Instead of the pattern of Fig. 2, a decorative layer 3a may be formed on a part of the light-transmitting region 15 of the multilayer film 10.

在薄膜成形步驟,如第4圖所示,複層薄膜10被加熱,而且預備成形為三維形狀。複層薄膜10的預備成形係由熱壓、真空成形、壓空成形等進行。藉由在薄膜成形步驟的加熱,使複層薄膜10的溫度超過黏接層5~7的熱硬化性黏接劑之硬化溫度的話,黏接層5~7會硬化。 In the film forming step, as shown in Fig. 4, the multi-layer film 10 is heated and preliminary formed into a three-dimensional shape. The preliminary forming of the multilayer film 10 is performed by hot pressing, vacuum forming, pressure forming, or the like. When the temperature of the multilayer film 10 exceeds the curing temperature of the thermosetting adhesive of the adhesive layers 5 to 7 by heating in the film forming step, the adhesive layers 5 to 7 are hardened.

接著,如第5圖所示,將預備成形後的複層薄膜10配置成沿著射出成型用的模具30之一方的成形模31之內面。如第6圖所示,封閉模具30的話,另一方的成形模32之凸部33會抵接複層薄膜10,在凸部33的周圍會形成腔室34。 Next, as shown in FIG. 5, the pre-formed multi-layer film 10 is placed along the inner surface of the molding die 31 which is one of the injection molding molds 30. As shown in Fig. 6, when the mold 30 is closed, the convex portion 33 of the other molding die 32 abuts against the multi-layer film 10, and the chamber 34 is formed around the convex portion 33.

之後,如第7圖所示,對腔室34從閘門35 射出熔融樹脂使面板材11成形,並使三維形狀的複層薄膜10與面板材11一體化。藉由這個一體化步驟來製造觸控面板20。 Thereafter, as shown in FIG. 7, the chamber 34 is gated 35. The molten resin is injected to form the sheet material 11, and the multi-layered film 10 having the three-dimensional shape is integrated with the sheet material 11. The touch panel 20 is manufactured by this integration step.

如此一來,薄膜成形步驟中複層薄膜10藉由加熱而使黏接層5~7硬化。因此,在各薄膜1~4經由黏接層5~7而密接的狀態,可將複層薄膜10成形為三維形狀。藉此,複層薄膜10在成形為三維形狀時不易產生成形扭曲,引發各薄膜1~4與黏接層5~7之剝離的內部應力會降低。結果,可製造使穩定的三維形狀之複層薄膜10與面板材11一體化的觸控面板20。又,即使在薄膜成形步驟的加熱所導致的黏接層5~7之硬化並未完成的情況,也可在面板一體化步驟中藉由加熱複層薄膜10而使黏接層5~7硬化完成。 As a result, in the film forming step, the multi-layer film 10 is cured by heating to bond the adhesive layers 5 to 7. Therefore, the multi-layer film 10 can be formed into a three-dimensional shape in a state in which the respective films 1 to 4 are in close contact via the adhesive layers 5 to 7. As a result, the multilayer film 10 is less likely to be deformed when formed into a three-dimensional shape, and the internal stress which causes the peeling of the respective films 1 to 4 and the adhesive layers 5 to 7 is lowered. As a result, the touch panel 20 in which the stable three-dimensionally shaped multi-layer film 10 and the face sheet 11 are integrated can be manufactured. Further, even in the case where the hardening of the adhesive layers 5 to 7 due to the heating of the film forming step is not completed, the adhesive layer 5 to 7 can be hardened by heating the multi-layer film 10 in the panel integration step. carry out.

在薄膜成形步驟中使複層薄膜10預備成形時,通常在60℃~100℃加熱複層薄膜10。因此,若熱硬化性黏接劑的硬化開始溫度不同,即會產生相應的不同作用。 When the multi-layer film 10 is preliminary formed in the film forming step, the multi-layer film 10 is usually heated at 60 ° C to 100 ° C. Therefore, if the hardening start temperature of the thermosetting adhesive is different, a corresponding different effect is produced.

黏接層5~7的熱硬化性黏接劑例如可使用在60℃以上開始硬化者。此時,在薄膜製造步驟中黏接層5~7未硬化,但藉由在薄膜成形步驟中預備成形時的加熱,黏接層5~7會開始硬化。 The thermosetting adhesive for the adhesive layers 5 to 7 can be used, for example, at 60 ° C or higher. At this time, in the film forming step, the adhesive layers 5 to 7 are not cured, but the adhesive layers 5 to 7 start to harden by heating during preliminary forming in the film forming step.

熱硬化性黏接劑可為在100℃以上開始硬化者。此時,藉由將薄膜成形步驟的複層薄膜10的加熱溫度設定在較高的區域,而使黏接層5~7硬化。因此,在薄 膜成形步驟之前,例如對複層薄膜10,可在進行滅菌(autoclave)處理或退火(anneling)處理時不使黏接層5~7硬化而是在薄膜成形步驟時才開始使黏接層5~7硬化。又,藉由調低薄膜成形步驟的加熱溫度,可在薄膜成形步驟抑制複層薄膜10的黏接層5~7開始硬化,而在面板一體化步驟才使黏接層5~7硬化。 The thermosetting adhesive may be one that starts to harden at 100 ° C or higher. At this time, the adhesion layers 5 to 7 are hardened by setting the heating temperature of the multilayer film 10 in the film forming step to a higher region. So in thin Before the film forming step, for example, for the multi-layer film 10, the adhesive layer 5 to 7 may be hardened during the autoclave treatment or the annealing treatment, but the adhesive layer 5 may be started at the film forming step. ~7 hardened. Further, by lowering the heating temperature of the film forming step, it is possible to suppress the adhesion of the adhesive layers 5 to 7 of the multi-layer film 10 in the film forming step, and to cure the adhesive layers 5 to 7 in the panel integration step.

熱硬化性黏接劑可為在250℃以上開始硬化者。此時,熱硬化性黏接劑的硬化開始溫度比薄膜成形步驟之預備成形時的加熱溫度更高。因此,複層薄膜10被配置於模具30時,黏接層5~7尚未硬化。因此,在面板一體化步驟,即使已預備成形的複層薄膜10在縫隙存在的狀態被配置到模具30,也能夠藉由熔融樹脂的射出壓力使複層薄膜10被矯正成模具30之形狀,並且在這個狀態下藉由使複層薄膜10被熔融樹脂加熱,而使黏接層5~7硬化。 The thermosetting adhesive may be one that starts to harden at 250 ° C or higher. At this time, the hardening start temperature of the thermosetting adhesive is higher than the heating temperature at the time of preliminary forming of the film forming step. Therefore, when the multilayer film 10 is placed on the mold 30, the adhesive layers 5 to 7 are not yet cured. Therefore, in the panel integration step, even if the pre-formed multi-layer film 10 is placed in the mold 30 in the state in which the slit is present, the multi-layer film 10 can be corrected to the shape of the mold 30 by the injection pressure of the molten resin. Further, in this state, the adhesive layer 5 to 7 is cured by heating the laminated film 10 by the molten resin.

〔觸控面板的其他製造方法〕 [Other manufacturing methods of touch panel]

如第8圖~第9圖所示,可將平板的複層薄膜10插入模具30,在模具30的內部進行複層薄膜10的成形。複層薄膜10係例如由未圖示的熱源加熱,同時沿著成形模31變形。之後,封閉模具30,對腔室34從閘門35射出熔融樹脂使面板材11成形。藉此,在三維形狀的複層薄膜10可製造面板材11被一體化的觸控面板20。 As shown in Figs. 8 to 9, the flat film 10 of the flat plate can be inserted into the mold 30, and the multilayer film 10 can be formed inside the mold 30. The multilayer film 10 is heated, for example, by a heat source (not shown), and is deformed along the molding die 31. Thereafter, the mold 30 is closed, and the molten resin is injected from the shutter 35 to the chamber 34 to form the face sheet 11. Thereby, the touch panel 20 in which the face sheet 11 is integrated can be manufactured in the multi-layered film 10 having a three-dimensional shape.

被插入模具30的複層薄膜10可在藉由封閉 模具30時的按壓力,變形為至少一部分沿著模具30的形狀之後,進行利用熔融樹脂的射出成形。如此一來,複層薄膜10受到熔融樹脂的壓力而變形,並且黏接層5~7藉由熔融樹脂被加熱而硬化。 The multi-layer film 10 inserted into the mold 30 can be closed by The pressing force at the time of the mold 30 is deformed so that at least a part of the shape along the mold 30 is subjected to injection molding by molten resin. As a result, the multi-layer film 10 is deformed by the pressure of the molten resin, and the adhesive layers 5 to 7 are hardened by heating of the molten resin.

〔第2實施型態〕 [Second embodiment]

在第2實施型態,觸控面板21係如第10圖~第11圖所示,構成為複層薄膜10被層合在不具有開口的面板材11的表面全體。面板材11及複層薄膜10皆形成為三維形狀。面板材11係由聚碳酸酯等透明的樹脂組成,構成為與複層薄膜10大略相同的形狀。在第10圖所示的複層薄膜10,於成為操作畫面的透光性區域15並未形成加飾層3a。可在複層薄膜10中透光性區域15的一部分形成有加飾層3a,以取代第10圖的型態。觸控面板21係藉由與第1實施型態相同的製造方法製造。 In the second embodiment, as shown in FIGS. 10 to 11 , the touch panel 21 is configured such that the multi-layer film 10 is laminated on the entire surface of the surface plate 11 having no opening. Both the face sheet 11 and the multi-layer film 10 are formed in a three-dimensional shape. The top sheet 11 is made of a transparent resin such as polycarbonate, and is configured to have substantially the same shape as the multi-layer film 10. In the multi-layer film 10 shown in Fig. 10, the decorative layer 3a is not formed in the light-transmitting region 15 which becomes an operation screen. Instead of the pattern of Fig. 10, a decorative layer 3a may be formed in a part of the light transmissive region 15 in the multi-layer film 10. The touch panel 21 is manufactured by the same manufacturing method as that of the first embodiment.

如此一來,藉由使複層薄膜10與面板材11層合為相同形狀,可使觸控面板21確保在整體上具有滿足規格的穩定強度。藉此,觸控面板21的耐久性會提升。又,雖然未圖示,但可在觸控面板21使用不具有加飾層3a的複層薄膜10。在該情況下,可使用複層薄膜10的全體表面作為觸控面板21的操作畫面。 In this way, by laminating the multi-layer film 10 and the face sheet 11 in the same shape, the touch panel 21 can be ensured to have a stable strength that satisfies the specifications as a whole. Thereby, the durability of the touch panel 21 is improved. Further, although not shown, a multi-layer film 10 having no decorative layer 3a can be used for the touch panel 21. In this case, the entire surface of the multi-layer film 10 can be used as an operation screen of the touch panel 21.

〔其他實施型態〕 [Other implementations]

(1)第12圖表示其他實施型態的觸控面板22。在 這個觸控面板22,表面形成為三維曲面形狀,左右的端部13摺疊成大略直角。又,在觸控面板22的表面側具備可按壓操作的區隔部14。區隔部14可設在第1實施型態的觸控面板20或第2實施型態的觸控面板21。 (1) Fig. 12 shows a touch panel 22 of another embodiment. in The surface of the touch panel 22 is formed into a three-dimensional curved shape, and the left and right end portions 13 are folded into a substantially right angle. Further, a partition portion 14 that can be pressed is provided on the surface side of the touch panel 22. The partition portion 14 can be provided in the touch panel 20 of the first embodiment or the touch panel 21 of the second embodiment.

(2)在上述的各實施型態表示複層薄膜10具備導電薄膜1、2、加飾薄膜3及保護薄膜4之例,但可為不具備保護薄膜4的複層薄膜10。此時,因為複層薄膜10的最外層為加飾薄膜3,所以加飾薄膜3兼作為保護薄膜。也就是說,複層薄膜10的保護薄膜由加飾薄膜3構成。又,複層薄膜10可不具備加飾薄膜3而由導電薄膜1、2及保護薄膜4構成。 (2) In each of the above embodiments, the multilayer film 10 is provided with the conductive film 1, 2, the decorative film 3, and the protective film 4. However, the multi-layer film 10 not including the protective film 4 may be used. At this time, since the outermost layer of the multi-layer film 10 is the decorative film 3, the decorative film 3 also serves as a protective film. That is, the protective film of the multi-layer film 10 is composed of the decorative film 3. Further, the multi-layer film 10 may be composed of the conductive films 1 and 2 and the protective film 4 without the decorative film 3 .

(3)在複層薄膜10,於導電薄膜1、2之間,可為了調整觸控面板20的感度而使虛設薄膜層合。虛設薄膜由各薄膜1~4的基膜單體構成。也就是說,虛設薄膜為不具有導電層1a、2a、加飾層3a、保護層4a等的薄膜。又,在導電薄膜1、2與保護薄膜4之間,可僅使虛設薄膜層合,並使虛設薄膜與加飾薄膜3兩方層合。藉由使用虛設薄膜,可容易調整複層薄膜10的厚度。各薄膜(導電薄膜1、2、加飾薄膜3、保護薄膜4、虛設薄膜)皆經由利用熱硬化性黏接劑形成的黏接層而層合。 (3) In the multi-layer film 10, between the electroconductive films 1 and 2, the dummy film may be laminated in order to adjust the sensitivity of the touch panel 20. The dummy film is composed of a base film monomer of each of the films 1 to 4. That is, the dummy film is a film which does not have the conductive layers 1a, 2a, the decorative layer 3a, the protective layer 4a, and the like. Further, between the conductive films 1, 2 and the protective film 4, only the dummy film can be laminated, and the dummy film and the decorative film 3 can be laminated. The thickness of the multi-layer film 10 can be easily adjusted by using a dummy film. Each of the films (the conductive film 1, the decorative film 3, the protective film 4, and the dummy film) is laminated via an adhesive layer formed using a thermosetting adhesive.

(4)複層薄膜10所具備的保護薄膜4、加飾薄膜3及虛設薄膜可皆為複數。設置複數個同種的薄膜也可經由利用熱硬化性黏接劑形成的黏接層而層合。 (4) The protective film 4, the decorative film 3, and the dummy film provided in the multi-layer film 10 may each be plural. A plurality of films of the same type may be laminated via an adhesive layer formed using a thermosetting adhesive.

(5)在上述的各實施型態表示將觸控面板 20~22的表面設成三維曲面形狀之例,但觸控面板的表面可為三維形狀,也可為曲面以外的形狀。 (5) In each of the above embodiments, the touch panel is shown The surface of 20 to 22 is set as a three-dimensional curved shape, but the surface of the touch panel may be a three-dimensional shape or a shape other than a curved surface.

(6)在上述的各實施型態表示將導電層1a、2a形成在導電薄膜1、2的表面側、將加飾層3a形成在加飾薄膜3的背面側之例。然而,導電層1a、2a可形成在導電薄膜1、2的背面側。又,加飾層3a可形成在加飾薄膜3的表面側。 (6) In each of the above embodiments, the conductive layers 1a and 2a are formed on the surface side of the conductive films 1 and 2, and the decorative layer 3a is formed on the back side of the decorative film 3. However, the conductive layers 1a, 2a may be formed on the back side of the conductive films 1, 2. Further, the decorative layer 3a may be formed on the surface side of the decorative film 3.

(7)在上述的各實施型態表示使用薄膜插入法將複層薄膜10與面板材11一體化的之例,但可使用TOM工法取代薄膜插入法。 (7) In each of the above embodiments, an example in which the multi-layer film 10 and the top sheet 11 are integrated by a film insertion method is used, but a TOM method may be used instead of the film insertion method.

〔產業上的可利用性〕 [Industrial Availability]

本發明可廣泛應用在設置於汽車、家電製品、電子機器等的觸控面板。 The present invention can be widely applied to touch panels installed in automobiles, home electric appliances, electronic appliances, and the like.

1、2‧‧‧導電薄膜 1, 2‧‧‧ conductive film

1a‧‧‧第1導電層 1a‧‧‧1st conductive layer

1b‧‧‧黏合劑 1b‧‧‧Binder

2a‧‧‧第2導電層 2a‧‧‧2nd conductive layer

3‧‧‧加飾薄膜 3‧‧‧Plus film

3a‧‧‧加飾層 3a‧‧‧plus layer

4‧‧‧保護薄膜 4‧‧‧Protective film

4a‧‧‧保護層 4a‧‧‧Protective layer

5、6、7‧‧‧黏接層 5, 6, 7‧‧‧ adhesive layer

10‧‧‧複層薄膜 10‧‧‧Multilayer film

Claims (3)

一種觸控面板,其具備:面板材;及複層薄膜,其接合至前述面板材的表面,並包含具有導電層的導電薄膜及保護薄膜,前述複層薄膜係使各薄膜經由利用熱硬化性黏接劑所形成的黏接層而層合,並且以沿著前述表面的三維形狀成形。 A touch panel comprising: a face plate; and a multi-layer film bonded to a surface of the face plate and comprising a conductive film having a conductive layer and a protective film, wherein the film is made to be thermally hardened by using each film The adhesive layer formed by the adhesive is laminated and formed in a three-dimensional shape along the aforementioned surface. 如申請專利範圍第1項所記載之觸控面板,其中,前述保護薄膜為具有加飾層的加飾薄膜。 The touch panel according to the first aspect of the invention, wherein the protective film is a decorative film having a decorative layer. 一種觸控面板的製造方法,其具有:薄膜製造步驟,其將具有導電層的導電薄膜及保護薄膜經由利用熱硬化性黏接劑所形成的黏接層來層合而製造複層薄膜;薄膜成形步驟,其將前述複層薄膜加熱並使其變形為三維形狀;及面板一體化步驟,其將成形後的前述複層薄膜配置在射出成形用的模具,然後在前述模具內射出熔融樹脂以使面板材成形,並且將前述複層薄膜與前述面板材一體化。 A method for manufacturing a touch panel, comprising: a film manufacturing step of laminating a conductive film having a conductive layer and a protective film through an adhesive layer formed by using a thermosetting adhesive; a forming step of heating and deforming the multi-layer film into a three-dimensional shape; and a panel integration step of disposing the formed multi-layer film in a mold for injection molding, and then ejecting the molten resin in the mold The face sheet is formed, and the above-mentioned multi-layer film is integrated with the above-mentioned face sheet.
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