TW201632303A - Manufacturing method of precast polish pad - Google Patents

Abstract

The present invention provides a manufacturing method of precast polish pad, in which a mold plate with a groove pattern is put in a polish pad mold, and then an perfusion molding is performed to directly manufacture a precast polish pad with a groove formed on a surface thereof. As a result, it is not necessary to further perform the steps of thickness cutting, pattern processing and so on, so as to decrease the time of CNC milling groove operation, avoid micro dust pollutants generated in the pattern processing course, and reduce the amount of polish pad raw material by one third, thereby facilitating cost reduction. Furthermore, with the precast polish pad manufactured by such a mold plate perfusion method, it is possible to increase the polish removal rate and manufacture a vertical and flat groove wall without the memory effect.

Description

Pre-injection polishing pad manufacturing method

The present invention relates to the field of chemical mechanical polishing techniques, and more particularly to a method of making a pre-filled polishing pad.

In order to effectively increase production capacity and reduce costs, the flattening process for producing semiconductor components has become increasingly important. In the flattening process, a chemical mechanical polishing (CMP) process is often used to remove excess portions of the wafer surface film to achieve full planarization.

The chemical mechanical polishing process fixes the polishing pad on the rotating disk of the polishing machine, and then presses the wafer against the polishing pad by using the polishing head. The rotation of the rotating disk can drive the polishing pad to cause mutual mutual interaction between the wafer surface and the polishing pad. Friction, at the same time, an acidic or alkaline chemical slurry or slurry is continuously and uniformly injected between the wafer and the polishing pad to combine mechanical polishing and wet chemical reaction to remove the film deposited on the surface layer of the wafer. The surface is smooth and flat.

Currently used in the CMP process, the polishing pad is usually formed into a large volume of the polishing pad block, and then cut into several pieces according to different thicknesses, and then processed by computer numerical control (CNC). Thinned and grooved, this process takes time to process and creates dust particles.

In view of the above, the present invention provides a method of fabricating a pre-filled polishing pad to effectively overcome the above-mentioned various deficiencies of the prior art.

The main object of the present invention is to provide a method for manufacturing a pre-injection polishing pad, which can reduce the use amount of the polishing pad raw material by using the preset filling method, and reduce the cost, and does not require steps such as thickness cutting and CNC graphic processing. , can shorten the processing time, at the same time, can avoid the generation of dust particles during the graphics processing.

Another object of the present invention is to provide a method for manufacturing a pre-injection polishing pad, which has a high polishing removal rate and can grind a vertically flat groove wall without a memory effect.

Therefore, in order to achieve the above object, a method for manufacturing a pre-injection polishing pad provided by the present invention is to provide a polishing pad raw material, and at the same time, provide a polishing pad mold, and place a template into the polishing pad mold. The template has a groove pattern, and then the polishing pad raw material is poured into the polishing pad mold to cause polymerization reaction of the polishing pad raw material, and after the curing is formed, the pre-injection polishing pad of the present invention is prepared, and the pre-injection polishing pad is prepared thereon. The surface of the polishing pad is formed with a groove corresponding to the groove pattern.

Therefore, according to the method for manufacturing the pre-injection polishing pad provided by the present invention, after the polishing pad is formed, the steps of demolding, aging, baking, and the like can be directly performed, and then the CNC grinding thickness and the adhesive bonding are directly performed. That is, the production of the polishing pad product is completed. That is to say, the present invention can be directly formed into a polishing pad having a groove in a mold by a preset infusion method, and the thickness cutting operation is not required, and the pattern of the groove is not required. The invention can simplify the process steps, shorten the processing time, and can reduce or eliminate the generation of dusty pollutants during the processing, and can greatly reduce the use amount of the polishing pad raw materials, thereby achieving the purpose of reducing cost and improving economic efficiency; The filling method will increase the removal rate of the polishing pad, and the groove wall will be vertical and flat. Memory effect.

In order to further understand the purpose, features and functions of the present invention, the drawings are described in detail as follows:

10‧‧‧ polishing pad mould

20‧‧‧上模

30‧‧‧Down

40‧‧‧ template

41‧‧‧ Groove graphics

50‧‧‧ polishing pad raw materials

60‧‧‧Pre-injection polishing pad

61‧‧‧ trench

FIG. 1 is a flow chart showing a method of fabricating a pre-filled polishing pad according to an embodiment of the present invention.

2A-2C are schematic cross-sectional structural views of a perfusion molding process of a method for fabricating a pre-injection polishing pad according to an embodiment of the present invention.

Referring to FIG. 1 , a manufacturing process of a method for manufacturing a pre-filled polishing pad disclosed in an embodiment of the present invention includes the following steps: First, in step S100, a composition formula of a polishing pad raw material is provided, as this embodiment is For example, a pre-filled polishing pad for making a polyurethane material comprises a chemical raw material isocyanate (ISO) and a polyol (containing ethylene glycol, water) in the composition of the polishing pad raw material, and then according to the estimated foaming ratio. 1.35:1 adjustment, according to the program to adjust the required amount, and evenly stirred to obtain the polishing pad raw material, that is, poured into the mixing tank of the filling machine, and then the polishing pad raw material is first heated to a temperature of 110 ° C and then poured. Since the present invention adopts the infusion molding method of presetting the template, the polishing pad raw material can be reduced by about one third, for example, it can be reduced from 4 kg (Kg) to about 3 kg, so that the production cost is greatly reduced.

Hereinafter, the perfusion molding process of the method for fabricating the pre-filled polishing pad 60 disclosed in the embodiment of the present invention will be described with reference to FIGS. 2A-2C.

In step S110, a polishing pad mold 10 is provided. As shown in FIG. 2A, the polishing pad mold 10 includes an upper mold 20 and a lower mold 30, and a cavity is formed in the lower mold 30 of the polishing pad mold 10 to have a groove. The template 40 of the groove pattern 41 is then brought into close contact with the lower mold 30; in practice, a sealing ring such as an O-ring can be used for the edges of the upper mold 20 and the lower mold 30. The seal is provided and a vent hole is provided for vacuum defoaming to discharge excess air to the polishing pad mold 10. When the filling machine is in operation, the polishing pad mold 10 is heated to a temperature of 25 to 100 ° C by a heating cycle system, and the time required is about 30 minutes. The material of the template 40 can be selected from a Teflon plate, an aluminum plate, an electric board or an acrylic plate.

Then, in step S120, the polishing pad raw material 50 is directly injected into the polishing pad mold 10 by injection molding, as shown in Fig. 2B. Then, the polishing pad raw material 50 is mixed and mixed by a pressure of 70 to 200 bar (Bar) through a perfusion machine for 30 minutes, and the polishing pad raw material 50 is subjected to polymerization of the copolymer in the polishing pad mold 10.

In step S130, after the high temperature and high pressure are applied, the air inside the polishing pad mold 10 is discharged from the vent hole, and the polishing pad raw material 50 is foamed and expanded. After 30 minutes, the curing can be formed into the pre-form of the embodiment. Injection pad 60. The surface of the pre-filled polishing pad 60 is formed with a groove 61 corresponding to the groove pattern 41 as shown in FIG. 2C. In addition, the hardness of the pre-filled polishing pad ranges from about 50 to 60, and the hardness D is.

Next, in step S140, the polishing pad mold 10 is opened, and the pre-injection polishing pad 60 is detached from the template 40, and the pre-injection polishing pad 60 is taken out, cooked and hot-baked, and then subjected to computer numerical control (CNC) grinding. To the appropriate thickness, finally, the adhesive is applied to the back surface of the pre-filled polishing pad 60 for adhesive bonding, and the pre-filled polishing pad 60 of the present embodiment can be obtained after curing.

The pre-injection polishing pad disclosed in the present invention is formed by injecting a preset template into a template, and after the infusion molding, the polishing pad material can directly form a polishing pad having a groove directly in the polishing pad mold. After the steps of demolding, aging, baking, etc., the thickness of the CNC grinding and the adhesive bonding can be directly performed, that is, the production of the pre-injection polishing pad product is completed. In addition, the choice of template can be replaced according to the required groove pattern, no need to re-order the polishing pad mold, which is very cost-effective.

Therefore, compared with the traditional polishing pad process, the finished product must first be cut into several pieces by thickness, and then processed by the CNC to grind the thickness and the groove pattern; the pre-injection polishing pad of the invention does not need to be thickness-cut. The operation does not need to perform pattern processing to form the groove. Therefore, the invention can simplify the process steps and shorten the processing time of the subsequent CNC pattern milling operation, and at the same time, avoid the processing process, thereby avoiding the processing process. The generation of dust particles can also greatly reduce the amount of raw materials used in the polishing pad, thereby achieving the goal of reducing costs and improving economic efficiency. Furthermore, the pre-injection polishing pad prepared by the template infusion method has a high grinding removal rate, and can produce a vertically flat groove wall without a memory effect.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

10‧‧‧ polishing pad mould

20‧‧‧上模

30‧‧‧Down

40‧‧‧ template

50‧‧‧ polishing pad raw materials

Claims (8)

A method for manufacturing a pre-injection polishing pad, comprising the steps of: providing a polishing pad material; providing a polishing pad mold; and placing a template having a groove pattern into the polishing pad mold; Injecting into the polishing pad mold to cause polymerization of the polishing pad raw material; and molding the pre-injection polishing pad through a curing process, and the surface of the pre-injection polishing pad is formed with a groove corresponding to the groove pattern . The method for manufacturing a pre-filled polishing pad according to claim 1, wherein the pre-injection polishing pad is made of a polyurethane material, and the polishing pad raw material is prepared by mixing isocyanate and polyol according to a foaming ratio. , prepared by uniform stirring. The method for manufacturing a pre-filled polishing pad according to claim 1, wherein the polishing pad mold has an upper mold and a lower mold, and the upper mold is in close contact with the lower mold and is sealed by a sealing ring to the edge. The template is placed in the cavity of the lower mold. The method of manufacturing a pre-filled polishing pad according to claim 1, wherein the step of injecting the polishing pad material into the polishing pad mold comprises: heating the polishing pad material to a temperature of 110 ° C, and heating the polishing pad mold The polishing pad material is injected into the polishing pad mold by injection molding at a temperature of 25 to 100 ° C, and the polishing pad material is mixed under a pressure of 70 to 200 bar (Bar). The method of manufacturing a pre-filled polishing pad according to claim 1, wherein after the step of the curing process is completed, the method further comprises: opening the polishing pad mold, and detaching the pre-injection polishing pad from the template to take out the pre-preparation Injection molding pad, followed by the steps of aging and baking. The method for preparing a pre-filled polishing pad according to claim 5, wherein the step of aging and baking further comprises the step of grinding the thickness by computer numerical control (CNC), and then performing the step of bonding. The method of manufacturing a pre-filled polishing pad according to claim 1, wherein the material of the template is a Teflon plate, an aluminum plate, an electric board or an acrylic plate. The method for manufacturing a pre-filled polishing pad according to claim 1, wherein the pre-injection polishing pad has a hardness ranging from 50 to 60 temperament hardness D.