TW201630129A - Heat sink device with increased pulling force - Google Patents

Abstract

A heat sink device having an increased pulling force is suitable for being adhered to a substrate by using an adhesive, and comprises a first body unit and a plurality of first drawing units. The first body unit includes a first body. Each of the first drawing units includes a first through hole penetrating the first body, a first upper opening disposed above the first through hole, and a first lower opening disposed below the first through hole. And a first surrounding wall connecting the first upper opening and the first lower opening, the first upper opening has an opening area larger than the first lower opening, when the first lower surface of the first body is adhered to the substrate The adhesive can be solidified after entering the first through hole by the first lower opening, and forms a pulling force with the first surrounding wall, so that the first body unit is not easily detached from the substrate.

Description

Heat sink device with increased pulling force

The present invention relates to a heat sink device, and more particularly to a heat sink device having an increased pulling force.

With the ever-changing semiconductor manufacturing process, the size of the existing semiconductor components is gradually reduced and the efficiency is gradually improved. The heat generated by the operation of the semiconductor components is increased due to the improvement of the performance. In order to avoid the semiconductor components being burned due to heat, the semiconductor components are burned. Bad, a metal heat sink is adhered to the top of the semiconductor component to improve the heat dissipation of the semiconductor component.

Referring to FIG. 1, a conventional heat sink 10 is bonded to a substrate 12 by using an adhesive 11 and is bonded to a semiconductor wafer 14 by using a heat conductive material 13 for generating the semiconductor wafer 14 during operation. The heat is conducted to the outside through the heat sink 10 to dissipate heat, so that the temperature at which the semiconductor wafer 14 is operated is not too high, and the high temperature is prevented from causing the semiconductor wafer 14 to burn out.

In addition, the International Automobile Promotion Group (IATF) and the relevant National Automobile Industry Associations (ANFIA, AIAG, CCFA, FIEV, SMMT and VDA-QMC) establish globally uniform standards for future quality management system validation in the automotive industry, in March 1999. The ISO/TS16949 technical specification was developed to seek a unified supplier quality management system for the global automotive industry. The technical specifications of ISO/TS16949 apply to the entire automotive supply chain manufacturer, which covers the scope of the specification for electronic products used in vehicles.

As mentioned above, the ISO/TS16949 technology regulates the use of automobiles because the car will be used in many environments, including extremely hot, extremely cold, extremely dry and extremely humid extreme climates, as well as extreme climate changes. All parts must be higher than the standard parts used in general products to withstand harsh environmental changes, including the adhesion specifications of the electronic parts to the heat sink, resulting in the general semiconductor heat sink adhesion process technology Products cannot pass the technical standards of the high standard ISO/TS16949.

Therefore, how to improve the adhesion and pull-out force between the heat sink and the semiconductor to meet the high standard technical specifications, so that the heat sink attached to the electronic product can resist the harsh environmental changes and the pull of the external force is not easy to self-semiconductor Peeling off the wafer has become an urgent need for the industry.

In view of the above, an object of the present invention is to provide a heat sink device having an increased pulling force, which is suitable for being adhered to a substrate by using an adhesive, and comprising a first body unit and a plurality of first drawing units. The first body unit includes a first body having a first upper surface and a first lower surface.

The plurality of first drawing units are dispersedly disposed in the first body, each of the first drawing units includes a first through hole penetrating the first body, and a first upper opening disposed on the first upper surface a first lower opening disposed on the first lower surface, and a first surrounding wall connecting the first upper opening and the first lower opening, and an opening area of the first upper opening is larger than the first lower opening When the first lower surface of the first body is adhered to the substrate, the adhesive may be solidified by the first lower opening into the first through hole, and form a pulling force with the first surrounding wall, so that The first body unit is not easily detached from the substrate.

According to still another aspect of the present invention, the circumference of the first surrounding wall is gradually increased from the first lower opening toward the first upper opening.

Another technical means of the present invention is that each of the first drawing units further includes a rough surface disposed on the first surrounding wall.

According to still another aspect of the present invention, the first through hole has a large aperture portion connecting the first upper opening, a small aperture portion connecting the first lower opening, and a large aperture portion and the Small aperture Shoulder.

According to still another aspect of the present invention, the first through hole further has a pull-tab protruding from the shoulder toward the center line of the first through hole.

Another technical means of the present invention is that the first body unit further includes a large opening hole disposed in the first body and extending through the first upper surface and the first lower surface.

According to still another aspect of the present invention, the first lower surface of the first body is formed with a receiving groove, and the plurality of first drawing units are disposed around the receiving groove.

Another technical means of the present invention is that the heat sink device having the increased pulling force further comprises a second body unit, wherein the spacer body is disposed above the first body and has a second upper surface and a second a second body of the lower surface, and a connecting layer connecting the second lower surface and the first upper surface, and the outer periphery of the first body and the second body are aligned.

Another technical means of the present invention is that the heat sink device having the increased pulling force further includes a plurality of second drawing units, which are dispersedly disposed in the second body, and each of the second drawing units includes a a second through hole penetrating the second body, a second upper opening disposed on the second upper surface, a second lower opening disposed on the second lower surface, and a second upper opening and the first opening a second surrounding wall of the second lower opening, the second upper opening having an opening area larger than the second lower opening.

A further technical means of the present invention is that the heat sink device having the increased pulling force further comprises a third body unit, comprising a third body spaced apart from the first body, and a third body a connecting section extending from the periphery of the body toward the substrate and connected to the first body, and the outer periphery of the third body is not larger than the large opening.

The beneficial effect of the invention is that a plurality of first drawing units are disposed in the first body having heat dissipation effect, and the adhesive not only adheres the first body to the substrate when performing the semiconductor heat sink bonding process Sticking together, the adhesive also enters the first through hole through the first lower opening and adheres to the first surrounding wall, thereby increasing the adhesion between the first body and the substrate, and each The first upper opening of the first drawing unit has an area larger than the first lower opening, so that the adhesive solidified in the first through hole and the first surrounding wall mutually generate a pulling force, so that the plural number can be set The first body of the first drawing unit can be tightly adhered to the substrate and is not easily dropped to resist the harsh environmental changes and the pulling force of the outside.

A‧‧‧Adhesive

B‧‧‧Substrate

3‧‧‧First main unit

31‧‧‧First subject

311‧‧‧ first upper surface

312‧‧‧ First lower surface

313‧‧‧ accommodating slots

32‧‧‧ large open hole

4‧‧‧First pull unit

41‧‧‧First through hole

410‧‧‧ center line

411‧‧‧ Large aperture

412‧‧‧Small aperture

413‧‧‧ Shoulder

414‧‧‧Protruding

42‧‧‧First opening

43‧‧‧First opening

44‧‧‧First Surrounding Wall

45‧‧‧Rough surface

5‧‧‧Second main unit

51‧‧‧Second subject

511‧‧‧Second upper surface

512‧‧‧Second lower surface

52‧‧‧Connection layer

6‧‧‧Second drawing unit

61‧‧‧Second through hole

62‧‧‧Second upper opening

63‧‧‧Second opening

64‧‧‧Second surround wall

7‧‧‧ Third main unit

71‧‧‧ third subject

72‧‧‧ Connection section

1 is a schematic view showing a state in which a conventional heat sink is adhered to a substrate; FIG. 2 is a schematic view showing a first preferred embodiment of the heat sink device having an increased drawing force according to the present invention; A partial cross-sectional view illustrating a first drawing unit of the first preferred embodiment; and FIG. 4 is a schematic view of the device, illustrating a second preferred embodiment of the heat sink device with increased pulling force of the present invention; Is a schematic cross-sectional view showing the first drawing unit of the second preferred embodiment; FIG. 6 is a schematic view of the device, illustrating a third preferred embodiment of the heat sink device with increased pulling force of the present invention; 7 is a schematic view showing an embodiment of the third preferred embodiment; and FIG. 8 is a partial cross-sectional view showing a fourth preferred embodiment of the heat sink device with increased pulling force of the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a schematic view showing a fifth preferred embodiment of the present invention having a heat sink device for increasing the drawing force; FIG. 11 is a partial cross-sectional view. Explain the fifth preferred embodiment The first drawing unit of the example; and FIG. 12 is a schematic diagram illustrating the embodiment of the fifth preferred embodiment kind.

The details of the related patents and the technical contents of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings.

It should be noted that, before the detailed description, similar elements are denoted by the same reference numerals. Moreover, the semiconductor packaging process mentioned in the specification can be used for Flip Chip Package (FC), Plastic Ball Grid Array Package (PBGA), Ball Grid Array (BGA), Quartet A variety of semiconductor packaging technologies, such as Quad Flat Package (QFP), Quad Flat No-lead Package (QFN), and Chip Scale Package (CSP).

Referring to Figures 2 and 3, there is shown a first preferred embodiment of a heat sink device having an increased pulling force, which is suitable for bonding to a substrate B using an adhesive A, and the wafer above the substrate B. The generated heat is conducted to the outside, and the tangent line aa in the figure is the hatching of the first preferred embodiment. The heat sink device includes a first body unit 3 and a plurality of first drawing units 4. The first body unit 3 includes a first body 31 having a first upper surface 311 and a first lower surface 312.

The first first drawing unit 4 is disposed in the first body 31, and each of the first drawing units 4 includes a first through hole 41 extending through the first body 31 and a first upper surface. a first upper opening 42 of the 311, a first lower opening 43 disposed on the first lower surface 312, and a first surrounding wall 44 connecting the first upper opening 42 and the first lower opening 43, and the first The opening area of the upper opening 42 is larger than the first lower opening 43, and the circumference of the first surrounding wall 44 is gradually enlarged from the first lower opening 43 toward the first upper opening 42.

In the first preferred embodiment, the plurality of first drawing units 4 are arranged in a pairwise arrangement along the circumference of the first body 31. When the side frame is formed in a circle so that the first body 31 is adhered to the substrate B, the first lower surface 312 of the first body 31 can be adhered to the upper surface of the wafer to generate the wafer. The heat is transmitted to the outside. In actual implementation, the plurality of first drawing units 4 can be set according to actual conditions, and should not be limited thereto.

As described above, when the first lower surface 312 of the first body 31 is adhered to the substrate B, the adhesive A can enter the first through hole 41 via the first lower opening 43 and solidify, and A surrounding force is formed around the wall 44 so that the first body unit 3 does not easily come off the substrate B.

It is worth mentioning that the adhesive A adhered to the first surrounding wall 44 can not only increase the adhesion area with the first body 31 to increase the adhesion, but also the circumference of the first through hole 41 is The feature that the first lower opening 43 is gradually enlarged toward the first upper opening 42 is such that the adhesive A solidified in the first through hole 41 forms a pulling force with the first surrounding wall 44, so that the solidified adhesive is solidified. A is not easily detached from the first lower opening 43. Compared with the conventional heat sink, the surface of the conventional heat sink is adhered to the substrate B, and the present invention can achieve the effects of improving the adhesion and increasing the pulling force.

Referring to Figures 4 and 5, there is shown a second preferred embodiment of the heat sink device having a drawing force in accordance with the present invention. The second preferred embodiment is substantially identical to the first preferred embodiment, and the same is no longer the same. The first main body unit 3 further includes a large opening 32 disposed in the first body 31 and extending through the first upper surface 311 and the first lower surface 312, and each first pull The drawing unit 4 further includes a rough surface 45 disposed on the first surrounding wall 44.

In the second preferred embodiment, the plurality of first drawing units 4 are disposed in the first body 31 in a dispersed manner. When the first body unit 3 is adhered to the substrate B, the large opening is The hole 32 can accommodate the wafer above the substrate B. In addition, the first drawing unit 4 of the second preferred embodiment can not only retain the same adhesive effect as the first preferred embodiment, but the rough surface 45 disposed on the first surrounding wall 44 can be further increased. The adhesion area of the adhesive A and the first body 31 is used to further enhance the adhesion and the pulling force in the first body 31 and the substrate B.

Referring to FIG. 6 and FIG. 7 , a third preferred embodiment of the heat sink device with increased pull force is shown in the figure. The tangent line bb is a cross-sectional line of the third preferred embodiment. The third preferred embodiment The first preferred embodiment is substantially the same as the first preferred embodiment. The first lower surface 312 of the first body 31 defines a receiving groove 313 for making the cross-sectional shape of the first body 31. The plurality of first drawing units 4 are disposed around the receiving groove 313. Preferably, the plurality of first drawing units 4 are framed in the first body 31 in a single arrangement. In actual implementation, the plurality of first drawing units 4 can be set according to actual conditions, and should not be limited thereto.

When the third preferred embodiment is adhered to the substrate B, the adhesive A will adhere the first lower surface 312 outside the receiving groove 313 to the upper surface of the substrate B, and the adhesive A will The first through hole 43 enters the first through hole 41 and solidifies, and generates an adhesive force and a pulling force with the first surrounding wall 44 to prevent the first body unit 3 from falling off from the substrate B. The upper surface of the substrate is adhered to the first lower surface 312 of the receiving groove 313 for conducting heat of the wafer. To the outside world.

Referring to Figures 8 and 9, a fourth preferred embodiment of the heat sink device with increased pull force is provided. The fourth preferred embodiment is substantially the same as the second preferred embodiment, and the same is no longer the same. The difference is that the heat sink device further includes a second body unit 5 and a plurality of second drawing units 6.

The second body unit 5 includes a second body 51 spaced apart from the first body 31 and having a second upper surface 511 and a second lower surface 512, and a second lower surface 512 and the first One on The connecting layer 52 of the surface 311 and the outer periphery of the first body 31 and the second body 51 are aligned. Preferably, the material and characteristics of the connecting layer 52 are the same as those of the adhesive A.

The plurality of second drawing units 6 are disposed in the second body 51. Each of the second drawing units 6 includes a second through hole 61 extending through the second body 51 and a second upper surface 511. a second upper opening 62, a second lower opening 63 disposed on the second lower surface 512, and a second surrounding wall 64 connecting the second upper opening 62 and the second lower opening 63. The opening area of the opening 62 is larger than the second lower opening 63, and the circumference of the second surrounding wall 64 is gradually increased from the second lower opening 63 toward the second upper opening 62.

When the four preferred embodiments are adhered to the substrate B, the large opening 32 of the first body unit 3 can accommodate the wafer above the substrate B, and the adhesive A solidified in the first through hole 41 Not only the adhesion area with the first body 31 can be increased to increase the adhesion, but also the circumference of the first surrounding wall 44 is enlarged by the first lower opening 43 toward the first upper opening 42 to solidify. The adhesive A in the first through hole 41 generates a pulling force and is not easily peeled off from the first lower opening 43.

In addition, the plurality of second drawing units 6 also have the same function as the first drawing unit 4, when the second body 51 is adhered to the first body 31 by the connecting layer 52, the connecting layer The material of the 52 can be solidified into the second through hole 61 through the second lower opening 63, and form an adhesive force and a pulling force with the second surrounding wall 64. The material of the connecting layer 52 can be combined with the material. The adhesives A in the through holes 41 are in contact with each other and adhered to each other so that the second main body unit 5 is tightly adhered to the first main body unit 3 without being easily detached.

In the fourth preferred embodiment, the plurality of first and second drawing units 4, 6 are respectively arranged in a circle along the inner side of the circumference of the first and second bodies 31, 51 in a pairwise arrangement. In actual implementation, the first and second drawing units 4 and 6 can be set according to actual conditions, and should not be used as limit. When the first and second bodies 31, 51 are adhered to the substrate B, the second lower surface 512 of the second body 51 can be adhered to the upper surface of the wafer to conduct heat generated by the wafer to external.

Referring to Figures 10, 11, and 12, a fifth preferred embodiment of the heat sink device having a pull-out force according to the present invention is shown. The tangent line cc is the hatching of the third preferred embodiment. The embodiment is substantially the same as the second preferred embodiment, and the same details are not described herein except that the heat sink device further includes a third body unit 7.

The third body unit 7 includes a third body 71 spaced apart from the first body 31, and a connecting portion 72 extending from the periphery of the third body 71 toward the substrate B and connected to the first body 31. The outer periphery of the third body 71 is not larger than the large opening 32. Preferably, the first body unit 3 and the third body unit 7 are made of a metal material and are integrally formed as the first body. When the main body 31 is adhered to the substrate B, the lower surface of the third main body 71 is adhered to the upper surface of the wafer so that the heat generated by the wafer can be conducted to the outside through the third main body 71.

The first through hole 41 has a large aperture portion 411 connected to the first upper opening 42 , a small aperture portion 412 connected to the first lower opening 43 , and a gap between the large aperture portion 411 and the small aperture portion 412 . The shoulder 413 and a pull-tab 414 protruding from the shoulder 413 toward the center line 410 of the first through hole 41.

The inventors will clarify that when the first lower surface 312 of the first body 31 is adhered to the substrate B, the adhesive A can enter the first through hole 41 through the first lower opening 43. The adhesion between the first surrounding wall 44 and the first surrounding wall 44 can be formed, and the adhesion of the large through-hole portion 411, the small aperture portion 412 and the shoulder portion 413 can be adhered to the first through hole 41. The agent A can generate a pulling force with the shoulder 413, and the adhesive A can be adhered to the solidification of the anti-sliding ridge 414, so that the adhesive A and the first main body unit 3 can be maximally adhered. Force and drawing force, the heat sink device and the substrate B can be closely adhered Together, not only can it resist the harsh environmental changes of the outside world, it will not fall off, and it can also resist the forces of drawing from the outside without separating.

As can be seen from the above description, the heat sink device of the present invention having an increased pulling force does include the following advantages:

First, improve adhesion

In the semiconductor heat sink bonding process, the adhesive A can not only adhere the first lower surface 312 to the upper surface of the substrate B, but also can pass through the first lower opening of the plurality of first drawing units 4. The first through hole 41 is adhered to the first surrounding wall 44 to increase the adhesion area to enhance the adhesion between the first body 31 and the substrate B.

Second, increase the pulling force

The first aspect of the first upper opening 42 of each first drawing unit 4 is larger than the first lower opening 43 , and the adhesive A enters the first through hole 41 via the first lower opening 43 . When solidified, the solidified adhesive A will abut against the first surrounding wall 44 or the shoulder 413 to increase the pulling force, so that the first body 31 can resist drawing from the outside without being separated.

Third, in line with high specifications of product specifications

As described above, the first body unit 3 provided with the plurality of first drawing units 4 can enhance the adhesion and the pulling force between the substrate B and the substrate B, so that the present invention can resist the harsh environmental changes and pull of the outside world. The pull-out road is tightly adhered to the substrate B and is not easy to fall off, and can meet the high specification product specifications.

In summary, the first first drawing unit 4 is disposed in the first body 31 of the heat sink device with increased pulling force, and the adhesive is applied when the first body 31 and the substrate B are adhered together. A can not only The first lower surface 312 is adhered to the upper surface of the substrate B, and is also inserted into the first through hole 41 through the first lower opening 43 to adhere to the first surrounding wall 44 to increase the adhesion area. To improve the adhesion, and by the feature that the area of the first lower opening 43 of each of the first drawing units 4 is smaller than that of the first upper opening 42, the adhesive A solidified in the first through hole 41 can The first surrounding walls 44 are mutually abutted and generate a pulling force, so that the heat sink device can be closely adhered to the substrate B, and can not only resist the harsh environmental changes of the outside world, but also can not fall off, and can also resist external pulling. The strength of the pull is not separated, so that the present invention can meet the technical scope of the high specification product, so that the object of the present invention can be achieved.

However, the above is only the five preferred embodiments of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes made by the scope of the invention and the description of the invention are Modifications are still within the scope of the invention.

3‧‧‧First main unit

31‧‧‧First subject

311‧‧‧ first upper surface

312‧‧‧ First lower surface

4‧‧‧First pull unit

41‧‧‧First through hole

410‧‧‧ center line

411‧‧‧ Large aperture

412‧‧‧Small aperture

413‧‧‧ Shoulder

414‧‧‧Protruding

42‧‧‧First opening

43‧‧‧First opening

7‧‧‧ Third main unit

71‧‧‧ third subject

72‧‧‧ Connection section

Claims (10)

A heat sink device having an increased drawing force, which is suitable for being adhered to a substrate by using an adhesive, and comprising: a first body unit comprising a first body having a first upper surface and a first lower surface And a plurality of first drawing units disposed in the first body, each of the first drawing units including a first through hole penetrating the first body and a first surface disposed on the first upper surface An upper opening, a first lower opening disposed on the first lower surface, and a first surrounding wall connecting the first upper opening and the first lower opening, the first upper opening having an opening area larger than the first a lower opening, when the first lower surface of the first body is adhered to the substrate, the adhesive can be solidified by the first lower opening into the first through hole, and form a pulling force with the first surrounding wall. Therefore, the first body unit is not easily detached from the substrate. A fin device having an increased pulling force according to the first aspect of the invention, wherein a circumference of the first surrounding wall is gradually increased from the first lower opening toward the first upper opening. A heat sink device having an increased drawing force according to the first aspect of the invention, wherein each of the first drawing units further comprises a rough surface disposed on the first surrounding wall. The heat sink device with increased pull force according to claim 1, wherein the first through hole has a large aperture portion connecting the first upper opening and a small aperture portion connecting the first lower opening And a shoulder between the large aperture portion and the small aperture portion. According to the fourth aspect of the invention, the heat sink device has a pull-out force, wherein the first through hole further has a pull-tab protruding from the shoulder toward the center line of the first through hole. The heat sink device of claim 1, wherein the first body unit further comprises a first body unit disposed in the first body and extending through the first upper surface and the first lower surface. Large open hole. The heat sink device of claim 1 , wherein the first lower surface of the first body forms a receiving groove, and the plurality of first drawing units surround the receiving groove Settings. The heat sink device with increased pull force according to claim 6 further includes a second body unit, including a spacer disposed above the first body and having a second upper surface and a second lower surface a second body, and a connecting layer connecting the second lower surface and the first upper surface, and the outer edges of the first body and the second body are aligned. The heat sink device with increased pull force according to Item 8 of the patent application scope further includes a plurality of second drawing units disposed in the second body, each of the second drawing units including a through hole a second through hole of the second body, a second upper opening disposed on the second upper surface, a second lower opening disposed on the second lower surface, and a second upper opening and the second lower a second surrounding wall of the opening, the second upper opening having an opening area larger than the second lower opening. The heat sink device with increased pull force according to claim 6 further includes a third body unit, including a third body disposed above the first body, and a periphery of the third body To the base a connecting section extending in the direction of the board and connected to the first body, the outer periphery of the third body being no larger than the large opening.