TW201637109A - Drying device and its suitable semiconductor strip honing machine - Google Patents

Abstract

The present invention relates to a drying apparatus and a semiconductor strip grinding machine to which the drying apparatus is applied, comprising: a mounting plate on which a grinding and cleaning work is completed; and a lifting portion that makes the mounting plate from a predetermined The reference position is lowered to the dry position; the rotary motor generates a rotational force; and the rotating portion transmits the rotational force of the rotary motor to the mounting plate to rotate the mounting plate, so that the present invention obtains the effect that the removal can be performed The cutting fluid, the washing water, and the grinding dust remaining on the surface after the grinding operation formed on the upper portion of the unit substrate of the semiconductor strip to reduce the overall thickness of the semiconductor strip are completely dried and removed.

Description

Drying device and its suitable semiconductor strip grinding machine

The present invention relates to a semiconductor strip grinder, and more particularly to a drying apparatus suitable for use in a semiconductor strip grinder, wherein the semiconductor strip grinder grinds a protective molding layer of a semiconductor strip to reduce semiconductor strips In the thickness, the semiconductor strip is formed by arranging a plurality of unit substrates on which a semiconductor wafer is mounted and packaged on the upper surface of the base substrate.

Generally, a semiconductor package is manufactured by the following process. That is, a semiconductor wafer is first fabricated by forming a highly integrated circuit such as a transistor and a capacitor on a semiconductor substrate fabricated on a germanium material, and then attaching the semiconductor wafer to, for example, a lead frame. Or a strip material such as a printed circuit board, and electrically connecting the semiconductor wafer and the strip material to a wire or the like to electrically energize each other, and then molding with an epoxy resin to protect the semiconductor wafer from the external environment. .

The semiconductor package is packaged in a matrix arrangement on the strip material, and the individual packages in the strip material are cut and separated into individual pieces, thus separated into individual packages which are in accordance with predetermined quality standards. After sorting, it is loaded on a tray or the like and sent to a subsequent step.

The form completed by the molding step is called a semiconductor strip or a semiconductor material. The semiconductor strip includes a plurality of semiconductor packages. The cutting step is performed in order to separate the individual semiconductor packages from the semiconductor strip or semiconductor material.

First, the semiconductor strip can be mounted to a chuck table or a cutting station of the manufacturing apparatus. That is, the strips before the separation of the plurality of semiconductor packages can be mounted by the strip picker.

The semiconductor strip is cut into a single package, ie a unit package, by a cutting device. Specifically, the semiconductor strip is cut into a semiconductor package by relative movement between the cutting device and the vacuum chuck unit in a state of being mounted to the vacuum chuck unit.

After the cutting step is completed, the plurality of semiconductor packages are moved by the unit pickup or the package pickup for subsequent steps such as cleaning and drying.

The plurality of semiconductor packages that have been cleaned and dried are moved to the turntable by a turn table picker. At the turntable, visual inspection of the semiconductor package can be performed, and the semiconductor package that has finished inspection is sorted by the sorting pickup.

For example, Patent Document 1 and Patent Document 2 below disclose a semiconductor strip and an adsorption unit configuration of a semiconductor manufacturing apparatus.

Patent Document 1 describes a configuration of a substrate strip including: a base substrate having a rectangular shape; a plurality of unit substrates formed by dividing a base substrate; and a mold gate formed on a long side of the base substrate a part of a plurality of unit substrates; and a dummy which is formed on the base substrate and formed on the two short sides of the base substrate facing each other.

Patent Document 2 describes a configuration of an adsorption unit for a semiconductor manufacturing apparatus including: an adsorption pad for adsorbing a semiconductor strip or a plurality of semiconductor packages; and a body having a body for accommodating The adsorption pad accommodating portion of the adsorption pad is attached to the adsorption pad accommodating portion after being formed in a manner corresponding to the outer size of the adsorption pad accommodating portion.

Prior technical literature Patent literature

Patent Document 1: Korean Invention Patent Authorization Gazette No. 10-0872129 (announcement on December 8, 2008)

Patent Document 2: Korean Patent Publication No. 10-2014-0024627 (published on March 3, 2014)

However, in the prior art, since the semiconductor strip forms a protective molding layer on the periphery of the unit substrate in order to protect the unit substrates provided on the base substrate, the protective molding layer is formed not only on the left and right sides of the unit substrate, but also in the unit. Since the upper portion of the substrate is also formed, there is a problem that the overall thickness of the semiconductor strip becomes thick.

That is, in the prior art, since there is no semiconductor strip grinder capable of grinding the protective mold layer of the semiconductor strip, there is a semiconductor strip which can only be thickened by the thickness of the protective mold layer. problem.

In addition, in the past, a cleaning operation was performed after grinding a semiconductor strip to remove cutting fluid and grinding dust, and dried by spraying compressed air. Since it is dry, there is a problem that the cutting fluid, the washing water, the grinding dust, and the like are scattered, and the drying cannot be performed completely.

Thus, there is a problem that the semiconductor strip which is not completely dried causes a decrease in accuracy during the visual inspection.

Further, in the past, after the semiconductor strip was dried, the semiconductor strip was supplied to the next step by the pickup method, and therefore, there was a problem that the unit substrate of the semiconductor strip was damaged during the pickup.

The present invention has been made in an effort to solve the above problems, and an object of the present invention is to provide a drying apparatus capable of rotating a semiconductor strip and drying it, and a semiconductor strip polishing machine to which the same is applied.

Another object of the present invention is to provide a drying apparatus and a semiconductor strip grinder to which it is applied, which is capable of preventing damage to the semiconductor strip during the supply of the dried semiconductor strip to the next step.

The present invention provides a drying apparatus for achieving the object as described above, and the drying apparatus according to the present invention includes: a mounting plate on which a grinding and cleaning work is completed; and a lifting portion that allows the mounting The plate is lowered from a predetermined reference position to a dry position; a rotary motor generates a rotational force; and a rotating portion that transmits a rotational force of the rotary motor to the mounting plate to rotate the mounting plate.

In order to achieve the above object, the present invention provides a semiconductor strip grinder to which a drying apparatus is applied, and a semiconductor strip grinder to which the drying apparatus according to the present invention is applied is characterized in that it comprises: a drying apparatus, which is used for work The semiconductor strip of the object is rotated for drying; vacuum suction a disk unit that fixes and cleans the semiconductor strip; a first picker that sequentially loads the semiconductor strips to the vacuum chuck unit; and a grinding unit that protects the semiconductor strips that are fixed to the vacuum chuck unit The layer is removed by grinding; and a second picker that loads the semiconductor strip ground by the grinding unit into the drying device.

As described above, with the drying apparatus according to the present invention and the semiconductor strip mill to which it is applied, there is obtained an effect that the semiconductor layer can be removed while performing the removal of the molding layer formed on the upper portion of the unit substrate of the semiconductor strip. The cutting fluid, the washing water, and the grinding dust remaining on the surface after the grinding operation in which the overall thickness is reduced is completely dried and removed.

Moreover, according to the present invention, since spin drying is performed in a state in which the semiconductor strip is firmly fixed by the fixing unit during the drying operation, damage of the semiconductor strip which can occur during the spin drying process is obtained. .

Further, according to the present invention, since the dried semiconductor strip is supplied to the next step by the feeding means by the feeding means, it is possible to obtain an effect of preventing damage of the semiconductor strip which occurs during the supply process.

Further, according to the present invention, since the semiconductor strip is quickly and thoroughly dried in a short time, an effect of improving the accuracy of the visual inspection performed in the next step can be obtained.

10‧‧‧Semiconductor strip grinder

11‧‧‧Shell

12‧‧‧ base

15‧‧‧rail

20‧‧‧vacuum suction cup unit

21‧‧‧Sucker Workbench

22‧‧‧Y-axis robot

30‧‧‧First picker

30’‧‧‧Second Picker

40‧‧‧ grinding unit

50‧‧‧Drying device

51‧‧‧Installation board

52‧‧‧ Lifting Department

53‧‧‧Rotary motor

54‧‧‧Rotating Department

55‧‧‧ upper board

56‧‧‧Shell

80‧‧‧Fixed unit

81‧‧‧Fixed parts

82‧‧‧ bracket

83‧‧‧Rotary bearings

84‧‧‧Vertical

85‧‧‧ horizontal department

86‧‧‧ fixed ridge

87‧‧‧Kandingkan

88‧‧‧Flexible parts

89‧‧‧Setting bracket

90‧‧‧Feed unit

91‧‧‧Mobile Department

92‧‧‧Feed parts

93‧‧‧Mobile board

94‧‧‧ Guides

110‧‧‧First Loading Department

111‧‧‧material box

112‧‧‧Box mobile robot

120‧‧‧Supply module

130‧‧‧Check module

131‧‧‧ visual orbit

132‧‧‧Visual Robot

140‧‧‧Second Loading Department

141‧‧‧Loading robot

511‧‧‧Guided ribs

551‧‧‧through hole

S10‧‧‧ steps

Step S12‧‧‧

Step S12‧‧‧

S16‧‧ steps

S18‧‧‧ steps

S20‧‧‧ steps

Figure 1 is a view of a drying apparatus according to a preferred embodiment of the present invention A perspective view of a semiconductor strip mill.

2 is a top plan view of the semiconductor strip grinder of FIG. 1 after removal of the outer casing.

Figure 3 is a perspective view of a drying apparatus in accordance with a preferred embodiment of the present invention.

4 is a view of the drying device illustrated in FIG. 3 after removal of the housing.

Fig. 5 is an enlarged view of the fixing unit.

6 and 7 are operational state diagrams of the lifting and lowering operation of the fixing unit with the mounting plate.

Figure 8 is a flow chart showing the operation of the semiconductor strip grinder to which the drying apparatus according to the preferred embodiment of the present invention is applied, in accordance with various steps.

Hereinafter, a drying apparatus and a semiconductor strip grinder to which the same is applied according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

In the following description, "upper", "lower", "front", "rear", and other directional terms are defined on the basis of the state illustrated in the drawings.

In the present embodiment, a drying apparatus suitable for use in a semiconductor strip grinder is described in which the semiconductor strip grinder grinds a protective mold layer formed on an upper portion of a semiconductor strip.

However, the present invention is not necessarily limited thereto, and it should be noted that the present invention can be modified not only in a manner suitable for use in a semiconductor strip polishing machine, but also in a drying apparatus suitable for a plurality of working objects. The drying device removes moisture, oil, dust, and the like remaining on the work object that has been processed and cleaned.

1 is a perspective view of a semiconductor strip grinder to which a drying apparatus according to a preferred embodiment of the present invention is applied, and FIG. 2 is a plan view of the semiconductor strip grinder of FIG. 1 after removing the outer casing.

As illustrated in Figures 1 and 2, a semiconductor strip mill 10 in accordance with a preferred embodiment of the present invention includes a vacuum chuck unit 20 that secures and cleans a semiconductor strip to remove a protective molding layer of a semiconductor strip. a first picker 30 that sequentially loads a semiconductor strip onto the vacuum chuck unit 20; a grinding unit 40 that removes the protective molding layer of the semiconductor strip loaded in the vacuum chuck unit 20; A device 50 that dries the semiconductor strip ground by the grinding unit 40, and a second picker 30' that loads the semiconductor strip ground by the grinding unit 40 into the drying device 50.

Also, the semiconductor strip grinder 10 according to the preferred embodiment of the present invention can further include: a first loading portion 110 having a loading space loaded with a plurality of cartridges (magazines) of a semiconductor strip to be subjected to a grinding operation 111 is loaded in the loading space; the supply module 120 sequentially supplies the semiconductor strips loaded in the respective cartridges 111 one by one to the grinding unit 40; and the inspection module 130 checks the accuracy of the semiconductor strips at the end of the grinding operation. And a second loading portion 140 that loads the semiconductor strip that is inspected.

Thus, the present invention is capable of providing various devices for performing various steps such as grinding, cleaning, drying, inspection, and the like inside a casing 11 and for providing each The cutting fluid, washing water or vacuum pressure tanks and pumps required for the steps.

A display panel that displays an operation state of each device and an operation panel for setting the operation of each device and controlling the operation can be provided on the front surface of the casing 11.

In this way, the present invention is configured as follows: a first loading unit, a drying device, an inspection module, and a second loading unit are respectively disposed on both sides of the vacuum chuck unit, and the supply module and the first pickup and the second are utilized. The pickup performs the respective steps while sequentially moving the semiconductor strips along a straight line.

Thus, the present invention minimizes the moving distance of the entire process of removing the protective mold layer of the semiconductor strip, thereby improving the work speed and simplifying the internal configuration of the entire apparatus, thereby making it possible to maximize the space utilization.

In the present embodiment, the direction in which the semiconductor strips are sequentially moved along a straight line (X-axis direction) is referred to as "semiconductor strip transport direction".

In the following description, the configuration of each device provided in the semiconductor strip mill will be described in detail in the order of the entire steps.

The cartridge moving robot 112 that moves the cartridge 111 upward or downward can be disposed at the first loading portion 110, thereby moving the cartridge 111 loaded with the semiconductor strip to a predetermined position to load the semiconductor strip loaded on the cartridge 111. The belt is supplied to the side of the grinding unit 40.

The inspection module 130 can include: a thickness inspection robot that checks the thickness of the semiconductor strip at the end of the grinding operation; receives the transfer of the semiconductor strip from the end of the grinding operation from the second pickup 30' and brings the semiconductor strip to the second a visual track 131 transported on the side of the loading portion 140; A visual robot 132 that performs a visual inspection is performed on the semiconductor strips conveyed by the tracks 131.

The loading robot 141 can be disposed at the second loading portion 140, and the loading robot 141 moves the cartridge 111 upward or downward to load a semiconductor strip inside the empty cartridge 111 to which the semiconductor strip that has been completed to the inspection operation is to be loaded, and The loading end of the cartridge 111 is moved toward the loading space.

The vacuum chuck unit 20 functions to cause the semiconductor strip to follow a predetermined direction when the semiconductor strip is fixed and the semiconductor strip is moved to the lower portion of the grinding unit 40 for the grinding operation, the cleaning operation, and the thickness inspection operation. Move only the predetermined distance.

To this end, the vacuum chuck unit 20 can include a chuck table 21 that forms a vacuum to fix the semiconductor strip in an adsorbed manner, and a Y-axis robot 22 that causes the chuck table 21 to be perpendicular to the direction in which the semiconductor strip is transported. Moving; a vacuum pump connected to the chuck table 21 and forming a vacuum to generate a suction force; and a washing water pump (not shown) that supplies the washing water to the chuck table 21.

The constitution of the drying apparatus according to the preferred embodiment of the present invention will now be described in detail with reference to Figs. 3 and 4.

3 is a perspective view of a drying apparatus in accordance with a preferred embodiment of the present invention, and FIG. 4 is a view of the drying apparatus illustrated in FIG. 3 after removal of the housing.

As illustrated in FIGS. 3 and 4, the drying device 50 according to the preferred embodiment of the present invention can include: a mounting plate 51 that mounts a semiconductor strip at the end of the cleaning operation; and a lifting portion 52 that causes the mounting plate 51 to Scheduled benchmark The position is lowered to the dry position; the rotary motor 53 generates a rotational force; and the rotating portion 54 transmits the rotational force of the rotary motor 53 to the mounting plate 51 to rotate the mounting plate 51.

Moreover, the drying device 50 according to the preferred embodiment of the present invention can further include: an upper plate 55 having a through hole 551 formed in a central portion thereof corresponding to the shape of the mounting plate 51; and a housing 56 disposed on the upper plate A space in which the mounting plate 51 rotates is formed in the lower portion of the 55.

The mounting plate 51 is formed substantially in a size and shape corresponding to the shape of the semiconductor strip, and a fixing unit 80 for fixing the semiconductor strip mounted on the upper surface can be provided on each of the front, rear, left, and right sides of the mounting board 51.

On the front and rear sides of the upper surface of the mounting plate 51, a guide rib 511 that guides the semiconductor strip to be inserted can be formed to protrude upward.

For example, FIG. 5 is an enlarged view of a fixed unit.

As illustrated in FIG. 5, the fixing unit 80 can include a fixing member 81 that is pivotally disposed on a side surface of the mounting plate 51, a bracket 82 that is coupled to the pivoting member thereof, and a rotary bearing 83, It is provided in the upper plate 55 so as to correspond to the fixing member 81, and the fixing member 81 is pivoted when the fixing member 81 performs the lifting operation.

The fixing member 81 is formed in a substantially "L" shape, and is pivotally provided to an installation space formed on one side of the bracket 82.

That is, the fixing member 81 can include: a vertical portion 84 that is disposed in the up and down direction when the semiconductor strip is fixed; and a horizontal portion 85 that is connected to the lower end of the vertical portion 84 and that is disposed in the horizontal direction when the semiconductor strip is fixed .

A fixed ridge 86 can be bent at the upper end of the vertical portion 84 to fix the side end of the semiconductor strip.

A concave curved surface is formed on one side of the horizontal portion 85 so as to be in contact with the rotary bearing 83 when the mounting plate 51 performs the ascending operation, and the locking can 87 can be formed at the end of the curved surface.

On the other hand, the fixing unit 80 can further include an elastic member 88 that provides an elastic force to the fixing member 81 to securely fix the semiconductor strip when the semiconductor strip is fixed. The elastic member 88 can be provided with a coil spring supported at both ends by the mounting plate 51 and the bracket 82, respectively.

The rotary bearing 83 is axially fitted to the mounting bracket 89 provided around the through hole 551 of the upper plate 55, and pivots the fixing member 81 while rotating while being in contact with the fixing member 81.

For example, FIGS. 6 and 7 are operational state diagrams of the lifting and lowering operation of the fixing unit with the mounting plate.

FIG. 6 shows a state in which the fixing of the semiconductor strip is released when the mounting board is raised, and FIG. 7 shows a state in which the semiconductor strip is fixed when the mounting board is lowered.

As illustrated in FIG. 6, when the mounting plate 51 performs the ascending motion, the rotary bearing 83 presses the locking dam 87 formed at the front end of the horizontal portion 85 of the fixing member 81, thereby pivoting the vertical portion 84 in the clockwise direction. Rotate and configure in the horizontal direction.

Thereby, the fixing unit 80 can supply the semiconductor strip to the mounting board 51 or discharge the semiconductor strip in which the drying operation is completed.

As illustrated in FIG. 7, when the mounting plate 51 performs the lowering motion, the rotation The rotary bearing 83 presses the vertical portion 84 of the fixing member 81 so that the vertical portion 84 is pivoted in the counterclockwise direction to be disposed in a vertical state.

At this time, the fixing member 81 maintains the vertical state by the elastic force of the elastic member 88, and the semiconductor strip can be firmly fixed by the fixing dam 86 formed at the front end of the vertical portion 84.

This drying device 50 is rotated at approximately 1500 rpm to thoroughly dry the semiconductor strip.

The lifting portion 52 can include a lifting cylinder that performs a lifting operation by the pressure of the fluid.

On the other hand, the drying device 50 according to the preferred embodiment of the present invention can further include a feeding unit 90 that feeds the dried semiconductor strips in a feeding manner to perform the next step, that is, visual inspection.

As illustrated in FIG. 3, the feeding unit 90 can include a moving portion 91 that is disposed to be movable along the guide rail 15, wherein the guide rail 15 is horizontally disposed on the base 12 along the conveying direction of the semiconductor strip. One side; and a feeding member 92 horizontally disposed at an upper end of the moving portion 91 along the Y-axis direction.

The moving unit 91 can include a motor (not shown in the drawings) that is driven based on a control signal of the control unit, and a moving plate 93 that moves in response to transmission of a rotational force of the motor.

The guide rail 15 is provided with a position detecting sensor (not shown) for detecting the position of the moving plate 93, and the control unit receives the transmission of the detection signal of the position detecting sensor and judges the moving plate 93 and the feeding member 92. Location It is possible to control the drive of the motor.

The feeding member 92 is formed substantially in a rod shape, and a pair of guide members 94 can be formed at a front end portion of the feeding member 92, and the pair of guide members 94 are spaced apart only by a distance corresponding to the width of the semiconductor strip.

In this way, the present invention supplies the semiconductor strip at the end of the cleaning and drying operation to the next step by the feeding robot in the feeding mode after the end of the grinding operation, thereby preventing the semiconductor strip from being damaged during the supply process. Or broken.

Next, a working method of a drying apparatus and a semiconductor strip grinder to which the same is applied according to a preferred embodiment of the present invention will be described in detail with reference to FIG.

Figure 8 is a flow chart showing the operation of the semiconductor strip grinder to which the drying apparatus according to the preferred embodiment of the present invention is applied, in accordance with various steps.

In step S10 of FIG. 8, the cartridge moving robot 112 transports the cartridge 111 loaded on the first loading portion 110 to a predetermined position, and the supply module 120 supplies the semiconductor strip in a feeding manner along the conveying rail to a predetermined position. position.

In this way, the pickup portion of the first picker 30 picks up the semiconductor strip in an adsorption manner by using the vacuum pressure generated by the driving of the vacuum pump to generate the suction force, and loads the semiconductor strip into the vacuum chuck unit 20 The suction cup table 21 (S12).

At this time, the elevating unit of the supply module 120 raises the semiconductor strip to a predetermined height to enable the first picker 30 to easily pick up the semiconductor strip.

The load sensor disposed on the first picker 30 detects the pick-up portion Raw vacuum pressure. If the detected vacuum pressure reaches a predetermined set pressure, the control portion controls the driving of the first picker 30 such that the first picker 30 lifts and loads the semiconductor strip to the chuck table 21.

The rotating portion 32 of the first pickup 30 causes the pickup portion to rotate only about 90 degrees so that the picked semiconductor strip is attached to the chuck table 21 disposed in a direction perpendicular to the conveying direction of the semiconductor strip.

As a result, the vacuum chuck unit 20 stably adsorbs and fixes the semiconductor strip by the vacuum pressure formed by the vacuum pump.

In step S14, the control unit controls the driving of the grinding unit such that the grinding wheel provided in the grinding unit 40 moves toward the upper portion of the semiconductor strip and the protective mold layer formed on the upper portion of the semiconductor strip is ground and removed.

At this time, the grinding unit 40 sprays the cutting fluid during the grinding operation, and if the grinding operation is completed, the vacuum chuck unit 20 discharges the washing water to remove the cutting fluid and the grinding dust remaining in the semiconductor strip and the chuck table 21. Thereby, the semiconductor strip and the chuck table 21 are cleaned.

As a result, the second picker 30' picks up the semiconductor strip by the suction force by the vacuum pressure, and loads the semiconductor strip to the mounting board 51 of the drying device 50.

In step S16, the drying device 50 rotates and drys the semiconductor strip at the end of the cleaning operation, and the feeding unit 90 supplies the dried semiconductor strip to the visual orbit 131 in a feeding manner.

The details are as follows: The lifting portion 52 of the drying device 50 lowers the mounting plate 51 to a predetermined rotational position.

At this time, the fixing member 81 of the fixing unit 80 provided to the mounting board 51 is provided. The fixed dam 86 formed at the front end of the vertical portion 84 is pressed by the rotary bearing 83 to be pivotally rotated in the counterclockwise direction, and the semiconductor strip is firmly fixed by the elastic force of the elastic member 88.

When the semiconductor strip is fixed, the control unit controls the driving of the rotary motor 53 so that the semiconductor strip is rotated at a predetermined rotational speed for a predetermined time to be dried.

As described above, in the present invention, since the semiconductor strip is dried by rotating the inside of the casing of the drying device, it is possible to prevent the water or the grinding dust from scattering during the drying process.

Moreover, in the present invention, since the semiconductor strip is firmly fixed by the fixing unit, the semiconductor strip can be prevented from being damaged or damaged during the drying process.

Furthermore, the present invention rapidly and thoroughly dries the semiconductor strip in a short period of time, thereby improving the accuracy of the visual inspection performed in the next step.

When the drying operation is completed, the lifting portion 52 raises the mounting plate 51 to a predetermined initial position, and the moving portion 91 of the feeding unit 90 moves the feeding member 92 in the semiconductor strip conveying direction to feed the visual track 131 in a feeding manner. Supply of semiconductor strips.

At this time, the locking dam 87 formed at the front end of the horizontal portion 85 is pressed by the rotary bearing 83 and pivoted in the clockwise direction so that the fixing member 81 of the fixing unit 80 is fixed, thereby releasing the fixing state of the semiconductor strip. .

As such, the present invention moves the semiconductor strip in a feed mode. Supply to the visual track, and therefore, damage of the semiconductor strip during the supply process can be prevented.

At step S18, the visual robot 132 captures the semiconductor strip supplied to the visual track 131 to perform a visual inspection, and if the visual inspection is completed, the loading robot 141 disposed at the second loading portion 140 adjusts the height of the empty cartridge to carry the semiconductor strip. Loaded in an empty space (S20).

The control unit performs control so as to repeatedly perform the steps S10 to S20 until the end of the grinding operation of the entire semiconductor strip on which the grinding operation is to be performed.

According to the above-described process, since the semiconductor strip is dried by the spin drying method, the cutting fluid, the abrasive dust, and the moisture remaining on the surface of the semiconductor strip during the grinding and cleaning can be completely removed.

The invention made by the inventors of the present invention has been described in detail above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention.

In the above embodiment, the description has been made with respect to an example applied to a semiconductor strip polishing machine, but the present invention is not necessarily limited thereto.

That is, the present invention can be modified not only in a manner suitable for use in a semiconductor strip polishing machine, but also in a drying apparatus suitable for a plurality of types of work objects, which will remain in the processed work and are cleaned. Moisture, oil, dust, and the like on the work object are dried and removed.

Industrial utilization

The present invention is applicable to a semiconductor strip mill technique in which a mold layer of an upper portion of a unit substrate of a semiconductor strip is ground and removed.

12‧‧‧ base

15‧‧‧rail

50‧‧‧Drying device

51‧‧‧Installation board

53‧‧‧Rotary motor

55‧‧‧ upper board

56‧‧‧Shell

80‧‧‧Fixed unit

90‧‧‧Feed unit

91‧‧‧Mobile Department

92‧‧‧Feed parts

93‧‧‧Mobile board

94‧‧‧ Guides

511‧‧‧Guided ribs

551‧‧‧through hole

Claims (8)

A drying device comprising: a mounting plate on which a working object at the end of grinding and cleaning operations is installed; a lifting portion that lowers the mounting plate from a predetermined reference position to a dry position; a rotating motor that generates a rotational force; and a rotation a portion that transmits a rotational force of the rotary motor to the mounting plate to rotate the mounting plate. The drying device according to claim 1, further comprising: an upper plate having a through hole corresponding to a shape of the mounting plate at a central portion thereof; and a case provided at a lower portion of the upper plate and having an inner portion formed therein a space in which the mounting plate rotates; a fixing unit that fixes the work object is disposed on the mounting plate. The drying device according to claim 2, wherein the fixing unit comprises: a fixing member that is pivotally disposed on a side of the mounting plate; a bracket that is pivotally engaged with the pivoting member; and a rotary bearing The upper plate is provided corresponding to the fixing member, and the fixing member is pivoted when the fixing member performs the lifting operation. The drying device of claim 3, wherein the fixing member comprises: a vertical portion disposed in an up-and-down direction when the work object is fixed; and a horizontal portion connected to a lower end of the vertical portion and disposed in a horizontal direction when the work object is fixed; and a front end of the vertical portion is bent and formed Fix the kan to fix the work object. The drying device according to claim 4, wherein a concave curved surface is formed on one side of the horizontal portion so as to be locked in contact with the rotary bearing when the mounting plate performs an ascending motion; a card is formed at an end of the curved surface. Fixed. The drying device according to claim 3, wherein the fixing unit further comprises an elastic member which is supported by the mounting plate and the bracket at both ends, and provides an elastic force to the fixing member when the working object is fixed . The drying device according to claim 2, further comprising a feeding unit that supplies the drying end of the working object to the next step by means of feeding; the feeding unit includes: a moving portion capable of being able to a guide rail is disposed in a manner of moving; the guide rail is disposed along a conveying direction of the working object; and a feeding member is horizontally disposed at an upper end of the moving portion along the Y-axis direction, and pushing a rear end of the working object to cause mobile. A semiconductor strip grinder suitable for use in a drying apparatus, comprising: a drying apparatus having the record as claimed in any one of claims 1 to 7 a carrier structure, which is dried by rotating a semiconductor strip as a work object; a vacuum chuck unit that fixes and cleans the semiconductor strip; and a first picker that sequentially loads the semiconductor strip into the vacuum chuck unit a grinding unit that removes the protective molding layer of the semiconductor strip fixed to the vacuum chuck unit; and a second picker that loads the semiconductor strip that is ground by the grinding unit In the drying device.