TW201628120A - Wafer carrier - Google Patents

Abstract

The present invention discloses a wafer carrier device for carrying a plurality of wafers for performing a semiconductor process. The wafer carrier device includes an active drive module, a plurality of driven turntable modules, and a ring gear member. Any of the driven turntable modules includes a turntable component and a gear ring, and the gear ring or the active drive module has a first annular groove for receiving the plurality of balls. The ring gear member is configured to mesh with a portion of the gear ring, and the wafer on the turntable member revolves relative to the central axis of the active drive module and rotates relative to the central axis of the turntable member by driving the active drive module. By using this device, the thickness of the wafer coating can be made uniform to improve the yield of the semiconductor process.

Description

Wafer carrier

The present invention relates to a semiconductor process apparatus, and more particularly to a wafer carrier and a reaction chamber therefor.

In semiconductor processes, vapor phase growth equipment uses a variety of gases from different sources to form a film. Among them, Chemical Vapor Deposition (CVD) is a chemical technique used to produce solid materials with high purity and good performance. A typical CVD process exposes a wafer to one or more different precursors, chemically and/or chemically decomposed on the surface of the wafer to produce a film to be deposited.

Metal Organic Chemical Vapor Deposition (MOCVD) is a kind of chemical vapor deposition. When growing a thin film, it is a container for passing a carrier gas through a metal organic reaction source. The saturated vapor is sent to the reaction chamber to be mixed with other reaction gases, and the heating temperature of the wafer to be grown is controlled by the heating device, and then a chemical reaction occurs on the wafer to be grown to promote the growth of the film. Generally, an MOCVD apparatus includes a chamber, a carrier base disposed in the chamber, and a conduit for flowing a reactive gas to the surface of the substrate. In the MOCVD apparatus, a wafer is placed on a carrier base, the wafer is heated to an appropriate temperature, and a metal metal gas is introduced into the surface of the wafer via a pipeline, thereby performing a film formation process. Here, in order to make the thickness of the formed film uniform, it is required that the reaction gas uniformly flows along the wafer surface in the MOCVD apparatus. Taking the horizontal flow type MOCVD device as an example, when the carrier base rotates, the wafer disposed thereon also rotates toward the central axis of the carrier base, so that when the carrier gas flows outward at a certain level, there is a specific consumption. Depletion, that is, a wafer near the inner ring portion of the carrier base has a higher coating thickness growth rate; and a wafer near the outer circumference of the carrier substrate has a lower coating thickness growth rate, and therefore, a carrier base In terms of the thickness of the full-surface wafer coating, the thickness of the coating will decrease from the inner ring portion to the outer ring portion, which is a consumption phenomenon. This coating thickness gradient phenomenon is not acceptable in the industry. A conventional device includes a rotating device, the rotating device is provided with a driving wheel, a ring body is provided with inner ring teeth on the inner ring wall, and at least one gear is disposed on the inner ring wall of the ring body, and the gear meshes with the driving wheel and the inner ring Between the teeth, the carrier disk is fixed on each gear, and the periphery of the disk is provided with a notch to facilitate the clamping of the wafer. After the driving wheel is rotated by the motor, the ring body is set as a fixing member, and the carrier plate holding the wafer will be driven by the gears and the inner ring teeth to achieve a revolution of the gear with respect to the center of the driving wheel. At the same time, each carrier disk itself can be combined with the inner ring and the inner ring tooth due to the gear teeth, and becomes a self-rotating effect when the revolution is running. However, this structure limits the configuration space of other components. Therefore, how to develop equipment with excellent process yield has always been a problem for the industry.

One of the objects of the present invention is to provide a wafer carrier device, wherein the wafer disposed on the turntable component can be simultaneously rotated toward the center axis of the active drive module and respectively toward the center of the turntable component by driving the active drive module. The shaft rotates to make the thickness of the wafer coating more uniform to improve the yield of the semiconductor process.

The present invention provides a wafer carrier device for carrying a plurality of wafers for performing a semiconductor process. The wafer carrier device includes: an active drive module, a plurality of driven turntable modules, and a ring gear member. The active drive module includes a plate-shaped body. A plurality of driven turntable modules are disposed on the plate-shaped main body, and any of the driven turntable modules includes a turntable component and a gear disposed around one side wall of the turntable component, wherein any of the turntable components is used to carry the wafer, and the gear One of the ring and the plate-shaped body has a first annular groove for receiving a plurality of balls. The ring gear member is disposed outside the plate body for engaging with the gear ring. By driving the active drive module, the wafer on the turntable component is revolved relative to the central axis of the active drive module and rotated relative to the central axis of the turntable component.

The purpose of the present invention, the technical contents, the features, and the effects achieved by the present invention will be more apparent from the detailed description of the embodiments.

The invention mainly provides a wafer carrying device, which comprises an active transmission module, a plurality of driven turntable modules and a ring gear component, wherein the plurality of driven turntable modules further comprise a plurality of turntable components and a plurality of gears The ring and the semiconductor device are simultaneously rotated and rotated by the above device to make the thickness of the wafer coating more uniform. The embodiments of the present invention will be described in detail below with reference to the drawings. In addition to the detailed description, the present invention may be widely practiced in other embodiments, and any alternatives, modifications, and equivalent variations of the described embodiments are included in the scope of the present invention, and the scope of the following patents is quasi. In the description of the specification, numerous specific details are set forth in the description of the invention. In addition, well-known steps or elements are not described in detail to avoid unnecessarily limiting the invention. The same or similar elements in the drawings will be denoted by the same or similar symbols. It is to be noted that the drawings are for illustrative purposes only and do not represent the actual dimensions or quantities of the components. The irrelevant details are not fully depicted in order to facilitate the simplicity of the drawings.

First, please refer to FIG. 1A. FIG. 1A is a schematic structural diagram of a wafer carrier device according to an embodiment of the present invention. As shown, a wafer carrier device 1 is configured to carry a plurality of wafers W for performing a semiconductor process in a reaction chamber (not shown). In one embodiment, the semiconductor process can be an MOCVD process. , but not limited to this. The wafer carrier device 1 of this embodiment mainly includes an active transmission module 10, a plurality of driven turntable modules 11 and a ring gear member 12. The active transmission module 10 includes a plate-shaped body 101. A plurality of driven turntable modules 11 are disposed on the plate-shaped main body 101. Any of the driven turntable modules 11 includes a turntable member 111 and a gear ring 112 disposed around one side wall 1111 of the turntable member 111. The turntable member 111 The wafer W is used to carry the wafer W, and one of the gear ring 112 and the plate-shaped body 101 has a first annular groove for accommodating a plurality of balls 13. The ring gear member 12 is disposed outside the plate-like body 101 for engaging with the partial gear ring 112. By driving the active transmission module 10, the wafer W on the turntable element 111 is driven to revolve relative to the central axis X _{1 of the} active drive module 10 and to rotate relative to the central axis X _{2 of the} turntable element 111. The detailed structure is described below.

Following the above, in one embodiment, the position of the first annular groove is illustrated. As shown in the embodiment of FIG. 1B, the first annular groove 131 is disposed on the plate-shaped body 101 and located in the plate-shaped body 101. Between the gear ring 112 and the gear ring 112, the position of the ball 13 is restricted. In another embodiment, as shown in FIG. 1C , the first annular groove 131 may also be disposed on the lower surface of the gear ring 112 . Or, an annular groove is provided on the lower surface of the plate-shaped main body 101 and the gear ring 112, as shown by reference numerals 131 and 132 in FIG. 1D, and the upper and lower grooves are opposite in position, and it can be understood that the annular groove is apart from A groove holder may be disposed on the lower surface of the plate-shaped body 101 and the gear ring 112; it may also be a groove integrally formed with the plate-shaped body 101 or the lower surface of the gear ring 112. The upper and lower limits are used to limit the range of movement of the plurality of balls 13, so that the balls 13 can roll evenly in the groove structure to reduce the average wear of the balls 13. In the drawings of the above embodiments, it can be seen that the widths of the annular grooves 131, 132 are larger than the diameter of the balls 13, so that the balls 13 can freely roll in the annular grooves 131, 132 (see also FIG. 1E). . It can be understood that, because the balls 13 are randomly arranged, in another embodiment, the balls 13 can also be closely arranged in the annular groove 131 (132) as shown in FIG. 1F. Regardless of the embodiment of FIG. 1E or FIG. 1F, the width d of the annular groove may be larger than the diameter D of the ball 13, wherein the material of the ball 13 includes, but is not limited to, ceramic. However, in still another embodiment, as shown in FIGS. 1G and 1F, the width d of the annular groove may also be equal to the diameter D of the ball 13.

Next, please refer to FIG. 2A. FIG. 2A is a partial exploded view showing the structure of a wafer carrying device according to an embodiment of the present invention. As shown in the figure, the active transmission module 10 is mainly a plate-shaped body 101, and the plate-shaped body 101 includes a plurality of grooves 1012 for accommodating the driven turntable module 11, and a part of the teeth of the gear ring 112 is worn. The side edges of the plate-like main body 101 are engaged with the ring gear member 12. In one embodiment, the active transmission module 10 is driven by a central rotating shaft module 14 , and the central rotating shaft module 14 is connected to the plate-shaped main body 101 for driving the wafer W on the rotating disk component 111 to simultaneously drive the active transmission. The central axis X _{1 of the} module 10 revolves. In this embodiment, the plate-shaped main body 101 includes a central through hole 1011 penetrating therein, and a center turntable member 102 is disposed in the center through hole 1011 and fitted into the plate-shaped main body 101. In one embodiment, the central through hole 1011 extends through the center of the plate-like body 101, and the groove 1012 is disposed around the central through hole 1011. Preferably, the distance from the center of the central through hole 1011 to the center of the groove 1012 The system is equidistant. A partially enlarged schematic view of the assembly, as shown in FIG. 2B, the center turntable member 102 is received in the central through hole 1011 and fitted into the central through hole 1011. In an embodiment, the upper portion of the center turntable member 102 has a fitting mechanism. 1021 is fitted to the plate-shaped main body 101.

The remaining detailed structure of the plate-shaped body 101 is shown in FIG. 3A and FIG. 3B. In this embodiment, as shown in FIG. 3A, the inner surface of each groove 1012 is formed with a taper with an opening tapered, wherein The inner surface of the recess 1012 includes a first opening 1012a at the bottom of the recess 1012, a second opening 1012b above the first opening 1012a, and a second opening 1012b having a diameter larger than the diameter of the first opening 1012a; The step portion 1012c is formed between the first opening 1012a and the second opening 1012b. The turntable member 111 is disposed behind the recess 1012. As shown in FIG. 3B, the recess 1012 has a gap G with the turntable member 111. In still another embodiment, the recess 1012 extends through the plate-like body 101 to form a plurality of through holes 1012', as shown in FIG. 3C, and the remaining structure can be the same as the above embodiment, which will not be described again. The first annular grooves 131, 132 (shown in FIGS. 3B, 3E, and 3F) are formed between the lower surface of the gear ring 112 and the step portion 1012c.

The driven turntable module 11 includes a turntable component 111 and a gear ring 112 disposed on a side thereof. The turntable component 111 is assembled and placed in the recess 1012. In an embodiment, please continue to match the reference diagram. 3A, FIG. 3B, FIG. 3A is an exploded cross-sectional view of the driven carousel module 11 according to an embodiment of the present invention; and FIG. 3B is a partially enlarged view of the assembled body of FIG. 3A. As shown in FIG. 3A, the turntable member 111 has a thickness. The cylinder is used to carry the wafer W, and includes a top surface 1112, a bottom surface 1113, and sidewalls 1111 surrounding the top surface 1112 and the bottom surface 1113. The bottom surface 1113 is disposed opposite to the top surface 1112, and the turntable element 111 is received. In the groove 1012 and between the bottom surface 1113 and the plate-like body 101, there is a gap G (as shown in FIG. 3B). In still another embodiment, if the groove is the through hole 1012', the bottom surface 1113 of the turntable member 111 It is flush with the lower surface 1013 of the plate-like body 101 (as shown in FIG. 3D) to facilitate temperature control by heating the heater below. It can be understood that the groove 1012 that does not penetrate the plate-like body 101 can prevent the corrosive gas in the process from flowing to the plate-like body 101 to reduce the loss of components under the plate-shaped body 101. As shown in FIG. 3A and FIG. 3B, the gear ring 112 is hollow and fixed to the side wall 1111 of the turntable member 111 near the top surface 1112 as a technical means for assisting the rotation of the turntable member 111, and the rear gear ring 112 and the plate are assembled. There is a gap G ₁ between the bodies 101. In one embodiment, the gear ring 112 is mechanically fixed to the turntable member 111. However, the gear ring 112 may be formed as a single component with the turntable member 111. Referring to FIG. 3B, in this embodiment, the turntable member 111 has a protrusion 1111a protruding outwardly from the side wall 1111 thereof and having a plurality of holes 1111b under the protrusion 1111a, and the inner diameter of the gear ring 112 corresponds to the hole. The position of 1111b has a gap 1121, and the plurality of cylinders 1114 are disposed in the hole 1111b and the gap 1121 to fix the gear ring 112 to the turntable member 111, so that the turntable member 111 can rotate simultaneously when the gear ring 112 is driven. .

Furthermore, referring again to FIG. 2A and FIG. 2B, the central hinge module 14 is fixed to the center turntable member 102 in a suitable manner and located in the center through hole 1011, so that the central hinge module 14 can be activated with the center turntable member 102. The plate-shaped main body 101 of the transmission module 10 is simultaneously interlocked. In one embodiment, the lower portion of the center turntable member 102 has a slope 1022, so that the center turntable member 102 is centered with the center shaft module 14 through the slope 1022. In one embodiment of the present invention, the active drive module 10 can be driven by the central rotating shaft module 14 so that the wafer W disposed on the turntable component 111 can simultaneously revolve against the active drive module 10 and respectively toward the central axis of the turntable component 111. rotation.

Following the above description, in an embodiment, when the driving module 10 is driven by the central rotating shaft module 14 and the ring gear member 12 is fixed and not rotated, when the central rotating shaft module 14 drives the central rotating plate member 102 to rotate, The moving turntable module 11 is revolved by the center turntable member 102, so that the gear ring 112 of the driven turntable module 11 can be rotated by meshing with the fixed ring gear member 12. In another embodiment, the wafer carrier further includes a rotor module 15 disposed under the ring gear member 12 for driving the ring gear member 12, wherein the rotor module 15 and the driving module 10 are driven. The speed can be different, so that the speed of the revolution and the rotation of the driven carousel module 11 is different. In short, the revolution speed and the rotation speed can be controlled separately according to the demand. The wafer carrier device 1 can simultaneously revolve and rotate the wafer W during the semiconductor manufacturing process to effectively offset the consumption phenomenon, and the uniformity of the temperature and the uniformity of the thickness of the coating layer can be effectively improved.

In another embodiment, referring to FIGS. 4A and 4B, the wafer carrier device 1 further includes a plurality of gear ring covers 16 for covering over the plurality of gear rings 112, wherein each of the gear ring covers 16 is disposed There is a gap G ₂ between the upper surface of the active transmission module 10 and the underlying gear ring 112, wherein the gear ring cover 16 is disposed to protect the gear ring 112 from slowing the rate of process gas corrosion to improve the gear ring 112. Lifetime, in one embodiment, the upper surface 161 of the covered gear ring cover 16 is flush with the top surface 1112 of the turntable member 111. In addition, the wafer carrier device 1 further includes an active drive module cover 17 for covering the active drive module 10, wherein the active drive module cover 17 has a plurality of hollow portions 171 for exposing the center turntable member 102, plural The turntable element 111 and the plurality of gear ring covers 16; and the upper surface 172 of the rear drive drive cover plate 17 is flush with the upper surface of the plate-like body 101 and the upper surface 161 of the gear ring cover 16. Similarly, the arrangement of the active transmission module cover 17 can slow the corrosion rate of the process gas to the plate-like body 101 to increase the service life of the plate-like body 101. Moreover, in order to prevent the process gas, such as hot ammonia gas, the corrosion of the cover plate, in one embodiment, further including a protective layer coating film disposed on the active transmission module cover 16 and the gear ring cover plate 17 One of them.

The above-mentioned wafer carrying device can be used to carry out a semiconductor process, and the reaction chambers of different embodiments of the present invention are respectively referred to FIG. 5A and FIG. 5B. A reaction chamber 2 is configured to perform a metal organic chemical vapor deposition (MOCVD) reaction process on a plurality of wafers W, and the reaction chamber 2 may include the wafer carrier device 1 of any of the above embodiments, wherein the reaction chamber 2 includes: a cavity 20, and the wafer carrier device 1 is disposed in the cavity 2. A gas supply device 21a (as shown in FIG. 5A) or 21b (FIG. 5B) is disposed above the wafer carrier device 1 for providing a reaction gas of the wafer carrier device 1, wherein the gas supply device is a horizontal spray type (FIG. 5A). ) with one of the vertical spray type (Figure 5B). A heating device 22 is disposed under the active transmission module 10 for heating the wafer W. By using the wafer carrier device 1 of the present invention, the wafer W can be simultaneously revolved and rotated during the semiconductor manufacturing process to effectively offset the consumption phenomenon, and the uniformity of the temperature and the uniformity of the thickness of the coating layer can be effectively improved.

In summary, the driving of the active drive module enables the wafer disposed on the turntable component to revolve simultaneously against the central axis of the active drive module and rotate toward the central axis of the turntable component to make the thickness of the wafer coating. Better uniformity to improve the yield of semiconductor processes. Furthermore, there is a gap between the turntable component for carrying the wafer and the plate-shaped body of the active drive module, and the ball can be placed to reduce the friction phenomenon when the wafer rotates. Moreover, the groove structure is used to limit the range of movement of the balls, and the opening of the groove is larger than the diameter of the balls, so that the balls can roll evenly in the groove structure, and the average wear of the balls can be reduced. In addition, in order to slow the process gas corrosion rate of the active drive module, the cover gas may be covered by the cover gas to improve the life of each component. The wafer carrying device of the present invention can be widely used in a horizontal jet or vertical spray MOCVD process chamber to effectively improve the process yield.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. Therefore, the scope of the patented scope of the invention should be construed as broadly construed in the

1‧‧‧ wafer carrier
10‧‧‧Active drive module
101‧‧‧ plate body
1011‧‧‧ center through hole
1012‧‧‧ Groove
1012'‧‧‧through hole
1012a‧‧‧first opening
1012b‧‧‧ second opening
1012c‧‧‧Departure
1013‧‧‧ lower surface
102‧‧‧ center turntable components
1021‧‧‧Chimeric institutions
1022‧‧‧Slope
11‧‧‧ Driven turntable module
111‧‧‧ Turntable components
1111‧‧‧ side wall
1111a‧‧‧Protruding
1111b‧‧‧ hole
1112‧‧‧ top surface
1113‧‧‧ bottom
1114‧‧‧Cylinder
112‧‧‧Gear ring
1121‧‧‧difference
12‧‧‧Ring gear elements
13‧‧‧ balls
131,132‧‧‧ annular groove
14‧‧‧Center shaft module
15‧‧‧Rotor module
16‧‧‧Gear ring cover
161‧‧‧ upper surface
17‧‧‧Active drive module cover
171‧‧‧镂空部
172‧‧‧ upper surface
2‧‧‧Reaction chamber
20‧‧‧ cavity
21a, 21b‧‧‧ gas supply
22‧‧‧ heating device
‧‧‧Width
D‧‧‧diameter
G, G ₁ , G ₂ ‧ ‧ gap
W‧‧‧ wafer
X ₁ , X ₂ ‧‧‧ central axis

FIG. 1A is a schematic structural view of a wafer carrier device according to an embodiment of the invention. 1B, 1C, and 1D are partially enlarged schematic views of different embodiments according to Fig. 1A. 1E and 1F are partially enlarged schematic views of a ball arrangement according to different embodiments of Fig. 1A. 1G and 1H are partially enlarged schematic views showing a ball arrangement according to still another embodiment of the present invention. 2A is a partial exploded view of the structure of FIG. 1A. 2B is a partial schematic view showing the structure of a wafer carrier device according to an embodiment of the invention. 3A is an exploded cross-sectional view of an active transmission module in accordance with an embodiment of the present invention. 3B, 3E, and 3F are partially enlarged views of different embodiments after the assembly of Fig. 3A. 3C is an exploded cross-sectional view of an active transmission module according to still another embodiment of the present invention. Figure 3D is a partial enlarged view of the assembled portion of Figure 3C. 4A is a partial exploded view showing the structure of a wafer carrying device according to still another embodiment of the present invention. 4B is a partial enlarged view showing the structure of a wafer carrying device according to still another embodiment of the present invention. 5A and 5B are schematic views of a reaction chamber of various embodiments of the present invention.

1‧‧‧ wafer carrier

10‧‧‧Active drive module

101‧‧‧ plate body

11‧‧‧ Driven turntable module

111‧‧‧ Turntable components

1111‧‧‧ side wall

112‧‧‧Gear ring

12‧‧‧Ring gear components

13‧‧‧ balls

W‧‧‧ wafer

X ₁ , X ₂ ‧‧‧ central axis

Claims (29)

A wafer carrying device for carrying a plurality of wafers for performing a semiconductor process, the wafer carrying device comprising: an active drive module comprising a plate-shaped body; a plurality of driven turntable modules disposed on the plate In the main body, any of the plurality of driven turntable modules includes a turntable component and a gear disposed around a side wall of the turntable component, wherein the turntable component is used to carry the wafers, and the gear rings and the board One of the main bodies has a first annular groove for receiving a plurality of balls; and a ring gear member is disposed outside the plate body for engaging the gear rings by driving the active The transmission module, in turn, drives the wafers on the turntable component to revolve relative to a central axis of the active drive module and to rotate relative to a central axis of the turntable component. The wafer carrier device of claim 1, wherein the plate-shaped body comprises a plurality of grooves for receiving the plurality of driven turntable modules, and a portion of the sides of the grooves pass through the plate-shaped body. The side edges are such that a part of the teeth of the gear ring passes through the side of the plate-shaped body to be engaged with the ring gear element. The wafer carrier device of claim 2, wherein the grooves have a gap with the turntable member. The wafer carrying device of claim 2, wherein an inner surface of each of the grooves is formed with a taper having an opening taper, wherein an inner surface of the recess comprises: a first opening at a bottom of the through hole a second opening is located above the first opening, and a diameter of the second opening is greater than a diameter of the first opening; and a gap portion is interposed between the first opening and the second opening. The wafer carrier device of claim 4, wherein the first annular groove is disposed on the step. The wafer carrier device of claim 2, wherein the grooves extend through the plate-shaped body to form a plurality of through holes. The wafer carrying device of claim 6, wherein an inner surface of each of the through holes is formed with a taper with an opening tapered, wherein an inner surface of the through hole includes: a first opening at a bottom of the through hole a second opening is located above the first opening, and a diameter of the second opening is greater than a diameter of the first opening; and a gap portion is interposed between the first opening and the second opening. The wafer carrier device of claim 7, wherein the first annular groove is disposed on the step. The wafer carrier of claim 1, wherein the turntable element and the gear ring are formed as a single part. The wafer carrier device of claim 1, wherein the gear ring is disposed on the turntable member with a fixing member. The wafer carrier device of claim 10, wherein the turntable member has a protrusion protruding outward from the sidewall and a plurality of holes are formed below the protrusion, and an inner diameter of the gear ring corresponds to the holes The position has a gap; and the fixing member is a plurality of cylinders disposed in the holes and the gap to fix the gear ring on the turntable member. The wafer carrier of claim 1, wherein the plurality of balls are free to roll within the first annular groove. The wafer carrier device of claim 1, wherein the plurality of balls are closely arranged in the first annular groove. The wafer carrier of claim 1, wherein the first annular groove is formed on the plate-shaped body and below the gear ring. The wafer carrier of claim 1, wherein the first annular groove is formed on a lower surface of the gear ring. The wafer carrier device of claim 1, wherein a second annular groove is formed in the other of the gear ring and the plate-shaped body and opposite to the first annular groove. The wafer carrier device of claim 1, wherein the active transmission module is driven by a central rotating shaft module, and the central rotating shaft module is coupled to the plate-shaped body for driving the crystals on the rotating plate member. The circle can simultaneously revolve against the central axis of the active drive module. The wafer carrier device of claim 17, wherein the plate-shaped body comprises a central through hole therethrough, and the plurality of through holes are disposed around the central through hole, wherein a center turntable member is disposed in the central through hole, And fitted to the plate-shaped body. The wafer carrier device of claim 18, wherein the upper portion of the center turntable member has a fitting mechanism and a lower portion thereof has a slope through which the center turntable member passes through the center through hole of the plate body The fitting is performed, and the inclined surface is opposite to the central rotating shaft module. The wafer carrier device of claim 18, further comprising a plurality of gear ring covers for covering the plurality of gear rings, wherein each of the gear ring covers and each of the gear rings has gap. The wafer carrier device of claim 20, further comprising an active drive module cover for covering the active drive module, wherein the active drive module cover has a plurality of openings for exposing the center turntable component The turntable components and the gear ring covers; and the upper surface of the active drive module cover is flush with the upper surfaces of the gear ring covers. The wafer carrier device of claim 21, further comprising a center cover covering the center turntable component, wherein an upper surface of the center cover and an upper surface of the active drive module cover, the gear ring cover The upper surface is flush. The wafer carrier device of claim 22, further comprising a protective layer coating disposed on at least one of the active drive module cover, the gear ring cover, and the center cover. The wafer carrier device of claim 1, further comprising a rotor module disposed under the ring gear member for driving the ring gear member. The wafer carrier device of claim 24, wherein the rotor module and the active drive module have different driving speeds. The wafer carrier device of claim 1, further comprising a plurality of gear ring covers for covering the plurality of gear rings, wherein each of the gear ring covers and each of the gear rings has gap. The wafer carrier device of claim 26, further comprising an active drive module cover for covering the active drive module, wherein the active drive module cover has a plurality of openings for exposing the turntable components And the gear ring cover; and the upper surface of the active drive module cover is flush with the upper surface of the gear ring cover. The wafer carrier of claim 26, wherein the active drive module cover and the gear ring cover are formed as a single component. The wafer carrier device of claim 26, further comprising a protective layer coating disposed on at least one of the active drive module cover and the gear ring cover.