TW201624185A - Compensating method of power frequency for heat dissipating device and heat dissipating system - Google Patents

Abstract

A heat dissipating system includes a current period controller, a heat dissipating device, and a temperature sensing module. The temperature sensing module is configured to sense a temperature about the resonance frequency of the heat dissipating device, and the temperature sensed by the temperature sensing module transmits to the current period controller by electrical connection between the temperature sensing module and the current period controller. The current period controller is configured to receive an external power and to output a driving period power, and the frequency of the driving period power can be adjusted into a resonance frequency, which is corresponding to the resonance frequency of the heat dissipating device, by the current period controller. The current period controller is electrically connected to the heat dissipating device for transmitting the driving period power with the resonance frequency to the heat dissipating device, thereby operating the heat dissipating device in a resonance state. Additionally, the instant disclosure also provides a compensating method of power frequency for a heat dissipating device.

Description

Power frequency compensation method and heat dissipation system of heat sink

The present invention relates to a heat dissipating device, and more particularly to a power source frequency compensating method and a heat dissipating system for a heat dissipating device.

With the rapid development of electronic products, whether it is a notebook computer, a desktop computer, or a tablet computer, the performance of electronic components such as a central processing unit has been greatly improved compared with the past, and the performance has been greatly improved. And the space is constant, or the downward trend, the electronic components in the operation, the heat per unit area increases accordingly. If the heat cannot be effectively removed, the excessive temperature will affect the operation of the electronic components. A considerable influence, hereinafter referred to as an electronic component, is a heating element, for example, causing a so-called "hotness". What is more, the conventional method is to install a cooling fan on the heating element to reduce the temperature of the heat-dissipating environment of the heating element. This in turn contributes to heat dissipation from the heating element.

However, the common cooling fan in the workshop is fixed in several sizes. For different size heating elements, the cooling fan cannot correspond to the size of all the heating elements, so that the part of the heating element cannot be the effective heat dissipation range of the cooling fan, in other words. The cooling fan is not easy to customize. Furthermore, whether the cooling fan can be continuously operated at a high efficiency is one of the topics that the industry is currently paying attention to.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

Embodiments of the present invention provide a power frequency compensation method and a heat dissipation system for a heat dissipation device, which can be adjusted for different heat generation components and effectively maintained in a high efficiency resonance state.

An embodiment of the present invention provides a heat dissipation system including: a current cycle controller for receiving an external power source and outputting a periodic driving power source, and the current cycle controller can adjust a frequency of the periodic driving power source; The device is electrically connected to the current cycle controller, the heat dissipation device comprises: a substrate; a driving group disposed on the substrate, and the driving group has a core portion and a winding the core portion and can receive the cycle a coil of a driving power source; and a first oscillating group disposed at a same distance from the driving group on the same surface of the substrate, and the first oscillating group has an elongated body and a corresponding body disposed on the body and correspondingly driven a set of actuating magnetic members disposed at a core position, the body having a fixed end disposed on the substrate and a free end opposite to the fixed end, and the body having a resonant frequency that varies with temperature; a temperature sensing mode a set, electrically connected to the current cycle controller, the temperature sensing module is configured to measure a temperature value related to the resonant frequency of the body, and transmit the temperature And the current period controller is configured to enable the current period controller to adjust the frequency of the periodic driving power source to a matching frequency corresponding to the resonant frequency according to the temperature value; wherein the coil can receive the matching frequency Periodically driving the power source to cause the core to generate a reciprocating magnetic field and attracting or repelling the actuating magnetic member through the magnetic field to move the actuating magnetic member adjacent to or away from the driving group, thereby making the body free The end can reciprocate in a resonant state as the actuating magnetic member is displaced.

The embodiment of the present invention further provides a method for compensating for a power supply frequency of a heat dissipating device, comprising: providing a heat dissipating device, wherein the heat dissipating device comprises a substrate, a driving group disposed on the substrate, and a spacing from the driving group a first oscillating group of the same surface of the substrate; the driving group has a core portion and a coil wound around the core portion, the first oscillating group has an elongated body and a corresponding body disposed on the body and corresponding to the driving group Actuating a magnetic member disposed at a core position, the body having a substrate disposed on the substrate a fixed end and a free end opposite to the fixed end, and the body has a resonant frequency that varies with temperature; a temperature sensing module measures a temperature value associated with the resonant frequency of the body; and a current cycle controller Electrically connected to the temperature sensing module and the heat dissipating device, and the current period controller receives an external power source to output a periodic driving power source, and then receives the temperature sensing module to measure through the current period controller. a temperature value obtained such that the current period controller adjusts the frequency of the periodic driving power source according to the temperature value to a matching frequency corresponding to the resonant frequency, and transmits the matching frequency periodic driving power source to the heat dissipation After the coil receives the periodic driving power of the matching frequency, the core generates a reciprocating magnetic field to attract or repel the actuating magnetic member to move the actuating magnetic member adjacent to or away from the driving group, thereby enabling The free end of the body reciprocates in a resonant state as the actuating magnetic member is displaced.

In summary, the power frequency compensation method and the heat dissipation system of the heat dissipation device provided by the embodiments of the present invention can pass through the temperature sensing module under the premise that the heat dissipation device can be customized for different heating element sizes. The current cycle controller cooperates to allow the free end of the body of the heat sink to reciprocate at any time in a resonant state, thereby maintaining the operation of the heat sink at the highest efficiency.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

1000‧‧‧heating system

100‧‧‧heating device

1‧‧‧Substrate

11‧‧‧ first surface

12‧‧‧ second surface

2‧‧‧Drive Group

20‧‧‧ coil

21‧‧‧ core

3A‧‧‧First swing group

3B‧‧‧Second swing group

31‧‧‧Ontology

311‧‧‧ fixed end

312‧‧‧Free end

313‧‧‧ first paragraph

314‧‧‧ second paragraph

315‧‧‧ side

316‧‧‧Connecting edge

317‧‧‧ contour

32‧‧‧Activity magnetic parts

33‧‧‧Swing magnetic parts

9‧‧‧heating components

A‧‧‧Width

B‧‧‧thickness

D‧‧‧Distance

L‧‧‧ Chief

200‧‧‧current cycle controller

300‧‧‧Temperature Sensing Module

301‧‧‧ Heat sink temperature sensor

302‧‧‧External ambient temperature sensor

400‧‧‧External power supply

S110, S120, S130‧‧‧ steps

1 is a schematic view showing a power supply frequency compensation method of the heat dissipation device of the present invention; FIG. 2 is a schematic view showing a first preferred embodiment of the heat dissipation device of the present invention; and FIG. 3A is a schematic view showing when a drive group is generated and Actuation of the magnetic field attracted by the actuating magnetic member; FIG. 3B is a schematic view showing the action of a magnetic field repelled by the two actuating magnetic members when a driving group is generated; FIG. 3C is a schematic view showing the second swinging group due to the elastic force Respond back to the action; 4 is a schematic view showing the state of use of the first preferred embodiment, and is applicable to at least one heat generating component; FIG. 5 is a schematic view showing that the first preferred embodiment is suitable for the size of a heat generating component. Figure 6 is a schematic view showing that the first preferred embodiment is suitable for a short heating element; Figure 7 is a schematic view showing a second preferred embodiment of the heat dissipating device of the present invention; 8 is a cross-sectional view taken along line XX in FIG. 7; FIG. 9 is a schematic view showing the state of use of the second preferred embodiment; FIG. 10 is a schematic view showing a third preferred embodiment of the heat sink of the present invention. Figure 11 is a cross-sectional view taken along line YY of Figure 10; Figure 12 is a cross-sectional view taken along line ZZ of Figure 10; Figure 13 is a schematic view showing the fourth embodiment of the heat sink of the present invention BEST MODE FOR CARRYING OUT THE INVENTION Fig. 14 is a schematic view showing the state of use of the fourth preferred embodiment; Fig. 15 is a schematic view showing the heat dissipation system of the present invention.

[First Embodiment]

Please refer to FIG. 1 to FIG. 14 , which are the first embodiment of the present invention. It should be noted that the related numbers and appearances mentioned in the embodiments are only used to specifically describe the implementation of the present invention. The manner in which the content is understood is not to be construed as limiting the scope of the invention.

This embodiment is a power frequency compensation method for the heat dissipation device 100, and the heat dissipation device 100 to which the method of the embodiment is applied has its specific design requirements (such as the oscillating heat dissipation described below), in order to facilitate understanding of the present embodiment. The power frequency compensation method of the heat sink 100, the specific structure and operation of the heat sink 100 suitable for the method of the present embodiment will be described below.

Referring to FIG. 2, a first preferred embodiment of the heat sink 100 of the present invention is for dissipating heat generated by at least one heat generating component 9 (see FIG. 4). The heat sink 100 includes a substrate 1 and a driving group 2 Two first swing groups 3A and two second swing groups 3B.

The substrate 1 has a first surface 11 and a second surface 12 opposite to the first surface 11. The driving group 2 is disposed on the first surface 11 of the substrate 1, and the driving group 2 includes a core portion 21, and a coil 20 wound around the core portion 21 and receiving a periodic driving power source. The coil 20 is electrically connected to a power supply source (not shown) that provides a periodic drive power source. The periodic driving power supply may be a positive or negative half cycle of a periodic square wave, a triangular wave, a sine wave or an alternating current. In this embodiment, the positive and negative half cycles of the alternating current are taken as an example for illustration. When the current of the power supply source passes through the coil 20, the core 21 and the coil 20 form a strong magnetic field, and the direction of the magnetic field of the strong magnetic field changes reciprocally with time. In this embodiment, the core portion 21 is an iron core.

The first swing group 3A and the second swing groups 3B are all elastic and disposed on opposite sides of the driving group 2, and are disposed at intervals on the first surface 11 of the substrate 1. The first swing groups 3A are closer to the drive group 2, and the second swing groups 3B are farther away from the drive group 2. In addition, the vertical distance D of the driving group 2 to the substrate 1 is less than or equal to one third of the total length L of each of the first swing groups 3A, then D 1/3L, so that each of the first swing groups 3A has a better swing amplitude.

The first oscillating group 3A and the second oscillating group 3B have substantially the same appearance, and only slightly differ in the detailed structure. Each of the first swing groups 3A has a body 31. Each of the bodies 31 has a fixed end 311 disposed on the substrate 1 and a free end 312 opposite to the fixed end 311. Each of the second swing groups 3B has a body 31 having a fixed end 311 disposed on the substrate 1 and a free end 312 opposite to the fixed end 311. The difference between the first swing group 3A and the second swing groups 3B will be described below. Each of the first swing groups 3A further has an actuating magnetic member 32 disposed on the body 31 and corresponding to the core portion 21 of the driving group 2, and is disposed on the body 31 and spaced apart from the actuating magnetic member 32. Swing magnetic member 33. Each of the second swing groups 3B further has a pendulum disposed on the body 31 and corresponding to the first swing group 3A. The oscillating magnetic member 33 is disposed at a position of the movable magnetic member 33. The position of the four-swing magnetic member 33 is away from the substrate 1 as compared with the position at which the two-acting magnetic member 32 is disposed. The two actuating magnetic members 32 and the four swinging magnetic members 33 each have a magnetic field. In the embodiment, the two actuating magnetic members 32 and the four swinging magnetic members 33 are permanent magnets. It should be noted that the magnetic poles 33 of the first oscillating group 3A and the oscillating magnetic members 33 of the second oscillating group 3B are exactly the same, that is, a repulsive force is generated between them.

The mode of operation of the heat sink 100 of the present embodiment will be described below.

Referring to FIG. 2, when the coil 20 does not receive a periodic power supply, or the periodic power supply is not powered, the driving group 2 cannot drive the first swing group 3A, and the first swing group 3A and the second The swing group 3B does not swing, that is, the initial state.

Referring to FIG. 3A to FIG. 4, when a positive or negative half cycle of a periodic power source such as alternating current is applied to the coil 22 of the driving group 2, the driving group 2 starts to generate a changing magnetic field to cause the actuating magnetic members. 32 is attracted or repelled by the drive group 2 such that the actuating magnetic members 32 are adjacent to or away from the drive group 2. Referring to FIG. 3A, when the driving group 2 generates a magnetic field that is attracted to the actuating magnetic members 32, the actuating magnetic members 32 are adjacent to the driving group 2 such that the bodies 31 of the first swing groups 3A are oriented. The swinging magnetic member 33 of the first swing group 3A is corresponding to the swinging magnetic member 33 away from the second swing group 3B, and the second swing group 3B cannot be swung. Referring to FIG. 3B, when the driving group 2 generates a magnetic field repelling the actuating magnetic members 32, the actuating magnetic members 32 are away from the driving group 2, so that the bodies 31 of the first swing groups 3A are oriented. Moving away from the driving group 2, since the oscillating magnetic members 33 of the first oscillating group 3A and the magnetic poles at the two adjacent positions of the oscillating magnetic members 33 of the second oscillating group 3B are exactly the same, the repulsion is driven by the repulsion The body 31 of the two swing groups 3B swings away from the first swing group 3A, and at the same time, the second swing groups 3B are made of an elastic material to store an elastic force. Referring to FIG. 3C, when the driving group 2 generates a magnetic field that is attracted to the actuating magnetic members 32, so that the body 31 of the first swing group 3A is swung toward the driving group 2, the first pendulum The repulsive force between the oscillating magnetic member 33 of the movable group 3A and the oscillating magnetic member 33 of the second oscillating group 3B disappears, and the second oscillating group 3B releases the elastic force, so that the body 31 of the second oscillating group 3B faces The swing is performed in the direction of the first swing group 3A. Referring to FIG. 4, in other words, the body 31 of the first swing group 3A and the body 31 of the second swing group 3B are repeatedly reciprocally oscillated by the different magnetic field directions of the drive group 2.

Referring to FIG. 4, if the heat dissipating device 100 of the embodiment is applied to dissipate heat generated by the at least one heating element 9, the heating element 9 may be disposed adjacent to the first swing group 3A and the second At the free end 312 of the oscillating group 3B, the first oscillating group 3A and the second oscillating group 3B are reciprocally oscillated, and an air flow is generated to blow a heat generating element 9 to dissipate heat. Furthermore, the heating element 9 is mounted on the second surface of the substrate, and the substrate, the first oscillating group 3A and the second oscillating group 3B are made of a material with good heat transfer. The body 31 of the swing group 3A and the body 31 of the second swing group 3B reciprocate to accelerate heat dissipation of the heat generating component 9.

The heat sink 100 can be adjusted for differently sized heating elements 9. Referring to FIG. 5, if the size of the heat generating component 9 is long, the heat sink 100 can increase the number of the second swing groups 3B or increase the distance between the first swing group 3A and the second swing group 3B. . Conversely, referring to FIG. 6, if the size of the heating element 9 is short, the heat sink 100 can reduce the number of the second swing groups 3B or reduce the first swing group 3A and the second swing group 3B. Pitch. In order to make the heat sink 100 easier to customize for different heating elements 9 .

Referring to FIG. 7 to FIG. 9 , a second preferred embodiment of the heat dissipation device 100 of the present invention is substantially the same as the first preferred embodiment, and the difference is the first swing group 3A and the second embodiment. The aspect of the body 31 of the swing group 3B is swung. Each of the bodies 31 has a first segment 313 disposed on the first surface 11 of the substrate 1 and a second segment 314 connected to the first segment 313 away from the substrate 1 . Each of the actuating magnetic members 32 and each of the swinging magnetic members 33 are disposed on the corresponding first segment 313. Preferably, each of the swinging magnets The feature member 33 is not limited to be disposed at the junction of the corresponding first segment 313 and the second segment 314. It should be noted that each of the oscillating magnetic members 33 is not limited to be disposed at the junction of the corresponding first segment 313 and the second segment 314, but may be corresponding to the first segment 313 and the second segment 314. The above (ie, the second segment 314) or the following (ie, the first segment 313) may also be implemented.

The materials of the first segment 313 and the second segments 314 may be copper, aluminum, copper alloy, plastic, wood material (Balsa Wood), carbon fiber and magnesium alloy, and the second segment 314 is compared with the Wait for the first section 313 to have more cardboard. The Young's modulus of the first segments 313 must be greater than the Young's modulus of the second segments 314 in physical properties. In principle, the length of the first segment 313 in the direction away from the substrate 1 is greater than the length of the second segment 314 in the direction away from the substrate 1 , and the ratio between the lengths of the two segments is determined by the actual situation. The size of the space applied is adjusted.

The operation mode of the second preferred embodiment is similar to that of the first preferred embodiment, and therefore will not be described again. It is worth mentioning that, referring to FIG. 5, according to the cantilever beam swing theory, the amplitude of the swing of each of the first segment 313 and the corresponding second segment 314 is negatively correlated with the Young's modulus, and the oscillation frequency is positive with the Young's modulus. Related. Since the swing amplitude and the swing frequency have other influence factors, the Young's modulus of each of the first segments 313 of the present embodiment is compared with the corresponding second segment 314 without changing other influence factors. Large, therefore, each of the first segments 313 can have a faster swing frequency, and each of the second segments 314 will have a larger swing amplitude. Since each of the first segments 313 drives the corresponding second segment 314, the swing frequency of each of the first segments 313 is increased, and the swing frequency of each of the second segments 314 is accelerated, and each of the second segments 314 is The swing amplitude is large, so that a strong airflow can be generated, and a good heat dissipation effect is achieved. More preferably, the first segment 313 has a Young's modulus greater than the second segment 314, and at the same time, the density of the first segment 313 is less than Second paragraph 314. In the preferred embodiment, the material of the first segment 313 is selected as carbon fiber, and the second segment 314 is selected under the condition that the Young's modulus and density are changed without changing other influencing factors. material selection It is a polyester film.

Referring to FIG. 10 to FIG. 12, a third preferred embodiment of the heat sink 100 of the present invention is substantially the same as the first preferred embodiment, and the difference is the first swing group 3A and the second The aspect of the body 31 of the swing group 3B is swung. Each of the bodies 31 has a sheet shape and is tapered toward a distance away from the substrate 1. The cross-section of each of the bodies 31 is a two-phase spaced side 315, and two connecting sides 316 respectively connected to opposite sides of the side 315. Each of the bodies 31 has four contour lines 317 that respectively connect the sides 315 and the vertices of the connecting sides 316. Since the weights of the first swing group 3A and the second swing groups 3B are gradually decreased in a direction away from the substrate 1, the weight is positively correlated with the volume under the same density condition, and therefore, the outline of each of the contour lines 317 can be The fixed end 311 to the free end 312 exhibit a convex curved surface, an oblique straight line, and a concave curve. The concave shape of each of the contour lines 317 is concave, and the effect of decreasing toward the volume away from the substrate 1 is optimal.

It should be noted that although the embodiment has a sheet shape and a volume which is tapered away from the substrate 1, the total length of each of the connecting sides 316 remains unchanged, and a preferred fanning area is obtained.

The operation mode of the third preferred embodiment is similar to that of the first preferred embodiment, and therefore will not be described again. It is worth mentioning that the first swing group 3A and the second swing group 3B are single materials, and according to the cantilever beam swing theory, when the Young's modulus is fixed and a single material is used, different cuts are used. The area (the length of the defined side 315 is the width A and the length of the connecting side 316 is the thickness B, and the width A is multiplied by the thickness B, then A × B) affects the swing frequency and the swing amplitude, since each of the bodies 31 is adjacent to the The cross-sectional area of the substrate 1 is larger than the cross-sectional area away from the substrate 1. Therefore, the portion adjacent to the substrate 1 has a larger oscillation frequency than the portion away from the substrate 1, but the swing amplitude is small, and conversely, away from the substrate 1 The portion of the swing is larger than the portion adjacent to the substrate 1, but the swing frequency is small. The portion of the body 31 adjacent to the substrate 1 will drive the portion of the body 31 away from the substrate 1 , so that the swing frequency of the portion of the body 31 adjacent to the substrate 1 is increased, and the body 31 is accelerated. The swinging frequency of the portion away from the substrate 1 and the swinging amplitude of the portion of the body 31 away from the substrate 1 are increased, and the swinging frequency and the swing of the first swing group 3A and the second swing group 3B are increased. Amplitude, which produces a strong airflow and achieves good heat dissipation.

Referring to Figures 13 and 14, a fourth preferred embodiment of the heat sink 100 of the present invention is substantially the same as the first preferred embodiment, and the differences will be described below.

The first oscillating group 3A of the fourth preferred embodiment omits the oscillating magnetic member 33 compared to the first oscillating group 3A of the first preferred embodiment. The oscillating magnetic members 33 of the second oscillating group 3B are disposed at positions corresponding to the actuating magnetic members 32 of the first oscillating group 3A. It should be noted that the magnetic poles 32 of the first swing group 3A and the magnetic poles 33 of the corresponding swing magnets 33 of the second swing group 3B are exactly the same, that is, one is generated between each other. Repulsive force. The operation mode of the fourth preferred embodiment is similar to that of the first preferred embodiment, and therefore will not be described again.

It should be noted that, in this embodiment, the number of the first swing groups 3A is two, but the heat sink 100 may include only one first swing group 3A.

In summary, the heat sink 100 can be adjusted for different sizes of the heating elements 9. If the size of the heating element 9 is long, the heat sink 100 can increase the number of the second swing groups 3B or increase the distance between the first swing group 3A and the second swing groups 3B. Conversely, if the size of the heat generating component 9 is short, the heat sink 100 can reduce the number of the second swing groups 3B or reduce the distance between the first swing groups 3A and the second swing groups 3B. In order to make the heat sink 100 easier to customize for different heat generating elements 9, one of the objects of the present invention can be achieved.

The above is the specific configuration and operation mode of the heat sink 100 suitable for the method of the present embodiment. Referring to FIG. 1 , the power frequency compensation method of the heat dissipation device 100 proposed in this embodiment will be described below, and the steps include the following steps:

Step S110: providing the heat sink 100 as described above, wherein the body 31 is elongated and has a resonant frequency that varies with temperature. Further, the temperature change of the heat sink 100 affects the resonant frequency of the body 31. For example, when the temperature of the heat sink 100 increases, the resonant frequency of the body 31 decreases; and when the temperature of the heat sink 100 decreases, the resonant frequency of the body 31 rises. That is, there is a negative correlation between the resonant frequency of the body 31 and the temperature of the heat sink 100. In the present embodiment, the negative correlation between the temperature of the heat sink 100 and the resonant frequency of the body 31 is substantially linear, but is not limited thereto. When the resonance frequency of the body 31 is the Y axis and the temperature of the heat dissipation device 100 is the X axis, the linear relationship between the temperature of the heat dissipation device 100 and the resonance frequency of the body 31 is approximately Y=aX+b, a<0. , b>0.

Accordingly, when the frequency of the periodic driving power source received by the coil 20 of the heat sink 100 and the resonant frequency of the body 31 match each other (eg, substantially equal), the reciprocating magnetic field generated by the core 21 can attract Alternatively, the actuating magnetic member 32 is repelled so that the free end 312 of the body 31 reciprocates in a resonant state as the actuating magnetic member 32 is displaced, thereby maintaining the operation of the heat sink 100 at the highest efficiency.

Step S120: measuring a temperature value related to the resonance frequency of the body 31 by a temperature sensing module. Here, the "temperature value related to the resonance frequency of the main body 31" means the temperature of the heat sink 100 (for example, the temperature of the core portion 21) or the external ambient temperature that can affect the temperature of the heat sink 100. That is to say, the temperature of the heat sink 100 will cause the components therein to be slightly changed, thereby directly affecting the resonant frequency of the body 31; the external ambient temperature is substantially estimated by the conversion formula, and the temperature of the heat sink 100 is estimated. In turn, the resonance frequency of the body 31 is indirectly affected.

Furthermore, the temperature sensing module correspondingly includes a heat sink temperature sensor and an external ambient temperature sensor for respectively measuring the temperature of the heat sink 100 and the external ambient temperature. It should be noted that the temperature sensing module in this embodiment is at least one of a heat sink temperature sensor and an external ambient temperature sensor.

Specifically, when the temperature sensing module only includes the heat sink temperature sensor, the step S120 measures the temperature of the heat sink 100 with the heat sink temperature sensor. When the temperature sensing module only includes the external ambient temperature sensor, in step S120, the external ambient temperature outside the heat sink 100 is measured by the external ambient temperature sensor, and the external ambient temperature is converted to obtain a heat equivalent. The temperature of device 100. When the temperature sensing module includes the heat sink temperature sensor and the external environment temperature sensor, the step S120 measures the temperature of the body 31 with the heat sink temperature sensor, and uses the external environment temperature sensor. The external ambient temperature other than the heat sink 100 is measured, and the external ambient temperature is converted to obtain a temperature substantially corresponding to the body 31.

Furthermore, the temperature value of the heat sink 100 measured by the heat sink temperature sensor can be mutually verified with the temperature value of the heat sink 100 measured by the external ambient temperature sensor, thereby being used in the heat sink temperature sensor and When one of the external ambient temperature sensors is damaged (for example, when the difference between the two temperature values is too large), the related maintenance can be immediately known to avoid affecting the overall operation.

Step S130: The current period controller is electrically connected to the temperature sensing module and the heat sink 100, and the current period controller receives an external power source to output a periodic driving power source, and then receives the temperature sense through the current period controller. Measure the temperature value measured by the module, so that the current cycle controller can accurately adjust the resonant frequency of the current body 31 according to the temperature value and the relationship between the temperature of the heat sink 100 and the resonant frequency of the body 31, and then adjust The frequency of the periodic driving power source is a matching frequency corresponding to (eg, approximately equal to) the resonant frequency, and the periodic driving power source of the matching frequency is transmitted to the heat sink 100.

Thereby, after the coil 20 of the heat sink 100 receives the periodic driving power of the matching frequency adjusted by the current cycle controller 200, the core 21 generates a reciprocating magnetic field to attract or repel the actuating magnetic member 32, so that Actuating the magnetic member 32 adjacent to or away from the drive group 2, thereby causing the free end 312 of the body 31 to actuate the magnetic member 32 Displaces and reciprocates in a resonant state.

Further, when the temperature of the heat sink 100 increases, the resonant frequency of the body 31 decreases. At this time, the current cycle controller 200 will decrease the frequency of the periodic driving power source to maintain the matching with the body 31. Similarly, when the temperature of the heat sink 100 drops, the resonant frequency of the body 31 rises, and the current cycle controller 200 will increase the frequency of the periodic driving power source to maintain the matching frequency of the body 31. .

More specifically, the temperature value received by the current cycle controller and the output periodic drive power frequency are substantially negatively correlated. In the present embodiment, the above negative correlation is in accordance with a linear relationship, but is not limited thereto. Wherein, when the frequency of the periodic driving power source is the Y axis and the temperature value is the X axis, the linear relationship is approximately Y=mX+n, m<0, n>0.

Wherein, when the temperature sensing module includes the heat sink temperature sensor and the external ambient temperature sensor, if the temperature value of the heat sink 100 measured by the heat sink temperature sensor is measured by the external ambient temperature sensor And the temperature value of the heat sink 100 after the conversion, when the difference between the temperature values of the two is within a preset range, the current cycle controller is mainly based on the temperature value measured by the heat sink temperature sensor, but not It is limited to this; if the difference between the temperature values of the two is outside the preset range, it means that one of the heat sink temperature sensor and the external ambient temperature sensor may be damaged, so it must be performed. Related inspections and repairs.

It should be noted that, in the above steps S110, S120, and S130 of the power frequency compensation method of the heat dissipation device 100 of the present embodiment, the preceding and following sequences are only for convenience of explanation, but in actual operation, Adjust the order of these steps as needed. For example, the current cycle controller can be electrically connected to the heat sink device 100, and then electrically connected to the current cycle controller by the temperature sensing module.

[Second embodiment]

Referring to FIG. 15 , which is a second embodiment of the present invention, the present embodiment is a heat dissipation system 1000 according to the power frequency compensation method of the heat dissipation device 100 of the first embodiment. From another point of view, the first embodiment is also equivalent to the power frequency compensation method of a heat sink 100 to which the heat dissipation system 1000 of the second embodiment is applied. The heat dissipation system 1000 of the present embodiment can be applied to a server host, a tablet computer, a desktop computer, or other system that requires heat dissipation, and the specific application range is not limited herein.

The heat dissipation system 1000 includes the heat dissipation device 100, a current cycle controller 200, and a temperature sensing module 300 as described in the first embodiment. For a detailed description of the specific configuration of the heat dissipating device 100 in the first embodiment, the description of the first embodiment and the related drawings are omitted, and details are not described herein again. In the following, only the connection relationship between the heat sink 100 and other components will be described. Furthermore, the temperature sensing module 300 is configured to measure a temperature value related to the resonant frequency of the body 31, and the current cycle controller 200 is electrically connected to the temperature sensing module 300 to receive the temperature sensing mode. The temperature value measured by the group 300; and the current cycle controller 200 is electrically connected to the heat sink 100.

The functions of the components of the heat dissipation system 1000 and their connection relationships are further described as follows:

The current cycle controller 200 is configured to receive an external power source 400 to output a periodic driving power source, and the current cycle controller 200 can be used to adjust the frequency of the periodic driving power source. The external power supply 400 is preferably an AC power supply or a pulse width modulation (PWM) DC power supply, but is not limited thereto. For example, when the external power source 400 is a DC power source, a frequency converter is integrated in the current cycle controller 200 to enable the DC power source to be converted into a PWM DC power source.

The temperature sensing module 300 includes a heat sink temperature sensor 301 and An external ambient temperature sensor 302. The heat sink temperature sensor 301 and the external environment temperature sensor 302 may be temperature sensors built in the server host, the tablet computer, or the desktop computer, thereby reducing the heat dissipation system of the embodiment. The cost of 1000 is not limited to this. In the embodiment, the temperature sensing module 300 is exemplified by a heat sink temperature sensor 301 and an external environment temperature sensor 302. However, in practical applications, the temperature sensing module is used. The group 300 may include one of a heat sink temperature sensor 301 and an external ambient temperature sensor 302.

Moreover, the temperature sensing module 300 can transmit the measured temperature value to the current cycle controller 200, so that the current cycle controller 200 can pass the temperature of the heat sink 100 and the body 31 according to the temperature value. The relationship between the resonant frequencies and the current resonant frequency of the body 31 is adjusted to adjust the frequency of the periodic driving power supply to a matching frequency corresponding to the resonant frequency. Accordingly, the coil 20 can receive a periodic drive power of a matching frequency, causing the core 21 to generate a reciprocating magnetic field and attract or repel the actuating magnetic member 32 through the magnetic field to cause the actuating magnetic member 32 to be adjacent. Or away from the drive group 2, the free end 312 of the body 31 can be reciprocally oscillated at any time in response to the displacement of the actuating magnetic member 32.

[Possible effects of the embodiments of the present invention]

In summary, the power frequency compensation method and the heat dissipation system of the heat dissipation device provided by the embodiments of the present invention can pass through the temperature sensing module under the premise that the heat dissipation device can be customized for different heating element sizes. The current cycle controller cooperates to allow the free end of the body of the heat sink to reciprocate at any time in a resonant state, thereby maintaining the operation of the heat sink at the highest efficiency.

Furthermore, the temperature sensing module can be mutually provided with a heat sink temperature sensor and an external ambient temperature sensor, thereby mutually verifying the temperature values of the two sensors, so that the heat sink temperature sensor is And when one of the sensors of the external ambient temperature sensor is damaged, the relevant maintenance can be immediately known to avoid the influence. Overall operation.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

1000‧‧‧heating system

100‧‧‧heating device

200‧‧‧current cycle controller

300‧‧‧Temperature Sensing Module

301‧‧‧ Heat sink temperature sensor

302‧‧‧External ambient temperature sensor

400‧‧‧External power supply

Claims (10)

A heat dissipation system includes: a current cycle controller for receiving an external power source to output a periodic driving power source, and the current cycle controller is capable of adjusting a frequency of the periodic driving power source; a heat sink, the electrical property thereof Connected to the current cycle controller, the heat sink includes: a substrate; a driving group disposed on the substrate, and the driving group has a core and a coil wound around the core and capable of receiving the periodic driving power And a first swing group disposed on the same surface of the substrate at intervals from the driving group, and the first swing group has an elongated body and a core position disposed on the body and corresponding to the driving group An actuating magnetic member is provided, the body having a fixed end disposed on the substrate and a free end opposite to the fixed end, and the body has a resonant frequency that varies with temperature; a temperature sensing module, the electrical property Connected to the current cycle controller, the temperature sensing module is configured to measure a temperature value related to the resonant frequency of the body, and transmit the temperature value to the current cycle The controller is configured to enable the current cycle controller to adjust the frequency of the periodic driving power source to a matching frequency corresponding to the resonant frequency according to the temperature value; wherein the coil can receive the periodic driving power of the matching frequency, And causing the core to generate a reciprocating magnetic field, and attracting or repelling the actuating magnetic member through the magnetic field, so that the actuating magnetic member is adjacent to or away from the driving group, thereby enabling the free end of the body to follow the The magnetic member is actuated to reciprocate in a resonant state. The heat dissipation system of claim 1, wherein the temperature sensing module comprises at least one of a heat sink temperature sensor and an external ambient temperature sensor, wherein the heat sink temperature sensor is used for measuring The temperature of the heat sink, the outside The ambient temperature sensor is used to measure the external ambient temperature outside the heat sink. The heat dissipation system of claim 2, wherein the temperature of the heat sink is substantially negatively correlated with the resonant frequency of the body. The heat dissipation system of any one of claims 1 to 3, wherein the first swing group further has a swinging magnetic member disposed on the body and spaced apart from the actuating magnetic member; the heat sink further comprises a a second swing group disposed on the substrate, the second swing group being away from the drive group than the first swing group, the second swing group having a body and a swing disposed on the body and corresponding to the first swing group a oscillating magnetic member disposed at a position of the magnetic member, the body of the second oscillating group having a fixed end disposed on the substrate and a free end opposite to the fixed end, the oscillating magnetic member of the first oscillating group and the corresponding second The oscillating magnetic members of the oscillating group are mutually exclusive. A power frequency compensation method for a heat sink includes: providing a heat sink, wherein the heat sink includes a substrate, a driving group disposed on the substrate, and a first swing group; the drive group has a core portion and a coil wound around the core portion, the first swing group has an elongated body and a core disposed on the body and corresponding to the position of the core of the drive group a magnetic member having a fixed end disposed on the substrate and a free end opposite to the fixed end, and the body has a resonant frequency that varies with temperature; and a temperature sensing module measures a body related to the body a temperature value of the resonant frequency; and electrically connecting a current cycle controller to the temperature sensing module and the heat sink, and receiving an external power source by the current cycle controller to output a periodic driving power source The current cycle controller receives the temperature value measured by the temperature sensing module, so that the current cycle controller adjusts the periodic drive according to the temperature value A power supply frequency corresponding to the resonance frequency to match the frequency and the matching frequency of the periodic driving power transmitted to the heat sink; after receiving a periodic enabling the coil to match the frequency of the driving power, of the core Generating a reciprocating magnetic field to attract or repel the actuating magnetic member such that the actuating magnetic member is adjacent to or away from the driving group, thereby causing the free end of the body to reciprocate with the displacement of the actuating magnetic member swing. The power frequency compensation method of the heat sink of claim 5, wherein the temperature sensing module comprises a heat sink temperature sensor; and the temperature sensing module is used to measure a temperature value related to the resonant frequency of the body In the step, the temperature of the heat sink is measured by the heat sink temperature sensor. The power frequency compensation method of the heat sink of claim 5, wherein the temperature sensing module includes an external ambient temperature sensor; and the temperature sensing module is used to measure a temperature value related to the resonant frequency of the body In the step of measuring, an external ambient temperature other than the heat sink is measured by the external ambient temperature sensor, and the external ambient temperature is converted to substantially correspond to the temperature of the heat sink. The power frequency compensation method of the heat sink according to claim 5, wherein the temperature sensing module comprises a heat sink temperature sensor and an external ambient temperature sensor; and the temperature sensing module is used to measure the correlation In the step of the temperature value of the body resonance frequency, the temperature of the heat sink is measured by the heat sink temperature sensor, and an external ambient temperature outside the heat sink is measured by the external ambient temperature sensor, and The external ambient temperature is converted to substantially correspond to the temperature of the heat sink. The power frequency compensation method of the heat sink according to claim 5, wherein, in the step of adjusting the frequency of the periodic driving power source according to the temperature value, the current period controller receives the current period controller There is a substantially negative correlation between the temperature value and the frequency of the periodically driven power supply that is output. The power frequency compensation method of the heat sink according to claim 8, wherein the heat sink temperature value measured by the heat sink temperature sensor and the heat sink temperature value measured by the external ambient temperature sensor Mutual verification to determine if the heat sink temperature sensor or the external ambient temperature sensor is damaged.