TW201613437A - Printed circuit board with embedded electronic component and method for manufacturing same - Google Patents
Printed circuit board with embedded electronic component and method for manufacturing sameInfo
- Publication number
- TW201613437A TW201613437A TW103138088A TW103138088A TW201613437A TW 201613437 A TW201613437 A TW 201613437A TW 103138088 A TW103138088 A TW 103138088A TW 103138088 A TW103138088 A TW 103138088A TW 201613437 A TW201613437 A TW 201613437A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- bonding sheet
- manufacturing same
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present disclosure relates to a printed circuit board with an electronic component. The printed circuit board includes an inner printed circuit board, an electronic component, a first bonding sheet, a second bonding sheet, and circuit pattern layers. A receiving hole is defined in the inner printed circuit board. The electronic component is received in the receiving hole. A plurality of electric protrusion blocks are formed on electrodes of the electronic component. A cross section area of each electric protrusion block is gradually decreased away from the corresponding electrode. The first bonding sheet and the second bonding sheet are respectively formed on two opposite sides of the inner printed circuit board. The circuit pattern layers are formed on surfaces of the first bonding sheet and the second bonding sheet. Each electric protrusion block passes through the first bonding sheet and electrically connected with a circuit pattern layer. A method for manufacturing the printed circuit board with an electronic component is also provided.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511781.0A CN105530765A (en) | 2014-09-29 | 2014-09-29 | Circuit board with embedded components and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613437A true TW201613437A (en) | 2016-04-01 |
| TWI599290B TWI599290B (en) | 2017-09-11 |
Family
ID=55772652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103138088A TWI599290B (en) | 2014-09-29 | 2014-11-03 | Printed circuit board with embeded electronic component and method for manufacturing same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105530765A (en) |
| TW (1) | TWI599290B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111527798A (en) * | 2018-10-12 | 2020-08-11 | 庆鼎精密电子（淮安）有限公司 | Embedded circuit board and manufacturing method thereof |
| CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技（淮安）有限公司 | High-density interconnection circuit board and preparation method thereof |
| WO2023272642A1 (en) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | Electronic component package, electronic component, voltage regulator module, and voltage stabilizing device |
| CN115551172A (en) * | 2021-06-30 | 2022-12-30 | 深南电路股份有限公司 | Electronic element package, electronic component, voltage regulation module and voltage regulator |
| CN119031582A (en) * | 2023-05-25 | 2024-11-26 | 鹏鼎控股(深圳)股份有限公司 | Method for manufacturing circuit board structure, circuit board structure, and power supply equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
| CN101281894B (en) * | 2007-04-02 | 2012-01-18 | 欣兴电子股份有限公司 | Carrying structure of semiconductor component and its stacking structure |
| CN101594740B (en) * | 2008-05-27 | 2012-06-06 | 华通电脑股份有限公司 | Circuit board with embedded electronic devices and method thereof |
| TWI393513B (en) * | 2009-02-04 | 2013-04-11 | Unimicron Technology Corp | Embedded circuit board and fabricating method thereof |
| US9305854B2 (en) * | 2012-08-21 | 2016-04-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package |
-
2014
- 2014-09-29 CN CN201410511781.0A patent/CN105530765A/en active Pending
- 2014-11-03 TW TW103138088A patent/TWI599290B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI599290B (en) | 2017-09-11 |
| CN105530765A (en) | 2016-04-27 |
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