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TW201613212A - Laser processing device and output method of pulsed laser beam - Google Patents

Laser processing device and output method of pulsed laser beam

Info

Publication number
TW201613212A
TW201613212A TW104116486A TW104116486A TW201613212A TW 201613212 A TW201613212 A TW 201613212A TW 104116486 A TW104116486 A TW 104116486A TW 104116486 A TW104116486 A TW 104116486A TW 201613212 A TW201613212 A TW 201613212A
Authority
TW
Taiwan
Prior art keywords
laser
instruction signal
control device
exciting
pulse
Prior art date
Application number
TW104116486A
Other languages
Chinese (zh)
Other versions
TWI562484B (en
Inventor
Shobun Hara
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201613212A publication Critical patent/TW201613212A/en
Application granted granted Critical
Publication of TWI562484B publication Critical patent/TWI562484B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a laser processing device and output method of pulsed laser beam. The laser processing device is capable of adjusting the laser power based on each laser pulse so as to change the pulse energy. A laser power source applies a high-frequency voltage to the discharging electrode of a laser oscillator according to the working cycle of an input exciting instruction signal. An exciting pattern instruction signal with working cycle information is applied to a laser control device. The laser control device provides the exciting instruction signal to the laser power source according to the working cycle information included in an exciting pattern instruction signal. A processing machine control device provides a pulse output time signal of an output time of an instruction pulse laser beam and the exciting pattern instruction signal to the laser control device. An object carrying table holds an object under processing. A pulsed laser beam outputted from the laser oscillator is guided by optics to the object under processing held on the object carrying table.
TW104116486A 2014-09-17 2015-05-22 Laser processing device and output method of pulsed laser beam TW201613212A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014188369A JP6355496B2 (en) 2014-09-17 2014-09-17 Laser processing apparatus and pulse laser beam output method

Publications (2)

Publication Number Publication Date
TW201613212A true TW201613212A (en) 2016-04-01
TWI562484B TWI562484B (en) 2016-12-11

Family

ID=55493525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104116486A TW201613212A (en) 2014-09-17 2015-05-22 Laser processing device and output method of pulsed laser beam

Country Status (4)

Country Link
JP (1) JP6355496B2 (en)
KR (1) KR101746921B1 (en)
CN (1) CN105414749B (en)
TW (1) TW201613212A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI713275B (en) * 2018-04-20 2020-12-11 日商住友重機械工業股份有限公司 Laser device and its power supply device
TWI744619B (en) * 2018-04-20 2021-11-01 日商住友重機械工業股份有限公司 Laser processing machine and its power supply device
TWI767476B (en) * 2019-12-31 2022-06-11 美商希瑪有限責任公司 Undercut electrodes for a gas discharge laser chamber
TWI796963B (en) * 2021-03-12 2023-03-21 達航科技股份有限公司 Laser processing method of printed circuit board and laser processing device of printed circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6732613B2 (en) * 2016-09-07 2020-07-29 住友重機械工業株式会社 Laser light source and laser processing apparatus using the same
JP6831270B2 (en) * 2017-03-02 2021-02-17 住友重機械工業株式会社 Power control device for high frequency power supply, control method for high frequency power supply, and light source for laser machining system
BE1025957B1 (en) * 2018-01-26 2019-08-27 Laser Engineering Applications Method for determining laser machining parameters and laser machining device using said method
JP6957113B2 (en) * 2018-01-30 2021-11-02 住友重機械工業株式会社 Laser control device
JP7084759B2 (en) * 2018-03-29 2022-06-15 住友重機械工業株式会社 Laser processing equipment
US11070026B2 (en) 2019-07-19 2021-07-20 Analog Devices International Unlimited Company High current nanosecond laser driver circuit with wide pulse-width adjustment range
US11075502B2 (en) 2019-08-29 2021-07-27 Analog Devices, Inc. Laser diode driver circuit techniques
US20220288720A1 (en) * 2021-03-12 2022-09-15 Ofuna Enterprise Japan Co., Ltd. Laser processing method and laser processing machine
CN119965657A (en) * 2024-12-31 2025-05-09 上海瑞柯恩激光技术有限公司 Multi-pulse laser light emitting system and control method thereof and laser treatment equipment

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Publication number Priority date Publication date Assignee Title
JP3945951B2 (en) * 1999-01-14 2007-07-18 日立ビアメカニクス株式会社 Laser processing method and laser processing machine
JP4647372B2 (en) * 2005-04-11 2011-03-09 住友重機械工業株式会社 Laser processing equipment
JP5159355B2 (en) * 2008-02-12 2013-03-06 三菱電機株式会社 Laser power supply
JP5550648B2 (en) * 2009-07-27 2014-07-16 三菱電機株式会社 High frequency power supply
CN102593702B (en) * 2011-01-04 2013-11-13 李俊豪 Laser device with equal energy pulse wave synchronous movement
WO2014080822A1 (en) * 2012-11-20 2014-05-30 国立大学法人九州大学 Laser machining apparatus and laser machining method
WO2014110276A1 (en) * 2013-01-11 2014-07-17 Electro Scientific Industries, Inc. Laser pulse energy control systems and methods
CN104105568B (en) * 2013-02-14 2015-10-21 三菱电机株式会社 Laser processing device, processing control device and pulse frequency control method
CN203621730U (en) * 2013-11-12 2014-06-04 西安中科麦特电子技术设备有限公司 High-power laser spot control system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI713275B (en) * 2018-04-20 2020-12-11 日商住友重機械工業股份有限公司 Laser device and its power supply device
TWI744619B (en) * 2018-04-20 2021-11-01 日商住友重機械工業股份有限公司 Laser processing machine and its power supply device
TWI767476B (en) * 2019-12-31 2022-06-11 美商希瑪有限責任公司 Undercut electrodes for a gas discharge laser chamber
TWI796963B (en) * 2021-03-12 2023-03-21 達航科技股份有限公司 Laser processing method of printed circuit board and laser processing device of printed circuit board

Also Published As

Publication number Publication date
TWI562484B (en) 2016-12-11
CN105414749B (en) 2018-02-16
KR20160033022A (en) 2016-03-25
CN105414749A (en) 2016-03-23
JP6355496B2 (en) 2018-07-11
KR101746921B1 (en) 2017-06-14
JP2016059932A (en) 2016-04-25

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