TW201613030A - Package substrate and method for manufacturing the same - Google Patents
Package substrate and method for manufacturing the sameInfo
- Publication number
- TW201613030A TW201613030A TW103134044A TW103134044A TW201613030A TW 201613030 A TW201613030 A TW 201613030A TW 103134044 A TW103134044 A TW 103134044A TW 103134044 A TW103134044 A TW 103134044A TW 201613030 A TW201613030 A TW 201613030A
- Authority
- TW
- Taiwan
- Prior art keywords
- package substrate
- conductive posts
- circuit layer
- high conductive
- manufacturing
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A method for forming a package substrate is provided. First, a package substrate structure is provided, in which the package substrate structure includes a dielectric layer, a first circuit layer and a second circuit layer respectively disposed on two sides of the dielectric layer, and a plurality of conductive posts disposed in the dielectric layer and electrically connected to the first circuit layer and the second circuit layer. Then, a plurality of lower parts of high conductive posts are formed on the first circuit layer, and a plurality of upper parts of the high conductive posts are formed on the lower parts of the high conductive posts, in which a diameter of the lower parts of the high conductive posts is greater than a diameter of the uppers parts of the high conductive posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103134044A TWI569365B (en) | 2014-09-30 | 2014-09-30 | Package substrate and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103134044A TWI569365B (en) | 2014-09-30 | 2014-09-30 | Package substrate and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613030A true TW201613030A (en) | 2016-04-01 |
| TWI569365B TWI569365B (en) | 2017-02-01 |
Family
ID=56360943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103134044A TWI569365B (en) | 2014-09-30 | 2014-09-30 | Package substrate and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI569365B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7468545B2 (en) * | 2005-05-06 | 2008-12-23 | Megica Corporation | Post passivation structure for a semiconductor device and packaging process for same |
| TWM433634U (en) * | 2012-03-23 | 2012-07-11 | Unimicron Technology Corp | Semiconductor substrate |
-
2014
- 2014-09-30 TW TW103134044A patent/TWI569365B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI569365B (en) | 2017-02-01 |
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