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TW201612249A - Photosensitive resin composition, manufacturing method for cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel - Google Patents

Photosensitive resin composition, manufacturing method for cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel

Info

Publication number
TW201612249A
TW201612249A TW104131723A TW104131723A TW201612249A TW 201612249 A TW201612249 A TW 201612249A TW 104131723 A TW104131723 A TW 104131723A TW 104131723 A TW104131723 A TW 104131723A TW 201612249 A TW201612249 A TW 201612249A
Authority
TW
Taiwan
Prior art keywords
display device
cured film
resin composition
photosensitive resin
liquid crystal
Prior art date
Application number
TW104131723A
Other languages
Chinese (zh)
Inventor
Takeshi Ando
Daisuke Kashiwagi
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201612249A publication Critical patent/TW201612249A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Human Computer Interaction (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention provides a photosensitive resin composition which has good sensitivity and excellent developing performance. In addition, the present invention provides a manufacturing method for a cured film by using the photosensitive resin composition, the cured film, a liquid crystal display device, an organic electroluminescence display device and a touch panel. The photosensitive resin composition provided by the present invention comprises a polysiloxane component, a photoacid generator which generates an acid having a pKa less than 3, a solvent and an alicyclic epoxy compound which has a molecular weight from 150 to 1000 and is represented by the formula (EP) as follows. In the formula, R EP1 is an alkyl group, p is an integer number from 0 to 7, A is a q-valent alkyl group capable of containing oxygen atoms, and q is an integer number from 1 to 4.
TW104131723A 2014-09-29 2015-09-25 Photosensitive resin composition, manufacturing method for cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel TW201612249A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014198678 2014-09-29

Publications (1)

Publication Number Publication Date
TW201612249A true TW201612249A (en) 2016-04-01

Family

ID=55630425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131723A TW201612249A (en) 2014-09-29 2015-09-25 Photosensitive resin composition, manufacturing method for cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel

Country Status (2)

Country Link
TW (1) TW201612249A (en)
WO (1) WO2016052389A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707204B (en) * 2016-05-03 2020-10-11 南韓商東友精細化工有限公司 Positive photosensitive resin composition and insulation layer prepared from the same
TWI710856B (en) * 2016-08-11 2020-11-21 南韓商東友精細化工有限公司 Chemically amplified photosensitive resin composition and insulation film prepared from the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6826361B2 (en) * 2015-05-13 2021-02-03 東京応化工業株式会社 Photosensitive composition for forming an insulating film and a method for forming an insulating film pattern
JP6758897B2 (en) * 2016-04-27 2020-09-23 株式会社カネカ Positive photosensitive composition
JP7357505B2 (en) 2018-11-21 2023-10-06 信越化学工業株式会社 Iodine-containing thermosetting silicon-containing material, composition for forming a resist underlayer film for EUV lithography containing the same, and pattern forming method
EP4001344A4 (en) * 2019-07-16 2023-08-16 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition, photosensitive dry film, layered product, and pattern formation method
JP7368324B2 (en) 2019-07-23 2023-10-24 信越化学工業株式会社 Composition for forming silicon-containing resist underlayer film and pattern forming method
JP2022010759A (en) * 2020-06-29 2022-01-17 東洋インキＳｃホールディングス株式会社 Photosensitive coloring composition, color filter and display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4039056B2 (en) * 2001-12-27 2008-01-30 住友化学株式会社 Chemically amplified resist composition
JP5638767B2 (en) * 2009-03-31 2014-12-10 株式会社カネカ Curable composition
JP2013092633A (en) * 2011-10-25 2013-05-16 Adeka Corp Positive photosensitive composition
JP6065789B2 (en) * 2012-09-27 2017-01-25 信越化学工業株式会社 Chemically amplified positive resist material and pattern forming method
JP6064570B2 (en) * 2012-12-10 2017-01-25 Jsr株式会社 Radiation sensitive resin composition for display element, cured film, method for producing cured film, semiconductor element and display element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707204B (en) * 2016-05-03 2020-10-11 南韓商東友精細化工有限公司 Positive photosensitive resin composition and insulation layer prepared from the same
TWI710856B (en) * 2016-08-11 2020-11-21 南韓商東友精細化工有限公司 Chemically amplified photosensitive resin composition and insulation film prepared from the same

Also Published As

Publication number Publication date
WO2016052389A1 (en) 2016-04-07

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