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TW201611978A - Manufacturing method of Liquid Crystal Display panel - Google Patents

Manufacturing method of Liquid Crystal Display panel

Info

Publication number
TW201611978A
TW201611978A TW104127197A TW104127197A TW201611978A TW 201611978 A TW201611978 A TW 201611978A TW 104127197 A TW104127197 A TW 104127197A TW 104127197 A TW104127197 A TW 104127197A TW 201611978 A TW201611978 A TW 201611978A
Authority
TW
Taiwan
Prior art keywords
brittle substrate
main surface
fracture
substrate
liquid crystal
Prior art date
Application number
TW104127197A
Other languages
Chinese (zh)
Other versions
TWI660828B (en
Inventor
Hiroshi Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201611978A publication Critical patent/TW201611978A/en
Application granted granted Critical
Publication of TWI660828B publication Critical patent/TWI660828B/en

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • Nonlinear Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

The present invention relates to a manufacturing method of a Liquid Crystal Display panel to proceed the breaking step without turning over the cell substrate. A trench line TL is formed on the first main surface SF1 of the first brittle substrate 11. The trench line TL is formed in the state with no fracture. The first brittle substrate 11 and the second brittle substrate 12 are laminated mutually in the manner that the first main surface SF1 of the first brittle substrate 11 and the third main surface SF3 of the second brittle substrate 12 oppositely face with each other. By extending the fracture of first brittle substrate 11 in the thickness direction along the trench line TL to form the fracture line CL, the fracture line CL is formed on the fourth main surface SF4 of the second brittle substrate 12. By applying a loading weight locally on the second main surface SF2 of the first brittle substrate 11 to warp the first brittle substrate 11 and the second brittle substrate 12, the first brittle substrate 11 and the second brittle substrate 12 are cut off.
TW104127197A 2014-09-26 2015-08-20 Manufacturing method of liquid crystal display panel TWI660828B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-196494 2014-09-26
JP2014196494A JP6432245B2 (en) 2014-09-26 2014-09-26 Substrate cutting method

Publications (2)

Publication Number Publication Date
TW201611978A true TW201611978A (en) 2016-04-01
TWI660828B TWI660828B (en) 2019-06-01

Family

ID=55599429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127197A TWI660828B (en) 2014-09-26 2015-08-20 Manufacturing method of liquid crystal display panel

Country Status (4)

Country Link
JP (1) JP6432245B2 (en)
KR (1) KR20160037076A (en)
CN (1) CN105461202A (en)
TW (1) TWI660828B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618166B (en) * 2016-12-01 2018-03-11 Top Engineering Co., Ltd Scribing equipment
EP3632869A4 (en) * 2017-05-31 2020-07-08 Panasonic Intellectual Property Management Co., Ltd. METHOD FOR PRODUCING A GLASS PANEL UNIT AND METHOD FOR PRODUCING A GLASS WINDOW

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6589381B2 (en) * 2015-05-29 2019-10-16 三星ダイヤモンド工業株式会社 Method for forming vertical crack in brittle material substrate and method for dividing brittle material substrate
WO2017204055A1 (en) * 2016-05-25 2017-11-30 三星ダイヤモンド工業株式会社 Brittle substrate cutting method
JP6760641B2 (en) * 2016-06-29 2020-09-23 三星ダイヤモンド工業株式会社 Method of dividing a brittle substrate
JP2018150191A (en) * 2017-03-13 2018-09-27 日本電気硝子株式会社 Production method of glass sheet
JP6955754B2 (en) * 2017-07-25 2021-10-27 三星ダイヤモンド工業株式会社 Diamond cutting edge and substrate cutting method
KR102863226B1 (en) * 2019-08-14 2025-09-25 주식회사 탑 엔지니어링 Method of controlling scribing apparatus
CN119861502A (en) * 2023-10-20 2025-04-22 深圳晶微峰光电科技有限公司 Preparation method and device of Liquid Crystal On Silicon (LCOS) panel, liquid Crystal On Silicon (LCOS) panel and equipment

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JPS6065738A (en) * 1983-09-16 1985-04-15 Nippon Sheet Glass Co Ltd Method for cutting flat glass
JP2003012335A (en) * 2001-06-27 2003-01-15 Seiko Epson Corp How to scribe glass plate
TWI226877B (en) * 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
EP1579971B1 (en) * 2002-11-22 2011-10-05 Mitsuboshi Diamond Industrial Co., Ltd. Method for dividing a substrate and a panel production method
CN101585655B (en) * 2003-01-29 2013-04-24 三星宝石工业株式会社 Substrate dividing apparatus and method for dividing substrate
JP2007039302A (en) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd Glass substrate cleaving method and glass substrate cleaving apparatus
JP4890462B2 (en) * 2005-10-28 2012-03-07 三星ダイヤモンド工業株式会社 Scribing line forming method and scribing line forming apparatus for brittle material substrate
JP2007160811A (en) * 2005-12-15 2007-06-28 Pioneer Electronic Corp Manufacturing method of plane-surface display panel and cutting method of glass plate
JP4890034B2 (en) * 2006-01-19 2012-03-07 富士吉田ティアック株式会社 Manufacturing method of optical components
JP4885675B2 (en) * 2006-09-27 2012-02-29 株式会社Ｎｓｃ Method for cutting and separating laminated glass plates
TWI374863B (en) * 2007-10-12 2012-10-21 Chimei Innolux Corp Process for manufacturing liquid crystal panel and method for cutting substrate
EP2199007A4 (en) * 2007-10-16 2011-02-09 Mitsuboshi Diamond Ind Co Ltd Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
JP2010023071A (en) * 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd Method for machining terminal of laminated substrate
JP5192977B2 (en) * 2008-10-10 2013-05-08 三星ダイヤモンド工業株式会社 Method for scribing bonded substrates
JP4996703B2 (en) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 Substrate cutting device
US9701043B2 (en) * 2012-04-24 2017-07-11 Tokyo Seimitsu Co., Ltd. Dicing blade
JP6421472B2 (en) * 2014-06-24 2018-11-14 三星ダイヤモンド工業株式会社 Method for dividing brittle substrate and method for manufacturing display panel
JP6413496B2 (en) * 2014-08-29 2018-10-31 三星ダイヤモンド工業株式会社 Manufacturing method of liquid crystal display panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618166B (en) * 2016-12-01 2018-03-11 Top Engineering Co., Ltd Scribing equipment
EP3632869A4 (en) * 2017-05-31 2020-07-08 Panasonic Intellectual Property Management Co., Ltd. METHOD FOR PRODUCING A GLASS PANEL UNIT AND METHOD FOR PRODUCING A GLASS WINDOW

Also Published As

Publication number Publication date
CN105461202A (en) 2016-04-06
KR20160037076A (en) 2016-04-05
TWI660828B (en) 2019-06-01
JP6432245B2 (en) 2018-12-05
JP2016069195A (en) 2016-05-09

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees