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TW201611932A - Laser processing method and laser processing object - Google Patents

Laser processing method and laser processing object

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Publication number
TW201611932A
TW201611932A TW103133942A TW103133942A TW201611932A TW 201611932 A TW201611932 A TW 201611932A TW 103133942 A TW103133942 A TW 103133942A TW 103133942 A TW103133942 A TW 103133942A TW 201611932 A TW201611932 A TW 201611932A
Authority
TW
Taiwan
Prior art keywords
laser processing
processing method
laser beam
substrate
processing object
Prior art date
Application number
TW103133942A
Other languages
Chinese (zh)
Other versions
TWI566870B (en
Inventor
Chih-Wei Luo
Sheng-Yang Tseng
Ya-Hsin Tseng
Hui-Hsin Chu
Original Assignee
Univ Nat Chiao Tung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chiao Tung filed Critical Univ Nat Chiao Tung
Priority to TW103133942A priority Critical patent/TWI566870B/en
Publication of TW201611932A publication Critical patent/TW201611932A/en
Application granted granted Critical
Publication of TWI566870B publication Critical patent/TWI566870B/en

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  • Laser Beam Processing (AREA)

Abstract

A laser processing method including the following steps is provided: providing a substrate, wherein the substrate has a first surface and a second surface opposite to the first surface; radiating the first surface by a first laser beam, and radiating the second surface by a second laser beam, wherein the components perpendicular to the substrate of the propagating directions of the first laser beam and the second laser beam are opposite. A laser processing object is also provided.
TW103133942A 2014-09-30 2014-09-30 Laser processing method and laser processing object TWI566870B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103133942A TWI566870B (en) 2014-09-30 2014-09-30 Laser processing method and laser processing object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103133942A TWI566870B (en) 2014-09-30 2014-09-30 Laser processing method and laser processing object

Publications (2)

Publication Number Publication Date
TW201611932A true TW201611932A (en) 2016-04-01
TWI566870B TWI566870B (en) 2017-01-21

Family

ID=56360694

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103133942A TWI566870B (en) 2014-09-30 2014-09-30 Laser processing method and laser processing object

Country Status (1)

Country Link
TW (1) TWI566870B (en)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4397571B2 (en) * 2001-09-25 2010-01-13 株式会社半導体エネルギー研究所 Laser irradiation method, laser irradiation apparatus, and manufacturing method of semiconductor device
JP4628129B2 (en) * 2005-02-14 2011-02-09 株式会社アマダ Laser processing method and apparatus
KR20070097189A (en) * 2006-03-28 2007-10-04 삼성전자주식회사 Substrate cutting method and substrate cutting apparatus used therein
EP1875983B1 (en) * 2006-07-03 2013-09-11 Hamamatsu Photonics K.K. Laser processing method and chip
GB2457720A (en) * 2008-02-23 2009-08-26 Philip Thomas Rumsby Method for laser processing on the opposite sides of thin transparent substrates
CN101474723A (en) * 2009-01-21 2009-07-08 西安天瑞达光电技术发展有限公司 Optical isolation laser shock processing double-side simultaneous shock device
CN101658979A (en) * 2009-10-09 2010-03-03 廊坊昊博金刚石有限公司 Laser double-faced synchronous machining system and machining method thereof
TW201114535A (en) * 2009-10-20 2011-05-01 Foxsemicon Integrated Tech Inc Apparatus and method for laser cutting
CN103008887A (en) * 2012-06-29 2013-04-03 苏州德龙激光有限公司 Method and device for cutting machined target from two surfaces by using ultra-short pulse laser
CN102785031B (en) * 2012-08-15 2015-04-01 武汉隽龙科技有限公司 Method and device for cutting transparent material by using ultra-short pulse laser
JP6127526B2 (en) * 2012-10-29 2017-05-17 三星ダイヤモンド工業株式会社 Laser processing apparatus and processing condition setting method for patterned substrate
JP6036173B2 (en) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 Laser processing equipment
CN104014936B (en) * 2013-02-28 2016-12-28 大族激光科技产业集团股份有限公司 The laser processing of macromolecular material workpiece and laser cutting system
CN203171147U (en) * 2013-03-14 2013-09-04 镭射谷科技(深圳)有限公司 Double-laser cutting machine
CN103962720B (en) * 2014-04-24 2016-07-13 中国航空工业集团公司北京航空制造工程研究所 The synchronisation control means of dual-beam laser welding and device

Also Published As

Publication number Publication date
TWI566870B (en) 2017-01-21

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MM4A Annulment or lapse of patent due to non-payment of fees