TW201614867A - Thin-film flip-chip light emitting diode having dual sub-mounts and method for manufacturing the same - Google Patents
Thin-film flip-chip light emitting diode having dual sub-mounts and method for manufacturing the sameInfo
- Publication number
- TW201614867A TW201614867A TW103135234A TW103135234A TW201614867A TW 201614867 A TW201614867 A TW 201614867A TW 103135234 A TW103135234 A TW 103135234A TW 103135234 A TW103135234 A TW 103135234A TW 201614867 A TW201614867 A TW 201614867A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor layer
- light emitting
- sub
- mounts
- thin
- Prior art date
Links
- 230000009977 dual effect Effects 0.000 title abstract 3
- 239000010409 thin film Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000010410 layer Substances 0.000 abstract 11
- 239000004065 semiconductor Substances 0.000 abstract 9
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000012788 optical film Substances 0.000 abstract 1
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to a thin-film flip-chip light emitting diode having dual sub-mounts and a method for manufacturing the same. It comprises the steps of depositing a first semiconductor layer on a substrate; forming a light emitting structure layer on the first semiconductor layer; forming a second semiconductor layer on the light emitting structure layer, wherein the second semiconductor layer is electrically opposite to the first semiconductor layer; forming a first contact electrode and a second contact electrode on the first semiconductor layer and the second semiconductor layer respectively; forming a first sub-mount on the first and second contact electrodes and removing the substrate; adhering a transparent second sub-mount to the first semiconductor layer through an adhesive layer, wherein a first optical film is disposed between the second sub-mount and the first semiconductor layer. Thereby a thin-film flip-chip light emitting diode having dual sub-mounts is prepared. Accordingly, the present invention can effectively improve luminous efficiency.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107114351A TW201828501A (en) | 2014-10-09 | 2014-10-09 | Light emitting device |
| TW103135234A TWI583025B (en) | 2014-10-09 | 2014-10-09 | Thin-film flip-chip light emitting diode having dual sub-mounts and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103135234A TWI583025B (en) | 2014-10-09 | 2014-10-09 | Thin-film flip-chip light emitting diode having dual sub-mounts and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201614867A true TW201614867A (en) | 2016-04-16 |
| TWI583025B TWI583025B (en) | 2017-05-11 |
Family
ID=56361296
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103135234A TWI583025B (en) | 2014-10-09 | 2014-10-09 | Thin-film flip-chip light emitting diode having dual sub-mounts and method for manufacturing the same |
| TW107114351A TW201828501A (en) | 2014-10-09 | 2014-10-09 | Light emitting device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107114351A TW201828501A (en) | 2014-10-09 | 2014-10-09 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| TW (2) | TWI583025B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI736756B (en) * | 2018-04-03 | 2021-08-21 | 晶元光電股份有限公司 | Semiconductor device |
| TWI778917B (en) * | 2018-04-03 | 2022-09-21 | 晶元光電股份有限公司 | Semiconductor device |
| TWI758212B (en) * | 2018-04-03 | 2022-03-11 | 晶元光電股份有限公司 | Semiconductor device |
| TWI797044B (en) * | 2018-04-03 | 2023-03-21 | 晶元光電股份有限公司 | Semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7626210B2 (en) * | 2006-06-09 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED |
| US7791093B2 (en) * | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| US20110031516A1 (en) * | 2009-08-07 | 2011-02-10 | Koninklijke Philips Electronics N.V. | Led with silicone layer and laminated remote phosphor layer |
-
2014
- 2014-10-09 TW TW103135234A patent/TWI583025B/en active
- 2014-10-09 TW TW107114351A patent/TW201828501A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI583025B (en) | 2017-05-11 |
| TW201828501A (en) | 2018-08-01 |
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