TW201603127A - Method for manufacturing touch sensing conductive electrode and structure thereof - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 139
- 239000002184 metal Substances 0.000 claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000005530 etching Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 35
- 230000002093 peripheral effect Effects 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 239000011135 tin Substances 0.000 claims description 19
- 239000011651 chromium Substances 0.000 claims description 16
- 239000010936 titanium Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 230000003647 oxidation Effects 0.000 claims description 14
- 238000007254 oxidation reaction Methods 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000002313 adhesive film Substances 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 239000010941 cobalt Substances 0.000 claims description 12
- 229910017052 cobalt Inorganic materials 0.000 claims description 12
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 12
- 229920001940 conductive polymer Polymers 0.000 claims description 12
- 229910052750 molybdenum Inorganic materials 0.000 claims description 12
- 239000011733 molybdenum Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 12
- 229910052721 tungsten Inorganic materials 0.000 claims description 12
- 239000010937 tungsten Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 9
- 239000002861 polymer material Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 230000003064 anti-oxidating effect Effects 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000007779 soft material Substances 0.000 claims description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 6
- -1 polyphenylene fluorene Polymers 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 150000005690 diesters Chemical class 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000010410 layer Substances 0.000 description 262
- 239000010955 niobium Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 229910052758 niobium Inorganic materials 0.000 description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 6
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Position Input By Displaying (AREA)
Abstract
Description
本發明有關於一種觸控用導電電極的製造方法及其構造,尤指一種利用遮蔽層相關步驟製成金屬導電電極同時提供金屬導電電極層表面完整包覆保護的構造及方法,提升金屬導電電極線路的生產良率及使用耐久性之目的。The invention relates to a method for manufacturing a conductive electrode for touch control and a structure thereof, in particular to a structure and a method for forming a metal conductive electrode by using a mask layer related step and simultaneously providing complete protection of the surface of the metal conductive electrode layer, and lifting the metal conductive electrode The production yield and durability of the line.
隨著電子資訊產品朝輕薄短小化的方向發展,半導體製造方法亦朝著高密度及自動化生產的方向前進,而習知之具有觸控感應面的電子產品或設備,隨著其觸控感應面或觸控面板產品之尺寸由小而逐漸增大,導電電極的製成材料由原本普遍使用的氧化銦錫(ITO)轉變成為金屬導體電極,而其設計上為了使構成面板基底的導電電極不被使用者以眼睛明顯地察覺到其存在,亦即不讓導電電極被使用者視認出,而使得目前該產業中的研發人員朝向將金屬導電電極的線徑寬度製成極細作為其目標。With the development of electronic information products in the direction of lightness and thinness, semiconductor manufacturing methods are also moving toward high-density and automated production, and the electronic products or devices with touch-sensitive surfaces, along with their touch-sensing surfaces or The size of the touch panel product is gradually increased from small to small. The conductive electrode is made of a material commonly used indium tin oxide (ITO) to be converted into a metal conductor electrode, and is designed so that the conductive electrode constituting the panel substrate is not The user clearly perceives the presence of the conductive electrode by the user, that is, the conductive electrode is not recognized by the user, and the research and development personnel in the industry are currently aiming at making the wire diameter of the metal conductive electrode extremely fine.
實際上一般金屬導電電極10的結構與製程,請參閱圖1所示,通常為步驟(1)透過至少一附著層11(又稱作接著層)將金屬導電電極10附著於基材12上,使金屬導電電極10不易由基材12上脫落,步驟(2)而後將至少一耐候層13(抗蝕層)覆合於上述金屬導電電極10上,步驟(3)接著再利用蝕刻液體進行蝕刻程序(wet etching)形成金屬導電電極10電極線路14,便完成初步上述金屬導電電極10電極線路14的製造,另外,後續於最終感測電極產品完成後,還能夠再以保護膠膜16(OCA)進行上述金屬導電電極10電極線路14的全部表面舖設。In fact, the structure and process of the general metal conductive electrode 10, as shown in FIG. 1, is generally the step (1) of attaching the metal conductive electrode 10 to the substrate 12 through at least one adhesion layer 11 (also referred to as an adhesion layer). The metal conductive electrode 10 is not easily detached from the substrate 12, and at least one weather resistant layer 13 (resist layer) is then overlaid on the metal conductive electrode 10, and the step (3) is followed by etching with an etching liquid. Wet etching forms the metal conductive electrode 10 electrode line 14 to complete the preliminary fabrication of the metal conductive electrode 10 electrode line 14. In addition, after the final sensing electrode product is completed, the protective film 16 (OCA) can be further used. The entire surface of the electrode line 14 of the metal conductive electrode 10 is laid.
請參閱圖2所示,上述附著層11設計為兩層,分別為一與上述基材12結合的中介層17及一與上述金屬導電電極10結合的導電基底層18。Referring to FIG. 2, the adhesion layer 11 is designed as two layers, which are respectively an interposer 17 bonded to the substrate 12 and a conductive underlayer 18 bonded to the metal conductive electrode 10.
然而,濕式蝕刻是等向性的(Isotropic),而且因於上述耐候層13為一耐蝕刻材料,造成上述耐候層13以及上述金屬導電電極10兩者之間對於蝕刻液體的蝕刻速率差距甚大,又,針對步驟(2)所形成的上述耐候層13的分佈經常為一厚度不均勻樣態,因此,當蝕刻溶液做縱向蝕刻時,恐於蝕刻過程當中的上述金屬導電電極10發生一嚴重的側蝕現象15。However, the wet etching is isotropic, and since the weathering layer 13 is an etching resistant material, the etching rate of the etching liquid between the weathering layer 13 and the metal conductive electrode 10 is greatly different. Further, the distribution of the weather-resistant layer 13 formed in the step (2) is often a thickness unevenness state. Therefore, when the etching solution is longitudinally etched, it is feared that the metal conductive electrode 10 in the etching process is severely affected. Side erosion phenomenon 15.
請再參閱圖1所示,換句話說,亦即是上述金屬導電電極10的左右側面部份,尤其是指寬度設計小於5μm以及厚度設計大於0.3μm範圍的上述金屬導電電極10線徑,更容易發生一上述側蝕現象15,導致上述金屬導電電極10的蝕刻總面積比例過大、蝕刻局部不均造成上述金屬導電電極10電極線路14線徑之阻抗數值太大,更甚者使上述金屬導電電極10電極線路14發生一斷線的結果,使製造廠商所出產的金屬導電電極10的良率及品質不易控管,實為目前極細導電電極於發展製作上的炙手根本問題。Referring to FIG. 1 again, in other words, the left and right side portions of the metal conductive electrode 10, especially the above-mentioned metal conductive electrode 10 having a width design of less than 5 μm and a thickness design of more than 0.3 μm, The above-mentioned side etching phenomenon 15 is likely to occur, resulting in an excessively large proportion of the total etching area of the metal conductive electrode 10 and uneven local etching, which causes the impedance value of the wire diameter of the electrode line 10 of the metal conductive electrode 10 to be too large, and even more so that the metal is electrically conductive. As a result of the disconnection of the electrode 10 electrode line 14, the yield and quality of the metal conductive electrode 10 produced by the manufacturer are not easily controlled, which is a fundamental problem in the development of the ultra-fine conductive electrode.
再者,更進一步而言,習知於產業界中已普遍使用之金屬導電電極10電極線路14線徑寬度為極細的情況下,若無更進一步地設計保護措施,使用者長久使用加上於環境氧化之下使得上述金屬導電電極10電極線路14可能無法再達到原先預定的工作效能,恐有縮短產品使用壽命、影響製造廠商所出產的最終觸控面板成品之良率以及環境耐久性等品質表現等多種情況。Furthermore, in the case where the metal-conducting electrode 10 electrode line 14 which is commonly used in the industry is extremely thin in wire diameter, if the protective measures are not further designed, the user uses it for a long time. Under the environment oxidation, the above-mentioned metal conductive electrode 10 electrode line 14 may not reach the original predetermined working efficiency, which may shorten the service life of the product, affect the quality of the final touch panel finished product produced by the manufacturer, and the environmental durability. Performance and other conditions.
另外,前述習知的觸控面板可進行一系列嚴格規定的環境檢測實驗,例如:將觸控面板進行一1000小時、85℃、90%濕度之下進行高溫加熱檢測實驗,又或者是以100℃ 煮沸100分鐘進行模擬一長期高溫高壓環境。In addition, the conventional touch panel can perform a series of strict environmental testing experiments, for example, the touch panel is subjected to a high temperature heating test under 1000 hours, 85 ° C, and 90% humidity, or 100. °C boil for 100 minutes to simulate a long-term high temperature and high pressure environment.
於前述兩種檢測實驗的當下,水分子滲入上述保護膠膜16中,進而接觸到上述金屬導電電極10,極可能使上述金屬導電電極10發生一氧化現象,由此可知,使用者若長久使用以前述製程所出產的觸控面板,其形成觸控螢幕或電子產品的電容感應之阻抗數值極可能大幅增加,直至無法供給使用者一正常使用狀態。In the present two kinds of detection experiments, water molecules penetrate into the protective film 16 and contact the metal conductive electrode 10, which may cause oxidation of the metal conductive electrode 10, thereby knowing that the user can use it for a long time. In the touch panel produced by the above process, the impedance value of the capacitive sensing forming the touch screen or the electronic product is likely to increase greatly until it is unable to supply the user to a normal use state.
有據於前述釋明的種種習知製程所生產的上述金屬導電電極10之觸控面板不足缺失,實為本發明欲改良的目的。The lack of a touch panel of the above-described metal conductive electrode 10 produced according to the various conventional processes explained above is an object of the present invention.
本發明之主要目的在於提供一種利用一具有預定線路圖案的遮蔽層之相關步驟製成觸控用導電電極的生產過程,替代習知以蝕刻技術製成金屬導電電極的步驟,降低習知的金屬導電電極於十顆程序過程中所發生的嚴重側向蝕刻現象造成金屬導電電極的產品之良率極低的現象。The main object of the present invention is to provide a process for manufacturing a conductive electrode for touch using a related step of a shielding layer having a predetermined line pattern, instead of forming a metal conductive electrode by etching, and reducing the conventional metal. The severe lateral etching phenomenon of the conductive electrode during ten procedures causes the product of the metal conductive electrode to have an extremely low yield.
本發明之另一目的在於透過在形成線路圖案的金屬導電電極進行完整的耐候層包覆保護之設計,更進一步大幅降低使用者使用時,導電電極長期處於空氣中水氣滲入之氧化過程,增強導電電極的耐腐蝕功效,延長觸控用導電電極的產品使用年限。Another object of the present invention is to design a complete weather-resistant layer coating protection through a metal conductive electrode forming a line pattern, and further reduce the oxidation process of the conductive electrode in the air for a long time in the air, and further enhance the oxidation process of the conductive electrode. The corrosion resistance of the conductive electrode extends the product life of the conductive electrode for touch.
本發明之再一目的在於利用一具有預定線路圖案的遮蔽層之相關步驟製成觸控用導電電極的生產過程,可達到管控並維持每一觸控用導電電極的線徑寬度之目的。A further object of the present invention is to produce a conductive electrode for touch using a related step of a mask layer having a predetermined line pattern, which can achieve the purpose of controlling and maintaining the wire diameter of each touch conductive electrode.
本發明之又一目的在於本發明觸控用導電電極結構以及極細線徑的設計能夠避免人眼可視見之干涉條紋現象(Moire)產生,以及增加觸控面板光源的光線穿透率、提高色彩飽和度、減少色偏現象等效果,提供使用者一舒適的人眼可視觸控操作介面。Another object of the present invention is that the conductive electrode structure for touch control and the design of the ultra-fine wire diameter of the present invention can avoid the occurrence of interference fringes (Moire) visible to the human eye, and increase the light transmittance and color of the touch panel light source. The effect of saturation, color shift reduction, etc., provides the user with a comfortable human eye visual touch operation interface.
為達上述目的, 本發明觸控用導電電極的製造方法,(A)選定一預設的基材,由上述基材形成一基材層,上述基材層是具有可撓性或者是不具有可撓性(硬式);(B)於上述基材層表面上形成至少一附著層;(C)於上述附著層表面形成一具有凹槽線路的遮蔽層;(D)於上述遮蔽層表面的凹槽線路中形成至少一金屬導電電極;(E)去除上述遮蔽層形成一具有線路圖案的上述金屬導電電極及以蝕刻方式去除上述金屬導電電極線路圖案之間的上述附著層,並於上述金屬導電電極表面形成至少一耐候層。In order to achieve the above object, in the method for manufacturing a conductive electrode for touch control according to the present invention, (A) a predetermined substrate is selected, and a substrate layer is formed from the substrate, and the substrate layer has flexibility or does not have Flexible (hard); (B) forming at least one adhesion layer on the surface of the substrate layer; (C) forming a shielding layer having a groove line on the surface of the adhesion layer; (D) on the surface of the shielding layer Forming at least one metal conductive electrode in the groove line; (E) removing the shielding layer to form a metal conductive electrode having a line pattern; and removing the adhesion layer between the metal conductive electrode line patterns by etching, and forming the metal layer The surface of the conductive electrode forms at least one weather resistant layer.
其中,於一較佳實施例,上述步驟(E)於金屬導電電極的外周面形成一耐候層,上述耐候層配合上述附著層將上述已具有線路圖案的金屬導電電極與外部隔絕密封,而且,上述耐候層可設為一具有能夠用於遮蔽上述金屬導電電極的黑化性質。In a preferred embodiment, the step (E) forms a weather-resistant layer on the outer peripheral surface of the metal conductive electrode, and the weather-resistant layer cooperates with the adhesion layer to seal the metal conductive electrode having the line pattern from the outside. The weather resistant layer may be provided with a blackening property capable of shielding the metal conductive electrode.
於一較佳實施例,上述步驟(D)進一步於金屬導電電極的上表面形成一第一耐候層。In a preferred embodiment, the step (D) further forms a first weathering layer on the upper surface of the metal conductive electrode.
於一較佳實施例,上述步驟(E)於金屬導電電極的表面形成一第二耐候層。In a preferred embodiment, the above step (E) forms a second weathering layer on the surface of the metal conductive electrode.
再者,於一較佳實施例中,上述步驟(B)進一步於上述基材層表面上形成一中介層、於上述中介層表面形成一導電基底層以及於上述導電基底層表面形成一抗氧化層以共同建構上述附著層。Furthermore, in a preferred embodiment, the step (B) further forms an interposer on the surface of the substrate layer, forms a conductive substrate layer on the surface of the interposer layer, and forms an anti-oxidation layer on the surface of the conductive substrate layer. The layers are used to jointly construct the above adhesion layer.
於另一較佳實施例中,上述步驟(B)進一步於上述基材層表面上形成一黑化層,於上述黑化層表面形成一中介層以及於上述中介層表面形成一導電基底層以共同建構上述附著層。In another preferred embodiment, the step (B) further forms a blackening layer on the surface of the substrate layer, an interposer on the surface of the blackening layer, and a conductive substrate layer on the surface of the interposer. The above adhesion layer is jointly constructed.
於再一較佳實施例中,上述步驟(B)進一步於上述基材層表面上形成一黑化層,於上述黑化層表面形成一中介層、於上述中介層表面形成一導電基底層以及於上述導電基底層表面形成一抗氧化層以共同建構上述附著層。In a further preferred embodiment, the step (B) further comprises forming a blackening layer on the surface of the substrate layer, forming an interposer on the surface of the blackening layer, forming a conductive substrate layer on the surface of the interposer layer, and An anti-oxidation layer is formed on the surface of the conductive substrate layer to jointly construct the adhesion layer.
而且,上述附著層可選自於真空濺鍍、化學鍍或者是高分子塗佈其中一種或其組合方式進行製程。Moreover, the adhesion layer may be selected from one of vacuum sputtering, electroless plating, or polymer coating, or a combination thereof.
上述遮蔽層是以印刷或者是光阻曝光顯影技術其中一種或其組合方式進行製程。The above masking layer is processed by one of printing or photoresist exposure developing techniques or a combination thereof.
上述金屬導電電極可選自於真空濺鍍、蒸鍍、化學鍍、電鍍或者是導電高分子塗佈其中一種或其組合方式進行製程。The metal conductive electrode may be selected from the group consisting of vacuum sputtering, evaporation, electroless plating, electroplating, or conductive polymer coating.
上述耐候層可選自於化學鍍、電鍍或者是導電高分子塗佈其中一種或其組合方式進行製程。The weatherable layer may be selected from one of electroless plating, electroplating, or conductive polymer coating, or a combination thereof.
再者,本發明觸控用導電電極,包含一基材層;至少一附著層,形成一線路圖案佈設於上述基材層表面;一金屬導電電極,連接於上述附著層表面,並對應上述線路圖案形成一導電線路;以及一耐候層,連接包覆於上述金屬導電電極的外周面,使上述導電線路與外部隔絕密封。Furthermore, the conductive electrode for touch control of the present invention comprises a substrate layer; at least one adhesion layer is formed on the surface of the substrate layer; and a metal conductive electrode is connected to the surface of the adhesion layer and corresponds to the line The pattern forms a conductive line; and a weather-resistant layer is attached to the outer peripheral surface of the metal conductive electrode to seal the conductive line from the outside.
上述耐候層包含一第一耐候層形成於上述金屬導電電極的線路圖案上表面以及一第二耐候層進一步包覆於上述金屬導電電極的線路圖案外周面並連接包覆於上述附著層的線路圖案外周面。The weather-resistant layer includes a first weather-resistant layer formed on the upper surface of the circuit pattern of the metal conductive electrode, and a second weather-resistant layer further covering the outer peripheral surface of the line pattern of the metal conductive electrode and connecting the line pattern coated on the adhesion layer The outer perimeter.
此外,上述附著層可設計為三種不同的結構樣態,敘明如下:In addition, the above adhesion layer can be designed into three different structural forms, as described below:
上述附著層包含一位於上述基材層表面的中介層、一形成於上述中介層表面的導電基底層以及一位於上述導電基底層表面的抗氧化層。The adhesion layer comprises an interposer on the surface of the substrate layer, a conductive substrate layer formed on the surface of the interposer, and an anti-oxidation layer on the surface of the conductive substrate.
上述附著層包含一形成於上述基材層表面的黑化層、一形成於上述黑化層表面的中介層以及一形成於上述中介層表面的導電基底層。The adhesion layer includes a blackening layer formed on a surface of the substrate layer, an interposer formed on a surface of the blackening layer, and a conductive underlayer formed on a surface of the interposer.
以及,上述附著層包含一形成於上述基材層表面的黑化層、一形成於上述黑化層表面的中介層、一形成於上述中介層表面的導電基底層以及一位於上述導電基底層表面的抗氧化層。And the adhesion layer comprises a blackening layer formed on the surface of the substrate layer, an interposer formed on the surface of the blackening layer, a conductive substrate layer formed on the surface of the interposer, and a surface on the conductive substrate layer. Antioxidant layer.
而上述觸控用導電電極進一步包含一形成透明樣態的保護膠膜層,上述保護膠膜層佈設於上述基材層以及上述耐候層的外周面。又,上述保護膠膜層是由(聚)氧化樹脂或者是丙烯酸樹脂其中一種所製成。The conductive electrode for touch control further includes a protective adhesive film layer forming a transparent state, and the protective adhesive film layer is disposed on the outer peripheral surface of the base material layer and the weather resistant layer. Further, the above protective film layer is made of one of (poly)oxy resin or acrylic resin.
另外,上述導電線路呈現一網格狀結構,而上述耐候層呈現一ㄇ字型結構。In addition, the conductive line exhibits a grid-like structure, and the weather-resistant layer exhibits a U-shaped structure.
其中,上述基材層可由軟性材料或者是玻璃板所構成,上述軟性材料是由聚對苯二甲酸以二酯、聚甲基丙烯酸甲酯、聚碳酸酯、聚亞苯基碸、聚乙烯亞胺或者是聚亞醯胺其中一種所製成。Wherein, the base material layer may be composed of a soft material or a glass plate, and the soft material is composed of polyterephthalic acid as a diester, polymethyl methacrylate, polycarbonate, polyphenylene fluorene or polyethylene. The amine is either one of polyamines.
上述附著層是由金屬、金屬氧化物、高分子材料或者是其複合材料其中一種所製成,而且,上述金屬是選自於鎢、鎳、鉻、銅、釩、鉬、錫、鋅、鈷、鐵、鈦、鋁、鈮或其合金其中一種所製成,上述金屬氧化物分別是由鎢、鎳、鉻、銅、釩、鉬、錫、鋅、鈷、鐵、鈦、鋁、鈮或其合金其中一種氧化所製成。The adhesion layer is made of one of a metal, a metal oxide, a polymer material or a composite material thereof, and the metal is selected from the group consisting of tungsten, nickel, chromium, copper, vanadium, molybdenum, tin, zinc, cobalt. Made of iron, titanium, aluminum, niobium or an alloy thereof, which is made of tungsten, nickel, chromium, copper, vanadium, molybdenum, tin, zinc, cobalt, iron, titanium, aluminum, niobium or One of its alloys is made by oxidation.
上述金屬導電電極是由金、銅、銀、鋅、鋁、鎳、錫等金屬、或其合金、或者是由導電高分子材料其中一種所製成。The metal conductive electrode is made of a metal such as gold, copper, silver, zinc, aluminum, nickel, tin, or an alloy thereof, or one of conductive polymer materials.
上述耐候層是由碳、石墨、金屬、金屬氧化物、可導電的高分子材料或者是其複合材料其中一種所製成,而且,上述金屬是選自於鎢、鎳、鉻、銅、鋁、銀、鈦、鉬、錫、鋅、鈷、鐵、鈮或其合金其中一種所製成,上述金屬氧化物分別是由鎢、鎳、鉻、銅、鋁、銀、鈦、鉬、錫、鋅、鈷、鐵、鈮或其合金其中一種氧化所製成。The weathering layer is made of carbon, graphite, metal, metal oxide, conductive polymer material or a composite material thereof, and the metal is selected from the group consisting of tungsten, nickel, chromium, copper, aluminum, Made of silver, titanium, molybdenum, tin, zinc, cobalt, iron, bismuth or an alloy thereof, the above metal oxides are respectively tungsten, nickel, chromium, copper, aluminum, silver, titanium, molybdenum, tin, zinc , one of oxidation of cobalt, iron, ruthenium or its alloy.
最後,上述附著層的厚度介於0.01μm ~1μm,上述金屬導電電極的厚度介於0.1μm ~6μm、而上述耐候層的厚度介於0.01μm ~1μm,上述每一觸控用導電電極的寬度介於0.1μm ~10μm。Finally, the thickness of the adhesion layer is between 0.01 μm and 1 μm, the thickness of the metal conductive electrode is between 0.1 μm and 6 μm, and the thickness of the weatherable layer is between 0.01 μm and 1 μm, and the width of each of the above-mentioned conductive electrodes for touch Between 0.1μm ~ 10μm.
由前述說明可知,本發明的特點在於:利用遮蔽層等相關製程達到大幅提升金屬導電電極電極線路的生產良率及進一步穩定地生產每一觸控用導電電極的線徑寬度之效果;此外,透過針對每一形成線路圖案的金屬導電電極進行完整的包覆保護,藉此提升觸控用導電電極電極線路產品的使用耐久性。As apparent from the foregoing description, the present invention is characterized in that the effect of greatly improving the production yield of the metal conductive electrode line and further stably producing the wire diameter of each of the touch conductive electrodes by using a masking layer or the like is further improved; Through the complete cladding protection for each of the metal conductive electrodes forming the line pattern, the durability of the use of the conductive electrode line product for touch is improved.
茲為便於更進一步對本發明之構造、使用及其特徵有更深一層明確、詳實的認識與瞭解,爰舉出較佳實施例,配合圖式詳細說明如下:In order to further clarify and understand the structure, the use and the features of the present invention, the preferred embodiment is described in detail with reference to the following drawings:
請參照圖3A至圖3B所示,本發明觸控用導電電極的製造方法於第一較佳實施例中,製造步驟如下敘明:Referring to FIG. 3A to FIG. 3B, in the first preferred embodiment of the method for manufacturing the conductive electrode for touch control of the present invention, the manufacturing steps are as follows:
(A)選定一預設的基材,由上述基材形成一基材層2,上述基材層2可由軟性材料或者是玻璃板所構成,上述軟性材料是由聚對苯二甲酸乙二酯(PET)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚亞苯基碸(PPSU)、聚乙烯亞胺(PEI)或者是聚亞醯胺(PI)其中一種所製成;(A) selecting a predetermined substrate from which a substrate layer 2 is formed, and the substrate layer 2 may be composed of a soft material or a glass plate, and the soft material is polyethylene terephthalate. Made of (PET), polymethyl methacrylate (PMMA), polycarbonate (PC), polyphenylene hydrazine (PPSU), polyethyleneimine (PEI) or polyiminamide (PI) to make;
(B)於上述基材層2表面上形成至少一具有導電性的附著層3,其中,上述附著層3可選自於真空濺鍍、化學鍍或者是高分子塗佈其中一種或其組合方式進行製程,而上述附著層3是由金屬、金屬氧化物、高分子材料或者是其複合材料其中一種所製成,其中,上述附著層3的上述金屬是選自於鎢(W)、鎳(Ni)、鉻(Cr)、銅(Cu)、釩(V)、鉬(Mo)、錫(Sn)、鋅(Zn)、鈷(Co)、鐵(Fe)、鈦(Ti)、鋁(Al)、鈮(Nb)或其合金其中一種所製成,上述附著層3的上述金屬氧化物分別是由鎢(W)、鎳(Ni)、鉻(Cr)、銅(Cu)、釩(V)、鉬(Mo)、錫(Sn)、鋅(Zn)、鈷(Co)、鐵(Fe)、鈦(Ti)、鋁(Al)、鈮(Nb)或其合金其中一種氧化所製成。(B) forming at least one electrically conductive adhesion layer 3 on the surface of the substrate layer 2, wherein the adhesion layer 3 may be selected from one of vacuum sputtering, electroless plating or polymer coating or a combination thereof. The process is performed, and the adhesion layer 3 is made of one of a metal, a metal oxide, a polymer material or a composite material thereof, wherein the metal of the adhesion layer 3 is selected from the group consisting of tungsten (W) and nickel ( Ni), chromium (Cr), copper (Cu), vanadium (V), molybdenum (Mo), tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), titanium (Ti), aluminum ( Made of one of Al), niobium (Nb) or an alloy thereof, the above metal oxide of the adhesion layer 3 is made of tungsten (W), nickel (Ni), chromium (Cr), copper (Cu), vanadium ( V), molybdenum (Mo), tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), titanium (Ti), aluminum (Al), niobium (Nb) or an alloy thereof to make.
請參照圖4所示,更進一步而言,相對於習知附著層11是由兩層所構成,本發明於一第一較佳實施例中,上述附著層3可利用濺鍍製程分別依序由一中介層31、一導電基底層32以及一抗氧化層33共三層所共同製成,先於上述基材層2表面上形成一中介層31、於上述中介層31表面形成一導電基底層32以及於上述導電基底層32表面形成一抗氧化層33。Referring to FIG. 4, further, the conventional adhesion layer 11 is composed of two layers. In the first preferred embodiment, the adhesion layer 3 can be sequentially processed by a sputtering process. An interposer 31, a conductive substrate 32, and an anti-oxidation layer 33 are formed in three layers. An interposer 31 is formed on the surface of the substrate layer 2, and a conductive substrate is formed on the surface of the interposer 31. The layer 32 and an anti-oxidation layer 33 are formed on the surface of the conductive substrate layer 32.
請參照圖5所示,於第二較佳實施例中,上述附著層3可利用濺鍍製程分別依序由一黑化層30、一中介層31以及一導電基底層32共三層所共同製成,先於上述基材層2表面上形成一黑化層30,於上述黑化層30表面形成一中介層31以及於上述中介層31表面形成一導電基底層32。Referring to FIG. 5, in the second preferred embodiment, the adhesion layer 3 can be sequentially formed by a blackening layer 30, an interposer 31, and a conductive substrate 32 in a sputtering process. A blackening layer 30 is formed on the surface of the substrate layer 2, an interposer 31 is formed on the surface of the blackening layer 30, and a conductive substrate 32 is formed on the surface of the interposer 31.
請參照圖6所示,於第三較佳實施例中,上述附著層3可利用濺鍍製程分別依序由一黑化層30、一中介層31、一導電基底層32以及一抗氧化層33共四層所共同製成,先於上述基材層2表面上形成一黑化層30,再於上述黑化層30表面形成一中介層31、於上述中介層31表面形成一導電基底層32以及於上述導電基底層32表面形成一抗氧化層33。Referring to FIG. 6 , in the third preferred embodiment, the adhesion layer 3 may sequentially comprise a blackening layer 30 , an interposer layer 31 , a conductive substrate layer 32 , and an anti-oxidation layer by using a sputtering process. A total of four layers are formed together, a blackening layer 30 is formed on the surface of the substrate layer 2, an interposer 31 is formed on the surface of the blackening layer 30, and a conductive substrate layer is formed on the surface of the interposer 31. 32 and an anti-oxidation layer 33 is formed on the surface of the conductive base layer 32.
而由於上述第二及第三較佳實施例中所具有的上述附著層3朝向上述基材層2方向另具有一黑化層30,上述黑化層30為具有導電特性的金屬氧化物或者是具有抗蝕特性的金屬化合物其中一種所製成,而且上述黑化層30厚度介於5nm~0.1μm範圍之間,換言之,由於上述黑化層30所製成的材料特性為本身顏色偏藍色、綠色、紫色、棕色或者是黑色等較為深色的顏色,有助於吸收產品上反射光線或者是折射光線,因此,間接造成上述金屬導電電極6不易被產品使用者明顯覺察,有效降低干涉條紋現象(moire)的發生,於使用者以眼睛視見於產品表面時供一舒適的效果。The adhesion layer 3 of the second and third preferred embodiments has a blackening layer 30 in the direction of the substrate layer 2, and the blackening layer 30 is a metal oxide having electrical conductivity or One of the metal compounds having a resist property is formed, and the thickness of the blackening layer 30 is in the range of 5 nm to 0.1 μm, in other words, the material properties of the blackening layer 30 are blue in color. A darker color such as green, purple, brown or black, which helps to absorb reflected light or refracted light on the product. Therefore, the above-mentioned metal conductive electrode 6 is inconveniently noticeable to the user of the product, and the interference fringe is effectively reduced. The occurrence of a phenomenon (moire) provides a comfortable effect when the user views the surface of the product with the eye.
上述中介層31(又稱作Tie-coat)是用以結合上述黑化層30以及上述導電基底層32,上述導電基底層32(又稱作Seed layer)具有易氧化特性,相對於習知利用下述三種方法避免上述導電基底層32的氧化狀況發生:方法(1)以酸性溶液去除氧化的導電基底層32、方法(2)暫時先冷凍乾燥或者是低溫低濕保存並於12至24小時內使用上述導電基底層32、方法(3)以真空保存並於三至六個月內使用上述導電基底層32,然而,本發明係設計於上述導電基底層32表面形成一抗氧化層33,避免上述導電基底層32的氧化作用。The interposer 31 (also referred to as a Tie-coat) is used to bond the blackening layer 30 and the conductive base layer 32. The conductive base layer 32 (also referred to as a seed layer) has an oxidizable property and is used in comparison with the conventional one. The following three methods prevent the oxidation state of the conductive underlayer 32 from occurring: Method (1) removing the oxidized conductive underlayer 32 with an acidic solution, and the method (2) is temporarily freeze-dried or stored under low temperature and low humidity for 12 to 24 hours. The conductive base layer 32 and the method (3) are used for vacuum storage and the conductive base layer 32 is used within three to six months. However, the present invention is designed to form an oxidation resistant layer 33 on the surface of the conductive base layer 32. The oxidation of the above-mentioned conductive underlayer 32 is avoided.
請再參照圖3A至圖3B所示,接續上述步驟(B),(C)於上述附著層3表面形成一具有凹槽線路4的遮蔽層5,其中,而上述遮蔽層5是利用光阻曝光顯影技術配合感光阻劑或者是印刷方式配合運用高分子材料其中一種或者是其組合所製成,據此,可察知本發明的凹槽線路4之寬度能夠以前述敘明的方式進行精確地控制;Referring to FIG. 3A to FIG. 3B, the above step (B) is continued, and (C) a shielding layer 5 having a groove line 4 is formed on the surface of the adhesion layer 3, wherein the shielding layer 5 is made of a photoresist. The exposure developing technique is combined with a photosensitive resist or a printing method in combination with one or a combination of polymer materials, whereby it can be observed that the width of the groove line 4 of the present invention can be accurately performed in the manner described above. control;
(D)於上述遮蔽層5表面之間的凹槽線路4中形成至少一金屬導電電極6,上述金屬導電電極6被限制於上述凹槽線路4中,因此,能夠保證所生產的上述金屬導電電極6的線徑寬度,其中,上述金屬導電電極6可選自於真空濺鍍、蒸鍍、化學鍍、電鍍或者是導電高分子塗佈其中一種或其組合方式進行製程,上述金屬導電電極6是由金(Au)、銅(Cu)、銀(Ag)、鋅(Zn)、鋁(Al)、鎳(Ni)、錫(Sn)等金屬、或其合金、或者是由導電高分子材料其中一種所製成。(D) forming at least one metal conductive electrode 6 in the groove line 4 between the surfaces of the shielding layer 5, the metal conductive electrode 6 being confined in the groove line 4, thereby ensuring that the metal produced is electrically conductive The wire diameter of the electrode 6, wherein the metal conductive electrode 6 may be selected from the group consisting of vacuum sputtering, evaporation, electroless plating, electroplating, or conductive polymer coating, or a combination thereof, and the metal conductive electrode 6 is used. It is made of metal such as gold (Au), copper (Cu), silver (Ag), zinc (Zn), aluminum (Al), nickel (Ni), tin (Sn), or an alloy thereof, or a conductive polymer material. One of them is made.
(E)去除上述遮蔽層5形成一具有線路圖案的上述金屬導電電極6,及以蝕刻方式去除上述金屬導電電極6之間的上述附著層3,並於上述金屬導電電極6的外周面61及上述附著層3表面形成一ㄇ字型樣態的耐候層7,上述耐候層7將上述已具有線路圖案的上述金屬導電電極6與外部隔絕密封,其中,上述耐候層7可選自於化學鍍、電鍍或者是導電高分子塗佈其中一種或其組合方式進行製程,而上述耐候層7是由碳(C)、石墨(graphite)、金屬、金屬氧化物、可導電的高分子材料或者是其複合材料其中一種所製成。(E) removing the above-mentioned shielding layer 5 to form a metal conductive electrode 6 having a line pattern, and removing the adhesion layer 3 between the metal conductive electrodes 6 by etching, and on the outer peripheral surface 61 of the metal conductive electrode 6 and The surface of the adhesion layer 3 is formed with a weather-resistant layer 7 of a U-shaped form. The weather-resistant layer 7 seals the metal conductive electrode 6 having the line pattern from the outside. The weather-resistant layer 7 may be selected from electroless plating. Or electroplating or a combination of conductive polymer coatings, wherein the weathering layer 7 is made of carbon (C), graphite, metal, metal oxide, conductive polymer material or One of the composite materials is made.
由上述步驟(A)、(B)、(C)、(D)、(E)共同形成本發明之觸控用導電電極的初步產品,而上述每一觸控用導電電極的寬度可精確地調整到0.1μm ~10μm之間。The preliminary products of the conductive electrode for touch control of the present invention are formed by the above steps (A), (B), (C), (D), and (E), and the width of each of the conductive electrodes for touch control can be accurately Adjust to between 0.1μm and 10μm.
其中,上述耐候層7的上述金屬是選自於鎢(W)、鎳(Ni)、鉻(Cr)、銅(Cu)、鋁(Al)、銀(Ag)、鈦(Ti)、鉬(Mo)、錫(Sn)、鋅(Zn)、鈷(Co)、鐵(Fe)、鈮(Nb)或其合金其中一種所製成,上述耐候層7的上述金屬氧化物分別是由鎢(W)、鎳(Ni)、鉻(Cr)、銅(Cu)、鋁(Al)、銀(Ag)、鈦(Ti)、鉬(Mo)、錫(Sn)、鋅(Zn)、鈷(Co)、鐵(Fe)、鈮(Nb)或其合金其中一種氧化所製成。Wherein, the metal of the weathering layer 7 is selected from the group consisting of tungsten (W), nickel (Ni), chromium (Cr), copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), and molybdenum ( Mo), tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), niobium (Nb) or an alloy thereof, the metal oxide of the weathering layer 7 is made of tungsten ( W), nickel (Ni), chromium (Cr), copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo), tin (Sn), zinc (Zn), cobalt ( Co), iron (Fe), niobium (Nb) or an alloy thereof is produced by oxidation of one of them.
再進更ㄧ步而言,上述耐候層7可設為一具有較深色顏色的黑化性質,因此,間接造成上述金屬導電電極6不易被產品使用者明顯覺察,有效降低干涉條紋現象(moire)的發生,於使用者以眼睛視見於產品表面時供一舒適的效果。Further, in the further step, the weathering layer 7 can be set to have a blackening property with a darker color, and thus indirectly causes the metal conductive electrode 6 to be less noticeable to the user of the product, thereby effectively reducing the interference fringe phenomenon (moire). The occurrence of a comfortable effect when the user views the surface of the product with the eyes.
(F)在本發明送達其它目的地進行其它接續加工程序之後,可利用塗佈或者是直接貼膜的方式進行將一透明的保護膠膜層8(Optically clear adhesive)完全覆蓋密封於上述導電電極,作一保護本發明構造之步驟,其中,上述保護膠膜層8是由(聚)氧化樹脂(Silicone)或者是丙烯酸樹脂(Acrylic)其中一種所製成。(F) After the present invention is sent to other destinations for other subsequent processing procedures, a transparent protective adhesive film layer 8 (Optically clear adhesive) can be completely covered and sealed to the conductive electrode by coating or direct filming. A step of protecting the construction of the present invention, wherein the protective adhesive film layer 8 is made of one of a (poly) oxidized resin (Silicone) or an acrylic resin (Acrylic).
相對於本發明之保護膠膜層8設計,是將導電電極完全包覆於上述保護膠膜層8中,而上述保護膠膜層8相對於上述基材層2形成一近乎平坦的表面樣態,並不會於具有線路圖案的觸控用導電電極之間留有空隙。Compared with the protective film layer 8 of the present invention, the conductive electrode is completely covered in the protective adhesive film layer 8, and the protective adhesive film layer 8 forms a nearly flat surface state with respect to the substrate layer 2. It does not leave a gap between the conductive electrodes for touch having a line pattern.
本發明之電極線路可設計建構於上述基材層2的其中一面(單面)(圖未示),或者是位於上述基材層2的雙面,甚至是位於上述基材層2的多個表面。The electrode circuit of the present invention can be designed to be constructed on one side (one side) of the substrate layer 2 (not shown), or on both sides of the substrate layer 2, or even a plurality of the substrate layer 2 surface.
請參照圖7A至圖7B所示,於第二較佳實施例中,製造步驟(A)、步驟(B)、步驟(C)及步驟(D)皆與第一實施例相同,僅於步驟(E)及步驟(F)具有差異性:(E)去除上述遮蔽層5形成一具有線路圖案的金屬導電電極6,及以蝕刻方式去除上述金屬導電電極6之間的上述附著層3,並於上述金屬導電電極6的線路圖案外周面61形成一ㄇ字型樣態的耐候層7。Referring to FIG. 7A to FIG. 7B, in the second preferred embodiment, the manufacturing step (A), the step (B), the step (C) and the step (D) are the same as the first embodiment, only in the steps. (E) and (F) are different: (E) removing the above-mentioned shielding layer 5 to form a metal conductive electrode 6 having a line pattern, and etchingly removing the adhesion layer 3 between the metal conductive electrodes 6 and A weather-resistant layer 7 of a U-shape is formed on the outer peripheral surface 61 of the wiring pattern of the metal conductive electrode 6.
(F)將一透明的保護膠膜層8(Optically clear adhesive)完全覆蓋密封於上述基材層2、上述附著層3及上述耐候層7的表面形成一密封樣態。(F) A transparent protective adhesive layer 8 (Optically clear adhesive) is completely covered and sealed on the surface of the base material layer 2, the adhesion layer 3, and the weathering layer 7 to form a sealed state.
更進一步地說明上述耐候層7可設為包含一第一耐候層70形成於上述金屬導電電極6的線路圖案上表面60以及一第二耐候層71包覆於上述金屬導電電極6的線路圖案外周面61,據此,遂有下列第三、第四及第五實施例:It is to be noted that the weather-resistant layer 7 may be formed by a line pattern upper surface 60 including a first weather-resistant layer 70 formed on the metal conductive electrode 6 and a circuit pattern outer periphery of a second weather-resistant layer 71 covering the metal conductive electrode 6. Face 61, according to which, the following third, fourth and fifth embodiments are:
請參照圖8A至圖8B所示,於第三較佳實施例中,製造步驟(A)、步驟(B)、步驟(C)及步驟(F)皆與第一實施例相同,僅於步驟(D)、步驟(E)具有差異性:步驟(D)於上述遮蔽層5表面的凹槽線路4中形成至少一金屬導電電極6,且進一步於上述金屬導電電極6的上表面60形成一第一耐候層70。Referring to FIG. 8A to FIG. 8B, in the third preferred embodiment, the manufacturing step (A), the step (B), the step (C) and the step (F) are the same as the first embodiment, only in the steps. (D), the step (E) has a difference: the step (D) forms at least one metal conductive electrode 6 in the groove line 4 on the surface of the shielding layer 5, and further forms a surface on the upper surface 60 of the metal conductive electrode 6 The first weathering layer 70.
再者,步驟(E)去除上述遮蔽層5形成一具有線路圖案的上述金屬導電電極6,及以蝕刻方式去除上述金屬導電電極6之間的上述附著層3,並於上述金屬導電電極6的外周面61、上述第一耐候層70外周面以及連同上述附著層3外周面形成一第二耐候層71,上述第二耐候層71配合上述附著層3將上述金屬導電電極6與外部隔絕密封。Further, in step (E), the shielding layer 5 is removed to form the metal conductive electrode 6 having a line pattern, and the adhesion layer 3 between the metal conductive electrodes 6 is removed by etching, and the metal conductive electrode 6 is disposed on the metal conductive electrode 6 The outer peripheral surface 61, the outer peripheral surface of the first weather-resistant layer 70, and the outer peripheral surface of the adhesion layer 3 form a second weather-resistant layer 71, and the second weather-resistant layer 71 cooperates with the adhesion layer 3 to seal the metal conductive electrode 6 from the outside.
請參照圖9A至圖9B所示,於第四較佳實施例中,製造步驟(A)、步驟(B)、步驟(C)及步驟(D)皆與第三較佳實施例相同,僅於步驟(E)及步驟(F)具有差異性:去除上述遮蔽層5形成一具有線路圖案的上述金屬導電電極6,及以蝕刻方式去除上述金屬導電電極6之間的上述附著層3,並於上述金屬導電電極6的線路圖案外周面61形成一第二耐候層71,上述第二耐候層71配合上述附著層3及上述第一耐候層70將上述金屬導電電極6與外部隔絕密封。Referring to FIG. 9A to FIG. 9B, in the fourth preferred embodiment, the manufacturing step (A), the step (B), the step (C) and the step (D) are the same as the third preferred embodiment, only The step (E) and the step (F) are different in that the shielding layer 5 is removed to form the metal conductive electrode 6 having a line pattern, and the adhesion layer 3 between the metal conductive electrodes 6 is removed by etching, and A second weather-resistant layer 71 is formed on the outer peripheral surface 61 of the wiring pattern of the metal conductive electrode 6, and the second weather-resistant layer 71 is sealed to the outside by the adhesion layer 3 and the first weather-resistant layer 70.
步驟(F):以一透明的保護膠膜層8完全覆蓋密封於上述基材層2、上述附著層3的外周面、上述第一耐候層70的外周面及上述第二耐候層71的外周面形成一密封樣態。Step (F): completely covering the outer peripheral surface of the base material layer 2, the adhesion layer 3, the outer peripheral surface of the first weather-resistant layer 70, and the outer periphery of the second weather-resistant layer 71 with a transparent protective adhesive film layer 8 The face forms a sealed state.
如此一來,本發明耐候層7完全包覆於已具有線路圖案的上述金屬導電電極6外周面61之設計可達到不同於習知之防止使用者於使用之下,延長觸控用導電電極的產品使用年限之目的。In this way, the weather-resistant layer 7 of the present invention is completely coated on the outer peripheral surface 61 of the metal conductive electrode 6 having the line pattern, and the product can be different from the conventional one to prevent the user from using the conductive electrode for touch control. The purpose of the use of years.
再更進一步而言,本發明製程中利用具有預定線路圖案的遮蔽層5製造上述金屬導電電極6的線路圖案,便能降低習知出現嚴重的側蝕現象15而導致每一導電電極的產品之良率極低的現象以及線徑寬度不一致之情況,換句話說,本發明可達到提升上述金屬導電電極6的生產良率,並管控維持每一金屬導電電極6的線徑寬度之兩項目的。Further, in the process of the present invention, by using the shielding layer 5 having a predetermined wiring pattern to fabricate the wiring pattern of the metal conductive electrode 6, the conventional side etching phenomenon 15 can be reduced to cause the product of each conductive electrode. The phenomenon of extremely low yield and the inconsistency of the wire diameter, in other words, the present invention can achieve the production yield improvement of the above-mentioned metal conductive electrode 6, and control the two items of the wire diameter of each metal conductive electrode 6 .
除此之外,請參照圖10A至圖10B所示,於第五較佳實施例中,製造步驟(A)、步驟(B)、步驟(C)及步驟(D)皆與第四較佳實施例相同,僅於步驟(E)及步驟(F)具有差異性:去除上述遮蔽層5形成一具有線路圖案的上述金屬導電電極6,及以蝕刻方式去除上述金屬導電電極6之間的附著層3。In addition, referring to FIG. 10A to FIG. 10B, in the fifth preferred embodiment, the manufacturing step (A), the step (B), the step (C), and the step (D) are both fourth and fourth preferred. In the same embodiment, only step (E) and step (F) are different: removing the above-mentioned shielding layer 5 to form a metal conductive electrode 6 having a line pattern, and removing the adhesion between the metal conductive electrodes 6 by etching. Layer 3.
步驟(F):以一透明的保護膠膜層8完全覆蓋密封於上述基材層2、上述附著層3的外周面、上述金屬導電電極6的外周面61及上述耐候層7的外周面形成一密封樣態。Step (F): forming a transparent protective adhesive film layer 8 to completely cover the outer peripheral surface of the base material layer 2, the adhesion layer 3, the outer peripheral surface 61 of the metal conductive electrode 6, and the outer peripheral surface of the weather resistant layer 7 A sealed form.
請參照圖11至圖13所示,本發明觸控用導電電極於下列敘明之較佳實施例中,主要包含:一基材層2、至少一附著層3、至少一金屬導電電極6、至少一耐候層7等四個部分,上述基材層2可選自玻璃、塑膠板、及塑膠膜等其中之一,而本發明之觸控用導電電極可於上述基材層2的其中一面或者是至少一面所製成。Referring to FIG. 11 to FIG. 13 , in the preferred embodiment of the present invention, the conductive electrode for touch control comprises: a substrate layer 2, at least one adhesion layer 3, at least one metal conductive electrode 6, at least a weathering layer 7 and the like, the substrate layer 2 may be selected from one of a glass, a plastic plate, and a plastic film, and the conductive electrode for touch control of the present invention may be on one side of the substrate layer 2 or It is made on at least one side.
本發明為一由所選定的基材層2所製成的基材層2、由至少一具有導電性的附著層3去形成一線路圖案並佈設於上述基材層2表面、再透過上述附著層3使一由至少一金屬導電電極6連接於上述基材層2表面。The present invention is a base material layer 2 made of the selected base material layer 2, and a wiring pattern formed by at least one conductive adhesive layer 3 is disposed on the surface of the base material layer 2, and is further permeable to the adhesion. The layer 3 is connected to the surface of the substrate layer 2 by at least one metal conductive electrode 6.
於實際上製造本發明的觸控用導電電極產品時,上述每一導電電極的寬度介於0.1μm ~10μm之間,而且,如果以俯視圖來看,以上述金屬導電電極6對應上述線路圖案形成一呈現網格狀結構的導電線路,如果以剖視圖來看,一連接包覆於上述金屬導電電極6的外周面61且呈現ㄇ字型結構之耐候層7、以及利用一透明樣態的保護膠膜層8塗佈或貼合於上述基材層2以及上述耐候層7的外周面。When the touch conductive electrode product of the present invention is actually manufactured, the width of each of the conductive electrodes is between 0.1 μm and 10 μm, and if the metal conductive electrode 6 corresponds to the above-mentioned line pattern, the above-mentioned metal conductive electrode 6 is formed in a plan view. A conductive line exhibiting a grid-like structure, if viewed in a cross-sectional view, a weather-resistant layer 7 which is coated on the outer peripheral surface 61 of the metal conductive electrode 6 and exhibits a U-shaped structure, and a protective adhesive using a transparent state The film layer 8 is applied or bonded to the outer peripheral surface of the base material layer 2 and the weather resistant layer 7.
請參照圖8所示,於第一較佳實施例中,上述耐候層7連同形成於上述金屬導電電極6的外周面61的同時,由上述耐候層7延伸連接包覆於上述附著層3的外周面,上述耐候層7最終呈現一ㄇ字型結構,上述耐候層7還可設為具有一同時具有保護及遮蔽功效之較深色顏色的黑化性質;Referring to FIG. 8 , in the first preferred embodiment, the weather-resistant layer 7 is formed on the outer peripheral surface 61 of the metal conductive electrode 6 and is extended and connected to the adhesion layer 3 by the weather-resistant layer 7 . The outer peripheral surface, the weathering layer 7 finally exhibits a U-shaped structure, and the weathering layer 7 can also be set to have a blackening property of a darker color having both protection and shielding effects;
或者是於第二較佳實施例中,請參照圖9所示,上述耐候層7可設計為形成於上述金屬導電電極6的全部外周面61並呈現一ㄇ字型結構;Or in the second preferred embodiment, as shown in FIG. 9, the weather-resistant layer 7 may be formed on the entire outer peripheral surface 61 of the metal conductive electrode 6 and have a U-shaped structure;
而於第三較佳實施例中,請參照圖10所示,結構上為相對於上述第一較佳實施例,於上述金屬導電電極6先形成一位於上述金屬導電電極6的上表面60之第一耐候層70,以上述第二耐候層71連同形成於上述金屬導電電極6的外周面61的同時,由上述第二耐候層71延伸連接包覆於上述附著層3的外周面,因此,上述第一及第二耐候層70、71便配合上述附著層3能夠共同使每一導電線路與外部隔絕密封,最終上述第一及第二耐候層70、71共同呈現一ㄇ字型結構;In the third preferred embodiment, as shown in FIG. 10, the metal conductive electrode 6 is first formed on the upper surface 60 of the metal conductive electrode 6 with respect to the first preferred embodiment. The first weather-resistant layer 70 is extended and joined to the outer peripheral surface of the adhesion layer 3 by the second weather-resistant layer 71 together with the outer peripheral surface 61 formed on the metal conductive electrode 6; The first and second weathering layers 70 and 71 can cooperate with the adhesion layer 3 to electrically seal each conductive line from the outside, and finally the first and second weathering layers 70 and 71 jointly exhibit a U-shaped structure;
於第四較佳實施例(圖未示),為上述第三較佳實施中,僅於上述已具有第一耐候層70的上述金屬導電電極6外周面61再形成一上述第二耐候層71,最終上述第一耐候層70及上述第二耐候層71共同呈現一ㄇ字型結構。In the fourth preferred embodiment (not shown), in the third preferred embodiment, the second weathering layer 71 is further formed only on the outer peripheral surface 61 of the metal conductive electrode 6 having the first weather resistant layer 70. Finally, the first weather-resistant layer 70 and the second weather-resistant layer 71 together have a U-shaped structure.
再者,本發明之附著層3的厚度設為介於0.01μm~1μm範圍之間;而上述金屬導電電極6的厚度設為介於0.1μm~6μm範圍之間;以及,上述耐候層7的厚度設為介於0.01μm~1μm範圍之間。Furthermore, the thickness of the adhesion layer 3 of the present invention is set to be in the range of 0.01 μm to 1 μm; and the thickness of the metal conductive electrode 6 is set to be in the range of 0.1 μm to 6 μm; and the weatherable layer 7 is The thickness is set to be in the range of 0.01 μm to 1 μm.
據此,相對於習知圖1金屬導電電極10所呈現的結構樣態,本發明觸控用導電電極於第一至第四較佳實施例中之上述第一耐候層70及上述第二耐候層71的位置分佈設計將上述金屬導電電極6及附著層3皆被包覆於上述耐候層7中,對於在高溫度、高濕度或是低溫環境之下,本發明的產品具有極高的環境耐候性質且良率極高,又,針對具有較細寬度的導電電極之產品的觸控感測(Sensor)之電容靈敏度也有穩定之效益。Accordingly, the first weathering layer 70 and the second weathering resistance of the conductive conductive electrode of the present invention in the first to fourth preferred embodiments are different from those of the conventional metal conductive electrode 10 of FIG. The position distribution design of the layer 71 is such that the above-mentioned metal conductive electrode 6 and the adhesion layer 3 are coated in the weather-resistant layer 7, and the product of the present invention has an extremely high environment under high temperature, high humidity or low temperature environment. The weather resistance property is extremely high, and the capacitive sensitivity of the touch sensing sensor for products having a thinner width of the conductive electrode is also stable.
而且,上述導電電極可利用至少一保護膠膜層8將其完全密封包覆,本發明觸控用導電電極能夠確實達到防止使用者於長期使用之下,位於上述保護膠膜層8內部被包覆的上述導電電極長期處於空氣中水氣所發生的氧化過程,本發明便可完成增強導電電極的耐氧化功效,延長觸控用導電電極的產品使用年限之目的。Moreover, the conductive electrode can be completely sealed by at least one protective adhesive film layer 8. The conductive electrode for touch control of the present invention can be surely prevented from being used by the user for a long time under the protective adhesive film layer 8. The above-mentioned conductive electrode covers the oxidation process of moisture in the air for a long time, and the invention can complete the oxidation resistance of the conductive electrode and prolong the service life of the conductive electrode for touch.
最後,相對於習知圖1金屬導電電極10所呈現的結構樣態,本發明觸控用導電電極於前述較佳實施例中之上述金屬導電電極6表面形成的上述耐候層7也能夠進一步地設計為具有深色顏色的黑化性質以及上述附著層3中設計一黑化層30,位於上述基材層2第一面的上述耐候層7位置及位於上述基材層2第二面的上述黑化層30位置相互交錯,此結構交錯設計方式配合具有黑化性質的上述耐候層7及上述黑化層30,而能夠讓使用者的眼睛注視於本發明觸控用導電電極時,人眼首先視見於第一面上述耐候層7,而當人眼視見於上述耐候層7上述耐候層7之間的空隙時,透過光線進入上述基材層2後到達第二面上述黑化層30,因此,相較於習知人眼視見於上述金屬導電電極10與上述金屬導電電極10之間的空隙時,習知結構會讓人眼直接明顯覺查到第二面的上述金屬導電電極10,本發明結構設計能夠避免第二面上述金屬導電電極6被人眼視見之,形成一完整遮蔽的效果,因此,本發明再再地加強與提升避免使用者的眼睛可視見觸控面板介面表面之干涉條紋現象(Moire)及視察觸控面板介面下方的金屬導電電極6之功效。Finally, the weathering layer 7 formed on the surface of the metal conductive electrode 6 in the preferred embodiment of the present invention can be further improved with respect to the structure of the metal conductive electrode 10 of the prior art. Designed to have a blackening property of a dark color and a blackening layer 30 in the adhesion layer 3, a position of the weathering layer 7 on the first side of the substrate layer 2, and the above-mentioned second surface of the substrate layer 2 The positions of the blackening layer 30 are mutually staggered, and the structure is alternately designed to match the weathering layer 7 and the blackening layer 30 having blackening properties, so that the eyes of the user can be seen when the user's eyes are focused on the conductive electrode for touch control of the present invention. First, the weather-receiving layer 7 is viewed on the first surface, and when the human eye sees the gap between the weather-resistant layer 7 of the weather-resistant layer 7, the light enters the substrate layer 2 and reaches the blackening layer 30 on the second surface. Therefore, when the gap between the metal conductive electrode 10 and the metal conductive electrode 10 is seen by a conventional human eye, the conventional structure can directly visually recognize the metal conductive electrode 10 of the second surface. The structural design of the invention can avoid the effect that the metal conductive electrode 6 on the second surface is visible to the human eye to form a complete shielding effect. Therefore, the present invention further enhances and enhances the visual protection of the user's eyes to the surface of the touch panel interface. The interference fringe phenomenon (Moire) and the effect of inspecting the metal conductive electrode 6 under the touch panel interface.
上述所舉實施例,僅用為方便說明本發明並非加以限制,在不離本發明精神範疇,熟悉此一行業技藝人士依本發明申請專利範圍及發明說明所作之各種簡易變形與修飾,均仍應含括於以下申請專利範圍中。The above-mentioned embodiments are merely intended to be illustrative of the present invention and are not intended to limit the scope of the invention, and the various modifications and modifications made by those skilled in the art in accordance with the scope of the invention and the description of the invention are still It is included in the scope of the following patent application.
〔習知〕
10‧‧‧金屬導電電極
11‧‧‧附著層
12‧‧‧基材
13‧‧‧耐候層
14‧‧‧電極線路
15‧‧‧側蝕現象
16‧‧‧保護膠膜
17‧‧‧中介層
18‧‧‧導電基底層
〔本發明〕
2‧‧‧基材層
3‧‧‧附著層
30‧‧‧黑化層
31‧‧‧中介層
32‧‧‧導電基底層
33‧‧‧抗氧化層
4‧‧‧凹槽線路
5‧‧‧遮蔽層
6‧‧‧金屬導電電極
60‧‧‧上表面
61‧‧‧外周面
7‧‧‧耐候層
70‧‧‧第一耐候層
71‧‧‧第二耐候層
8‧‧‧保護膠膜層[study]
10‧‧‧Metal conductive electrode
11‧‧‧Adhesive layer
12‧‧‧Substrate
13‧‧‧ weathering layer
14‧‧‧Electrode lines
15‧‧‧Side erosion
16‧‧‧Protective film
17‧‧‧Intermediary
18‧‧‧ Conductive substrate layer (invention)
2‧‧‧Substrate layer
3‧‧‧Adhesive layer
30‧‧‧Blackening layer
31‧‧‧Intermediary
32‧‧‧ conductive base layer
33‧‧‧Antioxidant layer
4‧‧‧ Groove line
5‧‧‧shading layer
6‧‧‧Metal conductive electrode
60‧‧‧ upper surface
61‧‧‧ outer perimeter
7‧‧‧ weathering layer
70‧‧‧First weathering layer
71‧‧‧second weathering layer
8‧‧‧Protective film layer
圖1為習知金屬導電電極之製造方法流程圖; 圖2為習知附著層之結構示意圖; 圖3A至圖3B為本發明第一較佳實施例之製造方法流程圖; 圖4為本發明附著層第一較佳實施例之結構示意圖; 圖5為本發明附著層第二較佳實施例之結構示意圖; 圖6為本發明附著層第三較佳實施例之結構示意圖; 圖7A至圖7B為本發明第二較佳實施例之製造方法流程圖; 圖8A至圖8B為本發明第三較佳實施例之製造方法流程圖; 圖9A至圖9B為本發明第四較佳實施例之另一製造方法流程圖; 圖10A至圖10B為本發明第五較佳實施例之製造方法流程圖; 圖11為本發明觸控用導電電極之第一較佳實施例結構示意圖; 圖12為本發明觸控用導電電極之第二較佳實施例結構示意圖; 圖13為本發明觸控用導電電極之第三較佳實施例結構示意圖。1 is a flow chart of a conventional method for manufacturing a metal conductive electrode; FIG. 2 is a schematic structural view of a conventional adhesive layer; FIG. 3A to FIG. 3B are flowcharts of a manufacturing method according to a first preferred embodiment of the present invention; FIG. 5 is a schematic structural view of a second preferred embodiment of the adhesive layer of the present invention; FIG. 6 is a schematic structural view of a third preferred embodiment of the adhesive layer of the present invention; FIG. 7A to FIG. 7B is a flow chart of a manufacturing method of a second preferred embodiment of the present invention; FIG. 8A to FIG. 8B are flowcharts of a manufacturing method of a third preferred embodiment of the present invention; FIG. 9A to FIG. 9B are a fourth preferred embodiment of the present invention; FIG. 10 is a flow chart of a manufacturing method according to a fifth preferred embodiment of the present invention; FIG. 11 is a schematic structural view of a first preferred embodiment of a conductive electrode for touch according to the present invention; FIG. 13 is a schematic structural view of a second preferred embodiment of the conductive electrode for touch control according to the present invention; FIG.
Claims (27)
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